TWI611694B - Contact image sensor module and method for manufacturing thereof - Google Patents

Abstract

The invention provides a contact image sensor module and a manufacturing method thereof. A method for manufacturing a contact image sensor module includes: providing a lens group; burying the lens group in a first insert molding mold; and injecting a first injection material into the insert molding mold to form the embedded mold. A base of the lens group. In the present invention, the lens group and the base of the contact image sensor module are formed by an insert molding method, thereby effectively increasing a bonding area between the lens group and the base, and also realizing the contact type. Miniaturization of the image sensor module.

Description

Contact image sensor module and manufacturing method thereof

The invention relates to a contact image sensor module and a manufacturing method thereof, and in particular to a contact image sensor module formed by using an insert molding method with a lens group and a base and a manufacturing method thereof.

At present, most electronic devices with a scanning function use a contact image sensor module (CISM) as a sensing element during scanning, which is used to convert images or text on an object to be scanned. Converted into electronic signals for processing actions such as transmission, display and storage.

Please refer to FIG. 1, which is a schematic cross-sectional view of a conventional contact image sensor module 10. The contact-type image sensor module 10 includes a base 11, a lens group 12, a light source group 13, a glass cover 14, and a sensor substrate 15. When using the contact image sensor module 10 to scan an object to be scanned, the light source group 13 irradiates the generated light to the object to be scanned, and the object to be scanned reflects light of different intensity (for example, The dark area reflects a small amount of light, while the bright area reflects a large amount of light, etc.) The lens group 12 focuses the reflected light of different intensity onto the sensor substrate 15, and the sensor substrate 15 focuses different intensity on the sensor substrate 15. The electrical light is converted into an analog electrical signal, which is proportional to the light intensity, and finally the analog electrical signal is converted to digital After the electrical signals are processed through appropriate image processing, information such as images or text on the object to be scanned can be generated.

As shown in FIG. 1, the lens group is adhered to the base 11 by the adhesive 16, and the glass cover 14 is also adhered to the upper portion of the base 11 by applying the adhesive 16. Specifically, when the contact image sensor module 10 is manufactured, a plastic material is used to form the base 11, and then a geometric inner surface of the base 11 is coated with a layer of adhesive 16. The lens group 12 is then attached to the adhesive 16 to complete the combination between the lens group 12 and the base 11. Since the lens group 12 and the base 11 are combined by the above method, the base 11 must have a sufficiently wide assembly space and a large enough gap to allow the adhesive 16 to be coated therein. However, in order to maintain a sufficiently wide assembly space, the volume of the base 11 is limited, and it is difficult to achieve miniaturization. Furthermore, in order to keep a large enough gap to facilitate the assembly of the lens group 12 and the light source group 13, the area of the geometric inner surface of the base 11 for coating the adhesive 16 is also limited, so that the lens group Only a small part of the side surface of 12 can be adhered to the geometric inner surface of the base 11, which in turn results in a weak bonding force between the base 11 and the lens group 12 and is liable to fall off.

In view of this, it is necessary to provide a contact image sensor module and a manufacturing method thereof to solve the problems existing in the conventional technology.

In order to solve the above technical problems, an object of the present invention is to provide a contact image sensor module and a manufacturing method thereof. In the method for manufacturing the contact image sensor module, the lens group and the base of the contact image sensor module are formed by an insert molding method, so the space between the lens group and the base is effectively increased. The combined area and can also be realized with a miniaturized body Integrated the contact image sensor module.

To achieve the above object, the present invention provides a method for manufacturing a contact image sensor module, including: providing a lens group; embedding the lens group in a first insert molding mold; and in the first insert molding mold. A first emitting material is injected to form a base in which the lens group is embedded.

In one of the preferred embodiments of the present invention, before the lens group is embedded in a first insert molding mold, an adhesive material is further provided on the outer surface of the lens group for bonding the lens group and the lens group. The base.

In one of the preferred embodiments of the present invention, a method for disposing the adhesive material on an outer surface of the lens group includes applying, pad printing, dispensing, or placing an adhesive film.

In one preferred embodiment of the present invention, the adhesive material is formed on all side surfaces of the lens group.

In one of the preferred embodiments of the present invention, the base further includes a receiving space for setting a light source group, and the light source group corresponds to the lens group, and when the contact image sensor module During the scanning operation, the light source group generates a light and irradiates an object to be scanned, and the lens group focuses the light reflected from the object to be scanned onto a sensor substrate.

In one preferred embodiment of the present invention, the manufacturing method further includes: providing a glass substrate; burying the glass substrate in a second insert molding mold; and injecting a second injection into the second insert molding mold. Material to form an upper cover inlaid with the glass substrate, wherein the upper cover is to be assembled above the base.

In one preferred embodiment of the present invention, the manufacturing method further includes: providing a glass substrate, wherein the glass substrate is to be assembled above the base.

Another object of the present invention is to provide a contact-type image sensor module, including: a base having an accommodation space and an assembling slot; and a lens group, wherein the lens group is embedded by an insert molding method In the assembly groove of the base.

In one preferred embodiment of the present invention, the contact image sensor module further includes an adhesive material disposed on an outer surface of the lens group for bonding the lens group and the base.

In one preferred embodiment of the present invention, the adhesive material covers the entire side surface of the lens group.

In one of the preferred embodiments of the present invention, the contact image sensor module further includes a light source group and a sensor substrate, wherein the light source group is disposed in the accommodation space of the base and corresponds to In the lens group, when the contact image sensor module performs a scanning operation, the light source group generates a light and irradiates an object to be scanned, and the lens group focuses the light reflected from the object to be scanned Onto the sensor substrate.

In one preferred embodiment of the present invention, the contact image sensor module further includes an upper cover combined above the base, wherein the upper cover includes a glass substrate and a frame, and the glass substrate uses An insert molding method is set on the frame.

In one preferred embodiment of the present invention, the contact image sensor module further includes an upper cover made of a glass substrate.

10, 100‧‧‧ contact image sensor module

11, 110‧‧‧ base

12, 120‧‧‧ lens group

13, 130‧‧‧ light source group

14‧‧‧ glass cover

15, 150‧‧‧ sensor substrate

16‧‧‧Viscose

112‧‧‧Assembly tank

114‧‧‧accommodation space

140‧‧‧ Upper cover

142‧‧‧Frame

144‧‧‧glass substrate

160‧‧‧ Adhesive material

S10 ~ S70‧‧‧step

FIG. 1 is a schematic cross-sectional view of a conventional contact image sensor module.

FIG. 2 is a schematic exploded cross-sectional view of a contact image sensor module according to a preferred embodiment of the present invention.

FIG. 3 shows a manufacturing flow chart of the contact image sensor module of FIG. 2.

In order to make the above and other objects, features, and advantages of the present invention more comprehensible, the following describes the preferred embodiments of the present invention and the accompanying drawings in detail, as follows.

Please refer to FIG. 2, which shows an exploded cross-sectional view of a contact image sensor module 100 according to a preferred embodiment of the present invention. The contact image sensor module 100 includes at least a base 110, a lens group 120, a light source group 130, an upper cover 140, and a sensor substrate 150. When using the contact image sensor module 100 to scan an object to be scanned, the object to be scanned is first placed above the upper cover 140, and then the light source group 130 will irradiate the generated light to the object to be scanned After the object to be scanned reflects light of different intensities (for example, a dark area reflects a small amount of light, and a bright area reflects a large amount of light, etc.), the lens group 120 focuses the reflected light of different intensity to the sense. On the sensor substrate 150, the sensor substrate 150 converts light of different intensities into an analog electrical signal. The analog electrical signal is proportional to the light intensity. Finally, the analog electrical signal is converted into a digital electrical signal and then passed through an appropriate image. Processing can generate information such as images or text on the object to be scanned.

As shown in FIG. 2, the inside of the base 110 includes an assembly groove 112 and an accommodation space 114. The assembling groove 112 is used to be combined with the lens group 120, and the receiving space 114 is used to receive the light source group 130. In addition, after the lens group 120 and the light source group 130 are respectively assembled in the base 110, the light source group 130 corresponds to the lens group 120, so that when the contact image sensor module 100 performs a scanning operation, The light source group 130 generates a light and irradiates an object to be scanned, and The lens group 120 focuses the light reflected from the object to be scanned onto the sensor substrate 150. It should be noted that the lens group 120 is embedded in the assembly groove 112 of the base 110 by an insert molding method (a specific manufacturing method will be described in detail later). In addition, the geometric surface of the assembling groove 112 of the base 110 and the outer surface of the lens group 120 further include an adhesive material 160 (such as adhesive), and the lens group can be formed by the adhesive material 160. 120 is adhered to the base 110. In a preferred embodiment of the present invention (as shown in FIG. 2), the adhesive material 160 is formed on all side surfaces of the lens group 120, and the geometry of the assembly groove 112 of the base 110 The surface is bonded to all side surfaces of the lens group 120 by the adhesive material 160. Therefore, in the present invention, the lens group 120 is embedded in the assembly groove 112 of the base 110 by the insert molding method. Not only can the volume of the contact image sensor module 100 be miniaturized, but the size of the contact image sensor module 100 can be effectively increased. The joint area between the lens group 120 and the base 110 further secures the lens group 120 in the assembly groove 112 of the base 110.

As shown in FIG. 2, the upper cover 140 of the contact image sensor module 100 includes a frame 142 and a glass substrate 144. The glass substrate 144 is also embedded in the frame 142 by an insert molding method.

Please refer to FIG. 3, which is a manufacturing flowchart of the contact image sensor module 100 of FIG. 2. First, in step S10, the lens group 120 is provided. The material of the lens group 120 includes glass, acrylic, or various suitable polymer materials. Next, step S20 is performed to set the adhesive material 160 on the outer surface of the lens group 120 for bonding the lens group 120 and the base 110, wherein the adhesive is provided on the outer surface of the lens group 120. The method of the material 160 includes coating, pad printing, dispensing, or placing an adhesive film. Next, step S30 is performed to embed the lens group 120 in a first insert molding mold. Next, step S40 is performed in the insert molding mold. A first injection material is injected to form the base 110 inlaid with the lens group 120. The first injection material is preferably a plastic material. Therefore, when the lens group 120 of the present invention is made of a glass material or a material different from the first emitting material, the manufacturing method of the contact image sensor module 100 of the present invention can effectively make The base 110 and the lens group 120 of different materials are firmly combined.

Referring to FIG. 3, step S50 is performed to provide the glass substrate 144 for forming the upper cover 140. Then, step S60 is performed to embed the glass substrate 144 into a second insert molding mold. Next, step S70 is performed to inject a second injection material into the second insert molding mold to form the upper cover 140 in which the glass substrate 144 is embedded. Specifically, the second injection material is a plastic material and is used to form the frame 142 that is fitted to the glass substrate 144. In a preferred embodiment, before the glass substrate 144 is embedded in the second insert molding mold, an adhesive material may also be formed on the side surface of the glass substrate 144, so that the glass substrate 144 can be firmly adhered. Connected to this frame 142. In another preferred embodiment, geometric side surfaces can be formed on the sides of the glass substrate 144 (as shown in FIG. 2, the glass substrate 144 has a protruding geometric side surface) to achieve The effect of firmly combining the glass substrate 144 and the frame 142. It should be noted that, in another preferred embodiment, the order of the two steps of steps S10 to S40 and steps S50 to S70 can be interchanged, or in another preferred embodiment, only steps S10 to Step S50 is omitted and steps S60 to S70 are omitted, and then the glass substrate 144 is directly adhered to the base 110 to serve as an upper cover of the contact image sensor module 100.

In summary, the present invention inserts the lens group 120 into the assembly groove 112 of the base 110 by insert molding, which can not only achieve the miniaturization of the contact image sensor module 100, but also Effectively increase the bonding area between the lens group 120 and the base 110, Furthermore, the lens group 120 is stably disposed in the assembling groove 112 of the base 110. Similarly, in the present invention, the glass substrate 144 can be embedded in the frame 142 by the insert molding method, so as to achieve the miniaturization of the volume of the contact image sensor module 100 and effectively increase the glass substrate 144 and The bonding area of the frame 142 further secures the glass substrate 144 on the frame 142. Therefore, with the method for manufacturing the contact image sensor module 100 provided by the present invention, the product design, manufacturing process, and related mechanical parts of the contact image sensor module 100 can be simplified, and the design can be effectively shortened. The manufacturing man-hours and the yield rate are improved, and the overall configuration of the contact image sensor module 100 can be high-quality, thin, short, and short and have market advantages.

Although the present invention has been disclosed as above with preferred embodiments, it is not intended to limit the present invention. Those with ordinary knowledge in the technical field to which the present invention pertains may make various changes and modifications without departing from the spirit and scope of the present invention. Retouching, so the scope of protection of the present invention shall be determined by the scope of the attached patent application.

S10 ~ S70‧‧‧step

Claims (11)

A method for manufacturing a contact image sensor module includes: providing a lens group; burying the lens group in a first insert molding mold; and injecting a first injection material into the first insert molding mold to form A base inlaid with the lens group, wherein before the lens group is embedded in a first insert molding mold, an adhesive material is further provided on the outer surface of the lens group for bonding the lens group and the lens Base. The method for manufacturing a contact image sensor module according to item 1 of the scope of patent application, wherein the method of disposing the adhesive material on the outer surface of the lens group includes applying coating, pad printing, dispensing, or Place an adhesive film. The method for manufacturing a contact image sensor module according to item 1 of the scope of the patent application, wherein the adhesive material is formed on all side surfaces of the lens group. According to the method for manufacturing a contact image sensor module described in item 1 of the scope of patent application, wherein the base further includes a receiving space for setting a light source group, and the light source group corresponds to the lens group, When the contact image sensor module performs a scanning operation, the light source group generates a light and irradiates an object to be scanned, and the lens group focuses the light reflected from the object to be scanned to a sensor. Device substrate. The method of manufacturing a contact image sensor module according to item 1 of the scope of patent application, wherein the manufacturing method further comprises: providing a glass substrate; burying the glass substrate in a second insert molding mold; and A second injection molding material is injected into the second insert molding mold to form the glass substrate. An upper cover of the board, wherein the upper cover is to be assembled above the base. The method for manufacturing a contact image sensor module according to item 1 of the scope of patent application, wherein the manufacturing method further includes: providing a glass substrate, wherein the glass substrate is to be assembled above the base. A contact image sensor module includes: a base having an accommodation space and an assembly groove; and a lens group, wherein the lens group is embedded in the assembly groove of the base using an insert molding method Wherein, the contact image sensor module further includes a sticky material, which is disposed on the outer surface of the lens group for bonding the lens group and the base. According to the touch image sensor module described in item 7 of the patent application scope, wherein the adhesive material covers the entire side surface of the lens group. The contact image sensor module according to item 7 of the scope of patent application, wherein the contact image sensor module further includes a light source group and a sensor substrate, wherein the light source group is disposed on the base. In the accommodating space and corresponding to the lens group, when the contact image sensor module performs a scanning action, the light source group generates a light and irradiates an object to be scanned, and the lens group will be from the The light reflected from the object to be scanned is focused onto the sensor substrate. The contact image sensor module according to item 7 of the scope of patent application, wherein the contact image sensor module further includes a top cover combined above the base, wherein the top cover includes a glass substrate and a Frame, and the glass substrate is embedded in the frame by an insert molding method. The contact image sensor module according to item 7 of the scope of patent application, wherein the contact image sensor module further includes an upper cover made of a glass substrate.