TWI621853B - Wafer inspection positioning device - Google Patents

Abstract

A wafer inspection positioning device for mounting on an air bearing seat, the air socket includes a mounting surface, and an air suction hole and a blowing hole formed on the mounting surface, the wafer inspection positioning device includes a positioning seat, the positioning seat The device includes a wafer mounting portion, a gas mounting portion, and a gas guiding portion. The wafer mounting portion has a wafer mounting groove, a first gas groove and a second gas groove. The gas seat mounting portion has a gas for the gas. The air bearing mounting groove is inserted into the seat, the air guiding portion has a surface for the mounting surface, a through hole penetrating the surface, and a first portion connecting the first air groove and the second air groove A three-gas tank whereby a wafer is subjected to adsorption from the through-hole and is positioned by blowing of gas from the first gas tank and the second gas tank to facilitate subsequent detection.

Description

Wafer inspection positioning device

The present invention relates to an inspection apparatus, and more particularly to a wafer inspection positioning apparatus.

After the existing wire is processed through a wire, a manual inspection is performed by a microscope to determine whether the circuit and the solder joints are normal. If everything is normal, the subsequent packaging operation can be performed, but if there is an abnormal condition, it must be Perform other abnormal condition exclusion tasks, such as taking out the abnormal wafer.

However, before the manual inspection, the wafer must be manually moved to a position that can be observed by the microscope, and the manual operation cannot accurately place the wafer at a fixed reference position, resulting in observation by the microscope. Position adjustments must be made, so the operation is cumbersome and time consuming.

Accordingly, it is an object of the present invention to provide a wafer inspection positioning apparatus that overcomes at least the disadvantages of the prior art.

Therefore, the wafer inspection positioning device of the present invention is mounted on an air bearing seat, the air socket includes a mounting surface, and an air suction hole and a blowing hole formed on the mounting surface, and the wafer inspection positioning device includes a positioning seat.

The positioning base includes a wafer mounting portion, an air bearing mounting portion opposite to the wafer mounting portion, and a gas guiding portion between the wafer mounting portion and the air bearing mounting portion, the wafer mounting portion having a wafer mounting groove Forming a first gas supply surface, a first gas supply surface, a first abutment surface and a second abutment surface, respectively, around the defined wafer mounting groove a first air groove of the surface, and a second air groove formed on the second air supply surface, the air seat mounting portion has a gas seat mounting groove adjacent to the air guiding portion for inserting the air seat The air guiding portion has a first surface facing the wafer mounting groove, a first surface opposite the first surface and facing the air bearing mounting groove, and is disposed on the second surface of the mounting surface, through the first surface, and a through hole of the second surface, and a third air groove formed on the second surface and communicating with the first air groove and the second air groove.

The effect of the present invention is that the wafer can be subjected to adsorption from the through hole by providing the wafer mounting groove, the through hole, the first gas groove, the second gas groove and the third gas groove, and The gas from the first gas tank and the second gas tank is positioned by blowing to facilitate subsequent detection.

Referring to Figures 1, 2 and 3, an embodiment of the wafer inspection positioning device of the present invention is mounted on an operable mobile device (not shown) for adsorbing a wafer to be inspected and squared. 5. The moving device includes a gas seat 6 including a mounting surface 61, and an air suction hole 62 and a blowing hole 63 formed on the mounting surface 61 and respectively providing the effects of suction and blowing.

Referring to Figures 3, 4, and 5, the wafer inspection positioning device includes a positioning base 2.

The positioning base 2 includes a wafer mounting portion 21, an air bearing mounting portion 23 opposite to the wafer mounting portion 21, and an air guiding portion 25 between the wafer mounting portion 21 and the air bearing mounting portion 23.

The wafer mounting portion 21 has a wafer mounting groove 211, a first air supply surface 212, a second air supply surface 213, and a first contact surface 214, which are sequentially defined around the wafer mounting groove 211. a second abutment surface 215, a first air groove 216 formed on the first air supply surface 212, a second air groove 217 formed on the second air supply surface 213, and two formed on the first abutment The first through hole 218 of the surface 214 and the second through hole 219 formed on the second abutting surface 215.

The first air channel 216 has a first slot region 221 connecting the chip mounting slot 211 and a first guiding channel 222 connecting the first slot region 221.

The second air channel 217 has a second slot 223 connecting the chip mounting slot 211 and a second guiding channel 224 connecting the second slot 223.

Referring to Figures 4, 6, and 7, the air seat mounting portion 23 has an air bearing mounting groove 231 adjacent to the air guiding portion 25 for inserting the air bearing 6.

Referring to FIGS. 3, 4, and 7, the air guiding portion 25 has a first surface 251 facing the wafer mounting groove 211, a first surface 251 opposite to the air mounting groove 231, and is disposed on the mounting surface. a second surface 252 , a through hole 253 extending through the first surface 251 and the second surface 252 , and a second surface 252 formed on the second surface 252 and communicating with the first air groove 216 and the second air groove 217 The third gas groove 254.

The third air channel 254 has a third slot 255 adjacent to the mounting surface 61, a third guiding channel 256 connecting the first guiding channel 222 and the third slot 255, respectively. The second guiding track 224 and the fourth guiding track 257 of the third groove area 255 are connected.

The third groove region 255 is annular and surrounds the outer side of the through hole 253.

See Figures 2, 6, and 7,

The mounting seat 2 is mounted on the air base 6 so that the air seat 6 is fitted to the air seat mounting groove 231. At this time, the mounting surface 61 and the second surface 252 are pushed against each other. The sealing effect is achieved such that the through hole 253 can only communicate with the suction hole 62, and the third air groove 254 can only communicate with the air blowing hole 63.

Referring to FIGS. 2, 7, and 8, the mobile device can be operated to align the wafer mounting groove 211 with the wafer 5, and the inhalation is started through the air suction hole 62. Since the air suction hole 62 is connected to the through hole. 253, so that the wafer 5 can be attached to the first surface 251 by the adsorption of the through hole 253, and the moving device can be operated to face the wafer 5 upward.

Referring to Figures 2, 7, and 9, finally, air is blown through the air blowing hole 63. Since the air blowing hole 63 is the third groove portion 255 that communicates with the third air groove 254, gas is blown from the air blowing hole when blowing. The third slot area 255 is inserted into the third slot area 255, and the third slot area 255 is blown by the first slot area 221 toward the wafer 5 through the third guiding track 256 and the first guiding track 222. And the third slot region 255 passes through the fourth guiding channel 257 and the second guiding channel 224, and is blown toward the wafer 5 by the second slot region 223, because the first slot region 221 and the first slot The two-groove area 223 forms one corner of the square shape, so that the wafer 5 is blown in a diagonal direction, so that two adjacent sides of the wafer 5 can respectively abut the first abutting surface 214 and the second The contact surface 215, so that the wafer 5 can be secured at a fixed reference position in the case where the position of each movement of the mobile device is a fixed position, so that the wafer 5 is subsequently circuit-on or When the solder joint is detected, it is ensured that the position of the wafer 5 is not deviated, so that it is not necessary to perform subsequent inspection by the microscope. The microscope is adjusted to speed up the inspection time.

It is to be noted that when the air is blown through the air blowing hole 63, the amount of intake air that is inhaled through the air intake hole 62 can be lowered accordingly, so that the wafer 5 can be easily blown to complete positioning.

In addition, in order to accelerate the positioning of the wafer 5, the wafer 5 can be inhaled through the first through holes 218 and the second through holes 219, so that the wafer 5 can be pressed against the wafer 5 more quickly and more stably. The first abutment surface 214 and the second abutment surface 215.

In summary, the wafer 5 can be received from the through hole by providing the wafer mounting groove 211, the through hole 253, the first gas groove 216, the second gas groove 217 and the third gas groove 254. The adsorption of 253 and the blowing of the gas from the first gas tank 216 and the second gas tank 217 are positioned to facilitate subsequent detection, so that the object of the present invention can be achieved.

However, the above is only the embodiment of the present invention, and the scope of the invention is not limited thereto, and all the equivalent equivalent changes and modifications according to the scope of the patent application and the patent specification of the present invention are still The scope of the invention is covered.

2‧‧‧ Positioning Block
21‧‧‧ Wafer Installation Department
211‧‧‧ wafer mounting slot
212‧‧‧First gas supply surface
213‧‧‧second gas supply surface
214‧‧‧First contact surface
215‧‧‧Second affixed
216‧‧‧First gas trough
217‧‧‧Second gas tank
218‧‧‧ first perforation
219‧‧‧Second perforation
221‧‧‧First trough area
222‧‧‧First Guide Road
223‧‧‧Second trough area
224‧‧‧Second Guide Road
23‧‧‧Air seat installation
231‧‧‧Air seat installation slot
25‧‧‧Gas Guide
251‧‧‧ first surface
252‧‧‧ second surface
253‧‧‧through holes
254‧‧‧ third gas trough
255‧‧‧ third trough area
256‧‧‧ Third Guide Road
257‧‧‧fourth guiding channel
5‧‧‧chip
6‧‧‧ Air Seat
61‧‧‧Installation surface
62‧‧‧ suction holes
63‧‧‧Blow holes

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of an embodiment of a wafer inspection and positioning apparatus, a gas holder and a wafer according to an embodiment of the present invention; 2 is a perspective view of the embodiment, the air block and the wafer; FIG. 3 is a plan view of the embodiment; FIG. 4 is a bottom view of the embodiment; FIG. 5 is a perspective view of the embodiment; 6 is a perspective view of the embodiment from another perspective; FIG. 7 is a cross-sectional view of the embodiment, the air holder and the wafer; FIG. 8 is a schematic view showing the state in which the wafer is adsorbed to the positioning seat; And Fig. 9 is a view similar to Fig. 8 illustrating the state in which the wafer is blown and positioned.

Claims (3)

A wafer inspection positioning device for mounting on an air bearing seat, the air socket includes a mounting surface, and an air suction hole and a blowing hole formed on the mounting surface, the wafer inspection positioning device comprises: a positioning seat, including a a wafer mounting portion, an air bearing mounting portion opposite to the wafer mounting portion, and a gas guiding portion between the wafer mounting portion and the air bearing mounting portion, the wafer mounting portion having a wafer mounting groove and sequentially defining a first air supply surface, a second air supply surface, a first abutting surface and a second abutting surface of the chip mounting slot of the outlet type, and a first gas formed on the first air supply surface a groove, and a second gas groove formed on the second gas supply surface, the air seat mounting portion has a gas seat mounting groove adjacent to the gas guiding portion for inserting the gas seat, the gas guiding portion Having a first surface facing the wafer mounting groove, a surface opposite the first surface and facing the air bearing mounting groove for abutting the second surface of the mounting surface, a first surface and the second surface a through hole, and one formed on the second surface and communicating with the first air groove and the second a third gas groove of the groove, the first gas groove has a first groove region connecting the wafer mounting groove, and a plurality of first guide channels connecting the first groove region, the second gas groove has a connection to the wafer a second slot of the mounting slot, and a second guiding channel connected to the second slot, the third air slot has a third slot adjacent to the mounting surface, and the plurality of first guides are respectively connected And a third guiding channel of the third slot area, and a plurality of fourth guiding tracks respectively connecting the second guiding track and the third slot area. The wafer inspection positioning device according to claim 1, wherein the wafer mounting portion further has a plurality of first perforations formed on the first abutting surface, and a plurality of second perforations formed on the second abutting surface. The wafer inspection positioning device of claim 1, wherein the third groove region is annular and surrounds an outer side of the through hole.