TWI630158B - Storage pod and particle inspection method - Google Patents

Storage pod and particle inspection method Download PDF

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TWI630158B
TWI630158B TW106100678A TW106100678A TWI630158B TW I630158 B TWI630158 B TW I630158B TW 106100678 A TW106100678 A TW 106100678A TW 106100678 A TW106100678 A TW 106100678A TW I630158 B TWI630158 B TW I630158B
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substrate
upper cover
light transmission
storage case
base
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TW106100678A
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Chinese (zh)
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TW201825371A (en
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陳慶躍
翁國倫
賴俊宏
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台灣積體電路製造股份有限公司
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Abstract

一種存放盒,適於存放基板,存放盒包括底座以及上蓋。上蓋覆蓋底座上並且與底座組裝,其中基板適於被存放在底座與上蓋之間的存放空間內,而上蓋具有位於基板上方的透光檢測窗,且透光檢測窗的尺寸大於基板的尺寸。此外,一種使用前述的存放盒的顆粒檢測方法亦被提出。A storage box is suitable for storing a substrate, and the storage box comprises a base and an upper cover. The upper cover covers the base and is assembled with the base, wherein the substrate is adapted to be stored in a storage space between the base and the upper cover, and the upper cover has a light transmission detection window above the substrate, and the size of the light transmission detection window is larger than the size of the substrate. Further, a particle detecting method using the aforementioned storage case is also proposed.

Description

存放盒及顆粒檢測方法Storage box and particle detection method

本發明的實施例是有關於一種存放盒(storage pod),且特別是有關於一種使用前述存放盒的顆粒檢測方法。Embodiments of the present invention relate to a storage pod, and more particularly to a method of detecting particles using the aforementioned storage cartridge.

隨著半導體技術不斷創新,利用半導體製程所製成的半導體晶片已被廣泛地應用於各種領域中。在半導體晶片的製造過程中,運用自動化物料搬運系統(Automated Material Handling System,AMHS)及標準機械介面(Standard Mechanical Interface,SMIF)設備來進行晶圓或光罩的維護與運送,自動化物料搬運系統(AMHS)及標準機械介面設備(SMIF)不但能降低成本,還能在存放與運輸過程提升晶圓或光罩的潔淨度。據此,自動化物料搬運系統(AMHS)及標準機械介面設備(SMIF)已被列為半導體廠的標準設備規範。As semiconductor technology continues to innovate, semiconductor wafers fabricated using semiconductor processes have been widely used in various fields. In the manufacturing process of semiconductor wafers, automated material handling systems (AMHS) and standard mechanical interface (SMIF) equipment are used to maintain and transport wafers or reticle, automated material handling systems ( AMHS) and standard mechanical interface equipment (SMIF) not only reduce costs, but also improve the cleanliness of wafers or reticle during storage and transportation. Accordingly, automated material handling systems (AMHS) and standard mechanical interface devices (SMIF) have been listed as standard equipment specifications for semiconductor plants.

在半導體晶片的製造過程中,通常會在各個製程步驟之後進行顆粒檢測(particle-gating)以期能夠盡早檢測出存在於晶圓或光罩上的顆粒或缺陷,進而改善半導體晶片的製造良率。然而,顆粒檢測的進行需要將晶圓或光罩從標準機械介面設備(SMIF)中取出,此舉將增加顆粒附著於晶圓或光罩上的風險。因此,如何降低顆粒檢測時顆粒附著於晶圓或光罩上的風險,實為目前研發人員關注的議題之一。In the manufacturing process of a semiconductor wafer, particle-gating is usually performed after each process step in order to detect particles or defects existing on the wafer or the mask as early as possible, thereby improving the manufacturing yield of the semiconductor wafer. However, particle detection requires the wafer or reticle to be removed from a standard mechanical interface device (SMIF), which increases the risk of particles adhering to the wafer or reticle. Therefore, how to reduce the risk of particles adhering to the wafer or the reticle during particle detection is one of the topics that researchers are currently paying attention to.

本發明的實施例提供一種存放盒,其適於存放基板。存放盒包括底座以及上蓋,且上蓋覆蓋底座並且與底座組裝。基板適於被存放在底座與上蓋之間的存放空間內,上蓋具有位於基板上方的透光檢測窗,且透光檢測窗的尺寸大於基板的尺寸。Embodiments of the present invention provide a storage case that is adapted to store a substrate. The storage box includes a base and an upper cover, and the upper cover covers the base and is assembled with the base. The substrate is adapted to be stored in a storage space between the base and the upper cover, and the upper cover has a light transmission detection window located above the substrate, and the size of the light transmission detection window is larger than the size of the substrate.

本發明的另一實施例提供一種存放盒,其適於存放基板。存放盒包括底座以及上蓋,且上蓋覆蓋底座並且與底座組裝。基板適於被存放在底座與上蓋之間的存放空間內,上蓋包括上蓋主體以及透光檢測窗,上蓋主體具有位於基板上方的開孔,透光檢測窗安裝於開孔中,透光檢測窗的尺寸大於基板的尺寸,且透光檢測窗包括透光基材以及分別位於透光基材的內表面與外表面上的二抗靜電層。Another embodiment of the present invention provides a storage case that is adapted to store a substrate. The storage box includes a base and an upper cover, and the upper cover covers the base and is assembled with the base. The substrate is adapted to be stored in a storage space between the base and the upper cover, the upper cover comprises an upper cover body and a light transmission detection window, the upper cover body has an opening above the substrate, the light transmission detection window is installed in the opening, and the light transmission detection window The size is larger than the size of the substrate, and the light transmission detection window includes a light transmissive substrate and two antistatic layers respectively on the inner and outer surfaces of the light transmissive substrate.

本發明的又一實施例提供一種顆粒檢測方法,其包括下列步驟:在基板上進行第一製程;將基板存放在前述的存放盒中;以及藉由透光檢測窗對存放於存放盒中的基板進行顆粒檢測製程。A further embodiment of the present invention provides a particle detecting method comprising the steps of: performing a first process on a substrate; storing the substrate in the storage box; and storing the light in the storage box by the light transmission detecting window The substrate is subjected to a particle detection process.

以下揭露內容提供用於實施所提供標的物的不同特徵的許多不同實施例或實例。下文描述組件以及配置的特定實例以簡化本發明。當然,此等組件以及配置僅僅為實例且不意欲為限制性的。舉例而言,在以下描述中,第一特徵在第二特徵上方或上的形成可包含第一特徵以及第二特徵直接接觸地形成的實施例,且還可包含額外特徵可在第一特徵與第二特徵之間形成使得第一特徵與第二特徵可不直接接觸的實施例。另外,本發明可在各種實例中重複圖式元件符號以及/或字母。此重複是出於簡化以及清楚的目的,且本身並不指示所論述的各種實施例以及/或組態之間的關係。The following disclosure provides many different embodiments or examples for implementing different features of the subject matter provided. Specific components of the components and configurations are described below to simplify the present invention. Of course, such components and configurations are merely examples and are not intended to be limiting. For example, in the following description, the formation of the first feature over or over the second feature can include embodiments in which the first feature and the second feature are formed in direct contact, and can also include additional features that can be associated with the first feature Embodiments are formed between the second features such that the first feature and the second feature may not be in direct contact. In addition, the present invention may repeat the graphical element symbols and/or letters in various examples. This repetition is for the purpose of simplicity and clarity, and is not a limitation of the various embodiments and/or configurations discussed.

另外,為易於描述,本文中可使用諸如「在...之下」、「在...下方」、「下部」、「在...上方」、「上部」以及其類似者的空間相對術語,以描述如諸圖中所說明的一個元件或特徵相對於另一元件或特徵的關係。除了諸圖中所描繪的定向之外,空間相對術語意欲涵蓋裝置在使用或操作中的不同定向。設備可以其他方式定向(旋轉90度或處於其他定向),且本文中所使用的空間相對描述詞同樣可相應地進行解釋。In addition, for ease of description, spatially relatives such as "under", "below", "lower", "above", "upper", and the like may be used herein. Terminology to describe the relationship of one element or feature to another element or feature as illustrated in the figures. In addition to the orientation depicted in the figures, spatially relative terms are intended to encompass different orientations of the device in use or operation. The device may be otherwise oriented (rotated 90 degrees or at other orientations), and the spatially relative descriptors used herein may be interpreted accordingly.

圖1是根據本發明一實施例的存放盒的立體示意圖,圖2是根據本發明一實施例的存放盒的側面透視示意圖,而圖3是根據本發明一實施例的存放盒的頂視示意圖,且圖4是根據本發明一實施例的存放盒的底視示意圖。請參照圖1至圖4,本實施例的存放盒100適於存放基板SUB,而基板SUB例如為晶圓或光罩。如圖1所示,存放盒100包括底座110(繪示於圖4中)以及上蓋120(繪示於圖1至圖3中),且上蓋120覆蓋底座110並且與底座110組裝。基板SUB適於被存放在底座110與上蓋120之間的存放空間S內,而上蓋120具有位於基板SUB上方的透光檢測窗W,且透光檢測窗W的尺寸大於基板SUB的尺寸。1 is a perspective view of a storage case according to an embodiment of the present invention, FIG. 2 is a perspective view showing a side view of a storage case according to an embodiment of the present invention, and FIG. 3 is a top plan view of a storage case according to an embodiment of the present invention; 4 is a bottom plan view of a storage case in accordance with an embodiment of the present invention. Referring to FIGS. 1 to 4, the storage case 100 of the present embodiment is adapted to store a substrate SUB, and the substrate SUB is, for example, a wafer or a photomask. As shown in FIG. 1 , the storage case 100 includes a base 110 (shown in FIG. 4 ) and an upper cover 120 (shown in FIGS. 1 to 3 ), and the upper cover 120 covers the base 110 and is assembled with the base 110 . The substrate SUB is adapted to be stored in the storage space S between the base 110 and the upper cover 120, and the upper cover 120 has a light transmission detection window W located above the substrate SUB, and the size of the light transmission detection window W is larger than the size of the substrate SUB.

本實施例的存放盒100例如為標準機械介面晶舟盒(SMIF Cassette)、前開式晶圓傳送盒(Front Opening Universal Pod,FOUP)、前開式晶圓運輸盒(Front Opening Shipping Pod,FOSP)、光罩儲存盒(Mask Package Pod)或標準機械介面的光罩傳送盒(Reticle SMIF Pod,RSP)等,且前述的存放盒100可以有效地防止存放於其中的基板SUB受到污染,以確保高基板SUB的潔淨度。舉例而言,存放盒100的底座110以及上蓋120可採用低產氣(outgassing)的塑膠材料製成,如丙烯腈-丁二烯-苯乙烯共聚物(Acrylonitrile Butadiene Styren,ABS)、聚甲基丙烯酸甲酯(Poly(methyl methacrylate),PMMA)或聚碳酸酯(Polycarbonate)等。前述材料所製作出的底座110以及上蓋120除了具有低產氣的特性之外,亦具備靜電導引與釋放的能力,以有效保護基板免於遭受靜電放電而損壞。The storage box 100 of the embodiment is, for example, a standard mechanical interface wafer box (SMIF Cassette), a front opening wafer transfer box (Front Opening Universal Pod, FOUP), a front opening wafer transport box (Front Opening Shipping Pod, FOSP), A Mask Package Pod or a standard mechanical interface Reticle SMIF Pod (RSP), etc., and the aforementioned storage case 100 can effectively prevent the substrate SUB stored therein from being contaminated to ensure a high substrate. SUB's cleanliness. For example, the base 110 of the storage box 100 and the upper cover 120 may be made of a low-gassing plastic material such as Acrylonitrile Butadiene Styren (ABS), polymethacrylic acid. Poly (methyl methacrylate), PMMA or polycarbonate (Polycarbonate). The base 110 and the upper cover 120 fabricated by the foregoing materials have the ability of electrostatic guiding and releasing in addition to the characteristics of low gas production, so as to effectively protect the substrate from electrostatic discharge and damage.

不論是何種型態的存放盒100,由底座110與上蓋120所共同定義出來的存放空間S須足以容納基板SUB,而基板SUB是藉由底座110及/或上蓋120的機構設計而被穩定地存放於存放空間S之中。在一些實施例中,基板SUB是平放於底座110上並且位於存放空間S之中。詳言之,基板SUB可具有底面以及與底面相對的待檢測表面,其中基板SUB的底面承靠於底座110上,而基板SUB的待檢測表面則朝向上蓋120的透光檢測窗W。Regardless of the type of storage box 100, the storage space S defined by the base 110 and the upper cover 120 must be sufficient to accommodate the substrate SUB, and the substrate SUB is stabilized by the mechanism design of the base 110 and/or the upper cover 120. The ground is stored in the storage space S. In some embodiments, the substrate SUB is laid flat on the base 110 and located in the storage space S. In detail, the substrate SUB may have a bottom surface and a surface to be inspected opposite to the bottom surface, wherein the bottom surface of the substrate SUB bears against the base 110, and the surface to be inspected of the substrate SUB faces the light transmission detecting window W of the upper cover 120.

在一些實施例中,為了讓存放盒100能夠配合各種製程設備中的運作,底座110可包括多組適用於不同製程設備的定位孔112(如圖4所繪示)。In some embodiments, in order to enable the storage box 100 to cooperate with operations in various process devices, the base 110 can include a plurality of sets of positioning holes 112 (as illustrated in FIG. 4) suitable for different process devices.

在一些實施例中,存放盒100中所存放的基板SUB可為圓形的晶圓,而上蓋120的透光檢測窗W可為圓形、矩形或近似於矩形的透光檢測窗,且透光檢測窗W的直徑或寬度W D大於晶圓的直徑D,以利對晶圓的待檢測表面進行顆粒檢測。在其他實施例中,存放盒100中所存放的基板SUB可為矩形的光罩,而上蓋120的透光檢測窗W可為矩形或近似於矩形的透光檢測窗,且透光檢測窗W的寬度W D大於光罩的寬度,以利對光罩的待檢測表面進行顆粒檢測。值得注意的是,前述的矩形透光檢測窗可為正方形透光檢測窗或長方形透光檢測窗,而前述近似於矩形的透光檢測窗可為具有倒圓角的正方形透光檢測窗或具有倒圓角的長方形透光檢測窗。此外,位於基板SUB上方的透光檢測窗W例如是平行於基板SUB的待檢測表面。 In some embodiments, the substrate SUB stored in the storage box 100 may be a circular wafer, and the light transmission detection window W of the upper cover 120 may be a circular, rectangular or nearly rectangular transparent detection window. The diameter or width W D of the light detecting window W is larger than the diameter D of the wafer to facilitate particle detection of the surface to be inspected of the wafer. In other embodiments, the substrate SUB stored in the storage box 100 may be a rectangular reticle, and the light transmission detection window W of the upper cover 120 may be a rectangular or approximately rectangular light transmission detection window, and the light transmission detection window W W D is larger than the width of the mask width to facilitate the detection surface of the mask to be detected is granules. It should be noted that the foregoing rectangular light transmission detection window may be a square light transmission detection window or a rectangular light transmission detection window, and the foregoing rectangular light transmission detection window may be a square light transmission detection window with rounded corners or have Rounded rectangular light transmission detection window. Further, the light transmission detecting window W located above the substrate SUB is, for example, a surface to be inspected parallel to the substrate SUB.

透光檢測窗W不限於以上所描述的圓形、矩形或近似於矩形的透光檢測窗,透光檢測窗W的形狀可依據實際需求而做是度的更動。此外,透光檢測窗W的尺寸以不遮蔽基板SUB(即晶圓或光罩)的待檢測表面為原則。換言之,透光檢測窗W的尺寸以及形狀與基板SUB的形狀以及尺寸相關。The light transmission detecting window W is not limited to the above-described circular, rectangular or nearly rectangular light-transmitting detection window, and the shape of the light-transmitting detection window W can be changed according to actual needs. Further, the size of the light transmission detecting window W is based on the principle that the surface to be inspected of the substrate SUB (ie, the wafer or the photomask) is not shielded. In other words, the size and shape of the light transmission detecting window W are related to the shape and size of the substrate SUB.

在一些實施例中,上蓋120包括上蓋主體B以及透光檢測窗W,上蓋主體B具有位於基板SUB上方的開孔122,且透光檢測窗W安裝於上蓋主體B的開孔122中。上蓋主體B的開孔122的尺寸以不遮蔽基板SUB(即晶圓或光罩)的待檢測表面為原則,而透光檢測窗W安裝於上蓋120的開孔122中。舉例而言,透光檢測窗W的穿透率可高於上蓋120的穿透率,且透光檢測窗W的穿透率可高於或等於90%。在一些實施例中,可採用具有相對較高穿透率的材質(例如石英或其他穿透率高於或等於90%的材質)來製作透光檢測窗W,並且採用具有相對較低穿透率的材質來製作上蓋120。In some embodiments, the upper cover 120 includes an upper cover body B and a light transmission detecting window W. The upper cover body B has an opening 122 above the substrate SUB, and the light transmission detecting window W is mounted in the opening 122 of the upper cover body B. The size of the opening 122 of the upper cover body B is based on the principle that the surface to be inspected of the substrate SUB (ie, the wafer or the reticle) is not shielded, and the light transmission detecting window W is installed in the opening 122 of the upper cover 120. For example, the transmittance of the light transmission detecting window W may be higher than the transmittance of the upper cover 120, and the transmittance of the light transmission detecting window W may be higher than or equal to 90%. In some embodiments, a material having a relatively high transmittance (for example, quartz or other material having a transmittance higher than or equal to 90%) may be used to fabricate the light-transmitting detection window W, and has a relatively low penetration. The material of the rate is used to make the upper cover 120.

在一些實施例中,如圖1至圖3所繪示,除了位於基板SUB上方的開孔122之外,上蓋主體B可進一步包括至少一對提把124,而此提把124有助於讓搬運者提取存放盒100或有助於讓製程設備中的拾取機構開啟存放盒100。In some embodiments, as shown in FIGS. 1 to 3, in addition to the opening 122 above the substrate SUB, the upper cover body B may further include at least one pair of handles 124, and the handle 124 helps The carrier extracts the storage box 100 or helps the pick-up mechanism in the process equipment to open the storage box 100.

在本實施例中,當上蓋120被組裝於底座110上時,存放盒100處於關閉的狀態,此時,存放盒100內可存放有基板SUB或者是閒置(即,未存放有基板SUB)。在欲將基板SUB從存放盒100中取出(準備進行後續製程)或者欲將基板SUB存放於存放盒100內(已經進行完某些製程)的情況下,可將上蓋120從底座110上卸下,使存放盒100處於開啟的狀態,以方便基板SUB的取出或放回。In the present embodiment, when the upper cover 120 is assembled on the base 110, the storage box 100 is in a closed state. At this time, the storage unit 100 can store the substrate SUB or be idle (ie, the substrate SUB is not stored). The upper cover 120 can be detached from the base 110 in the case where the substrate SUB is to be taken out of the storage case 100 (prepared for subsequent processes) or the substrate SUB is to be stored in the storage case 100 (some processes have been performed). The storage box 100 is placed in an open state to facilitate the removal or replacement of the substrate SUB.

圖5A至圖5C是圖2中位置A的局部放大示意圖。請參照圖2與圖5A與圖5B,在一些實施例中,透光檢測窗W包括透光基材W1以及抗靜電層W2,透光基材W1為石英或其他穿透率高於或等於90%的材質所製成,而抗靜電層W2可選擇性地製作於透光基材W1的其中一個表面(例如內表面或外表面)上。詳言之,如圖5A所示,抗靜電層W2可位於透光基材W1較接近基板SUB的表面(即內表面)上,當然,抗靜電層W2亦可位於透光基材W1較遠離基板SUB的表面(即外表面)上,如圖5B所示。5A to 5C are partial enlarged views of the position A in Fig. 2. Referring to FIG. 2 and FIG. 5A and FIG. 5B , in some embodiments, the light transmission detecting window W includes a transparent substrate W1 and an antistatic layer W2. The transparent substrate W1 is quartz or other transmittance higher than or equal to 90% of the material is made, and the antistatic layer W2 is selectively formed on one surface (for example, the inner surface or the outer surface) of the light-transmitting substrate W1. In detail, as shown in FIG. 5A, the antistatic layer W2 may be located on the surface (ie, the inner surface) of the transparent substrate W1 that is closer to the substrate SUB. Of course, the antistatic layer W2 may also be located farther away from the transparent substrate W1. The surface (i.e., the outer surface) of the substrate SUB is as shown in Fig. 5B.

在其他可行的實施例中,透光檢測窗W包括透光基材W1以及二抗靜電層W2,透光基材W1為石英或其他穿透率高於或等於90%的材質所製成,且前述的二抗靜電層W2分別位於透光基材W1的內表面以及外表面上,如圖5C所示。In other feasible embodiments, the light transmission detecting window W includes a light transmissive substrate W1 and a second antistatic layer W2, and the light transmissive substrate W1 is made of quartz or other material having a transmittance higher than or equal to 90%. And the foregoing two antistatic layers W2 are respectively located on the inner surface and the outer surface of the light transmissive substrate W1 as shown in FIG. 5C.

為了兼顧透光檢測窗W的穿透率以及抗靜電能力,製作於透光基材W1(例如石英基材)的表面上的至少一層抗靜電層W2可為透明導電氧化物(Transparent Conductive Oxide,TCO)層,且此透明導電氧化物層的材質例如是銦錫氧化物(ITO)層、銦鋅氧化物(IZO)層、前述導電氧化物層的組合等。由於存放盒100的底座110以及上蓋120具備靜電導引與釋放的能力,且透光檢測窗W具有抗靜電層W2,因此,底座110、上蓋120以及透光檢測窗W共同提供了完善的靜電釋放路徑,以有效保護存放於存放盒100中的基板SUB免於遭受靜電放電而損壞。In order to achieve both the transmittance and the antistatic ability of the light transmission detecting window W, at least one antistatic layer W2 formed on the surface of the light-transmitting substrate W1 (for example, a quartz substrate) may be a transparent conductive oxide (Transparent Conductive Oxide, The TCO) layer, and the material of the transparent conductive oxide layer is, for example, an indium tin oxide (ITO) layer, an indium zinc oxide (IZO) layer, a combination of the conductive oxide layers, or the like. Since the base 110 and the upper cover 120 of the storage box 100 have the capability of electrostatic guiding and releasing, and the light transmission detecting window W has the antistatic layer W2, the base 110, the upper cover 120 and the light transmission detecting window W together provide perfect static electricity. The path is released to effectively protect the substrate SUB stored in the storage case 100 from electrostatic discharge and damage.

如圖5所示,透光檢測窗W與上蓋主體B的開孔122之間可選擇性地設置有緩衝材料126,以使透光檢測窗W能夠穩定地被安裝於上蓋主體B的開孔122中。此外,上述的緩衝材料126可具備適當的導電性,以避免靜電在透光檢測窗W上累積。如圖5所示,緩衝材料126可以沿著開孔122的邊緣設置,以作為透光檢測窗W與上蓋主體B之間的緩衝,進而避免透光檢測窗W與上蓋主體B直接碰撞或摩擦。換言之,緩衝材料126配置於透光檢測窗W的周圍。在本實施例中,由於緩衝材料126、存放盒100的底座110以及上蓋120皆具備靜電導引與釋放的能力,且透光檢測窗W具有抗靜電層W2,因此,底座110、上蓋120、緩衝材料126以及透光檢測窗W共同提供了完善的靜電釋放路徑,以有效保護存放於存放盒100中的基板SUB免於遭受靜電放電而損壞。As shown in FIG. 5, a buffer material 126 may be selectively disposed between the light transmission detecting window W and the opening 122 of the upper cover body B, so that the light transmission detecting window W can be stably installed in the opening of the upper cover body B. 122. Further, the buffer material 126 described above may be provided with appropriate conductivity to prevent static electricity from accumulating on the light transmission detecting window W. As shown in FIG. 5, the cushioning material 126 can be disposed along the edge of the opening 122 to serve as a buffer between the light-transmitting detection window W and the upper cover body B, thereby preventing the light-transmitting detection window W from directly colliding or rubbing against the upper cover body B. . In other words, the cushioning material 126 is disposed around the light transmission detecting window W. In this embodiment, since the buffer material 126, the base 110 of the storage box 100, and the upper cover 120 have the capability of electrostatic guiding and releasing, and the light transmission detecting window W has the antistatic layer W2, the base 110, the upper cover 120, The cushioning material 126 and the light-transmitting detection window W together provide a perfect electrostatic discharge path to effectively protect the substrate SUB stored in the storage case 100 from electrostatic discharge.

圖6是根據本發明一實施例的顆粒檢測方法的流程示意圖。請參照圖6,本實施例的顆粒檢測方法能夠在不開啟存放盒100(繪示於圖1至圖4)的情況下,透過透光檢測窗W對存放於存放盒100內的基板SUB進行顆粒檢測或其他表面特性的檢測。當在基板SUB上進行完第一製程(例如微影製程、烘烤製程、顯影製程、蝕刻製程等)之後,將基板SUB存放在存放盒100之中,並且藉由透光檢測窗W對存放於存放盒100中的基板SUB進行顆粒檢測製程。此處,存放盒100不但可用於基板SUB的存放與運輸,亦可被應用於顆粒檢測製程之中。由於本實施例的存放盒100具有透光檢測窗W,因此在不開啟存放盒100的情況下對存放於存放盒100內的基板SUB進行顆粒檢測或其他表面特性的檢測。據此,具有透光檢測窗W的存放盒100可降低顆粒或缺陷出現在基板SUB的表面的機率,進而改善製造良率。FIG. 6 is a schematic flow chart of a particle detecting method according to an embodiment of the present invention. Referring to FIG. 6 , the particle detecting method of the present embodiment can perform the substrate SUB stored in the storage box 100 through the light transmission detecting window W without opening the storage box 100 (shown in FIGS. 1 to 4 ). Detection of particle detection or other surface characteristics. After the first process (eg, lithography process, baking process, development process, etching process, etc.) is performed on the substrate SUB, the substrate SUB is stored in the storage case 100, and is stored by the light transmission detection window W. The substrate SUB in the storage case 100 performs a particle detecting process. Here, the storage box 100 can be used not only for the storage and transportation of the substrate SUB, but also for the particle detection process. Since the storage case 100 of the present embodiment has the light transmission detecting window W, the substrate SUB stored in the storage case 100 is subjected to particle detection or other surface characteristics detection without opening the storage case 100. According to this, the storage case 100 having the light transmission detecting window W can reduce the probability that particles or defects appear on the surface of the substrate SUB, thereby improving the manufacturing yield.

在一些實施例中,在對存放於存放盒100內的基板SUB進行顆粒檢測或其他表面特性的檢測之後,可進一步從存放盒100中取出基板SUB,並且在基板SUB上進行第二製程(例如微影製程、烘烤製程、顯影製程、蝕刻製程等)。在進行完第一製程之後以及進行第二製程之前,存放盒100可以降低基板SUB暴露於外而遭受到顆粒污染的機率,進而改善製造良率。In some embodiments, after detecting the particle detection or other surface characteristics of the substrate SUB stored in the storage case 100, the substrate SUB may be further taken out from the storage case 100, and the second process is performed on the substrate SUB (for example, Photolithography process, baking process, development process, etching process, etc.). After the first process is completed and before the second process is performed, the storage case 100 can reduce the probability that the substrate SUB is exposed to particles and be exposed to particle contamination, thereby improving the manufacturing yield.

舉例而言,前述的顆粒檢測製程包括光源200的提供以及基板SUB的待檢測表面的影像擷取。首先,提供光源200至存放於存放盒100中的基板SUB上,以使光源200所提供的光線照射在基板SUB的待檢測表面上,接著擷取存放於存放盒100中的基板SUB的待檢測表面的影像,以判斷基板SUB的待檢測表面上是否存在顆粒及/或瑕疵。在一些實施例中,光源200可提供離軸照明(off-axis lighting)或同軸照明(on-axis lighting),而基板SUB的影像可透過影像擷取裝置300來擷取。影像擷取裝置300例如包括影像感測器(例如電荷耦合元件、互補金氧半導體感測器等感測陣列)以及影像擷取鏡頭。當光源200提供離軸照明時,光源200所提供的照明光束是以不平行於影像擷取鏡頭的光軸的角度照射於基板SUB的待檢測表面。當光源200提供同軸照明時,光源200所提供的照明光束是以平行於影像擷取鏡頭的光軸的角度照射於基板SUB的待檢測表面。For example, the aforementioned particle detecting process includes the supply of the light source 200 and the image capturing of the surface to be inspected of the substrate SUB. First, the light source 200 is provided on the substrate SUB stored in the storage box 100, so that the light provided by the light source 200 is irradiated on the surface to be inspected of the substrate SUB, and then the substrate SUB stored in the storage box 100 is to be detected. An image of the surface to determine whether particles and/or flaws are present on the surface to be inspected of the substrate SUB. In some embodiments, the light source 200 can provide off-axis lighting or on-axis lighting, and the image of the substrate SUB can be captured by the image capturing device 300. The image capturing device 300 includes, for example, an image sensor (for example, a charge coupled device, a sensing array such as a complementary MOS sensor), and an image capturing lens. When the light source 200 provides off-axis illumination, the illumination beam provided by the light source 200 is illuminated on the surface to be inspected of the substrate SUB at an angle that is not parallel to the optical axis of the image capture lens. When the light source 200 provides coaxial illumination, the illumination beam provided by the light source 200 is illuminated on the surface to be inspected of the substrate SUB at an angle parallel to the optical axis of the image capture lens.

承上述,光源200的設置以能夠提供均勻的光線照射至基板SUB的待檢測表面上並且能夠讓影像擷取裝置300順利擷取基板SUB的待檢測表面為原則,本實施例不限定光源200與影像擷取裝置300的相對設置位置。In the above, the light source 200 is disposed to provide uniform light to the surface to be inspected of the substrate SUB and allows the image capturing device 300 to smoothly capture the surface to be inspected of the substrate SUB. The relative position of the image capturing device 300.

前文概述若干實施例的特徵,使得所屬領域中具通常知識者可較好地理解本發明的態樣。所屬領域中具通常知識者應瞭解,其可易於使用本發明作為設計或修改用於進行本文中所引入的實施例的相同目的以及/或達成相同優勢的其他製程以及結構的基礎。所屬領域中具通常知識者亦應認識到,此類等效構造並不脫離本發明的精神以及範疇,且其可在不脫離本發明的精神以及範疇的情況下在本文中進行各種改變、替代以及更改。 The foregoing has outlined the features of several embodiments, such that those of ordinary skill in the art can understand the invention. It will be appreciated by those of ordinary skill in the art that the present invention can be readily utilized as a basis for designing or modifying other processes and structures for the same purposes and/or advantages of the embodiments disclosed herein. It should be understood by those of ordinary skill in the art that the present invention is not limited to the spirit and scope of the invention, and various changes and substitutions may be made herein without departing from the spirit and scope of the invention. And changes.

100‧‧‧存放盒 100‧‧‧Storage box

110‧‧‧底座 110‧‧‧Base

112‧‧‧定位孔 112‧‧‧Positioning holes

120‧‧‧上蓋 120‧‧‧Upper cover

122‧‧‧開孔 122‧‧‧Opening

124‧‧‧提把 124‧‧‧提提

126‧‧‧緩衝材料 126‧‧‧ cushioning material

200‧‧‧光源 200‧‧‧Light source

300‧‧‧影像擷取裝置 300‧‧‧Image capture device

A‧‧‧位置 A‧‧‧ position

B‧‧‧上蓋主體 B‧‧‧Cap body

D‧‧‧直徑 D‧‧‧diameter

SUB‧‧‧基板 SUB‧‧‧ substrate

S‧‧‧存放空間 S‧‧‧ storage space

W‧‧‧透光檢測窗 W‧‧‧Light transmission detection window

W1‧‧‧透光基材 W1‧‧‧Lighting substrate

W2‧‧‧抗靜電層 W2‧‧‧Antistatic layer

WD‧‧‧寬度 W D ‧‧‧Width

圖1是根據本發明一實施例的存放盒的立體示意圖。 圖2是根據本發明一實施例的存放盒的側面透視示意圖。 圖3是根據本發明一實施例的存放盒的頂視示意圖。 圖4是根據本發明一實施例的存放盒的底視示意圖。 圖5A至圖5C是圖2中位置A的局部放大示意圖。 圖6是根據本發明一實施例的顆粒檢測方法的流程示意圖。1 is a perspective view of a storage case in accordance with an embodiment of the present invention. 2 is a side perspective view of a storage case in accordance with an embodiment of the present invention. 3 is a top plan view of a storage case in accordance with an embodiment of the present invention. 4 is a bottom plan view of a storage case in accordance with an embodiment of the present invention. 5A to 5C are partial enlarged views of the position A in Fig. 2. FIG. 6 is a schematic flow chart of a particle detecting method according to an embodiment of the present invention.

Claims (10)

一種存放盒,適於存放基板,所述存放盒包括:底座;以及上蓋,覆蓋所述底座並且與所述底座組裝,其中所述基板適於被存放在所述底座與所述上蓋之間的存放空間內,所述上蓋包括上蓋主體、安裝於所述上蓋主體中且位於所述基板上方的透光檢測窗以及配置於所述上蓋主體與所述透光檢測窗之間的緩衝材料,且所述透光檢測窗的尺寸大於所述基板的尺寸。 A storage case adapted to store a substrate, the storage case comprising: a base; and an upper cover covering the base and assembled with the base, wherein the substrate is adapted to be stored between the base and the upper cover In the storage space, the upper cover includes an upper cover body, a light transmission detection window mounted in the upper cover body and located above the substrate, and a buffer material disposed between the upper cover body and the light transmission detection window, and The size of the light transmission detecting window is larger than the size of the substrate. 如申請專利範圍第1項所述的存放盒,其中所述透光檢測窗的穿透率高於或等於90%。 The storage case according to claim 1, wherein the light transmission detecting window has a transmittance higher than or equal to 90%. 如申請專利範圍第1項所述的存放盒,其中所述緩衝材料具有導電性。 The storage case of claim 1, wherein the cushioning material is electrically conductive. 如申請專利範圍第1項所述的存放盒,其中所述透光檢測窗包括:透光基材;以及抗靜電層,位於所述透光基材的表面上。 The storage case according to claim 1, wherein the light transmission detecting window comprises: a light transmissive substrate; and an antistatic layer on the surface of the light transmissive substrate. 一種存放盒,適於存放基板,所述存放盒包括:底座;以及上蓋,覆蓋所述底座並且與所述底座組裝,其中所述基板適於被存放在所述底座與所述上蓋之間的存放空間內,所述上蓋包括上蓋主體、透光檢測窗以及配置於所述上蓋主體與所述透光檢測窗之間的緩衝材料,所述上蓋主體具有位於所述基板上方的開 孔,所述透光檢測窗安裝於所述開孔中,所述透光檢測窗的尺寸大於所述基板的尺寸,且所述透光檢測窗包括透光基材以及分別位於所述透光基材的內表面與外表面上的二抗靜電層。 A storage case adapted to store a substrate, the storage case comprising: a base; and an upper cover covering the base and assembled with the base, wherein the substrate is adapted to be stored between the base and the upper cover In the storage space, the upper cover includes an upper cover main body, a light transmission detecting window, and a buffer material disposed between the upper cover main body and the light transmission detecting window, and the upper cover main body has an opening above the substrate The light transmission detection window is installed in the opening, the size of the light transmission detection window is larger than the size of the substrate, and the light transmission detection window comprises a light transmissive substrate and is respectively located in the light transmission A second antistatic layer on the inner and outer surfaces of the substrate. 如申請專利範圍第5項所述的存放盒,其中所述透光檢測窗的穿透率高於或等於90%。 The storage case according to claim 5, wherein the transmittance of the light transmission detecting window is higher than or equal to 90%. 如申請專利範圍第5項所述的存放盒,其中所述緩衝材料具有導電性。 The storage case of claim 5, wherein the cushioning material is electrically conductive. 一種顆粒檢測方法,包括:在基板上進行第一製程;將所述基板存放在如申請專利範圍第1項至第7項中的任一項所述的存放盒中;以及藉由所述透光檢測窗對存放於所述存放盒中的所述基板進行顆粒檢測製程。 A particle detecting method comprising: performing a first process on a substrate; storing the substrate in a storage case according to any one of claims 1 to 7; The light detecting window performs a particle detecting process on the substrate stored in the storage box. 如申請專利範圍第8項所述的顆粒檢測方法,其中所述顆粒檢測製程包括:提供光源至存放於所述存放盒中的所述基板上;以及擷取存放於所述存放盒中的所述基板的影像以判斷所述基板上是否存在顆粒及/或瑕疵。 The particle detecting method of claim 8, wherein the particle detecting process comprises: providing a light source to the substrate stored in the storage box; and extracting a place stored in the storage box An image of the substrate is used to determine whether particles and/or defects are present on the substrate. 如申請專利範圍第8項所述的顆粒檢測方法,更包括:在對所述基板進行顆粒檢測之後,從所述存放盒中取出所述基板;以及在從所述存放盒中取出的所述基板上進行第二製程。 The particle detecting method of claim 8, further comprising: taking out the substrate from the storage box after performing particle detection on the substrate; and extracting the substrate from the storage case A second process is performed on the substrate.
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TWM496010U (en) * 2014-09-29 2015-02-21 Gudeng Prec Ind Co Ltd Reticle pod

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