TWI607856B - Polyester film - Google Patents

Polyester film Download PDF

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TWI607856B
TWI607856B TW102127563A TW102127563A TWI607856B TW I607856 B TWI607856 B TW I607856B TW 102127563 A TW102127563 A TW 102127563A TW 102127563 A TW102127563 A TW 102127563A TW I607856 B TWI607856 B TW I607856B
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film
polyester
still
temperature
polyester resin
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TW102127563A
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TW201408467A (en
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清水敏之
中谷伊志
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東洋紡股份有限公司
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18Manufacture of films or sheets
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00Chemical treatment or coating of shaped articles made of macromolecular substances
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2367/00Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
    • C08J2367/02Polyesters derived from dicarboxylic acids and dihydroxy compounds

Description

聚酯薄膜 Polyester film

本發明關於易黏著性聚酯薄膜。更詳細地,關於在各種積層用途、印刷用途中顯示優異的黏著性之聚酯薄膜及其製造方法。 The present invention relates to an easily adhesive polyester film. More specifically, the polyester film which exhibits excellent adhesiveness in various laminated applications and printing applications, and a method for producing the same.

以聚對苯二甲酸乙二酯(PET)薄膜為代表之雙軸延伸聚酯薄膜,由於其優異的透明性、尺寸穩定性、機械性質、電氣性質、耐藥品性等,而在磁帶、絕緣帶、相片薄膜、描圖薄膜、包裝材料、電絕緣材料、資訊記錄材料、各種工程紙等之廣泛領域中被利用。然而,雙軸延伸聚酯薄膜由於高度地結晶配向,薄膜表面對於各種黏著劑、塗料、油墨、感光劑、磁性塗料、消光劑等缺乏黏著性。因此,就簡便的方法而言,對於薄膜係採用:除了藉由在高溫予以退火處理外,亦藉由在製膜步驟中之熱定型時實施高溫的處理,而降低薄膜整體之配向以使其易黏著化之方法,但於該習知技術中有薄膜會脆化之問題點。 Biaxially stretched polyester film represented by polyethylene terephthalate (PET) film, due to its excellent transparency, dimensional stability, mechanical properties, electrical properties, chemical resistance, etc. It is used in a wide range of fields such as tapes, photo films, tracing films, packaging materials, electrical insulating materials, information recording materials, and various engineering papers. However, due to the highly crystalline alignment of the biaxially stretched polyester film, the surface of the film lacks adhesion to various adhesives, coatings, inks, sensitizers, magnetic coatings, matting agents, and the like. Therefore, in a simple method, for the film system, in addition to the annealing treatment at a high temperature, the high-temperature treatment is also performed by heat setting in the film forming step, thereby reducing the overall alignment of the film so that A method of easy adhesion, but in the prior art, there is a problem that the film is embrittled.

因此,就一般的方法而言,實際上在各種製程使用時,較多為必須對聚酯薄膜表面施予任意的易黏著處理之情形。以下例示: 已知有藉由對原料予以添加、共聚結晶熔解熱量小之成分(例如聚伸烷二醇等),而使表面變得容易熔解,藉此增加油墨密接性、積層強度之技術(例如參照專利文獻1等)。然而,雖然該習知技術係因使表面的結晶化度變低而改善黏著性,但基材側之面的黏著性在高溫下容易降低,而有容易結塊(blocking)之問題點。 Therefore, in the conventional method, in actual use in various processes, it is often necessary to apply any easy adhesion treatment to the surface of the polyester film. The following examples: It is known that a material having a small amount of heat (for example, a polyalkylene glycol) is added by adding a raw material to a raw material, and the surface is easily melted, thereby increasing the ink adhesion and the strength of the laminate (for example, refer to the patent). Literature 1, etc.). However, this conventional technique improves the adhesion by lowering the degree of crystallization of the surface, but the adhesion of the surface on the substrate side is liable to lower at a high temperature, and there is a problem that it is easy to block.

又,已知有利用藉由生產線上塗布或離線塗布而在表面上積層易黏著性的塗布層而藉以形成的樹脂層來增加油墨密接性、積層強度之技術(例如參照專利文獻2等)。然而,該習知技術有使製程複雜化而在將無法作為製品使用之薄膜端部回收時表層成分會混入之問題點。 Further, a technique of increasing the ink adhesion and the laminate strength by using a resin layer formed by laminating a coating layer which is easy to adhere to the surface by coating or off-line coating on a production line (see, for example, Patent Document 2). However, this prior art has a problem that the process composition is complicated and the surface layer component is mixed when the film end which cannot be used as a product is recovered.

另一方面,於印刷時或積層時,為了增加油墨密接性、積層強度等之黏著性,已知實施紫外線照射處理、電暈放電處理、電漿放電處理、火焰處理等之物理方法,或鹼處理、底漆處理等之化學處理等。例如,已知有藉由在表層上所形成的極性基,而增加油墨密接性、積層強度之技術(例如參照專利文獻3)。然而,由於電暈處理亦會使薄膜表面的結晶化度變高,而有易黏著化變得難以進行之問題點。 On the other hand, in order to increase the adhesion between ink adhesion and laminate strength during printing or lamination, physical methods such as ultraviolet irradiation treatment, corona discharge treatment, plasma discharge treatment, and flame treatment, or alkali are known. Chemical treatment such as treatment, primer treatment, etc. For example, a technique of increasing ink adhesion and layering strength by a polar group formed on a surface layer is known (for example, see Patent Document 3). However, since the corona treatment also causes the degree of crystallization of the surface of the film to become high, there is a problem that easy adhesion becomes difficult.

[先前技術文獻] [Previous Technical Literature] [專利文獻] [Patent Literature]

[專利文獻1]日本特開昭51-90346號公報 [Patent Document 1] Japanese Laid-Open Patent Publication No. 51-90346

[專利文獻2]日本特公昭41-8470號公報 [Patent Document 2] Japanese Patent Publication No. 41-8470

[專利文獻3]日本特公昭58-25331號公報 [Patent Document 3] Japanese Patent Publication No. Sho 58-25331

本發明係以上述習知技術之問題作為背景而完成者。即,本發明目的在於:藉由電暈放電處理等之易黏著處理等簡單的方法而提供兼具薄膜強度與易黏著性之雙軸延伸聚酯薄膜。 The present invention has been accomplished in the light of the above-described problems of the prior art. That is, an object of the present invention is to provide a biaxially stretched polyester film having both film strength and easy adhesion by a simple method such as easy adhesion treatment such as corona discharge treatment.

本發明者為了達成該目的而專心致力地檢討,結果終於完成本發明。即,本發明為: The inventors of the present invention have devoted themselves to the review in order to achieve the object, and have finally completed the present invention. That is, the present invention is:

1.一種雙軸延伸聚酯薄膜,其特徵為其係由藉由DSC所得之於以40℃/分鐘之速度自熔融狀態起冷卻時所觀察的再結晶化溫度與以20℃/分鐘之速度的再結晶化溫度之差為0~15℃的聚酯樹脂所構成,具有3~50μm之厚度,且滿足下述要件(1)~(4)的薄膜物性;(1)MD方向的熱收縮率為0.5~10%;(2)突刺強度為5~20N;(3)關於易黏著處理面側,藉由ATR-IR所求得之表面結晶化度為1.10~1.35;(4)自薄膜一側的表面結晶化度減去薄膜的另一側的表面結晶化度後的值係在-0.1~0之範圍。 A biaxially stretched polyester film characterized by a recrystallization temperature observed by DSC at a temperature of 40 ° C / min from a molten state and a rate of 20 ° C / min The resin having a recrystallization temperature of 0 to 15 ° C is composed of a polyester resin having a thickness of 3 to 50 μm and satisfying the following physical properties of the materials (1) to (4); (1) heat shrinkage in the MD direction The rate is 0.5~10%; (2) the spur strength is 5~20N; (3) the surface crystallization degree obtained by ATR-IR is 1.10~1.35 on the easy adhesion treatment side; (4) from the film The value of the surface crystallization degree on one side minus the surface crystallization degree on the other side of the film is in the range of -0.1 to 0.

2.如上述1記載之雙軸延伸聚酯薄膜,其中前述聚酯樹脂具有間苯二甲酸成分。 2. The biaxially stretched polyester film according to 1, wherein the polyester resin has an isophthalic acid component.

3.如上述1記載之雙軸延伸聚酯薄膜,其中聚酯樹脂含有由來自植物的乙二醇成分所聚合之聚酯樹脂。 3. The biaxially stretched polyester film according to the above 1, wherein the polyester resin contains a polyester resin polymerized from a glycol component derived from a plant.

本發明係藉由使雙軸延伸聚酯薄膜之各自的面成為特定的表面狀態,而可一邊保持薄膜的強度,一邊降低一側的表面之結晶化度與配向,並可提高薄膜的黏著性。 According to the present invention, by making the respective surfaces of the biaxially stretched polyester film into a specific surface state, it is possible to reduce the crystallinity and alignment of the surface on one side while maintaining the strength of the film, and to improve the adhesion of the film. .

依照本發明,除了可使以往難以並存的密接性與力學特性平衡化,亦可提供無其它材料的混入,且表面層的耐熱性優異之易黏著性聚酯薄膜。 According to the present invention, in addition to the balance between the adhesion and the mechanical properties which are difficult to coexist in the past, it is possible to provide an easily-adhesive polyester film which is free from the incorporation of other materials and which is excellent in heat resistance of the surface layer.

[實施發明之形態] [Formation of the Invention]

以下,詳細說明本發明。 Hereinafter, the present invention will be described in detail.

本發明中使用的聚酯樹脂係以對苯二甲酸(TPA)與乙二醇(EG)作為主要構成成分而得之聚酯(A),TPA的含有率較佳為60質量%以上,更佳為70質量%以上,特佳為75質量%以上,最佳為80質量%以上。若少於60質量%,則結晶性會降低,薄膜特性變不充分。 The polyester resin used in the present invention is a polyester (A) obtained by using terephthalic acid (TPA) and ethylene glycol (EG) as main constituent components, and the content of TPA is preferably 60% by mass or more. It is preferably 70% by mass or more, particularly preferably 75% by mass or more, and most preferably 80% by mass or more. When it is less than 60% by mass, the crystallinity is lowered and the film properties are insufficient.

作為主要構成成分使用之聚酯(A)中,就二羧酸成分而言,TPA較佳為90莫耳%以上,更佳為95莫耳%以上,更佳為98莫耳%以上。就二醇成分而言,EG較佳為90莫耳%以上,更佳為95莫耳%以上,進一步更佳為97莫耳%以上。此時,較佳為不含有在聚合時因醚鍵所生成的副生成物以外之雜質。由於此等雜質即使非常少量也會使聚酯樹脂的熔點大幅降低而不宜。 In the polyester (A) used as the main component, the TPA is preferably 90 mol% or more, more preferably 95 mol% or more, and still more preferably 98 mol% or more in terms of the dicarboxylic acid component. With respect to the diol component, EG is preferably 90 mol% or more, more preferably 95 mol% or more, still more preferably 97 mol% or more. In this case, it is preferred that impurities other than the by-products generated by the ether bond at the time of polymerization are not contained. Since such impurities are extremely small, the melting point of the polyester resin is drastically lowered.

聚酯亦可為共聚物。作為可對聚酯共聚之二羧酸成分,例如可舉出間苯二甲酸、鄰苯二甲酸、萘二羧酸、聯苯基二羧酸、環己烷二羧酸、己二酸、壬二酸、癸二酸等。作為可對聚酯共聚之二醇成分,例如可舉出乙二醇、1,3-丙二醇、1,2-丙二醇、1,4-丁二醇、新戊二醇、1,5-戊二醇、1,6-己二醇、二乙二醇、環己二醇、聚乙二醇、聚丁二醇、聚碳酸酯二醇等。此等成分的共聚由於具有使聚對苯二甲酸乙二酯的結晶化容易度與結晶熔點降低之效果,可藉由電暈放電處理等之處理時的熱輕易地緩和表面的配向結晶,故對本發明之目的而言係非常好的方法。 The polyester may also be a copolymer. Examples of the dicarboxylic acid component copolymerizable with the polyester include isophthalic acid, phthalic acid, naphthalene dicarboxylic acid, biphenyl dicarboxylic acid, cyclohexane dicarboxylic acid, adipic acid, and hydrazine. Diacid, sebacic acid, etc. Examples of the diol component copolymerizable with the polyester include ethylene glycol, 1,3-propanediol, 1,2-propanediol, 1,4-butanediol, neopentyl glycol, and 1,5-pentane. Alcohol, 1,6-hexanediol, diethylene glycol, cyclohexanediol, polyethylene glycol, polytetramethylene glycol, polycarbonate diol, and the like. Since the copolymerization of these components has an effect of lowering the crystallization ease of polyethylene terephthalate and the crystal melting point, the surface crystallization can be easily alleviated by the heat during the treatment such as corona discharge treatment. A very good method for the purposes of the present invention.

又,作為聚酯的其它構成成分,並沒有特別的限制,例如可舉出聚對苯二甲酸丁二酯(PBT)、聚萘二甲酸乙二酯(PEN)、聚萘二甲酸丁二酯(PBN)、聚對苯二甲酸丙二酯(PPT)等之聚酯(A)以外的聚酯樹脂。此外,為了改善彎曲時的耐針孔性,就添加劑而言,可添加經共聚有柔軟的聚醚成分、聚碳酸酯成分、聚酯成分之至少任一者而成之聚酯系及聚醯胺系彈性體、聚烯烴系彈性體等。此等添加劑之量的下限較佳為0重量%,上限較佳為20重量%。若超過20重量%,則除了效果飽和外,還會發生薄膜的透明性降低等之不良狀況。 Further, the other constituent components of the polyester are not particularly limited, and examples thereof include polybutylene terephthalate (PBT), polyethylene naphthalate (PEN), and polybutylene naphthalate. A polyester resin other than the polyester (A) such as (PBN) or polytrimethylene terephthalate (PPT). In addition, in order to improve the pinhole resistance at the time of bending, a polyester system and a polypene obtained by copolymerizing at least one of a soft polyether component, a polycarbonate component, and a polyester component may be added to the additive. An amine-based elastomer, a polyolefin-based elastomer, or the like. The lower limit of the amount of these additives is preferably 0% by weight, and the upper limit is preferably 20% by weight. When it exceeds 20% by weight, in addition to the effect of saturation, problems such as a decrease in transparency of the film may occur.

於聚酯薄膜中可含有滑劑。作為滑劑的種類,較佳為除了二氧化矽、碳酸鈣、氧化鋁等之無機系滑材外,還有有機系滑劑,更佳為二氧化矽、碳酸鈣,特佳為二氧化矽。藉由此等滑劑之添加,可對薄膜賦予透 明性與滑性。 A slip agent may be contained in the polyester film. The type of the lubricant is preferably an inorganic slipper other than cerium oxide, calcium carbonate, alumina, or the like, and more preferably cerium oxide or calcium carbonate, and particularly preferably cerium oxide. . By adding the above-mentioned slip agent, the film can be given through Brightness and slipperiness.

滑劑在聚酯薄膜中的含有濃度(ppm)之下限較佳為10,更佳為30,進一步更佳為50。若小於上述,則在滑性之方面,實用性會變低。滑劑濃度(ppm)之上限較佳為10000,更佳為9000,進一步更佳為8000。若超過上述,則薄膜的透明性會降低。 The lower limit of the concentration (ppm) of the lubricant in the polyester film is preferably 10, more preferably 30, still more preferably 50. If it is less than the above, the practicality will become low in terms of slipperiness. The upper limit of the concentration of the lubricant (ppm) is preferably 10,000, more preferably 9000, still more preferably 8,000. If it exceeds the above, the transparency of the film is lowered.

關於滑劑之粒徑,一次粒徑的下限為0.005μm,較佳為0.010μm,更佳為0.015μm。於0.005μm以下時,由於會看到熔融時的黏度上升而不宜。關於滑劑之粒徑,一次粒徑的上限為50μm,較佳為40μm,更佳為30μm。於50μm以上時,會看到透明性的降低或脫落而不宜。 Regarding the particle diameter of the lubricant, the lower limit of the primary particle diameter is 0.005 μm, preferably 0.010 μm, more preferably 0.015 μm. When it is 0.005 μm or less, it is not preferable to increase the viscosity at the time of melting. Regarding the particle diameter of the lubricant, the upper limit of the primary particle diameter is 50 μm, preferably 40 μm, more preferably 30 μm. When it is 50 μm or more, it is not preferable to reduce the transparency or fall off.

前述聚酯樹脂係視需要亦可含有習知的添加劑,例如滑劑、穩定劑、著色劑、抗氧化劑、抗靜電劑、紫外線吸收劑等。 The polyester resin may contain a conventional additive such as a slip agent, a stabilizer, a colorant, an antioxidant, an antistatic agent, an ultraviolet absorber, or the like as needed.

此等添加劑必須在可滿足衝擊強度或突刺強度的範圍內調整。 These additives must be adjusted within a range that satisfies the impact strength or spur strength.

本發明中的聚酯樹脂之特徵係以使藉由DSC所得之以20℃/分鐘之速度自熔融狀態起冷卻時所觀察的再結晶化溫度(以下當作Tc(A))與藉由DSC所得之以40℃/分鐘之速度的再結晶化溫度(以下當作Tc(B))之差(以下當作Tc(A)-Tc(B))在特定範圍內為特徵。 The polyester resin in the present invention is characterized by a recrystallization temperature (hereinafter referred to as Tc(A)) and a DSC observed by cooling from a molten state at a rate of 20 ° C/min obtained by DSC. The difference in recrystallization temperature (hereinafter referred to as Tc (B)) obtained at a rate of 40 ° C /min (hereinafter referred to as Tc (A) - Tc (B)) is characterized by a specific range.

Tc(A)-Tc(B)之下限較佳為0,更佳為0.5,進一步更佳為1。小於0℃時,結晶化速度過慢,對於本發明不宜。 The lower limit of Tc(A)-Tc(B) is preferably 0, more preferably 0.5, still more preferably 1. When the temperature is less than 0 ° C, the crystallization rate is too slow, which is not preferable for the present invention.

Tc(A)-Tc(B)之上限較佳為15,更佳為14.5,進一步 更佳為14,特佳為13.5,最佳為13.3。超過上述時,由於其對於電暈放電處理等之熱會非常穩定,而使各種黏著性的改善效果小故不宜。關於其理由,推測係因為結晶化速度快,會在更低溫生成強固的表面結晶,而不因電暈放電處理等之熱而容易熔融。 The upper limit of Tc(A)-Tc(B) is preferably 15, more preferably 14.5, further More preferably 14, the best is 13.5, and the best is 13.3. When it exceeds the above, since it is very stable to heat such as corona discharge treatment, it is not preferable to improve the effects of various adhesions. The reason for this is presumably because the crystallization rate is high, and strong surface crystals are formed at a lower temperature, and are not easily melted by heat such as corona discharge treatment.

已知Tc(A)-Tc(B)可藉由聚酯樹脂中的滑劑之種類或樹脂中的雜質之量、共聚成分之種類或有結晶化延遲效果的添加劑之添加來控制。 It is known that Tc(A)-Tc(B) can be controlled by the kind of the slip agent in the polyester resin, the amount of impurities in the resin, the kind of the copolymerization component, or the addition of an additive having a crystallization delay effect.

Tc(A)之下限較佳為140,更佳為141,進一步更佳為143。小於上述時,結晶化速度過低,薄膜的耐熱性會變低。 The lower limit of Tc(A) is preferably 140, more preferably 141, still more preferably 143. When it is less than the above, the crystallization rate is too low, and the heat resistance of the film is lowered.

Tc(A)之上限較佳為175,更佳為170,進一步更佳為168。超過上述時,結晶化溫度與熔融溫度之差變過小,延伸性會降低。 The upper limit of Tc(A) is preferably 175, more preferably 170, still more preferably 168. When it exceeds the above, the difference between the crystallization temperature and the melting temperature becomes too small, and the elongation is lowered.

Tc(B)之下限較佳為130,更佳為131,進一步更佳為133。小於上述時,結晶化速度過低,薄膜的耐熱性會變低。 The lower limit of Tc(B) is preferably 130, more preferably 131, still more preferably 133. When it is less than the above, the crystallization rate is too low, and the heat resistance of the film is lowered.

Tc(B)之上限較佳為165,更佳為155,進一步更佳為155。超過上述時,會得不到黏著性。 The upper limit of Tc(B) is preferably 165, more preferably 155, still more preferably 155. When it exceeds the above, adhesion will not be obtained.

於本發明的薄膜中,為了使聚酯樹脂的Tc(A)-Tc(B)成為上述範圍,聚酯樹脂中所含有的結晶核劑之量的上限為100ppm,較佳為10ppm,最佳為5ppm以下。 In the film of the present invention, the upper limit of the amount of the crystal nucleating agent contained in the polyester resin is 100 ppm, preferably 10 ppm, in order to set the Tc(A)-Tc(B) of the polyester resin to the above range. It is 5 ppm or less.

又,就雜質而言,除了氮系化合物、硫系化合物等原料中所含有的雜質,還指在聚合時或熔融擠出時混入 者,其混入量的上限較佳為1ppm以下,更佳為0.5ppm以下,最佳為0.1ppm以下。 In addition, impurities other than impurities contained in a raw material such as a nitrogen-based compound or a sulfur-based compound are also referred to as being mixed during polymerization or melt extrusion. The upper limit of the amount of the mixture is preferably 1 ppm or less, more preferably 0.5 ppm or less, and most preferably 0.1 ppm or less.

若超過各自的上限,則會使電暈放電處理所致的結晶化度之變化小,而使易黏著化的效果變小。雖然理由不明,但推測係熱定型時的配向結晶之前驅物會在低溫形成強固的配向結晶,結果雙軸延伸後的表層之結晶的熱穩定性變高,而難以發生本發明目的之藉由處理時的熱導致結晶之熔融,並使易黏著化之效果變小。 When the respective upper limits are exceeded, the change in the degree of crystallization due to the corona discharge treatment is small, and the effect of easy adhesion is reduced. Although the reason is not clear, it is presumed that the precursor will form a strong alignment crystal at a low temperature before the alignment crystallization in the heat setting, and as a result, the thermal stability of the crystal of the surface layer after the biaxial stretching becomes high, and it is difficult to cause the object of the present invention. The heat during the treatment causes melting of the crystals, and the effect of easy adhesion becomes small.

本發明之聚酯薄膜係除了以往之用來自化石燃料的原料所得之聚酯樹脂外,還可使用用來自植物的原料所得之聚酯樹脂。從近來環境負荷減低之方面來看,當然較佳為使用來自植物的原料。具體而言,可舉出來自植物的TPA、EG、BD、己二酸、癸二酸、二聚酸、氫化二聚酸、異山梨醇、呋喃二羧酸等,惟不受此等所限定。 The polyester film of the present invention may be a polyester resin obtained by using a raw material derived from a plant in addition to a polyester resin obtained by using a raw material derived from a fossil fuel. From the viewpoint of recent reduction in environmental load, it is of course preferred to use raw materials derived from plants. Specific examples thereof include TPA, EG, BD, adipic acid, sebacic acid, dimer acid, hydrogenated dimer acid, isosorbide, and furan dicarboxylic acid derived from plants, but are not limited thereto. .

尤其,雖然用來自植物的原料所得之聚酯樹脂,在其精製過程中雜質的去除有限,而有氮化合物等殘存等之問題,但此等用來自植物的原料所得之聚酯樹脂由於會幫助進行薄膜的結晶化促進,而形成強固的配向結晶,故處理時的熱所造成的表層之結晶緩和會變小而成為黏著性降低之要因,因此重要的是使用精製度高之原料。 In particular, although the polyester resin obtained from the raw material of the plant has a problem of limited removal of impurities during the purification process, and there are problems such as residual nitrogen compounds, etc., the polyester resin obtained from the raw material of the plant will help Since the crystallization of the film is promoted to form a strong alignment crystal, the crystallization of the surface layer due to the heat during the treatment is reduced and the adhesiveness is lowered. Therefore, it is important to use a raw material having a high purity system.

本發明之聚酯薄膜係可僅由新原料而得,也可使用回收再利用原料。尤其,藉由使用將PET瓶回收而得之再生PET樹脂等,可有助於近來的環境負荷減低。 The polyester film of the present invention can be obtained only from a new raw material, and a recycled raw material can also be used. In particular, it is possible to contribute to the recent reduction in environmental load by using a recycled PET resin obtained by recovering a PET bottle.

再生PET樹脂的IV(固有黏度,單位[dL/g])之下限必須為0.5,更佳為0.55。小於0.5時,除了力學特性降低,還有因分子量降低而結晶化速度增加,發生製膜性降低等之問題而不宜。IV之上限必須為0.8之範圍,較佳為0.75。IV若超過0.8,則熔融黏度過高,擠壓機的吐出量降低而生產性降低。 The lower limit of IV (inherent viscosity, unit [dL/g]) of the recycled PET resin must be 0.5, more preferably 0.55. When it is less than 0.5, in addition to a decrease in mechanical properties, it is not preferable because the molecular weight is lowered and the crystallization rate is increased, and the film forming property is lowered. The upper limit of IV must be in the range of 0.8, preferably 0.75. When the IV exceeds 0.8, the melt viscosity is too high, and the discharge amount of the extruder is lowered to deteriorate the productivity.

再生PET樹脂等再生原料之添加量係沒有特別的限制,但可考慮色調或薄膜的IV等而決定。即使全量為再生PET樹脂也無妨,但色調的Co-b值較佳為10以下之範圍,具體地其為0~95%。 The amount of the raw material to be recycled such as the recycled PET resin is not particularly limited, but may be determined in consideration of the color tone or the IV of the film. Even if the total amount is a recycled PET resin, the Co-b value of the color tone is preferably in the range of 10 or less, specifically 0 to 95%.

使用再生PET樹脂時,相對於薄膜之聚酯樹脂中的間苯二甲酸之酸成分而言,共聚量較佳為0.5~2.5莫耳%,更佳為1.0~2.5莫耳%。 When the recycled PET resin is used, the copolymerization amount is preferably from 0.5 to 2.5 mol%, more preferably from 1.0 to 2.5 mol%, based on the acid component of isophthalic acid in the polyester resin of the film.

又,使用PET瓶用原料或再生PET樹脂時,為了賦予流延時的靜電密接性,較佳為添加調整熔融比電阻用之添加劑。作為添加劑,可使用眾所周知的化合物,具體而言可使用Mg系化合物、P系化合物、Na系化合物、K系化合物等,並從其熔融比電阻與色調等之方面來決定添加量等。 Further, when a raw material for a PET bottle or a recycled PET resin is used, it is preferable to add an additive for adjusting the specific resistance of the melt in order to impart a fluid-tight electrostatic adhesion. As the additive, a well-known compound can be used, and specifically, a Mg-based compound, a P-based compound, a Na-based compound, a K-based compound, or the like can be used, and the amount of addition or the like can be determined from the viewpoints of melting specific resistance, color tone, and the like.

以下,具體陳述本發明的雙軸延伸薄膜之製膜方法,惟不受此等所限定。 Hereinafter, the film forming method of the biaxially stretched film of the present invention will be specifically described, but is not limited thereto.

本發明的延伸薄膜,可為在長度方向(MD方向)或橫向(TD方向)的單軸延伸薄膜,但較佳為雙軸延伸薄膜。於雙軸延伸時,可為依次雙軸延伸或同時雙軸延伸,但較佳為依次雙軸延伸。 The stretched film of the present invention may be a uniaxially stretched film in the longitudinal direction (MD direction) or the transverse direction (TD direction), but is preferably a biaxially stretched film. In the case of biaxial stretching, it may be a sequential biaxial extension or a simultaneous biaxial extension, but preferably a sequential biaxial extension.

藉由成為延伸薄膜,可得到以往之聚丙烯薄膜中所無法預料之即使在150℃也熱收縮率低之薄膜。 By forming the stretched film, it is possible to obtain a film which is unpredictable in the conventional polypropylene film and which has a low heat shrinkage rate even at 150 °C.

以下說明最佳例的縱延伸-橫向延伸之依次雙軸延伸的薄膜之製造方法。 Hereinafter, a method of producing a longitudinally-transversely extending sequential biaxially stretched film of a preferred embodiment will be described.

首先,在單軸或2軸的擠壓機將聚酯樹脂加熱熔融,擠壓於冷卻輥上而得到未延伸薄膜。 First, a polyester resin is heated and melted in a single-axis or 2-axis extruder, and extruded on a cooling roll to obtain an unstretched film.

樹脂熔融溫度(℃)之下限較佳為220,更佳為240,進一步更佳為260。低於上述時,熔融黏度高,吐出會變困難。樹脂熔融溫度(℃)之上限較佳為350,更佳為340,進一步更佳為330。超過上述時,由於會看到熱分解所致的分子量降低或著色等而不宜。 The lower limit of the resin melting temperature (°C) is preferably 220, more preferably 240, still more preferably 260. When it is less than the above, the melt viscosity is high and the discharge becomes difficult. The upper limit of the resin melting temperature (°C) is preferably 350, more preferably 340, still more preferably 330. When it exceeds the above, it is not preferable because molecular weight reduction or coloring due to thermal decomposition is observed.

擠壓模頭溫度(℃)之下限較佳為220,更佳為240,進一步更佳為260。低於上述時,熔融黏度高,吐出會變困難。擠壓模頭溫度(℃)之上限較佳為350,更佳為340,進一步更佳為330。超過上述時,由於會看到熱分解所致的分子量降低或著色等而不宜。 The lower limit of the extrusion die temperature (°C) is preferably 220, more preferably 240, still more preferably 260. When it is less than the above, the melt viscosity is high and the discharge becomes difficult. The upper limit of the extrusion die temperature (°C) is preferably 350, more preferably 340, still more preferably 330. When it exceeds the above, it is not preferable because molecular weight reduction or coloring due to thermal decomposition is observed.

冷卻輥溫度(℃)之下限較佳為0,更佳為2,進一步更佳為5。冷卻輥溫度若未達上述而過低,則由於冷卻輥會結露,而使品質的穩定性降低故不宜。冷卻輥溫度(℃)之上限較佳為80,更佳為50,進一步更佳為40。超過上述時,冷卻化會不足,而有延伸性的降低或厚度不良。 The lower limit of the chill roll temperature (°C) is preferably 0, more preferably 2, still more preferably 5. If the temperature of the chill roll is too low as described above, the chill roll will be dew condensation, which degrades the stability of the quality, which is not preferable. The upper limit of the chill roll temperature (°C) is preferably 80, more preferably 50, still more preferably 40. When it exceeds the above, the cooling will be insufficient, and the elongation will be lowered or the thickness will be poor.

流延速度(m/分鐘)之下限較佳為2,更佳為5,進一步更佳為10,特佳為20。小於上述時,生產性會變低。 The lower limit of the casting speed (m/min) is preferably 2, more preferably 5, still more preferably 10, and particularly preferably 20. When it is less than the above, productivity will become low.

流延速度(m/分鐘)之上限較佳為120,更佳為 110,進一步更佳為100。超過上述時,流延會不安定化。流延厚度(μm)之下限較佳為10,更佳為15,進一步更佳為20。小於上述時,流延厚度係過薄,雙軸延伸會變困難。 The upper limit of the casting speed (m/min) is preferably 120, more preferably 110, further preferably 100. When it exceeds the above, the casting will be unstable. The lower limit of the casting thickness (μm) is preferably 10, more preferably 15, and still more preferably 20. When it is less than the above, the casting thickness is too thin, and the biaxial stretching becomes difficult.

流延厚度(μm)之上限較佳為1250,更佳為1000,進一步更佳為800。超過上述時,冷卻變不充分,難以得到穩定的延伸性。 The upper limit of the casting thickness (μm) is preferably 1,250, more preferably 1,000, still more preferably 800. When it exceeds the above, the cooling becomes insufficient, and it is difficult to obtain stable elongation.

作為MD延伸方法,較佳為除了一段延伸外,還有二段延伸等之多段延伸。尤其,為了不使雙軸延伸後之面配向升高或為了雙軸延伸後之歪斜的減低,較佳為二段延伸等之多段延伸。作為MD延伸方法,較佳為輥加熱方式、紅外加熱方式。 As the MD extension method, it is preferable to have a plurality of extensions of two extensions and the like in addition to one extension. In particular, in order not to increase the surface alignment after the biaxial stretching or to reduce the skew after the biaxial stretching, it is preferable to extend the plurality of sections such as the two-stage extension. As the MD stretching method, a roll heating method or an infrared heating method is preferred.

MD延伸倍率(倍)之下限較佳為3,更佳為3.1,進一步更佳為3.2。小於上述時,會看到突刺強度等之力學特性的降低。MD延伸倍率(倍)之上限較佳為4.5,更佳為4.4,進一步更佳為4.3。超過上述時,在製膜時看見斷裂等,生產性會降低。 The lower limit of the MD stretching ratio (times) is preferably 3, more preferably 3.1, still more preferably 3.2. When it is less than the above, the mechanical properties such as the spur strength are lowered. The upper limit of the MD stretching ratio (times) is preferably 4.5, more preferably 4.4, still more preferably 4.3. When it exceeds the above, the fracture is observed at the time of film formation, and productivity is lowered.

MD預熱溫度(℃)之下限較佳為30,更佳為35,進一步更佳為40。低於上述時,預熱係不充分,延伸會變困難。MD預熱溫度(℃)之上限較佳為200,更佳為180,進一步更佳為150。超過上述時會結晶化,延伸會變困難。 The lower limit of the MD preheating temperature (°C) is preferably 30, more preferably 35, still more preferably 40. When it is less than the above, the preheating system is insufficient, and the elongation becomes difficult. The upper limit of the MD preheating temperature (°C) is preferably 200, more preferably 180, still more preferably 150. When it exceeds the above, it will crystallize and it will become difficult to extend.

MD延伸溫度(℃)之下限較佳為50,更佳為60,進一步更佳為70,特佳為80。低於上述時,樹脂無法軟化,延伸會變困難。MD延伸溫度(℃)之上限較佳為150,更佳為145,進一步更佳為140。超過上述時會結晶化,延 伸會變困難。 The lower limit of the MD extension temperature (°C) is preferably 50, more preferably 60, still more preferably 70, and particularly preferably 80. When it is less than the above, the resin does not soften and the elongation becomes difficult. The upper limit of the MD extension temperature (°C) is preferably 150, more preferably 145, still more preferably 140. Crystallization, extension Stretching will become difficult.

紅外加熱方式時的延伸溫度係根據其製膜條件來適宜調整,但延伸時的薄膜溫度較佳在上述之範圍。 The stretching temperature in the infrared heating mode is appropriately adjusted depending on the film forming conditions, but the film temperature at the time of stretching is preferably in the above range.

MD延伸速度(%/分鐘)之下限較佳為100,更佳為150,進一步更佳為200。低於上述時,生產性會變低。MD延伸速度(%/分鐘)之上限較佳為100000,更佳為90000,進一步更佳為80000。超過上述時,製膜穩定性會降低。 The lower limit of the MD stretching speed (%/min) is preferably 100, more preferably 150, still more preferably 200. Below this, productivity will become low. The upper limit of the MD stretching speed (%/min) is preferably 100,000, more preferably 90,000, still more preferably 80,000. When the above is exceeded, the film formation stability is lowered.

MD延伸倍率之下限較佳為2.5,更佳為2.6,進一步更佳為2.7。小於上述時,表層的結晶化度低,擠壓積層條件變更時,除了剝離力會變化外,還有突刺強度會降低。MD延伸倍率之上限較佳為4.5,更佳為4.4,進一步更佳為4.35。超過上述時,製膜時的生產性會降低。 The lower limit of the MD stretching ratio is preferably 2.5, more preferably 2.6, still more preferably 2.7. When it is less than the above, the degree of crystallization of the surface layer is low, and when the conditions of the extrusion build-up are changed, in addition to the change in the peeling force, the spur strength is also lowered. The upper limit of the MD stretching ratio is preferably 4.5, more preferably 4.4, still more preferably 4.35. When it exceeds the above, the productivity at the time of film formation will fall.

MD延伸後之厚度(μm)之下限較佳為5,更佳為10,進一步更佳為15。小於上述時,橫向延伸會變困難。 The lower limit of the thickness (μm) after the MD extension is preferably 5, more preferably 10, still more preferably 15. When it is less than the above, the lateral extension becomes difficult.

MD延伸後之厚度(μm)之上限較佳為250,更佳為240,進一步更佳為230。超過上述時,雙軸延伸後之厚度係過厚,不適於本發明之目的。 The upper limit of the thickness (μm) after the MD extension is preferably 250, more preferably 240, still more preferably 230. When the above is exceeded, the thickness after biaxial stretching is too thick and is not suitable for the purpose of the present invention.

TD延伸倍率(倍)之下限較佳為3.5,更佳為3.6,進一步更佳為3.7。小於上述時,除了製膜時的生產性降低,還有厚度的均勻性會降低。TD延伸倍率(倍)之上限較佳為5,更佳為4.8,進一步更佳為4.5。超過上述時,在製膜時看到斷裂等,生產性會降低。 The lower limit of the TD stretching ratio (times) is preferably 3.5, more preferably 3.6, still more preferably 3.7. When it is less than the above, the productivity in the film formation is lowered, and the uniformity of the thickness is lowered. The upper limit of the TD stretching ratio (times) is preferably 5, more preferably 4.8, still more preferably 4.5. When it exceeds the above, a fracture or the like is observed at the time of film formation, and productivity is lowered.

TD預熱溫度(℃)之下限較佳為30,更佳為40,進一步更佳為50,特佳為60。低於上述時,預熱係不充分,延伸會變困難。TD預熱溫度(℃)之上限較佳為150,更佳為145,進一步更佳為140。超過上述時會結晶化,延伸會變困難。 The lower limit of the TD preheating temperature (°C) is preferably 30, more preferably 40, still more preferably 50, and particularly preferably 60. When it is less than the above, the preheating system is insufficient, and the elongation becomes difficult. The upper limit of the TD preheating temperature (°C) is preferably 150, more preferably 145, still more preferably 140. When it exceeds the above, it will crystallize and it will become difficult to extend.

TD延伸溫度(℃)之下限較佳為50,更佳為60,進一步更佳為70,特佳為80,最佳為100。低於上述時,樹脂無法軟化,延伸會變困難。 The lower limit of the TD extension temperature (°C) is preferably 50, more preferably 60, still more preferably 70, particularly preferably 80, most preferably 100. When it is less than the above, the resin does not soften and the elongation becomes difficult.

TD延伸溫度(℃)之上限較佳為180,更佳為175,進一步更佳為170,特佳為165,最佳為160。超過上述時會結晶化,延伸會變困難。 The upper limit of the TD extension temperature (°C) is preferably 180, more preferably 175, still more preferably 170, particularly preferably 165, most preferably 160. When it exceeds the above, it will crystallize and it will become difficult to extend.

熱定型條件之設定係本發明中的最重要之點。於本發明中,為了黏著性之展現,必須以電暈放電處理等之處理時的熱使薄膜表面的結晶緩和之方式,設定熱定型條件。若以電暈放電處理前之狀態且係表面的結晶強固者,則結晶的熔融等構造之緩和會變得難以發生,且藉由電暈放電處理所致黏著性之改善效果會變小。因此,必須配合雙軸延伸後當下的熱定型前之狀態來設定熱定型條件。 The setting of heat setting conditions is the most important point in the present invention. In the present invention, in order to exhibit adhesion, it is necessary to set the heat setting conditions so that the crystal on the surface of the film is moderated by heat during the treatment such as corona discharge treatment. When the crystal is solidified on the surface before the corona discharge treatment, the relaxation of the structure such as melting of the crystal becomes difficult to occur, and the effect of improving the adhesion by the corona discharge treatment is small. Therefore, it is necessary to set the heat setting condition in accordance with the state before the heat setting immediately after the biaxial stretching.

作為概略的方針: As a general guideline:

‧在使用結晶化速度快的原料時或雙軸延伸後的配向較高時,會成為表面的結晶強固者,必須以高溫作為薄膜表面所到達的溫度進行熱定型,但若長時間暴露於高溫下,則薄膜的力學特性會降低。因此,必須使薄膜所到達的溫度高,且使高溫下的處理時間短。 ‧When using a material with a high crystallization rate or a high alignment after biaxial stretching, it will become a crystal sturdy on the surface. It must be heat set at a high temperature as the temperature reached by the film surface, but if it is exposed to high temperature for a long time. Underneath, the mechanical properties of the film will be reduced. Therefore, it is necessary to make the temperature reached by the film high and to make the processing time at a high temperature short.

‧在使用結晶化速度慢的原料時或雙軸延伸後的配向較低時,由於以熱定型時之熱難以引起薄膜的結晶化,於高溫下的熱定型中薄膜會發生熔融等,而使薄膜的力學特性降低。因此,必須進行低溫且長時間的熱定型,但太過於低溫且長時間之處理時,不會產生薄膜的力學特性之改善或表面的結晶之熔融等,而不會產生電暈放電處理等所致的黏著性之改善。因此,必須於確認薄膜的物性後,再進行一邊提高適宜熱定型溫度,一邊縮短高溫下的熱定型時間之調整。 ‧ When using a raw material with a slow crystallization rate or a low alignment after biaxial stretching, it is difficult to cause crystallization of the film due to heat during heat setting, and the film may be melted during heat setting at a high temperature. The mechanical properties of the film are reduced. Therefore, it is necessary to carry out heat setting at a low temperature for a long period of time, but when it is too low temperature and treated for a long period of time, there is no improvement in mechanical properties of the film or melting of crystals on the surface, and corona discharge treatment is not caused. The improvement in adhesion. Therefore, after confirming the physical properties of the film, it is necessary to reduce the heat setting time at a high temperature while increasing the suitable heat setting temperature.

對於此等之點進行檢討,結果發現:藉由以成為如後述的表面結晶化度之範圍的方式調整製膜條件(延伸倍率)及熱定型條件,並對電暈放電處理前後之表面進行調整,可得到黏著性之改善。基於此等之點,必須適宜地調整條件,如以下例示,但不受此等方法或條件所限定。 When reviewing these points, it was found that the film forming conditions (stretching ratio) and the heat setting conditions were adjusted so as to be in the range of the surface crystallization degree to be described later, and the surface before and after the corona discharge treatment was adjusted. , the improvement of adhesion can be obtained. Based on these points, the conditions must be appropriately adjusted, as exemplified below, but are not limited by such methods or conditions.

以下記載假設熱定型區為一個或二個以上之情形(前半部為區1,後半部為區2)。 The following description assumes that the heat setting zone is one or more (the first half is zone 1 and the second half is zone 2).

各區的熱定型溫度(℃)之下限較佳為150,更佳為160,進一步更佳為170。低於上述時,熱收縮率變過大,各種加工步驟的尺寸穩定性會變不良。各區的熱定型溫度(℃)之上限較佳為280,更佳為270,進一步更佳為260。超過上述時,不僅表層的結晶,而且薄膜整體之配向會崩解,會發生力學特性之降低。 The lower limit of the heat setting temperature (°C) of each zone is preferably 150, more preferably 160, still more preferably 170. When it is less than the above, the heat shrinkage rate becomes too large, and the dimensional stability of various processing steps becomes poor. The upper limit of the heat setting temperature (°C) of each zone is preferably 280, more preferably 270, still more preferably 260. When it exceeds the above, not only the crystallization of the surface layer but also the alignment of the entire film is disintegrated, and the mechanical properties are lowered.

熱定型時間(秒)之下限較佳為0.5,更佳為1,進一步更佳為1.2,特佳為1.5,最佳為2.5。少於上述 時,生產性會降低。熱定型時間(秒)之上限較佳為50,更佳為15,進一步更佳為10,特佳為7,最佳為5。超過上述時,生產性會降低。 The lower limit of the heat setting time (second) is preferably 0.5, more preferably 1, still more preferably 1.2, particularly preferably 1.5, and most preferably 2.5. Less than the above At the time, productivity will decrease. The upper limit of the heat setting time (seconds) is preferably 50, more preferably 15, more preferably 10, particularly preferably 7, and most preferably 5. When it exceeds the above, productivity will decrease.

TD鬆弛率(%)之下限較佳為0,更佳為0.5,進一步更佳為0.8。小於上述時,會容易斷裂,生產性會降低。TD鬆弛率(%)之上限較佳為20,更佳為15,進一步更佳為10。超過上述時,會發生下垂,寬度方向之厚度精度會降低。 The lower limit of the TD relaxation rate (%) is preferably 0, more preferably 0.5, still more preferably 0.8. When it is less than the above, it will be easily broken and the productivity will be lowered. The upper limit of the TD relaxation rate (%) is preferably 20, more preferably 15, and still more preferably 10. When it exceeds the above, sagging occurs, and the thickness accuracy in the width direction is lowered.

TD出口的製膜速度(m/分鐘)之下限較佳為3,更佳為5,進一步更佳為10,特佳為20。低於上述時,生產性低,從工業方面來看係不合適。TD出口的製膜速度(m/分鐘)之上限較佳為500,更佳為400,進一步更佳為300。超過上述時,歪斜會變大。 The lower limit of the film forming speed (m/min) of the TD outlet is preferably 3, more preferably 5, still more preferably 10, and particularly preferably 20. When it is less than the above, the productivity is low and it is not suitable from the industrial point of view. The upper limit of the film forming speed (m/min) of the TD outlet is preferably 500, more preferably 400, still more preferably 300. When it exceeds the above, the skew will become larger.

雙軸延伸後之厚度(μm)之下限較佳為3,更佳為4,進一步更佳為5。小於上述時,會過薄而使作業性降低。雙軸延伸後之厚度(μm)之上限較佳為50,更佳為45,進一步更佳為40。超過上述時,除了會過厚而使作業性會降低外,而且作為包裝材料使用時,彎曲性會變低。 The lower limit of the thickness (μm) after biaxial stretching is preferably 3, more preferably 4, still more preferably 5. When it is less than the above, it is too thin and the workability is lowered. The upper limit of the thickness (μm) after the biaxial stretching is preferably 50, more preferably 45, still more preferably 40. When it exceeds the above, the workability is lowered in addition to being too thick, and the flexibility is lowered when used as a packaging material.

(薄膜特性) (film properties)

本發明在150℃×15分鐘的MD方向之熱收縮率(%)之下限較佳為0.5,更佳為0.6,進一步更佳為0.7。小於上述時,尺寸穩定性升高所致的實用上之效果係飽和。在150℃×15分鐘的MD方向之熱收縮率(%)之上限較佳為10,更佳為8,進一步更佳為5。超過上述時,發生各種加 工步驟的間距偏移等,外觀低落。 The lower limit of the heat shrinkage ratio (%) in the MD direction at 150 ° C for 15 minutes of the present invention is preferably 0.5, more preferably 0.6, still more preferably 0.7. When it is less than the above, the practical effect due to an increase in dimensional stability is saturation. The upper limit of the heat shrinkage ratio (%) in the MD direction at 150 ° C for 15 minutes is preferably 10, more preferably 8, more preferably 5. When more than the above, various kinds of addition occur The pitch of the steps of the work is offset, and the appearance is low.

本發明之易黏著處理面的表面結晶化度之下限較佳為1.1,更佳為1.15,進一步更佳為1.2,最佳為1.25。小於上述時,熱所致的薄膜表層之結晶化度的變化大,因加工後的熱處理而各種密接性會變化。易黏著處理面的表面結晶化度之上限較佳為1.35,更佳為1.34,進一步更佳為1.33,特佳為1.3,最佳為1.28。超過上述時,薄膜表層的結晶化度係過高,黏著性會降低。 The lower limit of the degree of surface crystallization of the easy-adhesive treated surface of the present invention is preferably 1.1, more preferably 1.15, still more preferably 1.2, most preferably 1.25. When it is less than the above, the change in the degree of crystallization of the surface layer of the film due to heat is large, and various adhesiveness changes due to the heat treatment after the treatment. The upper limit of the degree of surface crystallization of the easy-adhesive treated surface is preferably 1.35, more preferably 1.34, still more preferably 1.33, particularly preferably 1.3, most preferably 1.28. When it exceeds the above, the degree of crystallization of the surface layer of the film is too high, and the adhesion is lowered.

本發明之非處理面的表面結晶化度之下限較佳為1.1,更佳為1.15,進一步更佳為1.2,最佳為1.25。非處理面的表面結晶化度係與電暈放電處理等之處理前的表面相同,但若小於上述,則由於薄膜表層之結晶化度過低,各種密接性會變化。非處理面的表面結晶化度之上限較佳為1.5,更佳為1.45,進一步更佳為1.4。如上述,非處理面係與各種處理前的處理面大致相同,但若超過上述,則由於薄膜表層的結晶化度過高,而無法改善易黏著處理面側之密接性故不宜。 The lower limit of the degree of surface crystallization of the non-treated surface of the present invention is preferably 1.1, more preferably 1.15, still more preferably 1.2, most preferably 1.25. The degree of surface crystallization of the non-treated surface is the same as that before the treatment such as corona discharge treatment. However, if it is less than the above, the degree of crystallization of the surface layer of the film is too low, and various adhesion properties are changed. The upper limit of the degree of surface crystallization of the non-treated surface is preferably 1.5, more preferably 1.45, still more preferably 1.4. As described above, the non-treated surface is substantially the same as the treatment surface before the various treatments. However, if the degree of crystallization of the surface layer of the film is too high, the adhesion of the surface of the film to the side of the easy-to-adhere treatment surface is not preferable.

自本發明之薄膜的一側的表面結晶化度減去薄膜的另一側的結晶化度後的值之下限較佳為-0.1,更佳為-0.08,進一步更佳為-0.05。小於上述時,黏著性改善的效果會飽和。自薄膜的一側的表面結晶化度減去薄膜的另一側的結晶化度後的值之上限較佳為0,更佳為-0.001,進一步更佳為-0.004,最佳為-0.008。超過上述時,會因電暈放電處理等之易黏著處理而使表面的結晶化度增加,而無法改善黏著性。 The lower limit of the value after the surface crystallization degree of one side of the film of the present invention minus the crystallization degree of the other side of the film is preferably -0.1, more preferably -0.08, still more preferably -0.05. When it is less than the above, the effect of improving the adhesion is saturated. The upper limit of the value after the surface crystallization degree of one side of the film minus the crystallization degree of the other side of the film is preferably 0, more preferably -0.001, still more preferably -0.004, most preferably -0.008. When it exceeds the above, the degree of crystallization of the surface is increased by the adhesion treatment such as corona discharge treatment, and the adhesion cannot be improved.

於進一步限定時,只要自薄膜的易黏著處理面之結晶化度減去非處理面之結晶化度後的值為上述範圍即可。 In the case of further limiting, the value obtained by subtracting the degree of crystallization of the non-treated surface from the degree of crystallization of the easy-adhesion treated surface of the film may be within the above range.

本發明之薄膜的突刺強度(N)之下限較佳為5,更佳為6,進一步更佳為7。小於上述時,容易發生加工時的斷裂等。突刺強度(N)之上限較佳為20,更佳為18,進一步更佳為17。超過上述時,效果會飽和。 The lower limit of the spur strength (N) of the film of the present invention is preferably 5, more preferably 6, still more preferably 7. When it is less than the above, it is easy to cause breakage during processing or the like. The upper limit of the spur strength (N) is preferably 20, more preferably 18, still more preferably 17. When the above is exceeded, the effect will be saturated.

於本說明書中,所謂的「易黏著處理面」,就是指施有以下所示的易黏著處理之面。就本發明中的易黏著處理方法而言,除了紫外線照射處理、電暈放電處理、電漿放電處理、火焰處理等之物理上的方法外,還可使用鹼處理、底漆處理等之化學處理等。較佳為可乾式處理之物理上的方法,更佳為紫外線照射處理、電暈放電處理、電漿放電處理、火焰處理,進一步更佳為紫外線照射處理、電暈放電處理、電漿放電處理,最佳為電暈放電處理。 In the present specification, the term "easy adhesion treatment surface" means a surface to which the adhesion treatment is as follows. In the adhesion processing method of the present invention, in addition to the physical methods such as ultraviolet irradiation treatment, corona discharge treatment, plasma discharge treatment, flame treatment, etc., chemical treatment such as alkali treatment, primer treatment, or the like can be used. Wait. Preferably, it is a physical method capable of dry treatment, more preferably ultraviolet irradiation treatment, corona discharge treatment, plasma discharge treatment, flame treatment, and further preferably ultraviolet irradiation treatment, corona discharge treatment, plasma discharge treatment, The best is corona discharge treatment.

關於電暈放電處理,可利用眾所周知之方法(例如參照專利文獻特開昭62-106934號)。較佳的放電量(W‧min/m2)之下限為1,更佳為5,進一步更佳為10。小於上述時,處理之效果小,看不到黏著性的改善效果。較佳的放電量(W‧min/m2)之上限為200,更佳為180,進一步更佳為150。超過上述時,表面的氧化進行過度,反而看不到黏著性的改善效果。 For the corona discharge treatment, a well-known method can be used (for example, refer to JP-A-62-106934). The lower limit of the preferable discharge amount (W‧min/m 2 ) is 1, more preferably 5, still more preferably 10. When it is less than the above, the effect of the treatment is small, and the effect of improving the adhesion is not observed. The upper limit of the preferable discharge amount (W‧min/m 2 ) is 200, more preferably 180, still more preferably 150. When it exceeds the above, the oxidation of the surface is excessive, and the effect of improving the adhesion is not observed.

於本發明中,藉由使薄膜的各特性成為本發明之範圍,於積層加工時可賦予非常高的黏著性(積層強 度)。 In the present invention, by making each characteristic of the film into the range of the present invention, it is possible to impart a very high adhesiveness during lamination processing (strong laminate) degree).

積層強度之下限較佳為3,更佳為3.5,進一步更佳為4。若小於上述,則在作為袋或蓋材等使用之際而施加強衝撃時,有容易破袋等之不良狀況。積層強度之上限較佳為15,更佳為13,進一步更佳為10。超過上述時,效果係飽和。 The lower limit of the buildup strength is preferably 3, more preferably 3.5, still more preferably 4. When it is less than the above, when a strong punch is applied as a bag or a cover material, there is a problem that it is easy to break a bag or the like. The upper limit of the buildup strength is preferably 15, more preferably 13, and even more preferably 10. When the above is exceeded, the effect is saturated.

本案係以在平成24年8月3日申請的日本發明專利申請案第2012-172815號為基礎,而主張優先權之利益者。在平成24年8月3日申請的日本發明專利申請案第2012-172815號的說明書之全部內容係為了參考而在本案中引用。 This case is based on Japanese Patent Application No. 2012-172815 filed on August 3, 2002, and claims priority. The entire contents of the specification of Japanese Patent Application No. 2012-172815, filed on Jan. 3, 2008, the entire disclosure of which is incorporated herein by reference.

[實施例] [Examples]

其次,藉由實施例來更詳細說明本發明,惟本發明不受以下之例所限定。再者,薄膜之評價係藉由以下的測定方法來進行。 Next, the present invention will be described in more detail by way of examples, but the invention is not limited by the following examples. Further, the evaluation of the film was carried out by the following measurement method.

[聚酯之固有黏度] [Intrinsic viscosity of polyester]

使0.1g聚酯溶解於苯酚/四氯乙烷(容積比:3/2)的混合溶劑25mL中,在30℃使用奧士瓦黏度計測定。 0.1 g of the polyester was dissolved in 25 mL of a mixed solvent of phenol/tetrachloroethane (volume ratio: 3/2), and measured at 30 ° C using an Oswald viscometer.

[聚酯之熔點] [melting point of polyester]

使用SU製示差掃描型熱量計(DSC),以10mg樣品量、20℃/分鐘的升溫速度來測定。將於此所檢測出的熔解吸熱峰溫度當作熔點。 The measurement was carried out using a SU-based differential scanning calorimeter (DSC) at a sample rate of 10 mg and a temperature increase rate of 20 ° C /min. The melting endothermic peak temperature detected here was taken as the melting point.

[厚度] [thickness]

用依據JIS-Z-1702之方法來測定。 It was measured by the method according to JIS-Z-1702.

[表面結晶化度] [Surface crystallinity]

對於試料的易黏著處理面及非處理面之兩面,在以下的條件下進行FT-IR ATR測定。 The FT-IR ATR measurement was performed under the following conditions on both the easy-adhesive treated surface and the non-treated surface of the sample.

FT-IR裝置:Bio Rad DIGILAB公司製FTS-60A/896 FT-IR device: FTS-60A/896 made by Bio Rad DIGILAB

1次反射ATR附件:golden gate MKII(SPECAC製) 1st reflection ATR accessory: golden gate MKII (made by SPECAC)

內部反射元件:鑽石 Internal reflective element: diamond

入射角:45° Angle of incidence: 45°

分解能:4cm-1 Decomposition energy: 4cm -1

累計次數:128次 Cumulative number: 128 times

結晶化度係由在1340cm-1附近出現的吸收度與在1410cm-1附近出現的吸收度之強度比(1340cm-1/1410cm-1)算出。此處,1340cm-1係乙二醇的CH2(反式構造)的變形振動所造成之吸收,1410cm-1係與結晶、配向無關之吸收。 The degree of crystallinity was calculated from the intensity of the absorption lines of the absorption occurring in the vicinity of 1340cm -1 and 1410cm -1 appear in the vicinity of ratio (1340cm -1 / 1410cm -1). Here, absorption by the deformation vibration of CH 2 (trans structure) of 1340 cm -1 ethylene glycol, and absorption of 1410 cm -1 irrespective of crystallization and alignment.

再者,作為「自薄膜的一側的表面結晶化度減去薄膜的另一側的表面結晶化度後的值」,使用「自薄膜的易黏著處理面之表面結晶化度減去非處理面之表面結晶化度後的值」。 In addition, as "the value obtained by subtracting the surface crystallization degree of the other side of the film from the surface crystallization degree of one side of the film", "the surface crystallization degree of the easy-adhesion treated surface of the film is subtracted from the non-treatment. The value after the surface crystallization degree of the surface".

[斷裂強度、斷裂延伸度] [breaking strength, elongation at break]

根據JIS K 7113。於薄膜的長度方向及寬度方向中,使用剃刀切出寬度10mm、長度100mm之試料,當作試料。於23℃、35%RH之環境下放置12小時後,測定係在23℃、35%RH之環境下,於40mm的夾頭間距離、200mm/分鐘的拉伸速度之條件下進行,使用5次的測定結果之平均值。作為測定裝置,使用島津製作所公司製Autograph AG5000A。 According to JIS K 7113. A sample having a width of 10 mm and a length of 100 mm was cut out in the longitudinal direction and the width direction of the film using a razor as a sample. After being allowed to stand in an environment of 23 ° C and 35% RH for 12 hours, the measurement was carried out under the conditions of a cross-clamp distance of 40 mm and a tensile speed of 200 mm/min in an environment of 23 ° C and 35% RH. The average of the measurement results of the second time. As the measuring device, Autograph AG5000A manufactured by Shimadzu Corporation was used.

[突刺強度] [spur strength]

依據日本食品衛生法中的「食品、添加物等之規格基準第3:器具及容器包裝」(昭和57年厚生省告示第20號)的「2.強度等試驗法」來測定。將尖端部直徑0.7mm之針以50mm/分鐘的突刺速度來突刺薄膜,測定針貫穿薄膜時的強度,當作突刺強度。測定係在常溫(23℃)進行,單位為[N]。 It is measured according to the "2. Strength and other test methods" of "Standards for Foods and Additives, No. 3: Apparatus and Container Packaging" (Showing No. 20 of the Ministry of Health and Welfare in the Showa 57). The needle having a tip end portion of 0.7 mm was spurted at a spur speed of 50 mm/min, and the strength at which the needle penetrated the film was measured to obtain the spur strength. The measurement was carried out at room temperature (23 ° C) in units of [N].

[熱收縮率] [heat shrinkage rate]

除了150℃的試驗溫度、10分鐘的加熱時間以外,係藉由JIS-C-2318記載之尺寸變化試驗法進行測定。 The measurement was carried out by a dimensional change test method described in JIS-C-2318 except for a test temperature of 150 ° C and a heating time of 10 minutes.

[積層強度] [layer strength]

由以厚度40μm的聚烯烴薄膜所積層之積層體切出寬度15mm、長度200mm當作試驗片,使用TOYO BALDWIN公司製之「Tensilon UMT-II-500型」,於23℃的溫度、65%的相對濕度之條件下,測定聚酯薄膜1的未處理面與聚烯烴樹脂層之接合面的剝離強度。再者,拉伸速度為10cm/分鐘,剝離角度為180度。 A laminate having a width of 15 mm and a length of 200 mm was formed by a laminate of a polyolefin film having a thickness of 40 μm, and was used as a test piece by "Tensilon UMT-II-500" manufactured by TOYO BALDWIN Co., Ltd. at a temperature of 23 ° C and 65%. The peeling strength of the joint surface of the untreated surface of the polyester film 1 and the polyolefin resin layer was measured under the conditions of relative humidity. Further, the stretching speed was 10 cm/min, and the peeling angle was 180 degrees.

[油墨密接性] [Ink Adhesion]

根據JIS-K5400記載之棋盤格評價,在薄膜的易黏著面上印刷油墨後,使用十字切割導引器,藉由刀刃作成100個1mm方格後,使用黏著帶(NICHIBAN公司製賽璐玢膠帶),評價方格部分的密接力。 According to the checkerboard evaluation described in JIS-K5400, after printing the ink on the easy-adhesive surface of the film, the cross-cut guide was used to make 100 1 mm squares by the blade, and the adhesive tape (NICHIBAN company's celluloid tape) was used. ), evaluate the closeness of the square part.

作為所用之油墨,係使用溶劑型油墨(十條油墨公司製900系列Tetron ink),於薄膜的被覆層面(本發明之被覆層A)進行#250的網版印刷後,使用24小時放置乾燥者。 As the ink to be used, a solvent type ink (900 series Tetron ink manufactured by Shikoku Co., Ltd.) was used, and screen printing of #250 was carried out on the coating layer of the film (the coating layer A of the present invention), and then the dryer was placed for 24 hours.

[聚酯樹脂1之製造例] [Production Example of Polyester Resin 1]

於對苯二甲酸與乙二醇的混合物中,以在聚酯中的Mg原子計成為60ppm之方式,添加醋酸鎂四水鹽,於常壓下在溫度255℃使酯化反應。然後,添加使Sb原子在聚酯中成為150ppm之量的三氧化銻及使P原子在聚酯中成為40ppm之量的磷酸三甲酯,更在260℃的溫度使反應。 In a mixture of terephthalic acid and ethylene glycol, magnesium acetate tetrahydrate was added in such a manner that the Mg atom in the polyester was 60 ppm, and the esterification reaction was carried out at a temperature of 255 ° C under normal pressure. Then, antimony trioxide in an amount of 150 ppm of the Sb atom in the polyester and trimethyl phosphate in an amount of 40 ppm in the polyester were added, and the reaction was further carried out at a temperature of 260 °C.

接著,將反應生成物移到聚縮合反應層,以二氧化矽在聚酯中成為1000ppm之方式,添加平均粒徑2.3μm的二氧化矽粒子之乙二醇漿體後,其次邊加熱升溫邊將反應系徐徐地減壓,於133Pa(1mmHg)之減壓下,在280℃藉由常用方法進行聚縮合,而得到IV=0.62之聚酯碎片。再者,所得之聚酯樹脂係藉由DSC所得之以20℃/分鐘之速度自熔融狀態起冷卻時所觀察的再結晶化溫度[Tc(A)]為161℃,以40℃/分鐘之速度的再結晶化溫度[Tc(B)]為157℃,Tc(A)-Tc(B)為4℃。 Next, the reaction product was transferred to a polycondensation reaction layer, and an ethylene glycol slurry of cerium oxide particles having an average particle diameter of 2.3 μm was added so that cerium oxide became 1000 ppm in the polyester, and then the temperature was raised while heating. The reaction system was slowly depressurized, and polycondensed at 280 ° C under a reduced pressure of 133 Pa (1 mmHg) by a usual method to obtain a polyester scrap of IV = 0.62. Further, the obtained polyester resin was obtained by DSC and the recrystallization temperature [Tc(A)] observed by cooling from a molten state at a rate of 20 ° C /min was 161 ° C at 40 ° C / min. The recrystallization temperature of the speed [Tc(B)] was 157 ° C, and Tc (A) - Tc (B) was 4 °C.

[實施例1] [Example 1]

將聚酯樹脂1在120℃減壓乾燥(1.3hPa)24小時,使用單軸擠壓機,在280℃使熔融後,由30cm寬的T模頭(280℃)流延到冷卻輥(表面溫度10℃)上,(自以與冷卻輥周面相向的方式所設置之直徑為30μm的鎢絲電極來施加7.2kV之電壓,流通0.2mA之電流而使靜電密接),得到中央部之厚度為170μm之未延伸片。 The polyester resin 1 was dried under reduced pressure (1.3 hPa) at 120 ° C for 24 hours, and after melting at 280 ° C using a uniaxial extruder, it was cast from a 30 cm wide T die (280 ° C) to a cooling roll (surface). At a temperature of 10 ° C), a voltage of 7.2 kV was applied from a tungsten wire electrode having a diameter of 30 μm disposed opposite to the circumferential surface of the cooling roll, and a current of 0.2 mA was passed to make electrostatic adhesion, and the thickness of the central portion was obtained. It is an unextended sheet of 170 μm.

以95℃的輥溫度來預熱該未延伸片,以100℃的延伸溫度在長度方向中延伸3.5倍,其次以100℃在橫向中延伸4.0倍,接著以3.0%的鬆弛率,在230℃進行熱定型處 理,得到厚度12μm的聚酯薄膜。TD出口之速度為50m/分鐘,在熱定型區的滯留時間為2秒。然後,預熱至40℃後,對薄膜一面側進行電暈放電處理。電暈放電處理係以90W‧min/m2進行。然後,捲繞在紙管上,成為聚酯薄膜1。表1中顯示所得之薄膜的特性。 The unstretched sheet was preheated at a roll temperature of 95 ° C, extended 3.5 times in the length direction at an elongation temperature of 100 ° C, and then extended 4.0 times in the transverse direction at 100 ° C, followed by a relaxation rate of 3.0% at 230 ° C. The heat setting treatment was carried out to obtain a polyester film having a thickness of 12 μm. The speed of the TD outlet is 50 m/min, and the residence time in the heat setting zone is 2 seconds. Then, after preheating to 40 ° C, one side of the film was subjected to corona discharge treatment. The corona discharge treatment was carried out at 90 W ‧ min/m 2 . Then, it is wound on a paper tube to form a polyester film 1. The properties of the resulting film are shown in Table 1.

[實施例2] [Embodiment 2]

依照表1記載之條件得到薄膜。表1中顯示所得之薄膜的製膜條件、物性及評價結果。 A film was obtained according to the conditions described in Table 1. Table 1 shows the film forming conditions, physical properties, and evaluation results of the obtained film.

[實施例3] [Example 3]

作為原料,將PET瓶洗淨後,於再丸粒化而得之再生PET樹脂(IV:0.68,Co-b:8,間苯二甲酸共聚量2.0莫耳%)60%中混合含有平均粒徑1.3μm的凝聚二氧化矽之聚酯樹脂40%,使用二氧化矽濃度成為700ppm者,依照表1記載之條件得到薄膜。表1中顯示所得之薄膜的製膜條件、物性及評價結果。再者,於上述的原料配方中,藉由DSC所得之以20℃/分鐘之速度自熔融狀態起冷卻時所觀察的再結晶化溫度[Tc(A)]為151℃,以40℃/分鐘之速度的再結晶化溫度[Tc(B)]為144℃,Tc(A)-Tc(B)為7℃。 After washing the PET bottle as a raw material, the recycled PET resin (IV: 0.68, Co-b: 8, isophthalic acid copolymerization amount: 2.0 mol%) obtained by regranulation was mixed with an average particle of 60%. A polyester resin having a diameter of 1.3 μm and a condensed cerium oxide of 40% was used, and when the concentration of cerium oxide was 700 ppm, a film was obtained according to the conditions described in Table 1. Table 1 shows the film forming conditions, physical properties, and evaluation results of the obtained film. Further, in the above raw material formulation, the recrystallization temperature [Tc(A)] observed by DSC at a rate of 20 ° C /min from the molten state was 151 ° C at 40 ° C / min. The recrystallization temperature [Tc (B)] of the speed was 144 ° C, and Tc (A) - Tc (B) was 7 ° C.

[實施例4] [Example 4]

作為原料,將聚酯樹脂1的乙二醇當作來自植物的乙二醇,於不添加凝聚二氧化矽下所得之聚酯樹脂(IV:0.65)80%中混合含有3500ppm的平均粒徑2.3μm的凝聚二氧化矽之PET樹脂20%,使用二氧化矽濃度成為700ppm者,依照表1記載之條件得到薄膜。表1中顯示所得之薄 膜的製膜條件、物性及評價結果。再者,於上述的原料配方中,藉由DSC所得之以20℃/分鐘之速度自熔融狀態起冷卻時所觀察的再結晶化溫度[Tc(A)]為168℃,以40℃/分鐘之速度的再結晶化溫度[Tc(B)]為155℃,Tc(A)-Tc(B)為13℃。又,所用之來自植物的乙二醇中之藉由氧循環式化學發光法所得之氮化合物量為0~1ppm之範圍。 As a raw material, ethylene glycol of the polyester resin 1 was used as a plant-derived ethylene glycol, and an average particle diameter of 3500 ppm was mixed in a polyester resin (IV: 0.65) obtained by adding no condensed cerium oxide (80%). 20% of the PET resin of the condensed cerium oxide of μm was used, and when the concentration of cerium oxide was 700 ppm, a film was obtained according to the conditions described in Table 1. The thinness shown in Table 1 Film forming conditions, physical properties and evaluation results of the film. Further, in the above raw material formulation, the recrystallization temperature [Tc(A)] observed by DSC at a rate of 20 ° C/min from the molten state was 168 ° C at 40 ° C / min. The recrystallization temperature [Tc(B)] of the speed was 155 ° C, and Tc (A) - Tc (B) was 13 °C. Further, the amount of the nitrogen compound obtained by the oxygen cycle chemiluminescence method in the ethylene glycol derived from the plant is in the range of 0 to 1 ppm.

[比較例1~4] [Comparative Examples 1 to 4]

依照表1記載之條件得到薄膜。表1中顯示所得之薄膜的製膜條件、物性及評價結果。 A film was obtained according to the conditions described in Table 1. Table 1 shows the film forming conditions, physical properties, and evaluation results of the obtained film.

[比較例5~7] [Comparative Examples 5 to 7]

作為原料,除了使用含有10ppm的氮系化合物作為雜質之來自植物的乙二醇以外,於與實施例4同樣地得到之聚酯樹脂(IV:0.65)80%中混合含有平均粒徑1.3μm的凝聚二氧化矽之PET樹脂20%,使用二氧化矽濃度成為1000ppm者,依照表1記載之條件得到薄膜。表1中顯示所得之薄膜的製膜條件、物性及評價結果。再者,於上述的原料配方中,藉由DSC所得之以20℃/分鐘之速度自熔融狀態起冷卻時所觀察的再結晶化溫度[Tc(A)]為175℃,以40℃/分鐘之速度的再結晶化溫度[Tc(B)]為155℃,Tc(A)-Tc(B)為20℃。 In the polyester resin (IV: 0.65) obtained in the same manner as in Example 4, 80% of the polyester resin (IV: 0.65) obtained in the same manner as in Example 4 was mixed with an average particle diameter of 1.3 μm, except that a plant-derived ethylene glycol containing 10 ppm of a nitrogen-based compound as an impurity was used. 20% of the PET resin in which cerium oxide was condensed, and when the concentration of cerium oxide was 1000 ppm, a film was obtained according to the conditions described in Table 1. Table 1 shows the film forming conditions, physical properties, and evaluation results of the obtained film. Further, in the above raw material formulation, the recrystallization temperature [Tc(A)] observed by DSC at a rate of 20 ° C /min from the molten state was 175 ° C at 40 ° C / min. The recrystallization temperature [Tc(B)] of the speed was 155 ° C, and Tc (A) - Tc (B) was 20 °C.

[比較例8] [Comparative Example 8]

使用在聚酯樹脂1中添加有1重量%的結晶核劑(ADKEA製Adekastab NA-05)之原料,依照表1記載之條件得到薄膜。表1中顯示所得之薄膜的製膜條件、物性及 評價結果。再者,於上述的原料配方中,藉由DSC所得之以20℃/分鐘之速度自熔融狀態起冷卻時所觀察的結晶化溫度[Tc(A)]為185℃,以40℃/分鐘之速度的再結晶化溫度[Tc(B)]為153℃,Tc(A)-Tc(B)為32℃。 A film obtained by adding a 1% by weight of a crystal nucleating agent (Adekastab NA-05 manufactured by ADKEA) to the polyester resin 1 was used to obtain a film in accordance with the conditions described in Table 1. Table 1 shows the film forming conditions, physical properties and properties of the obtained film. Evaluation results. Further, in the above raw material formulation, the crystallization temperature [Tc(A)] observed by DSC at a rate of 20 ° C /min from the molten state was 185 ° C, at 40 ° C / min. The recrystallization temperature of the speed [Tc(B)] was 153 ° C, and Tc (A) - Tc (B) was 32 °C.

表1中顯示上述結果。 The above results are shown in Table 1.

[產業上之可利用性] [Industrial availability]

本發明之聚酯薄膜係可廣用於磁帶、絕緣帶、相片薄膜、描圖薄膜、包裝材料、電絕緣材料、資訊記錄材料、各種步驟紙等之廣泛領域中,特別因為耐熱性、尺寸穩定性優異,而適合於印刷加工。 The polyester film of the invention can be widely used in a wide range of fields such as magnetic tapes, insulating tapes, photo films, tracing films, packaging materials, electrical insulating materials, information recording materials, various step papers, etc., especially because of heat resistance and dimensional stability. Excellent, and suitable for printing.

又,由於耐熱性高,在塗布或印刷的乾燥時可高溫乾燥,可使生產效率化及使用以往難以使用之塗布劑或油墨、積層黏著劑等。 Moreover, since it is high in heat resistance, it can be dried at a high temperature during drying of coating or printing, and productivity can be improved, and a coating agent or ink which has been difficult to use in the past, a laminated adhesive, etc. can be used.

再者,亦適合於電容器或馬達等的絕緣薄膜、太陽電池的背板、無機氧化物的障壁薄膜、ITO等透明導電薄膜之基底薄膜。 Further, it is also suitable for an insulating film such as a capacitor or a motor, a back sheet of a solar cell, a barrier film of an inorganic oxide, or a base film of a transparent conductive film such as ITO.

Claims (3)

一種雙軸延伸聚酯薄膜,其特徵為其係由藉由DSC所得之於以40℃/分鐘之速度自熔融狀態起冷卻時所觀察的再結晶化溫度(Tc(A))為140℃~175℃,以20℃/分鐘之速度的再結晶化溫度(Tc(B))為130℃~165℃,Tc(A)與Tc(B)之差(Tc(A)-Tc(B))為0~15℃的聚酯樹脂所構成,聚酯樹脂為以對苯二甲酸(TPA)與乙二醇(EG)作為主要成分而得之聚酯(A),對苯二甲酸的含有率為60質量%以上,具有3~50μm之厚度,且滿足下述要件(1)~(4)的薄膜物性;(1)MD方向的熱收縮率為0.5~10%;(2)突刺強度為5~20N;(3)關於易黏著處理面側,藉由ATR-IR所求得之表面結晶化度為1.10~1.35;(4)自薄膜的易黏著處理面的表面結晶化度減去薄膜的非處理面的表面結晶化度後的值係在-0.1~0之範圍。 A biaxially stretched polyester film characterized in that the recrystallization temperature (Tc(A)) observed by DSC from a molten state at a rate of 40 ° C/min is 140 ° C. Recrystallization temperature (Tc(B)) at 175 ° C at a rate of 20 ° C / min is 130 ° C ~ 165 ° C, the difference between Tc (A) and Tc (B) (Tc (A) - Tc (B)) It is composed of a polyester resin of 0 to 15 ° C. The polyester resin is a polyester (A) obtained by using terephthalic acid (TPA) and ethylene glycol (EG) as main components, and the content of terephthalic acid. It is 60% by mass or more, has a thickness of 3 to 50 μm, and satisfies the physical properties of the film of the following requirements (1) to (4); (1) the thermal shrinkage in the MD direction is 0.5 to 10%; and (2) the spur strength is 5~20N; (3) on the surface of the easy-adhesive treatment surface, the surface crystallization degree obtained by ATR-IR is 1.10~1.35; (4) the film is subtracted from the surface crystallization degree of the easy adhesion treatment surface of the film. The value of the surface crystallization degree of the non-treated surface is in the range of -0.1 to 0. 如申請專利範圍第1項之雙軸延伸聚酯薄膜,其中聚酯樹脂具有間苯二甲酸成分。 The biaxially stretched polyester film of claim 1, wherein the polyester resin has an isophthalic acid component. 如申請專利範圍第1項之雙軸延伸聚酯薄膜,其中聚酯樹脂含有由來自植物的乙二醇成分所聚合之聚酯樹脂。 The biaxially stretched polyester film of claim 1, wherein the polyester resin contains a polyester resin polymerized from a glycol component derived from a plant.
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