KR20160053919A - Sensor device, input device, and electronic device - Google Patents

Abstract

An object of the present invention is to provide a sensor device, an input device, and an electronic device that can suppress deterioration of detection accuracy due to the influence of electromagnetic noise from the outside. A sensor device according to an embodiment of the present technology includes an electrode substrate and a shield layer. Wherein the electrode substrate has a plurality of first electrode lines and a plurality of second electrode lines and a plurality of capacitance sensors formed respectively in a plurality of opposing regions of the plurality of first electrode lines and the plurality of second electrode lines are arranged in a matrix form . The shield layer includes a conductor film formed on the electrode substrate and shielding at least a part of the wiring region of the plurality of second electrode lines that communicate between the plurality of opposed regions.

Description

TECHNICAL FIELD [0001] The present invention relates to a sensor device, an input device, and an electronic device,

The present invention relates to a sensor device, an input device, and an electronic device capable of electrostatically detecting an input operation.

As a sensor device for an electronic device, for example, a configuration is known in which a capacitive element is provided and it is possible to detect an operating position and a pressing force of an operator on an input operating surface (see, for example, Patent Document 1) .

Japanese Patent Application Laid-Open No. 11-170659

In recent years, an input method with a high degree of freedom has been performed by a gesture operation using a finger movement. In addition, if the pressing force on the operation surface can be stably detected with high accuracy, it is expected to realize more various input operations. For example, in a sensor apparatus configured to detect an input operation electrostatically, it is necessary to suppress deterioration of detection accuracy due to the influence of electromagnetic noise from the outside.

SUMMARY OF THE INVENTION In view of the above circumstances, an object of the present invention is to provide a sensor device, an input device, and an electronic device capable of suppressing deterioration of detection accuracy due to the influence of electromagnetic noise from the outside.

In order to achieve the above object, a sensor device according to an aspect of the present technology includes an electrode substrate and a shield layer.

Wherein the electrode substrate has a plurality of first electrode lines and a plurality of second electrode lines and a plurality of capacitance sensors formed respectively in a plurality of opposing regions of the plurality of first electrode lines and the plurality of second electrode lines are arranged in a matrix form .

The shield layer includes a conductor film formed on the electrode substrate and shielding at least a part of the wiring region of the plurality of second electrode lines that communicate between the plurality of opposed regions.

In the sensor device, the shield layer functions as an electronic shield covering the wiring region. This makes it possible to suppress deterioration in the detection accuracy of each capacitive sensor due to the influence of the electromagnetic noise from the outside.

The plurality of first electrode lines and the plurality of second electrode lines may be disposed apart from each other in the thickness direction of the electrode substrate. In this case, the plurality of capacitance sensors are respectively formed in the intersecting regions of the plurality of first electrode lines and the plurality of second electrode lines.

The electrode substrate may have a first insulating layer for supporting the plurality of first electrode lines and a second insulating layer for supporting the plurality of second electrode lines. In this case, the shield layer is formed, for example, in the first insulating layer.

The shield layer may be formed on the same plane as the plurality of first electrode lines. The conductor film may be made of the same material as the plurality of first electrode lines. The conductor film may include a plurality of third electrode lines disposed between the plurality of first electrode lines. The conductor film may further include a wiring portion connecting the plurality of third electrode lines to each other.

On the other hand, the plurality of capacitance sensors may be formed respectively in opposing areas of the plurality of first electrode lines and the plurality of second electrode lines facing each other in the in-plane direction of the electrode substrate. In this case, the shield layer may further include an insulating film disposed between the conductor film and the wiring region.

The electrode substrate may have a plurality of jumper wiring portions formed at intersections of the plurality of first electrode lines and the plurality of second electrode lines. The conductor film may be formed on the same plane as the plurality of jumper wiring portions. The shield layer may cover the plurality of jumper wiring portions. The conductor film may be made of the same material as the plurality of jumper wiring portions. The shield layer may further shield at least a part of the wiring region of the plurality of first electrode lines that communicate between the plurality of opposing regions.

The plurality of second electrode lines may have an outer wiring portion formed outside the detection region in which the plurality of capacitance sensors arranged in a matrix are formed. In this case, the shield layer may further shield at least a part of the outer wiring portion.

The sensor device further includes a first support body having a deformable first conductor layer disposed to face one main surface of the electrode substrate and a plurality of first structure members connecting between the first conductor layer and the electrode substrate . The sensor device may further include a second support layer having a second conductor layer disposed opposite to the other main surface of the electrode substrate and a plurality of second structure members connecting the second conductor layer and the electrode substrate, .

An input device according to an aspect of the technology includes an operating member, an electrode substrate, and a shield layer.

The operating member has an input operating surface.

Wherein the electrode substrate has a plurality of first electrode lines and a plurality of second electrode lines and a plurality of capacitance sensors formed respectively in a plurality of opposing regions of the plurality of first electrode lines and the plurality of second electrode lines are arranged in a matrix form .

The shield layer includes a conductor film which is formed between the operating member and the electrode substrate and shields at least a part of the wiring region of the plurality of second electrode lines communicating between the plurality of opposed regions.

An electronic apparatus according to an embodiment of the present technology includes a display element, an electrode substrate, and a shield layer.

The display element has an input operation surface.

Wherein the electrode substrate has a plurality of first electrode lines and a plurality of second electrode lines and a plurality of capacitance sensors formed respectively in a plurality of opposing regions of the plurality of first electrode lines and the plurality of second electrode lines are arranged in a matrix form .

The shield layer includes a conductor film which is formed between the display element and the electrode substrate and shields at least part of the wiring region of the plurality of second electrode lines that communicate between the plurality of opposed regions.

As described above, according to the present technique, it is possible to suppress deterioration of the detection accuracy due to the influence of the electromagnetic noise from the outside.

Further, the effects described herein are not necessarily limited, and any one of the effects described in the present disclosure may be used.

1 is a schematic sectional view of an input device according to a first embodiment of the present technology.
2 is an exploded perspective view of the input device.
3 is a schematic cross-sectional view of the main part of the input device.
4 is a block diagram of an electronic apparatus using the input device.
5 is a schematic cross-sectional view showing a state of a force applied to the first and second structures when a point on the first surface of the input device is pressed downward in the Z-axis direction by the operator.
Fig. 6 is a schematic cross-sectional view showing a schematic main part showing the shape of the input device when a point on the first structure of the first surface receives an operation by an operator, and Fig. to be.
7 is a plan view of a principal portion of the electrode substrate in the input device.
Fig. 8 is a plan view of the main part of the first wiring substrate constituting the electrode substrate. Fig.
Fig. 9 is a plan view of the main portion of the second wiring substrate constituting the electrode substrate. Fig.
10 is a plan view schematically showing the whole of the first wiring board.
11A is a schematic cross-sectional view of an input device according to a second embodiment of the present technology, and FIG. 11B is a cross-sectional view showing an enlarged main part of an input device.
Fig. 12 is a plan view of the principal parts showing the configurations of the first electrode line and the second electrode line in the input device. Fig.
Fig. 13A is a plan view of the principal portion of the electrode substrate in the input device, and Fig. 13B is a sectional view taken along the line AA.
Fig. 14 is a schematic cross-sectional view for explaining the configuration of the detecting unit relating to the above-mentioned input device.
FIG. 15A is a plan view of a principal portion of the electrode substrate having a shield layer, FIG. 15B is a sectional view taken along the line B1-B1, and FIG. 15C is a sectional view taken along the line C1-C1.
FIG. 16A is a plan view of a principal portion of the electrode substrate having a shield layer, FIG. 16B is a sectional view taken along line B2-B2 thereof, and FIG. 16C is a sectional view taken along line C2-C2.
Fig. 17 is a plan view of a principal part showing a modification of the configuration of the first electrode line. Fig.
18 is a schematic plan view showing another configuration example of the first electrode line.
Fig. 19 is a plan view of a principal portion showing a modification of the configuration of the second electrode line. Fig.
20 is a schematic cross-sectional view showing a modification of the configuration of the input device.

Hereinafter, embodiments of the present technology will be described with reference to the drawings.

≪ First Embodiment >

2 is a disassembled perspective view of the input device 100, Fig. 3 is a schematic cross-sectional view of the main part of the input device 100, Fig. 4 is a cross- Fig. 7 is a block diagram of an electronic device 70 using the input device 100. Fig. Hereinafter, the configuration of the input apparatus 100 of the present embodiment will be described. In the drawing, the X axis and Y axis indicate directions orthogonal to each other (in-plane direction of the input apparatus 100), and the Z axis indicates a direction orthogonal to the X axis and the Y axis ).

[Input device]

The input device 100 has a flexible display (display device) 11 for accepting an operation by a user and a sensor device 1 for detecting the operation of the user. The input device 100 is constituted by, for example, a flexible touch panel display and is incorporated in an electronic device 70 described later. The sensor device 1 and the flexible display 11 are in a flat plate shape extending in a direction perpendicular to the Z-axis.

The flexible display 11 has a first surface 110 and a second surface 120 which is opposite to the first surface 110. The flexible display 11 has a function as an input operation unit and a function as a display unit in the input device 100. [ In other words, the flexible display 11 functions as the input operation surface and the display surface, and the image from the first surface 110 in accordance with the operation by the user is displayed upward in the Z-axis direction. On the first surface 110, for example, an image corresponding to a keyboard or a GUI (Graphical User Interface) is displayed. Examples of the operator who performs the operation on the flexible display 11 include a finger or a pen (stylus pen).

The specific configuration of the flexible display 11 is not particularly limited. For example, as the flexible display 11, a so-called electronic paper, an organic EL (electroluminescence) panel, an inorganic EL panel, a liquid crystal panel, or the like can be employed. The thickness of the flexible display 11 is not particularly limited, and is, for example, about 0.1 mm to 1 mm.

The sensor device 1 includes a metal film (first conductor layer) 12, a conductor layer (second conductor layer) 50, an electrode substrate 20, a first support body 30, (40). The sensor device 1 is disposed on the second surface 120 side of the flexible display 11.

The metal film 12 is formed in a deformable sheet shape. The conductor layer 50 is disposed opposite to the metal film 12. The electrode substrate 20 includes a plurality of first electrode lines 210 and a plurality of second electrode lines 220 disposed opposite to the plurality of first electrode lines 210 and intersecting the plurality of first electrode lines 210 And it is possible to detect the change in the distance between the metal film 12 and the conductor layer 50 in a static manner between the metal film 12 and the conductor layer 50 so as to be deformable. The first support 30 includes a plurality of first structures 310 connecting between the metal film 12 and the electrode substrate 20 and a plurality of second spaces 310 formed between the plurality of first structures 310. [ (330). The second support body 40 includes a plurality of second structure bodies 410 that are respectively disposed between adjacent first structure bodies 310 and connect between the conductor layer 50 and the electrode substrate 20, And a second space portion 430 formed between the second structures 410 of the first structure 410.

The sensor device 1 according to the present embodiment (input device 100) includes the metal film 12 and the electrode substrate 20 by the input operation on the first surface 110 of the flexible display 11, The change in distance between the conductor layer 50 and the electrode substrate 20 is detected positively to detect the input operation. The input operation is not limited to the operation of consciously pressing (pushing) on the first surface 110, but may be a touch (touch) operation. That is, since the input device 100 can detect even a minute pressing force (for example, about several tens of grams) added by a general touch operation as described later, it is possible to perform a touch operation similar to that of a normal touch sensor .

The input device 100 has a control unit 60 and the control unit 60 includes an operation unit 61 and a signal generation unit 62. The calculating section 61 detects the operation by the user based on the change of the capacitance of the detecting section 20s. The signal generation unit 62 generates an operation signal based on the detection result by the operation unit 61. [

The electronic device 70 shown in Fig. 4 has a controller 710 that performs processing based on an operation signal generated by the signal generation unit 62 of the input device 100. Fig. The operation signal processed by the controller 710 is output to the flexible display 11 as, for example, an image signal. The flexible display 11 is connected to a drive circuit mounted on the controller 710 through a flexible wiring board 113 (see Fig. 2). The driving circuit may be mounted on the wiring board 113.

Typical examples of the electronic device 70 include a cellular phone, a smart phone, a notebook type personal computer (PC), a tablet type personal computer, a portable game device and the like, but the present invention is not limited to these portable electronic devices, Etc.), automatic ticket machines, and the like.

The flexible display 11 is configured as a part of the operating member 10 of the input device 100 in the present embodiment. That is, the input device 100 has the operation member 10, the electrode substrate 20, the first support body 30, the second support body 40, and the conductor layer 50. Each of these elements will be described below.

(Operating member)

The operating member 10 has a laminated structure of the flexible display 11 including the first surface 110 and the second surface 120 and the metal film 12. [ That is, the operating member 10 has a first surface 110 for accepting an operation by the user and a second surface 120 on which the metal film 12 is formed and which is opposite to the first surface 110, And is formed into a sheet shape as far as possible.

The metal film 12 is formed in a deformable sheet shape in accordance with deformation of the flexible display 11 and is made of a metal foil or a mesh material such as Cu (copper), Al (aluminum), or the like. The thickness of the metal film 12 is not particularly limited, and is, for example, several tens nm to several tens of micrometers. The metal film 12 is connected to a predetermined reference potential (for example, ground potential). As a result, the metal film 12 exerts a certain shielding function for electromagnetic waves when mounted on the electronic device 70. That is, for example, it is possible to suppress the intrusion of electromagnetic waves from other electronic parts or the like mounted on the electronic device 70 and the leakage of the electromagnetic wave from the input device 100, thereby contributing to the stability of the operation of the electronic device 70 .

The constituent material of the metal film 12 is not limited to metal but may be a metal oxide material such as ITO or another conductive material such as carbon.

The metal film 12 is formed, for example, by attaching a sticky adhesive layer 13 with a metal foil to the flexible display 11, as shown in Fig. The material of the adhesive layer 13 is not particularly limited as long as it has adhesiveness, but it may be a resin film to which a resin material is applied. Alternatively, it may be formed of a vapor deposition film or a sputtering film formed directly on the flexible display 11, or may be a coating film of conductive paste or the like printed on the surface of the flexible display 11.

(Conductor layer)

The conductor layer 50 constitutes the lowermost portion of the input device 100 and is arranged to face the metal film 12 in the Z-axis direction. The conductor layer 50 also functions as a support plate of the input device 100 and has a bending rigidity higher than that of the operation member 10 and the electrode substrate 20, for example. The conductor layer 50 may be made of a conductive plate such as a metal plate containing carbon, for example, an Al alloy, a Mg (magnesium) alloy or other metal material, or a carbon fiber reinforced plastic. Or the conductor layer 50 may have a laminated structure in which a conductor film such as a plated film, a vapor deposition film, a sputtering film, or a metal foil is formed on an insulator layer such as a plastic material. The thickness of the conductor layer 50 is not particularly limited, and is, for example, about 0.3 mm.

The conductor layer 50 is connected to a predetermined reference potential (for example, ground potential). As a result, the conductor layer 50 functions as an electromagnetic shielding layer when mounted on the electronic device 70. That is, for example, it is possible to suppress the intrusion of electromagnetic waves from other electronic parts or the like mounted on the electronic device 70 and the leakage of the electromagnetic wave from the input device 100, thereby contributing to the stability of the operation of the electronic device 70 .

(Electrode substrate)

The electrode substrate 20 is formed of a laminate of a first wiring substrate 21 having a first electrode line 210 and a second wiring substrate 22 having a second electrode line 220.

The first wiring board 21 has a first substrate 211 (see FIG. 2) and a plurality of first electrode lines (X electrodes) 210. The first substrate 211 (first insulating layer) is made of, for example, a flexible sheet material, and specifically, an electrically insulating plastic sheet (film) such as PET, PEN, PC, PMMA, or polyimide . The thickness of the first base material 211 is not particularly limited, and is, for example, several 10 mu m to several hundred mu m.

The plurality of first electrode lines 210 are integrally formed on one surface of the first substrate 211. The plurality of first electrode lines 210 are arranged at predetermined intervals along the X-axis direction, and are formed substantially linearly along the Y-axis direction. Each of the first electrode lines 210 is led out to the edge of the first substrate 211 or the like, and is connected to a different terminal. Each of the first electrode lines 210 is electrically connected to the control unit 60 through these terminals.

Each of the plurality of first electrode lines 210 may be composed of a single electrode line or a plurality of electrode groups arranged along the X axis direction. The plurality of electrode lines constituting each of the electrode groups may be connected to a common terminal or may be connected to two or more different terminals.

On the other hand, the second wiring substrate 22 has a second substrate 221 (see FIG. 2) and a plurality of second electrode lines (Y electrodes) 220. The second substrate 221 (second insulating layer) is made of a flexible sheet material, for example, PET, PEN, PC, PMMA, polyimide or the like An electrically insulating plastic sheet (film) or the like. The thickness of the second base material 221 is not particularly limited, and is, for example, several 10 탆 to several hundred 탆. The second wiring board 22 is disposed opposite to the first wiring board 21.

The plurality of second electrode lines 220 are configured similarly to the plurality of first electrode lines 210. That is, the plurality of second electrode lines 220 are integrally formed on one surface of the second substrate 221, are arranged at predetermined intervals along the Y axis direction, and are arranged substantially linearly along the X axis direction Respectively. Each of the plurality of second electrode lines 220 may be composed of a single electrode line or a plurality of electrode groups arranged along the Y axis direction.

Each of the second electrode lines 220 is led out to the edge of the second substrate 221 or the like, and is connected to a different terminal. The plurality of electrode lines constituting each of the electrode groups may be connected to a common terminal, or may be connected to two or more different terminals. Each of the second electrode lines 220 is electrically connected to the control unit 60 through these terminals.

The first electrode line 210 and the second electrode line 220 may be formed by a printing method such as a screen printing method, a gravure offset printing method, an inkjet printing method or the like by forming a conductive paste or the like by a patterning method using a metal foil or a metal layer photolithography technique . Further, the first and second substrates 211 and 221 are all made of flexible sheets, so that the electrode substrate 20 can be made flexible in its entirety.

As shown in Fig. 3, the electrode substrate 20 has an adhesive layer 23 for bonding the first wiring substrate 21 and the second wiring substrate 22 to each other. The adhesive layer 23 has electrical insulation and is composed of, for example, a cured product of an adhesive, an adhesive material such as an adhesive tape, or the like.

As described above, in the electrode substrate 20 of the present embodiment, the plurality of first electrode lines 210 and the plurality of second electrode lines 220 are spaced apart from each other in the thickness direction (Z-axis direction) of the electrode substrate 20 . The electrode substrate 20 is provided with a plurality of detecting portions 20s (capacitance sensors) formed in a plurality of opposed regions of the plurality of first electrode lines 210 and the plurality of second electrode lines 220 in a matrix do. The plurality of detecting portions 20s are formed in the intersecting regions of the plurality of first electrode lines 210 and the plurality of second electrode lines 220, respectively.

The plurality of first electrode lines 210 are disposed on the side of the operation member 10 rather than the plurality of second electrode lines 220. The present invention is not limited to this, The first electrode line 210 may be disposed on the operation member 10 side.

(Control section)

The control unit 60 is electrically connected to the electrode substrate 20. [ More specifically, the control unit 60 is connected to each of the first and second electrode lines 210 and 220 through a terminal. The control unit 60 constitutes a signal processing circuit capable of generating information on the input operation with respect to the first surface 110 based on the outputs of the plurality of detection units 20s. The control unit 60 acquires the amount of capacitance change of each detection unit 20s while scanning each of the plurality of detection units 20s at a predetermined cycle and generates information about the input operation based on the amount of capacitance change.

The control unit 60 is typically composed of a computer having a CPU / MPU, a memory, and the like. The control unit 60 may be composed of a single chip component or a plurality of circuit components. The control unit 60 may be mounted on the input device 100 or may be mounted on the electronic device 70 in which the input device 100 is incorporated. In the former case, it is mounted on a flexible wiring board connected to the electrode substrate 20, for example. In the latter case, it may be configured integrally with the controller 710 for controlling the electronic device 70. [

The control unit 60 has an operation unit 61 and a signal generation unit 62 as described above and executes various functions in accordance with a program stored in a storage unit (not shown). The arithmetic operation section 61 calculates an XY coordinate value on the first surface 110 based on an electrical signal (input signal) output from each of the first and second electrode lines 210 and 220 of the electrode substrate 20 And the signal generating unit 62 generates an operation signal based on the result. As a result, an image based on the input operation on the first surface 110 can be displayed on the flexible display 11.

The calculation unit 61 shown in Figs. 3 and 4 calculates the XY coordinate of the operation position by the operator on the first surface 110 based on the output from each detection unit 20s assigned the unique XY coordinate . Specifically, the calculating unit 61 calculates the intersection of each X electrode and the Y electrode based on the amount of change in electrostatic capacitance obtained from each X electrode (first electrode line 210) and Y electrode (second electrode line 220) The amount of change in the capacitance of each detecting portion 20s formed in the region (opposing region) is calculated. It is possible to calculate the XY coordinates of the operation position by the operator on the basis of the ratio of the change amount of the electrostatic capacity of the angular detection unit 20s or the like.

For example, the arithmetic operation section 61 calculates a voltage value corresponding to the detection electrode E2 obtained when a drive signal is applied to the electrode line corresponding to the drive electrode E1, among the first and second electrode lines 210 and 220, Based on the output from the electrode line, the amount of capacitance change of each detection portion 20s is acquired. The signal generating unit 62 generates information (control signal) on the input operation on the input operation surface based on the output of the arithmetic unit 61 (the capacitance change amount of each detection unit 20s).

In the present embodiment, the first electrode line 210 serves as the driving electrode E1 and the second electrode line 220 serves as the detecting electrode E2. Since the potential of the driving electrode E1 is stable as compared with the detecting electrode E2, it is less affected by the electron noise than the detecting electrode E2. In this respect, the first electrode line 210 also has a function as a shield layer for protecting the second electrode line 220 from electromagnetic noise.

The calculation unit 61 can also determine whether or not the first surface 110 is under operation. Specifically, for example, when the amount of change in the capacitance of the entire detection portion 20s, the amount of change in the capacitance of each of the detection portions 20s, and the like are equal to or larger than a predetermined threshold, it is determined that the first surface 110 is being operated . Further, by setting the threshold value to two or more, for example, it is possible to discriminate between the touch operation and the (conscious) push operation. It is also possible to calculate the pressing force based on the change amount of the electrostatic capacity of the detecting portion 20s.

The signal generating unit 62 generates a predetermined operation signal based on the calculation result of the calculating unit 61. [ The operation signal may be, for example, an image control signal for generating a display image to be output to the flexible display 11, an operation signal corresponding to a key of a keyboard image displayed at an operation position on the flexible display 11, Graphical User Interface), or the like.

Here, the input apparatus 100 is configured to change the distance between the metal film 12 and the conductor layer 50 and the electrode substrate 20 (detection section 20s) by the operation on the first surface 110 The first and second support members 30 and 40 are provided. Hereinafter, the first and second support members 30 and 40 will be described.

(Basic Structure of First and Second Supports)

The first support body 30 is disposed between the operation member 10 and the electrode substrate 20. The first support body 30 has a plurality of first structures 310, a first frame body 320, and a first space portion 330. In the present embodiment, the first support body 30 is bonded onto the electrode substrate 20 through the adhesive layer 35 (see Fig. 3). The adhesive layer 35 may be an adhesive or an adhesive material such as an adhesive, an adhesive tape, or the like.

3, the first support 30 according to the present embodiment includes a substrate 31, a structure layer 32 formed on the surface (upper surface) of the substrate 31, And a plurality of joining portions 341 formed at predetermined positions of the joining portions 341. The base material 31 is made of an electrically insulating plastic sheet such as PET, PEN, or PC. The thickness of the substrate 31 is not particularly limited, and is, for example, several mu m to several hundred mu m.

The structure layer 32 is made of an electrically insulating resin material such as UV resin and has a plurality of first convex portions 321, second convex portions 322, concave portions 323, . Each of the first convex portions 321 has, for example, a cylindrical shape, a prism shape, a truncated cone shape or the like protruding in the Z-axis direction and arranged at a predetermined interval on the base material 31. The second convex portion 322 is formed to have a predetermined width so as to surround the periphery of the base material 31.

The structure layer 32 is made of a material having such rigidity that the electrode substrate 20 can be deformed by an input operation on the first surface 110. However, Or may be composed of an elastic material that can be deformed together. That is, the modulus of elasticity of the structure layer 32 is not particularly limited, and can be appropriately selected within a range in which an intended operation feeling and detection sensitivity can be obtained.

The concave portion 323 is formed of a flat surface formed between the first and second convex portions 321 and 322. [ That is, the space region on the concave portion 323 constitutes the first space portion 330. Further, on the concave portion 323, an anti-bonding layer 342 formed of UV resin or the like having low adhesiveness is formed (not shown in Fig. 3) in this embodiment. The shape of the anti-adhesion layer 342 is not particularly limited and may be an island shape or a flat film on the recess 323. [

Further, on each of the first and second convex portions 321 and 322, a bonding portion 341 made of an adhesive resin material or the like is formed. That is, each of the first structures 310 is composed of a laminate of a first convex portion 321 and a joint portion 341 formed thereon, and each of the first frame bodies 320 includes a second convex portion 322, And a laminated body of the joining portions 341 formed thereon. Thus, the thickness (height) of the first structural body 310 and the first frame body 320 are substantially the same, and in this embodiment, for example, in the range of several m to several hundred m. The height of the adhesion preventive layer 342 is not particularly limited as long as it is lower than the height of the first structural body 310 and the first structural body 320. The height of the first and second convex portions 321 and 322, .

The plurality of first structures 310 are arranged corresponding to the arrangement of each of the detecting portions 20s. In the present embodiment, the plurality of first structures 310 are arranged so as to face the center of each of the plurality of detection portions 20s in the Z-axis direction, but the present invention is not limited thereto. Or may be disposed at an offset position with respect to the center. In addition, the number of structures 310 opposed to each detection portion 20s is not limited to one, but may be plural.

The first frame body 320 is formed so as to surround the periphery of the first support body 30 along the periphery of the electrode substrate 20. The length in the short direction of the first frame member 320, that is, the width is not particularly limited as long as the strength of the entire first support member 30 and the input device 100 can be sufficiently secured.

On the other hand, the second support body 40 is disposed between the electrode substrate 20 and the conductor layer 50. The second support body 40 has a plurality of second structures 410, a second frame body 420, and a second space portion 430.

3, the second support body 40 according to the present embodiment has the second structure body 410 and the second frame body 420 formed directly on the conductor layer 50. [ The second structure body 410 and the second frame body 420 are made of, for example, an insulating resin material having adhesiveness, and serve also as a function of a joint portion joining the conductor layer 50 and the electrode substrate 20 do. Thicknesses of the second structural body 410 and the second frame body 420 are not particularly limited, but are, for example, several mu m to several hundred mu m.

The second structures 410 are disposed between adjacent first structures 310, respectively. That is, the second structures 410 are disposed between adjacent detection portions 20s. The present invention is not limited to this, and the second structure body 410 may be disposed so as to be opposed to the respective detection portions 20s.

The second frame body 420 is formed so as to surround the periphery of the second support body 40 along the periphery of the conductor layer 50. The width of the second frame member 420 is not particularly limited as long as the strength of the entirety of the second support member 40 and the input device 100 can be sufficiently secured. For example, the width of the second frame member 420 is substantially the same as that of the first frame member 320 Width.

The elastic modulus of the second structural body 410 is not particularly limited, as is the structural layer 32 constituting the first structural body 310. That is, it may be made of an elastic material which can be appropriately selected within a range in which an intended operation feeling and detection sensitivity can be obtained, and deformable together with the electrode substrate 20 at the time of input operation.

The second space portion 430 is formed between the second structural bodies 410 and constitutes a spatial region around the second structural body 410 and the second frame body 420. In the present embodiment, the second space portion 430 houses the detecting portions 20s and the first structures 310 when viewed in the Z-axis direction.

As described above, the first and second support bodies 30,

(1) Having the first and second structures 310 and 410 and the first and second space portions 330 and 430,

(2) The first structure 310 and the second structure 410 are not overlapped with each other in the Z-axis direction, and the first structure 310 is disposed on the second space 430.

Therefore, as shown below, it is possible to deform the metal film 12 and the conductor layer 50 by a minute pressing force of several tens of grams at the time of operation.

(Operation of the first and second supports)

5 is a schematic sectional view showing a state of a force applied to the first and second structures 310 and 410 when the point P on the first surface 110 is pressed downward in the Z axis direction by the operator h to be. A contour arrow in the figure schematically shows the magnitude of the force in the Z-axis direction (hereinafter simply referred to as " downward "). 14, the shapes of the metal film 12, the electrode substrate 20 and the like, and the elastic deformation of the first and second structures 310 and 410 are not shown. In the following description, even when the user performs the touch operation without conscious of the pressure, the input operation is collectively referred to as " pressurization " because a minute pressing force is actually added.

For example, when the point P on the first space portion 330p0 is pressed downward by the force F, the metal film 12 immediately below the point P is bent downward. Along with this, the first structures 310p1 and 310p2 adjacent to the first space portion 330p0 are subjected to the force Fl, and are elastically deformed in the Z-axis direction, thereby slightly reducing the thickness. Also, due to the warping of the metal film 12, the first structures 310p3 and 310p4 adjacent to the first structures 310p1 and 310p2 also receive a force F2 smaller than F1. Also, the force is applied to the electrode substrate 20 by the forces F 1 and F 2, and the first and second structures 310 p 1 and 310 p 2 are bent downward about the region below the first structures 310 p 1 and 310 p 2. As a result, the second structure 410p0 disposed between the first structures 310p1 and 310p2 receives the force F3 and is elastically deformed in the Z-axis direction, so that the thickness is slightly reduced. The second structure 410p1 disposed between the first structures 310p1 and 310p3 and the second structure 410p2 disposed between the first structures 310p2 and 310p4 also receive F4 smaller than F3.

Thus, the force can be transmitted in the thickness direction by the first and second structures 310 and 410, and the electrode substrate 20 can be easily deformed. The metal film 12 and the electrode substrate 20 are warped and affected by the pressing force in the in-plane direction (the direction parallel to the X axis direction and the Y axis direction), so that not only the area immediately below the operator h, It may also exert a force on the first and second structures 310 and 410 in the vicinity thereof.

The metal film 12 and the electrode substrate 20 can be easily deformed by the first and second space portions 330 and 430 in the above (1). The first and second structures 310 and 410 constituted by columns or the like can exert a high pressure on the electrode substrate 20 against the pressing force of the operator h so that the electrode substrate 20 can be efficiently bent have.

Since the first and second structures 310 and 410 are not overlapped with each other in the Z-axis direction, the first structure 310 may be disposed below the second space 430, The electrode substrate 20 can be easily bent.

Hereinafter, an example of the amount of change in the capacitance of the detection section 20s at the time of a specific operation is shown.

(Output example of detection unit)

Figs. 15A and 15B are schematic cross-sectional views showing the schematic shape of the input device 100 when the first surface 110 receives an operation by the operator h, Fig. 8 is a diagram showing an example of an output signal to be output. The bar graphs along the X-axis in Figs. 15A and 15B schematically show the amount of change of the electrostatic capacitance from the reference value in each detecting portion 20s. 15A shows a state in which the operator h presses on the first structure 310 (310a2), and FIG. 15B shows a state in which the operator h is positioned above the first space 330 (330b1) And FIG.

In Fig. 15A, the first structure 310a2 immediately under the operating position receives the most force, and the first structure 310a2 itself is elastically deformed and displaced downward. The detection portion 20sa2 immediately under the first structure 310a2 is displaced downward by the displacement. Thus, the detecting portion 20sa2 and the conductor layer 50 come close to each other through the second space portion 430a2. That is, the distance between the detecting portion 20sa2 and the metal film 12 slightly changes, and the distance from the conductive layer 50 greatly changes, thereby obtaining the capacitance change amount Ca2. On the other hand, the first structures 310a1 and 310a3 are slightly displaced downward by the influence of the bending of the metal film 12, and the amounts of change in capacitance in the detecting portions 20sa1 and 20sa3 become Ca1 and Ca3, respectively .

In the example shown in Fig. 15A, Ca2 is the largest, Ca1 and Ca3 are approximately the same, and Ca2 is smaller than Ca2. That is, as shown in Fig. 15A, the capacitance change amounts Ca1, Ca2, and Ca3 indicate the distribution of the acid type with Ca2 as the apex. In this case, the calculating unit 61 can calculate the center of gravity based on the ratio of Ca1, Ca2, and Ca3, and calculate the XY coordinate on the detecting unit 20sa2 as the operating position.

On the other hand, in Fig. 15B, the first structures 310b1 and 310b2 in the vicinity of the operating position are slightly elastically deformed and displaced downward due to the bending of the metal film 12. Fig. Due to the displacement, the electrode substrate 20 is bent and the detection portions 20sb1 and 20sb2 immediately below the first structures 310b1 and 310b2 are displaced downward. Thus, the detecting portions 20sb1 and 20sb2 and the conductor layer 50 come close to each other through the second spatial portions 430b1 and 430b2. That is, the detectors 20sb1 and 20sb2 slightly change the distance from the metal film 12 and change the distance from the conductor layer 50 to a relatively large value, thereby obtaining the capacitance change amounts Cb1 and Cb2, respectively.

In the example shown in Fig. 15B, Cb1 and Cb2 are substantially the same. Thereby, the calculating section 61 can calculate the XY coordinates between the detecting sections 20sb1 and 20sb2 as the operating positions.

As described above, according to the present embodiment, in the point that both of the thicknesses of the detection portion 20s and the metal film 12, and the thicknesses of the detection portion 20s and the conductor layer 50 are variable by the pressing force, The amount of change in the capacitance of the capacitor can be increased. This makes it possible to increase the detection sensitivity of the input operation.

It is also possible to calculate the XY coordinates of the operation position regardless of whether the operation position on the flexible display 11 is above the first structure 310 or on the first space 330. That is, not only the detection section 20s immediately below the operation position but also the detection section 20s in the vicinity of the operation position as viewed in the Z-axis direction, the influence of the pressing force is widened by the metal film 12 in the in- . This makes it possible to suppress deviation in detection accuracy within the first surface 110 and to maintain high detection accuracy on the entire surface of the first surface 110. [

(Shield layer)

By the way, the flexible display 11 constituting the operating member 10 is driven and controlled by the controller 710 as described above. The flexible display 11 displays an image by controlling the light emission of a plurality of pixels arranged in a matrix, typically in a plane. At this time, electronic noise at a level that can not be ignored in the sensor device 1 may be generated from the pixel circuit for driving the individual pixels.

The sensor device 1 is configured to detect the position of the input operating face 1 (the first operating face) based on the change in the capacitance of the detecting portion 20s based on the change in the opposing distance to the metal film 12 and the conductor layer 50, (Pressing force) of the operating surface and the operating position (surface 110) Therefore, when the electronic noise enters the detection section 20s, the detection accuracy of the capacitance change amount of the detection section 20s is lowered, and the problem becomes more serious as the capacitance change amount becomes smaller.

On the other hand, it is possible to secure a certain shielding function by the metal film 12 disposed between the detecting portions 20s and the flexible display 11. [ However, since the metal film 12 needs to be formed so as to be deformable so as to follow the input operation on the input operating surface (first surface 110), the thickness of the metal film 12 It can not necessarily be ensured. In such an input device that detects the input operation in an electrostatic manner, in order to improve the detection accuracy, a structure capable of sufficiently protecting the detection portion 20s from electromagnetic noise is required.

Therefore, the sensor device 1 of the present embodiment has the shield layer S1 for electronically shielding the electrode line constituting the detection portion 20s from the noise source. The shield layer S1 is formed on the electrode substrate 20, as shown in Figs.

The shield layer S1 is composed of a conductor film formed on the first base material 211 for supporting a plurality of first electrode lines 210. [ In the present embodiment, the shielding layer S1 is formed on the first substrate 211 on the same plane as the plurality of first electrode lines 210. [ Thereby, the shield layer S1 can be formed without separately forming a member for supporting the shield layer S1. Further, the shield layer S1 is made of the same material as the plurality of first electrode lines 210, so that the first electrode line and the shield layer S1 can be formed in the same process.

Fig. 7 is a plan view of the principal portion of the electrode substrate 20, Fig. 8 is a plan view of the principal portion of the first wiring substrate 21, and Fig. 9 is a plan view of the main portion of the second wiring substrate 22.

In the illustrated example, the first and second electrode lines 210 and 220 are each formed of an electrode line group including a plurality of electrode fine lines, but the present invention is not limited thereto, and the first and second electrode lines 210 and 220 may be formed of a single wide electrode line .

In the present embodiment, the shield layer S1 has a plurality of electrode lines S11 (third electrode lines) disposed between the plurality of first electrode lines 210, respectively. The plurality of electrode lines S11 are arranged at a predetermined interval from the first electrode lines 210. [ The plurality of electrode lines S11 are formed to have the same width and the length of each of the electrode lines S11 is formed to be substantially equal to the length of the first electrode lines 210. [ The plurality of electrode lines S11 are connected to a predetermined reference potential (for example, a ground potential) in the same manner as the metal film 12 and the conductor layer 50, respectively.

The plurality of second electrode lines 220 can be disposed between the plurality of detection portions 20s (opposing regions of the first electrode lines 210 and the second electrode lines 220) as viewed from the flexible display 11 The interconnecting wiring region 220b to be connected is shielded by the shielding layer S1 (electrode line S11). Thereby, the wiring region 220b is electronically shielded from the flexible display 11.

Each of the electrode lines S11 may be formed by a printing method such as screen printing, gravure offset printing, or inkjet printing using a conductive paste or the like, or may be formed by a printing method such as a metal foil or a metal layer, a material of a transparent conductive film such as ITO, May be formed by a patterning method using a technique. The thickness of each of the electrode lines S11 is not particularly limited and is typically formed to have a thickness equivalent to that of the first electrode lines 210 (e.g., several tens to several tens of micrometers).

Each of the electrode lines S11 is not limited to the example formed by the same process as the first electrode line 210. [ Each of the electrode lines S11 may be formed of a different material from the first electrode line 210 or may be formed to have a thickness larger than the thickness of the first electrode line 210. [

The region where the wiring region 220b is shielded by the shielding layer S1 is adjusted by the width of each of the electrode lines S11 constituting the shielding layer S1. Since the shield layer S1 is formed on the same plane as the first electrode line 210, a part of the wiring region 220b is shielded by the shield layer S1.

In order to shield all the regions of the wiring region 220b with the shield layer S1, for example, an insulating film covering the first electrode line 210 may be formed separately and a shield layer may be formed on the insulating film. At this time, the shield layer may cover at least a part of the wiring region of the first electrode line 210 that connects the plurality of detecting portions 20s. In this case, the shield layer may be composed of a lattice-shaped conductor film which is an opening in a region facing the plurality of detecting portions 20s.

Fig. 10A is a plan view schematically showing the entire first wiring board 21. Fig. The shield layer S1 further includes a wiring portion S12 connecting the plurality of electrode lines S11 to each other. The wiring portion S12 is connected to the plurality of electrode lines S11 at the rim portion 21a on one long side of the first wiring board 21, respectively. The wiring portion S12 is wired to the rim portion 21c on the long side of the other side through the rim portion 21b on one side of the first wiring substrate 21. A lead line S12a connected to the wiring portion S12 is formed in the rim portion 21c and is connected to a predetermined reference potential (ground potential) through the control portion 60. [ As a result, the plurality of electrode lines S11 disposed between the plurality of first electrode lines 210 can be commonly connected to the ground potential.

A lead wire 210a connected to each of the plurality of first electrode wires 210 is further formed in the rim portion 21c of the first wiring board 21 and electrically connected to each of the first electrode wires 210a through these lead wires 210a. (210) is connected to the control unit (60).

Although not shown, the second wiring substrate 22 has lead wires connected to each of the plurality of second electrode lines 220, and these lead wires are connected to the second wiring board 22, And is formed on the rim portion. Therefore, in order to protect at least a part of the lead wires of these second electrode lines 220 (the outer peripheral wiring portions formed on the outer side of the detection region where the plurality of detection portions 20s are formed) to protect them from electromagnetic noise, It is also possible to shield the lead wire in the shield layer S formed on the first wiring board 21 as shown in the figure.

10B is a plan view of a first wiring substrate showing a modification of the configuration of the shield layer S1. The shield layer S1 further includes a strip-shaped portion S11b formed on the rim portion 21b of the first wiring board 21. [ The strip-shaped portion S11b is connected between the wiring portion S12 and the lead wire S12a and has an area between the edge portion of the electrode line 210b located on the most rim portion 21b side of the plurality of first electrode lines 210 And is coated in a solid shape. This makes it possible to protect the outer wiring portion of the second electrode line 220 immediately below the strip-shaped portion S11b from electromagnetic noise.

Here, the flexible display 11 is one of the devices that influence the detection sensitivity of the sensor device 1. [ For example, when the metal film 12, the conductor layer 50, and the shield layer S1 are connected only to the ground of the control unit 60, there is a possibility that the flexible display 11 affects the ground potential of the control unit 60 There is a possibility that the electromagnetic shielding effect can not be sufficiently exhibited. Therefore, by connecting the metal film 12 and the conductor layer 50 and the shield layer S1 to the ground of the controller 710 to which the flexible display 11 is connected, it is possible to maintain the ground potential at a more stable level and improve the electromagnetic shielding effect . The electromagnetic shielding effect can also be improved by connecting the metal film 12, the conductor layer 50, and the shield layer S1 at a larger number of contact points.

≪ Second Embodiment >

Next, a second embodiment of the present technology will be described.

In the above-described first embodiment, a plurality of first electrode lines and a plurality of second electrode lines are spaced apart from each other in the thickness direction of the electrode substrate, and a plurality of detecting portions (capacitance sensors) are formed in the intersecting region of these electrode lines. In contrast, in the present embodiment, the plurality of first electrode lines and the plurality of second electrode lines are spaced apart from each other in the plane of the electrode substrate, and a plurality of detecting portions (capacitance sensors) are formed in the regions opposed to the respective electrode lines.

11A is a schematic cross-sectional view of the input device 100C according to the second embodiment of the present technology, and FIG. 11B is a cross-sectional view showing an enlarged main part of the input device 100C. In the present embodiment, in the point that the electrode substrate 20C electrostatically detects a change in the distance between the metal film 12 and the conductor layer 50 by the amount of change in capacitive coupling in the XY plane, 1 embodiment. That is, the Y electrode 220C has a facing portion facing the in-plane direction of the X electrode 210C and the electrode substrate 20C, and the facing portion constitutes the detecting portion 20Cs.

The electrode substrate 20C has a substrate 211C on which a plurality of first electrode lines (X electrodes) 210C and a plurality of second electrode lines (Y electrodes) 220C are disposed. The plurality of X electrodes 210C, And the Y electrode 220C are arranged on the same plane.

An example of the configuration of the X electrode (first electrode line) 210C and the Y electrode (second electrode line) 220C will be described with reference to Figs. 12A and 12B. Here, each of the X electrode 210C and each Y electrode 220C includes a plurality of comb-shaped unit electrode bodies (first unit electrode bodies) 210m and a plurality of unit electrode bodies (second unit electrode bodies) And one unit electrode member 210m and one unit electrode member 220m form the detection units 20Cs.

As shown in Fig. 12A, the X electrode 210C has a plurality of unit electrode members 210m, an electrode line portion 210p, and a plurality of connection portions 210z. The electrode wire portion 210p extends in the Y-axis direction. The plurality of unit electrode members 210m are arranged at regular intervals in the Y-axis direction. The electrode wire portion 210p and the unit electrode member 210m are spaced apart from each other by a predetermined distance, and they are connected to each other by a connecting portion 210z.

The unit electrode member 210m has a comb shape as a whole as described above. Specifically, the unit electrode member 210m includes a plurality of sub-electrodes 210w and a connection portion 210y. The plurality of sub-electrodes 210w extend in the X-axis direction. The adjacent sub-electrodes 210w are spaced apart from each other by a predetermined distance. One end of the plurality of sub-electrodes 210w is connected to a connection portion 210y extending in the X-axis direction.

As shown in Fig. 12B, the Y electrode 220C includes a plurality of unit electrode members 220m, an electrode line portion 220p, and a plurality of connection portions 220z. The electrode wire portion 220p extends in the X-axis direction. The plurality of unit electrode members 220m are arranged at regular intervals in the X-axis direction. The electrode wire portion 220p and the unit electrode body 220m are arranged at a predetermined distance from each other and are connected to each other by a connecting portion 220z. Further, the connecting portion 220z may be omitted, and the unit electrode body 220m may be directly formed on the electrode wire portion 220p.

The unit electrode member 220m has a comb shape as a whole as described above. Specifically, the unit electrode member 220m includes a plurality of sub-electrodes 220w and a connection portion 220y. The plurality of sub-electrodes 220w extend in the X-axis direction. The adjacent sub-electrodes 220w are spaced apart from each other by a predetermined distance. One end of the plurality of sub-electrodes 220w is connected to a connecting portion 220y extending in the Y-axis direction.

As shown in Fig. 13A, each detecting portion 20Cs is formed in a region where the unit electrode bodies 210m and the unit electrode bodies 220m are combined with each other. A plurality of sub electrodes 210w of the unit electrode body 210m and a plurality of sub electrodes 220w of the unit electrode body 220m are alternately arranged in the Y axis direction. That is, the sub electrodes 210w and 220w are disposed so as to face each other in the in-plane direction (for example, the Y axis direction) of the electrode substrate 20C.

13B is a sectional view taken along the line A-A of Fig. 13A. The Y electrode 220C is formed so as to cross the X electrode 210C, but is formed on the same plane as the X electrode 210C, as in the first embodiment. Therefore, as shown in FIG. 13B, the region where the X electrode 210C and the Y electrode 220C intersect is configured so that the X electrodes 210C and the Y electrodes 220C do not directly contact each other. That is, the insulating layer 220r is formed on the electrode line portion 210p of the X electrode 210C and the electrode line portion 220p of the Y electrode 220C. A jumper wiring portion 220q is formed in a region where the X electrode 210C and the Y electrode 220C intersect with each other across the insulating layer 220r. The electrode wire portion 220p is connected to the jumper wire portion 220q.

Fig. 14 is a schematic cross-sectional view for explaining the configuration of the detection unit 20Cs according to the present embodiment. In the example shown in the figure, the sub electrode 210w1 and the sub electrode 220w1, the sub electrode 220w1 and the sub electrode 210w2, the sub electrode 210w2 and the sub electrode 220w2, The sub electrode 220w2 and the sub electrode 210w3 and the sub electrode 210w3 and the sub electrode 220w3 are capacitively coupled. That is, the substrate 211C is used as a dielectric layer, and the capacitances Cc11, Cc12, Cc13, Cc14, and Cc15 between the sub-electrodes are respectively set between the first and second And variable in accordance with capacitive coupling with the electrode lines 210C and 220C.

With this configuration, the second base material and the adhesive layer of the electrode substrate are unnecessary, contributing to the thinning of the input device 100C. Further, the distance between the sub-electrodes where the plurality of sub-electrodes are capacitively coupled and capacitively coupled can be narrowed. This makes it possible to increase the overall capacity coupling amount of the input device 100C and to improve the detection sensitivity.

The sensor device of the present embodiment also has a shield layer S2 for electronically shielding the electrode line constituting the detection portion 20Cs from the noise source. The shield layer S2 is formed on the electrode substrate 20C as shown in Figs. 15A to 15C.

Fig. 15A is a plan view of the principal part of the electrode substrate 20C, Fig. 15B is a sectional view taken along line B1-B1 in Fig. 15A, and Fig. 15C is a cross- Fig.

15A, the shield layer S2 includes a first conductor film S21 covering the electrode line portion 210p of the first electrode line 210C and a second conductor film S21 covering the electrode line portion 220p of the second electrode line 220C And a second conductor film S22 covering at least a part thereof. These electrode line portions 210p and 220p correspond to the wiring regions of the first and second electrode lines 210 and 220 for connecting between the plurality of detection portions 20Cs.

The shield layer S2 has an insulating film disposed between the first conductor film S21 and the electrode line portion 210p and an insulating film disposed between the second conductor film S22 and the electrode line portion 220p. In the present embodiment, each of the insulating films corresponds to the insulating layer 220r covering the electrode line portions 210p and 220p.

That is, in this embodiment, the shield layer S2 is formed on the same plane as the jumper wiring portion 220q and the insulating layer 220r. The first and second conductor films S21 and S22 are formed on the same plane as the jumper wiring portion 220q. Therefore, it is possible to form the first and second conductor films S21, S22 and the jumper wiring portion 220q in the same process by constituting the first and second conductor films S21, S22 with the same material as the jumper wiring portion 220q . That is, in this example, after the first electrode line 210C and the second electrode line 220C are formed, the jumper wiring portion 220q and the jumper wiring portion 220q are formed at intersections of the first electrode line 210C and the second electrode line 220C. The insulating layer 220r existing between the one-electrode lines 210C and the insulating layer 220r covering the first electrode lines 210C and the second electrode lines 220C can be formed at the same time. Further, after that, the jumper wiring portion 220q and the first and second conductor films S21 and S22 described above can be formed at the same time. The forming method is not particularly limited, and typically a printing method such as screen printing is applicable.

In order to avoid electrical contact between the first and second conductor films S21 and S22 and the jumper wiring portion 220q, the shield layer S2 has an opening S20 for exposing the jumper wiring portion 220q. However, the present invention is not limited to this, and the shielding effect may be improved by covering the jumper wiring portion 220q with the shielding layer S. In this case, the configuration of the shield layer S3 shown in Figs. 16A to 16C can be adopted.

FIG. 16A is a plan view of the principal portion of the electrode substrate 20C, FIG. 16B is a sectional view taken along the line B2-B2 in FIG. 16A, and FIG. 16C is a sectional view taken along the line C2- Fig.

In this example, after the jumper wiring portion 220q is formed, the insulating film 220r1 covering the jumper wiring portion 220q is formed. On the insulating film 220r1, the first and second conductor films S21, S22 are formed. That is, the shield layer S3 in this example has the first and second conductor films S21 and S22, and the insulating film 220r1 disposed between the conductor films S21 and S22 and the electrode wire portions 210p and 220p.

Although the embodiments of the present technology have been described above, the present technology is not limited to the above-described embodiments, and it goes without saying that various modifications can be made within the scope of the present invention.

For example, in the first embodiment described above, the first electrode line 210 is composed of a straight line or an electrode line group, but the present invention is not limited to this, and various shapes of electrodes can be employed.

For example, as shown in Fig. 17, the first electrode lines 210D may each have a plurality of unit electrode members 210Dm. The unit electrode member 210Dm is formed in an opposing region crossing the second electrode line, and constitutes a capacitance sensor. Although the unit electrode 210Dm of the X electrode 210D is composed of a plurality of sub electrodes, it may be composed of a plate-like solid electrode.

The configuration of the unit electrode body is not limited to the above example, and various types of units as shown in Figs. 18A to 18P can be employed, for example.

Similarly to the plurality of second electrode lines 220, as shown in FIG. 19A, an electrode line 220D composed of a plurality of electrode line groups including a plurality of electrode thin lines may be employed, and as shown in FIG. 19B Similarly, an electrode line 220E having a plurality of unit electrode bodies may be employed. Alternatively, as shown in Fig. 19C, each electrode may be formed of a single electrode line 220F.

The shield layers S1 and S2 for shielding the detection section 20s from electromagnetic noise are disposed between the flexible display 11 and the detection section 20s. However, when the noise source is on the conductor layer 50 side A wiring board such as a driving circuit of an input device is provided), the shield layer may be disposed on the back surface side of the electrode substrate.

In each of the embodiments described above, the structure in which the electrode substrate 20 is supported by the pair of supports 30 and 40 has been described, but either one of them may be used. 20 shows a configuration example of an input device in which the second support body 40 is omitted.

In the above-described embodiments, the input device including the first and second support members 30 and 40 has been described as an example. However, the input device provided with only one of the support members or the support member This technique is also applicable to input devices.

Further, although the flexible display 11 has been described as an example of the operation member 10, the present invention is not limited thereto. For example, the present invention is also applicable to a keyboard having a key arrangement.

The present technology can also take the following configuration.

(1) A plurality of capacitive sensors each having a plurality of first electrode lines and a plurality of second electrode lines and formed respectively in a plurality of opposed regions of the plurality of first electrode lines and the plurality of second electrode lines are arranged in a matrix Electrode substrate,

And a shield layer formed on the electrode substrate and including a conductor film for shielding at least a part of wiring regions of the plurality of second electrode lines which are connected to each other between the plurality of opposed regions.

(2) The sensor device according to (1)

The plurality of first electrode lines and the plurality of second electrode lines are arranged apart from each other in the thickness direction of the electrode substrate,

And the plurality of capacitance sensors are respectively formed at intersecting regions of the plurality of first electrode lines and the plurality of second electrode lines.

(3) The sensor device according to (2)

Wherein:

A first insulating layer for supporting the plurality of first electrode lines,

And a second insulating layer for supporting the plurality of second electrode lines,

Wherein the shield layer is formed on the first insulating layer.

(4) The sensor device according to (3)

Wherein the shield layer is formed on the same plane as the plurality of first electrode lines.

(5) The sensor device according to any one of (2) to (4) above,

Wherein the conductor film is made of the same material as the plurality of first electrode lines.

(6) The sensor device according to any one of (2) to (5) above,

Wherein the conductor film includes a plurality of third electrode lines disposed between each of the plurality of first electrode lines.

(7) The sensor device according to (6)

And the conductor film further includes a wiring portion connecting the plurality of third electrode lines to each other.

(8) The sensor device according to (1)

Wherein the plurality of capacitance sensors are formed respectively in opposing areas of the plurality of first electrode lines and the plurality of second electrode lines facing each other in the in-plane direction of the electrode substrate,

And the shield layer further includes an insulating film disposed between the conductor film and the wiring region.

(9) The sensor device according to (8)

Wherein the electrode substrate has a plurality of jumper wiring portions formed at intersections of the plurality of first electrode lines and the plurality of second electrode lines.

(10) The sensor device according to (9)

Wherein the conductor film is formed on the same plane as the plurality of jumper wiring portions.

(11) The sensor device according to (9)

And the shield layer covers the plurality of jumper wiring portions.

(12) The sensor device according to any one of (9) to (11)

Wherein the conductor film is made of the same material as the plurality of jumper wiring portions.

(13) The sensor device according to any one of (1) to (12) above,

Wherein the shield layer further shields at least a wiring region of the plurality of first electrode lines which are in contact with each other between the plurality of opposing regions.

(14) The sensor device according to any one of (1) to (13) above,

Wherein the plurality of second electrode lines have an outer peripheral wiring portion formed outside the detection region in which the plurality of capacitive sensors arranged in a matrix are formed,

And the shield layer further shields at least part of the outer wiring portion.

(15) The sensor device according to any one of (1) to (14) above,

A deformable first conductor layer disposed opposite to one main surface of the electrode substrate,

And a first support body having a plurality of first structures for connecting between the first conductor layer and the electrode substrate.

(16) The sensor device according to (15)

A second conductor layer disposed opposite to the other main surface of the electrode substrate,

And a second support body having a plurality of second structures for connecting between the second conductor layer and the electrode substrate.

1: Sensor device
11: Flexible display
20, 20C: electrode substrate
20s, 20Cs:
30: first support
40: second support
50: conductor layer
60:
100: input device
210, and 210C: a first electrode line
220, 220C: a second electrode line
220q: jumper wiring part
310: first structure
410: second structure
S1, S2: shield layer
S21, S22:

Claims (18)

A plurality of first electrode lines, a plurality of second electrode lines, and a plurality of capacitive sensors respectively formed in a plurality of opposing regions of the plurality of first electrode lines and the plurality of second electrode lines are arranged in a matrix, and,
And a shield layer formed on the electrode substrate and including a conductor film for shielding at least a part of wiring regions of the plurality of second electrode lines which are connected to each other between the plurality of opposed regions. The method according to claim 1,
The plurality of first electrode lines and the plurality of second electrode lines are arranged apart from each other in the thickness direction of the electrode substrate,
And the plurality of capacitance sensors are respectively formed at intersecting regions of the plurality of first electrode lines and the plurality of second electrode lines. 3. The method of claim 2,
Wherein:
A first insulating layer for supporting the plurality of first electrode lines,
And a second insulating layer for supporting the plurality of second electrode lines,
Wherein the shield layer is formed on the first insulating layer. The method of claim 3,
Wherein the shield layer is formed on the same plane as the plurality of first electrode lines. 3. The method of claim 2,
Wherein the conductor film is made of the same material as the plurality of first electrode lines. 3. The method of claim 2,
Wherein the conductor film includes a plurality of third electrode lines disposed between each of the plurality of first electrode lines. The method according to claim 6,
And the conductor film further includes a wiring portion connecting the plurality of third electrode lines to each other. The method according to claim 1,
Wherein the plurality of capacitance sensors are formed respectively in opposing areas of the plurality of first electrode lines and the plurality of second electrode lines facing each other in the in-plane direction of the electrode substrate,
And the shield layer further includes an insulating film disposed between the conductor film and the wiring region. 9. The method of claim 8,
Wherein the electrode substrate has a plurality of jumper wiring portions formed at intersections of the plurality of first electrode lines and the plurality of second electrode lines. 10. The method of claim 9,
Wherein the conductor film is formed on the same plane as the plurality of jumper wiring portions. 10. The method of claim 9,
And the shield layer covers the plurality of jumper wiring portions. 10. The method of claim 9,
Wherein the conductor film is made of the same material as the plurality of jumper wiring portions. The method according to claim 1,
Wherein the shield layer further shields at least a wiring region of the plurality of first electrode lines which are in communication with each other between the plurality of opposing regions. The method according to claim 1,
Wherein the plurality of second electrode lines have an outer peripheral wiring portion formed outside the detection region in which the plurality of capacitive sensors arranged in a matrix are formed,
And the shield layer further shields at least part of the outer wiring portion. The method according to claim 1,
A deformable first conductor layer disposed opposite to one main surface of the electrode substrate,
And a first support body having a plurality of first structures for connecting between the first conductor layer and the electrode substrate. 16. The method of claim 15,
A second conductor layer disposed opposite to the other main surface of the electrode substrate,
And a second support body having a plurality of second structures for connecting between the second conductor layer and the electrode substrate. An operating member having an input operating surface;
And a plurality of capacitive sensors each having a plurality of first electrode lines and a plurality of second electrode lines and formed respectively in a plurality of opposing regions of the plurality of first electrode lines and the plurality of second electrode lines are arranged in a matrix, and,
And a shield layer formed between the operating member and the electrode substrate and shielding at least a part of wiring regions of the plurality of second electrode lines which are in contact with each other between the plurality of opposed regions. A display element having an input operation surface,
And a plurality of capacitive sensors each having a plurality of first electrode lines and a plurality of second electrode lines and formed respectively in a plurality of opposing regions of the plurality of first electrode lines and the plurality of second electrode lines are arranged in a matrix, and,
And a shield layer formed between the display element and the electrode substrate and shielding at least a part of wiring regions of the plurality of second electrode lines which are in contact with each other between the plurality of opposing regions.

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