TWI619057B - Display device - Google Patents

Abstract

A display element includes a substrate, a signal line, a first insulating layer, and a first electrical layer. Electrode, second insulating layer, and second electrode. The signal line is located on the substrate. The first insulation layer is located on the signal line. The first electrode is on the first insulating layer. The second insulating layer is located on the first electrode and the first insulating layer. The second electrode is on the second insulating layer. The second insulating layer has a first through hole, and the first insulating layer and the second insulating layer have a second through hole in common. The signal line and the first electrode are electrically connected through the first through hole, the second through hole, and the second electrode.

Description

Display element

The invention relates to an element, and in particular to a display element.

In recent years, in order to achieve more convenient, lighter, and more humane purposes, many information products have been transformed from traditional keyboard or mouse input devices to use touch panels as input devices. The touch display device with a display function has become one of the most popular products today. According to different structures and manufacturing methods, touch display devices can be roughly divided into three types: out-cell, on-cell and in-cell.

In the manufacturing process of the in-cell touch display device, a through hole needs to be formed through an etching process. However, in the conventional through-hole design, the undercut may occur due to lateral etching, which may lead to the risk of peeling of the film, or the film may be under-etched due to under-etching. The gas generated between the layers cannot be exhausted, thereby causing bubbles between the layers of the film. As a result, short-circuit or open-circuit conditions may be caused, eventually causing low yield and poor product reliability. Therefore, how to overcome the problems of the above-mentioned conventional technologies has already been achieved. It has become a problem to be solved urgently.

At least one embodiment of the present invention provides an electronic component with better reliability.

At least one embodiment of the present invention provides an electronic component including a substrate, a signal line, a first insulating layer, a first electrode, a second insulating layer, and a second electrode. The signal line is located on the substrate. The first insulation layer is located on the signal line. The first electrode is on the first insulating layer. The second insulating layer is located on the first electrode and the first insulating layer. The second electrode is located on the second insulating layer. The second insulating layer has a first through hole, and the first insulating layer and the second insulating layer have a second through hole in common. The signal line and the first electrode pass through the first through hole. The second through hole and the second electrode are electrically connected.

At least one embodiment of the present invention provides an electronic component including a signal line, a first electrode, and a second electrode. The first electrode includes a main body portion and an extension portion connected to the main body portion. The main body portion does not overlap the signal line, and the extension portion overlaps the signal line. The signal line and the first electrode are electrically connected through the first through hole, the second through hole, and the second electrode. The second through hole does not substantially overlap the extension portion. The size of the second through hole is larger than the width of the extension portion.

In the electronic component provided in at least one embodiment of the present invention, during the manufacturing process of the electronic component, the risk of film peeling is reduced.

In the electronic component provided by at least one embodiment of the present invention, during the manufacturing process of the electronic component, the gas generated between the film layers can be easily discharged.

The manufacturing process of electronic components provided in at least one embodiment of the present invention can effectively improve product yield.

In order to make the above features and advantages of the present invention more comprehensible, embodiments are hereinafter described in detail with reference to the accompanying drawings. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention.

In the drawings, the thickness of each element and the like is exaggerated for clarity. Throughout the description, the same reference numerals denote the same elements. It should be understood that when an element such as a layer, film, region, or substrate is referred to as being "on another element" or "connected to another element" or "overlapping on another element", it may be directly on the other element It may be connected to another element, or an intermediate element may be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. As used herein, "connected" may refer to a physical and / or electrical connection.

It should be understood that, although the terms "first," "second," "third," etc. may be used herein to describe various elements, components, regions, layers and / or sections, these elements, components, regions, and / or sections, and / Or in part should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a "first element," "component," "region," "layer," or "portion" discussed below may be termed a second element, component, region, layer, or section without departing from the teachings herein.

The terminology used herein is for the purpose of describing particular embodiments only and is not limiting. As used herein, unless the content clearly indicates otherwise, the singular The forms "a", "an" and "the" are intended to include the plural forms, including "at least one". "Or" means "and / or". As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. It should also be understood that when used in this specification, the terms "including" and / or "including" designate the stated features, regions, wholes, steps, operations, presence of elements and / or components, but do not exclude one or more The presence or addition of other features, areas as a whole, steps, operations, elements, components, and / or combinations thereof.

In addition, relative terms such as "lower" or "bottom" and "upper" or "top" may be used herein to describe the relationship of one element to another element, as shown. It should be understood that relative terms are intended to include different orientations of the device in addition to the orientation shown in the figures. For example, if the device in one of the figures is turned over, elements described as being on the "lower" side of other elements would then be oriented on "upper" sides of the other elements. Thus, the exemplary term "down" may include orientations of "down" and "up", depending on the particular orientation of the drawings. Similarly, if the device in one of the figures is turned over, elements described as "below" or "beneath" other elements would then be oriented "above" the other elements. Thus, the exemplary terms "below" or "below" may include orientations above and below.

As used herein, "about", "substantially", or "approximately" includes the stated value and the average value within an acceptable deviation range of a particular value determined by one of ordinary skill in the art, taking into account the measurements and A specific number of measurement-related errors (ie, limitations of the measurement system). For example, "about" may mean within one or more standard deviations of the stated value, or within ± 30%, ± 20%, ± 10%, ± 5%.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted to have meanings consistent with their meanings in the context of the related art and the present invention, and will not be interpreted as idealized or excessive Formal meaning unless explicitly defined as such in this article.

Exemplary embodiments are described herein with reference to cross-sectional views that are schematic views of idealized embodiments. Accordingly, variations in the shapes of the illustrations as a result, for example, of manufacturing techniques and / or tolerances, are to be expected. Therefore, the embodiments described herein should not be construed as limited to the particular shape of the area as shown herein, but include shape deviations caused by, for example, manufacturing. For example, a region shown or described as flat may generally have rough and / or non-linear characteristics. Furthermore, the acute angles shown may be round. Thus, the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the precise shape of a region and are not intended to limit the scope of the claims.

100, 200, 300, 400‧‧‧ electronic components

110‧‧‧ substrate

120‧‧‧ signal line

120c‧‧‧conductor side wall

122‧‧‧Part I

122a‧‧‧Second upper surface

124‧‧‧ Part Two

130‧‧‧first insulating layer

140‧‧‧first electrode

142‧‧‧Main body

144‧‧‧ extension

144a‧‧‧First extension

140a1‧‧‧First upper surface

144b‧‧‧second extension

144b1‧‧‧ Third upper surface

144d‧‧‧first width

146‧‧‧Connecting pad

150‧‧‧Second insulation layer

160‧‧‧Second electrode

170, 270, 370, 470‧‧‧ first through hole

170a‧‧‧first side wall

170b‧‧‧first size

172‧‧‧First auxiliary through hole

172a‧‧‧Third side wall

180, 280‧‧‧Second through hole

180a‧‧‧Second sidewall

180b‧‧‧Second size

190‧‧‧Third through hole

190a‧‧‧Fourth side wall

d‧‧‧horizontal spacing

PE‧‧‧Pixel electrode

T, T’‧‧‧ Active components

GE, GE’‧‧‧ Gate

GI‧‧‧Gate insulation

CH, CH’‧‧‧ channel layer

SE, SE’‧‧‧Source

DE, DE’‧‧‧ Drain

DEa‧‧‧ fourth upper surface

SL‧‧‧scan line

DL, DL’‧‧‧ data line

R‧‧‧ area

FIG. 1 is a schematic top view of an electronic component according to an embodiment of the present invention.

FIG. 2 is an enlarged view of a region R in FIG. 1.

Fig. 3 is a schematic cross-sectional view of the electronic component of Fig. 2 along a section line A-A '.

Fig. 4 is a schematic cross-sectional view of the electronic component of Fig. 1 along a section line B-B '.

FIG. 5 is a schematic top view of an electronic component according to another embodiment of the invention.

Fig. 6 is a schematic cross-sectional view of the electronic component of Fig. 5 along a section line C-C '.

FIG. 7 is a schematic top view of an electronic component according to another embodiment of the present invention.

Fig. 8 is a schematic cross-sectional view of the electronic component of Fig. 7 taken along a section line D-D '.

FIG. 9 is a schematic top view of an electronic component according to another embodiment of the present invention.

Fig. 10 is a schematic cross-sectional view of the electronic component of Fig. 9 taken along a section line E-E '.

FIG. 1 is a schematic top view of an electronic component according to an embodiment of the present invention. FIG. 2 is an enlarged view of a region R in FIG. 1. Fig. 3 is a schematic cross-sectional view of the electronic component of Fig. 2 along a section line A-A '. Fig. 4 is a schematic cross-sectional view of the electronic component of Fig. 1 along a section line B-B '. For clarity and convenience of explanation, the film layers in the drawing are omitted in FIGS. 1 and 2. Hereinafter, an embodiment of the present invention will be described in detail with reference to FIGS. 1 to 4.

Referring to FIGS. 1 to 4 at the same time, the electronic component 100 includes a substrate 110, a signal line 120, a first insulating layer 130, a first electrode 140, a second insulating layer 150, and a second electrode 160. The signal line 120 is located on the substrate 110. The first insulating layer 130 is located on the signal line 120. The first electrode 140 is located on the first insulating layer 130. The second insulating layer 150 is located on the first electrode 140 and the first insulating layer 130. The second electrode 160 is located on the second insulating layer 150. The second insulating layer 150 has a first through hole 170. The first insulating layer 130 and the second insulating layer 150 have a second through hole 180 in common. The signal line 120 and the first electrode 140 are electrically connected to each other through the first through hole 170, the second through hole 180, and the second electrode 160.

The material of the substrate 110 may be glass, quartz, organic polymer, or other materials. Applicable materials. Examples of the material of the first electrode 140 and the second electrode 160 include metal oxide or other suitable transparent conductive materials, such as Indium Tin Oxide (ITO), Indium Zinc Oxide (IZO). , Aluminum Tin Oxide (ATO), Aluminum Zinc Oxide (AZO), or other suitable oxides, or a stacked layer of at least two of the foregoing. The material of the first insulating layer 130 and the second insulating layer 150 includes an inorganic material. For example, the inorganic material is silicon oxide, silicon nitride, silicon oxynitride, other suitable materials, or The above-mentioned stacked layers of at least two materials, and the materials of the first insulating layer 130 and the second insulating layer 150 may also include organic materials, other suitable materials, or combinations thereof. In this embodiment, the first insulating layer 130 may be an organic flat layer to provide better flatness. In addition, based on considerations of electrical conductivity, the signal line 120 is generally made of a metal material, but the present invention is not limited thereto. It is worth noting that, in this embodiment, the second electrode 160 is located on the first electrode 140. In order to facilitate observation and description, the outline of the first electrode 140 is still drawn in FIG. 1 and FIG. Corresponding relationship between the positions of the first electrode 140 and the second electrode 160.

The first electrode 140 includes a main body portion 142 and an extension portion 144 connected to the main body portion 142. The body portion 142 of the first electrode 140 does not overlap the signal line 120, and the extension portion 144 of the first electrode 140 overlaps the signal line 120. In this embodiment, the extending portion 144 of the first electrode 140 is a segmented electrode having a first extending portion 144a and a second extending portion 144b. A first through hole 170 is formed above the first extension portion 144a. The first through hole 170 penetrates the second insulating layer 150 above the first extension portion 144a, and the first The two electrodes 160 cover a portion of the first side wall 170a of the first through hole 170 and a portion of the first upper surface 144a1 of the corresponding first extension portion 144a. In this way, the second electrode 160 and the first electrode 140 can be borrowed. The first through holes 170 are electrically connected to each other.

The signal line 120 has a first portion 122 and a second portion 124 connected to the first portion 122. The first portion 122 of the signal line 120 and the first electrode 140 do not overlap, and the second portion 124 of the signal line 120 and the extension portion 144 of the first electrode 140 overlap. A second through hole 180 is formed above the first portion 122. The second through hole 180 penetrates the first insulating layer 130 and the second insulating layer 150 above the first portion 122, and the second electrode 160 covers the second sidewall 180 a of the second through hole 180 and the corresponding signal line 120. Part of the second upper surface 122a of the first portion 122. In this way, the second electrode 160 and the signal line 120 can be electrically connected to each other through the second through hole 180, and the signal line 120 and the first electrode 140 can be connected through the first through hole 170, the second through hole 180, and The second electrodes 160 are electrically connected to each other.

In terms of manufacturing process, the first through hole 170 and the second through hole 180 may be formed by a similar method. For example, the first through hole 170 and the second through hole 180 penetrating the second insulating layer 150 can be formed in the second insulating layer 150 by an etching process or other similar processes. The first through hole 170 located above the first extension portion 144 a of the first electrode 140 penetrates the second insulating layer 150. The second through hole 180 located above the first portion 122 of the signal line 120 penetrates the second insulating layer 150 and penetrates the first insulating layer 130. For example, the first through hole 170 penetrating the second insulating layer 150 uses the first electrode 140 as an etching stop layer, and the second through hole penetrating the second insulating layer 150 and the first insulating layer 130 180 The signal line 120 is used as an etch stop layer. In this way, the occurrence of undercut can be reduced, and the risk of film peeling is reduced. In addition, the first through hole 170 and / or the second through hole 180 can also be used to increase the outgassing space or efficiency in subsequent processes, so that the gas generated between the membrane layers can be easily discharged. And reduce the bubble generation between the film layers.

Then, a conductive substance is filled in the first through hole 170 and / or the second through hole 180, so that the second electrode 160 is electrically connected to the first electrode 140 through the first through hole 170, and the second electrode is 160 is electrically connected to the signal line 120 through the second through hole 180. In this embodiment, the conductive material filled in the first through hole 170 and / or the second through hole 180 may be similar to the material of the second electrode 160 or a part of the second electrode 160 itself. The invention is not limited to this. In this embodiment, the first through hole 170 and the second through hole 180 can be formed by a similar process, so the process flow can be simplified and the production efficiency and yield can be improved.

In this embodiment, the length or width of the second open hole 180 corresponding to the open area above the second insulating layer 150 is defined as a second dimension 180b, and the first through hole 170 corresponds to the second insulating layer 150 The length or width of the opening area is defined as the first dimension 170b. The first dimension 170b and the second dimension 180b have the same extending direction. The first dimension 170b and the second dimension 180b are perpendicular to the signal line 120. For example, the extending direction of the first dimension 170b and the second dimension 180b is parallel to the scanning line SL. The second dimension 180b is larger than the first dimension 170b, but the present invention is not limited thereto.

In this embodiment, the first through hole 170 and the second through hole 180 are connected to each other. The extending portion 144 of the first electrode 140 may have a larger width in a portion overlapping the second electrode 160 to form a landing pad 146, and the first through hole 170 is located on the connection pad 146. In addition, since the second insulating layer 150 covers a portion of the connection pad 146 immediately adjacent to or adjacent to the second through hole 180, the first electrode 140 and / or a subsequent film layer formed on the first electrode 140 (such as : The second insulation layer 150 and / or the second electrode 160) may cause the film to peel off due to the undercut phenomenon. The shape of the aforementioned connection pad 146 is, for example, a circle, an oval or a polygon, but the present invention is not limited thereto.

In this embodiment, an end of the extending portion 144 far from the first through hole 170 has a first width 144d, and the second dimension 180b of the second through hole 180 is larger than the first width 144d of the extending portion 144. In this way, during the manufacturing process of the electronic component, the gas or liquid generated between the film layers can be discharged through the first through hole 170 and the second through hole 180, thereby reducing the generation of bubbles between the film layers.

In this embodiment, a first auxiliary through hole 172 is formed above the second extension portion 144b. The first auxiliary through hole 172 is connected to the second through hole 180, and the second through hole 180 is located between the first through hole 170 and the first auxiliary through hole 172. The first auxiliary through-hole 172 penetrates the second insulating layer 150 above the second extension 144b, and the second electrode 160 covers the third side wall 172a of the first auxiliary through-hole 172 and the first extension of the second extension 144b corresponding thereto. Part of the three upper surfaces 144b1. The first auxiliary through-hole 172 may be formed by a method similar to the first through-hole 170, and thus will not be described again here. In this embodiment, the first electrode 140 and the signal line 120 may pass through the first extension portion 144 a of the first electrode 140, the first through hole 170, the second electrode 160, and the second through hole 180. They are electrically connected to each other, and / or are electrically connected to each other through the first electrode 140, the second extension 144b, the first auxiliary through hole 172, the second electrode 160, and the second through hole 180. For example, the first electrode 140 and the signal line 120 may be electrically connected to each other through different current paths. In this way, the risk of disconnection can be reduced to improve yield and product reliability.

In some embodiments, the electronic device 100 is, for example, a display device, and the electronic device 100 includes a pixel electrode PE, an active device T, a scan line SL, and a data line DL. The pixel electrode PE is located on the second insulating layer 150, and the pixel electrode PE overlaps the first electrode 140. The active device T is, for example, a thin film transistor (TFT), which includes a gate electrode GE, a source electrode SE, a drain electrode DE, and a channel layer CH. The first insulating layer 130 covers the active device T, and the first electrode 140 The main body portion 142 overlaps the active device T, and the drain electrode DE is electrically connected to the pixel electrode PE. The scan line SL is electrically connected to the gate electrode GE. The data line DL is electrically connected to the source SE.

The gate electrode GE and the scan line SL are exemplified by a continuous conductive pattern, which means that the gate electrode GE and the scan line SL are electrically connected to each other. In this embodiment, a part of the scan line SL is used as the gate electrode GE. The source SE and the data line DL are exemplified by continuous conductive patterns, which means that the source SE and the data line DL are electrically connected to each other.

The channel layer CH is located above the gate electrode GE. The source SE and the drain DE are located above the channel layer CH. In this embodiment, the source SE, the drain DE, and the signal line 120 belong to the same film layer. That is to say, in this embodiment, the active device T is described by taking a bottom gate thin film transistor (bottom gate TFT) as an example, but the present invention is not limited thereto. In other embodiments, the active element T may also be a top gate. Thin film transistor (top gate TFT).

In this embodiment, the gate GE of the active element T is further covered with a gate insulating layer GI. The material of the gate insulating layer GI may be an inorganic material, an organic material, or a combination thereof. The inorganic material is, for example, silicon oxide, silicon nitride, silicon oxynitride, or a stacked layer of at least two of the foregoing materials. The organic material is, for example, polysilicon. Polymer materials such as amine (Polyimide, PI) resin, epoxy resin or acrylic resin.

The pixel electrode PE is electrically connected to the drain electrode DE of the active device T, and the pixel electrode PE and the second electrode 160 are separated from each other. In this embodiment, the pixel electrode PE and the second electrode 160 belong to the same film layer, and the material of the pixel electrode PE is, for example, a transparent conductive material similar to the first electrode 140 or the second electrode 160, but the present invention is not limited to this. this. In addition, in this embodiment, the pixel electrode PE may include a plurality of strip-shaped electrode patterns. In this embodiment, the pixel electrode PE is located on the first electrode 140. In order to facilitate observation and description, the outline of the first electrode 140 is still drawn in FIG. 1 so as to clearly show the first electrode 140 and the pixel electrode. Correspondence of the position of PE.

In this embodiment, the pixel electrode PE is electrically connected to the drain electrode DE through the third through hole 190. The third through hole 190 penetrates the first insulating layer 130 and the second insulating layer 150, and the pixel electrode PE substantially covers the fourth sidewall 190a of the third through hole 190 and the fourth upper surface of the corresponding drain electrode DE. A part of DEa, so that the drain electrode DE and the pixel electrode PE are electrically connected to each other through the third through hole 190. The third through-hole 190 may be formed by a method similar to the formation of the second through-hole 180, so it will not be repeated here.

In some embodiments, the electronic component 100 includes a plurality of scan lines SL and Multiple data lines DL. The scanning lines SL and the data lines DL are staggered with each other, and at least a part of the pixel electrode PE and the signal line 120 are substantially located between two adjacent data lines DL (as shown in FIG. 5, FIG. 7 or FIG. 9 described later). Exemplified embodiment).

In some embodiments, the electronic device 100 is, for example, a touch display device, and the signal line 120 may be a touch electrode of the aforementioned touch display device. For example, the second electrode 160 and the signal line 120 can be electrically connected to a control system, and the control system can transmit a timing signal so that the electronic component 100 has a display function during the first time period, and The two time periods have a touch function, and the first time period and the second time period are alternately arranged as an example.

Fig. 5 is a schematic top view of an electronic component according to another embodiment of the present invention, and Fig. 6 is a schematic cross-sectional view of the electronic component of Fig. 5 along a section line C-C '. For clarity and ease of description, FIG. 5 omits the film layer of the drawing portion. It must be explained here that the embodiments of FIGS. 5 to 6 inherit the component numbers and parts of the embodiments of FIGS. 1 to 4, in which the same or similar reference numerals are used to indicate the same or similar components, and the same are omitted. For the description of the technical content, for the description of the omitted parts, refer to the foregoing embodiments, and the following embodiments are not repeated.

Please refer to FIG. 5 to FIG. 6 at the same time. The electronic component 200 of this embodiment is similar to the electronic component 100 of the embodiment of FIGS. 1 to 4. A horizontal distance d is provided. The horizontal distance d between the first through hole 270 and the second through hole 280 is 3 micrometers (μm) to 6 micrometers, but the present invention is not limited thereto. The area where the extending portion 144 of the first electrode 140 contacts the first through hole 270 is far from the edge of the first electrode 140, and the first The two through holes 280 are far from the edge of the first electrode 140. For example, the first through hole 270 and the second through hole 280 do not overlap the edges of the extending portion 144. In this way, since the second insulating layer 150 covers the first electrode 140 adjacent to the first through hole 270, the first electrode 140 and / or the subsequent film layer formed on the first electrode 140 can be reduced due to the undercut phenomenon. Risk of film peeling. It is worth noting that, in this embodiment, the second electrode 160 is located on the first electrode 140. In order to facilitate observation and description, in FIG. 5, the outline of the first electrode 140 is still drawn in order to clearly show the first electrode The corresponding relationship between 140 and the position of the second electrode 160 and the pixel electrode PE.

In this embodiment, the first through hole 270 is located on the signal line 120. For example, the first through hole 270 overlaps with the signal line 120. As far as the manufacturing process is concerned, at least part of the first electrode 140 is located between the second insulating layer 150 and the signal line 120. Therefore, by etching or other similar The first through-hole 270 penetrating the second insulating layer 150 is formed in the second insulating layer 150 by using the first electrode 140 as an etch stop layer, so that the etching process can be terminated at the first electrode 140 without continuing to be located at the first electrode 140. The signal line 120 under an electrode 140 is etched. However, the present invention is not limited to this. In other variations, the first through hole 270 may be formed on other elements or other suitable positions, so as to increase the exhaust space or efficiency in the subsequent process, so that the generation between the film layers is generated. The gas can be easily discharged to reduce air bubbles between the layers.

In this embodiment, the electronic component 200 includes a plurality of scan lines SL and a plurality of data lines DL and DL ′. For convenience of explanation, FIG. 5 only illustrates one scan line SL by way of example, and the scan line SL and the data line DL , DL 'are intertwined with each other. Each sub-pixel includes corresponding active elements T, T '. The active element T includes the corresponding gate GE, source SE, The drain electrode DE and the channel layer CH are electrically connected to corresponding data lines DL and scan lines SL. The active device T 'includes a corresponding gate electrode GE', a source electrode SE ', a drain electrode DE', and a channel layer CH ', and is electrically connected to the corresponding data line DL' and the scanning line SL. The active element T 'is similar to the active element T, and is not repeated here. At least a part of the pixel electrode PE and the signal line 120 are substantially located between the data line DL and an adjacent data line DL '.

FIG. 7 is a schematic top view of an electronic component according to another embodiment of the present invention. Fig. 8 is a schematic cross-sectional view of the electronic component of Fig. 7 taken along a section line D-D '. For clarity and ease of description, FIG. 7 omits the film layer of the drawing portion. It must be explained here that the embodiments of FIGS. 7 to 8 inherit the component numbers and parts of the embodiments of FIGS. 5 to 6, in which the same or similar reference numerals are used to indicate the same or similar components, and the same are omitted. Description of technical content. For the description of the omitted parts, reference may be made to the foregoing embodiments, and the following embodiments are not repeated.

Please refer to FIG. 7 to FIG. 8 at the same time. The electronic component 300 of this embodiment is similar to the electronic component 200 of the embodiment of FIG. 5 to FIG. 6. For example, the first through hole 370 overlaps the active device T '. In terms of manufacturing process, since part of the first electrode 140 is located between the second insulating layer 150 and the active device T ′, the second insulating layer 150 is formed through the second insulating layer 150 by etching or other similar processes. The first through hole 370 uses the first electrode 140 as an etching stop layer, so that the etching process can be terminated at the first electrode 140 without continuing to etch the active device T ′ located under the first electrode 140. In this embodiment, the second electrode 160 and the pixel electrode PE are located on the first electrode 140, which is For convenience of observation and description, in FIG. 7, the outline of the first electrode 140 is still drawn, so as to clearly show the corresponding relationship between the positions of the first electrode 140 and the second electrode 160 and the pixel electrode PE.

In this embodiment, the first through hole 370 overlaps the source electrode SE 'of the active device T', but the present invention is not limited thereto. In other embodiments, the first through hole 370 may also overlap the drain electrode DE 'of the active device T'. In other embodiments, the first through hole 370 may also overlap the channel layer CH '. In other embodiments, the first through hole 370 may also be located between the source electrode SE 'and the drain electrode DE' of the active device T '. In other embodiments, the first through hole 370 may overlap the data line DL, DL 'or the scan line SL.

FIG. 9 is a schematic top view of an electronic component according to another embodiment of the present invention. Fig. 10 is a schematic cross-sectional view of the electronic component of Fig. 9 taken along a section line E-E '. For clarity and ease of description, FIG. 9 omits the film layer of the drawing portion. It must be explained here that the embodiments of FIGS. 9 to 10 inherit the component numbers and parts of the embodiments of FIGS. 5 to 6, in which the same or similar reference numerals are used to indicate the same or similar components, and the same are omitted. Description of technical content. For the description of the omitted parts, reference may be made to the foregoing embodiments, and the following embodiments are not repeated.

Please refer to FIG. 9 to FIG. 10 at the same time. The electronic component 400 of this embodiment is similar to the electronic component 200 of the embodiments of FIGS. 5 to 6. The difference between the two is that the first through hole 470 is located on a part of the signal line 120. For example, the first through hole 470 overlaps with a part of the signal line 120, and a part of the first through hole 470 does not overlap with the signal line 120. As far as the manufacturing process is concerned, at least part of the first electrode 140 is located in the second insulation. Between the edge layer 150 and the signal line 120, a part of the first electrode 140 overlaps with the side wall 120 c of the wire of the signal line 120. Therefore, the first through hole 470 penetrating through the second insulating layer 150 is formed in the second insulating layer 150 by etching or other similar processes, and the first electrode 140 is used as an etching stop layer, so that the etching process can be terminated at the first electrode 140 without continuing to etch the signal line 120 under the first electrode 140. It is worth noting that, in this embodiment, the second electrode 160 and the pixel electrode PE are located on the first electrode 140. In order to facilitate the observation and description, the outline of the first electrode 140 is still drawn in FIG. The corresponding relationship between the positions of the first electrode 140, the second electrode 160, and the pixel electrode PE is clearly shown.

In summary, the electronic component of at least one embodiment of the present invention passes through the first through hole, the second through hole and the second electrode, so that the signal line and the first electrode are electrically connected to each other. Therefore, in the manufacturing process of the electronic component according to at least one embodiment of the present invention, the risk of film layer peeling is reduced, and / or the gas generated between the film layers can be easily discharged, thereby effectively improving the product yield. In an embodiment, the first through hole and the second through hole can also be formed by a similar process, so the process flow can be simplified and the production efficiency and yield can be improved.

Although the present invention has been disclosed as above with the examples, it is not intended to limit the present invention. Any person with ordinary knowledge in the technical field can make some modifications and retouching without departing from the spirit and scope of the present invention. The protection scope of the present invention shall be determined by the scope of the attached patent application.

100‧‧‧Electronic components

120‧‧‧ signal line

140‧‧‧first electrode

142‧‧‧Main body

144‧‧‧ extension

160‧‧‧Second electrode

170‧‧‧The first through hole

172‧‧‧First auxiliary through hole

180‧‧‧Second through hole

190‧‧‧Third through hole

PE‧‧‧Pixel electrode

T‧‧‧active element

GE‧‧‧Gate

SE‧‧‧Source

DE‧‧‧ Drain

CH‧‧‧ Channel layer

SL‧‧‧scan line

DL‧‧‧Data Line

R‧‧‧ area

Claims (43)

A display element includes: a substrate; a signal line on the substrate; a first insulation layer on the signal line; a first electrode on the first insulation layer; a second insulation layer on the substrate A first electrode and the first insulating layer; and a second electrode located on the second insulating layer, wherein the second insulating layer has a first through hole, and the first insulating layer and the second insulating layer There is a second through hole in common, the signal line and the first electrode are electrically connected through the first through hole, the second through hole and the second electrode, wherein the first electrode has a main body portion and is in contact with the first electrode. An extension portion connected to the main body portion does not overlap with the signal line, the extension portion overlaps with the signal line, and the size of the second through hole is greater than the width of the extension portion. The display element according to item 1 of the scope of patent application, wherein a size of the second through hole is larger than a size of the first through hole. The display element according to item 1 of the scope of patent application, wherein the first through hole and the second through hole are connected to each other. The display element according to item 3 of the scope of patent application, wherein the second insulating layer further has a first auxiliary through hole connected to the second through hole, wherein the second through hole is located between the first through hole and the first through hole. Between an auxiliary via, the signal line and the first electrode are electrically connected through the first via, the second via, the first auxiliary via, and the second electrode. The display element according to item 1 of the scope of patent application, wherein the second electrode completely covers a through-hole sidewall of the first through-hole. The display element according to item 5 of the application, wherein the second electrode completely covers a sidewall of the through hole of the second through hole. The display element according to item 1 of the patent application scope further includes: a pixel electrode located on the second insulating layer, and the pixel electrode overlaps the first electrode; an active element including a gate electrode, A source electrode and a drain electrode, wherein the first insulating layer covers the active element, the first electrode overlaps the active element, the drain electrode is electrically connected to the pixel electrode, and a scan line is connected to the gate electrode ; And a data line connected to the source. The display element according to item 7 of the scope of patent application, wherein the source electrode, the drain electrode, and the signal line are the same patterned conductive layer. The display element according to item 8 of the scope of patent application, wherein at least a part of the pixel electrode and the signal line are substantially located between the data line and another data line. The display element according to item 7 of the scope of patent application, wherein the pixel electrode and the second electrode are the same patterned conductive layer. The display element according to item 7 of the scope of patent application, wherein the first insulating layer and the second insulating layer more commonly have a third through hole, wherein the pixel electrode The third through hole is covered so that the drain electrode and the pixel electrode are electrically connected through the third through hole. The display element according to item 7 of the application, wherein the first through hole overlaps with another active element. The display element according to item 1 of the scope of patent application, wherein the first through hole overlaps the signal line. A display element includes: a signal line; a first electrode having a main body portion and an extension portion connected to the main body portion, the main body portion does not overlap with the signal line, and the extension portion overlaps with the signal line; And a second electrode, the signal line and the first electrode are electrically connected through a first through hole, a second through hole and the second electrode, and the second through hole does not substantially overlap the extension portion, The size of the second through hole is larger than the width of the extension portion. The display element according to item 14 of the application, wherein the first through hole and the second through hole are connected to each other, and the size of the second through hole is larger than the size of the first through hole. A display element includes: a substrate; a signal line on the substrate; a first insulation layer on the signal line; a first electrode on the first insulation layer; a second insulation layer on the substrate A first electrode and the first insulating layer; and A second electrode is located on the second insulating layer, wherein the second insulating layer has a first through hole, and the first insulating layer and the second insulating layer together have a second through hole, the signal line and The first electrode is electrically connected through the first through-hole, the second through-hole, and the second electrode, wherein the first through-hole and the second through-hole are separated from each other with a horizontal distance between 3 micrometers and 6 Microns. The display element according to item 16 of the application, wherein the second electrode completely covers a sidewall of the through hole of the first through hole. The display element according to item 17 of the application, wherein the second electrode completely covers a sidewall of the through hole of the second through hole. The display element according to item 16 of the scope of patent application, further comprising: a pixel electrode on the second insulating layer, and the pixel electrode and the first electrode overlap; an active element including a gate electrode, A source electrode and a drain electrode, wherein the first insulating layer covers the active element, the first electrode overlaps the active element, the drain electrode is electrically connected to the pixel electrode, and a scan line is connected to the gate electrode ; And a data line connected to the source. The display element according to item 19 of the application, wherein the source electrode, the drain electrode, and the signal line are the same patterned conductive layer. According to the display element described in claim 20, at least a part of the pixel electrode and the signal line are substantially located between the data line and another data line. The display element according to item 19 of the application, wherein the pixel electrode and the second electrode are the same patterned conductive layer. The display element according to item 19 of the scope of patent application, wherein the first insulating layer and the second insulating layer more commonly have a third through hole, and the pixel electrode covers the third through hole so that the drain The electrode and the pixel electrode are electrically connected through the third through hole. The display element according to item 19 of the application, wherein the first through hole overlaps with another active element. The display element according to item 16 of the application, wherein the first through hole overlaps the signal line. A display element includes: a substrate; a signal line on the substrate; a first insulation layer on the signal line; a first electrode on the first insulation layer; a second insulation layer on the substrate A first electrode and the first insulating layer; a second electrode located on the second insulating layer, wherein the second insulating layer has a first through hole, and the first insulating layer and the second insulating layer are common; A second through hole, the signal line and the first electrode are electrically connected through the first through hole, the second through hole and the second electrode; a pixel electrode is located on the second insulating layer, And the pixel electrode overlaps the first electrode; An active element includes a gate, a source, and a drain, wherein the first insulating layer covers the active element, the first electrode overlaps the active element, and the drain is electrically connected to the pixel electrode; A scan line is connected to the gate; and a data line is connected to the source. The display element according to item 26 of the application, wherein a size of the second through hole is larger than a size of the first through hole. The display element according to item 26 of the application, wherein the first through hole and the second through hole are connected to each other. According to the display element in claim 28, wherein the second insulating layer further has a first auxiliary through hole connected to the second through hole, wherein the second through hole is located between the first through hole and the first through hole. Between an auxiliary via, the signal line and the first electrode are electrically connected through the first via, the second via, the first auxiliary via, and the second electrode. The display element according to item 26 of the application, wherein the second electrode completely covers the through-hole sidewall of the first through-hole. The display element according to item 30 of the application, wherein the second electrode completely covers a sidewall of the through hole of the second through hole. The display element according to item 26 of the application, wherein the source electrode, the drain electrode, and the signal line are the same patterned conductive layer. The display element according to item 32 of the scope of patent application, wherein at least a part of the pixel electrode and the signal line are substantially located between the data line and another data line. The display element according to item 26 of the application, wherein the pixel electrode and the second electrode are the same patterned conductive layer. The display element according to item 26 of the scope of patent application, wherein the first insulating layer and the second insulating layer more commonly have a third through hole, and the pixel electrode covers the third through hole so that the drain The electrode and the pixel electrode are electrically connected through the third through hole. The display element according to item 26 of the application, wherein the first through hole overlaps with another active element. The display element according to item 26 of the application, wherein the first through hole overlaps the signal line. A display element includes: a substrate; a signal line on the substrate; a first insulation layer on the signal line; a first electrode on the first insulation layer; a second insulation layer on the substrate A first electrode and the first insulating layer; and a second electrode located on the second insulating layer, wherein the second insulating layer has a first through hole, and the first insulating layer and the second insulating layer There is a second through hole in common, the signal line and the first electrode pass through the first through hole, the second through hole and The second electrode is electrically connected, wherein the first through hole overlaps the signal line. The display element as described in claim 38, wherein a size of the second through hole is larger than a size of the first through hole. The display element according to item 38 of the application, wherein the first through hole and the second through hole are connected to each other. According to the display element in claim 40, wherein the second insulating layer further has a first auxiliary through hole connected to the second through hole, and the second through hole is located between the first through hole and the first through hole. Between an auxiliary via, the signal line and the first electrode are electrically connected through the first via, the second via, the first auxiliary via, and the second electrode. The display element according to item 38 of the application, wherein the second electrode completely covers a through-hole sidewall of the first through-hole. The display element according to item 42 of the application, wherein the second electrode completely covers the sidewall of the through hole of the second through hole.