TWI647431B - Optical metrology apparatus and method - Google Patents

Optical metrology apparatus and method Download PDF

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TWI647431B
TWI647431B TW105135496A TW105135496A TWI647431B TW I647431 B TWI647431 B TW I647431B TW 105135496 A TW105135496 A TW 105135496A TW 105135496 A TW105135496 A TW 105135496A TW I647431 B TWI647431 B TW I647431B
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light
illumination
sample
line
detector
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TW105135496A
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TW201719126A (en
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安德茲 巴克考斯基
米哈伊爾 史辣克
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耐諾股份有限公司
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  • Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
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Abstract

一種光學計量器件能夠偵測來自跨越一樣本之寬度之一線之光致發光光、寬頻帶光之鏡面反射與散射光之任何組合。該計量器件包含在該樣本上產生一第一照射線之一第一光源。一掃描系統可用於使一照射點掃描跨越該樣本以形成該照射線。一偵測器收集沿著該照射線發射之該光致發光光。另外,可使用一寬頻帶照射源在該樣本上產生一第二照射線,其中該偵測器收集沿著該第二照射線反射之該寬頻帶照射。一信號收集光學器件可收集該光致發光光及該寬頻帶光且將其聚焦成由一光導管接收之一線。該光導管之輸出端具有與該偵測器之入口匹配之一形狀。 An optical metrology device is capable of detecting any combination of specular and scattered light from photoluminescent light, broadband light across a line of the same width. The metering device includes a first source of light that produces a first illumination line on the sample. A scanning system can be used to scan an illumination spot across the sample to form the illumination line. A detector collects the photoluminescent light emitted along the illumination line. Additionally, a second illumination line can be generated on the sample using a broadband illumination source, wherein the detector collects the broadband illumination reflected along the second illumination line. A signal collecting optics collects the photoluminescent light and the broadband light and focuses it to receive a line by a light pipe. The output of the light pipe has a shape that matches one of the entrances of the detector.

Description

光學計量裝置及方法 Optical metering device and method

光致發光成像及光譜學係探測材料(諸如矽半導體晶圓、太陽能電池以及其他工件及材料)之電子結構之一無接觸非破壞性方法。在一典型光致發光程序中,光經引導至一晶圓或其他工件(在下文中統稱為一「樣本」)上,其中至少某些光被吸收。所吸收之光經由一「光激發」程序將多餘能量施予材料中。樣本透過一系列路徑消散多餘能量;一個此路徑係光之發射或光致發光。光致發光之強度及光譜內容係與樣本之各種材料性質直接相關,且因此可用於判定樣本之特定特性(包含缺陷),如在美國專利第7,113,276B1號中所論述,該美國專利以引用之方式併入本文中。 Photoluminescence imaging and spectroscopy are one of the non-contact, non-destructive methods of detecting electronic structures of materials such as germanium semiconductor wafers, solar cells, and other workpieces and materials. In a typical photoluminescence process, light is directed onto a wafer or other workpiece (collectively referred to hereinafter as a "sample"), at least some of which is absorbed. The absorbed light is applied to the material via a "light excitation" procedure. The sample dissipates excess energy through a series of paths; one of which is the emission of light or photoluminescence. The intensity and spectral content of the photoluminescence are directly related to the various material properties of the sample and can therefore be used to determine the particular properties of the sample, including defects, as discussed in U.S. Patent No. 7,113,276, the disclosure of which is incorporated herein by reference. The manner is incorporated herein.

反射或反射性成像係用一寬頻帶照射源探測表面且分析自表面回彈之信號之強度及光譜內容之一無接觸非破壞性方法。表面通常可分類成鏡面表面或漫射表面且實物通常展現兩種性質之一混合。 Reflective or reflective imaging is a contactless non-destructive method that uses a broadband illumination source to detect the surface and analyze the intensity and spectral content of the signal from surface rejuvenation. Surfaces can generally be classified as specular or diffuse surfaces and the physical material typically exhibits a mixture of two properties.

有時可期望(例如)半導體晶圓檢驗應用量測光致發光之強度及光譜內容及半導體晶圓大小之工件之反射以用於以單晶圓負載在同一裝置中同時或以一短序列進行品質檢驗同時達成組合有高量測空間及光譜解析度之一高量測輸送量之目的。 It is sometimes desirable to, for example, use semiconductor wafer inspection applications to measure the intensity of photoluminescence and the reflection of the spectral content and the semiconductor wafer size of the workpiece for loading in a single wafer at the same time or in a short sequence. At the same time, the quality inspection achieves the purpose of combining high-measurement space and spectral resolution to measure the amount of conveyance.

習知使用一單一逐點檢驗方案來量測光譜光致發光或經組合之光譜光致發光與反射。在一逐點方案中,樣本放置於一X-Y運動(或R-Θ)系統上且在一單一激發點處被照射且量測。樣本經移動至另一量測點且再次被照射及量測。藉由沿X-Y方向重複樣本之平移,可自逐點量測建構一光致發光與反射映射。然而,由於低輸送量,此方案本質上係緩慢的,且因此在全晶圓檢驗系統中係不切實際的,尤其在大樣品大小(直徑接近及大於100mm)的情況中更係如此。 It is conventional to measure spectral photoluminescence or combined spectral photoluminescence and reflection using a single point-by-point assay scheme. In a point-by-point approach, the sample is placed on an X-Y motion (or R-Θ) system and illuminated and measured at a single excitation point. The sample is moved to another measurement point and is again illuminated and measured. By repeating the translation of the sample in the X-Y direction, a photoluminescence and reflection map can be constructed from a point-by-point measurement. However, this approach is inherently slow due to the low throughput and is therefore impractical in a full wafer inspection system, especially in the case of large sample sizes (diameters approaching and greater than 100 mm).

一光學計量器件能夠偵測來自跨越一樣本之寬度之一線之光致發光光、寬頻帶光之鏡面反射與散射光之任何組合。該計量器件包含在該樣本上產生一第一照射線之一第一光源。一掃描系統可用於使一照射點掃描跨越樣本以形成該照射線。一偵測器收集沿著該照射線發射之該光致發光光。另外,可使用一寬頻帶照射源在該樣本上產生一第二照射線,其中該偵測器收集沿著該第二照射線反射之該寬頻帶照射。該偵測器亦可將來自該第一照射線之散射光成像。該等照射線可掃描跨越該樣本,使得可量測該樣本上之所有位置。一信號收集光學器件可收集該光致發光光及該寬頻帶光且將其聚焦成由一光導管接收之一線。該光導管之輸出端具有與該偵測器之入口匹配之一形狀。 An optical metrology device is capable of detecting any combination of specular reflection and scattered light from a line of light across a width of the same width, broadband light. The metering device includes a first source of light that produces a first illumination line on the sample. A scanning system can be used to scan an illumination spot across the sample to form the illumination line. A detector collects the photoluminescent light emitted along the illumination line. Additionally, a second illumination line can be generated on the sample using a broadband illumination source, wherein the detector collects the broadband illumination reflected along the second illumination line. The detector can also image scattered light from the first illumination line. The illumination lines can be scanned across the sample such that all locations on the sample can be measured. A signal collecting optics collects the photoluminescent light and the broadband light and focuses it to receive a line by a light pipe. The output of the light pipe has a shape that matches one of the entrances of the detector.

在一項實施例中,一裝置包含:一照射源,其產生一第一光束;一第一透鏡系統,其致使該第一光束入射於一樣本之一表面上作為沿著一第一方向定向之一第一照射線,該第一照射線以一第一入射角入射於該樣本上,其中該樣本沿著該第一照射線回應於由該第一光束所致之激發而發射光致發光光;一第二照射源;一第二透鏡系統,其將由該第二照射源發射 之光聚焦至該樣本上作為沿著第一方向定向且疊加於該樣本之該表面上之該第一照射線上之一第二照射線,且該第二照射線以不同於該第一入射角之一第二入射角入射於該樣本上;一載台,其用於提供該樣本與第一及第二照射線之間沿不同於該第一方向之一第二方向之相對移動;一偵測器,其收集來自該第二照射線之反射光,且接收由該樣本沿著第一照射線發射之光致發光光;一信號收集光學器件,其延伸達該第一照射線及該第二照射線之一長度,該信號收集光學器件接收來自該第一照射線之該光致發光光及來自該第二照射線之反射光,且將該光致發光光及該反射光聚焦成一線;一光導管,其具有接收由該信號收集光學器件聚焦之該光致發光光及該反射光之一線性接收端,該光導管進一步具有經組態以將該光致發光光及該反射光提供至該偵測器之一輸出端,該輸出端具有不同於該線性接收端之一形狀;及一處理器,其耦合至該偵測器且經組態以使用該光致發光光及該反射光針對該樣本之該表面上之複數個位置判定該樣本之一特性。 In one embodiment, a device includes: an illumination source that generates a first beam; a first lens system that causes the first beam to be incident on a surface of the same body as oriented along a first direction a first illumination line incident on the sample at a first angle of incidence, wherein the sample emits photoluminescence along the first illumination line in response to excitation by the first beam Light; a second illumination source; a second lens system that will be emitted by the second illumination source Light is focused onto the sample as a second illumination line on the first illumination line oriented along the first direction and superimposed on the surface of the sample, and the second illumination line is different from the first illumination angle a second incident angle incident on the sample; a stage for providing relative movement between the sample and the first and second illumination lines in a second direction different from the first direction; a detector that collects reflected light from the second illumination line and receives photoluminescent light emitted by the sample along the first illumination line; a signal collection optic extending to the first illumination line and the first a length of one of the two illumination lines, the signal collecting optics receiving the photoluminescence light from the first illumination line and the reflected light from the second illumination line, and focusing the photoluminescence light and the reflected light into a line a light pipe having a linear receiving end for receiving the photoluminescent light focused by the signal collecting optics and the reflected light, the light pipe further having a configuration to illuminate the photoluminescent light and the reflected light Provided to the detector An output having a shape different from one of the linear receiving ends; and a processor coupled to the detector and configured to use the photoluminescent light and the reflected light for the surface of the sample A plurality of positions above determine a characteristic of the sample.

在一項實施例中,一裝置包含:一光源,其產生一照射光束;一光學系統,其接收該照射光束且在一樣本之一表面上產生一照射點;一掃描系統,其使該照射點掃描跨越該樣本以形成一照射線,其中該樣本沿著該照射線回應於由該照射點所致之激發而發射光致發光光;一載台,其用於提供該照射線與該樣本之間的相對移動;一信號收集光學器件,其延伸達該照射線之一長度,該信號收集光學器件接收來自該照射線之該光致發光光且將該光致發光光聚焦成一線;一光導管,其具有接收由該信號收集光學器件聚焦之該光致發光光之一線性接收端,該光導管進一步具有一輸出端,該輸出端具有不同於該線性接收端之一形狀;一偵測器,其收集來自該光導管之該光致發光光,該偵測器具有與該光導管之該輸出端之一形狀 匹配之一入口孔隙;及一處理器,其耦合至該偵測器以接收該光致發光光以判定該樣本之一特性。 In one embodiment, a device includes: a light source that produces an illumination beam; an optical system that receives the illumination beam and produces an illumination spot on a surface of one of the samples; and a scanning system that causes the illumination A point scan spans the sample to form an illumination line, wherein the sample emits photoluminescent light along the illumination line in response to excitation by the illumination point; a stage for providing the illumination line and the sample Relative movement between the signals; a signal collecting optic extending to a length of the illumination line, the signal collecting optics receiving the photoluminescent light from the illumination line and focusing the photoluminescent light into a line; a light pipe having a linear receiving end for receiving the photoluminescent light focused by the signal collecting optics, the light pipe further having an output having a shape different from one of the linear receiving ends; a detector that collects the photoluminescent light from the light pipe, the detector having a shape with the output of the light pipe Matching one of the entrance apertures; and a processor coupled to the detector to receive the photoluminescent light to determine a characteristic of the sample.

在一個實施例中,一方法包含:沿著具有沿一第一方向之一定向之一照射線使用一光源照射一樣本之一表面,其中該樣本回應於由來自該光源之光所致之激發而自該照射線發射光致發光光;沿著該照射線之一長度使用一信號收集光學器件自該照射線收集該光致發光光且使用該信號收集光學器件將該光致發光光聚焦成一線;使用具有一線性接收端之一光導管沿著該線接收該光致發光光且在具有不同於該線性接收端之一形狀之一輸出端處自該光導管輸出該光致發光光;使用具有與該光導管之該輸出端之一形狀匹配之一入口孔隙之一偵測器偵測自該光導管之該輸出端接收之該光致發光光;沿不同於該第一方向之一第二方向使該照射線移動跨越該樣本之該表面;且使用由該偵測器偵測到之該光致發光光針對該樣本之該表面上之複數個位置判定該樣本之一特性。 In one embodiment, a method includes: illuminating a surface with a light source along an illumination line having one of the directions along a first direction, wherein the sample is responsive to excitation by light from the source And emitting photoluminescence light from the illumination line; collecting the photoluminescence light from the illumination line using a signal collection optic along a length of the illumination line and using the signal collection optics to focus the photoluminescence light a line; receiving the photoluminescent light along the line using a light pipe having a linear receiving end and outputting the photoluminescent light from the light pipe at an output having a shape different from one of the linear receiving ends; Detecting the photoluminescence light received from the output end of the light pipe using a detector having one of the inlet apertures shaped to match one of the output ends of the light pipe; along one of the first directions a second direction causing the illumination line to move across the surface of the sample; and determining, by using the photoluminescence light detected by the detector, a plurality of locations on the surface of the sample .

100‧‧‧光學計量器件/計量器件 100‧‧‧Optical metering device / metering device

100'‧‧‧光學計量器件 100'‧‧‧Optical metering device

100"‧‧‧光學計量器件 100"‧‧‧Optical metering device

101‧‧‧樣本 101‧‧‧ sample

104‧‧‧載台/線性載台 104‧‧‧stage/linear stage

110‧‧‧第一光源/窄頻帶照射源/光源/窄頻帶光源 110‧‧‧First light source/narrowband illumination source/light source/narrowband source

111‧‧‧選用F-θ透鏡 111‧‧‧Select F-θ lens

112‧‧‧光學器件/透鏡 112‧‧‧Optics/Lens

114‧‧‧照射光束/經準直照射光束/窄頻帶照射光束/掃描照射光束/入射照射光束 114‧‧‧Illumination beam/collimated illumination beam/narrowband illumination beam/scanning illumination beam/incident illumination beam

114'‧‧‧照射光束/窄頻帶照射光束/窄頻帶照射 114'‧‧‧Illuminated beam/narrowband illumination beam/narrowband illumination

114"‧‧‧窄頻帶照射光束/窄頻帶照射 114"‧‧‧Narrowband illumination beam/narrowband illumination

115‧‧‧散射光 115‧‧‧scattered light

116‧‧‧掃描系統 116‧‧‧ scanning system

117‧‧‧光致發光光 117‧‧‧Photoluminescent light

118‧‧‧掃描鏡/鏡 118‧‧‧Scan mirror/mirror

119‧‧‧光束偏光器 119‧‧‧beam polarizer

120‧‧‧固定鏡/重定向鏡 120‧‧‧Fixed/redirect mirror

121‧‧‧線 121‧‧‧ line

122‧‧‧照射線/激發線 122‧‧‧irradiation/excitation line

123‧‧‧箭頭 123‧‧‧ arrow

124‧‧‧照射點 124‧‧‧illumination point

125‧‧‧線 125‧‧‧ line

125"‧‧‧鏡面反射 125"‧‧ ‧ specular reflection

126‧‧‧表面缺陷/缺陷 126‧‧‧ Surface defects/defects

127‧‧‧箭頭 127‧‧‧ arrow

130‧‧‧偵測器/信號偵測器 130‧‧‧Detector/Signal Detector

131‧‧‧偵測器路徑 131‧‧‧Detector Path

132‧‧‧光學器件/前部光學器件 132‧‧‧Optics/front optics

133‧‧‧分析儀 133‧‧‧Analyzer

134‧‧‧光譜儀 134‧‧‧ Spectrometer

136‧‧‧感測器/攝影機感測器/感測器偵測器 136‧‧‧Sensor/Camera Sensor/Sensor Detector

140‧‧‧第二光源/寬頻帶光源/光源 140‧‧‧Second light source/broadband light source/light source

141‧‧‧線/寬頻帶照射 141‧‧‧Line/Broadband illumination

142‧‧‧照射線/寬頻帶照射線/線/激發線 142‧‧‧Illumination line/broadband illumination line/line/excitation line

143‧‧‧寬頻帶光/所反射寬頻帶光 143‧‧‧Broadband light/reflected broadband light

144‧‧‧光纖 144‧‧‧ fiber optic

145‧‧‧箭頭 145‧‧‧ arrow

146‧‧‧柱面透鏡 146‧‧‧ cylindrical lens

150‧‧‧電腦 150‧‧‧ computer

152‧‧‧處理器 152‧‧‧ processor

154‧‧‧記憶體 154‧‧‧ memory

158‧‧‧顯示器 158‧‧‧ display

160‧‧‧輸入器件 160‧‧‧Input device

162‧‧‧非暫時性電腦可用媒體/電腦可讀儲存媒體/電腦可用媒體 162‧‧‧Non-temporary computer usable media/computer readable storage media/computer usable media

164‧‧‧通信埠 164‧‧‧Communication埠

202‧‧‧峰值 202‧‧‧ peak

204‧‧‧峰值 204‧‧‧ peak

206‧‧‧峰值 206‧‧‧ peak

402‧‧‧長橢圓柱面鏡/橢圓鏡/橢圓柱面鏡/光學器件 402‧‧‧Long elliptical cylindrical mirror / elliptical mirror / elliptical cylindrical mirror / optics

403‧‧‧狹縫 403‧‧‧slit

406‧‧‧激發雷射光束/雷射光束/光束/激發光束 406‧‧‧Excitation laser beam/laser beam/beam/excitation beam

407‧‧‧光學信號/所得光學信號 407‧‧‧ Optical signal / resulting optical signal

409‧‧‧經鏡面反射之光 409‧‧‧Mirror-reflected light

410‧‧‧線 410‧‧‧ line

412‧‧‧光導管 412‧‧‧Light pipe

414‧‧‧線性信號接收端 414‧‧‧Linear signal receiver

416‧‧‧信號輸出端/矩形信號輸出端 416‧‧‧Signal output / rectangular signal output

418‧‧‧光纖 418‧‧‧ fiber optic

452‧‧‧濾光器/光學濾光器 452‧‧‧Filter/Optical Filter

454‧‧‧光譜儀 454‧‧‧ Spectrometer

456‧‧‧CCD或CMOS攝影機感測器陣列 456‧‧‧CCD or CMOS camera sensor array

458‧‧‧資料獲取器件 458‧‧‧ data acquisition device

462‧‧‧光電倍增管/突崩光二極體 462‧‧‧Photomultiplier tube / sudden photodiode

502‧‧‧長圓柱形透鏡/圓柱形透鏡/透鏡/光學器件 502‧‧‧Long cylindrical lens / cylindrical lens / lens / optics

510‧‧‧線 Line 510‧‧

N‧‧‧法線/表面法線 N‧‧‧ normal/surface normal

X‧‧‧軸 X‧‧‧ axis

X1‧‧‧位置/離散位置 X1‧‧‧ Position/Discrete Position

X2‧‧‧位置/離散位置 X2‧‧‧ Position/Discrete Position

X3‧‧‧位置/離散位置 X3‧‧‧ Position/Discrete Position

X4‧‧‧位置/離散位置 X4‧‧‧ Position/Discrete Position

X5‧‧‧位置/離散位置 X5‧‧‧ Position/Discrete Position

Y‧‧‧軸 Y‧‧‧ axis

Z‧‧‧軸 Z‧‧‧ axis

α1‧‧‧入射角/非零入射角/角 Α1‧‧‧incident angle/non-zero incident angle/angle

α2‧‧‧入射角/非零入射角/非法線入射角/視角 Α2‧‧‧incident angle/non-zero incident angle/illegal line incident angle/angle of view

α3‧‧‧視角/非零角 33‧‧‧ viewing angle / non-zero angle

λ‧‧‧波長 Λ‧‧‧wavelength

圖1繪示能夠同時偵測來自跨越一樣本之寬度之一線之光致發光光、寬頻帶光之鏡面反射及散射光之任何組合之一光學計量器件。 1 illustrates an optical metrology device capable of simultaneously detecting any combination of photoluminescence light, specular reflection, and scattered light of a broad band of light across a line of the same width.

圖2A繪示樣本之表面之一俯視圖,其中具有掃描跨越樣本寬度以產生一照射線的來自一第一光源之一照射點,且照射線跨越樣本而移動。 2A is a top plan view of a surface of a sample having an illumination point from a first source of light that scans across the width of the sample to produce an illumination line, and the illumination line moves across the sample.

圖2B繪示樣本之一俯視圖,其中具有來自一第二光源之照射線且照射線跨越樣本而移動。 2B depicts a top view of a sample with an illumination line from a second source and the illumination line moving across the sample.

圖3A及圖3B分別繪示藉由圖1之光學計量器件對散射光進行之一暗通道觀察之一透視圖及側視圖。 3A and 3B are respectively a perspective view and a side view of a dark channel observation of scattered light by the optical metrology device of FIG. 1.

圖4A及圖4B分別繪示藉由圖1之光學計量器件進行之亮場反射觀察 之一透視圖及側視圖,其中為清晰起見省略一窄頻帶光源及相關聯之光學器件。 4A and 4B respectively illustrate bright field reflection observation by the optical metrology device of FIG. One of a perspective view and a side view, wherein a narrow band source and associated optics are omitted for clarity.

圖5A及圖5B分別繪示樣本因掃描照射光束而發生之激發及藉由圖1之光學計量器件進行之所發射光致發光光之收集之一透視圖及側視圖。 5A and 5B are respectively a perspective view and a side view showing the excitation of the sample by scanning the illumination beam and the collection of the emitted photoluminescence light by the optical metrology device of FIG. 1.

圖6繪示一入射照射光束及所發射光致發光光之朗伯(Lambertian)特性。 Figure 6 illustrates the Lambertian characteristics of an incident illumination beam and emitted photoluminescence.

圖7及圖8分別繪示一側視圖(沿著Y-Z平面)及一正視圖(沿著X-Z平面),該等側視圖及正視圖繪示藉由圖1之光學計量器件進行之暗場散射輻射、亮場反射輻射及光致發光光之同時收集。 7 and 8 respectively illustrate a side view (along the YZ plane) and a front view (along the XZ plane), the side view and front view showing dark field scattering by the optical metrology device of FIG. Simultaneous collection of radiation, bright field reflected radiation, and photoluminescent light.

圖9繪示由一2D感測器陣列成像之三個光譜通道(暗場散射輻射、亮場反射輻射及光致發光光)之信號分離。 Figure 9 illustrates signal separation of three spectral channels (dark field scattered radiation, bright field reflected radiation, and photoluminescent light) imaged by a 2D sensor array.

圖10係繪示來自數個光源之光學計量資料之一方法之一流程圖。 Figure 10 is a flow chart showing one of the methods of optical metrology data from a plurality of light sources.

圖11及圖12繪示圖1之光學計量器件之替代組態之側視圖(沿著Y-Z平面)。 11 and 12 illustrate side views (along the Y-Z plane) of an alternate configuration of the optical metrology device of FIG. 1.

圖13繪示可用於接收自樣本發射之光致發光光之一長橢圓柱面鏡之一透視圖。 Figure 13 is a perspective view of one of the oblong cylindrical mirrors that can be used to receive photoluminescent light from a sample emission.

圖14繪示收集來自樣本之光致發光或散射輻射之橢圓鏡之一側視圖(沿著Y-Z平面)。 Figure 14 depicts a side view (along the Y-Z plane) of an elliptical mirror that collects photoluminescence or scattered radiation from a sample.

圖15繪示可用於接收自樣本發射之光致發光之一長柱面透鏡之一透視圖。 Figure 15 depicts a perspective view of one of the long cylindrical lenses that can be used to receive photoluminescence from sample emission.

圖16繪示收集來自樣本之光致發光或散射輻射之柱面透鏡之一側視圖(沿著Y-Z平面)。 Figure 16 depicts a side view (along the Y-Z plane) of a cylindrical lens that collects photoluminescence or scattered radiation from a sample.

圖17A及圖17B分別繪示數個光纖之一光導管之接收端及輸出端。 17A and 17B illustrate a receiving end and an output end of a light guide of one of a plurality of optical fibers, respectively.

圖18繪示將經收集光提供至包含一光譜儀之一偵測器之一光導管。 Figure 18 illustrates the supply of collected light to a light pipe comprising one of the detectors of a spectrometer.

圖19繪示將經收集光提供至包含一光電倍增管(PMT)或突崩光二極體(APD)之一偵測器之一光導管。 Figure 19 illustrates a light pipe that provides collected light to one of the detectors including a photomultiplier tube (PMT) or a astigmatism diode (APD).

圖20繪示由一光學計量器件採用一橢圓鏡進行之暗場散射輻射、光致發光光及視情況亮場反射輻射之同時收集之一側視圖(沿著Y-Z平面)。 Figure 20 illustrates a side view (along the Y-Z plane) of simultaneous collection of dark field scattered radiation, photoluminescent light, and optionally bright field reflected radiation by an optical metrology device using an elliptical mirror.

相關申請案之交叉參考 Cross-reference to related applications

此申請案主張2016年6月9日申請之美國申請案第15/178,484號之優先權,美國申請案第15/178,484號係2015年11月9日申請之美國申請案第14/936,635號之一部分接續案,美國申請案第14/936,635號係2013年11月26日申請之美國申請案第14/091,199號(現為美國專利第9,182,351號)之一接續案,此申請案根據35 USC 119進一步主張2015年11月9日申請之美國臨時申請案第62/253,092號之優先權,所有該等申請案之全部內容以引用之方式併入本文中。 This application claims priority to U.S. Application Serial No. 15/178, 484, filed on Jun. Part of the continuation case, U.S. Application No. 14/936,635, which is incorporated herein by reference in its entirety, U.S. Application Serial No. 14/091,199 (now U.S. Patent No. 9,182,351), which is based on 35 USC 119 The priority of U.S. Provisional Application No. 62/253,092, filed on Nov. 9, 2015, the entire disclosure of which is hereby incorporated by reference.

圖1繪示能夠同時偵測來自跨越一樣本之寬度之一線之光致發光光、寬頻帶光之鏡面反射及散射光之任何組合之一光學計量器件100。樣本沿一單一方向移動以使線掃掠跨越樣本,使得可自樣本之表面上每一位置快速收集資料。 1 illustrates an optical metrology device 100 capable of simultaneously detecting any combination of photoluminescent light, specular reflection, and scattered light of a broad band of light across a line of the same width. The sample is moved in a single direction to sweep the line across the sample so that data can be quickly collected from each location on the surface of the sample.

計量器件100包含一第一光源110,第一光源110可係(例如)一窄頻帶照射源,諸如一雷射。藉由實例,取決於所量測樣本之光致發光效率及待由偵測器記錄之所要信號強度,光源110可係一高強度雷射,諸如具有405nm之峰值波長及1mW至500mW範圍中之功率之一連續波(CW)雷射。若需要,則可使用一個以上雷射來產生經組合用於光源110之多個窄 頻帶波長。藉由實例,另外或替代地可單獨或選擇性組合地使用其他雷射波長(諸如266nm、355nm、375nm、532nm、640nm或830nm,及此處未列出之其他波長)。用作光源110之(若干)雷射可以連續波或Q切換操作模式操作。若Q切換(QS)雷射用於樣本激發,則瞬時功率(即,脈衝期間之功率)可係大得多(例如,在幾千瓦(2.5kW)範圍中)。 Metering device 100 includes a first source 110 that can be, for example, a narrowband illumination source, such as a laser. By way of example, the light source 110 can be a high intensity laser, such as having a peak wavelength of 405 nm and a range of 1 mW to 500 mW, depending on the photoluminescence efficiency of the sample being measured and the desired signal intensity to be recorded by the detector. One of the power continuous wave (CW) lasers. If desired, more than one laser can be used to create multiple narrow combinations for source 110 Band wavelength. Other laser wavelengths (such as 266 nm, 355 nm, 375 nm, 532 nm, 640 nm, or 830 nm, and other wavelengths not listed herein) may additionally or alternatively be used by way of example. The laser(s) used as source 110 can operate in a continuous wave or Q switching mode of operation. If a Q-switched (QS) laser is used for sample excitation, the instantaneous power (ie, the power during the pulse) can be much larger (eg, in the range of a few kilowatts (2.5 kW)).

包含光學器件112之一透鏡系統用於用照射光束114在樣本101之表面上產生一照射點。由照射光束114產生之照射點應具有用以激發樣本101中之光致發光之一大小及/或功率密度。藉由實例,照射點大小可介於在50μm至1mm範圍之間及/或具有介於約0.1W/cm2至108W/cm2範圍之間的一功率密度。舉例而言,若一CW 1mW之雷射經聚焦至一約1mm之點,則功率密度係約0.127W/cm2。經聚焦至50微米之點之相同CW 1mW之雷射將給定50W/cm2之功率。若使用一更高功率500mW CW之雷射,且其經聚焦至一1mm之點,則達到63W/cm2之一功率密度且聚焦至50μm之相同雷射將導致2.5*104W/cm2之功率密度。因此,CW雷射之典型功率密度係在0.1W/cm2至2.5*104W/cm2之範圍中。在使用樣本激發之Q切換雷射之情況下,功率密度係非常不同的。舉例而言,在1mW之一平均功率及10奈秒(10*10-9s)之脈衝持續時間及100kHz之重複率下,瞬間功率可高達1W,且在一1mm點處之對應功率密度係127W/cm2。當相同雷射與500mW之一平均功率一起使用且經聚焦至50μm點大小時,瞬間功率可達到(例如)2.5*107W/cm2A lens system comprising one of the optical devices 112 is used to generate an illumination spot on the surface of the sample 101 with the illumination beam 114. The illumination spot produced by illumination beam 114 should have a size and/or power density to excite photoluminescence in sample 101. By way of example, the spot size can range between 50 [mu]m and 1 mm and/or have a power density ranging between about 0.1 W/cm2 and 10<8>W/cm<2> . For example, if a CW 1 mW laser is focused to a point of about 1 mm, the power density is about 0.127 W/cm 2 . A laser of the same CW 1 mW focused to a point of 50 microns will give a power of 50 W/cm 2 . If a higher power 500mW CW laser is used and it is focused to a point of 1mm, then a power density of 63W/cm 2 and the same laser focused to 50μm will result in 2.5*10 4 W/cm 2 Power density. Thus, a typical power density of the laser system in the CW 0.1W / cm 2 to 2.5 * 10 4 W / cm 2 of the range. In the case of a sample-excited Q-switched laser, the power density is very different. For example, at an average power of 1 mW and a pulse duration of 10 nanoseconds (10*10 -9 s) and a repetition rate of 100 kHz, the instantaneous power can be as high as 1 W, and the corresponding power density at a point of 1 mm 127W/cm 2 . When the same laser is used with an average power of 500 mW and is focused to a 50 μm dot size, the instantaneous power can reach, for example, 2.5*10 7 W/cm 2 .

透鏡系統可進一步包含繪示為包含一掃描鏡118及一固定鏡120之一掃描系統116,掃描系統116用於使照射點掃描跨越樣本101之表面之寬度成為一照射線122(其繪示為沿X方向定向)。可取決於掃描解析度及感測 器讀出速度而調整掃描系統116之掃描速度/頻率。舉例而言,頻率可係(例如)介於50Hz至100Hz之間的範圍中,但可在1Hz至10kHz或更高之一範圍中變化。掃描鏡118移動以使照射點掃描跨越樣本101之表面,且可係(例如)一(擺動)電流計式鏡或一旋轉多邊形鏡。藉由實例,圖2A繪示樣本101之表面之一俯視圖,其中具有掃描跨越樣本之寬度(如由箭頭127指示)的由照射光束114(圖1)產生之一照射點124。如由圖1中之線121繪示,掃描系統116使照射光束114在一平面內掃描跨越樣本101,此相對於表面法線N形成一非零入射角α1。因此,照射線122以一非法線入射角入射於樣本101之表面上。應理解,照射線122另外藉由載台104(圖1)沿Y方向(如由箭頭123繪示)移動樣本101而掃描跨越樣本101之表面,使得照射線122可入射於樣本101之表面上之所有位置上。 The lens system can further include a scanning system 116 including a scanning mirror 118 and a fixed mirror 120 for scanning the width of the surface of the sample 101 across the surface of the sample 101 into an illumination line 122 (shown as Oriented in the X direction). Depending on scanning resolution and sensing The scan speed/frequency of the scanning system 116 is adjusted by the read speed. For example, the frequency can be, for example, in the range between 50 Hz and 100 Hz, but can vary from one of 1 Hz to 10 kHz or higher. Scanning mirror 118 is moved to cause the illumination spot to scan across the surface of sample 101 and may be, for example, a (swing) galvanometer mirror or a rotating polygon mirror. By way of example, FIG. 2A depicts a top view of the surface of the sample 101 with an illumination spot 124 generated by the illumination beam 114 (FIG. 1) having a scan across the width of the sample (as indicated by arrow 127). As depicted by line 121 in FIG. 1, scanning system 116 causes illumination beam 114 to scan across sample 101 in a plane that forms a non-zero incident angle α1 with respect to surface normal N. Therefore, the illumination line 122 is incident on the surface of the sample 101 at an illegal line incident angle. It should be understood that the illumination line 122 is additionally scanned across the surface of the sample 101 by moving the sample 101 in the Y direction (as illustrated by arrow 123) by the stage 104 (FIG. 1) such that the illumination line 122 can be incident on the surface of the sample 101. In all positions.

應理解,圖1繪示窄頻帶照射源110及相關聯之光學器件(包含掃描系統116)之一個組態,但若需要,則可使用其他組態。舉例而言,雖然使用固定鏡120有利於簡化系統對準,但若需要,則可自掃描系統116移除固定鏡120,且將光源110、透鏡112及掃描鏡118重新定位,使得照射光束114直接照射樣本101,而不需要重定向鏡120。再者,應理解,光學器件112可將照射光束114聚焦為樣本101之一表面上之一照射點124。若照射光束114聚焦於與樣本101之表面重合之一樣本平面處,則隨著照射光束沿著照射線122移動,照射點可稍稍變得散焦,但由散焦所致之信號強度變化可由電腦150內之信號處理補償。另一選擇係,藉由實例,光學器件112可準直照射光束114。若需要,則可使用一選用F-θ透鏡111(在圖1中用虛線展示)將經準直照射光束114聚焦於樣本之表面上。再者,若需要,則經準直照射光束114可在未被聚焦之情況下作為照射點入射於樣本101 之表面上,其中具有解析度及激發條件之一相關聯損失。 It should be understood that FIG. 1 illustrates one configuration of the narrowband illumination source 110 and associated optics (including the scanning system 116), although other configurations may be used if desired. For example, while the use of the fixed mirror 120 facilitates simplified system alignment, the fixed mirror 120 can be removed from the scanning system 116 if desired, and the light source 110, lens 112, and scanning mirror 118 can be repositioned such that the illumination beam 114 The sample 101 is directly illuminated without the need to redirect the mirror 120. Again, it should be understood that the optical device 112 can focus the illumination beam 114 as one of the illumination spots 124 on one of the surfaces of the sample 101. If the illumination beam 114 is focused on one of the sample planes that coincides with the surface of the sample 101, as the illumination beam moves along the illumination line 122, the illumination point may become slightly defocused, but the signal intensity variation due to defocus may be Signal processing compensation within the computer 150. Alternatively, optical device 112 can collimate illumination beam 114 by way of example. If desired, the collimated illumination beam 114 can be focused onto the surface of the sample using an optional F-theta lens 111 (shown in phantom in Figure 1). Furthermore, if necessary, the collimated illumination beam 114 can be incident on the sample 101 as an illumination point without being focused. On the surface, there is associated loss associated with one of the resolution and excitation conditions.

藉由使照射點124掃描跨越樣本101以產生照射線122,可維持入射光之一高功率密度。因此,來自光源110之照射光束經由「光激發」將能量施予至樣本之材料中,從而產生沿著照射線122自樣本發射之光致發光光。另外,樣本101上之表面缺陷(諸如刮痕、顆粒、磊晶生長缺陷(例如,堆疊缺層或積丘))在照射光束114沿著照射線122進行掃描時可使照射光束114散射。 By scanning the illumination spot 124 across the sample 101 to produce the illumination line 122, one of the high power densities of the incident light can be maintained. Thus, the illumination beam from source 110 imparts energy to the material of the sample via "photoexcitation", thereby producing photoluminescent light that is emitted from the sample along illumination line 122. Additionally, surface defects on the sample 101, such as scratches, particles, epitaxial growth defects (eg, stacked lamella or clumps), may scatter the illumination beam 114 as the illumination beam 114 scans along the illumination line 122.

如在圖1中由線121繪示,掃描系統116使照射光束114在一平面內掃描跨越樣本101,此相對於表面法線N形成一非零入射角α1。因此,照射線122以一非法線入射角入射於樣本101之表面上。 As depicted by line 121 in FIG. 1, scanning system 116 causes illumination beam 114 to scan across sample 101 in a plane that forms a non-zero incident angle α1 with respect to surface normal N. Therefore, the illumination line 122 is incident on the surface of the sample 101 at an illegal line incident angle.

光學計量器件100包含沿著一偵測器路徑131接收來自樣本101之表面之光之一偵測器130,偵測器路徑131相對於表面法線N具有一非零角α3。因此,如在圖1中繪示,偵測器130具有不同於照射線122之入射角α1之視角α3。因此,來自樣本101之表面的照射光束114之鏡面反射並不進入偵測器路徑131。通常,光致發光信號比經反射輻射信號幾級。藉助使用入射角α1及視角α3,光學計量器件100允許照射光束114自樣本101之鏡面表面反射,而不干擾由偵測器130接收之光致發光信號,從而避免需要過濾照射光束114之反射。再者,由於未過濾照射光束114,因此偵測器130可接收由表面缺陷散射之光,而不接收照射光束114,即,實現暗場觀察。應理解,樣本101回應於藉由照射光束114之激發而產生之光致發光光將具有不同於照射光束114自身之一波長。因此,來自光致發光光及散射光之波長可分散至不同光譜通道中。因此,光學計量器件100可用於同時偵測表面構形缺陷及光致發光。另外,藉助使用掃描系統116,光源110可 充當一線照射源,其中在使用一柱面透鏡或柱面鏡之情況下沿著該線不具有功率密度或照射均勻性之損失。 The optical metrology device 100 includes a light detector 130 that receives light from the surface of the sample 101 along a detector path 131. The detector path 131 has a non-zero angle α3 with respect to the surface normal N. Therefore, as shown in FIG. 1, the detector 130 has a viewing angle α3 that is different from the incident angle α1 of the illumination line 122. Therefore, the specular reflection of the illumination beam 114 from the surface of the sample 101 does not enter the detector path 131. Typically, the photoluminescent signal is several orders of magnitude longer than the reflected radiation signal. By using the angle of incidence α1 and the angle of view α3, the optical metrology device 100 allows the illumination beam 114 to be reflected from the specular surface of the sample 101 without interfering with the photoluminescence signal received by the detector 130, thereby avoiding the need to filter the reflection of the illumination beam 114. Moreover, since the illumination beam 114 is not filtered, the detector 130 can receive light scattered by surface defects without receiving the illumination beam 114, i.e., achieve dark field observation. It will be appreciated that the sample 101 will have a different wavelength than the illumination beam 114 itself in response to the photoluminescence generated by the excitation of the illumination beam 114. Therefore, the wavelengths from the photoluminescent light and the scattered light can be dispersed into different spectral channels. Therefore, the optical metrology device 100 can be used to simultaneously detect surface configuration defects and photoluminescence. In addition, by using the scanning system 116, the light source 110 can Acting as a line of illumination where there is no loss of power density or uniformity of illumination along the line with the use of a cylindrical lens or cylindrical mirror.

偵測器130包含光學器件132、一光譜儀134及一感測器136,感測器136包含一個二維CCD或CMOS感測器陣列。沿著偵測器路徑131收集之光(例如,光致發光光或散射光)係由前部光學器件132收集,然後傳遞穿過光譜儀134中之一窄入口狹縫孔隙。光譜儀134之視野係由入口狹縫限制,入口狹縫與照射線122之定向匹配。因此,偵測器130(或更確切而言,光譜儀134)之入口狹縫與照射線122對準且疊加寬頻帶照射線142(在下文中論述),即,入口狹縫及照射線122及142皆屬於相同平面,同時照射線122及142彼此上下疊加,且至偵測器130之入口狹縫與照射線122及142平行。光譜儀134將接收光之光譜分散,且在光譜儀134之出口處之感測器136用一個二維(2D)感測器陣列記錄且產生一所得影像圖框,其中感測器陣列之一第一維度表示沿著照射線122之空間位置,且感測器陣列之一第二維度表示光譜資訊。光譜儀134將發射之光致發光光之波長分離且將沿2D感測器陣列之一個維度之散射光分離,同時由2D感測器陣列之第二維度記錄沿著照射線122之位置。舉例而言,沿著照射線122之一個點可發射460.3nm之一最大光致發光,同時照射線122上之另一點可發射460.8nm之一最大光致發光。因此,光譜儀134將發射之光致發光光之波長分離以執行光譜光致發光成像。 The detector 130 includes an optical device 132, a spectrometer 134, and a sensor 136. The sensor 136 includes a two-dimensional CCD or CMOS sensor array. Light collected along detector path 131 (e.g., photoluminescent or scattered light) is collected by front optics 132 and then passed through a narrow entrance slit aperture in spectrometer 134. The field of view of spectrometer 134 is limited by the entrance slit, which matches the orientation of illumination line 122. Thus, the entrance slit of detector 130 (or more specifically, spectrometer 134) is aligned with illumination line 122 and superimposes broadband illumination line 142 (discussed below), ie, entrance slits and illumination lines 122 and 142. All belong to the same plane, while the illumination lines 122 and 142 are superimposed on each other, and the entrance slit to the detector 130 is parallel to the illumination lines 122 and 142. Spectrometer 134 disperses the spectrum of the received light, and sensor 136 at the exit of spectrometer 134 records with a two-dimensional (2D) sensor array and produces a resulting image frame, with one of the sensor arrays first The dimension represents the spatial location along the illumination line 122, and one of the second dimensions of the sensor array represents spectral information. Spectrometer 134 separates the wavelengths of the emitted photoluminescent light and separates the scattered light along one dimension of the 2D sensor array while recording the position along illumination line 122 by the second dimension of the 2D sensor array. For example, one point along the illumination line 122 can emit one of the maximum photoluminescence of 460.3 nm while another point on the illumination line 122 can emit one of the maximum photoluminescence of 460.8 nm. Thus, spectrometer 134 separates the wavelengths of the emitted photoluminescent light to perform spectral photoluminescence imaging.

計量器件100進一步包含一第二光源140,第二光源140可係(例如)一寬頻帶照射源,諸如一鹵素光源,第二光源140包含不同於第一光源110所使用之波長或樣本101回應於藉由照射光束114之激發而發射之光致發光光之波長之光波長。寬頻帶輻射源(有時稱為一「白」光源)形成為與樣 本101之表面上之照射線122對準且疊加之照射線142。如繪示,可(例如)使用一系列光纖144(該等光纖中之僅一者繪示為耦合至光源140)來產生照射線142。藉由實例,具有一系列光纖144之第二光源140可係Schott North America有限公司製造之一光線產品。來自多個光纖144之光藉助一柱面透鏡146形成為一幾乎準直線狀光束。圖2B繪示樣本101之一俯視圖,其中具有來自第二光源140之照射線142。 The metering device 100 further includes a second light source 140, which may be, for example, a broadband illumination source, such as a halogen source, the second source 140 comprising a different wavelength than the first source 110 or a sample 101 response The wavelength of light at the wavelength of the photoluminescent light emitted by the excitation of the illumination beam 114. Broadband radiation sources (sometimes referred to as a "white" source) are formed as a sample The illumination line 122 on the surface of the 101 is aligned and superimposed on the illumination line 142. As shown, illumination line 142 can be generated, for example, using a series of optical fibers 144 (only one of which is shown coupled to light source 140). By way of example, the second light source 140 having a series of optical fibers 144 can be a light product manufactured by Schott North America, Inc. Light from the plurality of optical fibers 144 is formed as an almost quasi-linear beam by means of a cylindrical lens 146. 2B illustrates a top view of sample 101 with illumination line 142 from second source 140.

如在圖1中繪示,來自光源140之寬頻帶光沿著由線141繪示之一平面照射樣本101之表面,線141相對於表面法線N成一非零入射角α2。因此,照射線142以一非法線入射角α2入射於樣本101之表面上。應理解,照射線142另外藉由載台104(圖1)而掃描跨越樣本101之表面(連同所疊加照射線122一起)(如由圖2B中之箭頭145繪示),使得照射線142可入射於樣本101之表面上之所有位置上。入射角α2不同於入射角α1,且具有不同於角α1之標記之一標記,即,照射線142自與照射線122相反之一方向入射於樣本之表面上,且具有一不同入射角。然而,照射線142之入射角α2與偵測器路徑131之視角α3相同但值相反,即,視角α2=-α3。因此,偵測器130之視角經調諧為照射線142之入射角,且因此,沿著照射線142之寬頻帶光之鏡面反射亦與光譜儀134之視野對準。因此,由光源110產生之照射線122及由光源140產生之照射線142兩者由偵測器接收。光譜儀134將沿著照射線142之寬頻帶照射之鏡面反射之波長分離至2D感測器陣列之一個維度中,同時由2D感測器陣列之第二維度表示沿著照射線142(及照射線122)之位置。 As depicted in FIG. 1, the broadband light from source 140 illuminates the surface of sample 101 along a plane depicted by line 141, which has a non-zero incident angle [alpha]2 with respect to surface normal N. Therefore, the illumination line 142 is incident on the surface of the sample 101 at an illegal line incident angle α2. It should be understood that the illumination line 142 is additionally scanned across the surface of the sample 101 (along with the superimposed illumination lines 122) by the stage 104 (FIG. 1) (as depicted by arrow 145 in FIG. 2B) such that the illumination line 142 can It is incident on all positions on the surface of the sample 101. The incident angle α2 is different from the incident angle α1 and has a mark different from the mark of the angle α1, that is, the illumination line 142 is incident on the surface of the sample from one direction opposite to the illumination line 122, and has a different incident angle. However, the angle of incidence α2 of the illumination line 142 is the same as the angle of view α3 of the detector path 131 but the value is opposite, that is, the angle of view α2 = -α3. Thus, the viewing angle of the detector 130 is tuned to the angle of incidence of the illumination line 142, and thus, the specular reflection of the broadband light along the illumination line 142 is also aligned with the field of view of the spectrometer 134. Therefore, both the illumination line 122 generated by the light source 110 and the illumination line 142 generated by the light source 140 are received by the detector. Spectrometer 134 separates the wavelength of the specular reflection of the broadband illumination along illumination line 142 into one dimension of the 2D sensor array while being represented by the second dimension of the 2D sensor array along illumination line 142 (and the illumination line) 122) Location.

寬頻帶光源140可使用不同於由第一光源110所使用之(若干)波長及由樣本101發射之光致發光光之(若干)波長之光波長,使得光譜儀134可將 來自反射之寬頻帶光之波長與散射光之波長及光致發光光之波長分離。因此,第一光源110及第二光源140可與偵測器130一起使用以同時偵測關於由照射光束114之激發所致之光致發光光之位置連同照射線122及142、照射光束114之暗場散射以及來自光源140之亮場反射之光譜資訊。藉由實例,基於窄頻帶光源110、寬頻帶光源140及發射之光致發光光之波長,光學計量器件100可使用在400nm至1,000nm之間的一波長範圍(即,600nm範圍)。偵測器130可將所接收之光分成(例如)1200個波長,即,在感測器陣列之光譜維度中之像素之數目,且因此,偵測器130可具有0.5nm之一光譜解析度。當然,若需要,則可使用其他光譜解析度、以及光波長或光波長之範圍以及偵測器130偵測之波長數目。 The broadband light source 140 can use a wavelength of light different from the wavelength(s) used by the first source 110 and the wavelength(s) of photoluminescent light emitted by the sample 101 such that the spectrometer 134 can The wavelength of the broadband light from the reflection is separated from the wavelength of the scattered light and the wavelength of the photoluminescent light. Therefore, the first light source 110 and the second light source 140 can be used together with the detector 130 to simultaneously detect the position of the photoluminescence light caused by the excitation of the illumination beam 114 together with the illumination lines 122 and 142 and the illumination beam 114. Dark field scattering and spectral information from bright field reflections from source 140. By way of example, based on the wavelengths of the narrowband source 110, the broadband source 140, and the emitted photoluminescent light, the optical metrology device 100 can use a range of wavelengths between 400 nm and 1,000 nm (ie, in the range of 600 nm). The detector 130 can divide the received light into, for example, 1200 wavelengths, that is, the number of pixels in the spectral dimension of the sensor array, and thus, the detector 130 can have a spectral resolution of 0.5 nm. . Of course, other spectral resolutions, as well as ranges of optical or optical wavelengths and the number of wavelengths detected by detector 130, may be used if desired.

再者,自樣本101之表面鏡面反射之寬頻帶光經引導至偵測器130,而不需要偵測器130之機械重新定位,因此偵測器130可同時或緊接地收集表面反射、散射及光致發光信號而無任何裝置光學器件子組件之機械重新定位之任何延遲。當然,若需要,則第一光源110及第二光源140可緊接地使用,使得偵測器130無法同時接收來自照射線122及142兩者之光。 Moreover, the wide-band light that is specularly reflected from the surface of the sample 101 is guided to the detector 130 without mechanical repositioning of the detector 130, so that the detector 130 can simultaneously or closely collect the surface reflection, scattering, and Photoluminescence signal without any delay in mechanical repositioning of any device optics subassembly. Of course, if desired, the first light source 110 and the second light source 140 can be used in close proximity such that the detector 130 cannot simultaneously receive light from both of the illumination lines 122 and 142.

樣本101固持於一線性載台104上,線性載台104可沿不同於照射線122及142之定向之一方向平移樣本101。舉例而言,照射線122及142之定向可在與線性載台104之行進方向(例如,Y方向)正交之一方向(例如,X方向)上。載台104使樣本101平移以使照射線122及142置於跨越樣本101之多個位置處(如由圖2A及圖2B中之箭頭123及145繪示),且在各新位置處重複照射線122及142之光譜成像。將樣本101成像及移動之程序經重複以使照射線122及142掃描跨越樣本101,從而產生一系列2D影像圖框。若需要,則載台104可使樣本101逐步移動或使樣本101連續移動,使得資料 獲取得以連續執行(例如,藉助照射點124之一高頻率掃描),而不需要Y軸運動在各線處停止。舉例而言,當照射點124之一高頻率掃描(例如,500Hz)與沿著Y軸之一相對低速載台運動及影像圖框之低速收集(例如,100Hz)一起使用時,照射光束114針對各給定影像圖框掃描數次照射線122(例如,在給定實例中為五次),此提供改良之信號平均化。沿著Y軸之載台運動速度可以毫米/秒為單位表示且取決於沿著Y方向之所需解析度。舉例而言,當Y速度為20mm/s且圖框率為100個圖框/秒時,Y解析度為20mm/s除以100/s等於0.2mm。 The sample 101 is held on a linear stage 104 that can translate the sample 101 in one direction other than the orientation of the illumination lines 122 and 142. For example, the orientation of illumination lines 122 and 142 can be in one direction (eg, the X direction) orthogonal to the direction of travel (eg, the Y direction) of linear stage 104. The stage 104 translates the sample 101 such that the illumination lines 122 and 142 are placed at multiple locations across the sample 101 (as depicted by arrows 123 and 145 in Figures 2A and 2B) and are repeatedly illuminated at each new location. Spectral imaging of lines 122 and 142. The process of imaging and moving the sample 101 is repeated to cause the illumination lines 122 and 142 to scan across the sample 101, resulting in a series of 2D image frames. If necessary, the stage 104 can move the sample 101 stepwise or continuously move the sample 101, so that the data Acquisition is performed continuously (e.g., by high frequency scanning of one of the illumination points 124) without requiring the Y-axis motion to stop at each line. For example, when one of the illumination points 124 is scanned at a high frequency (eg, 500 Hz) with one of the Y-axis relative to the low-speed stage motion and the low-speed collection of the image frame (eg, 100 Hz), the illumination beam 114 is directed to Each given image frame scans the illumination line 122 several times (e.g., five times in a given example), which provides improved signal averaging. The speed of movement of the stage along the Y axis can be expressed in millimeters per second and depends on the desired resolution along the Y direction. For example, when the Y speed is 20 mm/s and the frame rate is 100 frames/second, the Y resolution is 20 mm/s divided by 100/s equals 0.2 mm.

因此,在一個資料擷取操作中,光學計量器件100能夠自樣本101之線照射部分同時收集光譜光致發光及光譜散射輻射以及光譜反射輻射信號,且可沿一單一軸移動且重複執行資料擷取操作以獲取整個樣本表面之資料。在一項實施例中,藉由用一線性載台沿Y方向移動照射線122及142下方之樣本101而獲取整個樣本表面之資料。然而,在另一實施例中,可藉由用一旋轉載台沿Θ(角度)方向(如在圖1中用一虛線箭頭繪示)旋轉照射線122及142下方之樣本101而收集資料。在兩項實施例中,樣本101僅沿一個軸移動(Y或Θ(兩者皆非必需的)),從而產生一高速量測。比較而言,習知系統自一單一照射點獲取資料且必須使樣本沿兩個軸移動以獲取整個樣本表面之資料。因此,光學計量器件100使用一單一單向載台而非習知兩個線性載台系統或者線性及旋轉載台系統。再者,資料獲取因沿著X軸之所需載台運動之消除而加速。 Therefore, in a data capture operation, the optical metrology device 100 is capable of simultaneously collecting spectral photoluminescence and spectrally scattered radiation and spectrally reflected radiation signals from the line illumination portion of the sample 101, and is movable along a single axis and repeatedly performing data. Take the operation to get the data of the entire sample surface. In one embodiment, the entire sample surface is acquired by moving the sample 101 beneath the illumination lines 122 and 142 in the Y direction with a linear stage. However, in another embodiment, the data may be collected by rotating the sample 101 beneath the illumination lines 122 and 142 in a Θ (angle) direction (as illustrated by a dashed arrow in FIG. 1) with a rotating stage. In both embodiments, the sample 101 is moved along only one axis (Y or Θ (both non-essential)), resulting in a high speed measurement. In contrast, conventional systems acquire data from a single illumination point and must move the sample along two axes to obtain data for the entire sample surface. Thus, optical metrology device 100 uses a single unidirectional stage rather than two linear stage systems or linear and rotary stage systems. Furthermore, data acquisition is accelerated by the elimination of the required stage motion along the X-axis.

應理解,照射線122及142與樣本101之間的運動係相對的,且因此,若需要,則載台104可保持靜止且可使用用以使(例如)光源及相關聯之光學器件相對於樣本101移動之一載台或其他適當構件來使照射線122及142 沿Y方向橫向移動或沿Θ方向旋轉。 It should be understood that the illumination between the illumination lines 122 and 142 and the sample 101 is relative, and therefore, if desired, the stage 104 can remain stationary and can be used to align, for example, the light source and associated optics with respect to Sample 101 moves one of the stages or other suitable components to illuminate lines 122 and 142 Move laterally in the Y direction or in the Θ direction.

隨著移動樣本101及獲取來自樣本101之線照射部分之光譜資訊而由偵測器130產生之複數個影像圖框可由一電腦150接收,電腦150可將複數個影像圖框儲存為三維(3D)資料立方體。3D資料立方體包含為空間之兩個維度(例如,一個維度係沿著照射線122及142之位置(X軸)且另一維度係掃描跨越樣本之線之位置(Y軸))及表示光譜資訊之一第三維度。偵測器130經耦合以將影像資料提供至電腦150,電腦150包含具有記憶體154之一處理器152以及包含(例如)一顯示器158及輸入器件160之一使用者介面。具有所體現之電腦可讀程式碼之一非暫時性電腦可用媒體162可由電腦150用於致使處理器控制計量器件100且執行包含本文描述之分析之功能。用於自動實施在此詳細說明中描述之一或多個動作之資料結構及軟體碼可由熟習此項技術者根據本發明實施且儲存於(例如)一電腦可讀儲存媒體162上,電腦可讀儲存媒體162可係可儲存供由一電腦系統(諸如處理器152)使用之碼及/或資料之任何器件或媒體。電腦可用媒體162可係但不限於磁性及光學儲存器件,諸如磁碟機、磁帶、光碟及DVD(數位多功能光碟或數位視訊光碟)。一通信埠164亦可用於接收指令,該等指令用於程式化電腦150以執行本文描述之功能中之任何一或多者且可表示任何類型之通信連接(諸如,至網際網路或任何其他電腦網路)。另外,可在一特殊應用積體電路(ASIC)或一可程式化邏輯器件(PLD)之電路內全部或部分體現本文中描述之功能,且可以可用來形成如本文描述而操作之一ASIC或PLD之一電腦可理解之描述符語言體現功能。 The plurality of image frames generated by the detector 130 can be received by the computer 150 as the moving sample 101 and the spectral information of the line illumination portion from the sample 101 are received, and the computer 150 can store the plurality of image frames as three-dimensional (3D). ) Data cube. The 3D data cube is contained in two dimensions of space (eg, one dimension is along the position of the illumination lines 122 and 142 (X-axis) and the other dimension is the position of the line across the sample (Y-axis)) and represents spectral information. One of the third dimensions. The detector 130 is coupled to provide image data to a computer 150. The computer 150 includes a processor 152 having a memory 154 and a user interface including, for example, a display 158 and an input device 160. One of the non-transitory computer usable media 162 having embodied computer readable code can be used by computer 150 to cause the processor to control metering device 100 and perform the functions comprising the analysis described herein. Data structures and software codes for automatically implementing one or more of the actions described in this detailed description can be implemented by a person skilled in the art in accordance with the present invention and stored on, for example, a computer readable storage medium 162, Storage medium 162 can be any device or medium that can store code and/or material for use by a computer system, such as processor 152. Computer usable media 162 may be, but is not limited to, magnetic and optical storage devices such as disk drives, magnetic tapes, optical discs, and DVDs (digital versatile discs or digital video discs). A communication port 164 can also be used to receive instructions for programming the computer 150 to perform any one or more of the functions described herein and can represent any type of communication connection (such as to the Internet or any other). Computer network). In addition, the functions described herein may be embodied in whole or in part in a circuit of a special application integrated circuit (ASIC) or a programmable logic device (PLD), and may be used to form an ASIC or as described herein. One of the PLDs is a computer-understandable descriptor language.

藉由實例,電腦150可使用如儲存於3D資料立方體中的針對樣本101之表面上之每一位置自偵測器130接收之光致發光信號,且產生樣本101 之一光致發光影像(或映射)。光致發光影像可係(例如)光致發光信號之信號強度之一映射。光致發光強度影像之檢驗可用於程序控制以確保樣本101之所有部分滿足所要規範。舉例而言,在樣本101含有所製造之發光二極體(LED)晶片之情況下,光致發光資料(例如,呈一光致發光強度影像之形式)之檢驗可用於確保每一LED將具有適當亮度。類似地,光致發光強度影像可用於缺陷分割且用於基於局部低光致發光信號之存在而預測良率損失,該等局部低光致發光信號可在后段製程處導致不合規範之器件。若需要,則光致發光信號可經處理以產生其他影像或映射。舉例而言,可產生一峰值λ影像以展示樣本表面上峰值λ之分佈,其中峰值λ係在其下影像或映射中之任何給定點具有最大光致發光之波長。因此,舉例而言,樣本表面上一個點可發射460.3nm之最大光致發光,而相同樣本之表面上之另一點可發射460.8nm之一最大光致發光,此用一峰值λ影像清晰可見。藉助使用光譜光致發光成像,可識別由樣本發射之不同波長之光致發光光。因此,光學計量器件100可用於程序控制以確保樣本表面上之所有點發射一預定義波長範圍內之光致發光。另外或替代地,光致發光信號可轉換為一半峰全寬(FWHM)影像,該FWHM影像展示針對樣本上之任何給定點處之每一峰值λ之FWHM值。藉由實例,FWHM影像可用於確保用樣本製造之發光二極體(LED)發射預定義寬(頻帶)光譜範圍內之光。光致發光信號可經處理以產生樣本101之影像,而非光致發光強度、峰值λ及FWHM影像。舉例而言,光致發光信號可經處理或分析以產生不同品質,諸如例如在一給定固定波長下光致發光強度之一映射,該映射不同於最大光致發光強度映射。再者,所關注之影像或映射可藉由組合多組影像(諸如所論述之彼等影像)(例如,藉由逐像素倍增)而產生。因此,光致發 光信號可經處理以基於所記錄之光致發光信號產生樣本101之其他所需影像或以其他方式經分析以用於樣本之製造期間之程序控制。 By way of example, the computer 150 can use the photoluminescence signal received from the detector 130 for each position on the surface of the sample 101 as stored in the 3D data cube, and generate the sample 101. One photoluminescent image (or mapping). The photoluminescence image can be mapped, for example, to one of the signal intensities of the photoluminescent signal. Examination of the photoluminescence intensity image can be used for program control to ensure that all parts of the sample 101 meet the desired specifications. For example, where sample 101 contains a fabricated light emitting diode (LED) wafer, inspection of the photoluminescent material (eg, in the form of a photoluminescence image) can be used to ensure that each LED will have Appropriate brightness. Similarly, photoluminescence intensity images can be used for defect segmentation and for predicting yield loss based on the presence of local low photoluminescence signals that can result in substandard devices at the back end process. If desired, the photoluminescent signal can be processed to produce additional images or maps. For example, a peak lambda image can be generated to show the distribution of peaks λ on the surface of the sample, where the peak lambda has the wavelength of maximum photoluminescence at any given point in its lower image or map. Thus, for example, one point on the surface of the sample can emit a maximum photoluminescence of 460.3 nm, while another point on the surface of the same sample can emit one of the maximum photoluminescence of 460.8 nm, which is clearly visible with a peak λ image. By using spectrophotoluminescence imaging, photoluminescent light of different wavelengths emitted by the sample can be identified. Thus, the optical metrology device 100 can be used for program control to ensure that all points on the surface of the sample emit photoluminescence over a predefined range of wavelengths. Additionally or alternatively, the photoluminescent signal can be converted to a full width at half maximum (FWHM) image that exhibits a FWHM value for each peak λ at any given point on the sample. By way of example, FWHM images can be used to ensure that light-emitting diodes (LEDs) fabricated with samples emit light in a predefined wide (band) spectral range. The photoluminescence signal can be processed to produce an image of the sample 101 instead of the photoluminescence intensity, peak lambda, and FWHM images. For example, the photoluminescent signal can be processed or analyzed to produce different qualities, such as, for example, one of the photoluminescence intensities at a given fixed wavelength, which map is different from the maximum photoluminescence intensity map. Furthermore, the image or mapping of interest can be generated by combining multiple sets of images, such as those images discussed (eg, by pixel-by-pixel multiplication). Therefore, light is emitted The optical signal can be processed to generate other desired images of the sample 101 based on the recorded photoluminescent signal or otherwise analyzed for program control during manufacture of the sample.

另外,電腦150可處理所接收之反射寬頻帶信號以判定多個位置處之樣本101之一特性且產生該特性之一映射。舉例而言,層厚度可基於與寬頻帶光之反射相關聯之光譜回應而計算,且因此,所接收之反射寬頻帶信號可用於判定樣本表面上點之厚度且可產生一磊晶層厚度影像(或映射)。因此,光學計量器件100可用於監測樣本之表面上之任何給定點處之磊晶層厚度,此可用於確保所量測之厚度在一給定磊晶生長程序之預定義範圍內。另外,使用所接收之散射光,電腦150可產生樣本101之表面之一暗場影像,從而曝露表面缺陷,該等缺陷可係相關之刮痕、顆粒、磊晶生長缺陷(例如堆疊缺層或積丘)等等。 Additionally, computer 150 can process the received reflected wideband signal to determine one of the characteristics of sample 101 at a plurality of locations and to generate a map of that characteristic. For example, the layer thickness can be calculated based on the spectral response associated with the reflection of the broadband light, and thus, the received reflected broadband signal can be used to determine the thickness of the spot on the surface of the sample and can produce an epitaxial layer thickness image (or map). Thus, the optical metrology device 100 can be used to monitor the thickness of the epitaxial layer at any given point on the surface of the sample, which can be used to ensure that the measured thickness is within a predefined range of a given epitaxial growth procedure. Additionally, using the received scattered light, computer 150 can produce a dark field image of the surface of sample 101 to expose surface defects that can be associated with scratches, particles, epitaxial growth defects (eg, stacked defects or Chimney) and so on.

圖3A及圖3B分別繪示藉由光學計量器件100對散射光進行之暗通道觀察之一透視圖及側視圖。如繪示,光源110使用光學器件112以及包含掃描鏡118及固定鏡120之掃描系統116在樣本101之表面上產生照射線122。若樣本無缺陷,則光將如線125繪示由樣本101之表面鏡面反射,且不會被攝影機感測器136偵測到。當一表面缺陷126存在於樣本101上時,在照射光束114於缺陷126上方進行掃描時,照射光束114之一部分被散射。沿著偵測器路徑131之散射光由偵測器130接收,且穿過狹縫孔隙進入光譜儀134。光譜儀134之視野受一狹縫孔隙限制,且因此,感測器136僅使照射線122成像。照射光束114之鏡面反射不被光譜儀134接收。光譜儀134通常將光分離至2D感測器陣列之光譜維度中之波長分級箱中。然而,散射光來源於窄頻帶光源110,且因此由偵測器130接收之散射光由光譜儀134偏轉至對應於由感測器136記錄的光源110之(若干)波長之(若 干)分級箱中。散射光通道之效能可藉由將偏光器及分析儀添加至窄頻帶照射光束114之光學路徑中而得以進一步更改。藉由實例,一光束偏光器119可視情況放置於光源110下游(例如,在透鏡112與鏡118之間),且分析儀133可與前部光學器件132組合。 3A and 3B are respectively a perspective view and a side view of the dark channel observation of the scattered light by the optical metrology device 100. As shown, light source 110 produces illumination line 122 on the surface of sample 101 using optical device 112 and scanning system 116 including scanning mirror 118 and fixed mirror 120. If the sample is free of defects, the light will be mirrored as shown by line 125 from the surface of sample 101 and will not be detected by camera sensor 136. When a surface defect 126 is present on the sample 101, one portion of the illumination beam 114 is scattered as the illumination beam 114 is scanned over the defect 126. The scattered light along the detector path 131 is received by the detector 130 and passes through the slit aperture into the spectrometer 134. The field of view of spectrometer 134 is limited by a slit aperture, and thus, sensor 136 only images illumination line 122. The specular reflection of the illumination beam 114 is not received by the spectrometer 134. Spectrometer 134 typically separates light into a wavelength grading bin in the spectral dimension of the 2D sensor array. However, the scattered light is derived from the narrowband source 110, and thus the scattered light received by the detector 130 is deflected by the spectrometer 134 to correspond to the wavelength(s) of the source 110 recorded by the sensor 136 (if Dry) in the grading box. The effectiveness of the scattered light channel can be further modified by adding a polarizer and analyzer to the optical path of the narrowband illumination beam 114. By way of example, a beam polarizer 119 can be placed downstream of the light source 110 (eg, between the lens 112 and the mirror 118), and the analyzer 133 can be combined with the front optics 132.

圖4A及圖4B分別繪示藉由光學計量器件100進行之亮場反射觀察之一透視圖及側視圖,其中為清晰起見省略光源110及相關聯之光學器件。寬頻帶光源140沿著照射線142照射樣本101,照射線142沿著匹配光譜儀134之入口狹縫之定向之一定向延伸跨越樣本101之寬度。因此,自樣本101之表面鏡面反射的來自光源140之光穿過狹縫孔隙進入光譜儀134。在光譜儀134內,寬頻帶光被分離(分級)為一系列波長,該等波長由感測器136中之2D感測器陣列記錄,其中2D感測器陣列之一個維度表示光譜資訊且另一維度表示沿著照射線142之空間資訊。因此,寬頻帶光源140之配置係其中將可為樣本101之寬度之一照射線142光譜成像之一亮場操作模式。將一非法線入射角用於亮場觀察有利於簡化沿著照射線142對樣本101進行之均勻照射及光譜成像。 4A and 4B are respectively a perspective view and a side view of bright field reflection observation by optical metrology device 100, with light source 110 and associated optics omitted for clarity. The broadband light source 140 illuminates the sample 101 along an illumination line 142 that extends across the width of the sample 101 along one of the orientations of the entrance slits of the matching spectrometer 134. Thus, light from the source 140 that is specularly reflected from the surface of the sample 101 passes through the slit aperture into the spectrometer 134. Within spectrometer 134, the broadband light is separated (graded) into a series of wavelengths that are recorded by a 2D sensor array in sensor 136, where one dimension of the 2D sensor array represents spectral information and the other The dimension represents spatial information along the illumination line 142. Thus, the configuration of the broadband light source 140 is one of the bright field modes of operation in which the illumination line 142 can be spectrally imaged for one of the widths of the sample 101. The use of an illegal line incident angle for bright field viewing facilitates simplification of uniform illumination and spectral imaging of sample 101 along illumination line 142.

圖5A及圖5B分別繪示樣本101因掃描照射光束114而發生之激發及藉由光學計量器件100進行之所發射光致發光光收集之一透視圖及側視圖。類似於上文之圖3A及圖3B,光源110使用光學器件112及掃描系統116在樣本101之表面上產生照射線122,掃描系統116可包含掃描鏡118及固定鏡120。如上文論述,可移除或替換固定鏡120及/或可使用一F-θ透鏡。經鏡面反射的來自照射光束114之光由線125繪示。然而,來自照射光束114之光之另一部分進入樣本101且被吸收。所吸收之能量產生電子-電洞對,該等電子-電洞對在重組後旋即沿著激發線(即,照射線122)發射光致發光 光。自激發線發射之所產生光致發光光沿多個方向射出樣本101,其中具有近朗伯特性。藉由實例,圖6繪示入射照射光束114及所發射光致發光光之朗伯特性(圖6中未繪示鏡面反射之光)。另外,由於照射光束114沿著照射線122掃描跨越樣本101之寬度,因此如在圖5A中繪示,沿著激發方向發射光致發光光。穿過光譜儀134之狹縫孔隙接收沿著偵測器路徑131之所發射光致發光光,其中該光由光譜儀134偏轉至對應於由感測器136記錄之光致發光光之(若干)波長之(若干)分級箱中。 5A and 5B are respectively a perspective view and a side view showing the excitation of the sample 101 by scanning the illumination beam 114 and the collection of the emitted photoluminescence light by the optical metrology device 100. Similar to FIGS. 3A and 3B above, light source 110 produces illumination line 122 on the surface of sample 101 using optics 112 and scanning system 116, which may include scanning mirror 118 and fixed mirror 120. As discussed above, the fixed mirror 120 can be removed or replaced and/or an F-theta lens can be used. The specularly reflected light from the illumination beam 114 is depicted by line 125. However, another portion of the light from the illumination beam 114 enters the sample 101 and is absorbed. The absorbed energy produces an electron-hole pair that emits photoluminescence along the excitation line (ie, illumination line 122) immediately after recombination. Light. The photoluminescence light generated from the excitation line emission exits the sample 101 in a plurality of directions having a near Lambertian property. By way of example, FIG. 6 illustrates the Lambertian characteristics of the incident illumination beam 114 and the emitted photoluminescence (light that is not specularly reflected in FIG. 6). Additionally, since the illumination beam 114 is scanned across the width of the sample 101 along the illumination line 122, as depicted in Figure 5A, photoluminescent light is emitted along the excitation direction. The slit apertures passing through the spectrometer 134 receive the emitted photoluminescent light along the detector path 131, wherein the light is deflected by the spectrometer 134 to a wavelength(s) corresponding to the photoluminescent light recorded by the sensor 136. In the (several) classification box.

圖7及圖8分別繪示一側視圖(沿著Y-Z平面)及一正視圖(沿著X-Z平面),該等側視圖及正視圖繪示藉由光學計量器件100進行之暗場散射輻射、亮場反射輻射及光致發光光之同時收集。如繪示,照射光束114產生散射光115且激發光致發光光117,散射光115及光致發光光117連同所反射寬頻帶光143一起由光譜儀134接收。 7 and 8 respectively illustrate a side view (along the YZ plane) and a front view (along the XZ plane), the side view and front view showing dark field scattered radiation by the optical metrology device 100, Simultaneous collection of bright field reflected radiation and photoluminescence light. As illustrated, the illumination beam 114 produces scattered light 115 and excites the photoluminescent light 117, which is received by the spectrometer 134 along with the reflected broadband light 143.

藉由實例,圖9繪示由感測器偵測器136之2D感測器陣列成像之三個光譜通道(暗場散射輻射、亮場反射輻射及光致發光光)之信號分離。如繪示,2D感測器陣列包含表示沿著照射線122及142之空間資訊之一第一維度(在圖9中為X軸),其中另一維度表示關於信號強度之光譜資訊(即,波長λ)。在圖9中,散射雷射光束信號由峰值202繪示,光致發光信號由峰值204繪示,且所反射寬頻帶光束信號由峰值206繪示。 By way of example, FIG. 9 illustrates signal separation of three spectral channels (dark field scattered radiation, bright field reflected radiation, and photoluminescent light) imaged by the 2D sensor array of the sensor detector 136. As shown, the 2D sensor array includes a first dimension (X-axis in FIG. 9) representing spatial information along illumination lines 122 and 142, wherein another dimension represents spectral information about signal strength (ie, Wavelength λ). In FIG. 9, the scattered laser beam signal is depicted by peak 202, the photoluminescent signal is depicted by peak 204, and the reflected broadband beam signal is depicted by peak 206.

因此,如在圖7、圖8及圖9中繪示,偵測器130可同時記錄樣本101中回應於藉由照射光束114之激發而產生之光致發光光及寬頻帶光143之一亮場反射。若需要,則偵測器130可進一步記錄照射光束114因樣本上之缺陷而發生之一暗場散射,使得若需要,則同時將三個單獨信號成像。三個信號可在一宏觀模式中沿著樣本101之整個寬度同時記錄,而非如習知 執行之在一微觀中逐點記錄或在一窄視野內記錄。再者,一個偵測器130用於收集所有三個信號,使得在三個信號之間不存在空間或時間移位。一光譜儀134將信號分至三個不同之光譜資訊通道中,即,用偵測器130之2D感測器陣列感測器將信號光譜分離(記錄)於不同波長分級箱(感測器像素)中。應理解,在圖9中繪示之影像圖框係針對沿著圖1中之Y軸的照射線122及142之一個位置,且隨著載台104使樣本101沿Y方向移動以使照射線122及142掃描跨越樣本,感測器136將產生針對沿著圖1中之Y軸之照射線122及142之每一位置之複數個影像圖框。 Therefore, as shown in FIG. 7, FIG. 8, and FIG. 9, the detector 130 can simultaneously record one of the photoluminescence light and the broadband light 143 generated in the sample 101 in response to the excitation by the illumination beam 114. Field reflection. If desired, the detector 130 can further record a dark field scatter of the illumination beam 114 due to a defect on the sample, such that if desired, three separate signals are simultaneously imaged. The three signals can be recorded simultaneously along the entire width of the sample 101 in a macro mode, rather than as is conventional Execution is recorded point by point in a microscopic or recorded in a narrow field of view. Again, a detector 130 is used to collect all three signals such that there is no spatial or temporal shift between the three signals. A spectrometer 134 splits the signal into three different spectral information channels, i.e., uses a 2D sensor array sensor of the detector 130 to spectrally separate (record) the signal spectrum into different wavelength bins (sensor pixels). in. It should be understood that the image frame shown in FIG. 9 is for one position of the illumination lines 122 and 142 along the Y axis in FIG. 1, and the sample 101 is moved in the Y direction with the stage 104 to make the illumination line The 122 and 142 scans span the sample, and the sensor 136 will generate a plurality of image frames for each of the illumination lines 122 and 142 along the Y-axis in FIG.

圖10係繪示來自數個光源之光學計量資料之一方法之一流程圖。如繪示,沿著具有沿一第一方向之一定向之一第一照射線用一第一光源以一第一入射角照射一樣本之一表面(302)。樣本回應於由來自第一光源之光所致之激發而自第一照射線發射光致發光光。藉由實例,如上文論述,可用(例如)使用一窄頻帶光源110產生且掃描跨越樣本以產生第一照射線之一照射光束來照射樣本。沿著具有沿第一方向之一定向且疊加第一照射線之一第二照射線用一第二光源以一第二入射角照射樣本之表面(304)。第二入射角不同於第一入射角,且第二光源係一寬頻帶光源。寬頻帶光自樣本之表面反射。用一二維陣列偵測由樣本沿著第一照射線發射之光致發光光及來自第二照射線之寬頻帶光之鏡面反射,該二維陣列具有表示對應於沿著第一照射線及第二照射線之位置之空間資訊之一第一維度及表示光譜資訊之一第二維度(306)。可不偵測來自第一光源之光沿著第一照射線之鏡面反射。使疊加之第一照射線及第二照射線沿不同於第一方向之一第二方向移動跨越樣本之表面(308)。舉例而言,第一方向及第二方向可係正交的。可藉由一線性載台或一旋轉載台使樣本101相對於照射線移動而致 使第一照射線及第二照射線移動。若需要,則可藉由一載台使第一照射線及第二照射線相對於樣本101移動(例如,藉由使光源及相關聯之光學器件相對於可保持靜止之樣本101移動)而致使第一照射線及第二照射線移動。隨著第一照射線及第二照射線移動跨越樣本之表面,使用所偵測光致發光光及所偵測寬頻帶光之鏡面反射來產生一三維資料立方體,該三維資料立方體具有表示樣本之表面之空間資訊之兩個維度及表示光譜資訊之一第三維度(310)。 Figure 10 is a flow chart showing one of the methods of optical metrology data from a plurality of light sources. As shown, a first surface (302) is illuminated at a first angle of incidence with a first source along a first illumination line having a direction along one of the first directions. The sample emits photoluminescent light from the first illumination line in response to excitation by light from the first source. By way of example, as discussed above, the sample can be illuminated, for example, using a narrowband source 110 and scanning across the sample to produce an illumination beam of one of the first illumination lines. A surface (304) of the sample is illuminated with a second source at a second angle of incidence along a second illumination line having one of the first illumination lines oriented along one of the first illumination lines. The second incident angle is different from the first incident angle, and the second light source is a broadband light source. Broadband light is reflected from the surface of the sample. Detecting, by a two-dimensional array, specular reflection of the photoluminescent light emitted by the sample along the first illumination line and the broadband light from the second illumination line, the two-dimensional array having a representation corresponding to the first illumination line and A first dimension of spatial information of the location of the second illumination line and a second dimension (306) representing spectral information. The specular reflection of light from the first source along the first illumination line may not be detected. The superimposed first and second illumination lines are moved across a surface of the sample (308) in a second direction that is different from the first direction. For example, the first direction and the second direction can be orthogonal. The sample 101 can be moved relative to the illumination line by a linear stage or a rotating stage The first illumination line and the second illumination line are moved. If desired, the first and second illumination lines can be moved relative to the sample 101 by a stage (e.g., by moving the source and associated optics relative to the sample 101 that can remain stationary). The first illumination line and the second illumination line move. As the first illumination line and the second illumination line move across the surface of the sample, a three-dimensional data cube is generated using the detected photoluminescence light and the specular reflection of the detected broadband light, the three-dimensional data cube having a representation sample The two dimensions of the spatial information of the surface and the third dimension of the spectral information (310).

另外,如上文討論,來自第一光源之光之一部分可作為散射光自樣本上之表面缺陷散射且散射光可用二維陣列偵測,其中三維資料立方體另外包含所偵測之散射光。使用在三維資料立方體中之散射光可產生樣本之表面之一表面缺陷影像。另外,樣本之表面之一光致發光影像可使用在三維資料立方體中之所偵測之光致發光光產生。舉例而言,樣本表面之光致發光影像可係(例如)一光致發光強度影像、光致發光峰值λ影像或一光致發光半峰全寬(FWHM)影像。另外,針對樣本之表面上之複數個位置,可使用三維資料立方體中之寬頻帶光之所偵測鏡面反射而判定樣本之一特性,且可使用針對複數個位置之樣本特性來產生樣本之表面之一影像。舉例而言,可在樣本101之表面上之複數個位置處判定樣本101之磊晶層厚度,且可產生一磊晶層厚度影像(或映射)。如上文討論,來自三維資料立方體之資料可經分析用於樣本製造期間之程序控制。 Additionally, as discussed above, a portion of the light from the first source can be scattered as scattered light from surface defects on the sample and the scattered light can be detected by a two-dimensional array, wherein the three-dimensional data cube additionally includes the detected scattered light. The use of scattered light in a three-dimensional data cube produces a surface defect image of one of the surfaces of the sample. Alternatively, a photoluminescence image of the surface of the sample can be generated using the detected photoluminescence light in a three-dimensional data cube. For example, the photoluminescence image of the sample surface can be, for example, a photoluminescence intensity image, a photoluminescence peak lambda image, or a photoluminescence full width at half maximum (FWHM) image. In addition, for a plurality of positions on the surface of the sample, the detected specular reflection of the broadband light in the three-dimensional data cube can be used to determine one of the characteristics of the sample, and the sample characteristics for the plurality of positions can be used to generate the surface of the sample. One image. For example, the epitaxial layer thickness of the sample 101 can be determined at a plurality of locations on the surface of the sample 101, and an epitaxial layer thickness image (or map) can be produced. As discussed above, data from a three-dimensional data cube can be analyzed for program control during sample manufacturing.

藉由實例,圖11繪示一光學計量器件100'之一側視圖,除窄頻帶照射光束114'繪示為自與寬頻帶照射141相同之法線N側入射外,光學計量器件100'與圖7繪示之光學計量器件100類似。因此,雖然窄頻帶照射光束114'及寬頻帶照射141自法線N之相同側入射於樣本101之表面上,但其等 使用不同入射角,使得窄頻帶照射114'之鏡面反射125'並不沿著偵測器路徑131,從而實現暗場模式量測。如在圖11中可見,相對於法線N,照射光束114'之入射角大於寬頻帶照射141之入射角,但此並非嚴格要求的。藉由實例,圖12類似於圖11,且繪示一光學計量器件100",光學計量器件100"經組態使得窄頻帶照射光束114"與寬頻帶照射141相比相對於法線N具有一較小入射角,同時窄頻帶照射114"之鏡面反射125"仍不沿著偵測器路徑131,從而實現暗場模式量測。 By way of example, FIG. 11 illustrates a side view of an optical metrology device 100', except that the narrowband illumination beam 114' is shown as being incident on the same N-side as the broadband illumination 141, the optical metrology device 100' and The optical metrology device 100 illustrated in Figure 7 is similar. Therefore, although the narrow-band illumination beam 114' and the broadband illumination 141 are incident on the surface of the sample 101 from the same side of the normal line N, Using different angles of incidence, the specular reflection 125' of the narrowband illumination 114' does not follow the detector path 131, thereby enabling dark field mode measurements. As can be seen in Figure 11, the angle of incidence of the illumination beam 114' is greater than the angle of incidence of the broadband illumination 141 relative to the normal N, although this is not strictly required. By way of example, FIG. 12 is similar to FIG. 11 and depicts an optical metrology device 100" that is configured such that the narrowband illumination beam 114" has one relative to the normal N compared to the broadband illumination 141. The smaller incident angle, while the narrow-band illumination 114" specular reflection 125" still does not follow the detector path 131, enabling dark field mode measurements.

對於晶圓檢驗設備設計者之一顯著挑戰為在高解析度(約每像素數百微米)下以高速(每小時數十個晶圓)且以高信號收集效率達成光致發光或者反射或散射光之全晶圓成像。為達成高量測速度,有時使用低數值孔徑(NA)物鏡及大視野(FOV)配置來實現在一個信號擷取中自整個樣本大小之信號收集。按一般定義,數值孔徑等於NA=n* sin(θ),其中n係其中使用透鏡之介質之折射率(空氣為1.00)且θ係可透過透鏡孔隙進入透鏡之光之最大半角。因此,針對典型大FOV成像系統(具有一20mm直徑之透鏡及約400mm之典型物體至透鏡距離),數值孔徑可經計算為NA=0.025。低NA物鏡及大FOV配置導致低信號收集效率及低儀器靈敏度,此乃因在此一配置中,光學器件至樣本距離必須係大的。一大光學器件至樣本距離導致光致發光或散射光輻射之實質損失。較高數值孔徑物鏡容許較短光學器件至樣本距離、較佳信號收集及較高儀器靈敏度,然而,此係以減小光學器件之FOV為代價的。因此,量測速度變低,此乃因若干量測及影像拼接必須以全樣本尺度應用於重構資訊。 A significant challenge for one of the wafer inspection equipment designers is to achieve photoluminescence or reflection or scattering at high resolution (a few hundred microns per pixel) at high speed (tens of wafers per hour) with high signal collection efficiency. Full wafer imaging of light. To achieve high measurement speeds, low numerical aperture (NA) objectives and large field of view (FOV) configurations are sometimes used to achieve signal acquisition from the entire sample size in one signal acquisition. By general definition, the numerical aperture is equal to NA = n * sin(θ), where n is the refractive index of the medium in which the lens is used (air is 1.00) and θ is the maximum half angle of the light that enters the lens through the lens aperture. Thus, for a typical large FOV imaging system (having a 20 mm diameter lens and a typical object-to-lens distance of about 400 mm), the numerical aperture can be calculated as NA = 0.025. Low NA objectives and large FOV configurations result in low signal collection efficiency and low instrument sensitivity, since in this configuration the optics to sample distance must be large. A large optical device to sample distance results in substantial loss of photoluminescence or scattered light radiation. Higher numerical aperture objectives allow for shorter optics to sample distances, better signal acquisition, and higher instrument sensitivity, however, at the expense of reducing the FOV of the optics. Therefore, the measurement speed becomes lower, because several measurements and image stitching must be applied to the reconstruction information at the full sample scale.

上文描述之實施例藉由使用一雷射光束使照射點掃描跨越表面(例如,使用一電流計式鏡或一旋轉多面鏡)來激發樣本同時使用與高光譜光 譜儀及攝影機系統組合之一基於透鏡之物鏡來探測光致發光或者反射或散射輻射回應而提供一高量測解析度及高速。為達成一所需高量測速度,可使用具有足夠用於整個樣本之視野(多達300mm)之低數值孔徑光學器件。此一配置容許高量測速度(例如,每小時數十個晶圓)及高解析度(例如,約每像素數百微米)。然而,物鏡之低數值孔徑可導致信號收集器件與樣本之間的一大距離。因此,可據此核准光學信號收集效率。 The embodiments described above use a laser beam to scan an illumination spot across a surface (eg, using a galvanometer mirror or a rotating polygon mirror) to excite the sample while using hyperspectral light. One of the spectrometer and camera system combinations provides a high measurement resolution and high speed based on the lens objective to detect photoluminescence or reflected or scattered radiation responses. To achieve a desired high measurement speed, low numerical aperture optics with sufficient field of view (up to 300 mm) for the entire sample can be used. This configuration allows for high speed measurements (eg, tens of wafers per hour) and high resolution (eg, on the order of hundreds of microns per pixel). However, the low numerical aperture of the objective lens can result in a large distance between the signal collecting device and the sample. Therefore, optical signal collection efficiency can be approved accordingly.

改良光學信號收集效率之一種方式(例如)係藉由使用較高數值孔徑光學器件,藉此實現光學器件至樣本距離之減小,藉此增大信號收集效率,然而,此係以一減小之光學器件視野為代價的。藉助使用較高數值孔徑光學器件,在一個成像循環中掃描或觀看樣本之僅一部分。因此,來重構整個樣本之一影像需要一系列量測及影像拼接。此一解決方案本質上導致低量測速度及最終低量測處理量。 One way to improve the efficiency of optical signal collection, for example, is to achieve a reduction in optical device-to-sample distance by using higher numerical aperture optics, thereby increasing signal collection efficiency, however, this is a reduction. The optics field of view comes at the cost. By using higher numerical aperture optics, only a portion of the sample is scanned or viewed in one imaging cycle. Therefore, reconstructing an image of the entire sample requires a series of measurements and image stitching. This solution essentially results in a low measurement speed and a final low measurement throughput.

因此,在另一實施例中,具有(例如)等於或超過所需影像大小之一長度之高NA光學器件可用於達成光學信號之一高收集效率。藉助使用延伸達一長度(例如,照射線之三分之一、一半或整個長度)之一信號收集光學器件,信號收集光學器件可經放置靠近樣本表面。應理解,若信號收集光學器件延伸達照射線之長度之三分之一,則擷取整個影像之資料將需要三次掃描,且類似地,若信號收集光學器件延伸達照射線之長度之一半,則擷取整個影像之資料將需要兩次掃描,藉此相對於延伸達照射線之整個長度之一信號收集光學器件減小了處理量。例如,從信號收集光學器件至樣本之距離及信號收集光學器件之寬度可經組態以產生足以產生0.4或更高之一NA之信號收集半角θ。高NA信號收集光學器件可反射性或折射性的。另外,一光導管可與光學器件一起使用以將接收之光提供至偵測器。 實施方案以全樣本大小FOV實現高解析度及高靈敏度信號收集,此容許克服高解析度、敏感度及速度之間的現有折衷。 Thus, in another embodiment, a high NA optical device having, for example, one of the lengths of the desired image size, can be used to achieve a high collection efficiency of one of the optical signals. By using one of the signal collecting optics that extends for a length (eg, one-third, one-half, or the entire length of the illumination line), the signal collection optics can be placed close to the sample surface. It should be understood that if the signal collecting optics extends for one-third of the length of the illumination line, then the data for the entire image will require three scans, and similarly, if the signal collection optics extends for one-half the length of the illumination line, The data for the entire image will require two scans, thereby reducing the throughput of the signal collection optics relative to one of the entire lengths of the illumination line. For example, the distance from the signal collection optics to the sample and the width of the signal collection optics can be configured to produce a signal collection half angle θ sufficient to produce one of 0.4 or higher NA. High NA signal collection optics are reflective or refractive. Additionally, a light pipe can be used with the optics to provide the received light to the detector. The implementation achieves high resolution and high sensitivity signal collection with full sample size FOV, which allows for overcoming existing tradeoffs between high resolution, sensitivity, and speed.

例如,在一項實施例中,為收集跨越圖1中展示之激發線122之光致發光或散射輻射,可使用反射性光學器件,諸如一長橢圓柱面鏡,例如,具有一正橢圓柱形表面之一鏡。藉由實例,圖13繪示可用於接收自樣本101發射之光致發光或自樣本101散射之光之一長橢圓柱面鏡402之一透視圖。在長度方向上,沿著X軸,鏡402係平坦的,而在寬度方向上,沿著Y軸,鏡402橢圓地彎曲有高NA(即,短焦距)。例如,從鏡至樣本之距離可係10mm,且鏡之輪廓大小亦可係10mm,且因此,信號收集半角θ為約26度,從而導致一NA=0.45。鏡402之長度(例如)可超過所需影像大小,例如針對當前晶圓技術為300mm樣本大小。鏡402連同收集光學器件及光譜儀(下文論述)一起可替代偵測器130(例如,圖1、圖3A、圖4A、圖7、圖11及圖12中繪示)而使用。 For example, in one embodiment, to collect photoluminescence or scattered radiation across the excitation line 122 shown in FIG. 1, reflective optics such as a long elliptical cylindrical mirror can be used, for example, having a positive elliptical cylinder. One of the shaped surfaces. By way of example, FIG. 13 depicts a perspective view of one of the oblong cylindrical mirrors 402 that can be used to receive photoluminescence emitted from sample 101 or light scattered from sample 101. In the length direction, along the X-axis, the mirror 402 is flat, and in the width direction, along the Y-axis, the mirror 402 is elliptically curved with a high NA (ie, a short focal length). For example, the distance from the mirror to the sample can be 10 mm, and the contour of the mirror can be 10 mm, and therefore, the signal collection half angle θ is about 26 degrees, resulting in a NA = 0.45. The length of mirror 402, for example, can exceed a desired image size, such as a 300 mm sample size for current wafer technology. Mirror 402, along with collection optics and spectrometers (discussed below), can be used in place of detector 130 (e.g., as depicted in Figures 1, 3A, 4A, 7, 11, and 12).

圖14繪示從一樣本101收集光致發光或散射輻射之橢圓鏡402之一側視圖(沿著Y-Z平面)。鏡402可經放置靠近(數毫米至數十毫米)樣本404,從而導致藉由激發雷射光束406產生之光學光致發光或散射輻射信號之一高收集效率。鏡402可包含一狹縫403或多個狹縫,激發雷射光束406可通過該或該等狹縫。替代地,激發雷射光束406可在鏡402下方通過,然而,一狹縫403之使用容許使用一較寬鏡,因此提供較高NA及較佳信號靈敏度。(例如)使用圖1中展示之掃描系統116或類似物使雷射光束406沿X方向掃描跨越晶圓。在沿著線142之各所需空間位置(沿著X方向)(在圖13中繪示為位置X1、X2、X3、X4及X5)處,鏡402以一寬角度從樣本404收集光學信號407,此導致一高儀器靈敏度。應理解,雖然在圖13中繪示離 散位置X1、X2、X3、X4及X5,但光束406連續地掃描跨越樣本404,且來自沿著線142之所有位置之一光學信號407由鏡402接收。由於鏡402沿著X方向之線性組態,如在圖13中繪示,其中激發區沿樣本404之X方向呈跨越整個樣本之一線142之一形式,因此所得光學信號407(例如,自樣本404發射之光致發光輻射或由樣本404散射之輻射)由橢圓柱面鏡402聚焦成具有與激發線142相同之長度之一線410。激發線142及線410可具有與鏡402相同之長度,即,超過所需影像大小之一長度(例如,約300mm)。 Figure 14 depicts a side view (along the Y-Z plane) of an elliptical mirror 402 that collects photoluminescence or scattered radiation from the same 101. The mirror 402 can be placed close to (several millimeters to tens of millimeters) of the sample 404, resulting in a high collection efficiency of one of the optical photoluminescent or scattered radiation signals generated by exciting the laser beam 406. Mirror 402 can include a slit 403 or slits through which excitation laser beam 406 can pass. Alternatively, the excitation laser beam 406 can pass under the mirror 402, however, the use of a slit 403 allows for the use of a wider mirror, thus providing a higher NA and better signal sensitivity. The laser beam 406 is scanned across the wafer in the X direction, for example, using the scanning system 116 or the like shown in FIG. Mirror 402 collects optical signals from sample 404 at a wide angle at each desired spatial location along line 142 (along the X direction) (shown as positions X1, X2, X3, X4, and X5 in FIG. 13). 407, which results in a high instrument sensitivity. It should be understood that although depicted in Figure 13 The positions X1, X2, X3, X4, and X5 are scattered, but the beam 406 is continuously scanned across the sample 404, and optical signal 407 from all of the locations along line 142 is received by mirror 402. Due to the linear configuration of mirror 402 along the X direction, as depicted in Figure 13, where the excitation region is in the X direction of sample 404 across one of the lines 142 of the entire sample, the resulting optical signal 407 (e.g., from the sample) The 404 emitted photoluminescent radiation or the radiation scattered by the sample 404 is focused by an elliptical cylindrical mirror 402 into a line 410 having the same length as the excitation line 142. Excitation line 142 and line 410 can have the same length as mirror 402, i.e., one length beyond the desired image size (e.g., about 300 mm).

樣本404以藉由使用掃描系統116沿著樣本移動激發光束406而產生之一線之一形式被激發。在一個配置中,為激發樣本404,在激發光束406沿著X方向掃描時,激發光束406可在鏡402外側通過。在一個配置中,激發光束406可在鏡402下方或上方通過。在另一配置中,橢圓柱面鏡402沿著鏡長度可包含一狹縫,使得光束406可通過鏡402中之狹縫且可以任何期望角度(包含法線角度)激發樣本404。 The sample 404 is excited in the form of one of the lines produced by moving the excitation beam 406 along the sample using the scanning system 116. In one configuration, to excite the sample 404, the excitation beam 406 can pass outside of the mirror 402 as the excitation beam 406 scans in the X direction. In one configuration, the excitation beam 406 can pass under or over the mirror 402. In another configuration, the elliptical cylindrical mirror 402 can include a slit along the length of the mirror such that the beam 406 can pass through the slit in the mirror 402 and can excite the sample 404 at any desired angle (including the normal angle).

沿著線410聚焦之所得光學信號407(如在圖13中展示)經由使用橢圓柱面鏡402聚焦光致發光或散射輻射而獲得。出於記錄光學信號之目的,所得光學信號407(其沿著線410聚焦)需要遞送至一偵測器130。然而,偵測器通常不具有呈一300mm長線之形狀之輸入孔隙。因此,所得光學信號407(其沿著線410聚焦)應與偵測器130之孔隙匹配,從而產生最小光損失。在一項實施例中,由鏡402聚焦之所得光學信號407可由一光導管412接收,光導管412具有一線性信號接收端414(與圖13中之線410對準)以及具有與偵測器130之孔隙相配之一形狀之一信號輸出端416。如繪示,鏡402或光導管412不接收經鏡面反射之光409。若需要,則鏡402可包含使 經鏡面反射之光409通過之一狹縫(未展示)。 The resulting optical signal 407 (as shown in FIG. 13) focused along line 410 is obtained by focusing photoluminescence or scattered radiation using an elliptical cylindrical mirror 402. The resulting optical signal 407 (which is focused along line 410) needs to be delivered to a detector 130 for the purpose of recording optical signals. However, the detector typically does not have an input aperture in the shape of a 300 mm long line. Thus, the resulting optical signal 407 (which is focused along line 410) should match the aperture of the detector 130 to produce minimal optical loss. In one embodiment, the resulting optical signal 407 focused by mirror 402 can be received by a light pipe 412 having a linear signal receiving end 414 (aligned with line 410 in FIG. 13) and having a detector The aperture of 130 matches one of the shapes of signal output 416. As shown, mirror 402 or light pipe 412 does not receive specularly reflected light 409. If desired, mirror 402 can include The specularly reflected light 409 passes through a slit (not shown).

在另一實施例中,為收集跨越圖1中展示之激發線122之光致發光或散射輻射,可使用折射性光學器件,諸如一長圓柱形聚焦透鏡,例如,具有一正圓柱形形狀之一透鏡。藉由實例,圖15繪示可用於接收自樣本101發射之光致發光或自樣本101散射之光之一長圓柱形透鏡502之一透視圖。圓柱形透鏡502可具有一高NA,即,短焦距。例如,若圓柱形透鏡之直徑係約20mm,且透鏡中心處於距樣本20mm之距離處(即,樣本與透鏡之間的氣隙為10mm),則導致一NA=0.45。透鏡502之長度(例如)可超過所需影像大小,例如針對當前晶圓技術為300mm樣本大小。透鏡502連同收集光學器件及光譜儀(下文論述)一起可替代偵測器130(例如,圖1、圖3A、圖4A、圖7、圖11及圖12中繪示)而使用。 In another embodiment, to collect photoluminescence or scattered radiation across the excitation line 122 shown in Figure 1, refractive optical means, such as an elongated cylindrical focusing lens, for example, having a positive cylindrical shape, may be used. a lens. By way of example, FIG. 15 depicts a perspective view of one of the elongated cylindrical lenses 502 that can be used to receive photoluminescence emitted from sample 101 or light scattered from sample 101. The cylindrical lens 502 can have a high NA, i.e., a short focal length. For example, if the diameter of the cylindrical lens is about 20 mm and the center of the lens is at a distance of 20 mm from the sample (i.e., the air gap between the sample and the lens is 10 mm), a NA = 0.45 is caused. The length of lens 502, for example, can exceed a desired image size, such as a 300 mm sample size for current wafer technology. Lens 502, along with collection optics and spectrometers (discussed below), can be used in place of detector 130 (e.g., as depicted in Figures 1, 3A, 4A, 7, 11, and 12).

圖16繪示從一樣本101收集光致發光或散射輻射之圓柱形透鏡502之一側視圖(沿著Y-Z平面)。圓柱形透鏡502可經放置靠近(數毫米至數十毫米)樣本101,從而導致藉由激發雷射光束406而產生之光學光致發光或散射輻射信號之一高收集效率。(例如)使用圖1中展示之掃描系統116或類似物使雷射光束406沿X方向掃描跨越晶圓。圓柱形透鏡502以一寬角度沿著樣本101上之線142(圖15中展示)之長度自樣本101收集光學信號407,此導致一高儀器靈敏度。由於沿著X方向之圓柱形透鏡502之線性組態,如在圖15中繪示,其中激發區沿樣本404之X方向呈跨越整個樣本之一線142之一形式,所得光學信號407(例如,自樣本404發射之光致發光輻射或由樣本404散射之輻射)由圓柱形透鏡502聚焦成具有與激發線142相同之長度之一線510。激發線142及線510可具有與圓柱形透鏡502相同之長度,即,超過所需影像大小之一長度(例如,約300mm)。 Figure 16 depicts a side view (along the Y-Z plane) of a cylindrical lens 502 that collects photoluminescence or scattered radiation from the same 101. The cylindrical lens 502 can be placed close to (several millimeters to tens of millimeters) of the sample 101, resulting in a high collection efficiency of one of the optical photoluminescent or scattered radiation signals generated by exciting the laser beam 406. The laser beam 406 is scanned across the wafer in the X direction, for example, using the scanning system 116 or the like shown in FIG. Cylindrical lens 502 collects optical signal 407 from sample 101 at a wide angle along the length of line 142 (shown in Figure 15) on sample 101, which results in a high instrument sensitivity. Due to the linear configuration of the cylindrical lens 502 along the X direction, as depicted in Figure 15, where the excitation region is in the X direction of the sample 404 in the form of one of the lines 142 across the entire sample, the resulting optical signal 407 (e.g., The photoluminescence radiation emitted from sample 404 or the radiation scattered by sample 404 is focused by cylindrical lens 502 into a line 510 having the same length as excitation line 142. Excitation line 142 and line 510 can have the same length as cylindrical lens 502, i.e., one length beyond the desired image size (e.g., about 300 mm).

樣一101以藉由使用掃描系統116沿著樣本移動激發光束406而產生之一線之一形式被激發。如繪示,為激發樣本101,在激發光束406沿著X方向掃描時,激發光束406可在圓柱形透鏡502下方通過。沿著線510聚焦之所得光學信號407(如在圖15中展示)經由使用圓柱形透鏡502聚焦光致發光或散射輻射而獲得。出於記錄光學信號之目的,所得光學信號407(其沿著線510聚焦)需要遞送至一偵測器130。如上文論述,所得光學信號407(其沿著線510聚焦)應與偵測器130之孔隙匹配,從而產生最小光損失。在一項實施例中,由圓柱形透鏡502聚焦之所得光學信號407可由一光導管412接收,光導管412具有一線性信號接收端414(與圖15中之線510對準)及具有可與偵測器130之孔隙相配之一形狀之一信號輸出端416。如繪示,圓柱形透鏡502或光導管412不接收經鏡面反射之光409。 Sample 101 is excited in the form of one of the lines produced by moving the excitation beam 406 along the sample using scanning system 116. As shown, to excite the sample 101, the excitation beam 406 can pass under the cylindrical lens 502 as the excitation beam 406 scans in the X direction. The resulting optical signal 407 (as shown in FIG. 15) focused along line 510 is obtained by focusing photoluminescence or scattered radiation using a cylindrical lens 502. The resulting optical signal 407 (which is focused along line 510) needs to be delivered to a detector 130 for the purpose of recording optical signals. As discussed above, the resulting optical signal 407 (which is focused along line 510) should match the aperture of the detector 130 to produce minimal optical loss. In one embodiment, the resulting optical signal 407 focused by the cylindrical lens 502 can be received by a light pipe 412 having a linear signal receiving end 414 (aligned with line 510 in FIG. 15) and having The aperture of the detector 130 is matched to one of the signal outputs 416. As illustrated, cylindrical lens 502 or light pipe 412 does not receive specularly reflected light 409.

圖17A繪示用以自光學器件402或502接收光學信號407的光導管412之線性信號接收端414,且圖17B繪示用以將光學信號407提供至偵測器130之一矩形信號輸出端416。光導管412在線性信號接收端414與一矩形信號輸出端416之間包含數個光纖418。如繪示,光纖418可以與光學信號407之長度匹配或與光學器件(例如,橢圓柱面鏡402或圓柱形透鏡502)之長度匹配之一單一列配置於線性信號接收端414處。藉由實例,可使用1298個光纖(其等之各者具有0.245mm之直徑)來形成約318mm長之一線(略大於300mm樣本)以便從樣本邊緣收集大多數信號。若需要,則可使用不同數量之光纖或不同光纖直徑,或在線性信號接收端414處可使用不同數量之光纖列。再者,若樣本大小係不同的(例如,200mm),則可使用不同數量之光纖,例如,可使用891個光纖來形成約218mm長之一線。當然,若光導管412之長度比光學器件402或502之長度短,則光學信號 407之一部分可不被光導管412接納,且因此,可需要偵測器130及多個通路來獲取整個樣本之資料。光纖418從線性信號接收端414重新機械配置至矩形信號輸出端416。例如,如在圖17B中繪示,光纖可配置成若干層。例如,線性信號接收端414上之1298個光纖可在光譜儀側上重新配置成118個層乘以11個層從而給出相同數量之光纖(118×11=1298個纖維)。針對一不同大小之樣本(例如,一200mm樣本),其中在線性信號接收端414上存在891個光纖,該891個光纖可在光譜儀側上重新配置成81個層乘以11個層從而給出相同數量之光纖(81×11=891個纖維)。按照該實例,重新配置成81乘以11個層之矩形形狀將光導管412從線性信號接收端414處之218mm長(乘以0.245mm)調整大小為矩形信號輸出端416處之約20mm乘以2.5mm(此為偵測器130所接受的)。因此,光學信號407由光學器件402或502聚焦至線性信號接收端414中且光纖418用來將光學信號提供至耦合至偵測器130之矩形信號輸出端416。此配置促進將光學信號407遞送至信號偵測器130中,偵測器130最終將光學輻射轉換為電信號。可使用光導管412之信號輸出端416上之不同形狀,諸如矩形、正方形或圓形。另外,進一步聚焦光學器件可應用於矩形信號輸出端416與偵測器130之間以視需要達成甚至更佳之匹配。 17A illustrates the linear signal receiving end 414 of the light pipe 412 for receiving the optical signal 407 from the optical device 402 or 502, and FIG. 17B illustrates the optical signal 407 for providing a rectangular signal output to the detector 130. 416. Light pipe 412 includes a plurality of optical fibers 418 between linear signal receiving end 414 and a rectangular signal output 416. As shown, the fiber 418 can be disposed at a linear signal receiving end 414 in a single column that matches the length of the optical signal 407 or matches the length of the optical device (eg, elliptical cylindrical mirror 402 or cylindrical lens 502). By way of example, 1298 fibers (each of which has a diameter of 0.245 mm) can be used to form a line approximately 318 mm long (slightly larger than 300 mm sample) to collect most of the signal from the edge of the sample. If desired, a different number of fibers or different fiber diameters can be used, or a different number of fiber trains can be used at the linear signal receiving end 414. Furthermore, if the sample sizes are different (eg, 200 mm), a different number of fibers can be used, for example, 891 fibers can be used to form a line about 218 mm long. Of course, if the length of the light pipe 412 is shorter than the length of the optical device 402 or 502, the optical signal One portion of 407 may not be received by light pipe 412, and thus, detector 130 and multiple paths may be required to obtain data for the entire sample. Fiber 418 is mechanically reconfigured from linear signal receiving end 414 to rectangular signal output 416. For example, as illustrated in Figure 17B, the fiber can be configured in several layers. For example, 1298 fibers on the linear signal receiving end 414 can be reconfigured on the spectrometer side to 118 layers multiplied by 11 layers to give the same number of fibers (118 x 11 = 1298 fibers). For a different sized sample (eg, a 200 mm sample) where there are 891 fibers on the linear signal receiving end 414, the 891 fibers can be reconfigured on the spectrometer side to 81 layers multiplied by 11 layers to give The same number of fibers (81 x 11 = 891 fibers). According to this example, the rectangular shape reconfigured to 81 times 11 layers sizing the light pipe 412 from the linear signal receiving end 414 by 218 mm (multiplied by 0.245 mm) to approximately 20 mm at the rectangular signal output 416 multiplied by 2.5mm (this is accepted by the detector 130). Thus, optical signal 407 is focused by optical device 402 or 502 into linear signal receiving end 414 and optical fiber 418 is used to provide an optical signal to rectangular signal output 416 coupled to detector 130. This configuration facilitates the delivery of optical signal 407 to signal detector 130, which ultimately converts the optical radiation into an electrical signal. Different shapes on the signal output 416 of the light pipe 412 can be used, such as rectangular, square or circular. Additionally, further focusing optics can be applied between the rectangular signal output 416 and the detector 130 to achieve even better matching as desired.

在自光導管412離開後,光學信號407可藉由出口光學器件進一步成形以將信號與偵測器輸入匹配。取決於所需最終結果,可使用各種偵測場景。例如,偵測器130可使用一光譜儀。如在圖18中繪示,在離開光導管412後,光學信號407可由一光學濾光器452濾光且提供至一光譜儀454之狹縫,其中光藉由光柵或棱鏡分散為不同波長,且最終遞送至CCD或CMOS攝影機感測器陣列456中且由一資料獲取器件458記錄,資料獲取器 件458將資料提供至處理器152以用於分析。因此,偵測器130可擷取多個輸出信號,同時激發光束406沿X方向掃描跨越晶圓以便獲得光譜及空間資訊。 After exiting from light pipe 412, optical signal 407 can be further shaped by the exit optics to match the signal to the detector input. Various detection scenarios can be used depending on the desired end result. For example, detector 130 can use a spectrometer. As shown in FIG. 18, after exiting the light pipe 412, the optical signal 407 can be filtered by an optical filter 452 and provided to a slit of a spectrometer 454, wherein the light is dispersed into different wavelengths by a grating or prism, and Eventually delivered to the CCD or CMOS camera sensor array 456 and recorded by a data acquisition device 458, the data acquirer Piece 458 provides the data to processor 152 for analysis. Therefore, the detector 130 can capture a plurality of output signals while the excitation beam 406 scans across the wafer in the X direction to obtain spectral and spatial information.

在另一實施例中,偵測器130可使用一光電倍增管(PMT)或突崩光二極體(APD)。如在圖19中繪示,在離開光導管412後,光學信號407可由一光學濾光器452濾光且提供至光電倍增管(PMT)或突崩光二極體(APD)462。光學信號407轉換為電信號,且由資料獲取器件458記錄,資料獲取器件458將資料提供至處理器152以供分析。在此實施例中,未獲得光譜資訊,而是將所有波長整合成一個電信號。因此,可期望同步化第一光源110及第二光源140(圖1)使得所得信號不被偵測器130同時接收。 In another embodiment, the detector 130 can use a photomultiplier tube (PMT) or a astigmatism diode (APD). As shown in FIG. 19, upon exiting the light pipe 412, the optical signal 407 can be filtered by an optical filter 452 and provided to a photomultiplier tube (PMT) or a swell light diode (APD) 462. Optical signal 407 is converted to an electrical signal and recorded by data acquisition device 458, which provides the data to processor 152 for analysis. In this embodiment, spectral information is not obtained, but all wavelengths are integrated into one electrical signal. Accordingly, it may be desirable to synchronize the first source 110 and the second source 140 (FIG. 1) such that the resulting signals are not simultaneously received by the detector 130.

圖20繪示一側視圖(沿著Y-Z平面),藉由實例,該側視圖繪示由光學計量器件使用橢圓鏡402利用光導管412進行之暗場散射輻射、光致發光光及視情況亮場反射輻射之同時收集。如繪示,照射光束114產生散射光115,且激發光致發光光117,該等光連同所反射寬頻帶光143一起由光譜儀134接收。 20 is a side view (along the YZ plane). By way of example, the side view shows dark field scattered radiation, photoluminescence, and brightness as seen by the optical metrology device using the elliptical mirror 402 using the light pipe 412. The field is reflected while collecting radiation. As illustrated, illumination beam 114 produces scattered light 115 and excites photoluminescent light 117, which is received by spectrometer 134 along with reflected broadband light 143.

可包含光學器件132、光譜儀134及感測器136之偵測器130可同時記錄樣本101中回應於藉由照射光束114之激發而產生之光致發光光及來自照射光束114之散射光,及視情況寬頻帶光143之一亮場反射(例如,若光導管412具有呈一線之形式之一信號輸出端以提供空間資訊)。若需要,則偵測器130可進一步記錄照射光束114因樣本上之缺陷而發生之一暗場散射,使得若需要,則同時將三個單獨信號成像。偵測器130用於收集所有三個信號,使得三個信號之間不存在空間或時間移位。一光譜儀134將信號分至三個不同光譜資訊通道中,即,用偵測器130之2D感測器陣列感測 器將信號光譜分離(記錄)於不同波長分級箱(感測器像素)中。 The detector 130, which may include the optical device 132, the spectrometer 134, and the sensor 136, can simultaneously record the photoluminescence light generated in the sample 101 in response to the excitation by the illumination beam 114 and the scattered light from the illumination beam 114, and Depending on the situation, one of the broadband light 143 is bright field reflected (e.g., if the light pipe 412 has one of the signal outputs in the form of a line to provide spatial information). If desired, the detector 130 can further record a dark field scatter of the illumination beam 114 due to a defect on the sample, such that if desired, three separate signals are simultaneously imaged. The detector 130 is used to collect all three signals such that there is no spatial or temporal shift between the three signals. A spectrometer 134 splits the signal into three different spectral information channels, i.e., senses with a 2D sensor array of detectors 130. The signal is spectrally separated (recorded) into different wavelength bins (sensor pixels).

藉助使用橢圓鏡402,自樣本101之表面發射之光學信號由高NA基於鏡之光學器件收集,該等光學器件達成光學信號之高收集效率及高儀器靈敏度。在X方向上,樣本以藉由掃描系統116產生之一線之一形式被激發,此實現高量測速度。量測配置藉由應用一光導管412得以補充,此在不進行機械移動之情況下實現光學信號從一樣本大小長線之收集及光學信號至一所需形狀之轉變(諸如一小圓形區域或在一線中)。具有數千個個別光纖之多光纖電路之應用實現每像素約數十微米之高量測解析度。因此,裝置達成高靈敏度、高解析度及高速度(量測輸送量)。 By using the elliptical mirror 402, the optical signals emitted from the surface of the sample 101 are collected by high-NA mirror-based optics that achieve high collection efficiency and high instrument sensitivity of the optical signal. In the X direction, the sample is excited in the form of one of the lines produced by the scanning system 116, which achieves a high rate of measurement. The measurement configuration is supplemented by the application of a light pipe 412 that enables the collection of optical signals from the same length of long lines and the transition of optical signals to a desired shape without mechanical movement (such as a small circular area or In the first line). Applications with multiple fiber optic circuits with thousands of individual fibers achieve high resolutions of up to tens of microns per pixel. Therefore, the device achieves high sensitivity, high resolution, and high speed (measured delivery amount).

儘管出於指導性目的,本文中提供特定實施例,但所描述之實施例並非限制性。可在不脫離本發明之範疇的情況下做出各種調適及修改。舉例而言,可使用一旋轉載台來代替一線性載台以用於使照射線122及142掃描跨越樣本101之表面。再者,掃描系統116可經修改以消除(例如,固定鏡),或一F-θ透鏡可用於將照射光束114聚焦於樣本101之表面上。其他修改及變化係可能的,且因此,隨附申請專利範圍之精神及範疇不應限於前文之描述。 Although specific embodiments are provided herein for illustrative purposes, the described embodiments are not limiting. Various adaptations and modifications can be made without departing from the scope of the invention. For example, a rotating stage can be used in place of a linear stage for scanning illumination lines 122 and 142 across the surface of sample 101. Again, scanning system 116 can be modified to eliminate (eg, a fixed mirror), or an F-theta lens can be used to focus illumination beam 114 onto the surface of sample 101. Other modifications and variations are possible, and therefore, the spirit and scope of the appended claims should not be limited to the foregoing description.

Claims (27)

一種光學計量裝置,其包括:一照射源,其產生一第一光束;一第一透鏡系統,其致使該第一光束入射於一樣本之一表面上作為沿著一第一方向定向之一第一照射線,該第一照射線以一第一入射角入射於該樣本上,其中該樣本沿著該第一照射線回應於由該第一光束所致之激發而發射光致發光光;一第二照射源;一第二透鏡系統,其將由該第二照射源發射之光聚焦至該樣本上作為沿著該第一方向定向且疊加於該樣本之該表面上之該第一照射線上之一第二照射線,且該第二照射線以不同於該第一入射角之一第二入射角入射於該樣本上;一載台,其用於提供該樣本與該第一照射線及該第二照射線之間沿不同於該第一方向之一第二方向之相對移動;一偵測器,其收集來自該第二照射線之反射光,且接收由該樣本沿著該第一照射線發射之該光致發光光;一信號收集光學器件,其延伸達該第一照射線及該第二照射線之一長度,該信號收集光學器件接收來自該第一照射線之該光致發光光及來自該第二照射線之該反射光,且將該光致發光光及該反射光聚焦成一線;一光導管,其具有接收由該信號收集光學器件聚焦之該光致發光光及該反射光之一線性接收端,該光導管進一步具有經組態以將該 光致發光光及該反射光提供至該偵測器之一輸出端,該輸出端具有不同於該線性接收端之一形狀;及一處理器,其耦合至該偵測器且經組態以使用該光致發光光及該反射光針對該樣本之該表面上之複數個位置判定該樣本之一特性。 An optical metering device comprising: an illumination source that generates a first beam; a first lens system that causes the first beam to be incident on a surface of the same as one of the orientations along a first direction An illumination line incident on the sample at a first incident angle, wherein the sample emits photoluminescence light along the first illumination line in response to excitation by the first beam; a second illumination source; a second lens system that focuses light emitted by the second illumination source onto the sample as the first illumination line oriented along the first direction and superimposed on the surface of the sample a second illumination line incident on the sample at a second incident angle different from the first incident angle; a stage for providing the sample and the first illumination line and the a second movement of the second illumination line in a second direction different from the first direction; a detector that collects the reflected light from the second illumination line and receives the sample along the first illumination Line emits the photoluminescent light; a letter Collecting optics extending to a length of the first illumination line and the second illumination line, the signal collection optics receiving the photoluminescent light from the first illumination line and the reflection from the second illumination line Light, and focusing the photoluminescent light and the reflected light into a line; a light pipe having a linear receiving end for receiving the photoluminescent light focused by the signal collecting optics and the reflected light, the light pipe Further having a configuration to Photoluminescent light and the reflected light are provided to an output of the detector, the output having a shape different from one of the linear receiving ends; and a processor coupled to the detector and configured to The photoluminescence light and the reflected light are used to determine a characteristic of the sample for a plurality of locations on the surface of the sample. 如請求項1之裝置,其中該信號收集光學器件係一橢圓柱面鏡或一圓柱形透鏡中之一者。 The device of claim 1, wherein the signal collecting optics is one of an elliptical cylindrical mirror or a cylindrical lens. 如請求項2之裝置,其中該信號收集光學器件具有0.4或更大之一數值孔徑(NA)。 The device of claim 2, wherein the signal collecting optics has a numerical aperture (NA) of 0.4 or greater. 如請求項1之裝置,其中該光導管包括複數個光纖,該等光纖在該線性接收端處具有一第一配置且在該輸出端處具有不同於該第一配置之一第二配置,且其中該輸出端具有與該偵測器之一入口孔隙之一形狀匹配之一形狀。 The device of claim 1, wherein the light guide comprises a plurality of optical fibers having a first configuration at the linear receiving end and having a second configuration different from the first configuration at the output, and Wherein the output has a shape that matches one of the shape of one of the entrance apertures of the detector. 如請求項1之裝置,其中該第一光束之一部分沿著該第一照射線自該樣本上之表面缺陷散射從而產生散射信號,該偵測器接收該等散射信號。 The apparatus of claim 1, wherein a portion of the first light beam is scattered along a surface of the first illumination line from a surface defect on the sample to generate a scatter signal, the detector receiving the scatter signal. 如請求項5之裝置,其中該處理器使用自該偵測器接收之該等散射信號產生該樣本之一表面缺陷影像。 The device of claim 5, wherein the processor generates the surface defect image of the sample using the scattered signals received from the detector. 如請求項1之裝置,其中該第一透鏡系統包括一掃描鏡以使該第一光 沿該第二方向掃描跨越該樣本以形成該第一照射線。 The device of claim 1, wherein the first lens system comprises a scanning mirror to make the first light A scan is traversed across the sample in the second direction to form the first illumination line. 如請求項1之裝置,其中同時產生該第一照射線及該第二照射線。 The device of claim 1, wherein the first illumination line and the second illumination line are simultaneously generated. 如請求項1之裝置,其中循序產生該第一照射線及該第二照射線。 The device of claim 1, wherein the first illumination line and the second illumination line are sequentially generated. 如請求項1之裝置,其中該偵測器包括一光電倍增管(PMT)或突崩光二極體(APD)。 The device of claim 1, wherein the detector comprises a photomultiplier tube (PMT) or a astigmatism diode (APD). 如請求項1之裝置,其中該第二照射源係產生寬頻帶光之一寬頻帶光源且該反射光係反射寬頻帶光,且其中該偵測器在一二維陣列上將該反射寬頻帶光及該光致發光光成像且作為回應而產生一影像圖框,該二維陣列具有表示沿著該第二方向之空間資訊之一第一維度及表示該反射寬頻帶光及該光致發光光之光譜資訊之一第二維度,其中在該載台沿該第一方向移動該樣本時,該偵測器產生針對疊加於該樣本之該表面上之該第一照射線及該第二照射線之複數個位置之複數個影像圖框。 The device of claim 1, wherein the second illumination source generates a broadband light source of broadband light and the reflected light reflects broadband light, and wherein the detector reflects the broadband on a two-dimensional array Light and the photoluminescence light image and in response generate an image frame having a first dimension representing spatial information along the second direction and representing the reflected broadband light and the photoluminescence a second dimension of light spectral information, wherein the detector generates the first illumination line and the second illumination for the surface superimposed on the sample when the stage moves the sample along the first direction A plurality of image frames of a plurality of positions of the line. 一種光學計量裝置,其包括:一光源,其產生一照射光束;一光學系統,其接收該照射光束且在一樣本之一表面上產生一照射點;一掃描系統,其使該照射點掃描跨越該樣本以形成一照射線,其中該樣本沿著該照射線回應於由該照射點所致之激發而發射光致發 光光;一載台,其用於提供該照射線與該樣本之間的相對移動;一信號收集光學器件,其延伸達該照射線之一長度,該信號收集光學器件接收來自該照射線之該光致發光光且將該光致發光光聚焦成一線;一光導管,其具有接收由該信號收集光學器件聚焦之該光致發光光之一線性接收端,該光導管進一步具有一輸出端,該輸出端具有不同於該線性接收端之一形狀;一偵測器,其自該光導管收集該光致發光光,該偵測器具有與該光導管之該輸出端之一形狀匹配之一入口孔隙;及一處理器,其耦合至該偵測器以接收該光致發光光以判定該樣本之一特性。 An optical metering device comprising: a light source that generates an illumination beam; an optical system that receives the illumination beam and produces an illumination spot on a surface of a sample; and a scanning system that scans the illumination point across The sample is formed to form an illumination line, wherein the sample emits light along the illumination line in response to excitation caused by the illumination point Light; a stage for providing relative movement between the illumination line and the sample; a signal collection optic extending to a length of the illumination line, the signal collection optics receiving the illumination line The photoluminescent light and focusing the photoluminescent light into a line; a light pipe having a linear receiving end for receiving the photoluminescent light focused by the signal collecting optics, the light pipe further having an output The output has a shape different from one of the linear receiving ends; a detector that collects the photoluminescent light from the light pipe, the detector having a shape matching one of the output ends of the light pipe An inlet aperture; and a processor coupled to the detector to receive the photoluminescent light to determine a characteristic of the sample. 如請求項12之裝置,其中該信號收集光學器件係一橢圓柱面鏡或一圓柱形透鏡中之一者。 The device of claim 12, wherein the signal collection optics is one of an elliptical cylindrical mirror or a cylindrical lens. 如請求項13之裝置,其中該信號收集光學器件具有0.4或更大之一數值孔徑(NA)。 The device of claim 13, wherein the signal collecting optics has a numerical aperture (NA) of 0.4 or greater. 如請求項12之裝置,其中該光導管包括複數個光纖,該等光纖在該線性接收端處具有一第一配置且在該輸出端處具有不同於該第一配置之一第二配置。 The device of claim 12, wherein the light guide comprises a plurality of optical fibers having a first configuration at the linear receiving end and having a second configuration at the output different from the first configuration. 如請求項12之裝置,其中該照射光束之一部分沿著該照射線自該樣本上之表面缺陷散射從而產生散射信號,其中該信號收集光學器件接收該等散射信號且使用該光導管將該等散射信號提供至該偵測器。 The device of claim 12, wherein a portion of the illumination beam is scattered along the illumination line from a surface defect on the sample to produce a scatter signal, wherein the signal collection optics receives the scatter signal and uses the light pipe to A scatter signal is provided to the detector. 如請求項12之裝置,其中該掃描系統在一平面中掃描該照射光束,其在該樣本上處於一非法線入射角。 The device of claim 12, wherein the scanning system scans the illumination beam in a plane that is at an illegal line incidence angle on the sample. 如請求項12之裝置,其中該偵測器包括一光電倍增管(PMT)或突崩光二極體(APD)。 The device of claim 12, wherein the detector comprises a photomultiplier tube (PMT) or a astigmatism diode (APD). 如請求項12之裝置,其中該照射光束中之所有波長同時組合於該照射點中,且其中該偵測器在一二維陣列上將沿著該照射線發射之該光致發光光成像,該二維陣列具有表示沿著該照射線之空間資訊之一第一維度及表示該光致發光光之光譜資訊之一第二維度,其中該偵測器產生表示沿著該照射線發射之該光致發光光之一影像圖框,且其中在該載台產生該照射線與該樣本之間的相對移動時,該偵測器產生針對該樣本之該表面上之該照射線之複數個影像圖框。 The apparatus of claim 12, wherein all of the wavelengths of the illumination beam are simultaneously combined in the illumination spot, and wherein the detector images the photoluminescence light emitted along the illumination line on a two-dimensional array, The two-dimensional array has a first dimension representing one of spatial information along the illumination line and a second dimension representing spectral information of the photoluminescent light, wherein the detector generates the representation of the emission along the illumination line An image frame of photoluminescence light, and wherein the detector generates a plurality of images of the illumination line on the surface of the sample when the stage generates relative movement between the illumination line and the sample Frame. 如請求項12之裝置,其中該照射光束係一第一照射光束,該照射線係一第一照射線,該裝置進一步包括:一寬頻帶光源,其產生寬頻帶光;及一透鏡,其將該寬頻帶光在該樣本之該表面上聚焦成一第二照射線,該第二照射線疊加該第一照射線並與該第一照射線對準,且以 不同於該照射光束之一平面之一入射角之一入射角入射於該樣本上,其中該第二照射線由該樣本反射以產生反射光;其中該信號收集光學器件進一步接收該反射光且將該反射光聚焦成線,且該光導管自該信號收集光學器件接收該反射光;且其中該偵測器自該光導管收集該反射光,且其中該處理器進一步使用該反射光判定該樣本之一特性。 The device of claim 12, wherein the illumination beam is a first illumination beam, the illumination line is a first illumination line, the device further comprising: a broadband light source that produces broadband light; and a lens that will The broadband light is focused on the surface of the sample into a second illumination line, the second illumination line superimposing the first illumination line and being aligned with the first illumination line, and An incident angle different from an incident angle of one of the planes of the illumination beam is incident on the sample, wherein the second illumination line is reflected by the sample to generate reflected light; wherein the signal collecting optics further receives the reflected light and The reflected light is focused into a line, and the light guide receives the reflected light from the signal collecting optics; and wherein the detector collects the reflected light from the light pipe, and wherein the processor further determines the sample using the reflected light One of the features. 如請求項20之裝置,其中該信號收集光學器件接收鏡面反射寬頻帶光。 The device of claim 20, wherein the signal collection optics receives specularly reflected broadband light. 如請求項12之裝置,其中使該照射點在該樣本之該表面上進行掃描以形成該照射線之該掃描系統包括一電流計式鏡或一多面鏡。 The apparatus of claim 12, wherein the scanning system that causes the illumination spot to scan on the surface of the sample to form the illumination line comprises a galvanometer mirror or a polygon mirror. 一種光學計量方法,其包括:沿著具有沿一第一方向之一定向之一照射線使用一光源照射一樣本之一表面,其中該樣本回應於由來自該光源之光所致之激發而自該照射線發射光致發光光;沿著該照射線之一長度使用一信號收集光學器件收集來自該照射線之該光致發光光且使用該信號收集光學器件將該光致發光光聚焦成一線;使用具有一線性接收端之一光導管沿著該線接收該光致發光光且在具有不同於該線性接收端之一形狀之一輸出端處自該光導管輸出該光致發光光; 使用具有與該光導管之該輸出端之一形狀匹配之一入口孔隙之一偵測器偵測自該光導管之輸該出端接收之該光致發光光;使該照射線沿不同於該第一方向之一第二方向移動跨越該樣本之該表面;及使用由該偵測器偵測到之該光致發光光針對該樣本之該表面上之複數個位置判定該樣本之一特性。 An optical metrology method comprising: illuminating a surface with a light source along an illumination line having one of the directions along a first direction, wherein the sample is responsive to excitation by light from the source The illumination line emits photoluminescent light; a signal collecting optics is used along the length of one of the illumination lines to collect the photoluminescent light from the illumination line and use the signal collection optics to focus the photoluminescent light into a line Receiving the photoluminescent light along the line using a light pipe having a linear receiving end and outputting the photoluminescent light from the light pipe at an output having a shape different from one of the linear receiving ends; Detecting the photoluminescence light received from the output end of the light guide by using one of the inlet apertures having a shape matching one of the output ends of the light guide; making the illumination line different from the One of the first directions moves in a second direction across the surface of the sample; and the photoluminescent light detected by the detector determines a characteristic of the sample for a plurality of locations on the surface of the sample. 如請求項23之方法,其中該信號收集光學器件係一橢圓柱面鏡或一圓柱形透鏡中之一者且具有0.4或更大之一數值孔徑(NA)。 The method of claim 23, wherein the signal collecting optics is one of an elliptical cylindrical mirror or a cylindrical lens and has a numerical aperture (NA) of 0.4 or greater. 如請求項23之方法,其進一步包括在該光導管中使用複數個光纖來傳輸該光致發光光,其中該等光纖在該線性接收端處具有一第一配置且在該輸出端處具有不同於該第一配置之一第二配置。 The method of claim 23, further comprising transmitting the photoluminescent light using a plurality of optical fibers in the light pipe, wherein the optical fibers have a first configuration at the linear receiving end and are different at the output end The second configuration is one of the first configurations. 如請求項23之方法,其中該照射光束之一部分沿著該照射線自該樣本上之表面缺陷散射從而產生散射信號,該方法進一步包括使用該信號收集光學器件收集該等散射信號且使用該光導管將該等散射信號提供至該偵測器。 The method of claim 23, wherein a portion of the illumination beam is scattered along the illumination line from a surface defect on the sample to produce a scatter signal, the method further comprising collecting the scatter signal using the signal collection optics and using the light A conduit provides the scatter signal to the detector. 如請求項23之方法,其中該偵測該光致發光光係藉由一光電倍增管(PMT)、突崩光二極體(APD)或一光譜儀中之一者而執行。 The method of claim 23, wherein the detecting the photoluminescence light is performed by one of a photomultiplier tube (PMT), a astigmatism diode (APD), or a spectrometer.
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