TWI614663B - Touch detection method of capacitive 3d detection module - Google Patents

Touch detection method of capacitive 3d detection module Download PDF

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TWI614663B
TWI614663B TW105126936A TW105126936A TWI614663B TW I614663 B TWI614663 B TW I614663B TW 105126936 A TW105126936 A TW 105126936A TW 105126936 A TW105126936 A TW 105126936A TW I614663 B TWI614663 B TW I614663B
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pressure
touch
capacitive
signal
detecting
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TW105126936A
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TW201714069A (en
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周家麒
莊志成
林尙宇
鄭太獅
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宸鴻科技(廈門)有限公司
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Abstract

本發明提供一種電容式三維偵測模組的偵測方法,提供一電容式三維偵測模組,該電容式三維偵測模組包括電容式觸控感測器與壓電式壓力感測器以及集成在晶片上的電容式三維控制器,該電容式觸控感測器包括多個觸控單元,該壓電式壓力感測器包括至少一壓感單元。偵測方法包括步驟:S1:採用互電容方式對觸控單元進行觸控信號的偵測以確定觸控點位置;及S2:採用自電容方式對壓感單元進行壓力信號的偵測以確定按壓力值大小;觸控信號及壓力信號由電容式三維控制器進行運算處理。 The invention provides a capacitive three-dimensional detecting module detecting method, and provides a capacitive three-dimensional detecting module, wherein the capacitive three-dimensional detecting module comprises a capacitive touch sensor and a piezoelectric pressure sensor And a capacitive three-dimensional controller integrated on the chip, the capacitive touch sensor comprising a plurality of touch units, the piezoelectric pressure sensor comprising at least one pressure sensing unit. The detecting method includes the following steps: S1: detecting the touch signal by using the mutual capacitance method to determine the touch point position; and S2: detecting the pressure signal by using the self-capacitance method to determine the pressing signal. The magnitude of the pressure value; the touch signal and the pressure signal are processed by the capacitive three-dimensional controller.

Description

電容式三維偵測模組的偵測方法 Capacitive three-dimensional detection module detection method

本發明是有關於觸控壓感領域,且特別是有關於一種電容式三維偵測模組的偵測方法。 The invention relates to the field of touch pressure sensing, and in particular to a method for detecting a capacitive three-dimensional detection module.

隨著觸控技術的發展,無論是現有的工業電子裝置還是消費電子裝置大多數都採用了具有觸控功能的觸控模組,具有觸控功能的觸控模組表面受到來自手指以及觸控筆等的操作時,電子裝置通過檢測觸控點的位置來執行特定的操作。對於觸控點的偵測,無論是電容式螢幕還是電阻式螢幕,其均通過不同的原理來確定觸控點在顯示裝置上的二維座標,以觸控操作面所在表面建立二維坐標系(X,Y),觸控點的檢測就相當於確定觸控點在X軸方向的位置以及Y軸方向上的位置,即確定觸控點的二維位置。 With the development of touch technology, most of the existing industrial electronic devices and consumer electronic devices use a touch function with touch function, and the touch function of the touch control module receives the finger and the touch. When the pen or the like is operated, the electronic device performs a specific operation by detecting the position of the touch point. For the detection of touch points, whether it is a capacitive screen or a resistive screen, the two-dimensional coordinates of the touch point on the display device are determined by different principles, and a two-dimensional coordinate system is established on the surface of the touch operation surface. (X, Y), the detection of the touch point is equivalent to determining the position of the touch point in the X-axis direction and the position in the Y-axis direction, that is, determining the two-dimensional position of the touch point.

為了進一步豐富具有觸控功能的觸控模組,目前已有部分觸控模組會加裝壓力感測器以形成三維偵測模組,所述壓力感測器包括多個壓感單元,位於觸控點處的壓感單元感應來自垂直於觸控模組(相當於Z軸方向)的按壓力會產生一定的形變從而引起壓感單元處的電信號發生變 化,對該電性號的偵測可以確定壓感單元所受到的壓力。不同位置觸控點匹配不同按壓力值時可設置對應的裝置功能,即我們可以從觸控點(X,Y)和壓力(Z)所界定的3D(3-dimension三維)角度去豐富設計從而形成兼具觸控偵測功能和壓力偵測功能的三維偵測模組。 In order to further enrich the touch module with touch function, some touch modules are installed with a pressure sensor to form a three-dimensional detection module, and the pressure sensor includes a plurality of pressure sensing units. The pressure sensing unit at the touch point senses that the pressing force from the perpendicular to the touch module (corresponding to the Z-axis direction) causes a certain deformation to cause the electrical signal at the pressure sensing unit to change. The detection of the electrical number can determine the pressure experienced by the pressure sensing unit. When the touch points of different positions match different pressing values, the corresponding device functions can be set, that is, we can enrich the design from the 3D (3-dimension three-dimensional) angle defined by the touch points (X, Y) and pressure (Z). A three-dimensional detection module with touch detection function and pressure detection function is formed.

然而,在電子設備日趨輕薄化低價化的今天,載入有壓力感測器的三維偵測模組硬體非常複雜,觸控感測器的硬體與壓力感測器的硬體多半各自獨立(需要至少兩套硬體設備,硬體設備包括多個晶片),具有成本高,耗能多等缺點。由於其相互的獨立性,所述三維偵測模組的整體偵測方法也相對複雜。 However, in today's increasingly thin and light electronic devices, the hardware of the 3D detection module loaded with the pressure sensor is very complicated, and the hardware of the touch sensor and the hardware of the pressure sensor are mostly different. Independent (requires at least two sets of hardware devices, hardware devices include multiple wafers), which has the disadvantages of high cost and high energy consumption. Due to their mutual independence, the overall detection method of the three-dimensional detection module is relatively complicated.

實際上,以目前用以支持偵測觸控位置的觸控晶片來說,主要採用互電容偵測模式為主,而現有技術對於力感測器遭受壓力變化時,主要以阻抗偵測及電容值變化偵測兩種偵測態樣為選擇;值得留意,若觸控偵測採用互電容式,而壓力變化採用阻抗偵測的方式時,將使用的整體硬體(需要多個晶片搭配惠斯登電橋解決信號偵測與處理)顯得複雜。 In fact, in the current touch chip for supporting the detection of the touch position, the mutual capacitance detection mode is mainly used, and the prior art mainly uses the impedance detection and the capacitance when the force sensor is subjected to the pressure change. Value change detection is a choice of two detection modes; it is worth noting that if the touch detection uses mutual capacitance, and the pressure change uses the impedance detection method, the overall hardware that will be used (requires multiple wafers The Stern bridge solves signal detection and processing.

對業界來說,若能開發出以現有觸控晶片解決信號偵測方案(即以電容偵測型態)的基礎,並使壓力感測訊號也以電容型態被偵測,實現將現有電容式偵測晶片技術直接支援三維偵測應用,即為業界所期待。 For the industry, if the basis of the existing touch chip to solve the signal detection scheme (ie, the capacitance detection type) can be developed, and the pressure sensing signal is also detected in the capacitance type, the existing capacitor can be realized. The detection chip technology directly supports 3D detection applications, which is expected by the industry.

為克服目前三維偵測模組所存在的硬體複雜(需要多個晶片解決信號處理)及偵測方法複雜的問題,本發明提供一種電容式三維偵測模組的偵測方法。 The present invention provides a method for detecting a capacitive three-dimensional detection module in order to overcome the complexity of the hardware complexity of the current three-dimensional detection module (requiring multiple wafers to solve signal processing) and the detection method.

本發明提供了一種解決上述技術問題的技術方案:一種電容式三維偵測模組的偵測方法,提供一電容式三維偵測模組,所述電容式三維偵測模組包括一電容式觸控感測器與一壓電式壓力感測器以及一集成(整合)在一晶片上的電容式三維控制器,所述電容式觸控感測器包括多個觸控單元,所述壓電式壓力感測器包括至少一壓感單元,所述偵測方法依次包括步驟:S1:採用互電容方式對所述多個觸控單元進行觸控信號的偵測以確定觸控點位置;及S2:採用自電容方式對所述至少一壓感單元進行壓力信號的偵測以確定按壓力值大小,在該步驟中所述的至少一壓感單元與步驟S1中所確定的觸控點位置相對應;所述觸控信號以及所述壓力信號由所述電容式三維控制器進行運算處理。 The present invention provides a technical solution for solving the above technical problem: a method for detecting a capacitive three-dimensional detection module, providing a capacitive three-dimensional detection module, the capacitive three-dimensional detection module including a capacitive touch Controlling the sensor and a piezoelectric pressure sensor and a capacitive three-dimensional controller integrated (integrated) on a wafer, the capacitive touch sensor comprising a plurality of touch units, the piezoelectric The pressure sensor includes at least one pressure sensing unit, and the detecting method includes the following steps: S1: detecting a touch signal of the plurality of touch units by using a mutual capacitance method to determine a touch point position; S2: detecting the pressure signal of the at least one pressure sensing unit by using a self-capacitance method to determine the pressing force value, the at least one pressure sensing unit in the step and the touch point position determined in step S1. Correspondingly; the touch signal and the pressure signal are processed by the capacitive three-dimensional controller.

較佳地,所述觸控信號的偵測週期的起始點和結束點均與所述壓力信號偵測週期的起始點和結束點錯位。 Preferably, the start point and the end point of the detection period of the touch signal are both offset from the start point and the end point of the pressure signal detection period.

較佳地,所述至少一壓感單元與多個觸控單元位置對應設置。 Preferably, the at least one pressure sensing unit is disposed corresponding to the positions of the plurality of touch units.

本發明還提供一種電容式三維偵測模組的偵測方法,提供一電容式三維偵測模組,所述電容式三維偵測模組包括一電容式觸控感測器與一壓電式壓力感測器以及一集成在一晶片上的電容式三維控制器,所述電容式觸控感測器包括多個觸控單元,所述壓電式壓力感測器包括至少一壓感單元,所 述偵測方法包括步驟:T21:採用互電容方式對所述多個觸控單元進行觸控信號的偵測以確定觸控點位置;及T22:採用自電容方式對所述至少一壓感單元進行壓力信號的偵測以確定按壓力值大小;步驟T21和步驟T22相互獨立進行;所述觸控信號以及所述壓力信號由所述電容式三維控制器進行運算處理。 The invention also provides a capacitive three-dimensional detection module, which provides a capacitive three-dimensional detection module, the capacitive three-dimensional detection module comprising a capacitive touch sensor and a piezoelectric type a pressure sensor and a capacitive three-dimensional controller integrated on a chip, the capacitive touch sensor includes a plurality of touch units, and the piezoelectric pressure sensor includes at least one pressure sensing unit. Place The detecting method includes the following steps: T21: detecting a touch signal of the plurality of touch units by using a mutual capacitance method to determine a touch point position; and T22: using the self-capacitance method to the at least one pressure sensing unit The pressure signal is detected to determine the pressing force value; the step T21 and the step T22 are performed independently of each other; and the touch signal and the pressure signal are processed by the capacitive three-dimensional controller.

較佳地,所述第一壓感層為採用正溫度係數的壓感材料製成的正溫度係數壓感層,所述第二壓感層為採用負溫度係數的壓感材料製成的負溫度係數壓感層,所述第二壓感層上壓感單元之壓力信號作為所述第一壓感層上壓感單元之壓力信號的溫度補償對象。 Preferably, the first pressure sensitive layer is a positive temperature coefficient pressure sensitive layer made of a pressure sensitive material having a positive temperature coefficient, and the second pressure sensitive layer is a negative pressure sensitive material made of a negative temperature coefficient. a temperature coefficient pressure sensing layer, wherein a pressure signal of the pressure sensing unit on the second pressure sensing layer is a temperature compensation target of a pressure signal of the pressure sensing unit on the first pressure sensing layer.

較佳地,所述觸控信號的偵測與所述壓力信號的偵測分時序進行。 Preferably, the detecting of the touch signal and the detecting of the pressure signal are performed at a timing.

較佳地,所述觸控信號的偵測與所述壓力信號的偵測同時序進行。 Preferably, the detection of the touch signal and the detection of the pressure signal are performed simultaneously.

較佳地,所述觸控信號的偵測週期的起始點和結束點均與所述壓力信號偵測週期的起始點和結束點錯位。 Preferably, the start point and the end point of the detection period of the touch signal are both offset from the start point and the end point of the pressure signal detection period.

較佳地,所述至少一壓感單元與多個觸控單元位置對應設置。 Preferably, the at least one pressure sensing unit is disposed corresponding to the positions of the plurality of touch units.

較佳地,所述壓電式壓力感測器包括至少一柔性基材層,在所述柔性基材層的兩側分別設置有一第一壓感層和一第二壓感層,所述第一壓感層和所述第二壓感層上均設置有至少一所述的壓感單元。 Preferably, the piezoelectric pressure sensor comprises at least one flexible substrate layer, and a first pressure sensitive layer and a second pressure sensitive layer are respectively disposed on two sides of the flexible substrate layer, At least one of the pressure sensitive units is disposed on both the pressure sensitive layer and the second pressure sensitive layer.

較佳地,所述電容式三維控制器對所述第一壓感層上壓感單元之壓力信號和所述第二壓感層上壓感單元之壓力信號進行疊加。 Preferably, the capacitive three-dimensional controller superimposes the pressure signal of the pressure sensitive unit on the first pressure sensitive layer and the pressure signal of the pressure sensitive unit on the second pressure sensitive layer.

與現有技術相比,本發明所提供的電容式三維偵測模組成具有如下優點: Compared with the prior art, the capacitive three-dimensional detection mode composition provided by the invention has the following advantages:

1.電容式三維偵測模組在觸控點位置以及按壓力值的偵測中,可以先偵測觸控點的位置,然後再偵測觸控點位置處所對應的壓感單元所受到的按壓力值,因此,在按壓力值的偵測過程中,電容式三維控制器可選擇性地無需對壓感單元全部進行一次偵測,提高了偵測效率,降低了硬體損耗。 1. In the detection of the touch point position and the pressing value, the capacitive 3D detecting module can detect the position of the touch point first, and then detect the pressure sensitive unit corresponding to the position of the touch point. According to the pressure value, the capacitive three-dimensional controller can selectively detect all the pressure sensing units without detecting the pressure sensing unit, thereby improving the detection efficiency and reducing the hardware loss.

2.觸控點位置的偵測與按壓力值的偵測也可以相互獨立分時序或同時序進行。由於觸控信號和壓力信號因觸控操作所引起的信號類型變化一致。故所述兩者之間容易產生信號干擾,壓力偵測與觸控點的偵測分時序進行時,由於兩者偵測時序相互錯開,故相互之間的干擾可以降低以避免信號誤判。更進一步,所述壓力信號與觸控信號偵測的電位切換點錯開,其可以進一步降低信號之間的相互干擾。在同時序時,在觸控信號偵測的起點處(電位切點)壓力信號的偵測還沒有開始或者已經結束,即使產生了干擾信號,它們之間也避開了相互干擾的可能,而在壓力信號偵測起始點以及結束點(電位切換點)處,觸控信號的偵測處於穩定期,故,兩者之間的干擾也不大。 2. The detection of the touch point position and the detection of the pressing force value can also be performed independently of each other in time series or simultaneously. Since the touch signal and the pressure signal are consistent in the type of signal caused by the touch operation. Therefore, signal interference is easily generated between the two. When the pressure detection and the detection of the touch point are performed in sequence, since the detection timings of the two are staggered, the mutual interference can be reduced to avoid signal misjudgment. Further, the pressure signal is offset from the potential switching point detected by the touch signal, which can further reduce mutual interference between the signals. At the same time, the detection of the pressure signal at the beginning of the touch signal detection (potential cut point) has not started or has ended. Even if an interference signal is generated, they avoid the possibility of mutual interference. At the start of the pressure signal detection and the end point (potential switching point), the detection of the touch signal is in a stable period, so the interference between the two is not large.

3.所述壓電式壓力感測器至少包括一柔性基材層,所述柔性基材層採用柔性材質製作,其能夠靈敏感應於觸 控點所產生的壓力而發生形變。在所述柔性基材層的兩側設置有第一壓感層和第二壓感層,分別位於第一壓感層和第二壓感層上的第一壓感單元和第二壓感單元尺寸位置一一對應,在第一壓感單元和第二壓感單元互為溫度補償的參考對象時,由於其尺寸位置的對應,其各自所受的如溫度以及其他干擾所帶來的雜訊訊號一致,經過運算電路等處理後可以較好的消除壓力信號偵測過程中所產生的其他雜訊訊號。提升壓力偵測精度;此外觸控點所對應的第一壓感單元和第二壓感單元也進行信號疊加,電容式三維偵測模組檢測到更強更穩定的壓力信號。第一壓感層和第二壓感層的壓力信號處理既可以設置為溫度補償方式,又可以兼顧為壓力信號疊加方式,具有設計靈活,結構合理等優點。 3. The piezoelectric pressure sensor comprises at least a flexible substrate layer made of a flexible material, which is sensitive to contact Deformation occurs by the pressure generated by the handle. Providing a first pressure sensitive layer and a second pressure sensitive layer on both sides of the flexible substrate layer, the first pressure sensing unit and the second pressure sensing unit respectively located on the first pressure sensing layer and the second pressure sensing layer One-to-one correspondence of the size positions, when the first pressure sensing unit and the second pressure sensing unit are temperature-compensated reference objects, due to the correspondence of the size positions thereof, the respective noises caused by temperature and other interferences The signals are consistent, and the other noise signals generated during the pressure signal detection process can be better eliminated after being processed by the arithmetic circuit. The pressure detection accuracy is improved; the first pressure sensing unit and the second pressure sensing unit corresponding to the touch point are also superimposed, and the capacitive three-dimensional detecting module detects a stronger and more stable pressure signal. The pressure signal processing of the first pressure sensing layer and the second pressure sensing layer can be set to a temperature compensation mode or a pressure signal superposition method, and has the advantages of flexible design and reasonable structure.

4.觸控單元與壓感單元的通過同一公共驅動器來驅動,其節約了硬體成本,簡化了電路設計,提升了電容式三維偵測模組集成度,且從一定程度上降低了電容式三維偵測模組的厚度與重量。 4. The touch unit and the pressure sensing unit are driven by the same common driver, which saves the hardware cost, simplifies the circuit design, improves the integration degree of the capacitive three-dimensional detection module, and reduces the capacitive type to some extent. The thickness and weight of the 3D detection module.

10‧‧‧電容式三維偵測模組 10‧‧‧Capacitive 3D Detection Module

10s‧‧‧壓力感測器 10s‧‧‧pressure sensor

11‧‧‧上基板 11‧‧‧Upper substrate

12‧‧‧貼合層 12‧‧‧Fitting layer

13‧‧‧電容式觸控感測器 13‧‧‧Capacitive touch sensor

131‧‧‧第一方向觸控驅動電極 131‧‧‧First direction touch drive electrode

132‧‧‧第二方向觸控接收電極 132‧‧‧Second direction touch receiving electrode

133‧‧‧絕緣塊 133‧‧‧Insulation block

14‧‧‧觸控面板 14‧‧‧Touch panel

15‧‧‧第一壓感層 15‧‧‧First pressure sensitive layer

151‧‧‧第一壓感單元 151‧‧‧First pressure sensing unit

16‧‧‧柔性基材層 16‧‧‧Flexible substrate layer

17‧‧‧第二壓感層 17‧‧‧Second pressure sensitive layer

171‧‧‧第二壓感單元 171‧‧‧Second pressure sensing unit

18‧‧‧三維信號處理電路 18‧‧‧Three-dimensional signal processing circuit

180‧‧‧電容式三維控制器 180‧‧‧Capacitive 3D controller

181‧‧‧公共驅動器 181‧‧‧Common drive

183‧‧‧選擇電路 183‧‧‧Selection circuit

185‧‧‧脈衝重整電路 185‧‧‧ pulse reforming circuit

187‧‧‧驅動脈衝處理電路 187‧‧‧Drive pulse processing circuit

189‧‧‧電容式三維處理器 189‧‧‧Capacitive 3D processor

20‧‧‧電容式三維偵測模組 20‧‧‧Capacitive 3D Detection Module

20s‧‧‧壓電式壓力感測器 20s‧‧‧Piezoelectric pressure sensor

21‧‧‧上基板 21‧‧‧Upper substrate

22‧‧‧貼合層 22‧‧‧Fitting layer

23‧‧‧電容式觸控感測器 23‧‧‧Capacitive touch sensor

231‧‧‧第一觸控電極層 231‧‧‧First touch electrode layer

232‧‧‧第二觸控電極層 232‧‧‧Second touch electrode layer

24‧‧‧第一絕緣層 24‧‧‧First insulation

24,‧‧‧第二絕緣層 24, ‧‧‧second insulation

25‧‧‧第一壓感層 25‧‧‧First pressure sensitive layer

26‧‧‧柔性基材層 26‧‧‧Flexible substrate layer

27‧‧‧第二壓感層 27‧‧‧Second pressure sensitive layer

28‧‧‧信號處理電路 28‧‧‧Signal Processing Circuit

40‧‧‧電容式三維偵測模組 40‧‧‧Capacitive 3D Detection Module

40d‧‧‧電容式三維感測器 40d‧‧‧Capacitive three-dimensional sensor

40s‧‧‧壓電式壓力感測器 40s‧‧‧Piezoelectric pressure sensor

41‧‧‧上基板 41‧‧‧Upper substrate

42‧‧‧貼合層 42‧‧‧Fitting layer

431‧‧‧第一觸控電極層 431‧‧‧First touch electrode layer

4311‧‧‧第一方向觸控驅動電極 4311‧‧‧First direction touch drive electrode

432‧‧‧第二觸控電極層 432‧‧‧Second touch electrode layer

45‧‧‧第一壓感層 45‧‧‧First pressure sensitive layer

46‧‧‧柔性基材層 46‧‧‧Flexible substrate layer

47‧‧‧第二壓感層 47‧‧‧Second pressure sensitive layer

48‧‧‧三維信號處理電路 48‧‧‧Three-dimensional signal processing circuit

480‧‧‧電容式三維控制器 480‧‧‧Capacitive 3D controller

481‧‧‧公共驅動器 481‧‧‧Common drive

483‧‧‧選擇電路 483‧‧‧Selection circuit

485‧‧‧脈衝重整電路 485‧‧‧ pulse reforming circuit

487‧‧‧驅動脈衝處理電路 487‧‧‧Drive pulse processing circuit

489‧‧‧電容式三維處理器 489‧‧‧Capacitive 3D Processor

S0-S4‧‧‧步驟 S0-S4‧‧‧ steps

T0-T4、T21-T22‧‧‧步驟 T0-T4, T21-T22‧‧‧ steps

第1圖是本發明第一實施例電容式三維偵測模組的層狀結構示意圖;第2圖是本發明第一實施例電容式三維偵測模組之觸控電極層的平面結構示意圖;第3圖是第2圖中A處的放大結構示意圖; 第4圖是本發明第一實施例電容式三維偵測模組之壓電式壓力感測器的剖視圖;第5圖是本發明第一實施例電容式三維偵測模組之信號處理電路的模組結構示意圖;第6A圖是本發明第一實施例電容式三維偵測模組之觸控信號偵測與壓力信號偵測時序圖;第6B圖是本發明第一實施例電容式三維偵測模組之觸控信號偵測與壓力信號偵測時序圖的變形實施例一;第6C圖是本發明第一實施例電容式三維偵測模組之觸控信號偵測與壓力信號偵測時序圖的變形實施例二;第6D圖是本發明第一實施例電容式三維偵測模組之觸控信號偵測與壓力信號偵測時序圖的變形實施例三;第7圖是本發明第二實施例電容式三維偵測模組的層狀結構示意圖;第8圖是本發明第三實施例電容式三維偵測模組的層狀結構示意圖;第9圖是本發明第三實施例電容式三維偵測模組之信號處理電路的模組結構示意圖;第10圖是本發明第三實施例電容式三維偵測模組之觸控信號偵測與壓力信號偵測時序圖;第11圖是本發明第三實施例電容式三維偵測模組的爆炸結構示意圖;第12圖是本發明第三實施例電容式三維偵測模組的之第一觸控電極層的變形結構示意圖; 第13圖是本發明第四實施例電容式三維偵測模組的偵測方法的流程圖;以及第14圖是本發明第五實施例電容式三維偵測模組的偵測方法的流程圖。 1 is a schematic view showing a layered structure of a capacitive three-dimensional detecting module according to a first embodiment of the present invention; and FIG. 2 is a plan view showing a planar structure of a touch electrode layer of the capacitive three-dimensional detecting module according to the first embodiment of the present invention; Figure 3 is a schematic enlarged view of the structure at A in Figure 2; 4 is a cross-sectional view of a piezoelectric pressure sensor of a capacitive three-dimensional detecting module according to a first embodiment of the present invention; and FIG. 5 is a signal processing circuit of the capacitive three-dimensional detecting module of the first embodiment of the present invention; FIG. 6A is a timing diagram of touch signal detection and pressure signal detection of the capacitive three-dimensional detection module according to the first embodiment of the present invention; FIG. 6B is a capacitive three-dimensional detection of the first embodiment of the present invention; Example 1 of the touch signal detection and pressure signal detection timing chart of the test module; FIG. 6C is a touch signal detection and pressure signal detection of the capacitive 3D detection module according to the first embodiment of the present invention; FIG. 6D is a third modification of the touch signal detection and pressure signal detection timing diagram of the capacitive three-dimensional detection module according to the first embodiment of the present invention; FIG. 7 is the present invention. FIG. 8 is a schematic view showing a layered structure of a capacitive three-dimensional detecting module according to a third embodiment of the present invention; FIG. 9 is a third embodiment of the present invention; Signal processing circuit of capacitive 3D detection module FIG. 10 is a timing diagram of touch signal detection and pressure signal detection of a capacitive three-dimensional detection module according to a third embodiment of the present invention; and FIG. 11 is a third embodiment of the present invention. FIG. 12 is a schematic diagram showing a deformation structure of a first touch electrode layer of a capacitive three-dimensional detecting module according to a third embodiment of the present invention; 13 is a flowchart of a method for detecting a capacitive 3D detection module according to a fourth embodiment of the present invention; and FIG. 14 is a flowchart of a method for detecting a capacitive 3D detection module according to a fifth embodiment of the present invention; .

為了使本發明的目的,技術方案及優點更加清楚明白,以下結合附圖及實施實例,對本發明進行進一步詳細說明。應當理解,此處所描述的具體實施例僅僅用以解釋本發明,並不用於限定本發明。 The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It is understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

請參閱第1圖,本發明第一實施例電容式三維偵測模組10包括一從上至下(本發明中,上下左右、頂部、底部等位置詞僅用於限定指定視圖上的相對位置,而非絕對位置)依次包括一觸控面板14,一貼合層12以及一壓力感測器10s,所述觸控面板14通過貼合層12與壓電式壓力感測器10s貼合,所述電容式三維偵測模組10進一步包括一三維信號處理電路18,所述三維信號處理電路18設置在壓電式壓力感測器10s的下方,其位置不作限定。所述三維信號處理電路18電性連接於觸控面板14與壓電式壓力感測器10s。 Referring to FIG. 1 , the capacitive three-dimensional detecting module 10 of the first embodiment of the present invention includes a top-to-bottom (in the present invention, position words such as up, down, left, right, top, bottom, etc. are only used to define relative positions on a specified view. The non-absolute position includes a touch panel 14 , a bonding layer 12 and a pressure sensor 10 s. The touch panel 14 is bonded to the piezoelectric pressure sensor 10s through the bonding layer 12 . The capacitive three-dimensional detection module 10 further includes a three-dimensional signal processing circuit 18, and the three-dimensional signal processing circuit 18 is disposed below the piezoelectric pressure sensor 10s, and its position is not limited. The three-dimensional signal processing circuit 18 is electrically connected to the touch panel 14 and the piezoelectric pressure sensor 10s.

觸控面板14包括一上基板11與一電容式觸控感測器13,所述電容式觸控感測器13設置於所述上基板11的下表面。上基板11可以認定為電子設備的觸摸蓋板,所謂的蓋板包括一觸控操作面與一組件安裝面,其觸控操作面 用於手指或觸控筆等進行觸控操作,元件安裝面則用於安裝觸控電極元件或顯示模組等。 The touch panel 14 includes an upper substrate 11 and a capacitive touch sensor 13 . The capacitive touch sensor 13 is disposed on a lower surface of the upper substrate 11 . The upper substrate 11 can be regarded as a touch cover of an electronic device. The so-called cover plate includes a touch operation surface and a component mounting surface, and the touch operation surface thereof It is used for touch operation on a finger or a stylus, and the component mounting surface is used to mount a touch electrode element or a display module.

柔性基材層16為柔性材質,較佳地,厚度小於500μm,更佳地,厚度小於200μm。柔性基材層16材質可以是聚合物膜,所述聚合物膜諸如包括聚對苯二甲酸乙二醇酯(PET)、聚萘二甲酸乙二醇酯(PEN)、聚甲基丙烯酸甲酯(PMMA)或聚碳酸酯的膜,薄玻璃片(例如,100μm厚或更薄)或鈉鈣矽玻璃。 The flexible substrate layer 16 is a flexible material, preferably having a thickness of less than 500 μm, and more preferably a thickness of less than 200 μm. The material of the flexible substrate layer 16 may be a polymer film such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polymethyl methacrylate. (PMMA) or a film of polycarbonate, a thin glass sheet (for example, 100 μm thick or thinner) or a soda lime glass.

首先,為清楚敘明觸控面板14實施方式,請參閱第2圖和第3圖,所述電容式觸控感測器13包括多條沿第一方向(X方向)平行等間距排列的第一方向觸控驅動電極131以及多條沿第二方向(Y方向)平行等間距排列的第二方向觸控接收電極132,所述多條相互平行排列的第一方向觸控驅動電極131與多條相互平行排列的第二方向觸控接收電極132正交,在兩者的交疊區域處設置有絕緣塊133,所述絕緣塊133位於第一方向觸控驅動電極131和第二方向觸控接收電極132之間將所述兩者電性隔離。所述第一方向觸控驅動電極131與第二方向觸控接收電極132之間界定有觸控單元(未標號),即相當於上基板11下表面上陣列設置有多個觸控單元。當所述觸控單元偵測到來自上基板11的觸控操作後產生相應的電信號傳輸至三維信號處理電路18。第2圖中僅以4條第一方向觸控驅動電極131與4條第二方向觸控接收電極132為例來進行示意說明,實際上,數量 不作限制。所述第一方向觸控驅動電極131與第二方向觸控接收電極132的設置位置互補。 First, in order to clearly illustrate the implementation of the touch panel 14, please refer to FIGS. 2 and 3, the capacitive touch sensor 13 includes a plurality of parallel rows arranged in the first direction (X direction). a first direction touch driving electrode 131 and a plurality of second direction touch receiving electrodes 132 arranged in parallel in the second direction (Y direction), and the plurality of first direction touch driving electrodes 131 arranged in parallel with each other The second direction touch receiving electrodes 132 are arranged in parallel with each other, and an insulating block 133 is disposed at an overlapping area of the two, the insulating block 133 is located in the first direction touch driving electrode 131 and the second direction touch The two are electrically isolated between the receiving electrodes 132. A touch unit (not labeled) is defined between the first direction touch driving electrode 131 and the second direction touch receiving electrode 132, that is, a plurality of touch units are arranged on the lower surface of the upper substrate 11. When the touch unit detects a touch operation from the upper substrate 11 , a corresponding electrical signal is generated and transmitted to the three-dimensional signal processing circuit 18 . In FIG. 2, only four first-direction touch driving electrodes 131 and four second-direction touch receiving electrodes 132 are taken as an example for illustration, in fact, the number No restrictions. The first direction touch driving electrode 131 is complementary to the second position touch receiving electrode 132.

其次,為清楚敘明壓電式壓力感測器10s實施方式,請參閱第1圖和第4圖,壓電式壓力感測器10s從上至下依次包括一第一壓感層15,一柔性基材層16以及一第二壓感層17,所述第一壓感層15以及第二壓感層17設置在柔性基材層16兩側並以柔性基材層16作為承載層。由第4圖可知,第一壓感層15上設置有至少一個第一壓感單元151,第二壓感層17上設置有至少一個第二壓感單元171,第一壓感單元151及第二壓感單元171形狀可以是矩形、多邊形、圓形、梯形等不規則形狀中的一種或多種。位於所述柔性基材層16上下表面的第一壓感層15與第二壓感層17形狀尺寸一致,第二壓感層17上設置有第二壓感單元171,多個第一壓感單元151與多個第二壓感單元171之間位置一一對應。觸控操作者在上基板11的上表面進行觸控操作時,該觸控點處對應的至少一第一壓感單元151,或至少一第一壓感單元151與至少一第二壓感單元171將同時受到壓力。 Next, in order to clearly illustrate the embodiment of the piezoelectric pressure sensor 10s, referring to FIG. 1 and FIG. 4, the piezoelectric pressure sensor 10s includes a first pressure sensing layer 15 in order from top to bottom. The flexible substrate layer 16 and a second pressure-sensitive layer 17 are disposed on both sides of the flexible substrate layer 16 and have a flexible substrate layer 16 as a carrier layer. As shown in FIG. 4, at least one first pressure sensitive unit 151 is disposed on the first pressure sensitive layer 15, and at least one second pressure sensitive unit 171 is disposed on the second pressure sensitive layer 17, and the first pressure sensitive unit 151 and the first The shape of the second pressure sensing unit 171 may be one or more of irregular shapes such as a rectangle, a polygon, a circle, and a trapezoid. The first pressure sensitive layer 15 on the upper and lower surfaces of the flexible substrate layer 16 has the same shape and shape as the second pressure sensitive layer 17. The second pressure sensitive layer 17 is provided with a second pressure sensing unit 171, and a plurality of first pressure sensors. The unit 151 has a one-to-one correspondence with the positions of the plurality of second pressure sensing units 171. When the touch operator performs a touch operation on the upper surface of the upper substrate 11, the at least one first pressure sensing unit 151 or the at least one first pressure sensing unit 151 and the at least one second pressure sensing unit are corresponding to the touch point. 171 will be under pressure at the same time.

所述第一壓感單元151及/或第二壓感單元171是由觸控操作所產生的壓力而引起的變形、偏轉或剪切等應變性反應從而導致至少一個電性能發生改變的壓感材料,本發明中採用為壓電材料,第一壓感單元151及/或第二壓感單元171回應於按壓動作會產生電容量的變化。於其他實施例中第一壓感單元151及/或第二壓感單元171材料可以是鈦酸鋇或鋯鈦酸鉛(PZT)及壓電陶瓷等中的一種或多種, 還可以是分散在絕緣、透明、可變形的基質中的銦錫氧化物(ITO)、摻銻的氧化錫(ATO)、摻鋁的氧化鋅(AZO)或其他透明導電氧化物的粒子。 The first pressure sensing unit 151 and/or the second pressure sensing unit 171 is a pressure reaction caused by deformation, deflection or shear caused by pressure generated by a touch operation, thereby causing at least one pressure change in which electrical properties are changed. As the material, in the present invention, the piezoelectric material is used, and the first pressure sensitive unit 151 and/or the second pressure sensitive unit 171 generate a change in capacitance in response to the pressing action. In other embodiments, the first pressure sensitive unit 151 and/or the second pressure sensitive unit 171 may be one or more of barium titanate or lead zirconate titanate (PZT) and piezoelectric ceramics. It may also be particles of indium tin oxide (ITO), antimony-doped tin oxide (ATO), aluminum-doped zinc oxide (AZO) or other transparent conductive oxide dispersed in an insulating, transparent, deformable matrix.

請參閱第5圖,第5圖為本發明常用的三維信號處理電路18的模組結構示意圖,但並不以此模組為限。第5圖中指出三維信號處理電路18包括一電容式三維控制器180,該電容式三維控制器180集成在一晶片上,壓電式壓力感測器10s和電容式觸控感測器13均電性連接於電容式三維控制器180。所述電容式三維控制器180進一步包括一公共驅動器181,一驅動脈衝處理電路187以及一電容式三維處理器189,所述驅動脈衝處理電路187進一步包括一選擇電路183以及一脈衝重整電路185,所述公共驅動器181所提供的驅動信號直接輸出至電容式觸控感測器13為其提供觸控掃描脈衝,所述驅動脈衝處理電路187將所述的公共驅動器181輸出的驅動信號進行位移、脈寬縮窄、分頻等處理後為壓電式壓力感測器10s提供壓力掃描脈衝。所述驅動脈衝處理電路187之內的局部電路亦可隨偵測方法的改動而變化不以此為限。用戶在上基板11表面進行操作時,壓電式壓力感測器10s以及電容式觸控感測器13會分別偵測到壓力信號與觸控信號,所述壓力信號與觸控信號通過線路傳導至電容式三維處理器189,所述電容式三維處理器189對壓力信號與觸控信號進行處理。 Please refer to FIG. 5. FIG. 5 is a schematic diagram showing the module structure of the commonly used three-dimensional signal processing circuit 18 of the present invention, but is not limited to this module. It is noted in FIG. 5 that the three-dimensional signal processing circuit 18 includes a capacitive three-dimensional controller 180 integrated on a wafer, both the piezoelectric pressure sensor 10s and the capacitive touch sensor 13 Electrically connected to the capacitive three-dimensional controller 180. The capacitive three-dimensional controller 180 further includes a common driver 181, a drive pulse processing circuit 187, and a capacitive three-dimensional processor 189. The drive pulse processing circuit 187 further includes a selection circuit 183 and a pulse reforming circuit 185. The driving signal provided by the common driver 181 is directly outputted to the capacitive touch sensor 13 to provide a touch scan pulse, and the driving pulse processing circuit 187 shifts the driving signal output by the common driver 181 The pulse width is narrowed, the frequency division is processed, and the like, and the piezoelectric pressure sensor 10s is provided with a pressure scan pulse. The partial circuit within the driving pulse processing circuit 187 may also vary with the detection method, and is not limited thereto. When the user operates on the surface of the upper substrate 11, the piezoelectric pressure sensor 10s and the capacitive touch sensor 13 respectively detect a pressure signal and a touch signal, and the pressure signal and the touch signal are transmitted through the line. To the capacitive three-dimensional processor 189, the capacitive three-dimensional processor 189 processes the pressure signal and the touch signal.

選擇電路183從公共驅動器181中選擇全部或部分驅動信號傳輸至脈衝重整電路185,驅動脈衝處理電路187也可以僅設置脈衝重整電路185/或選擇電路183。 The selection circuit 183 selects all or part of the drive signals from the common driver 181 to be transmitted to the pulse reformer circuit 185, and the drive pulse processing circuit 187 may also only provide the pulse reformer circuit 185/or the selection circuit 183.

對應的電容式三維偵測模組10的偵測方法如下:觸控單元與壓感單元(第一壓感單元151及第二壓感單元171)之觸控信號與壓力信號的偵測方式有多種,在本發明中,採用互電容方式偵測觸控信號,採用自電容的方式偵測壓力信號。 The detection method of the corresponding capacitive 3D detection module 10 is as follows: the touch signal and the pressure signal are detected by the touch unit and the pressure sensing unit (the first pressure sensing unit 151 and the second pressure sensing unit 171). In the present invention, the mutual touch mode is used to detect the touch signal, and the self-capacitance method is used to detect the pressure signal.

所述互電容方式偵測觸控信號具體為:所述觸控單元由第一方向觸控驅動電極131與第二方向觸控接收電極132所界定,其具有電容效應,即第一方向觸控驅動電極131與第二方向觸控接收電極132之間形成電容,第一方向觸控驅動電極131相當於電容的上極板,所述第二方向觸控接收電極132相當於電容的下極板,當用戶手指或觸控筆等在上基板11上進行觸控操作時,影響了觸控點之觸控單元上下極板之間的耦合,從而改變了這兩個極板之間的電容量。所述電容量的改變形成觸控信號傳遞至電容式三維處理器189,所述電容式三維處理器189進行信號處理後確認觸控點的位置。偵測上下極板之間互電容大小時,第一方向觸控驅動電極131接收來自公共驅動器181的觸控掃描脈衝,即第一方向觸控驅動電極131發出激勵信號,第二方向觸控接收電極132接收觸控信號並通過線路將觸控信號傳導至電容式三維處理器189。 The mutual-capacitance mode detecting touch signal is specifically defined by: the touch control unit is defined by the first direction touch driving electrode 131 and the second direction touch receiving electrode 132, and has a capacitive effect, that is, the first direction touch A capacitance is formed between the driving electrode 131 and the second direction touch receiving electrode 132. The first direction touch driving electrode 131 is equivalent to the upper plate of the capacitor, and the second direction touch receiving electrode 132 is equivalent to the lower plate of the capacitor. When a user's finger or a stylus pen performs a touch operation on the upper substrate 11, the coupling between the upper and lower plates of the touch unit of the touch point is affected, thereby changing the capacitance between the two plates. . The change in the capacitance forms a touch signal to the capacitive three-dimensional processor 189, and the capacitive three-dimensional processor 189 performs signal processing to confirm the position of the touch point. When the mutual capacitance between the upper and lower plates is detected, the first direction touch driving electrode 131 receives the touch scan pulse from the common driver 181, that is, the first direction touch driving electrode 131 emits an excitation signal, and the second direction touch receiving The electrode 132 receives the touch signal and conducts the touch signal to the capacitive three-dimensional processor 189 through the line.

所述自電容方式偵測壓力信號具體為:每一壓感單元至少包括一壓力驅動電極與一壓力接收電極(均圖未示,即該二電極建構每一壓感單元為完整回路的輸入電極與輸出電極),所述壓力驅動電極接收來自電容式三維控制器180的壓力掃描脈衝,即壓力驅動電極發出激勵信號,壓力接收電極接收壓力信號並通過線路將壓力信號傳導至電容式三維處理器189。 The self-capacitance mode detecting the pressure signal is specifically: each pressure sensing unit includes at least one pressure driving electrode and one pressure receiving electrode (the same figure is not shown, that is, the two electrodes construct each input pressure unit as a complete circuit input electrode) And the output electrode), the pressure driving electrode receives a pressure scan pulse from the capacitive three-dimensional controller 180, that is, the pressure driving electrode emits an excitation signal, and the pressure receiving electrode receives the pressure signal and conducts the pressure signal to the capacitive three-dimensional processor through the line 189.

請參閱第6A圖,It_1與It_2分別代表二不同的觸控單元之觸控信號偵測時序,所述Ifa_1與Ifa_2代表第一壓感層15上二不同的第一壓感單元151之壓力信號偵測時序,Ifb_1與Ifb_2代表第二壓感層17上二不同的第二壓感單元171之壓力信號偵測時序,所述二不同的第一壓感單元151與二不同的第二壓感單元171位置對應。 Referring to FIG. 6A, It_1 and It_2 respectively represent touch signal detection timings of two different touch units, and the Ifa_1 and Ifa_2 represent pressure signals of two different first pressure sensing units 151 on the first pressure sensitive layer 15. The detection timing, Ifb_1 and Ifb_2 represent the pressure signal detection timing of the two different second pressure sensing units 171 on the second pressure sensing layer 17, the two different first pressure sensing units 151 and the second different pressure sensing The unit 171 corresponds to the position.

從第6A圖上可以看出:觸控點位置的偵測與壓力值大小的偵測分開進行,且所述電容式三維控制器180是先進行觸控點位置的偵測確定觸控點的位置之後,再偵測對應的觸控點位置處對應的壓感單元。觸控單元之觸控信號偵測以及壓力單元之壓力信號偵測分時序進行,即兩者的觸控信號偵測與壓力信號偵測在時序上分開進行不存在時間段重疊。第一壓感單元151與第二壓感單元171之壓力信號的偵測同時進行。本發明中僅以特定的幾個觸控單元與壓感單元為例來進行偵測時序的說明,實際上觸控單元與壓感單元數量不作限定,圖示中信號的幅值均一致,其僅為了方便圖示示意說明而並不用來起限定作用。 It can be seen from FIG. 6A that the detection of the position of the touch point is performed separately from the detection of the magnitude of the pressure value, and the capacitive three-dimensional controller 180 first detects the position of the touch point and determines the touch point. After the position, the corresponding pressure sensing unit at the corresponding touch point position is detected. The touch signal detection of the touch unit and the pressure signal detection of the pressure unit are performed in time series, that is, the touch signal detection and the pressure signal detection of the two are separated in time series without overlapping time periods. The first pressure sensing unit 151 and the detection of the pressure signal of the second pressure sensing unit 171 are simultaneously performed. In the present invention, only a specific touch unit and a pressure sensitive unit are taken as an example for the detection timing. In fact, the number of the touch unit and the pressure sensitive unit are not limited, and the amplitudes of the signals in the figure are the same. It is for convenience of illustration only and is not intended to be limiting.

請參閱第6B圖,作為觸控單元與壓感單元偵測時序的變形實施例一:觸控單元之觸控信號偵測以及壓力單元之壓力信號偵測仍然是分時序進行,但電容式三維控制器180並沒有先確定好觸控位置之後再偵測按壓力值。壓力偵測與觸控點的偵測相互獨立分時序進行。 Please refer to FIG. 6B as a variant of the touch unit and the pressure sensing unit detecting timing. The touch signal detection of the touch unit and the pressure signal detection of the pressure unit are still performed in time series, but the capacitive three-dimensional The controller 180 does not determine the touch position after determining the touch position. The pressure detection and the detection of the touch points are performed independently of each other in time series.

請參閱第6C圖,作為觸控單元與壓感單元偵測時序的變形實施例二:與第6B圖中變形實施例一中的不同之處僅在於壓力信號偵測的週期縮短(脈寬變窄),使相鄰觸控信號與壓力信號的偵測結束點與起始點錯開,即該兩者的電位切換點處(從“0”到“1”或“1”到“0”)相互錯開,避免相互之間的干擾。作為一種變形實施例,壓力信號偵測的週期可以和觸控信號偵測的週期部分重疊,但電位切換點錯位。 Please refer to FIG. 6C as a variant of the touch unit and the pressure sensitive unit detecting timing. The second embodiment is different from the modified example 1 of FIG. 6B only in that the period of the pressure signal detection is shortened (pulse width is changed). Narrow), so that the detection end point of the adjacent touch signal and the pressure signal is shifted from the starting point, that is, the potential switching point of the two (from "0" to "1" or "1" to "0") Staggered from each other to avoid mutual interference. As a variant embodiment, the period of the pressure signal detection may partially overlap with the period of the touch signal detection, but the potential switching point is misaligned.

請參閱第6D圖,作為觸控單元與壓感單元偵測時序的變形實施例三:所述壓力偵測與觸控點的偵測相互獨立同時序進行,觸控位置與按壓力值的偵測未分先後進行,且觸控單元之觸控信號偵測以及壓力單元之壓力信號偵測是同時序進行的,也就是電容式三維控制器180在偵測壓力值的同時也在偵測觸控點位置。 Please refer to FIG. 6D as a variant of the touch unit and the pressure sensing unit detecting timing. The pressure detection and the detection of the touch point are performed independently and simultaneously, and the touch position and the pressing force value are detected. The measurement is performed in sequence, and the touch signal detection of the touch unit and the pressure signal detection of the pressure unit are performed simultaneously, that is, the capacitive three-dimensional controller 180 detects the pressure value while detecting the touch. Control point location.

在發明所有實施例中,所謂同時序即指在觸控信號偵測與壓力信號偵測在一個工作週期(電位為“1”)記憶體在重疊(不包括端點重疊),反之,則為分時序。 In all embodiments of the invention, the so-called simultaneous order means that the touch signal detection and the pressure signal detection overlap in a working cycle (potential is "1") (excluding the end point overlap), and vice versa. Time division.

電容式三維處理器189對壓電式壓力感測器10s之第一壓感層15與第二壓感層17上的壓力信號處理方 式因其材料的選取不同而至少能體現溫度補償及壓力信號疊加兩種有益效果;值得一提,在該溫度補償模式下,所述第一壓感層15上的第一壓感單元151分別與第二壓感層17上所對應的第二壓感單元171作為相互的溫度補償參考對象以消除熱燥訊號所帶來的壓力信號偵測誤差。 The capacitive three-dimensional processor 189 processes the pressure signal on the first pressure sensitive layer 15 and the second pressure sensitive layer 17 of the piezoelectric pressure sensor 10s. The two types of beneficial effects of temperature compensation and pressure signal superposition can be reflected by the selection of materials; it is worth mentioning that in the temperature compensation mode, the first pressure sensing unit 151 on the first pressure sensitive layer 15 respectively The second pressure sensing unit 171 corresponding to the second pressure sensing layer 17 serves as a mutual temperature compensation reference object to eliminate the pressure signal detection error caused by the heat drying signal.

作為一種較佳實施方式,所述第一壓感單元151和第二壓感單元171採用不同的材料製作,具體為所述第一壓感層15為採用正溫度係數的壓電材料製成的正溫度係數壓感層,所述第二壓感層17為採用負溫度係數的壓電材料製成的負溫度係數壓感層,所述正溫度係數壓感層和負溫度係數壓感層在相同環境影響下所產生的雜訊訊號大小相同或近似,但是其極性相反,故,在壓力信號疊加方式下,通過電路設計可使所述第一壓感層15和第二壓感層17的雜訊信號進行了抵消,壓力信號雙倍的增強。採用正溫度係數的壓電材料與負溫度係數的壓電材料的配合不僅可以達到了溫度補償方式所帶來的降噪效果,其也達到了壓力信號疊加方式所帶來的壓力信號增強效果。 As a preferred embodiment, the first pressure sensing unit 151 and the second pressure sensing unit 171 are made of different materials, specifically, the first pressure sensing layer 15 is made of a piezoelectric material with a positive temperature coefficient. a positive temperature coefficient pressure sensitive layer, the second pressure sensitive layer 17 is a negative temperature coefficient pressure sensitive layer made of a piezoelectric material having a negative temperature coefficient, and the positive temperature coefficient pressure sensitive layer and the negative temperature coefficient pressure sensitive layer are The noise signals generated under the same environmental influence are the same or similar in size, but their polarities are opposite. Therefore, in the pressure signal superposition mode, the first pressure sensitive layer 15 and the second pressure sensitive layer 17 can be made by circuit design. The noise signal is cancelled and the pressure signal is doubled. The combination of the piezoelectric material with positive temperature coefficient and the piezoelectric material with negative temperature coefficient can not only achieve the noise reduction effect brought by the temperature compensation method, but also achieve the pressure signal enhancement effect brought by the pressure signal superposition method.

本發明所提供的電容式三維偵測模組10可用於多點觸控。 The capacitive 3D detection module 10 provided by the present invention can be used for multi-touch.

與現有技術相比,本發明揭示的電容式三維偵測模組10以及其偵測方法至少具有如下優點: Compared with the prior art, the capacitive three-dimensional detecting module 10 and the detecting method thereof have at least the following advantages:

1.電容式三維偵測模組10在觸控點位置以及按壓力值的偵測中,可以先偵測觸控點的位置,然後再偵測觸控點位置處所對應的壓感單元所受到的按壓力值,因此,在 按壓力值的偵測過程中,電容式三維控制器180可選擇性地無需對壓感單元全部進行一次偵測,提高了偵測效率,降低了硬體損耗。 1. The capacitive 3D detection module 10 can detect the position of the touch point in the detection of the position of the touch point and the pressure value, and then detect the pressure sensitive unit corresponding to the position of the touch point. Pressure value, therefore, at During the detection of the pressure value, the capacitive three-dimensional controller 180 can selectively detect all of the pressure sensing unit without any need, thereby improving the detection efficiency and reducing the hardware loss.

2.觸控點位置的偵測與按壓力值的偵測也可以相互獨立分時序或同時序進行。由於觸控信號和壓力信號因觸控操作所引起的信號類型變化一致。故所述兩者之間容易產生信號干擾,壓力偵測與觸控點的偵測分時序進行時,由於兩者偵測時序相互錯開,故相互之間的干擾可以降低以避免信號誤判。更進一步,所述壓力信號與觸控信號偵測的電位切換點錯開,其可以進一步降低信號之間的相互干擾。在同時序時,在觸控信號偵測的起點處(電位切點)壓力信號的偵測還沒有開始或者已經結束,即使產生了干擾信號,它們之間也避開了相互干擾的可能,而在壓力信號偵測起始點以及結束點(電位切換點)處,觸控信號的偵測處於穩定期,故,兩者之間的干擾也不大。 2. The detection of the touch point position and the detection of the pressing force value can also be performed independently of each other in time series or simultaneously. Since the touch signal and the pressure signal are consistent in the type of signal caused by the touch operation. Therefore, signal interference is easily generated between the two. When the pressure detection and the detection of the touch point are performed in sequence, since the detection timings of the two are staggered, the mutual interference can be reduced to avoid signal misjudgment. Further, the pressure signal is offset from the potential switching point detected by the touch signal, which can further reduce mutual interference between the signals. At the same time, the detection of the pressure signal at the beginning of the touch signal detection (potential cut point) has not started or has ended. Even if an interference signal is generated, they avoid the possibility of mutual interference. At the start of the pressure signal detection and the end point (potential switching point), the detection of the touch signal is in a stable period, so the interference between the two is not large.

3.所述壓電式壓力感測器10s至少包括一柔性基材層16,所述柔性基材層16採用柔性材質製作,其能夠靈敏感應於觸控點所產生的壓力而發生形變。在所述柔性基材層16的兩側設置有第一壓感層15和第二壓感層17,分別位於第一壓感層15和第二壓感層17上的第一壓感單元151和第二壓感單元171尺寸位置一一對應,在第一壓感單元151和第二壓感單元171互為溫度補償的參考對象時,由於其尺寸位置的對應,其各自所受的如溫度以及其他干擾所帶來的雜訊訊號一致,經過運算電路等處理後可以較好的消除 壓力信號偵測過程中所產生的其他雜訊訊號。提升壓力偵測精度;此外觸控點所對應的第一壓感單元151和第二壓感單元171也進行信號疊加,電容式三維偵測模組10檢測到更強更穩定的壓力信號。第一壓感層15和第二壓感層17的壓力信號處理既可以設置為溫度補償方式,又可以兼顧為壓力信號疊加方式,尤其是在第一壓感層15為採用正溫度係數的壓感材料製成所述第二壓感層17為採用負溫度係數的壓感材料製成時,其即可達到溫度補償又可以達到壓力信號疊加的效果。整體具有設計靈活,結構合理等優點。 3. The piezoelectric pressure sensor 10s includes at least one flexible substrate layer 16 made of a flexible material that is sensitive to deformation under pressure generated by the touch point. A first pressure sensitive layer 15 and a second pressure sensitive layer 17 are disposed on both sides of the flexible substrate layer 16, and the first pressure sensing unit 151 is located on the first pressure sensitive layer 15 and the second pressure sensitive layer 17, respectively. Corresponding to the size position of the second pressure sensing unit 171, when the first pressure sensing unit 151 and the second pressure sensing unit 171 are temperature-compensated reference objects, respectively, due to the corresponding position of the size, their respective temperatures, such as temperature And the noise signals brought by other interferences are consistent, and can be better eliminated after being processed by an arithmetic circuit or the like. Other noise signals generated during the pressure signal detection process. The pressure detection accuracy is improved. In addition, the first pressure sensing unit 151 and the second pressure sensing unit 171 corresponding to the touch point are also superimposed, and the capacitive three-dimensional detecting module 10 detects a stronger and more stable pressure signal. The pressure signal processing of the first pressure sensitive layer 15 and the second pressure sensitive layer 17 can be set to both the temperature compensation mode and the pressure signal superposition mode, especially when the first pressure sensitive layer 15 is a positive temperature coefficient. When the second pressure sensitive layer 17 is made of a pressure sensitive material having a negative temperature coefficient, the temperature compensation can be achieved and the pressure signal superimposition effect can be achieved. The overall design has the advantages of flexible design and reasonable structure.

4.觸控單元與壓感單元的通過同一公共驅動器181來驅動,其節約了硬體成本,簡化了電路設計,提升了電容式三維偵測模組10集成度,且從一定程度上降低了電容式三維偵測模組10的厚度與重量。 4. The touch unit and the pressure sensing unit are driven by the same common driver 181, which saves the hardware cost, simplifies the circuit design, improves the integration degree of the capacitive three-dimensional detection module 10, and reduces the degree to a certain extent. The thickness and weight of the capacitive three-dimensional detection module 10.

請參閱第7圖,本發明第二實施例電容式三維偵測模組20與第一實施例電容式三維偵測模組10不同之處僅在於:所述電容式三維偵測模組20的第一方向觸控驅動電極與第二方向觸控接收電極(均未圖示)設置在不同的承載層上,另所述壓電式壓力感測器20s並不是外掛式定位於觸控面板(未標號),而是內嵌於觸控面板內。具體的,電容式三維偵測模組20包括一電容式觸控感測器23,所述電容式觸控感測器23至少由第一觸控電極層231(包括多條等間距平行設置的第一方向觸控驅動電極)和一第二觸控電極層232(包括多條等間距平行設置的第二方向觸控接收電極)所界定。所述觸控感測器23內嵌有一壓電式壓力感測器 20s,至此,電容式三維偵測模組20從上至下包括上基板21、貼合層22,第一觸控電極層231,第一絕緣層24,壓電式壓力感測器20s,第二絕緣層24’,第二觸控電極層232以及一信號處理電路28。第一絕緣層24與第二絕緣層24’(合稱絕緣層)分別作為第一觸控電極層231與第二觸控電極層232的承載層,並在電容式觸控感測器23與壓電式壓力感測器20s之間起絕緣作用。所述第一方向觸控驅動電極與第二方向觸控接收電極之間界定有觸控單元。 Referring to FIG. 7 , the capacitive three-dimensional detection module 20 of the second embodiment of the present invention is different from the capacitive three-dimensional detection module 10 of the first embodiment only in that: the capacitive three-dimensional detection module 20 The first direction touch driving electrode and the second direction touch receiving electrode (neither shown) are disposed on different bearing layers, and the piezoelectric pressure sensor 20s is not externally positioned on the touch panel ( Not labeled), but embedded in the touch panel. Specifically, the capacitive 3D detection module 20 includes a capacitive touch sensor 23, and the capacitive touch sensor 23 is at least configured by a first touch electrode layer 231 (including a plurality of parallel pitches) The first direction touch driving electrode is defined by a second touch electrode layer 232 (including a plurality of second direction touch receiving electrodes arranged at equal intervals). A piezoelectric pressure sensor is embedded in the touch sensor 23 20s, at this point, the capacitive three-dimensional detection module 20 includes an upper substrate 21, a bonding layer 22, a first touch electrode layer 231, a first insulating layer 24, and a piezoelectric pressure sensor 20s, from top to bottom. The second insulating layer 24', the second touch electrode layer 232 and a signal processing circuit 28. The first insulating layer 24 and the second insulating layer 24 ′ (collectively referred to as insulating layers) serve as bearing layers of the first touch electrode layer 231 and the second touch electrode layer 232 , respectively, and are in the capacitive touch sensor 23 . The piezoelectric pressure sensor 20s is insulated from each other. A touch unit is defined between the first direction touch driving electrode and the second direction touch receiving electrode.

所述壓電式壓力感測器20s包括一第一壓感層25,一柔性基材層26以及一第二壓感層27,所述第一壓感層25以及第二壓感層27設置在柔性基材層26兩側並以柔性基材層26作為承載層。第一壓感層25和第二壓感層27上分別設置有至少一壓感單元。 The piezoelectric pressure sensor 20s includes a first pressure sensitive layer 25, a flexible substrate layer 26 and a second pressure sensitive layer 27, and the first pressure sensitive layer 25 and the second pressure sensitive layer 27 are disposed. The flexible substrate layer 26 is used as a carrier layer on both sides of the flexible substrate layer 26. At least one pressure sensing unit is disposed on each of the first pressure sensitive layer 25 and the second pressure sensitive layer 27.

本實施例中三維信號處理電路28結構及運作原理,以及壓感單元與觸控單元之間偵測方法與原理保持一致,即觸控感測器23採用互電容方式偵測觸控點位置,壓電式壓力感測器20s採用自電容方式偵測按壓力值。 In this embodiment, the structure and operation principle of the three-dimensional signal processing circuit 28, and the detection method and principle between the pressure sensing unit and the touch unit are consistent, that is, the touch sensor 23 detects the position of the touch point by using mutual capacitance. The piezoelectric pressure sensor 20s uses a self-capacitance method to detect the pressing force value.

請參閱第8圖,本發明第三實施例電容式三維偵測模組40與第二實施例電容式三維偵測模組20不同之處僅在於:所述電容式三維偵測模組40未設置實施例二中的絕緣層,電容式三維偵測模組40從上至下依次包括一上基板41,一貼合層42,一電容式三維感測器40d以及一三維信號處理電路48,所述電容式三維感測器40d包括一壓電式壓力感測器40s以及一由第一觸控電極層431與第二觸控電極層 432所界定的電容式觸控感測器(未標號),壓電式壓力感測器40s包括設置在柔性基材層46兩側的一第一壓感層45與一第二壓感層47,其內嵌於電容式觸控感測器內。所述第一壓感層45與第二壓感層47分別與第一觸控電極層431以及第二觸控電極層432緊密貼合設置,第一壓感層45與第二壓感層47上設置有至少一壓感單元。所述第一觸控電極層431以及第二觸控電極層432上分別設置有多條等間距平行設置的第一方向觸控驅動電極與第二方向觸控接收電極(圖未示),第一方向觸控驅動電極與第二方向觸控接收電極之間界定有觸控單元。 Referring to FIG. 8 , the capacitive 3D detection module 40 of the third embodiment of the present invention is different from the capacitive 3D detection module 20 of the second embodiment only in that the capacitive 3D detection module 40 is not The insulating layer is disposed in the second embodiment. The capacitive three-dimensional detecting module 40 includes an upper substrate 41, a bonding layer 42, a capacitive three-dimensional sensor 40d and a three-dimensional signal processing circuit 48 in order from top to bottom. The capacitive three-dimensional sensor 40d includes a piezoelectric pressure sensor 40s and a first touch electrode layer 431 and a second touch electrode layer. The capacitive touch sensor (not labeled) defined by 432, the piezoelectric pressure sensor 40s includes a first pressure sensitive layer 45 and a second pressure sensitive layer 47 disposed on opposite sides of the flexible substrate layer 46. It is embedded in the capacitive touch sensor. The first pressure sensitive layer 45 and the second pressure sensitive layer 47 are respectively closely disposed with the first touch electrode layer 431 and the second touch electrode layer 432 , and the first pressure sensitive layer 45 and the second pressure sensitive layer 47 are respectively disposed. At least one pressure sensing unit is disposed thereon. The first touch electrode layer 431 and the second touch electrode layer 432 are respectively provided with a plurality of first-direction touch driving electrodes and second-direction touch receiving electrodes arranged in parallel at equal intervals (not shown). A touch unit is defined between the one-direction touch driving electrode and the second direction touch receiving electrode.

在本方案中,未經圖案化處理的第一壓感層45與一第二壓感層47利用第一觸控電極層431以及第二觸控電極層432充當了導出壓力信號的導電電極(充當壓力信號導出層,即建構每一壓感單元為完整回路的輸入電極與輸出電極),第一壓感層45與一第二壓感層47通過與其緊密貼合設置的第一觸控電極層431以及第二觸控電極層432將壓力信號傳導出去。這樣電容式三維偵測模組40既可以偵測觸控點位置,也可以傳導壓力信號的電極,解決了部分壓電材料導電性不佳所引起的壓力信號偵測困難的問題。 In the present embodiment, the first pressure sensing layer 45 and the second pressure sensing layer 47 that are not patterned serve as the conductive electrode for deriving the pressure signal by using the first touch electrode layer 431 and the second touch electrode layer 432 ( Acting as a pressure signal derivation layer, that is, constructing an input electrode and an output electrode of each of the pressure sensing units as a complete circuit, and the first pressure sensing layer 45 and a second pressure sensing layer 47 are disposed through the first touch electrode The layer 431 and the second touch electrode layer 432 conduct the pressure signal. The capacitive three-dimensional detecting module 40 can detect the position of the touch point and the electrode of the pressure signal, and solves the problem that the pressure signal detection caused by the poor conductivity of the piezoelectric material is difficult.

請配合第8圖再參閱第9圖,所述三維信號處理器48包括一電容式三維控制器480,該電容式三維控制器480集成在一晶片上,電容式三維感測器40d通過同一線路連接於電容式三維控制器480之電容式三維處理器489。所述電容式三維控制器480進一步包括一公共驅動器481,一 驅動脈衝處理電路487(包括一選擇電路483以及一脈衝重整電路485),所述選擇電路483連接於公共驅動器481並可以對公共驅動器481所輸出的驅動信號進行全部或部分的選取後輸出至脈衝重整電路485,若有變形實施上的設計需要選擇電路483亦可將部分來自公共驅動器481提供的訊號直接傳送至電容式三維感測器40d,所述脈衝重整電路485對接收的信號可以進行位移,分頻,脈寬縮窄等處理後輸出觸控掃描脈衝或壓力掃描脈衝提供給三維感測器40d。 Referring to FIG. 8 and FIG. 9, the three-dimensional signal processor 48 includes a capacitive three-dimensional controller 480 integrated on a wafer, and the capacitive three-dimensional sensor 40d passes through the same line. A capacitive three-dimensional processor 489 is coupled to the capacitive three-dimensional controller 480. The capacitive three-dimensional controller 480 further includes a common driver 481, one The driving pulse processing circuit 487 (including a selection circuit 483 and a pulse reforming circuit 485), the selection circuit 483 is connected to the common driver 481 and can select all or part of the driving signal outputted by the common driver 481 and output to The pulse reforming circuit 485 can also directly transmit a signal from the common driver 481 to the capacitive three-dimensional sensor 40d if the design of the modified implementation requires the selection circuit 483. The pulse reforming circuit 485 pairs the received signal. The touch scan pulse or the pressure scan pulse may be output to the three-dimensional sensor 40d after the processing such as displacement, frequency division, and pulse width narrowing.

請參閱第10圖,It1和It2分別代表二不同的觸控單元之觸控信號偵測時序,所述Ifa_1與Ifa_2代表第一壓感層45上二不同的壓感單元之壓力信號偵測時序,Ifb_1與Ifb_2代表第二壓感層47上二不同的壓感單元之壓力信號偵測時序,位於第一壓感層45上二不同的壓感單元與位於第二壓感層47上二不同的壓感單元位置對應。由於第一壓感層45與一第二壓感層47需要通過與其緊密貼合設置的第一觸控電極層431以及第二觸控電極層432(充當壓力信號導出層)將壓力信號傳導出去,因此,觸控點位置的偵測與壓力值大小的偵測分開進行,且所述電容式三維控制器480是先進行觸控點位置的偵測確定觸控點的位置之後,再偵測對應的觸控點位置處對應的壓感單元。 Referring to FIG. 10, It1 and It2 respectively represent touch signal detection timings of two different touch units, and the Ifa_1 and Ifa_2 represent pressure signal detection timings of two different pressure sensing units on the first pressure sensing layer 45. , Ifb_1 and Ifb_2 represent pressure signal detection timings of two different pressure sensing units on the second pressure sensitive layer 47. Two different pressure sensing units on the first pressure sensitive layer 45 are different from those on the second pressure sensitive layer 47. The position of the pressure sensitive unit corresponds. The first pressure sensing layer 45 and the second pressure sensing layer 47 need to conduct the pressure signal through the first touch electrode layer 431 and the second touch electrode layer 432 (acting as a pressure signal deriving layer) disposed closely to each other. Therefore, the detection of the position of the touch point is performed separately from the detection of the magnitude of the pressure value, and the capacitive three-dimensional controller 480 first detects the position of the touch point to determine the position of the touch point, and then detects the position of the touch point. The corresponding pressure sensing unit at the corresponding touch point position.

請參閱第11圖,作為一種變形實施例,所述第一壓感層45和第二壓感層47也可以進行圖案化處理且所述圖案分別與其緊密貼合的第一觸控電極層431和第二觸控電極層432的圖案相同或相對應。 Referring to FIG. 11 , as a modified embodiment, the first pressure sensitive layer 45 and the second pressure sensitive layer 47 may also be patterned and the first touch electrode layer 431 is closely adhered to the pattern. The pattern of the second touch electrode layer 432 is the same or corresponds to.

本實施例中第一觸控電極層431和第二觸控電極層432較佳地使用金屬網格製作,以第一觸控電極層431採用金屬網格製作為例來說,第一觸控電極層431上陣列有多條第一方向觸控驅動電極4311(第12圖實線部分),如第12圖所示。 In the embodiment, the first touch electrode layer 431 and the second touch electrode layer 432 are preferably fabricated using a metal mesh. The first touch electrode layer 431 is formed by using a metal mesh. A plurality of first-direction touch driving electrodes 4311 (solid line portion in FIG. 12) are arrayed on the electrode layer 431 as shown in FIG.

與現有技術相比,第一壓感層45與一第二壓感層47需要通過與其緊密貼合設置的第一觸控電極層431以及第二觸控電極層432將壓力信號傳導出去,是以於此較佳實施例中第一壓感層45與一第二壓感層47則無需設置壓力驅動電極與壓力接收電極(即觸控單元與壓感單元電性接觸,故觸控單元與壓感單元共用相同導電線路電性連接至電容式三維處理器489),這樣可以極大的減少線路的設置。也簡化了製作工藝。第一觸控電極層431和第二觸控電極層432選用金屬網格製作,其具有非常好的導電性,故,其能夠較好地將壓力信號可靠導出。 Compared with the prior art, the first pressure sensing layer 45 and the second pressure sensing layer 47 need to transmit the pressure signal through the first touch electrode layer 431 and the second touch electrode layer 432 disposed in close contact with each other. In the preferred embodiment, the first pressure sensing layer 45 and the second pressure sensing layer 47 do not need to be provided with a pressure driving electrode and a pressure receiving electrode (ie, the touch unit and the pressure sensing unit are in electrical contact, so the touch unit and the touch unit The pressure sensing unit shares the same conductive line electrically connected to the capacitive three-dimensional processor 489), which can greatly reduce the line setting. It also simplifies the production process. The first touch electrode layer 431 and the second touch electrode layer 432 are made of a metal mesh, which has very good conductivity, so that the pressure signal can be reliably derived.

請參閱第13圖,本發明第四實施例提供一種電容式三維偵測模組的偵測方法,所述電容式三維偵測模組可以是第1圖至第12圖所揭示的實施例任一種電容式三維偵測模組10(本實施例中所提及的機械元器件的標號請參照實施例一),所述電容式三維偵測模組包括至少一電容式觸控感測器13與一壓電式壓力感測器10s,以及一集成在一晶片上的電容式三維控制器180。 Referring to FIG. 13 , a fourth embodiment of the present invention provides a method for detecting a capacitive three-dimensional detection module. The capacitive three-dimensional detection module can be any of the embodiments disclosed in FIGS. 1 to 12 . A capacitive three-dimensional detection module 10 (refer to the first embodiment of the mechanical components mentioned in the embodiment), the capacitive three-dimensional detection module includes at least one capacitive touch sensor 13 And a piezoelectric pressure sensor 10s, and a capacitive three-dimensional controller 180 integrated on a wafer.

電容式三維偵測模組的偵測方法包括如下步驟: The method for detecting a capacitive 3D detection module includes the following steps:

S0:開始; S0: start;

S1:電容式觸控感測器13采互電容方式對所述多個觸控單元進行偵測觸控點位置;在所述觸控點位置確定後,進一步包括步驟: S1: The capacitive touch sensor 13 detects the touch point position of the plurality of touch units by using a mutual capacitance mode; after the position of the touch point is determined, the method further includes the following steps:

S2:壓電式壓力感測器10s采自電容方式對所述至少一壓感單元進行壓力信號的偵測以確定按壓力值大小;所述壓電式壓力感測器10s偵測觸控點位置處所對應的壓感單元;所述觸控信號的偵測週期的起始點和結束點均與所述壓力信號偵測週期的起始點和結束點錯位。 S2: The piezoelectric pressure sensor 10s adopts a capacitive method to detect a pressure signal of the at least one pressure sensing unit to determine a pressing force value; and the piezoelectric pressure sensor 10s detects the touch point. The pressure sensing unit corresponding to the position; the starting point and the ending point of the detecting period of the touch signal are both offset from the starting point and the ending point of the pressure signal detecting period.

S3:電容式三維偵測模組10回應(亦即響應的動作);電容式三維偵測模組10在確定好觸控點位置以及按壓力值後作出對應的回應動作,如顯示介面的跳轉,滑動等。 S3: The capacitive 3D detection module 10 responds (ie, responds to the action); the capacitive 3D detection module 10 responds to the position of the touch point and presses the pressure value, such as a jump of the display interface. , sliding, etc.

S4:結束。 S4: End.

所述電容式觸控感測器13所產生的觸控信號以及所述壓電式壓力感測器10s所產生的壓力信號由所述電容式三維控制器180進行運算處理。 The touch signal generated by the capacitive touch sensor 13 and the pressure signal generated by the piezoelectric pressure sensor 10s are processed by the capacitive three-dimensional controller 180.

較佳地,在步驟S2中,偵測觸控點位置處所對應的壓感單元包括至少二壓感單元,所述至少二壓感單元分別位於同一柔性基材層的兩側。 Preferably, in step S2, the pressure sensing unit corresponding to the position of the touch point is detected to include at least two pressure sensing units, and the at least two pressure sensing units are respectively located on two sides of the same flexible substrate layer.

請參閱第14圖,本發明第五實施例提供一種電容式三維偵測模組的偵測方法,所述電容式三維偵測模組可以是第1圖至第12圖所揭示實施例的任一種電容式三維偵測模組10(本實施例中所提及的機械元器件的標號請參照 實施例一),所述電容式三維偵測模組包括至少一電容式觸控感測器13與一壓電式壓力感測器10s,以及一電容式三維控制器180。 Referring to FIG. 14 , a fifth embodiment of the present invention provides a method for detecting a capacitive three-dimensional detection module. The capacitive three-dimensional detection module may be any of the embodiments disclosed in FIGS. 1 to 12 . A capacitive three-dimensional detecting module 10 (refer to the label of the mechanical components mentioned in this embodiment) Embodiment 1) The capacitive 3D detection module includes at least one capacitive touch sensor 13 and a piezoelectric pressure sensor 10s, and a capacitive three-dimensional controller 180.

電容式三維偵測模組的偵測方法包括如下步驟: The method for detecting a capacitive 3D detection module includes the following steps:

T0:開始; T0: start;

T21:電容式觸控感測器採用互電容方式對所述多個觸控單元進行觸控信號的偵測以確定觸控點位置; T21: The capacitive touch sensor uses the mutual capacitance method to detect the touch signals of the plurality of touch units to determine the position of the touch point;

T22:壓電式壓力感測器採用自電容方式對所述至少一壓感單元進行壓力信號的偵測以確定按壓力值大小;所述壓電式壓力感測器10s偵測觸控點位置處所對應的壓感單元;所述步驟觸控點位置的偵測與所述按壓力值大小彼此獨立同時序或分時序進行。 T22: The piezoelectric pressure sensor uses a self-capacitance method to detect a pressure signal of the at least one pressure sensing unit to determine a pressing force value; and the piezoelectric pressure sensor 10s detects a touch point position. The pressure sensing unit corresponding to the location; the detecting of the position of the touch point in the step and the magnitude of the pressing force value are performed independently of each other simultaneously or sequentially.

T3:電容式三維偵測模組回應;電容式三維偵測模組在確定好觸控點位置以及按壓力值後作出對應的回應動作,如顯示介面的跳轉,滑動等。 T3: The capacitive 3D detection module responds; the capacitive 3D detection module makes corresponding response actions after determining the position of the touch point and pressing the pressure value, such as jumping, sliding, etc. of the display interface.

T4:結束。 T4: End.

較佳地,在步驟T22中,偵測觸控點位置處所對應的壓感單元包括至少二壓感單元,所述至少二壓感單元分別位於同一柔性基材層的兩側。 Preferably, in step T22, the pressure sensing unit corresponding to the position of the touch point is detected to include at least two pressure sensing units, and the at least two pressure sensing units are respectively located on two sides of the same flexible substrate layer.

以上所述僅為本發明的較佳實施例而已,並不用以限制本發明,凡在本發明的原則之內所作的任何修改,等同替換和改進等均應包含本發明的保護範圍之內。 The above is only the preferred embodiment of the present invention, and is not intended to limit the present invention, and any modifications, equivalents, and improvements made within the principles of the present invention should be included in the scope of the present invention.

S0-S4‧‧‧步驟 S0-S4‧‧‧ steps

Claims (11)

一種電容式三維偵測模組的偵測方法,應用於一電容式三維偵測模組,該電容式三維偵測模組包括一電容式觸控感測器與一壓電式壓力感測器以及一集成在一晶片上的電容式三維控制器,該電容式觸控感測器包括多個觸控單元,該壓電式壓力感測器包括至少一壓感單元,該偵測方法依次包括步驟:S1:採用互電容方式對該多個觸控單元進行觸控信號的偵測以確定觸控點位置;及S2:採用自電容方式對該至少一壓感單元進行壓力信號的偵測以確定按壓力值大小,在該步驟中所述的該至少一壓感單元與步驟S1中所確定的觸控點位置相對應;該觸控信號以及該壓力信號由該電容式三維控制器進行運算處理。 A capacitive three-dimensional detection module is applied to a capacitive three-dimensional detection module, the capacitive three-dimensional detection module comprising a capacitive touch sensor and a piezoelectric pressure sensor And a capacitive three-dimensional controller integrated on a chip, the capacitive touch sensor includes a plurality of touch units, the piezoelectric pressure sensor includes at least one pressure sensing unit, and the detecting method includes Step: S1: detecting the touch signals of the plurality of touch units by mutual capacitance to determine the position of the touch point; and S2: detecting the pressure signal of the at least one pressure sensitive unit by using a self-capacitance method Determining the pressing force value, the at least one pressure sensing unit in the step corresponding to the touch point position determined in step S1; the touch signal and the pressure signal are operated by the capacitive three-dimensional controller deal with. 如請求項1所述的電容式三維偵測模組的偵測方法,更包含:該壓電式壓力感測器包括一第一壓感層和一第二壓感層,該第一壓感層和該第二壓感層上均設置有至少一該壓感單元;該第一壓感層為採用正溫度係數的壓感材料製成的正溫度係數壓感層,該第二壓感層為採用負溫度係數的壓感材料製成的負溫度係數壓感層,該第二壓感層上之至少 一該壓感單元之壓力信號作為該第一壓感層上之至少一該壓感單元之壓力信號的溫度補償對象。 The method for detecting a capacitive three-dimensional detection module according to claim 1, further comprising: the piezoelectric pressure sensor comprising a first pressure sensing layer and a second pressure sensing layer, the first pressure sensing At least one of the pressure sensitive layer is disposed on the layer and the second pressure sensitive layer; the first pressure sensitive layer is a positive temperature coefficient pressure sensitive layer made of a pressure sensitive material with a positive temperature coefficient, and the second pressure sensitive layer a negative temperature coefficient pressure sensitive layer made of a pressure sensitive material having a negative temperature coefficient, at least on the second pressure sensitive layer A pressure signal of the pressure sensing unit is used as a temperature compensation target of the pressure signal of at least one of the pressure sensing units on the first pressure sensing layer. 如請求項1所述的電容式三維偵測模組的偵測方法,更包含:該觸控信號的偵測週期的起始點和結束點均與該壓力信號偵測週期的起始點和結束點錯位。 The method for detecting a capacitive three-dimensional detection module according to claim 1, further comprising: a starting point and an ending point of the detection period of the touch signal and a starting point of the pressure signal detecting period The end point is misplaced. 如請求項1所述的電容式三維偵測模組的偵測方法,更包含:該至少一壓感單元與多個觸控單元位置對應設置。 The method for detecting a capacitive three-dimensional detection module according to claim 1, further comprising: the at least one pressure sensing unit is disposed corresponding to the positions of the plurality of touch units. 一種電容式三維偵測模組的偵測方法,應用於一電容式三維偵測模組,該電容式三維偵測模組包括一電容式觸控感測器與一壓電式壓力感測器以及一集成在一晶片上的電容式三維控制器,該電容式觸控感測器包括多個觸控單元,該壓電式壓力感測器包括至少一壓感單元,該偵測方法包括步驟:T21:採用互電容方式對該多個觸控單元進行觸控信號的偵測以確定觸控點位置;及T22:採用自電容方式對該至少一壓感單元進行壓力信號的偵測以確定按壓力值大小;步驟T21和步驟T22相互獨立進行;該觸控信號以及該壓力信號由該電容式三維控制器進行運算處理。 A capacitive three-dimensional detection module is applied to a capacitive three-dimensional detection module, the capacitive three-dimensional detection module comprising a capacitive touch sensor and a piezoelectric pressure sensor And a capacitive three-dimensional controller integrated on a chip, the capacitive touch sensor comprising a plurality of touch units, the piezoelectric pressure sensor comprising at least one pressure sensing unit, the detecting method comprising the steps : T21: detecting the touch signals of the plurality of touch units by mutual capacitance to determine the position of the touch point; and T22: detecting the pressure signal of the at least one pressure sensitive unit by using a self-capacitance method to determine According to the magnitude of the pressure value, the step T21 and the step T22 are performed independently of each other; the touch signal and the pressure signal are processed by the capacitive three-dimensional controller. 如請求項5所述的電容式三維偵測模組的偵測方法,更包含:該觸控信號的偵測與該壓力信號的偵測分時序進行。 The method for detecting a capacitive three-dimensional detection module according to claim 5, further comprising: detecting the touch signal and detecting the timing of the pressure signal. 如請求項5所述的電容式三維偵測模組的偵測方法,更包含:該觸控信號的偵測與該壓力信號的偵測同時序進行。 The method for detecting a capacitive three-dimensional detection module according to claim 5, further comprising: detecting the touch signal and simultaneously detecting the pressure signal. 如請求項6或7所述的電容式三維偵測模組的偵測方法,更包含:該觸控信號的偵測週期的起始點和結束點均與該壓力信號偵測週期的起始點和結束點錯位。 The method for detecting a capacitive three-dimensional detection module according to claim 6 or 7, further comprising: a start point and an end point of the detection period of the touch signal and a start of the pressure signal detection period The point and end point are misplaced. 如請求項5所述的電容式三維偵測模組的偵測方法,更包含:該至少一壓感單元與多個觸控單元位置對應設置。 The method for detecting a capacitive three-dimensional detection module according to claim 5, further comprising: the at least one pressure sensing unit is corresponding to the position of the plurality of touch units. 如請求項5所述的電容式三維偵測模組的偵測方法,更包含:該壓電式壓力感測器包括至少一柔性基材層,在該柔性基材層的兩側分別設置有一第一壓感層和一第二壓感層,該第一壓感層和該第二壓感層上均設置有至少一該壓感單元。 The method for detecting a capacitive three-dimensional detection module according to claim 5, further comprising: the piezoelectric pressure sensor comprising at least one flexible substrate layer, one of which is disposed on each side of the flexible substrate layer The first pressure sensitive layer and the second pressure sensitive layer are provided with at least one pressure sensing unit on the first pressure sensitive layer and the second pressure sensitive layer. 如請求項10所述的電容式三維偵測模組的偵測方法,更包含:該電容式三維控制器對該第一壓感層上壓感單元之壓力信號和該第二壓感層上壓感單元之壓力信號進行疊加。 The method for detecting a capacitive three-dimensional detecting module according to claim 10, further comprising: the capacitive three-dimensional controller is configured to apply a pressure signal to the pressure sensing unit on the first pressure sensing layer and the second pressure sensing layer The pressure signals of the pressure sensing unit are superimposed.
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201205404A (en) * 2010-07-16 2012-02-01 Elan Microelectronics Corp Three-dimensional touch sensor and application thereof
CN203630766U (en) * 2013-12-11 2014-06-04 深圳市宇顺电子股份有限公司 3d display capacitive touch screen module
TWI448935B (en) * 2011-05-20 2014-08-11 Nat Univ Tsing Hua 3-d touch sensor and 3-d touch panel
TW201516806A (en) * 2013-10-16 2015-05-01 Acer Inc Three-dimension touch apparatus

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102339179A (en) * 2010-07-16 2012-02-01 义隆电子股份有限公司 Three-dimensional touch sensor and application method thereof
TWI491859B (en) * 2013-05-24 2015-07-11 Himax Tech Ltd Method of detecting touch force and detector
CN203858612U (en) * 2013-08-29 2014-10-01 福建省辉锐材料科技有限公司 Transparent piezoelectric plate and touch panel
CN104423740B (en) * 2013-08-30 2018-07-13 唐山东唐电气股份有限公司 Method for sensing based on capacitive touch device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201205404A (en) * 2010-07-16 2012-02-01 Elan Microelectronics Corp Three-dimensional touch sensor and application thereof
TWI448935B (en) * 2011-05-20 2014-08-11 Nat Univ Tsing Hua 3-d touch sensor and 3-d touch panel
TW201516806A (en) * 2013-10-16 2015-05-01 Acer Inc Three-dimension touch apparatus
CN203630766U (en) * 2013-12-11 2014-06-04 深圳市宇顺电子股份有限公司 3d display capacitive touch screen module

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