以下，說明本發明之詳細內容。 (電感器用接著劑) 本發明之電感器用接著劑(以下，有時簡稱為接著劑)係用於電感器。本發明之接著劑包含熱硬化性化合物、熱硬化劑、無機填料及間隔物粒子。於本發明之接著劑中，上述間隔物粒子為樹脂粒子或有機無機混合粒子。於本發明之接著劑中，上述間隔物粒子之平均粒徑為20 μm以上且200 μm以下。於本發明之接著劑中，上述間隔物粒子之粒徑之CV值為10%以下。於本發明之接著劑100重量%中，上述無機填料之含量超過30重量%且為75重量%以下。 本發明由於具備上述構成，故而可使耐濕性較高。例如，藉由接著劑所形成之接著部不易吸水，即便暴露於高濕下，亦可抑制接著性之降低。進而，本發明由於具備上述構成，故而可提高接著部之厚度之均一性，可表現優異之接著性，可抑制電感之偏差。進而，於本發明中，可提高耐熱衝擊性，可提高電感器之耐熱衝擊性(長期可靠性)。即便電感器暴露於高溫下或低溫下，或者暴露於冷熱循環下，亦可使電感之變化較小。 進而，本發明由於具備上述構成，故而可抑制接著劑之過度之潤濕擴散，接著劑之塗佈性亦變高。 上述間隔物粒子之平均粒徑為20 μm以上且200 μm以下。就進一步提高接著性之觀點而言，上述間隔物粒子之平均粒徑較佳為25 μm以上，更佳為30 μm以上，且較佳為150 μm以下，更佳為130 μm以下。 就進一步提高接著性之觀點而言，上述無機填料之平均粒徑相對於上述間隔物粒子之平均粒徑的比(無機填料之平均粒徑/間隔物粒子之平均粒徑)較佳為0.1以下，更佳為0.01以下。就進一步提高耐濕性之觀點而言，上述比(無機填料之平均粒徑/間隔物粒子之平均粒徑)較佳為0.00005以上，更佳為0.0005以上。 上述平均粒徑表示數量平均粒徑。上述無機填料及上述間隔物粒子之平均粒徑例如藉由利用電子顯微鏡或光學顯微鏡觀察任意50個無機填料或任意50個間隔物粒子，算出平均值而求出。 上述間隔物粒子之粒徑之CV值為10%以下。就進一步提高接著性之觀點而言，上述間隔物粒子之粒徑之CV值較佳為1%以上，且較佳為5%以下。 上述CV值(變異係數)係由下述式表示。 CV值(%)＝(ρ/Dn)×100 ρ：間隔物粒子之粒徑之標準偏差 Dn：間隔物粒子之粒徑之平均值 就有效地提高塗佈性，進一步提高接著部之厚度之均一性，進一步提高接著性，且進一步抑制孔隙之產生之觀點而言，上述接著劑之25℃下之黏度較佳為10 Pa・s以上，更佳為15 Pa・s以上，且較佳為150 Pa・s以下，更佳為100 Pa・s以下，進而較佳為70 Pa・s以下，尤佳為40 Pa・s以下，最佳為35 Pa・s以下。 上述黏度(η25)例如可使用E型黏度計(東機產業公司製造之「TVE22L」)等，於25℃及5 rpm之條件下進行測定，且使用螺旋黏度計(Malcom公司製造之「PCU-02V」)，於25℃及10 rpm之條件下進行測定。於接著劑中之間隔物粒子之粒徑為20 μm以下之情形時，可較佳地使用E型黏度計(東機產業公司製造之「TVE22L」)。於接著劑中之間隔物粒子之粒徑超過20 μm之情形時，可較佳地使用螺旋黏度計(Malcom公司製造之「PCU-02V」)。 就進一步提高耐熱衝擊性之觀點而言，於將上述接著劑於120℃下加熱20分鐘後，於170℃下加熱15分鐘而獲得硬化物，此時所獲得之硬化物之玻璃轉移點溫度較佳為120℃以上，且較佳為210℃以下。再者，於使本發明之接著劑硬化時，可於在120℃下加熱20分鐘後，於170℃下加熱15分鐘之條件以外之條件下進行加熱。 就有效地提高耐濕性、間隙控制性、電感之偏差及耐熱衝擊性之各性能之觀點而言，於將上述接著劑30 mg置於第1載玻片，將第2載玻片置於上述接著劑上後，將50 g之砝碼置於上述第2載玻片上，放置20分鐘，此時，俯視時上述間隔物粒子之個數較佳為2個/mm2
以上，且較佳為1000個/mm2
以下。於該俯視下之觀察中，對第1、第2載玻片之間之接著劑進行觀察。 就有效地提高耐濕性、間隙控制性、電感之偏差及耐熱衝擊性之各性能之觀點而言，於將上述接著劑於120℃下加熱20分鐘後，於170℃下加熱15分鐘而獲得硬化物，此時所獲得之硬化物之線膨脹率較佳為60 ppm以下，更佳為50 ppm以下，進而較佳為40 ppm以下，尤佳為30 ppm以下。 上述接著劑可較佳地用於電感器中之鐵氧體磁芯之接著。 以下，說明上述電感器用接著劑之其他詳細內容。 熱硬化性化合物： 上述接著劑中所包含之熱硬化性化合物並無特別限定。上述熱硬化性化合物係藉由加熱而可硬化之化合物。上述熱硬化性化合物可僅使用1種，亦可併用2種以上。 就進一步提高耐濕性及接著性之觀點而言，上述熱硬化性化合物較佳為包含環氧化合物。 就進一步提高耐濕性、接著性及耐熱性之觀點而言，上述熱硬化性化合物較佳為具有芳香族骨架。 作為上述芳香族骨架，可列舉：苯骨架、萘骨架、茀骨架、聯苯骨架、蒽骨架、芘骨架、𠮿骨架、金剛烷骨架及雙酚A型骨架等。就進一步提高耐濕性、接著性及耐熱性之觀點而言，上述芳香族骨架較佳為苯骨架、萘骨架或茀骨架，更佳為萘骨架。上述芳香族骨架可為苯骨架或萘骨架。就進一步提高耐濕性、接著性及耐熱性之觀點而言，上述熱硬化性化合物較佳為包含具有萘骨架之熱硬化性化合物。 就進一步提高耐濕性及接著性之觀點而言，於上述接著劑100重量%中，上述熱硬化性化合物之含量較佳為0.01重量%以上，更佳為0.1重量%以上，進而較佳為1重量%以上，尤佳為15重量%以上，且較佳為90重量%以下，更佳為80重量%以下，進而較佳為70重量%以下。 就進一步提高耐濕性及接著性之觀點而言，於上述接著劑100重量%中，上述具有萘骨架之熱硬化性化合物之含量較佳為0.01重量%以上，更佳為0.1重量%以上，進而較佳為1重量%以上，尤佳為15重量%以上，且較佳為90重量%以下，更佳為80重量%以下，進而較佳為70重量%以下，尤佳為50重量%以下，最佳為30重量%以下。 熱硬化劑： 上述熱硬化劑係使上述熱硬化性化合物熱硬化。作為上述熱硬化劑，有咪唑硬化劑、酚硬化劑、硫醇硬化劑、胺硬化劑、酸酐硬化劑、熱陽離子起始劑及熱自由基產生劑等。上述熱硬化劑可僅使用1種，亦可併用2種以上。 作為上述咪唑硬化劑，並無特別限定，可列舉：2-甲基咪唑、2-乙基-4-甲基咪唑、1-氰基乙基-2-苯基咪唑、1-氰基乙基-2-苯基咪唑鎓偏苯三酸鹽、2,4-二胺基-6-[2'-甲基咪唑基-(1')]-乙基-均三𠯤及2,4-二胺基-6-[2'-甲基咪唑基-(1')]-乙基-均三𠯤異三聚氰酸加成物等。 作為上述硫醇硬化劑，並無特別限定，可列舉：三羥甲基丙烷三(3-巰基丙酸)酯、季戊四醇四(3-巰基丙酸)酯及二季戊四醇六(3-巰基丙酸)酯等。 就有效地表現本發明之效果之方面而言，上述硫醇硬化劑之溶解度參數較佳為9.5以上，且較佳為12以下。上述溶解度參數係藉由Fedors法進行計算。例如，三羥甲基丙烷三(3-巰基丙酸)酯之溶解度參數為9.6，二季戊四醇六(3-巰基丙酸)酯之溶解度參數為11.4。 作為上述胺硬化劑，並無特別限定，可列舉：六亞甲基二胺、八亞甲基二胺、十亞甲基二胺、3,9-雙(3-胺基丙基)-2,4,8,10-四螺[5.5]十一烷、雙(4-胺基環己基)甲烷、間苯二胺及二胺基二苯基碸等。 作為上述熱陽離子起始劑，可列舉：錪系陽離子硬化劑、氧鎓系陽離子硬化劑及鋶系陽離子硬化劑等。作為上述錪系陽離子硬化劑，可列舉雙(4-第三丁基苯基)錪六氟磷酸鹽等。作為上述氧鎓系陽離子硬化劑，可列舉三甲基氧鎓四氟硼酸鹽等。作為上述鋶系陽離子硬化劑，可列舉三對甲苯基鋶六氟磷酸鹽等。 作為上述熱自由基產生劑，並無特別限定，可列舉偶氮化合物及有機過氧化物等。作為上述偶氮化合物，可列舉偶氮二異丁腈(AIBN)等。作為上述有機過氧化物，可列舉：過氧化二第三丁基及過氧化甲基乙基酮等。 上述熱硬化劑之含量並無特別限定。相對於上述熱硬化性化合物100重量份，上述熱硬化劑之含量較佳為0.01重量份以上，更佳為1重量份以上，且較佳為200重量份以下，更佳為100重量份以下，進而較佳為75重量份以下，尤佳為50重量份以下，最佳為10重量份以下。若熱硬化劑之含量為上述下限以上，則容易使接著劑充分地硬化。若熱硬化劑之含量為上述上限以下，則於硬化後，未參與硬化之剩餘之熱硬化劑不易殘存，且接著部之耐熱性變得更高。 間隔物粒子： 作為間隔物粒子，可列舉：樹脂粒子、除金屬粒子以外之無機粒子、有機無機混合粒子及金屬粒子等。於本發明中，上述間隔物粒子為樹脂粒子或有機無機混合粒子。上述間隔物粒子可為具備核、及配置於該核之表面上之殼之核殼粒子。上述核可為有機核。上述殼可為無機殼。於對接著部施加應力時，就可緩和應力，將接著性維持為較高之觀點而言，較佳為除金屬粒子以外之間隔物粒子，更佳為樹脂粒子、除金屬粒子以外之無機粒子或有機無機混合粒子。就本發明之效果更優異之方面而言，於本發明中，使用樹脂粒子或有機無機混合粒子。 上述間隔物粒子較佳為藉由樹脂所形成之樹脂粒子。若上述間隔物粒子為樹脂粒子，則於對接著部施加應力時，可緩和應力，可將接著性維持為較高。 作為用以形成上述樹脂粒子之樹脂，可較佳地使用各種有機物。作為用以形成上述樹脂粒子之樹脂，例如可列舉：聚乙烯、聚丙烯、聚苯乙烯、聚氯乙烯、聚偏二氯乙烯、聚異丁烯、聚丁二烯等聚烯烴樹脂；聚甲基丙烯酸甲酯及聚丙烯酸甲酯等丙烯酸系樹脂；聚對苯二甲酸烷二酯、聚碳酸酯、聚醯胺、苯酚甲醛樹脂、三聚氰胺甲醛樹脂、苯胍胺甲醛樹脂、脲甲醛樹脂、酚樹脂、三聚氰胺樹脂、苯胍胺樹脂、脲樹脂、環氧樹脂、不飽和聚酯樹脂、飽和聚酯樹脂、聚碸、聚苯醚、聚縮醛、聚醯亞胺、聚醯胺醯亞胺、聚醚醚酮、聚醚碸、及使1種或2種以上之具有乙烯性不飽和基之各種聚合性單體進行聚合而獲得之聚合物等。由於可將間隔物粒子之硬度容易地控制為較佳之範圍，故而用以形成上述樹脂粒子之樹脂較佳為使1種或2種以上之具有複數個乙烯性不飽和基之聚合性單體進行聚合而成的聚合物。 於使具有乙烯性不飽和基之聚合性單體聚合而獲得上述樹脂粒子之情形時，作為上述具有乙烯性不飽和基之聚合性單體，可列舉非交聯性單體及交聯性單體。 作為上述非交聯性單體，例如可列舉：苯乙烯、α-甲基苯乙烯等苯乙烯系單體；(甲基)丙烯酸、順丁烯二酸、順丁烯二酸酐等含羧基單體；(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸月桂酯、(甲基)丙烯酸鯨蠟酯、(甲基)丙烯酸硬脂酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸異𦯉基酯等(甲基)丙烯酸烷基酯化合物；(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸甘油酯、聚氧乙烯(甲基)丙烯酸酯、(甲基)丙烯酸縮水甘油酯等含氧原子(甲基)丙烯酸酯化合物；(甲基)丙烯腈等含腈基單體；甲基乙烯基醚、乙基乙烯基醚、丙基乙烯基醚等乙烯基醚化合物；乙酸乙烯酯、丁酸乙烯酯、月桂酸乙烯酯、硬脂酸乙烯酯等酸乙烯酯化合物；乙烯、丙烯、異戊二烯、丁二烯等不飽和烴；(甲基)丙烯酸三氟甲酯、(甲基)丙烯酸五氟乙酯、氯乙烯、氟乙烯、氯苯乙烯等含鹵素單體等。 作為上述交聯性單體，例如可列舉：四羥甲基甲烷四(甲基)丙烯酸酯、四羥甲基甲烷三(甲基)丙烯酸酯、四羥甲基甲烷二(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、二季戊四醇五(甲基)丙烯酸酯、三(甲基)丙烯酸甘油酯、二(甲基)丙烯酸甘油酯、(聚)乙二醇二(甲基)丙烯酸酯、(聚)丙二醇二(甲基)丙烯酸酯、(聚)四亞甲基二醇二(甲基)丙烯酸酯、1,4-丁二醇二(甲基)丙烯酸酯等多官能(甲基)丙烯酸酯化合物；(異)氰尿酸三烯丙酯、偏苯三酸三烯丙酯、二乙烯苯、鄰苯二甲酸二烯丙酯、二烯丙基丙烯醯胺、二烯丙醚、γ-(甲基)丙烯醯氧基丙基三甲氧基矽烷、三甲氧基矽烷基苯乙烯、乙烯基三甲氧基矽烷等含矽烷單體等。 藉由公知之方法使上述具有乙烯性不飽和基之聚合性單體進行聚合，藉此可獲得上述樹脂粒子。作為該方法，例如可列舉：於自由基聚合起始劑之存在下進行懸浮聚合之方法；以及使用非交聯之種粒，使單體與自由基聚合起始劑一起膨潤而進行聚合之方法等。 於上述間隔物粒子為除金屬粒子以外之無機粒子或有機無機混合粒子之情形時，作為用以形成間隔物粒子之無機物，可列舉二氧化矽及碳黑等。較佳為上述無機物不為金屬。作為藉由上述二氧化矽所形成之粒子，並無特別限定，例如可列舉如下粒子：藉由於將具有2個以上之水解性烷氧基矽烷基之矽化合物進行水解而形成交聯聚合物粒子後，視需要進行焙燒而獲得者。作為上述有機無機混合粒子，例如可列舉由交聯之烷氧基矽烷基聚合物及丙烯酸系樹脂所形成之有機無機混合粒子等。 就進一步提高接著性及接著可靠性之觀點而言，將上述間隔物粒子壓縮10%時之壓縮彈性模數(10%K值)較佳為980 N/mm2
以上，更佳為1200 N/mm2
以上，且較佳為4900 N/mm2
以下，更佳為3000 N/mm2
以下。 上述間隔物粒子之上述10%K值可以如下方式進行測定。 使用微小壓縮試驗機，於圓柱(直徑50 μm，金剛石製)之平滑壓頭端面，於25℃、負荷30秒最大試驗負載90 mN之條件下壓縮間隔物粒子。測定此時之負載值(N)及壓縮位移(mm)。根據所獲得之測定值，藉由下述式可求出上述壓縮彈性模數。作為上述微小壓縮試驗機，例如使用Fischer公司製造之「Fischerscope H-100」等。 K值(N/mm2
)＝(3/21/2
)・F・S-3/2
・R-1/2
F：間隔物粒子壓縮變形10%時之負載值(N) S：間隔物粒子壓縮變形10%時之壓縮位移(mm) R：間隔物粒子之半徑(mm) 就進一步提高耐濕性及接著性，且進一步提高接著部之厚度之均一性之觀點而言，於上述接著劑100重量%中，上述間隔物粒子之含量較佳為1重量%以上，更佳為2重量%以上，進而較佳為超過5重量%，且較佳為15重量%以下，更佳為12重量%以下。 無機填料： 作為上述無機填料之材料，可列舉：二氧化矽、滑石、黏土、雲母、水滑石、氧化鋁、氧化鎂、氫氧化鋁、氮化鋁及氮化硼等。 就進一步提高耐濕性之觀點而言，上述無機填料較佳為二氧化矽或氧化鋁，更佳為二氧化矽，進而較佳為熔融二氧化矽。藉由使用二氧化矽，接著部之熱膨脹率變得更低，接著可靠性變得更高。 就進一步提高耐濕性之觀點而言，上述無機填料較佳為藉由偶合劑處理之表面處理物。 作為上述偶合劑，可列舉：矽烷偶合劑、鈦偶合劑及鋁偶合劑等。就進一步提高接著性之觀點而言，上述無機填料較佳為藉由矽烷偶合劑處理之表面處理物。 作為上述矽烷偶合劑，可列舉：苯基矽烷、乙烯基矽烷、胺基矽烷、咪唑矽烷及環氧矽烷等。就進一步提高耐濕性之觀點而言，較佳為苯基矽烷。 於上述接著劑100重量%中，上述無機填料之含量超過30重量%且為75重量%以下。就進一步提高耐濕性之觀點而言，於上述接著劑100重量%中，上述無機填料之含量較佳為超過35重量%，更佳為40重量%以上。就進一步提高接著性之觀點而言，上述無機填料之含量較佳為70重量%以下，更佳為65重量%以下，進而較佳為60重量%以下。 於上述接著劑100重量%中，若上述無機填料之含量超過35重量%，則耐濕性變得相當高。 就平衡性較佳地提高接著性及耐濕性兩者之觀點而言，上述接著劑100重量%中之上述無機填料之含量相對於上述接著劑100重量%中之上述間隔物粒子之含量的比(無機填料之含量/間隔物粒子之含量)較佳為3以上，更佳為4以上，且較佳為60以下，更佳為30以下。 其他成分： 上述接著劑可包含光硬化性成分，亦可包含光硬化性化合物及光聚合起始劑。 就進一步提高接著性之觀點而言，上述接著劑較佳為包含偶合劑。 作為上述偶合劑，可列舉：矽烷偶合劑、鈦偶合劑及鋁偶合劑等。就進一步提高接著性之觀點而言，上述接著劑較佳為包含矽烷偶合劑。 作為上述矽烷偶合劑，可列舉：苯基矽烷、乙烯基矽烷、胺基矽烷、咪唑矽烷及環氧矽烷等。 就進一步提高接著性之觀點而言，於上述接著劑100重量%中，上述偶合劑之含量較佳為0.01重量%以上，更佳為0.1重量%以上，且較佳為2重量%以下，更佳為1重量%以下。 就有效地提高塗佈性，進一步提高接著部之厚度之均一性，進一步提高接著性，且進一步抑制孔隙之產生之觀點而言，上述接著劑較佳為包含觸變性賦予劑。 作為上述觸變性賦予劑，可列舉：金屬粒子、碳酸鈣、發煙二氧化矽、氧化鋁、氮化硼、氮化鋁、硼酸鋁等無機粒子等。 就有效地提高塗佈性，進一步提高接著部之厚度之均一性，進一步提高接著性，且進一步抑制孔隙之產生之觀點而言，於上述接著劑100重量%中，上述觸變性賦予劑之含量較佳為0.1重量%以上，更佳為0.5重量%以上，且較佳為10重量%以下，更佳為5重量%以下。 上述接著劑可視需要，例如包含填充劑、增量劑、軟化劑、塑化劑、聚合觸媒、硬化觸媒、著色劑、抗氧化劑、熱穩定劑、光穩定劑、紫外線吸收劑、潤滑劑、防靜電劑及阻燃劑等各種添加劑。 (電感器) 本發明之電感器具備鐵氧體磁芯、及將上述鐵氧體磁芯接著之接著部。於本發明之電感器中，上述接著部之材料為上述電感器用接著劑。上述接著部為上述電感器用接著劑之硬化物。上述接著部係藉由使上述電感器用接著劑硬化而形成。 較佳為於上述接著部之相互對向之兩側之表面上配置有上述鐵氧體磁芯。較佳為上述鐵氧體磁芯因上述接著部而具有間隙。 圖1係模式性地表示使用本發明之一實施形態之電感器用接著劑之電感器的剖視圖。 圖1所示之電感器1具備鐵氧體磁芯11、鐵氧體磁芯12及接著部13。電感器1包含複數個鐵氧體磁芯(鐵氧體磁芯11及鐵氧體磁芯12)。電感器1包含變壓器零件用線圈鐵芯。鐵氧體磁芯11為E型鐵氧體磁芯。鐵氧體磁芯12為I型鐵氧體磁芯。於E型鐵氧體磁芯11之3個凸部中，外側之2個凸部之前端與I型鐵氧體磁芯12之側面對向，且隔著間隙。於該間隙配置有接著部13。該接著部13之材料為上述電感器用接著劑。於本實施形態中，接著部13之厚度係與接著劑13中所包含之間隔物粒子之粒徑相同。間隔物粒子係與鐵氧體磁芯11及鐵氧體磁芯12兩者接觸。 以下，列舉實施例及比較例，具體地說明本發明。本發明並不僅限定於以下之實施例。 準備以下之材料。 熱硬化性化合物1：間苯二酚型環氧化合物，共榮社化學製造之「Epolight TDG-LC」 熱硬化性化合物2：雙酚F型環氧化合物，DIC製造之「EXA-830CRP」 熱硬化性化合物3：萘型環氧化合物，DIC公司製造之「HP-4032D」 熱硬化性化合物4：雙酚A型環氧化合物，DIC製造之「EXA-850CRP」 熱硬化性化合物5：萘型環氧化合物，DIC公司製造之「HP-4710」 熱硬化性化合物6：茀型環氧化合物，Osaka Gas Chemicals公司製造之「OGSOL PG-100」 熱硬化劑1：咪唑硬化促進劑，日本曹達公司製造之「TEP-2E4MZ」 熱硬化劑2：咪唑硬化促進劑，四國化成工業公司製造之「2MZA-PW」 偶合劑：矽烷偶合劑，信越化學工業公司製造之「KBM-573」 觸變性賦予劑：德山公司製造之「PM-20L」 無機填料1：二氧化矽，平均粒徑1 μm，Admatechs公司製造之「SE4050-SPE」 無機填料2：二氧化矽，平均粒徑3.8 μm，龍森公司製造之「EXR-4」 間隔物1：平均粒徑20 μm，CV值5%，10%K值3600 N/mm2
，積水化學工業公司製造之「SP-220」，樹脂粒子 間隔物2：平均粒徑150 μm，CV值7%，10%K值2000 N/mm2
，積水化學工業公司製造之「SP-L150」，樹脂粒子 間隔物3：平均粒徑50 μm，CV值5%，10%K值3800 N/mm2
，積水化學工業公司製造之「SP-250」，樹脂粒子 間隔物4：平均粒徑200 μm，CV值7%，10%K值3900 N/mm2
，積水化學工業公司製造之「GS-L200」，樹脂粒子 (實施例1) (1)電感器用接著劑之製備 按照表1之組成，藉由自轉公轉混合機將間隔物以外之各材料進行攪拌混合，藉此獲得接著劑組合物。於所獲得之接著劑組合物中，按照表1之組成調配間隔物粒子，使用自轉公轉混合機進行攪拌混合，藉此製作電感器用接著劑。 (2)電感器之製作 將所獲得之電感器用接著劑填充於10 mL注射器(武蔵高科技公司製造)中，於注射器之前端安裝精密噴嘴(武蔵高科技公司製造，噴嘴前端內徑：於間隔物粒徑未達100 μm之情形時為0.3 mm，於間隔物之粒徑為100 μm以上之情形時為0.6 mm)，使用點膠機裝置(武蔵高科技公司製造之「SHOT MASTER300」)，塗佈於I型磁芯，與E型磁芯貼合後，藉由回焊爐使之硬化，獲得電感器。 (3)耐濕性評價用樣本之製作 將所獲得之電感器用接著劑填充於10 mL注射器(武蔵高科技公司製造)中，於注射器之前端安裝精密噴嘴(武蔵高科技公司製造，噴嘴前端內徑0.3 mm)，使用點膠機裝置(武蔵高科技公司製造之「SHOT MASTER300」)，貼合5個長3 mm、寬3 mm、厚度0.3 mm之與電感器同質之鐵氧體片、及1個長20 mm、寬20 mm、厚度0.3 mm之與電感器同質之鐵氧體片後，藉由回焊爐使之硬化，獲得耐濕性評價用樣本。 (實施例2～16、比較例1、2) 如表1、2所示般變更調配成分之種類及調配量，除此以外，以與實施例1相同之方式獲得電感器用接著劑、電感器及耐濕性評價用樣本。 (評價) (1)黏度 於接著劑中之間隔物粒子之粒徑為20 μm以下之情形時，使用E型黏度計(東機產業公司製造之「TVE22L」)，於25℃及5 rpm之條件下測定接著劑之25℃下之黏度(η25)。 於接著劑中之間隔物粒子之粒徑超過20 μm之情形時，使用螺旋黏度計(Malcom公司製造之「PCU-02V」)，於25℃及10 rpm之條件下測定接著劑之25℃下之黏度(η25)。 (2)塗佈性 塗佈性之評價係使用點膠機裝置(武蔵高科技公司製造之「SHOT MASTER300」)進行。關於塗佈條件，於精密噴嘴(武蔵高科技公司製造，噴嘴前端內徑0.3 mm)、噴出條件(溫度25℃，噴出壓力0.3 Mpa)下進行固定，塗佈於玻璃基板上，藉此評價塗佈性。以下述基準判定塗佈性。 [塗佈性之判定基準] ○○：無模糊或塌邊地成功塗佈 ○：稍微產生模糊或塌邊 △：雖不存在塗佈龜裂，但產生較大之模糊或塌邊 ×：產生塗佈龜裂，或者完全無法塗佈 (3)粒子分散性(個/mm2
) 將接著劑30 mg置於第1載玻片，將第2載玻片置於接著劑上後，將50 g之砝碼置於上述第2載玻片上，放置20分鐘。於放置後，使用光學顯微鏡，測定俯視時每1 mm2
之間隔物粒子之個數。 (4)玻璃轉移點溫度(Tg)之測定 將接著劑於120℃下加熱20分鐘後，於170℃下加熱15分鐘，使之硬化而獲得硬化物。使用黏彈性測定機(IT Meter and Control公司製造)，於升溫速度10℃/分鐘以及夾持寬度20 mm及5 Hz之條件下測定所獲得之硬化物之tanδ。將Tanδ之波峰時之溫度作為玻璃轉移溫度。 (5)線膨脹率 將接著劑於120℃下加熱20分鐘後，於170℃下加熱15分鐘，使之硬化而獲得硬化物。使用TMA/SS6000(Seiko Instruments公司製造)，於以升溫速度5℃/min自室溫(25℃)加熱至250℃之條件下測定所獲得之硬化物之線膨脹率。 (6)耐濕性 對將所獲得之耐濕性評價用樣本於85℃、濕度85%之烘箱中放置24小時後之樣本、與將所獲得之耐濕性評價用樣本放置於常溫下之樣本的接著力進行測定。藉由Dage公司製造之晶片剪切強度測試機「Dage series 4000」測定晶片剪切接著力，藉此評價耐濕性。以下述基準判定耐濕性。 [耐濕性之判定基準] ○○：於高溫高濕下放置之樣本之接著力係於常溫下放置之樣本之接著力的90%以上 ○：於高溫高濕下放置之樣本之接著力係於常溫下放置之樣本之接著力的80%以上且未達90% △：於高溫高濕下放置之樣本之接著力係於常溫下放置之樣本之接著力的70%以上且未達80% ×：於高溫高濕下放置之樣本之接著力未達於常溫下放置之樣本之接著力的70% (7)間隙控制性 於所獲得之電感器中，使用雷射位移計(KEYENCE公司製造之「KS-1100」)，測定硬化後之間隙間距離及間隙間距離之偏差3σ(σ；標準偏差)。根據間隙間距離之偏差3σ/硬化後之間隙間距離之值X，評價間隙控制性。以下述基準判定間隙控制性。 [間隙控制性之判定基準] ○○：值X未達0.1 ○：值X為0.1以上且未達0.2 △：值X為0.2以上且未達0.4 ×：值X為0.4以上 (8)電感之偏差 測定20個所獲得之電感器之電感，評價偏差。以下述基準判定電感之偏差。 [電感之偏差之判定基準] ○○：電感之CV值未達5% ○：電感之CV值為5%以上且未達10% △：電感之CV值為10%以上且未達15% ×：電感之CV值為15%以上 (9)耐熱衝擊性1(長期可靠性) 將所獲得之電感器放置於賦予於高溫125℃下為30分鐘、於低溫-40℃下為30分鐘之溫度變化的500次循環之環境下。其後，測定電感之變化率。特性變化率意指由因熱衝擊而於接著面產生剝離、或者間隙間距離產生變化所引起之電感之偏差比率。 [耐熱衝擊性1之判定基準] ○○：與電感之初始值之間之變化率未達10% ○：與電感之初始值之間之變化率為10%以上且未達20% △：與電感之初始值之間之變化率為20%以上且未達30% ×：與電感之初始值之間之變化率為30%以上 (10)耐熱衝擊性2(長期可靠性) 將所獲得之電感器放置於賦予於高溫150℃下為30分鐘、於低溫-50℃下為30分鐘之溫度變化的500次循環之環境下。其後，測定電感之變化率。 [耐熱衝擊性2之判定基準] ○○：與電感之初始值之間之變化率未達10% ○：與電感之初始值之間之變化率為10%以上且未達20% △：與電感之初始值之間之變化率為20%以上且未達30% ×：與電感之初始值之間之變化率為30%以上 將詳細內容及結果示於下述表1、2。 [表1]
[表2] Hereinafter, the details of the present invention will be described. (Binder for Inductor) The adhesive for an inductor of the present invention (hereinafter sometimes referred to simply as an adhesive) is used for an inductor. The adhesive of the present invention contains a thermosetting compound, a thermosetting agent, an inorganic filler, and spacer particles. In the adhesive of the present invention, the spacer particles are resin particles or organic-inorganic hybrid particles. In the adhesive of the present invention, the spacer particles have an average particle diameter of 20 μm or more and 200 μm or less. In the adhesive of the present invention, the particle diameter of the spacer particles has a CV value of 10% or less. In the 100% by weight of the adhesive of the present invention, the content of the inorganic filler is more than 30% by weight and not more than 75% by weight. Since the present invention has the above configuration, the moisture resistance can be made high. For example, the adhesive portion formed by the adhesive agent is less likely to absorb water, and even when exposed to high humidity, the decrease in adhesion can be suppressed. Further, according to the present invention, since the thickness of the adhesive portion is uniform, the uniformity of the thickness of the adhesive portion can be improved, and the variation in inductance can be suppressed. Further, in the present invention, the thermal shock resistance can be improved, and the thermal shock resistance (long-term reliability) of the inductor can be improved. Even if the inductor is exposed to high temperatures or low temperatures, or exposed to hot and cold cycles, the inductance can be changed less. Further, according to the present invention, since the above-described configuration is provided, excessive wettability of the adhesive can be suppressed, and the applicability of the adhesive is also increased. The average particle diameter of the spacer particles is 20 μm or more and 200 μm or less. The average particle diameter of the spacer particles is preferably 25 μm or more, more preferably 30 μm or more, and is preferably 150 μm or less, and more preferably 130 μm or less from the viewpoint of further improving the adhesion. The ratio of the average particle diameter of the inorganic filler to the average particle diameter of the spacer particles (the average particle diameter of the inorganic filler / the average particle diameter of the spacer particles) is preferably 0.1 or less from the viewpoint of further improving the adhesion. More preferably, it is 0.01 or less. The ratio (the average particle diameter of the inorganic filler/the average particle diameter of the spacer particles) is preferably 0.00005 or more, and more preferably 0.0005 or more, from the viewpoint of further improving the moisture resistance. The above average particle diameter represents a number average particle diameter. The average particle diameter of the inorganic filler and the spacer particles is determined by, for example, observing an arbitrary number of inorganic fillers or any of 50 spacer particles by an electron microscope or an optical microscope, and calculating an average value. The particle diameter of the spacer particles has a CV value of 10% or less. From the viewpoint of further improving the adhesion, the CV value of the particle diameter of the spacer particles is preferably 1% or more, and preferably 5% or less. The above CV value (coefficient of variation) is represented by the following formula. CV value (%) = (ρ / Dn) × 100 ρ: standard deviation of the particle diameter of the spacer particles Dn: the average value of the particle diameters of the spacer particles effectively improves the coating property and further increases the thickness of the succeeding portion The viscosity at 25 ° C of the above-mentioned adhesive is preferably 10 Pa·s or more, more preferably 15 Pa·s or more, and is preferably from the viewpoint of uniformity, further improvement of adhesion, and further suppression of generation of pores. 150 Pa·s or less is more preferably 100 Pa·s or less, further preferably 70 Pa·s or less, and particularly preferably 40 Pa·s or less, and most preferably 35 Pa·s or less. The viscosity (η25) can be measured, for example, at 25 ° C and 5 rpm using an E-type viscometer ("TVE22L" manufactured by Toki Sangyo Co., Ltd.), and a spiral viscometer ("PCU-" manufactured by Malcom Corporation) is used. 02V"), measured at 25 ° C and 10 rpm. When the particle size of the spacer particles in the adhesive is 20 μm or less, an E-type viscometer ("TVE22L" manufactured by Toki Sangyo Co., Ltd.) can be preferably used. When the particle diameter of the spacer particles in the adhesive exceeds 20 μm, a spiral viscometer ("PCU-02V" manufactured by Malcom Co., Ltd.) can be preferably used. From the viewpoint of further improving the thermal shock resistance, the above-mentioned adhesive is heated at 120 ° C for 20 minutes, and then heated at 170 ° C for 15 minutes to obtain a cured product, and the glass transition point temperature of the cured product obtained at this time is higher. It is preferably 120 ° C or more, and preferably 210 ° C or less. Further, when the adhesive of the present invention is cured, it can be heated under conditions other than the conditions of heating at 120 ° C for 20 minutes and then heating at 170 ° C for 15 minutes. From the viewpoint of effectively improving the properties of moisture resistance, gap controllability, inductance variation, and thermal shock resistance, 30 mg of the above adhesive was placed on the first slide, and the second slide was placed. After the adhesive is applied, a 50 g weight is placed on the second glass slide and left for 20 minutes. In this case, the number of the spacer particles is preferably 2/mm 2 or more in plan view, and is preferably. It is 1000 pieces/mm 2 or less. In the observation in plan view, the adhesive between the first and second slides was observed. From the viewpoint of effectively improving the properties of moisture resistance, gap controllability, inductance variation, and thermal shock resistance, the above-mentioned adhesive was heated at 120 ° C for 20 minutes, and then heated at 170 ° C for 15 minutes. The cured product, the linear expansion ratio of the cured product obtained at this time is preferably 60 ppm or less, more preferably 50 ppm or less, further preferably 40 ppm or less, and particularly preferably 30 ppm or less. The above-mentioned adhesive can be preferably used for the subsequent application of the ferrite core in the inductor. Hereinafter, other details of the above-mentioned adhesive for an inductor will be described. Thermosetting Compound: The thermosetting compound contained in the above-mentioned adhesive is not particularly limited. The above thermosetting compound is a compound which can be hardened by heating. The thermosetting compound may be used alone or in combination of two or more. The thermosetting compound preferably contains an epoxy compound from the viewpoint of further improving moisture resistance and adhesion. The thermosetting compound preferably has an aromatic skeleton from the viewpoint of further improving moisture resistance, adhesion, and heat resistance. Examples of the aromatic skeleton include a benzene skeleton, a naphthalene skeleton, an anthracene skeleton, a biphenyl skeleton, an anthracene skeleton, an anthracene skeleton, and an anthracene. Skeleton, adamantane skeleton, and bisphenol A skeleton. The aromatic skeleton is preferably a benzene skeleton, a naphthalene skeleton or an anthracene skeleton from the viewpoint of further improving moisture resistance, adhesion, and heat resistance, and more preferably a naphthalene skeleton. The above aromatic skeleton may be a benzene skeleton or a naphthalene skeleton. The thermosetting compound preferably contains a thermosetting compound having a naphthalene skeleton from the viewpoint of further improving moisture resistance, adhesion, and heat resistance. The content of the thermosetting compound is preferably 0.01% by weight or more, more preferably 0.1% by weight or more, and still more preferably 100% by weight of the above-mentioned adhesive, from the viewpoint of further improving the moisture resistance and the adhesion. 1% by weight or more, particularly preferably 15% by weight or more, and preferably 90% by weight or less, more preferably 80% by weight or less, still more preferably 70% by weight or less. The content of the thermosetting compound having a naphthalene skeleton is preferably 0.01% by weight or more, and more preferably 0.1% by weight or more, based on 100% by weight of the above-mentioned adhesive, from the viewpoint of further improving moisture resistance and adhesion. Further, it is preferably 1% by weight or more, more preferably 15% by weight or more, and is preferably 90% by weight or less, more preferably 80% by weight or less, further preferably 70% by weight or less, and particularly preferably 50% by weight or less. The optimum is 30% by weight or less. Thermal Hardener: The above-mentioned thermosetting agent thermally hardens the above-mentioned thermosetting compound. Examples of the above-mentioned thermosetting agent include an imidazole curing agent, a phenol curing agent, a thiol curing agent, an amine curing agent, an acid anhydride curing agent, a thermal cation initiator, and a thermal radical generating agent. These thermosetting agents may be used alone or in combination of two or more. The imidazole curing agent is not particularly limited, and examples thereof include 2-methylimidazole, 2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, and 1-cyanoethyl group. -2-phenylimidazolium trimellitate, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-allo 𠯤4-Diamino-6-[2'-methylimidazolyl-(1')]-ethyl-distributor𠯤 an isocyanuric acid adduct or the like. The thiol curing agent is not particularly limited, and examples thereof include trimethylolpropane tris(3-mercaptopropionic acid) ester, pentaerythritol tetrakis(3-mercaptopropionic acid) ester, and dipentaerythritol hexa(3-mercaptopropionic acid). ) esters, etc. The solubility parameter of the above-mentioned thiol hardener is preferably 9.5 or more, and preferably 12 or less, in terms of effectively exhibiting the effects of the present invention. The above solubility parameters are calculated by the Fedors method. For example, the solubility parameter of trimethylolpropane tris(3-mercaptopropionic acid) ester is 9.6, and the solubility parameter of dipentaerythritol hexa(3-mercaptopropionic acid) ester is 11.4. The amine curing agent is not particularly limited, and examples thereof include hexamethylenediamine, octamethylenediamine, decamethylenediamine, and 3,9-bis(3-aminopropyl)-2. 4,8,10-tetraspiro[5.5]undecane, bis(4-aminocyclohexyl)methane, m-phenylenediamine, and diaminodiphenylphosphonium. Examples of the thermal cation initiator include a lanthanoid cation curing agent, an oxonium cation curing agent, and a lanthanoid cation curing agent. Examples of the ruthenium-based cation hardener include bis(4-t-butylphenyl)phosphonium hexafluorophosphate. Examples of the oxonium-based cation hardener include trimethyloxonium tetrafluoroborate. Examples of the ruthenium-based cation hardener include tri-p-tolylsulfonium hexafluorophosphate. The thermal radical generating agent is not particularly limited, and examples thereof include an azo compound and an organic peroxide. Examples of the azo compound include azobisisobutyronitrile (AIBN) and the like. Examples of the organic peroxide include ditributyl peroxide and methyl ethyl ketone peroxide. The content of the above-mentioned thermosetting agent is not particularly limited. The content of the above-mentioned thermosetting agent is preferably 0.01 parts by weight or more, more preferably 1 part by weight or more, and preferably 200 parts by weight or less, more preferably 100 parts by weight or less, based on 100 parts by weight of the thermosetting compound. Further, it is preferably 75 parts by weight or less, more preferably 50 parts by weight or less, and most preferably 10 parts by weight or less. When the content of the thermosetting agent is at least the above lower limit, the adhesive is easily sufficiently cured. When the content of the thermosetting agent is not more than the above upper limit, the remaining thermosetting agent that does not participate in curing hardens after the curing, and the heat resistance of the succeeding portion becomes higher. Spacer particles: Examples of the spacer particles include resin particles, inorganic particles other than metal particles, organic-inorganic hybrid particles, and metal particles. In the invention, the spacer particles are resin particles or organic-inorganic hybrid particles. The spacer particles may be core-shell particles having a core and a shell disposed on a surface of the core. The above-mentioned core may be an organic core. The above shell may be an inorganic shell. When stress is applied to the adhesive portion, the stress can be alleviated, and spacer particles other than the metal particles are preferable, and the resin particles and the inorganic particles other than the metal particles are more preferable. Or organic-inorganic hybrid particles. In terms of the effect of the present invention being more excellent, in the present invention, resin particles or organic-inorganic hybrid particles are used. The spacer particles are preferably resin particles formed of a resin. When the spacer particles are resin particles, stress can be alleviated when stress is applied to the adhesive portion, and the adhesion can be maintained high. As the resin for forming the above resin particles, various organic materials can be preferably used. Examples of the resin for forming the resin particles include polyolefin resins such as polyethylene, polypropylene, polystyrene, polyvinyl chloride, polyvinylidene chloride, polyisobutylene, and polybutadiene; and polymethacrylic acid; Acrylic resin such as methyl ester and polymethyl acrylate; polyalkylene terephthalate, polycarbonate, polyamide, phenol formaldehyde resin, melamine formaldehyde resin, benzoguanidine formaldehyde resin, urea formaldehyde resin, phenol resin, Melamine resin, benzoguanamine resin, urea resin, epoxy resin, unsaturated polyester resin, saturated polyester resin, polyfluorene, polyphenylene ether, polyacetal, polyimine, polyamidimide, poly Ether ether ketone, polyether oxime, and a polymer obtained by polymerizing one or two or more kinds of polymerizable monomers having an ethylenically unsaturated group. The resin for forming the resin particles is preferably one or more kinds of polymerizable monomers having a plurality of ethylenically unsaturated groups. Polymerized polymer. When the polymerizable monomer having an ethylenically unsaturated group is polymerized to obtain the above resin particles, examples of the polymerizable monomer having an ethylenically unsaturated group include a non-crosslinkable monomer and a crosslinkable single. body. Examples of the non-crosslinkable monomer include a styrene monomer such as styrene or α-methylstyrene; and a carboxyl group such as (meth)acrylic acid, maleic acid or maleic anhydride. Methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, (methyl) (Methyl) acrylate such as lauryl acrylate, cetyl (meth) acrylate, stearyl (meth) acrylate, cyclohexyl (meth) acrylate, (meth) acrylate 𦯉 Alkyl ester compound; 2-hydroxyethyl (meth)acrylate, glycerol (meth)acrylate, polyoxyethylene (meth)acrylate, glycidyl (meth)acrylate, etc., oxygen atom (meth)acrylic acid An ester compound; a nitrile group-containing monomer such as (meth)acrylonitrile; a vinyl ether compound such as methyl vinyl ether, ethyl vinyl ether or propyl vinyl ether; vinyl acetate, vinyl butyrate, lauric acid Acid vinyl ester compounds such as vinyl ester and vinyl stearate; unsaturated hydrocarbons such as ethylene, propylene, isoprene and butadiene; Ester, (meth) acrylate, pentafluoro methacrylate, vinyl chloride, vinyl fluoride, chlorine halogen-containing monomers such as styrene and the like. Examples of the crosslinkable monomer include tetramethylolmethanetetra(meth)acrylate, tetramethylolmethanetri(meth)acrylate, and tetramethylolmethanedi(meth)acrylate. , trimethylolpropane tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, dipentaerythritol penta (meth) acrylate, tris (meth) acrylate, di(meth) acrylate glycerol Ester, (poly)ethylene glycol di(meth)acrylate, (poly)propylene glycol di(meth)acrylate, (poly)tetramethylene glycol di(meth)acrylate, 1,4-butyl a polyfunctional (meth) acrylate compound such as diol di(meth) acrylate; triallyl (iso) cyanurate, triallyl trimellitate, divinyl benzene, diallyl phthalate a decane-containing single ester such as an ester, diallyl acrylamide, diallyl ether, γ-(meth) propylene methoxy propyl trimethoxy decane, trimethoxy decyl styrene, vinyl trimethoxy decane Body and so on. The above resin particles can be obtained by polymerizing the above polymerizable monomer having an ethylenically unsaturated group by a known method. As the method, for example, a method of performing suspension polymerization in the presence of a radical polymerization initiator; and a method of performing polymerization by swelling a monomer together with a radical polymerization initiator using a non-crosslinked seed particle Wait. In the case where the spacer particles are inorganic particles or organic-inorganic hybrid particles other than the metal particles, examples of the inorganic material for forming the spacer particles include ceria and carbon black. Preferably, the inorganic substance is not a metal. The particles formed by the above-mentioned ceria are not particularly limited, and examples thereof include particles obtained by hydrolyzing a ruthenium compound having two or more hydrolyzable alkoxyalkyl groups to form crosslinked polymer particles. After that, it is obtained by baking as needed. Examples of the organic-inorganic hybrid particles include organic-inorganic hybrid particles formed of a crosslinked alkoxyfluorene alkyl polymer and an acrylic resin. From the viewpoint of further improving the adhesion and subsequent reliability, the compression elastic modulus (10% K value) when the spacer particles are compressed by 10% is preferably 980 N/mm 2 or more, more preferably 1200 N/ mm 2 or more, and preferably 4900 N / 2 mm or less, more preferably 3000 N / 2 or less mm. The above 10% K value of the spacer particles can be measured as follows. Using a micro compression tester, the spacer particles were compressed on a smooth end face of a cylinder (diameter 50 μm, made of diamond) at 25 ° C under a load of 30 mN for a maximum test load of 30 mN. The load value (N) and the compression displacement (mm) at this time were measured. From the measured values obtained, the above-described compression elastic modulus can be obtained by the following formula. As the above-described micro compression tester, for example, "Fischerscope H-100" manufactured by Fischer Co., Ltd., or the like is used. K value (N/mm 2 )=(3/2 1/2 )·F·S -3/2・R -1/2 F: Load value (N) when the spacer particles are 10% compression-deformed S: Interval The compression displacement (mm) when the particles are 10% compressed and deformed by R: R: the radius of the spacer particles (mm), in order to further improve the moisture resistance and the adhesion, and further improve the uniformity of the thickness of the succeeding portion, The content of the spacer particles in 100% by weight of the subsequent agent is preferably 1% by weight or more, more preferably 2% by weight or more, further preferably more than 5% by weight, and more preferably 15% by weight or less, more preferably 12% by weight or less. Inorganic filler: Examples of the material of the inorganic filler include cerium oxide, talc, clay, mica, hydrotalcite, alumina, magnesia, aluminum hydroxide, aluminum nitride, and boron nitride. The inorganic filler is preferably cerium oxide or aluminum oxide, more preferably cerium oxide, and further preferably molten cerium oxide, from the viewpoint of further improving moisture resistance. By using cerium oxide, the thermal expansion rate of the succeeding portion becomes lower, and then the reliability becomes higher. From the viewpoint of further improving moisture resistance, the above inorganic filler is preferably a surface treated material treated by a coupling agent. Examples of the coupling agent include a decane coupling agent, a titanium coupling agent, and an aluminum coupling agent. The inorganic filler is preferably a surface-treated material treated with a decane coupling agent from the viewpoint of further improving the adhesion. Examples of the decane coupling agent include phenyl decane, vinyl decane, amino decane, imidazolium, and epoxy decane. From the viewpoint of further improving moisture resistance, phenyl decane is preferred. The content of the inorganic filler is more than 30% by weight and not more than 75% by weight in 100% by weight of the above-mentioned adhesive. In view of further improving the moisture resistance, the content of the inorganic filler is preferably more than 35% by weight, more preferably 40% by weight or more, based on 100% by weight of the above-mentioned adhesive. The content of the inorganic filler is preferably 70% by weight or less, more preferably 65% by weight or less, and still more preferably 60% by weight or less from the viewpoint of further improving the adhesion. When the content of the inorganic filler exceeds 35% by weight in 100% by weight of the above-mentioned adhesive, the moisture resistance becomes relatively high. The content of the inorganic filler in 100% by weight of the above-mentioned adhesive is relative to the content of the spacer particles in 100% by weight of the above-mentioned adhesive, from the viewpoint of improving the balance and the moisture resistance. The ratio (content of the inorganic filler/content of the spacer particles) is preferably 3 or more, more preferably 4 or more, and is preferably 60 or less, more preferably 30 or less. Other components: The above-mentioned adhesive may include a photocurable component, and may also contain a photocurable compound and a photopolymerization initiator. From the viewpoint of further improving the adhesion, the above-mentioned adhesive preferably contains a coupling agent. Examples of the coupling agent include a decane coupling agent, a titanium coupling agent, and an aluminum coupling agent. From the viewpoint of further improving the adhesion, the above-mentioned adhesive preferably contains a decane coupling agent. Examples of the decane coupling agent include phenyl decane, vinyl decane, amino decane, imidazolium, and epoxy decane. From the viewpoint of further improving the adhesion, the content of the coupling agent is preferably 0.01% by weight or more, more preferably 0.1% by weight or more, and preferably 2% by weight or less, more preferably 100% by weight of the above-mentioned adhesive. Preferably, it is 1% by weight or less. The adhesive agent preferably contains a thixotropic imparting agent from the viewpoint of effectively improving the coating property, further improving the uniformity of the thickness of the adhesive portion, further improving the adhesion, and further suppressing the generation of voids. Examples of the thixotropy-imparting agent include inorganic particles such as metal particles, calcium carbonate, fumed cerium oxide, aluminum oxide, boron nitride, aluminum nitride, and aluminum borate. The content of the thixotropic imparting agent is 100% by weight of the above-mentioned adhesive, from the viewpoint of further improving the coating property, further improving the uniformity of the thickness of the adhesive portion, further improving the adhesion, and further suppressing the generation of voids. It is preferably 0.1% by weight or more, more preferably 0.5% by weight or more, and is preferably 10% by weight or less, more preferably 5% by weight or less. The above-mentioned adhesive may optionally include a filler, a bulking agent, a softener, a plasticizer, a polymerization catalyst, a hardening catalyst, a colorant, an antioxidant, a heat stabilizer, a light stabilizer, a UV absorber, and a lubricant. Various additives such as antistatic agents and flame retardants. (Inductor) The inductor of the present invention includes a ferrite core and a connecting portion of the ferrite core. In the inductor of the present invention, the material of the above-mentioned bonding portion is the above-mentioned adhesive for an inductor. The above-mentioned adhesive portion is a cured product of the above-mentioned inductor adhesive. The above-mentioned adhesive portion is formed by curing the inductor with an adhesive. Preferably, the ferrite core is disposed on a surface of both sides of the opposite portion facing each other. Preferably, the ferrite core has a gap due to the above-mentioned portion. Fig. 1 is a cross-sectional view schematically showing an inductor using an adhesive for an inductor according to an embodiment of the present invention. The inductor 1 shown in FIG. 1 includes a ferrite core 11, a ferrite core 12, and a follower portion 13. The inductor 1 includes a plurality of ferrite cores (a ferrite core 11 and a ferrite core 12). The inductor 1 includes a coil core for a transformer component. The ferrite core 11 is an E-type ferrite core. The ferrite core 12 is an I-type ferrite core. Among the three convex portions of the E-type ferrite core 11, the front ends of the two outer convex portions face the side faces of the I-type ferrite core 12 with a gap interposed therebetween. A rear portion 13 is disposed in the gap. The material of the adhesion portion 13 is the above-mentioned adhesive for the inductor. In the present embodiment, the thickness of the adhesive portion 13 is the same as the particle diameter of the spacer particles contained in the adhesive 13. The spacer particles are in contact with both the ferrite core 11 and the ferrite core 12. Hereinafter, the present invention will be specifically described by way of examples and comparative examples. The invention is not limited to the following examples. Prepare the following materials. Thermosetting compound 1: Resorcinol type epoxy compound, "Epolight TDG-LC" manufactured by Kyoeisha Chemical Co., Ltd. Thermosetting compound 2: bisphenol F type epoxy compound, "EXA-830CRP" manufactured by DIC Cure compound 3: naphthalene epoxy compound, "HP-4032D" manufactured by DIC Corporation Thermosetting compound 4: bisphenol A epoxy compound, "EXA-850CRP" manufactured by DIC Thermosetting compound 5: naphthalene type Epoxy compound, "HP-4710" manufactured by DIC Corporation Thermosetting compound 6: oxime type epoxy compound, "OGSOL PG-100" manufactured by Osaka Gas Chemicals Co., Ltd. Thermal hardener 1: Imidazole hardening accelerator, Japan Soda Corporation "TEP-2E4MZ", a heat-hardening agent 2: an imidazole hardening accelerator, "2MZA-PW" manufactured by Shikoku Chemicals Co., Ltd. Coupling agent: a decane coupling agent, "KBM-573" manufactured by Shin-Etsu Chemical Co., Ltd. Agent: "PM-20L" manufactured by Tokuyama Co., Ltd. Inorganic filler 1: cerium oxide, average particle size 1 μm, "SE4050-SPE" manufactured by Admatechs Inc. Inorganic filler 2: cerium oxide, average particle size 3.8 μm, dragon Made by Mori Company "EXR-4" spacer 1 average particle size: 20 μm, CV value of 5%, 10% K value is 3600 N / mm 2, manufactured by Sekisui Chemical Co.'s "SP-220" resin spacer particles 2: average particle 150 μm in diameter, CV value 7%, 10% K value 2000 N/mm 2 , "SP-L150" manufactured by Sekisui Chemical Industry Co., Ltd., resin particle spacer 3: average particle size 50 μm, CV value 5%, 10% K value 3800 N/mm 2 , "SP-250" manufactured by Sekisui Chemical Industry Co., Ltd., resin particle spacer 4: average particle size 200 μm, CV value 7%, 10% K value 3900 N/mm 2 , Sekisui Chemical Industry "GS-L200" manufactured by the company, resin particles (Example 1) (1) Preparation of an adhesive for the inductor According to the composition of Table 1, the materials other than the spacer were stirred and mixed by a rotation-revolving mixer. An adhesive composition is obtained. In the obtained adhesive composition, spacer particles were prepared in accordance with the composition of Table 1, and stirred and mixed using a spin-rotation mixer to prepare an inductor for an inductor. (2) Manufacture of the inductor The obtained inductor was filled with a 10 mL syringe (manufactured by Wuyi Hi-Tech Co., Ltd.), and a precision nozzle was attached to the front end of the syringe (manufactured by Wuyi Hi-Tech Co., Ltd., nozzle tip inner diameter: at intervals) When the particle size is less than 100 μm, it is 0.3 mm, and when the particle diameter of the spacer is 100 μm or more, it is 0.6 mm), and the dispenser device ("SHOT MASTER300" manufactured by Wuyi Hi-Tech Co., Ltd.) is used. After being applied to an I-type magnetic core and bonded to an E-shaped magnetic core, it is hardened by a reflow furnace to obtain an inductor. (3) Preparation of sample for moisture resistance evaluation The obtained inductor was filled in a 10 mL syringe (manufactured by Takeshi Hi-Tech Co., Ltd.), and a precision nozzle was attached to the front end of the syringe (manufactured by Takeshi Hi-Tech Co., Ltd., inside the nozzle tip). With a diameter of 0.3 mm), using a dispenser device ("SHOT MASTER300" manufactured by Wuyi Hi-Tech Co., Ltd.), five ferrite sheets of the same length as the inductor, which are 3 mm long, 3 mm wide, and 0.3 mm thick, and A ferrite sheet of the same length as the inductor of 20 mm in length, 20 mm in width and 0.3 mm in thickness was hardened by a reflow furnace to obtain a sample for evaluation of moisture resistance. (Examples 2 to 16 and Comparative Examples 1 and 2) In the same manner as in Example 1, except that the type and the amount of the compounding component were changed as shown in Tables 1 and 2, an inductor for an inductor and an inductor were obtained in the same manner as in Example 1. And samples for moisture resistance evaluation. (Evaluation) (1) When the particle size of the spacer particles in the adhesive is 20 μm or less, an E-type viscometer ("TVE22L" manufactured by Toki Sangyo Co., Ltd.) is used at 25 ° C and 5 rpm. The viscosity (η25) of the adhesive at 25 ° C was measured under the conditions. When the particle size of the spacer particles in the adhesive exceeds 20 μm, the adhesive is measured at 25 ° C at 25 ° C and 10 rpm using a spiral viscometer ("PCU-02V" manufactured by Malcom Corporation). Viscosity (η25). (2) The evaluation of the coatability was carried out using a dispenser device ("SHOT MASTER300" manufactured by Takeo Hi-Tech Co., Ltd.). The coating conditions were fixed by a precision nozzle (manufactured by Wuyi Hi-Tech Co., Ltd., nozzle tip inner diameter: 0.3 mm) and discharge conditions (temperature: 25 ° C, discharge pressure: 0.3 Mpa), and applied to a glass substrate to evaluate the coating. Cloth. The coatability was judged based on the following criteria. [Criteria for determination of coating property] ○○: Successful coating without blurring or sag ○: slight blurring or sag △: Although there is no coating crack, large blur or sag is generated ×: Coating cracks, or not coating at all. (3) Particle dispersibility (pieces/mm 2 ) Place 30 mg of the adhesive on the first slide and place the second slide on the adhesive. The weight of g was placed on the above second slide and left for 20 minutes. After standing, the number of spacer particles per 1 mm 2 in plan view was measured using an optical microscope. (4) Measurement of glass transition point temperature (Tg) The adhesive was heated at 120 ° C for 20 minutes, and then heated at 170 ° C for 15 minutes to be hardened to obtain a cured product. The tan δ of the obtained cured product was measured using a viscoelasticity measuring machine (manufactured by IT Meter and Control Co., Ltd.) under the conditions of a temperature rising rate of 10 ° C / min and a nip width of 20 mm and 5 Hz. The temperature at the peak of Tan δ was taken as the glass transition temperature. (5) Linear expansion ratio After the adhesive was heated at 120 ° C for 20 minutes, it was heated at 170 ° C for 15 minutes to be hardened to obtain a cured product. The linear expansion ratio of the obtained cured product was measured using TMA/SS6000 (manufactured by Seiko Instruments Co., Ltd.) at a heating rate of 5 ° C/min from room temperature (25 ° C) to 250 ° C. (6) Moisture resistance The sample after the sample for moisture resistance evaluation obtained was placed in an oven at 85 ° C and a humidity of 85% for 24 hours, and the sample for moisture resistance evaluation obtained was placed at room temperature. The adhesion of the sample was measured. The wafer shear adhesion force was measured by a wafer shear strength tester "Dage series 4000" manufactured by Dage Co., Ltd., thereby evaluating moisture resistance. The moisture resistance was determined based on the following criteria. [Criteria for Judging Moisture Resistance] ○○: The adhesion force of the sample placed under high temperature and high humidity is 90% or more of the adhesion force of the sample placed at normal temperature. ○: The adhesion force of the sample placed under high temperature and high humidity. More than 80% of the adhesion force of the sample placed at room temperature and less than 90% △: The adhesion force of the sample placed under high temperature and high humidity is more than 70% of the adhesion force of the sample placed at normal temperature and less than 80% ×: The adhesion force of the sample placed under high temperature and high humidity is less than 70% of the adhesion force of the sample placed at normal temperature. (7) Gap controllability is obtained in the obtained inductor, using a laser displacement meter (manufactured by KEYENCE Corporation) "KS-1100") measures the deviation of the gap between the gaps after hardening and the distance between the gaps by 3σ (σ; standard deviation). The gap controllability was evaluated based on the deviation 3σ of the gap between the gaps/the value X of the distance between the gaps after hardening. The gap controllability was determined based on the following criteria. [Criteria for the determination of the gap control property] ○○: The value X is less than 0.1 ○: The value X is 0.1 or more and less than 0.2 △: The value X is 0.2 or more and less than 0.4 ×: The value X is 0.4 or more (8) Inductance The inductance of the 20 obtained inductors was measured for the deviation, and the deviation was evaluated. The deviation of the inductance is determined based on the following criteria. [Criteria for Judging the Deviation of Inductance] ○○: The CV value of the inductor is less than 5%. ○: The CV value of the inductor is 5% or more and less than 10%. △: The CV value of the inductor is 10% or more and less than 15% × : The CV value of the inductor is 15% or more. (9) Thermal shock resistance 1 (long-term reliability) The obtained inductor is placed at a temperature of 30 minutes at a high temperature of 125 ° C and a temperature of 30 minutes at a low temperature of -40 ° C. The environment of the 500 cycles of change. Thereafter, the rate of change of the inductance was measured. The characteristic change rate means the ratio of the deviation of the inductance caused by the peeling of the adhesion surface due to thermal shock or the change in the distance between the gaps. [Criteria for Judging Thermal Shock Resistance 1] ○○: The rate of change between the initial value of the inductance and the initial value of the inductance is less than 10%. ○: The rate of change between the initial value of the inductance and the initial value of the inductance is 10% or more and less than 20%. The rate of change between the initial values of the inductance is 20% or more and less than 30% ×: The rate of change between the initial value of the inductance and the initial value of the inductance is 30% or more (10) Thermal shock resistance 2 (long-term reliability) The inductor was placed in an environment of 500 cycles of a temperature change of 30 minutes at a high temperature of 150 ° C and a low temperature of -50 ° C for 30 minutes. Thereafter, the rate of change of the inductance was measured. [Criteria for Judging Thermal Shock Resistance 2] ○○: The rate of change between the initial value of the inductance and the initial value of the inductance is less than 10%. ○: The rate of change between the initial value of the inductance and the initial value of the inductance is 10% or more and less than 20%. The rate of change between the initial values of the inductance is 20% or more and less than 30% ×: The rate of change between the initial value of the inductance and the initial value of the inductance is 30% or more. Details and results are shown in Tables 1 and 2 below. [Table 1] [Table 2]