TWI640570B - Polymer thermistor composite and polymer thermistor - Google Patents
Polymer thermistor composite and polymer thermistor Download PDFInfo
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Abstract
本發明的高分子熱敏電阻複合材料其中包括5wt%至15wt%的結晶性高分子、75wt%至90wt%的導電填料、1wt%至7wt%的具有至少三個環氧基的環氧樹脂、0.25wt%至0.5wt%的固化劑和0.5wt%至3wt%的助劑。以高分子熱敏電阻複合材料製成的高分子熱敏電阻於室溫下具有較低的電阻率、良好的耐壓性能以及良好的電阻再現性。 The polymer thermistor composite of the present invention comprises 5 wt% to 15 wt% of a crystalline polymer, 75 wt% to 90 wt% of a conductive filler, and 1 wt% to 7 wt% of an epoxy resin having at least three epoxy groups. 0.25 wt% to 0.5 wt% of a curing agent and 0.5 wt% to 3 wt% of an auxiliary agent. The polymer thermistor made of the polymer thermistor composite material has low electrical resistivity, good pressure resistance and good electrical resistance reproducibility at room temperature.
Description
本發明是關於一種高分子熱敏電阻複合材料及高分子熱敏電阻,尤指一種包含具有至少三個環氧基的環氧樹酯的高分子熱敏電阻複合材料及高分子熱敏電阻。 The invention relates to a polymer thermistor composite material and a polymer thermistor, in particular to a polymer thermistor composite material and a polymer thermistor comprising an epoxy resin having at least three epoxy groups.
正溫度係數熱敏電阻(positive temperature coefficient thermistor,PTC thermistor)係為廣泛的應用於過電流保護(over-current protection)用途之電子元件,正溫度係數熱敏電阻在正常溫度下,其電阻維持在低水平,使得電路得以正常運作;倘若發生故障時,電路之電流異常過大,使得電路之溫度升高,正溫度係數熱敏電阻之電阻則隨著溫度升高而變大,藉此限制電路之電流以保護電路。當故障狀況排除後,因電流恢復正常,電路溫度恢復正常,正溫度係數熱敏電阻之電阻亦回復至低水平,使得電路得以繼續正常運作。 The positive temperature coefficient thermistor (PTC thermistor) is a widely used electronic component for over-current protection applications. The positive temperature coefficient thermistor maintains its resistance at normal temperature. Low level, so that the circuit can operate normally; if the fault occurs, the current of the circuit is abnormally too large, so that the temperature of the circuit rises, the resistance of the positive temperature coefficient thermistor becomes larger as the temperature increases, thereby limiting the circuit Current to protect the circuit. When the fault condition is removed, the circuit temperature returns to normal as the current returns to normal, and the resistance of the positive temperature coefficient thermistor returns to a low level, so that the circuit can continue to operate normally.
高分子熱敏電阻(polymeric positive temperature coefficient thermistor,PPTC thermistor)係屬於正溫度係數熱敏電阻的一種,其製備係由一結晶性高分子(crystalline polymer)與一導電填料經混鍊後得一高分子熱敏電阻複合材料,接著將該高分子熱敏電阻複合材料之兩面以電極壓合,並經裁切後可得該高分子熱敏電阻。 Polymeric temperature coefficient thermistor (PPTC thermistor) is a kind of positive temperature coefficient thermistor, which is prepared by mixing a crystalline polymer with a conductive filler. The molecular thermistor composite material is then pressed onto both sides of the polymer thermistor composite material, and the polymer thermistor is obtained after cutting.
結晶性高分子一般是聚烯烴或其共聚物,例如聚乙烯、聚丙烯或乙烯/醋酸乙烯共聚物。而導電填料一般為碳黑粉末、金屬粉末、金屬 碳化物或陶瓷粉末;其中,碳黑粉末因表面有極性基團,故與聚合物的附著性較好,而可具有較佳的穩定性,但由於碳黑粉末本身的導電能力有限,故電阻值通常偏高,而不利於符合低電阻的要求。 The crystalline polymer is generally a polyolefin or a copolymer thereof such as polyethylene, polypropylene or an ethylene/vinyl acetate copolymer. The conductive filler is generally carbon black powder, metal powder, metal Carbide or ceramic powder; wherein the carbon black powder has a good adhesion to the polymer due to the polar group on the surface, and has better stability, but the conductivity of the carbon black powder itself is limited, so the resistance The value is usually too high, which is not conducive to meeting the requirements of low resistance.
或者,可使用金屬粉末作為導電填料,可有效降低電阻值,但因金屬粉末容易氧化,因此需對複合材料進行包封,以防止金屬粉末在空氣中氧化而導致電阻值升高,然而,當複合材料包封後,其體積則難以縮小,故無法滿足電子元件小型化的訴求。 Alternatively, metal powder can be used as the conductive filler, which can effectively reduce the resistance value, but since the metal powder is easily oxidized, the composite material needs to be encapsulated to prevent the metal powder from being oxidized in the air to cause an increase in the resistance value, however, when After the composite material is encapsulated, its volume is difficult to shrink, so it cannot satisfy the demand for miniaturization of electronic components.
若要為了同時滿足低電阻以及電子元件小型化的訴求,可以金屬碳化物陶瓷粉末作為導電填料,例如碳化鈦,但由於金屬碳化物和結晶性高分子的結合性通常不佳,故較難控制電阻的再現性,因此,現有的高分子熱敏電阻複合材料仍有待改善之處。 In order to satisfy both the low resistance and the miniaturization of electronic components, metal carbide ceramic powder can be used as a conductive filler, such as titanium carbide, but it is difficult to control because the combination of metal carbide and crystalline polymer is generally poor. The reproducibility of the resistor, therefore, there is still room for improvement in the existing polymer thermistor composite.
有鑑於上述問題,本發明的目的為提供一種高分子熱敏電阻複合材料及高分子熱敏電阻,該高分子熱敏電阻於室溫下具有較低的電阻率、良好的耐壓性能以及良好的電阻再現性。 In view of the above problems, an object of the present invention is to provide a polymer thermistor composite material and a polymer thermistor having low electrical resistivity, good withstand voltage performance and good temperature at room temperature. Resistance reproducibility.
為達上述目的,本發明的高分子熱敏電阻複合材料包含5重量百分比(wt%)至15wt%的結晶性高分子、75wt%至90wt%的導電填料、1wt%至7wt%的具有至少三個環氧基的環氧樹脂、0.25wt%至0.5wt%的固化劑和0.5wt%至3wt%的助劑。 To achieve the above object, the polymer thermistor composite of the present invention comprises 5 wt% (wt%) to 15 wt% of a crystalline polymer, 75 wt% to 90 wt% of a conductive filler, and 1 wt% to 7 wt% of at least three An epoxy group epoxy resin, 0.25 wt% to 0.5 wt% of a curing agent, and 0.5 wt% to 3 wt% of an auxiliary agent.
藉由上述技術手段,本發明高分子熱敏電阻複合材料可使製成的高分子熱敏電阻具有較低的電阻率(resistivity)、較佳的耐壓性能以及良好的電阻再現性,故可符合低電阻的要求以及應用於高電壓的電子器件中。 According to the above technical means, the polymer thermistor composite material of the invention can make the prepared polymer thermistor have lower resistivity, better pressure resistance performance and good resistance reproducibility, so Meets low resistance requirements and is used in high voltage electronic devices.
具體而言,該結晶性高分子可以是聚乙烯(polyethylene)、聚丙烯(polypropylene)、聚偏氟乙烯(polyvinylidene difluoride)、乙烯/丙烯共聚 物(ethylene/propylene copolymer)、乙烯/醋酸乙烯酯共聚物(ethylene/vinyl acetate copolymer)、乙烯/丙烯酸共聚物(ethylene/acrylic acid copolymer)、乙烯/丙烯酸甲酯共聚物(ethylene/methyl acrylate copolymer)、乙烯/丙烯酸乙酯共聚物(ethylene/ethyl acrylate copolymer)、聚醯胺(polyamide)、聚碳酸酯(polycarbonate)、聚碸(polysulfone)或其組合物。 Specifically, the crystalline polymer may be polyethylene, polypropylene, polyvinylidene difluoride, ethylene/propylene copolymerization. (ethylene/propylene copolymer), ethylene/vinyl acetate copolymer, ethylene/acrylic acid copolymer, ethylene/methyl acrylate copolymer And an ethylene/ethyl acrylate copolymer, a polyamide, a polycarbonate, a polysulfone or a combination thereof.
另外,該導電填料可以是金屬碳化物具體而言,該導電填料可以是碳化鈦、碳化鎢、石墨烯、碳纖維或其組合物。 Additionally, the electrically conductive filler may be a metal carbide. Specifically, the electrically conductive filler may be titanium carbide, tungsten carbide, graphene, carbon fiber, or a combination thereof.
該固化劑是二聚氰胺或4,4'-二氨基二苯碸。 The curing agent is melamine or 4,4 ' -diaminodiphenyl hydrazine.
該助劑包括一抗氧化劑和一偶聯劑,該抗氧化劑為酚類抗氧化劑或胺類抗氧化劑,該偶聯劑為矽烷偶聯劑或鈦酸酯偶聯劑。 The adjuvant comprises an antioxidant and a coupling agent, the antioxidant being a phenolic antioxidant or an amine antioxidant, the coupling agent being a decane coupling agent or a titanate coupling agent.
並且,該具有至少三個環氧基的環氧樹脂是選自於由下列所構成的群組:具有至少三個環氧基的縮水甘油醚類、具有至少三個環氧基的酯類、具有至少三個環氧基的矽氧烷類或其組合物。例如,該具有至少三個環氧基的環氧樹脂可以是二氨基二苯甲烷四縮水甘油醚(tetraglycidyl-4,4'-diaminodiphenyl methane,TGDDM)、三縮水甘油基異氰尿酸酯(triglycidyl isocyanurate,TGIC)、環氧改質有機矽氧樹脂(購自信越化學,商品編號:X-40-2670)。 Further, the epoxy resin having at least three epoxy groups is selected from the group consisting of glycidyl ethers having at least three epoxy groups, esters having at least three epoxy groups, A decane having at least three epoxy groups or a combination thereof. For example, the epoxy resin having at least three epoxy groups may be tetraglycidyl-4, 4'-diaminodiphenyl methane (TGDDM), triglycidyl uridine (triglycidyl) Isocyanurate, TGIC), epoxy modified organic epoxy resin (purchased more confident chemical, commodity number: X-40-2670).
本發明另包括一種高分子熱敏電阻,其包括一中間層和一電極,該中間層包含所述的高分子熱敏電阻複合材料,該電極設置於該中間層上。 The invention further includes a polymeric thermistor comprising an intermediate layer and an electrode, the intermediate layer comprising the polymeric thermistor composite, the electrode being disposed on the intermediate layer.
就高分子熱敏電阻的性能而言,該高分子熱敏電阻的電阻值為1毫歐姆(mΩ)至40mΩ。 The polymer thermistor has a resistance value of 1 milliohm (mΩ) to 40 mΩ in terms of performance of the polymer thermistor.
較佳的,該高分子熱敏電阻的耐壓性能為12伏特(V)至18V。 Preferably, the polymer thermistor has a withstand voltage of 12 volts (V) to 18 volts.
較佳的,該高分子熱敏電阻在小於耐壓性能的電壓下進行一 千次通斷循環後,該高分子熱敏電阻的電阻值為一千次通斷循環前的電阻值的10倍至14倍。 Preferably, the polymer thermistor is subjected to a voltage lower than the withstand voltage performance. After a thousand cycles, the resistance of the polymer thermistor is 10 to 14 times the resistance value before one thousand on-off cycles.
實施例1至4:高分子熱敏電阻複合材料Examples 1 to 4: Polymer thermistor composites
設定一密鍊機的溫度於180℃,將一結晶性高分子加入密鍊機中並攪拌,接著加入粒徑為0.1微米至50微米的一導電填料,再以每分鐘40轉的速度(round per minute,rpm)密鍊結晶性高分子和導電填料,於5分鐘後提高轉速至80rpm。 Set a temperature of the dense chain machine at 180 ° C, add a crystalline polymer to the chain mixer and stir, then add a conductive filler with a particle size of 0.1 micron to 50 microns, and then at a speed of 40 revolutions per minute (round Per minute, rpm) dense chain crystalline polymer and conductive filler, and the rotation speed was increased to 80 rpm after 5 minutes.
以80rpm的轉速混合10分鐘後,加入一具有至少三個環氧基的環氧樹脂、一固化劑、一抗氧化劑和一偶聯劑於180℃下混合熔煉,獲得一組合物。 After mixing at 80 rpm for 10 minutes, an epoxy resin having at least three epoxy groups, a curing agent, an antioxidant, and a coupling agent were added and mixed and smelted at 180 ° C to obtain a composition.
將該組合物置於一模具中,該模具的外層為鋼板而內層設置有鏡面銅箔,以50公斤/平方公分的壓力、180℃的溫度預壓5分鐘;於排氣之後,以100公斤/平方公分的壓力、180℃的溫度壓合3分鐘;並以相同的參數重複一次壓合;最後,以150公斤/平方公分的壓力、180℃的溫度壓合5分鐘,以形成一高分子熱敏電阻複合材料,實施例1至4中各成分的添加比例列於表1中。 The composition is placed in a mold, the outer layer of the mold is a steel plate and the inner layer is provided with a mirror-finished copper foil, which is pre-pressed at a pressure of 50 kg/cm 2 and a temperature of 180 ° C for 5 minutes; after exhausting, 100 kg is taken. / square centimeter pressure, 180 ° C temperature is pressed for 3 minutes; and repeated pressing with the same parameters; finally, 150 kg / cm ^ 2 pressure, 180 ° C temperature for 5 minutes to form a polymer The thermistor composite materials, the addition ratios of the components in Examples 1 to 4 are listed in Table 1.
在實施例1至4中,結晶性高分子、具有至少三個環氧基的環氧樹脂和固化劑的總量為11wt%。 In Examples 1 to 4, the total amount of the crystalline polymer, the epoxy resin having at least three epoxy groups, and the curing agent was 11% by weight.
其中,該結晶性高分子為聚乙烯;該導電填料為碳化鈦粒子、碳化鎢粒子、石墨烯粒子或其組合物;該具有至少三個環氧基的環氧樹脂為四縮水甘油基-4,4'-二氨基二苯甲烷(tetraglycidyl diamincdiphenylmethane,TGDDM);該固化劑為4,4'-二氨基二苯碸;該抗氧化劑為酚類抗氧化劑1010(CAS No.6683-19-8);該偶聯劑為矽烷偶聯劑A-171(CAS No.2530-83-8)。 Wherein, the crystalline polymer is polyethylene; the conductive filler is titanium carbide particles, tungsten carbide particles, graphene particles or a combination thereof; and the epoxy resin having at least three epoxy groups is tetraglycidyl-4 , 4 '- diaminodiphenylmethane (tetraglycidyl diamincdiphenylmethane, TGDDM); the curing agent is 4,4' - diaminodiphenyl sulfone; the antioxidant is a phenolic antioxidant 1010 (CAS No.6683-19-8) The coupling agent is a decane coupling agent A-171 (CAS No. 2530-83-8).
比較例1和2:高分子熱敏電阻複合材料Comparative Examples 1 and 2: Polymer Thermistor Composites
比較例1和2的高分子熱敏電阻複合材料製作方式與實施例1至4相似,其差異在於:比較例1和2的高分子熱敏電阻複合材料中並未包括具有至少三個環氧基的環氧樹脂和固化劑,比較例1和2中各成分的添加比例列於表1中。 The polymer thermistor composite materials of Comparative Examples 1 and 2 were produced in a similar manner to Examples 1 to 4, except that the polymer thermistor composite materials of Comparative Examples 1 and 2 did not include at least three epoxy resins. The epoxy resin and the curing agent of the base, and the addition ratio of each component in Comparative Examples 1 and 2 are listed in Table 1.
比較例3:高分子熱敏電阻複合材料Comparative Example 3: Polymer thermistor composite
比較例3的高分子熱敏電阻複合材料製作方式與實施例4相似,其差異在於:比較例的高分子熱敏電阻複合材料的中並未包括具有至少三個環氧基的環氧樹脂,並且,比較例3中添加的環氧樹脂為具有兩個環氧基的環氧樹脂(購自長春化工,商品名:BE-188EL),並添加購自索瑪(Somar)的固化劑為H143,比較例3中各成分的添加比例列於表1中。 The polymer thermistor composite material of Comparative Example 3 was produced in a similar manner to that of Example 4, except that the polymer thermistor composite material of the comparative example did not include an epoxy resin having at least three epoxy groups. Further, the epoxy resin added in Comparative Example 3 was an epoxy resin having two epoxy groups (purchased from Changchun Chemical Co., trade name: BE-188EL), and the curing agent purchased from Somar was H143. The addition ratio of each component in Comparative Example 3 is shown in Table 1.
實施例5至8:高分子熱敏電阻Examples 5 to 8: Polymer thermistors
將實施例1至4的高分子熱敏電阻複合材料裁切為厚度為1.4毫米、面積為2.6平方毫米的長方形片材,再使二金屬箔片壓合於該片材的上下表面作為電極,再將專用緩衝材、鏡面銅箔和鋼板以70公斤/平方公分的壓力和180℃的溫度壓合30分鐘後形成多層結構,即為實施例5至8的高分子熱敏電阻,據此,該片材作為高分子熱敏電阻的中間層。 The polymer thermistor composite materials of Examples 1 to 4 were cut into a rectangular sheet having a thickness of 1.4 mm and an area of 2.6 mm 2 , and then the two metal foil sheets were pressed against the upper and lower surfaces of the sheet as electrodes. Then, the special cushioning material, the mirror copper foil and the steel plate are pressed at a pressure of 70 kg/cm 2 and a temperature of 180 ° C for 30 minutes to form a multilayer structure, which is the polymer thermistor of Examples 5 to 8, according to which This sheet serves as an intermediate layer of the polymer thermistor.
於另一實施例,可依照不同的電阻值需求裁切不同尺寸的高分子熱敏電阻複合材料,藉以達到更廣泛的應用。 In another embodiment, different sizes of the polymer thermistor composite materials can be cut according to different resistance value requirements, thereby achieving a wider application.
比較例4至6:高分子熱敏電阻Comparative Examples 4 to 6: Polymer Thermistors
將比較例1至3的高分子熱敏電阻複合材料裁切為厚度為1.4 毫米、面積為2.6平方毫米的片材,並以類似於實施例5至8的步驟壓合製作比較例4至6的高分子熱敏電阻。 The polymer thermistor composite materials of Comparative Examples 1 to 3 were cut to a thickness of 1.4 A sheet having a diameter of 2.6 mm 2 was fabricated, and the polymer thermistors of Comparative Examples 4 to 6 were produced by press-fitting in a manner similar to that of Examples 5 to 8.
為方便比較實施例5至8和比較例4至6間高分子熱敏電阻的特性差異,以下將針對各高分子熱敏電阻的電阻值、耐電壓特性以及電阻再現性進行測試,並將結果列於表1中。 In order to facilitate the comparison of the difference in characteristics between the polymer thermistors of Examples 5 to 8 and Comparative Examples 4 to 6, the resistance values, withstand voltage characteristics, and resistance reproducibility of each of the polymer thermistors were tested below, and the results were Listed in Table 1.
試驗例1:電阻值的測量Test Example 1: Measurement of resistance value
於室溫下測量各高分子熱敏電阻的電阻值,並根據各高分子熱敏電阻製作時的尺寸,將電阻值另計算為電阻率;電阻率的計算方式為將電阻值乘於高分子熱敏電阻的截面積在除於高分子熱敏電阻的厚度。 The resistance value of each polymer thermistor is measured at room temperature, and the resistance value is additionally calculated as the resistivity according to the size of each polymer thermistor; the resistivity is calculated by multiplying the resistance value by the polymer The cross-sectional area of the thermistor is divided by the thickness of the polymer thermistor.
試驗例2:耐壓測試Test Example 2: Withstand voltage test
根據優力國際安全認證有限公司(Underwriters Laboratories Inc.,UL)的標準測試方法,以耐壓測試儀(廠牌:ACP OWER、型號:ADC4000)對各高分子熱敏電阻進行耐壓測試。 According to the standard test method of Underwriters Laboratories Inc. (UL), each polymer thermistor was subjected to withstand voltage test with a withstand voltage tester (label: ACP OWER, model: ADC4000).
試驗例3:阻值再現性測試Test Example 3: Resistance Reproducibility Test
為測試電阻值是否具有再現性,試驗例3先施以6伏特的電壓以及通以20安培的電流於各高分子熱敏電阻再斷電,並重複通電、斷電的步驟(簡稱通斷循環)一千次後,再以三用電表測量通斷循環後的電阻值,並與試驗例1中測得的電阻值進行比較,進而計算獲得電阻變化率;電阻變化率的計算方式為將一千次通斷循環後的電阻值除於試驗例1中測得的電阻值的百分比。 In order to test whether the resistance value is reproducible, Test Example 3 first applies a voltage of 6 volts and a current of 20 amps to power off each polymer thermistor, and repeats the steps of energizing and de-energizing (referred to as the on-off cycle). After one thousand times, the resistance value after the on-off cycle is measured by a three-meter electric meter, and compared with the resistance value measured in the test example 1, and the resistance change rate is calculated. The calculation method of the resistance change rate is The resistance value after one thousand on-off cycles was divided by the percentage of the resistance value measured in Test Example 1.
類似的,本試驗例另施以12伏特的電壓以及通以20安培的電流於各高分子熱敏電阻,經過一千次通斷循環後,再以三用電表測量通斷循環後的電阻值,並與試驗例1中測得的電阻值進行比較,進而計算獲得電阻變化率;電阻變化率的計算方式為將通斷循環後的電阻值除於試驗例1中 測得的電阻值的百分比。 Similarly, in this test example, a voltage of 12 volts and a current of 20 amps were applied to each of the polymer thermistors. After one thousand cycles of on-off, the resistance after the on-off cycle was measured by a three-meter meter. The value is compared with the resistance value measured in Test Example 1, and the resistance change rate is calculated. The resistance change rate is calculated by dividing the resistance value after the on-off cycle in Test Example 1. The percentage of the measured resistance value.
請參照表1的實驗結果,就電阻值的測量結果而言,實施例5至8的高分子熱敏電阻相較於比較例4至6的高分子熱敏電阻具有較低的電阻值以及較低的電阻率;例如,實施例5的電阻值(6.5mΩ)低於比較例3的電阻值(8.6mΩ),類似的,實施例6的電阻值(6.8mΩ)也低於比較例4的電阻值(8.8mΩ);據此,本發明的高分子熱敏電阻可具有4mΩ至7mΩ的電阻值和25mΩ˙mm至50mΩ˙mm的電阻率。 Referring to the experimental results of Table 1, in terms of the measurement results of the resistance values, the polymer thermistors of Examples 5 to 8 have lower resistance values than the polymer thermistors of Comparative Examples 4 to 6 and Low resistivity; for example, the resistance value of Example 5 (6.5 mΩ) is lower than that of Comparative Example 3 (8.6 mΩ), and similarly, the resistance value of Example 6 (6.8 mΩ) is also lower than that of Comparative Example 4. The resistance value (8.8 mΩ); accordingly, the polymer thermistor of the present invention may have a resistance value of 4 mΩ to 7 mΩ and a resistivity of 25 mΩ ̇mm to 50 mΩ ̇mm.
針對耐壓測試的結果,實施例5至8的高分子熱敏電阻相較於比較例4至6的高分子熱敏電阻具有較高的耐壓性能,本發明的高分子熱敏電阻的耐壓性能可達到12V至18V,而比較例4至6高分子熱敏電阻的耐壓性能僅達到8V。 For the results of the withstand voltage test, the polymer thermistors of Examples 5 to 8 have higher withstand voltage performance than the polymer thermistors of Comparative Examples 4 to 6, and the resistance of the polymer thermistor of the present invention The pressure performance can reach 12V to 18V, while the pressure resistance of the comparative example 4 to 6 polymer thermistors is only 8V.
另針對阻值再現性的測試結果,實施例5至8的高分子熱敏電阻未經過通斷循環前的電阻值介於4mΩ至7mΩ之間,在經過一千次通斷循環(6V/20A)後,其電阻值上升至55mΩ至90mΩ,電阻值變化的倍率約為10倍至13倍;即使提高施加的電壓至12V,於一千次通斷循環(12V/20A)後,高分子熱敏電阻的電阻值僅略高於6V電壓時的結果,大致介於55mΩ至95mΩ之間,電阻值變化的倍率約為12倍至14倍。 For the test results of the resistance reproducibility, the resistance values of the polymer thermistors of Examples 5 to 8 before the on-off cycle were between 4 mΩ and 7 mΩ, after one thousand on-off cycles (6V/20A). After that, the resistance value rises to 55mΩ to 90mΩ, and the resistance value changes by about 10 times to 13 times; even if the applied voltage is increased to 12V, after one thousand on-off cycles (12V/20A), the polymer heat The resistance of the varistor is only slightly higher than the voltage of 6V, which is roughly between 55mΩ and 95mΩ, and the resistance value varies by about 12 times to 14 times.
反觀比較例4至6的高分子熱敏電阻,在未經過通斷循環前的電阻值介於8mΩ至10mΩ之間,經過一千次通斷循環(6V/20A)後,其電阻值上升至3000mΩ至3300mΩ,電阻值上升的倍率約為350倍至390倍;且當施加的電壓提升至12V後,比較例4至6的高分子熱敏電阻在實驗中燒毀,更可證實比較例4至6的高分子熱敏電阻無法承受超過8V的施加電壓。 In contrast, the polymer thermistors of Comparative Examples 4 to 6 have a resistance value between 8 mΩ and 10 mΩ before the on-off cycle, and after a thousand on-off cycles (6 V/20 A), the resistance value rises to 3000mΩ to 3300mΩ, the resistance value is increased by about 350 times to 390 times; and when the applied voltage is raised to 12V, the polymer thermistors of Comparative Examples 4 to 6 are burned in the experiment, and Comparative Example 4 can be confirmed. The polymer thermistor of 6 cannot withstand an applied voltage exceeding 8V.
另特別比較實施例8和比較例6的高分子熱敏電阻,實施例8和比較例6的差異在於,實施例8中使用的環氧樹脂具有三個環氧基,而比較例6中使用的環氧樹脂只具有兩個環氧基。 The polymer thermistors of Example 8 and Comparative Example 6 were specifically compared. The difference between Example 8 and Comparative Example 6 was that the epoxy resin used in Example 8 had three epoxy groups, and was used in Comparative Example 6. The epoxy resin has only two epoxy groups.
就電阻值而言,實施例8的電阻值(4.8mΩ)明顯低於比較例6的電阻值(8.4mΩ)。就耐壓性能而言,實施例8的耐壓性能可達到15V,而比較例6的耐壓性能僅具有8V。測試阻值再現性時,在6V/20A的操作條件下,比較例6的電阻值變化率更是高達383倍,遠大於實施例8的電阻值變化率;另由於比較例6的高分子熱敏電阻無法承受12V的操作電壓,故在12V/20A的操作條件下則是直接燒毀。 The resistance value (4.8 mΩ) of Example 8 was significantly lower than that of Comparative Example 6 in terms of the resistance value (8.4 mΩ). With respect to the withstand voltage performance, the withstand voltage performance of Example 8 was 15 V, and the withstand voltage performance of Comparative Example 6 was only 8 V. When the resistance reproducibility was tested, the resistance value change ratio of Comparative Example 6 was as high as 383 times under the operating condition of 6 V/20 A, which was much larger than the resistance value change rate of Example 8, and the polymer heat of Comparative Example 6 was further used. The varistor cannot withstand the operating voltage of 12V, so it is directly burned under the operating conditions of 12V/20A.
綜合上述,以本發明高分子熱敏電阻複合材料製作出的高分子熱敏電阻可於室溫下具有較低的電阻率、良好的耐壓性能以及良好的電阻再現性。 In summary, the polymer thermistor made of the polymer thermistor composite of the present invention has low electrical resistivity, good pressure resistance and good electrical resistance reproducibility at room temperature.
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