TWI634953B - Glue dispensing device and glue dispensing method - Google Patents
Glue dispensing device and glue dispensing method Download PDFInfo
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- TWI634953B TWI634953B TW106110422A TW106110422A TWI634953B TW I634953 B TWI634953 B TW I634953B TW 106110422 A TW106110422 A TW 106110422A TW 106110422 A TW106110422 A TW 106110422A TW I634953 B TWI634953 B TW I634953B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
- B05C11/06—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface with a blast of gas or vapour
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Abstract
一種點膠裝置,使用在於點膠過程中鍵結強化與防止膠品溢流,其包括一擴散裝置及防止溢流裝置,該防止溢流裝置係在於一承載板上之基板上,於光學元件之周圍設置一孔穴或溝槽,限制膠品溢流。擴散裝置在於一承載板內設置一流道,並於基板與光學元件接觸之部位設置一小孔與該流道相通,當氣體通入流道內,將改變控制膠液流場變化,達到可以將膠品擴散與增加光學元件接觸長度,提升光學元件與基板點膠定位鍵結的強度,及確保點膠防止溢流與元件構裝製程品質良率。 A dispensing device used for bonding strengthening and preventing overflow of glue during the dispensing process. The device includes a diffusion device and an overflow preventing device. The overflow preventing device is located on a substrate on a carrier board and is on an optical element. Set a hole or groove around it to limit the overflow of the glue. The diffusion device is provided with a first-grade channel in a carrier plate, and a small hole is provided at the portion where the substrate and the optical element are in contact with the flow channel. When the gas passes into the flow channel, it will change and control the flow field of the glue solution, so that the glue can be transferred. Product diffusion and increase the contact length of the optical element, improve the strength of the optical component and the substrate dispensing positioning bond, and ensure the dispensing to prevent overflow and quality of the component assembly process.
Description
本揭露係關於一種點膠裝置及方法,使用在於點膠過程中鍵結強化與防止膠品溢流,其包括一擴散裝置及防止溢流裝置。 This disclosure relates to a dispensing device and method, which are used to strengthen bonds and prevent overflow of glue during the dispensing process. The disclosure includes a diffusion device and an overflow prevention device.
目前點膠製程中主要應用於在雷射源與光通訊元件構裝主動元件與被動元件產品。製程中常需借助影像視覺進行輔助對位,及使用點膠進行光學元件之間固著結合,雷射與光通訊元件構裝以邁向更微小化趨勢,因此精微固著微小元件之點膠製程,所需要解決的問題重點要關於構裝時點膠防止溢流與精微點膠固著鍵結強化防止偏移控制。 At present, the dispensing process is mainly used to construct active and passive components in laser sources and optical communication components. In the manufacturing process, it is often necessary to use image vision to assist in alignment and use glue to fix the optical components. Laser and optical communication components are constructed to move toward a more miniaturized trend. The problem that needs to be solved is to focus on the prevention of overflow during dispensing and the strengthening of micro-distribution to strengthen the prevention of offset control during assembly.
目前市面採用傳統點膠製程影響點膠定量精度的因素很多,包括流體粘度、流體温度、針筒內液体的高度和壓力、針尖內徑和長度、點膠機功能結構、點膠大小和形狀,所以必須透過程序控制與機械控制來提高點膠的定量精度與流速,使得此程序變得更加複雜,還是無法克服有限狹窄空間中進行相鄰元件點膠作業。常導致膠液擴散導致相鄰元件點膠溢流情況產生,嚴重引響點膠製程品質、元件定位性與光學耦合效率。 At present, there are many factors that affect the quantitative accuracy of dispensing in the traditional dispensing process on the market, including fluid viscosity, fluid temperature, height and pressure of the liquid in the syringe, the inner diameter and length of the tip, the functional structure of the dispenser, the size and shape of the dispenser, Therefore, it is necessary to improve the quantitative accuracy and flow rate of dispensing through program control and mechanical control, which makes this program more complicated, or it is impossible to overcome the problem of dispensing adjacent components in a limited and narrow space. Often caused by the dispersion of glue solution caused by the overflow of adjacent components, which seriously affects the quality of the dispensing process, component positioning and optical coupling efficiency.
因此,有鑑於前述各種等缺陷,使得現行導致效能不佳的問題,此實為本技術領域之人亟欲解決的技術課題。 Therefore, in view of the aforementioned various defects, which cause the current problem of poor performance, this is actually a technical problem that people in the technical field want to solve.
本揭露為一種點膠裝置,使用在於點膠過程中鍵結強化與防止膠品溢流。 This disclosure is a dispensing device, which is used to strengthen bonding and prevent overflow of glue during the dispensing process.
點膠裝置包括一擴散裝置及防止溢流裝置,該防止溢流裝置係在於一承載板上之基板上,於光學元件之周圍設置一孔穴或溝槽,限制膠品溢流。 The dispensing device includes a diffusion device and an overflow prevention device. The overflow prevention device is located on a substrate on a carrier board, and a hole or groove is set around the optical element to limit the overflow of the glue product.
擴散裝置在於一承載板內設置一流道,並於基板與光學元件接觸之部位設置一小孔與該流道相通,當氣體通入流道內,將改變控制膠液流場變化,達到可以將膠品擴散與增加光學元件接觸長度,提升光學元件與基板點膠定位鍵結的強度,及防止溢流裝置可確保點膠防止溢流,並提高元件構裝製程品質良率。 The diffusion device is provided with a first-grade channel in a carrier plate, and a small hole is provided at the portion where the substrate and the optical element are in contact with the flow channel. When the gas passes into the flow channel, it will change and control the flow field of the glue solution, so that Product diffusion and increase the contact length of optical components, improve the strength of the optical component and the substrate positioning positioning bond, and the overflow prevention device can ensure the dispensing to prevent overflow, and improve the yield rate of component assembly process quality.
應用於二極體幫浦雷射源上之實施例,二極體雷射源之光束透過三組光學元件反射,使得雷射光點坐落在耦合範圍內;其中光學元件固化於承載板上之擴散裝置及防止溢流裝置,與上述陳述相同。 An embodiment applied to a diode pump laser source. The beam of the diode laser source is reflected through three sets of optical elements, so that the laser light point is located within the coupling range. The diffusion of the optical elements on the carrier plate is solidified. The device and anti-overflow device are the same as those stated above.
由於影響點膠定量精度的因素很多,包括黏膠粘度、流體温度、針筒內液体的高度和壓力、針尖內徑和長度、點膠機功能結構、點膠大小和形狀,所以必須透過程序控制與機械控制來提高點膠的定量精度與流速。所以依點膠製程不同條件,採用八種不相同之孔穴或溝槽。分別搭配一層與多層次變化幾何孔穴或溝槽,八種不相同之孔穴或溝槽,可以是圓形、多重圓形、多重橢圓形、橢圓形、方形、多重方形、矩形、多重矩形、三角形、多重三角形等幾何形狀均可適用。 There are many factors that affect the accuracy of dispensing, including the viscosity of the adhesive, the temperature of the fluid, the height and pressure of the liquid in the syringe, the inner diameter and length of the needle tip, the functional structure of the dispenser, and the size and shape of the dispensing, so it must be controlled by a program. And mechanical control to improve the quantitative accuracy and flow rate of dispensing. Therefore, according to different conditions of the dispensing process, eight different holes or grooves are used. One layer and multiple levels of varying geometric holes or grooves, respectively. The eight different holes or grooves can be circular, multiple circles, multiple ovals, ovals, squares, multiple squares, rectangles, multiple rectangles, triangles. Geometric shapes such as multiple triangles are applicable.
一種點膠方法,包括1.先進行將黏膠點膠至橫向流道之 上端,即承載板之小孔上;2.放置光學元件,如玻璃鏡片於黏膠上方處,保留一間隙;3.通入氣流於橫向流道,再通入直向流道。 A method of dispensing, including: 1. first performing adhesive dispensing to a lateral flow channel The upper end, that is, the small hole of the carrier board; 2. Place the optical components, such as glass lenses, above the adhesive, leaving a gap; 3. Pass the airflow to the lateral flow channel, and then the straight flow channel.
以上關於本發明內容的說明及以下實施方式的說明係用以示範與解釋本發明的原理,並且提供本發明的專利申請範圍更進一步的解釋。 The above description of the content of the present invention and the description of the following embodiments are used to demonstrate and explain the principle of the present invention, and provide further explanation of the scope of the patent application of the present invention.
A‧‧‧點膠裝置 A‧‧‧ Dispensing Device
B‧‧‧擴散裝置 B‧‧‧ Diffusion device
C‧‧‧防止溢流裝置 C‧‧‧ Overflow prevention device
D‧‧‧治具 D‧‧‧Jig
D1‧‧‧間隙 D1‧‧‧ Clearance
1‧‧‧承載板 1‧‧‧ load plate
10‧‧‧上端面 10‧‧‧ upper face
11‧‧‧側面 11‧‧‧ side
12‧‧‧入口 12‧‧‧ entrance
13‧‧‧孔穴或溝槽 13‧‧‧hole or groove
14‧‧‧小孔 14‧‧‧ small hole
15‧‧‧十字記號 15‧‧‧ cross
21‧‧‧光學元件 21‧‧‧optical element
22‧‧‧黏膠 22‧‧‧ Adhesive
31‧‧‧橫向流道 31‧‧‧cross runner
32‧‧‧直向流道 32‧‧‧Straight Runner
51‧‧‧承載板 51‧‧‧bearing plate
61‧‧‧承載板 61‧‧‧bearing plate
62‧‧‧基板 62‧‧‧ substrate
63‧‧‧二極體雷射源 63‧‧‧diode laser source
63a‧‧‧二極體固定螺絲 63a‧‧‧Diode fixing screw
64‧‧‧隔板 64‧‧‧ bulkhead
65‧‧‧聚焦鏡 65‧‧‧ focusing lens
66‧‧‧負極電源孔 66‧‧‧Negative power hole
66a‧‧‧正極電源孔 66a‧‧‧Positive power hole
67‧‧‧固定孔 67‧‧‧Fixing holes
71‧‧‧圓形溝槽 71‧‧‧ round groove
72‧‧‧多重圓形溝槽 72‧‧‧Multiple circular grooves
73‧‧‧橢圓形溝槽 73‧‧‧oval groove
74‧‧‧多重橢圓形溝槽 74‧‧‧Multi-oval groove
75‧‧‧正方形溝槽 75‧‧‧square groove
76‧‧‧多重正方形溝槽 76‧‧‧Multiple square grooves
77‧‧‧矩形溝槽 77‧‧‧ rectangular groove
78‧‧‧多重矩形溝槽 78‧‧‧Multiple rectangular grooves
81‧‧‧基板 81‧‧‧ substrate
82‧‧‧通孔 82‧‧‧through hole
83‧‧‧出口 83‧‧‧Export
84,85‧‧‧固定孔 84, 85‧‧‧ fixing holes
圖1為本揭露的擴散裝置及防止溢流裝置;圖2為本揭露的光學元件與承載板固著示意圖;圖3為本揭露的擴散裝置支流道放大示意圖;圖4-1至圖4-4為本揭露的點膠過程示意圖;圖5-1與圖5-2為習知未設置本揭露擴散裝置的點膠過程示意圖;圖6為本揭露二極體幫浦示意圖;圖7為本揭露八種孔穴或溝槽示意圖。 FIG. 1 is a diffusion device and an overflow prevention device of the disclosure; FIG. 2 is a schematic view of fixing an optical element and a carrier plate of the disclosure; FIG. 3 is an enlarged schematic view of a branch channel of the diffusion device of the disclosure; 4 is a schematic diagram of the dispensing process of the disclosure; Figures 5-1 and 5-2 are conventional schematic diagrams of the dispensing process without the disclosure of the diffusion device; Figure 6 is a schematic diagram of the diode pump; Figure 7 is Reveal eight kinds of holes or grooves.
圖8-1與圖8-2為本揭露分離式點膠裝置示意圖。 FIG. 8-1 and FIG. 8-2 are schematic diagrams of the separated dispensing device of the present disclosure.
以下係藉由特定的實施例說明本揭露之實施方式,熟悉此技術之人士可由本說明書所揭示之內容輕易地瞭解本揭露之其他特點與功效。本揭露亦可藉由其他不同的具體實施例加以施行或應用。 The following is a description of the implementation of the present disclosure through specific examples. Those skilled in the art can easily understand other features and effects of the present disclosure from the content disclosed in this description. This disclosure can also be implemented or applied by other different specific embodiments.
本揭露目的是要創造一種點膠裝置A,使得在於點膠過程中鍵結強化與防止膠品溢流。如圖1至圖3所示,點膠裝置A包括一擴散裝置B及防止溢流裝置C,該防止溢流裝置C設置在一承載板1之上 端面10,於放置光學元件21之周圍處設置至少一孔穴或溝槽13,限制黏膠22溢流。黏膠22可使用AB膠或UV膠,該兩種黏膠22為快速將非金屬與金屬膠合。擴散裝置B設置在一承載板1內部,並設置一橫向流道31及至少一直向流道32,該直向流道32分別與橫向流道31連通,橫向流道31之氣體入口12設置在承載板1之側面11,至少一直向流道32貫穿該承載板1,十字記號15為放置光學元件21之中心位置,並於承載板1上與光學元件21接觸之部位設置至少一小孔14與該至少一直向流道32相通,當氣體由該橫向流道31入口12流入,並再分別流入直向流道32內時,將改變控制黏膠22流場變化,達到可以將黏膠22擴散與增加光學元件接觸長度,提升光學元件21與承載板1點膠定位鍵結的強度,及防止溢流裝置C確保黏膠22防止溢流,並提高元件構裝製程品質良率。 The purpose of this disclosure is to create a dispensing device A, so as to strengthen the bonding and prevent the overflow of the glue during the dispensing process. As shown in FIGS. 1 to 3, the dispensing device A includes a diffusion device B and an overflow prevention device C. The overflow prevention device C is disposed on a carrier plate 1. The end surface 10 is provided with at least one hole or groove 13 around the optical element 21 to limit the overflow of the adhesive 22. Adhesive 22 can use AB glue or UV glue. These two kinds of glue 22 are used to quickly glue non-metal and metal. The diffusion device B is disposed inside a carrier plate 1 and is provided with a lateral flow path 31 and at least a straight flow path 32. The straight flow path 32 communicates with the lateral flow path 31, respectively. The gas inlet 12 of the lateral flow path 31 is provided at The side surface 11 of the carrier plate 1 runs through the carrier plate 1 at least to the flow channel 32. The cross mark 15 is the center position where the optical element 21 is placed, and at least one small hole 14 is provided on the carrier plate 1 in contact with the optical element 21 It is in communication with the at least straight flow channel 32. When the gas flows in from the inlet 12 of the lateral flow channel 31 and then flows into the straight flow channel 32, the flow field of the viscose 22 will be changed and controlled, so that the viscose 22 can be changed. Diffusion and increase the contact length of the optical element, improve the strength of the adhesive positioning bond between the optical element 21 and the carrier plate 1, and the overflow prevention device C ensures that the adhesive 22 prevents overflow, and improves the quality yield of the component assembly process.
如圖4-1至圖4-4所示,為一採用點膠擴散與防止溢流方法之示意圖,圖4-1為先進行將黏膠22點膠至橫向流道31之上端,即承載板1之小孔14上,圖4-2為放置光學元件21,如玻璃鏡片於黏膠22上方處,保留一間隙D1,圖4-3為通入氣流於橫向流道31,再通入直向流道32後,如圖4-4氣流會由黏膠22底部與光學元件21中形成氣流來改變控制黏膠22流場變化,達到可以將黏膠擴散與增加光學元件21接觸長度,以增加點膠鍵結強度,放置光學元件21之周圍處設置至少一孔穴或溝槽13來限制黏膠22溢流。 As shown in Figure 4-1 to Figure 4-4, it is a schematic diagram of the method of dispensing dispersion and preventing overflow. Figure 4-1 is the first step of dispensing the adhesive 22 to the upper end of the lateral flow channel 31, that is, the load. On the small hole 14 of the plate 1, FIG. 4-2 is for placing the optical element 21, such as a glass lens above the adhesive 22, leaving a gap D1, and FIG. 4-3 is for the airflow to the lateral flow channel 31, and then to the After going straight to the flow channel 32, as shown in Figure 4-4, the airflow will form an airflow from the bottom of the adhesive 22 and the optical element 21 to change and control the flow field of the adhesive 22, so that the adhesive can be diffused and the contact length of the optical element 21 can be increased. In order to increase the bonding strength of the glue, at least one hole or groove 13 is placed around the optical element 21 to limit the overflow of the adhesive 22.
如圖5-1與圖5-2為習知未設置本揭露擴散裝置的點膠過程方法示意圖;圖5-1為先進行將黏膠22點膠至承載板51上,圖5-2 為置放光學元件21,如玻璃鏡片於黏膠22上方處,保留一間隙D1,無法達到可以將黏膠擴散與增加光學元件接觸長度,以增加點膠鍵結強度。 Figure 5-1 and Figure 5-2 are schematic diagrams of the conventional dispensing process without the disclosed diffusion device; Figure 5-1 is the first step of dispensing adhesive 22 onto the carrier plate 51, and Figure 5-2 In order to place the optical element 21, if a glass lens is placed above the adhesive 22, a gap D1 is reserved. It is not possible to diffuse the adhesive and increase the contact length of the optical element to increase the bonding strength of the glue.
如圖6為應用於二極體幫浦雷射源上之實施例,二極體雷射源63之光束透過三組光學元件21反射,63a二極體固定螺絲固定二極體雷射源63,使得雷射光點坐落在耦合範圍內;其中光學元件21固化於承載板61上,該擴散裝置B及防止溢流裝置C,與上述第1至3圖所陳述相同,該光學元件21固化於基板62上,基板62與承載板61可一體成形,因基板62與光學元件21相接觸固化黏結,故基板62須精密研磨,隔板64上設置聚焦鏡65,負極電源孔66及66a正極電源孔,固定孔67為承載板61之固定孔。 Figure 6 shows an example applied to a diode pump laser source. The light beam of the diode laser source 63 is reflected through three groups of optical elements 21, and the 63a diode fixing screw fixes the diode laser source 63. So that the laser light point is located within the coupling range; wherein the optical element 21 is cured on the carrier plate 61, the diffusion device B and the overflow prevention device C are the same as stated in the above FIGS. 1 to 3, the optical element 21 is cured on On the substrate 62, the substrate 62 and the carrier plate 61 can be integrally formed. Because the substrate 62 and the optical element 21 are in contact with each other to be solidified and bonded, the substrate 62 must be precisely ground. A focusing lens 65 is provided on the separator 64, and a negative power hole 66 and a 66a positive power supply The hole and the fixing hole 67 are fixing holes of the carrier plate 61.
圖7為本揭露八種孔穴或溝槽之示意圖,搭配一層與多層次變化幾何孔穴或溝槽,此方式可以是圓形、多重圓形、多重橢圓形、橢圓形、方形、多重方形、矩形、多重矩形、三角形、多重三角形等幾何形狀均可適用。分別顯示如圓形溝槽71,多重圓形溝槽72,橢圓形溝槽73,多重橢圓形溝槽74,正方形溝槽75,多重正方形溝槽76,矩形溝槽77,多重矩形溝槽78,其他形狀如三角形亦在本專利範圍內。 FIG. 7 is a schematic diagram of eight types of holes or grooves, with one layer and multiple layers of varying geometric holes or grooves. This method can be circular, multiple circles, multiple ovals, ovals, squares, multiple squares, or rectangles. , Multiple rectangles, triangles, multiple triangles and other geometric shapes are applicable. Shows such as circular groove 71, multiple circular groove 72, oval groove 73, multiple oval groove 74, square groove 75, multiple square groove 76, rectangular groove 77, multiple rectangular groove 78 Other shapes such as triangles are also within the scope of this patent.
非金屬與金屬之黏結在定量點膠製程中,其最基本的要求是在整個點膠製程中保持黏膠、流速和點膠效果一致。由於影響點膠定量精度的因素很多,包括黏膠粘度、流體温度、針筒內液体的高度和壓力、針尖內徑和長度、點膠機功能結構、點膠大小和形狀,所以必須透過程序控制與機械控制來提高點膠的定量精度與流速。所以依點膠製程 不同條件,採用上述八種不相同之孔穴或溝槽,以控制點膠之品質。 The adhesion of non-metals and metals in the quantitative dispensing process, the most basic requirement is to maintain the same viscosity, flow rate and dispensing effect throughout the entire dispensing process. There are many factors that affect the accuracy of dispensing, including the viscosity of the adhesive, the temperature of the fluid, the height and pressure of the liquid in the syringe, the inner diameter and length of the needle tip, the functional structure of the dispenser, and the size and shape of the dispensing, so it must be controlled by a program. And mechanical control to improve the quantitative accuracy and flow rate of dispensing. So according to the dispensing process Under different conditions, the above eight different holes or grooves are used to control the quality of dispensing.
圖8-1與圖8-2為一種分離式點膠裝置,可將上述點膠裝置A之擴散裝置B及防止溢流裝置C分離設置,其中擴散裝置B設置於一治具D內,擴散裝置B包括一橫向流道31及直向流道32,與上述圖3所述相同。另外一件基板81上設置一防止溢流裝置C,該溢流裝置C包括至少一孔穴或溝槽13,並於孔穴或溝槽13內設置至少一通孔82,與直向流道32上端之出口83相貫通,並使用螺柱通過基板81上之固定孔85與治具D上之固定孔84,將基板81固定於該治具D上,然後於光學元件21固化於基板81上後,再將基板81與該治具D分離。 Figure 8-1 and Figure 8-2 show a separate dispensing device. The diffusion device B and the overflow prevention device C of the above-mentioned dispensing device A can be separated. The diffusion device B is set in a fixture D and diffuses. The device B includes a lateral flow path 31 and a straight flow path 32, which are the same as those described in FIG. 3 above. Another substrate 81 is provided with an overflow preventing device C. The overflow device C includes at least one hole or groove 13, and at least one through hole 82 is provided in the hole or groove 13. The outlet 83 passes through and uses a stud to pass through the fixing hole 85 on the substrate 81 and the fixing hole 84 on the jig D to fix the substrate 81 on the jig D. After the optical element 21 is cured on the substrate 81, The substrate 81 is then separated from the jig D.
本揭露採用點膠鍵結強化與防止溢流與未用點膠鍵結強化與防止溢流於X軸向之點膠鍵結推力約3倍,本揭露Y軸向之點膠鍵結推力亦較大,因此有顯助點膠鍵結強化效果,如下表所示,故證明本揭露具有新穎性及進部性。 This disclosure uses glue bonding to strengthen and prevent overflow and unused glue bonding to strengthen and prevent overflow in the X-axis. The bond strength of the glue bond is about 3 times. Larger, so it has the effect of strengthening the bonding of the glue, as shown in the following table, which proves that the disclosure is novel and advanced.
上述實施例僅例示性說明本揭露之原理及其功效,而非用於限制本揭露。任何熟習此項技藝之人士均可在不違背本揭露之精神及範疇下,對上述實施例進行修飾與改變。因此,本揭露之權利保護範圍, 應如後述之申請專利範圍所列。 The above-mentioned embodiments only exemplify the principle and effect of the present disclosure, and are not intended to limit the present disclosure. Anyone familiar with this technique can modify and change the above embodiments without departing from the spirit and scope of this disclosure. Therefore, the scope of protection of the rights in this disclosure, It should be listed in the scope of patent application mentioned later.
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