TWI601228B - The method and the device for applying the adhesive film of a larger size substrate - Google Patents
The method and the device for applying the adhesive film of a larger size substrate Download PDFInfo
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- TWI601228B TWI601228B TW104125098A TW104125098A TWI601228B TW I601228 B TWI601228 B TW I601228B TW 104125098 A TW104125098 A TW 104125098A TW 104125098 A TW104125098 A TW 104125098A TW I601228 B TWI601228 B TW I601228B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Description
本發明涉及在基板上覆膜的技術,特別有關一種適用較大尺寸基板的膠膜貼覆方法及其裝置。 The present invention relates to a technique for coating a film on a substrate, and more particularly to a film coating method and apparatus for a large-sized substrate.
一般所謂的基板,可以是指製作太陽能面板過程中所用到的太陽能基板,或是製作觸控面板過程中所用到的觸控基板等。 Generally, the substrate may refer to a solar substrate used in the process of fabricating a solar panel, or a touch substrate used in the process of manufacturing a touch panel.
周知,在生產觸控面板或太陽能面板的製程中,必須於基板的表面披覆上至少一層的膠膜,該膠膜可以是指乙烯醋酸乙烯共聚物(Ethylene Vinyl Acetate,EVA),用以產生保護、絕緣、遮蔽或阻隔光線等效果。例如,以太陽能面板為例,即常見在其基板的雙端或其背端表面貼覆一層透明膠膜,用以提供光線穿透,使夾附於或貼覆於基板上的太陽能電池能夠吸收太陽熱能,並藉此保護基板,以提升太陽能面板的耐候性。 It is known that in the process of producing a touch panel or a solar panel, at least one layer of a film must be coated on the surface of the substrate, and the film may be an ethylene vinyl acetate copolymer (EVA) for producing Protect, insulate, block or block light. For example, in the case of a solar panel, a transparent film is usually applied to the double end or the back end surface of the substrate to provide light penetration, so that the solar cell attached to or attached to the substrate can be absorbed. Solar heat, and thereby protecting the substrate to enhance the weatherability of the solar panel.
目前,常見使用太陽能面板作為一般建築物的帷幕牆,由於帷幕牆的面域甚大,相對使得作為帷幕牆使用的太陽能面板的單位面積也愈來愈大,依所知,坊間已有需求至3800x2500mm面域尺寸的太陽能面板,專供帷幕牆使用。 At present, solar panels are commonly used as curtain walls for general buildings. Due to the large surface area of the curtain wall, the unit area of solar panels used as curtain walls is relatively larger. According to the knowledge, there is already demand for 3800x2500mm. A solar panel of the size of the area, designed for curtain walls.
由於所述膠膜的質料輕薄且柔軟,一般較小面域尺寸之觸控面板或太陽能面板的製程中所常見的拉料覆膜方式,因受面域較大的影響,易使膠膜中央呈現低陷下垂現象,乃至於造成披覆不平整、易生氣泡等瑕疵,因此無法據實的實施於上述較大面域尺寸的基板上。 Since the material of the film is light and soft, the film coating method commonly used in the process of a touch panel or a solar panel with a small area size is easy to make the center of the film due to the influence of a large area. The phenomenon of sagging and sagging is caused, and the coating is not flat, and bubbles are easily generated, so that it cannot be implemented on the substrate of the above large surface size.
此外,基板上有時所需披覆的膠膜為多層時,不 論該膠膜是接觸基板(例如玻璃基板)表面,亦或是與相同或不同材質的膠膜之間的相互接觸,上述傳統的拉料覆膜方式,也會形成披覆不平整、易生氣泡等瑕疵。 In addition, when the film on the substrate sometimes needs to be covered by a plurality of layers, The film is contacted with a substrate (for example, a glass substrate) or with a film of the same or different materials. The above-mentioned conventional film coating method also forms an uneven coating and is easy to produce. Bubbles are equal.
有鑑於此,本發明之目的,旨在改善傳統採用拉引膠膜直接覆膜於基板上的覆膜方式,於遭遇面域尺寸較大的基板時,容易造成披覆不平整及易生氣泡等瑕疵的問題,進而提供一種適用較大尺寸基板之膠膜貼覆方法,其技術手段包括:佈設一可捲收式的承載件,以平張方式鄰近的懸持於基板之一表面的上方,接著拉引膠膜平張地擺放於承載件上,隨後捲收該承載件而使承載件上的膠膜漸進的貼覆於基板表面。 In view of the above, the object of the present invention is to improve the conventional method of coating a film directly on a substrate by using a pull-on film, and when it encounters a substrate having a large surface area, it is easy to cause unevenness of the coating and easy to generate bubbles. The problem of enthalpy, and the like, further provides a film attaching method for a larger-sized substrate, the technical means comprising: arranging a retractable carrier, suspended in a flat manner adjacent to a surface of one of the substrates Then, the pull film is placed flat on the carrier, and then the carrier is wound to make the adhesive film on the carrier gradually adhere to the surface of the substrate.
在進一步實施中,本發明還包括:該承載件係以一蛇行彎摺路徑捲收。 In a further implementation, the invention further includes the carrier being wound in a meandering path.
該捲收承載件的方向與拉引膠膜的方向相反。 The direction of the take-up carrier is opposite to the direction in which the film is pulled.
上述方法可以透過一種裝置技術而獲得實現,為此,本發明之一具體實施例在於提供一種較大尺寸基板之膠膜貼覆裝置,其技術手段包括:一基台,承放基板定位,該基板具有一顯露於外的表面;一拉膜器,包含一滑動配置於基台上方的拉膜爪,該拉膜爪能於基板的表面上方往復水平移動;及一捲收器,包含兩滑動配置於基台雙端的導引帶,該導引帶之間銜接有一承載件,該導引帶能帶動承載件移動,而使該承載件鄰近的懸持於基板的表面上方並且位於拉膜爪的下方,該拉膜爪能拉引膠膜平張地擺放於承載件上,且該捲收器能逐漸地捲收承載件至基台之一側而離開基板表面,使該承載件上的膠膜漸進的貼覆於基板表面。 The above method can be realized by a device technology. To this end, an embodiment of the present invention provides a film attaching device for a large-sized substrate, and the technical means thereof comprises: a base, positioning the substrate, The substrate has an exposed surface; a film puller includes a pull film claw disposed above the base plate, the pull film claw can reciprocate horizontally above the surface of the substrate; and a retractor comprising two slides a guiding belt disposed at the double end of the base plate, the guiding belt is coupled with a carrier member, the guiding belt can drive the carrier to move, and the carrier is suspended adjacent to the surface of the substrate and located at the pulling claw Bottom, the pull-tab can pull the film on the carrier piece, and the retractor can gradually retract the carrier to one side of the base and away from the substrate surface, so that the carrier is on the carrier The film is gradually attached to the surface of the substrate.
在進一步實施中,本發明還包括:該基台一側設有一集網區,該捲收器還包含一捲 繞輪組,該捲繞輪組由多個上下錯位排列的滾輪組成,該導引帶繞設至捲繞輪組,用以捲收承載件至基台一側的集網區。其中該基台雙側分別設有集網區。 In a further implementation, the present invention further includes: a collecting area on one side of the base, the retractor further comprising a roll The winding wheel set is composed of a plurality of rollers arranged up and down, and the guiding belt is wound around the winding wheel set for winding the carrier to the collecting area on one side of the base. Wherein the two sides of the base are respectively provided with a network area.
該捲收器捲收承載件的方向與該拉膜爪拉引膠膜的方向相反。 The retractor retracts the carrier in a direction opposite to the direction in which the pull film pulls the film.
所述兩導引帶呈迴圈狀滑動配置於基台雙端。 The two guiding belts are arranged in a loop shape and are arranged at both ends of the base.
根據上述技術手段,本發明所能產生的技術效果在於:利用可捲收式承載件來作為膠膜貼膜前的承放基面,並且利用承載件可被捲收而漸近的離開基板上欲貼膜之表面的特性,使得擺放於承載件上的膠膜能逐漸且輕柔地貼覆於基板表面,據以提升較大尺寸基板所貼覆之膠膜的平整性,並且避免貼膜後生成氣泡。 According to the above technical means, the technical effect that can be produced by the present invention is that the retractable carrier is used as the receiving base surface before the film film, and the carrier can be wound up and asymptotically separated from the substrate. The surface characteristics enable the film placed on the carrier to be gradually and gently applied to the surface of the substrate, thereby improving the flatness of the film adhered by the larger-sized substrate and avoiding generation of bubbles after the film is applied.
以上所述之方法與裝置之技術手段及其產生效能的具體實施細節,請參照下列實施例及圖式加以說明。 The specific implementation details of the above-mentioned methods and devices and the specific implementation details thereof will be described with reference to the following embodiments and drawings.
10‧‧‧基台 10‧‧‧Abutment
11‧‧‧集網區 11‧‧‧Set network area
20‧‧‧基板 20‧‧‧Substrate
21‧‧‧表面 21‧‧‧ surface
30‧‧‧拉膜器 30‧‧‧ film puller
31‧‧‧拉膜爪 31‧‧‧ Pull film claw
40‧‧‧膠膜 40‧‧‧ film
50‧‧‧捲收器 50‧‧‧Retractor
51‧‧‧導引帶 51‧‧‧Guide belt
52‧‧‧承載件 52‧‧‧Carrier
52a‧‧‧桿體 52a‧‧‧ rod body
52b‧‧‧帶體 52b‧‧‧Band
53‧‧‧捲繞輪組 53‧‧‧Winding wheel set
61‧‧‧第一線性方向 61‧‧‧First linear direction
62‧‧‧第二線性方向 62‧‧‧Second linear direction
S1至S4‧‧‧實施例之步驟說明 Description of the steps of the S1 to S4‧‧‧ examples
圖1是本發明膠膜貼覆方法的步驟流程圖;圖2a至圖2e分別是圖1的動作示意圖;圖3是本發明膠膜貼覆裝置的配置示意圖;圖4是圖3中捲收器的立體示意圖;圖5a至圖5d分別是圖3的動作示意圖。 1 is a flow chart of the steps of the film sticking method of the present invention; FIG. 2a to FIG. 2e are respectively schematic views of the operation of FIG. 1; FIG. 3 is a schematic view of the configuration of the film sticking device of the present invention; FIG. 5a to FIG. 5d are schematic diagrams of the operation of FIG. 3, respectively.
本發明所提供的適用較大尺寸基板之膠膜貼覆方法,用於提升較大尺寸基板所貼覆之膠膜的平整性,在本發明中所謂較大尺寸基板是定義為基板的面域尺寸較大者,如3800x2500mm。 The film coating method for a larger-sized substrate provided by the present invention is used for improving the flatness of a film coated by a large-sized substrate. In the present invention, a larger-sized substrate is defined as a surface area of the substrate. Larger size, such as 3800x2500mm.
具體的說,請參閱圖1所示,說明本發明之方法,包括下列S1至S4步驟:步驟S1:佈設承載件。 Specifically, referring to FIG. 1, the method of the present invention is illustrated, including the following steps S1 to S4: Step S1: Deploying the carrier.
請參閱圖2a,說明該承載件52提供可平張及捲 收的兩種機能,使承載件52佈設於一基板20的上方。具體的說,該基板20具有一提供貼覆膠膜用的表面21,該承載件52是佈設於該表面21的上方。更進一步的說,該承載件52是以平行張開之方式而鄰近的懸持於基板20的表面21上方,且該承載件為可捲收形式,使該承載件52能以捲收方式離開基板20的表面21上方。 Please refer to FIG. 2a, illustrating that the carrier 52 provides a flattenable and rollable The two functions are received such that the carrier 52 is disposed above a substrate 20. Specifically, the substrate 20 has a surface 21 for providing an adhesive film, and the carrier 52 is disposed above the surface 21. Further, the carrier 52 is suspended above the surface 21 of the substrate 20 in a parallel manner, and the carrier is in a retractable form, so that the carrier 52 can be separated from the substrate 20 in a retractable manner. Above the surface 21.
步驟S2:拉引膠膜。 Step S2: Pull the film.
請合併參閱圖2b及2c,說明本發明可以透過一 拉膜爪31拉引膠膜40至承載件52上方,並使膠膜40平整張開地擺放於承載件52上,在實施上,該拉膜爪31拉引膠膜40沿一第一線性方向61至承載件52上方,該第一線性方向61是平行於該承載件52,使膠膜40能平整張開地擺放於承載件52上,並透過該承載件52作為膠膜40貼覆基板20前的承放基面。 Please refer to FIG. 2b and 2c together to illustrate that the present invention can pass through a The filming claw 31 pulls the film 40 over the carrier 52, and the film 40 is placed flat on the carrier 52. In practice, the filming claw 31 pulls the film 40 along a first The linear direction 61 is above the carrier 52. The first linear direction 61 is parallel to the carrier 52, so that the film 40 can be placed flat on the carrier 52 and passed through the carrier 52 as a glue. The film 40 is attached to the receiving base surface before the substrate 20.
步驟S3:捲收承載件。 Step S3: Rolling up the carrier.
請參閱圖2d,說明以捲收的方式使承載件52離 開基板20之表面21的上方,在實施上,該承載件52是沿一第二線性方向62離開基板20的表面21上方,該第二線性方向62與第一線性方向61之間相互平行但方向相反,用以避免承載件52離開基板20之表面21的上方時帶動膠膜40跟隨移動,且該承載件52係以一蛇行彎摺路徑進行捲收,能有效的減少用來捲收承載件52所需裝置的佔置空間。 Please refer to FIG. 2d, illustrating that the carrier 52 is separated by the winding method. Above the surface 21 of the open substrate 20, in practice, the carrier 52 is spaced above the surface 21 of the substrate 20 in a second linear direction 62, the second linear direction 62 being parallel to the first linear direction 61 However, in the opposite direction, when the carrier 52 is removed from the surface 21 of the substrate 20, the film 40 is driven to follow, and the carrier 52 is wound by a meandering bending path, which can effectively reduce the winding. The space occupied by the device required for the carrier 52.
步驟S4:膠膜貼覆基板。 Step S4: The film is attached to the substrate.
請參閱圖2e,說明透過上述承載件52逐漸地離 開基板20的表面21上方,使擺放於承載件52上的膠膜40因失去承載件52的支撐而下垂進而接觸到基板20,並藉由承載件52鄰近的懸持於基板20的上方,使膠膜40能漸近的接觸基板20,進而輕柔地貼覆於基板20的表面21。此外,當 膠膜40貼覆於基板20後,將凸出於基板20端邊的膠膜40加以切除,進而完成基板20貼覆膠膜40的作業。 Referring to FIG. 2e, the gradual separation from the carrier 52 is illustrated. Above the surface 21 of the substrate 20, the adhesive film 40 placed on the carrier 52 is suspended by the support of the carrier 52 to contact the substrate 20, and is suspended above the substrate 20 by the carrier 52. The film 40 can be brought into abutment with the substrate 20 and gently adhered to the surface 21 of the substrate 20. In addition, when After the adhesive film 40 is attached to the substrate 20, the adhesive film 40 protruding from the end of the substrate 20 is cut off, thereby completing the work of attaching the adhesive film 40 to the substrate 20.
另一方面,請合併參閱圖3及圖4,說明本發明 還提供一種適用較大尺寸基板之膠膜貼覆裝置,使上述適用較大尺寸基板之膠膜貼覆方法可以容易地被實施。該適用較大尺寸基板之膠膜貼覆裝置包括一基台10、一拉膜器30及一捲收器50。其中:該基台10為一承放平台,該基台10能用來承放及定位基板20,以便於對基板20進行加工,該基板20具有一承放於基台10時會顯露於外的表面21,上述的膠膜40是貼覆於該表面21上。進一步的說,該基台10可以是由滾輪或皮帶等建構而成,使該基板20能透過基台10的載運及定位,進而接受後續加工,例如貼膜。 On the other hand, please refer to FIG. 3 and FIG. 4 together to illustrate the present invention. There is also provided a film attaching device suitable for a substrate of a larger size, so that the above-described film attaching method for a larger-sized substrate can be easily carried out. The film coating device for a larger-sized substrate includes a base 10, a film puller 30, and a retractor 50. Wherein: the base 10 is a receiving platform, and the base 10 can be used for receiving and positioning the substrate 20 to facilitate processing of the substrate 20. The substrate 20 has a display when placed on the base 10 The surface 21, the above-mentioned film 40 is attached to the surface 21. Further, the base 10 may be constructed by a roller or a belt to enable the substrate 20 to be transported and positioned through the base 10 to receive subsequent processing, such as filming.
該拉膜器30在實施上是用來拉引膠膜40至基板 20的表面21上方,該拉膜器30包含有一拉膜爪31,該拉膜爪31是滑動配置於基台10的上方,該拉膜爪31能於基板20的表面21上方往復水平移動,進而拉引膠膜40至基板20的表面21上方,該拉膜爪31可以是電動夾爪或氣動夾爪。進一步的說,該拉膜器30在實施上還包含有一個傳動裝置(未繪示)上,該傳動裝置能驅動拉膜爪31於基板20的表面21上方往復水平移動,以拉引膠膜40至基板20的表面21上方。 The film puller 30 is used to pull the film 40 to the substrate. Above the surface 21 of the 20, the film puller 30 includes a pull-tab 31 which is slidably disposed above the base 10, and the pull-tab 31 can reciprocate horizontally above the surface 21 of the substrate 20, The film 40 is then pulled over the surface 21 of the substrate 20, which may be an electric jaw or a pneumatic jaw. Further, the film puller 30 further includes a transmission device (not shown) for driving the film pull claw 31 to reciprocate horizontally above the surface 21 of the substrate 20 to pull the film. 40 to the top of the surface 21 of the substrate 20.
該捲收器50包含兩滑動配置於基台10雙端的導 引帶51,所述兩導引帶51呈迴圈狀的配置於基台10雙端,所述導引帶51能接受一驅動器(未繪示)的驅動而進行迴圈移動,所述導引帶51可以是皮帶或鏈條。上述承載件52是銜接於兩導引帶51之間,該導引帶51能帶動承載件52移動,而使該承載件52能鄰近的懸持於基板20的表面21上方,以及位於拉膜爪31的下方,使拉膜爪31能拉引膠膜40平張地擺放於承載件52上。 The retractor 50 includes two sliding guides disposed at the double end of the base 10 The lead belt 51 is disposed in a loop shape at the double end of the base 10, and the guiding belt 51 can be driven by a drive (not shown) for loop movement. The leader belt 51 can be a belt or a chain. The carrier 52 is coupled between the two guiding belts 51. The guiding belt 51 can drive the carrier 52 to move, so that the carrier 52 can be suspended adjacent to the surface 21 of the substrate 20 and located at the film. Below the claws 31, the pull film claws 31 can be placed on the carrier 52 in a flat manner.
在本實施上本發明以該承載件52是由多個間隔 排列的桿體52a與多個間隔排列的帶體52b所組成來作說明。其中,所述桿體52a可以是由具有剛性支撐強度的金屬製成而銜接於兩導引帶51之間,且所述桿體52a透過帶體52b的串組而構成承載件52;所述帶體52b可以是由例如是塑膠、橡膠或皮革等具有可塑性的材質製成,以避免膠膜40由桿體52a之間的縫隙低陷下垂,且該承載件52能透過帶體52b的可塑性及桿體52a的剛性而呈現出可捲收及平張的狀態。 In the present invention, the carrier 52 is separated by a plurality of spacers. The arrangement of the aligned rod body 52a and the plurality of spaced apart belt bodies 52b will be described. Wherein, the rod body 52a may be made of metal having a rigid supporting strength and engaged between the two guiding belts 51, and the rod body 52a penetrates the string of the belt body 52b to constitute the carrier 52; The belt body 52b may be made of a plastic material such as plastic, rubber or leather to prevent the film 40 from sagging from the gap between the rod bodies 52a, and the carrier 52 can penetrate the plasticity of the belt body 52b. The rigidity of the rod body 52a is in a state of being retractable and flattened.
除此之外,上述承載件52還可以由例如是帆布、 鋁帶等兼具捲收及平張機能的材料製成,皆屬本發明所思及且可供應用之等效技術範疇,併予陳明。 In addition to the above, the carrier 52 can also be made of, for example, canvas. The aluminum strip and the like which are both made of the material for the winding and the flattening function are all equivalent technical fields of the present invention and can be applied, and are also given to Chen Ming.
該捲收器50能漸近的捲收承載件52至基台10 之一側而離開基板表面21的上方,使該承載件52上的膠膜40逐漸地貼覆於基板表面21。在具體實施上,該基台10一側設有一集網區11,該承載件52透過捲收器50的捲收而移動至集網區11,進而離開基板表面21的上方。進一步的說,該捲收器50還包含一捲繞輪組53,該捲繞輪組53由多個上下錯位排列的滾輪組成,該導引帶51繞設至捲繞輪組53,使該承載件52沿一蛇行彎摺路徑捲收至基台10一側的集網區11。更進一步的說,該基台10雙側分別設有集網區11,藉此透過於基台10單側或雙側設有集網區11,能有效的減少捲收器50整體所需的佔置空間。 The retractor 50 can asymptoticly retract the carrier 52 to the base 10 One side of the substrate surface 21 is separated from the substrate surface 21 such that the adhesive film 40 on the carrier 52 is gradually attached to the substrate surface 21. In a specific implementation, the base 10 is provided with a collecting area 11 on the side of the base 10, and the carrying member 52 is moved to the collecting area 11 through the retracting of the retractor 50, thereby separating from above the substrate surface 21. Further, the retractor 50 further includes a winding wheel set 53. The winding wheel set 53 is composed of a plurality of rollers arranged up and down, and the guiding belt 51 is wound around the winding wheel set 53 so that the The carrier 52 is wound up along a meandering bending path to the collecting section 11 on the side of the base 10. Furthermore, the base 10 is provided with a network area 11 on both sides thereof, thereby providing a network area 11 on one side or both sides of the base 10, which can effectively reduce the overall requirement of the retractor 50. Take up space.
根據上述配置,請接續參閱圖5a至圖5d,依序 揭示本發明的動作解說圖,說明該拉膜爪31夾持膠膜40沿第一線性方向61移動至承載件52的上方(如圖5a所示),使膠膜40擺放於承載件52上(如圖5b所示),該承載件52透過導引帶51的帶動而沿第二線性方向62離開基板10的上方(如圖5c所示),使擺放於承載件52上的膠膜40因失去承載件52的承持而向下移動並接觸到基板20,進而貼覆於基板20 上(如圖5d所示)。由於承載件52是由基板20的一側移動至另一側的方式離開基板20,因此使膠膜40能逐漸的與基板20接觸,進而提升膠膜40貼覆於基板20時的平整性及避免貼膜後生成氣泡。 According to the above configuration, please refer to Figure 5a to Figure 5d, in order The action diagram of the present invention is disclosed, and the film clamping film 31 is moved along the first linear direction 61 to the upper side of the carrier 52 (as shown in FIG. 5a), so that the film 40 is placed on the carrier. 52 (as shown in FIG. 5b), the carrier 52 is driven by the guiding belt 51 to move away from the substrate 10 in the second linear direction 62 (as shown in FIG. 5c), so as to be placed on the carrier 52. The film 40 moves downward and contacts the substrate 20 due to the loss of the support of the carrier 52, and is then attached to the substrate 20 Upper (as shown in Figure 5d). Since the carrier 52 is separated from the substrate 20 by moving from one side of the substrate 20 to the other side, the adhesive film 40 can be gradually brought into contact with the substrate 20, thereby improving the flatness of the adhesive film 40 when it is attached to the substrate 20. Avoid creating bubbles after filming.
以上實施例僅為表達了本發明的較佳實施方式,但並不能因此而理解為對本發明專利範圍的限制。因此,本發明應以申請專利範圍中限定的請求項內容為準。 The above embodiments are merely illustrative of preferred embodiments of the invention, but are not to be construed as limiting the scope of the invention. Therefore, the present invention should be based on the content of the claims defined in the scope of the patent application.
S1至S4‧‧‧實施例之步驟說明 Description of the steps of the S1 to S4‧‧‧ examples
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CN201510541521.2A CN106393939B (en) | 2015-08-03 | 2015-08-28 | Glue film pasting method and device suitable for larger-size substrate |
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