TWI624380B - Printhead,print bar,and print cartridge including molded die slivers with exposed front and back surfaces - Google Patents

Abstract

In an exemplary implementation, a printhead includes a die strip molded into a molded article. The die strip includes a front surface exposed to the mold and flush with the molded article to dispense fluid, and a rear surface exposed to the mold and flush with the molded article to receive fluid. A plurality of edges of the die strip contact the molded article to form a joint between the die strip and the molded article.

Description

Includes print heads, print strips, and print cartridges with molded die strips that expose the front and back surfaces

The present invention is directed to molded grain strips having exposed front and back surfaces.

The inkjet pen and print strip can include one or more printhead dies each having a plurality of fluid injection elements on the surface of the ruthenium substrate. The fluid typically flows to the injection element through one or more fluid delivery slits formed in the substrate between opposing substrate surfaces. While such slits effectively deliver fluid to fluid injection components, there are still some disadvantages associated with their use. From a cost perspective, for example, fluid delivery slits occupy valuable 矽 available area and significantly increase slit processing costs. Partial reduction in the cost of the print head die can be achieved by reducing the grain size. However, the smaller grain size results in tighter slit pitches and/or slit widths in the tantalum substrate, which additionally increases the cost of assembly associated with the integration of smaller grains into the inkjet pen. Further, removing the material of the substrate to form an ink delivery slit weakens the structure of the print head die. Thus, when a single printhead die has multiple slits (eg, to improve the print quality and speed of the monochrome printhead die, or to provide different colors for the multicolor printhead die), print The head grains are more fragile as each slit increases.

According to an embodiment of the present invention, a printing head is specifically provided, comprising: a die strip molded in a molded article, the die strip comprising: a front surface exposed to the mold An outer portion of the article and flush with the molded article to dispense a fluid; a rear surface exposed to the outside of the molded article and flush with the molded article to receive a fluid; and a plurality of edges that are in contact with the molded article to A joint is formed between the die strip and the molded article.

100‧‧‧Molded head die/print head die/molded print head/die/print head

102‧‧‧Met strip/strip substrate

104‧‧‧Molded material/molded article/molded body

106‧‧‧Back surface

108‧‧‧ front surface

110‧‧‧矽Crystal substrate/substrate/矽 substrate/block substrate/die strip substrate

112‧‧‧Fluid feed hole

114‧‧‧First substrate surface

116‧‧‧Second substrate surface/second surface

118‧‧‧Blowing architecture layer/jet layer/layer

120‧‧Injection chamber/chamber

122‧‧‧ Corresponding orifice/flow orifice/ink injection orifice

124‧‧‧ solder pads

126, 704‧‧‧ edge

300‧‧‧ Carrier

302‧‧‧Hot peeling tape/tape/hot tape

304‧‧‧plastic cover

306‧‧‧small cap

400‧‧‧Joining enhanced morphological/morphological

402‧‧‧Cone edge/conical substrate edge

404‧‧‧Molded lips

500, 600, 700‧‧‧ Bonded Strengthened Morphology

502‧‧‧Outward tapered edge / tapered substrate edge / tapered edge

504‧‧‧Inward tapered edge / tapered substrate edge / tapered edge

506‧‧‧Upper molded lip area/molded lip area

508‧‧‧Molded lip area/molded lip area

602‧‧‧With notched edge/with notched substrate edge

604‧‧‧Molded notched area

702‧‧‧Conical edge/edge

706‧‧‧Molded lip area

800, 924‧‧‧ print head assembly

802‧‧‧ Printed Circuit Board (PCB)

804‧‧‧ window

900, 1200‧‧‧Inkjet printing device / inkjet printer / list machine

902‧‧ Print Card/Card

904‧‧‧Carriage

906‧‧‧Printing media/media

908‧‧‧Fluid compartment/compartment

910‧‧‧External supply/ink supply

911, 1214‧‧‧Management

912‧‧‧Media delivery assembly

913‧‧‧ grain carrier

914‧‧‧ Controller

915‧‧‧ corresponding holes

916‧‧‧Carshell housing/housing

917‧‧‧Low profile protection cover

918‧‧‧Ink mouth

920‧‧‧Electrical contacts/contacts

922‧‧‧Flexible circuit

1202‧‧‧Printing strips

1204‧‧‧Print media

1206‧‧‧Flow Regulator

1208‧‧‧Media transmission agency

1210‧‧‧Printing fluid supply/supplier

1212‧‧‧Listing machine controller/controller

1300‧‧‧Molded print/print strips

Several embodiments are now described with reference to the drawings.

1 is a perspective view of a thinned die head die embodiment suitable for use in a fluid injection device; FIG. 2 is a cross section of the exemplary print head die taken along line AA of FIG. 1; Several basic steps are shown for an exemplary method of making and thinning a die of a printhead; the embodiment of the diehead die of Figures 4 through 7 has a plurality of buried die strips comprising different bonds Reinforced topography embodiment; Figure 8 illustrates an exemplary printhead assembly with a number of die-printed printhead dies; Figure 9 illustrates a block diagram of an exemplary inkjet printer with exemplary columns The print cartridge includes one or more print head assembly embodiments for thinning the printhead die; FIG. 10 illustrates a perspective view of an exemplary print cartridge; and FIG. 11 illustrates a perspective view of the exemplary print cartridge Figure 12 is a block diagram of an exemplary ink jet printer in which a media wide print strip achieves an exemplary thinned print head die; Figure 13 illustrates a plurality of thinned print head die A perspective view of an exemplary molded printing strip.

In the figures, similar, but not necessarily identical elements are denoted by the same element symbols.

In the past, the cost of inkjet printhead dies has been reduced by reducing die size and reducing wafer cost. The grain size is substantially dependent on the spacing of the fluid transport slits formed through the tantalum substrate, which transport ink from the reservoir on one side of the die to the fluid injection element on the other side of the die. Therefore, most of the prior methods for reducing the grain size have included reducing the slit pitch and size by a silicon slotting process, which may include, for example, laser machining, anisotropic wet etching. Method, dry etching, combinations of these, and the like. Unfortunately, the cost of the squeezing method itself increases the cost of the print head die. In addition, as the grain size is reduced, the cost and complexity associated with integrating smaller die into an inkjet pen or print strip begins to outweigh the benefits of smaller die. In addition, as the grain size decreases, the removal of the grain material to form an ink delivery slit has an incremental negative impact on grain strength, which may increase the grain failure rate.

Recent developments in molded fluid flow structures, including molded ink jet print heads and molded ink jet print strips, have abolished the use of fluid transport slits in die substrates. An example of a molded fluid flow structure and method for making such a structure is disclosed in International Patent Application No. PCT/US2013/046065, filed on Jun. 17, 2013, entitled Printhead Die, and in March 2013. PCT/US2013/033046, filed on Jun. 20, entitled,,,,,,,,,,,,,,,,,,,,

These molded fluid flow structures (e.g., molded inkjet printheads) enable the use of very small printhead die "strips". The grain strips comprise a thin crucible, glass or other substrate (i.e., about 650 picometers or less) and an aspect ratio (L/W) of at least three. Molded fluid flow structures, such as molded ink jet printheads, are not formed through fluid slits through the die strip substrate. Instead, each of the die strips is molded into a monolithic molded body that provides a jet fan-out by forming a fluid passage into the molded article at the rear surface of the die strip. Thus, the molded printhead structure avoids significant costs associated with previous die grooving methods and associated assemblies for inkjet pen and printer strip manifolds entering the slotted die.

In previous molded inkjet printhead designs, fluid channels formed in the shaped body enabled the printing fluid to flow to the back surface of each of the die strips. An ink/ink feed hole (IFH) formed through the die strip from the back surface to the front surface enables fluid to flow through the strip to the fluid droplet injection chamber on the front surface, which Here, the print head is ejected through the nozzle. Used to form a fluid passage into the molded body and into the grain strip The method of ink feed holes is much less costly and complicated than the die grooving and assembly methods associated with previous print head designs. However, these methods still have additional costs and problems. For example, in a process, a dicing saw is used to sneak into a shaped body to form a fluid passage in a molded printhead die, as in International Patent Application No. PCT/US2013/ filed on Jun. 27, 2013. The title is Molded Fluid Flow Structure with Saw Cut Channel, which is incorporated herein by reference. In other embodiments, the fluid passages may be formed in the molded body by a compression molding method and a transfer molding method, for example, each of which is described in the following: International Patent Application No. PCT/US2013 filed on Jul. 29, 2013 U.S. Patent Application Serial No. PCT/US2013/052505, the entire disclosure of which is incorporated herein by reference. Thus, while there are many ways to form fluid passages in a shaped body, each contributes to measuring the cost and complexity of manufacturing a molded inkjet printhead.

In order to accomplish the further reduction in cost and complexity of the molded inkjet printhead, the embodiments described herein include "thinned" molded printhead dies comprising one or more die strips embedded in the shaped body. . The molded print head die is thinned or thinned from the back side to remove portions of the surface of the molded body after molding the die of the print head. Since the molding die grain is gradually thinned to the surface of the die strip (or a plurality of die strips) embedded in the molded article, no fluid passage into the molded body is formed to guide the fluid to the die strip The back surface is designed as previously molded inkjet print heads. Instead, the front of each die strip, The back surface is flush with the molding material in which the grain strips are embedded. Thinning the molding head die in this manner opens the fluid/ink feed holes (IFH) previously formed on the back surface of each of the die strips to enable fluid to flow from the back surface of the die strip to the die A fluid injection chamber on the front surface of the strip.

In one embodiment, a row of printheads includes a die strip molded into a molded article. The die strip includes a front surface that is flush with the molded article and exposed to the molded article to dispense fluid. The die strips also include a rear surface that is flush with the molded article and exposed to the outside of the molded article to receive the fluid. The die strip has a plurality of edges in contact with the molded article to form a joint between the die strip and the molded article.

In another embodiment, a row of print strips includes a plurality of thinned molded print head dies embedded in a molding material. The molded print head dies are arranged in a staggered configuration substantially end to end along the length of the printed circuit board (PCB), wherein one or more of the dies overlap the crystal One or more of the granules are adjacent to it. Each of the molded print head dies includes a die strip having a front surface and a rear surface exposed to the outside of the molded article. The rear surface is a fluid to receive fluid and the front surface is to be dispensed through the fluid feed holes of the die strips from the back surface to the front surface.

In another embodiment, a stack of print cartridges includes a housing that can include a printing fluid, and a thinned molded printhead die. The thinned molded print head die comprises a die strip embedded in a molded article. The die strip has a plurality of edges forming a joint with the molded article, and is exposed to the front surface and the rear surface of the molded article. The rear surface is to receive fluid and the front surface is to be dispensed from the back surface of the fluid feed hole that will pass through the die strip The fluid to the front surface.

As used herein, "printing head" and "printing head die" refer to the portion of an ink jet printer or other ink jet type dispenser that can dispense fluid from one or more nozzle openings. A row of printheads includes one or more printhead dies, and a row of printhead dies includes one or more die strips. A "strip" of a grain refers to a thin substrate (eg, tantalum or glass) having a thickness of about 200 picometers and an aspect ratio (L/W) of at least three. The print head and print head die are not limited for dispensing ink and other printing fluids, but may instead dispense other fluids for purposes other than printing.

The perspective view of Figure 1 illustrates a "thinned" molded printhead die 100 embodiment suitable for use in a fluid injection device, such as a print cartridge and/or print strip of an ink jet printer. In addition, FIG. 1 illustrates how one or more of the printhead dies 100 can be disposed within the printhead assembly 800. The exemplary printhead assembly 800 is described in greater detail below using FIG. 2 is a cross-sectional view of the exemplary printhead assembly 800 taken along line A-A of FIG.

Referring generally to Figures 1 and 2, the exemplary molded printhead die 100 of Figure 1 includes four die strips 102. The molded printhead die 100 has been "thinned" into a molded article material 104 (which may be interchanged herein with the molded article 104 or molded article 104), containing an epoxy mold compound, plastic or other suitable material. The moldable material has been thinned to the back surface 106 of each of the die strips 102. Thus, the back surface 106 of each of the die strips 102 is flush with the molded article material 104 and exposed to the outside of the molded article material 104 (i.e., not covered).

Each of the die strips 102 has a front table opposite the back surface 106 thereof Face 108. Through a molding process in which the die strips 102 are molded into the molded article material 104, the front surface 108 is flush with the molded article material 104 and is still exposed thereto, which causes the individual die strips 102 (and the print heads) The die 100) is capable of dispensing a fluid. Each of the die strips 102 includes a tantalum die substrate 110 comprising a thin tantalum strip comprising a fluid feed aperture 112 that is dry etched or otherwise formed therein to enable fluid to pass from the first substrate surface 114 to The second substrate surface 116 flows through the substrate 110. In addition to removing the molding material 104 of the back surface 106 of the die strip 102, the method for thinning the stamping die 100 (e.g., grinding) can also remove the thin masking fluid feed holes 112. A lidcap layer (not shown) allows fluid at the back surface 106 to enter and flow through the fluid feed aperture 112 to the front surface 108.

Formed on the second substrate surface 116 is one or more layers 118 defining a fluidic architecture to facilitate injection of fluid droplets of the molding head die 100. The fluidic architecture defined by layers (or plurality) 118 generally includes an injection chamber 120 having a plurality of corresponding orifices 122, a manifold (not shown), and other jet channels and structures. The (iso) layer 118 can include, for example, a chamber layer formed on the substrate 110, and a via layer formed separately over the chamber layer. In other embodiments, the (etc.) layer 118 can comprise a single unitary layer that combines the chamber with the orifice layer. The fluidic architecture layer 118 is typically formed from SU8 epoxy or some other polyamine material and can be formed by a variety of methods, including spin coating and lamination.

In addition to the jet architecture defined by the (iso) layer 118 on the germanium substrate 110, each die strip 102 includes an integrated circuit formed on the substrate 110 using a thin film layer and components (not shown). For example, with each injection chamber 120 Corresponding to is an injection element formed on the second surface 116 of the substrate 110, such as a thermal resistor injection element or a piezoelectric injection element. The injection elements are activated to inject droplets or streams of ink or other printing fluid from the chamber 120 through the orifices 122. Thus, each of the chambers 120 and corresponding orifices 122 and injection elements generally form a fluid drop generator formed on the second surface 116 of the substrate 110. The injection elements on each of the die strips 102 are connected to the pads 124 or other suitable electrical terminals on the die strips 102 either directly or through the substrate 110. In general, a wire bond connects the die strip pads 124 to the printed circuit board, and the printed circuit board is connected to the inkjet columns via the signal traces of the flex circuit 922 (FIGS. 10, 11). The controller on the printing device (Fig. 9, 900; Fig. 12, 1200) (Fig. 9, 914; Fig. 12, 1212), as of the international patent application No. CT/US2013/068529 filed on November 5, 2013 The title is Molded Printhead, the entire contents of which are incorporated herein by reference.

FIG. 3 illustrates several basic steps for making and thinning the stamping die 100. As shown in FIG. 3, at portion "A", the die strip 102 is attached to the carrier 300 with a thermal release tape 302. The die strips 102 are placed on the tape 302 with the front surface 108 positioned such that it is directed downward toward the carrier 300 and against the tape 302. Contact of the front surface 108 with the tape 302 seals the area around the bond pad 124 and prevents the epoxy molding material from entering during subsequent molding.

The molding method generally illustrated in Fig. 3 in the portion "B" may be a compression molding method, for example, or another suitable molding method such as transfer molding. In compression molding, preheating the molding material 104, such as a plastic or epoxy mold The creation is placed in a bottom mold (not specifically shown) together with the die strips 102. Then, the mold top 304 is lowered, and the heat and pressure forces the molding material 104 into all areas of the mold (except in the area around the pad 124 sealed by the tape 302) so that it encapsulates the grain strips. 102. The thin cap 306 prevents the molding material 104 from entering the fluid feed hole 112 of the strip substrate 102 during compression molding.

After the compression molding process, the carrier 300 is peeled off by the thermal tape 302, and the tape of the molding die 100 is removed, as shown in part "C" of FIG. As shown in part "D" of FIG. 3, the molded print head die 100 is thinned to a mold material that can cover the back surface 106 of the die strip 102, and a thin cover fluid feed hole 112. Cap 306. Thinning the die 100 may include grinding the molded article material 104 and the thin cap 306 with a diamond wheel, an ELID (on-line electrolytic dressing) grinding wheel, or another suitable grinding method. The thinning of the molded printhead die 100 leaves the exposed back surface 106 (i.e., not covered by the molding material 104) and is flush with the molding material 104, and it opens the fluid feed aperture 112 so that the fluid can Flow from the back surface 106 to the front surface 108 through the die strips 102.

The molding and the thinning process leaves the die strips 102 embedded within the molded article material 104 such that the sides of the edges 126 or die strips 102 include the number of surface regions that form the joints or are joined to the molded article 104. In some embodiments, a more robust joint is made between the die strip 102 and the molded article 104, which is applied to the edge 126 of the die strip 102. The bond-enhanced topography generally increases the surface area contact of the die strips 102 with the molded article material 104 to improve bonding and reduce the number of die strips 102 The possibility of the molded material 104 being loosened.

4 through 7 illustrate an embodiment of a molded printhead die 100, in which the buried die strip 102 includes an embodiment of a bonded strengthened topography 400. The bonded strengthened topography 400 illustrated in Figures 4-7 is not intended to be drawn to scale, and they include various solid topography embodiments that may be applied to the edge 126 of the die strip 102 to improve the die strip 102. Connection to the molded article material 104. Thus, the topography 400 is provided for illustration, and may actually be formed in a different shape and may be smaller or larger than that shown in Figures 4-7.

As shown in FIG. 4, an embodiment of a bonded strengthened topography 400 is provided in which the edges 126 of the bulk substrate 110 of the die strip 102 are tapered. In FIG. 4, the tapered edge 402 of the substrate 110 tapers outwardly from the second substrate surface 116 to the first substrate surface 114 (ie, away from the die strip 102). During molding, the molding material 104 forms a region of the molded lip 404 where the molding material 104 is seated over the tapered substrate edge 402. The molded lip 404 and the tapered edge 402 help to form a strong joint between the molded article material 104 and the die strip 102. The joints may be formed around all edges of the die strips 102 (i.e., the four edges 126 of the rectangular die strips 102), or fewer edges, such as two edges.

As shown in FIG. 5, another embodiment of a bonded reinforcement topography 500 is provided in which the edge 126 of the bulk substrate 110 of the die strip 102 tapers in two different directions. In FIG. 5, the edge 126 of the substrate 110 includes an outwardly tapered edge 502 that tapers from the second substrate surface 116 toward the first substrate surface 114 (ie, the edge is tapered away from the die strip 102). ,as well as From the first substrate surface 114 to the second substrate surface 116, the inwardly tapered edge 504 is tapered toward the die strip 102. During molding, the molding material 104 forms upper and lower molding lip regions 506, 508 where the molding material 104 surrounds the tapered substrate edges 502, 504. The molded lip regions 506, 508 and tapered edges 502, 504 help to form a strong joint between the molded article material 104 and the die strip 102. The joints may be formed around all edges of the die strips 102 (i.e., the four edges of the rectangular die strips 102), or fewer edges, such as two edges.

As shown in FIG. 6, another embodiment of a bonded reinforcement topography 600 is provided in which the edge 126 of the bulk substrate 110 of the die strip 102 has a recess. In Figure 6, the notched edges 602 of the substrate 110 are all concave (i.e., toward the die strips 102), but in other embodiments they may be concave (i.e., away from the die strips). 102). During molding, the molding material 104 forms a molded notched region 604 that projects into or fills the notched edge 602 of the substrate 110. Molded notched region 604 and notched substrate edge 602 help form a strong joint between molded article material 104 and die strip 102. The joints may be formed around all edges of the die strips 102 (i.e., the four edges of the rectangular die strips 102), or fewer edges, such as two edges.

As shown in Fig. 7, another embodiment of a bonded strengthened topography 700 is provided in which the edge 126 of the bulk substrate 110 of the die strip 102 is tapered. In FIG. 7, the tapered edge 702 of the substrate 110 tapers outwardly from the first substrate surface 114 to the second substrate surface 116 (ie, away from the die strip 102). This results in the die strip substrate 110 being slightly more than the formation of the fluidic architecture layer 118. SU8 is wide. Thus, during molding, the molding material 104 surrounds the edges 702 and 704 of the substrate 110 to form a molded lip region 706. The molded lip region 706 and the substrate 110 edges 702 and 704 help to form a strong joint between the molded article material 104 and the die strip 102. The joints may be formed around all edges of the die strips 102 (i.e., the four edges of the rectangular die strips 102), or fewer edges, such as two edges.

Although a specific embodiment of the bonded strengthened topography is illustrated and described herein with a germanium substrate 110 and a fluidics layer 118 at the edge 126 of the die strip 102, the shape and configuration of the shaped bodies There is no limit in this respect. Rather, the bond-reinforced topography formed at the edge 126 of the die strip 102 can take many other shapes and configurations, including, for example, grooves, cuts, notches, channels, cones, indentations, bumps, and the like. a combination of the like, and the like.

As shown in FIG. 8, one or more of the molded printhead dies 100 can be bonded or otherwise attached to the printhead assembly 800. The printhead assembly 800 typically includes a printed circuit board (PCB) 802 that attaches one or more molded printhead dies 100. The method of attaching the molded printhead die 100 to the PCB 802 includes, for example, the use of an adhesive or an additional molding method that molds the PCB 802 and the molded printhead die 100 into a single structure. In the exemplary printhead assembly 800 of FIG. 8, the four molded printhead dies 100 are each located within a window 804 cut out by the PCB 802. The molded printhead die 100 and PCB 802 can then be further attached to the die carrier (Fig. 9; 913) and other structural components, such as a manifold for printing a cartridge or a print strip for use in an inkjet column. Printed inside the device.

As described above, the thinned molded print head die 100 is suitable for use. For example, a print cartridge and/or a print strip of an ink jet printing device. The block diagram of FIG. 9 illustrates an embodiment of an inkjet printer 900 in which the print cartridge 902 includes an embodiment of a printhead assembly 800 that includes one or more thinned molded printhead dies 100. In the lister 900, a carriage 904 scans the print cartridge 902 back and forth over the print media 906 to apply ink to the media 906 in the desired pattern. The print cartridge 902 includes one or more fluid compartments 908 and printheads 100 that receive ink from an external supply 910 and provide ink to the molded printhead die 100. In other embodiments, the ink supply 910 can be integrated with the compartment (or plurality) 908 as a component of the self-contained printing cassette 902. In general, the number of compartments 908 in the cassette 902 corresponds to the number of die strips 102 embedded in the molded printhead die 100 such that each die strip 102 can be supplied by a different compartment 908. Different printing fluids (for example, inks of different colors). The manifold 911 includes ribs or other internal routing structures having corresponding holes 915 (e.g., FIG. 1) coupled to the die strip 102 and/or the rear surface 106 of the die carrier 913 to distribute printed fluid paths from the various compartments 908. To the appropriate die strips 102 in the molding die 100. During printing, the media transfer assembly 912 moves the print media 906 to the print cartridge 902 in a desired pattern to facilitate application of ink to the media 906. Controller 914 generally includes a program, a processor (or plurality), a memory (or plurality), electronic circuitry, and other necessary components to control the operating elements of lister 900.

FIG. 10 illustrates a perspective view of an exemplary print cartridge 902. Referring to FIGS. 9 and 10, the print cartridge 902 includes a thinned molded printhead die 100 supported by a cassette housing 916. The molded print head die 100 includes a buried mold Four elongated die strips 102 and PCB 802 of article material 104 (eg, epoxy molding). In the illustrated embodiment, the die strips 102 are configured to traverse the width of the molded printhead die 100 in parallel with one another. The printhead die 100 is located within a window 804 that has been cut by the PCB 802. Although the print cartridge 902 of the single molded printhead die 100 illustrates four die strips 102, other configurations are possible, such as having more or fewer die strips 102 each. More or less print head die 100. At the other end of the die strip 102 is a bond wire (not shown) that is covered by a low profile protective cover 917 that contains a suitable protective material, such as epoxy, and a flat placed over the protective material. Cap.

The print cartridge 902 is fluidically connected to the ink supply 910 through an ink port 918 and electrically coupled to the controller 914 via electrical contacts 920. Contact 920 is formed in flexible circuit 922 that is attached to housing 916. Signal traces (not shown) embedded within flex circuit 922 connect contacts 920 to corresponding contacts (not shown) on printhead die 100. Ink injection orifices 122 (not shown in FIGS. 9 and 10) on each of the die strips 102 are exposed through the opening of the flex circuit 922 along the bottom of the cassette housing 916.

The perspective view of FIG. 11 illustrates another exemplary print cartridge 902 that is suitable for use with the lister 900. In this embodiment, the print cartridge 902 includes a printhead assembly 924 having four thinned molded printhead dies 100 and a PCB 802 embedded in the molded article material 104 and by the cassette housing 916. support. Each of the molded printhead dies 100 includes four die strips 102 and is located within a window 804 that is cut by the PCB 802. Despite the total print head of this exemplary print cartridge 902 924 is illustrated as having four thinned molded printhead dies 100, although other configurations are possible, such as more or less molding with more or fewer die strips 102, respectively. The head die 100 is printed. At the other end of the die strip 102 in each of the mold print heads 102 is a bond wire (not shown) covered by a low profile protective cover 917, the low profile protective cover 917 comprising a suitable protective material, such as epoxy, And a flat cap placed on the protective material. As with the exemplary cassette 902 illustrated in FIG. 10, the ink port 918 fluidly connects the cassette 902 with the ink supply 910 and the electrical contacts 920 such that the print head assembly 924 of the cassette 902 is embedded in the flex circuit 922. The signal trace is electrically coupled to controller 914. Ink injection orifices 122 (not shown in FIG. 11) on each of the die strips 102 are exposed through the opening of the flex circuit 922 along the bottom of the cassette housing 916.

The block diagram of FIG. 12 illustrates the ink jet printer 1200 having a media wide print strip 1202 that implements another thinned molded printhead die 100 embodiment. The lister 1200 includes a print bar 1202 across the width of the print media 1204, a flow conditioner 1206 associated with the print bar 1202, a media transfer mechanism 1208, an ink or other printing fluid supply 1210, and a lister controller 1212. The controller 1212 is a program, a processor (or several) and associated memory, and electronic circuitry and necessary components to control the operating elements of the lister 1200. The print strip 1202 includes a configuration of thinned molded printhead dies 100 for dispensing printing fluid onto a sheet or continuous roll of paper or other print media 1204. The die strips 102 within each of the molded printhead dies 100 are received by the supply 1210 through the flow path through the flow path into the flow regulators 1206 and manifolds 1214 of the print strips 1202.

Figure 13 is a perspective view showing the molded print strip 1300 having a plurality of subtractions The thin molded printhead die 100 is suitable for use in the lister 1200 of FIG. Molded print strip 1300 includes a plurality of thinned stamped die grains 100 and PCB 802 embedded in molding material 104. The molded print head die 100 is disposed in a staggered configuration in a vertical direction in a row across the print bar 1300 in a window 804 cut out by the PCB 802, wherein each of the molded print head die 100 overlaps the adjacent die. The print head die 100 is formed. Although the ten molded printhead dies 100 are illustrated in a staggered configuration, the same or different configurations may use more or fewer printhead dies 100. At the other end of the die strip 102 in each of the die blanks 102 is a bond wire (not shown) covered by a low profile protective cover 917, the low profile protective cover 917 comprising a suitable protective material, such as epoxy, And a flat cap placed on the protective material.

Claims (15)

A printing head comprising: a die strip molded in a molded article, the die strip comprising: a front surface exposed outside the molded article and flush with the molded article to be dispensed a fluid; a rear surface exposed to the molding and flush with the molding to receive a fluid; and a substrate having a plurality of edges, the edges being in contact with the molded article to be in contact with the molded article A joint is formed between the molded articles. The print head of claim 1, further comprising: a plurality of fluid feed holes formed in the die strip to allow fluid to flow from the rear surface to the front surface through the die strip sheet. The printhead of claim 1 wherein the edges comprise tapered edges and the joint comprises a molded lip covering the tapered edges. The print head of claim 3, wherein the die strip further comprises a fluidic layer, and wherein the tapered edges taper outwardly such that the tantalum substrate is wider than the jet layer. The print head of claim 1, further comprising: a joint-strengthened topography for increasing surface area contact between the edges and the molded article. The print head according to claim 5, wherein the joint reinforcement topography system is selected A group consisting of a groove, a slit, a notch, a channel, a cone, a dent, a bump, and/or a combination thereof. The print head of claim 2, further comprising: a fluidic layer on the front surface; and a plurality of droplet generators formed in the fluidic layer to receive the fluid feed from the fluid The fluid of the well and the droplets of the fluid are ejected. The print head of claim 1, further comprising: a plurality of die strips molded in the molded article; and a manifold including a plurality of holes, the holes and the die strips One of the different ones is associated to deliver a particular fluid to it. The print head of claim 8 further comprising a grain carrier for adhering the plurality of die strips. A printing strip comprising: a plurality of molded printhead dies arranged substantially end-to-end along a length of a printed circuit board (PCB) in a staggered configuration, wherein one of the dies Exchanging one or more adjacent ones of the dies; each of the molding head dies has a plurality of die strips embedded in a molding material, each of the dies being exposed to a front surface and a rear surface of the molded article material, the rear surface for receiving a fluid, and the front surface for dispensing through the plurality of fluid feed holes in the die strip from the rear surface to The fluid of the front surface; wherein the die strips each comprise a substrate having a plurality of edges, the edges contacting the molding material to form a joint between the die strip and the molding material. The print strip of claim 10, wherein the front surface and the back surface are flush with the molding material. A printing cartridge comprising: a housing capable of containing a printing fluid; and a thinned molded head die comprising: a die strip embedded in a molded article The die strip includes a substrate having a plurality of edges forming a joint portion with the molded article, and a front surface and a rear surface exposed to the outside of the molded article, the rear surface being adapted to receive a fluid, The front surface is for dispensing a fluid that will flow from the back surface to the front surface through a plurality of fluid feed holes in the die strip. The print cartridge of claim 12, wherein the thinned molded print head die comprises a plurality of dies configured to traverse the molded article in parallel with each other along a bottom portion of the housing The strip, and wherein the print cartridge further comprises: a plurality of compartments, each compartment capable of holding a different printing fluid; and a manifold for providing a path for each printing fluid to be delivered to the strips One of the different ones in the film. The print cartridge of claim 12, further comprising: a die carrier for adhering the thinned die head die; and a manifold for providing path for each printing fluid Pass this The grain carrier is different from one of the grain strips. The printing cartridge of claim 12, wherein the engaging portion comprises: a tapered edge of the die strip; and a molding in the molded article adjacent to the tapered edge of the die strip Lips.