TWI626517B - 陰影遮罩-基板對準方法 - Google Patents
陰影遮罩-基板對準方法 Download PDFInfo
- Publication number
- TWI626517B TWI626517B TW103128822A TW103128822A TWI626517B TW I626517 B TWI626517 B TW I626517B TW 103128822 A TW103128822 A TW 103128822A TW 103128822 A TW103128822 A TW 103128822A TW I626517 B TWI626517 B TW I626517B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- shadow mask
- grid
- light
- grids
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 220
- 238000000034 method Methods 0.000 title claims abstract description 27
- 230000003287 optical effect Effects 0.000 claims abstract description 103
- 238000002310 reflectometry Methods 0.000 claims 1
- 108020003175 receptors Proteins 0.000 abstract description 22
- 108091008695 photoreceptors Proteins 0.000 abstract description 7
- 238000000151 deposition Methods 0.000 description 53
- 230000008021 deposition Effects 0.000 description 52
- 238000006073 displacement reaction Methods 0.000 description 48
- 239000000463 material Substances 0.000 description 13
- 238000007740 vapor deposition Methods 0.000 description 6
- 238000012545 processing Methods 0.000 description 5
- 238000005070 sampling Methods 0.000 description 4
- 229910001374 Invar Inorganic materials 0.000 description 3
- 229910000833 kovar Inorganic materials 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229920001621 AMOLED Polymers 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Electroluminescent Light Sources (AREA)
- Length Measuring Devices By Optical Means (AREA)
- General Chemical & Material Sciences (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/973,328 US9122172B2 (en) | 2010-06-04 | 2013-08-22 | Reflection shadow mask alignment using coded apertures |
| US13/973,328 | 2013-08-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201520703A TW201520703A (zh) | 2015-06-01 |
| TWI626517B true TWI626517B (zh) | 2018-06-11 |
Family
ID=52484181
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103128822A TWI626517B (zh) | 2013-08-22 | 2014-08-21 | 陰影遮罩-基板對準方法 |
Country Status (4)
| Country | Link |
|---|---|
| KR (1) | KR20160050032A (ko) |
| CN (1) | CN105659402B (ko) |
| TW (1) | TWI626517B (ko) |
| WO (1) | WO2015027123A1 (ko) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9939605B2 (en) | 2015-08-06 | 2018-04-10 | Qualcomm Incorporated | Submicron wafer alignment |
| US10048473B2 (en) | 2015-08-06 | 2018-08-14 | Qualcomm Incorporated | Submicron wafer alignment |
| CN108064316B (zh) * | 2016-12-28 | 2020-10-27 | 深圳市柔宇科技有限公司 | 蒸镀机对位系统及蒸镀机对位系统选取方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6661951B1 (en) * | 2001-03-12 | 2003-12-09 | Thomas H. Blair | Optoelectric alignment apparatus |
| US20060086321A1 (en) * | 2004-10-22 | 2006-04-27 | Advantech Global, Ltd | Substrate-to-mask alignment and securing system with temperature control for use in an automated shadow mask vacuum deposition process |
| US20070246706A1 (en) * | 2005-06-08 | 2007-10-25 | Advantech Global, Ltd | Electronic circuit with repetitive patterns formed by shadow mask vapor deposition and a method of manufacturing an electronic circuit element |
| TW201231692A (en) * | 2010-06-04 | 2012-08-01 | Advantech Global Ltd | Shadow mask alignment using coded apertures |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4211489A (en) * | 1978-01-16 | 1980-07-08 | Rca Corporation | Photomask alignment system |
| JPH07142325A (ja) * | 1993-06-23 | 1995-06-02 | Nikon Corp | 位置合わせ装置 |
| US6469793B1 (en) * | 1999-08-10 | 2002-10-22 | Svg Lithography Systems, Inc. | Multi-channel grating interference alignment sensor |
| US20050275841A1 (en) * | 2004-06-09 | 2005-12-15 | Asml Netherlands B.V. | Alignment marker and lithographic apparatus and device manufacturing method using the same |
-
2014
- 2014-08-21 TW TW103128822A patent/TWI626517B/zh not_active IP Right Cessation
- 2014-08-22 KR KR1020167006325A patent/KR20160050032A/ko not_active Application Discontinuation
- 2014-08-22 CN CN201480058290.3A patent/CN105659402B/zh not_active Expired - Fee Related
- 2014-08-22 WO PCT/US2014/052211 patent/WO2015027123A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6661951B1 (en) * | 2001-03-12 | 2003-12-09 | Thomas H. Blair | Optoelectric alignment apparatus |
| US20060086321A1 (en) * | 2004-10-22 | 2006-04-27 | Advantech Global, Ltd | Substrate-to-mask alignment and securing system with temperature control for use in an automated shadow mask vacuum deposition process |
| US20070246706A1 (en) * | 2005-06-08 | 2007-10-25 | Advantech Global, Ltd | Electronic circuit with repetitive patterns formed by shadow mask vapor deposition and a method of manufacturing an electronic circuit element |
| TW201231692A (en) * | 2010-06-04 | 2012-08-01 | Advantech Global Ltd | Shadow mask alignment using coded apertures |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201520703A (zh) | 2015-06-01 |
| KR20160050032A (ko) | 2016-05-10 |
| CN105659402A (zh) | 2016-06-08 |
| WO2015027123A1 (en) | 2015-02-26 |
| CN105659402B (zh) | 2019-01-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9157148B2 (en) | Shadow mask alignment using coded apertures | |
| TWI254794B (en) | X-ray diffraction apparatus | |
| TWI626517B (zh) | 陰影遮罩-基板對準方法 | |
| CN100535767C (zh) | 一种调焦调平测量方法和装置 | |
| CN101663588B (zh) | 形变测量成像系统 | |
| CN103162832A (zh) | 包含参考光束的垂直入射宽带偏振光谱仪及光学测量系统 | |
| KR101317536B1 (ko) | 광학식 막두께계 및 광학식 막두께계를 구비한 박막 형성장치 | |
| US20060017931A1 (en) | Measuring apparatus | |
| KR101852663B1 (ko) | 편광광 조사 장치 | |
| US9122172B2 (en) | Reflection shadow mask alignment using coded apertures | |
| TW201704506A (zh) | 使用可變節距編碼孔徑之陰影遮罩對準技術 | |
| KR20170036108A (ko) | 기판의 형상 변화 측정 방법 | |
| CN105737758B (zh) | 一种长程面形测量仪 | |
| JPS62261003A (ja) | 位置合わせ方法 | |
| EP3663031A1 (en) | Laser processing apparatus | |
| EP4246204A1 (en) | Calibration target, fourier ptychographic imaging system and method for calibrating a fourier ptychographic imaging system | |
| US9580792B2 (en) | Shadow mask alignment using variable pitch coded apertures | |
| EP2691811B1 (en) | Measurement of the position of a radiation beam spot in lithography | |
| RU2674305C1 (ru) | Способ коррекции направлений отраженных призматическим уголковым отражателем пучков параллельных световых лучей | |
| JPH087322A (ja) | 旋光素子、収束発散光学装置及び光ピツクアツプ | |
| US10113711B2 (en) | Assembly for producing a plurality of beam bundles | |
| CN110174244A (zh) | 一种平面基底变间距光栅的线密度测试系统及测试方法 | |
| US20230136420A1 (en) | Metalens-integrated optical engine | |
| US8045250B1 (en) | Optical scanning using rotating parallel plate | |
| FI107358B (fi) | Fokusoiva interferometri |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |