TWI609452B - Chuck device and trasfer method for element - Google Patents

Description

Suction device and component transfer method

The present invention relates to a chuck device and a component transfer method, and more particularly to a chuck device having a patterned conductive layer and a component transfer method using the same.

In general, conventional electronic component assembly is made by mechanical pick-place. However, as component sizes become more and more miniaturized, the traditional way of taking them leads to a significant increase in cost. In addition, when electronic components enter the micron or nanometer size, the mechanical handling method is no longer sufficient. Although it has been proposed to replace the mechanical handling method with a novel method such as a nozzle, it has the disadvantages of being expensive and difficult to manufacture. Therefore, the assembly of tiny components is in a bottleneck.

The present invention provides a chuck device that adsorbs an element by inducing a dipole-dipole force therebetween.

The invention further provides a method for transferring components, which can avoid electrostatic force from damaging the components.

The chuck device of the present invention is for sucking at least one component. The chuck device includes an electrostatic chuck and a patterned conductive layer. The patterned conductive layer is disposed on the electrostatic chuck, and has at least one opening exposing a portion of the electrostatic chuck, wherein when the electrostatic chuck is energized, the electrostatic chuck exposed through the at least one opening induces a dipole-dipole force between the at least one component So that at least one component is adsorbed to a portion of the electrostatic chuck via at least one opening.

The method of transferring the elements of the present invention includes the following steps. Apply a voltage to the electrostatic chuck of the chuck device. The chuck device is brought close to at least one component at the first position, wherein at least one component is adsorbed to the portion of the electrostatic chuck via the at least one opening. The suction cup device to which at least one component has been adsorbed is moved from the first position to the second position. The voltage applied to the chuck device is removed at the second position such that at least one component is disengaged from the chuck device and drawn from the first position to the second position.

In an embodiment of the invention, the electrostatic chuck comprises at least one positive electrode, at least one negative electrode, and an insulating layer surrounding the at least one positive electrode and the at least one negative electrode.

In an embodiment of the invention, the at least one positive electrode comprises a plurality of positive electrodes, and the at least one negative electrode comprises a plurality of negative electrodes.

In an embodiment of the invention, a release layer is further disposed between the electrostatic chuck and the patterned conductive layer.

In an embodiment of the invention, the patterned conductive layer has a thickness of between 1 μm and 5 μm.

In an embodiment of the invention, the patterned conductive layer has a grid structure.

In an embodiment of the invention, the at least one opening includes a plurality of openings.

In an embodiment of the invention, the at least one component includes a plurality of components, and the plurality of components are respectively adsorbed to the partial electrostatic chuck via the plurality of openings.

Based on the above, the present invention utilizes the formation of a patterned conductive layer on an electrostatic chuck such that a localized area of the electrostatic chuck has an electrostatic force. In this way, a dipole-dipole force can be generated between the inducing element and the electrostatic chuck exposed through the opening such that the element is attracted to the electrostatic chuck via the opening. In addition, by designing the arrangement of the openings of the patterned conductive layer, a plurality of component batches can be transferred to a desired location and arranged in a desired manner. Therefore, the chuck device can be widely applied to the transfer step of an element having a micron or nanometer size, and the static electricity can be prevented from affecting the characteristics of the element.

The above described features and advantages of the invention will be apparent from the following description.

1A is a schematic cross-sectional view of a chuck device in accordance with an embodiment of the present invention, and FIG. 1B is a top plan view of a chuck device in accordance with an embodiment of the present invention. Referring to FIG. 1A and FIG. 1B simultaneously, in the present embodiment, the chuck device 10 includes an electrostatic chuck 100 and a patterned conductive layer 110. The electrostatic chuck 100 includes, for example, at least one positive electrode 104, at least one negative electrode 106, and an insulating layer 108 surrounding the positive electrode 104 and the negative electrode 106, wherein charges are distributed in the insulating layer 108. The positive electrode 104 and the negative electrode 106 are arranged to intersect the positive and negative electrodes. In the present embodiment, the electrostatic chuck 100 includes, for example, a plurality of positive electrodes 104 and a plurality of negative electrodes 106 arranged in a staggered manner. In the present embodiment, the material of the positive electrode 104 and the negative electrode 106 is, for example, a copper foil, but the invention is not limited thereto.

The patterned conductive layer 110 is disposed on the electrostatic chuck 100 and has at least one opening 112. The opening 112 exposes the area 102 of the electrostatic chuck 100, and the remaining area 103 of the electrostatic chuck 100 is covered by the patterned conductive layer 110. In the present embodiment, the thickness of the patterned conductive layer 110 is, for example, between 1 μm and 5 μm. The material of the patterned conductive layer 110 may be a photoresist type conductive material. Therefore, the patterned conductive layer 110 can be formed by forming a conductive layer, sequentially exposing and developing the conductive layer. Alternatively, when the patterned conductive layer 110 does not have photoresist characteristics, the conductive layer and the patterned photoresist layer may be sequentially formed on the electrostatic chuck 100, and the patterned photoresist layer is used as a mask to remove portions. A conductive layer is formed to form the patterned conductive layer 110. In the present embodiment, the patterned conductive layer 110 has, for example, a plurality of openings 112 separated from each other, and thus, as shown in FIG. 1B, the patterned conductive layer 110 has, for example, a grid structure. In the present embodiment, the width and length of the opening 112 are, for example, less than or equal to 100 μm, respectively.

In this embodiment, as shown in FIG. 1B , an array of a plurality of openings 112 is taken as an example, but the invention is not limited thereto. In another embodiment (not shown), the patterned conductive layer 110 may also have only one opening 112, as desired. Alternatively, in yet another embodiment (not shown), the plurality of openings 112 of the patterned conductive layer 110 may also have a particular arrangement rather than a close arrangement, such as a monochromatic pixel in a color filter (such as Arrangement of red, green, or blue pixels.

In the present embodiment, the chuck device 10 further includes a release layer 120 disposed between the electrostatic chuck 100 and the patterned conductive layer 110. The release layer 120 includes features that are separable from the electrostatic chuck 100, the configuration of which facilitates the separation of the patterned conductive layer 110 from the electrostatic chuck 100 to provide a new patterned conductive layer 110. In the present embodiment, the release layer 120 is formed, for example, by a spray coating method. The thickness of the release layer 120 is, for example, less than or equal to 0.1 μm.

Furthermore, as shown in FIG. 1A, although in the present embodiment, a pair of positive and negative electrodes (including the positive electrode 104 and the negative electrode 106) are disposed under one opening 112, the number or opening of the electrodes is not in the present invention. The correspondence between positive and negative electrodes is limited. For example, the positive electrode 104 and the negative electrode 106 and the opening 112 in the chuck device 10 may also have a configuration as shown in FIG. 2.

In the present embodiment, the patterned conductive layer 110 shields the electrostatic force of the region 103 of the electrostatic chuck 100 covered by it, while the unmasked region 102 exposed through the opening 112 still has an electrostatic force. Therefore, as shown in FIGS. 3A and 4A, when a voltage is applied to the electrostatic chuck 100 and the chuck device 10 is brought close to the element 130 at the first position S1, the electrostatic force of the electrostatic chuck 100 exposed through the opening 112 induces the element 130 and its A dipole-dipole force is generated therebetween such that the element 130 is attracted to the portion of the electrostatic chuck 100 via the opening 112. That is, the electric field is concentrated on the adsorption surface (i.e., region 102) such that the opposite surface potential is zero, thus enhancing the adsorption force such that element 130 is adsorbed by region 102 of electrostatic chuck 100 at least partially within opening 112.

In the present embodiment, the size of the element 130 may be greater than, equal to, or less than the size of the opening 112, and the size of the element 130 is, for example, a micron rating or a nanometer rating. Element 130 is a conductor or insulator and element 130 is generally neutral. Element 130 is, for example, a component that needs to be transferred from one location to another, in particular a plurality of components that require a large number of transfers in a batch. For example, component 130 can be a component with an electronic circuit, such as a circuit board, a micro LED, a flash memory, or the like. Alternatively, component 130 can be a component for wafer packaging, such as solder balls, solder paste, or any conductive particles. In other embodiments, element 130 can also be a particle. Furthermore, in the present embodiment, an opening 112 corresponding to the adsorption of one component 130 is taken as an example, but the invention is not limited thereto. According to requirements, one opening 112 can also adsorb multiple components 130 at the same time, or multiple The opening 112 can adsorb one element 130 together.

Next, as shown in FIGS. 3B and 4B, after the chuck device 10 to which the component 130 has been adsorbed is moved from the first position S1 to the second position S2, the voltage applied to the electrostatic chuck 100 is removed, so that the component 130 is self-sucking the disk device. 10 off. As shown in FIGS. 1B and 4B, the arrangement of elements 130 corresponds to the arrangement of openings 112 in patterned conductive layer 110. In the present embodiment, the elements 130 are, for example, arranged in an array.

In the present embodiment, since the patterned conductive layer 110 has a plurality of openings 112, the plurality of elements 130 are simultaneously transferred from the first position S1 to the second position S2 by the chucking device 10. Therefore, a plurality of components 130 can be batch-transferred by the aforementioned chucking device 10 to form, for example, a micro-light emitting diode array, a ball grid array (BGA) package, or a solder paste printing. Therefore, it can be applied to technologies such as micro light-emitting diodes, chip packaging, or surface mount technology (SMT). In particular, in the present embodiment, the dipole-dipole force is generated between the inducing element 130, so that the element 130 is adsorbed to the partial electrostatic chuck 100 via the opening 112, so the element 130 is substantially not Static electricity can avoid the phenomenon of mutual repulsion between the components 130 to achieve the purpose of arranging the components 130. In addition, it is also possible to prevent components such as electronic circuits in the component 130 from being damaged by the static electrodes.

In summary, the present invention retains a partial region by arranging a patterned conductive layer on the electrostatic chuck to shield the electrostatic force of the partial region without damaging the overall electrostatic distribution (ie, the surface electric field E=0). Electrostatic force. In this way, a plurality of component batches can be transferred to a desired location and arranged in a desired manner by designing an arrangement of openings in the patterned conductive layer. In addition, since the chuck device sucks the component by inducing a dipole-dipole force between the components, the component itself remains substantially neutral, so that the components are mutually exclusive due to charging, and the components are avoided. The electronic circuit or the like is damaged by electrostatic breakdown. Therefore, the chuck device can be widely applied to a transfer step of a micron or nano-scale component (such as a package, etc.) to greatly reduce cost and increase production efficiency.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.

10‧‧‧Sucker device
100‧‧‧Electrostatic suction cup
102, 103‧‧‧ area
104‧‧‧ positive electrode
106‧‧‧Negative electrode
108‧‧‧Insulation
110‧‧‧ patterned conductive layer
112‧‧‧ openings
120‧‧‧ release layer
130‧‧‧ components
S1‧‧‧ first position
S2‧‧‧ second position

1A is a schematic cross-sectional view of a suction cup device in accordance with an embodiment of the present invention. 1B is a top plan view of a suction cup device in accordance with an embodiment of the present invention. 2 is a top plan view of a suction cup device in accordance with an embodiment of the present invention. 3A-3B are schematic cross-sectional views showing a method of transferring an element in accordance with an embodiment of the present invention. 4A-4B are top schematic views of a method of transferring components in accordance with an embodiment of the present invention.

10‧‧‧Sucker device

100‧‧‧Electrostatic suction cup

102, 103‧‧‧ area

104‧‧‧ positive electrode

106‧‧‧Negative electrode

108‧‧‧Insulation

110‧‧‧ patterned conductive layer

112‧‧‧ openings

120‧‧‧ release layer

Claims (9)

a suction cup device for sucking at least one component, comprising: an electrostatic chuck; and a patterned conductive layer disposed on the electrostatic chuck, having at least one opening exposing a portion of the electrostatic chuck, wherein when the electrostatic chuck is powered The electrostatic chuck exposed through the at least one opening induces a dipole-dipole force between the at least one component and the at least one component to be adsorbed to the portion of the static electricity via the at least one opening On the suction cup. The chuck device of claim 1, wherein the electrostatic chuck comprises at least one positive electrode, at least one negative electrode, and an insulating layer surrounding the at least one positive electrode and the at least one negative electrode. The chuck device of claim 2, wherein the at least one positive electrode comprises a plurality of positive electrodes, and the at least one negative electrode comprises a plurality of negative electrodes. The suction cup device of claim 1, further comprising a release layer disposed between the electrostatic chuck and the patterned conductive layer. The chuck device of claim 1, wherein the patterned conductive layer has a thickness of from 1 μm to 5 μm. The chuck device of claim 1, wherein the patterned conductive layer has a grid structure. The suction cup device of claim 1, wherein the at least one opening comprises a plurality of openings. The chuck device of claim 7, wherein the at least one component comprises a plurality of components, and the plurality of components are respectively adsorbed to a portion of the electrostatic chuck via the plurality of openings. A method of transferring a component, comprising: applying the voltage to the electrostatic chuck of the chuck device according to any one of claims 1 to 8; bringing the chuck device to at least one component at the first position The at least one component is adsorbed to a portion of the electrostatic chuck via the at least one opening; moving the chuck device to which the at least one component has been adsorbed from the first position to a second position; The voltage applied to the chuck device is removed at a second location such that the at least one component is detached from the chuck device and is drawn from the first position to the second position.