TWI627482B - Method for manufacturing display - Google Patents

Abstract

A method for manufacturing a display device includes forming an insulating layer on a substrate. An element layer is formed on the insulating layer, and the element layer includes at least one electronic component. A contact hole is formed in the insulating layer. The material of the insulating layer is silicon oxide, silicon nitride, or silicon oxynitride. Remove the substrate. An electrode is formed on a surface of the insulating layer opposite to the element layer and in a contact hole, and the electrode is electrically connected to at least one electronic component. A liquid crystal layer is formed between the electrode and the opposite substrate.

Description

Manufacturing method of display device

The present disclosure relates to a method for manufacturing a display device.

In the field of liquid crystal display devices, a liquid crystal display device includes an array substrate, a color filter, and a liquid crystal layer disposed therebetween. Polymer Network Liquid Crystal (PNLC) includes a polymer polymer network and a liquid crystal. Liquid crystals are distributed in a three-dimensional network of polymers, forming a continuous network of channels. Under the influence of no electric field, it presents a chaotic state and optically exhibits a scattering or hazy type. When an electric field is applied, the liquid crystal is neatly arranged by the influence of the upper and lower electric fields, and it is optically transparent. Because of the advantages of wide viewing angle, high response speed, and low driving voltage, polymer network liquid crystals have been widely used in displays.

At present, polymer network liquid crystals generally use ultraviolet (UV) polymerization to polymerize monomers. However, liquid crystal panels are generally equipped with metal wires, color filters, and black matrix (BM) structures. These structures will shield or absorb ultraviolet light and reduce the monomer polymerization reaction, affecting the photoelectric properties of the polymer network liquid crystal.

In order to overcome the foregoing problems, the present disclosure provides a display device and a manufacturing method thereof, which reduces the problem of shielding ultraviolet light during the polymerization reaction stage of the liquid crystal layer, and simultaneously increases the uniformity of the polymerization reaction of the entire liquid crystal layer, thereby improving the display device Photoelectric characteristics.

An embodiment of the present disclosure is a display device including an insulating layer, an element layer, an electrode, an opposite substrate, and a liquid crystal layer. The insulating layer has a contact hole. The material of the insulating layer is silicon oxide, silicon nitride, or silicon oxynitride. The element layer is disposed on the insulating layer, and the element layer includes at least one electronic component. The electrode is disposed on a surface of the insulating layer opposite to the element layer and in a contact hole, wherein the electrode is electrically connected to at least one electronic component. The liquid crystal layer is located between the electrode and the opposite substrate.

Another embodiment of the present disclosure is a display device including an insulating layer, an element layer, an electrode, an opposite substrate, and a liquid crystal layer. The material of the insulating layer is polyethylene terephthalate, polyethylene naphthalate, polyether, polypropylene, vulcanized polypropylene, polycarbonate, polyetherimide, polyphenylene sulfide, polyoxydiene Toluene, polyfluorene or polyphthalamide. The element layer is disposed on the insulating layer. The element layer includes at least one electronic element and a dielectric layer disposed on the at least one electronic element. The dielectric layer has a contact hole. The electrode is disposed on a surface of the element layer opposite to the insulation layer and in a contact hole, wherein the electrode is electrically connected to at least one electronic component. The liquid crystal layer is located between the electrode and the opposite substrate.

Another embodiment of the present disclosure is a method for manufacturing a display device, which includes forming an element layer on an insulating layer, and the element layer includes at least one electron. element. A contact hole is formed in the insulating layer. The material of the insulating layer is silicon oxide, silicon nitride, or silicon oxynitride. An electrode is formed on a surface of the insulating layer opposite to the element layer and in a contact hole, and the electrode is electrically connected to at least one electronic component. A liquid crystal layer is formed between the electrode and the opposite substrate.

Another embodiment of the present disclosure is a method for manufacturing a display device, including forming an element layer on an insulating layer, the element layer including at least one electronic component and a dielectric layer disposed on the at least one electronic component, wherein the material of the insulating layer is Polyethylene terephthalate, polyethylene naphthalate, polyether, polypropylene, vulcanized polypropylene, polycarbonate, polyetherimine, polyphenylene sulfide, polyoxyxylene, polyfluorene, or Polyphthalamide. A contact hole is formed in the dielectric layer. An electrode is formed on a surface of the element layer opposite to the insulating layer and in a contact hole, and the electrode is electrically connected to at least one electronic component. A liquid crystal layer is formed between the electrode and the opposite substrate.

10, 20‧‧‧ display device

100, 200‧‧‧ substrate

110, 210‧‧‧ Insulation

110a, 210a‧‧‧ surface

112, 212‧‧‧ contact hole

120, 220‧‧‧ component layer

121, 221‧‧‧ electronic components

123, 223‧‧‧Dielectric layer

130, 142, 230, 242‧‧‧ electrodes

140, 240, 166, 266‧‧‧ Opposite substrates

140a‧‧‧side

144, 244‧‧‧ spacer

150, 150 ’, 250, 250’ ‧‧‧ liquid crystal layer

160, 260‧‧‧shading element

162, 262‧‧‧ color filters

164, 264‧‧‧ protective layer

170, 270‧‧‧light treatment

180, 280‧‧‧ backlight module

1211, 2211‧‧‧‧Gate

1213, 2213‧‧‧‧Gate dielectric

1215, 2215‧‧‧active zone

1217, 2217‧‧‧ Drain

1219, 2219‧‧‧ source

Read the following detailed description and the corresponding drawings to understand the various aspects of this disclosure. It should be noted that according to standard practice in the industry, multiple features are not drawn to scale. In fact, the dimensions of multiple features can be arbitrarily increased or decreased to facilitate clarity of discussion.

FIG. 1A to FIG. 1I are cross-sectional views of a display device according to some embodiments of the disclosure at different manufacturing stages.

FIG. 2A to FIG. 2I are cross-sectional views of a display device of some embodiments of the disclosure at different manufacturing stages.

The following disclosure provides many different embodiments or examples for implementing the different features of the main content provided in this case. The components and configurations of a specific example are described below to simplify this disclosure. Of course, this example is only illustrative and is not intended to be limiting. For example, the following description "the first feature is formed on or above the second feature", in the embodiment may include the first feature and the second feature in direct contact, and may also be included in the first feature and the second feature Additional features are formed between the first feature and the second feature without direct contact. In addition, the disclosure may reuse component symbols and / or letters in various examples. The purpose of this repetition is to simplify and clarify, and does not itself define the relationship between the embodiments and / or configurations discussed.

In addition, spatially relative terms such as "beneath", "below", "lower", "above", "upper", etc. are used herein to simplify the description To describe the relationship between one element or feature and another element or feature as illustrated in the drawings. In addition to the orientation depicted, spatial relative terms also include the different orientations of an element in use or operation. This device can be oriented in other ways (rotated 90 degrees or at other orientations), and the spatially relative descriptors used in this case can be interpreted accordingly.

FIG. 1A to FIG. 1I are cross-sectional views of the display device 10 at different manufacturing stages according to some embodiments of the disclosure. Referring to FIG. 1A, an insulating layer 110 is formed on the substrate 100. In some embodiments, the substrate 100 may be a glass substrate or other suitable materials. The insulating layer 110 may have a single-layer structure or a multi-layer structure. In some embodiments, the material of the insulating layer 110 is silicon oxide. (silicon oxide), silicon nitride, silicon oxynitride, or other suitable materials. The insulating layer 110 is used as a flexible substrate, and will be separated from the substrate 100 in the subsequent process steps. In some embodiments, an interface layer may be formed between the insulating layer 110 and the substrate 100, so that in a subsequent substrate peeling process, the insulating layer 110 and the substrate 100 may be separated in a substantially stress-free state.

Referring to FIG. 1B, an element layer 120 is formed on the insulating layer 110. The device layer 120 includes at least one electronic device 121. In this embodiment, the electronic component 121 is a thin film transistor, and includes a gate 1211, a gate dielectric 1213, an active region 1215, a drain 1217, and a source 1219. The method for forming the electronic component 121 may include forming a gate electrode 1211 on the insulating layer 110; forming a gate dielectric 1213 on the gate electrode 1211; and forming an active region 1215 and an active region 1215 on the gate dielectric 1213. It includes indium gallium zinc oxide (IGZO), amorphous silicon, polycrystalline silicon, single crystal silicon, or other suitable semiconductor materials. The active region 1215 may be a single layer or multiple layers. Then, a drain is formed on the active region 1215 1217 and the source 1219. In some embodiments, the drain electrode 1217 and the source electrode 1219 are metal.

In some embodiments, the device layer 120 further includes a dielectric layer 123 formed on the electronic device 121. The dielectric layer 123 may be a resin material, such as epoxy resin, acrylic resin, or the like. The dielectric layer 123 may be an organic material, such as benzocyclobutene, parylene, or the like. The dielectric layer 123 may also be silicon oxide, silicon nitride, silicon oxynitride, or a combination thereof. Together. In some embodiments, the dielectric layer 123 may be omitted.

Referring to FIG. 1C, a color layer (not labeled) is disposed above the dielectric layer 123. The color layer includes a light shielding element 160 and a color filter 162. In some embodiments, the light-shielding element 160 is a black matrix, and the material may be chromium (Cr) or a black resin. The color filter 162 may include red (R), green (G), and blue (B) color filters. The light-shielding element 160 corresponds to a position of the electronic element 121 to completely or partially overlap the electronic element 121 on a vertical projection of the insulating layer 110, thereby blocking or absorbing scattered light. In this embodiment, the color filter 162 is formed first, and then the light-shielding element 160 is formed on the color filter 162, but is not limited thereto. In other variations, the light-shielding element 160 may be formed first, and then A color filter 162 is formed on the light shielding element 160.

Next, an overcoat layer 164 is selectively formed on the light shielding element 160 and the color filter 162. The protective layer 164 may be a transparent organic material or an inorganic material. The protective layer 164 has a substantially flat upper surface. Next, a first opposing substrate 166 is disposed on the protective layer 164. In some embodiments, the first opposite substrate 166 is a glass substrate, or other suitable materials. Alternatively, the first opposing substrate 166 and the color layer may be closely adhered to the pair by using an adhesive layer, but not limited thereto. In other variations, a light-shielding element 160 may be formed on the first opposing substrate 166 first, and then a color filter 162 may be formed on the light-shielding element 160, and then the light-emitting element 160 having the first opposite substrate 166 and the light-shielding element 160 may be formed. And the components of the color filter 162 are joined to the structure in FIG. 1B in pairs, for example, they are joined by an adhesive layer.

Referring to FIG. 1D, a substrate peeling process is performed to separate the substrate 100 from the insulating layer 110. After the substrate 100 is peeled off, the insulation is exposed One surface 110a of the layer 110.

Referring to FIG. 1E, a contact hole 112 is formed. The contact hole 112 penetrates the gate dielectric 1213 of the electronic component 121 (as shown in FIG. 1B) of the insulating layer 110 and the element layer 120, and exposes the drain electrode 1217 of the electronic component 121. In detail, the step of forming the contact hole 112 is to first flip the display device 10 (such as the display device 10 after the substrate 100 is peeled off in FIG. 1D) so that the surface 110 a of the insulating layer 110 faces upward. Next, a masking layer is formed on the insulating layer 110, and the masking layer is patterned to form an opening, wherein the opening defines a position of the contact hole 112. Next, an etching process is performed on the insulating layer 110 and the gate dielectric 1213 to form a contact hole 112. The contact hole 112 can be formed using dry etching, wet etching, or other suitable etching techniques. In addition, the drain electrode 1217 can be used as an etch stop layer in the above-mentioned etching process of the insulating layer 110 and the gate dielectric 1213.

Referring to FIG. 1F, a first electrode 130 is formed on the surface 110 a of the insulating layer 110 and the contact hole 112. The first electrode 130 is electrically connected to the electronic device 121 in the device layer 120. In detail, the first electrode 130 is electrically connected to the drain electrode 1217 through the contact hole 112. From another perspective, the first electrode 130 is formed on a surface 110 a of the insulating layer 110 opposite to the element layer 120. In some embodiments, the first electrode 130 may include a metal oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc aluminum oxide (AZO), indium aluminum oxide (AIO), indium oxide (InO), Gallium oxide (GaO); nanometer carbon tubes, nanometer silver particles; metal or alloy with a thickness less than 60 nanometers (nm), organic transparent conductive materials, or other suitable transparent conductive materials. In addition, the method of forming the first electrode 130 is similar to FIG. 1E. First, the display device 10 in FIG. 1E is turned over so that the exposed surface 110a and the contact hole 112 of the insulating layer 110 face upward. The first electrode 130 is formed by a suitable deposition technique (such as a suitable technique such as electron beam evaporation, chemical vapor deposition, or physical vapor deposition). In addition, the first electrode 130 may be further patterned to obtain a desired functional circuit.

Referring to FIG. 1G, a second opposite substrate 140 is disposed on the opposite side of the first electrode 130. A second electrode 142 is formed on the second opposite substrate 140. The material of the second electrode 142 may be similar to that of the first electrode 130. In addition, a spacer 144 may be disposed between the second electrode 142 and the first electrode 130 to form a gap G between the second opposite substrate 140 (or the second electrode 142) and the first electrode 130. The gap G is used for The liquid crystal material is filled in a subsequent step.

Referring to FIG. 1H, a liquid crystal material is filled in the gap G, thereby forming a liquid crystal layer 150 between the second opposite substrate 140 (or the second electrode 142) and the first electrode 130. In some embodiments, the material of the liquid crystal layer 150 is a mixed monomer liquid crystal material or other liquid crystal materials.

Next, a light process 170 is performed on the liquid crystal layer 150. In this embodiment, for example, the light treatment 170 is performed by irradiating the liquid crystal layer 150 with ultraviolet light (UV), thereby allowing the monomers of the liquid crystal layer 150 to undergo a polymerization reaction to form a liquid crystal layer 150 ′ (as shown in FIG. 1I). The material of 150 'is polymer network liquid crystal, polymer network liquid crystal, polymer dispersed liquid crystal, or cholesterol liquid crystal, etc. This step is exemplified by photopolymerization. Phase separation (Photopolynerization induced phase separation). In detail, the light treatment 170 is performed on the liquid crystal layer 150 by the side 140 a of the second opposite substrate 140 away from the first electrode 130. In other words, the ultraviolet light polymerizes the monomers in the liquid crystal layer 150 through the second opposite substrate 140 and the second electrode 142.

In this embodiment, the liquid crystal layer 150, the element layer 120, and the light shielding element 160 are respectively disposed on opposite sides of the insulating layer 110. Therefore, during the polymerization of the monomers, the ultraviolet light can directly polymerize the monomers in the liquid crystal layer 150 through the second opposite substrate 140 and the second electrode 142 without being affected by the electronic component 121 in the element layer 120. The metal wiring, the color filter 162, or the light shielding element 160 (such as: ultraviolet light is shielded or absorbed). In addition, the liquid crystal layer 150 is disposed on the other side of the insulating layer 110 so that the first electrode 130 and the second electrode 142 provide a substantially flat surface, so that the liquid crystal material can be uniformly distributed in the liquid crystal layer 150. Through this configuration, the liquid crystal layer 150 'has better photoelectric characteristics.

Referring to FIG. 11, a backlight module 180 is configured. In this embodiment, the backlight module 180 is disposed on a side of the liquid crystal layer 150 'opposite to the light shielding element 160 (or the color filter 162). Therefore, the backlight module 180, the liquid crystal layer 150, the element layer 120, and the color filter 162 (or the light shielding element 160) are sequentially arranged from bottom to top in FIG. In other words, the light is first provided through the backlight module 180, then through the liquid crystal layer 150 ', and then emitted through the color filter 162 (or the light shielding element 160). Specifically, light passing through the liquid crystal layer 150 and then passing through the color filter 162 will have better color and optical performance. In some embodiments, the backlight module 180 may be a direct type backlight module Or edge-lit backlight module.

FIG. 2A to FIG. 2I are cross-sectional views of the display device 20 at different manufacturing stages according to some embodiments of the disclosure. Referring to FIG. 2A, an insulating layer 210 is formed on the substrate 200. In some embodiments, the substrate 200 may be a glass substrate or other suitable materials. Examples of the material of the insulating layer 210 include polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyethersulfone (PES), polypropylene, polypropylene, Polypropylene sulfide, polycarbonate, polyetherimide (PEI), polyphenylene sulfide (PPS), polyphenylene oxide (PPO), polyfluorene (polysulfone) or polyphthalamide (PPA). The insulating layer 210 is used as a flexible substrate, and will be separated from the substrate 200 in a subsequent process step. In some embodiments, an interface layer may be formed between the insulating layer 210 and the substrate 200, so that in the subsequent substrate peeling process, the substrate 200 may be peeled in a substantially stress-free state.

Referring to FIG. 2B, an element layer 220 is formed on the substrate 200 and the insulating layer 210. The device layer 220 includes at least one electronic device 221. In this embodiment, the electronic component 221 is a thin film transistor, and includes a gate electrode 2211, a gate dielectric 2213, an active region 2215, a drain electrode 2217, and a source electrode 2219. The method for forming the electronic component 221 may include forming a gate electrode 2211 on the insulating layer 210. A gate dielectric 2213 is formed on the gate 2211; an active region 2215 is formed on the gate dielectric 2213, and the material of the active region 2215 includes indium oxide Gallium zinc, amorphous silicon, polycrystalline silicon, single crystal silicon or other suitable semiconductor materials. The active region 2215 may be a single layer or multiple layers. Then, a drain electrode 2217 and a source electrode 2219 are formed on the active region 2215. In some embodiments, the drain electrode 2217 and the source electrode 2219 are metal.

In some embodiments, the element layer 220 further includes a dielectric layer 223 formed on the electronic element 221. The dielectric layer 223 may be a resin material, such as an epoxy resin, an acrylic resin, or the like. The dielectric layer 223 may be an organic material, such as benzocyclobutene, parylene, or the like. The dielectric layer 223 may also be an insulating material, such as silicon oxide, silicon nitride, silicon oxynitride, or a combination thereof. In some embodiments, the dielectric layer 223 may be omitted.

Referring to FIG. 2C, a contact hole 212 is formed. The contact hole 212 penetrates the dielectric layer 223 and exposes the drain electrode 2217. In detail, the step of forming the contact hole 212 includes forming a masking layer (not shown) on the dielectric layer 223, and the masking layer is patterned to form an opening, wherein the opening defines the position of the contact hole 212. Next, an etching process is performed to remove a portion of the dielectric layer 223, thereby forming a contact hole 212. The above-mentioned etching process includes dry etching, wet etching, or other suitable etching techniques to form the contact holes 212. In addition, the drain feature 2217 can be used as an etch stop layer for the dielectric layer 223.

Referring to FIG. 2D, a first electrode 230 is formed on the surface of the dielectric layer 223 and the contact hole 212. The first electrode 230 is substantially electrically connected to the electronic device 221 in the device layer 220. In detail, the first electrode 230 is electrically connected to the drain electrode 2217 through the contact hole 212. From another perspective, the first electrode 230 is formed on a surface of the dielectric layer 223 of the element layer 220 opposite to the insulating layer 210. In some embodiments, the first electrode 230 may include metal oxygen. Compounds such as indium tin oxide, indium zinc oxide, zinc aluminum oxide, indium aluminum oxide, indium oxide, gallium oxide; carbon nanotubes, nano silver particles; metals or alloys with a thickness of less than 60 nanometers (nm), organic transparent conductive Materials or other suitable transparent conductive materials. The first electrode 230 may be formed by a suitable deposition technique (such as a suitable technique such as electron beam evaporation, chemical vapor deposition, physical vapor deposition, etc.). In addition, the first electrode 230 may be further patterned to obtain a desired functional circuit.

Referring to FIG. 2E, the first opposing substrate 240 is disposed on the opposite side of the first electrode 230. A second electrode 242 is formed on the first opposite substrate 240. The material of the second electrode 242 may be similar to that of the first electrode 230. In addition, a spacer 244 may be disposed between the second electrode 242 and the first electrode 230 to form a gap G between the first opposite substrate 240 (or the second electrode 242) and the first electrode 230. The gap G is used for The liquid crystal material is filled in a subsequent step.

Referring to FIG. 2F, a liquid crystal material is filled in the gap G, thereby forming a liquid crystal layer 250 between the first opposite substrate 240 (or the second electrode 242) and the first electrode 230. In some embodiments, the material of the liquid crystal layer 250 is a liquid crystal material of mixed monomers or other liquid crystal materials.

Next, a light process 270 is performed on the liquid crystal layer 250. In this embodiment, the light treatment 270 is, for example, by irradiating the liquid crystal layer 250 with ultraviolet light (UV), thereby allowing the monomers of the liquid crystal layer 250 to undergo a polymerization reaction to form a liquid crystal layer 250 ′ (as shown in FIG. 2G). The material of 250 'is polymer network liquid crystal, polymer dispersed liquid crystal (Polymer Dispersed Liquid Crystal) or cholesterol liquid crystal (Cholesteric Liquid Crystal). An example of the step is Photopolymerization induced phase separation. In detail, the light processing 270 is performed on the liquid crystal layer 250 by a side of the first opposite substrate 240 away from the first electrode 230. In other words, the ultraviolet light polymerizes the monomers in the liquid crystal layer 250 through the first opposing substrate 240 and the second electrode 242.

Referring to FIG. 2G, a substrate peeling process is performed to separate the substrate 200 from the insulating layer 210. After the substrate 200 is peeled off, one surface 210a of the insulating layer 210 is exposed.

Referring to FIG. 2H, a color layer (not labeled) is disposed below the insulating layer 210 so that the insulating layer 210 is located between the color layer and the element layer 220. The color layer includes a light shielding element 260 and a color filter 262. In some embodiments, the light-shielding element 260 is a black matrix, and the material may be chromium or black resin. The color filter 262 may include red, green, and blue color filters. The light-shielding element 260 corresponds to a position of the electronic element 221 to completely or partially overlap the electronic element 221 on a vertical projection of the insulating layer 210, thereby blocking or absorbing scattered light.

In addition, a protective layer 264 is formed between the insulating layer 210 and the color filter 262. The protective layer 264 may be a transparent organic material or an inorganic material. The protective layer 264 can be used as an adhesion layer between the insulating layer 210 and the color filter 262, so that the color filter 262 is attached to the insulating layer 210. Next, a second opposing substrate 266 is disposed on the color filter 262. In some embodiments, the second opposite substrate 266 is a glass substrate or other suitable materials. In some embodiments, the second opposite substrate 266 and the color filter 262 may be provided with another protective layer. In other variations, the light-shielding element 260 may be formed first. After the first opposing substrate 266 is formed, a color filter 262 is formed on the light shielding element 160, and then the component having the first opposing substrate 266, the light shielding element 260, and the color filter 262 is shown in FIG. 2G. The structures that have been separated from the substrate 200 are bonded in pairs, for example, by bonding with an adhesive layer. However, in other variations, a color filter 262 may be formed on the first counter substrate 266 first, and then a light shielding element 260 may be formed on the color filter 262, and then the first counter substrate 266 may be formed. The components of the color filter 262 and the light-shielding element 260 are bonded to the structure separated from the substrate 200 in FIG. 2G, for example, by bonding with an adhesive layer.

In this embodiment, the liquid crystal layer 250 'and the light shielding element 260 are respectively disposed on opposite sides of the insulating layer 210, and the element layer 220 is disposed between the liquid crystal layer 250' and the insulating layer 210. Therefore, during the polymerization reaction of the liquid crystal layer 250, the ultraviolet light can directly polymerize the liquid crystal layer 250 through the first counter substrate 240 and the second electrode 242 without being subjected to the metal wiring of the electronic component 221 in the element layer 220. , The influence of the color filter 262 or the light shielding element 260 (for example, the ultraviolet light is blocked or absorbed). In addition, the first electrode 230 and the second electrode 242 provide a substantially flat surface, so that the liquid crystal material can be uniformly distributed in the liquid crystal layer 250 '. Through this configuration, the liquid crystal layer 250 'has better photoelectric characteristics.

Referring to FIG. 2I, a backlight module 280 is disposed. In this embodiment, the backlight module 280 is disposed on a side of the liquid crystal layer 250 'opposite to the light shielding element 260 (or the color filter 262). Therefore, the backlight module 280, the liquid crystal layer 250 ', the element layer 220, and the color filter 262 (or the light shielding element 260) are sequentially arranged from top to bottom in FIG. 2I. In other words, light It is first provided through the backlight module 280, then through the liquid crystal layer 250 ', and then emitted through the color filter 262 (or the light shielding element 260). Specifically, light passing through the liquid crystal layer 250 'and then passing through the color filter 262 will have better color and optical performance. In some embodiments, the backlight module 280 may be a direct type backlight module or an edge type backlight module.

The present disclosure provides a liquid crystal layer and a light-shielding element on two sides of an insulating layer through a substrate separation technology. During the polymerization reaction, the liquid crystal layer is not affected by the light-shielding element or the metal wiring of the electronic element, thereby causing incident light (such as ultraviolet light) to be shielded or absorbed. In other words, the advantage of this configuration is that the monomers in the liquid crystal layer can be polymerized in the state of the lowest shielding, so that a uniform polymerization reaction can be generated everywhere in the liquid crystal layer, thereby increasing the overall photoelectric characteristics of the display.

Based on the above structure, the present disclosure further arranges the backlight module on one side of the liquid crystal layer opposite to the color filter (or light shielding element). The light is first provided through the backlight module 280, then through the liquid crystal layer 250, and then emitted through the color filter 262 (or the light shielding element 260). Specifically, light passes through the liquid crystal layer and then passes through a color filter to be emitted. This configuration enables the display device to have better color and optical performance.

The features of several embodiments are summarized above so that those skilled in the art can better understand the aspects of the present disclosure. Those skilled in the art should understand that they can easily use this disclosure as a basis to design or modify other processes and structures to achieve the same purpose and / or achieve the same advantages. Those skilled in the art should also understand that such equivalent structures do not depart from the spirit and scope of this disclosure, and Without departing from the spirit and scope of this disclosure, it can make various changes, substitutions and alterations to this article.

Claims (8)

A method for manufacturing a display device includes: forming an insulating layer on a substrate; forming an element layer on the insulating layer, the element layer including at least one electronic component; forming a contact hole in the insulating layer, wherein the insulating layer The material is silicon oxide, silicon nitride or silicon oxynitride; the substrate is removed; an electrode is formed on a surface of the insulating layer opposite to the element layer and in the contact hole, and the electrode is electrically connected to the at least one electronic component. And a liquid crystal layer is formed between the electrode and the opposite substrate. The method according to claim 1, further comprising: forming a light-shielding element on the element layer. The method according to claim 2, further comprising: arranging a backlight module on a side of the liquid crystal layer opposite to the light shielding element. A method for manufacturing a display device includes: forming an element layer on an insulating layer, the element layer including at least one electronic element; forming a light shielding element on the element layer; forming a contact hole in the insulating layer, wherein the insulation The material of the layer is silicon oxide, silicon nitride or silicon oxynitride; forming an electrode on a surface of the insulating layer opposite to the element layer and in the contact hole, the electrode is electrically connected to the at least one electronic component; and Forming a liquid crystal layer between the electrode and the opposite substrate, wherein the step of forming the liquid crystal layer between the electrode and the opposite substrate includes forming a liquid crystal material of a mixed monomer between the electrode and the opposite substrate Between; and performing a light treatment on the liquid crystal material of the mixed monomer from the side of the opposite substrate away from the electrode, thereby allowing the monomer to undergo a polymerization reaction to form the liquid crystal layer, and the material of the liquid crystal layer is a polymer Network liquid crystal, polymer dispersed liquid crystal (Polymer Dispersed Liquid Crystal) or cholesterol liquid crystal (Cholesteric Liquid Crystal). A method for manufacturing a display device includes: forming an insulating layer on a substrate; forming an element layer on the insulating layer, the element layer including at least one electronic component and a dielectric layer disposed on the at least one electronic component The material of the insulating layer is polyethylene terephthalate, polyethylene naphthalate, polyether, polypropylene, vulcanized polypropylene, polycarbonate, polyetherimide, polyphenylene sulfide, Polyoxyxylene, polyfluorene, or polyphthalamide; forming a contact hole in the dielectric layer; forming an electrode on a surface of the element layer opposite to the insulating layer and in the contact hole, the An electrode is electrically connected to the at least one electronic component; a liquid crystal layer is formed between the electrode and a pair of opposite substrates; and the substrate is removed. The method according to claim 5, further comprising: arranging a light shielding element on one side of the insulating layer opposite to the liquid crystal layer. The method according to claim 6, further comprising: arranging a backlight module on a side of the liquid crystal layer opposite to the light shielding element. A method for manufacturing a display device includes: forming an element layer on an insulating layer, the element layer including at least one electronic component and a dielectric layer disposed on the at least one electronic component, wherein a material of the insulating layer is poly Ethylene terephthalate, polyethylene naphthalate, polyether, polypropylene, sulfurized polypropylene, polycarbonate, polyetherimide, polyphenylene sulfide, polyoxyxylene, polyfluorene, or poly O-xylylenediamine; forming a contact hole in the dielectric layer; forming an electrode on a surface of the element layer opposite to the insulating layer and in the contact hole, the electrode and the at least one electronic component are electrically Connecting; and forming a liquid crystal layer between the electrode and a pair of opposing substrates; and disposing a light-shielding element on one side of the insulating layer opposite to the liquid crystal layer, wherein the liquid crystal layer is formed between the electrode and the opposing substrate The intermediate steps include: forming a liquid crystal material of a mixed monomer between the electrode and the opposite substrate; and performing a light treatment on the liquid crystal material of the mixed monomer from a side of the opposite substrate away from the electrode, whereby Let the monomer proceed Together to form the liquid crystal layer, the liquid crystal material is a layer of polymer network liquid crystal, polymer dispersed liquid crystal (Polymer Dispersed Liquid Crystal) or a cholesteric liquid crystal (Cholesteric Liquid Crystal).