TWI612259B - Heating apparatus and heating method - Google Patents

Heating apparatus and heating method Download PDF

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TWI612259B
TWI612259B TW105127790A TW105127790A TWI612259B TW I612259 B TWI612259 B TW I612259B TW 105127790 A TW105127790 A TW 105127790A TW 105127790 A TW105127790 A TW 105127790A TW I612259 B TWI612259 B TW I612259B
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heating
workpiece
sensing
monitoring
sensing element
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TW105127790A
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TW201730483A (en
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宋兆峰
陳逸書
陳長營
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財團法人工業技術研究院
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02BCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B30/00Energy efficient heating, ventilation or air conditioning [HVAC]
    • Y02B30/70Efficient control or regulation technologies, e.g. for control of refrigerant flow, motor or heating

Abstract

一種加熱設備,適於加熱位於一加熱區域內的一工件。所述加熱設備包括一加熱元件、一感測元件以及一控制器。加熱元件適於提供一熱輻射能量至加熱區域內。感測元件被配置於加熱區域內的一感測位置,用以監測感測位置的熱輻射能量。感測元件與工件相隔,且感測元件對於熱輻射能量的反應時間小於或等於100毫秒。此外,控制器用於接收感測元件的監測結果,並且依據監測結果來調整加熱工件的一製程參數。本揭露更提出適用於此加熱設備的加熱方法。A heating device adapted to heat a workpiece located in a heated region. The heating device includes a heating element, a sensing element, and a controller. The heating element is adapted to provide a thermal radiant energy into the heating zone. The sensing element is disposed at a sensing location within the heating zone for monitoring thermal radiation energy at the sensing location. The sensing element is spaced apart from the workpiece and the sensing element has a response time to the thermal radiation energy of less than or equal to 100 milliseconds. In addition, the controller is configured to receive the monitoring result of the sensing component, and adjust a process parameter of the heated workpiece according to the monitoring result. The present disclosure further proposes a heating method suitable for use in such a heating apparatus.

Description

加熱設備以及加熱方法Heating device and heating method

本揭露是有關於一種加熱製程以及加熱方法。The present disclosure relates to a heating process and a heating method.

加熱製程被廣泛地應用在工業製造上,藉以調制製程環境或改變產物特性等。並且,隨著製程技術的發展與革新,更衍生出對加熱製程的效率改善、線上監測、即時回饋等需求。The heating process is widely used in industrial manufacturing to modulate the process environment or change product characteristics. Moreover, with the development and innovation of process technology, the demand for efficiency improvement, online monitoring, and instant feedback for heating processes has been derived.

以卷對卷(Roll-to-Roll, R2R)製造技術為例,因其具有連續、大量生產等特性,而被應用於電子產品的製造。在卷對卷製程中,使用烘烤設備來加熱塗層,以去除塗層內之溶劑,固化或乾燥塗層。目前,可使用例如近紅外線(Near-infrared, NIR)加熱器等快速昇降溫烘烤設備來取代傳統的烘烤設備。相較於傳統以熱對流或熱傳導方式來傳遞熱能的烘烤設備,近紅外線加熱器以熱輻射(radiation)的方式傳遞熱能,因此可使被烘烤的塗層快速升溫而被固化。Taking Roll-to-Roll (R2R) manufacturing technology as an example, it is applied to the manufacture of electronic products because of its continuous and mass production characteristics. In a roll-to-roll process, a baking apparatus is used to heat the coating to remove solvent from the coating, cure or dry the coating. At present, a conventional fast-bake baking apparatus such as a near-infrared (NIR) heater can be used instead of the conventional baking apparatus. Compared to conventional baking equipment that transfers heat energy by heat convection or heat conduction, the near-infrared heater transfers heat energy in a thermal radiation manner, thereby allowing the baked coating to rapidly heat up and be solidified.

然而,受到加熱時的高溫或其他製程條件的限制,現有針對此類加熱設備的監測只能依據輸入功率來推測工件實際的受熱情況。換言之,在無法得知工件實際受熱情形的情況下,由於高能量輸出強度使加熱源的穩定性較難掌控,往往需要延長加熱時間與提高加熱強度來確保工件確實被烘烤。另一方面,必須對已產出的產品特性進行檢測,才能回饋並調整製程參數。如此,將難以掌握製程穩定性與再現性,影響產品良率,也導致熱能耗損。However, due to the high temperature or other process conditions during heating, the existing monitoring of such heating equipment can only infer the actual heating of the workpiece based on the input power. In other words, in the case where the actual heating condition of the workpiece cannot be known, since the high energy output intensity makes the stability of the heating source difficult to control, it is often necessary to extend the heating time and increase the heating intensity to ensure that the workpiece is actually baked. On the other hand, the characteristics of the products that have been produced must be tested in order to feed back and adjust the process parameters. In this way, it will be difficult to grasp process stability and reproducibility, affect product yield, and also cause thermal energy loss.

本揭露提供一種加熱設備,適於對加熱區域內的工件受熱情形進行實時監測,並且即時回饋、調整加熱該工件的製程參數,以提高製程穩定性與再現性,減少熱能耗損,並且改善產品良率。The disclosure provides a heating device, which is suitable for real-time monitoring of the heating condition of a workpiece in a heating area, and instantly feedbacks and adjusts process parameters for heating the workpiece to improve process stability and reproducibility, reduce thermal energy loss, and improve product quality. rate.

本揭露的加熱設備適於加熱位於一加熱區域內的一工件。所述加熱設備包括一加熱元件、一感測元件以及一控制器。加熱元件適於提供一熱輻射能量至所述加熱區域內。感測元件被配置於所述加熱區域內的一感測位置,用以監測感測位置的熱輻射能量。所述感測元件與工件相隔一距離,所述距離不為零,且所述感測元件對於熱輻射能量的反應時間小於或等於100毫秒。此外,控制器用於接收所述感測元件的監測結果,並且依據監測結果來調整加熱所述工件的一製程參數。The heating apparatus of the present disclosure is adapted to heat a workpiece located in a heated area. The heating device includes a heating element, a sensing element, and a controller. The heating element is adapted to provide a thermal radiant energy into the heating zone. The sensing element is disposed at a sensing location within the heating zone for monitoring thermal radiation energy at the sensing location. The sensing element is spaced from the workpiece by a distance that is not zero and the response time of the sensing element for thermal radiant energy is less than or equal to 100 milliseconds. In addition, the controller is configured to receive the monitoring result of the sensing component, and adjust a process parameter for heating the workpiece according to the monitoring result.

本揭露提供一種加熱方法,適於對加熱區域內的工件受熱情形進行實時監測,並且即時回饋、調整加熱該工件的製程參數,以提高製程穩定性與再現性,減少熱能耗損,並且改善產品良率。The disclosure provides a heating method, which is suitable for real-time monitoring of the heating condition of a workpiece in a heating area, and instantly feedbacks and adjusts process parameters for heating the workpiece to improve process stability and reproducibility, reduce thermal energy loss, and improve product quality. rate.

本揭露的加熱方法適於加熱位於一加熱區域內的一工件。首先,提供一熱輻射能量至所述加熱區域內。並且,使用一感測元件在所述加熱區域內的一感測位置上監測熱輻射能量。所述感測元件與所述工件相隔一距離,所述距離不為零,且所述感測元件對於熱輻射能量的反應時間小於或等於100毫秒。之後,依據所述監測結果來調整加熱所述工件的一製程參數。The heating method of the present disclosure is adapted to heat a workpiece located in a heated region. First, a thermal radiant energy is provided into the heating zone. Also, a sensing element is used to monitor thermal radiant energy at a sensing location within the heating zone. The sensing element is spaced from the workpiece by a distance that is not zero and the response time of the sensing element to thermal radiant energy is less than or equal to 100 milliseconds. Thereafter, a process parameter for heating the workpiece is adjusted according to the monitoring result.

為讓本揭露的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。The above described features and advantages of the present invention will be more apparent from the following description.

下文的多個實施例將以卷對卷技術中的烘烤製程為例說明本揭露的技術方案。應理解的是,本技術領域中具有通常知識者在參照相關實施例之後,當可在合理的範圍內將本揭露的技術方案應用於其他有相同或類似加熱需求的製程環境。此外,下列多個實施例中將以類似或相同的元件符號來表示相同或類似的元件,並且在合理的情況下省略對所述相同或類似元件的介紹。The following embodiments will illustrate the technical solution of the present disclosure by taking the baking process in the roll-to-roll technology as an example. It should be understood that those skilled in the art, after referring to the related embodiments, may apply the disclosed embodiments to other process environments having the same or similar heating requirements within a reasonable range. In the following various embodiments, the same or similar elements are denoted by the same or similar elements, and the description of the same or similar elements is omitted as appropriate.

圖1是使用本揭露之一實施例的加熱設備來加熱工件的示意圖。圖2是依據本揭露之一實施例的加熱方法的流程圖。如圖1所示,本實施例的加熱設備100例如是用於卷對卷製程的烘烤設備。在卷對卷製程中,輸送裝置190的放捲單元192與收捲單元194帶動傳輸基板196前進。傳輸基板196上方設置有例如塗佈機180或其他可能的加工設備。塗佈機180在傳輸基板196上形成塗層198。做為受熱工件的塗層198被加熱設備100加熱後,塗層198內的溶劑將會蒸發,而使得塗層198固化。1 is a schematic view of a heating apparatus using an embodiment of the present disclosure to heat a workpiece. 2 is a flow chart of a heating method in accordance with an embodiment of the present disclosure. As shown in Fig. 1, the heating apparatus 100 of the present embodiment is, for example, a baking apparatus for a roll-to-roll process. In the roll-to-roll process, the unwinding unit 192 and the winding unit 194 of the conveying device 190 drive the transfer substrate 196 to advance. Above the transfer substrate 196 is disposed, for example, a coater 180 or other possible processing equipment. The coater 180 forms a coating 198 on the transfer substrate 196. After the coating 198 as a heated workpiece is heated by the heating apparatus 100, the solvent within the coating 198 will evaporate, causing the coating 198 to cure.

具體而言,加熱設備100包括加熱元件110、感測元件120以及控制器130。在此,加熱元件110例如是近紅外線加熱器,用以加熱塗層198,以移除塗層198內的溶劑。在本實施例中,加熱元件110的輸出波長例如是介於400nm~1500nm之間,輸出功率例如是介於50~1000kw/m2 之間,而加熱溫度範圍例如是介於80~250℃之間。Specifically, the heating device 100 includes a heating element 110, a sensing element 120, and a controller 130. Here, the heating element 110 is, for example, a near infrared heater for heating the coating 198 to remove the solvent within the coating 198. In this embodiment, the output wavelength of the heating element 110 is, for example, between 400 nm and 1500 nm, and the output power is, for example, between 50 and 1000 kw/m 2 , and the heating temperature range is, for example, between 80 and 250 ° C. between.

此外,本實施例可選擇塗層198與傳輸基板196的材料,藉由不同材料對特定波長的熱輻射能量有不同的吸收率來提高加熱效率,並且保護傳輸基板196不受到熱輻射能量的破壞。舉例而言,塗層198例如是含有銀的高分子材料,而傳輸基板196例如是含有聚對苯二甲酸乙二酯(Polyethylene terephthalate,PET)、聚萘二甲酸乙二醇酯(polyethylene naphthalate, PEN)等的高分子材料。傳輸基板196對於近紅外線的穿透率大於80%。如此,藉由塗層198對於近紅外線吸收率高,而傳輸基板196對於近紅外線吸收率低的特性,達成加熱(烘烤)目的,且不會傷害傳輸基板196。In addition, the present embodiment can select the material of the coating 198 and the transmission substrate 196 to improve the heating efficiency by different absorption rates of heat radiation energy of a specific wavelength by different materials, and protect the transmission substrate 196 from thermal radiation energy. . For example, the coating layer 198 is, for example, a polymer material containing silver, and the transmission substrate 196 is, for example, a polyethylene terephthalate (PET) or a polyethylene naphthalate (polyethylene naphthalate). Polymer materials such as PEN). The transmission substrate 196 has a transmittance for near infrared rays of more than 80%. As described above, since the coating layer 198 has a high absorption rate for near-infrared rays, and the transfer substrate 196 has a low absorption ratio of near-infrared rays, heating (baking) is achieved without damaging the transfer substrate 196.

在本實施例中,加熱元件110提供熱輻射能量至加熱區域R1內(步驟210)。當傳輸基板196傳輸塗層198通過加熱區域R1時,加熱動作可在極短時間(例如2秒)內完成。由於加熱時間極短,本實施例採用了對於熱輻射能量能快速反應的感測元件120來對加熱元件110的輸出進行即時監測。In the present embodiment, the heating element 110 provides thermal radiant energy into the heating zone R1 (step 210). When the transfer substrate 196 transports the coating 198 through the heating zone R1, the heating action can be completed in a very short time (e.g., 2 seconds). Since the heating time is extremely short, the present embodiment employs the sensing element 120 that reacts rapidly with the thermal radiation energy to immediately monitor the output of the heating element 110.

如圖1與2所示,感測元件120被配置於加熱區域R1內的感測位置,用以監測在熱輻射傳遞之路徑上的感測位置的熱輻射能量(步驟220)。感測元件120與塗層198相隔一距離,不接觸塗層198。並且,感測元件120對於熱輻射能量的反應時間小於或等於100毫秒。在此,感測元件120例如是含有奈米碳管(carbon nano-tube)的溫度感測器,其對於熱輻射能量的反應時間例如約為10毫秒(ms),用以監測所述感測位置的溫度變化。當然,在其他實施例中,感測元件120也可以是能夠感測與熱輻射能量相應的其他物理量的感測器,例如是可感測輻射光強度並將其轉化為電信號的光二極體。As shown in Figures 1 and 2, the sensing element 120 is disposed at a sensing location within the heating region R1 for monitoring thermal radiant energy at a sensing location on the path of thermal radiation transfer (step 220). Sensing element 120 is spaced a distance from coating 198 and does not contact coating 198. Also, the response time of the sensing element 120 to the heat radiation energy is less than or equal to 100 milliseconds. Here, the sensing element 120 is, for example, a carbon nano-tube temperature sensor whose reaction time for heat radiation energy is, for example, about 10 milliseconds (ms) for monitoring the sensing. The temperature of the position changes. Of course, in other embodiments, the sensing element 120 can also be a sensor capable of sensing other physical quantities corresponding to the thermal radiation energy, such as a photodiode that can sense the intensity of the radiant light and convert it into an electrical signal. .

之後,如圖2的步驟230所示,控制器130耦接於感測元件120,用於接收感測元件120的監測結果,並且依據監測結果來調整加熱塗層198的製程參數。以前述身為溫度感測器的感測元件120為例,控制器130可依據感測元件120所測得的溫度變化來估算塗層198的受熱溫度。具體而言,當感測元件120偵測到感測位置的溫度變化之後,控制器130可依據加熱元件110與感測元件120的距離、加熱元件110與塗層198的距離、塗層198的材料、傳輸基板196的材料、加熱元件110在塗層198上形成的加熱面積、塗層198與傳輸基板196的厚度與導熱係數、加熱設備100所處的環境溫度與濕度等相關製程參數,來推得塗層198的溫度。並且,可依據此估算結果來調整後續加熱塗層198的製程參數。Then, as shown in step 230 of FIG. 2, the controller 130 is coupled to the sensing component 120 for receiving the monitoring result of the sensing component 120, and adjusting the process parameters of the heating coating 198 according to the monitoring result. Taking the sensing element 120 as the temperature sensor as an example, the controller 130 can estimate the heating temperature of the coating 198 according to the temperature change measured by the sensing element 120. Specifically, after the sensing component 120 detects the temperature change of the sensing location, the controller 130 can depend on the distance between the heating component 110 and the sensing component 120, the distance between the heating component 110 and the coating 198, and the coating 198. The material, the material of the transfer substrate 196, the heating area formed by the heating element 110 on the coating 198, the thickness and thermal conductivity of the coating 198 and the transfer substrate 196, and the ambient temperature and humidity at which the heating device 100 is placed, The temperature of the coating 198 is derived. And, the process parameters of the subsequent heating coating 198 can be adjusted according to the estimation result.

舉例而言,本實施例可藉由快速反應的感測元件120監測加熱元件110輸出的熱輻射能量變化並分析塗層198的溫度,以進一步調整加熱元件的輸出強度與輸出週期。換言之,加熱元件110的輸出強度與輸出週期為可調,其調整方法包含系統全自動調整、系統配合操作人員半自動半手動調整、操作人員全手動調整適合的輸出參數,以節省能源之損耗。此外,加熱元件110的輸出可以為連續式(continuous)輸出、以某一固定周期或不固定周期的脈衝式(pulse)輸出,或者可根據感測元件120取得的加熱元件的熱輻射能量變化以及塗層198溫度等參數即時調整加熱元件110的輸出能量。For example, the present embodiment can monitor the change in thermal radiant energy output by the heating element 110 by the rapidly reacting sensing element 120 and analyze the temperature of the coating 198 to further adjust the output intensity and output period of the heating element. In other words, the output intensity and output period of the heating element 110 are adjustable, and the adjustment method includes the system automatic adjustment, the system cooperates with the operator semi-automatic semi-manual adjustment, and the operator manually adjusts the appropriate output parameters to save energy loss. In addition, the output of the heating element 110 can be a continuous output, a pulse output at a fixed period or an unfixed period, or a change in thermal radiant energy of the heating element taken according to the sensing element 120 and The output energy of the heating element 110 is instantly adjusted by parameters such as the temperature of the coating 198.

另一方面,在加熱過程中,由於塗層198(或工件)的溶劑被蒸發,塗層198的特性會產生變化,例如塗層198的電性特徵可能從不良導體變成導體。此時,本實施例也可藉由感測元件120的監測結果來評估塗層198的特性變化,並將此資訊回饋至加熱元件110,以調整加熱元件110的輸出能量或其他製程參數。On the other hand, during the heating process, the properties of the coating 198 may change as the solvent of the coating 198 (or workpiece) is evaporated, for example, the electrical characteristics of the coating 198 may change from a poor conductor to a conductor. At this time, the embodiment can also evaluate the characteristic change of the coating 198 by the monitoring result of the sensing element 120, and feed back this information to the heating element 110 to adjust the output energy or other process parameters of the heating element 110.

基於上述,本實施例的加熱設備100藉由在加熱區域R1設置快速反應的感測元件120,並且藉由控制器130依據感測元件120的監測結果來調整加熱的製程參數。因此,除了可進行加熱設備100上線前的校正,也可在線上實時監測加熱元件110輸出的熱輻射能量變化,藉以調整加熱元件110的相關參數,對加熱製程參數進行即時修正與反饋,以提升產能與製程穩定性,並且減少能源的浪費。Based on the above, the heating apparatus 100 of the present embodiment adjusts the heated process parameters by the controller 130 according to the monitoring result of the sensing element 120 by providing the fast-reacting sensing element 120 in the heating region R1. Therefore, in addition to the correction of the heating device 100 before the line is on, the change of the heat radiation energy output by the heating element 110 can be monitored in real time on the line, thereby adjusting the relevant parameters of the heating element 110, and performing immediate correction and feedback on the heating process parameters to improve Capacity and process stability, and reduce energy waste.

圖3A與3B更繪示本揭露另一實施例之依據監測結果來調整製程參數的示意圖。本實施例移動加熱元件310,使加熱元件310在傳輸基板396上方掃描待加熱的工件302。首先,如圖3A所示,若工件302的面積等於加熱元件310的掃描面積,且加熱元件310的掃描速度為等速,則工件302的加熱時間會隨著位置不同而有變化。在掃描路徑的前後兩端因為加熱元件310的位置限制,導致部分工件302的受熱時間不足。此時,如圖3B所示,採用如圖2所示的本揭露的技術方案,選擇在傳輸基板396上設置多個感測元件320,以監測整個加熱區域內的受熱情形。並且依據監測結果即時調整加熱元件310的掃描速度,可以使加熱區域內的受熱溫度分布較為均勻。3A and 3B are schematic diagrams showing adjustment of process parameters according to monitoring results according to another embodiment of the disclosure. This embodiment moves the heating element 310 such that the heating element 310 scans the workpiece 302 to be heated above the transfer substrate 396. First, as shown in FIG. 3A, if the area of the workpiece 302 is equal to the scanning area of the heating element 310, and the scanning speed of the heating element 310 is constant, the heating time of the workpiece 302 may vary depending on the position. Due to the positional limitation of the heating element 310 at the front and rear ends of the scanning path, the heating time of the partial workpiece 302 is insufficient. At this time, as shown in FIG. 3B, using the technical solution of the present disclosure as shown in FIG. 2, a plurality of sensing elements 320 are selectively disposed on the transmission substrate 396 to monitor the heating condition in the entire heating region. Moreover, the scanning speed of the heating element 310 can be adjusted in time according to the monitoring result, so that the heating temperature distribution in the heating region can be relatively uniform.

另外,請再參考圖1,本揭露還可以選擇在加熱設備100中設置資料庫140,以做為控制器130反饋資訊的依據。具體而言,此資料庫例如被內建於控制器130或儲存於外部主機(未繪示),用以儲存不同的製程參數與其所對應的加熱結果的資料。在此,製程參數可包括加熱元件110的輸出功率或對工件(如塗層198)的加熱時間。所述控制器130耦接資料庫140,並且適於參照資料庫140所儲存的資料來調整製程參數。In addition, please refer to FIG. 1 again. The disclosure may also select to set the database 140 in the heating device 100 as a basis for the controller 130 to feed back information. Specifically, the database is built in the controller 130 or stored in an external host (not shown) for storing different process parameters and data corresponding to the heating result. Here, the process parameters may include the output power of the heating element 110 or the heating time of the workpiece (eg, coating 198). The controller 130 is coupled to the database 140 and is adapted to adjust the process parameters with reference to the data stored in the database 140.

圖4A與4B繪示依照本揭露之一實施例的資料庫140記載的製程參數與其所對應的加熱結果的關係。首先,由圖4A可知加熱時間與輸出功率為負相關。若輸出功率隨著加熱時間提高,將導致工件的變形加劇。藉此,可推估算出如圖4B所示的在特定區域內的合適的製程參數。舉例而言,當感測元件120檢測到加熱元件110的輸出功率發生變化,而未能即時進行輸入功率的補償時,可依據資料庫140的內容進行製程參數(如烘烤時間)的修正。此外,若製程參數到達無法補償的狀況,可以選擇讓加熱設備100發出警示,並對產品進行標記。換言之,可藉由前述設計讓加熱設備提供適當的加熱時間,並可節省能量的浪費。此外,由於可即時偵測加熱元件110輸出的能量變化,以隨時判斷是否需要調整製程參數,或是否需要更換加熱元件110。4A and 4B illustrate the relationship between the process parameters described in the database 140 and the corresponding heating results in accordance with an embodiment of the present disclosure. First, it can be seen from Fig. 4A that the heating time is negatively correlated with the output power. If the output power increases with the heating time, the deformation of the workpiece will be intensified. Thereby, a suitable process parameter in a specific area as shown in FIG. 4B can be estimated. For example, when the sensing component 120 detects that the output power of the heating component 110 has changed, and the compensation of the input power is not immediately performed, the correction of the process parameters (such as the baking time) may be performed according to the content of the database 140. In addition, if the process parameters reach a condition that cannot be compensated, the heating device 100 can be selected to issue a warning and mark the product. In other words, the heating device can be provided with an appropriate heating time by the aforementioned design, and energy waste can be saved. In addition, since the energy change outputted by the heating element 110 can be detected immediately, it is possible to judge whether the process parameter needs to be adjusted at any time, or whether the heating element 110 needs to be replaced.

圖5是使用本揭露之另一實施例的加熱設備來加熱工件的示意圖。如圖5所示,本實施例的加熱設備500與圖1所示的加熱設備100類似。兩者主要的差異在於本實施例的感測元件520位於傳輸基板196下方。換言之,加熱元件110與感測元件520分別位於傳輸基板196的相對兩側。藉此,可以避免在加熱塗層198過程中向上蒸發的溶劑氣體影響感測元件520的監測結果。Figure 5 is a schematic illustration of a heating apparatus for heating a workpiece using another embodiment of the present disclosure. As shown in FIG. 5, the heating apparatus 500 of the present embodiment is similar to the heating apparatus 100 shown in FIG. The main difference between the two is that the sensing element 520 of the present embodiment is located below the transmission substrate 196. In other words, the heating element 110 and the sensing element 520 are respectively located on opposite sides of the transmission substrate 196. Thereby, it is possible to avoid that the solvent gas evaporating upward during the heating of the coating 198 affects the monitoring result of the sensing element 520.

換言之,本揭露並不限制感測元件的位置與數量。本技術領域中具有通常知識者當可依據需求調整感測元件的位置與數量。In other words, the present disclosure does not limit the position and number of sensing elements. Those of ordinary skill in the art can adjust the position and number of sensing elements as needed.

圖6是使用本揭露之另一實施例的加熱設備來加熱工件的示意圖。如圖6所示,本實施例的加熱設備600與圖5所示的加熱設備500類似。兩者主要的差異在於本實施例不需藉由傳輸基板來承載被加熱的工件,例如塗層198。具體而言,本實施例介由放捲單元192與收捲單元194直接帶動被加熱的工件(例如塗層198)前進。加熱元件110與感測元件620分別位於被加熱的工件(例如塗層198)的相對兩側,以藉由感測元件620來監測被加熱的工件(例如塗層198)的受熱狀態。Figure 6 is a schematic illustration of a heating apparatus for heating a workpiece using another embodiment of the present disclosure. As shown in FIG. 6, the heating apparatus 600 of the present embodiment is similar to the heating apparatus 500 shown in FIG. The main difference between the two is that this embodiment does not require carrying a heated substrate, such as coating 198, by transporting the substrate. Specifically, the present embodiment advances the heated workpiece (eg, coating 198) directly by the unwinding unit 192 and the winding unit 194. Heating element 110 and sensing element 620 are respectively located on opposite sides of the heated workpiece (e.g., coating 198) to monitor the heated state of the heated workpiece (e.g., coating 198) by sensing element 620.

圖7是使用本揭露之又一實施例的加熱設備來加熱工件的示意圖。如圖7所示,本實施例的加熱設備700與圖1所示的加熱設備100類似。兩者主要的差異在於本實施例更在感測元件120與加熱元件110之間設置濾光元件750,用以降低進入感測元件120的熱輻射能量。Figure 7 is a schematic illustration of a heating apparatus for heating a workpiece using yet another embodiment of the present disclosure. As shown in FIG. 7, the heating apparatus 700 of the present embodiment is similar to the heating apparatus 100 shown in FIG. The main difference between the two is that the filter element 750 is further disposed between the sensing element 120 and the heating element 110 to reduce the heat radiation energy entering the sensing element 120.

具體而言,由於加熱元件110持續照射所產生溫度可能大於250˚C,然而感測元件120的工作溫度範圍有限,例如介於10~90˚C,因此需要加熱元件110與感測元件120之間設置濾光元件750,避免熱輻射能量直接進入感測元件120,使感測元件120處於適合的工作溫度範圍內,也可防止感測元件120因過熱而損壞。In particular, since the temperature generated by the continuous illumination of the heating element 110 may be greater than 250 ̊C, the operating temperature range of the sensing element 120 is limited, for example, between 10 and 90 ̊C, so the heating element 110 and the sensing element 120 are required. The filter element 750 is disposed to prevent the heat radiation energy from directly entering the sensing element 120, so that the sensing element 120 is within a suitable operating temperature range, and the sensing element 120 is prevented from being damaged by overheating.

在本實施例中,濾光元件750的主體材質與鍍膜材質例如是以低紅外線吸收或是高紅外線反射材料組成,例如硼矽酸鹽玻璃(BK7玻璃)、石英、氧化鋁、氧化鉭、氧化矽、銀、金等,以避免濾光元件750本身受到紅外線照射而被加熱至高溫。此外,濾光元件750例如是針對某一特定波長範圍的帶阻濾光片(band-stop filter),其中所述特定波長範圍例如是近紅外線之波長範圍(如400nm~1500nm)或是在近紅外線波長範圍內的某一特定波長範圍(如750~850nm)。此外,濾光元件750也可以是不考慮特定波長範圍的中性濾光片(neutral density filter)。In this embodiment, the material of the filter element 750 and the coating material are, for example, low-infrared absorption or high-infrared reflective materials, such as borosilicate glass (BK7 glass), quartz, alumina, yttria, oxidation. Helium, silver, gold, etc., to prevent the filter element 750 itself from being heated by infrared rays to be heated to a high temperature. In addition, the filter element 750 is, for example, a band-stop filter for a specific wavelength range, such as a near-infrared wavelength range (eg, 400 nm to 1500 nm) or near A specific wavelength range (such as 750~850nm) in the infrared wavelength range. Further, the filter element 750 may also be a neutral density filter that does not consider a specific wavelength range.

圖8是使用本揭露之再一實施例的加熱設備來加熱工件的示意圖。如圖8所示,本實施例的加熱設備800與圖1所示的加熱設備100類似。兩者主要的差異在於本實施例更包括濕度感測器860,其可被設置在加熱區域R1的周圍或加熱區域R1內,用以監測加熱設備800線上的濕度變化。例如,濕度感測器860被配置於塗層198上方的抽氣設備880上,藉由監測氣流882的濕度來判斷塗層198是否被加熱完全。或者,本實施例還可包括濕度感測器870,其可被設置在加熱設備800的其他位置,用以監測加熱設備800所處環境的濕度變化。控制器130可耦接於感測元件120以及濕度感測器860或870,用於接收感測元件120與濕度感測器860或870的監測結果,並且依據監測結果來調整加熱塗層198的製程參數。Figure 8 is a schematic illustration of a heating apparatus for heating a workpiece using still another embodiment of the present disclosure. As shown in FIG. 8, the heating apparatus 800 of the present embodiment is similar to the heating apparatus 100 shown in FIG. The main difference between the two is that the present embodiment further includes a humidity sensor 860 that can be disposed around the heating zone R1 or within the heating zone R1 for monitoring humidity changes on the heating device 800 line. For example, humidity sensor 860 is disposed on extraction device 880 above coating 198 to determine if coating 198 is fully heated by monitoring the humidity of gas stream 882. Alternatively, the present embodiment may further include a humidity sensor 870 that may be disposed at other locations of the heating device 800 to monitor changes in humidity of the environment in which the heating device 800 is located. The controller 130 can be coupled to the sensing component 120 and the humidity sensor 860 or 870 for receiving the monitoring result of the sensing component 120 and the humidity sensor 860 or 870, and adjusting the heating coating 198 according to the monitoring result. Process parameters.

在此,濕度感測器860或870連同前述被舉例為溫度感測器的感測元件120、320、520以及620等,皆可為奈米碳管的感測器,其具有極短的反應時間,例如小於或等於10毫秒,用以監測所述感測位置的濕度或溫度變化。Here, the humidity sensor 860 or 870, together with the sensing elements 120, 320, 520, and 620, which are exemplified as temperature sensors, can be a sensor of a carbon nanotube, which has a very short reaction. The time, for example less than or equal to 10 milliseconds, is used to monitor the humidity or temperature change of the sensed location.

綜上所述,本揭露的加熱設備與加熱方法在加熱區域內設置快速反應的感測元件,以量測實際輸出的熱輻射能量。藉此,可依據實時監測的結果來校正或補償加熱元件在製程中的變異與效率衰減。此外,本揭露可準確分析工件的受熱情形,並據此即時調整加熱所述工件的製程參數,例如所述加熱元件的輸出功率或對所述工件的加熱時間等,以避免過度加熱而損壞工件,或加熱不足而產出不良品。In summary, the heating device and the heating method of the present disclosure provide a rapidly reacting sensing element in the heating region to measure the actual output thermal radiation energy. Thereby, the variation and efficiency attenuation of the heating element in the process can be corrected or compensated according to the result of the real-time monitoring. In addition, the present disclosure can accurately analyze the heating condition of the workpiece, and adjust the process parameters for heating the workpiece, such as the output power of the heating element or the heating time of the workpiece, etc., to avoid excessive heating and damage the workpiece. , or insufficient heating to produce defective products.

雖然本揭露已以實施例揭露如上,然其並非用以限定本揭露,任何所屬技術領域中具有通常知識者,在不脫離本揭露的精神和範圍內,當可作些許的更動與潤飾,故本揭露的保護範圍當視後附的申請專利範圍所界定者為準。The present disclosure has been disclosed in the above embodiments, but it is not intended to limit the disclosure, and any person skilled in the art can make some changes and refinements without departing from the spirit and scope of the disclosure. The scope of protection of this disclosure is subject to the definition of the scope of the appended claims.

100‧‧‧加熱設備
110‧‧‧加熱元件
120‧‧‧感測元件
130‧‧‧控制器
140‧‧‧資料庫
180‧‧‧塗佈機
190‧‧‧輸送裝置
192‧‧‧放捲單元
194‧‧‧收捲單元
196‧‧‧傳輸基板
198‧‧‧塗層
R1‧‧‧加熱區域
210~230‧‧‧步驟
302‧‧‧工件
310‧‧‧加熱元件
320‧‧‧感測元件
396‧‧‧傳輸基板
500‧‧‧加熱設備
520‧‧‧感測元件
600‧‧‧加熱設備
620‧‧‧感測元件
700‧‧‧加熱設備
750‧‧‧濾光元件
800‧‧‧加熱設備
860、870‧‧‧濕度感測器
880‧‧‧抽氣設備
882‧‧‧氣流
100‧‧‧heating equipment
110‧‧‧heating elements
120‧‧‧Sensor components
130‧‧‧ Controller
140‧‧‧Database
180‧‧‧Coating machine
190‧‧‧Conveyor
192‧‧‧Unwinding unit
194‧‧‧Winding unit
196‧‧‧Transfer substrate
198‧‧‧ coating
R1‧‧‧heating area
210~230‧‧‧Steps
302‧‧‧Workpiece
310‧‧‧ heating element
320‧‧‧Sensor components
396‧‧‧Transfer substrate
500‧‧‧heating equipment
520‧‧‧Sensor components
600‧‧‧heating equipment
620‧‧‧Sensor components
700‧‧‧heating equipment
750‧‧‧ Filter elements
800‧‧‧heating equipment
860, 870‧‧‧ Humidity Sensor
880‧‧‧Pumping equipment
882‧‧‧ airflow

圖1是使用本揭露之一實施例的加熱設備來加熱工件的示意圖。 圖2是依據本揭露之一實施例的加熱方法的流程圖。 圖3A與3B繪示本揭露依據監測結果來調整製程參數的示意圖。 圖4A與4B繪示依照本揭露之一實施例的資料庫記載的製程參數與其所對應的加熱結果的關係。 圖5是使用本揭露之另一實施例的加熱設備來加熱工件的示意圖。 圖6是使用本揭露之另一實施例的加熱設備來加熱工件的示意圖。 圖7是使用本揭露之另一實施例的加熱設備來加熱工件的示意圖。 圖8是使用本揭露之另一實施例的加熱設備來加熱工件的示意圖。1 is a schematic view of a heating apparatus using an embodiment of the present disclosure to heat a workpiece. 2 is a flow chart of a heating method in accordance with an embodiment of the present disclosure. 3A and 3B are schematic diagrams showing adjustment of process parameters according to monitoring results. 4A and 4B illustrate the relationship between the process parameters recorded in the database and the corresponding heating results in accordance with an embodiment of the present disclosure. Figure 5 is a schematic illustration of a heating apparatus for heating a workpiece using another embodiment of the present disclosure. Figure 6 is a schematic illustration of a heating apparatus for heating a workpiece using another embodiment of the present disclosure. Figure 7 is a schematic illustration of a heating apparatus for heating a workpiece using another embodiment of the present disclosure. Figure 8 is a schematic illustration of a heating apparatus for heating a workpiece using another embodiment of the present disclosure.

100‧‧‧加熱設備 100‧‧‧heating equipment

110‧‧‧加熱元件 110‧‧‧heating elements

120‧‧‧感測元件 120‧‧‧Sensor components

130‧‧‧控制器 130‧‧‧ Controller

140‧‧‧資料庫 140‧‧‧Database

180‧‧‧塗佈機 180‧‧‧Coating machine

190‧‧‧輸送裝置 190‧‧‧Conveyor

192‧‧‧放捲單元 192‧‧‧Unwinding unit

194‧‧‧收捲單元 194‧‧‧Winding unit

196‧‧‧傳輸基板 196‧‧‧Transfer substrate

198‧‧‧塗層 198‧‧‧ coating

R1‧‧‧加熱區域 R1‧‧‧heating area

Claims (18)

一種加熱設備,適於加熱位於一加熱區域內的一工件,該加熱設備包括: 一加熱元件,用以提供一熱輻射能量至該加熱區域內; 一感測元件,配置於該加熱區域內的一感測位置,用以監測該感測位置的該熱輻射能量,其中該感測元件與該工件相隔一距離,該距離不為零,且該感測元件對於該熱輻射能量的反應時間小於或等於100毫秒;以及 一控制器,接收該感測元件的監測結果,並且依據該監測結果來調整加熱該工件的一製程參數。A heating device adapted to heat a workpiece located in a heating zone, the heating device comprising: a heating element for providing a thermal radiant energy into the heating zone; a sensing component disposed in the heating zone a sensing position for monitoring the thermal radiant energy of the sensing location, wherein the sensing component is separated from the workpiece by a distance that is not zero, and the sensing element has a reaction time for the thermal radiant energy is less than Or equal to 100 milliseconds; and a controller receiving the monitoring result of the sensing component and adjusting a process parameter for heating the workpiece according to the monitoring result. 如申請專利範圍第1項所述的加熱設備,更包括一濾光元件,位於該加熱元件與該感測元件之間,用以降低進入該感測元件的該熱輻射能量。The heating device of claim 1, further comprising a filter element between the heating element and the sensing element for reducing the heat radiation energy entering the sensing element. 如申請專利範圍第2項所述的加熱設備,其中該濾光元件包括中性濾光片(neutral density filter)或帶阻濾光片(band-stop filter)。The heating device of claim 2, wherein the filter element comprises a neutral density filter or a band-stop filter. 如申請專利範圍第1項所述的加熱設備,其中該加熱元件包括一近紅外線(Near-infrared, NIR)加熱器。The heating device of claim 1, wherein the heating element comprises a near-infrared (NIR) heater. 如申請專利範圍第1項所述的加熱設備,更包括一資料庫,儲存不同的該製程參數與其所對應的加熱結果的資料,其中該控制器耦接該資料庫,並且適於參照該資料庫所儲存的該資料來調整該製程參數。The heating device of claim 1, further comprising a database for storing different data of the process parameter and the corresponding heating result, wherein the controller is coupled to the database and is adapted to refer to the data. The data stored by the library is used to adjust the process parameters. 如申請專利範圍第5項所述的加熱設備,其中該製程參數包括該加熱元件的輸出功率或對該工件的加熱時間。The heating device of claim 5, wherein the process parameter comprises an output power of the heating element or a heating time of the workpiece. 如申請專利範圍第1項所述的加熱設備,其中該感測元件包括一溫度感測器,用以監測該感測位置的溫度變化。The heating device of claim 1, wherein the sensing component comprises a temperature sensor for monitoring a temperature change of the sensing location. 如申請專利範圍第7項所述的加熱設備,其中該控制器更依據該溫度感測器所測得的該溫度變化來估算該工件的受熱溫度(heated temperature)。The heating device of claim 7, wherein the controller estimates the heated temperature of the workpiece based on the temperature change measured by the temperature sensor. 如申請專利範圍第1項所述的加熱設備,更包括一輸送裝置,用以傳輸該工件通過該加熱區域。The heating device of claim 1, further comprising a conveying device for conveying the workpiece through the heating zone. 如申請專利範圍第1或9項所述的加熱設備,該加熱元件與該感測元件分別位於該工件的相對兩側。The heating device of claim 1 or 9, wherein the heating element and the sensing element are respectively located on opposite sides of the workpiece. 如申請專利範圍第9項所述的加熱設備,其中該輸送裝置包括用以承載該工件的一傳輸基板,且該加熱元件與該感測元件分別位於該傳輸基板的相對兩側。The heating device of claim 9, wherein the conveying device comprises a transmission substrate for carrying the workpiece, and the heating element and the sensing element are respectively located on opposite sides of the transmission substrate. 如申請專利範圍第1項所述的加熱設備,更包括一濕度感測器,位於該加熱區域內或該加熱區域周圍,用以監測該加熱區域內或該加熱區域周圍之特定位置的濕度變化。The heating device of claim 1, further comprising a humidity sensor located in or around the heating zone for monitoring a change in humidity at a specific location in the heating zone or around the heating zone. . 一種加熱方法,適於加熱位於一加熱區域內的一工件,該加熱方法包括: 提供一熱輻射能量至該加熱區域內; 使用一感測元件在該加熱區域內的一感測位置上監測該熱輻射能量,其中該感測元件與該工件相隔一距離,該距離不為零,且該感測元件對於該熱輻射能量的反應時間小於或等於100毫秒;以及 依據該監測結果來調整加熱該工件的一製程參數。A heating method adapted to heat a workpiece located in a heating zone, the heating method comprising: providing a thermal radiant energy into the heating zone; monitoring the sensing location at a sensing location in the heating zone using a sensing component Thermal radiant energy, wherein the sensing element is separated from the workpiece by a distance that is not zero, and the response time of the sensing element for the thermal radiant energy is less than or equal to 100 milliseconds; and the heating is adjusted according to the monitoring result A process parameter of the workpiece. 如申請專利範圍第13項所述的加熱方法,其中使用一近紅外線(Near-infrared, NIR)加熱器提供該熱輻射能量至該加熱區域內。The heating method of claim 13, wherein a near-infrared (NIR) heater is used to provide the heat radiation energy into the heating zone. 如申請專利範圍第13項所述的加熱方法,其中該感測元件包括一溫度感測器,用以監測該感測位置的溫度變化。The heating method of claim 13, wherein the sensing element comprises a temperature sensor for monitoring a temperature change of the sensing position. 如申請專利範圍第15項所述的加熱方法,更包括依據該溫度感測器所測得的該溫度變化來估算該工件的受熱溫度(heated temperature)。The heating method of claim 15, further comprising estimating the heated temperature of the workpiece based on the temperature change measured by the temperature sensor. 如申請專利範圍第13項所述的加熱方法,更包括使用一輸送裝置來傳輸該工件通過該加熱區域。The heating method of claim 13, further comprising using a conveying device to transport the workpiece through the heating zone. 如申請專利範圍第13項所述的加熱方法,更包括使用一濕度感測器監測該加熱區域內或該加熱區域周圍之特定位置的濕度變化。The heating method of claim 13, further comprising monitoring a change in humidity at a specific location within the heated region or around the heated region using a humidity sensor.
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