TWI608332B - Electronic module and heat dissipation module - Google Patents

Description

Electronic module and thermal module

The invention relates to a heat dissipation module, and in particular to an electronic module using the heat dissipation module.

In recent years, with the development of the technology industry, electronic devices such as notebooks (notebooks, NBs), tablet PCs, and smart phones have frequently appeared in daily life. The types and functions of electronic devices are becoming more diverse, and the convenience and practicality make these electronic devices more popular and can be used for different purposes.

Electronic devices are usually equipped with a central processing unit (CPU), a system on chip (SOC) or other electronic components. However, these electronic components (for example, a central processing unit) generate a large amount of thermal energy during operation. . Therefore, how to integrate the heat dissipation design into the electronic device is also the focus of attention.

The invention provides an electronic module with a heat dissipation function.

The invention provides a heat dissipation module with a heat dissipation function.

The electronic module of the present invention comprises a substrate, a metal shielding cover, an electronic component and a piezoelectric component. The metal shielding cover is disposed on the substrate and forms a receiving cavity with the substrate, wherein the metal shielding cover has an opening, and the receiving cavity is communicated to the outside through the opening. The electronic component is disposed on the substrate and is received in the accommodating cavity. The piezoelectric element is attached to the metal shielding cover, wherein the piezoelectric element is adapted to drive a partial vibration of the metal shielding cover to change the volume of the accommodating cavity.

The heat dissipation module of the present invention comprises a housing and a piezoelectric element. The housing has a receiving cavity for accommodating a heat source, wherein the housing has an opening, and the receiving cavity is communicated to the outside through the opening. The piezoelectric element is attached to the housing, wherein the piezoelectric element is adapted to drive a local vibration of the housing to change the volume of the accommodating chamber and allow air to flow into or out of the accommodating chamber via the opening.

In an embodiment of the invention, the metal shielding cover comprises a side wall and an upper cover. The side wall is placed on the substrate and surrounds the electronic component, and the upper cover is disposed on the side wall.

In an embodiment of the invention, the opening is located on the side wall.

In an embodiment of the invention, the opening is located in the upper cover.

In an embodiment of the invention, the piezoelectric element and the upper cover form a buzzer.

In an embodiment of the invention, the electronic module further includes two one-way valves, wherein the opening includes a first opening and a second opening, and the two one-way valves respectively The first opening and the second opening are disposed such that the first opening and the second opening respectively serve as an inlet and an outlet.

In an embodiment of the invention, the two one-way valves comprise two barrier members. One of the two barrier members is disposed at the first opening and located at the inner side of the upper cover, and the two barrier members are disposed at the second opening and located outside the upper cover. An air flow flows from the outside of the accommodating cavity into the accommodating cavity via the first opening, and flows out of the accommodating cavity from the accommodating cavity through the second opening.

In an embodiment of the invention, the substrate comprises a circuit board, and the electronic component comprises a central processing unit, a radio frequency integrated circuit, a charging integrated circuit or a power amplifier.

In an embodiment of the invention, the heat dissipation module further includes two one-way valves, wherein the opening includes a first opening and a second opening, and the two one-way valves are respectively disposed on the first opening and the second opening, so that The first opening and the second opening serve as an inlet and an outlet, respectively. The air flows into the accommodating cavity from the outside of the accommodating cavity through the first opening, and flows out of the accommodating cavity from the accommodating cavity through the second opening.

Based on the above, the housing of the heat dissipation module of the present invention has a receiving cavity for accommodating a heat source, and the piezoelectric element of the heat dissipation module is attached to the housing. In this way, after the piezoelectric element is actuated, the local vibration of the housing is driven to change the volume of the accommodating cavity, and the air flows into or out of the accommodating cavity through the opening, and the thermal energy of the heat source is discharged outside the accommodating cavity. Similarly, the piezoelectric element of the electronic module of the present invention is attached to the metal shielding cover, wherein the metal shielding cover forms a receiving cavity with the substrate, and the electronic component is located in the receiving cavity. In this way, the piezoelectric element is actuated to drive the local vibration of the metal shielding cover to change the volume of the accommodating cavity, and the thermal energy of the electronic component is flowed into or out of the accommodating cavity by the airflow. Discharge out of the chamber. Accordingly, the electronic module and the heat dissipation module of the present invention have a heat dissipation function.

The above described features and advantages of the invention will be apparent from the following description.

100‧‧‧ Thermal Module

102‧‧‧heat source

104, 202‧‧‧ Air

110‧‧‧shell

112, 212‧‧‧ 容 cavity

114‧‧‧ openings

120, 240‧‧‧ Piezoelectric components

200, 200a‧‧‧ electronic modules

210‧‧‧Substrate

220‧‧‧Metal cover

222a‧‧‧first opening

222b‧‧‧ second opening

224‧‧‧Upper cover

226‧‧‧ side wall

230‧‧‧Electronic components

250‧‧‧ one-way valve

252‧‧‧Resistance

d‧‧‧Amplitude

1 is a schematic view of a heat dissipation module according to an embodiment of the present invention.

2 is a schematic diagram of an electronic module according to another embodiment of the present invention.

3A and 3B are schematic diagrams showing the operation of the electronic module of FIG. 2.

4 is a schematic diagram of an electronic module according to still another embodiment of the present invention.

1 is a schematic view of a heat dissipation module according to an embodiment of the present invention. Referring to FIG. 1 , in the embodiment, the heat dissipation module 100 includes a housing 110 and a piezoelectric element 120 . The housing 110 has a receiving cavity 112 for accommodating the heat source 102. The housing 110 has an opening 114 through which the receiving cavity 112 communicates to the outside. On the other hand, the piezoelectric element 120 is attached to the housing 110, wherein the piezoelectric element 120 can be disposed inside the housing 110 as shown in FIG. 1, but in other embodiments not shown, the piezoelectric element 120 is also It may be disposed on the outer side of the housing 110. Thus, after the piezoelectric element 120 is actuated, for example, an alternating current is introduced into the piezoelectric element 120, and the piezoelectric material (not shown) inside the piezoelectric element 120 generates a piezoelectric effect, and repeatedly stretches and contracts. Further, the piezoelectric element 120 is vibrated. At this time, since the piezoelectric element 120 is attached to the housing 110 in this embodiment, the piezoelectric element 120 is adapted to drive local vibration of the housing 110 after being actuated to change the volume of the accommodating cavity 112. In other words, in the present embodiment, when the piezoelectric element 120 drives the local vibration of the housing 110, a part of the housing 110 (for example, the upper half of the housing 110 of FIG. 1 ) moves back and forth relative to the accommodating cavity 112 , The volume of the accommodating cavity 112 is repeatedly increased and decreased. At this time, the air 104 can flow into or out of the accommodating cavity 112 through the opening 114 by the volume change of the accommodating cavity 112, and the flow path thereof is indicated by an arrow in FIG.

Further, in the present embodiment, the air 104 is sucked into the accommodating cavity 112 when the volume of the accommodating cavity 112 is increased, and is discharged to the accommodating cavity 112 when the volume of the accommodating cavity 112 is reduced. In this way, the air 104 that does not absorb thermal energy can flow from the outside of the accommodating cavity 112 into the accommodating cavity 112, and after absorbing the thermal energy of the heat generating source 102, flows out of the accommodating cavity 112 from the accommodating cavity 112, thereby discharging the heat energy of the heat generating source 102. Cavity 112. Accordingly, the heat dissipation module 100 has a heat dissipation function by arranging the piezoelectric element 120. In addition, in other embodiments not shown, the housing of the heat dissipation module may also have a plurality of openings for increasing the efficiency of the air flowing into and out of the accommodating cavity, thereby improving the heat dissipation efficiency of the heat dissipation module. Based on the above, the piezoelectric element 120 is attached to the housing 110, and after the piezoelectric element 120 is actuated to drive the local vibration of the housing 110, the air 104 can flow into or out of the housing cavity 112 of the housing 110. .

2 is a schematic diagram of an electronic module according to another embodiment of the present invention. Referring to FIG. 2 , in the embodiment, the electronic module 200 includes a substrate 210 , a metal shielding cover 220 , an electronic component 230 , and a piezoelectric component 240 . The metal shielding cover 220 is disposed on the substrate 210 The accommodating cavity 212 is formed by the first opening 222a and the second opening 222b. The accommodating cavity 212 communicates with the outside through the first opening 222a and the second opening 222b. The electronic component 230 is disposed on the substrate 210 and is received in the accommodating cavity 212. The piezoelectric element 240 is attached to the metal shielding cover 220 and, after being actuated, is adapted to drive local vibration of the metal shielding cover 220 to generate a heat dissipation effect.

Specifically, in the embodiment, the substrate 210 is, for example, a circuit board, and the electronic component 230 may be a central processing unit (CPU), a radio frequency integrated circuit (RF IC), and a charging product. An element such as a charger integrated circuit (charger IC) or a power amplifier (PA). Although FIG. 2 illustrates four electronic components 230, the present invention does not limit the type and number of electronic components 230. The electronic component 230 is disposed on the substrate 210 and electrically connected to the substrate 210 to perform a function corresponding to the type thereof. In this case, in order to prevent the electronic component 230 from being interfered with by the electromagnetic wave, for example, the metal shielding cover 220 of the embodiment is disposed on the substrate 210 when the electronic component 230 and the remaining electronic components are not interfered with each other when the signal is transmitted or received. The accommodating cavity 212 is formed with the substrate 210, and the electronic component 230 is accommodated in the accommodating cavity 212. In this manner, the electronic module 200 can shield the electronic component 230 by the accommodating cavity 212 formed by the metal shielding cover 220 and the substrate 210 to realize the function of electromagnetic shielding. Here, the heat dissipation effect can be achieved by combining the piezoelectric element 240 with the metal shielding cover 220. Similar to the design of the heat dissipation module 100 of FIG. 1 , the piezoelectric element 240 of the present embodiment is attached to the metal shielding cover 220 , and after being actuated, the piezoelectric element 240 is adapted to drive the local vibration of the metal shielding cover 220 to The volume of the accommodating cavity 212 is varied, and the air 202 (shown in the subsequent FIGS. 3A and 3B) is adapted to absorb thermal energy via the first opening 222a or the second opening 222b into or out of the accommodating cavity 212.

On the other hand, in the present embodiment, the metal shielding cover 220 includes a side wall 226 and an upper cover 224. The sidewall 226 stands on the substrate 210 and surrounds the electronic component 230. The upper cover 224 is disposed on the side wall 226 and faces the substrate 210. Moreover, in the embodiment, the first opening 222a and the second opening 222b are located in the upper cover 224, and the piezoelectric element 240 is located between the first opening 222a and the second opening 222b. As such, the piezoelectric element 240 is actuated to drive the upper cover 224 to vibrate to change the volume of the accommodating cavity 212. However, in other embodiments not shown, the metal shield cover 220 may have one or more openings, and the openings may be disposed on the upper cover 224 or the side walls 226, and the present invention does not limit the number and position of the openings. In addition, in other embodiments not shown, the piezoelectric element 240 is not limited to be located between the first opening 222a and the second opening 222b, and the piezoelectric element 240 is not limited to being attached to the inner side of the metal shielding cover 220, and is pressed. The position of the electrical component 240 can also be adjusted as needed, for example, attached to the outside of the metal shielding cover 220, and the invention is not limited thereto.

3A and 3B are schematic diagrams showing the operation of the electronic module of FIG. 2. Referring to FIG. 3A and FIG. 3B, in the present embodiment, the air 202 is already present in the accommodating cavity 212 and the outside before the piezoelectric element 240 is actuated. After the piezoelectric element 240 is actuated, for example, an alternating current is introduced into the piezoelectric element 240, and the piezoelectric element 240 drives a part of the metal shielding cover 220, for example, to drive the attached upper cover 224 to vibrate to change the accommodating cavity 212. volume of. For example, when the piezoelectric element 240 is introduced with a negative voltage, the piezoelectric element 240 vibrates upwards in FIG. 3A and generates an amplitude d to drive the upper cover 224 relative to The accommodating cavity 212 is moved outward to increase the volume of the accommodating cavity 212. At this time, the cold air 202 located outside the accommodating cavity 212 can flow into the accommodating cavity 212 from the first opening 222a and the second opening 222b by increasing the volume of the accommodating cavity 212, as shown in FIG. 3A (air 202). The flow path is indicated by an arrow in Figure 3A). In contrast, when the piezoelectric element 240 is introduced with a positive voltage, the piezoelectric element 240 vibrates to the lower side of FIG. 3B and generates an amplitude d to drive the upper cover 224 to move inwardly relative to the accommodating cavity 212 to make the accommodating cavity 212. The volume is reduced. At this time, the air 202 located in the accommodating cavity 212 can flow out of the accommodating cavity 212 from the first opening 222a and the second opening 222b by the volume reduction of the accommodating cavity 212, as shown in FIG. 3B (the air 202 The flow path is indicated by an arrow in Figure 3B). By introducing the alternating current into the piezoelectric element 240, the piezoelectric element 240 can repeatedly vibrate the upper cover 224 with respect to the accommodating cavity 212 to repeatedly suck in and discharge the air 202 by changing the volume of the accommodating cavity 212.

To make the drawing clearer, the amplitude d is shown to be more apparent in FIGS. 3A and 3B. 3A and 3B are not actual scales and are for illustrative purposes only. The larger the amplitude d is, the better the heat dissipation effect of the electronic module 200 is. However, the amplitude d of the vibration generated by the piezoelectric element 240 needs to be considered to the space of the accommodating cavity 212, that is, the piezoelectric element 240 is driven by the amplitude d. The heat dissipation mode of the vibration of the upper cover 224 does not interfere with the electronic component 230 in the accommodating cavity 212. Therefore, the value of the amplitude d can be adjusted according to the demand. Based on the above, the piezoelectric element 240 repeatedly drives the upper cover 224 to vibrate, and the air 202 that does not absorb thermal energy can flow from the outside of the accommodating cavity 212 into the accommodating cavity 212, and then dissipates from the accommodating cavity 212 after absorbing the thermal energy of the electronic component 230. The cavity 212, in turn, discharges the thermal energy of the electronic component 230 out of the receiving cavity 212. Accordingly, the piezoelectric element 240 is disposed by using The electromagnetic shielded metal shield cover 220 and the piezoelectric element 240 are actuated, and the electronic module 200 can have a heat dissipation function.

4 is a schematic diagram of an electronic module according to still another embodiment of the present invention. The main difference between the electronic module 200a and the electronic module 200 is that the electronic module 200a further includes two one-way valves 250 disposed on the first opening 222a and the second opening 222b, respectively. The first opening 222a and the second opening 222b are used as an inlet and an outlet, respectively. Specifically, in the electronic module 200, the first opening 222a and the second opening 222b communicate the accommodating cavity 212 to the outside, so that the cold air 202 can flow from the outside through the first opening 222a and the second opening 222b respectively. The cavity 212 is disposed, and the heat is absorbed from the accommodating cavity 212 and then flows out of the accommodating cavity 212 through the first opening 222a and the second opening 222b, respectively. In contrast, in the embodiment, the electronic module 200a disposes the two one-way valves 250 in the first opening 222a and the second opening 222b, respectively, so that the air 202 flows from one of the openings into the accommodating cavity 212 and from the other opening. The accommodating cavity 2l2 flows out.

For example, in the present embodiment, the one-way valve 250 includes two barrier members 252, wherein the barrier member 252 is, for example, a rubber, but the present invention does not limit the material of the barrier member 252, nor does it limit the one-way valve 250. composition. One of the two blocking members 252 is disposed on the inner side of the upper cover 222a and is disposed on the inner side of the upper cover 224, and the two blocking members 252 are disposed on the outer side of the upper cover 224b. Thus, when the piezoelectric element 240 is actuated to drive the upper cover 224 to vibrate, the upper cover 224 disturbs the air 202 around it to form an air flow. The airflow flows from the accommodating cavity 212 to the accommodating cavity 212 through the first opening 222a and the blocking member 252 through the volume change of the accommodating cavity 212. After the heat energy is absorbed, the accommodating cavity 212 flows out from the accommodating cavity 212 through the second opening 222b and the blocking member 252. The flow path of the air 202 forming the air flow is indicated by arrows in FIG. After the air 202 forming the airflow flows from the first opening 222a into the accommodating cavity 212, the air 202 located in the accommodating cavity 212 is blocked by the blocking member 252 located inside the upper cover 224, and cannot be discharged through the first opening 222a. Cavity 212. Similarly, after the air 202 forming the airflow flows out of the accommodating cavity 212 from the second opening 222b, the air 202 located outside the accommodating cavity 212 is blocked by the blocking member 252 located outside the upper cover 224, and cannot pass through the second opening 222b. Flowing into the accommodating cavity 212. In other words, the air 202 that does not absorb thermal energy flows into the accommodating cavity 212 from the first opening 222a, and the air 202 that has absorbed heat energy flows out of the accommodating cavity 212 from the second opening 222b.

Therefore, in the present embodiment, by the configuration of the one-way valve 250, the cold air 202 flowing into the accommodating cavity 212 has a low heat content, and more heat energy can be absorbed in the accommodating cavity 212. The air 202 flows out of the accommodating cavity 212 after absorbing heat energy and increasing the heat content. When the hot air 202 after absorbing thermal energy flows out of the accommodating cavity 212 and remains around the opening, the air 202 does not immediately flow back to the accommodating cavity 212 through the same opening. Accordingly, the electronic module 200a has good heat dissipation efficiency. However, the above configuration is only one embodiment of the present invention, and the present invention does not limit the number, position and type of the one-way valves 250, nor does it limit the configuration of the one-way valve 250. In addition, when the housing 110 of the heat dissipation module 100 has a plurality of openings 114, the heat dissipation module 100 can also be configured with the one-way valve 250 as described above, so that at least one of the openings 114 serves as an inlet, and at least one of the openings 114 as an outlet to improve heat dissipation efficiency. For the specific implementation, reference may be made to the foregoing electronic module 200a.

Referring to FIG. 2 again, in the embodiment, since the piezoelectric element 240 of the electronic module 200 is attached to the upper cover 224 of the metal shielding cover 220, the piezoelectric element 240 and the upper cover 224 may form a buzzer. Specifically, in general, the electronic module can be configured with a separate buzzer to sound as an indicator sound for operating the electronic module by the buzzer, or as a warning tone when the system or electronic component operates abnormally. In the present embodiment, the piezoelectric element 240 is attached to the upper cover 224 of the metal shielding cover 220 in order to achieve the aforementioned heat dissipation. The upper cover 224 can be made of stainless steel, brass or other suitable metal. Therefore, when the piezoelectric element 240 is actuated to drive the upper cover 224 to generate vibration, thereby generating the aforementioned heat dissipation effect, the deformation of the piezoelectric element 240 causes the upper cover made of metal to emit an audible sound. As such, the electronic module 200 can omit the configuration of an additional buzzer, and the piezoelectric element 240 and the upper cover 224 of the metal shielding cover 220 serve as a buzzer. From another point of view, the present embodiment can be regarded as that the piezoelectric element 240 in the buzzer is coupled to the metal shielding cover 220 for electromagnetic shielding, and the metal shielding cover 220 and the piezoelectric element 240 are simultaneously realized. Buzzer, electromagnetic shielding and heat dissipation. In other words, the present embodiment combines components for achieving different functions. Further, in this embodiment, the metal shielding cover 220 for realizing electromagnetic shielding is combined with the piezoelectric element 240 to form a buzzer, and at the same time, the piezoelectric element 240 is used to drive the local vibration of the metal shielding cover 220 to provide a heat dissipation function. .

In summary, the heat dissipation module of the present invention has a housing and a piezoelectric element, wherein the housing has a receiving cavity for accommodating a heat source, and the piezoelectric element is disposed on the housing. In this way, after the piezoelectric element is actuated, the local vibration of the housing is driven to change the volume of the accommodating cavity, and the air flows into or out of the accommodating cavity, and the thermal energy of the heat source is discharged. Outside the cavity. Similarly, the present invention applies the above design to an electronic module. The metal shielding cover of the electronic module of the present invention covers the electronic components disposed on the substrate, and the metal shielding cover forms a receiving cavity with the substrate to realize the function of electromagnetic shielding. In this way, the piezoelectric element is disposed on the metal shielding cover for performing electromagnetic shielding, and the electronic module can change the volume of the accommodating cavity by actuating the local vibration of the metal shielding cover after the piezoelectric element is actuated. The airflow flows into or out of the accommodating cavity to discharge the thermal energy of the electronic component out of the cavity. At the same time, the piezoelectric element and the metal shielding cover can also form a buzzer. Accordingly, the electronic module and the heat dissipation module of the present invention have a heat dissipation function, wherein the electronic module also integrates the functions of the electromagnetic shielding and the buzzer, and the electronic module integrates various functions.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.

200‧‧‧Electronic module

210‧‧‧Substrate

212‧‧‧容容

220‧‧‧Metal cover

222a‧‧‧first opening

222b‧‧‧ second opening

224‧‧‧Upper cover

226‧‧‧ side wall

230‧‧‧Electronic components

240‧‧‧Piezoelectric components

Claims (14)

An electronic module includes: a substrate; a metal shielding cover disposed on the substrate and forming a receiving cavity with the substrate, wherein the metal shielding cover has a first opening and a second opening, and the receiving The cavity is connected to the outside through the first opening and the second opening; an electronic component is disposed on the substrate and received in the receiving cavity; and a piezoelectric element is attached to the metal shielding cover. And being located between the first opening and the second opening, wherein the piezoelectric element is adapted to drive a partial vibration of the metal shielding cover to change the volume of the receiving cavity. The electronic module of claim 1, wherein the metal shielding cover comprises a side wall and an upper cover, the side wall is standing on the substrate and surrounding the electronic component, and the upper cover is disposed on the side wall. The electronic module of claim 2, wherein the first opening and the second opening are located on the side wall. The electronic module of claim 2, wherein the first opening and the second opening are located in the upper cover. The electronic module of claim 4, wherein the piezoelectric element forms a buzzer with the upper cover. The electronic module of claim 1, further comprising: two one-way valves respectively disposed on the first opening and the two openings, so that the first opening and the second opening respectively serve as an inlet and An exit. The electronic module of claim 6, wherein the two one-way valves comprise two barrier members, one of the two barrier members is disposed at the first opening and located inside the upper cover, and the two barrier members are Disposed on the second opening and located outside the upper cover, an airflow flows from the outside of the accommodating cavity into the accommodating cavity via the first opening, and flows out of the accommodating cavity through the second opening from the accommodating cavity . The electronic module of claim 1, wherein the substrate comprises a circuit board, and the electronic component comprises a central processing unit, a radio frequency integrated circuit, a charging integrated circuit or a power amplifier. The electronic module of claim 1, wherein the piezoelectric element is attached to an inner side of the metal shielding cover. A heat dissipation module includes: a housing having a receiving cavity for receiving a heat source, wherein the housing has a first opening and a second opening, the receiving cavity is configured by the first opening And communicating with the second opening to the outside; and a piezoelectric element attached to the housing and located between the first opening and the second opening, wherein the piezoelectric element is adapted to drive the A part of the housing vibrates to change the volume of the accommodating cavity, and the air flows into or out of the accommodating cavity through the first opening and the second opening. The heat dissipation module of claim 10, further comprising: two one-way valves respectively disposed on the first opening and the two openings, so that the first opening and the second opening respectively serve as an inlet and An outlet from which the air passes The venting chamber flows into the accommodating cavity through the first opening, and flows out of the accommodating cavity through the second opening from the accommodating cavity. The heat dissipation module of claim 10, wherein the piezoelectric element is attached to an inner side of the housing. An electronic module includes: a substrate; a metal shielding cover disposed on the substrate and forming a receiving cavity with the substrate, wherein the metal shielding cover has an opening, and the receiving cavity is connected to the opening through the opening An external component; an electronic component disposed on the substrate and housed in the accommodating cavity; and a piezoelectric element attached to the inner side of the metal shielding cover, wherein the piezoelectric component is adapted to be driven after being actuated The metal shields a portion of the cover from vibration to change the volume of the receiving cavity. A heat dissipation module includes: a housing having a receiving cavity for accommodating a heat source, wherein the housing has an opening, the receiving cavity is communicated to the outside through the opening; and a piezoelectric element Attached to the inner side of the casing, wherein the piezoelectric element is adapted to drive a partial vibration of the casing to change the volume of the accommodating cavity and allow air to flow into or out of the accommodating space through the opening Set the cavity.