TWI604561B - Substrate sucking device and operation method thereof - Google Patents
Substrate sucking device and operation method thereof Download PDFInfo
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Description
本發明係關於一種基板吸附裝置,特別關於一種基板吸附裝置及其作動方法。 The present invention relates to a substrate adsorption device, and more particularly to a substrate adsorption device and an operation method thereof.
基板加工製程中,常需要使用一基板吸附裝置來搬運基板,以使基板到達所需要之地點來進行所需製程。而在基板吸附裝置搬運基板的過程中,由於薄型化基板在由上往下的吸附過程吸附難免會因為薄型化與輕軟的特性,以致於受到地心引力的影響產生彎曲(bending)現象。因此,基板吸附裝置所提供給基板的吸附效果,相當程度地影響搬運的品質以及產品的良率。 In the substrate processing process, it is often necessary to use a substrate adsorption device to transport the substrate so that the substrate reaches the desired location to perform the required process. In the process of transporting the substrate by the substrate adsorption device, the adsorption of the thinned substrate during the adsorption process from top to bottom is inevitably due to the thinning and softness characteristics, so that the bending phenomenon occurs due to the influence of the gravity. Therefore, the adsorption effect provided by the substrate adsorption device to the substrate affects the quality of the conveyance and the yield of the product to a considerable extent.
此外,現今的平面電子裝置,例如顯示裝置、觸控裝置等等,都要求輕薄化,以致於電子裝置內所使用的基板薄形化趨勢日益顯著。而傳統的基板吸附裝置在吸附這些薄化的基板時,由於在吸附過程無法因應對薄化基板的不規則彎曲量來提供足夠的吸附效果,導致薄化基板因其不規則的波浪彎度以致部分區域無法貼合,甚至有部分區域會吸附不到。因此在吸附的過程容易造成破片、掉片、報廢等損壞,進而影響後續製程的進行以及產品的良率。 In addition, today's planar electronic devices, such as display devices, touch devices, and the like, are required to be thin and light, so that the tendency of the substrate used in the electronic device to be thinned is becoming more and more significant. However, when the conventional substrate adsorption device adsorbs these thinned substrates, since the adsorption process cannot provide sufficient adsorption effect due to the irregular bending amount of the thinned substrate, the thinned substrate is partially broken due to its irregular wave curvature. The area cannot be attached, and even some areas will not be absorbed. Therefore, in the process of adsorption, it is easy to cause damage such as fragmentation, falling off, scrapping, etc., thereby affecting the subsequent process and the yield of the product.
因此,如何提供一種基板吸附裝置,可以高效率的應用於薄化基板並提供適切的吸附效果以應對薄化基板的彎曲量,進而提升產品良率,實為當前重要課題之一。 Therefore, how to provide a substrate adsorption device can be applied to a thin substrate and provide an appropriate adsorption effect to cope with the amount of bending of the thinned substrate, thereby improving the yield of the product, and is one of the current important issues.
有鑒於上述課題,本發明之目的在於提供一種基板吸附裝置,其具有創新的結構設計,使其能高效率的應用於薄化基板並提供適切 的吸附效果,進而能提升產品良率。 In view of the above problems, an object of the present invention is to provide a substrate adsorption device which has an innovative structural design, which enables high efficiency to be applied to a thinned substrate and provides appropriate The adsorption effect can further improve the product yield.
此外,因應薄化基板的趨勢,本發明亦提供一種更適切的作動方法來應用於基板吸附裝置,使得基板吸附裝置能夠發揮更佳的吸附效果。 In addition, in view of the trend of thinning the substrate, the present invention also provides a more suitable method for applying to the substrate adsorption device, so that the substrate adsorption device can exert a better adsorption effect.
為達上述目的,本發明之一種基板吸附裝置包含至少一載體以及至少一吸附元件,載體係包含有至少一吸附孔。吸附元件對應設置於吸附孔上,並具有一連接部與一伸縮部,連接部係連接於載體與伸縮部間,且連接部與伸縮部係共同界定有與吸附孔相連通的一連通孔,其中,伸縮部的形變量為30%~50%。 To achieve the above object, a substrate adsorption apparatus of the present invention comprises at least one carrier and at least one adsorption element, and the carrier comprises at least one adsorption hole. The adsorption component is disposed on the adsorption hole, and has a connecting portion and a telescopic portion. The connecting portion is connected between the carrier and the telescopic portion, and the connecting portion and the telescopic portion define a communication hole communicating with the adsorption hole. The deformation amount of the expansion and contraction portion is 30% to 50%.
在一實施例中,伸縮部的形變量進一步為35%~50%。 In an embodiment, the deformation amount of the expansion and contraction portion is further 35% to 50%.
在一實施例中,伸縮部的形變量進一步為42%~48%。 In an embodiment, the deformation amount of the expansion and contraction portion is further 42% to 48%.
在一實施例中,於同一載體上的該些吸附元件係間隔排列,並呈二維陣列或交錯排列。 In one embodiment, the adsorbing elements on the same carrier are spaced apart and arranged in a two-dimensional array or staggered.
在一實施例中,載體內有一氣體管路通過吸附孔連接吸附元件。 In one embodiment, a gas line within the carrier is coupled to the adsorption element through the adsorption aperture.
在一實施例中,吸附元件之材質包含矽膠、乳膠、橡膠或聚酯化合物。 In one embodiment, the material of the adsorption element comprises a silicone, latex, rubber or polyester compound.
為達上述目的,本發明之一種基板吸附裝置之作動方法,其係使用於如上所述的任一基板吸附裝置,其中,該些吸附元件的吸附作動時間係不同步。 In order to achieve the above object, a substrate adsorption apparatus according to the present invention is used in any of the substrate adsorption apparatuses described above, wherein adsorption timings of the adsorption elements are not synchronized.
在一實施例中,載體上係界定有一第一位置及一第二位置,該些吸附元件的吸附順序係由第一位置往第二位置吸附。 In one embodiment, the carrier defines a first position and a second position, and the adsorption order of the adsorption elements is adsorbed from the first position to the second position.
在一實施例中,第一位置係位於載體中段位置處,第二位置係位於載體外側。 In one embodiment, the first location is at a mid-segment location and the second location is external to the carrier.
在一實施例中,第一位置係位於載體外側,第二位置係位於載體中段位置處。 In one embodiment, the first location is located outside of the carrier and the second location is located at a mid-segment location of the carrier.
承上所述,在本發明之一種基板吸附裝置中,載體上之吸附元件具有一連接部與一伸縮部,且連接部係連接於載體與伸縮部間,其中,伸縮部的形變量為30%~50%。本發明藉由將吸附元件設計成具有伸縮部之 結構,且限定其形變量為30%~50%,而能對基板提供更合適的吸附效果。由於形變量太大對於吸附元件的整體結構強度並不有利,而形變量太小又無法改善薄化基板形變狀況,因此經由驗證,將形變量限制在30%~50%可得到較佳的吸附效果及結構強度,進而能提升產品良率。此外,在本發明之一種基板吸附裝置之作動方法中,吸附元件的吸附作動時間係不同步。主要是由於薄化基板在吸附之前可能會有各種不規則的彎度,以往的一次性吸著方式對於控制薄化基板變形量與整體吸附能力不夠,導致薄化基板在傳送時吸著異常的比例提高,進而有破片、掉片、報廢甚至導致停機等重大損失。故本發明提出不同步的吸附方式,對薄化基板作漸進式吸著,進而讓薄化基板在吸附時降低其過大的彎度與提高整體水平吸著,以增加上基板水平性,對於在組立薄化基板時,其組立精度可以獲得一定控制及提升。本發明的不同步漸進式吸著可以是由外側朝中間吸附或由中間朝外側吸附或是可兩者混合使用,藉此可使本發明之基板吸附裝置發揮更佳的吸附效果。 As described above, in the substrate adsorption device of the present invention, the adsorption member on the carrier has a connecting portion and a telescopic portion, and the connecting portion is connected between the carrier and the telescopic portion, wherein the deformation of the telescopic portion is 30. %~50%. The present invention is designed to have an expansion and contraction portion by The structure, and the deformation variable thereof is 30% to 50%, and can provide a more suitable adsorption effect on the substrate. Since the shape variable is too large for the overall structural strength of the adsorption element, and the deformation is too small to improve the deformation of the thinned substrate, it is verified that the deformation is limited to 30% to 50% for better adsorption. The effect and structural strength, which in turn can increase product yield. Further, in the operation method of the substrate adsorption apparatus of the present invention, the adsorption actuation time of the adsorption element is not synchronized. The main reason is that the thinned substrate may have various irregular curvatures before adsorption. The conventional one-time adsorption method is insufficient for controlling the amount of deformation of the thinned substrate and the overall adsorption capacity, resulting in an abnormal ratio of thinned substrate during transport. Improve, and then there are major losses such as fragmentation, falling, scrapping and even causing downtime. Therefore, the present invention proposes a non-synchronized adsorption mode for progressively absorbing the thinned substrate, thereby reducing the excessive curvature of the thinned substrate during adsorption and increasing the overall horizontal sorption to increase the horizontality of the upper substrate. When the substrate is thinned, the accuracy of the assembly can be controlled and improved. The asynchronous progressive sorption of the present invention may be adsorbed from the outside toward the center or from the middle to the outside or may be used in combination, whereby the substrate adsorption device of the present invention can exert a better adsorption effect.
1‧‧‧基板吸附裝置 1‧‧‧Substrate adsorption device
11‧‧‧載體 11‧‧‧ Carrier
111‧‧‧吸附孔 111‧‧‧Adsorption holes
112‧‧‧氣體管路 112‧‧‧ gas pipeline
12‧‧‧吸附元件 12‧‧‧Adsorption elements
121‧‧‧連接部 121‧‧‧Connecting Department
122‧‧‧伸縮部 122‧‧‧Flexing Department
123‧‧‧連通孔 123‧‧‧Connected holes
13‧‧‧連接體 13‧‧‧Connector
D1~D6、D11‧‧‧方向 Directions D1~D6, D11‧‧‧
h1、h2、h3‧‧‧長度 H1, h2, h3‧‧‧ length
P1‧‧‧第一位置 P1‧‧‧ first position
P2‧‧‧第二位置 P2‧‧‧ second position
S‧‧‧基板 S‧‧‧Substrate
圖1為本發明一實施例之一基板吸附裝置應用於一基板S的俯視示意圖。 1 is a top plan view showing a substrate adsorption device applied to a substrate S according to an embodiment of the invention.
圖2為本發明一實施例之一基板吸附裝置之一部分示意圖。 2 is a schematic partial view of a substrate adsorption device according to an embodiment of the invention.
圖3A及圖3B為本發明一實施例之吸附元件未進行吸附與進行吸附的示意圖。 3A and 3B are schematic views showing the adsorption element not being adsorbed and adsorbed according to an embodiment of the present invention.
圖4為本發明另一實施例之一基板吸附裝置之吸附元件交錯排列的示意圖。 4 is a schematic view showing the staggered arrangement of adsorption elements of a substrate adsorption device according to another embodiment of the present invention.
圖5為本發明一實施例之基板吸附裝置之作動方法的示意圖。 FIG. 5 is a schematic diagram of a method of operating a substrate adsorption apparatus according to an embodiment of the present invention.
圖6為本發明一實施例之基板吸附裝置之作動方法中,吸附元件之吸附順序之可能方向的示意圖。 Fig. 6 is a schematic view showing a possible direction of adsorption order of adsorption elements in a method of operating a substrate adsorption apparatus according to an embodiment of the present invention.
以下將參照相關圖式,說明依本發明較佳實施例之一種基板吸附裝置及其作動方法,其中相同的元件將以相同的參照符號加以說明。 DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a substrate adsorption apparatus and an operation method thereof according to a preferred embodiment of the present invention will be described with reference to the accompanying drawings, wherein the same elements will be described with the same reference numerals.
圖1為本發明一實施例之一基板吸附裝置1應用於一基板S 的俯視示意圖,圖2為基板吸附裝置1之一部分示意圖。在本實施例中,基板S例如為一玻璃基板,並例如應用於半導體製程或其他基板加工製程,於此並不限制。 1 is a substrate adsorbing device 1 applied to a substrate S according to an embodiment of the invention. A schematic view of a top view, FIG. 2 is a schematic view of a portion of the substrate adsorption device 1. In the present embodiment, the substrate S is, for example, a glass substrate, and is applied to, for example, a semiconductor process or other substrate processing process, and is not limited thereto.
請參照圖1及圖2所示,基板吸附裝置1包含至少一載體 11以及至少一吸附元件12。在本實施例中,基板吸附裝置1係以包含複數載體11為例,並且載體11係為長條狀並且沿一方向設置,此外,載體11係互相平行。另外,本實施例之基板吸附裝置1更包含一連接體13,其係連接該些載體11。於此,連接體13係連接該些載體11之一端。載體11包含有至少一吸附孔111,於此係以載體11包含複數吸附孔111為例,並且同一載體11之吸附孔111係以間隔設置且直線排列為例。在其他實施例中,同一載體11上的吸附孔111亦可呈二維陣列或交錯排列(如圖4所示)。另外,載體11內設有一氣體管路112通過該吸附孔111而連接吸附元件12。 Referring to FIG. 1 and FIG. 2, the substrate adsorption device 1 includes at least one carrier. 11 and at least one adsorption element 12. In the present embodiment, the substrate adsorbing device 1 is exemplified by a plurality of carriers 11, and the carrier 11 is elongated and disposed in one direction. Further, the carriers 11 are parallel to each other. In addition, the substrate adsorption device 1 of the present embodiment further includes a connecting body 13 that connects the carriers 11. Here, the connecting body 13 is connected to one end of the carriers 11. The carrier 11 includes at least one adsorption hole 111. The carrier 11 includes a plurality of adsorption holes 111 as an example, and the adsorption holes 111 of the same carrier 11 are arranged at intervals and arranged in a straight line. In other embodiments, the adsorption holes 111 on the same carrier 11 may also be arranged in a two-dimensional array or staggered (as shown in FIG. 4). Further, a gas line 112 is provided in the carrier 11 through the adsorption hole 111 to connect the adsorption element 12.
在本實施例中,吸附元件12係對應設置於吸附孔111上, 因此,本實施例係具有複數吸附元件12,並且同一載體11上的吸附元件12係以間隔設置且直線排列為例。在其他實施例中,同一載體11上的吸附元件12亦可呈二維陣列或交錯排列。 In this embodiment, the adsorption element 12 is correspondingly disposed on the adsorption hole 111. Therefore, the present embodiment has a plurality of adsorption elements 12, and the adsorption elements 12 on the same carrier 11 are exemplified by an interval arrangement and a linear arrangement. In other embodiments, the adsorbent elements 12 on the same carrier 11 may also be arranged in a two-dimensional array or in a staggered arrangement.
在本實施例中,吸附元件12具有一連接部121與一伸縮部 122。連接部121係連接於載體11與伸縮部122間,且連接部121與伸縮部122係共同界定有與吸附孔111相連通的一連通孔123。換言之,當氣體管路112經由吸附孔111與連通孔123進行抽真空時,載體11上之吸附元件12可對基板S進行吸附。 In this embodiment, the adsorption element 12 has a connecting portion 121 and a telescopic portion. 122. The connecting portion 121 is connected between the carrier 11 and the expansion and contraction portion 122, and the connecting portion 121 and the expansion and contraction portion 122 define a communication hole 123 communicating with the adsorption hole 111. In other words, when the gas line 112 is evacuated through the adsorption hole 111 and the communication hole 123, the adsorption member 12 on the carrier 11 can adsorb the substrate S.
圖3A及圖3B為本發明一實施例之吸附元件12未進行吸附 與進行吸附的示意圖。請參照圖3B所示,在吸附元件12進行吸附時,伸縮部122的形變量為30%~50%。舉例而言,本實施例之吸附元件12未進行吸附時,其連接部121之一長度h1為4公釐,伸縮部122之一長度h2為14公釐,而進行吸附時,連接部121之長度可視為不變,而伸縮部122之長度h3變為8公釐,因此伸縮部122在此例子中的形變量約為43%((14-8)/14)。在其他實施例中,伸縮部122的形變量可進一步為35%~50%。 在其他實施例中,伸縮部122的形變量可進一步為42%~48%。 3A and 3B show that the adsorption element 12 is not adsorbed according to an embodiment of the invention. A schematic diagram of the adsorption. Referring to FIG. 3B, when the adsorption element 12 performs adsorption, the deformation amount of the expansion-contraction portion 122 is 30% to 50%. For example, when the adsorption element 12 of the present embodiment is not adsorbed, the length h1 of the connecting portion 121 is 4 mm, and the length h2 of the elasticized portion 122 is 14 mm. When the adsorption is performed, the connecting portion 121 is The length can be regarded as constant, and the length h3 of the stretchable portion 122 becomes 8 mm, so the deformation amount of the stretchable portion 122 in this example is about 43% ((14-8)/14). In other embodiments, the deformation amount of the expansion and contraction portion 122 may further be 35% to 50%. In other embodiments, the deformation amount of the expansion and contraction portion 122 may further be 42% to 48%.
在本實施例中,吸附元件12之伸縮部122係為三層結構為 例,進而提升其可撓性。此外,吸附元件12之材質亦可包含矽膠以提升其可撓性。於此係以吸附元件12之伸縮部122由矽膠構成為例。當然,在其他實施例中,吸附元件12之伸縮部122可具有其他可撓結構或由其他彈性材質製成,諸如:乳膠、橡膠或聚酯化合物等,並不限定。 In this embodiment, the expansion and contraction portion 122 of the adsorption element 12 is a three-layer structure. For example, to improve its flexibility. In addition, the material of the adsorption element 12 may also include silicone to enhance its flexibility. Here, the expansion and contraction portion 122 of the adsorption element 12 is exemplified by silicone rubber. Of course, in other embodiments, the expansion and contraction portion 122 of the adsorption member 12 may have other flexible structures or be made of other elastic materials, such as latex, rubber or polyester compounds, and is not limited.
另外,本發明一實施例之基板吸附裝置之作動方法,其係可 使用如上所述之任一基板吸附裝置。其中,該些吸附元件的吸附作動時間係不同步。以下以圖5來說明本實施例之基板吸附裝置1之作動方法。 In addition, the method for operating the substrate adsorption device according to an embodiment of the present invention may be Any of the substrate adsorption devices described above is used. The adsorption actuation time of the adsorption elements is not synchronized. Next, the operation method of the substrate adsorption apparatus 1 of the present embodiment will be described with reference to FIG.
請參照圖5所示,一載體11上係界定有一第一位置P1及一 第二位置P2,該些吸附元件12的吸附順序係由第一位置P1往第二位置P2吸附。在本實施例中,第一位置P1係位於載體11中段位置處,第二位置P2係位於載體11外側。換言之,在本實施例之基板吸附裝置之作動方法中,吸附元件12的吸附順序係依據方向D1實施。在其他實施例中,第一位置可位於載體11外側,第二位置P2可位於載體11中段位置處,亦即吸附元件12的吸附順序可依據方向D11實施。需注意者,上述僅為舉例說明,非用以限制本發明。圖6所示為其他可應用之吸附順序的方向,其中包含如垂直向外的方向D1、水平向外的方向D2、對角向外的方向D3、D4、螺旋向外的方向D5以及螺旋向內的方向D6。另外,本發明亦包含上述方向向內或向外的態樣,以及上述所有方向的任意組合。藉由吸附元件的吸附作動時間不同步以及吸附依循的不同方向,可使本發明之基板吸附裝置發揮不同的吸附效果。 Referring to FIG. 5, a carrier 11 defines a first position P1 and a In the second position P2, the adsorption order of the adsorption elements 12 is adsorbed from the first position P1 to the second position P2. In the present embodiment, the first position P1 is located at the middle position of the carrier 11, and the second position P2 is located outside the carrier 11. In other words, in the operation method of the substrate adsorption apparatus of the present embodiment, the adsorption order of the adsorption element 12 is performed in accordance with the direction D1. In other embodiments, the first position may be located outside the carrier 11 and the second position P2 may be located at a mid-section of the carrier 11, that is, the adsorption order of the adsorption elements 12 may be performed according to the direction D11. It should be noted that the above is merely illustrative and is not intended to limit the present invention. Figure 6 shows the direction of other applicable adsorption sequences, including vertical outward direction D1, horizontal outward direction D2, diagonal outward direction D3, D4, spiral outward direction D5, and spiral direction. The direction D6 inside. In addition, the invention also encompasses aspects of the above-described directions inward or outward, as well as any combination of all of the above. The substrate adsorption device of the present invention can exert different adsorption effects by the adsorption actuation time of the adsorption element being asynchronous and the different directions of adsorption follow.
綜上所述,在本發明之一種基板吸附裝置中,載體上之吸附元件具有一連接部與一伸縮部,且連接部係連接於載體與伸縮部間,其中,伸縮部的形變量為30%~50%。本發明藉由將吸附元件設計成具有伸縮部之結構,且限定其形變量為30%~50%,而能對基板提供更合適的吸附效果。由於形變量太大對於吸附元件的整體結構強度並不有利,而形變量太小又無法改善薄化基板形變的狀況,因此經由驗證,將形變量限制在30%~50%可得到較佳的吸附效果及整體結構強度,進而能提升產品良率。此外,在 本發明之一種基板吸附裝置之作動方法中,吸附元件的吸附作動時間係不同步,例如是由外側朝中間吸附或由中間朝外側吸附,藉此可使本發明之基板吸附裝置發揮更佳的吸附效果。 In a substrate adsorption device of the present invention, the adsorption element on the carrier has a connecting portion and a telescopic portion, and the connecting portion is connected between the carrier and the telescopic portion, wherein the deformation of the telescopic portion is 30. %~50%. The present invention can provide a more suitable adsorption effect on the substrate by designing the adsorption element to have a structure of a stretchable portion and defining a deformation amount of 30% to 50%. Since the shape variable is too large for the overall structural strength of the adsorption element, and the deformation amount is too small to improve the deformation of the thinned substrate, it is better to limit the deformation to 30% to 50% by verification. Adsorption effect and overall structural strength, which in turn can improve product yield. In addition, in In the method for operating the substrate adsorption device of the present invention, the adsorption actuation time of the adsorption element is not synchronized, for example, adsorption from the outside toward the center or from the center to the outside, thereby making the substrate adsorption device of the present invention better. Adsorption effect.
以上所述僅為舉例性,而非為限制性者。任何未脫離本發明之精神與範疇,而對其進行之等效修改或變更,均應包含於後附之申請專利範圍中。 The above is intended to be illustrative only and not limiting. Any equivalent modifications or alterations to the spirit and scope of the invention are intended to be included in the scope of the appended claims.
11‧‧‧載體 11‧‧‧ Carrier
111‧‧‧吸附孔 111‧‧‧Adsorption holes
112‧‧‧氣體管路 112‧‧‧ gas pipeline
12‧‧‧吸附元件 12‧‧‧Adsorption elements
121‧‧‧連接部 121‧‧‧Connecting Department
122‧‧‧伸縮部 122‧‧‧Flexing Department
123‧‧‧連通孔 123‧‧‧Connected holes
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