TWI599280B - Flexible electronic device and fabricating method thereof - Google Patents

Description

Flexible electronic device and method of manufacturing same

The present invention relates to an electronic device and a method of fabricating the same, and more particularly to a flexible electronic device and a method of fabricating the same.

In general, soft electronic products have high development potential due to their light weight, easy to carry, flexible and bendable characteristics, and they have good usability and rich applicability. After years of development, some soft electronic related products have been put into commercialization and started to profit, such as Organic Light-Emitting Diode (OLED) display or Electronic Paper Display (EPD). Wait.

In the structure of a general flexible display, the display panel is fabricated on a flexible flexible substrate, and the relevant components for controlling the display panel are fabricated on a printed circuit board (PCB). The flexible substrate and the printed circuit board are connected by a flexible printed circuit board (FPCB). Although the flexible substrate has good flexibility, the printed circuit board does not have flexibility, and it cannot be folded, so that the degree of freedom of bending of the flexible electronic device is limited. In addition, the joint between the flexible printed circuit board and the printed circuit board and the joint structure of the flexible printed circuit board and the flexible substrate are relatively weak. At present, how to improve the structural strength of a flexible electronic device and increase the degree of freedom of its bending state is a problem that the field is eager to solve.

The invention provides a soft electronic device, which has simplified circuit, good structural strength and high degree of freedom of bending.

The invention provides a method for manufacturing a flexible electronic device, wherein the soft electronic device circuit is simplified, has good structural strength, and has high degree of freedom in bending.

A flexible electronic device in an embodiment of the invention includes a first flexible substrate, an electronic component, and a control component. The first flexible substrate has a surface. The electronic component includes a conductive layer. The control element is disposed on the surface. The control element includes at least one integrated circuit and a circuit layer set. The circuit layer group is disposed between the at least one integrated circuit and the first flexible substrate. The circuit layer set has a plurality of circuit layers and at least one first dielectric layer, and at least a portion of the at least one first dielectric layer is sandwiched between adjacent two circuit layers. The integrated circuit is electrically connected to the electronic component through the circuit layer group and the conductive layer. At least a portion of the conductive layer is integrally formed with at least a portion of a circuit layer, and the conductive layer and a circuit layer are disposed on the first flexible substrate.

In an embodiment of the invention, the circuit layer set includes a plurality of conductive vias. The conductive vias extend through at least a portion of the at least one first dielectric layer to communicate with at least a portion of the circuit layers, and at least one integrated circuit is electrically coupled to the conductive vias.

In an embodiment of the invention, each of the conductive vias includes a plurality of sub-conducting vias, and the at least one first dielectric layer is a plurality of first dielectric layers. Each of the sub-conductive vias extends through at least a portion of the first dielectric layers, and at least one integrated circuit is electrically connected to the sub-conducting vias. The circuit layer group further includes a plurality of electrodes, and each of the electrodes is disposed between adjacent two first dielectric layers through which a conductive via hole extends. Each of the conductive vias extends through an electrode, and the area of each of the electrodes is greater than the sum of the cross-sectional areas of the sub-conductive vias in the conductive vias of the through electrodes.

In an embodiment of the invention, the circuit layer group further includes a plurality of shielding layers. Each shielding layer is disposed between two adjacent first dielectric layers.

In an embodiment of the invention, the at least one first dielectric layer is a plurality of first dielectric layers. The circuit layer group further includes a passive component disposed between the adjacent two first dielectric layers. At least a portion of the conductive vias are electrically coupled to the passive component.

In an embodiment of the invention, the electronic component includes a first sub-electronic component and a second sub-electronic component. The first sub-electronic component is disposed between the second sub-electronic component and the first flexible substrate, the first sub-electronic component is electrically connected to the conductive layer, and the second sub-electronic component is electrically connected to the conductive layer.

In an embodiment of the invention, the flexible electronic device further includes a second flexible substrate, and the electronic component includes a first sub-electronic component and a second sub-electronic component. The first sub-electronic component is disposed on the surface, the second sub-electronic component is disposed on the second flexible substrate, and the second sub-electronic component is disposed between the first flexible substrate and the second flexible substrate.

In an embodiment of the invention, the electronic component further includes at least one second dielectric layer, and the electronic component is disposed on the first flexible substrate by at least one second dielectric layer.

In an embodiment of the invention, the at least one second dielectric layer is disposed between the conductive layer and the first flexible substrate, or the conductive layer is disposed between the at least one second dielectric layer and the first flexible substrate.

In an embodiment of the invention, the at least one second dielectric layer is a plurality of second dielectric layers, and the conductive layer is disposed between the adjacent two second dielectric layers.

In an embodiment of the invention, the first flexible substrate further includes a bent portion. The bent portion is located between the electronic component and the control component, and the conductive layer is disposed on the bent portion. The bent portion is bent to fold the first flexible substrate in half.

In an embodiment of the invention, the electronic device further includes a second flexible substrate disposed between the at least one integrated circuit and the circuit layer group, and the electronic component is disposed on the second flexible substrate facing the at least one integrated circuit on the surface. The circuit layer set includes a plurality of conductive vias extending through at least a portion of the at least one first dielectric layer to communicate at least a portion of the circuit layers, and the conductive vias extend through the second flexible substrate and to the at least one integrated body The circuit is electrically connected.

In an embodiment of the invention, the flexible electronic device further includes an interposer disposed between the at least one integrated circuit and the circuit layer set. The circuit layer set includes a plurality of conductive vias extending through at least a portion of the at least one first dielectric layer to communicate at least a portion of the circuit layers, and the conductive vias extend through the interposer and are electrically coupled to the at least one integrated circuit Sexual connection. The hardness of the interposer is greater than the hardness of the first flexible substrate.

In an embodiment of the invention, the at least one first dielectric layer is a flexible material.

A method of fabricating a flexible electronic device in an embodiment of the invention includes forming a layer of a conductive material on a surface of a first flexible substrate. A portion of the layer of electrically conductive material is a conductive layer of the electronic component, and another portion of the layer of electrically conductive material is one of a plurality of circuit layers of the set of circuit layers of the control element. The manufacturing method of the flexible electronic device further includes forming the circuit layers of the circuit layer group and the at least one first dielectric layer, and at least a portion of the at least one first dielectric layer is sandwiched between the adjacent two circuit layers. The method of manufacturing a flexible electronic device also includes electrically connecting at least one integrated circuit of the control element to the circuit layer set and the conductive layer to the electronic component.

In an embodiment of the invention, the method for fabricating the flexible electronic device further includes forming an electronic component on the surface and forming the control component on the surface.

In an embodiment of the invention, the method of forming a layer of conductive material on a surface of a first flexible substrate includes forming a release layer on the rigid carrier. A first flexible substrate is formed on the release layer. A layer of conductive material is formed on the surface of the first flexible substrate. The release layer is cut to remove the release layer as well as the rigid carrier.

In an embodiment of the invention, the method for electrically connecting at least one integrated circuit of the control element to the circuit layer group and the conductive layer and the electronic component comprises forming a plurality of conductive via holes. The conductive vias extend through at least a portion of the at least one first dielectric layer to communicate at least a portion of the circuit layers. In addition, the method further includes electrically connecting at least one integrated circuit to the conductive vias.

In an embodiment of the invention, each of the conductive vias includes a plurality of sub-conducting vias. The at least one first dielectric layer is a plurality of first dielectric layers, and each of the sub-conductive vias extends through at least a portion of the first dielectric layers. A method of electrically connecting at least one integrated circuit of the control element through the circuit layer set and electrically connecting the conductive layer to the electronic component includes forming a plurality of electrodes. Each of the electrodes is formed between two adjacent first dielectric layers through which a conductive via is penetrating, and each of the conductive vias extends through an electrode. The area of each electrode is larger than the sum of the cross-sectional areas of the sub-conductive vias among the conductive vias of the through electrodes. In addition, the method further includes electrically connecting at least one integrated circuit to the sub-conductive vias.

In an embodiment of the invention, the method for fabricating the flexible electronic device further includes forming a plurality of shielding layers. Each shielding layer is formed between adjacent two first dielectric layers.

In an embodiment of the invention, the at least one first dielectric layer is a plurality of first dielectric layers. The method of manufacturing a flexible electronic device further includes forming a passive component between adjacent two first dielectric layers, and electrically connecting at least a portion of the conductive vias to the passive component.

In an embodiment of the invention, the electronic component includes a first sub-electronic component and a second sub-electronic component, and the first sub-electronic component is disposed between the second sub-electronic component and the first flexible substrate. The method of electrically connecting at least one integrated circuit of the control element to the circuit layer group and the conductive layer and the electronic component comprises electrically connecting the first sub-electronic component to the conductive layer, and electrically connecting the second sub-electronic component and the conductive layer connection.

In an embodiment of the invention, the electronic component includes a first sub-electronic component and a second sub-electronic component, and the first sub-electronic component is disposed on a surface. The method of manufacturing a flexible electronic device further includes forming a second flexible substrate and forming a second sub-electronic component on the second flexible substrate. The second sub-electronic component is located between the first flexible substrate and the second flexible substrate.

In an embodiment of the invention, the method for manufacturing a flexible electronic device further includes forming at least one second dielectric layer, wherein the electronic component is disposed on the first flexible substrate by using at least one second dielectric layer. At least one second dielectric layer and at least one first dielectric layer are simultaneously formed.

In an embodiment of the invention, the at least one second dielectric layer is formed between the conductive layer and the first flexible substrate, or the conductive layer is formed between the at least one second dielectric layer and the first flexible substrate.

In an embodiment of the invention, the at least one second dielectric layer is a plurality of second dielectric layers, and the conductive layer is formed between the adjacent two second dielectric layers.

In an embodiment of the invention, the method for manufacturing a flexible electronic device further includes forming a second flexible substrate between the at least one integrated circuit and the circuit layer set, and forming the electronic component on the second flexible substrate facing at least one On the surface of the integrated circuit. A method of electrically connecting at least one integrated circuit of the control element to the circuit layer set and electrically connecting the conductive layer to the electronic component includes forming a plurality of conductive vias. The conductive vias extend through at least a portion of the at least one first dielectric layer, and the conductive vias extend through the second flexible substrate. In addition, the method further includes connecting the conductive vias to at least a portion of the circuit layers and electrically connecting the conductive vias to the at least one integrated circuit.

In an embodiment of the invention, the method for manufacturing a flexible electronic device further includes forming an interposer between the at least one integrated circuit and the circuit layer set, and the hardness of the interposer is greater than the hardness of the first flexible substrate. A method of electrically connecting at least one integrated circuit of the control element to the circuit layer set and electrically connecting the conductive layer to the electronic component includes forming a plurality of conductive vias. The conductive vias extend through at least a portion of the at least one first dielectric layer, and the conductive vias extend through the interposer. In addition, the method further includes connecting the conductive vias to at least a portion of the circuit layers and electrically connecting the conductive vias to the at least one integrated circuit.

In an embodiment of the invention, the display panel comprises an active-matrix organic light-emitting diode (AMOLED) and a passive matrix organic light-emitting diode (Passive-matrix organic light-emitting). Diode, PMOLED), liquid crystal display (LCD), electro-optical display (EPD) or other types of display panels.

In an embodiment of the invention, the touch panel is a capacitive touch panel, a resistive touch panel, an optical touch panel or other types of touch panels.

Based on the above, in the flexible electronic device and the method of manufacturing the same according to the embodiment of the invention, the control element is disposed on the surface of the first flexible substrate. The at least one integrated circuit of the control element is electrically connected to the electronic component through the circuit layer group and the conductive layer of the electronic component, and at least a portion of the conductive layer is integrally formed with at least a portion of a circuit layer of the circuit layer group, and the conductive layer and the conductive layer The circuit layers are all disposed on the first flexible substrate. Therefore, the control element does not have to be fabricated on the unfoldable printed circuit board, and the control element does not need to be electrically connected to the electronic component by the flexible printed circuit board, so that the circuit of the flexible electronic device is simplified, the structure is strong, and the bending state is High degree of freedom.

The above described features and advantages of the invention will be apparent from the following description.

FIG. 1A is a top view of a flexible electronic device according to an embodiment of the invention. Please refer to FIG. 1A. In the present embodiment, the flexible electronic device 100a includes an electronic component 120 and a control component 130. Further, the flexible electronic device 100a has an electronic component area EA and a control element area CA. The electronic component 120 is located in the electronic component area EA, and the control element 130 is located in the control element area CA. In particular, electronic component 120 includes a display panel, a touch panel, a sensor, or a combination thereof. In this embodiment, the electronic component 120 is a display panel having a touch function, such as an active-matrix organic light-emitting diode (AMOLED) display panel having a touch function, and having a touch control function. Passive-matrix organic light-emitting diode (PMOLED), liquid crystal display (LCD) or other types of display panels. In addition, in some embodiments, the electronic component 120 may also have a sensor according to different applications, and the sensor includes a photo sensor, a thermal sensor, a chemical sensor, or a combination thereof, and the present invention does not This is limited to this. In addition, in the present embodiment, the control element 130 includes at least one integrated circuit 132 for driving and controlling the electronic component 120. The integrated circuit 132 includes a central processing unit, an image signal interface, a radio frequency device, or a combination thereof, or the integrated circuit 132 can be other types of integrated circuits depending on the application. Specifically, the flexible electronic device 100a includes a plurality of integrated circuits 132. The integrated circuits 132 are a central processing unit 132b, a radio frequency device 132c, a video signal interface 132d, a touch driving device 132e, and a display driving device 132f. In addition, the power source 132a of the flexible electronic device 100a is disposed in the control element area CA. In this embodiment, the respective members of the control element 130 are electrically connected to each other in an appropriate manner to achieve the purpose of driving the operation of the electronic component 120 or to achieve the functions of other flexible electronic devices 100a.

1B is a cross-sectional view of the flexible electronic device of FIG. 1A along line A-A'. Please refer to FIG. 1A and FIG. 1B simultaneously. In the embodiment, the flexible electronic device 100a includes a first flexible substrate 110. The first flexible substrate 110 has a surface S, and the electronic component 120 and the control component 130 are disposed on the surface S. In some embodiments, the electronic component 120 and the control component 130 may be disposed on two surfaces of the first flexible substrate 110 opposite to each other, and the invention is not limited thereto. In addition, in the present embodiment, the electronic component 120 and the control component 130 are located in the electronic component area EA and the control element area CA, respectively. The electronic component 120 includes a conductive layer 124, and the electronic component 120 is disposed on the surface S by a conductive layer 124. Specifically, the conductive layer 124 is, for example, a metal layer in the electronic component 120 that controls the display line of the display panel or the data line. In addition, the control element 130 includes a circuit layer group 140, and the circuit layer group 140 is disposed between the integrated circuit 132 and the first flexible substrate 110.

In this embodiment, the circuit layer group 140 has a plurality of circuit layers and at least one first dielectric layer, and at least a portion of the at least one first dielectric layer is sandwiched between adjacent two circuit layers. Specifically, the circuit layer group 140 has a circuit layer 142a, a circuit layer 142b, a circuit layer 142c, a circuit layer 142d, and a circuit layer 142e, and the circuit layer group 140 has a plurality of first dielectric layers, that is, a first dielectric layer 144a. a first dielectric layer 144b, a first dielectric layer 144c, and a first dielectric layer 144d. In this embodiment, the first dielectric layers are alternately stacked with the circuit layers. The first dielectric layer 144a is interposed between the circuit layer 142a and the circuit layer 142b. The first dielectric layer 144b is interposed between the circuit layer 142b and the circuit layer 142c. The first dielectric layer 144c is sandwiched between the circuit layer 142c. And between the circuit layers 142d, and the first dielectric layer 144d is interposed between the circuit layer 142d and the circuit layer 142e. In this embodiment, the first dielectric layers are flexible materials such that the first dielectric layers can be flexed in conjunction with the first flexible substrate 110 without damage.

In this embodiment, the circuit layer group 140 includes a plurality of conductive vias 146 extending through at least a portion of the first dielectric layer 144a, the first dielectric layer 144b, the first dielectric layer 144c, and the first dielectric layer 144d. At least a portion of the circuit layer 142a, the circuit layer 142b, the circuit layer 142c, the circuit layer 142d, and the circuit layer 142e are connected. The integrated circuit 132 is electrically connected to the conductive vias 146, for example, the central processing unit 132b, the radio frequency device 132c, the video signal interface 132d, the touch driving device 132e, and the display driving device 132f of the present embodiment.

Please continue to refer to FIG. 1A and FIG. 1B. In the present embodiment, at least a portion of the conductive layer 124 of the electronic component 120 is integrally formed with at least a portion of a circuit layer of the circuit layer stack 140 of the control component 130. Specifically, the integrated circuit 132 is electrically connected to the electronic component 120 through the circuit layer set 140 and the conductive layer 124. At least a portion of the conductive layer 124 is integrally formed with at least a portion of a circuit layer 142e, and the conductive layer 124 and the circuit are integrally formed. The layers 142e are all disposed on the first flexible substrate 110. Further, at least a portion of the conductive layer 124 and at least a portion of the circuit layer 142e are a conductive material layer CML integrally formed. The signals from the integrated circuits 132 of the control element 130 can be transmitted to the conductive layer 124 through the circuit layers of the circuit layer group 140 and the conductive vias 146, and the signals can be transmitted to the electronic component 120 via the conductive layer 124. . Therefore, the control element 130 is electrically connected to the electronic component 120, and the driving electronic component 120 operates.

In addition, in the embodiment, the electronic component 120 includes a plurality of gate driving devices 122 disposed on the surface S of the first flexible substrate 110 and located in the electronic component region EA. The gate drivers 122 are coupled to the conductive layer 124, and the gate drivers 122 are used to provide display panel gate signals in the electronic component 120 to drive the display panel. In addition, the electronic component 120 of the present embodiment further has a wire W. One end of the wire W is connected to the conductive layer 124, and the other end extends to a side of the electronic component 120 away from the first flexible substrate 110. For example, the electronic component 120 of the embodiment has a touch panel (not shown), and the touch panel is located on a side of the electronic component 120 away from the first flexible substrate 110. The touch panel can be electrically connected to the control component 130 by the wire W, so that the control component 130 can drive the operation of the touch panel. In the embodiment of the present invention, the touch panel of the electronic component 120 may be a capacitive touch panel, a resistive touch panel, an optical touch panel, or other types of touch panels, and the present invention does not limit. In addition, the wires W may be disposed in accordance with different components of the electronic component 120 to connect the respective components of the electronic component 120 to the conductive layer 124. The invention is not limited thereto.

In the present embodiment, the control element 130 is disposed on the surface S of the first flexible substrate 110. The integrated circuits 132 of the control element 130 are electrically connected to the electronic component 120 through the circuit layer 140 and the conductive layer 124 of the electronic component 120, and at least a portion of the conductive layer 124 is identical to at least a portion of the circuit layer 142e of the circuit layer 140. It is a layer of conductive material CML. Therefore, the control element 130 does not have to be fabricated on the unfoldable printed circuit board, so that the electronic component 120 and the control component 130 on the first flexible substrate 110 can be in different directions by the flexible characteristics of the first flexible substrate 110. Bend. That is to say, the degree of freedom of the bending state of the flexible electronic device 100a is high. In addition, the control component 130 does not need to be electrically connected to the electronic component 120 by the flexible printed circuit board. Therefore, the trace between the control component 130 and the electronic component 120 does not need to pass through the flexible printed circuit board, so that the circuit of the flexible electronic device 100a as a whole goes. The line can be designed to be more simplified. In addition, since the flexible electronic device 100a of the present embodiment does not need to connect the flexible substrate and the printed circuit board having completely different flexural characteristics by the flexible printed circuit board, the joint between the flexible printed circuit board and the printed circuit board does not occur. And the problem that the joint structure between the flexible printed circuit board and the flexible substrate is relatively weak. That is, the flexible electronic device 100a has a better structural strength.

FIG. 1C to FIG. 1F are schematic diagrams showing the flow of a method for manufacturing a flexible electronic device according to an embodiment of the present invention. Please refer to FIG. 1C first. In the present embodiment, the flexible electronic device 100b is similar to the flexible electronic device 100a of the embodiment of FIGS. 1A and 1B. The components of the flexible electronic device 100b and related descriptions can be referred to the flexible electronic device 100a of the embodiment of FIGS. 1A and 1B. Specifically, the method of manufacturing the flexible electronic device 100b includes forming a conductive material layer CML on the surface S of the first flexible substrate 110. In addition, the method of manufacturing the flexible electronic device 100b also includes forming the electronic component 120 on the surface S. Next, referring to FIG. 1D, a circuit layer 142f of the circuit layer group of the control element 130 (the control element 130 as shown in FIG. 1F) and a first dielectric layer 144e are formed. Specifically, a portion of the conductive material layer CML is the conductive layer 124 of the electronic component 120, and another portion of the conductive material layer CML is the circuit layer 142f of the circuit layer group of the control component 130. In some embodiments, a portion of the conductive material layer CML is the conductive layer 124 of the electronic component 120, and another portion of the conductive material layer CML is one of the plurality of circuit layers of the circuit layer group of the control component 130. Not limited to this.

Thereafter, referring to FIG. 1E and FIG. 1F, the manufacturing method of the flexible electronic device 100b includes forming a plurality of conductive vias 146a and a circuit layer 142g. The conductive vias 146a extend through the first dielectric layer to connect the circuit layers 142f and the circuit layers 142g, and the first dielectric layer 144e is interposed between the adjacent two circuit layers 142f and the circuit layer 142g. Next, the control element 130 is formed on the surface S. Specifically, the control element 130 includes at least one integrated circuit 132, and the circuit layer group is disposed between the integrated circuit 132 and the first flexible substrate 110. Thereafter, the manufacturing method of the flexible electronic device 100b includes electrically connecting the integrated circuit 132 to the conductive vias 146a, and electrically connecting the integrated circuit 132 of the control element 130 to the electronic component 120 through the circuit layer group and the conductive layer 124. To form the flexible electronic device 100b. In some embodiments, the circuit layer set of the control element 130 may also include a plurality of circuit layers and a plurality of first dielectric layers, at least a portion of the first dielectric layers being sandwiched between adjacent two circuit layers, and These first dielectric layers are stacked alternately with these circuit layers. In addition, in the above embodiments, a portion of the conductive material layer CML is the conductive layer 124 of the electronic component 120, and another portion of the conductive material layer CML is one of the circuit layers of the circuit layer group of the control component 130, The invention is not limited to this.

1G to 1J are schematic flow charts showing a method of manufacturing a flexible electronic device according to another embodiment of the present invention. Specifically, FIG. 1G to FIG. 1J illustrate another manufacturing manner of the flexible electronic device 100b of the embodiment of FIG. 1C to FIG. Referring first to FIG. 1G, in the embodiment, the method of manufacturing the flexible electronic device includes the following steps. First, a conductive material layer CML is formed on the surface S of the first flexible substrate 110. A portion of the conductive material layer CML is the conductive layer 124, and another portion of the conductive material layer CML is the circuit layer 142f. And, a first dielectric layer 144e is formed. Next, referring to FIG. 1H and FIG. 1I, a plurality of conductive vias 146a and a circuit layer 142g are formed, and a control element 130 is formed on the surface S, and a circuit layer group of the control element 130 is disposed on the integrated circuit 132 of the control element 130. Between the first flexible substrates 110. Thereafter, referring to FIG. 1J, the electronic component 120 is formed on the surface S, and the integrated circuit 132 of the control component 130 is electrically connected to the electronic component 120 through the circuit layer group and the conductive layer 124 to form the flexible electronic device 100b.

FIG. 1K is a top view of a flexible electronic device according to another embodiment of the present invention. Please refer to FIG. 1K. In the present embodiment, the flexible electronic device 100c is similar to the flexible electronic device 100a of the embodiment of FIGS. 1A-1B. For the components of the flexible electronic device 100c and the related description, reference may be made to the flexible electronic device 100a of the embodiment of FIG. 1A to FIG. 1B, and details are not described herein again. The flexible electronic device 100c is different from the flexible electronic device 100a in that the gate driving devices 122 of the flexible electronic device 100c are disposed on the circuit layer group 140 and located in the control element region CA. Specifically, similar to the flexible electronic device 100a of the embodiment of FIGS. 1A to 1B, the circuit of the flexible electronic device 100c is simplified, has good structural strength, and has a high degree of freedom in bending.

FIG. 1L is a top view of a flexible electronic device according to still another embodiment of the present invention. Please refer to FIG. 1L. In the present embodiment, the flexible electronic device 100d is similar to the flexible electronic device 100a of the embodiment of FIGS. 1A-1B. For the components of the flexible electronic device 100d and the related description, reference may be made to the flexible electronic device 100a of the embodiment of FIG. 1A to FIG. 1B, and details are not described herein again. The flexible electronic device 100d is different from the flexible electronic device 100a in that the flexible electronic device 100d includes an electronic component 150 and a control component 130'. The electronic component 150 is located in the electronic component area EA, and the control element 130' is located in the control element area CA. In particular, electronic component 150 has, for example, a sensor. In this embodiment, the sensor includes a photo sensor, a thermal sensor, a chemical sensor, or a combination thereof, and the invention is not limited thereto. Further, in the present embodiment, the control element 130' includes a plurality of integrated circuits 132' for driving and controlling the electronic components 150. These integrated circuits 132' include a drive control element 132g and a signal transmission element 132h. In addition, the power supply element 132i of the flexible electronic device 100d is disposed in the control element area CA. In this embodiment, the components of the control component 130' are electrically connected to each other to achieve the purpose of driving the electronic component 150, for example, to implement a sensing function of the sensor, or to achieve the functions of other flexible electronic devices 100d. . Specifically, similar to the flexible electronic device 100a of the embodiment of FIGS. 1A to 1B, the circuit of the flexible electronic device 100d is simplified, has good structural strength, and has high degree of freedom in bending.

2A-2L are schematic diagrams showing the flow of manufacturing a control element on a first flexible substrate according to an embodiment of the invention. The method for fabricating the control element on the first flexible substrate in the embodiment is applicable to at least the flexible electronic device 100a of the embodiment of FIGS. 1A to 1B and the flexible electronic device 100b of the embodiment of FIGS. 1C to 1J. In addition, the method for manufacturing the control element on the first flexible substrate in the embodiment can also be applied to the flexible electronic device of other embodiments to be described later, and other types of flexible electronic devices, and the invention is not limited thereto. In this embodiment, the method of fabricating the control element on the first flexible substrate comprises forming the conductive material layer CML on the surface S of the first flexible substrate 110, and forming the conductive material layer CML on the surface S of the first flexible substrate 110. The method includes the following steps. Referring first to FIG. 2A, first, a release layer RL is formed on the rigid carrier RC, and a first flexible substrate 110 is formed on the release layer RL. Next, referring to FIG. 2B and FIG. 2C, the circuit layer 142h is formed on the surface S of the first flexible substrate 110. Further, the circuit layer 142h is patterned to form a patterned circuit layer 142h' according to actual electrical conductivity requirements, wherein the circuit layer 142h' is a portion of the conductive material layer CML. Specifically, the method of forming the conductive material layer CML on the surface S of the first flexible substrate 110 also includes cutting the release layer RL after removing the conductive material layer CML on the surface S to remove the release layer RL and the rigidity. Carrier RC. In this embodiment, however, the release layer RL may be cut to remove the release layer RL and the rigid carrier RC in other steps of fabricating the control element on the first flexible substrate 110. The invention is not limited thereto. .

Referring to FIG. 2D to FIG. 2G, after the circuit layer 142h' is formed on the surface S of the first flexible substrate 110, the first dielectric layer 144f is coated on the circuit layer 142h'. Also, a photoresist MK is formed on the first dielectric layer 144f, and the first dielectric layer 144f is etched to form a patterned first dielectric layer 144f'. Next, the photoresist MK is removed. Then, referring to FIG. 2H to FIG. 2I, the method of fabricating the control element on the first flexible substrate 110 further includes forming the circuit layer 142i on the first dielectric layer 144f', and patterning the circuit layer 142i, according to actual conditions. The conductive requirements require formation of the circuit layer 142i' after patterning. Specifically, the patterned first dielectric layer 144f' has a plurality of holes. After the circuit layer 142i' is formed on the first dielectric layer 144f', the holes are filled with a conductive material to form a plurality of conductive vias 146b extending through the first dielectric layer 144f'. The patterned circuit layer 142i' and at least a portion of the circuit layer 142h' are connected by the conductive vias 146b.

Next, referring to FIG. 2J to FIG. 2K, the first dielectric layer 144g is formed in a manner similar to the above-described method of forming the first dielectric layer 144f, and the pattern is formed in a manner similar to the above-described method of forming the first dielectric layer 144f'. The first dielectric layer 144g' after the crystallization. Thereafter, a plurality of conductive vias 146c penetrating through the first dielectric layer 144g' are formed in a manner similar to that described above for forming the conductive vias 146b, and a circuit layer (not shown) is formed on the first dielectric layer 144g'. And, the circuit layer and at least a portion of the circuit layer 142i' are connected by the conductive vias 146c. Thereafter, the release layer RL is cut to remove the release layer RL and the rigid carrier RC. However, in this embodiment, after the control element is formed on the first flexible substrate 110, the release layer RL is further cut to remove the release layer RL and the rigid carrier RC, and the invention is not limited thereto. Next, referring to FIG. 2L, the integrated circuit 132 of the control element is formed on the first dielectric layer 144g', and the integrated circuit 132 is electrically connected to the conductive material layer CML.

3A is a schematic cross-sectional view of a flexible electronic device according to another embodiment of the present invention. Please refer to FIG. 3A. In the present embodiment, the flexible electronic device 300a is similar to the flexible electronic device 100a of the embodiment of FIGS. 1A-1B. For the components of the flexible electronic device 300a and the related description, reference may be made to the flexible electronic device 100a of the embodiment of FIG. 1A to FIG. 1B, and details are not described herein again. The flexible electronic device 300a is different from the flexible electronic device 100a in that the electronic component 320 of the flexible electronic device 300a further includes at least one second dielectric layer, and the electronic component 320 is disposed on the first layer by at least one second dielectric layer. On the flexible substrate 110. Specifically, the electronic component 320 includes a plurality of second dielectric layers 326 , and the electronic components 320 are disposed on the first flexible substrate 110 by the second dielectric layers 326 . In the embodiment, the second dielectric layer 326 is disposed between the conductive layer 124 of the electronic component 320 and the first flexible substrate 110 . In some embodiments, the conductive layer 124 may also be disposed between the second dielectric layer 326 and the first flexible substrate 110. In addition, in other embodiments, the conductive layer 124 may be disposed between adjacent two second dielectric layers 326, and the invention is not limited thereto.

In the present embodiment, the control element 130 of the flexible electronic device 300a is disposed on the surface S of the first flexible substrate 110. The integrated circuits 132 of the control element 130 are electrically connected to the electronic component 320 through the circuit layer 140 and the conductive layer 124 of the electronic component 320, and at least a portion of the conductive layer 124 is identical to at least a portion of the circuit layer 142a of the circuit layer 140. It is a layer of conductive material CML. Therefore, the flexible electronic device 300a is similar to the flexible electronic device 100a, and the circuit of the flexible electronic device 300a is simplified, the structural strength is good, and the degree of freedom of the bent state is high.

3B-3E are schematic flow charts showing a method of manufacturing a flexible electronic device according to still another embodiment of the present invention. In the present embodiment, the flexible electronic device 300b is similar to the flexible electronic device 300a of the embodiment of FIG. 3A. The components of the flexible electronic device 300b and related descriptions can be referred to the flexible electronic device 300a of the embodiment of FIG. 3A. Specifically, the method of manufacturing the flexible electronic device 300b includes the following steps. Referring to FIG. 3B, first, a conductive material layer CML is formed on the surface S of the first flexible substrate 110, and a dielectric material layer DML is formed on the conductive material layer CML. Next, referring to FIG. 3C, a plurality of conductive vias 146 are formed in the dielectric material layer DML. Also, a circuit layer 142k is formed on a portion of the dielectric material layer DML, and a circuit layer 142j is formed on another portion of the dielectric material layer DML. The circuit layer 142k is connected to a portion of the conductive vias 146, and the circuit layer 142j is coupled to the other conductive vias 146 of the other portion. Specifically, the circuit layer 142k is electrically connected to the circuit layer 142j by the conductive vias 146 and the conductive material layer CML. Next, referring to FIG. 3D and FIG. 3E, the integrated circuit 132 of the control element 130 is placed or formed on the circuit layer 142j, and the electronic component 320 is formed or formed on the circuit layer 142k to form the flexible electronic device 300b. In this embodiment, a portion of the dielectric material layer DML can be considered as a single layer of the second dielectric layer, and another portion of the dielectric material layer DML can be considered as a single layer of the first dielectric layer. The electronic component 320 is disposed on the first flexible substrate 110 by the second dielectric layer of the single layer. In some embodiments, the flexible electronic device 300b may also have a plurality of dielectric material layers DML, and a portion of each dielectric material layer DML may be regarded as a second dielectric layer, and another portion of each dielectric material layer DML may be visible. For a first dielectric layer, the invention is not limited thereto.

4A is a schematic cross-sectional view of a flexible electronic device according to still another embodiment of the present invention. Please refer to FIG. 4A. In the present embodiment, the flexible electronic device 400a is similar to the flexible electronic device 100a of the embodiment of FIGS. 1A-1B. For the components of the flexible electronic device 400a and the related description, reference may be made to the flexible electronic device 100a of the embodiment of FIG. 1A to FIG. 1B, and details are not described herein again. The flexible electronic device 400a is different from the flexible electronic device 100a in that the flexible electronic device 400a further includes a second flexible substrate 450 disposed between the control element 430 and the circuit layer group 440, and the electronic component 120 is disposed on the second flexible substrate. 450 faces at least one surface S2 of the integrated circuit 132. The circuit layer set 440 includes a plurality of conductive vias 446 extending through at least a portion of the at least one first dielectric layer to communicate at least a portion of the circuit layers, and the conductive vias 446 extend through the second flexible substrate 450 and It is electrically connected to at least one integrated circuit 132. Specifically, the conductive vias 446 extend through at least a portion of the first dielectric layer 444a, the first dielectric layer 444b, and the first dielectric layer 444c to connect the circuit layers 442a, the circuit layer 442b, the circuit layer 442c, and the circuit. At least a portion of the layer 442d and the circuit layer 442e, and the conductive vias 446 extend through the second flexible substrate 450 and are electrically connected to the integrated circuit 132 (the RF device 132c, the image signal interface 132d or the display driving device 132f).

In the present embodiment, the control element 430 of the flexible electronic device 400a is disposed on the surface S of the first flexible substrate 410. The integrated circuits 132 of the control element 430 are electrically connected to the electronic component 120 through the circuit layer 440 and the conductive layer 424 of the electronic component 120, and at least a portion of the conductive layer 424 is identical to at least a portion of the circuit layer 442a of the circuit layer group 440. It is a layer of conductive material CML. Therefore, the flexible electronic device 400a is similar to the flexible electronic device 100a. The circuit of the flexible electronic device 400a is simplified, has good structural strength, and has a high degree of freedom in bending.

4B to 4F are schematic flow charts showing a method of manufacturing a flexible electronic device according to still another embodiment of the present invention. In the present embodiment, the flexible electronic device 400b is similar to the flexible electronic device 400a of the embodiment of FIG. 4A. The components of the flexible electronic device 400b and related descriptions can be referred to the flexible electronic device 400a of the embodiment of FIG. 4A. Specifically, the manufacturing method of the flexible electronic device 400b includes the following steps. Referring to FIG. 4B, first, a circuit layer 442f is formed on the surface S1 of the first flexible substrate 410, and a first dielectric layer 444d is formed on the circuit layer 442f. Next, referring to FIG. 4C, a plurality of conductive vias 446a are formed in the first dielectric layer 444d. Further, a circuit layer 442g is formed on the first dielectric layer 444d. The circuit layer 442g and at least a portion of the conductive vias 446a, and the circuit layer 442g are electrically connected to the circuit layer 442f by the conductive vias 446a.

Next, referring to FIG. 4D to FIG. 4E, the second flexible substrate 450 is formed to cover the circuit layer 442g, the plurality of conductive vias 446b are formed in the second flexible substrate 450, and the second flexible substrate 450 faces the integrated circuit 132. A conductive material layer CML is formed on the surface S2, a portion of the conductive material layer CML is the conductive layer 124 of the electronic component 120 (such as the electronic component 120 as shown in FIG. 4F), and another portion of the conductive material layer CML is the circuit layer 442h. The circuit layer 442h corresponds to the position of the first flexible substrate 410, and the conductive layer 124 does not correspond to the position of the first flexible substrate 410. Further, the integrated circuit 132 of the control element 130 is formed on the second flexible substrate 450.

Specifically, the conductive vias 446a extend through the first dielectric layer 444d, and the conductive vias 446b extend through the second flexible substrate 450. The conductive vias 446a and the conductive vias 446b communicate with the circuit layer 442f, the circuit layer 442g, and the circuit layer 442h, and the conductive vias 446a and the conductive vias 446b are electrically connected to the integrated circuit 132. In some embodiments, a plurality of conductive vias may also be formed, such that the conductive vias penetrate the first dielectric layer 444d, and the conductive vias are penetrated. The second flexible substrate 450. In addition, the conductive vias are connected to at least a portion of the circuit layer 442f, the circuit layer 442g, and the circuit layer 442h, and the conductive vias are electrically connected to the integrated circuit 132. The invention is not limited thereto. Next, referring to FIG. 4F, the electronic component 120 is formed on the surface S2 of the second flexible substrate 450 facing the integrated circuit 132 to form the flexible electronic device 400b. In the present embodiment, the electronic component 120 is disposed on the surface S2 by the conductive layer 124.

FIG. 5A is a schematic cross-sectional view of a flexible electronic device according to still another embodiment of the present invention. Please refer to FIG. 5A. In the present embodiment, the flexible electronic device 500 is similar to the flexible electronic device 100a of the embodiment of FIGS. 1A-1B. For the components of the flexible electronic device 500 and the related description, reference may be made to the flexible electronic device 100a of the embodiment of FIG. 1A to FIG. 1B, and details are not described herein again. The flexible electronic device 500 is different from the flexible electronic device 100a in that the control element 530 of the flexible electronic device 500 includes a circuit layer group 540, and the circuit layer group 540 has a circuit layer 542a, a circuit layer 542b, a circuit layer 542c, and a circuit layer 542d. And a first dielectric layer 544a, a first dielectric layer 544b, and a first dielectric layer 544c. These first dielectric layers are stacked alternately with these circuit layers. In addition, the circuit layer set 540 further includes a plurality of conductive vias 546. The conductive vias 546 extend through at least a portion of the first dielectric layers to communicate at least a portion of the circuit layers. Specifically, the first flexible substrate 510 of the flexible electronic device 500 further includes a bent portion 512 . The bent portion 512 is located between the electronic component 120 and the control component 530 , and the conductive layer 524 of the electronic component 120 is disposed on the bent portion 512 . In the present embodiment, the bent portion 512 is used to bend the first flexible substrate 510 in half.

FIG. 5B is an enlarged schematic view of the flexible electronic device of the embodiment of FIG. 5A in the area A, please refer to FIG. 5B. In this embodiment, the conductive layer 524 is disposed on the surface S of the first flexible substrate 510 and disposed on the surface of the bent portion 512 . At the same time, the conductive layer 524 is connected to the circuit layer 542d. Specifically, the control element 530 of the flexible electronic device 500 is disposed on the surface S of the first flexible substrate 510. The integrated circuits 132 of the control element 530 are electrically connected to the electronic component 120 through the circuit layer set 540 and the conductive layer 524 of the electronic component 120, and at least a portion of the conductive layer 524 is identical to at least a portion of the circuit layer 542d of the circuit layer set 540. It is a layer of conductive material CML. Therefore, the flexible electronic device 500 is similar to the flexible electronic device 100a. The circuit of the flexible electronic device 500 is simplified, the structural strength is good, and the degree of freedom of the bent state is high. In addition, the first flexible substrate 510 of the flexible electronic device 500 has a bent portion 512, and the integrated circuit 132 of the control element 530 is not located on the bent portion 512. Therefore, the flexible electronic device 500 can have a better bending effect at the bent portion 512 through appropriate design without causing damage to the control member 530.

5C-5D illustrate a flexible electronic device corresponding to the embodiment of FIG. 5A in a region A in various embodiments of the present invention. Referring to FIG. 5C , in the embodiment, the conductive layer 524 a extends from the surface S of the first flexible substrate 510 to the other surface of the first flexible substrate 510 relative to the surface S, and the conductive layer 524 a is disposed on the bent portion 512 . on the surface. At the same time, the conductive layer 524 is connected to the circuit layer 542d. In addition, referring to FIG. 5D , in the embodiment, the conductive layer 524 a is disposed inside the first flexible substrate 510 , and the conductive layer 524 a is disposed inside the bent portion 512 . At the same time, the conductive layer 524 is connected to the circuit layer 542d. Specifically, in these embodiments, the flexible electronic device can be appropriately designed to make the flexible electronic device have a better bending effect on the bent portion 512 without causing damage to the control element.

6A is a schematic cross-sectional view of a flexible electronic device according to another embodiment of the present invention. Please refer to FIG. 6A. In the present embodiment, the flexible electronic device 600 is similar to the flexible electronic device 100a of the embodiment of FIGS. 1A-1B. For the components of the flexible electronic device 600 and the related description, reference may be made to the flexible electronic device 100a of the embodiment of FIG. 1A to FIG. 1B, and details are not described herein again. The flexible electronic device 600 is different from the flexible electronic device 100a in that the circuit layer group 640 of the flexible electronic device 600 further includes a passive component 648 disposed between two adjacent first dielectric layers. Specifically, the passive component 648 of the circuit layer group 640 of the present embodiment is disposed between the first dielectric layer 144a and the first dielectric layer 144b. Additionally, at least a portion of the conductive vias 146 are electrically coupled to the passive component 648. In related embodiments, passive component 648 includes a resistor, a capacitor, or a combination thereof, or passive component 648 can be other types of passive component.

6B is a cross-sectional view showing a portion of a circuit layer group of a flexible electronic device according to another embodiment of the present invention, and FIG. 6C is an enlarged schematic view showing a portion of the circuit layer group of the embodiment of FIG. 6B in a region B. Please refer to FIG. 6B and Figure 6C. In the present embodiment, the flexible electronic device is similar to the flexible electronic device 600 of the embodiment of FIG. 6A. The difference between the flexible electronic device of the present embodiment and the flexible electronic device 600 of the embodiment of FIG. 6A is that the circuit layer group of the flexible electronic device of the present embodiment is different from the circuit layer group 640 of the flexible electronic device 600 of the embodiment of FIG. 6A. The difference is that the conductive via 646 of the circuit layer set of this embodiment is different from the conductive via 146 of the embodiment of FIG. 6A. Specifically, the conductive via 646 of the embodiment includes a plurality of sub-conducting vias. Each of the sub-conductive vias extends through at least a portion of the first dielectric layers, and at least one integrated circuit is electrically connected to the sub-conducting vias. In the present embodiment, the conductive via 646 includes a sub-conducting via 646a and a sub-conducting via 646b. The sub-conducting vias 646a and the sub-conducting vias 646b extend through the first dielectric layer 144a, the first dielectric layer 144b, and the first dielectric layer 144c, and the integrated circuits (not shown) and the sub-conducting vias 646a and sub- The conductive through holes 646b are electrically connected.

In this embodiment, the circuit layer group further includes a plurality of electrodes 649. Each electrode 649 is disposed between two adjacent first dielectric layers penetrated by a conductive via 646, such as between the adjacent first dielectric layer 144b and the first dielectric layer 144c. In addition, each of the conductive vias 646 extends through an electrode 649. Specifically, the area of each electrode 649 is larger than the sum of the cross-sectional areas of the sub-conducting vias 646a and the sub-conducting vias 646b among the conductive vias 646 of the through electrodes 649. In addition, the circuit layer group further includes a plurality of shielding layers, and each shielding layer is disposed between the adjacent two first dielectric layers. Specifically, a shielding layer may be disposed between the adjacent two first dielectric layers, for example, between the adjacent first dielectric layer 144b and the first dielectric layer 144c, and the shielding layer is located at the electrodes 649. Outside the area. The shielding layer can avoid interference of signals transmitted in the circuit layer group. In this embodiment, since each of the conductive vias 646 is connected to an electrode 649 having a large area, and the electrode 649 is located between the adjacent two first dielectric layers, when these When a dielectric layer has a large relative displacement, these sub-conductive vias maintain their connection to the electrode 649 without causing an open circuit. That is to say, when the flexible electronic device of the embodiment is bent, the conductive through holes 646 are less likely to form an open circuit.

FIG. 7A is a schematic cross-sectional view of a flexible electronic device according to still another embodiment of the present invention. Please refer to FIG. 7A. In the present embodiment, the flexible electronic device 700a is similar to the flexible electronic device 100a of the embodiment of FIGS. 1A-1B. For the components of the flexible electronic device 700a and the related description, reference may be made to the flexible electronic device 100a of the embodiment of FIG. 1A to FIG. 1B, and details are not described herein again. The flexible electronic device 700a is different from the flexible electronic device 100a in that the flexible electronic device 700a further includes an interposer 750 disposed between the at least one integrated circuit 132 and the circuit layer set 740. In the present embodiment, circuit layer set 740 includes a plurality of conductive vias 746. The conductive vias 746 extend through at least a portion of the at least one first dielectric layer to communicate at least a portion of the circuit layers. Specifically, the conductive vias 746 extend through at least a portion of the first dielectric layer 144a, the first dielectric layer 144b, the first dielectric layer 144c, and the first dielectric layer 144d to communicate the circuit layers 142a and 142b. At least a portion of circuit layer 142c, circuit layer 142d, and circuit layer 142e. In addition, the conductive vias 746 extend through the interposer 750 and are electrically connected to the integrated circuit 132. In the present embodiment, the hardness of the interposer 750 is greater than the hardness of the first flexible substrate 110. Specifically, the material of the interposer 750 is, for example, Polyimide (PI), polyethylene terephthalate (PET) or other materials. In other embodiments, the interposer 750 may also be other materials, and the invention is not limited thereto.

In the present embodiment, the control element 730 of the flexible electronic device 700a is disposed on the surface S of the first flexible substrate 110. The integrated circuits 132 of the control element 730 are electrically connected to the electronic component 120 through the circuit layer set 740 and the conductive layer 124 of the electronic component 120, and at least a portion of the conductive layer 124 is identical to at least a portion of the circuit layer 142e of the circuit layer set 140. It is a layer of conductive material CML. Therefore, the flexible electronic device 700a is similar to the flexible electronic device 100a. The circuit of the flexible electronic device 700a is simplified, has good structural strength, and has a high degree of freedom in bending. Further, in general, the hardness of the first flexible substrate 110 and the hardness of the integrated circuit 132 are largely different. When the integrated circuit 132 is directly disposed on the first flexible substrate 110 through the circuit layer group 140, the wire between the integrated circuit 132 and the circuit layer group 140 is liable to be broken during the bending of the flexible electronic device. In contrast, since the flexible electronic device 700a includes the interposer 750, disposed between the at least one integrated circuit 132 and the circuit layer group 740, and the hardness of the interposer 750 is greater than the hardness of the first flexible substrate 110, therefore, the flexible electronic device The wire between the integrated circuit 132 of the 700a and the circuit layer group 140 is less likely to be broken during the bending of the flexible electronic device 700a.

7B-7F are schematic flow charts showing a method of manufacturing a flexible electronic device according to another embodiment of the present invention. In the present embodiment, the flexible electronic device 700b is similar to the flexible electronic device 700a of the embodiment of FIG. 7A. The components of the flexible electronic device 700b and related descriptions may refer to the flexible electronic device 700a of the embodiment of FIG. 7A. Specifically, the manufacturing method of the flexible electronic device 700b includes the following steps. Referring to FIG. 7B, first, a conductive material layer CML is formed on the surface S of the first flexible substrate 110. A portion of the conductive material layer CML is the conductive layer 124, and another portion of the conductive material layer CML is the circuit layer 142f of the circuit layer group of the control element 130 (the control element 130 as illustrated in FIG. 7F). Also, the electronic component 120 is formed on the surface S. Next, referring to FIGS. 7C through 7E, a first dielectric layer 144e is formed, and a plurality of conductive vias 746a' and a circuit layer 142g are formed. Next, an interposer 750 is formed over the circuit layer 142g. Further, these conductive vias 746a' are passed through the interposer 750. Next, referring to FIG. 7F, the control element 130 is formed on the surface S to form the flexible electronic device 700b. In particular, control element 130 includes at least one integrated circuit 132. The interposer 750 is between the integrated circuit 132 and the circuit layer set, and the hardness of the interposer 750 is greater than the hardness of the first flexible substrate 110.

FIG. 8A is a schematic cross-sectional view of a flexible electronic device according to another embodiment of the present invention. Please refer to FIG. 8A. In the present embodiment, the flexible electronic device 800a is similar to the flexible electronic device 100a of the embodiment of FIGS. 1A-1B. For the components of the flexible electronic device 800a and the related description, reference may be made to the flexible electronic device 100a of the embodiment of FIG. 1A to FIG. 1B, and details are not described herein again. The flexible electronic device 800a includes a first flexible substrate 810, an electronic component 820a, and a control component 830. Control element 830 includes at least one integrated circuit and circuit layer set 840. Specifically, the first flexible substrate 810, the electronic component 820a, the control component 830, and the circuit layer group 840 are similar to the first flexible substrate 110, the electronic component 120, the control component 130, and the circuit layer group of the embodiment of FIGS. 1A-1B, respectively. 140. The components of the first flexible substrate 810, the electronic component 820a, the control component 830, and the circuit layer group 840 and related descriptions may be referred to the related description of the corresponding components in the embodiment of FIG. 1A to FIG. 1B, and details are not described herein again.

In the present embodiment, the flexible electronic device 800a is different from the flexible electronic device 100a in that the electronic component 820a of the flexible electronic device 800a includes a first sub-electronic component 820a1 and a second sub-electronic component 820a2. The first sub-electronic component 820a1 is disposed between the second sub-electronic component 820a2 and the first flexible substrate 810. Specifically, the first sub-electronic component 820a1 is electrically connected to the conductive layer 824a, and the second sub-electronic component 820a2 is electrically connected to the conductive layer 824a. In this embodiment, the first sub-electronic component 820a1 is, for example, an active matrix organic light emitting diode display panel, and the second sub-electronic component 820a2 is, for example, a touch panel. The second sub-electronic component 820a2 is externally attached to the surface of the first sub-electronic component 820a1 to provide a function of the touch of the electronic component 820a. In addition, the second sub-electronic component 820a2 is electrically connected to the conductive layer 824a by the conductive material 826a. In the present embodiment, the conductive material 826a is, for example, an anisotropic conductive film (ACF). In other embodiments, the conductive material 826a may also be other types of conductive materials, and the invention is not limited thereto.

FIG. 8B is a cross-sectional view of a flexible electronic device according to still another embodiment of the present invention. Please refer to FIG. 8B. In the present embodiment, the flexible electronic device 800b is similar to the flexible electronic device 800a of the embodiment of FIG. 8A. For the components of the flexible electronic device 800b and the related description, reference may be made to the flexible electronic device 800a of the embodiment of FIG. 8A, and details are not described herein again. The flexible electronic device 800b is different from the flexible electronic device 800a in that the flexible electronic device 800b further includes a second flexible substrate 810b. The electronic component 820a of the flexible electronic device 800b includes a first sub-electronic component 820b1 and a second sub-electronic component 820b2. In this embodiment, the first sub-electronic component 820b1 is disposed on the surface S, the second sub-electronic component 820b2 is disposed on the second flexible substrate 810b, and the second sub-electronic component 820b2 is disposed on the first flexible substrate 810a and the second Between the flexible substrates 810b. In this embodiment, the first sub-electronic component 820b1 is, for example, a touch panel, and the second sub-electronic component 820b2 is, for example, an active matrix organic light-emitting diode display panel. The first sub-electronic component 820b1 and the second sub-electronic component 820b2 can be fabricated on the first flexible substrate 810a and the second flexible substrate 810b, respectively. The first flexible substrate 810a is electrically connected to the second flexible substrate 810b by the conductive material 826b. In particular, the control element 830 of the flexible electronic device 800b can drive and control the first sub-electronic component 820b1 and the second sub-electronic component 820b2.

FIG. 9 is a flow chart showing the steps of a method for manufacturing a flexible electronic device according to an embodiment of the present invention. Please refer to FIG. 9. The method of manufacturing the flexible electronic device can be applied at least to the embodiment of FIGS. 1A to 8B described above. The manufacturing method of the flexible electronic device is as follows. In step S900, a layer of conductive material is formed on the surface of the first flexible substrate. A portion of the layer of electrically conductive material is a conductive layer of the electronic component, and another portion of the layer of electrically conductive material is one of a plurality of circuit layers of the set of circuit layers of the control element. Next, in step S910, the circuit layers of the circuit layer group and the at least one first dielectric layer are formed, and at least a portion of the at least one first dielectric layer is sandwiched between the adjacent two circuit layers. Thereafter, in step S920, at least one integrated circuit of the control element is electrically connected to the electronic component through the circuit layer group and the conductive layer. Specifically, the method for manufacturing the flexible electronic device according to the embodiment of the present invention can be sufficiently taught, suggested, and implemented by the description of the embodiment of FIG. 1A to FIG. 8B, and thus will not be described again.

In summary, in the flexible electronic device and the method of manufacturing the same according to the embodiment of the invention, the control element is disposed on the surface of the first flexible substrate. At least one integrated circuit of the control element is electrically connected to the electronic component through the circuit layer group and the conductive layer of the electronic component. At least a portion of the conductive layer is integrally formed with at least a portion of a circuit layer of the circuit layer group, and the conductive layer and a circuit layer are disposed on the first flexible substrate. Therefore, the control element does not have to be fabricated on the unfoldable printed circuit board, and the control element does not need to be electrically connected to the electronic component by the flexible printed circuit board, so that the circuit of the flexible electronic device is simplified, the structure is strong, and the bending state is High degree of freedom.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.

100a, 100b, 100c, 100d, 300a, 300b, 400a, 400b, 500, 600, 700a, 700b, 800a, 800b‧‧‧‧soft electronic device
110, 410, 510, 810, 810a‧‧‧ first flexible substrate
120, 150, 320, 820a‧‧‧ electronic components
122‧‧‧ gate drive
124, 424, 524, 524a, 524b, 524c, 824a, 824b‧‧‧ conductive layer
130, 130', 430, 630, 730, 830‧‧‧ control elements
132, 132'‧‧‧ integrated circuits
132a‧‧‧Power supply
132b‧‧‧Central Processing Unit
32c‧‧‧RF device
132d‧‧‧image signal interface
132e‧‧‧Touch driver
132f‧‧‧Display drive
132g‧‧‧ drive control components
132h‧‧‧Signal transmission component
132i‧‧‧Power supply components
140, 440, 540, 640, 740, 840‧‧‧ circuit layer groups
142a, 142b, 142c, 142d, 142e, 142f, 142g, 142h, 142h', 142i, 142i', 142j, 142k, 442a, 442b, 442c, 442d, 442e, 442f, 442g, 442h, 542a, 542b, 542c, 542d‧‧‧ circuit layer
144a, 144b, 144c, 144d, 144e, 144f, 144f', 144g, 144g', 444a, 444b, 444c, 444d, 544a, 544b, 544c‧‧‧ first dielectric layer
146, 146a, 146b, 146c, 446, 446a, 546, 646, 746, 746a, 746a'‧‧‧ conductive through holes
326‧‧‧Second dielectric layer
512‧‧‧Bend
646a, 646b‧‧‧ child conductive through holes
648‧‧‧ Passive components
649‧‧‧electrode
750‧‧‧Intermediary
810b‧‧‧Second flexible substrate
820a1, 820b1‧‧‧ first sub-electronic components
820a2, 820b2‧‧‧ second sub-electronic components
826a, 826b‧‧‧ conductive materials
A, B‧‧‧ area
A-A'‧‧‧ line segment
CA‧‧‧Control element area
CML‧‧‧ conductive material layer
DML‧‧‧ dielectric material layer
EA‧‧‧Electronic component area
MK‧‧‧ photoresist
RC‧‧‧Rigid carrier
S, S1, S2‧‧‧ surface
S900, S910, S920‧‧‧ steps of the manufacturing method of the flexible electronic device
w‧‧‧Wire

FIG. 1A is a top view of a flexible electronic device according to an embodiment of the invention. 1B is a cross-sectional view of the flexible electronic device of the embodiment of FIG. 1A along line A-A'. 1C to 1F are schematic flow charts showing a method of manufacturing a flexible electronic device according to an embodiment of the present invention. 1G to 1J are schematic flow charts showing a method of manufacturing a flexible electronic device according to another embodiment of the present invention. FIG. 1K is a top view of a flexible electronic device according to another embodiment of the present invention. FIG. 1L is a schematic top view of a flexible electronic device according to still another embodiment of the present invention. 2A-2L are schematic diagrams showing the flow of manufacturing a control element on a first flexible substrate according to an embodiment of the invention. 3A is a schematic cross-sectional view of a flexible electronic device according to another embodiment of the present invention. 3B-3E are schematic flow charts showing a method of manufacturing a flexible electronic device according to still another embodiment of the present invention. 4A is a cross-sectional view showing a flexible electronic device according to still another embodiment of the present invention. 4B to 4F are schematic flow charts showing a method of manufacturing a flexible electronic device according to still another embodiment of the present invention. FIG. 5A is a schematic cross-sectional view of a flexible electronic device according to still another embodiment of the present invention. FIG. 5B is an enlarged schematic view of the flexible electronic device of the embodiment of FIG. 5A in the area A. 5C-5D illustrate implementations of the flexible electronic device in the region A corresponding to the embodiment of FIG. 5A in various embodiments of the present invention. 6A is a cross-sectional view of a flexible electronic device according to another embodiment of the present invention. 6B is a cross-sectional view showing a portion of a circuit layer group of a flexible electronic device according to still another embodiment of the present invention. 6C is an enlarged schematic view showing a portion of the circuit layer group of the embodiment of FIG. 6B in a region B. 7A is a cross-sectional view showing a flexible electronic device according to still another embodiment of the present invention. 7B-7F are schematic flow charts showing a method of manufacturing a flexible electronic device according to another embodiment of the present invention. FIG. 8A is a cross-sectional view of a flexible electronic device according to another embodiment of the present invention. 8B is a cross-sectional view of a flexible electronic device according to still another embodiment of the present invention. FIG. 9 is a flow chart showing the steps of a method of manufacturing a flexible electronic device according to an embodiment of the invention.

100a‧‧‧Soft electronic devices

110‧‧‧First flexible substrate

120‧‧‧Electronic components

122‧‧‧ gate drive

124‧‧‧ Conductive layer

130‧‧‧Control elements

132‧‧‧ integrated circuit

132b‧‧‧Central Processing Unit

132d‧‧‧image signal interface

132f‧‧‧Display drive

140‧‧‧Circuit layer group

142a, 142b, 142c, 142d, 142e‧‧‧ circuit layer

144a, 144b, 144c, 144d‧‧‧ first dielectric layer

146‧‧‧ Conductive through hole

A-A’‧‧‧ segment

CA‧‧‧Control element area

CML‧‧‧ conductive material layer

EA‧‧‧Electronic component area

S‧‧‧ surface

w‧‧‧Wire

Claims (28)

A flexible electronic device comprising: a first flexible substrate having a surface; an electronic component comprising a conductive layer; and a control component disposed on the surface, the control component comprising: at least one integrated circuit; a circuit layer group disposed between the at least one integrated circuit and the first flexible substrate, the circuit layer group having a plurality of circuit layers and at least one first dielectric layer, and at least one of the at least one first dielectric layer a portion of the circuit layer is interposed between the adjacent circuit layers, wherein the at least one integrated circuit is electrically connected to the electronic component through the circuit layer group, wherein at least a portion of the conductive layer and a circuit layer are At least a portion is integrally formed, and the conductive layer and the circuit layer are disposed on the first flexible substrate. The flexible electronic device of claim 1, wherein the circuit layer group includes a plurality of conductive vias, the conductive vias extending through at least a portion of the at least one first dielectric layer to communicate the circuit layers At least a portion of the integrated circuit is electrically connected to the conductive vias. The flexible electronic device of claim 2, wherein each of the conductive vias comprises a plurality of sub-conducting vias, and the at least one first dielectric layer is a plurality of first dielectric layers, each of the sub-conducting vias The at least one integrated circuit is electrically connected to the sub-conducting vias, wherein the circuit layer group further includes a plurality of electrodes, each of the electrodes being disposed on the conductive layer Between the two adjacent first dielectric layers through which the holes are formed, each of the conductive through holes penetrates through the electrode, and each of the electrodes has an area larger than the sub-conductive through holes of the conductive through holes extending through the electrode. The sum of the cross-sectional areas. The flexible electronic device of claim 3, wherein the circuit layer group further comprises a plurality of shielding layers, each of the shielding layers being disposed between two adjacent first dielectric layers. The flexible electronic device of claim 2, wherein the at least one first dielectric layer is a plurality of first dielectric layers, and the circuit layer group further comprises a passive component disposed adjacent to the first Between the dielectric layers, at least a portion of the conductive vias are electrically connected to the passive component. The flexible electronic device of claim 1, wherein the electronic component comprises a first sub-electronic component and a second sub-electronic component, wherein the first sub-electronic component is disposed in the second sub-electronic component and the first The first sub-electronic component is electrically connected to the conductive layer, and the second sub-electronic component is electrically connected to the conductive layer. The flexible electronic device of claim 1, further comprising a second flexible substrate, the electronic component comprising a first sub-electronic component and a second sub-electronic component, wherein the first sub-electronic component is disposed On the surface, the second sub-electronic component is disposed on the second flexible substrate, and the second sub-electronic component is disposed between the first flexible substrate and the second flexible substrate. The flexible electronic device of claim 1, wherein the electronic component further comprises at least one second dielectric layer, and the electronic component is disposed on the first flexible substrate by the at least one second dielectric layer . The flexible electronic device of claim 8, wherein the at least one second dielectric layer is disposed between the conductive layer and the first flexible substrate, or the conductive layer is disposed on the at least one second dielectric The layer is between the first flexible substrate. The flexible electronic device of claim 8, wherein the at least one second dielectric layer is a plurality of the second dielectric layers, and the conductive layer is disposed between the adjacent two second dielectric layers . The flexible electronic device of claim 1, wherein the first flexible substrate further comprises a bent portion, the bent portion is located between the electronic component and the control component, and the conductive layer is disposed in the bend The folded portion is configured to bend the first flexible substrate to be folded in half. The flexible electronic device of claim 1, further comprising a second flexible substrate disposed between the at least one integrated circuit and the circuit layer set, wherein the electronic component is disposed on the second flexible substrate On the surface of the at least one integrated circuit, wherein the circuit layer group includes a plurality of conductive vias, the conductive vias extending through at least a portion of the at least one first dielectric layer to communicate at least a portion of the circuit layers, The conductive vias are electrically connected to the second flexible substrate and electrically connected to the at least one integrated circuit. The flexible electronic device of claim 1, further comprising an interposer disposed between the at least one integrated circuit and the circuit layer set, the circuit layer set comprising a plurality of conductive vias, the conductive The through hole penetrates at least a portion of the at least one first dielectric layer to communicate with at least a portion of the circuit layers, and the conductive vias extend through the interposer and are electrically connected to the at least one integrated circuit, wherein the interposer The hardness is greater than the hardness of the first flexible substrate. The flexible electronic device of claim 1, wherein the at least one first dielectric layer is a flexible material. A method of manufacturing a flexible electronic device, comprising: forming a conductive material layer on a surface of a first flexible substrate, wherein a portion of the conductive material layer is a conductive layer of an electronic component, and another portion of the conductive material layer One of a plurality of circuit layers of a circuit layer group of a control element; the circuit layers forming the circuit layer group and at least one first dielectric layer, and at least a portion of the at least one first dielectric layer Between two adjacent circuit layers; and at least one integrated circuit of the control element is transmitted through the circuit layer set and the conductive layer is electrically connected to the electronic component. The method of manufacturing a flexible electronic device according to claim 15, further comprising: forming the electronic component on the surface; and forming the control component on the surface. The method of manufacturing a flexible electronic device according to claim 15, wherein the method of forming the conductive material layer on the surface of the first flexible substrate comprises: forming a release layer on a rigid carrier; forming the a first flexible substrate on the release layer; forming the conductive material layer on the surface of the first flexible substrate; and cutting the release layer to remove the release layer and the rigid carrier. The method of manufacturing a flexible electronic device according to claim 15, wherein the method of causing the at least one integrated circuit of the control element to pass through the circuit layer group and the conductive layer to be electrically connected to the electronic component comprises: forming a plurality of conductive vias, wherein the conductive vias extend through at least a portion of the at least one first dielectric layer to communicate at least a portion of the circuit layers; and electrically conductive the at least one integrated circuit and the conductive vias connection. The method of manufacturing a flexible electronic device according to claim 18, wherein each of the conductive vias comprises a plurality of sub-conducting vias, and the at least one first dielectric layer is a plurality of first dielectric layers, each of the sub-layers The conductive via penetrates at least a portion of the first dielectric layers, wherein the method of causing the at least one integrated circuit of the control element to pass through the circuit layer group and the conductive layer to be electrically connected to the electronic component comprises: forming a plurality of An electrode, each of the electrodes is formed between two adjacent first dielectric layers through which the conductive via is penetrating, and each of the conductive vias penetrates through the electrode, wherein each of the electrodes has an area larger than the conductive portion penetrating the electrode a sum of sectional areas of the sub-conducting through holes in the through holes; and electrically connecting the at least one integrated circuit to the sub-conductive through holes. The method for manufacturing a flexible electronic device according to claim 19, further comprising forming a plurality of shielding layers, each of the shielding layers being formed between the adjacent two first dielectric layers. The method of manufacturing a flexible electronic device according to claim 18, wherein the at least one first dielectric layer is a plurality of first dielectric layers, and the manufacturing method of the flexible electronic device further comprises: forming a passive component Adjacent to the first dielectric layer; and electrically connecting at least a portion of the conductive vias to the passive component. The method of manufacturing a flexible electronic device according to claim 16, wherein the electronic component comprises a first sub-electronic component and a second sub-electronic component, and the first sub-electronic component is disposed in the second sub-component Between the electronic component and the first flexible substrate, wherein the at least one integrated circuit of the control component is transmitted through the circuit layer set and the conductive layer is electrically connected to the electronic component: the first sub-electronic component is: Electrically connecting to the conductive layer; and electrically connecting the second sub-electronic component to the conductive layer. The method of manufacturing a flexible electronic device according to claim 16, wherein the electronic component comprises a first sub-electronic component and a second sub-electronic component, wherein the first sub-electronic component is disposed on the surface, The manufacturing method of the flexible electronic device further includes: forming a second flexible substrate; and forming the second sub-electronic component on the second flexible substrate, wherein the second sub-electronic component is located on the first flexible substrate and the second softness Between the substrates. The method for manufacturing a flexible electronic device according to claim 16, further comprising: forming at least one second dielectric layer, wherein the electronic component is disposed on the first flexible substrate by the at least one second dielectric layer The at least one second dielectric layer and the at least one first dielectric layer are simultaneously formed. The method of manufacturing a flexible electronic device according to claim 24, wherein the at least one second dielectric layer is formed between the conductive layer and the first flexible substrate, or the conductive layer is formed on the at least one Between the two dielectric layers and the first flexible substrate. The method of manufacturing a flexible electronic device according to claim 24, wherein the at least one second dielectric layer is a plurality of the second dielectric layers, and the conductive layer is formed adjacent to the second dielectric Between the layers. The method of manufacturing a flexible electronic device according to claim 15, further comprising: forming a second flexible substrate between the at least one integrated circuit and the circuit layer group; and forming the electronic component in the second The flexible substrate faces the surface of the at least one integrated circuit, wherein the at least one integrated circuit of the control element is transmitted through the circuit layer set and the conductive layer is electrically connected to the electronic component comprises: forming a plurality of conductive a through hole, wherein the conductive vias penetrate at least a portion of the at least one first dielectric layer, and the conductive vias penetrate the second flexible substrate; and the conductive vias are connected to at least a portion of the circuit layers And electrically connecting the conductive vias to the at least one integrated circuit. The method for manufacturing a flexible electronic device according to claim 15, further comprising: forming an interposer between the at least one integrated circuit and the circuit layer set, wherein the interposer has a hardness greater than the first softness The hardness of the substrate, the at least one integrated circuit of the control element is transmitted through the circuit layer set, and the conductive layer is electrically connected to the electronic component, and the method includes: forming a plurality of conductive through holes, wherein the conductive through holes penetrate the At least a portion of the first dielectric layer, and the conductive vias extend through the interposer; and the conductive vias are connected to at least a portion of the circuit layers, and the conductive vias and the at least one product The body circuit is electrically connected.