TWI641564B - Transfer board - Google Patents

Abstract

The present invention relates to a transfer board for use in a gas-tight continuous atmosphere sintering hot press forming apparatus. The end surface of the transfer board of the present invention has at least one accommodating groove extending through the bottom to accommodate the mold and the bottom of the mold. Direct contact with the lower heating plate, and direct conduction heating with the lower heating plate, in addition to the continuous, high efficiency and high quality hot pressing products, the heating and cooling speed is better; the receiving groove is longer than the mold The wide profile, or the two sides of the center have a flow groove larger than the width of the mold, so that the mold has better heating or cooling effect relative to the flow groove, and has temperature control effect.

Description

Transfer board

The present invention is particularly directed to a new designer of a transfer plate for a gas-tight continuous atmosphere sintering hot press forming apparatus for a hot press formed product, which has better heating and the addition of a continuous, high efficiency and high quality hot press forming product. Cooling rate.

Press, hot press forming is a method of processing polymer materials, mainly by placing a material with a certain thickness in a mold, heating the mold or the environment, softening the material to cover the surface of the mold, and then pressing the machine through the cooling stage. After curing, a hot formed product can be obtained.

For hot-pressed materials, for example, glass has high light transmission characteristics, so display devices (such as mobile phones, watches and other electronic products) are selected as the outer casing of the window. It can be seen that the surface of the handheld electronic product is usually provided with a glass casing to protect the display module inside the product. At present, most of the glass casings are in the shape of a flat plate, so seams are formed on the upper surface of the electronic product. Furthermore, since the peripheral portion of the electronic product must retain a certain width of the mechanism portion for holding the flat glass, the top surface of the electronic product cannot be fully utilized. Therefore, three-dimensional or curved glass has gradually been applied to the glass casing of electronic products.

A flat glass housing is easier to manufacture, and a glass housing having a three-dimensional shape is relatively difficult to manufacture. At present, there are generally two methods for manufacturing a glass shell having a three-dimensional shape: the first one is to manufacture a plurality of flat glass units, and then form a glass shell having a three-dimensional shape by adhering the edges. The second type is: manufacturing a rectangular parallelepiped glass of a certain thickness, and then growing at the length The square glass is ground several times to form a three-dimensional shape with multiple sides. However, the above two methods are time consuming and labor intensive, and the production speed is very slow. In general, since the glass material is a flat plate, if a glass having a shape is to be produced, it is preferable to arrange a flat glass material between an upper mold and a lower mold, and then heat the upper mold. Pieces, lower molds and glass materials to soften the glass material. When the glass material is softened, the upper mold member and the lower mold member can be clamped, so that the upper mold member and the lower mold member together shape the shape of the glass material along a mold clamping direction, thereby producing a corresponding molded glass. . China Patent Publication No. M452174 "Molding Equipment for Molding Glass" (refer to the patent publication date of the announcement date of May 1, 2013), which comprises a female mold part, a first male mold part, and a second public A mold part, a support ram and a pressure bar. The first male mold member is disposed on the female mold member in an openable manner, and the second male mold member is disposed between the female mold member and the first male mold member. The support ejector is disposed on the female mold member, and the support ejector rod is used for pushing the second male mold member to support the second male mold member and the first male mold member A molded glass. The pressing rod is disposed on one side of the first male mold part, and the pressing rod is used for pressing down the first male mold part such that the first male mold part is opposite to the second male mold part The master mold member is moved to a clamping position to form the molded glass. However, it is still unable to meet the industry's need for continuous and rapid manufacturing of high-quality molded three-dimensional glass.

Please refer to FIG. 1 , which is a side view of a conventional upper and lower heating type molding apparatus, which mainly comprises an upper heating plate (A), a bottom heating plate (B) and a displacement mechanism (C), and a mold (D) system. Placed on the bottom heating plate (B), the displacement mold (D) is moved by the displacement mechanism (C), although the mold (D) and the bottom heating plate (B) are contact heating, and the displacement mechanism (C) is It is located in the furnace and is easily deformed or damaged due to high temperature in the furnace.

Applicant's previous application for I613160 "Airtight Molded Stereoscopic Glass Continuous Forming Device" patent, which mainly includes: the furnace body is closed, the exchange system is provided at the two ends of the furnace body, and the inside of the furnace body is airtight. a chamber; an exchange system, disposed at the two ends of the furnace body, and an outer conveying passage between the two ends of the furnace body, and each of the exchange systems includes an inner airtight door disposed on the side of the furnace body and a gas disposed outside the outer conveyor side The dense door forms an airtight space between the inner airtight door and the outer airtight door, and is provided with a displacement device to push the carrier plate into or out of the furnace body. Before the carrier plate is sent into the furnace body, the inside of the furnace body head is airtight. The door and the outer airtight door are closed. After the vacuum is applied in the airtight space and the shielding gas is introduced into the same environment as the airtight cavity, the airtight door in the furnace side is opened to push the carrier into the airtight cavity. Before the carrier plate is sent out of the airtight cavity, the inner airtight door and the outer airtight door at the end of the furnace body are closed, and the airtight space has been evacuated and the shielding gas is introduced into the same environment as the airtight cavity. The inner airtight door opens to push the carrier into the airtight space to avoid mixing into the outer space of the airtight cavity. The airtight chamber is disposed inside the furnace body and includes an airtight cavity. The airtight cavity has an inner conveying passage, and the inner conveying passage connects the inner airtight door of the two-end exchange system of the furnace body, and is provided with a sliding rail to As a track for moving the carrier plate, the airtight cavity is airtight and introduces a shielding gas, and has a heating zone, a high temperature forming zone and a cooling zone according to the process, and at least one thermal insulation layer is provided in the heating zone and the high temperature forming zone. And forming a thermal field in the center of the thermal insulation layer, the heating element is provided with a heating element according to the temperature required by the process program, the cooling zone has a cooling device, the high temperature forming zone is provided with a pressurizing system, and the outer conveying channel is connected with the two ends of the furnace body. The system; the pressurization system is mainly composed of a pressure cylinder, a pressurizing shaft and a pressurizing column; and the present invention thus constructed, the flat glass to be formed is placed in the mold forming surface, the mold is placed on the carrier board, and the carrier board is exchanged. Entering the airtight chamber, preheating in the temperature rising zone, and high temperature in the high temperature forming zone, the in-mold glass is softened and formed by the pressurization of the pressurized system, and then cooled by the cooling zone, and then sent out to the furnace body through the exchange system. External, then demoulded [2018 Refer to the patent announcement on February 1st. The mold of this patent is placed on a carrier board, and the carrier board is The exchange system enters the airtight chamber, the preheating in the temperature rising zone, and the high temperature in the high temperature forming zone, so that the in-mold glass is softened and formed by the pressurization of the pressurized system, and then cooled by the cooling zone, and then sent through the exchange system. Out of the furnace body, and then demoulded. Since the exchange system is installed outside the furnace body and displaced by the carrier plate in the furnace, there is no shortage of the deformation or damage of the displacement mechanism due to the high temperature in the furnace. However, because the thickness of the carrier itself is between the carrier and the lower heating plate, since the thickness of the carrier is separated by the mold and the lower heating plate, there is room for improvement in the speed of heating and cooling by indirect contact heating. The better design makes the continuous hot press forming device more perfect.

The inventor of the present invention, in view of the lack of conventional technology, has accumulated many years of experience in the design and manufacture of precision ceramics technology industrial products. After continuous research and improvement, the invention has been successfully developed and made public.

The main object of the present invention is to provide a "transfer plate" which is directed to a new design of a transfer plate for a gas-tight continuous atmosphere sintering hot press forming apparatus of a hot press formed product, which is sintered in a gas-tight continuous atmosphere. The hot press forming device mainly comprises a closed furnace body, and an exchange system is arranged at the outer end of the furnace body, and the conveying channel is connected outside the exchange system, and the airtight cavity is arranged inside the furnace body, and the inner conveying channel is provided in the airtight cavity, and the inner conveying is provided. The two-end exchange system of the connected furnace body is air-tight and introduces shielding gas, and has a heating zone, a high temperature forming zone and a cooling zone according to the process, and at least one layer is formed in the heating zone and the high temperature forming zone. The thermal layer forms a thermal field in the center of the thermal insulation layer. The heating element is provided with a heating element and a lower heating element depending on the temperature required by the process. The upper heating element radiates heat over the thermal field, and the lower heating element is disposed on the lower heating plate. The heating plate is heated to the bottom of the transfer plate, and the lower heating plate is provided with a sliding rail as a track for moving the transfer plate, the cooling zone has a cooling device, and the high temperature forming zone is provided with a pressing system, which is to be hot pressed. It was placed in a mold inner surface, the mold Then placed on the transfer board, the transfer board is pushed into the airtight chamber for preheating in the temperature rising zone, and the high temperature of the high temperature forming zone softens the hot pressed molding and is pressurized by the pressurization system, and then passes through the cooling zone. After cooling, it is sent out of the furnace body and then released from the mold. The transfer board of the present invention is characterized in that: at least one end of the transfer board of the present invention has a receiving groove extending through the bottom to accommodate the mold, and the bottom of the mold is directly in contact with the lower heating plate, and is directly and indirectly heated. Plate conduction heating, in addition to the continuous, high efficiency and high quality hot press molding products, it has better heating and cooling speed.

The accommodating groove of the present invention is disposed with respect to the long and wide outer shape of the mold, or has a flow groove larger than the width of the mold on both sides of the center, so that the mold has better heating or cooling effect with respect to the flow groove, and has temperature control effect.

(A) ‧ ‧ upper heating plate

(B) ‧‧‧ bottom heating plate

(C) ‧ ‧ displacement mechanism

(D)‧‧‧Mold

(1)‧‧‧ furnace body

(2) ‧ ‧ exchange system

(20) ‧ ‧ inner airtight door

(21) ‧ ‧ outside airtight doors

(22) ‧ ‧ airtight space

(23) ‧‧‧displacement device

(3) ‧ ‧ airtight chamber

(30) ‧ ‧ airtight cavity

(31) ‧ ‧ inner conveyor

(32) ‧‧ ‧ warming zone

(33) ‧‧‧High temperature forming zone

(34) ‧‧‧Cooling area

(35) ‧‧‧ Thermal insulation

(36)‧‧‧Hot field

(37) ‧‧‧Upper heating elements

(370) ‧‧‧ Lower heating element

(371) ‧‧‧ Lower heating plate

(372)‧‧‧Slide rails

(38) ‧‧‧Cooling device

(4) ‧‧‧Outer transport lanes

(5) ‧‧‧ Pressurized system

(50)‧‧‧Cylinder

(51) ‧‧‧Pressure shaft

(52) ‧ ‧ pressurized column

(6)‧‧‧Transfer board

(60) ‧‧‧ accommodating slots

(61)‧‧‧Circulation slots

(7)‧‧‧Mold

1 is a side view of a conventional hot-press molding apparatus; FIG. 2 is a front cross-sectional view of the hot press forming apparatus of the present invention; FIG. 3 is a cross-sectional view of the upper end of the hot press forming apparatus of the present invention; Fig. 5 is a cross-sectional view showing a high temperature forming section of the hot press forming apparatus of the present invention; and Fig. 6 is a schematic view showing a mold of the transfer board of the embodiment of the present invention.

In order to achieve the above-described technical means of the present invention, an embodiment will be described, and with reference to the drawings, the reviewer can obtain a better understanding of the structure, features and effects of the present invention.

The invention relates to a gas-tight continuous atmosphere sintering hot pressing of a hot press formed product A new design of the transfer plate of the type device, the hot press forming material of the present invention, including but not limited to glass, metal, ceramic or cermet heterogeneous composite materials. Referring to Figures 2 and 3, the gas-tight continuous atmosphere sintering hot press forming apparatus of the present invention mainly comprises: a furnace body (1), which is a closed type, and an exchange system is provided at the outer two ends of the furnace body (1) (2) ), the furnace body (1) is provided with an airtight chamber (3); the exchange system (2) is arranged at the two ends of the furnace body (1), and the furnace body (1) is provided with an external transportation between the two end exchange systems (2) In the circuit (4), each of the exchange systems (2) includes an inner airtight door (20) disposed on the side of the furnace body (1) and an airtight door (21) disposed outside the outer conveyor (4) side. An airtight space (22) is formed between the dense door (20) and the outer airtight door (21), and a displacement device (23) is provided to push the transfer plate (6) into or out of the furnace body (1); the airtight cavity (3) is disposed inside the furnace body (1) and includes an airtight cavity (30). The airtight cavity (30) has an inner conveying path (31), and the inner conveying path (31) is coupled to the furnace body (1). a two-terminal exchange system (2) inside the airtight door (20), the airtight chamber (3) is airtight, and introduces a shielding gas [generally an inert gas such as nitrogen; a device for providing a shielding gas is a conventional technique, Not many rumors], and according to the process, there are temperature rising zone (32), high temperature forming zone (33) and cooling zone (34), heating zone (32) and high temperature forming zone (33) There is at least one thermal insulation layer (35), and a thermal field (36) is formed in the center of the thermal insulation layer (35), and the heating element (37) and the lower heating element are disposed in the thermal field (36) according to the temperature required by the process program. (370) [The temperature control device is a conventional technology, not much rumor], the upper heating element (37) is radiantly heated above the thermal field, and the lower heating element (370) is placed in the lower heating plate (371) for transfer The bottom of the plate (6) is conductively heated, and the lower heating plate (371) is provided with a slide rail (372) [please refer to Figures 4 and 5] as a moving track of the transfer plate (6), a cooling zone ( 34) With cooling device (38) [Cooling device (38) is a conventional technology, not much rumor], high temperature forming zone (33) is provided with a pressurizing system (5); outer conveying channel (4) is connected to the furnace body (1) ) two-terminal switching system (2); The pressurizing system (5), as shown in Fig. 5, the pressurizing system (5) is mainly composed of a press cylinder (50), a pressurizing shaft (51) and a pressurizing column (52); The hot-pressed product is placed in the molding surface of the mold (7), the mold (7) is placed on the transfer plate (6), and the transfer plate (6) enters the airtight chamber (3) via the exchange system (2). The preheating of the heating zone (32) [avoiding the temperature change is too fast), and the high temperature of the high temperature forming zone (33), softens the hot-pressed molding in the mold, and is formed by the pressurization of the pressurizing system (5). After cooling by the cooling zone (34), it is sent out of the furnace body (1) through the exchange system (2), and then released from the mold.

Referring to FIG. 2, the present invention is provided on the exchange system (2) on both sides of the furnace body (1), and each exchange system (2) includes an inner airtight door (20) disposed on the side of the furnace body (1). And an airtight door (21) disposed outside the outer conveyor (4) side, forming an airtight space (22) between the inner airtight door (20) and the outer airtight door (21), when the transfer plate (6) Before being fed into the furnace body (1), the inner airtight door (20) and the outer airtight door (21) at the head end of the furnace body (1) are closed, and the vacuum is introduced into the airtight space (22) and the shielding gas is introduced. After the same environment as in the airtight chamber (3) [the vacuum process will remove the air (especially oxygen) and impurities from the mold (7)], and the airtight door (20) inside the furnace side Open and push the transfer plate (6) into the airtight chamber (3). Before the transfer plate (6) is sent out of the airtight chamber (3), the inner airtight door (20) and the external air at the end of the furnace body The dense door (21) is closed, and the airtight space (22) has been evacuated and introduced into the same environment as the airtight chamber (3), and the inner airtight door (20) of the furnace side is opened to be transferred. The plate (6) is pushed into the airtight space (22), so that the air in the airtight cavity (3) is prevented from being mixed into the air outside the furnace to improve the molding quality of the hot-pressed product.

Referring to FIG. 6, the transfer board (6) of the present invention is applied to the gas-tight continuous atmosphere sintering forming apparatus, and the transfer board (6) has at least one accommodating groove extending through the bottom end surface ( 60), to accommodate the mold (7), and the bottom of the mold (7) and the lower heating plate (371) in direct contact, and directly and the lower heating plate (371) conduction heating, in addition to continuous, high efficiency and high quality heat Compression molding In addition to the product function, the bottom of the mold (7) is in direct contact with the lower heating plate (371) by the design of the receiving groove (60) of the transfer plate (6), and the heating is directly transmitted to the lower heating plate (371). It has a better heating effect and a cooling effect. In this way, the thickness interval between the precursor carrier and the lower lower heater plate is removed, and the thickness of the carrier is separated from the lower heating plate, so that the indirect contact heating is inferior in heating and cooling speed.

The accommodating groove (60) of the present invention is disposed with respect to the long and wide outer shape of the mold (7) [i.e., slightly larger than the length and width of the mold (7)], or has a flow groove larger than the width of the mold (7) on both sides of the center (61). Since the mold (7) has a space for circulation with respect to the circulation groove (61), a better heating or cooling effect can be obtained, and the effect of controlling the temperature of the mold (7) can be obtained. This achieves the design goals of the present invention.

In summary, the "transfer board" disclosed in the present invention has never been seen in the publications disclosed at home and abroad, and has a novel patent requirement, and the present invention can eliminate the lack of conventional technology. And to achieve the design purpose, has also fully complied with the patent requirements, 提出 apply in accordance with the law, I would like to ask your review board to review, and give the patent in this case, really feel good.

However, the above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and the equivalent structural changes made by the present invention and the scope of the patent application are known to those skilled in the art. It is intended to be included in the scope of the patent of the present invention.

Claims (3)

A transfer plate is applied to a gas-tight continuous atmosphere sintering hot press forming device, and the transfer plate has at least one accommodating groove extending through the bottom end, and the accommodating groove serves as a accommodating mold to make the bottom and the bottom of the mold The heating plate is in direct contact, and the heating is conducted directly to the lower heating plate. The transfer board of claim 1, wherein the transfer board receiving groove is disposed with respect to a mold length and width. The transfer board of claim 1, wherein the transfer side of the transfer tray receiving groove has a flow groove larger than the width of the mold.