TWI602964B - Texture structure - Google Patents
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- TWI602964B TWI602964B TW104144378A TW104144378A TWI602964B TW I602964 B TWI602964 B TW I602964B TW 104144378 A TW104144378 A TW 104144378A TW 104144378 A TW104144378 A TW 104144378A TW I602964 B TWI602964 B TW I602964B
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Description
本發明是有關於一種織物結構，且特別是有關於一種具有導電線路層的織物結構。This invention relates to a fabric structure, and more particularly to a fabric structure having a conductive circuit layer.
隨著科技的進步以及人類對於健康與生活舒適度的愈加重視，使得智慧衣等相關穿戴式產品的發展愈加受到重視。使用者可藉由穿著智慧衣來達到心跳、呼吸以及體溫等生物訊號的感測及監控的目的。此外，智慧衣還可對使用者的身體提供例如是加熱或是致冷等特定功能。因此，使用者可無需額外攜帶或穿著其他的裝置來達成上述的功能或目的，從而提升使用者的使用方便性。With the advancement of technology and the increasing emphasis on health and lifestyle comfort, the development of smart wear and other related wearable products has received increasing attention. Users can wear smart clothes to achieve the sensing and monitoring of biological signals such as heartbeat, breathing and body temperature. In addition, the smart suit can also provide the user's body with specific functions such as heating or cooling. Therefore, the user can carry out the above functions or purposes without additional carrying or wearing other devices, thereby improving the user's usability.
在目前智慧衣技術的發展上，其中一個主要的發展方向是將導體線路直接印製於布料上。然而，由於一般布料本身對於熱的耐受性較低，當布料上的導體電路透過傳統錫焊的方式來與例如是電路板等電子元件焊接時，容易破壞布料本身的結構。此外，若是採用一般膠體黏著方式，則需要精準地控制膠量並對位，在製程上較為複雜，且無法於導體線路之間產生有效的電性連接。因此，如何以適當的接點技術電性連接印製於布料上的導體電路與電路板等外接電子元件，並且同時不破壞脆弱的布料結構，已成為目前智慧衣技術發展的一個重要課題。In the current development of smart clothing technology, one of the main development directions is to directly print the conductor lines on the fabric. However, since the cloth itself is generally less resistant to heat, when the conductor circuit on the cloth is soldered to an electronic component such as a circuit board by conventional soldering, the structure of the cloth itself is easily broken. In addition, if the general colloidal adhesion method is adopted, it is necessary to accurately control the amount of glue and the position, which is complicated in the process and cannot produce an effective electrical connection between the conductor lines. Therefore, how to electrically connect the conductor circuit printed on the cloth with the external electronic components such as the circuit board with appropriate contact technology, and at the same time does not damage the fragile fabric structure, has become an important issue in the development of the smart clothing technology.
本發明提供一種織物結構，其可藉由不影響或不傷害薄膜的布料結構的製程方式來整合並電性連接具有導電線路的薄膜及電子元件。The present invention provides a fabric structure that integrates and electrically connects films and electronic components having conductive traces by a process that does not affect or harm the fabric structure of the film.
本發明的織物結構適於電性連接電子元件，並且織物結構包括薄膜、第一圖案化線路層、電路板以及異方性導電膠層。第一圖案化線路層形成於薄膜上。電路板配置於第一圖案化線路層上，並且電子元件配置於電路板上。異方性導電膠層配置於薄膜與電路板之間，以膠黏固定電路板於薄膜上，並且電性連接電路板與第一圖案化線路層。The fabric structure of the present invention is suitable for electrically connecting electronic components, and the fabric structure comprises a film, a first patterned circuit layer, a circuit board, and an anisotropic conductive adhesive layer. A first patterned wiring layer is formed on the film. The circuit board is disposed on the first patterned circuit layer, and the electronic component is disposed on the circuit board. The anisotropic conductive adhesive layer is disposed between the film and the circuit board to adhesively fix the circuit board to the film, and electrically connects the circuit board and the first patterned circuit layer.
在本發明的一實施例中，上述的第一圖案化線路層是藉由網版印刷的方式形成於該薄膜上。In an embodiment of the invention, the first patterned circuit layer is formed on the film by screen printing.
在本發明的一實施例中，上述的織物結構更包括絕緣層。絕緣層覆蓋於部分的第一圖案化線路層上。In an embodiment of the invention, the fabric structure further includes an insulating layer. The insulating layer covers a portion of the first patterned wiring layer.
在本發明的一實施例中，上述的織物結構還包括防水層。防水層配置於電路板與薄膜貼合的表面周圍以及電子元件的表面上。In an embodiment of the invention, the fabric structure further includes a waterproof layer. The waterproof layer is disposed around the surface of the circuit board to which the film is bonded and on the surface of the electronic component.
在本發明的一實施例中，上述的薄膜為熱塑性薄膜，並且熱塑性薄膜的組成材料包括熱塑性聚酯(thermoplastic polyester elastomer)層、熱塑性聚氨酯(thermoplastic polyurethane)層、聚氨酯層或聚四氟乙烯(PTFE)層。In an embodiment of the invention, the film is a thermoplastic film, and the constituent material of the thermoplastic film comprises a thermoplastic polyester elastomer layer, a thermoplastic polyurethane layer, a polyurethane layer or a polytetrafluoroethylene (PTFE). )Floor.
在本發明的一實施例中，上述的電路板為軟性電路板(flexible printed circuit board)。In an embodiment of the invention, the circuit board is a flexible printed circuit board.
在本發明的一實施例中，上述的電子元件為訊號感測元件。In an embodiment of the invention, the electronic component is a signal sensing component.
在本發明的一實施例中，上述的織物結構更包括織物層。織物層配置於薄膜上相對第一圖案化線路層的一側。In an embodiment of the invention, the fabric structure further comprises a fabric layer. The fabric layer is disposed on one side of the film opposite the first patterned circuit layer.
在本發明的一實施例中，上述的織物層的組成材料包括聚酯纖維(polyester)、尼龍(nylon)、彈性纖維(elastane)或前述材料的組合。In an embodiment of the invention, the constituent material of the fabric layer comprises polyester, nylon, elastane or a combination of the foregoing.
在本發明的一實施例中，上述的織物結構還包括第二圖案化線路層。第二圖案化線路層配置於電路板面對第一圖案化線路層的一側，並且第二圖案化線路層經由異方性導電膠層與第一圖案化線路層電性連接。In an embodiment of the invention, the fabric structure further includes a second patterned circuit layer. The second patterned circuit layer is disposed on a side of the circuit board facing the first patterned circuit layer, and the second patterned circuit layer is electrically connected to the first patterned circuit layer via the anisotropic conductive adhesive layer.
基於上述，在本發明的實施例中，織物結構的電路板與薄膜之間可配置異方性導電膠層，使得電路板可透過異方性導電膠層貼合固定於薄膜上，並且電性連接形成於薄膜上的第一圖案化線路層。由於本發明的實施例中的織物結構是以異方性導電膠層來接合電路板及薄膜上的電路層與電子元件，因此，相較於一般的電路的接合製程而言，本發明的實施例中的織物結構可以較低的製程溫度來進行電路板與薄膜的線路層與電子元件之間的接合，並使得電路板在與薄膜貼合的過程中，薄膜本身的結構不會由於製程的高溫而受到影響或破壞。Based on the above, in the embodiment of the present invention, an anisotropic conductive adhesive layer may be disposed between the circuit board and the film of the fabric structure, so that the circuit board can be adhered to the film through the anisotropic conductive adhesive layer, and the electrical property is A first patterned wiring layer formed on the film is connected. Since the fabric structure in the embodiment of the present invention bonds the circuit layer and the electronic component on the circuit board and the film with an anisotropic conductive adhesive layer, the implementation of the present invention is compared with the bonding process of a general circuit. The fabric structure in the example can carry out the bonding between the circuit board and the circuit layer of the film and the electronic component at a lower process temperature, and the structure of the film itself is not due to the process of the process in the process of bonding the circuit board to the film. It is affected or destroyed by high temperatures.
為讓本發明的上述特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。The above described features and advantages of the invention will be apparent from the following description.
圖1是依照本發明的一實施例的織物結構的示意圖。請參考圖1。本實施例的織物結構100可用來連接電子元件50，並且織物結構100包括薄膜110、第一圖案化線路層120、電路板130以及異方性導電膠層140。第一圖案化線路層120以例如是網版印刷的方式形成於薄膜110上。電路板130配置於第一圖案化線路層120上，並且電子元件50配置於電路板130上。異方性導電膠層140配置薄膜110與電路板130之間，以膠黏固定電路板130於薄膜110上，並且電路板130可經由異方性導電膠層140與薄膜110上的第一圖案化線路層120電性連接。1 is a schematic illustration of a fabric structure in accordance with an embodiment of the present invention. Please refer to Figure 1. The fabric structure 100 of the present embodiment can be used to connect the electronic component 50, and the fabric structure 100 includes the film 110, the first patterned circuit layer 120, the circuit board 130, and the anisotropic conductive adhesive layer 140. The first patterned wiring layer 120 is formed on the thin film 110 in a manner such as screen printing. The circuit board 130 is disposed on the first patterned circuit layer 120, and the electronic component 50 is disposed on the circuit board 130. The anisotropic conductive adhesive layer 140 is disposed between the film 110 and the circuit board 130 to adhesively fix the circuit board 130 on the film 110, and the circuit board 130 can pass through the anisotropic conductive adhesive layer 140 and the first pattern on the film 110. The circuit layer 120 is electrically connected.
在本實施例中，薄膜110可具有開口112，以暴露出電子元件50於薄膜110的表面上，使得電子元件50可與人體接觸或是電性連接其他的外接電子元件。此外，電路板130上可另外配置第二圖案化線路層135，且第二圖案化線路層135配置於電路板130面對第一圖案化線路層120的一側。在本實施例中，第一圖案化線路層120及第二圖案化線路層135可經由異方性導電膠層140上下電性導通。In this embodiment, the film 110 may have an opening 112 to expose the electronic component 50 on the surface of the film 110 such that the electronic component 50 can be in contact with the human body or electrically connected to other external electronic components. In addition, a second patterned circuit layer 135 may be additionally disposed on the circuit board 130, and the second patterned circuit layer 135 is disposed on a side of the circuit board 130 facing the first patterned circuit layer 120. In this embodiment, the first patterned circuit layer 120 and the second patterned circuit layer 135 can be electrically connected to each other via the anisotropic conductive adhesive layer 140.
在本實施例中，薄膜110及其上的第一圖案化線路層120是藉由異方性導電膠層140來與電路板130及其上的第二圖案化線路層135彼此黏著固定。因此，本實施例的織物結構100可以較低的製程溫度，例如是攝氏150度至攝氏180度，來進行薄膜110與電路板130的貼合製程。也因此，相較於一般連接導體電路所使用的高溫焊接製程，本實施例的印有第一圖案化線路層120的薄膜110在與電路板130及其上的第二圖案化線路層135貼合的過程中不會由於製程溫度過高，而對薄膜110本身的結構產生影響或傷害。再者，異方性導電膠層140在黏著固定薄膜110及電路板130的同時，還可有效地電性連接第一圖案化線路層120與第二圖案化線路層135。In the present embodiment, the thin film 110 and the first patterned wiring layer 120 thereon are adhered to the circuit board 130 and the second patterned wiring layer 135 thereon by the anisotropic conductive adhesive layer 140. Therefore, the fabric structure 100 of the present embodiment can perform the bonding process of the film 110 and the circuit board 130 at a lower process temperature, for example, 150 degrees Celsius to 180 degrees Celsius. Therefore, the film 110 printed with the first patterned wiring layer 120 of the present embodiment is attached to the circuit board 130 and the second patterned wiring layer 135 thereon, compared to the high-temperature soldering process generally used for connecting the conductor circuits. During the process of bonding, the structure of the film 110 itself is not affected or damaged due to excessive process temperature. Moreover, the anisotropic conductive adhesive layer 140 can effectively electrically connect the first patterned circuit layer 120 and the second patterned circuit layer 135 while adhering the fixed film 110 and the circuit board 130.
在第一圖案化線路層120及第二圖案線路層135電性連接的過程中，異方性導電膠層140可先配置於薄膜110或是電路板130上，並且在電路板130與薄膜110進行對位程序之後，電路板130與薄膜110可以熱壓的方式相互貼合，使得第一圖案化線路層120與第二圖案化線路層135經由異方性導電膠層140產生電性連接。In the process of electrically connecting the first patterned circuit layer 120 and the second patterned circuit layer 135, the anisotropic conductive adhesive layer 140 may be disposed on the film 110 or the circuit board 130 first, and on the circuit board 130 and the film 110. After the alignment process is performed, the circuit board 130 and the film 110 are heat-pressed to each other such that the first patterned circuit layer 120 and the second patterned circuit layer 135 are electrically connected via the anisotropic conductive adhesive layer 140.
相較於一般的膠體，異方性導電膠層140在配置於薄膜110或電路板130的過程中，可無須對膠量進行控制，亦無須於膠體本身與基材之間進行精準的對位，同時異方性導電膠層140的配置過程可以較低溫的製程溫度進行，從而減低多層的異質材料層的接合過程的複雜性。因此，異方性導電膠層140特別適合使用於由不同材料組成的基材之間，例如是本實施例的薄膜110與電路板130之間的接合，以於薄膜110與電路板130之間提供良好的接著效果，並於導電線路層之間提供良好的電性連接效果。Compared with the general colloid, the anisotropic conductive adhesive layer 140 does not need to control the amount of glue in the process of being disposed on the film 110 or the circuit board 130, and does not need to accurately perform alignment between the colloid itself and the substrate. At the same time, the configuration process of the anisotropic conductive adhesive layer 140 can be performed at a relatively low process temperature, thereby reducing the complexity of the bonding process of the multilayered heterogeneous material layer. Therefore, the anisotropic conductive adhesive layer 140 is particularly suitable for use between substrates composed of different materials, such as the bonding between the film 110 and the circuit board 130 of the present embodiment, between the film 110 and the circuit board 130. Provides a good bonding effect and provides a good electrical connection between the conductive circuit layers.
異方性導電膠層140除了上述導電以及接著的功用之外，還可提供防濕以及絕緣的功能。因此，在本實施例中，異方性導電膠層140除用來接著固定薄膜110與電路板130，並且電性連接分別配置於薄膜110與電路板130上的第一及第二圖案化線路層120、135之外，異方性導電膠層140還可於薄膜110與電路板130之間提供良好的防濕及絕緣效果，以防止水氣進入薄膜110與電路板130之間，而對其表面的電路結構產生破壞，並且避免漏電流的情形發生。The anisotropic conductive adhesive layer 140 provides a function of moisture prevention and insulation in addition to the above-described electrical conduction and subsequent functions. Therefore, in the embodiment, the anisotropic conductive adhesive layer 140 is used to fix the film 110 and the circuit board 130, and is electrically connected to the first and second patterned lines respectively disposed on the film 110 and the circuit board 130. In addition to the layers 120, 135, the anisotropic conductive adhesive layer 140 can also provide a good moisture and insulation between the film 110 and the circuit board 130 to prevent moisture from entering between the film 110 and the circuit board 130. The circuit structure on the surface is broken and leakage current is avoided.
值得一提的是，異方性導電膠層140本身包含導電粒子與樹脂(未繪示)，其中導電粒子可在垂直的方向上電性導通上下配置的基板，而在水平方向上，也就是織物結構100的橫向方向上，樹脂可提供良好的電性絕緣與防濕效果。因此，在本實施例中，異方性導電膠層140在電性連接上下配置的薄膜110及電路板130及其上的第一及第二圖案化線路層120、135的同時，不會在織物結構100的橫向方向上產生漏電流的情形。It is worth mentioning that the anisotropic conductive adhesive layer 140 itself comprises conductive particles and a resin (not shown), wherein the conductive particles can electrically conduct the upper and lower substrates in a vertical direction, and in the horizontal direction, that is, In the transverse direction of the fabric structure 100, the resin provides good electrical insulation and moisture protection. Therefore, in the embodiment, the anisotropic conductive adhesive layer 140 is electrically connected to the upper and lower films 110 and the circuit board 130 and the first and second patterned circuit layers 120 and 135 thereon. A leakage current is generated in the lateral direction of the fabric structure 100.
在本實施例中，薄膜110例如是熱塑性薄膜，並且熱塑性薄膜的組成材料包括熱塑性聚酯層、熱塑性聚氨酯層、聚氨酯層或聚四氟乙烯層。此外，上述的薄膜110的組成材料還可提供防水與透濕的功能，而使薄膜110適宜作為可防水、透濕、透氣、絕緣、防風以及保暖的防風透濕布料。網印於薄膜110上的第一圖案化線路層120的材料例如是銅膠或銀膠等金屬膠材。此外，第二圖案化線路層135可以噴墨法、網版印刷法、黃光顯影法或是其他適當的製程方法形成於電路板130上，本實施例對於第二圖案化線路層135的形成方法並不加以限制。再者，本實施例的電路板130為軟性電路板，其組成的材料例如包括聚亞醯胺（Polyimide；簡稱PI）層，以使薄膜110與電路板130皆具有可撓性，而使得織物結構100可應用種各種織品服裝上，並且適於人體穿著。In the present embodiment, the film 110 is, for example, a thermoplastic film, and the constituent material of the thermoplastic film includes a thermoplastic polyester layer, a thermoplastic polyurethane layer, a polyurethane layer or a polytetrafluoroethylene layer. In addition, the constituent materials of the film 110 described above can also provide waterproof and moisture permeable functions, and the film 110 can be suitably used as a waterproof and moisture permeable fabric that is waterproof, moisture permeable, breathable, insulating, windproof, and warm. The material of the first patterned wiring layer 120, which is printed on the film 110, is, for example, a metal glue such as copper glue or silver paste. In addition, the second patterned circuit layer 135 may be formed on the circuit board 130 by an inkjet method, a screen printing method, a yellow light developing method, or other suitable processing method. The second patterned circuit layer 135 is formed in this embodiment. The method is not limited. Furthermore, the circuit board 130 of the present embodiment is a flexible circuit board, and the material thereof comprises, for example, a polyimide (PI) layer, so that the film 110 and the circuit board 130 have flexibility, and the fabric is made. The structure 100 can be applied to a variety of fabric garments and is suitable for human body wear.
如圖1所示，在本實施例中，部份未配置異方性導電膠層140的第一圖案化線路層120的表面可覆蓋絕緣層150來提供絕緣，並同時對於第一圖案化線路層120提供保護。在本實施例中，絕緣層150可為有機絕緣層150，其組成的材料例如是聚亞醯胺或感光性樹脂組合物(photosensitive resin composition)等。此外，絕緣層160可根據織物結構100的應用需求，而配置並覆蓋於織物結構100上的其他適當位置。As shown in FIG. 1, in the embodiment, a portion of the surface of the first patterned wiring layer 120, which is not provided with the anisotropic conductive adhesive layer 140, may cover the insulating layer 150 to provide insulation, and at the same time, for the first patterned circuit. Layer 120 provides protection. In the present embodiment, the insulating layer 150 may be an organic insulating layer 150 composed of, for example, a polyimide or a photosensitive resin composition or the like. In addition, the insulating layer 160 can be disposed and covered in other suitable locations on the fabric structure 100 depending on the application requirements of the fabric structure 100.
電路板130與薄膜110貼合的表面周圍以及電子元件50的表面上可環繞配置防水層160，且防水層160例如是以聚亞醯氨(polyimide)材料層形成。防水層160可防止水氣進入電路板130與薄膜110之間的間隙或是滲入電子元件50中，而影響或破壞薄膜110上的第一圖案化線路層120及電路板130上的第二圖案化線路層135與電子元件50之間的電性連接，同時確保電子元件50的功能的正常運作。此外，本實施例的防水層160也可同時作為電路板130與薄膜110之間的黏著固定層，以進一步加強電路板130與薄膜110之間的黏著固定效果。The waterproof layer 160 may be disposed around the surface of the circuit board 130 that is bonded to the film 110 and the surface of the electronic component 50, and the waterproof layer 160 is formed, for example, of a polyimide material layer. The waterproof layer 160 prevents moisture from entering the gap between the circuit board 130 and the film 110 or penetrating into the electronic component 50, thereby affecting or destroying the first patterned circuit layer 120 on the film 110 and the second pattern on the circuit board 130. The electrical connection between the circuit layer 135 and the electronic component 50 ensures the proper functioning of the function of the electronic component 50. In addition, the waterproof layer 160 of the present embodiment can also serve as an adhesive fixing layer between the circuit board 130 and the film 110 to further strengthen the adhesion between the circuit board 130 and the film 110.
在另一個未繪示的實施例中，防水層160也可配置並覆蓋於所有的織物結構100的表面，以增加織物結構100的表面防水氣的效果。在本發明中，防水層160的配置位置可根據織物結構100的實際應用需求來做適當的調整。In another embodiment, not shown, the waterproof layer 160 can also be configured and overlaid on the surface of all of the fabric structures 100 to increase the effect of the surface of the fabric structure 100. In the present invention, the arrangement position of the waterproof layer 160 can be appropriately adjusted according to the actual application requirements of the fabric structure 100.
本實施例的電子元件50例如是生物訊號感測元件。電子元件50經由開口112暴露於薄膜110的表面上，並且電子元件50可藉由與人體直接或間接的電性接觸來量測人體的心跳、血壓、體溫、呼吸或是身體姿態等各種生理訊號。此外，電子元件50本身可具有或可外接無線訊號傳輸元件(未繪示)，以將所量測的生理訊號傳輸至手機、平板等行動電子裝置或是遠端伺服器，使得人體的生體訊號可被即時的監控。The electronic component 50 of this embodiment is, for example, a biosignal sensing component. The electronic component 50 is exposed on the surface of the film 110 through the opening 112, and the electronic component 50 can measure various physiological signals such as the heartbeat, blood pressure, body temperature, breathing or body posture of the human body by direct or indirect electrical contact with the human body. . In addition, the electronic component 50 itself may have or be externally connected to a wireless signal transmission component (not shown) for transmitting the measured physiological signal to a mobile electronic device such as a mobile phone or a tablet or a remote server, so that the human body is Signals can be monitored on the fly.
在另一個未繪示的實施例中，電子元件50也可為全球定位系統(global positioning system；簡稱GPS)元件或是環境感測元件。同時，電子元件50的開口112可相對於人體朝向外界環境，以將電子元件50暴露於外界環境中，用以偵測並顯示地圖方位、環境溫溼度以及空氣品質等資訊。In another embodiment not shown, the electronic component 50 can also be a global positioning system (GPS) component or an environmental sensing component. At the same time, the opening 112 of the electronic component 50 can face the external environment with respect to the human body to expose the electronic component 50 to the external environment for detecting and displaying information such as map orientation, ambient temperature and humidity, and air quality.
圖2是依照本發明的另一實施例的織物結構的示意圖。請參考圖2，本實施例的織物結構200與圖1的織物結構100具有相似的結構，因此相同或相似構件以相同或相似的符號表示，並且不再重複說明。在本實施例中，織物結構200與上述織物結構100的不同之處在於，織物結構200另具有第一織物層212與第二織物層214，第一織物層212配置於薄膜110上相對於第一圖案化線路層120的一側，而第二織物層214則是配置於電路板130上相對於電子元件50以及第二圖案化線路層135的一側。在本實施例中，織物結構200可根據實際的應用需求同時配置第一織物層212及第二織物層214，或是僅配置第一織物層212或第二織物層214。2 is a schematic illustration of a fabric structure in accordance with another embodiment of the present invention. Referring to FIG. 2, the fabric structure 200 of the present embodiment has a similar structure to the fabric structure 100 of FIG. 1, and therefore the same or similar components are denoted by the same or similar symbols, and the description thereof will not be repeated. In the present embodiment, the fabric structure 200 is different from the fabric structure 100 described above in that the fabric structure 200 further has a first fabric layer 212 and a second fabric layer 214. The first fabric layer 212 is disposed on the film 110 relative to the first One side of the circuit layer 120 is patterned, and the second fabric layer 214 is disposed on the side of the circuit board 130 with respect to the electronic component 50 and the second patterned wiring layer 135. In the present embodiment, the fabric structure 200 can simultaneously configure the first fabric layer 212 and the second fabric layer 214 according to actual application requirements, or only the first fabric layer 212 or the second fabric layer 214.
在本實施例中，薄膜110可以熱壓的方式結合於第一織物層212上，而電路板130亦可以熱壓的方式與第二織物層214結合，而將薄膜110及電路板130整合於第一織物層212與第二織物層214之間。在本實施例中，第一織物層212與第二織物層214的材料例如是聚酯纖維、尼龍、彈性纖維或是前述材料的組合。織物結構200藉由第一織物層212與第二織物層214的配置可增加包含織物結構200的服裝的穿著舒適性，同時藉由多層織物層的配置來增進服裝的保暖效果。此外，在本實施例中，上述第一織物層212及第二織物層214的材質皆適合用來接觸人體。因此，織物結構200可應用於各種具有雙面穿著設計的服裝上。In this embodiment, the film 110 can be bonded to the first fabric layer 212 by heat pressing, and the circuit board 130 can also be combined with the second fabric layer 214 by heat pressing, and the film 110 and the circuit board 130 can be integrated. Between the first fabric layer 212 and the second fabric layer 214. In the present embodiment, the material of the first fabric layer 212 and the second fabric layer 214 is, for example, polyester fiber, nylon, elastic fiber or a combination of the foregoing materials. The fabric structure 200 can increase the wearing comfort of the garment comprising the fabric structure 200 by the configuration of the first fabric layer 212 and the second fabric layer 214, while enhancing the warmth of the garment by the configuration of the plurality of fabric layers. In addition, in the embodiment, the materials of the first fabric layer 212 and the second fabric layer 214 are all suitable for contacting the human body. Therefore, the fabric structure 200 can be applied to a variety of garments having a double-faced design.
此外，上述的第一織物層212及第二織物層214的材質還可具有防水的功能，而避免外界的水氣，例如是環境中的溼氣或是穿戴者的汗水等，進入包覆於第一織物層212與第二織物層214之間的薄膜110、電路板130以及其上的第一、第二圖案化線路層120、135及電子元件50，而使得織物結構200適合應用於各種機能性服裝上。In addition, the materials of the first fabric layer 212 and the second fabric layer 214 may also have a waterproof function, and avoid external moisture, such as moisture in the environment or sweat of the wearer, etc. The film 110 between the first fabric layer 212 and the second fabric layer 214, the circuit board 130, and the first and second patterned circuit layers 120, 135 and the electronic component 50 thereon, so that the fabric structure 200 is suitable for various applications Functional clothing.
綜上所述，本發明上述多個實施例中的織物結構具有薄膜以及電路板，且電路板與薄膜之間可配置異方性導電膠層，以將電路板膠黏固定於薄膜上，並且電性連接網印於薄膜上的第一圖案化線路層與電路板上的第二圖案化線路層及電子元件。因此，本發明的實施例以異方性導電膠層來貼合電路板與薄膜，可使得薄膜及電路板上配置的電路結構以及電子元件可以相對較低的製程溫度進行電性接合，而避免由於製程溫度過高而破壞或傷害薄膜本身的結構。此外，織物結構上可配置絕緣層及防水層來對織物結構的表面以及內部提供絕緣及防水的效果。再者，配置於電路板上的電子元件可為生物感測元件，並且織物結構本身可與織物層整合，以應用於各種機能性的服裝穿著上，使得穿戴者在穿著服裝的同時，織物結構可對於穿戴者進行各種生理訊號的量測與監控，並且提供穿戴著良好的穿著舒適性。In summary, the fabric structure in the above various embodiments of the present invention has a film and a circuit board, and an anisotropic conductive adhesive layer may be disposed between the circuit board and the film to adhere the circuit board to the film, and The first patterned circuit layer printed on the film and the second patterned circuit layer and the electronic component on the circuit board are electrically connected. Therefore, the embodiment of the present invention laminates the circuit board and the film with the anisotropic conductive adhesive layer, so that the circuit structure and the electronic components disposed on the film and the circuit board can be electrically joined at a relatively low process temperature, thereby avoiding The structure of the film itself is destroyed or damaged due to excessive process temperature. In addition, the fabric structure can be provided with an insulating layer and a waterproof layer to provide insulation and waterproof effects on the surface and interior of the fabric structure. Furthermore, the electronic component disposed on the circuit board can be a bio-sensing component, and the fabric structure itself can be integrated with the fabric layer to be applied to various functional garments, so that the wearer wears the garment while the fabric structure The measurement and monitoring of various physiological signals can be performed for the wearer and the wearing comfort is provided.
雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明的精神和範圍內，當可作些許的更動與潤飾，故本發明的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.
50‧‧‧電子元件
100、200‧‧‧織物結構
110‧‧‧薄膜
112‧‧‧開口
120‧‧‧第一圖案化線路層
130‧‧‧電路板
135‧‧‧第二圖案化線路層
140‧‧‧異方性導電膠層
150‧‧‧絕緣層
160‧‧‧防水層
212‧‧‧第一織物層
214‧‧‧第二織物層50‧‧‧Electronic components
100,200‧‧‧ fabric structure
110‧‧‧film
112‧‧‧ openings
120‧‧‧First patterned circuit layer
130‧‧‧ boards
135‧‧‧Second patterned circuit layer
140‧‧‧ anisotropic conductive adhesive layer
150‧‧‧Insulation
160‧‧‧Waterproof layer
212‧‧‧First fabric layer
214‧‧‧Second fabric layer
圖1是依照本發明的一實施例的織物結構的示意圖。 圖2是依照本發明的另一實施例的織物結構的示意圖。1 is a schematic illustration of a fabric structure in accordance with an embodiment of the present invention. 2 is a schematic illustration of a fabric structure in accordance with another embodiment of the present invention.
50‧‧‧電子元件 50‧‧‧Electronic components
100‧‧‧織物結構 100‧‧‧ fabric structure
110‧‧‧薄膜 110‧‧‧film
112‧‧‧開口 112‧‧‧ openings
120‧‧‧第一圖案化線路層 120‧‧‧First patterned circuit layer
130‧‧‧電路板 130‧‧‧ boards
135‧‧‧第二圖案化線路層 135‧‧‧Second patterned circuit layer
140‧‧‧異方性導電膠層 140‧‧‧ anisotropic conductive adhesive layer
150‧‧‧絕緣層 150‧‧‧Insulation
160‧‧‧防水層 160‧‧‧Waterproof layer
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104144378A TWI602964B (en) | 2015-12-30 | 2015-12-30 | Texture structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104144378A TWI602964B (en) | 2015-12-30 | 2015-12-30 | Texture structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201723250A TW201723250A (en) | 2017-07-01 |
| TWI602964B true TWI602964B (en) | 2017-10-21 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104144378A TWI602964B (en) | 2015-12-30 | 2015-12-30 | Texture structure |
Country Status (1)
| Country | Link |
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| TW (1) | TWI602964B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI629760B (en) | 2017-08-25 | 2018-07-11 | 國立臺北科技大學 | Fabric having multiple layered circuit thereon integrating with electronic devices |
| CN111254711A (en) * | 2018-12-03 | 2020-06-09 | 东华镜月（苏州）纺织技术研究有限公司 | Waterproof sensing fabric |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1322837C (en) * | 2002-05-10 | 2007-06-27 | 沙诺夫股份有限公司 | Woven electronic textile, yarn and article |
| JP2009266197A (en) * | 2008-04-22 | 2009-11-12 | Korea Advanced Inst Of Sci Technol | Textile input device |
| WO2009145536A2 (en) * | 2008-05-28 | 2009-12-03 | 실버레이 주식회사 | Electrically conductive pad and a production method thereof |
| US7829480B2 (en) * | 2008-01-24 | 2010-11-09 | Inventec Corporation | PCB supporting woven fabric and a PCB having the same |
| TWM456044U (en) * | 2013-01-23 | 2013-06-21 | Flexium Interconnect Inc | Flexible printed circuit board for electronic device stable arrangement |
-
2015
- 2015-12-30 TW TW104144378A patent/TWI602964B/en not_active IP Right Cessation
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1322837C (en) * | 2002-05-10 | 2007-06-27 | 沙诺夫股份有限公司 | Woven electronic textile, yarn and article |
| US7829480B2 (en) * | 2008-01-24 | 2010-11-09 | Inventec Corporation | PCB supporting woven fabric and a PCB having the same |
| JP2009266197A (en) * | 2008-04-22 | 2009-11-12 | Korea Advanced Inst Of Sci Technol | Textile input device |
| WO2009145536A2 (en) * | 2008-05-28 | 2009-12-03 | 실버레이 주식회사 | Electrically conductive pad and a production method thereof |
| TWM456044U (en) * | 2013-01-23 | 2013-06-21 | Flexium Interconnect Inc | Flexible printed circuit board for electronic device stable arrangement |
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