TWI618856B - Cryotrap - Google Patents

Cryotrap Download PDF

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Publication number
TWI618856B
TWI618856B TW105119453A TW105119453A TWI618856B TW I618856 B TWI618856 B TW I618856B TW 105119453 A TW105119453 A TW 105119453A TW 105119453 A TW105119453 A TW 105119453A TW I618856 B TWI618856 B TW I618856B
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Taiwan
Prior art keywords
temperature
low
space
drying
trap
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TW105119453A
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Chinese (zh)
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TW201706506A (en
Inventor
安田淳一
村山吉信
森本秀敏
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愛發科低溫泵股份有限公司
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26DRYING
    • F26BDRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B5/00Drying solid materials or objects by processes not involving the application of heat
    • F26B5/04Drying solid materials or objects by processes not involving the application of heat by evaporation or sublimation of moisture under reduced pressure, e.g. in a vacuum
    • F26B5/06Drying solid materials or objects by processes not involving the application of heat by evaporation or sublimation of moisture under reduced pressure, e.g. in a vacuum the process involving freezing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D8/00Cold traps; Cold baffles
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61JCONTAINERS SPECIALLY ADAPTED FOR MEDICAL OR PHARMACEUTICAL PURPOSES; DEVICES OR METHODS SPECIALLY ADAPTED FOR BRINGING PHARMACEUTICAL PRODUCTS INTO PARTICULAR PHYSICAL OR ADMINISTERING FORMS; DEVICES FOR ADMINISTERING FOOD OR MEDICINES ORALLY; BABY COMFORTERS; DEVICES FOR RECEIVING SPITTLE
    • A61J3/00Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms
    • A61J3/02Devices or methods specially adapted for bringing pharmaceutical products into particular physical or administering forms into the form of powders
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61KPREPARATIONS FOR MEDICAL, DENTAL OR TOILETRY PURPOSES
    • A61K9/00Medicinal preparations characterised by special physical form
    • A61K9/14Particulate form, e.g. powders, Processes for size reducing of pure drugs or the resulting products, Pure drug nanoparticles
    • A61K9/19Particulate form, e.g. powders, Processes for size reducing of pure drugs or the resulting products, Pure drug nanoparticles lyophilised, i.e. freeze-dried, solutions or dispersions
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26DRYING
    • F26BDRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B25/00Details of general application not covered by group F26B21/00 or F26B23/00
    • F26B25/06Chambers, containers, or receptacles
    • F26B25/08Parts thereof
    • F26B25/12Walls or sides; Doors
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26DRYING
    • F26BDRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B2200/00Drying processes and machines for solid materials characterised by the specific requirements of the drying good
    • F26B2200/08Granular materials

Abstract

本發明之低溫阱係一種在連接於被脫氣空間之室的殼體內,將利用機械式冷凍機冷卻之低溫板件自殼體壁隔開而設置之低溫阱,其設置有冷卻分離分隔壁,該冷卻分離分隔壁係與前述低溫板件之一個板面相接,且將前述殼體內分離為前述室側之第1空間與前述低溫板件側之第2空間。 The low-temperature trap of the present invention is a low-temperature trap provided in a casing connected to a room to be degassed, and separating low-temperature plates cooled by a mechanical freezer from a wall of the casing, and provided with a cooling separation wall The cooling and separating partition wall is in contact with one plate surface of the low-temperature plate, and separates the inside of the casing into a first space on the chamber side and a second space on the low-temperature plate side.

Description

低溫阱 Cryogenic trap

本發明係關於一種低溫阱,特別係關於一種在耐腐蝕環境下之冷凍等所使用之適合之技術。 The present invention relates to a low-temperature trap, and more particularly, to a suitable technique for freezing and the like in a corrosion-resistant environment.

按,業界曾提出一種用於將醫藥品、食品、化妝品或化學品等之原料液凍結並真空乾燥之具備冷阱的真空乾燥裝置(例如日本專利第5574318號公報)。 According to the industry, a vacuum drying device with a cold trap (for example, Japanese Patent No. 5574318) has been proposed in the industry to freeze and dry raw material liquids such as pharmaceuticals, foods, cosmetics, or chemicals.

根據先前之真空乾燥裝置,真空幫浦經由排氣路徑與收容被乾燥物之乾燥室連接,而於該排氣路徑之中途設置有冷阱。可藉由利用冷阱使乾燥室內之自被乾燥物昇華之水蒸氣凝結並將其捕集,而使被乾燥物乾燥。 According to the previous vacuum drying device, the vacuum pump is connected to the drying chamber containing the object to be dried through the exhaust path, and a cold trap is provided in the middle of the exhaust path. The dry matter can be dried by using a cold trap to condense and trap water vapor sublimated from the dry matter in the drying chamber.

另外,作為面向醫藥品之凍結乾燥裝置之最近之傾向,針對『抗體醫藥』或『生物醫藥』之需求日益提高。 In addition, as a recent trend of freeze-drying devices for pharmaceuticals, the demand for "antibody medicine" or "biomedicine" is increasing.

由背景而言,由於此等藥劑與先前之化學物質相比水分活性高,故必須要將含水率進一步降低地製造。因此,在大陽日酸技報No.33(2014)p1-p2森公哉、米倉正浩「面向生物醫藥品液化氮式真空凍結乾燥機」網際網路(URL;https://www.tn-sanso-giho.com/pdf/33/tnscgiho33_06.pdf)(以下稱為非專利文獻)中,將使用液態氮之熱交換器追加於真空凍結乾燥機而營造低溫狀態,從而降低凍結乾燥槽內之壓力而實現藥劑之製造。 From the background, since these agents have higher water activity than previous chemicals, it is necessary to further reduce the water content. Therefore, in the Dayang Daily Acid News No.33 (2014) p1-p2 Mori Kojima and Yoshikura Masao “The Bio-Pharmaceutical Liquefied Nitrogen Vacuum Freeze Dryer” Internet (URL; https: //www.tn- sanso-giho.com/pdf/33/tnscgiho33_06.pdf) (hereinafter referred to as non-patent literature), a heat exchanger using liquid nitrogen is added to a vacuum freeze dryer to create a low temperature state, thereby reducing the Pressure to achieve the manufacture of pharmaceuticals.

又,此等藥劑之情況下,係要求在不改變臨床試驗藥之製法下製造藥劑。 Moreover, in the case of these drugs, it is required to manufacture the drugs without changing the manufacturing method of the clinical trial drugs.

然而,若採用上述非專利文獻所揭示之技術,則因使用液態氮而導致裝置變得規模極其大,因此,存在期望小型化、省空間化此一要求。進而,由於因使用液態氮而導致維修之時間與勞力及運轉成本增大,故要求一種不需耗費如此之成本而操作性佳之裝置、方法。 However, if the technology disclosed in the above-mentioned non-patent literature is adopted, the device becomes extremely large due to the use of liquid nitrogen. Therefore, there is a demand for miniaturization and space saving. Furthermore, since the time, labor, and running costs of maintenance are increased due to the use of liquid nitrogen, a device and method with good operability without requiring such costs are required.

因此,業界自先前起就研究將在半導體或FPD(Flat Panel Display,平板顯示器)之製造裝置中所使用之低溫阱應用於藥劑之製造(例如日本特開平05-044642號公報)。 Therefore, the industry has previously studied the application of low temperature traps used in semiconductor or FPD (Flat Panel Display) manufacturing equipment to the manufacture of pharmaceuticals (for example, Japanese Patent Application Laid-Open No. 05-044642).

然而,低溫阱原本係一直在半導體或FPD之製造中所使用之裝置,而未設想在水分等之腐蝕性氣體大量存在之環境下使用低溫阱之事宜,因而無法將如此之低溫阱原樣應用於面向醫藥品之裝置。 However, the low temperature trap was originally a device used in the manufacture of semiconductors or FPDs, and it was not envisaged to use the low temperature trap in an environment where a large amount of corrosive gas such as moisture exists. Therefore, such a low temperature trap cannot be applied as it is. Devices for pharmaceuticals.

另外,由於在醫藥品製造中有嚴密之基準,需要進行裝置內部之殺菌洗淨,故無法將先前之高冷凍能力之小型裝置原樣應用於面向醫藥品之裝置。同時,曝露於醫藥製劑之部分無法使用銅等之金屬,而存在謀求兼顧維持冷卻能力與使用面向醫藥品製造之材料的必要。 In addition, since there are strict standards in the manufacture of pharmaceuticals and the sterilization and cleaning of the interior of the device is required, the previous small devices with high freezing capacity cannot be applied to the devices for pharmaceuticals as they are. At the same time, metals such as copper cannot be used in the parts exposed to pharmaceutical preparations, and there is a need to achieve a balance between maintaining cooling capacity and using materials for pharmaceutical manufacturing.

此外,由於在半導體或FPD之製造中所設想之冷卻能力、溫度範圍、及壓力範圍與醫藥品製造中之條件不同,故無法將面向半導體或FPD之製造之低溫阱原樣適用於醫藥品製造。 In addition, since the cooling capacity, temperature range, and pressure range envisioned in the manufacture of semiconductors or FPDs are different from the conditions in the manufacture of pharmaceuticals, it is not possible to apply the low temperature traps for the manufacture of semiconductors or FPDs to pharmaceuticals as they are.

本發明係鑒於上述情形而完成者,且試圖達成以下之目的。 The present invention has been made in view of the above circumstances, and attempts to achieve the following objects.

1.使得能夠應用於醫藥品之製造之高性能的凍結乾燥成為可能。 1. It enables high-performance freeze-drying that can be applied to the manufacture of pharmaceuticals.

2.使得低溫阱能夠應用於凍結乾燥(真空乾燥)裝置。 2. Enable low temperature traps to be used in freeze drying (vacuum drying) devices.

3.提高耐腐蝕氣體性能。 3. Improve the resistance to corrosion gas.

本發明之一態樣之低溫阱,係一種在連接於被脫氣空間之室的 殼體內,將利用機械式冷凍機冷卻之低溫板件自殼體壁隔開而設置之低溫阱,其設置有冷卻分離分隔壁,該冷卻分離分隔壁係與前述低溫板件之一個板面相接,且將前述殼體內分離為前述室側之第1空間與前述低溫板件側之第2空間。 One aspect of the present invention is a low temperature trap, which is a Inside the casing, a low-temperature trap that separates the low-temperature plates cooled by a mechanical freezer from the wall of the casing is provided with a cooling separation partition wall, which is in line with one of the above-mentioned low-temperature plates. Then, the inside of the casing is separated into a first space on the chamber side and a second space on the low-temperature plate side.

藉此,可在不將低溫板件曝露於室側之第1空間下,對室內進行真空冷凍乾燥等之處理。 Thereby, a process such as vacuum freeze-drying in the room can be performed without exposing the low-temperature plate to the first space on the side of the room.

在本發明之一態樣之低溫阱中,前述冷卻分離分隔壁具有與前述低溫板件之一個板面密接之平板部,且前述平板部之中朝向前述室之表面可為阱面。 In the low temperature trap of one aspect of the present invention, the cooling separation partition wall has a flat plate portion closely contacting one plate surface of the low temperature plate, and a surface of the flat plate portion facing the chamber may be a well surface.

藉此,可在與室對向而曝露之平板部之中朝向室之表面處捕集水分等,而進行室內之脫氣。 Thereby, moisture can be collected at the surface facing the chamber among the flat plate portions exposed opposite to the chamber, and the room can be degassed.

在本發明之一態樣之低溫阱中,前述冷卻分離分隔壁之前述平板部可連接有筒狀部,其自前述平板部之周緣延伸,且包圍前述低溫板件之周圍。 In the low temperature trap of one aspect of the present invention, the flat plate portion of the cooling separation partition wall may be connected with a cylindrical portion extending from a peripheral edge of the flat plate portion and surrounding the low temperature plate.

藉此,可使與低溫板件相接之冷卻分離分隔壁自殼體壁分隔,而防止經冷卻之低溫板件之溫度上升。 Thereby, the cooling separation partition wall connected to the low-temperature plate can be separated from the shell wall, and the temperature of the cooled low-temperature plate can be prevented from rising.

在本發明之一態樣之低溫阱中,可在前述冷卻分離分隔壁之前述低溫板件側之前述第2空間連接有排氣機構。 In the low temperature trap according to an aspect of the present invention, an exhaust mechanism may be connected to the second space on the low temperature plate side of the cooling and separating partition wall.

藉此,可將第2空間(後背空間)之真空度對應於室側之被脫氣空間而設定,而維持低溫板件之設定溫度。 Thereby, the degree of vacuum of the second space (back space) can be set corresponding to the degassed space on the chamber side, and the set temperature of the low-temperature plate can be maintained.

本發明之一態樣之低溫阱中,前述冷卻分離分隔壁可由耐腐蝕性材料形成。 In one aspect of the present invention, the cooling separation partition wall may be formed of a corrosion-resistant material.

藉此,可進行對應於水分或腐蝕性氣體之真空凍結乾燥處理。 Thereby, vacuum freeze-drying processing corresponding to moisture or corrosive gas can be performed.

根據本發明之一態樣,能夠發揮下述之效果:即便在真空乾燥等存在耐腐蝕性氣體之狀態下亦能夠使用低溫阱,且可以充分降低真 空乾燥中被乾燥物之含水率。 According to one aspect of the present invention, the following effects can be exhibited: a low-temperature trap can be used even in the presence of a corrosion-resistant gas such as vacuum drying, and the true temperature can be sufficiently reduced. Moisture content of the material to be dried in air drying.

10‧‧‧真空乾燥裝置 10‧‧‧Vacuum drying device

11‧‧‧乾燥室(chamber,室) 11‧‧‧ drying chamber (chamber)

11a‧‧‧擱架 11a‧‧‧Shelf

11b‧‧‧加熱器(調溫機構)/調溫裝置 11b‧‧‧Heater (temperature control mechanism) / temperature control device

11c‧‧‧溫度感測器 11c‧‧‧Temperature sensor

12‧‧‧第1脫水部/脫水部 12‧‧‧The first dehydration section / dehydration section

14‧‧‧控制單元(控制部) 14‧‧‧Control Unit (Control Department)

15‧‧‧真空幫浦(第1排氣機構) 15‧‧‧Vacuum pump (the first exhaust mechanism)

16‧‧‧幫浦(第2排氣機構)/排氣幫浦/真空幫浦/渦輪分子幫浦 16‧‧‧pump (second exhaust mechanism) / exhaust pump / vacuum pump / turbo molecular pump

17‧‧‧第1捕集裝置(第1捕集機構)/第1冷阱 17‧‧‧1st trapping device (1st trapping mechanism) / 1st cold trap

17a‧‧‧導入部 17a‧‧‧Introduction Department

17b‧‧‧導出部 17b‧‧‧Export Department

17c‧‧‧第1冷卻單元/冷凍機 17c‧‧‧The first cooling unit / freezer

19‧‧‧洗淨、殺菌裝置(洗淨、殺菌機構) 19‧‧‧Washing and sterilizing device (washing and sterilizing mechanism)

21‧‧‧第1分隔部 21‧‧‧The first division

21a‧‧‧分隔體 21a‧‧‧ divider

22‧‧‧第1切換閥 22‧‧‧The first switching valve

23‧‧‧第2分隔部 23‧‧‧Second Division

23a‧‧‧分隔體 23a‧‧‧ divider

24‧‧‧第2切換閥 24‧‧‧The second switching valve

26‧‧‧壓力計/第1真空計 26‧‧‧Pressure gauge / 1st vacuum gauge

27‧‧‧壓力計/第2真空計 27‧‧‧Pressure gauge / Second vacuum gauge

30‧‧‧第2脫水部/第2冷阱/脫水部/低溫阱 30‧‧‧ 2nd dehydration section / 2nd cold trap / dehydration section / low temperature trap

30A‧‧‧被脫氣空間(第1空間) 30A‧‧‧Degassed space (first space)

30B‧‧‧後背空間(第2空間) 30B‧‧‧Back space (second space)

31‧‧‧殼體 31‧‧‧shell

31c‧‧‧背面部 31c‧‧‧Back

36‧‧‧冷卻分離分隔壁 36‧‧‧ Cooling separation wall

36a‧‧‧平板部 36a‧‧‧ Flat

36b‧‧‧筒狀部 36b‧‧‧Tube

36c‧‧‧變形部 36c‧‧‧Deformation Department

36d‧‧‧桿 36d‧‧‧par

38‧‧‧捕集裝置(捕集機構)/第2冷阱/低溫阱 38‧‧‧trap device (trap mechanism) / second cold trap / low temperature trap

38a‧‧‧低溫板件/阱板件 38a‧‧‧Low temperature plate / well plate

38b‧‧‧機械式冷凍機 38b‧‧‧ mechanical freezer

39‧‧‧排氣裝置(排氣機構) 39‧‧‧Exhaust device (exhaust mechanism)

F1‧‧‧被乾燥物/原料/試樣/脫氣對象 F1‧‧‧‧Dried material / raw material / sample / degassing object

圖1係顯示設置有本發明之一個實施方式之低溫阱之真空乾燥裝置的模式圖。 FIG. 1 is a schematic diagram showing a vacuum drying apparatus provided with a low temperature trap according to an embodiment of the present invention.

圖2係顯示本發明之一個實施方式之低溫阱之剖視圖。 FIG. 2 is a cross-sectional view showing a low temperature trap according to an embodiment of the present invention.

圖3係顯示使用本發明之一個實施方式之低溫阱之真空乾燥步驟的流程圖。 FIG. 3 is a flowchart showing a vacuum drying step using a low temperature trap according to an embodiment of the present invention.

以下基於圖式說明本發明之一個實施方式之低溫阱。 Hereinafter, a low temperature trap according to an embodiment of the present invention will be described based on the drawings.

圖1係顯示設置有本實施方式之低溫阱之真空乾燥裝置的模式圖,在圖1中,符號10表示真空乾燥裝置。 FIG. 1 is a schematic diagram showing a vacuum drying apparatus provided with a low temperature trap according to this embodiment. In FIG. 1, reference numeral 10 denotes a vacuum drying apparatus.

本實施方式之真空乾燥裝置10係為了製造例如醫藥品、醫藥製劑、及醫藥品或醫藥製劑之原材料等而用於將其原料液凍結並真空乾燥。被乾燥物F1為醫藥製劑或醫藥製劑之材料。被乾燥物F1可為將上述原料液收容於容器內之液體狀態,亦可為在使用真空乾燥裝置10之處理之前步驟中使其真空凍結之固體狀態(例如塊狀、粉末狀)。在本實施方式中,係說明被乾燥物F1為醫藥製劑或醫藥製劑之材料的情形。 The vacuum drying device 10 according to the present embodiment is used for freezing and vacuum drying a raw material liquid for manufacturing pharmaceuticals, pharmaceutical preparations, and raw materials for pharmaceuticals or pharmaceutical preparations. The object to be dried F1 is a material for a pharmaceutical preparation or a pharmaceutical preparation. The object to be dried F1 may be in a liquid state in which the above-mentioned raw material liquid is contained in a container, or may be in a solid state (for example, a block shape or a powder state) that is frozen in a vacuum in a step before the treatment using the vacuum drying device 10. In this embodiment, a case where the object to be dried F1 is a pharmaceutical preparation or a material of a pharmaceutical preparation will be described.

本實施方式之真空乾燥裝置10如圖1所示般,具有:乾燥室11,其收容被乾燥物;第1脫水部12,其連接於乾燥室11;第2脫水部30,其與第1脫水部12獨立地連接於乾燥室11;第1分隔部21;第2分隔部23;及控制單元14(控制部)。 As shown in FIG. 1, the vacuum drying device 10 according to the present embodiment includes a drying chamber 11 that stores objects to be dried, a first dewatering unit 12 that is connected to the drying chamber 11, and a second dewatering unit 30 that is connected to the first dewatering unit 30. The dewatering section 12 is independently connected to the drying chamber 11; the first partition section 21; the second partition section 23; and the control unit 14 (control section).

第1脫水部12具有第1捕集裝置17(第1捕集機構),其能夠冷卻至第1溫度,該第1溫度能夠使自被乾燥物F1昇華之水分凝結並將其捕集。 The first dewatering unit 12 includes a first trapping device 17 (first trapping mechanism) capable of cooling to a first temperature, which is capable of condensing and sublimating the water sublimated from the dried object F1.

第2脫水部30具有捕集裝置38(捕集機構),其能夠冷卻至較第1溫 度低之第2溫度。 The second dewatering unit 30 includes a trap device 38 (trap mechanism), which can cool down to a temperature lower than the first temperature. The second low temperature.

第1分隔部21作為切換器件發揮機能,能夠使乾燥室11與第1脫水部12選擇性地連通或彼此脫離。 The first partitioning section 21 functions as a switching device, and can selectively connect or disconnect the drying chamber 11 and the first dewatering section 12 from each other.

第2分隔部23與第1分隔部21相同地作為切換器件發揮機能,能夠使乾燥室11與第2脫水部30選擇性地連通或彼此脫離。 The second partition portion 23 functions as a switching device in the same manner as the first partition portion 21, and can selectively connect or separate the drying chamber 11 and the second dewatering portion 30 from each other.

乾燥室11係用於將作為被乾燥物之原料F1予以真空乾燥之空間。乾燥室11內之真空度可在例如5~300Pa之範圍內進行調整。乾燥室11具有多段複數個擱架11a,其支持供載置試樣F1之托盤(圖示省略)。 The drying chamber 11 is a space for vacuum-drying the raw material F1 as a material to be dried. The degree of vacuum in the drying chamber 11 can be adjusted within a range of, for example, 5 to 300 Pa. The drying chamber 11 has a plurality of shelves 11a in a plurality of stages, and supports a tray (not shown) for holding the sample F1.

於乾燥室11中之複數個擱架11a處分別設置有加熱器(調溫機構)11b。加熱器11b係由控制單元(控制部)14控制,能夠對載置於擱架11a之試樣F1予以加熱及冷卻。作為加熱器11b,例如可利用使熱媒在擱架11a之內部循環之機構而構成,或者可利用護套加熱器等之電阻加熱式之加熱器等構成。加熱時之加熱器11b之設定溫度無特別限定,可設定為例如20℃。 A heater (temperature control mechanism) 11b is provided at each of a plurality of shelves 11a in the drying chamber 11. The heater 11b is controlled by a control unit (control unit) 14 and can heat and cool the sample F1 placed on the shelf 11a. The heater 11b may be configured by a mechanism that circulates a heat medium inside the shelf 11a, or may be configured by a resistance heating type heater such as a sheathed heater. The setting temperature of the heater 11b during heating is not particularly limited, and may be set to, for example, 20 ° C.

於至少任一者之1個擱架11a處,設置有溫度感測器11c。溫度感測器11c檢測載置於由加熱器11b加熱之擱架3上之試樣F1的溫度,並將所檢測之溫度作為檢測信號輸出至控制單元14。較佳的是溫度感測器11c可於擱架11a之上側測定溫度,並分別設置在複數個擱架11a處。 A temperature sensor 11c is provided at at least one of the shelves 11a. The temperature sensor 11c detects the temperature of the sample F1 placed on the shelf 3 heated by the heater 11b, and outputs the detected temperature to the control unit 14 as a detection signal. Preferably, the temperature sensor 11c can measure the temperature on the upper side of the shelf 11a, and is disposed on each of the plurality of shelves 11a.

於乾燥室11分別連接有獨立之第1脫水部12與第2脫水部30,乾燥室11經由該第1脫水部12及第2脫水部30與真空幫浦(第1排氣機構)15及幫浦(第2排氣機構)16連通。真空幫浦15係用於將乾燥室11內之氣體排出而將乾燥室11內設為特定之真空度的幫浦。作為真空幫浦15,可採用旋轉幫浦或乾式幫浦等之各種真空幫浦。 A separate first dewatering section 12 and a second dewatering section 30 are connected to the drying chamber 11, respectively, and the drying chamber 11 passes through the first dewatering section 12 and the second dewatering section 30 and a vacuum pump (first exhaust mechanism) 15 and The pump (second exhaust mechanism) 16 communicates. The vacuum pump 15 is a pump for exhausting the gas in the drying chamber 11 and setting the inside of the drying chamber 11 to a specific degree of vacuum. As the vacuum pump 15, various vacuum pumps such as a rotary pump or a dry pump can be used.

於乾燥室11處設置有洗淨、殺菌裝置19(洗淨、殺菌機構),其係 如後述般用於對乾燥室11、第1脫水部12、及第2脫水部30內予以洗淨、殺菌者。洗淨、殺菌裝置19由控制單元14控制。洗淨、殺菌裝置19能夠將殺菌步驟用之122℃左右之蒸汽、或者洗淨步驟用之滿足特定之基準的純水供給至乾燥室11、第1脫水部12、及第2脫水部30內部。 A washing and sterilizing device 19 (washing and sterilizing mechanism) is provided in the drying room 11 As described later, it is used for those who clean and sterilize the inside of the drying chamber 11, the first dewatering section 12, and the second dewatering section 30. The washing and sterilizing device 19 is controlled by the control unit 14. The washing and sterilizing device 19 can supply steam at a temperature of about 122 ° C. used for the sterilization step, or pure water that satisfies a specific standard for the washing step, into the drying chamber 11, the first dewatering section 12, and the second dewatering section 30 .

於乾燥室11處設置有用於測定乾燥室11內部之壓力的壓力計26、27。壓力計26係被設為不受因測定氣體之種類而產生之測定指示值之影響而可測定全壓之第1真空計,設為例如BARATRON真空計、隔膜壓力計之電容壓力計。壓力計27係被設為利用熱傳導可測定全壓之真空計,且被設為根據測定氣體之種類而於測定指示值產生差的第2真空計,設為例如皮拉尼真空計。 The drying chamber 11 is provided with pressure gauges 26 and 27 for measuring the pressure inside the drying chamber 11. The pressure gauge 26 is a first vacuum gauge capable of measuring the total pressure without being affected by a measurement indication value caused by the type of the measurement gas, and is a capacitance pressure gauge such as a BARATRON vacuum gauge and a diaphragm pressure gauge. The pressure gauge 27 is a vacuum gauge that can measure the total pressure by heat conduction, and is a second vacuum gauge that causes a difference in the measurement instruction value according to the type of the measurement gas, and is, for example, a Pirani vacuum gauge.

將於第1脫水部12之第1乾燥步驟或加熱乾燥步驟中、前述第1真空計26所測定之乾燥室11之測定指示值與第2真空計27所測定之乾燥室11之測定指示值進行比較,並將測定指示值之差收斂為極小之時點判斷為第1乾燥步驟或加熱乾燥步驟之結束點。此為後述之判別步驟。 In the first drying step or heating and drying step of the first dewatering section 12, the measurement indication value of the drying chamber 11 measured by the first vacuum gauge 26 and the measurement indication value of the drying chamber 11 measured by the second vacuum gauge 27 The comparison is performed, and the point at which the difference between the measurement instruction values converges to be extremely small is judged as the end point of the first drying step or the heating and drying step. This is a discrimination step described later.

亦即,在自壓力計26、27之測定值為相隔之狀態變化為壓力計26、27之測定值為一致之狀態之際,判斷為乾燥室11內部之水分被去除至第1脫水部12之能力界限程度,而可向第2脫水部30之第2乾燥步驟切換。壓力計26、27之計測值被輸出至控制單元14。 That is, when the measured values of the pressure gauges 26 and 27 are separated from each other and the measured values of the pressure gauges 26 and 27 are consistent, it is determined that the moisture in the drying chamber 11 is removed to the first dehydration unit 12. It can be switched to the second drying step of the second dewatering section 30 by the limit of the capacity. The measured values of the pressure gauges 26 and 27 are output to the control unit 14.

第1脫水部12係作為使乾燥室11與真空幫浦(第1排氣機構)15連通之一個排氣路徑(第1排氣路徑)而發揮機能。於第1脫水部12處設置有第1冷阱17(捕集機構)。第1冷阱17構成捕集面(第1捕集面),其能夠使水蒸氣凝結並將其捕集。第1冷阱17較之後所說明之第2冷阱38例如設為大型化、作為能夠捕集更大量之水蒸氣之主要乾燥用之冷阱而被使用。 The first dewatering section 12 functions as one exhaust path (first exhaust path) that communicates the drying chamber 11 with the vacuum pump (first exhaust mechanism) 15. A first cold trap 17 (collecting mechanism) is provided at the first dehydration section 12. The first cold trap 17 constitutes a collection surface (first collection surface), which is capable of condensing and collecting water vapor. The first cold trap 17 is larger than the second cold trap 38 described later, and is used as a cold trap for drying, which is mainly used for trapping a larger amount of water vapor, for example.

第1脫水部12中之第1冷阱17以流通有冷卻媒體之管被捲繞為線圈狀之方式構成。作為除此以外之構成,第1冷阱17亦可構成為平板(plate)狀。第1冷阱17於管之兩端具有冷媒之導入部17a及導出部17b。該等冷媒之導入部17a及導出部17b係連接於第1冷卻單元17c,該第1冷卻單元17c將冷媒供給至第1冷阱17內並使其流通。 The first cold trap 17 in the first dewatering section 12 is configured such that a pipe through which a cooling medium flows is wound in a coil shape. As a configuration other than this, the first cold trap 17 may be configured in a plate shape. The first cold trap 17 has a refrigerant introduction portion 17a and an outlet portion 17b at both ends of the tube. The introduction portion 17a and the extraction portion 17b of these refrigerants are connected to a first cooling unit 17c, which supplies the refrigerant into the first cold trap 17 and circulates the refrigerant.

第1冷卻單元17c由控制單元14控制,而使冷媒在第1冷阱17內流通。第1冷卻單元17c具有:壓縮機,其將冷媒壓縮;凝縮器,其將經壓縮之高溫高壓冷媒液化;膨脹閥,其使液體冷媒絕熱膨脹;及蒸發器,其將液體冷媒氣化。第1冷阱17相當於上述蒸發器。冷媒係藉由自導入部17a被導入至第1冷阱17內,並在第1冷阱17流通,且自導出部17b被導出而進行循環。並且,作為冷媒可使用例如氟利昂氣體R404A或矽油等。 The first cooling unit 17 c is controlled by the control unit 14 so that the refrigerant flows in the first cold trap 17. The first cooling unit 17c includes a compressor that compresses the refrigerant, a condenser that liquefies the compressed high-temperature and high-pressure refrigerant, an expansion valve that adiabatically expands the liquid refrigerant, and an evaporator that vaporizes the liquid refrigerant. The first cold trap 17 corresponds to the evaporator. The refrigerant is introduced into the first cold trap 17 through the introduction unit 17a and circulates through the first cold trap 17, and is led out from the outlet unit 17b for circulation. As the refrigerant, for example, Freon gas R404A or silicone oil can be used.

第1冷卻單元17c將第1冷阱17之表面(第1捕集面)冷卻至第1溫度。所謂第1溫度係指能夠使第1冷阱17可將乾燥室11內之自試樣F1昇華之水蒸氣之絕大部分凝結並將其捕集之溫度。第1溫度之值係根據作為乾燥對象物之試樣F1之種類、乾燥室之到達壓力等而被設定,在本實施方式中,係設定為-40℃左右、-20℃~-60℃左右之範圍。 The first cooling unit 17c cools the surface (first collection surface) of the first cold trap 17 to a first temperature. The first temperature is a temperature at which the first cold trap 17 can condense and capture most of the water vapor in the drying chamber 11 sublimated from the sample F1. The value of the first temperature is set according to the type of the sample F1 to be dried, the reach pressure of the drying chamber, and the like. In this embodiment, it is set to about -40 ° C, about -20 ° C to -60 ° C. Range.

於第1脫水部12處,在乾燥室11與第1冷阱17之間,設置有作為切換閥而發揮機能之第1分隔部21,且在第1冷阱17與真空幫浦(第1排氣機構)15之間,設置有作為切換器件之第1切換閥22。第1分隔部21及第1切換閥22之開閉係由控制單元14控制。 At the first dehydration section 12, a first partition section 21 functioning as a switching valve is provided between the drying chamber 11 and the first cold trap 17, and the first cold trap 17 and the vacuum pump (the first A first switching valve 22 is provided between the exhaust mechanisms) 15 as a switching device. The opening and closing of the first partition 21 and the first switching valve 22 are controlled by the control unit 14.

第1分隔部21具有:分隔體21a,其能夠將在乾燥室11之壁面開口之部分閉塞;未圖示之驅動部,其使分隔體21a移動;及未圖示之驅動源,其驅動此驅動部。驅動部係切換於將分隔體21a與壁面接觸之閉塞狀態、與分隔體21a自壁面脫離之開放狀態。藉由驅動源由控制單元14驅動控制,而進行第1分隔部21之開閉控制。分隔體21a及驅動 部設為如後述般在將第1脫水部12及乾燥室11予以洗淨、殺菌之際,能夠洗淨之構成。 The first partitioning section 21 includes a partitioning body 21a capable of closing a portion opened on the wall surface of the drying chamber 11; a driving section (not shown) moves the partitioning body 21a; and a driving source (not shown) drives this Drive section. The driving unit is switched between a closed state where the partition body 21a is in contact with the wall surface and an open state where the partition body 21a is separated from the wall surface. The drive unit is driven and controlled by the control unit 14 to perform opening and closing control of the first partition 21. Separator 21a and drive As described later, when the first dewatering unit 12 and the drying chamber 11 are washed and sterilized, the unit is configured to be washable.

可藉由將第1分隔部21開放,而將乾燥室11與第1脫水部12彼此連通。可藉由將第1分隔部21及第1切換閥22一起開放,而將乾燥室11與真空幫浦15彼此連通。可藉由將第1分隔部21閉塞且將第1切換閥22開放,而將第1脫水部12內之氣體排出。可藉由將第1分隔部21及第1切換閥22一起閉塞,而限制乾燥室11內之氣體經由第1脫水部12之排出。由真空幫浦15與第1切換閥22構成第1排氣機構。 By opening the first partition portion 21, the drying chamber 11 and the first dewatering portion 12 can communicate with each other. By opening the first partition 21 and the first switching valve 22 together, the drying chamber 11 and the vacuum pump 15 can communicate with each other. The gas in the first dewatering section 12 can be discharged by closing the first partitioning section 21 and opening the first switching valve 22. The first partitioning portion 21 and the first switching valve 22 can be closed together to restrict the gas in the drying chamber 11 from being discharged through the first dewatering portion 12. The vacuum pump 15 and the first switching valve 22 constitute a first exhaust mechanism.

在本實施方式中,在作為連通於乾燥室11之另一個排氣路徑(第2排氣路徑)而發揮機能之第2脫水部30處,設置有第2冷阱38。第2冷阱38構成捕集面(第2捕集面),其能夠使水蒸氣凝結並將其捕集。第2冷阱38係設為能夠冷卻至較第1冷阱17之第1捕集面更低之第2溫度之構成。 In the present embodiment, a second cold trap 38 is provided at the second dewatering section 30 that functions as another exhaust path (second exhaust path) communicating with the drying chamber 11. The second cold trap 38 constitutes a collection surface (second collection surface), which is capable of condensing and collecting water vapor. The second cold trap 38 is configured to be capable of being cooled to a second temperature lower than the first collection surface of the first cold trap 17.

圖2係顯示本實施方式之低溫阱之剖視圖。 FIG. 2 is a cross-sectional view showing a low temperature trap according to this embodiment.

本實施方式之低溫阱作為最終乾燥用之第2脫水部30而設置於殼體31內,該殼體31係與被安裝於真空乾燥裝置10之作為被脫氣空間之乾燥室(chamber,室)11連接。 The low temperature trap of the present embodiment is provided in a casing 31 as a second dehydration section 30 for final drying, and the casing 31 is connected to a drying chamber (chamber, chamber) as a degassed space installed in the vacuum drying device 10. ) 11 connection.

在本實施方式中,對第1冷阱17之冷凍機17c要求之能力係實現-50~-60℃左右之溫度調整,且具有大的熱容量。相對於此,第2冷阱38係用於二次乾燥而進行利用一次乾燥吸附水分後之處理的阱。因此,作為對第2冷阱38要求之能力,係要求實現進一步低溫(例如-80℃~-100℃)之溫度調整,但熱容量為小即可。因此,第2冷阱38與第1冷阱17相比為小型。利用第2冷阱38能夠捕集之水蒸氣量與第1冷阱17相比為少量。第2冷阱38係作為最終乾燥用之冷阱而被使用。例如在被乾燥物中包含有500kg左右之水分之情形下,第1冷阱17使被乾燥物中之絕大部分之水分乾燥,而為了使被乾燥物中剩餘之1%之水 分乾燥而使用第2冷阱38。 In this embodiment, the capacity required for the refrigerator 17c of the first cold trap 17 is to achieve a temperature adjustment of about -50 to -60 ° C, and has a large heat capacity. In contrast, the second cold trap 38 is a trap for performing secondary drying and performing a treatment after adsorbing moisture by the primary drying. Therefore, as the capability required for the second cold trap 38, it is required to achieve a further low temperature (for example, -80 ° C to -100 ° C) temperature adjustment, but the heat capacity may be small. Therefore, the second cold trap 38 is smaller than the first cold trap 17. The amount of water vapor that can be trapped by the second cold trap 38 is smaller than that of the first cold trap 17. The second cold trap 38 is used as a cold trap for final drying. For example, when the dried material contains about 500 kg of water, the first cold trap 17 dries most of the water in the dried material, and in order to dry the remaining 1% of the water in the dried material, The second cold trap 38 was used for drying.

第2冷阱38由控制單元14控制。利用機械式冷凍機38b被冷卻之低溫板件38a係作為低溫阱而發揮機能。第2冷阱38係設置於由冷卻分離分隔壁36分割之殼體31內。低溫板件38a之板面以朝向乾燥室11(chamber,室)內之脫氣對象(被乾燥物)F1之方式而設置。 The second cold trap 38 is controlled by the control unit 14. The low-temperature plate 38a cooled by the mechanical refrigerator 38b functions as a low-temperature trap. The second cold trap 38 is provided in the casing 31 divided by the cooling separation partition wall 36. The plate surface of the low-temperature plate member 38a is provided so as to face the deaeration object (the object to be dried) F1 in the drying chamber 11 (chamber).

冷卻分離分隔壁36如圖2所示般,與低溫板件38a之一個板面相接。又,冷卻分離分隔壁36係以下述方式設置,即:將殼體31內之空間分離成前述乾燥室11側之被脫氣空間30A(第1空間)與低溫板件38a側之後背空間30B(第2空間,相對於低溫板件38a與第1空間為相反側之空間)。換言之,於被脫氣空間30A與後背空間30B之間設置有冷卻分離分隔壁36。 As shown in FIG. 2, the cooling separation partition wall 36 is in contact with one plate surface of the low-temperature plate member 38 a. The cooling separation partition wall 36 is provided in such a manner that the space in the casing 31 is separated into the deaerated space 30A (the first space) on the drying chamber 11 side and the rear back space 30B on the low temperature plate 38a side (The second space is a space opposite to the first space with respect to the low-temperature plate member 38a). In other words, a cooling separation partition wall 36 is provided between the deaerated space 30A and the back space 30B.

冷卻分離分隔壁36如圖2所示般具有與低溫板件38a之一個板面密接之平板部36a。平板部36a之朝向乾燥室11(chamber,室)之表面作為低溫阱之阱面。 As shown in FIG. 2, the cooling separation partition wall 36 has a flat plate portion 36 a which is in close contact with one plate surface of the low-temperature plate member 38 a. The surface of the flat plate portion 36a facing the drying chamber 11 (chamber) serves as the well surface of the low-temperature well.

於冷卻分離分隔壁36之平板部36a處,如圖2所示般以自平板部36a之周緣起延伸且圍著低溫板件38a之周圍之方式連接有筒狀部36b。冷卻分離分隔壁36形成為具有底部之圓筒形狀。筒狀部36b之端部與殼體31之背面部31c連接,從而被脫氣空間30A能夠密閉。冷卻分離分隔壁36係構成為,除了筒狀部36b與背面部31c連接之部位以外,與殼體31不接觸。因此,低溫板件38a附近能夠充分地冷卻,從而低溫板件38a可作為阱板件(阱面)而發揮作用。 A cylindrical portion 36b is connected to the flat plate portion 36a of the cooling separation partition wall 36 so as to extend from the periphery of the flat plate portion 36a and surround the periphery of the low-temperature plate member 38a as shown in FIG. 2. The cooling separation partition wall 36 is formed in a cylindrical shape having a bottom. The end portion of the cylindrical portion 36b is connected to the rear surface portion 31c of the case 31, so that the deaerated space 30A can be sealed. The cooling separation partition wall 36 is configured so as not to be in contact with the case 31 except for a portion where the cylindrical portion 36b is connected to the back surface portion 31c. Therefore, the vicinity of the low-temperature plate 38a can be sufficiently cooled, and the low-temperature plate 38a can function as a well plate (well surface).

此外,於殼體31之背面部31c與低溫板件38a(平板部36a)之間,設置有桿36d。利用桿36d,背面部31c與低溫板件38a之距離被設定為特定距離。 Further, a rod 36d is provided between the rear surface portion 31c of the case 31 and the low-temperature plate member 38a (flat plate portion 36a). With the lever 36d, the distance between the rear surface portion 31c and the low-temperature plate member 38a is set to a specific distance.

於筒狀部36b之中心軸向之中間部如圖2所示般周設有突狀之變形部36c。在被脫氣空間30A與後背空間30B產生壓力差時,由於變形 部36c變形,而筒狀部36b可進行伸縮。 A protruding deformed portion 36c is provided around the middle portion in the central axial direction of the cylindrical portion 36b as shown in FIG. When a pressure difference occurs between the deaerated space 30A and the back space 30B, the The portion 36c is deformed, and the cylindrical portion 36b is expandable and contractible.

冷卻分離分隔壁36包含作為耐腐蝕性材料而被周知之SUS 316、316L。 The cooling separation partition wall 36 includes SUS 316 and 316L, which are well-known as corrosion-resistant materials.

在平板部36a與包含例如銅之低溫板件38a之間,為了提高密接性從而提高冷卻效率而配置有潤滑脂等。該潤滑脂被要求具有高熱傳導性、在低溫下能夠使用、蒸氣壓為低。 Between the flat plate portion 36a and the low-temperature plate member 38a containing copper, for example, a grease or the like is arranged in order to improve the adhesion and improve the cooling efficiency. This grease is required to have high thermal conductivity, be usable at low temperatures, and low vapor pressure.

於冷卻分離分隔壁36面向低溫板件38a之後背空間30B處,如圖1所示般連接有排氣裝置39(排氣機構)。 An exhaust device 39 (exhaust mechanism) is connected to the rear separation space 30B behind the cooling separation partition wall 36 facing the low-temperature plate 38a as shown in FIG. 1.

在使排氣裝置39與排氣幫浦16為別體而設置排氣裝置39之情形(使用2個幫浦之情形)時,可將與排氣幫浦16相同的幫浦使用於排氣裝置39。此外,在不使用排氣裝置39之情形下,亦可將排氣幫浦16連接於後背空間30B,而謀求所使用之排氣幫浦的共通化(僅使用一個排氣幫浦16)。該情形下,排氣幫浦16經由第1配管與後背空間30B連接,且排氣幫浦16經由第2配管與被脫氣空間30A連接。較佳地是預先於第1配管或第2配管設置止回閥等,使得氣體不會自後背空間30B逆流至被脫氣空間30A。 When the exhaust device 39 and the exhaust pump 16 are provided separately (when using two pumps), the same pump as the exhaust pump 16 can be used for exhaust装置 39。 Device 39. In addition, when the exhaust device 39 is not used, the exhaust pump 16 may be connected to the back space 30B, and common use of the exhaust pump may be achieved (only one exhaust pump 16 is used). In this case, the exhaust pump 16 is connected to the back space 30B via the first pipe, and the exhaust pump 16 is connected to the degassed space 30A via the second pipe. Preferably, a check valve or the like is provided in the first piping or the second piping in advance so that the gas does not flow backward from the back space 30B to the deaerated space 30A.

在第2冷阱38處,如圖2所示般,於成為第2脫水部30之殼體31內,利用機械式冷凍機38b被冷凍之低溫板件38a係以自殼體31之壁隔開之方式而設置。又,第2冷阱38藉由在第2脫水部30內使水分子等凝結於低溫板件38a,而將水分子等維持在第2脫水部30內,從而使乾燥室11內部之水分子等減少。 At the second cold trap 38, as shown in FIG. 2, in the casing 31 that becomes the second dehydration section 30, the low-temperature plate 38a frozen by the mechanical refrigerator 38b is separated from the wall of the casing 31 Set it on. In addition, the second cold trap 38 condenses water molecules and the like in the second dehydration section 30 to the low-temperature plate 38a, and maintains the water molecules and the like in the second dehydration section 30, thereby enabling water molecules in the drying chamber 11 to be condensed. And so on.

低溫板件38a可藉由機械式冷凍機38b使氦氣西蒙膨脹,而冷卻至例如80K之超低溫。可藉由將氣體分子凝結於低溫板件38a,而將乾燥室11內之真空度提高至利用排氣幫浦16等無法達到之高真空。 The low-temperature plate 38a can expand the helium Simon by a mechanical refrigerator 38b, and cool it to an ultra-low temperature of 80K, for example. By condensing gas molecules on the low-temperature plate 38a, the degree of vacuum in the drying chamber 11 can be increased to a high vacuum that cannot be achieved by the exhaust pump 16 or the like.

排氣幫浦16具有將第2脫水部30之中被脫氣空間30A內排氣至真空的機能,作為排氣幫浦16可使用渦輪分子幫浦。 The exhaust pump 16 has a function of exhausting the inside of the deaerated space 30A in the second dehydration section 30 to a vacuum, and a turbo molecular pump can be used as the exhaust pump 16.

第2冷阱38係將低溫板件38a之表面(第2捕集面)冷卻至較第1冷阱17之表面之溫度低之溫度,例如大致-70℃~-100℃範圍內之-85℃左右。若將低溫板件38a之表面溫度過低地設定,則由於必要之機械式冷凍機38b之能力過大故非較佳者。又,若將低溫板件38a之表面溫度過高地設定,則由於無法將被乾燥物F1之含水率降低至必要之程度故非較佳者。 The second cold trap 38 cools the surface (second collection surface) of the low-temperature plate 38a to a temperature lower than the temperature of the surface of the first cold trap 17, for example, -85 in the range of -70 ° C to -100 ° C. ℃ or so. If the surface temperature of the low-temperature plate 38a is set too low, it is not preferable because the necessary mechanical freezer 38b has too much capacity. In addition, if the surface temperature of the low-temperature plate member 38a is set too high, it is not preferable because the moisture content of the dried object F1 cannot be reduced to a necessary level.

此外,雖然第2冷阱38原本如上述般係使用可適用於半導體或FPD之製造的高性能之低溫阱,但亦可在與通常所使用之條件相比極其不同之條件下使用第2冷阱38。 In addition, although the second cold trap 38 originally uses a high-performance low-temperature trap suitable for the manufacture of semiconductors or FPDs as described above, the second cold trap 38 can also be used under conditions that are extremely different from those generally used. WELL 38.

於第2脫水部30中,如圖1所示般,在乾燥室11與第2冷阱38之間,設置有作為切換閥發揮機能之第2分隔部23。於第2冷阱38與排氣幫浦(第2排氣機構)16之間,設置有作為切換機構之第2切換閥24。第2分隔部23及第2切換閥24之開閉係由控制單元14控制。 As shown in FIG. 1, the second dewatering section 30 is provided with a second partitioning section 23 functioning as a switching valve between the drying chamber 11 and the second cold trap 38. A second switching valve 24 as a switching mechanism is provided between the second cold trap 38 and the exhaust pump (second exhaust mechanism) 16. The opening and closing of the second partition portion 23 and the second switching valve 24 are controlled by the control unit 14.

第2分隔部23具有:分隔體23a,其能夠將在乾燥室11之壁面開口之部分閉塞;未圖示之驅動部,其使分隔體23a移動;及未圖示之驅動源,其驅動此驅動部。驅動部係切換於將分隔體23a與壁面接觸之閉塞狀態、與分隔體23a自壁面脫離之開放狀態。藉由驅動源由控制單元14驅動控制,而進行第2分隔部23之開閉控制。分隔體23a及驅動部係如後述般採用在將第2脫水部30之被脫氣空間30A及乾燥室11予以洗淨、殺菌之際,能夠洗淨之構成。分隔體23a係配置於較未圖示之孔板更靠近於乾燥室11之被乾燥物F1之位置。 The second partitioning section 23 includes a partitioning body 23a capable of closing a portion opened on the wall surface of the drying chamber 11; a driving section (not shown) that moves the partitioning body 23a; and a driving source (not shown) that drives this Drive section. The driving unit is switched between a closed state where the partition body 23a is in contact with the wall surface, and an open state where the partition body 23a is separated from the wall surface. The drive unit is driven and controlled by the control unit 14 to perform opening and closing control of the second partition 23. The partition body 23a and the drive unit are configured to be washable when the deaerated space 30A and the drying chamber 11 of the second dehydration unit 30 are washed and sterilized, as described later. The separator 23a is disposed closer to the object F1 to be dried in the drying chamber 11 than the orifice plate (not shown).

可藉由將第2分隔部23開放,而將乾燥室11與第2脫水部30之被脫氣空間30A彼此連通。可藉由將第2分隔部23及第2切換閥24一起開放,而將乾燥室11與排氣幫浦(第2排氣機構)16彼此連通。可藉由將第2分隔部23閉塞且將第2切換閥24開放,而將第2脫水部30之被脫氣空間30A內之氣體排出。可藉由將第2分隔部23及第2切換閥24一起閉 塞,而將第2脫水部30之被脫氣空間30A及乾燥室11內獨立地閉塞。此外,較佳的是在將被脫氣空間30A內之氣體排出之際,亦將後背空間30B內之氣體排出,而使被脫氣空間30A及後背空間30B之壓力為相同程度。進而,在使低溫阱38動作之際,有必要將後背空間30B內之氣體排出而使後背空間30B成為真空狀態。由排氣幫浦16與第2切換閥24構成第2排氣機構。 By opening the second partition portion 23, the deaeration space 30A of the drying chamber 11 and the second dewatering portion 30 can communicate with each other. By opening the second partition 23 and the second switching valve 24 together, the drying chamber 11 and the exhaust pump (second exhaust mechanism) 16 can communicate with each other. By closing the second partition portion 23 and opening the second switching valve 24, the gas in the deaerated space 30A of the second dewatering portion 30 can be discharged. The second partition 23 and the second switching valve 24 can be closed together. The inside of the deaeration space 30A of the second dewatering unit 30 and the drying chamber 11 are closed independently. In addition, when the gas in the degassed space 30A is exhausted, it is preferable that the gas in the back space 30B is also exhausted so that the pressures in the degassed space 30A and the back space 30B are the same. Furthermore, when the low temperature trap 38 is operated, it is necessary to exhaust the gas in the back space 30B to make the back space 30B into a vacuum state. The exhaust pump 16 and the second switching valve 24 constitute a second exhaust mechanism.

本實施方式之真空乾燥裝置10在將乾燥室11、第1脫水部12與第2脫水部30洗淨之後,將乾燥室11與第1脫水部12連通,且將第2脫水部30閉塞而進行第1凍結乾燥步驟。其後,將乾燥室11與第2脫水部30連通,且將第1脫水部12閉塞而進行第2凍結乾燥步驟。 The vacuum drying device 10 according to the present embodiment cleans the drying chamber 11, the first dewatering section 12, and the second dewatering section 30, and then communicates the drying chamber 11 with the first dewatering section 12, and closes the second dewatering section 30. Perform the first freeze-drying step. Thereafter, the drying chamber 11 is communicated with the second dehydration unit 30, and the first dehydration unit 12 is closed to perform a second freeze-drying step.

因此,在本實施方式之真空乾燥裝置10中,乾燥室11與第1脫水部12及第2脫水部30之被脫氣空間30A,為可分別洗淨且分別密閉。 Therefore, in the vacuum drying apparatus 10 of this embodiment, the deaeration space 30A of the drying chamber 11 and the first dewatering section 12 and the second dewatering section 30 can be washed and sealed separately.

具體而言,在第1脫水部12與第2脫水部30之被脫氣空間30A處,作為殺菌時之熱對策、醫藥製劑製造用而言,分隔體21a、分隔體21a之驅動部、分隔體23a、分隔體23a之驅動部、及冷卻分離分隔壁36之表面可採用以SUS、SUS 316、SUS 316L、Au、Pt等之金屬覆蓋之構成。並且,未被洗淨之面,亦即與脫水部12、30之內側表面不相接之部分可使用熱傳導性良好之Cu。 Specifically, in the deaerated space 30A of the first dewatering section 12 and the second dewatering section 30, as a heat countermeasure at the time of sterilization, and for the manufacture of a pharmaceutical preparation, the partition 21a, the driving section of the partition 21a, The surfaces of the body 23a, the driving portion of the partition 23a, and the cooling and separating wall 36 may be made of metal covered with SUS, SUS 316, SUS 316L, Au, Pt, or the like. In addition, for the unwashed surface, that is, the portion not in contact with the inner surface of the dewatering portions 12 and 30, Cu with good thermal conductivity can be used.

在第1切換閥22及較第1切換閥22更靠近真空幫浦15側處,採用氣體不會從第1脫水部12朝乾燥室11逆流之構成。相同地,在第2切換閥24及較第2切換閥24更靠近排氣幫浦16側處,採用氣體不會從第2脫水部30朝乾燥室11逆流之構成。 The first switching valve 22 and the side closer to the vacuum pump 15 than the first switching valve 22 are configured so that the gas does not flow backward from the first dewatering section 12 to the drying chamber 11. Similarly, the second switching valve 24 and the side closer to the exhaust pump 16 than the second switching valve 24 are configured such that gas does not flow backward from the second dehydration section 30 toward the drying chamber 11.

此外,後背空間30B係與被脫氣空間30A分離而採用氣體不會自後背空間30B朝乾燥室11及被脫氣空間30A逆流之構成。 In addition, the back space 30B is separated from the deaerated space 30A and adopts a structure in which gas does not flow back from the back space 30B toward the drying chamber 11 and the deaerated space 30A.

低溫阱通常而言為了提高冷凍機與阱板件之連接部處之傳熱性,而在此部分夾著In箔,本實施方式將此處由In箔變更為金箔,且 利用冷卻分離分隔壁36分離使得In箔不曝露於被脫氣空間30A。 The low temperature trap is generally used to improve the heat transfer at the connection between the freezer and the trap plate, and the In foil is sandwiched between this part. In this embodiment, the In foil is changed from In foil to gold foil, and The separation by the cooling separation wall 36 prevents the In foil from being exposed to the deaerated space 30A.

另外,在第2脫水部30中,利用後述之本實施方式之真空乾燥方法,在殺菌步驟、洗淨步驟、收容步驟、第1乾燥步驟中,亦利用第2排氣機構之第2切換閥24使排氣幫浦16側處於被閉塞之狀態。 The second dewatering unit 30 also uses the vacuum drying method of the present embodiment described later, and also uses the second switching valve of the second exhaust mechanism in the sterilization step, the washing step, the storage step, and the first drying step. 24 causes the exhaust pump 16 side to be blocked.

以下針對使用本實施方式之低溫阱的真空乾燥方法予以說明。 The vacuum drying method using the low temperature trap of this embodiment will be described below.

圖3係顯示使用本實施方式之低溫阱之真空乾燥方法的流程圖。 FIG. 3 is a flowchart showing a vacuum drying method using the low temperature trap of the present embodiment.

使用本實施方式之低溫阱的真空乾燥方法如圖3所示般,具有:準備步驟S01、開閉步驟S02、殺菌步驟S03、洗淨步驟S04、預備乾燥步驟S05、開閉步驟S06、收容步驟S07、開閉步驟S08、第1乾燥步驟S09、加熱乾燥步驟S10、第2排氣步驟S11、判別步驟S12、開閉步驟S13、第2乾燥步驟S14、第1排氣步驟S15、密閉步驟S16、開閉步驟S17、及取出步驟S18。 The vacuum drying method using the low temperature trap of this embodiment is shown in FIG. 3 and includes a preparation step S01, an opening and closing step S02, a sterilization step S03, a washing step S04, a preliminary drying step S05, an opening and closing step S06, and a containing step S07. Opening and closing step S08, first drying step S09, heating and drying step S10, second exhausting step S11, discrimination step S12, opening and closing step S13, second drying step S14, first exhausting step S15, closing step S16, and opening and closing step S17 And take out step S18.

本實施方式之真空乾燥方法之圖3所示之準備步驟S01,係事先進行準備,以使必要之被乾燥物F1可被搬入擱架11a。又,在控制單元14中,準備必要之製造條件資訊。 The preparation step S01 shown in FIG. 3 of the vacuum drying method according to this embodiment is prepared in advance so that the object to be dried F1 can be carried into the shelf 11a. The control unit 14 prepares necessary manufacturing condition information.

其次,圖3所示之開閉步驟S02,係利用控制單元14之控制將各分隔部、閥如以下般開閉。 Next, in the opening / closing step S02 shown in FIG. 3, each partition and valve are opened and closed by the control of the control unit 14 as follows.

乾燥室11:開 Drying room 11: On

第1分隔部21:開 First partition 21: On

第2分隔部23:開 Second partition 23: On

第1切換閥22:閉 First switching valve 22: closed

第2切換閥24:閉 Second switching valve 24: closed

其次,圖3所示之殺菌步驟S03,係在開閉步驟S02中所設定之狀態下,亦即,在將第1分隔部21及第2分隔部23開放而使乾燥室11與第1脫水部12及第2脫水部30連通,並利用控制單元14之控制自洗淨、殺菌裝置19供給蒸汽。藉此,對乾燥室11與第1脫水部12及第2脫水部30 之被脫氣空間30A之內部進行殺菌。 Next, the sterilization step S03 shown in FIG. 3 is in the state set in the opening and closing step S02, that is, the first compartment 21 and the second compartment 23 are opened to open the drying chamber 11 and the first dehydration unit. The 12 and the second dehydration unit 30 communicate with each other, and the steam is supplied from the washing and sterilizing device 19 by the control of the control unit 14. Thereby, the drying chamber 11 and the first dewatering unit 12 and the second dewatering unit 30 The inside of the deaerated space 30A is sterilized.

被乾燥物F1之醫藥製劑所曝露之部分必須要保證完全無菌。因此,在每次開始進行藥劑生產步驟時,作為藥劑生產步驟之前步驟,要進行蒸氣殺菌步驟S03。所謂在面向醫藥品之凍結乾燥裝置中必要之殺菌,是指藉由於122℃以上之蒸汽中曝露20分種以上而將菌殺滅。 The exposed part of the pharmaceutical preparation of the dried substance F1 must be completely sterile. Therefore, each time the pharmaceutical production step is started, as a step before the pharmaceutical production step, a steam sterilization step S03 is performed. The so-called necessary sterilization in freeze-drying equipment for pharmaceuticals refers to the killing of bacteria by exposure to steam at 122 ° C or higher for 20 minutes or more.

在該蒸汽殺菌步驟中之壓力係被設為210kPa左右、220kpa~240kpa左右。實際而言,作為蒸汽殺菌步驟S03係將裝置內部維持高溫3個小時左右。 The pressure in this steam sterilization step is set to about 210 kPa and about 220 kpa to 240 kpa. Practically speaking, as the steam sterilization step S03, the inside of the device is maintained at a high temperature for about 3 hours.

此時,第1冷阱17之流通有冷卻媒體之管,為了耐受此溫度,係採用藉由使冷卻單元17c驅動運轉而保持在70℃以下之構成。 At this time, the tube of the cooling medium flowing through the first cold trap 17 is configured to be maintained at 70 ° C or lower by driving the cooling unit 17c in order to withstand this temperature.

相同地,第2冷阱38之低溫板件38a為了耐受此溫度,係採用在被加熱時藉由使機械式冷凍機38b驅動運轉而使得機械式冷凍機38b保持為70℃以下之構成。先前所使用之低溫阱在接收來自低溫板件38a之傳熱之際,機械式冷凍機38b之耐熱溫度為70℃,但此處藉由上述構成將溫度保持在機械式冷凍機38b之耐熱溫度以下。並且亦使機械式冷凍機38b之耐熱性提高。 Similarly, in order to withstand this temperature, the low-temperature plate 38a of the second cold trap 38 is configured to keep the mechanical refrigerator 38b at 70 ° C or lower by driving the mechanical refrigerator 38b while being heated. When the low temperature trap used previously receives heat transfer from the low temperature plate 38a, the heat resistance temperature of the mechanical refrigerator 38b is 70 ° C, but the temperature is maintained at the heat resistance temperature of the mechanical refrigerator 38b by the above configuration. the following. In addition, the heat resistance of the mechanical refrigerator 38b is also improved.

此時,較佳的是亦由冷卻分離分隔壁36分離之後背空間30B內之氣體利用排氣裝置39排出。 At this time, it is preferable that the gas in the back space 30B is also discharged by the exhaust device 39 after being separated by the cooling separation partition wall 36.

其次,圖3所示之洗淨步驟S04係在開閉步驟S02中所設定之狀態下,亦即將第1分隔部21及第2分隔部23開放而使乾燥室11與第1脫水部12及第2脫水部30之被脫氣空間30A連通,並利用控制單元14之控制,自洗淨、殺菌裝置19供給洗淨用之滿足特定之基準的純水。藉此,對乾燥室11與第1脫水部12及第2脫水部30之被脫氣空間30A之內部進行洗淨。與半導體等其他製造領域之真空裝置不同,係對裝置內部灑水進行洗淨。因此,較佳的是乾燥室11與第1脫水部12及第2脫水 部30之被脫氣空間30A之內部為儘量不積存水之構造。 Next, the washing step S04 shown in FIG. 3 is in the state set in the opening and closing step S02, that is, the first partition 21 and the second partition 23 are opened, and the drying chamber 11 and the first dewatering section 12 and the first 2 The deaerated space 30A of the dewatering unit 30 is communicated and controlled by the control unit 14 to supply pure water that meets specific standards for washing from the washing and sterilizing device 19. Thereby, the inside of the deaeration space 30A of the drying chamber 11 and the 1st dehydration part 12 and the 2nd dehydration part 30 is wash | cleaned. Unlike vacuum devices in other manufacturing fields such as semiconductors, the inside of the device is cleaned by spraying water. Therefore, it is preferable that the drying chamber 11 and the first dewatering section 12 and the second dewatering The inside of the deaerated space 30A of the portion 30 has a structure in which water is not accumulated as much as possible.

其次,圖3所示之預備乾燥步驟S05,係在開閉步驟S02中所設定之狀態下,亦即,將第1分隔部21及第2分隔部23開放而使乾燥室11與第1脫水部12及第2脫水部30之被脫氣空間30A連通,利用控制單元14之控制,驅動第1冷阱17,對乾燥室11與第1脫水部12及第2脫水部30之被脫氣空間30A進行預備乾燥,並去除洗淨水。此時,可利用擱架11a之調溫裝置(調溫機構)對乾燥室11內進行加溫。 Next, the preliminary drying step S05 shown in FIG. 3 is in the state set in the opening and closing step S02, that is, the first partition 21 and the second partition 23 are opened to open the drying chamber 11 and the first dewatering section. 12 and the deaerated space 30A of the second dewatering unit 30 communicate with each other, and the first cold trap 17 is driven by the control of the control unit 14 to the deaerated space of the drying chamber 11 and the first dewatering unit 12 and the second dewatering unit 30 30A was pre-dried and the washing water was removed. At this time, the inside of the drying chamber 11 can be heated by a temperature adjustment device (temperature adjustment mechanism) of the shelf 11a.

在預備乾燥步驟S05中,控制單元14驅動第1冷卻單元17c而使冷媒在第1冷阱17中流通,將第1分隔部21、第2分隔部23及第1切換閥22開啟,且將第2切換閥24關閉,驅動真空幫浦15而將乾燥室11內之氣體經由成為第1排氣路徑之第1脫水部12排出。藉此,由於乾燥室11與第1脫水部12及第2脫水部30之被脫氣空間30A的壓力降低,從而內部之水分蒸發。真空幫浦15將含有水蒸氣之乾燥室11與第1脫水部12及第2脫水部30之被脫氣空間30A之內部的氣體經由第1排氣路徑汲出。水蒸氣由第1冷阱17捕集。 In the preliminary drying step S05, the control unit 14 drives the first cooling unit 17c to circulate the refrigerant in the first cold trap 17, opens the first partition 21, the second partition 23, and the first switching valve 22, and opens The second switching valve 24 is closed, and the vacuum pump 15 is driven to discharge the gas in the drying chamber 11 through the first dewatering section 12 which is the first exhaust path. As a result, the pressure in the deaerated space 30A of the drying chamber 11 and the first and second dewatering units 12 and 30 is reduced, so that the water in the interior evaporates. The vacuum pump 15 extracts the gas inside the drying chamber 11 containing water vapor, and the deaerated space 30A of the first dewatering section 12 and the second dewatering section 30 through the first exhaust path. Water vapor is collected by the first cold trap 17.

並且,較佳的是在預備乾燥步驟S05中,不驅動第2冷阱38,但在藉由後述之第2排氣步驟S11將第2脫水部30之被脫氣空間30A內部之水分在後序步驟中排出之情形等時,則不在此限。 In addition, it is preferable that the second cold trap 38 is not driven in the preliminary drying step S05, but that the moisture in the deaerated space 30A of the second dewatering section 30 is after the second exhaust step S11 described later In the case of discharge in the sequential steps, etc., it is not limited.

其次,圖3所示之開閉步驟S06,係利用控制單元14之控制而將各分隔部、閥如以下般開閉。 Next, in the opening and closing step S06 shown in FIG. 3, each partition and valve are opened and closed as follows by the control of the control unit 14.

乾燥室11:開 Drying room 11: On

第1分隔部21:開 First partition 21: On

第2分隔部23:閉 Second partition 23: closed

第1切換閥22:閉 First switching valve 22: closed

第2切換閥24:閉 Second switching valve 24: closed

其次,圖3所示之收容步驟S07,係在開閉步驟S06中所設定之狀 態下,亦即,在將第1分隔部21開放而使乾燥室11與第1脫水部12連通,且將第2分隔部23閉塞而使第2脫水部30之被脫氣空間30A獨立之狀態下,將被乾燥物F1搬入乾燥室11。 Next, the containment step S07 shown in FIG. 3 is the state set in the opening and closing step S06. In a state, that is, when the first partition 21 is opened to communicate the drying chamber 11 and the first dewatering section 12, and the second partition 23 is closed, the deaerated space 30A of the second dewatering section 30 is independent. In the state, the object to be dried F1 is carried into the drying chamber 11.

其次,圖3所示之開閉步驟S08,係利用控制單元14之控制將各分隔部、閥如以下般開閉。 Next, in the opening and closing step S08 shown in FIG. 3, each partition and valve are opened and closed as follows by the control of the control unit 14.

乾燥室11:閉 Drying room 11: closed

第1分隔部21:開 First partition 21: On

第2分隔部23:閉 Second partition 23: closed

第1切換閥22:開 First switching valve 22: open

第2切換閥24:閉 Second switching valve 24: closed

其次,圖3所示之第1乾燥步驟S09,係在開閉步驟S08所設定之狀態下,亦即,在將第1分隔部21開放而使乾燥室11與第1脫水部12連通,且將第2分隔部23閉塞而使第2脫水部30獨立之狀態下,利用控制單元14之控制來驅動第1冷阱17,而對乾燥室11與第1脫水部12之內部,特別是對乾燥室11進行凍結乾燥。藉此,由於乾燥室11與第1脫水部12之壓力降低,從而內部之水分蒸發。真空幫浦15將含有水蒸氣之乾燥室11內的氣體經由第1排氣路徑汲出。水蒸氣由第1冷阱17捕集。 Next, the first drying step S09 shown in FIG. 3 is in a state set in the opening and closing step S08, that is, when the first partition portion 21 is opened to communicate the drying chamber 11 and the first dehydration portion 12, and In a state where the second partition section 23 is closed and the second dewatering section 30 is independent, the first cold trap 17 is driven by the control of the control unit 14, and the inside of the drying chamber 11 and the first dewatering section 12 is particularly dry. The chamber 11 is freeze-dried. As a result, the pressure in the drying chamber 11 and the first dewatering unit 12 is reduced, and the water in the interior is evaporated. The vacuum pump 15 extracts the gas in the drying chamber 11 containing water vapor through the first exhaust path. Water vapor is collected by the first cold trap 17.

自乾燥室11所汲出之氣體之中的氮等之非凝結氣體不在第1冷阱17處凝結而由真空幫浦15汲出。載置於擱架11a上之試樣F1由於自水分蒸發潛熱被奪走而凍結。 Non-condensable gases such as nitrogen among the gases extracted from the drying chamber 11 are not condensed at the first cold trap 17 and are extracted by the vacuum pump 15. The sample F1 placed on the shelf 11a is frozen because the latent heat of evaporation from moisture is taken away.

第1乾燥步驟S09中之第1冷阱17係溫度設定為-40℃左右。 The temperature of the first cold trap 17 system in the first drying step S09 is set to about -40 ° C.

其次,圖3所示之加熱乾燥步驟S10,係在開閉步驟S08所設定之狀態下,亦即,在將第1分隔部21開放而使乾燥室11與第1脫水部12連通,且將第2分隔部23閉塞而使第2脫水部30之被脫氣空間30A獨立之狀態下,利用控制單元14之控制而驅動設置於各擱架11a之調溫裝置 11b(調溫機構)。 Next, the heating and drying step S10 shown in FIG. 3 is in a state set in the opening and closing step S08, that is, when the first partition portion 21 is opened to communicate the drying chamber 11 and the first dehydration portion 12, and the first In a state where the 2 partitioning section 23 is closed and the deaerated space 30A of the second dewatering section 30 is independent, the temperature control device installed on each shelf 11a is driven by the control of the control unit 14 11b (temperature control mechanism).

加熱器(調溫機構)11b係藉由將乾燥室11內之擱架11a加熱至20℃而將載置於擱架11a之試樣F1進行加熱,藉此促進試樣F1之乾燥。經加熱之試樣F1中所包含之冰自該試樣F1獲取潛熱,而昇華而成為水蒸氣。 The heater (temperature-regulating mechanism) 11b accelerates the drying of the sample F1 by heating the sample F1 placed on the shelf 11a by heating the shelf 11a in the drying chamber 11 to 20 ° C. The ice contained in the heated sample F1 obtains latent heat from the sample F1, and sublimates to become water vapor.

真空幫浦15將含有此水蒸氣之乾燥室11內的氣體經由第1排氣路徑汲出。由真空幫浦15汲出之氣體之中,水蒸氣藉由在第1冷阱17之表面放出潛熱而凝結成為冰,而由第1冷阱17捕集。自乾燥室11所汲出之氣體之中的氮等之非凝結氣體不在第1冷阱17凝結而由真空幫浦15汲出。 The vacuum pump 15 extracts the gas in the drying chamber 11 containing the water vapor through the first exhaust path. Among the gases extracted by the vacuum pump 15, water vapor is condensed into ice by releasing latent heat on the surface of the first cold trap 17, and is captured by the first cold trap 17. Non-condensable gases, such as nitrogen, among the gases extracted from the drying chamber 11 are not condensed by the first cold trap 17 and are extracted by the vacuum pump 15.

藉由利用真空幫浦15之乾燥室11之排氣動作持續進行,乾燥室11達到真空幫浦15所具有之到達壓力。又,由於乾燥室11內之水蒸氣之凝結點下降,導致第1冷阱17之捕集能力劣化,乾燥室11內之真空度之上升停止。若乾燥室11內之真空度之上升停止,則試樣F1所包含之冰無法昇華。其結果為,既然昇華不再進行,則試樣F1所包含之冰不會從固體原料獲取潛熱,故因加熱器11b之加熱作用,試樣F1之溫度上升。設置於擱架11a之溫度感測器11c利用加熱器11b檢測經加熱之試樣F1之表面溫度,並將所檢測之溫度作為檢測信號輸出至控制單元14。 By continuously exhausting the drying chamber 11 using the vacuum pump 15, the drying chamber 11 reaches the reaching pressure of the vacuum pump 15. In addition, the condensation point of the water vapor in the drying chamber 11 is lowered, so that the trapping ability of the first cold trap 17 is deteriorated, and the increase in the vacuum degree in the drying chamber 11 is stopped. When the increase in the vacuum degree in the drying chamber 11 stops, the ice contained in the sample F1 cannot be sublimated. As a result, since the sublimation is no longer performed, the ice contained in the sample F1 does not obtain latent heat from the solid raw material. Therefore, the temperature of the sample F1 rises due to the heating action of the heater 11b. The temperature sensor 11c provided on the shelf 11a detects the surface temperature of the heated sample F1 by the heater 11b, and outputs the detected temperature to the control unit 14 as a detection signal.

同時,藉由利用真空幫浦15之乾燥室11之排氣動作持續進行,乾燥室11內之真空度之上升停止。此時,將壓力計26之測定指示值與壓力計27之測定指示值輸出至控制單元14,上述壓力計26係被設為不受測定氣體之種類所導致之測定指示值的影響而可測定全壓之第1真空計,且上述壓力計27係被設為根據測定氣體之種類而產生測定指示值之差的第2真空計。 At the same time, the exhausting operation of the drying chamber 11 using the vacuum pump 15 is continued, and the increase in the degree of vacuum in the drying chamber 11 is stopped. At this time, the measurement instruction value of the pressure gauge 26 and the measurement instruction value of the pressure gauge 27 are output to the control unit 14, and the above-mentioned pressure gauge 26 is set to be measurable without being affected by the measurement instruction value caused by the type of the measurement gas. A first vacuum gauge of full pressure, and the above-mentioned pressure gauge 27 is a second vacuum gauge that generates a difference in measurement instruction value depending on the type of measurement gas.

控制單元14將利用前述第1真空計26測定之乾燥室11之測定指示 值與利用第2真空計27測定之乾燥室11之測定指示值進行比較,並檢測測定指示值之差收斂為極小之時點。藉由將該等第1及第2真空計之測定指示值之差進行比較,而將該測定指示值之差收斂為極小之時點判斷為乾燥終點確認時,或者將第2真空計之測定指示曲線中下降曲線之拐點之時刻作為乾燥終點確認時而進行檢測。 The control unit 14 instructs the measurement of the drying chamber 11 measured by the first vacuum gauge 26 The value is compared with the measurement instruction value of the drying chamber 11 measured by the second vacuum gauge 27, and the time point at which the difference between the measurement instruction values converges to a minimum is detected. By comparing the difference between the measurement indication values of the first and second vacuum gauges and converging the difference between the measurement indication values to be extremely small, it is judged that the drying end point is confirmed, or the measurement indication of the second vacuum gauge The moment of the inflection point of the falling curve in the curve is detected as the drying end point confirmation.

同時,控制單元14基於來自溫度感測器11c之檢測信號,檢測試樣F1之表面溫度與加熱器11b之加熱溫度相同而達到上限。 Meanwhile, based on the detection signal from the temperature sensor 11c, the control unit 14 detects that the surface temperature of the sample F1 is the same as the heating temperature of the heater 11b and reaches the upper limit.

其次,圖3所示之判別步驟S12,係控制單元14在藉由對來自壓力計26、27之測定指示值進行比較而判斷為到達所檢測之乾燥終點確認時,及/或基於來自溫度感測器11c之檢測信號而判斷為到達所檢測之試樣F1之表面溫度與加熱器11b之溫度成為相同之上限時之情形下,則判斷此時為加熱乾燥步驟S10之結束點。該情形下,首先將第1分隔部21閉塞,其後,停止第1冷阱17之驅動。並且,若在第1分隔部21閉塞後,則第1切換閥22之開閉狀態為任一狀態皆可。 Secondly, the determination step S12 shown in FIG. 3 is when the control unit 14 determines that the detected drying end point is confirmed by comparing the measurement instruction values from the pressure gauges 26 and 27, and / or based on the temperature sense When it is determined that the surface temperature of the detected sample F1 and the temperature of the heater 11b have reached the same upper limit by the detection signal of the detector 11c, it is determined that this is the end point of the heating and drying step S10. In this case, first the first partition 21 is closed, and thereafter, the driving of the first cold trap 17 is stopped. After the first partition portion 21 is closed, the first switching valve 22 may be opened or closed in any state.

其次,圖3所示之開閉步驟S13,係利用控制單元14之控制將各分隔部、閥如以下般開閉。 Next, in the opening and closing step S13 shown in FIG. 3, each partition and valve are opened and closed as follows by the control of the control unit 14.

乾燥室11:閉 Drying room 11: closed

第1分隔部21:閉 The first partition 21: closed

第2分隔部23:開 Second partition 23: On

第1切換閥22:閉 First switching valve 22: closed

第2切換閥24:開 2nd switching valve 24: open

其次,圖3所示之第2乾燥步驟S14,係在開閉步驟S13所設定之狀態下,亦即,在將第2分隔部23開放而使乾燥室11與第2脫水部30之被脫氣空間30A連通,且將第1分隔部21閉塞而使第1脫水部12獨立之狀態下,利用控制單元14之控制,驅動第2冷阱38,而對乾燥室11與第2脫水部30之內部,特別是對乾燥室11進行凍結乾燥。 Next, the second drying step S14 shown in FIG. 3 is in a state set in the opening and closing step S13, that is, when the second partition portion 23 is opened to degas the drying chamber 11 and the second dehydration portion 30. In a state where the space 30A is in communication, and the first partitioning section 21 is closed to make the first dewatering section 12 independent, the second cold trap 38 is driven by the control of the control unit 14 to control the drying chamber 11 and the second dewatering section 30. Inside, especially the drying chamber 11 is freeze-dried.

此時,為了確實地進行低溫板件38a之冷卻(真空絕熱狀態),利用排氣裝置39預先將後背空間30B排氣而使其成為真空狀態。後背空間30B之壓力狀態被設定為與被脫氣空間30A相同程度。 At this time, in order to reliably cool the low-temperature plate 38a (vacuum thermal insulation state), the exhaust space 39B is previously exhausted to a vacuum state by the exhaust device 39. The pressure state of the back space 30B is set to the same degree as the degassed space 30A.

藉此,由於乾燥室11與第2脫水部30之被脫氣空間30A之壓力降低,從而內部之水分蒸發。渦輪分子幫浦16將含有水蒸氣之乾燥室11內之氣體經由第2排氣路徑汲出。水蒸氣係由作為第2冷阱之低溫阱38被捕集。 As a result, the pressure in the deaerated space 30A of the drying chamber 11 and the second dewatering unit 30 is reduced, and the water in the interior is evaporated. The turbo molecular pump 16 extracts the gas in the drying chamber 11 containing water vapor through the second exhaust path. The water vapor is captured by the low temperature trap 38 as a second cold trap.

此外,加熱器11b及渦輪分子幫浦16繼加熱乾燥步驟S10後繼續被設為驅動狀態。另外,亦可在第2分隔部23開放之前,開始低溫阱38之驅動。 In addition, the heater 11b and the turbo molecular pump 16 continue to be put into a driving state after the heating and drying step S10. Alternatively, the driving of the low-temperature well 38 may be started before the second partition portion 23 is opened.

低溫阱38係設定為較第1冷阱17低之溫度,例如-100℃左右。 The low temperature trap 38 is set to a temperature lower than the first cold trap 17, for example, about -100 ° C.

被冷卻至-100℃之第2冷阱38,捕集由第1冷阱17無法捕集之水蒸氣。與此相伴,乾燥室11之壓力降低。藉此,殘留於試樣F1之冰的昇華再次開始。殘留於試樣F1之冰自試樣F1獲取潛熱而昇華,所產生之水蒸氣在成為第2冷阱38之低溫板件38a位置之冷卻分離分隔壁36表面將潛熱放出並凝結而成為冰,而由第2冷阱38被捕集。利用該最終乾燥,可將加熱乾燥步驟S10所乾燥之試樣F1進一步乾燥,從而可提高試樣F1之最終乾燥度,而將含水率降低2個數量級。並且,相對於在使用第1脫水部12之第1乾燥步驟S09及加熱乾燥步驟S10所去除之水分,在使用第2脫水部30之被脫氣空間30A之第2乾燥步驟S14中所去除之水分係可設為1%左右,亦即5kg左右。 The second cold trap 38 cooled to -100 ° C captures water vapor that cannot be captured by the first cold trap 17. Along with this, the pressure in the drying chamber 11 decreases. With this, the sublimation of the ice remaining in the sample F1 starts again. The ice remaining in the sample F1 sublimates from the sample F1, and the generated water vapor releases the latent heat on the surface of the cooling separation partition wall 36 at the position of the low-temperature plate 38a of the second cold trap 38 to condense to become ice. The second cold trap 38 is captured. With this final drying, the sample F1 dried in the heating and drying step S10 can be further dried, so that the final dryness of the sample F1 can be improved, and the water content can be reduced by two orders of magnitude. In addition, the moisture removed in the first drying step S09 and the heat drying step S10 using the first dewatering section 12 is removed in the second drying step S14 in the deaerated space 30A using the second dewatering section 30. The water content can be set to about 1%, that is, about 5kg.

其次,圖3所示之密閉步驟S16,係在開閉步驟S13所設定之狀態下,亦即,在將第2分隔部23開放而使乾燥室11與第2脫水部30之被脫氣空間30A連通,且將第1分隔部21閉塞而使第1脫水部12獨立之狀態下,利用控制單元14之控制,使用未圖示之密閉裝置(密閉機構),對被乾燥物F1施以鋁密封等而進行密閉。 Next, the sealing step S16 shown in FIG. 3 is in the state set in the opening and closing step S13, that is, when the second partition section 23 is opened to open the deaerated space 30A of the drying chamber 11 and the second dewatering section 30. In a state where the first partition 21 is closed and the first dewatering section 12 is independent, the first dewatering section 12 is controlled by the control unit 14 and a sealing device (sealing mechanism) (not shown) is used to seal the dried object F1 with aluminum. Wait for airtightness.

其次,圖3所示之開閉步驟S17,係利用控制單元14之控制將各分隔部、閥如以下般開閉。 Next, in the opening and closing step S17 shown in FIG. 3, each partition and valve are opened and closed as follows by the control of the control unit 14.

乾燥室11:開 Drying room 11: On

第1分隔部21:閉 The first partition 21: closed

第2分隔部23:閉 Second partition 23: closed

第1切換閥22:閉 First switching valve 22: closed

第2切換閥24:閉 Second switching valve 24: closed

其次,圖3所示之取出步驟S18,係將含水率被降低至所期望之狀態而乾燥處理結束之被乾燥物F1自乾燥室11取出,而結束此批乾燥處理。 Next, the take-out step S18 shown in FIG. 3 is to take out the dried object F1 from the drying chamber 11 after the moisture content is reduced to a desired state and the drying process is completed, and the batch of drying processes is ended.

並且,如圖3所示般,第2排氣步驟S11係在第1乾燥步驟S09及加熱乾燥步驟S10之一部分或全部製程中,在開閉步驟S08所設定之狀態下,亦即在將第1分隔部21開放而使乾燥室11與第1脫水部12連通,且將第2分隔部23閉塞而使第2脫水部30之被脫氣空間30A獨立之狀態下,將第2切換閥24開啟,而可預先將成為該獨立狀態之第2脫水部30之被脫氣空間30A內之氣體排出,並將利用第2冷阱38捕集之水分排出至外部。藉此,能夠不延遲地著手後續批次之凍結乾燥步驟。 In addition, as shown in FIG. 3, the second exhausting step S11 is part or all of the first drying step S09 and the heating and drying step S10 in a state set in the opening and closing step S08, that is, the first step The partition 21 is opened to communicate the drying chamber 11 with the first dewatering section 12, and the second partition 23 is closed to separate the deaerated space 30A of the second dewatering section 30, and the second switching valve 24 is opened. In addition, the gas in the degassed space 30A of the second dewatering section 30 in the independent state can be discharged in advance, and the moisture captured by the second cold trap 38 can be discharged to the outside. Thereby, the freeze-drying step of subsequent batches can be started without delay.

在該將被脫氣空間30A內之氣體排出之第2排氣步驟S11中,可使排氣裝置39不動作。 In the second exhausting step S11 of exhausting the gas in the deaerated space 30A, the exhausting device 39 can be made inoperative.

相同地,在圖3所示之第2乾燥步驟S14之一部分或者全部過程中,作為第1排氣步驟S15係在開閉步驟S13所設定之狀態下,亦即,在將第2分隔部23開放,而使乾燥室11與第2脫水部30之被脫氣空間30A連通,且將第1分隔部21閉塞而使第1脫水部12獨立之狀態下,將第1切換閥22開啟,而可預先將成為該獨立狀態之第1脫水部12內之氣體排出,並將利用第1冷阱17捕集之水分排出至外部。藉此,能夠不延遲地著手後續批次之凍結乾燥步驟。 Similarly, in part or all of the second drying step S14 shown in FIG. 3, the first exhaust step S15 is in a state set in the opening and closing step S13, that is, the second partition 23 is opened. When the drying chamber 11 communicates with the deaerated space 30A of the second dewatering section 30, and the first partitioning section 21 is closed to make the first dewatering section 12 independent, the first switching valve 22 is opened, so that The gas in the first dehydration section 12 in the independent state is exhausted in advance, and the moisture trapped by the first cold trap 17 is exhausted to the outside. Thereby, the freeze-drying step of subsequent batches can be started without delay.

在本實施方式中,藉由將2個能夠切換之冷阱17、38之中的一個設為獨立之低溫阱38,且將包含銅之低溫阱38之低溫板件38a配置於以冷卻分離分隔壁36分離之後背空間30B,從而能夠將被乾燥物凍結乾燥至先前所無法到達之降低2個數量級之含水率。 In this embodiment, one of the two switchable cold traps 17, 38 is set as an independent low-temperature trap 38, and the low-temperature plate 38a including the copper low-temperature trap 38 is arranged to cool and separate the components. The back wall 30B is separated after the partition wall 36, so that the dried object can be freeze-dried to reduce the moisture content by 2 orders of magnitude that could not be reached before.

又,由於與先前已提出之利用液態氮獲得極低溫之方法相比本發明上述實施方式運轉成本低廉且溫度條件能夠設為可變,因此可對應於各種乾燥條件。 In addition, compared with the previously-proposed method of obtaining extremely low temperature by using liquid nitrogen, the above-mentioned embodiment of the present invention has lower operating costs and can change the temperature conditions, so it can correspond to various drying conditions.

在起動低溫阱38之際,藉由將第1分隔部21或第2分隔部23設為閉塞狀態,而可防止附著於第1冷阱17之冰吸附於較第1冷阱17處理溫度為低之低溫阱38之可能性。 When the low-temperature trap 38 is activated, the first partition 21 or the second partition 23 is set to a closed state, so that the ice adhered to the first cold trap 17 can be prevented from being adsorbed at a temperature higher than the processing temperature of the first cold trap 17. Possibility of low low temperature trap 38.

或者,可根據被乾燥物F1之種類、或被乾燥物F1之制約而將低溫阱38之低溫板件38a在利用冷卻分離分隔壁36分離之狀態下直接地設置於乾燥室11中。此構成能夠應用於在例如被乾燥物F1為於密閉下被取出此般製品之情形等,附著於低溫阱38之冰在製品出庫時不會成為問題之情況。 Alternatively, the low-temperature plate 38a of the low-temperature trap 38 may be directly installed in the drying chamber 11 in a state separated by the cooling separation wall 36 according to the type of the object to be dried F1 or the restriction of the object to be dried F1. This configuration can be applied to, for example, a case where the product to be dried F1 is taken out in a sealed state, and the like, and ice attached to the low temperature trap 38 does not cause a problem when the product is stored.

又,亦可在已設置之凍結乾燥裝置上與第1冷阱17相同地開設孔並追加閥,而追加低溫阱38。在此情形下,為了可應用於洗淨、殺菌步驟,而需要將銅製之低溫板件38a設為利用冷卻分離分隔壁36分離之規格、或者是採用以此為基礎之構成。 In addition, the same freeze-drying device as the first cold trap 17 may be used to open a hole, add a valve, and add a low temperature trap 38. In this case, in order to be applicable to the washing and sterilization steps, it is necessary to set the copper low-temperature plate 38a to a specification separated by a cooling separation partition wall 36 or adopt a structure based on this.

被乾燥物F1曝露之乾燥室11之內部、第1脫水部12之內部、第2脫水部30之被脫氣空間30A之內部,在乾燥處理中必須要保證完全地無菌。因此,在每次開始藥劑生產步驟時,作為藥劑生產步驟之前步驟,必須要進行蒸氣殺菌步驟、洗淨步驟。所謂在應用於面向醫藥品,特別是注射用水(WFI:water for injection)製造等之凍結乾燥裝置中必要的殺菌處理,是指藉由在122℃以上之蒸汽中曝露20分鐘以上而將菌殺滅。 The inside of the drying chamber 11 to which the object F1 is exposed, the inside of the first dewatering section 12 and the inside of the deaerated space 30A of the second dewatering section 30 must be completely sterile during the drying process. Therefore, each time a pharmaceutical production step is started, a steam sterilization step and a washing step must be performed as a step before the pharmaceutical production step. The so-called necessary sterilization treatment used in freeze-drying equipment for pharmaceuticals, especially for the manufacture of water for injection (WFI: water for injection), means that the bacteria are killed by exposure to steam at 122 ° C or higher for 20 minutes or more. Off.

此蒸氣殺菌步驟中之乾燥室11內部之壓力係設定為210kPa左右、220kpa~240kpa左右。實際而言,以3個小時左右之蒸汽殺菌步驟,裝置內部係維持於高溫。此時,第1冷阱17為了耐受此溫度,係藉由使冷卻單元17c運轉而保持70℃以下之溫度。又,低溫阱38之阱為了耐受此溫度,藉由在被蒸汽加熱時使機械式冷凍機38b之壓縮機動作而使機械式冷凍機38b運轉,並使排氣裝置39運轉,從而保持70℃以下之溫度。 The pressure inside the drying chamber 11 in this steam sterilization step is set to about 210 kPa and about 220 kpa to 240 kpa. Practically speaking, in the steam sterilization step of about 3 hours, the interior of the device is maintained at a high temperature. At this time, in order to withstand this temperature, the first cold trap 17 is maintained at a temperature of 70 ° C. or lower by operating the cooling unit 17 c. In order to withstand this temperature, the well of the low temperature trap 38 operates the mechanical refrigerator 38b by operating the compressor of the mechanical refrigerator 38b while being heated by steam, and operates the exhaust device 39 to maintain 70 Temperature below ℃.

在低溫阱38中,由於機械式冷凍機38b在超過70℃之環境下無法長時間保持,故在殺菌步驟S03中使機械式冷凍機38b處於運轉狀態一邊冷卻一邊進行殺菌處理為較佳。該情形下,由於機械式冷凍機38b之冷卻能力高,因而有必要進行機械式冷凍機38b之輸出設定,使得不會出現阱板件38a之溫度達不到殺菌所需之充分之溫度。 In the low temperature trap 38, since the mechanical refrigerator 38b cannot be maintained for a long time in an environment exceeding 70 ° C, it is preferable to perform the sterilization treatment while the mechanical refrigerator 38b is in the running state while cooling in the sterilization step S03. In this case, since the cooling capacity of the mechanical freezer 38b is high, it is necessary to set the output of the mechanical freezer 38b so that the temperature of the trap plate 38a does not reach a sufficient temperature required for sterilization.

另外,若為如本實施方式之面向醫藥製劑製造之裝置,則可將用於提高向機械式冷凍機38b與低溫板件38a之連接部之傳熱之箔體設為鍍金箔、金箔等。 Moreover, if it is a device for manufacturing pharmaceutical preparations like this embodiment, the foil for improving heat transfer to the connection part of the mechanical refrigerator 38b and the low temperature plate 38a can be gold-plated foil, gold foil, etc.

同時,可於冷卻分離分隔壁36與低溫板件38a之連接部設置潤滑脂等,而維持冷卻分離分隔壁36與低溫板件38a之密接性從而維持傳熱。 At the same time, a grease or the like may be provided at a connection portion between the cooling separation partition wall 36 and the low-temperature plate member 38a, and the closeness of the cooling separation partition wall 36 and the low-temperature plate member 38a may be maintained to maintain heat transfer.

在利用第1冷阱17在-50℃~-70℃下進行水之捕集之第1乾燥步驟S09及加熱乾燥步驟S10結束後,進一步進行作為總最終加工之第2乾燥步驟S14,其利用低溫阱38在-90℃~-100℃下吸取剩餘之水分。為此,較佳的是將第1冷阱17與低溫阱38設置於切離之房間(空間)。並且,較佳的是對低溫板件38a之融冰不使用加熱器11b。 After the first drying step S09 and the heat drying step S10 where the first cold trap 17 is used to trap water at -50 ° C to -70 ° C, the second drying step S14 is further performed as a total final processing. The low temperature trap 38 absorbs the remaining moisture at -90 ° C to -100 ° C. For this reason, it is preferable to install the first cold trap 17 and the low temperature trap 38 in a cut-off room (space). In addition, it is preferable not to use the heater 11b for melting ice of the low-temperature plate 38a.

在低溫阱38中,機械式冷凍機38b之缸體部之材質包含SUS 316、SUS 316L。又,成為阱板件之冷卻分離分隔壁36之材質係以SUS 316、SUS 316L構成,且傳熱部處係以金箔等耐腐蝕性高之金屬 構成。 In the low temperature trap 38, the material of the cylinder portion of the mechanical refrigerator 38b includes SUS 316 and SUS 316L. The material of the cooling and separating partition wall 36 serving as the well plate is made of SUS 316 and SUS 316L, and the heat transfer part is made of a metal with high corrosion resistance such as gold foil. Make up.

在極低溫下捕集水分而降低被乾燥物F1之含水率的第2乾燥步驟S14,係在以通常之運轉而進行凍結乾燥之第1乾燥步驟S09後的最終步驟,吸附所剩餘之極少量之水分。因此,在本實施方式之真空乾燥裝置中,沒有必要使處理速度上升而短縮處理時間,而是以將含水率之到達度改善2個數量級程度為目的。選擇先前之在半導體或FPD(flat panel display,平板顯示器)之製造裝置中所使用之低溫阱38,並將低溫阱38應用於本實施方式之真空乾燥裝置。 The second drying step S14, which captures moisture at a very low temperature to reduce the moisture content of the dried object F1, is the final step after the first drying step S09, which is freeze-dried under normal operation, and adsorbs a very small amount of remaining Of moisture. Therefore, in the vacuum drying apparatus of this embodiment, it is not necessary to increase the processing speed and shorten the processing time, but to improve the reach of the water content by about two orders of magnitude. The low temperature trap 38 previously used in a semiconductor or FPD (flat panel display) manufacturing device is selected, and the low temperature trap 38 is applied to the vacuum drying device of this embodiment.

另外,在本實施方式中,係將冷卻分離分隔壁36(低溫板件38a)表面朝向被乾燥物F1而配置,但本發明並不限定如此之配置。只要係冷卻分離分隔壁36(低溫板件38a)以朝向被乾燥物F1之方式被配置而能夠進行特定之冷卻的構造,第2脫水部30可連接於乾燥室11之下方,亦可將圖1所示之第1脫水部12之位置與第2脫水部30之位置予以調換。 In addition, in the present embodiment, the surface of the cooling separation partition wall 36 (the low-temperature plate member 38a) is disposed toward the object to be dried F1, but the present invention is not limited to such an arrangement. The second dewatering unit 30 may be connected below the drying chamber 11 as long as the cooling separation partition wall 36 (the low-temperature plate 38a) is disposed so as to face the object to be dried F1, and the second dewatering unit 30 may be connected. The position of the first dewatering section 12 shown in 1 and the position of the second dewatering section 30 are changed.

(實施例) (Example)

以下說明本發明之實施例。 Examples of the present invention will be described below.

並且,針對本發明之具體例予以說明。 A specific example of the present invention will be described.

本實施方式中之低溫阱30之規格表示如下。 The specifications of the low temperature trap 30 in this embodiment are shown below.

直徑r0:Ø400mm Diameter r0: Ø400mm

低溫板件38a厚度:5mm Low temperature plate 38a thickness: 5mm

低溫板件38a材質:Cu Low temperature plate 38a Material: Cu

機械式冷凍機18c方式;使用He之G-M(Gifford-McMahon;吉福特-麥克馬洪)冷凍機 Mechanical freezer 18c mode; G-M (Gifford-McMahon) freezer using He

殼體31內之壓力變化:自大氣壓起至13Pa為止在30分鐘以內(-100℃) Pressure change in case 31: within 30 minutes from atmospheric pressure to 13 Pa (-100 ° C)

切換為低溫阱38之際之乾燥室11內的壓力;約1Pa Switch to the pressure in the drying chamber 11 at the time of the low temperature trap 38; about 1 Pa

冷卻分離分隔壁36之厚度:3mm Thickness of cooling separation wall 36: 3mm

冷卻分離分隔壁36之筒狀部之軸向尺寸:φ350mm Axial dimension of the cylindrical portion of the cooling separation partition wall 36: φ350mm

冷卻分離分隔壁36之材質:SUS 316L Material of cooling separation wall 36: SUS 316L

在如此之低溫阱30中,測定低溫板件38a與冷卻分離分隔壁36之表面溫度之結果,可知低溫板件38a與冷卻分離分隔壁36之表面溫度任一者皆可穩定地維持在-100℃。 As a result of measuring the surface temperatures of the low-temperature plate 38a and the cooling separation wall 36 in such a low-temperature trap 30, it can be seen that the surface temperatures of both the low-temperature plate 38a and the cooling separation wall 36 can be stably maintained at -100. ℃.

[產業上之可利用性] [Industrial availability]

作為本發明之活用例,可舉出的是對於要求將生物醫藥或抗體醫藥等之含水率抑制為低之凍結乾燥,或微生物(細菌、病毒)、活細胞(原生動物、哺乳類細胞之血液、精子)之保存,或食品相關之應用。 Examples of applications of the present invention include freeze-drying, or microorganisms (bacteria, viruses), living cells (protozoa, mammalian cell blood, etc.) which are required to reduce the moisture content of biomedicine or antibody medicine, etc. Sperm), or food-related applications.

10‧‧‧真空乾燥裝置 10‧‧‧Vacuum drying device

11‧‧‧乾燥室(chamber,室) 11‧‧‧ drying chamber (chamber)

11a‧‧‧擱架 11a‧‧‧Shelf

11b‧‧‧加熱器(調溫機構)/調溫裝置 11b‧‧‧Heater (temperature control mechanism) / temperature control device

11c‧‧‧溫度感測器 11c‧‧‧Temperature sensor

12‧‧‧第1脫水部/脫水部 12‧‧‧The first dehydration section / dehydration section

14‧‧‧控制單元(控制部) 14‧‧‧Control Unit (Control Department)

15‧‧‧真空幫浦(第1排氣機構) 15‧‧‧Vacuum pump (the first exhaust mechanism)

16‧‧‧幫浦(第2排氣機構)/排氣幫浦/真空幫浦/渦輪分子幫浦 16‧‧‧pump (second exhaust mechanism) / exhaust pump / vacuum pump / turbo molecular pump

17‧‧‧第1捕集裝置(第1捕集機構)/第1冷阱 17‧‧‧1st trapping device (1st trapping mechanism) / 1st cold trap

17a‧‧‧導入部 17a‧‧‧Introduction Department

17b‧‧‧導出部 17b‧‧‧Export Department

17c‧‧‧第1冷卻單元/冷凍機 17c‧‧‧The first cooling unit / freezer

19‧‧‧洗淨、殺菌裝置(洗淨、殺菌機構) 19‧‧‧Washing and sterilizing device (washing and sterilizing mechanism)

21‧‧‧第1分隔部 21‧‧‧The first division

21a‧‧‧分隔體 21a‧‧‧ divider

22‧‧‧第1切換閥 22‧‧‧The first switching valve

23‧‧‧第2分隔部 23‧‧‧Second Division

23a‧‧‧分隔體 23a‧‧‧ divider

24‧‧‧第2切換閥 24‧‧‧The second switching valve

26‧‧‧壓力計/第1真空計 26‧‧‧Pressure gauge / 1st vacuum gauge

27‧‧‧壓力計/第2真空計 27‧‧‧Pressure gauge / Second vacuum gauge

30‧‧‧第2脫水部/第2冷阱/脫水部/低溫阱 30‧‧‧ 2nd dehydration section / 2nd cold trap / dehydration section / low temperature trap

30A‧‧‧被脫氣空間(第1空間) 30A‧‧‧Degassed space (first space)

30B‧‧‧後背空間(第2空間) 30B‧‧‧Back space (second space)

31‧‧‧殼體 31‧‧‧shell

36‧‧‧冷卻分離分隔壁 36‧‧‧ Cooling separation wall

38‧‧‧捕集裝置(捕集機構)/第2冷阱/低溫阱 38‧‧‧trap device (trap mechanism) / second cold trap / low temperature trap

38a‧‧‧低溫板件/阱板件 38a‧‧‧Low temperature plate / well plate

38b‧‧‧機械式冷凍機 38b‧‧‧ mechanical freezer

39‧‧‧排氣裝置(排氣機構) 39‧‧‧Exhaust device (exhaust mechanism)

F1‧‧‧被乾燥物/原料/試樣/脫氣對象 F1‧‧‧‧Dried material / raw material / sample / degassing object

Claims (6)

一種低溫阱,其係於連接於作為被脫氣空間之室之殼體內,將利用機械式冷凍機冷卻之低溫板件自殼體壁隔開而設置者,且設置有冷卻分離分隔壁,其與前述低溫板件之一個板面相接,且將前述殼體內分離為前述室側之第1空間與前述低溫板件側之第2空間,前述冷卻分離分隔壁具有面對前述第1空間且以耐腐蝕性材料形成之表面,且具有與前述低溫板件之前述板面密接之平板部,上述平板部之中朝向上述室之表面為阱面。 A low-temperature trap is provided in a housing connected to a room that is a space to be degassed, and a low-temperature plate cooled by a mechanical freezer is separated from a wall of the housing and provided with a cooling separation wall. It is in contact with one plate surface of the low-temperature plate, and separates the inside of the housing into a first space on the chamber side and a second space on the low-temperature plate side. The cooling and separating partition wall has a surface facing the first space and The surface formed of a corrosion-resistant material has a flat plate portion which is in close contact with the plate surface of the low-temperature plate. The surface of the flat plate portion facing the chamber is a well surface. 如請求項1之低溫阱,其中於前述冷卻分離分隔壁之前述平板部連接有筒狀部,其自前述平板部之周緣延伸,且包圍前述低溫板件之周圍。 The low temperature trap of claim 1, wherein a cylindrical portion is connected to the flat plate portion of the cooling and separating partition wall, which extends from a peripheral edge of the flat plate portion and surrounds the low temperature plate. 如請求項2之低溫阱,其中於上述筒狀部具有在前述室與前述殼體產生壓力差時,會產生變形之變形部。 The low temperature trap of claim 2, wherein the cylindrical portion has a deformed portion that is deformed when a pressure difference occurs between the chamber and the casing. 如請求項3之低溫阱,其中上述變形部係周設於上述筒狀部之中心軸方向之中間部,且突狀地形成。 The low temperature trap according to claim 3, wherein the deformed portion is formed around the middle portion in the central axis direction of the cylindrical portion and is formed in a protruding manner. 如請求項1至4中任一項之低溫阱,其中上述冷卻分離分隔壁之上述第1空間側之表面係以SUS、SUS 316、SUS 316L、Au或Pt覆蓋。 The low temperature trap according to any one of claims 1 to 4, wherein the surface on the first space side of the cooling separation partition wall is covered with SUS, SUS 316, SUS 316L, Au or Pt. 如請求項1至4中任一項之低溫阱,其中於前述冷卻分離分隔壁之前述低溫板件側之前述第2空間連接有排氣機構。 The low temperature trap according to any one of claims 1 to 4, wherein an exhaust mechanism is connected to the second space on the low temperature plate side of the cooling separation wall.
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