TWI637782B - Improvement of high concentration VOC exhaust gas treatment equipment - Google Patents

Abstract

A high concentration VOC exhaust gas treatment device is improved, comprising a first connecting pipe, a UV photocatalyst device, a second connecting pipe, a low temperature plasma processing device, a third connecting pipe, and an exhaust fan. One end of the first connecting pipe is disposed in an environment of high concentration VOC exhaust gas, and an input end of the UV photocatalyst device is connected to the other end of the first connecting pipe. The second connecting tube is connected to the output end of the UV photocatalyst device, and the outer periphery of the second connecting tube is provided with a plurality of air inlet holes communicating with the inner space of the second connecting tube. The input end of the low temperature plasma processing apparatus is connected to the other end of the second connecting tube. One end of the third connecting pipe is connected to the output end of the low temperature plasma processing apparatus. The input end of the exhaust fan is connected to the other end of the third connecting pipe. Through the arrangement of the air inlet holes, the outside air is attracted into the interior of the low temperature plasma processing device, and the operating temperature of the low temperature plasma processing device is prevented from being increased to cause the VOC exhaust gas to explode.

Description

Improvement of high concentration VOC exhaust gas treatment equipment

The invention relates to an exhaust gas treatment device, in particular to a high concentration VOC exhaust gas treatment device capable of effectively preventing an explosion accident.

With the advancement of technology, many devices emit toxic gases, which not only cause air pollution, but also endanger people's health. The rate of people getting lung cancer is increasing year by year, making today's society pay more and more attention to the standards of exhaust emissions.

Among the existing methods of air purification, the most common one is to generate a chemical reaction by photocatalytic irradiation of a photocatalyst to generate a purification medium, which can be used for oxidative decomposition to purify toxic gases.

In a working environment that produces high concentrations of VOC exhaust gas, equipment used to treat VOC exhaust gas is very important because workers will stay in these working environments for a long time, which may endanger the health of workers.

The existing equipment for treating VOC exhaust gas is to purify VOC exhaust gas through a photocatalyst processing device and a low temperature voltage plasma processing device to obtain an emission standard value. The photocatalyst processing device can achieve a removal rate of VOC exhaust gas of 80%, the low temperature voltage plasma processing device can achieve a VOC exhaust gas removal rate of 95%, and the low temperature voltage plasma processing device operates at a temperature of 30 ° C to 40 ° C.

However, after the VOC exhaust gas enters the photocatalyst processing device, the photocatalyst processing device will irradiate the photocatalyst with ultraviolet light to cause the photocatalyst to chemically react to purify the VOC exhaust gas, and then the VOC exhaust gas temperature will rise, and the temperature thereof is about 60 ° C to 70 ° C. .

When the VOC exhaust gas enters the low-temperature voltage plasma processing device, the temperature of the VOC exhaust gas causes the operating temperature of the low-temperature voltage plasma processing device to rise slowly, once the operating temperature of the low-temperature voltage plasma processing device is too high (about At 50 ° C), because the VOC exhaust gas is a volatile toxic gas, it will explode, causing an accident that would harm the worker. Therefore, it is necessary to propose improvements to the existing VOC exhaust gas treatment equipment.

The object of the present invention is to provide an improvement of a high-concentration VOC exhaust gas treatment device, which is to attract external air into the interior of the low-temperature plasma processing device by adding an air inlet hole, thereby cooling the working temperature of the low-temperature plasma processing device and avoiding work. The temperature is increased to prevent explosions.

According to the above object, the present invention provides an improvement of a high-concentration VOC exhaust gas treatment device, in particular, an environment in which a high-concentration VOC exhaust gas is generated, and the high-concentration VOC exhaust gas treatment device improvement includes a first connecting pipe and a UV photocatalyst device. A second connecting pipe, a low temperature plasma processing device, a third connecting pipe, and an exhaust fan. One end of the first connecting pipe is disposed in an environment of high concentration VOC exhaust gas.

The input end of the UV photocatalyst device is connected to the other end of the first connecting tube. The second connecting tube is connected to the output end of the UV photocatalyst device, and the outer periphery of the second connecting tube is provided with a plurality of air inlet holes communicating with the inner space of the second connecting tube. The input end of the low temperature plasma processing device is connected to the first The other end of the connecting tube. One end of the third connecting pipe is connected to the output end of the low temperature plasma processing apparatus. The input end of the exhaust fan is connected to the other end of the third connecting pipe.

Further, a fourth connecting tube and an activated carbon processing device are further included, and the two ends of the fourth connecting tube are respectively connected to the output end of the exhaust fan and the input end of the activated carbon processing device.

Further, a fifth connecting tube is further included, and one end of the fifth connecting tube is connected to the output end of the activated carbon processing device.

Further, further comprising an adjustment sleeve disposed around the outer periphery of the second connecting tube, the adjusting sleeve being slidable around the outside of the second connecting tube to adjust the size of each of the air inlet holes.

Further, a screw hole passing through the inner space of the adjusting sleeve and a screw screwing the screw hole are disposed around the outer circumference of the adjusting sleeve.

The invention is characterized by:

1. After the VOC exhaust gas enters the interior of the UV photocatalyst device, the UV photocatalyst device will irradiate the photocatalyst with ultraviolet rays to cause the photocatalyst to chemically react to purify the VOC exhaust gas, and then the VOC exhaust gas temperature will rise. When the VOC exhaust gas enters the low-temperature plasma processing device, the temperature of the VOC exhaust gas causes the operating temperature of the low-temperature plasma processing device to rise slowly, once the operating temperature of the low-temperature plasma processing device is too high, because the VOC exhaust gas is Volatile toxic gases can explode, causing accidents that harm workers. Therefore, the air inlet holes are attracted to the outside of the low-temperature plasma processing apparatus, thereby cooling the operating temperature of the low-temperature plasma processing apparatus, and avoiding an increase in the operating temperature to cause the VOC exhaust gas to explode.

2. Furthermore, in the embodiment, the VOC exhaust gas is again purified by the activated carbon treatment device in an embodiment to further improve the purification benefit.

1‧‧‧High-concentration VOC exhaust gas treatment equipment improvement

2‧‧‧First connecting tube

3‧‧‧UV photocatalyst device

40‧‧‧Second connection tube

400‧‧‧Air intake

41‧‧‧Adjustment casing

42‧‧‧Spiral firmware

420‧‧‧ rod body

5‧‧‧Low temperature plasma processing equipment

6‧‧‧ Third connecting pipe

7‧‧‧Exhaust fan

8‧‧‧Active carbon treatment unit

90‧‧‧fourth connecting pipe

91‧‧‧ fifth connecting tube

A‧‧‧ outside air

Fig. 1 is a structural view showing an improvement of the high-concentration VOC exhaust gas treating apparatus of the present invention.

Fig. 2 is a partial enlarged view of the second connecting pipe and the adjusting sleeve of the present invention.

Figure 3 is a schematic view showing the movement of the adjustment sleeve around the second connecting tube of the present invention.

Fig. 4 is a perspective view of Fig. 2.

The purpose, technical contents, features and effects achieved by the present invention will be more readily understood by the following description in conjunction with the accompanying drawings.

Referring to FIG. 1, the present invention proposes an improvement 1 of a high-concentration VOC exhaust gas treatment device, especially in an environment where high-concentration VOC exhaust gas is generated, wherein VOC refers to a volatile organic compound (Volatile Organic Compound). The high-concentration VOC exhaust gas treatment device modification 1 comprises a first connecting pipe 2, a UV photocatalyst device 3, a second connecting pipe 40, a low temperature plasma processing device 5, a third connecting pipe 6, and an exhaust fan 7. .

One end of the first connecting pipe 2 is disposed in an environment of a high concentration VOC exhaust gas, and an input end of the UV photocatalyst device 3 is connected to the other end of the first connecting pipe 2. The second connecting tube 40 is connected to the output end of the UV photocatalyst device 3. The outer connecting portion of the second connecting tube 40 is provided with a plurality of air inlet holes 400 communicating with the inner space of the second connecting tube 40. The input end of the low temperature plasma processing apparatus 5 is connected to the other end of the second connecting pipe 40. One end of the third connecting pipe 6 is connected to the output end of the low temperature plasma processing apparatus 5. The input end of the exhaust fan 7 is connected to the other end of the third connecting pipe 6.

Please continue to refer to FIG. 1 . Specifically, firstly, one end of the first connecting pipe 2 in the high-concentration VOC exhaust gas treatment device modification 1 of the present invention is set to produce high concentration VOC such as printing, painting, painting, and the like. In the environment of the exhaust gas, the exhaust fan 7 is continuously turned on to make the VOC exhaust gas in the environment The other end of the first connecting pipe 2 enters the inside of the first connecting pipe 2 and the inside of the UV photocatalyst device 3 sequentially, so that the VOC exhaust gas is first purified by the photocatalyst to decompose the VOC exhaust gas to obtain 80% of the VOC exhaust gas. Removal rate. Thereafter, the VOC exhaust gas enters the low-temperature plasma processing device 5 via the second connecting pipe 40, and the low-temperature plasma processing device 5 purifies the VOC exhaust gas by a low current and a high voltage to obtain a VOC exhaust gas. The % removal rate, the purified gas is directly discharged through the output of the exhaust fan 7.

Continuing, after the VOC exhaust gas enters the interior of the UV photocatalyst device 3, the UV photocatalyst device 3 irradiates the photocatalyst with ultraviolet rays to cause a chemical reaction of the photocatalyst to purify the VOC exhaust gas, and then the VOC exhaust gas temperature rises. When the VOC exhaust gas enters the low temperature plasma processing apparatus 5, the temperature of the VOC exhaust gas causes the operating temperature of the low temperature plasma processing apparatus 5 to rise slowly, once the operating temperature of the low temperature plasma processing apparatus 5 is too high, because VOC exhaust gas is a volatile toxic gas that can explode, causing accidents that harm workers. Therefore, by opening the exhaust fan 7, the outside air A enters the inside of the low-temperature plasma processing apparatus 5 via the air intake holes 400, thereby cooling the operating temperature of the low-temperature plasma processing apparatus 5, thereby avoiding an increase in operating temperature and causing VOC. Explosion of the exhaust gas.

In an embodiment, please refer to FIG. 1 to FIG. 4, the high-concentration VOC exhaust gas treatment device modification 1 further includes an adjustment sleeve 41 disposed around the outer circumference of the second connecting tube 40, the adjustment The sleeve 41 is slidable around the outside of the second connecting pipe 40 to adjust the size of each of the intake holes 400, whereby the internal operating temperature of the low temperature plasma processing apparatus 5 can be adjusted as appropriate.

The outer circumference of the adjusting sleeve 41 is provided with a screw hole (not shown) communicating with the inner space of the adjusting sleeve 41, and a screw 42 screwing the screw hole. The screw 42 extends through the screw hole and the screw hole 42 The bottom end of the rod 420 of the screw 42 is in contact with the second connecting tube 40, so that the adjusting sleeve 41 is positioned around the outside of the second connecting tube 40. In detail, when the size of each of the intake holes 400 is to be adjusted, the adjustment sleeve 41 is moved to an appropriate position, and thereafter the screw 42 is rotated to make the bottom end of the rod 420 of the screw 42 interfere. The second connecting tube 40 allows the adjusting sleeve 41 to be positioned around the outside of the second connecting tube 40 without shaking.

Further, referring to FIG. 1 again, in order to further improve the removal rate of the VOC exhaust gas, the high-concentration VOC exhaust gas treatment equipment improvement 1 further includes a fourth connecting pipe 90 and an activated carbon processing device 8. Both ends of the fourth connecting pipe 90 are connected to the output end of the exhaust fan 7 and the input end of the activated carbon processing device 8, respectively. The VOC exhaust gas enters the inside of the fourth connecting pipe 90 and the inside of the activated carbon processing device 8 through the output end of the exhaust fan 7, and the VOC exhaust gas is purified again through the activated carbon processing device 8 to obtain a 99.50% removal rate of the VOC exhaust gas. .

Continuing, the purified gas may be directly discharged through the output end of the activated carbon treatment device 8, or a fifth connecting pipe 91 may be connected to the output end of the activated carbon processing device 8 as the case may be. One end of the air outlet is discharged.

In summary, according to the above technical features can achieve the following characteristics:

1. After the VOC exhaust gas enters the interior of the UV photocatalyst device 3, the UV photocatalyst device 3 irradiates the photocatalyst with ultraviolet light to cause the photocatalyst to chemically react to purify the VOC exhaust gas, and then the VOC exhaust gas temperature rises. When the VOC exhaust gas enters the low-temperature plasma processing device 5, the temperature of the VOC exhaust gas causes the operating temperature of the low-temperature plasma processing device 5 to rise slowly. Once the operating temperature of the low-temperature plasma processing device 5 is too high, Because VOC exhaust gas is a volatile toxic gas, it will explode, causing accidents that harm workers. Therefore, the outside air A is sucked into the low temperature plasma processing apparatus 5 through the air intake holes 400, thereby cooling the operating temperature of the low temperature plasma processing apparatus 5, thereby preventing the VOC exhaust gas from being exploded due to an increase in the operating temperature.

2. Furthermore, in the embodiment, the VOC exhaust gas is again purified by the activated carbon treatment device 8 in an embodiment to further improve the purification benefit.

The foregoing is only a preferred embodiment of the present invention, and is intended to be understood by those skilled in the art, and is not intended to limit the scope of the invention. Equivalent variations or modifications of the shapes, configurations and features described in the scope of the present application are intended to be included within the scope of the present invention.

Claims (5)

A high-concentration VOC exhaust gas treatment device is improved, especially in an environment that generates a high-concentration VOC exhaust gas. The high-concentration VOC exhaust gas treatment device improvement includes: a first connecting pipe, one end of the first connecting pipe is set at a high In the environment of the concentration of the VOC exhaust gas; a UV photocatalyst device, the input end of the UV photocatalyst device is connected to the other end of the first connecting tube; and a second connecting tube is connected to the output end of the UV photocatalyst device, a plurality of intake holes communicating with the inner space of the second connecting pipe are disposed around the outer portion of the second connecting pipe; a low temperature plasma processing device, wherein the input end of the low temperature plasma processing device is connected to the other end of the second connecting pipe; a third connecting pipe, one end of which is connected to the output end of the low temperature plasma processing device; and an exhaust fan whose input end is connected to the other end of the third connecting pipe. The improved high-concentration VOC exhaust gas treatment device according to claim 1, further comprising a fourth connecting pipe and an activated carbon processing device, wherein the two ends of the fourth connecting pipe are respectively connected to the output end of the exhaust fan and the The input of the activated carbon treatment unit. The high-concentration VOC exhaust gas treatment device according to claim 2, further comprising a fifth connecting pipe, one end of the fifth connecting pipe being connected to the output end of the activated carbon processing device. The improved high-concentration VOC exhaust gas treatment device according to claim 1, further comprising an adjustment sleeve disposed around the outer portion of the second connecting pipe, the adjusting sleeve being slidable around the second connecting pipe Move to adjust the size of each of the intake holes. The high-concentration VOC exhaust gas treatment device according to claim 4 is characterized in that, the outer circumference of the adjusting sleeve is provided with a screw hole communicating with the inner space of the adjusting sleeve and a screw screwing the screw hole.