TWI632242B - Iridium-platinum alloy and machined article made thereof - Google Patents

Iridium-platinum alloy and machined article made thereof Download PDF

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TWI632242B
TWI632242B TW106106993A TW106106993A TWI632242B TW I632242 B TWI632242 B TW I632242B TW 106106993 A TW106106993 A TW 106106993A TW 106106993 A TW106106993 A TW 106106993A TW I632242 B TWI632242 B TW I632242B
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iridium
platinum alloy
less
platinum
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TW201732045A (en
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馬丁 許洛特
德克 梅爾
凡瑞納 瓦德
妮可 史道特
安妮特 盧卡斯
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赫瑞斯德國有限兩合公司
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    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C5/00Alloys based on noble metals
    • C22C5/04Alloys based on a platinum group metal
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/14Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of noble metals or alloys based thereon

Abstract

本發明係關於一種銥鉑合金,其含有呈70wt%或更小之量的鉑,剩餘部分為銥及不可避免的雜質,且平均顆粒寬度與高度比為至少5。 The present invention relates to an iridium-platinum alloy that contains platinum in an amount of 70 wt% or less, the remainder is iridium and unavoidable impurities, and the average particle width to height ratio is at least 5.

Description

銥鉑合金及其製造之加工物件 Iridium platinum alloy and its processed articles

本發明係關於一種銥鉑合金及其製造之加工物件。 The invention relates to an iridium-platinum alloy and a processed object manufactured by the same.

銥為鉑族金屬。其硬度及熔點極高。此外,銥為密度第二大的元素(在鋨之後)及最耐腐蝕金屬中之一者。歸因於此等屬性,銥及含銥合金為受數個應用關注之材料,諸如紡絲頭、火花塞、擺輪及珠寶。 Iridium is a platinum group metal. Its hardness and melting point are extremely high. In addition, iridium is one of the second most dense elements (after rhenium) and the most corrosion-resistant metal. Due to these attributes, iridium and iridium-containing alloys are materials of interest for several applications, such as spinning heads, spark plugs, balance wheels, and jewelry.

WO 2011/034566描述一種由含有至少75wt%銥之金屬製成的珠寶物品。 WO 2011/034566 describes a jewellery article made of a metal containing at least 75 wt% iridium.

US 2005/0129960 A1描述一種包含1至10原子%之Zr及/或Hf的合金組合物,其餘為銥;及由該合金組合物塗佈之物件。 US 2005/0129960 A1 describes an alloy composition containing 1 to 10 atomic% of Zr and / or Hf, the balance being iridium; and an article coated with the alloy composition.

EP 2 281 905 A1描述一種銥類金屬組合物,其不含Zr及Hf且包含0.5至30wt-ppm硼及0.5至20wt-ppm鈣。 EP 2 281 905 A1 describes an iridium-based metal composition that does not contain Zr and Hf and contains 0.5 to 30 wt-ppm boron and 0.5 to 20 wt-ppm calcium.

CN 101483319 A描述一種銥鉑合金及其作為火花塞電極材料之用途。 CN 101483319 A describes an iridium platinum alloy and its use as a spark plug electrode material.

US 2006/0270924 A1描述一種用於醫學應用之電極,其包含由多孔Pt-Ir合金塗佈之基體。 US 2006/0270924 A1 describes an electrode for medical applications comprising a substrate coated with a porous Pt-Ir alloy.

然而,因為銥之硬度、脆性及高熔點,銥極難以加工、成形 或鍛製。 However, because of its hardness, brittleness and high melting point, iridium is extremely difficult to process and shape. Or forged.

可藉由添加鉑從而獲得鉑銥合金來降低熔點。然而,詳言之,在此等合金為銥類(Ir含量多於50wt%)的情況下,其仍然為極脆性且硬性的材料,且因此仍然極難以加工。 The melting point can be reduced by adding platinum to obtain a platinum-iridium alloy. In detail, however, in the case where these alloys are iridium-based (Ir content is more than 50 wt%), they are still extremely brittle and hard materials, and therefore still extremely difficult to process.

若藉由加工(諸如碾磨)而自由極硬性且脆性的材料製成之模製本體製備塑形物件,則物件典型地展示表面疵點。詳言之,沿著在加工過程期間產生的邊緣,材料可能會折斷。然而,對於許多應用,具有此等表面疵點(例如,邊緣疵點)之經加工物件不可接受。 If shaped articles are made by processing (such as milling) from a molded body made of extremely hard and brittle materials, the articles typically exhibit surface defects. In detail, the material may break along the edges created during the machining process. However, for many applications, processed objects with such surface defects (eg, edge defects) are not acceptable.

本發明之目標為提供一種含銥合金,其具有改良之可鍛製性且適合於藉由加工而製備塑形物件。若塑形物件之結構含有邊緣,則應使沿著此等邊緣之疵點的數目及大小(例如,歸因於折斷之材料)保持儘可能低。 The object of the present invention is to provide an iridium-containing alloy which has improved forgeability and is suitable for preparing shaped articles by processing. If the structure of the shaped object contains edges, the number and size of defects along these edges (for example, due to broken materials) should be kept as low as possible.

該目標係由銥鉑合金解決,該銥鉑合金含有呈70wt%或更小之量的鉑,剩餘部分為銥及不可避免的雜質,且平均顆粒寬度與高度比為至少5。 This goal is solved by an iridium-platinum alloy, which contains 70% by weight or less of platinum, the remainder is iridium and unavoidable impurities, and the average particle width to height ratio is at least 5.

圖1展示經蝕刻顯微切片之光學影像。 Figure 1 shows an optical image of an etched microsection.

圖2展示經蝕刻顯微切片之光學影像。 Figure 2 shows an optical image of an etched microsection.

顆粒之形狀可由顆粒寬度與高度比指示。若寬度與高度比接 近於1,則顆粒具有相對「圓形」形狀,而遠高於1之寬度與高度比指示細長顆粒形狀。換言之,縱橫比愈高,顆粒愈細長。典型地,若材料已經受再結晶處理,則其含有大量等軸顆粒或甚至可由此等顆粒(亦即,寬度與高度比接近於1之顆粒)組成。 The shape of the particles can be indicated by the ratio of particle width to height. If the width and height are connected Close to 1, the particles have a relatively "round" shape, while a width to height ratio much higher than 1 indicates an elongated particle shape. In other words, the higher the aspect ratio, the more slender the particles. Typically, if a material has been subjected to a recrystallization process, it contains a large number of equiaxed particles or can even be composed of such particles (ie, particles with a width to height ratio close to 1).

在本發明中,已出人意料地實現可將模製本體(其由具有細長顆粒以使得平均顆粒寬度與高度比為至少5之銥鉑合金製成)加工成具有減少數目個表面疵點的物件。詳言之,邊緣疵點之數目及大小可明顯減少。 In the present invention, it has been unexpectedly achieved that a molded body (made of an iridium platinum alloy having elongated particles such that the average particle width to height ratio is at least 5) can be processed into an article having a reduced number of surface defects. In detail, the number and size of edge defects can be significantly reduced.

較佳地,平均顆粒寬度與高度比為至少8,更佳地為至少10。在一較佳具體實例中,平均顆粒寬度與高度比係在自5至25、更佳地自8至20、甚至更佳地自10至16之範圍內。 Preferably, the average particle width to height ratio is at least 8, more preferably at least 10. In a preferred embodiment, the average particle width to height ratio is in the range from 5 to 25, more preferably from 8 to 20, even more preferably from 10 to 16.

較佳地,銥鉑合金含有呈50wt%或更小、更佳地為45wt%或更小之量的鉑。在一較佳具體實例中,銥鉑合金含有呈自70wt%至25wt%、更佳地自50wt%至25wt%、甚至更佳地45wt%至25wt%之量的鉑。 Preferably, the iridium platinum alloy contains platinum in an amount of 50 wt% or less, more preferably 45 wt% or less. In a preferred embodiment, the iridium-platinum alloy contains platinum in an amount of from 70% to 25% by weight, more preferably from 50% to 25% by weight, and even more preferably from 45% to 25% by weight.

如上文所指示,合金由銥、鉑及不可避免的雜質組成。藉由將具有高純度(例如,純度為至少99.9%,更佳地為至少99.99%)之銥及具有高純度(例如,純度為至少99.9%,更佳地為至少99.99%)之鉑用作起始材料,可使最終Ir-Pt合金中之不可避免的雜質之量保持在極低含量。較佳地,銥鉑合金含有小於200wt-ppm之銠。更佳地,銥鉑合金含有小於200wt-ppm之銠、小於150wt-ppm之銅、小於100wt-ppm之鈣、小於50wt-ppm之硼及小於100wt-ppm之鐵。 As indicated above, the alloy consists of iridium, platinum, and unavoidable impurities. By using iridium with high purity (for example, at least 99.9% purity, more preferably at least 99.99%) and platinum with high purity (for example, at least 99.9% purity, more preferably at least 99.99%) as The starting material can keep the amount of inevitable impurities in the final Ir-Pt alloy to a very low content. Preferably, the iridium-platinum alloy contains less than 200 wt-ppm of rhodium. More preferably, the iridium-platinum alloy contains less than 200 wt-ppm rhodium, less than 150 wt-ppm copper, less than 100 wt-ppm calcium, less than 50 wt-ppm boron, and less than 100 wt-ppm iron.

較佳地,銥鉑合金每μm2的孔之平均數目小於0.04,更佳地 小於0.03。 Preferably, the average number of pores per μm 2 of the iridium-platinum alloy is less than 0.04, and more preferably less than 0.03.

較佳地,銥鉑合金之硬度為500HV1或更小,更佳地為480HV1或更小。 Preferably, the hardness of the iridium platinum alloy is 500 HV1 or less, and more preferably 480 HV1 or less.

如下文將進一步詳細論述,較佳地藉由其中使Ir-Pt澆鑄本體經受諸如輥壓或鍛造之一或多個成形步驟的方法而製備本發明之銥鉑合金。因此,較佳的是,銥鉑合金為成形銥鉑合金,詳言之,輥壓式或鍛造式銥鉑合金。成形銥鉑合金可為圓盤或板。然而,其他形狀亦有可能。 As will be discussed in further detail below, the iridium platinum alloy of the present invention is preferably prepared by a method in which the Ir-Pt cast body is subjected to one or more forming steps such as rolling or forging. Therefore, it is preferable that the iridium-platinum alloy is a shaped iridium-platinum alloy, in particular, a rolled or forged iridium-platinum alloy. The shaped iridium-platinum alloy can be a disc or a plate. However, other shapes are possible.

此外,本發明係關於一種用於製備銥鉑合金之方法,該方法包含 (i)自由銥、鉑及不可避免的雜質組成之銥鉑熔體製備澆鑄本體, (ii)預加熱澆鑄本體且使經預加熱澆鑄本體經受一或多個成形步驟,使得經成形銥鉑合金之再結晶度小於30%。 In addition, the present invention relates to a method for preparing an iridium-platinum alloy, the method comprising (i) preparing a casting body of an iridium-platinum melt composed of free iridium, platinum and unavoidable impurities, (ii) Pre-heating the cast body and subjecting the pre-heated cast body to one or more forming steps such that the recrystallization degree of the formed iridium-platinum alloy is less than 30%.

典型地,澆鑄步驟(i)包括在鍋爐(例如,感應鍋爐)中使銥及鉑金屬熔融,以便製備銥鉑熔體且接著將熔體澆鑄至模具中。熔體由銥及鉑以及不可避免的雜質組成。較佳地,銥鉑熔體含有呈70wt%或更小、更佳地為50wt%或更小、甚至更佳地為45wt%或更小之量的鉑。在一較佳具體實例中,銥鉑熔體含有呈自70wt%至25wt%、更佳地自50wt%至25wt%、甚至更佳地45wt%至25wt%之量的鉑。 Typically, the casting step (i) includes melting iridium and platinum metal in a boiler (eg, an induction boiler) to prepare an iridium platinum melt and then casting the melt into a mold. The melt consists of iridium and platinum and unavoidable impurities. Preferably, the iridium platinum melt contains platinum in an amount of 70 wt% or less, more preferably 50 wt% or less, even more preferably 45 wt% or less. In a preferred embodiment, the iridium platinum melt contains platinum in an amount of from 70% to 25% by weight, more preferably from 50% to 25% by weight, and even more preferably from 45% to 25% by weight.

視情況,冷卻(例如,水冷)模具。可為較佳的是,模具係由具有高熱導率(例如,在20℃下為至少200W/(m*K)或為至少300W/(m*K))之材料組成,諸如銅。較佳模具為(例如)水冷式銅模具。 Optionally, cool (eg, water-cool) the mold. It may be preferable that the mold is composed of a material having high thermal conductivity (for example, at least 200 W / (m * K) or at least 300 W / (m * K) at 20 ° C), such as copper. A preferred mold is, for example, a water-cooled copper mold.

如熟習此項技術者已知,可藉由在再結晶溫度以上進行熱處 理(靜態再結晶)而實現再結晶,視情況與成形(例如,輥壓)處理(動態再結晶)組合。通常,熟習此項技術者已知影響再結晶溫度之參數。再結晶度尤其取決於處理溫度(亦即,高於或低於再結晶溫度)及處理之持續時間。 As known to those skilled in the art, heat treatment can be carried out above the recrystallization temperature. Recrystallization (static recrystallization) to achieve recrystallization, as appropriate, combined with forming (for example, rolling) treatment (dynamic recrystallization). Generally, those skilled in the art are aware of parameters that affect the recrystallization temperature. The degree of recrystallization depends especially on the processing temperature (ie, above or below the recrystallization temperature) and the duration of the processing.

在本發明之方法中,預加熱及後續成形(例如,輥壓)步驟係在使得最終獲得之成形(例如,輥壓)銥鉑合金的再結晶度小於30%的條件下進行。如下文進一步解釋,再結晶度指示由經再結晶等軸顆粒覆蓋之顯微切片的相對面積(以%為單位)。 In the method of the present invention, the pre-heating and subsequent forming (for example, rolling) steps are performed under conditions such that the degree of recrystallization of the finally obtained (for example, rolling) iridium-platinum alloy is less than 30%. As explained further below, the degree of recrystallization indicates the relative area (in%) of microsections covered by recrystallized isometric particles.

基於公共常識,熟習此項技術者可識別確保最終獲得之成形(例如,輥壓)銥鉑合金的再結晶度小於30%的步驟(ii)之適當處理條件。僅作為一實例,澆鑄本體之成形(例如,輥壓)可在足夠低以便使再結晶保持在極低程度上或甚至低於再結晶溫度之溫度下進行。原則上,亦有可能的是,一或多個成形步驟至少部分地在高於再結晶溫度之成形溫度下進行,但使在高於再結晶溫度之溫度下的此等成形步驟之持續時間保持足夠短以便避免任何實質性再結晶。 Based on common sense, those skilled in the art can identify appropriate processing conditions for step (ii) to ensure that the resulting formed (eg, rolled) iridium-platinum alloy has a recrystallization degree of less than 30%. By way of example only, the shaping of the casting body (e.g., rolling) may be performed at a temperature low enough to keep recrystallization to a very low level or even below the recrystallization temperature. In principle, it is also possible that one or more forming steps are performed at least partly at a forming temperature above the recrystallization temperature, but the duration of these forming steps at a temperature above the recrystallization temperature is maintained Short enough to avoid any substantial recrystallization.

在一較佳具體實例中,成形銥鉑合金之再結晶度小於20%,更佳地小於10%,甚至更佳地小於5%。 In a preferred embodiment, the recrystallization degree of the formed iridium-platinum alloy is less than 20%, more preferably less than 10%, even more preferably less than 5%.

較佳地,至少最終成形步驟係在低於銥鉑合金之再結晶溫度Tr-c的成形溫度Tf下進行。更佳地,每一成形步驟係在低於銥鉑合金之再結晶溫度的成形溫度下進行。替代地,亦有可能的是,除最終成形步驟之外的一或多個成形步驟係在高於再結晶溫度之成形溫度下進行,但使此等成形步驟之持續時間保持足夠短以便避免任何實質性再結晶。如熟習此項技 術者已知,再結晶溫度為在可在商業上實現之時間內完成再結晶的溫度(典型地為1小時)。 Preferably, at least the final forming step is performed at a forming temperature T f which is lower than the recrystallization temperature T rc of the iridium-platinum alloy. More preferably, each forming step is performed at a forming temperature lower than the recrystallization temperature of the iridium platinum alloy. Alternatively, it is also possible that one or more forming steps other than the final forming step are performed at a forming temperature higher than the recrystallization temperature, but the duration of these forming steps is kept short enough to avoid any Substantial recrystallization. As known to those skilled in the art, the recrystallization temperature is the temperature (typically 1 hour) at which recrystallization can be accomplished within a commercially achievable time.

在一較佳具體實例中,Tf為至少300℃,更佳地為至少400℃,甚至更佳地為至少500℃,但低於銥鉑合金之再結晶溫度Tr-cIn a preferred embodiment, T f is at least 300 ° C., more preferably at least 400 ° C., and even more preferably at least 500 ° C., but lower than the recrystallization temperature T rc of the iridium-platinum alloy.

較佳地,在低於銥鉑合金之再結晶溫度Tr-c的溫度Tp-h下預加熱澆鑄本體。在一較佳具體實例中,Tp-h為至少300℃,更佳地為至少400℃,甚至更佳地為至少500℃,但低於銥鉑合金之再結晶溫度Tr-c。在Tp-h下之加熱時間可在廣泛範圍內變化。在Tp-h下對澆鑄本體預加熱可進行(例如)5至120分鐘或10至90分鐘。 Preferably, the casting body is pre-heated at a temperature T ph lower than the recrystallization temperature T rc of the iridium-platinum alloy. In a preferred embodiment, T ph is at least 300 ° C, more preferably at least 400 ° C, and even more preferably at least 500 ° C, but lower than the recrystallization temperature T rc of the iridium-platinum alloy. The heating time at T ph can vary over a wide range. Pre-heating the casting body at T ph may be performed, for example, for 5 to 120 minutes or 10 to 90 minutes.

熟習此項技術者已知適當成形方法。較佳地,步驟(ii)之成形為輥壓、鍛造或兩者之組合。 Those skilled in the art know suitable forming methods. Preferably, the forming of step (ii) is rolling, forging or a combination of the two.

較佳地,步驟(ii)包含二或多個成形步驟,例如,6至30個成形步驟,更佳地10至26個成形步驟。 Preferably, step (ii) comprises two or more forming steps, for example, 6 to 30 forming steps, more preferably 10 to 26 forming steps.

較佳地,每一成形步驟係在小於4.0s-1,更佳地小於3.0s-1之成形速率下及/或小於10.0%,更佳地小於8.0%之成形度下進行。 Preferably, each forming step is performed at a forming rate of less than 4.0 s -1 , more preferably less than 3.0 s -1 , and / or a forming degree of less than 10.0%, more preferably less than 8.0%.

如熟習此項技術者已知,可藉由下式判定成形速率 As known to those skilled in the art, the forming rate can be determined by the following formula

其中n為捲筒之旋轉速度,H0為在輥壓步驟之前的樣本厚度,r'=r/100;r:樣本厚度在輥壓步驟期間之減少, R為捲筒半徑。 Where n is the rotation speed of the roll, H 0 is the thickness of the sample before the rolling step, r '= r / 100; r: the decrease in the thickness of the sample during the rolling step, and R is the roll radius.

成形度對應於由成形處理引起之樣本厚度(以%為單位)的減少。 The degree of forming corresponds to a reduction in the thickness (in%) of the sample caused by the forming process.

總成形度可為至少(例如)50%,更佳地為至少65%。 The overall formability may be at least 50%, for example, and more preferably at least 65%.

若步驟(ii)包含二或多個成形步驟,則可為較佳的是,在此等成形步驟中之至少一者之後對澆鑄本體再加熱,以便避免銥鉑合金在成形(例如,輥壓)處理期間冷卻過多。典型地,為了在二個成形步驟中間進行再加熱,將銥鉑合金自成形(例如,輥壓)裝置轉移至烘箱,在烘箱中再加熱至如上文所解釋較佳地低於銥鉑合金之再結晶溫度的溫度,且接著再轉移至成形裝置以便繼續成形處理。再加熱時間可在廣泛範圍內變化。澆鑄本體之再加熱可進行(例如)0.5分鐘至20分鐘或1分鐘至10分鐘。取決於澆鑄本體之大小,再加熱可在成形步驟之至少50%之後進行,更佳地在除最終成形步驟之外的每一成形步驟之後。 If step (ii) includes two or more forming steps, it may be preferable to reheat the casting body after at least one of these forming steps in order to prevent the iridium-platinum alloy from forming (e.g., rolling) ) Excessive cooling during processing. Typically, for reheating in the middle of the two forming steps, the iridium platinum alloy is transferred from the forming (e.g., rolling) device to an oven and reheated in an oven to a temperature that is preferably lower than that of the iridium platinum alloy as explained above The temperature of the recrystallization temperature, and then transferred to the forming apparatus in order to continue the forming process. The reheating time can vary over a wide range. The reheating of the casting body may be performed, for example, for 0.5 minutes to 20 minutes or 1 minute to 10 minutes. Depending on the size of the casting body, reheating may be performed after at least 50% of the forming step, and more preferably after each forming step except the final forming step.

在一較佳具體實例中,由銥、鉑及不可避免的雜質組成之銥鉑熔體含有呈自70wt%至25wt%、更佳地自50wt%至25wt%、甚至更佳地45wt%至25wt%之量的鉑;將澆鑄本體預加熱至自500℃至小於1350℃、更佳地自800℃至小於1300℃、甚至更佳地自1000℃至小於1250℃之溫度Tp-h;且一或多個成形步驟係在自500℃至小於1350℃、更佳地自800℃至小於1300℃、甚至更佳地自1000℃至小於1250℃之溫度Tf下進行。 In a preferred embodiment, the iridium platinum melt consisting of iridium, platinum, and unavoidable impurities contains from 70% to 25% by weight, more preferably from 50% to 25% by weight, and even more preferably from 45% to 25% by weight. Amount of platinum; pre-heat the casting body to a temperature T ph from 500 ° C to less than 1350 ° C, more preferably from 800 ° C to less than 1300 ° C, even more preferably from 1000 ° C to less than 1250 ° C; and one or The multiple forming steps are performed at a temperature T f from 500 ° C to less than 1350 ° C, more preferably from 800 ° C to less than 1300 ° C, and even more preferably from 1000 ° C to less than 1250 ° C.

較佳地,藉由本發明之方法製備的銥鉑合金對應於上文所描述之銥鉑合金(亦即,平均顆粒寬度與高度比為至少5)。因此,較佳的是,銥鉑合金含有呈70wt%或更小之量的鉑,剩餘部分為銥及不可避免的雜 質,且平均顆粒寬度與高度比為至少5。關於銥鉑合金之其他較佳屬性,可參考上文所提供之陳述。 Preferably, the iridium platinum alloy prepared by the method of the present invention corresponds to the iridium platinum alloy described above (ie, the average particle width to height ratio is at least 5). Therefore, it is preferable that the iridium-platinum alloy contains platinum in an amount of 70% by weight or less, and the remainder is iridium and inevitable impurities. Quality, and the average particle width to height ratio is at least 5. For other preferred properties of the iridium-platinum alloy, reference may be made to the statements provided above.

此外,本發明係關於一種含有銥鉑合金且具有為至少21.4g/cm3之密度的加工物件。 In addition, the present invention relates to a processed article containing an iridium-platinum alloy and having a density of at least 21.4 g / cm 3 .

較佳地,加工物件為擺輪或時鐘機構之任何其他零件或組件。其亦可為珠寶零件。 Preferably, the processed object is any other part or component of a balance wheel or a clock mechanism. It may also be a jewelry part.

擺輪用於時鐘中,且有時亦被稱作轉子。典型地,擺輪或轉子為自由地旋轉之半圓形圓盤,其中時鐘之指針的每一移動自動地使主彈簧捲繞。其自身重量使其返回至豎直位置。 The balance wheel is used in clocks and is sometimes called a rotor. Typically, the balance wheel or rotor is a semi-circular disc that rotates freely, with each movement of the hands of the clock automatically winding the main spring. Its own weight returns it to an upright position.

較佳地,加工物件之銥鉑合金由銥、鉑及不可避免的雜質組成。 Preferably, the iridium-platinum alloy of the processed object is composed of iridium, platinum, and unavoidable impurities.

較佳地,加工物件(詳言之,擺輪)之密度為至少21.6g/cm3,更佳地為至少21.8g/cm3Preferably, the density of the processed object (more specifically, the balance wheel) is at least 21.6 g / cm 3 , and more preferably at least 21.8 g / cm 3 .

較佳地,擺輪之至少70wt%、更佳地至少80wt%、甚至更佳地至少90wt%係由銥鉑合金組成。最佳地,擺輪由銥鉑合金組成。 Preferably, at least 70 wt%, more preferably at least 80 wt%, even more preferably at least 90 wt% of the balance wheel is composed of an iridium-platinum alloy. Optimally, the balance wheel is composed of an iridium-platinum alloy.

較佳地,銥鉑合金由銥、鉑及不可避免的雜質組成,且含有不大於50wt%之鉑,更佳地不大於45wt%之鉑。在一較佳具體實例中,擺輪之銥鉑合金含有呈自50wt%至0,01wt%、更佳地自45wt%至5wt%、甚至更佳地45wt%至15wt%或自45wt%至25wt%之量的鉑。 Preferably, the iridium-platinum alloy is composed of iridium, platinum, and unavoidable impurities, and contains not more than 50% by weight of platinum, more preferably not more than 45% by weight of platinum. In a preferred embodiment, the iridium-platinum alloy of the balance contains from 50 wt% to 0.011 wt%, more preferably from 45 wt% to 5 wt%, even more preferably from 45 wt% to 15 wt%, or from 45 wt% to 25 wt. % Of platinum.

較佳地,擺輪之銥鉑合金對應於上文所描述之銥鉑合金(亦即,平均顆粒寬度與高度比為至少5)。因此,較佳的是,銥鉑合金含有呈70wt%或更小之量的鉑,剩餘部分為銥及不可避免的雜質,且平均顆粒寬 度與高度比為至少5。關於銥鉑合金之其他較佳屬性,可參考上文所提供之陳述。 Preferably, the iridium-platinum alloy of the balance wheel corresponds to the iridium-platinum alloy described above (ie, the average particle width to height ratio is at least 5). Therefore, it is preferable that the iridium-platinum alloy contains platinum in an amount of 70 wt% or less, and the remainder is iridium and unavoidable impurities, and the average particle width is The degree to height ratio is at least 5. For other preferred properties of the iridium-platinum alloy, reference may be made to the statements provided above.

此外,本發明係關於一種用於製備加工物件之方法,該方法包含 - 藉由上文所描述之方法而製備銥鉑合金, - 加工銥鉑合金。 In addition, the present invention relates to a method for preparing a processed article, the method comprising -The preparation of iridium-platinum alloy by the method described above, -Machining iridium platinum alloy.

較佳地,加工物件為擺輪。典型地,加工包括碾磨。另外或替代地,加工可包括鑽孔、車削或其他通常已知的加工步驟。 Preferably, the processed object is a balance wheel. Typically, processing includes milling. Additionally or alternatively, machining may include drilling, turning, or other commonly known machining steps.

此外,本發明係關於一種包含上文所描述之擺輪的時鐘。 Further, the present invention relates to a clock including the balance wheel described above.

此外,本發明係關於上文所描述之銥鉑合金用於製備加工物件(詳言之,擺輪)的用途。 In addition, the present invention relates to the use of the iridium-platinum alloy described above for preparing a processed object (more specifically, a balance wheel).

量測方法Measurement method

如下判定在本發明中參考之參數: The parameters referenced in the present invention are determined as follows:

顯微切片之製備以供微觀結構分析 Preparation of microsections for microstructural analysis

垂直於輥壓表面且在(亦即,平行於)輥壓方向上截取顯微切片。在真空下將材料嵌入至環氧樹脂中。研磨且拋光待分析之表面。對於研磨,在八個研磨步驟(120、320、500、800、1200、1500、2400及4000)中在200rpm下使用Struers之濕式研磨機Labo-Pol-25。用精細度高達1μm(鑽石拋光糊)的Struers之裝置LaboPol-5(250rpm)來進行拋光。隨後,用20% KCN來電解蝕刻樣本。 Microsections were taken perpendicular to the rolling surface and in (ie, parallel to) the rolling direction. The material was embedded into the epoxy under vacuum. Grind and polish the surface to be analyzed. For grinding, Struers' wet grinder Labo-Pol-25 was used in eight grinding steps (120, 320, 500, 800, 1200, 1500, 2400, and 4000) at 200 rpm. LaboPol-5 (250 rpm) by Struers with a fineness of up to 1 μm (diamond polishing paste) was used for polishing. Subsequently, the samples were electrolytically etched with 20% KCN.

平均顆粒寬度與高度比 Average particle width to height ratio

如下判定樣本之顆粒寬度與顆粒高度的平均比: 如上文已經提及,若輥壓樣本,則垂直於經輥壓樣本表面且平行於輥壓方向截取顯微切片。若在樣本表面上進行輥壓步驟且輥壓方向變化,則在最終輥壓步驟之輥壓方向上製備顯微切片。在顯微切片上選擇至少二個子區段,每一子區段含有至少40個顆粒。對於每一顆粒,使用具有比例尺之光顯微鏡(Olympus PMG3)來判定其寬度(亦即,其在輥壓方向上之最大尺寸)及其高度(亦即,其垂直於輥壓方向之最大尺寸)。對於每一顆粒,判定顆粒寬度與顆粒高度之比。最終,根據個別顆粒之比值,將平均顆粒寬度與高度比判定為算術平均值。 The average ratio of particle width to particle height of the sample is determined as follows: As already mentioned above, if the sample is rolled, the microsection is taken perpendicular to the surface of the rolled sample and parallel to the rolling direction. If a rolling step is performed on the sample surface and the rolling direction is changed, a microsection is prepared in the rolling direction of the final rolling step. Select at least two subsections on the microsection, each subsection containing at least 40 particles. For each particle, a light microscope (Olympus PMG3) with a scale is used to determine its width (i.e., its maximum dimension in the rolling direction) and its height (i.e., its maximum dimension perpendicular to the rolling direction) . For each particle, the ratio of particle width to particle height is determined. Finally, based on the ratio of individual particles, the average particle width to height ratio is determined as the arithmetic average.

平均再結晶度 Average recrystallization

如上文所描述製備顯微切片,亦即,垂直於經輥壓樣本表面且在輥壓方向上。在顯微切片上選擇至少二個子區段,每一子區段含有至少40個顆粒。對於每一子區段,判定由再結晶(亦即,等軸)顆粒覆蓋之相對面積(以%為單位)。可經由影像分析軟體判定由再結晶顆粒覆蓋之相對面積。將顆粒寬度與高度比為0.75至1.25之彼等顆粒視為再結晶顆粒。最終,根據子區段之值,將平均再結晶度判定為算術平均值。 Microsections were prepared as described above, that is, perpendicular to the surface of the rolled sample and in the rolling direction. Select at least two subsections on the microsection, each subsection containing at least 40 particles. For each sub-segment, the relative area (in%) covered by the recrystallized (ie, isometric) particles is determined. The relative area covered by the recrystallized particles can be determined via image analysis software. Those particles having a particle width to height ratio of 0.75 to 1.25 are considered as recrystallized particles. Finally, based on the value of the sub-segment, the average recrystallization degree is determined as the arithmetic mean.

每μm2孔之數目 Number of 2 holes per μm

在使用光顯微鏡(放大率為500x)的情況下,對在50x50μm2之區域上的孔之數目計數且接著將其轉換成每1μm2孔之數目。總體上,針對顯微切片上之10個不同區域進行此操作,且將孔之平均數目計算為算術平均值。 In the case of using a light microscope (500x magnification), the number of holes on a region of 50x50 μm 2 was counted and then converted to the number of 2 holes per 1 μm. In general, this operation is performed for 10 different areas on the microsection, and the average number of holes is calculated as an arithmetic mean.

密度 density

經由浮力根據阿基米德原理來判定密度。用梅特勒托萊多 (Mettler Toledo)之天平SB23001 DeltaRange量測樣本重量。接著,判定樣本在水中之重量。藉由對濕式樣本稱重而判定被吸收之水的量。為了計算樣本密度,假定水在22.5℃下之密度為0.99791g/cm3。如下計算密度:密度(g/cm3)=0.99791(g/cm3)x(SWdry/(SWwet-SWwater)) Density is determined via buoyancy according to Archimedes' principle. The weight of the sample was measured with a Mettler Toledo balance SB23001 DeltaRange. Next, determine the weight of the sample in water. Determine the amount of water absorbed by weighing the wet sample. To calculate the sample density, it is assumed that the density of water at 22.5 ° C is 0.99791 g / cm 3 . Calculate the density as follows: density (g / cm 3 ) = 0.99791 (g / cm 3 ) x (SW dry / (SW wet -SW water ))

其中SWdry為乾燥樣本之重量(以g為單位),SWwet為濕式樣本之重量(以g為單位),SWwater為樣本在水中之重量。 SW dry is the weight of the dry sample (in g), SW wet is the weight of the wet sample (in g), and SW water is the weight of the sample in water.

硬度 hardness

使用裝置Zwick Roell ZHμ在HV1之載重下判定經研磨樣本之硬度。 The hardness of the ground sample was determined using a device Zwick Roell ZHμ under a load of HV1.

雜質之量 Amount of impurities

藉由使用Horiba-Jobin-Yvon之裝置GD Profiler HR的輝光放電燈(glow discharge lamp;GDL)來判定雜質之量。藉由濺鍍實現樣本激發,且獲得發射光譜。藉由比較發射譜線之強度與經校準標準,判定在ppm範圍中的雜質之量。 The amount of impurities was determined by using a glow discharge lamp (GDL) of the GD Profiler HR device of Horiba-Jobin-Yvon. Excitation of the sample is achieved by sputtering and an emission spectrum is obtained. The amount of impurities in the ppm range was determined by comparing the intensity of the emission line with a calibrated standard.

實施例Examples

在以下實施例中,製備在平均顆粒寬度與高度比方面不同之銥鉑合金。從此等Ir-Pt合金,藉由碾磨製備擺輪,且在其邊緣處檢測此等經加工物件的疵點。 In the following examples, iridium-platinum alloys having different average particle width to height ratios were prepared. From these Ir-Pt alloys, a balance wheel is prepared by grinding, and defects of these processed objects are detected at the edges thereof.

發明實施例1(IE1):Ir-Pt合金,Pt含量:40wt% Invention Example 1 (IE1): Ir-Pt alloy, Pt content: 40wt%

在使用ZrO2坩堝之感應鍋爐中在2200℃下在氬氣下將用於 獲得Pt含量為40wt%之Ir-Pt合金的適當量之銥(3N純度)及鉑(3N純度)熔融。將銥鉑熔體澆鑄至水冷式銅模具中。在凝固後,獲得銥鉑澆鑄本體。將澆鑄本體自模具移除,且藉由碾磨移除其表面上之澆鑄皺痕。 A suitable amount of iridium (3N purity) and platinum (3N purity) for obtaining an Ir-Pt alloy with a Pt content of 40 wt% was melted under an argon at 2200 ° C in an induction boiler using a ZrO 2 crucible. The iridium platinum melt was cast into a water-cooled copper mold. After solidification, an iridium platinum cast body was obtained. The casting body is removed from the mold, and the casting wrinkles on its surface are removed by grinding.

在空氣氣氛下在烘箱中在1200℃下對澆鑄本體預加熱30分鐘。接著,使經預加熱澆鑄本體經受19個輥壓步驟。在每一輥壓步驟之後,除了最終輥壓步驟之外,將澆鑄本體自輥壓機轉移至烘箱,在1200℃之溫度下再加熱約5分鐘,且接著再轉移至輥壓機以供進行下一輥壓步驟。 The casting body was pre-heated in an oven at 1200 ° C for 30 minutes in an air atmosphere. Next, the pre-heated cast body was subjected to 19 rolling steps. After each rolling step, in addition to the final rolling step, the casting body is transferred from the rolling press to an oven, heated at a temperature of 1200 ° C for about 5 minutes, and then transferred to the rolling press for further processing. Next rolling step.

下文在表1中列舉澆鑄本體在輥壓處理之前且在每一輥壓步驟之後的厚度以及厚度減少(以mm為單位且以%為單位),及每一輥壓步驟之成形速率。 The thickness of the casting body before the rolling process and after each rolling step, as well as the thickness reduction (in mm and%), and the forming rate of each rolling step are listed in Table 1 below.

如熟習此項技術者已知,可藉由以下公式判定成形速率 As known to those skilled in the art, the forming rate can be determined by the following formula

其中n為捲筒之旋轉速度,H0為在輥壓步驟之前的樣本厚度, r'=r/100;r:樣本厚度在輥壓步驟期間之減少,R為捲筒半徑。 Where n is the rotation speed of the roll, H 0 is the thickness of the sample before the rolling step, r '= r / 100; r: the decrease in the thickness of the sample during the rolling step, and R is the radius of the roll.

捲筒之旋轉速度為22rpm,且捲筒半徑為155mm。 The rotation speed of the roll is 22 rpm, and the roll radius is 155 mm.

在最終輥壓步驟之後,獲得220x50x3mm之板。垂直於經輥壓樣本表面,製備經蝕刻顯微切片。圖1中展示該經蝕刻顯微切片之光學影像。 After the final rolling step, a board of 220x50x3mm was obtained. An etched microsection was prepared perpendicular to the surface of the rolled sample. An optical image of the etched microsection is shown in FIG. 1.

Ir/Pt40合金之平均顆粒寬度與高度比為12.5。孔之數目為每μm2 0.01。孔大小值遠低於5μm。再結晶度極低(遠低於30%)。 The average particle width to height ratio of the Ir / Pt40 alloy is 12.5. The number of holes is 0.01 per μm 2 . The pore size values are well below 5 μm. The degree of recrystallization is extremely low (well below 30%).

雜質係以低量存在:Rh<200wt-ppm,Cu<150wt-ppm,Ca<100wt-ppm,B<50wt-ppm,Fe<100ppm。 Impurities are present in low amounts: Rh <200wt-ppm, Cu <150wt-ppm, Ca <100wt-ppm, B <50wt-ppm, and Fe <100ppm.

樣本硬度為475HV1且密度為22.0g/cm3The sample had a hardness of 475 HV1 and a density of 22.0 g / cm 3 .

藉由碾磨將由Ir/Pt40合金組成之澆鑄本體加工成平衡輪。針對大小>10μm之疵點檢測經碾磨物件之邊緣。然而,未偵測到疵點。 The cast body composed of Ir / Pt40 alloy was processed into a balance wheel by milling. Detect edges of milled objects for defects> 10μm. However, no defects were detected.

比較實施例1(CE1):Ir-Pt合金,Pt含量:40wt% Comparative Example 1 (CE1): Ir-Pt alloy, Pt content: 40wt%

在使用ZrO2坩堝之感應鍋爐中在2200℃下在氬氣下將用於獲得Pt含量為40wt%之Ir-Pt合金的適當量之銥(3N純度)及鉑(3N純度)熔融。將銥鉑熔體澆鑄至水冷式銅模具中。在凝固後,就獲得銥鉑澆鑄本體。將澆鑄本體自模具移除,且藉由碾磨移除其表面上之澆鑄皺痕。 A suitable amount of iridium (3N purity) and platinum (3N purity) for obtaining an Ir-Pt alloy with a Pt content of 40 wt% was melted under an argon at 2200 ° C in an induction boiler using a ZrO 2 crucible. The iridium platinum melt was cast into a water-cooled copper mold. After solidification, an iridium-platinum casting body was obtained. The casting body is removed from the mold, and the casting wrinkles on its surface are removed by grinding.

在空氣氣氛下在烘箱中在1400℃下對澆鑄本體加熱30分鐘。接著,使經加熱澆鑄本體經受19個輥壓步驟。在每一輥壓步驟之後,除了最終輥壓步驟之外,在1400℃之溫度下對澆鑄本體再加熱約4分鐘。除較高溫度之外,輥壓條件與發明實施例1之輥壓條件相同。因此,澆鑄 本體在輥壓處理之前且在每一輥壓步驟之後的厚度以及厚度減少(以mm為單位且以%為單位)及每一輥壓步驟之成形速率對應於上文在表1中所列舉的彼等者。 The cast body was heated in an oven at 1400 ° C. for 30 minutes in an air atmosphere. Next, the heated cast body was subjected to 19 rolling steps. After each rolling step, in addition to the final rolling step, the casting body was heated at a temperature of 1400 ° C for about 4 minutes. Except for the higher temperature, the rolling conditions are the same as the rolling conditions of Inventive Example 1. So cast The thickness of the body before the rolling process and after each rolling step, and the thickness reduction (in mm and%) and the forming rate of each rolling step correspond to those listed in Table 1 above They.

在最終輥壓步驟之後,獲得220x50x3mm之板。垂直於經輥壓樣本表面,製備經蝕刻顯微切片。圖2中展示該經蝕刻顯微切片之光學影像。 After the final rolling step, a board of 220x50x3mm was obtained. An etched microsection was prepared perpendicular to the surface of the rolled sample. An optical image of the etched microsection is shown in FIG. 2.

CE1之Ir/Pt40合金為寬度與高度比接近於1之顆粒與寬度與高度比高達5之稍細長顆粒的混合物。因此,平均顆粒寬度與高度比遠低於5。孔之數目為每μm2 0.05。偵測到大於30%之相當大的再結晶度。 CE1's Ir / Pt40 alloy is a mixture of particles with a width to height ratio close to 1 and slightly elongated particles with a width to height ratio of up to 5. Therefore, the average particle width to height ratio is much lower than 5. The number of holes was 0.05 per μm 2 . A considerable degree of recrystallization greater than 30% was detected.

相似於發明實施例1,雜質係以低量存在:Rh<200wt-ppm,Cu<150wt-ppm,Ca<100wt-ppm,B<50wt-ppm,Fe<100ppm。 Similar to Invention Example 1, impurities are present in low amounts: Rh <200wt-ppm, Cu <150wt-ppm, Ca <100wt-ppm, B <50wt-ppm, and Fe <100ppm.

CE1之樣本硬度為485HV1,且密度為22.0g/cm3The sample of CE1 has a hardness of 485HV1 and a density of 22.0g / cm 3 .

在與如用於發明實施例1中之加工條件相同的加工條件下,藉由碾磨而將由CE1之Ir/Pt40合金製成的澆鑄本體加工成平衡輪。檢測經碾磨物件之邊緣的大小>10μm之疵點。偵測到相當大數目個此等較大大小之位於邊緣的疵點。 Under the same processing conditions as those used in Invention Example 1, the cast body made of the Ir / Pt40 alloy of CE1 was processed into a balance wheel by milling. Detect defects where the size of the edge of the milled object is> 10 μm. A considerable number of such larger-sized edge defects are detected.

在表2中概述發明實施例1及比較實施例1之結果。 Table 2 summarizes the results of Inventive Example 1 and Comparative Example 1.

如實施例所示範,可將由具有細長顆粒之銥鉑合金製成的模製本體加工成具有減少數目個表面疵點的物件。詳言之,邊緣疵點之數目及大小可明顯減少。 As demonstrated in the examples, a molded body made of an iridium-platinum alloy with elongated particles can be processed into an article having a reduced number of surface defects. In detail, the number and size of edge defects can be significantly reduced.

Claims (31)

一種銥鉑合金,其含有呈70wt%或更小之量的鉑,剩餘部分為銥及不可避免的雜質,且平均顆粒寬度與高度比為至少5。An iridium-platinum alloy containing platinum in an amount of 70% by weight or less, the balance of which is iridium and unavoidable impurities, and the average particle width to height ratio is at least 5. 如申請專利範圍第1項之銥鉑合金,其中該平均顆粒寬度與高度比係在自5至25之範圍內;及/或該銥鉑合金含有呈自70wt%至25wt%之量的鉑。For example, the iridium-platinum alloy according to item 1 of the patent application range, wherein the average particle width to height ratio is in a range from 5 to 25; and / or the iridium-platinum alloy contains platinum in an amount from 70 to 25% by weight. 如申請專利範圍第2項之銥鉑合金,其中該平均顆粒寬度與高度比係在自8至20之範圍內。For example, the iridium-platinum alloy according to item 2 of the patent application range, wherein the average particle width to height ratio is in the range from 8 to 20. 如申請專利範圍第2項之銥鉑合金,其中該平均顆粒寬度與高度比係在自10至16之範圍內。For example, the iridium-platinum alloy in item 2 of the patent application range, wherein the average particle width to height ratio is in the range from 10 to 16. 如申請專利範圍第2項之銥鉑合金,其中該銥鉑合金含有呈自50wt%至25wt%之量的鉑。For example, the iridium-platinum alloy according to item 2 of the patent application range, wherein the iridium-platinum alloy contains platinum in an amount ranging from 50% by weight to 25% by weight. 如申請專利範圍第2項之銥鉑合金,其中該銥鉑合金含有呈自45wt%至25wt%之量的鉑。For example, the iridium-platinum alloy according to item 2 of the patent application range, wherein the iridium-platinum alloy contains platinum in an amount of from 45% to 25% by weight. 如申請專利範圍第1項至第6項中任一項之銥鉑合金,每μm2孔之平均數目小於0.04;及/或硬度為500HV1或更小。For example, the iridium-platinum alloy according to any one of the items 1 to 6 of the patent application range, the average number of holes per μm 2 is less than 0.04; and / or the hardness is 500 HV1 or less. 如申請專利範圍第7項之銥鉑合金,每μm2孔之平均數目小於0.04;及/或硬度為480HV1或更小。For example, the iridium-platinum alloy according to item 7 of the scope of patent application, the average number of pores per μm 2 is less than 0.04; and / or the hardness is 480HV1 or less. 如申請專利範圍第1項至第6項中任一項之銥鉑合金,其含有小於200wt-ppm之銠、小於150wt-ppm之銅、小於100wt-ppm之鈣、小於50wt-ppm之硼及小於100wt-ppm之鐵。For example, the iridium-platinum alloy in any one of the items 1 to 6 of the patent application scope contains less than 200wt-ppm rhodium, less than 150wt-ppm copper, less than 100wt-ppm calcium, less than 50wt-ppm boron, and Fe less than 100 wt-ppm. 如申請專利範圍第1項至第6項中任一項之銥鉑合金,其為輥壓式或鍛造式銥鉑合金。For example, the iridium-platinum alloy according to any one of claims 1 to 6 of the patent application scope is a rolled or forged iridium-platinum alloy. 如申請專利範圍第10項之銥鉑合金,其為輥壓式或鍛造式銥鉑合金,具有圓盤或板之形狀。For example, the iridium-platinum alloy of item 10 of the scope of patent application is a rolled or forged iridium-platinum alloy with the shape of a disc or a plate. 一種用於製備如申請專利範圍第1項至第11項中任一項之銥鉑合金之方法,其包含(i)自由銥、鉑及不可避免的雜質組成之銥鉑熔體製備澆鑄本體,(ii)預加熱該澆鑄本體且使該經預加熱澆鑄本體經受一或多個成形步驟,使得該經成形銥鉑合金之再結晶度小於30%。A method for preparing an iridium-platinum alloy according to any one of claims 1 to 11 of the scope of patent application, which comprises (i) an iridium-platinum melt composed of free iridium, platinum and unavoidable impurities to prepare a casting body, (ii) Pre-heating the casting body and subjecting the pre-heating casting body to one or more forming steps such that the recrystallization degree of the shaped iridium-platinum alloy is less than 30%. 如申請專利範圍第12項之方法,其中至少最終成形步驟係在低於再結晶溫度之成形溫度Tf下進行;及/或其中該澆鑄本體之預加熱係在低於該再結晶溫度之溫度Tp-h下進行。For example, the method of claim 12 wherein at least the final forming step is performed at a forming temperature T f below the recrystallization temperature; and / or wherein the pre-heating of the casting body is at a temperature below the recrystallization temperature Performed at T ph . 如申請專利範圍第12項或第13項之方法,其中將該澆鑄本體預加熱至自500℃至小於1350℃之溫度Tp-h;且該一或多個成形步驟係在自500℃至小於1350℃之溫度Tf下進行。For example, the method of claim 12 or 13, wherein the casting body is preheated to a temperature T ph from 500 ° C to less than 1350 ° C; and the one or more forming steps are performed from 500 ° C to less than 1350 It is carried out at a temperature T f of ° C. 如申請專利範圍第14項之方法,其中將該澆鑄本體預加熱至自800℃至小於1300℃之溫度Tp-hFor example, the method of claim 14 in which the casting body is pre-heated to a temperature T ph from 800 ° C to less than 1300 ° C. 如申請專利範圍第14項之方法,其中將該澆鑄本體預加熱至自1000℃至小於1250℃之溫度Tp-hFor example, the method according to item 14 of the patent application range, wherein the casting body is preheated to a temperature T ph from 1000 ° C to less than 1250 ° C. 如申請專利範圍第14項之方法,其中將該一或多個成形步驟係在自800℃至小於1300℃之溫度Tf下進行。For example, the method of claim 14 in the patent application range, wherein the one or more forming steps are performed at a temperature T f from 800 ° C to less than 1300 ° C. 如申請專利範圍第14項之方法,其中該一或多個成形步驟係在自1000℃至小於1250℃之溫度Tf下進行。For example, the method of claim 14 in the patent application range, wherein the one or more forming steps are performed at a temperature T f from 1000 ° C to less than 1250 ° C. 如申請專利範圍第12項或第13項之方法,其中步驟(ii)之成形為輥壓或鍛造或其組合;及/或步驟(ii)包含二或多個成形步驟。For example, the method of claim 12 or 13, wherein the forming of step (ii) is rolling or forging or a combination thereof; and / or step (ii) includes two or more forming steps. 如申請專利範圍第19項之方法,其中該步驟(ii)包含6至30個成形步驟。For example, the method of claim 19, wherein step (ii) includes 6 to 30 forming steps. 如申請專利範圍第12項或第13項之方法,其中每一成形步驟係在小於4.0s-11之成形速率下及/或小於10.0%之成形度下進行。For example, the method of claim 12 or 13, in which each forming step is performed at a forming rate of less than 4.0s -11 and / or a forming degree of less than 10.0%. 如申請專利範圍第21項之方法,其中每一成形步驟係在小於3.0s-1之成形速率下進行。For example, the method of claim 21 in the patent scope, wherein each forming step is performed at a forming rate of less than 3.0s -1 . 如申請專利範圍第21項之方法,其中每一成形步驟係在小於8.0%之成形度下進行。For example, the method of claim 21 in the patent scope, wherein each forming step is performed at a forming degree of less than 8.0%. 一種加工物件,其含有如申請專利範圍第1項至第11項中任一項之銥鉑合金且具有為至少21.4g/cm3之密度。A processed article containing the iridium-platinum alloy according to any one of claims 1 to 11 and having a density of at least 21.4 g / cm 3 . 如申請專利範圍第24項之加工物件,其為擺輪。For example, the processed article under the scope of patent application No. 24 is a balance wheel. 如申請專利範圍第24項或第25項之加工物件,其中該加工物件之至少80wt%係由該銥鉑合金製成;及/或該銥鉑合金由銥、鉑及不可避免的雜質組成且含有不大於50wt%之鉑。For example, if a processed object is applied for item 24 or 25 of the patent scope, at least 80% by weight of the processed object is made of the iridium platinum alloy; and / or the iridium platinum alloy is composed of iridium, platinum, and unavoidable impurities and Contains no more than 50% by weight of platinum. 如申請專利範圍第26項之加工物件,其中該加工物件之至少90wt%係由該銥鉑合金製成。For example, at least 90% by weight of the processed article of the scope of patent application is made of the iridium platinum alloy. 如申請專利範圍第26項之加工物件,其中該銥鉑合金由銥、鉑及不可避免的雜質組成且含有不大於45wt%之鉑。For example, the processed article under the scope of application for patent No. 26, wherein the iridium-platinum alloy is composed of iridium, platinum, and unavoidable impurities, and contains not more than 45% by weight of platinum. 如申請專利範圍第24項或第25項之加工物件,其中該銥鉑合金為如申請專利範圍第1項至第11項中任一項之銥鉑合金。For example, the processed article of the scope of patent application No. 24 or 25, wherein the iridium-platinum alloy is the iridium-platinum alloy according to any one of the scope of patent application No. 1 to 11. 一種用於製備加工物件之方法,其包含藉由如申請專利範圍第12項至第23項中任一項之方法而製備銥鉑合金,使該銥鉑合金經受加工。A method for preparing a processed article, comprising subjecting the iridium-platinum alloy to processing by preparing a method such as any one of items 12 to 23 of the scope of patent application. 如申請專利範圍第30項之用於製備加工物件之方法,其中該加工係碾磨。For example, the method for preparing a processed article according to item 30 of the application, wherein the processing is milling.
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015146932A1 (en) * 2014-03-28 2015-10-01 田中貴金属工業株式会社 Metal wire rod composed of iridium or iridium alloy

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