TWI604561B - Substrate sucking device and operation method thereof - Google Patents

Description

Substrate adsorption device and operation method thereof

The present invention relates to a substrate adsorption device, and more particularly to a substrate adsorption device and an operation method thereof.

In the substrate processing process, it is often necessary to use a substrate adsorption device to transport the substrate so that the substrate reaches the desired location to perform the required process. In the process of transporting the substrate by the substrate adsorption device, the adsorption of the thinned substrate during the adsorption process from top to bottom is inevitably due to the thinning and softness characteristics, so that the bending phenomenon occurs due to the influence of the gravity. Therefore, the adsorption effect provided by the substrate adsorption device to the substrate affects the quality of the conveyance and the yield of the product to a considerable extent.

In addition, today's planar electronic devices, such as display devices, touch devices, and the like, are required to be thin and light, so that the tendency of the substrate used in the electronic device to be thinned is becoming more and more significant. However, when the conventional substrate adsorption device adsorbs these thinned substrates, since the adsorption process cannot provide sufficient adsorption effect due to the irregular bending amount of the thinned substrate, the thinned substrate is partially broken due to its irregular wave curvature. The area cannot be attached, and even some areas will not be absorbed. Therefore, in the process of adsorption, it is easy to cause damage such as fragmentation, falling off, scrapping, etc., thereby affecting the subsequent process and the yield of the product.

Therefore, how to provide a substrate adsorption device can be applied to a thin substrate and provide an appropriate adsorption effect to cope with the amount of bending of the thinned substrate, thereby improving the yield of the product, and is one of the current important issues.

In view of the above problems, an object of the present invention is to provide a substrate adsorption device which has an innovative structural design, which enables high efficiency to be applied to a thinned substrate and provides appropriate The adsorption effect can further improve the product yield.

In addition, in view of the trend of thinning the substrate, the present invention also provides a more suitable method for applying to the substrate adsorption device, so that the substrate adsorption device can exert a better adsorption effect.

To achieve the above object, a substrate adsorption apparatus of the present invention comprises at least one carrier and at least one adsorption element, and the carrier comprises at least one adsorption hole. The adsorption component is disposed on the adsorption hole, and has a connecting portion and a telescopic portion. The connecting portion is connected between the carrier and the telescopic portion, and the connecting portion and the telescopic portion define a communication hole communicating with the adsorption hole. The deformation amount of the expansion and contraction portion is 30% to 50%.

In an embodiment, the deformation amount of the expansion and contraction portion is further 35% to 50%.

In an embodiment, the deformation amount of the expansion and contraction portion is further 42% to 48%.

In one embodiment, the adsorbing elements on the same carrier are spaced apart and arranged in a two-dimensional array or staggered.

In one embodiment, a gas line within the carrier is coupled to the adsorption element through the adsorption aperture.

In one embodiment, the material of the adsorption element comprises a silicone, latex, rubber or polyester compound.

In order to achieve the above object, a substrate adsorption apparatus according to the present invention is used in any of the substrate adsorption apparatuses described above, wherein adsorption timings of the adsorption elements are not synchronized.

In one embodiment, the carrier defines a first position and a second position, and the adsorption order of the adsorption elements is adsorbed from the first position to the second position.

In one embodiment, the first location is at a mid-segment location and the second location is external to the carrier.

In one embodiment, the first location is located outside of the carrier and the second location is located at a mid-segment location of the carrier.

As described above, in the substrate adsorption device of the present invention, the adsorption member on the carrier has a connecting portion and a telescopic portion, and the connecting portion is connected between the carrier and the telescopic portion, wherein the deformation of the telescopic portion is 30. %~50%. The present invention is designed to have an expansion and contraction portion by The structure, and the deformation variable thereof is 30% to 50%, and can provide a more suitable adsorption effect on the substrate. Since the shape variable is too large for the overall structural strength of the adsorption element, and the deformation is too small to improve the deformation of the thinned substrate, it is verified that the deformation is limited to 30% to 50% for better adsorption. The effect and structural strength, which in turn can increase product yield. Further, in the operation method of the substrate adsorption apparatus of the present invention, the adsorption actuation time of the adsorption element is not synchronized. The main reason is that the thinned substrate may have various irregular curvatures before adsorption. The conventional one-time adsorption method is insufficient for controlling the amount of deformation of the thinned substrate and the overall adsorption capacity, resulting in an abnormal ratio of thinned substrate during transport. Improve, and then there are major losses such as fragmentation, falling, scrapping and even causing downtime. Therefore, the present invention proposes a non-synchronized adsorption mode for progressively absorbing the thinned substrate, thereby reducing the excessive curvature of the thinned substrate during adsorption and increasing the overall horizontal sorption to increase the horizontality of the upper substrate. When the substrate is thinned, the accuracy of the assembly can be controlled and improved. The asynchronous progressive sorption of the present invention may be adsorbed from the outside toward the center or from the middle to the outside or may be used in combination, whereby the substrate adsorption device of the present invention can exert a better adsorption effect.

1‧‧‧Substrate adsorption device

11‧‧‧ Carrier

111‧‧‧Adsorption holes

112‧‧‧ gas pipeline

12‧‧‧Adsorption elements

121‧‧‧Connecting Department

122‧‧‧Flexing Department

123‧‧‧Connected holes

13‧‧‧Connector

Directions D1~D6, D11‧‧‧

H1, h2, h3‧‧‧ length

P1‧‧‧ first position

P2‧‧‧ second position

S‧‧‧Substrate

1 is a top plan view showing a substrate adsorption device applied to a substrate S according to an embodiment of the invention.

2 is a schematic partial view of a substrate adsorption device according to an embodiment of the invention.

3A and 3B are schematic views showing the adsorption element not being adsorbed and adsorbed according to an embodiment of the present invention.

4 is a schematic view showing the staggered arrangement of adsorption elements of a substrate adsorption device according to another embodiment of the present invention.

FIG. 5 is a schematic diagram of a method of operating a substrate adsorption apparatus according to an embodiment of the present invention.

Fig. 6 is a schematic view showing a possible direction of adsorption order of adsorption elements in a method of operating a substrate adsorption apparatus according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a substrate adsorption apparatus and an operation method thereof according to a preferred embodiment of the present invention will be described with reference to the accompanying drawings, wherein the same elements will be described with the same reference numerals.

1 is a substrate adsorbing device 1 applied to a substrate S according to an embodiment of the invention. A schematic view of a top view, FIG. 2 is a schematic view of a portion of the substrate adsorption device 1. In the present embodiment, the substrate S is, for example, a glass substrate, and is applied to, for example, a semiconductor process or other substrate processing process, and is not limited thereto.

Referring to FIG. 1 and FIG. 2, the substrate adsorption device 1 includes at least one carrier. 11 and at least one adsorption element 12. In the present embodiment, the substrate adsorbing device 1 is exemplified by a plurality of carriers 11, and the carrier 11 is elongated and disposed in one direction. Further, the carriers 11 are parallel to each other. In addition, the substrate adsorption device 1 of the present embodiment further includes a connecting body 13 that connects the carriers 11. Here, the connecting body 13 is connected to one end of the carriers 11. The carrier 11 includes at least one adsorption hole 111. The carrier 11 includes a plurality of adsorption holes 111 as an example, and the adsorption holes 111 of the same carrier 11 are arranged at intervals and arranged in a straight line. In other embodiments, the adsorption holes 111 on the same carrier 11 may also be arranged in a two-dimensional array or staggered (as shown in FIG. 4). Further, a gas line 112 is provided in the carrier 11 through the adsorption hole 111 to connect the adsorption element 12.

In this embodiment, the adsorption element 12 is correspondingly disposed on the adsorption hole 111. Therefore, the present embodiment has a plurality of adsorption elements 12, and the adsorption elements 12 on the same carrier 11 are exemplified by an interval arrangement and a linear arrangement. In other embodiments, the adsorbent elements 12 on the same carrier 11 may also be arranged in a two-dimensional array or in a staggered arrangement.

In this embodiment, the adsorption element 12 has a connecting portion 121 and a telescopic portion. 122. The connecting portion 121 is connected between the carrier 11 and the expansion and contraction portion 122, and the connecting portion 121 and the expansion and contraction portion 122 define a communication hole 123 communicating with the adsorption hole 111. In other words, when the gas line 112 is evacuated through the adsorption hole 111 and the communication hole 123, the adsorption member 12 on the carrier 11 can adsorb the substrate S.

3A and 3B show that the adsorption element 12 is not adsorbed according to an embodiment of the invention. A schematic diagram of the adsorption. Referring to FIG. 3B, when the adsorption element 12 performs adsorption, the deformation amount of the expansion-contraction portion 122 is 30% to 50%. For example, when the adsorption element 12 of the present embodiment is not adsorbed, the length h1 of the connecting portion 121 is 4 mm, and the length h2 of the elasticized portion 122 is 14 mm. When the adsorption is performed, the connecting portion 121 is The length can be regarded as constant, and the length h3 of the stretchable portion 122 becomes 8 mm, so the deformation amount of the stretchable portion 122 in this example is about 43% ((14-8)/14). In other embodiments, the deformation amount of the expansion and contraction portion 122 may further be 35% to 50%. In other embodiments, the deformation amount of the expansion and contraction portion 122 may further be 42% to 48%.

In this embodiment, the expansion and contraction portion 122 of the adsorption element 12 is a three-layer structure. For example, to improve its flexibility. In addition, the material of the adsorption element 12 may also include silicone to enhance its flexibility. Here, the expansion and contraction portion 122 of the adsorption element 12 is exemplified by silicone rubber. Of course, in other embodiments, the expansion and contraction portion 122 of the adsorption member 12 may have other flexible structures or be made of other elastic materials, such as latex, rubber or polyester compounds, and is not limited.

In addition, the method for operating the substrate adsorption device according to an embodiment of the present invention may be Any of the substrate adsorption devices described above is used. The adsorption actuation time of the adsorption elements is not synchronized. Next, the operation method of the substrate adsorption apparatus 1 of the present embodiment will be described with reference to FIG.

Referring to FIG. 5, a carrier 11 defines a first position P1 and a In the second position P2, the adsorption order of the adsorption elements 12 is adsorbed from the first position P1 to the second position P2. In the present embodiment, the first position P1 is located at the middle position of the carrier 11, and the second position P2 is located outside the carrier 11. In other words, in the operation method of the substrate adsorption apparatus of the present embodiment, the adsorption order of the adsorption element 12 is performed in accordance with the direction D1. In other embodiments, the first position may be located outside the carrier 11 and the second position P2 may be located at a mid-section of the carrier 11, that is, the adsorption order of the adsorption elements 12 may be performed according to the direction D11. It should be noted that the above is merely illustrative and is not intended to limit the present invention. Figure 6 shows the direction of other applicable adsorption sequences, including vertical outward direction D1, horizontal outward direction D2, diagonal outward direction D3, D4, spiral outward direction D5, and spiral direction. The direction D6 inside. In addition, the invention also encompasses aspects of the above-described directions inward or outward, as well as any combination of all of the above. The substrate adsorption device of the present invention can exert different adsorption effects by the adsorption actuation time of the adsorption element being asynchronous and the different directions of adsorption follow.

In a substrate adsorption device of the present invention, the adsorption element on the carrier has a connecting portion and a telescopic portion, and the connecting portion is connected between the carrier and the telescopic portion, wherein the deformation of the telescopic portion is 30. %~50%. The present invention can provide a more suitable adsorption effect on the substrate by designing the adsorption element to have a structure of a stretchable portion and defining a deformation amount of 30% to 50%. Since the shape variable is too large for the overall structural strength of the adsorption element, and the deformation amount is too small to improve the deformation of the thinned substrate, it is better to limit the deformation to 30% to 50% by verification. Adsorption effect and overall structural strength, which in turn can improve product yield. In addition, in In the method for operating the substrate adsorption device of the present invention, the adsorption actuation time of the adsorption element is not synchronized, for example, adsorption from the outside toward the center or from the center to the outside, thereby making the substrate adsorption device of the present invention better. Adsorption effect.

The above is intended to be illustrative only and not limiting. Any equivalent modifications or alterations to the spirit and scope of the invention are intended to be included in the scope of the appended claims.

11‧‧‧ Carrier

111‧‧‧Adsorption holes

112‧‧‧ gas pipeline

12‧‧‧Adsorption elements

121‧‧‧Connecting Department

122‧‧‧Flexing Department

123‧‧‧Connected holes

Claims (9)

A substrate adsorption device comprising: at least one carrier comprising at least one adsorption hole; and at least one adsorption element correspondingly disposed on the adsorption hole, and having a connecting portion and a telescopic portion, the connecting portion being connected to the carrier Between the expansion and contraction portion, the connection portion and the expansion and contraction portion define a communication hole communicating with the adsorption hole, wherein the deformation amount of the expansion and contraction portion is 30% to 50%; The adsorbing elements are spaced apart and arranged in a two-dimensional array or staggered. The substrate adsorption device according to claim 1, wherein the deformation amount of the expansion and contraction portion is further from 35% to 50%. The substrate adsorption device according to claim 2, wherein the deformation amount of the expansion and contraction portion is further 42% to 48%. The substrate adsorption device according to claim 1, wherein a gas line in the carrier is connected to the adsorption element through the adsorption hole. The substrate adsorption device according to claim 1, wherein the material of the adsorption element comprises a silicone rubber, a latex, a rubber or a polyester compound. A substrate adsorption apparatus according to any one of claims 1 to 5, wherein the adsorption actuation time of the adsorption elements is not synchronized. The method for operating a substrate adsorption device according to claim 6, wherein the carrier defines a first position and a second position, and the adsorption order of the adsorption elements is from the first position to the second position. Adsorption. The method of actuating a substrate adsorption device according to claim 7, wherein the first position is located at a middle position of the carrier, and the second position is located outside the carrier. The method of actuating a substrate adsorption apparatus according to claim 7, wherein the first position is located outside the carrier, and the second position is located at a position of the middle of the carrier.