TW201415614A - Compact optical module and method for manufacturing the same - Google Patents

Abstract

The optical module (1) comprises a first member (O) having a first face (F1) which is substantially planar, wherein directions perpendicular to said first face (F1) are referred to as vertical directions; a second member (P) having a second face (F2) facing said first face (F1), which is substantially planar and is aligned substantially parallel to said first face (F1); a third member (S) comprised in said first member (O) or comprised in said second member (P) or distinct from and located between these, which comprises an opening (4); and a diffraction grating (G); wherein said first member (O) comprises one or more transparent portions through which light can pass. It is possible to manufacture said diffraction grating (G) in one process together with said first (O) or said second (P) member. The whole module can be manufactured on wafer-level.

Description

Compact optical module and method of manufacturing same

The present invention relates to the field of optics and more particularly to the packaging and fabrication of optical or optoelectronic components. More specifically, the present invention relates to optical modules and methods of fabricating optical modules and applications and devices incorporating such optical modules. The invention also relates to the method and apparatus described in the opening sentence of the scope of the patent application.

[noun definition]

"Active optical member": A light sensor or light emitting member. For example, photodiodes, image sensors, LEDs, OLEDs, laser wafers. An active optical component can be presented as a bare die or in a package form (eg, a packaged component).

"Passive optical component": An optical component that deflects light by refraction and/or diffraction and/or (internal and/or external) reflection, such as a lens, a dome, a mirror, or an optical system. One of the optical systems is a collection of such optical components, which may also include mechanical components such as aperture stops, image screens, and holding members.

"Optoelectronic module": a component that includes at least one active type and One less passive optical component.

"Replication": A technique by which a given structure or its negative can be replicated. For example, etching, embossing, imprinting, casting, molding.

"wafer": An object of substantially disc or plate shape that extends in one direction (z direction or vertical direction) relative to it in the other two directions (x and y directions or lateral directions). The extension is much smaller. Typically, on a (non-blank) wafer, a plurality of similar structures or articles are disposed or disposed therein, typically on a rectangular grid point. A wafer may have openings or holes, and a wafer may even have no material in a predominant portion of its two sides. A wafer can have any lateral shape, with the shape of the circle and the shape of the rectangle being a very common shape. Although in many contexts a wafer is understood to be primarily made of a semiconductor material, it is not limited in this patent application. Thus, a wafer can be made primarily of, for example, a semiconductor material, a polymeric material, a composite comprising a metal and a polymer or a polymer and glass. In particular, hardenable materials (e.g., thermally curable or UV hardenable polymers) are all wafer materials of interest to the present invention.

"Side": See "Wafer."

"Vertical": See "Wafer."

"Light": most generally electromagnetic radiation; more specifically electromagnetic radiation in the infrared, visible or ultraviolet portion of the electromagnetic spectrum.

Optical modules for wafer miniaturization for wafer level fabrication are well known in the art. They often contain one or more lenses for imaging on an image sensor. The major axes of the lenses are aligned in parallel with a surface that is orthogonal to the image sensor. It is desirable to provide a miniaturized optical module for wafer level manufacturing for other devices.

Accordingly, it is an object of the present invention to create a novel optical module, and in particular such modules can be manufactured in large quantities. Furthermore, corresponding application devices and methods of making such optical modules and methods of making such optical modules will be provided.

Another object of the present invention is to provide a micro or elaborate or miniaturized optical module or device and/or to provide a method of making the same.

Another object of the present invention is to provide a method of rapidly manufacturing an optical module or device.

Another object of the present invention is to provide an optical module or device having a small manufacturing tolerance and a method of manufacturing an optical module or device having high precision.

Another object of the present invention is to provide a method of mass producing a miniaturized optical module or device and to provide a corresponding optical module or device.

Another object of the present invention is to provide a miniaturized optical module or device for a particular application, and there are no miniaturized optical modules or devices available for these particular applications.

The optical module and/or device may in particular be a photovoltaic module.

Other objects will emerge from the following description and examples.

At least one of these objects is at least partially achieved by the apparatus and method claimed in the scope of the patent application of the present application.

The optical module includes: a first member having a substantially flat first surface, wherein a direction orthogonal to the first surface is referred to as a vertical direction; and a second member having a first surface facing the first surface a second surface that is substantially flat and aligned substantially parallel to the first surface; a third member that is included in or included in the first member or different from the first surface And a second member and disposed therebetween, comprising an opening; and a diffraction grating; wherein the first member comprises one or more light transmissive transparent portions. A diffraction grating is a passive optical member having a periodic structure that splits and diffracts (non-monochromatic) light into a plurality of beams propelling in different directions depending on the wavelength of the light. The directions are also (local) periodicity with the periodic structure (the spacing of the grating). A diffraction grating can thus be used as an astigmatism element.

These modules can be used in applications where light will be redirected and dispersed according to its wavelength. For example, in spectrum analysis applications or in telecom applications, these modules can find their applications. The grating can also be used to detect, redirect, or focus monochromatic light, in these examples without the splitting of the beam. The grating can be very thin and can have a contour Height, which is much smaller than the minimum profile height of most other optical components (eg, mirrors) that can do the same.

Light can enter and/or exit the optical module via the one or more transparent portions. The one or more transparent portions provide an optical connection between the opening in the third member and a space on a surface of the first member opposite the first surface, or in many instances, Between the opening and the exterior of the optical module.

In one aspect, light enters the optical module from outside the optical module and is diffracted by the diffraction grating of the module. The diffracted light is then detected or used by components within the module or external to the module. In another aspect, light generated within the module is diffracted by a diffraction grating of the module. The diffracted light is then detected or used by components within the module or external to the module.

The direction orthogonal to the vertical direction will be referred to as a lateral direction.

Typically, the first and second members are fixed relative to each other. The fixation may be direct fixation or the fixation may be indirect fixation through the third member if the third member is different from the first and second members. A bonding material such as an epoxy resin can be used between the various members.

In an embodiment, the third member is different from the first and second members, and the third member is disposed between the first and second members.

In an embodiment that can be combined with the previously mentioned embodiments, the diffraction grating is at least one of the following: Included within the first member; contained within at least one of the one or more transparent portions; attached to the first surface; contained within the second member; attached to the second a surface; disposed within the opening.

In an embodiment that can be combined with one or more of the aforementioned embodiments, the diffraction grating is a reflective diffraction grating within the opening.

In an embodiment that can be combined with one or more of the aforementioned embodiments, the diffraction grating is included in the first member or attached to the first surface or included in the second A reflective diffraction grating within or attached to the second surface.

In an embodiment that can be combined with one or more of the aforementioned embodiments (but only the two mentioned last), the diffraction grating is included in at least one of the one or more transparent portions Transmissive diffraction grating. Thereby, the light system passing through the specific transparent portion is diffracted by the (transmissive) diffraction grating. This configuration is particularly space efficient.

Of course, this does not exclude that two (or even more) diffraction gratings are included in the module, and one or more transmissive diffraction gratings and one or more reflective diffraction gratings can be provided. For example, a transmissive diffraction grating is within the transparent portion and a reflective diffraction grating is within the opening.

In combination with one or more of the aforementioned embodiments In an embodiment, the opening is surrounded by the first, second and third members. More specifically, the opening can be defined by the members. Thus, a cavity can be formed within the module. One or more passive optical members and/or one or more active optical members may be within the cavity. In particular, the opening or cavity formed in the module can be sealed in isolation. This protects the interior of the module from harmful objects such as dust or dirt. Thus, the optical components within the module can be protected in this manner and the optical path inside the module remains in good condition for a long period of time. The first, second and third members are members that define the opening or cavity.

In an embodiment that can be combined with one or more of the aforementioned embodiments, the module includes an interior space and a housing surrounding the interior space, the interior space being included in the opening, except for the one or The outer casing is opaque except for the plurality of transparent portions such that light can only enter or exit the interior space via the one or more transparent portions. More specifically, at least one of the third member and the first and second members are provided to the outer casing or, more specifically, they form the outer casing. Still more particularly, the first, second and third members are provided for the outer casing, and more particularly they even form the outer casing. Thereby, an extremely compactly packaged optical module can be completed. The optical module can be completed using only a very small number of components. Furthermore, not only the first member, but the second member may also comprise at least one transparent portion.

In an embodiment that can be combined with one or more of the aforementioned embodiments, the optical module is constructed such that light can be along at least one of the one or more transparent portions and the diffraction grating Interconnected light path broadcast. The at least one first transparent portion of the one or more transparent portions and the diffraction grating are disposed to each other such that light passing through the first transparent portion may be along a first transparent portion and the diffraction grating Even the light path spreads. The light path can be particularly located within the optical module.

In an embodiment that can be combined with one or more of the aforementioned embodiments, the first, second, and third members are generally block or plate shaped shapes that include at least one aperture. The fabrication of a wafer level of such optical modules is very likely.

In an embodiment that can be combined with one or more of the aforementioned embodiments, the outer boundary of the vertical silhouette of the module (ie, the projection of the optical module on a lateral plane) The outer boundary of the resulting shape) and the outer boundary of the vertical profile of the first, second, and third members (ie, the outer boundary of the shape depicted by the projection of each member on a lateral plane), each of which Both depict the same substantial rectangular shape. This gives a better manufacturability. In particular, all of the mentioned vertical profiles can depict one and the same rectangular shape. The lateral dimensions of the first, second and third members are substantially identical. It is highly probable that wafers are used to fabricate such optical modules, which allows for high-precision mass production.

In an embodiment that can be combined with one or more of the aforementioned embodiments, at least one of the first and second members, and in particular, both of them (ie, the first and second members), at least Portions are made substantially of material that is at least substantially opaque. Of course, the transparent portion is not fabricated from a material that is at least substantially opaque. The choice of materials prevents unwanted light from leaving the optical module and/or avoiding unwanted light entering In the optical module. It contributes to the optical sealing of the optical module, of course, wherein the optical seal is interrupted by the one or more transparent portions, in particular only by the transparent portion. Thus, the first member is typically made substantially entirely of a material that is at least substantially opaque, with the exception of the one or more transparent portions. The second component is substantially entirely fabricated from a material that is at least substantially opaque.

In an embodiment that can be combined with one or more of the previously mentioned embodiments, the third member is at least partially fabricated from a material that is at least substantially opaque. This contributes to optically sealing the optical module.

In an embodiment that can be combined with one or more of the aforementioned embodiments, the third member is a single component, particularly wherein the third member is different from the first and second members, which can improve The manufacturability of the third member.

Typically, the third member (especially when it is different from the first second member) has a vertical extent that is limited by the vertical distance from a surface of the ground to the second surface.

Generally, a third member (more specifically, a separate third member) may also be referred to as a spacer or spacer member or a remote member because it may be between the first and second members, more specifically A well defined (vertical) distance is created between the first and second surfaces.

In an embodiment that can be combined with one or more of the aforementioned embodiments, the third member is made of a hardenable hardenable material and obtained using a replication process, at least one of the two. This makes it a better The manufacturability is made possible. This makes it possible to provide a third component in the form of a single component in a more efficient manner and with greater precision.

In an embodiment that can be combined with one or more of the aforementioned embodiments, the diffraction grating is fabricated from a hardenable hardenable material and obtained using a replication process, at least one of the two. In particular, the diffraction grating can comprise, for example, a coating, such as a metallization. This makes it possible to achieve a better manufacturability. In particular, embossing can be used to fabricate the diffraction grating. It would be particularly efficient if the first and second members and the diffraction grating were fabricated in the same process. In this particular case, the individual components are at least substantially made of a hardenable hardenable material and/or obtained using a replication process. At least the diffraction grating will typically then be provided with a reflective coating.

In an embodiment that can be combined with one or more of the aforementioned embodiments, at least one of the first and second members is substantially a printed circuit board or printed circuit board assembly. This is especially useful when at least one active optical component is included in the module. A component embodied as a printed circuit board or printed circuit board assembly can provide one or more electrical connections across the individual components.

In an embodiment that can be combined with one or more of the aforementioned embodiments, the module additionally includes at least one of: a passive optical component, particularly an at least partially reflective component; and an active optical A component, in particular a light emitting component or a light detecting component.

Not only simple optical equipment, but also complex optical equipment It can be set in this module in this way.

In an embodiment that can be combined with one or more of the aforementioned embodiments, the one or more transparent portions comprise a passive optical member, in particular one or more lenses, a lens element, a cymbal, a Transmissive diffraction grating. The transmissive diffraction grating is identical to or different from the aforementioned diffraction grating. This can optically enhance the module and/or contribute to the miniaturization of the module and/or improve the manufacturability of the module.

In an embodiment that can be combined with one or more of the aforementioned embodiments, the first member includes an opaque occlusion portion, wherein at least a first transparent portion of the one or more transparent portions is The occlusion is surrounded. More specifically, each of the at least one transparent portion is surrounded by the occlusion portion. Thereby, one or more well-defined paths for light entering and/or exiting the module may also be provided while blocking light entering or leaving the module on other paths via the first member.

In an embodiment which may be combined with one or more of the aforementioned embodiments, the one or more transparent portions are substantially made of a transparent material, especially a hardened hardenable material. The one or more transparent portions can be fabricated by replication, such as embossing.

The appliance comprises a plurality of optical modules as described above. The application device can in particular be a wafer stack.

In an embodiment of the application device, the application device includes: a first wafer including a plurality of the first members; and a second wafer including a plurality of the second members; a third wafer comprising a plurality of the third members, wherein the third wafer is included in the first wafer or included in the second wafer or with the first and second wafers Different; and a plurality of the diffraction gratings.

This application appliance or wafer stack is useful for mass production of the above optical modules.

A method of fabricating an optical module includes the steps of: a) providing a first wafer comprising a plurality of transparent portions through which light can pass; b) providing a second wafer; c) providing a third wafer, The third wafer is included in the first wafer or included in the second wafer or different from the first and second wafers, and wherein the third wafer includes a plurality of openings; Providing a plurality of diffraction gratings; e) forming a wafer stack including the first wafer, the second wafer, the third wafer, and the plurality of diffraction gratings; in particular, wherein step e The method may include the following steps: e1) arranging the first, second, and third wafers and the diffraction gratings such that the third wafer is disposed between the first and second wafers and the plurality of Each of the diffraction gratings is assigned to one of the plurality of openings and a transparent portion of the plurality of transparent portions.

Thereby, mass production of high-precision optical modules can be achieved.

In one embodiment of the method, the method comprises the following Step: k) fabricate each of the plurality of diffraction gratings using a replication process, particularly using a embossing process.

In particular, all of the plurality of diffraction gratings are fabricated in one process. If all of the diffraction gratings of the plurality of diffraction gratings are fabricated at the same time (especially at the wafer level), mass production can be easily achieved. After the replication process, a coating process can be performed to coat the diffraction gratings. It is also conceivable that by this copying process only half-finished diffraction gratings are obtained, and that the actual periodic configuration of the diffraction gratings is then processed, for example, by using a mechanical process or using a holographic process. And/or a process using a particle beam (e.g., an electromagnetic beam, such as a laser beam, or an electron beam) to form on the semi-finished diffraction grating.

In an embodiment that can be combined with the previously mentioned embodiments, the method comprises the steps of: l) using a pick-and-place step to diffract each of the plurality of diffraction gratings The grating is disposed on one of the other first surfaces or on a second surface.

This is useful when the diffraction gratings and the first, second and third wafers are manufactured separately. Here, it is possible to use the replication to fabricate the diffraction gratings (see step k above), or to fabricate such diffraction gratings, for example in glass, without using replication, for example mechanically or holographically.

In an embodiment of the embodiment mentioned last in the foregoing, in step k), the diffraction gratings are fabricated on the first surface. Or fabricated on the second surface or fabricated in one process with the first or second wafer. This is particularly efficient because one of the wafers is fabricated simultaneously with all of the diffraction gratings (in one process). It is also contemplated that the plurality of diffraction gratings and the third wafer are fabricated together in one process.

In an embodiment which may be combined with one or more of the previously mentioned method embodiments comprising the step k), the step k) comprises the steps of: i) depositing a replication material on the first surface or On the second surface; ii) contacting a replication tool with the replication material; iii) hardening the replication material; iv) removing the replication tool.

Generally, a suitable replication tool includes a plurality of replicated regions, each replicated region having a surface structure that corresponds to the negative of the surface structure of one of the diffraction gratings. Step (i) can be carried out using a dispenser to form a single portion of the replication material for each of the diffraction gratings.

In an embodiment which can be combined with one or more of the previously mentioned method embodiments, the method comprises the steps of: m) fabricating the plurality of transparent portions using a replication process, in particular a embossing process Each transparent portion or a portion of the plurality of transparent portions.

In an embodiment that can be combined with one or more of the aforementioned method embodiments, the method includes at least one of the following steps: N1) using a copy process, in particular a embossing process, to fabricate the first wafer; n2) using a copy process, in particular a embossing process, to fabricate the second wafer; n3) using a copy process, In particular, the embossing process is used to fabricate the third wafer.

The benefits of copy processing have been described elsewhere in this patent application.

In an embodiment that can be combined with one or more of the aforementioned method embodiments, the method includes the steps of: f) dividing the wafer stack into the plurality of optical modules.

In particular, each of the optical modules includes: at least one transparent portion of the plurality of transparent portions; at least one diffraction grating of the plurality of diffraction gratings; and at least one of the plurality of openings Opening.

Each of the optical modules can be the optical module described above in this patent application.

This segmentation can be performed using known dicing techniques such as sawing, laser cutting, and others.

The invention comprises an optical module having the features of a corresponding method according to the invention, and vice versa, the invention comprises a method having the features of a corresponding optical module according to the invention.

The benefits of such optical modules substantially correspond to the benefits of the corresponding methods, and vice versa, the benefits of such methods essentially correspond to corresponding The benefits of the optical module.

Furthermore, a method of manufacturing a device is provided. The apparatus includes an optical module, and the method includes fabricating an optical module fabricated in accordance with one of the methods described above. In particular, the optical module can be an optical module as described above.

The device may for example be a spectrometer, a smart phone, a camera device, an optical sensor, an optical communication device. "Optical communication device" means an optical component used in optical data transmission, and more particularly in optical digital data transmission, and more particularly in optical long-distance telecommunications data transmission. Typically, an optical communication device has at least one input port for receiving light and at least one output port for outputting light. Typically, in the optical communication device, some processing is applied to the input light, which may be amplification, focusing, defocusing, filtering, optical filtering, separating, dividing, splitting ( Splitting), at least one of the mergers.

In the described device comprising at least one diffraction grating, at least one of filtering, optical filtering, separating, splitting, splitting will typically be applied to the light, in particular to the light within the device.

Other embodiments and benefits emerge from the accompanying claims and figures.

1‧‧‧Optical module

10‧‧‧ device

9‧‧‧ Printed Circuit Board (PCB)

8‧‧‧Control unit

P‧‧‧Substrate

S‧‧‧parts

O‧‧‧Optical component

B‧‧‧ Shield

20‧‧‧Active optical components

22‧‧‧Light emitter

30‧‧‧ Passive optical components

G‧‧‧Diffractive grating

G’‧‧‧Transmissive diffraction grating

32‧‧‧ Passive optical components

7‧‧‧ solder balls

4‧‧‧ openings

6‧‧‧Transparent components

5‧‧‧ lens elements

3‧‧‧Transparent area

Sb‧‧‧ spacer part

Sd‧‧‧distant part

Sb‧‧‧ Structure

PW‧‧‧Substrate Wafer

SW‧‧‧ spacer wafer

OW‧‧‧Optical Wafer

BW‧‧ occlusion wafer

b‧‧‧Occlusion

L‧‧‧Lens components

2‧‧‧ wafer stacking

PW‧‧‧Substrate Wafer

SW‧‧‧ spacer wafer

OW‧‧‧Optical Wafer

BW‧‧ occlusion wafer

19‧‧‧Perforation

11‧‧‧Shell

25‧‧‧Active optical components

31'‧‧‧ Passive optical components

31'''‧‧‧ Passive optical components

36‧‧‧Diffraction grating

26‧‧‧Detector configuration

Sb’‧‧‧ spacer section

Sb"‧‧‧ spacer part

Sb'''‧‧‧ spacer part

Sb''''‧‧‧ spacer part

t‧‧‧Transparent part

t’‧‧‧Transparent part

38‧‧‧稜鏡

M1‧‧‧Optical mirror

M2‧‧‧Optical mirror

M3‧‧‧Optical mirror

M4‧‧‧Optical mirror

F1‧‧‧ surface

F2‧‧‧ surface

Sp‧‧‧ channel divider

4’‧‧‧ Opening

24‧‧‧Detecting components

In the following, the invention will be described in more detail by way of examples and figures. The figures are shown in a schematic manner: 1 is a cross-sectional view of a device including an optical module; FIG. 2 is a various cross-sectional view of the composition of the optical module of FIG. 1; and FIG. 3 is used to form a plurality of FIG. FIG. 4 is a cross-sectional view of a wafer stack for forming a plurality of optical modules of FIG. 1; FIG. 5 is a cross-sectional view of a wafer stack for fabricating a plurality of the optical modules of FIG. 1. FIG. A cross-sectional view of an optical module; FIG. 6 is a cross-sectional view of an optical module including a diffraction grating; and FIG. 7 is a special illustration of a pattern through a vertical section of the embodiment of FIG. 8 is a side view of an optical module; FIG. 9 is a first interpretation of a vertical cross-section through the optical module of FIG. 8; FIG. 10 is a through the optical module of FIG. A second interpretation of a vertical cross-sectional view; FIG. 11 is a side view of an optical module; FIG. 12 is a vertical cross-sectional view through the optical module of FIG. 11; A cross-sectional view of the device of the module.

The described embodiments are intended to be illustrative, and should not be taken to limit the invention.

1 shows a schematic cross-sectional view of a device 10 comprising an optical module 1, wherein the optical module is in particular a photovoltaic module 1. The illustrated cross section is a vertical section. 2 is a schematic side cross-sectional view showing the composition of the module of FIG. 1, wherein the approximate positions of the side sections are indicated by s1 to s5 and dashed lines in FIG. Regarding s4 and s5, the viewing direction is indicated by an arrow.

Device 10 may be, for example, an electronic device and/or a camera device or a spectrometer device. In addition to the module 1, it also comprises a printed circuit board 9, which is mounted on the printed circuit board. Furthermore, mounted on the printed circuit board 9 is an integrated circuit 8, such as a control unit 8 or controller chip, which is operatively interconnected through the printed circuit board 9 and the module 1. For example, the integrated circuit 8 can evaluate the signal output by the module 1 and/or provide a signal to the module 1 for controlling the module 1.

The module 1 contains several compositions (P, S, O, B) stacked on one another in a direction defined as "vertical"; this corresponds to the z-direction (see Figure 1). A direction orthogonal to the vertical (z) direction on the x-y plane (see FIG. 2) is referred to as a "lateral direction."

The module 1 comprises a substrate P stacked on top of each other, a separator S (which may also be referred to as a spacer), an optics member O, and a non-essential shield B. The substrate P is, for example, a printed circuit board assembly or just a printed circuit board. The PCB of the printed circuit board (PCB) assembly is more specifically also referred to as an interposer. On the PCB, more specifically on a surface F2 of the substrate P, an active optical member 20 (e.g., light emitter 22) is mounted. A passive optical member 30 is also mounted thereon. The passive optical member is more specifically a reflective diffraction grating G. On the optics member O, in particular on a surface F1 of the optic member O, another passive optical member 30 is disposed thereon, more specifically a reflective member 32, such as a curved mirror.

The electrical contacts of the active optical device member 20 are electrically connected to the outside of the module 1 through the substrate P to which the solder balls 7 are attached. It is also possible to provide a contact pad on the PCB instead of a solder ball 7, which is not provided (or at a later point in time) on the contact pad.

Thereby, the module 1 can be mounted on the printed circuit board 9, for example by surface mount technology (SMT), and adjacent to other electronic components (for example, the controller 8). The module 1 is particularly suitable for use in a compact electronic device 10, such as in a hand-held device, as it can be designed and manufactured to have an extremely small size.

The partition member S has an opening 4 in which the active and passive optical members (22, 32, G) are disposed. In this way, these articles are laterally surrounded by the partition member S (see Figs. 1 and 2).

The partition (spacer) S can accomplish several tasks. It ensures (through its vertical extension) a well defined distance between the substrate P and the optic member O, which helps to achieve a well defined light path within the module. The spacer S can also inhibit the light generated by the active optical member 20 from diffusing outside the module 1 via the underlying light path. This is achieved by having the spacer S form part of the outer wall of the module 1, the spacer S being substantially made of an opaque material. Typically, The spacer S is made of a polymer material, in particular a hardenable, or more specifically curable, polymer material, such as an epoxy resin. If the separator S is substantially made of an opaque curable material, it may in particular be a heat curable material.

The optical device member O includes a shielding portion b and a transparent portion t for allowing light generated by the active optical member 20 to leave the module 1.

The occluding portion b is made substantially opaque by being made of a suitable (polymeric) material, such as a material similar to the separator S described. The transparent portion t comprises a passive optical member L or, more specifically, a lens element for light guiding, for example. The lens element L comprises, for example, a lens element 5 in close contact with the transparent element 6 as shown in FIG. The transparent element 6 can have the same vertical dimension as the obscuring portion b of the optic member O such that the obscuring portion b of the optic member O and the transparent element 6 together form a (near perfect) solid plate shape. Lens element 5 redirects light by refraction (see Figure 1) and/or by diffraction (not shown in Figure 1). The lens element L can, for example, be substantially convex (as shown in Figure 1), but the lens element 5 can be shaped differently, such as generally concave or partially concave. It is also possible to provide another optical structure on the opposite side of the transparent element 6 (not shown in Figure 1).

The shutter B is optional and can block unwanted light, especially light exiting the module 1 at a desired angle. Typically, the shutter B will have a transparent region 3 that can be embodied as an aperture or embodied in a transparent material. The shield B is available in a portion other than the transparent area 3 A material that substantially attenuates or blocks light, or a coating having such characteristics, wherein the latter is often more complicated to manufacture. The shutter B or more precisely the shape of the transparent region 3 may be different from the shape shown in Figures 1 and 2, and it may, for example, form a conical shape or a truncated pyramid shape.

Not only the side shape of the transparent region 3, but also the shape of the transparent portion t and the shape of the opening 4 may be different from the shape shown in FIG. 2, and have other appearances, such as a polygon having a rounded corner or a rectangle or an ellipse. shape.

Returning to the partition S, it does not alone comprise a laterally defined area in which the partition S extends vertically to a maximum extent, i.e. extends to substantially define the interposed substrate member P a degree of vertical distance from the optic member O, and a laterally defined region in which the spacer is completely free of material to form an opening that vertically traverses the maximum vertical extent . Moreover, there is a laterally defined region, the material of the spacer S (usually an opaque material) extending only vertically along a portion of the maximum vertical extent (ie, in the region of the spacer portion Sb) . Therefore, the spacer portion Sb can function as a light blocking member for the inside of the module 1 (see Fig. 1). It prevents light from spreading along unwanted paths. In particular, if the spacer S is manufactured using copying, the additional function of the spacer S provided by the spacer portion Sb can be easily achieved at almost no cost in terms of manufacturability and manufacturing steps. It should be noted that the same applies to the spacer portions (Sb, Sb', ...) in the other described embodiments.

The diffraction grating G can separate the light of different wavelengths emitted by the light-emitting element 22. In particular, this can be achieved with only a small portion of the different wavelengths emitted by the light emitter 22 being redirected by the diffraction grating G, the redirecting being by the portion of the light system via the transparent portion 1 leaves the module 1.

The active optical component 20 can also be a detecting component for detecting light, such as an image detector or a photodiode, instead of a light emitting module 1 including a light emitting member 22 as the active optical component 20. In this case, the spacer S can also be protected by being formed to be substantially opaque and by forming a portion of the outer wall of the module 1 and by forming a light shielding portion (ie, the spacer portion Sb). The side members block light that should not be detected by the detecting member. Furthermore, the transparent portion t can then be provided to allow light to enter the module 1 from outside the module 1 and to the detection member.

Light entering the module 1 from outside the module 1 via the transparent portion will be diffracted by the grating G such that a particular portion of the light (which has a wavelength in a particular (predefined) wavelength range) propagates to the passive The optical members 30, 32 are then reflected to be incident on the detection member. Therefore, a simple spectral analysis of light incident on the module 1 (more specifically, incident on the transparent portion t) can be achieved. What can be detected is how large the incident light is in the wavelength range.

Moreover, a light emitting member and a detecting member (not shown) may be provided in the module 1. In order to achieve electrical contact between the active optical components and the outside of the module 1, the two will typically be mounted to the substrate P. on. This module can be used to investigate the environment of the module 1 by, for example, emitting light out of the module 1 and detecting light that has interacted with an object in the environment of the module 1.

Furthermore, modules designed in accordance with the principles discussed above may be provided that include one or more additional electronic components in addition to one or two active optical components, such as additional photodetectors, and/or Or one or more integrated circuits, and/or two or more light sources.

The module 1 is an optoelectronic component, more precisely a packaged optoelectronic component. The vertical side walls of the module 1 are formed by objects P, S, O and B. A bottom wall is formed by the substrate P, and a top wall is formed by the shutter B or by the shutter B and the optical member O, or in the case where the wall B is not blocked, it is separately composed of the optical member O To form.

As can be clearly seen in Fig. 2, the four objects P, S, O and B can also be referred to as outer casing members (the outer casing constituting the module 1) for the above reasons, all of which have the same outer Side shape and outer side dimensions. This is related to a viable and highly efficient module 1 manufacturing method, which will be explained in more detail below with reference to Figures 3 and 4. These outer casing members P, S, O and B are generally all of a generally block or plate shape, or more generally a generally rectangular parallelogram, possibly having holes or openings (such as shield B and separator S). Or a (vertical) protrusion (for example, the optical member O has a protrusion due to the relationship of the optical structure 5).

The passive optical members 32 and G and the active optical member 22 are arranged such that light can propagate within the module 1 along the optical path and transparent portion t interconnecting the members. Set with optical components The separate transparent portions t of 32 (passive optical members 30, 32) have a lateral component (along the x-direction) of the optical path.

The active electronic component 20 (such as the light emitting component 22 in the example shown in FIG. 1) included in the module 1 may be a packaged or unpackaged electronic component. In order to contact the substrate P, a wire bonding technique or a flip chip technique or any other known surface mounting technique, or even a conventional perforation technique may be used. This applies to all of the described embodiments. Providing active optical components as bare die or wafer-scale packages allows for the design of particularly small modules 1 and allows active optical components packaged in different ways to be included in the module 1 inside.

3 shows a schematic cross-sectional view of a wafer used to form a wafer stack 2 for fabricating a plurality of modules shown in FIGS. 1 and 2. It is practical (actually) to manufacture the modules 1 entirely on a wafer-scale, with of course a subsequent segmentation step. Although Figures 3 and 4 only show that three modules 1 are provided, typically at least 10, or at least 30, or even more than 50 modules can be provided in each side of the wafer stack. Typical dimensions for each wafer are: laterally at least 5 cm or 10 cm, and up to 30 cm or 40 cm or even 50 cm; and vertically (measured when no components are placed on the substrate wafer PW) At least 0.2 mm to 0.4 mm or even 1 mm, and up to 6 mm or 10 mm or even 20 mm.

Four wafers (or three wafers without masking) are sufficient to make multiple modules as shown in Figure 1: a substrate wafer PW, a spacer wafer SW, and an optical wafer OW And non-essential occlusion Wafer BW. Each wafer contains a plurality of corresponding components (see FIGS. 1 and 2) contained within the respective module 1, which are typically disposed on a rectangular grid, typically having a small The distance is used for the wafer singulation step.

The substrate wafer PW may be a PCB assembly comprising a standard PCB material (for example, FR4) PCB having solder balls 7 on one side and one or more optical components (in FIG. 1: active optics) Member 22 and passive optical member G) are attached (e.g., soldered or bonded) to the other side thereof. The optical components can be placed on the substrate wafer PW, such as by pick-and-place using a standard pick and place machine. Similarly, passive optical member 32 can be disposed on optical wafer OW.

When the optical components are placed on a wafer, it is important to ensure that they are placed accurately enough to each other.

In order to provide maximum protection against unwanted light diffusion, all wafers PW, SW, OW, BW can be made substantially of opaque material, except in transparent areas such as transparent portions and transparent Area 3.

All or a portion of the wafers SW and BW and wafer OW may be fabricated by duplication or at least by duplication. In an exemplary replication process, a structured surface is embossed onto a liquid viscous material or a plastically deformable material, which is then cured, such as by using ultra-ultraviolet or heat, and then cured. The structured surface is removed. Thus, a replica of the structured surface (which in this example is a A negative replica) was obtained. Materials suitable for replication are, for example, hardenable (more specifically curable) polymeric materials or other replicating materials, ie, from a liquid-like viscosity during the hardening step (more specifically during the curing step). The state of hysteresis or plastic deformation is converted into a solid material. Replication is a well-known technique, see for example WO 2005/083789 A2 for more details on this technique.

In the example of the optical wafer OW, a copy, such as a convex embossing or molding, can be used to obtain an opaque portion (the occluding portion b). Holes may also be provided by drilling or etching where the transparent portion t should appear.

Next, a precursor wafer including the occluding portion b thus obtained is provided with a lens member L and a passive optical member 32. The former can be accomplished by replication, such as forming the lens member L as a single component, as described in US Publication No. US 2011/0043923 A1. However, the lens members L can also be fabricated from semi-finished components which are a wafer of transparent elements 6 contained within the holes from which the transparent portions t are formed. Defined. This is particularly useful when the lens elements L each have at least one apex and these vertices are located outside of the vertical section of the optical wafer OW. The half-finished component (typically and in the exemplary example shown in the figures) is a flat disk-shaped wafer that does not have holes in the transparent portion t that pass through the wafer and that have no or only very shallow surface wrinkles. These surface wrinkles are generally concave, i.e., do not exceed the surface of the wafer defined by the occluded portions b.

A semi-finished component as described above can be fabricated starting from a flat precursor wafer (typically made of a single constituent material) having holes in the portion where the transparent portion t should be present. Or opening, and then filling the holes with a transparent material using, for example, a dispensing process, and using, for example, a dispenser similar to the underfilling process in flip chip technology to wafer the precursor wafer The holes are filled one after the other, or filled with a plurality of holes at a time, for example, using a squeegee treatment (e.g., a screen printing user) or a dispenser of a hollow needle having a plurality of output materials. During the dispensing, the wafer can be placed on a flat support plate, such as a crucible. Care must be taken to prevent bubbles or voids from forming in the material to be dispensed, as this will degrade the optical properties of the manufactured lens member L. For example, the manner in which the dispensing is performed by the person may cause the wetting of the wafer material to begin at the edge of the wafer and the underlying support plate (or at a location near the edge), by properly guiding one A hollow needle that outputs the material is brought close to this edge. Next, the dispensed material is cured by heat or UV radiation to obtain a cured transparent material.

The convex meniscus that may be formed in this manner can be planarized by grinding to obtain a transparent member 6 having parallel surfaces that are adjusted to the thickness of the wafer. Then, by copying, the optical structure 5 (lens element 5) is applied to one side or both sides (top side and bottom side) of the optical device wafer OW. In the case of a concave crescent of the transparent elements, the replication can be applied to the wrinkles, wherein the applied replication material needs to be adjusted accordingly.

The spacer wafer SW and/or the occlusion wafer BW may be from the perspective of providing a special type of optical device wafer including the spacer wafer SW and the occlusion wafer BW. Obsolete, in which case various wafers are part of the wafer of the optics. The optical device wafer ("combined optical device wafer") includes the characteristics and functions of the spacer wafer SW and/or the occluding wafer BW. Fabrication of this "composite optics wafer" can be performed using a special precursor wafer, and a particular semi-finished component is fabricated on the precursor wafer. The precursor wafer and the semi-finished component each have at least one structured surface, typically having at least one protrusion that extends vertically beyond a portion that will be disposed within the precursor wafer and that appears in the half The two surfaces of the transparent element within the finished part. Considering the wafers OW and SW (or wafers OW and BW, or wafers OW and SW and BW) in Figure 4 as a single component, the optics used to fabricate the module of Figure 1 can be readily seen Wafers ("combined optics wafers") and a corresponding half-finished component look what it looks like.

In general, as part of the variations described above, the spacer wafer SW may be part of the substrate wafer PW. In this case, the substrate wafer PW will no longer be made of standard PCB material, but made of a replication material.

In order to form a wafer stack 2, the wafers are aligned and bonded together by using a heat curable epoxy. Ensure that each optical component (eg, active optical component 22 and passive optical component G) on the substrate wafer PW is accurately dispensed to the optical wafer The optical components of OW (for example, passive optical component 32) and the transparent portion t are critical points.

Figure 4 shows a cross-sectional view of the wafer stack 2 thus obtained for fabricating a plurality of modules 1 of Figure 1. This thin rectangular dashed line is where the splitting is performed using a slitting blade or laser cutting.

The fact that most of the alignment steps are implemented at the wafer level makes it possible to achieve good optical component alignment in a relatively simple and extremely fast manner. Thus, a clearly defined optical path for the light inside the module 1 can be implemented. The overall process is fast and accurate. Because of the wafer-scale manufacturing relationship, only a few manufacturing steps are required to fabricate multiple modules 1.

Following the concepts presented above, various other optical modules 1 can be constructed and fabricated. In the following, some examples are described.

Figure 5 shows a cross-sectional view of an optical module 1 on a printed circuit board 9. Contrary to the module of Fig. 1, the transparent portion t is not disposed on the optical member O, but is disposed on the substrate member P. When the optical module is mounted on the PCB 9, a through hole 19 is provided on the PCB 9 for allowing light to enter (or leave) the optical module 1 via the through hole and via the transparent portion t. The perforations 19 can act like a baffle to limit the range of angles in which light can enter the optical module 1. Since the positioning accuracy achievable on a PCB is very limited (in terms of optical standards), the perforations 19 will be designed to have a lateral extent greater than the lateral extent of the transparent portion t .

Furthermore, another possible variation of the transparent portion t is exemplified in Figure 5. In the illustrated example, the transparent portion t is only an opening in the outer casing 11 of the module 1. A transparent element similar to the transparent element 6 of Figures 1 to 4 can also be provided in the transparent portion t; this will help to prevent unwanted particles (e.g., dust) from entering the module 1. Similarly to the examples of Figs. 1 to 4, the outer casing 11 of the module 1 is substantially constituted by constituent members O, S, P (including non-essential members B in Figs. 1 to 4).

The active optical component 25 of the module 1 of Figure 5 can be, for example, a pixel array, such as an image sensor. An optical grating G is provided as a passive optical component. The spacer portion Sb contributes to preventing stray light entering the module 1 in an undesired manner from being detected by the active optical member 25.

Thereby, the module 1 in FIG. 5 can be used, for example, to spectrally analyze the light entering the module 1. The signal obtained by the active optical member 25 can be sent through the solder ball 7 to an evaluation unit operatively coupled to the PCB 9, for example, to an integrated circuit similar to the member 8 of FIG.

Another optical module 1 is illustrated in the form of a cross-sectional view in FIG. In the optical module, the transparent portion t comprises a lens member L comprising a transparent element 6, on each surface of the two opposite surfaces of the transparent element 6, a lens element 5 is attached, for example by means of a wafer Hierarchical copying to make (see above for details). A configuration 26 of a photodiode (e.g., in a straight line configuration) is disposed on the substrate member P. Further, three passive optical members G, 31', 31"' are provided on the base member P. Passive optics Member G is a reflective diffraction grating 36, and passive optical members 31', 31"' are embodied as optical mirrors. The grating G can be fabricated using replication (especially at the wafer level), or it can be a (pre-fabricated) raster, placed by, for example, a pick-and-place. Three passive optical members 31, 31", 31"" are provided on the optics member O, which are embodied as optical mirrors.

The mirror (or at least a portion thereof) may be a pre-manufactured mirror placed on each member by pick and place operations, or may be implemented by applying a coating to each member (on components O and P, respectively) .

The light entering the module 1 (via the transparent portion t) can proceed in the order of the grating G, the mirrors 31, 31', 31", 31", 31"" and the detector configuration 26 The light path propagates. A number of spacer portions, namely Sb, Sb', Sb", Sb''', Sb'''', block stray light from propagating toward the detector configuration 26. In the first way of interpreting Figure 6, the optical components shown in Figure 6 are disposed substantially along a generally x-z plane. In this example, the optical module 1 shown in Figure 6 will generally be of a relatively elongated shape with an extension in the y-direction that constitutes only a fraction of its extent in the x-direction (see figure). 6 coordinate system in the lower left corner). The light path drawn by the light propagating inside the optical module 1 advances in the x direction.

However, as illustrated in FIG. 7, it can also be applied to a specific use in the y direction. In a second interpretation, Figure 7 shows a pattern on a vertical section through the embodiment of Figure 6. The dotted line and the open arrow in Fig. 6 indicate the approximate position of the section. In this special interpretation of the embodiment illustrated in FIG. 6, by the optical module 1 The light path depicted by the propagating light has substantial components in both the x-direction and the y-direction. Thereby, a relatively long path length of the light path followed by the propagation of light inside the optical module 1 can be achieved. Moreover, various ways of shaping a light beam within the optical module 1 can thus be achieved.

As shown in Figure 7, it is possible to select substantially any suitable amount of extension of the spacer portions Sb, Sb', Sb" ... along the y-axis. However, at the vertical extent shown in Figure 6, the spacing The amount of extension of the y-axis of the piece portions Sb, Sb', Sb", ... may also completely traverse the amount of extension along the y-axis of the opening 4 (this is different from that shown in Figure 7). Vice versa, if there is an extension of the spacer portions Sb, Sb', Sb", ... as shown in Fig. 7 along the y-axis, the spacer portions Sb, Sb', Sb" ... along The amount of extension of the z-axis may also be completely transverse to the amount of vertical extension along the z-axis of the opening 4 (this is different from that shown in Figure 6). Of course, substantially, and for any embodiment, the spacer portions, such as the spacer portions Sb, Sb', Sb", ... may not only be rectangular in shape, but may also be many other shapes, such as wedges and bends. Corner shape.

8 is a side view of another optical module 1, in which both lateral directions are utilized, and more specifically, light propagation in the module 1 occurs not only in one lateral direction, but It has a substantial component in both lateral directions (x and y). More specifically, in FIG. 8, the light that has entered the optical module 1 from the transparent portion t is diffracted in the diffraction grating G, and then the propagation direction inside the optical module 1 is related to the wavelength of the light. . Thus, as shown in Figure 8, light propagating along a different (lateral) direction of light path enters the light in another mixture, such as white light or different wavelengths of light. Module 1 can be presented simultaneously.

In the first interpretation, the embodiment of Figure 8 is a complete passive optical module 1. Figure 9 shows a vertical section through the optical module of Figure 8 in this first interpretation. The dotted line and the open arrow in Fig. 8 indicate the position at which the section is taken. There are four transparent portions t' on the right hand side (see Fig. 8) through which the diffracted light can exit the optical module 1. The color (or wavelength) of the light leaving each transparent portion t' will be different at these four transparent portions t'. A 稜鏡 38 is provided to redirect the light.

I can also let light exit through the substrate P (not shown in Figures 7 and 8) rather than through the optic member O. In this case, one or more at least partially reflective elements, such as optical mirror 38, may be disposed within or disposed on optics member O for directing the diffracted light The base member S on which the transparent portion t' is provided is reflected.

Of course, a completely passive optical module can also be placed in an example where light propagates substantially only along a plane containing the vertical axis (z-axis). A fully passive optical module, as mentioned above, is useful in optical communication devices or as an optical communication device. Alternatively, they can (only when light enters the module) only allow light of certain colors to leak out; or let light of certain colors leak out in different places. Moreover, a photovoltaic module can constitute an optical communication device or a portion thereof.

In an embodiment similar to that of Figure 9, a multi-wavelength source can be placed at the location of the transparent portion t to emit light toward the diffraction grating G. The light source can for example be a white light emitting LED. Therefore, different wavelengths The light (and the light of different colors) can be emitted through each transparent portion t'.

Figure 10 is a diagram of a vertical section through the optical module of Figure 8 in a second interpretation. In this example, the optical module 1 is a photovoltaic module. Four light detecting elements 26 (e.g., photodiodes) are provided to detect different wavelengths of light that are diffracted. Light enters the optical module 1 via the substrate member P.

In either interpretation, the embodiment of Figure 8 can constitute a (simple) spectrometer. In this first interpretation, the detection can be performed with the naked eye, or the diffracted light exiting the optical module 1 can be further processed or analyzed by one or more additional devices.

It should be noted that in FIGS. 9 and 10 and FIGS. 11 and 12, members O, S, and P are not clearly distinguished in the drawings. As mentioned before, the optical member O and the partition member S or the base member P and the partition member S may be a single member. Of course, they can also be separate components, such as shown in the other figures, as shown in Figures 1 through 6 and Figure 13 (see below). In general, any of the following may be provided in any of the described embodiments: a separate dividing member S; or a dividing member S contained in the optical member O; or a partition contained in the substrate P Member S. 11 is a side view of an optical module 1, and FIG. 12 is a vertical cross-sectional view taken through the optical module 1 of FIG. 11 at a position indicated by an open arrow of FIG. The substrate member P comprises a transparent portion t comprising a grating G' (and substantially formed by the grating G'), which is a Transmissive diffraction grating. Another grating, that is, a reflective diffraction grating G is disposed on the surface F1 of the optical device member O. A plurality of active optical members 20 (more specifically, a detecting member 26 such as a photodiode) are disposed on the surface F2 of the substrate P. Thereby, a micro spectroscope can be realized. Light entering the module 1 via the transmissive diffraction grating G' is thus diffracted. Therefore, only light in a predetermined wavelength range is incident on the reflective diffraction grating G. The light is then diffracted by the diffraction grating G such that the light ultimately incident on each of the detecting members 26 has a wavelength in a small wavelength range which is not for each of the different detecting members 26. identical.

FIG. 13 is a cross-sectional view of a device 10 including an optical module 1. In many aspects, the optical module 1 is similar to the optical module of Figure 1 and referenced to its component numbers. The optical module 1 of Figure 15 includes two separate channels: a transmit channel (on the right hand side of Figure 15) and a detection channel (on the left hand side of Figure 15). The spacer portion Sp of the spacer member S optically separates the two channels; it may thus be referred to as a channel divider Sp. Therefore, there is no crosstalk between the two channels (since the channel divider Sp is opaque). The partition member S comprises two separate openings 4 and 4', one for each channel. The emission channel includes an emitting member 22 that acts as an active optical member 20, such as an LED (Light Emitting Diode). The detection channel includes a plurality of detecting members 24 (for example, photodiodes) as the active optical member 20, and a multi-pixel detector can also be disposed. The detection channel further includes the passive optical member 30, more specifically, a diffraction grating G and another diffraction grating G'. Moreover, a spacer similar to that of Figures 5 and 6 The spacer portion Sb of the portion Sb may be disposed in the detection channel as a light shielding member.

The light emitted by the emitting member 22 passes through a transparent portion t comprising a lens member L which is typically used to form a beam of light. If the light emitted from the optical module 1 interacts with an external object, a portion of the light may eventually enter the optical module 1, more specifically into the detection channel. The light is then diffracted by the diffraction grating G and at least partially redirected by the diffraction grating G' (by diffraction) and then at least partially hits again onto the one or more detection members 24.

The amount of light thus detected and its distribution on the detecting members 24 can result in a result regarding the color and/or position of the outer object, wherein the position is referred to as the outer object related The relative position of the optical module 1. The optical module 1 can be, for example, a proximity sensor and/or a (simple) spectrometer (which has its own light source).

It will be apparent from the above that a wide variety of optical configurations can be implemented within the framework of the present invention, for example, configurations that are generally well suited for implementation using flat shaped optics. Moreover, standard optical devices can be implemented in a miniaturized and mass-produced manner, and passive and active optical modules can be placed in such optical devices.

Various optical configurations can be realized by the present invention in the form of a micro-optical package (module 1).

1‧‧‧Optical module

4‧‧‧ openings

6‧‧‧Transparent components

7‧‧‧ solder balls

9‧‧‧ Printed Circuit Board (PCB)

11‧‧‧Shell

19‧‧‧Perforation

20‧‧‧Active optical components

25‧‧‧Active optical components

t‧‧‧Transparent part

G‧‧‧Diffractive grating

P‧‧‧Substrate

S‧‧‧parts

Sb‧‧‧ Structure

O‧‧‧Optical component

F1‧‧‧ surface

F2‧‧‧ surface

Claims (24)

An optical module includes: a first member having a substantially flat first surface, wherein a direction orthogonal to the first surface is referred to as a vertical direction; and a second member having a first surface facing the first surface a second surface that is substantially flat and aligned substantially parallel to the first surface; a third member that is included in or included in the first member or different from the first surface a first member and a second member positioned between the first and second members, comprising an opening; and a diffraction grating; wherein the first member comprises one or more light transmissive transparent portions. The optical module of claim 1, wherein the diffraction grating is at least one of: included in the first member; included in at least one of the one or more transparent portions Attached to the first surface; contained within the second member; attached to the second surface; disposed within the opening. The optical module of claim 1 or 2, wherein the opening is defined by the first member, the second member, and the third member. An optical module according to any one of the preceding claims, wherein the optical module is constructed and constructed such that light can be interconnected along at least one of the one or more transparent portions and the diffraction grating. Light path propagation. The optical module of any of the preceding claims, wherein the first member, the second member, and the third member are substantially block-shaped or plate-like in shape, comprising at least one hole. An optical module according to any one of the preceding claims, wherein the outer boundary of the vertical silhouette of the module and the outer boundary of the vertical contour of the first member, the second member and the third member are each Both depict the same substantial rectangular shape. The optical module of any of the preceding claims, wherein at least one of the first member and the second member, and in particular both, are at least partially fabricated substantially from an at least substantially opaque material. The optical module of any of the preceding claims, wherein the third member is at least partially fabricated substantially from a material that is at least substantially opaque. The optical module of any of the preceding claims, wherein the third member is a single component. An optical module according to any one of the preceding claims, wherein the third member is made of a hardenable hardenable material and obtained using a replication process, at least one of the two. An optical module according to any one of the preceding claims, wherein the diffraction grating is obtained by using a hardenable hardenable material and using a replication process, at least one of the two. An optical module according to any one of the preceding claims, further comprising at least one of: a passive optical component, in particular an at least partially reflective component; An active optical component, in particular a light emitting component or a light detecting component. An optical module according to any one of the preceding claims, comprising an inner space and a casing surrounding the inner space, the inner space being contained in the opening except the one or more transparent portions All are completely opaque such that light can only enter or exit the interior space via the one or more transparent portions, and more particularly wherein the first member, the second member, and the third member constitute the outer casing. An application device comprising a plurality of optical modules according to any of the preceding claims. The application device of claim 14, comprising: a first wafer comprising a plurality of the first members; a second wafer comprising a plurality of the second members; a third wafer, The method includes a plurality of the third members, wherein the third wafer is included in the first wafer or included in the second wafer or different from the first and second wafers; and the plurality of Diffraction grating. A method of fabricating an optical module, the method comprising the steps of: a) providing a first wafer comprising a plurality of transparent portions through which light can pass; b) providing a second wafer; c) providing a third a wafer, wherein the third wafer is included in the first wafer or included in the second wafer or with the first and second wafers And the third wafer includes a plurality of openings; d) providing a plurality of diffraction gratings; e) forming a wafer stack including the first wafer, the second wafer, and the third wafer And the plurality of diffraction gratings; in particular, wherein the step e) comprises the steps of: e1) arranging the first, second, and third wafers and the diffraction gratings such that the third wafer is disposed at Each of the plurality of diffraction gratings between the first and second wafers is assigned to an opening of the plurality of openings and a transparent portion of the plurality of transparent portions. The method of claim 16, further comprising the step of: k) fabricating each of the plurality of diffraction gratings using a replication process, particularly using a embossing process. The method of claim 16 or 17, further comprising the steps of: l) setting a diffraction grating of each of the plurality of diffraction gratings using a pick-and-place step On or on the first surface. The method of claim 17, wherein in step k), the diffraction gratings are fabricated on the first surface or fabricated on the second surface or with the first or second crystal The circles are manufactured together in one process. The method of claim 17 or 19, wherein the step k) comprises the following steps: i) depositing a replication material on the first surface or the second surface; ii) contacting a replication tool with the replication material; iii) hardening the replication material; iv) removing the replication tool. The method of any one of claims 16 to 20, comprising the steps of: m) fabricating each transparent portion of the plurality of transparent portions or using the replication process, in particular the embossing process A part of a plurality of transparent parts. The method of any one of claims 16 to 21, comprising the steps of: n1) using a replication process, in particular a embossing process, to fabricate the first wafer; n2) using a copy process, In particular, the embossing process is used to fabricate the second wafer; n3) the third wafer is fabricated using a replication process, particularly a embossing process. The method of any one of claims 16 to 22, comprising the steps of: f) dividing the wafer stack into the plurality of optical modules. A method of manufacturing a device, the device comprising an optical module, the method comprising the optical module manufactured by the method of any one of claims 16 to 23, in particular, wherein the optical module is The optical module of any one of claims 1 to 14.