TWI640238B - Electronic device package - Google Patents

Abstract

A package for an electronic device, comprising a first base unit and a second base unit. The first base unit includes a first base and a plurality of first pins respectively inserted into the first base. The first base has a first wiring face. Each of the first pins has a first wiring segment that protrudes from the first wiring surface. The second base unit includes a second base, and a plurality of second pins respectively inserted through the second base and the first base that are opposite to each other. The second base has a second wiring surface remote from the first wiring surface. Each of the second pins has a second wiring segment projecting the second wiring surface, and a protruding leg portion projecting the first wiring surface. The package is more convenient and easy to assemble by the above design.

Description

Electronic device package

The present invention relates to a package, and more particularly to a package for an electronic device specifically for packaging electronic components.

Referring to FIG. 1 and FIG. 2, a package 1 of a conventional electronic device is mounted for a plurality of first electronic components 10 and a plurality of second electronic components 11. Each of the first electronic components 10 has a hollow first magnetic ring 101 and two first wires 102 wound around the first magnetic ring 101, respectively. Each of the second electronic components 11 has a hollow second magnetic ring 111 and two second wires 112 respectively wound around the second magnetic ring 111. The package 1 includes a base unit 12 for mounting the first electronic components 10, and a cover unit 13 for mounting the second electronic components 11.

The base unit 12 includes a base 121 and a plurality of first pins 122 that are inserted into the base 121 at intervals. The base 121 has a bottom wall 123 for mounting the first magnetic rings 101 of the first electronic components 10, an inner surrounding wall 124 projecting upward from a periphery of the bottom wall 123, and one inner A side projecting wall 125 projecting horizontally around the bottom of the periphery of the wall 124. The side protruding wall 125 has a plurality of insertion holes 126 spaced apart from each other and arranged on the left and right sides. Each of the first pins 122 has an embedded in the a first embedded section 127 in the inner surrounding wall 124, a first connecting section 128 protruding upward from the first embedded section 127, and a top surface of the inner surrounding wall 124, and a first embedded section 127 projects downwardly from the first leg section 129 of the bottom surface of the inner surrounding wall 124. Each of the first wiring segments 128 is entangled with one of the first wires 102 of the first electronic components 10.

The cover unit 13 includes a cover 131 correspondingly disposed above the base 121, and a plurality of second pins 132 that are inserted into the cover 131 at intervals. The cover 131 has a top wall 133 which is disposed above the bottom wall 123 and is mounted by the second magnetic rings 111 of the second electronic components 11 and a downward projection from the periphery of the top wall 133. And is coupled to the outer surrounding wall 134 of the side protruding wall 125. Each of the second pins 132 has a second embedded portion 135 embedded in the outer surrounding wall 134, and a second portion of the outer surrounding wall 134 protruding downwardly from the second embedded portion 135. a second wiring section 136, an insertion section 137 extending downwardly from the second wiring section 136 and inserted into each of the insertion holes 126 of the side protruding wall 125, and a projection portion 137 projecting downwardly from the insertion section 137 A second leg section 138 of the bottom surface of the protruding wall 125. Each of the second wiring segments 136 is entangled with one of the second wires 112 of the second electronic components 11.

Each of the first pins 122 of the package 1 is electrically connected to one of the first electronic components 10, and each of the second pins 132 is associated with the second electronic component 11 One of the electrical connections can also be used to position the first leg segments 129 and the second leg segments 138 protruding from the bottom of the base 121 on a circuit board (not shown). However, since the capping unit 13 and the base unit 12 are vertically opposed to each other The second pin 132 of the cover unit 13 protrudes from the bottom surface of the outer surrounding wall 134 except for the second wire segment 136 for the second wire 112 to be wound. The insertion section 137 and the second protrusion section 138 continue to extend downward, resulting in a longer length of each of the second pins 132 protruding downward, so that the assembler wants to wrap the second wire 112 around the first When the two wiring sections 136 are wound, it is necessary to circumvent the insertion section 137 and the second protrusion section 138 every time, in order to be pushed and tied to the second wiring section near the bottom surface of the outer surrounding wall 134. On 136, it often causes inconvenience in assembly.

Accordingly, it is an object of the present invention to provide a package for an electronic device that is easy to assemble.

Therefore, the package of the electronic device of the present invention can be mounted by a plurality of first electronic components and a plurality of second electronic components, and includes: a first base unit and a second base unit. The first base unit includes a first base, and a plurality of first pins that are spaced apart from each other and coupled to the first base, the first base has a first joint surface, and the first base a first mounting surface spaced apart from each other for mounting the first electronic component, and a first wiring surface located around the first mounting surface, each of the first pins having a protruding protrusion from the first pedestal The first wiring face and the first wiring segment electrically connected to one of the first electronic components. The second base unit is coupled to the first base unit and includes a second base, and a plurality of second pins that are spaced apart from each other and are coupled to the second base and the first base. The second base has a second knot corresponding to the first joint surface a mating surface, a second mounting surface spaced apart from the second bonding surface for mounting the second electronic components, and a second wiring surface located around the second mounting surface, each of the second pins having a a second wiring segment protruding from the second wiring surface of the second base and electrically connected to one of the second electronic components, and a first wiring surface protruding from the first base The leg of the leg.

2‧‧‧First electronic components

21‧‧‧First magnetic ring

22‧‧‧First wire

3‧‧‧Second electronic components

31‧‧‧Second magnetic ring

32‧‧‧second wire

4‧‧‧First base unit

41‧‧‧First base

411‧‧‧First installation wall

412‧‧‧ first surrounding wall

413‧‧‧ first joint

414‧‧‧First mounting surface

415‧‧‧First wiring surface

416‧‧‧ first face

417‧‧‧ jack

42‧‧‧First pin

421‧‧‧First wiring section

422‧‧‧First embedded section

5‧‧‧Second base unit

51‧‧‧Second base

511‧‧‧Second installation wall

512‧‧‧Second surrounding wall

513‧‧‧Second junction

514‧‧‧Second mounting surface

515‧‧‧second wiring surface

516‧‧‧ second face

52‧‧‧second pin

521‧‧‧second wiring section

522‧‧‧Second embedded section

523‧‧‧Insert paragraph

524‧‧‧Foot section

6‧‧‧Cover unit

61‧‧‧ 盖

62‧‧‧Walls

Other features and effects of the present invention will be apparent from the following description of the drawings. FIG. 1 is a partially exploded perspective view of a package of the prior art electronic device; FIG. 3 is a partially exploded perspective view of an embodiment of the package of the present invention; FIG. 4 is a cross-sectional assembly view of the embodiment; and FIG. 5 is a cross-sectional exploded view of the embodiment.

Referring to FIG. 3, FIG. 4 and FIG. 5, an embodiment of the package of the present invention is provided for mounting a plurality of first electronic components 2 and a plurality of second electronic components 3. In the embodiment, the first electronic components 2 and the second electronic components 3 are all described by taking a coil as an example. Each of the first electronic components 2 has a hollow first magnetic ring 21, and two first wires 22 respectively wound around the two sides of the first magnetic ring 21 and extending outward. Each of the second electronic components 3 has a hollow second magnetic ring 31, and two coils are respectively wound around the second A second wire 32 extending further outward on both sides of the magnetic ring 31. However, the configurations, types, numbers, arrangements, and mounting positions of the first electronic components 2 and the second electronic components 3 are not the focus of the present invention, and may be changed during implementation, and thus will not be described in detail herein.

The package includes a first base unit 4, a second base unit 5, and a cover unit 6. In the following description, the directions are shown in the drawings. Of course, the installation direction of the package is not limited to the embodiment, and for example, it may be turned upside down or left and right.

The first base unit 4 includes a first base 41 made of an insulating plastic material, and a plurality of first pins respectively made of a conductive metal material and spaced apart from each other at the first base 41 42. The first base 41 is a hollow seat body which is hollow and faces downward to make an inverted U-shaped cross section, and has a horizontal first mounting wall 411, and a lower side of the periphery of the first mounting wall 411 The first stretched wall 412. The first mounting wall 411 has a first bonding surface 413 formed on the top side, and a first mounting surface 414 spaced below the first bonding surface 413 for mounting the first electronic components 2. The first surrounding wall 412 has a first wiring surface 415 formed on the bottom side and below the first mounting surface 414. The first wiring face 415 has two first and right spaced apart first faces 416. The first base 41 further has a plurality of insertion holes 417 that are directly connected to the first joint surface 413 and the first connection surface 415 at a distance from each other.

Each of the first pins 42 has a first connecting portion 421 protruding downwardly from the first connecting surface 415 of the first base 41 and electrically connected to one of the first electronic components 2, And one extending into the first base The first embedded section 422 of the first wiring section 421 is connected to the same body 41. The first connecting segments 421 of the first pins 42 respectively protrude from the first surface portions 416 of the first base 41, and are arranged on the first surface portion 416 to be staggered back and forth. Two columns of spacing. The first embedded segments 422 are bonded to the first base 41 when the first base 41 is molded.

The second base unit 5 is connected to the first base unit 4 and includes a second base 51 made of an insulating plastic material and facing away from the first base 41, and a plurality of The conductive metal material is made to be inserted into the second base 51 and the second pin 52 of the first base 41 at a distance from each other. The second base 51 is a hollow hollow body that is open in the upward direction and has a U-shaped cross section, and has a second mounting wall 511 parallel to the first mounting wall 411, and a second mounting wall A second surrounding wall 512 projecting upward from the periphery of 511. The second mounting wall 511 has a second joint surface 513 formed on the bottom side and corresponding to the first joint surface 413 of the first base 41, and a spacing is located above the second joint surface 513 for The second mounting surface 514 of the second electronic component 3 is mounted. The second surrounding wall 512 has a second wiring surface 515 formed on the top side and above the circumference of the second mounting surface 514. The second wiring face 515 has two second face portions 516 spaced apart from each other and spaced parallel to the first face portions 416, respectively.

Each of the second pins 52 has a second connecting portion 521 protruding upwardly from the second connecting surface 515 of the second base 51 and electrically connected to one of the second electronic components 3, The second embedded section 521 extends downwardly from the second embedded section 522 of the second base 51, and a respective insertion hole 417 of the first base 41 is inserted downwardly from the second embedded section 522. Insert The entry section 523 and a protruding section 524 of the first wiring surface 415 of the first base 41 protrude downward from the insertion section 523. The second connecting segments 521 of the second pins 52 respectively protrude from the second surface portions 516 of the second base 51, and are arranged on the second surface 516 to be staggered in the front and rear and spaced apart from each other. Two columns. The second embedded segments 522 are coupled to the second base 51 when the second base 51 is molded.

The cover unit 6 is made of an insulating plastic material and is covered on the periphery of the first base 41 and the second base 51. The cover unit 6 includes a second mounting surface 514 and the second wiring. The cover 515 is spaced apart from and covers the cover wall 61 of the second connecting segments 521 of the second pins 52, and a cover wall extending downwardly from the periphery of the cover wall 61 and surrounding the second base 51 and the first A peripheral wall 62 on the periphery of the base 41. It should be noted that the capping unit 6 further includes at least one latching portion (not shown) disposed on the peripheral wall 62 and detachably coupled to the first base 41, since the capping unit 6 is The joint structure between the first pedestals 41 is not the focus of the present invention, and therefore will not be described here.

When assembled, the first magnetic rings 21 of the first electronic components 2 are respectively mounted on the first mounting surface 414 of the first base 41, and the first wires 22 are respectively pulled out to the pair. The first wiring segments 421 of the first pin 42 should be waited for and wound around the first wiring segments 421, respectively. The second magnetic rings 31 of the second electronic components 3 are respectively mounted on the second mounting surface 514 of the second base 51, and the second wires 32 are respectively pulled out to correspond to each other. The second segments 521 of the second pins 52 are wound around the second segments 521, respectively. After winding, the first one The excess line segments of the wires 22 and the second wires 32 are respectively cut off, and then a tin plating operation is performed to electrically connect the first electronic components 2 and the first pins 42 and electrically connect the second electronic components 3 And the second pins 52. Of course, an insulating material (not shown) may be respectively filled in the first pedestal 41 and the second pedestal 51 for fixing and protecting the first electronic component 2 and the second electronic components 3 . , no longer here.

Then, the second base unit 5 is assembled on the first base unit 4, and the insertion sections 523 of the second pins 52 of the second base unit 5 are inserted downward together during assembly. In the sockets 417 of the first base 41 of the first base unit 4, until the protrusions 524 of the second pins 52 protrude downwardly from the first base 41 The first bonding surface 415 of the second pedestal 51 corresponds to the first bonding surface 413 of the first pedestal 41 . Finally, the capping unit 6 is disposed on the outer periphery of the first base 41 and the second base 51, and is coupled to the first base 41 to complete assembly of the package.

After the assembly is completed, the first connecting portion 421 and the protruding portion 524 of the first wiring surface 415 are protruded downwardly, and are inserted on a circuit board (not shown). The tin plating operation is electrically connected and fixed to the circuit board. Of course, the tin plating operation between the first wires 22 and the first wiring segments 421 of the first pins 42 can be omitted in the assembly, and can be inserted in the circuit board again. The tin plating operation is carried out, so that the process can be further simplified.

In summary, the package box of the electronic device of the present invention is provided with the first base unit 4 and the second base unit 5 for respectively supplying the first electric The sub-element 2 and the second electronic component 3 are mounted, and the second pedestal 51 and the first pedestal 41 are disposed opposite each other such that the second wiring surface 515 and the first wiring surface 415 are up and down. The first spacers 521 are oppositely spaced apart, and the second pins 52 are protruded upwardly from the second wiring surface 515. The first pins 42 protrude downwardly from the first portion. The portion of the wiring surface 415 is only the first wiring segments 421, and the protrusion length is just enough for the second wires 32 to be wound and connected with the first wires 22 without being too long, so that the assembly is relatively convenient and easy. The labor saving time can effectively reduce the cost. Therefore, the present invention is not only an unprecedented innovation, but also can be utilized by the industry, so that the object of the present invention can be achieved.

However, the above is only the embodiment of the present invention, and the scope of the present invention is not limited thereto, that is, the simple equivalent changes and modifications made by the patent application scope and the patent specification of the present invention are still It is within the scope of the patent of the present invention.

Claims (4)

A package for an electronic device, which is mountable by a plurality of first electronic components and a plurality of second electronic components, and includes: a first base unit including a first base that is hollow and open downward, and a plurality of Interconnecting the first pins of the first base at intervals, the first base has a first bonding surface formed on the top side, an interval below the first bonding surface, and the first electrons a first mounting surface of the component mounting, and a first wiring surface formed on the bottom side and located around the first mounting surface, each of the first pins has a first wiring protruding from the first base a first wiring segment electrically connected to one of the first electronic components; a second base unit coupled to the top side of the first base unit and including a hollow and upwardly opening and a second base opposite to the second base, and a plurality of second pins spaced apart from each other at the second base and the first base, the second base having a bottom formed Side and corresponding to the second joint surface of the first joint surface, a spacer a second mounting surface above the second bonding surface for mounting the second electronic components, and a second wiring surface formed on the top side and located around the second mounting surface, each of the second pins has a a second wiring segment protruding from the second wiring surface of the second base and electrically connected to one of the second electronic components, and a first wiring surface protruding from the first base And a cover unit disposed on the periphery of the first base and the second base, the cover unit including a second mounting surface and the second connection a cover wall of the second wiring segments that are opposite to each other and cover the second pins, and a first wall extending from the periphery of the cover wall toward the first base and surrounding the second base and the first The peripheral wall of the periphery of the base. The package of the electronic device of claim 1, wherein the first base further has a plurality of jacks that communicate with the first joint surface and the first wiring surface at intervals, each of the first pins The first embedded portion extends into the first base and is connected to the first wiring segment, and each of the second pins further has a second base extending into the second base and connected to the same body. a second embedded section of the two wiring segments, and a respective insertion hole inserted into the first base and connected to the insertion section of the second embedded section and the protruding section. The package of the electronic device of claim 1, wherein the first base has a first mounting wall on which the first joint surface and the first mounting surface are disposed, and a periphery of the first mounting wall a first surrounding wall protruding from the second base and disposed with the first connecting surface, the second base having a second mounting wall disposed with the second bonding surface and the second mounting surface, and a second surrounding wall projecting from the periphery of the second mounting wall in a direction away from the first base and providing the second wiring surface. The package of the electronic device of claim 1, 2 or 3, wherein the first wiring surface of the first base has two first and second spaced first faces, and the first pins The first connecting segments respectively protrude from the first faces of the first base, and are arranged on each of the first faces in two rows which are staggered and spaced apart from each other, and the second of the second bases The wiring face has two second and second spaced apart faces, and the second wire segments of the second pins respectively protrude from the second faces of the second base, and Each of the second faces is arranged in two rows which are staggered back and forth and spaced apart from each other.