TWI608109B - Rolled copper foil and lithium ion secondary battery and lithium ion capacitor using the same - Google Patents

Rolled copper foil and lithium ion secondary battery and lithium ion capacitor using the same Download PDF

Info

Publication number
TWI608109B
TWI608109B TW105108059A TW105108059A TWI608109B TW I608109 B TWI608109 B TW I608109B TW 105108059 A TW105108059 A TW 105108059A TW 105108059 A TW105108059 A TW 105108059A TW I608109 B TWI608109 B TW I608109B
Authority
TW
Taiwan
Prior art keywords
copper foil
less
rolled copper
lithium ion
heat treatment
Prior art date
Application number
TW105108059A
Other languages
Chinese (zh)
Other versions
TW201708549A (en
Inventor
Kaichiro Nakamuro
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of TW201708549A publication Critical patent/TW201708549A/en
Application granted granted Critical
Publication of TWI608109B publication Critical patent/TWI608109B/en

Links

Classifications

    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10Energy storage using batteries

Description

壓延銅箔與使用其之鋰離子二次電池及鋰離子電容器 Calendered copper foil and lithium ion secondary battery and lithium ion capacitor using same

本發明係關於一種適合用於含有鋰離子電池之二次電池的電極之集電體或負極活性物質載體的二次電池用壓延銅箔與使用其之鋰離子二次電池及鋰離子電容器。 The present invention relates to a rolled copper foil for a secondary battery suitable for use in a current collector or an anode active material carrier of an electrode including a secondary battery of a lithium ion battery, and a lithium ion secondary battery and a lithium ion capacitor using the same.

由於鋰離子電池輕量且能量密度高,正被用於許多領域中。並且,作為鋰離子電池之電極(負極)之集電體,自以往一直使用銅組分99.9%之被稱為精銅的壓延銅箔或電解銅箔。 Lithium-ion batteries are being used in many fields due to their light weight and high energy density. Further, as a current collector of an electrode (negative electrode) of a lithium ion battery, a rolled copper foil or an electrolytic copper foil called 99.9% of a copper component has been conventionally used.

然而,集電體中塗敷有電極活性物質,但伴隨著鋰離子之移動,充放電時活性物質膨脹、收縮,每次充放電,作為集電體之銅箔承受重複負載。並且,若銅箔因膨脹而產生塑性變形,則下次收縮時皺褶會集中於銅箔。另一方面,若收縮時銅箔產生塑性變形,則有於下次膨脹時銅箔破損之虞。為了避免該等異常,要求銅箔具有高強度。 However, the current collector is coated with the electrode active material, but the active material expands and contracts during charge and discharge with the movement of lithium ions, and the copper foil as the current collector receives a repeated load every time the charge and discharge are performed. Further, if the copper foil is plastically deformed by expansion, the wrinkles are concentrated on the copper foil at the time of the next shrinkage. On the other hand, if the copper foil is plastically deformed at the time of shrinkage, there is a possibility that the copper foil is broken at the time of the next expansion. In order to avoid such an abnormality, the copper foil is required to have high strength.

又,於負極之製造步驟中,對銅箔施加350℃左右之熱,故而要求銅箔具有於該熱處理後仍保持高強度之耐熱性。 Further, in the manufacturing step of the negative electrode, heat of about 350 ° C is applied to the copper foil, so that the copper foil is required to have high heat resistance after the heat treatment.

根據此情況,揭示有添加有0.1質量%以上之Zr或Ti之集電體用壓延銅箔(專利文獻1)。又,揭示有添加有0.01質量%之Ti或0.05 質量%之Zr的可撓性印刷基板用壓延銅箔(專利文獻2)。又,揭示有添加有0.01~0.20質量%之Zr之壓延銅箔(專利文獻3)。 In this case, a rolled copper foil for a current collector to which 0.1% by mass or more of Zr or Ti is added is disclosed (Patent Document 1). Further, it is disclosed that 0.01% by mass of Ti or 0.05 is added. Rolled copper foil for a flexible printed circuit board of mass % Zr (Patent Document 2). Further, a rolled copper foil to which Zr is added in an amount of 0.01 to 0.20% by mass is disclosed (Patent Document 3).

[專利文獻1]日本專利5654911號公報 [Patent Document 1] Japanese Patent No.5654911

[專利文獻2]日本專利5055088號公報(實施例5、7) [Patent Document 2] Japanese Patent No. 5055088 (Embodiment 5, 7)

[專利文獻3]日本專利4254488號公報 [Patent Document 3] Japanese Patent No. 4254488

然而,明白了於專利文獻1所記載之壓延銅箔之情形,導電率會降低。此被認為是由於Zr或Ti之添加量多,且於熱軋後最終冷軋前進行之退火的溫度為低溫(200℃以下)。 However, in the case of the rolled copper foil described in Patent Document 1, the conductivity is lowered. This is considered to be because the addition amount of Zr or Ti is large, and the temperature of annealing before final cold rolling after hot rolling is low temperature (200 ° C or lower).

又,將電極活性物質塗敷於集電體用壓延銅箔後進行乾燥,但於該乾燥步驟中,銅箔熱歷程增加。因此,若銅箔之強度因熱而降低,則於乾燥步驟中,有時銅箔會產生皺褶。然而,上述之專利文獻1~3記載之壓延銅箔,會有因熱導致強度大幅降低之問題。 Further, the electrode active material is applied to the rolled copper foil for a current collector and then dried, but in the drying step, the heat history of the copper foil is increased. Therefore, if the strength of the copper foil is lowered by heat, wrinkles may occur in the copper foil during the drying step. However, the rolled copper foil described in the above Patent Documents 1 to 3 has a problem that the strength is largely lowered due to heat.

進而,若於銅箔表面存在許多Zr或Ti之粗大夾雜物(亦包含自熔解鑄造時存在之粒子)粒子,則有成為針孔之原因,或於塗敷電極活性物質而裝配電池後,夾雜物脫落,電池之動作產生異常之虞。 Further, if a large number of coarse inclusions of Zr or Ti (including particles existing during the melting and casting) are present on the surface of the copper foil, the pinhole may be formed, or the battery may be assembled after the electrode active material is applied. When the object falls off, the action of the battery causes an abnormality.

即,本發明係為解決上述之問題而成者,其目的在於提供一種強度、耐熱性及導電性優異之二次電池用壓延銅箔與使用其之鋰離子二次電池及鋰離子電容器。 In other words, the present invention has been made to solve the above problems, and an object of the invention is to provide a rolled copper foil for a secondary battery which is excellent in strength, heat resistance and electrical conductivity, and a lithium ion secondary battery and a lithium ion capacitor using the same.

本發明人等多方探討,結果發現,藉由減小特定之熱處理前後的拉伸強度之變化率,且減少銅箔表面之Zr或Ti的夾雜物,能夠抑制由熱引起之強度降低。 As a result of investigations by the inventors of the present invention, it has been found that by reducing the rate of change of the tensile strength before and after the specific heat treatment and reducing the inclusions of Zr or Ti on the surface of the copper foil, it is possible to suppress the decrease in strength due to heat.

即,本發明之壓延銅箔含有合計100~500重量ppm之選自Ti及Zr之群的1種以上,氧濃度為50重量ppm以下,以350℃進行1小時熱處理後根據JIS-Z2241之與壓延方向平行的拉伸強度為350MPa以上,且該熱處理後之導電率為90%IACS以上,於上述熱處理之前後,上述拉伸強度之變化率為10%以下,於銅箔表面之1000μm2之範圍,長軸1μm~5μm之Zr或Ti的夾雜物為10個以下。 In other words, the rolled copper foil of the present invention contains one or more selected from the group consisting of Ti and Zr in a total amount of 100 to 500 ppm by weight, and has an oxygen concentration of 50 ppm by weight or less, and is heat-treated at 350 ° C for 1 hour, according to JIS-Z2241. The tensile strength parallel to the rolling direction is 350 MPa or more, and the electrical conductivity after the heat treatment is 90% IACS or more. After the above heat treatment, the rate of change of the tensile strength is 10% or less, and 1000 μm 2 of the surface of the copper foil. In the range, the number of inclusions of Zr or Ti having a long axis of 1 μm to 5 μm is 10 or less.

長軸10μm以上50μm以下之針孔較佳為50個/m2以下。 The pinhole having a long axis of 10 μm or more and 50 μm or less is preferably 50/m 2 or less.

較佳厚度為20μm以下。 A preferred thickness is 20 μm or less.

較佳於熱軋後重複1次以上退火及冷軋,以加工度80%以上95%以下進行最終冷軋而製造,在上述熱軋後上述最終冷軋前於700℃以上1000℃以下進行至少1次之高溫退火。 It is preferable to repeat annealing and cold rolling one time or more after hot rolling, and to perform final cold rolling with a working degree of 80% or more and 95% or less, and to perform at least 700 ° C to 1000 ° C or less before the final cold rolling after the hot rolling. 1 time high temperature annealing.

本發明之鋰離子二次電池使用上述二次電池用壓延銅箔。 The lithium ion secondary battery of the present invention uses the above-described rolled copper foil for a secondary battery.

本發明之鋰離子電容器使用上述二次電池用壓延銅箔。 The lithium ion capacitor of the present invention uses the above-described rolled copper foil for a secondary battery.

根據本發明,能夠獲得強度、耐熱性及導電性優異之二次電池用壓延銅箔與使用其之鋰離子二次電池及鋰離子電容器。 According to the present invention, a rolled copper foil for a secondary battery excellent in strength, heat resistance, and conductivity can be obtained, and a lithium ion secondary battery and a lithium ion capacitor using the same can be used.

圖1係實施例1之銅箔表面的掃描型電子顯微鏡之二次電子 像。 1 is a secondary electron of a scanning electron microscope on the surface of a copper foil of Example 1. image.

圖2係比較例4之銅箔表面的掃描型電子顯微鏡之反射電子像。 Fig. 2 is a reflection electron image of a scanning electron microscope of the surface of the copper foil of Comparative Example 4.

以下,對本發明之實施形態之二次電池用壓延銅箔進行說明。 Hereinafter, a rolled copper foil for a secondary battery according to an embodiment of the present invention will be described.

<成分組成> <Component composition>

作為壓延銅箔,能夠較佳地使用作為純銅系之組成之符合JIS-H3100(C1100)的精銅(TPC)或JIS-H3100(C1020)的無氧銅(OFC)。又,不含添加元素之純銅由於會因熱處理而完全再結晶,故而含有合計100~500重量ppm之選自Ti及Zr之群1種以上,氧濃度為50重量ppm以下。 As the rolled copper foil, oxygen-free copper (OFC) which is a pure copper-based composition of JIS-H3100 (C1100)-compliant refined copper (TPC) or JIS-H3100 (C1020) can be preferably used. In addition, pure copper containing no added element is completely recrystallized by heat treatment, and therefore contains one or more groups selected from the group consisting of Ti and Zr in a total amount of 100 to 500 ppm by weight, and the oxygen concentration is 50 ppm by weight or less.

Ti及Zr可提高耐熱性,即便受到熱處理,亦能抑制由再結晶引起之結晶粒之粗大化。若Ti及Zr之含量之合計未達100重量ppm,則不會提高耐熱性,若超過500重量ppm,則導電率降低。 Ti and Zr can improve heat resistance, and even if subjected to heat treatment, coarsening of crystal grains caused by recrystallization can be suppressed. When the total content of Ti and Zr is less than 100 ppm by weight, the heat resistance is not improved, and when it exceeds 500 ppm by weight, the electrical conductivity is lowered.

又,若氧濃度超過50重量ppm,則添加之Zr或Ti會氧化,由添加元素引起之效果降低,或該等的夾雜物增加。 Further, when the oxygen concentration exceeds 50 ppm by weight, the added Zr or Ti is oxidized, the effect by the added element is lowered, or the inclusions are increased.

<拉伸強度> <tensile strength>

本發明之壓延銅箔以350℃進行1小時熱處理後之拉伸強度為350MPa以上。若拉伸強度為350MPa以上,則即便每次充放電,作為集電體或負極活性物質載體之銅箔承受重複負載,亦能防止皺褶集中於銅箔或銅箔破損。 The rolled copper foil of the present invention has a tensile strength of 350 MPa or more after heat treatment at 350 ° C for 1 hour. When the tensile strength is 350 MPa or more, even if the copper foil as the current collector or the negative electrode active material carrier receives a repeated load, the wrinkles are prevented from being concentrated on the copper foil or the copper foil.

再者,拉伸強度係藉由拉伸試驗機,根據JIS-Z2241,測量與壓延方 向平行的方向之拉伸強度(斷裂強度)而求得。 Furthermore, the tensile strength is measured and calendered according to JIS-Z2241 by a tensile tester. The tensile strength (breaking strength) in the parallel direction was determined.

<導電率> <Electrical conductivity>

本發明之壓延銅箔以350℃進行1小時熱處理後之導電率為90%IACS以上。若上述導電率未達90%IACS,則不適於作為二次電池之集電體。導電率根據JIS-H0505藉由4端子法測量。 The electrical conductivity of the rolled copper foil of the present invention after heat treatment at 350 ° C for 1 hour is 90% IACS or more. If the above conductivity is less than 90% IACS, it is not suitable as a current collector of a secondary battery. The conductivity was measured by a 4-terminal method in accordance with JIS-H0505.

本發明之壓延銅箔之厚度較佳為20μm以下,更佳為5μm~18μm,更佳為7μm~15μm,最佳為10μm~15μm。 The thickness of the rolled copper foil of the present invention is preferably 20 μm or less, more preferably 5 μm to 18 μm, still more preferably 7 μm to 15 μm, most preferably 10 μm to 15 μm.

<由熱處理引起之拉伸強度之變化率> <Change rate of tensile strength caused by heat treatment>

本發明之壓延銅箔以350℃進行1小時熱處理之前後,上述之拉伸強度之變化率為10%以下。將電極活性物質塗敷於集電體用壓延銅箔之後,於乾燥步驟中,銅箔熱歷程增加。因此,若銅箔之拉伸強度之上述變化率超過10%,則由熱引起之強度降低變大,於乾燥步驟中,銅箔產生皺褶。再者,以350℃進行之1小時熱處理成為較實際之乾燥條件更苛刻的加速試驗,若熱處理之前後的拉伸強度之變化率為10%以下,則能抑制實際之乾燥步驟之皺褶。 The rolling strength of the rolled copper foil of the present invention after the heat treatment at 350 ° C for 1 hour is 10% or less. After the electrode active material is applied to the rolled copper foil for a current collector, the heat history of the copper foil is increased in the drying step. Therefore, when the above-described rate of change of the tensile strength of the copper foil exceeds 10%, the strength reduction due to heat becomes large, and the copper foil wrinkles in the drying step. Further, the one-hour heat treatment at 350 ° C becomes an accelerated test which is more severe than the actual drying conditions, and if the rate of change of the tensile strength after the heat treatment is 10% or less, wrinkles in the actual drying step can be suppressed.

<Zr或Ti的夾雜物> <Inclusions of Zr or Ti>

本發明之壓延銅箔於銅箔表面的1000μm2之範圍,長軸1μm~5μm之Zr或Ti的夾雜物為10個以下。Zr或Ti的夾雜物通常為氧化物。若上述夾雜物超過10個,則有成為銅箔之針孔之原因,或塗敷電極活性物質而裝配電池後,夾雜物脫落,電池之動作產生異常之虞。 The rolled copper foil of the present invention has a range of 1000 μm 2 on the surface of the copper foil, and 10 or less inclusions of Zr or Ti having a long axis of 1 μm to 5 μm. The inclusion of Zr or Ti is usually an oxide. When the number of the inclusions exceeds 10, there is a cause of pinholes in the copper foil, or when the battery is assembled by applying the electrode active material, the inclusions are detached, and the operation of the battery is abnormal.

夾雜物之長軸之測量方法將於下文敍述。再者,由於長軸1μm~5μm的夾雜物之個數於350℃進行1小時熱處理之前後不產生變化,故而可於熱 處理前後之任一情況下測量。 The measurement method of the long axis of inclusions will be described below. In addition, since the number of inclusions having a long axis of 1 μm to 5 μm does not change after heat treatment at 350 ° C for 1 hour, it can be heated. Measured in any case before and after treatment.

<針孔之個數> <number of pinholes>

於本發明之壓延銅箔中,長軸10μm以上50μm以下之針孔較佳為50個/m2以下。若針孔超過50個/m2,則當將電極活性物質之漿料塗敷於銅箔時,有時該漿料會滲出至銅箔背面,而難以將塗敷厚度保持固定。針孔之長軸未達10μm者由於漿料不易滲出至銅箔背面,故而不成為問題,且幾乎沒有針孔之長軸超過50μm者。 In the rolled copper foil of the present invention, the pinhole having a long axis of 10 μm or more and 50 μm or less is preferably 50/m 2 or less. When the pinhole exceeds 50 pieces/m 2 , when the slurry of the electrode active material is applied to the copper foil, the slurry may bleed out to the back surface of the copper foil, and it is difficult to keep the coating thickness constant. When the long axis of the pinhole is less than 10 μm, since the slurry does not easily bleed out to the back surface of the copper foil, it does not become a problem, and almost no long axis of the pinhole exceeds 50 μm.

再者,針孔之長軸之測量方法將於下文敍述。再者,由於長軸10μm~50μm之針孔之個數於350℃進行1小時熱處理之前後不產生變化,故而可於熱處理之前後之任一情況下測量。 Furthermore, the measurement method of the long axis of the pinhole will be described below. Further, since the number of pinholes having a long axis of 10 μm to 50 μm does not change after heat treatment at 350 ° C for 1 hour, it can be measured in any of the cases after the heat treatment.

本發明之壓延銅箔能夠較佳地用於鋰離子二次電池或鋰離子電容器等之電極(負極)之集電體或負極活性物質載體中,但用途並未限定。特別是,若銅箔之厚度為20μm以下,則由熱處理引起之強度降低變得顯著,故而能夠有效地應用本發明。 The rolled copper foil of the present invention can be preferably used for a current collector or a negative electrode active material carrier of an electrode (negative electrode) such as a lithium ion secondary battery or a lithium ion capacitor, but the use is not limited. In particular, when the thickness of the copper foil is 20 μm or less, the strength reduction due to the heat treatment becomes remarkable, and thus the present invention can be effectively applied.

<壓延銅箔之製造> <Manufacture of rolled copper foil>

本發明之壓延銅箔能夠於鑄造上述組成之鑄錠之後,進行熱軋,其次重複1次以上退火及冷軋,進行最終冷軋而製造。於對成為本發明之壓延銅箔的原料之鑄塊進行熔解鑄造時,Zr或Ti之添加中較佳使用該等之母合金。其原因在於,Zr及Ti熔點高,於作為金屬而添加之情形時,難以固溶於作為母材之Cu。又,母合金較佳為加工成片狀等,增大與Cu溶融金屬之接觸面積者。 The rolled copper foil of the present invention can be subjected to hot rolling after casting the ingot of the above composition, and then repeatedly subjected to annealing and cold rolling one time or more, and finally cold rolled. In the case of melt-casting an ingot which is a raw material of the rolled copper foil of the present invention, it is preferred to use such a master alloy for the addition of Zr or Ti. The reason for this is that Zr and Ti have a high melting point, and when added as a metal, it is difficult to dissolve in Cu as a base material. Further, the mother alloy is preferably processed into a sheet shape or the like to increase the contact area with the molten metal of Cu.

然而,由於表面積大之母合金有於保管過程中氧化,提高溶融金屬之 氧濃度之虞,故而必須使用氧含量少之母合金。具體而言,有將母合金保管於惰性氣體中、即將添加至溶融金屬之前粉碎成片狀、使用前於還原性氣體中加熱等方法,為了降低母合金之氧含量,亦可使用上述以外之方法。 However, since the mother alloy having a large surface area is oxidized during storage, the molten metal is increased. Since the oxygen concentration is high, it is necessary to use a mother alloy having a small oxygen content. Specifically, the master alloy may be stored in an inert gas, pulverized into a sheet form immediately before being added to the molten metal, and heated in a reducing gas before use. In order to reduce the oxygen content of the master alloy, other than the above may be used. method.

將最終冷軋之加工度設為80%以上95%以下。若將最終冷軋之加工度設為未達80%,則有作為集電體無法獲得所需之強度之情形。若最終冷軋之加工度超過95%,則藉由加工硬化,壓延後之強度變高,但藉由對銅箔進行熱處理時加工應變降低,強度大幅度降低,故而於上述熱處理之前後拉伸強度之變化率超過10%。 The degree of processing of the final cold rolling is set to be 80% or more and 95% or less. If the degree of processing of the final cold rolling is set to less than 80%, there is a case where the required strength cannot be obtained as a current collector. If the degree of processing of the final cold rolling exceeds 95%, the strength after rolling is increased by work hardening. However, when the copper foil is heat-treated, the processing strain is lowered and the strength is greatly lowered, so that the film is stretched before the heat treatment. The rate of change in strength exceeds 10%.

又,在熱軋後最終冷軋前,於700℃以上1000℃以下進行至少1次之高溫退火。 Further, at least 700 times of high temperature annealing is performed at 700 ° C or more and 1000 ° C or less before final cold rolling after hot rolling.

若上述高溫退火之溫度未達700℃,則作為添加元素之Ti、Zr不能充分地擴散至銅中,該等添加元素之大部分成為析出狀態。於該情形時,導電率成為90%IACS以上,但析出之Ti或Zr之粒子成為針孔或蝕刻不良等之原因。另一方面,若上述高溫退火之溫度超過1000℃,則由於銅材料產生部分熔解,組成變得不均勻,故而於其後之加工中,材料變得易斷裂。 When the temperature of the high-temperature annealing is less than 700 ° C, Ti and Zr as additive elements are not sufficiently diffused into the copper, and most of the added elements are in a precipitation state. In this case, the electrical conductivity is 90% IACS or more, but the precipitated particles of Ti or Zr cause pinholes or etching failure. On the other hand, if the temperature of the high-temperature annealing exceeds 1000 ° C, the copper material is partially melted and the composition becomes uneven, so that the material is easily broken during the subsequent processing.

再者,上述高溫退火亦可於批式爐、連續退火爐之任一者中進行。 Further, the high temperature annealing may be performed in any of a batch furnace and a continuous annealing furnace.

又,亦可於上述高溫退火之後,於300℃~500℃進行0.5小時~4小時之低溫退火。藉由該低溫退火,於高溫退火中固溶於Cu母相內之Zr或Ti析出,能夠提高導電率。 Further, after the high-temperature annealing described above, the low-temperature annealing may be performed at 300 ° C to 500 ° C for 0.5 to 4 hours. By this low-temperature annealing, Zr or Ti which is dissolved in the Cu mother phase during high-temperature annealing is precipitated, and the conductivity can be improved.

【實施例】 [Examples]

首先,對JIS-H3100(C1020)之無氧銅添加表1記載之元素,製造表1所記載之組成的銅鑄錠(殘餘部分為銅及不可避免之雜質), 熱軋至厚度10mm為止,其次重複1次以上退火及冷軋,進行最終冷軋,獲得表2所示厚度之銅箔(各實施例及比較例)。又,於熱軋後最終冷軋前,以表1所示之條件退火。 First, the elements described in Table 1 were added to the oxygen-free copper of JIS-H3100 (C1020), and the copper ingot of the composition shown in Table 1 was produced (the residual part was copper and unavoidable impurities). After hot rolling to a thickness of 10 mm, the annealing and cold rolling were repeated one time or more, and final cold rolling was performed to obtain copper foils having the thicknesses shown in Table 2 (various examples and comparative examples). Further, it was annealed under the conditions shown in Table 1 before final cold rolling after hot rolling.

再者,僅比較例4,代替無氧銅,對JIS-H3100(C1100)之精銅(TPC)添加表1所記載之元素,製造銅鑄錠。 Further, in Comparative Example 4, instead of oxygen-free copper, elements described in Table 1 were added to JIS-H3100 (C1100) refined copper (TPC) to produce a copper ingot.

<評價> <evaluation>

測量將進行最終壓延獲得之銅箔試樣以350℃進行1小時熱處理前後之拉伸強度及上述熱處理後之導電率。 The tensile strength of the copper foil sample obtained by final rolling at 350 ° C for 1 hour before and after heat treatment and the electrical conductivity after the above heat treatment were measured.

將用於拉伸強度及斷裂伸長率之測量的試驗片之尺寸設為寬12.7mm、長度110mm,將拉伸試驗機之夾頭間之距離(拉伸長度)設為50mm,根據JIS-Z2241,如上所述與壓延方向平行地拉伸,加以測量。 The test piece for measurement of tensile strength and elongation at break was set to have a width of 12.7 mm and a length of 110 mm, and the distance between the chucks of the tensile tester (stretching length) was set to 50 mm, according to JIS-Z2241. It was stretched in parallel with the rolling direction as described above and measured.

又,導電率根據JIS-H0505藉由4端子法測量。 Further, the electrical conductivity was measured by a 4-terminal method in accordance with JIS-H0505.

<Zr或Ti的夾雜物之個數> <Number of inclusions of Zr or Ti>

對以350℃進行1小時熱處理前的銅箔試樣之表面進行適當之電解研磨或酸洗而去除附著物之後,藉由掃描型電子顯微鏡(FEI公司製造之XL30SFEG)以觀察倍率1000倍、觀察視野1000μm2進行觀察,對色調與銅箔基質不同之部位進行圖像分析並取出,於相接於取出之各部位的外周之平行的兩條直線之間隔內,將最大值設為長軸。對上述觀察視野內之各粒子,分別測量長軸,計入長軸為1~5μm者之個數。觀察可藉二次電子像及反射電子像之任一者進行,但以易識別夾雜物之反射電子像的觀察較佳。 The surface of the copper foil sample before heat treatment at 350 ° C for 1 hour was subjected to appropriate electrolytic polishing or pickling to remove the deposit, and then observed by a scanning electron microscope (XL30SFEG manufactured by FEI Corporation) at a magnification of 1,000 times. The field of view was observed at 1000 μm 2 , and the image having different color tone and copper foil substrate was subjected to image analysis and taken out, and the maximum value was set to the long axis in the interval between the two straight lines which are adjacent to each other at the outer periphery of each of the extracted portions. The long axis is measured for each particle in the above observation field, and the number of the long axis is 1 to 5 μm. The observation can be performed by either of the secondary electron image and the reflected electron image, but it is preferable to observe the reflected electron image of the inclusion easily.

<針孔之個數> <number of pinholes>

使用光學式檢查法測量針孔之長軸及個數,該光學式檢查法係自以350℃進行1小時熱處理前的銅箔試樣之背面照射光而檢測有無來自針孔的透射光。針孔之檢測以如下方式進行。首先,將銅箔置於透光桌(light table)上,以來自針孔之透射光確認各個針孔位置,獲得以顯微鏡放大該位置附近後之圖像。繼而,對該圖像進行圖像分析,取出與針孔相當之明部,於相接於取出之各部位的外周之平行的兩條直線之間隔內,將最大值設為長軸。對特定之觀察區域內全部之針孔,分別測量長軸,計入長軸10μm以上50μm以下者之個數。 The long axis and the number of pinholes were measured by an optical inspection method. The optical inspection method was performed by irradiating light from the back surface of the copper foil sample before heat treatment at 350 ° C for 1 hour to detect the presence or absence of transmitted light from the pinhole. The detection of the pinholes was carried out in the following manner. First, the copper foil was placed on a light table, and the position of each pinhole was confirmed by the transmitted light from the pinhole, and an image obtained by magnifying the vicinity of the position with a microscope was obtained. Then, the image was subjected to image analysis, and the bright portion corresponding to the pinhole was taken out, and the maximum value was set to the long axis in the interval between the two straight lines parallel to the outer circumference of each portion to be taken out. The long axis is measured for all the pinholes in a specific observation area, and the number of the long axis of 10 μm or more and 50 μm or less is counted.

將所得之結果示於表1、表2。再者,表1之氧濃度為鑄錠所含之氧濃度。 The results obtained are shown in Tables 1 and 2. Further, the oxygen concentration in Table 1 is the oxygen concentration contained in the ingot.

由表1、表2明確可知,在熱軋後最終冷軋前於700℃以上1000℃以下進行高溫退火後之各實施例之情形時,以350℃進行1小時熱處理後之拉伸強度為350MPa以上,熱處理後之導電率為90%IACS以上,熱處理前後的拉伸強度之變化率為10%以下,長軸1μm~5μm之Zr或Ti的夾雜物為10個以下。 As is clear from Tables 1 and 2, in the case of each of the examples after high-temperature annealing at 700 ° C to 1000 ° C before final cold rolling after hot rolling, the tensile strength after heat treatment at 350 ° C for 1 hour was 350 MPa. As described above, the electric conductivity after the heat treatment is 90% IACS or more, the rate of change in tensile strength before and after the heat treatment is 10% or less, and the inclusions of Zr or Ti having a long axis of 1 μm to 5 μm are 10 or less.

另一方面,於Ti及Zr之含量的合計未達100重量ppm之比較例1之情形時,以350℃進行1小時熱處理後之拉伸強度降低至未達350MPa,並且熱處理前後的拉伸強度之變化率超過10%。 On the other hand, in the case of Comparative Example 1 in which the total content of Ti and Zr was less than 100 ppm by weight, the tensile strength after heat treatment at 350 ° C for 1 hour was lowered to less than 350 MPa, and tensile strength before and after heat treatment. The rate of change is over 10%.

於熱軋後最終冷軋前的退火溫度未達700℃之比較例2之情形時,長軸1μm~5μm之Zr或Ti的夾雜物超過10個,以350℃進行1小時熱處理 後之拉伸強度降低至未達350MPa,並且熱處理前後的拉伸強度之變化率超過10%。 In the case of Comparative Example 2, when the annealing temperature before the final cold rolling was less than 700 ° C after hot rolling, the inclusions of Zr or Ti having a long axis of 1 μm to 5 μm exceeded 10, and heat treatment was performed at 350 ° C for 1 hour. The tensile strength thereafter was lowered to less than 350 MPa, and the rate of change in tensile strength before and after the heat treatment exceeded 10%.

於熱軋後最終冷軋前的退火溫度超過1000℃之比較例3之情形時,於最終冷軋時材料破損,未能製造銅箔。 In the case of Comparative Example 3 in which the annealing temperature before the final cold rolling after hot rolling exceeded 1000 ° C, the material was broken at the final cold rolling, and the copper foil could not be produced.

於氧濃度超過50重量ppm之比較例4之情形時,於熱處理前後,拉伸強度之變化率超過10%,長軸1μm~5μm之Zr或Ti的夾雜物超過10個。 In the case of Comparative Example 4 in which the oxygen concentration exceeded 50 ppm by weight, the rate of change in tensile strength before and after the heat treatment exceeded 10%, and the inclusions of Zr or Ti having a long axis of 1 μm to 5 μm exceeded 10.

於最終冷軋的加工度超過95%之比較例7之情形時,於熱處理前後,拉伸強度之變化率超過10%,長軸1μm~5μm之Zr或Ti的夾雜物超過10個。 In the case of Comparative Example 7 in which the degree of processing of the final cold rolling was more than 95%, the rate of change in tensile strength before and after the heat treatment exceeded 10%, and the inclusions of Zr or Ti having a long axis of 1 μm to 5 μm exceeded 10.

於Ti及Zr之含量的合計超過500重量ppm之比較例5、6、8之情形時,以350℃進行1小時熱處理後之導電率降低至未達90%IACS。 In the case of Comparative Examples 5, 6, and 8 in which the total content of Ti and Zr exceeded 500 ppm by weight, the electrical conductivity after heat treatment at 350 ° C for 1 hour was lowered to less than 90% IACS.

於未添加Ti及Zr之任一者之比較例9~10之情形時,以350℃進行1小時熱處理後之拉伸強度降低至未達350MPa。 In the case of Comparative Examples 9 to 10 in which neither Ti nor Zr was added, the tensile strength after heat treatment at 350 ° C for 1 hour was lowered to less than 350 MPa.

於未添加Ti及Zr之任一者而大量添加Sn(超過1000重量ppm)之比較例11、12之情形時,於熱處理之前後,拉伸強度之變化率超過10%。 In the case of Comparative Examples 11 and 12 in which a large amount of Sn (more than 1000 ppm by weight) was added without adding any of Ti and Zr, the rate of change in tensile strength after the heat treatment was more than 10%.

再者,圖1為實施例1之銅箔表面的掃描型電子顯微鏡(觀察倍率1000倍、觀察視野1000μm2)之二次電子像。又,圖2為比較例4之銅箔表面之反射電子像。 Moreover, embodiment 1 is a scanning electron microscope the surface of the copper foil in Example 1 (observation magnification 1000 times, the observation field 1000μm 2) of the secondary electron image. 2 is a reflection electron image of the surface of the copper foil of Comparative Example 4.

Claims (6)

一種壓延銅箔,其含有合計100~500重量ppm之選自Ti及Zr之群的1種以上,氧濃度為50重量ppm以下,以350℃進行1小時熱處理後根據JIS-Z2241之與壓延方向平行的拉伸強度為350MPa以上,且該熱處理後之導電率為90%IACS以上,於該熱處理之前後,該拉伸強度之變化率為10%以下,於銅箔表面之1000μm2之範圍,長軸1μm~5μm之Zr或Ti的夾雜物為10個以下。 A rolled copper foil containing one or more selected from the group consisting of Ti and Zr in a total amount of 100 to 500 ppm by weight, an oxygen concentration of 50 ppm by weight or less, and heat treatment at 350 ° C for 1 hour, according to JIS-Z2241 and rolling direction. The parallel tensile strength is 350 MPa or more, and the electrical conductivity after the heat treatment is 90% IACS or more. After the heat treatment, the tensile strength changes by 10% or less, in the range of 1000 μm 2 on the surface of the copper foil. The inclusions of Zr or Ti having a long axis of 1 μm to 5 μm are 10 or less. 如申請專利範圍第1項之壓延銅箔,其中,長軸10μm以上50μm以下之針孔為50個/m2以下。 The rolled copper foil according to the first aspect of the invention, wherein the pinhole having a long axis of 10 μm or more and 50 μm or less is 50/m 2 or less. 如申請專利範圍第1項或2項之壓延銅箔,其中,厚度為20μm以下。 A rolled copper foil according to claim 1 or 2, wherein the thickness is 20 μm or less. 一種申請專利範圍第1至3項中任一項之壓延銅箔的製造方法,於熱軋後,重複1次以上退火及冷軋,以加工度80%以上95%以下進行最終冷軋而製造,在該熱軋後該最終冷軋前,於700℃以上1000℃以下進行至少1次高溫退火。 A method for producing a rolled copper foil according to any one of the first to third aspects of the present invention, which, after hot rolling, repeats annealing and cold rolling one time or more, and performs final cold rolling at a working degree of 80% or more and 95% or less. At least one high temperature annealing is performed at 700 ° C or more and 1000 ° C or less before the final cold rolling after the hot rolling. 一種鋰離子二次電池,其使用申請專利範圍第1至3項中任一項之壓延銅箔。 A lithium ion secondary battery using the rolled copper foil according to any one of claims 1 to 3. 一種鋰離子電容器,其使用申請專利範圍第1至3項中任一項之壓延銅箔。 A lithium ion capacitor using the rolled copper foil according to any one of claims 1 to 3.
TW105108059A 2015-03-30 2016-03-16 Rolled copper foil and lithium ion secondary battery and lithium ion capacitor using the same TWI608109B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015069329 2015-03-30
JP2015202569A JP6193950B2 (en) 2015-03-30 2015-10-14 Rolled copper foil for secondary battery, method for producing the same, and lithium ion secondary battery and lithium ion capacitor using the same

Publications (2)

Publication Number Publication Date
TW201708549A TW201708549A (en) 2017-03-01
TWI608109B true TWI608109B (en) 2017-12-11

Family

ID=57245354

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105108059A TWI608109B (en) 2015-03-30 2016-03-16 Rolled copper foil and lithium ion secondary battery and lithium ion capacitor using the same

Country Status (2)

Country Link
JP (1) JP6193950B2 (en)
TW (1) TWI608109B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6827022B2 (en) * 2018-10-03 2021-02-10 Jx金属株式会社 Copper foil for flexible printed circuit boards, copper-clad laminates using it, flexible printed circuit boards, and electronic devices
JP7042961B1 (en) 2021-11-17 2022-03-28 Jx金属株式会社 Rolled copper foil for secondary batteries, and secondary battery negative electrodes and secondary batteries using it

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011216463A (en) * 2010-03-15 2011-10-27 Jx Nippon Mining & Metals Corp Rolled copper foil, and negative electrode collector, negative electrode plate and secondary battery using the same
TW201334001A (en) * 2011-09-30 2013-08-16 Nippon Chemicon Method of manufacturing solid electrolytic capacitor, and solid electrolytic capacitor

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013241662A (en) * 2012-05-22 2013-12-05 Furukawa Electric Co Ltd:The Rolled copper foil for collector of secondary battery and method for producing the same
JP6190574B2 (en) * 2012-05-22 2017-08-30 古河電気工業株式会社 Rolled copper foil for secondary battery current collector and method for producing the same
JP6146963B2 (en) * 2012-07-06 2017-06-14 古河電気工業株式会社 Copper alloy rolled foil for secondary battery current collector and method for producing the same
JP2014065933A (en) * 2012-09-25 2014-04-17 Sh Copper Products Corp Rolled copper foil for lithium ion secondary battery collector
JP2014136821A (en) * 2013-01-17 2014-07-28 Sh Copper Products Corp Copper alloy film, anode for lithium ion secondary battery, lithium ion secondary battery, and manufacturing method of copper alloy film
JP6190646B2 (en) * 2013-07-10 2017-08-30 古河電気工業株式会社 Copper alloy rolled foil for secondary battery current collector and method for producing the same
JP2015030893A (en) * 2013-08-05 2015-02-16 株式会社Shカッパープロダクツ Copper alloy foil and secondary battery negative electrode
JP6041779B2 (en) * 2013-09-20 2016-12-14 Jx金属株式会社 Copper alloy foil

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011216463A (en) * 2010-03-15 2011-10-27 Jx Nippon Mining & Metals Corp Rolled copper foil, and negative electrode collector, negative electrode plate and secondary battery using the same
TW201334001A (en) * 2011-09-30 2013-08-16 Nippon Chemicon Method of manufacturing solid electrolytic capacitor, and solid electrolytic capacitor

Also Published As

Publication number Publication date
JP2016191139A (en) 2016-11-10
TW201708549A (en) 2017-03-01
JP6193950B2 (en) 2017-09-06

Similar Documents

Publication Publication Date Title
JPWO2010013790A1 (en) Copper alloy material for electric and electronic parts and manufacturing method thereof
JP5575632B2 (en) Method for producing copper foil for lithium ion secondary battery
TWI768097B (en) High-strength and high-conductivity copper alloy sheet and method for producing the same
TW201122120A (en) Cu-Mg-P based copper alloy material and method of producing the same
TW201945553A (en) Copper alloy for electronic and electrical device, copper alloy sheet strip for electronic and electrical device, part for electronic and electrical device, terminal, and bus bar
JP2011202218A (en) High-strength copper titanium plate and production method therefor
JP5639216B2 (en) Titanium plate material for fuel cell separator and method for producing the same
KR20150070201A (en) Aluminium alloy foil
JP5448929B2 (en) Aluminum alloy hard foil having excellent bending resistance and method for producing the same
TWI608109B (en) Rolled copper foil and lithium ion secondary battery and lithium ion capacitor using the same
WO2013176038A1 (en) Aluminum alloy foil for electrode collector, method for manufacturing same, and electrode material
JP2012092368A (en) Precipitation hardening copper alloy foil, lithium ion secondary battery negative electrode using it, and manufacturing method of precipitation hardening copper alloy foil
JP6545779B2 (en) Aluminum alloy foil for battery current collector
JP5460102B2 (en) Aluminum alloy foil for lithium ion secondary battery and method for producing the same
KR101338792B1 (en) Cu-Zn-Sn ALLOY PLATE AND TIN-PLATED Cu-Zn-Sn ALLOY STRIP
JP2015017301A (en) Secondary battery current collector copper alloy rolled foil and method for producing the same
KR101776471B1 (en) Rolled copper foil for secondary battery, and lithium ion secondary battery and lithium ion capacitor using the same
JP2012241232A (en) Rolled copper alloy foil and current collector for secondary battery using the same
JP2015017302A (en) Secondary battery current collector copper alloy rolled foil and method for producing the same
JP5904840B2 (en) Rolled copper foil
JP7042961B1 (en) Rolled copper foil for secondary batteries, and secondary battery negative electrodes and secondary batteries using it
CN117980513A (en) Rolled copper foil for secondary battery, and secondary battery negative electrode and secondary battery using the same
JP2019077889A (en) Copper alloy for electronic material
JPWO2018043117A1 (en) Aluminum alloy hard thin foil for secondary battery positive electrode current collector, secondary battery positive current collector and method for producing aluminum alloy hard thin foil
JP5514762B2 (en) Cu-Co-Si alloy with excellent bending workability