TWI637663B - Circuit board and manufacturing method thereof - Google Patents

Abstract

A circuit board comprising a composite layer of a non-conducting inorganic material and an organic material, a plurality of conductive structures, a first build-up structure, and a second build-up structure. The composite layer of the non-conducting inorganic material and the organic material has a first surface and a second surface and a plurality of openings opposite to each other. The conductive structures are respectively disposed in the openings of the composite layer of the non-conducting inorganic material and the organic material. The first build-up structure is disposed on the first surface of the composite layer of the non-conducting inorganic material and the organic material, and is electrically connected to the conductive structure. The second build-up structure is disposed on the second surface of the composite layer of the non-conducting inorganic material and the organic material, and is electrically connected to the conductive structure.

Description

Circuit board and manufacturing method thereof

The present invention relates to a circuit board and a method of fabricating the same, and more particularly to a circuit board having a preferred structural strength and a method of fabricating the same.

Stacked semiconductor component packages typically make vias in a germanium or glass substrate, such as through silicon vias (TSV), and a redistribution layer is formed on the surface of the germanium or glass substrate to complete the interposer. (interposer) is fabricated and the interposer is bonded to the package carrier in a mount manner or integrated into the package carrier in an embed manner. However, the interposer based on enamel or glass has a fragile material that relatively affects structural reliability. In addition, since the encapsulation colloid used in the encapsulation process has a different coefficient of thermal expansion from the interposer, in the curing process after encapsulation, the expansion and contraction amount of the interposer and the encapsulant may change with temperature. , which in turn causes the interposer to produce a warpage.

The invention provides a circuit board which can be used as an interposer or a package carrier, and has better structural strength.

The invention also provides a method for manufacturing a circuit board for fabricating the above-mentioned circuit board.

The circuit board of the present invention comprises a composite layer of a non-conducting inorganic material and an organic material, a plurality of conductive structures, a first build-up structure and a second build-up structure. The composite layer of the non-conducting inorganic material and the organic material has a first surface and a second surface and a plurality of openings opposite to each other. The conductive structures are respectively disposed in the openings of the composite layer of the non-conducting inorganic material and the organic material. The first build-up structure is disposed on the first surface of the composite layer of the non-conducting inorganic material and the organic material, and is electrically connected to the conductive structure. The second build-up structure is disposed on the second surface of the composite layer of the non-conducting inorganic material and the organic material, and is electrically connected to the conductive structure.

In an embodiment of the invention, the material of the composite layer of the non-conducting inorganic material and the organic material comprises a composite material composed of a ceramic material and a polymer material.

In an embodiment of the invention, the ceramic material comprises zirconia, alumina, tantalum nitride, tantalum carbide, tantalum oxide or a combination thereof, and the polymer material comprises epoxy resin, polyamine, liquid crystal polymer a methacrylate type resin, a vinyl phenyl type resin, an allyl type resin, a polyacrylate type resin, a polyether type resin, a polyolefin type resin, a polyamine type resin, a polyoxyalkylene type resin or the foregoing combination.

In an embodiment of the invention, the composite layer of the non-conducting inorganic material and the organic material is a pseudo-bead layer.

In an embodiment of the invention, the composite layer of the non-conductive inorganic material and the organic material has a Young's modulus of between 20 GPa and 100 GPa.

In an embodiment of the invention, the circuit board further includes a plurality of pads disposed on the second surface of the composite layer of the non-conducting inorganic material and the organic material, and electrically connected to the conductive structure, wherein the plurality of openings are A blind hole is formed, and a portion of the first build-up structure is embedded in the first surface of the composite layer of the non-conducting inorganic material and the organic material, and the pad is electrically connected to the first build-up structure through the conductive structure.

In an embodiment of the invention, the opening is a plurality of through holes connecting the first surface and the second surface of the composite layer of the non-conducting inorganic material and the organic material, and the conductive structure is a plurality of conductive pillars, the first build-up layer The structure is electrically connected to the second build-up structure through the conductive pillars.

In an embodiment of the invention, the first build-up structure includes at least one first dielectric layer, at least one first patterned conductive layer, and at least one first conductive via structure extending through the first dielectric layer. The first dielectric layer and the first patterned conductive layer are sequentially stacked on the first surface of the composite layer of the non-conducting inorganic material and the organic material, and the first patterned conductive layer is transmitted through the first conductive via structure and the conductive structure Electrical connection.

In an embodiment of the invention, the second build-up structure includes at least one second dielectric layer, at least one second patterned conductive layer, and at least one second conductive via structure extending through the second dielectric layer. The second dielectric layer and the second patterned conductive layer are sequentially stacked on the second surface of the composite layer of the non-conducting inorganic material and the organic material, and the second patterned conductive layer is transmitted through the second conductive via structure and the conductive structure Electrical connection.

In an embodiment of the invention, the circuit board further includes a solder resist layer and a surface treatment layer. The solder resist layer is disposed on the second build-up structure, wherein the solder resist layer exposes a portion of the second build-up structure. The surface treatment layer is disposed on the second buildup structure exposed by the solder resist layer.

A method of manufacturing a wiring board of the present invention includes the following steps. A support plate is provided. The support plate is provided with a temporary adhesive layer and a patterned circuit layer on the temporary adhesive layer. A first build-up structure is formed on the temporary adhesive layer and electrically connected to the patterned circuit layer. Disposing a composite layer of a non-conducting inorganic material and an organic material and a plurality of conductive structures on the first build-up structure, wherein the composite layer of the non-conducting inorganic material and the organic material covers the conductive structure, and the conductive structure and the first build-up structure Electrical connection. Forming a second build-up structure on the composite layer of the non-conducting inorganic material and the organic material, wherein the second build-up structure is electrically connected to the first build-up structure through the conductive structure. The support plate and the temporary adhesive layer are removed to expose a surface of the first build-up structure and the patterned circuit layer.

In an embodiment of the invention, the material of the composite layer of the non-conducting inorganic material and the organic material comprises a composite material composed of a ceramic material and a polymer material.

In an embodiment of the invention, the ceramic material comprises zirconia, alumina, tantalum nitride, tantalum carbide, tantalum oxide or a combination thereof, and the polymer material comprises epoxy resin, polyamine, liquid crystal polymer a methacrylate type resin, a vinyl phenyl type resin, an allyl type resin, a polyacrylate type resin, a polyether type resin, a polyolefin type resin, a polyamine type resin, a polyoxyalkylene type resin or the foregoing combination.

In an embodiment of the invention, the composite layer of the non-conducting inorganic material and the organic material is a pseudo-bead layer.

In an embodiment of the invention, the composite layer of the non-conducting inorganic material and the organic material has a Young's modulus of between 20 GPa and 100 GPa.

In an embodiment of the invention, the step of configuring the composite layer of the non-conducting inorganic material and the organic material and the conductive structure on the first build-up structure comprises: arranging the composite layer of the non-conducting inorganic material and the organic material in the first increase a layer structure, the composite layer of the non-conducting inorganic material and the organic material has a plurality of blind holes, and the blind holes expose a portion of the first build-up structure; and the conductive structure is formed on the first build-up structure and located in the blind hole, wherein The conductive structure is electrically connected to the first buildup structure exposed by the blind via.

In an embodiment of the invention, the plurality of pads are formed on the composite layer of the non-conducting inorganic material and the organic material while the conductive structure is formed, and the pad is electrically connected to the first build-up structure through the conductive structure.

In an embodiment of the invention, the step of configuring the composite layer and the conductive structure of the non-conducting inorganic material and the organic material on the first build-up structure comprises: forming a conductive structure on the first build-up structure, wherein the conductive structure is a plurality of conductive pillars; and a composite layer forming a non-conducting inorganic material and an organic material on the first build-up structure and covering the conductive pillars, wherein a first surface of the non-conducting inorganic material and the organic material composite layer are opposite to each other The second surface is respectively aligned with a third surface and a fourth surface of each of the conductive pillars.

In an embodiment of the invention, the step of disposing the composite layer of the non-conducting inorganic material and the organic material and the conductive structure on the first build-up structure comprises: providing a composite layer of a non-conducting inorganic material and an organic material, and a non-conductor The composite layer of the inorganic material and the organic material has an upper surface and a lower surface opposite to each other; a plurality of blind holes are formed on the upper surface of the composite layer of the non-conducting inorganic material and the organic material; forming a conductive material layer on the non-conducting inorganic material and a composite layer of organic material on the upper surface and in the blind hole, wherein the conductive material fills the blind hole; removing a portion of the conductive material layer and a portion of the non-conducting inorganic material and the organic material to form a thinned non-conductive inorganic material a composite layer and a conductive structure with an organic material, wherein the conductive structure is a plurality of conductive pillars, and a first surface and a second surface of the composite layer of the non-conducting inorganic material and the organic material are respectively opposite to each of the conductive pillars The third surface is aligned with a fourth surface; and the composite layer and the conductive structure of the non-conducting inorganic material and the organic material are disposed in the first Layer structure.

In an embodiment of the invention, the first build-up structure includes at least one first dielectric layer, at least one first patterned conductive layer, and at least one first conductive via structure extending through the first dielectric layer. The first dielectric layer and the first patterned conductive layer are sequentially stacked on the temporary adhesive layer, and the first patterned conductive layer is electrically connected to the patterned circuit layer through the first conductive via structure.

In an embodiment of the invention, the second build-up structure includes at least one second dielectric layer, at least one second patterned conductive layer, and at least one second conductive via structure extending through the second dielectric layer. The second dielectric layer and the second patterned conductive layer are sequentially stacked on the composite layer of the non-conducting inorganic material and the organic material, and the second patterned conductive layer is electrically connected to the conductive structure through the second conductive via structure.

In an embodiment of the invention, after forming the second build-up structure on the composite layer of the non-conducting inorganic material and the organic material, and before removing the support plate and the temporary adhesive layer, the method further comprises: forming a The solder resist layer is on the second build-up structure, wherein the solder resist layer exposes a portion of the second build-up structure; and a surface treatment layer is formed on the second build-up structure exposed by the solder resist layer.

Based on the above, since the wiring board of the present invention is provided with a build-up structure on the opposite surfaces of the composite layer of the non-conducting inorganic material and the organic material, it is intended that the composite layer of the non-conducting inorganic material and the organic material is regarded as a reinforcement. The layer has a higher hardness than the general dielectric layer and the encapsulating material. Therefore, the circuit board of the present invention can enhance the overall structural strength by the composite layer of the non-conducting inorganic material and the organic material to prevent the warpage of the carrier, thereby improving the process yield.

The above described features and advantages of the invention will be apparent from the following description.

FIG. 1A is a cross-sectional view of a circuit board according to an embodiment of the invention. Referring to FIG. 1A, in the embodiment, the circuit board 100a includes a composite layer 110a of non-conducting inorganic material and organic material, a plurality of conductive structures 120a, a first build-up structure 130a, and a second build-up structure 140a. The composite layer 110a of non-conducting inorganic material and organic material has a first surface 112 and a second surface 114 and a plurality of openings 116a opposite to each other. The conductive structures 120a are respectively disposed in the openings 116a of the composite layer 110a of the non-conducting inorganic material and the organic material. The first build-up structure 130a is disposed on the first surface 112 of the composite layer 110a of the non-conducting inorganic material and the organic material, and is electrically connected to the conductive structure 120a. The second build-up structure 140a is disposed on the second surface 114 of the composite layer 110a of the non-conducting inorganic material and the organic material, and is electrically connected to the conductive structure 120a.

In detail, the material of the composite layer 110a of the non-conducting inorganic material and the organic material of the present embodiment is, for example, a composite material composed of a ceramic material and a polymer material, wherein the ceramic material includes zirconia, alumina, and nitrogen. Huatanium, tantalum carbide, niobium oxide or a combination thereof, and the polymer material includes epoxy resin, polyamidamine, liquid crystal polymer, methacrylate type resin, ethylene phenyl type resin, allyl type resin, A polyacrylate resin, a polyether resin, a polyolefin resin, a polyamine resin, a polyoxyalkylene resin, or a combination thereof. The ceramic material may be a ceramic layer or a ceramic powder, but the ceramic material of the embodiment is not limited thereto. The composite layer 110a of the non-conducting inorganic material and the organic material may be a pseudo-bead layer. Here, the Young's modulus of the composite layer 110a of the non-conducting inorganic material and the organic material is, for example, between 20 GPa and 100 GPa. Compared with the conventional dielectric layer (having a Young's modulus of not more than 10 GPa) and the encapsulating material (having a Young's modulus of not more than 20 GPa), the composite layer of the non-conducting inorganic material and the organic material of the present embodiment 110a has excellent hardness and can effectively strengthen the structural strength of the circuit board 100a.

Furthermore, the circuit board 100a of the present embodiment further includes a plurality of pads 125, wherein the pads 125 are disposed on the second surface 114 of the composite layer 110a of non-conducting inorganic material and organic material, and are electrically connected to the conductive structure 120a. . Here, the opening 116a of the composite layer 110a of the non-conducting inorganic material and the organic material may be a plurality of blind holes, and a portion of the first build-up structure 130a is embedded in the first surface of the composite layer 110a of the non-conductive inorganic material and the organic material. 112, and the pad 125 is electrically connected to the first build-up structure 130a through the conductive structure 120a.

Further, referring to FIG. 1A, the first build-up structure 130a of the present embodiment includes at least one first dielectric layer 132 (three layers of the first dielectric layer are schematically illustrated in FIG. 1A), at least one A patterned conductive layer 134 (three layers of the first patterned conductive layer are schematically illustrated in FIG. 1A) and at least one first conductive via structure 136 extending through the first dielectric layer 132 (shown schematically in FIG. 1A First conductive via structures). The first dielectric layer 132 and the first patterned conductive layer 134 are sequentially stacked on the first surface 112 of the composite layer 110a of the non-conducting inorganic material and the organic material, and the first patterned conductive layer 134 is transmitted through the first conductive layer. The hole structure 136 is electrically connected to the conductive structure 120a.

On the other hand, the second build-up structure 140a of the present embodiment includes at least one second dielectric layer 142 (a second dielectric layer is schematically illustrated in FIG. 1A) and at least one second patterned conductive layer 144 (FIG. 1A). A second patterned conductive layer is schematically illustrated in FIG. 1A and at least one second conductive via structure 146 extending through the second dielectric layer 142 (a plurality of second conductive via structures are schematically illustrated in FIG. 1A). The second dielectric layer 142 and the second patterned conductive layer 144 are sequentially stacked on the second surface 114 of the composite layer 110a of the non-conducting inorganic material and the organic material, and the second patterned conductive layer 144 is transmitted through the second conductive layer. The hole structure 146 is electrically connected to the conductive structure 120a.

In addition, the circuit board 100a of the present embodiment further includes a solder resist layer 150 and a surface treatment layer 160. The solder resist layer 150 is disposed on the second build-up structure 140a, wherein the solder resist layer 150 exposes a portion of the second build-up structure 140a. The surface treatment layer 160 is disposed on the second build-up structure 140a exposed by the solder resist layer 150.

Since the circuit board 100a of the present embodiment is disposed on the first surface 112 and the second surface 114 of the composite layer 110a of the non-conducting inorganic material and the organic material, the first build-up structure 130a and the second build-up structure 140a are respectively disposed, that is, The composite layer 110a of the non-conducting inorganic material and the organic material can be regarded as a reinforcing layer, and the 110a has higher hardness than the general dielectric layer and the encapsulating material. Therefore, the circuit board 100a of the present embodiment can enhance the overall structural strength by transmitting the composite layer 110a of the non-conducting inorganic material and the organic material to prevent warpage of the carrier, thereby improving the process yield.

It is to be noted that the following embodiments use the same reference numerals and parts of the above-mentioned embodiments, and the same reference numerals are used to refer to the same or similar elements, and the description of the same technical content is omitted. For the description of the omitted portions, reference may be made to the foregoing embodiments, and the following embodiments are not repeated.

FIG. 1B is a cross-sectional view of a circuit board according to another embodiment of the present invention. Referring to FIG. 1A and FIG. 1B, the circuit board 100b of the present embodiment is similar to the circuit board 100a of FIG. 1A. The difference between the two is that the opening 116b of the composite layer 110b of the non-conducting inorganic material and the organic material of the embodiment can be The first surface 112 and the second surface 114 of the composite layer 110b of the non-conducting inorganic material and the organic material are connected to the plurality of through holes. The conductive structure 120b can be a plurality of conductive pillars, and the first conductive via structure 136 of the first build-up structure 130b is electrically transmitted through the conductive structure (ie, the conductive pillars) 120b and the second conductive via structures 146 of the second build-up structure 140b. Sexual connection.

Hereinafter, a method of fabricating the circuit boards 100a and 100b, which will be described separately in the second embodiment, and a method of manufacturing the circuit boards 100a and 100b will be described in detail with reference to FIGS. 2A to 2G and FIGS. 3A and 3F.

2A-2G are schematic cross-sectional views showing a method of fabricating a circuit board according to an embodiment of the invention. Referring to FIG. 2A, in accordance with the method for fabricating the circuit board 100a of the present embodiment, first, a support board 10 is provided, wherein the support board 10 is provided with a temporary adhesive layer 20. Here, the support plate 10 is, for example, a glass substrate, a germanium substrate or a copper foil substrate, but is not limited thereto.

Next, referring to FIG. 2B, a patterned wiring layer 30 is formed on the temporary adhesive layer 20, wherein the patterned wiring layer 30 exposes a portion of the temporary adhesive layer 20. Here, the method of forming the patterned wiring layer 30 includes a process of sputtering a titanium/copper and a lithography yellow light.

Next, referring to FIG. 2C , the first build-up structure 130 a is formed on the temporary adhesive layer 20 and electrically connected to the patterned circuit layer 30 . Here, the first build-up structure 130a includes three first dielectric layers 132, three first patterned conductive layers 134, and a plurality of first conductive via structures 136 extending through the first dielectric layer 132. The first dielectric layer 132 and the first patterned conductive layer 134 are sequentially stacked on the temporary adhesive layer 20 , and the first patterned conductive layer 134 is electrically connected to the patterned conductive layer 136 and the patterned conductive layer 30 . connection.

Next, referring to FIG. 2D, a composite layer 110a of non-conducting inorganic material and organic material and a plurality of conductive structures 120a are disposed on the first build-up structure 130a, wherein the composite layer 110a of the non-conductive inorganic material and the organic material is coated with conductive The structure 120a is electrically connected to the first build-up structure 130a.

In detail, the step of disposing the composite layer 110a of the non-conducting inorganic material and the organic material and the conductive structure 120a on the first build-up structure 130 includes: firstly disposing the composite layer 110a of the non-conducting inorganic material and the organic material in the first build-up layer In the structure 130, the composite layer 110a of the non-conducting inorganic material and the organic material has a plurality of blind holes (ie, the opening 116a), and the blind hole (ie, the opening 116a) exposes a portion of the first build-up structure 130a, that is, exposes the first The first patterned conductive layer 134 of the build-up structure 130a.

Then, the conductive structure 120a is further formed on the first build-up structure 130 and located in the blind via (ie, the opening 116a), wherein the conductive structure 120a and the first via structure 130a exposed by the blind via (ie, the opening 116a) are electrically connection. Here, a plurality of pads 125 are formed on the composite layer 110a of the non-conducting inorganic material and the organic material while the conductive structure 120a is formed, wherein the pads 125 are electrically connected to the first build-up structure 130 through the conductive structures 120a. .

Further, the material of the composite layer 110a of the non-conductive inorganic material and the organic material of the present embodiment is, for example, a composite material composed of a ceramic material and a polymer material, wherein the ceramic material includes zirconia, alumina, and nitrogen. Huatanium, tantalum carbide, niobium oxide or a combination thereof, and the polymer material includes epoxy resin, polyamidamine, liquid crystal polymer, methacrylate type resin, ethylene phenyl type resin, allyl type resin, A polyacrylate resin, a polyether resin, a polyolefin resin, a polyamine resin, a polyoxyalkylene resin, or a combination thereof. The ceramic material may be a ceramic layer or a ceramic powder, but the ceramic material of the embodiment is not limited thereto. In the ceramic powder embodiment, the method for preparing the composite layer 110a of the non-conducting inorganic material and the organic material may be impregnated into the ceramic powder by a vacuum impregnation technique to prepare a composite composed of the ceramic powder and the polymer material. A composite layer 110a of a non-conducting inorganic material and an organic material composed of a material. Then, the composite layer 110a of the non-conducting inorganic material and the organic material is disposed on the first build-up structure 130 by thermal compression or vacuum impregnation, ultraviolet light irradiation and heating, which will be supplemented by FIG. 3C, but not This is limited to this. In the embodiment of the ceramic layer sheet, the method for preparing the composite layer 110a of the non-conducting inorganic material and the organic material can be impregnated into the ceramic layer sheet by vacuum impregnation technology to prepare the ceramic layer sheet and the polymer material. A composite layer 110a of a non-conducting inorganic material and an organic material composed of a composite material composed of a composite material. However, the method for manufacturing the composite layer 110a of the non-conductive inorganic material and the organic material of the present embodiment is not limited thereto, and other methods for forming a composite material between the polymer material and the ceramic material may be employed. In the ceramic layer embodiment, in more detail, the composite layer 110a of the non-conducting inorganic material and the organic material comprises a composite composition of an organic substance and an inorganic substance (for example, a composite composition of a polymer material and a ceramic layer), based on an organic substance to an inorganic substance. Adhesion, the ceramic layer of the composite layer 110a of the non-conducting inorganic material and the organic material has a micro-layered structure in which a sheet shape, a brick shape or a combination thereof is arranged, which arrangement suppresses the conduction of the lateral rupture force, thereby significantly increasing the hardness thereof. degree. In this way, the material is strong and elastic, which can improve the ceramic strength and improve the ceramic brittleness, while having excellent toughness. The composite layer 110a of the non-conducting inorganic material and the organic material may be a pseudo-bead layer. Here, the Young's modulus of the composite layer 110a of the non-conducting inorganic material and the organic material is, for example, between 20 GPa and 100 GPa.

In the embodiment of the present invention, the blind holes 116a are formed by laser. In another embodiment of the present invention, the diameter of the bottom of the blind hole 116a is, for example, 10 um, and the length of the single-plate-shaped, brick-shaped ceramic layer is different from the diameter of the bottom of the hole, and the ratio of the former to the latter is 0.1 or less. Therefore, the length of the ceramic layer sheet may be relatively 0.3 to 1 um (300 nm to 1000 nm), and the thickness may be 0.03 to 0.1 um (30 nm to 100 nm). The polymer material is, for example, epoxy-based resin and enamel. A photosensitive resin composition of an imide-based resin. A sheet-like or brick-like ceramic layer having an ultraviolet light wavelength capable of exposing energy to the photosensitive resin composition, for example, a quartz material having a high transmittance in the ultraviolet light region can greatly reduce ultraviolet light energy loss. After the sheet-like or brick-shaped ceramic layer sheet of the laminated structure is immersed in the photosensitive resin composition, the position where the blind hole 116a is to be formed is exposed, and then the ultrasonic developing solution blister or the pulse developing solution water column is used. The resin at the position of the blind hole 116a and the effect of the sheet-like or brick-like ceramic layer of the laminated structure at the position where the blind hole 116a is removed are formed to form the blind hole 116a.

Next, referring to FIG. 2E, a second build-up structure 140a is formed on the composite layer 110a of the non-conducting inorganic material and the organic material, wherein the second build-up structure 140a is electrically connected to the first build-up structure 130a through the conductive structure 120a. Here, the second build-up structure 140a includes a second dielectric layer 142, a second patterned conductive layer 144, and a plurality of second conductive via structures 146 extending through the second dielectric layer 142. The second dielectric layer 142 and the second patterned conductive layer 144 are sequentially stacked on the composite layer 110a of the non-conducting inorganic material and the organic material, and the second patterned conductive layer 144 is transmitted through the second conductive via structure 146 and electrically conductive. The structure 120a is electrically connected.

Next, referring to FIG. 2F, a solder resist layer 150 is formed on the second build-up structure 140a, wherein the solder resist layer 150 exposes a portion of the second build-up structure 140a. That is, the solder resist layer 150 exposes a portion of the second patterned conductive layer 144 of the second build-up structure 140a.

Thereafter, referring to FIGS. 2F and 2G at the same time, the surface treatment layer 160 is formed on the second build-up structure 140a exposed by the solder resist layer 150. That is, the surface treatment layer 160 is formed on a portion of the second patterned conductive layer 144 of the second build-up structure 140a exposed by the solder resist layer 150. Finally, the support plate 10 and the temporary adhesive layer 20 are removed to expose a surface 131 of the first build-up structure 130a and the patterned wiring layer 30. So far, the manufacture of the circuit board 100a has been completed.

2H is a schematic cross-sectional view showing the circuit board of FIG. 2G carrying at least one wafer. Referring to FIG. 2G and FIG. 2H simultaneously, the circuit board 100a of FIG. 2G is adapted to carry at least one wafer (only two wafers 40, 50 are schematically illustrated in FIG. 2H), wherein the wafers 40, 50 are adapted to be configured in the first increase. The surface 131 of the layer structure 130a is electrically connected to the patterned wiring layer 30. Thereafter, the package structure 200a of FIG. 2H can be formed by a singulation process. Here, the wafers 40 and 50 are, for example, an application processor (AP) wafer, a wide I/O wafer, or a combination thereof, but are not limited thereto.

Since the package structure 200a of the present embodiment is configured to dispose the wafers 40, 50 on the wiring board 100a having the composite layer 110a of a non-conducting inorganic material and an organic material, the 110a has a higher dielectric layer and packaging material than the general dielectric layer and the packaging material. Hardness. Therefore, the package structure 200a of the present embodiment can enhance the overall structural strength by transmitting the composite layer 110a of the non-conducting inorganic material and the organic material to prevent warpage of the carrier, thereby improving structural reliability.

3A-3F are schematic cross-sectional views showing a partial step of a method of fabricating a circuit board according to another embodiment of the present invention. The manufacturing method of the circuit board 100b of the present embodiment is similar to the manufacturing method of the circuit board 100a described above, and the difference between the two is that after the step of FIG. 2B, that is, after the patterned wiring layer 30 is formed, please refer to FIG. 3A to form the first A build-up structure 130b is on the temporary adhesive layer 20 and is electrically connected to the patterned circuit layer 30. Here, the first build-up structure 130b includes three first dielectric layers 132, two first patterned conductive layers 134, and a plurality of first conductive via structures 136 extending through the first dielectric layer 132. The first dielectric layer 132 and the first patterned conductive layer 134 are sequentially stacked on the temporary adhesive layer 20 , and the first patterned conductive layer 134 is electrically connected to the patterned conductive layer 136 and the patterned conductive layer 30 . connection.

Next, referring to FIG. 3B, a conductive structure 120b is formed on the first build-up structure 130b, wherein the conductive structure 120b can have a plurality of conductive pillars, and the conductive structure 120b and the first conductive via structure 136 of the first build-up structure 130b are electrically Sexual connection.

Next, referring to FIG. 3C, a composite layer 110b of a non-conducting inorganic material and an organic material is formed on the first build-up structure 130a and coated with a conductive pillar (ie, the conductive structure 120b), wherein the composite layer of the non-conducting inorganic material and the organic material The first surface 112 and the second surface 114 opposite to each other 110b are respectively aligned with a third surface 122 and a fourth surface 124 of each conductive pillar (ie, the conductive structure 120b).

The material of the composite layer 110a of the non-conducting inorganic material and the organic material of the present embodiment is, for example, a composite material composed of a ceramic material and a polymer material. In the embodiment in which the ceramic material is a ceramic powder, vacuum impregnation can be applied. The technique infiltrates the polymer material into the ceramic powder to prepare a composite layer 110a of a non-conducting inorganic material and an organic material composed of a composite material composed of a ceramic powder and a polymer material. In the embodiment in which the polymer material is, for example, a photosensitive resin composition of an epoxy resin and a quinone imine resin, the non-conductive inorganic material and the organic material are irradiated by, for example, thermocompression or vacuum immersion, ultraviolet light, and heating. The composite layer 110a is disposed on the first build-up structure 130.

Next, referring to FIG. 3D, a second build-up structure 140b is formed on the composite layer 110b of the non-conducting inorganic material and the organic material, wherein the second build-up structure 140b is electrically connected to the first build-up structure 130b through the conductive structure 120b. Here, the second build-up structure 140b includes two second dielectric layers 142, two second patterned conductive layers 144, and a plurality of second conductive via structures 146 extending through the second dielectric layer 142. The second dielectric layer 142 and the second patterned conductive layer 144 are sequentially stacked on the composite layer 110b of the non-conducting inorganic material and the organic material, and the second patterned conductive layer 144 is transmitted through the second conductive via structure 146 and electrically conductive. The structure 120b is electrically connected.

Next, referring to FIG. 3E, a solder resist layer 150 is formed on the second build-up structure 140b, wherein the solder resist layer 150 exposes a portion of the second build-up structure 140b. That is, the solder resist layer 150 exposes a portion of the second patterned conductive layer 144 of the second build-up structure 140b.

Thereafter, referring to FIGS. 3E and 3F, a surface treatment layer 160 is formed on the second build-up structure 140a exposed by the solder resist layer 150. That is, the surface treatment layer 160 is formed on a portion of the second patterned conductive layer 144 of the second build-up structure 140b exposed by the solder resist layer 150. Finally, the support plate 10 and the temporary adhesive layer 20 are removed to expose the surface 131 of the first build-up structure 130b and the patterned wiring layer 30. So far, the production of the circuit board 100b has been completed.

3G is a cross-sectional view showing the circuit board of FIG. 3F carrying at least one wafer. Referring to FIG. 3F and FIG. 3G simultaneously, the circuit board 100b of FIG. 3F is adapted to carry at least one wafer (only two wafers 40, 50 are schematically illustrated in FIG. 3F), wherein the wafers 40, 50 are adapted to be configured in the first increase. The surface 131 of the layer structure 130b is electrically connected to the patterned wiring layer 30. Thereafter, the package structure 200b of FIG. 3G can be formed by a singulation process. Here, the wafers 40 and 50 are, for example, an application processor (AP) wafer, a wide I/O wafer, or a combination thereof, but are not limited thereto. (please ask the inventor to assist in confirming and supplementing)

Since the package structure 200b of the present embodiment is configured to dispose the wafers 40, 50 on the wiring board 100b having the composite layer 110b of a non-conducting inorganic material and an organic material, the 110b has a higher dielectric layer and packaging material than the general dielectric layer and the packaging material. Hardness. Therefore, the package structure 200b of the present embodiment can enhance the overall structural strength by transmitting the composite layer 110b of the non-conducting inorganic material and the organic material to prevent warpage of the carrier, thereby improving structural reliability.

4A-4D are cross-sectional views showing a partial step of a method of fabricating a circuit board according to another embodiment of the present invention. The manufacturing method of the circuit board of this embodiment is similar to the manufacturing method of the circuit board 100b described above, and the difference is that the composite layer 110c (refer to FIG. 4D) and the conductive structure 120c of the non-conducting inorganic material and the organic material are disposed (please Referring to Figure 4D), steps on the first build-up structure 130b.

In detail, first, referring to FIG. 4A, a composite layer 110 of a non-conducting inorganic material and an organic material is provided, wherein the composite layer 110 of the non-conducting inorganic material and the organic material has an upper surface 111 and a lower surface 113 opposite to each other. Next, referring to FIG. 4B, a plurality of blind vias 115 are formed on the upper surface 111 of the composite layer 110 of non-conducting inorganic material and organic material. Next, a plating seed layer 117 is formed on the upper surface 111 of the composite layer 110 of the non-conducting inorganic material and the organic material and on the pore walls of the blind holes 115.

Next, referring to FIG. 4C, a conductive material layer 120 is formed on the upper surface 111 of the composite layer 110 of non-conducting inorganic material and organic material and in the blind via 115 through the plating seed layer 117, wherein the conductive material 120 is completely filled with blindness. Hole 115. Thereafter, referring to FIG. 4D, a portion of the conductive material layer 120 and a portion of the non-conducting inorganic material and the organic material composite layer 110 are removed to form a thinned composite layer 110c of the non-conducting inorganic material and the organic material and the conductive structure 120c, wherein The conductive structure 120c may be a plurality of conductive pillars, and the first surface 112 and the second surface 114 of the non-conductor inorganic material and the composite layer 110c of the organic material are respectively opposite to the third surface of each conductive pillar (ie, the conductive structure 120c) 122 is aligned with the fourth surface 124. Finally, the composite layer 110c and the conductive structure 120c of the non-conducting inorganic material and the organic material are disposed on the first build-up structure 130b of FIG. 3A, and the circuit board can be completed by following the steps of FIG. 3D to FIG. 3F. .

In summary, since the circuit board of the present invention is provided with a build-up structure on the opposite surfaces of the composite layer of the non-conducting inorganic material and the organic material, the composite layer of the non-conducting inorganic material and the organic material can be regarded as A reinforcing layer having a higher hardness than a general dielectric layer and a packaging material. Therefore, the circuit board of the present invention can enhance the overall structural strength by the composite layer of the non-conducting inorganic material and the organic material to prevent the warpage of the carrier, thereby improving the process yield.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.

10‧‧‧Support board

20‧‧‧ Temporary adhesive layer

30‧‧‧ patterned circuit layer

40, 50‧‧‧ wafer

100a, 100b‧‧‧ circuit board

110, 110a, 110b, 110c‧‧‧Composite layers of non-conducting inorganic materials and organic materials

111‧‧‧Upper surface

112‧‧‧ first surface

113‧‧‧ lower surface

114‧‧‧ second surface

115‧‧‧Blind holes

116a, 116b‧‧‧ openings

117‧‧‧Electroplating seed layer

120‧‧‧ Conductive material layer

120a, 120b, 120c‧‧‧ conductive structure

122‧‧‧ third surface

124‧‧‧ fourth surface

125‧‧‧ pads

130a, 130b‧‧‧ first build-up structure

131‧‧‧ surface

132‧‧‧First dielectric layer

134‧‧‧First patterned conductive layer

136‧‧‧First conductive via structure

140a, 140b‧‧‧ second build-up structure

142‧‧‧Second dielectric layer

144‧‧‧Second patterned conductive layer

146‧‧‧Second conductive via structure

150‧‧‧ solder mask

160‧‧‧Surface treatment layer

200a, 200b‧‧‧ package structure

FIG. 1A is a cross-sectional view of a circuit board according to an embodiment of the invention. FIG. 1B is a cross-sectional view of a circuit board according to another embodiment of the present invention. 2A-2G are schematic cross-sectional views showing a method of fabricating a circuit board according to an embodiment of the invention. 2H is a schematic cross-sectional view showing the circuit board of FIG. 2G carrying at least one wafer. 3A-3F are schematic cross-sectional views showing a partial step of a method of fabricating a circuit board according to another embodiment of the present invention. 3G is a cross-sectional view showing the circuit board of FIG. 3F carrying at least one wafer. 4A-4D are cross-sectional views showing a partial step of a method of fabricating a circuit board according to another embodiment of the present invention.

Claims (10)

A circuit board comprising: a composite layer of a non-conducting inorganic material and an organic material, having a first surface and a second surface opposite to each other and a plurality of openings; a plurality of conductive structures respectively disposed on the non-conducting inorganic material and organic a plurality of openings in the composite layer of the material; a first build-up structure disposed on the first surface of the composite layer of the non-conducting inorganic material and the organic material, and electrically connected to the conductive structures; and a second The build-up structure is disposed on the second surface of the composite layer of the non-conducting inorganic material and the organic material, and is electrically connected to the conductive structures. The circuit board according to claim 1, wherein the material of the composite layer of the non-conducting inorganic material and the organic material comprises a composite material composed of a ceramic material and a polymer material. The circuit board of claim 2, wherein the ceramic material comprises zirconia, alumina, tantalum nitride, tantalum carbide, tantalum oxide or a combination thereof, and the polymer material comprises epoxy resin, poly Asia Indoleamine, liquid crystal polymer, methacrylate type resin, ethylene phenyl type resin, allyl type resin, polyacrylate type resin, polyether type resin, polyolefin type resin, polyamine type resin, polyfluorene oxide An alkane type resin or a combination of the foregoing. The circuit board according to claim 1, wherein the composite layer of the non-conducting inorganic material and the organic material is a layer of imitation pearl. The circuit board according to claim 1, wherein the composite layer of the non-conductive inorganic material and the organic material has a Young's modulus of between 20 GPa and 100 GPa. A method for manufacturing a circuit board, comprising: providing a support plate, wherein the support plate is provided with a temporary adhesive layer and a patterned circuit layer on the temporary adhesive layer; forming a first build-up structure for the temporary And electrically connected to the patterned circuit layer; and a composite layer of a non-conducting inorganic material and an organic material and a plurality of conductive structures on the first build-up structure, wherein the non-conductor inorganic material is combined with the organic material The layer is coated with the conductive structures, and the conductive structures are electrically connected to the first build-up structure; forming a second build-up structure on the composite layer of the non-conductive inorganic material and the organic material, wherein the second build-up layer The structure is electrically connected to the first build-up structure through the conductive structures; and the support plate and the temporary adhesive layer are removed to expose a surface of the first build-up structure and the patterned circuit layer. The method for fabricating a circuit board according to claim 6, wherein the material of the composite layer of the non-conducting inorganic material and the organic material comprises a composite material composed of a ceramic material and a polymer material. The method for fabricating a circuit board according to claim 7, wherein the ceramic material comprises zirconia, alumina, tantalum nitride, tantalum carbide, tantalum oxide or a combination thereof, and the polymer material comprises epoxy resin. , polymethyleneamine, liquid crystal polymer, methacrylate type resin, ethylene phenyl type resin, allyl type resin, polyacrylate type resin, polyether type resin, polyolefin type resin, polyamine type resin, Polyoxyalkylene type resin or a combination of the foregoing. The method for fabricating a circuit board according to claim 6, wherein the composite layer of the non-conducting inorganic material and the organic material is an imitation nacre. The method for fabricating a circuit board according to claim 6, wherein the composite layer of the non-conductive inorganic material and the organic material has a Young's modulus of between 20 GPa and 100 GPa.