TWI630674B - Semiconductor device transfer apparatus - Google Patents

Abstract

A method for transferring a plurality of semiconductor elements from a first substrate to a second substrate, comprising: providing the first substrate, wherein the plurality of semiconductor elements are located on the first substrate; providing the second substrate to the plurality of a semiconductor device is disposed between the first substrate and the second substrate; moving the first substrate toward the second substrate to bring the first substrate close to the second substrate; applying a pressure to the first substrate to enable the plurality of semiconductors An element is adhered to the second substrate; and the first substrate and the plurality of semiconductor elements are separated.

Description

Semiconductor component turning device

The present invention discloses a semiconductor device inverting device, and more particularly to a wafer type or chip form semiconductor device inverting device.

In order to meet the requirements of the semiconductor device fabrication steps or the limitations of the process equipment, it is often the case that the upper semiconductor element is turned up to the lower surface. The current method is to manually perform the flipping operation manually, and manually flipping the semiconductor component manually is not only time-consuming and laborious, but also easily causes damage to the structure of the semiconductor component.

The invention provides a semiconductor component inverting device, comprising: a platform comprising a carrying platform and a roller system; a positioning device located above the platform, comprising a circular opening area; and a mobile device connecting platform and positioning device.

The invention provides a semiconductor component inverting device, the operation steps are as follows: 1. Fixing the semiconductor component to be turned over on the colloidal substance of an iron ring, 2. Fixing the iron ring to the positioning device, 3. Complete the positioning device positioning action , 4. Perform the flipping action, 5. Positioning The device returns to the starting position, and the flipped semiconductor component is removed.

1‧‧‧ platform

1a‧‧‧Top surface of the platform

2‧‧‧Roller system

2a‧‧‧Roller

2b‧‧‧ Track

3‧‧‧Loading station

3a‧‧‧bearing fixture

4‧‧‧Mobile heater

5‧‧‧ Positioning device

5a‧‧‧Circular opening area

5b‧‧‧iron ring

5c‧‧‧colloidal substance

5d‧‧‧Top surface of the positioning device

6‧‧‧Mobile devices

7‧‧‧ pillar

8‧‧‧Light-emitting diode grains

D‧‧‧Distance between the upper surface of the positioning device and the upper surface of the platform

d‧‧‧The distance between the iron ring and the bearing fixture

Fig. 1 is a view showing the construction of a semiconductor element inverting device of the present invention.

Figure 2 is a schematic view showing the mounting of the semiconductor device of the present invention on a colloidal substance.

Fig. 3 is a view showing the flipping operation of the semiconductor device inverting device of the present invention.

In order to make the description of the present invention more detailed and complete, please refer to the following description and cooperate with the drawings of Figures 1-3.

1 is a semiconductor component inverting device according to the present invention, comprising: a platform 1 including an upper surface 1a; a roller system 2 and a loading platform 3 above the upper surface 1a; a positioning device 5 An upper surface 5d is disposed above the platform 1 and includes a circular opening area 5a; and a moving device 6 connects the platform 1 and the positioning device 5.

In this embodiment, the roller system 2 further includes a roller 2a and a track 2b, and the roller 2a rolls along the track 2b. The roller 2a may be composed of a non-rigid material or may be composed of an elastic material such as rubber. The roller 2a has a function of pressing down and rolling, and the speed can be equal speed, variable speed or constant acceleration when the roller rolls. In addition, the roller 2a may have a cylindrical shape or a convex lens shape. The carrying platform 3 comprises a heating device (not shown), and further comprises a carrying fixture 3a on the carrying platform 3; wherein the carrying fixture 3a A colloidal substance (not shown) may be attached thereto, and the colloidal substance may change its viscosity by a change in temperature. In this embodiment, the colloidal substance may be a styrofoam.

A positioning device 5 is located above the platform 1 and includes a circular opening area 5a. In addition, a mobile heater 4 is fixed to a post 7 and the position of the mobile heater 4 can be changed by moving the strut 7 up and down above the positioning device 5. A mobile device 6 is located between the platform 1 and the positioning device 5 and connects the platform 1 with the positioning device 5. The mobile device 6 further includes a pneumatic cylinder (not shown) as its power source. In the present embodiment, the mobile device 6 has four adjustable single-axis pneumatic cylinders. The positioning device 5 can thereby move the device 6 to approach or away from the platform 1.

The semiconductor device inverting device disclosed in the present invention has a function of inverting an upper surface of a semiconductor element to a lower surface thereof; wherein the semiconductor element can be a wafer type or a die type component, such as a light emitting diode wafer or Light-emitting diode grains. In this embodiment, taking the inverted LED die 8 as an example, the steps of operating the inverting device are as follows:

1. The light-emitting diode die 8 to be turned over is fixed on the colloidal substance 5c of an iron ring 5b: FIG. 2 is a schematic view showing that the light-emitting diode die 8 is fixed on a colloidal substance. First, as shown in Fig. 2a, an iron ring 5b is provided; as shown in Fig. 2b, a colloidal substance 5c is attached to the iron ring 5b; in this embodiment, the colloidal substance 5c may be a film. As shown in Fig. 2c, the surface of the light-emitting diode crystal 8 to be turned over is fixed in such a manner that the upper surface and the lower surface are in direct contact with the colloidal substance 5c. In the present embodiment, the colloidal substance 5c can change its viscosity by a change in temperature, and does not contaminate the light-emitting diode crystal 8 to be turned over when the viscosity is changed.

2. Fixing the iron ring 5b to the positioning device 5: the iron ring 5b to which the colloidal substance 5c is attached is fixed to the circular opening of the positioning device 5 in such a manner that the upper surface of the light-emitting diode die 8 is to be turned downward. Area 5a. At this time, the positioning device 5 is located at a specific position, and the distance between the upper surface 5d of the positioning device and the upper surface 1a of the platform is D, and this specific position is referred to as a starting position.

3. Complete the positioning operation of the positioning device 5: as shown in Fig. 3, a substrate (not shown) is placed on the bearing fixture 3a, for example, an alumina substrate, and a colloidal substance is attached thereto (Fig. Not shown, for example: a styrofoam; then a heating device (not shown) that activates the carrier 3 heats the colloidal material to increase its viscosity. The relative position of the circular opening area 5a and the bearing fixture 3a of the carrying platform 3 is adjusted by moving the moving device 6 to facilitate the subsequent turning operation. In the present embodiment, the distance d between the iron ring 5b and the bearing jig 3a is not more than 0.2 cm.

4. Performing the flipping operation: With continued reference to Fig. 3, after the positioning device 5 completes the positioning operation, the roller 2a performs the pressing and rolling operations along the rail 2b of Fig. 1. In the present embodiment, the roller 2a rolls back and forth at least once on the surface of the colloidal substance 5c above the attached iron ring 5b. In general, the pressing and scrolling of the scroll wheel 2a can be performed by setting a set of Programmable Logic Controllers (PLCs) (not shown). Next, the strut 7 is moved downward to move the movable heater 4 above the colloidal substance 5c of the iron ring 5b, and then the mobile heater 4 is turned on and heat is applied to the colloidal substance 5c; at this time, the colloidal substance 5c changes due to temperature. The viscous property is changed, and the light-emitting diode crystal 8 adhered thereto is detached and transferred onto the colloidal substance of the substrate carrying the jig 3a to complete the flipping action.

5. The positioning device 5 returns to the starting position.

6. Take out the flipped light-emitting diode die 8.

The semiconductor device according to the embodiment of the present invention may be a light-emitting diode die 8, wherein commonly used materials such as aluminum gallium indium phosphide (AlGaInP) series, aluminum gallium indium nitride (AlGaInN) series, zinc oxide (ZnO) series, etc.

The above figures and descriptions are only corresponding to specific embodiments, however, the elements, embodiments, design criteria, and technical principles described or disclosed in the various embodiments are inconsistent, contradictory, or difficult to implement together. In addition, we may use any reference, exchange, collocation, coordination, or merger as required.

Although the invention has been described above, it is not intended to limit the scope of the invention, the order of implementation, or the materials and process methods used. Various modifications and variations of the present invention are possible without departing from the spirit and scope of the invention.

Claims (10)

A method of transferring a plurality of semiconductor components from a material layer to a carrier, comprising: providing a layer of the material, wherein the plurality of semiconductor components are on the carrier; providing the carrier such that the plurality of semiconductor components are located in the substrate Between the layer and the carrier; moving the layer of material toward the carrier such that the layer of material is adjacent to the carrier; a pressure on the layer of material bonding the plurality of semiconductor components to the carrier; and separating the layer of material The plurality of semiconductor elements. The method of claim 1, further comprising providing a carrying fixture and fixing the carrier or the layer of material on the carrying fixture. The method of claim 1, further comprising heating the carrier prior to applying the pressure to the layer of material. The method of claim 1, further comprising reducing the adhesion between the plurality of semiconductor elements and the layer of material. The method of claim 4, further comprising heating the layer of material to reduce adhesion between the plurality of semiconductor elements and the layer of material. The method of claim 1, further comprising providing a positioning device to shorten the distance between the layer of material and the carrier such that the layer of material is adjacent to the carrier. The method of claim 6, further comprising providing an iron ring to fix the layer of material or the carrier on the positioning device. The method of claim 7, wherein the step of fixing the material layer or the carrier on the positioning device further comprises attaching the material layer or the carrier to the iron ring and fixing the iron ring to the positioning. On the device. The method of claim 1, wherein applying a pressure to the substance layer is performed by a controller. The method of claim 7, wherein the substance layer comprises a colloidal substance.