TWI595996B - Injection molding machine and injection molding method - Google Patents

Injection molding machine and injection molding method Download PDF

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TWI595996B
TWI595996B TW103132398A TW103132398A TWI595996B TW I595996 B TWI595996 B TW I595996B TW 103132398 A TW103132398 A TW 103132398A TW 103132398 A TW103132398 A TW 103132398A TW I595996 B TWI595996 B TW I595996B
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block
mold
injection molding
adsorption
movable
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TW103132398A
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TW201529277A (en
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Takaaki Morie
Hiroshi Morita
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Sumitomo Heavy Industries
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Description

射出成形機及射出成形方法 Injection molding machine and injection molding method

本發明係有關一種射出成形機及射出成形方法。 The present invention relates to an injection molding machine and an injection molding method.

射出成形機係進行模具裝置的閉模、合模及開模。模具裝置例如由固定模及可動模構成。在合模狀態的固定模與可動模之間形成有模穴空間,在模穴空間中填充有成形材料。填充於模穴空間中之成形材料被硬化並在開模後作為成形品被頂出。 The injection molding machine performs mold closing, mold clamping, and mold opening of the mold apparatus. The mold device is composed of, for example, a fixed mold and a movable mold. A cavity space is formed between the fixed mold and the movable mold in the mold clamping state, and the molding material is filled in the cavity space. The molding material filled in the cavity space is hardened and ejected as a molded article after the mold is opened.

射出成形機具有例如藉由電磁鐵之吸附力產生合模力之合模力產生部(例如參閱專利文獻1)。合模力產生部包括吸附力起作用之第1塊及第2塊。合模時,在第1塊與第2塊之間形成間隙,第1塊和第2塊並不接觸。 The injection molding machine has a mold clamping force generating portion that generates a mold clamping force by an adsorption force of an electromagnet (for example, see Patent Document 1). The mold clamping force generation unit includes a first block and a second block in which the suction force acts. When the mold is closed, a gap is formed between the first block and the second block, and the first block and the second block are not in contact with each other.

(先前技術文獻) (previous technical literature) (專利文獻) (Patent Literature)

專利文獻1:國際公開第2005/090052號 Patent Document 1: International Publication No. 2005/090052

為了抑制由吸附力產生力矩時的變形,第1塊的支撐構件及第2塊的支撐構件具有較高之剛性。 In order to suppress deformation when a moment is generated by the adsorption force, the support member of the first block and the support member of the second block have high rigidity.

本發明是鑑於上述課題而完成的,其主要目的在於提供一種能夠降低第1塊的支撐構件及第2塊的支撐構件中的至少一個的剛性之射出成形機。 The present invention has been made in view of the above circumstances, and a main object thereof is to provide an injection molding machine capable of reducing rigidity of at least one of a support member of a first block and a support member of a second block.

為了解決上述課題,依本發明的一樣態,提供一種射出成形機,其具有:藉由電磁鐵之吸附力產生合模力的合模力產生部,該合模力產生部包括前述吸附力起作用之第1塊及第2塊,前述第1塊僅在與前述第2塊相對向部分的一部分具有至少在合模時與前述第2塊接觸之接觸部。 In order to solve the above problems, according to the present invention, there is provided an injection molding machine comprising: a mold clamping force generating portion that generates a mold clamping force by an adsorption force of an electromagnet, wherein the mold clamping force generating portion includes the aforementioned suction force In the first block and the second block, the first block has a contact portion that contacts the second block at least in a part of the opposing portion of the second block.

依本發明的一樣態,提供一種能夠降低第1塊的支撐構件及第2塊的支撐構件中的至少一個的剛性之射出成形機。 According to the same aspect of the invention, an injection molding machine capable of reducing rigidity of at least one of the support member of the first block and the support member of the second block is provided.

10‧‧‧射出成形機 10‧‧‧ Injection molding machine

11‧‧‧框架 11‧‧‧Frame

12‧‧‧固定壓板 12‧‧‧Fixed platen

13‧‧‧可動壓板 13‧‧‧ movable platen

15‧‧‧後壓板 15‧‧‧ rear platen

15a‧‧‧接觸部 15a‧‧‧Contacts

15b‧‧‧非接觸部 15b‧‧‧ Non-contact department

18‧‧‧吸附板 18‧‧‧Adsorption plate

18a‧‧‧接觸部 18a‧‧‧Contacts

18b‧‧‧非接觸部 18b‧‧‧ Non-contact department

19‧‧‧連桿 19‧‧‧ Connecting rod

21‧‧‧線性馬達 21‧‧‧Linear motor

24‧‧‧合模力產生部 24‧‧‧Molding force generation department

25‧‧‧電磁鐵 25‧‧‧Electromagnet

26‧‧‧吸附部 26‧‧‧Adsorption Department

27‧‧‧線圈 27‧‧‧ coil

28‧‧‧槽 28‧‧‧ slots

29‧‧‧磁芯 29‧‧‧ magnetic core

第1圖係表示本發明的一實施形態之射出成形機的開模結束時的狀態之圖。 Fig. 1 is a view showing a state at the time of completion of mold opening of the injection molding machine according to the embodiment of the present invention.

第2圖係表示本發明的一實施形態之射出成形機的閉模結束時的狀態之圖。 Fig. 2 is a view showing a state at the time of completion of mold closing of the injection molding machine according to the embodiment of the present invention.

第3圖係表示本發明的一實施形態之射出成形機的合模時的狀態之圖。 Fig. 3 is a view showing a state at the time of mold clamping of the injection molding machine according to the embodiment of the present invention.

第4圖係表示第1變形例之合模力產生部的合模時的狀態之圖。 Fig. 4 is a view showing a state at the time of mold clamping of the mold clamping force generating portion of the first modification.

第5圖係表示第2變形例之合模力產生部的合模時的狀態之圖。 Fig. 5 is a view showing a state at the time of mold clamping of the mold clamping force generating portion of the second modification.

第6圖係表示第3變形例之合模力產生部的合模時的狀態之圖。 Fig. 6 is a view showing a state at the time of mold clamping of the mold clamping force generating portion of the third modification.

以下,參閱附圖對本發明的實施形態進行說明,在各附圖中,對於相同或相應之結構標註相同或相應之元件符號並省略說明。並且,將閉模時的可動壓板的移動方向設為前方,將開模時的可動壓板的移動方向設為後方來進行說明。 In the following, the embodiments of the present invention will be described with reference to the accompanying drawings, in which the same or corresponding components are designated by the same or corresponding elements, and the description is omitted. In addition, the moving direction of the movable platen at the time of mold closing is set to the front, and the moving direction of the movable platen at the time of mold opening is set to the rear.

第1圖係表示本發明的一實施形態之射出成形機的開模結束時的狀態之圖。第2圖係表示本發明的一實施形態之射出成形機的閉模結束時的狀態之圖。第3圖係表示本發明的一實施形態之射出成形機的合模時的狀態之圖。 Fig. 1 is a view showing a state at the time of completion of mold opening of the injection molding machine according to the embodiment of the present invention. Fig. 2 is a view showing a state at the time of completion of mold closing of the injection molding machine according to the embodiment of the present invention. Fig. 3 is a view showing a state at the time of mold clamping of the injection molding machine according to the embodiment of the present invention.

射出成形機10具有框架11、固定壓板12、可動壓板13、後壓板15、吸附板18、連桿19及作為模開閉驅動部的線性馬達21。後壓板15相當於申請專利範圍中記載的 固定構件,吸附板18相當於申請專利範圍中記載的可動構件。 The injection molding machine 10 has a frame 11, a fixed platen 12, a movable platen 13, a rear platen 15, an adsorption plate 18, a link 19, and a linear motor 21 as a die opening and closing drive unit. The rear platen 15 corresponds to the one described in the patent application scope. The fixing member and the suction plate 18 correspond to the movable member described in the patent application.

固定壓板12經由固定壓板支撐構件42進退自如地載置於框架11上。在固定壓板12中與可動壓板13相對向的面安裝有固定模32。 The fixed platen 12 is placed on the frame 11 in a retractable manner via the fixed platen support member 42. A fixed mold 32 is attached to a surface of the fixed platen 12 that faces the movable platen 13.

另外,固定壓板12可以經由固定壓板支撐構件42固定於導引塊,導引塊可以沿著舖設於框架11上之導件移動自如。固定壓板12的導件可以與可動壓板13的導件共用。此時,固定壓板12與可動壓板13獨立地沿著導件移動自如。 In addition, the fixed platen 12 may be fixed to the guide block via the fixed platen support member 42, and the guide block may be freely movable along the guide member laid on the frame 11. The guide of the fixed platen 12 can be shared with the guide of the movable platen 13. At this time, the fixed platen 12 and the movable platen 13 are freely movable along the guide.

可動壓板13經由可動壓板支撐構件43固定於導引塊14,導引塊14沿著舖設於框架11上之導件(例如導軌)17移動自如。由此,可動壓板13相對於固定壓板12進退自如。在可動壓板13中與固定壓板12相對向的面安裝有可動模33。 The movable platen 13 is fixed to the guide block 14 via the movable platen supporting member 43, and the guide block 14 is freely movable along a guide (for example, a guide rail) 17 laid on the frame 11. Thereby, the movable platen 13 can move forward and backward with respect to the fixed platen 12. A movable mold 33 is attached to a surface of the movable platen 13 that faces the fixed platen 12.

藉由使可動壓板13相對於固定壓板12進退來進行閉模、合模及開模。由固定模32和可動模33構成模具裝置30。 The mold closing, the mold clamping, and the mold opening are performed by advancing and retracting the movable platen 13 with respect to the fixed platen 12. The mold device 30 is constituted by the fixed mold 32 and the movable mold 33.

後壓板15藉由複數根(例如4根)繫桿16與固定壓板12連結。後壓板15配設於可動壓板13與吸附板18之間,經由後壓板支撐構件45固定於框架11。在後壓板15的中央部形成有貫穿孔,在該貫穿孔中插穿有連桿19。連桿19將可動壓板13和吸附板18連結。 The rear platen 15 is coupled to the fixed platen 12 by a plurality of (for example, four) tie rods 16. The rear platen 15 is disposed between the movable platen 13 and the suction plate 18, and is fixed to the frame 11 via the rear platen support member 45. A through hole is formed in a central portion of the rear platen 15, and a link 19 is inserted through the through hole. The link 19 connects the movable platen 13 and the suction plate 18.

另外,在本實施形態中,固定壓板12相對於框架11 進退自如,後壓板15相對於框架11被固定,但亦可以設為後壓板15相對於框架11進退自如,固定壓板12相對於框架11被固定。 Further, in the present embodiment, the fixed platen 12 is fixed relative to the frame 11 The rear platen 15 is fixed relative to the frame 11, but the rear platen 15 can be moved forward and backward with respect to the frame 11, and the fixed platen 12 is fixed relative to the frame 11.

吸附板18藉由連桿19與可動壓板13連結,並且與可動壓板13一同移動。吸附板18經由吸附板支撐構件48固定於滑動底座20,滑動底座20沿著舖設於框架11上之導件17移動自如。由此,吸附板18在比後壓板15更靠後方進退自如。 The suction plate 18 is coupled to the movable platen 13 by the link 19, and moves together with the movable platen 13. The suction plate 18 is fixed to the slide base 20 via the suction plate support member 48, and the slide base 20 is freely movable along the guide 17 laid on the frame 11. Thereby, the adsorption plate 18 can move forward and backward further than the rear platen 15.

線性馬達21使藉由連桿19連結之可動壓板13及吸附板18相對於框架11移動。線性馬達21例如配設於吸附板18與框架11之間,由線性馬達21產生之推動力經由吸附板18傳遞至可動壓板13。 The linear motor 21 moves the movable platen 13 and the suction plate 18 connected by the link 19 with respect to the frame 11. The linear motor 21 is disposed, for example, between the suction plate 18 and the frame 11, and the urging force generated by the linear motor 21 is transmitted to the movable platen 13 via the adsorption plate 18.

另外,線性馬達21亦可以配設於可動壓板13與框架11之間,由線性馬達21產生之推動力亦可以經由可動壓板13傳遞至吸附板18。 Further, the linear motor 21 may be disposed between the movable platen 13 and the frame 11, and the urging force generated by the linear motor 21 may be transmitted to the adsorption plate 18 via the movable platen 13.

線性馬達21包括定子22及轉子子23。定子22形成於框架11,轉子23形成於滑動底座20。若向轉子23的線圈供給規定的電流,則藉由由流過線圈之電流形成之磁場與由定子22的永久磁鐵形成之磁場的相互作用,能夠使轉子23進退。其結果,吸附板18及可動壓板13相對於框架11進退,從而進行閉模及開模。另外,亦可以將線圈與永久磁鐵的配置互換,並且,亦可以使用其他線圈來代替永久磁鐵。 The linear motor 21 includes a stator 22 and a rotor sub 23 . The stator 22 is formed on the frame 11, and the rotor 23 is formed on the slide base 20. When a predetermined current is supplied to the coil of the rotor 23, the rotor 23 can advance and retreat by the interaction of the magnetic field formed by the current flowing through the coil and the magnetic field formed by the permanent magnet of the stator 22. As a result, the suction plate 18 and the movable platen 13 advance and retreat with respect to the frame 11, thereby performing mold closing and mold opening. Alternatively, the arrangement of the coil and the permanent magnet may be interchanged, and other coils may be used instead of the permanent magnet.

另外,作為模開閉驅動部,例如亦可以使用包括旋轉 馬達及將旋轉馬達的旋轉運動轉換為直線運動之滾珠螺桿之驅動單元、或油壓缸等流體壓缸來代替線性馬達21。 In addition, as the mold opening and closing drive unit, for example, it is also possible to use rotation including The motor and the fluid pressure cylinder that converts the rotary motion of the rotary motor into a linear motion ball screw or a hydraulic cylinder are used instead of the linear motor 21.

合模力產生部24由後壓板15及吸附板18構成,藉由電磁鐵25之吸附力產生合模力。後壓板15及吸附板18中的一個相當於申請專利範圍中記載的第1塊,另一個相當於申請專利範圍中記載的第2塊。第1塊與第2塊相對地進退自如。 The mold clamping force generating portion 24 is composed of a rear pressure plate 15 and an adsorption plate 18, and generates a mold clamping force by the adsorption force of the electromagnet 25. One of the rear platen 15 and the suction plate 18 corresponds to the first block described in the patent application, and the other corresponds to the second block described in the patent application. The first block and the second block are relatively easy to move forward and backward.

後壓板15的吸附面(後端面)的規定部分,例如連桿19的周圍形成有收容電磁鐵25的線圈27的槽28,並且在槽28的內側形成有電磁鐵25的磁芯29。吸附部26形成於包圍吸附板18的吸附面(前端面)的規定部分,例如連桿19,並且與電磁鐵25相對向之部分。若向電磁鐵25的線圈27供給電流,則在電磁鐵25與吸附部26之間產生吸附力,從而產生合模力。磁芯29和吸附部26可以由鐵等磁性材料形成。 A predetermined portion of the suction surface (rear end surface) of the rear platen 15, for example, a groove 28 for accommodating the coil 27 of the electromagnet 25 is formed around the link 19, and a magnetic core 29 of the electromagnet 25 is formed inside the groove 28. The adsorption unit 26 is formed in a predetermined portion surrounding the adsorption surface (front end surface) of the adsorption plate 18, for example, the link 19, and is opposed to the electromagnet 25. When a current is supplied to the coil 27 of the electromagnet 25, an adsorption force is generated between the electromagnet 25 and the adsorption portion 26, and a mold clamping force is generated. The magnetic core 29 and the adsorption portion 26 may be formed of a magnetic material such as iron.

另外,本實施形態的電磁鐵25作為後壓板15的一部分而形成,但亦可以與後壓板15分體形成。並且,本實施形態的吸附部26作為吸附板18的一部分而形成,但亦可以與吸附板18分體形成。並且,亦可以將電磁鐵25與吸附部26的配置互換。亦即,可以在吸附板18側形成電磁鐵25,在後壓板15側形成吸附部26。並且,亦可以在後壓板15側和吸附板18側這兩側形成電磁鐵。並且,還可以在後壓板15側和吸附板18側中的至少一側形成複數個電磁鐵。構成合模力產生部之複數個電磁鐵可以分別進 行控制。 Further, although the electromagnet 25 of the present embodiment is formed as a part of the rear platen 15, it may be formed separately from the rear platen 15. Further, the adsorption unit 26 of the present embodiment is formed as a part of the adsorption plate 18, but may be formed separately from the adsorption plate 18. Further, the arrangement of the electromagnet 25 and the adsorption unit 26 may be interchanged. That is, the electromagnet 25 can be formed on the side of the adsorption plate 18, and the adsorption portion 26 can be formed on the side of the rear platen 15. Further, an electromagnet may be formed on both sides of the rear platen 15 side and the suction plate 18 side. Further, a plurality of electromagnets may be formed on at least one of the rear platen 15 side and the suction plate 18 side. The plurality of electromagnets constituting the mold clamping force generating portion can be separately entered Line control.

接著,對使用上述結構的射出成形機10之射出成形方法進行說明。射出成形方法具有閉模製程、合模製程及開模製程。 Next, an injection molding method using the injection molding machine 10 having the above configuration will be described. The injection molding method has a mold closing process, a mold clamping process, and a mold opening process.

在閉模製程中,驅動線性馬達21而使可動壓板13前進。如第2圖所示,藉由可動模33與固定模32接觸來結束閉模。在閉模結束的時刻,在後壓板15與吸附板18之間,即電磁鐵25與吸附部26之間可以形成規定的間隙δ。 In the mold closing process, the linear motor 21 is driven to advance the movable platen 13. As shown in Fig. 2, the mold closing is completed by the movable mold 33 coming into contact with the fixed mold 32. At the time when the mold closing is completed, a predetermined gap δ can be formed between the rear platen 15 and the adsorption plate 18, that is, between the electromagnet 25 and the adsorption portion 26.

在合模製程中,驅動電磁鐵25而使電磁鐵25與吸附部26之間產生吸附力。藉由該吸附力,在可動壓板13與固定壓板12之間產生合模力。在合模狀態的固定模32與可動模33之間形成模穴空間,在模穴空間填充成形材料(例如熔融樹脂)。填充於模穴空間之成形材料被硬化而成為成形品。 In the mold clamping process, the electromagnet 25 is driven to generate an adsorption force between the electromagnet 25 and the adsorption portion 26. By the suction force, a mold clamping force is generated between the movable platen 13 and the fixed platen 12. A cavity space is formed between the fixed mold 32 and the movable mold 33 in the mold clamping state, and a molding material (for example, molten resin) is filled in the cavity space. The molding material filled in the cavity space is hardened to become a molded article.

在開模製程中,驅動線性馬達21而使可動壓板13後退。開模結束後,成形品從模具裝置30被頂出。 In the mold opening process, the linear motor 21 is driven to retract the movable platen 13. After the mold opening is completed, the molded article is ejected from the mold device 30.

接著,再次參閱第1圖~第3圖對合模力產生部24進行詳細說明。後壓板15及吸附板18配設於框架11的一側(第3圖中為上側)。 Next, the mold clamping force generation unit 24 will be described in detail with reference to FIGS. 1 to 3 again. The rear platen 15 and the suction plate 18 are disposed on one side of the frame 11 (upper side in Fig. 3).

電磁鐵25的磁通量朝向容易通過之一側。由於框架11具有高於空氣之磁導率,因此會破壞磁通量密度的平衡,從而破壞了吸附力的平衡。具體而言,在後壓板15與吸附板18之間,上部的吸附力強於下部的吸附力。由 此,在後壓板15及吸附板18產生力矩。 The magnetic flux of the electromagnet 25 is easily passed through one side. Since the frame 11 has a magnetic permeability higher than that of air, the balance of the magnetic flux density is broken, thereby breaking the balance of the adsorption force. Specifically, between the rear platen 15 and the adsorption plate 18, the adsorption force of the upper portion is stronger than the adsorption force of the lower portion. by Thus, a moment is generated in the rear platen 15 and the suction plate 18.

因此,後壓板15僅在與吸附板18相對向部分的一部分具有至少在合模時與吸附板18接觸之接觸部15a。該接觸部15a僅形成於後壓板15中與吸附板18相對向部分中與框架11為相反側的端部(第3圖中為上端部)。後壓板15在與吸附板18相對向部分的其餘部分具有非接觸部15b。 Therefore, the rear platen 15 has the contact portion 15a which is in contact with the adsorption plate 18 at least at the time of mold clamping only in a portion of the portion opposite to the adsorption plate 18. The contact portion 15a is formed only at an end portion (upper end portion in Fig. 3) on the opposite side of the frame 11 from the suction plate 18 in the rear platen 15. The rear platen 15 has a non-contact portion 15b at the remaining portion of the portion opposite to the suction plate 18.

同樣地,吸附板18僅在與後壓板15相對向部分的一部分具有至少在合模時與後壓板15接觸之接觸部18a。該接觸部18a僅形成於吸附板18中與後壓板15相對向部分中與框架11為相反側的端部(第3圖中為上端部)。吸附板18在與後壓板15相對向部分的其餘部分具有非接觸部18b。 Similarly, the suction plate 18 has a contact portion 18a which is in contact with the rear platen 15 at least at the time of mold clamping only in a portion of the portion opposite to the rear platen 15. The contact portion 18a is formed only at an end portion (upper end portion in Fig. 3) opposite to the frame 11 in the opposing portion of the suction plate 18 and the rear platen 15. The suction plate 18 has a non-contact portion 18b at the remaining portion of the portion opposite to the rear platen 15.

依本實施形態,第1塊和第2塊在合模時接觸,後壓板15的接觸部15a和吸附板18的接觸部18a在合模時接觸。因此,產生推斥力,從而能夠抵消由吸附力的平衡失衡產生之力矩。藉此,施加於後壓板支撐構件45和吸附板支撐構件48之負擔較少,從而能夠降低後壓板支撐構件45和吸附板支撐構件48的剛性。並且,吸附力的平衡失衡難以導致合模力的平衡失衡,容易保持合模力的平衡。 According to the present embodiment, the first block and the second block are in contact at the time of mold clamping, and the contact portion 15a of the rear platen 15 and the contact portion 18a of the suction plate 18 are in contact with each other at the time of mold clamping. Therefore, a repulsive force is generated, so that the moment generated by the equilibrium imbalance of the adsorption force can be cancelled. Thereby, the burden applied to the rear platen supporting member 45 and the suction plate supporting member 48 is small, so that the rigidity of the rear platen supporting member 45 and the suction plate supporting member 48 can be reduced. Moreover, the imbalance of the adsorption force is difficult to cause the balance of the mold clamping force to be unbalanced, and it is easy to maintain the balance of the mold clamping force.

另外,本實施形態中之吸附力的平衡失衡之原因在於框架11的存在,但其原因亦可多種多樣。例如,當吸附力在後壓板15與吸附板18之間起作用時,由於吸附板支 撐構件48的下端部被限制,因此有時吸附板支撐構件48的上端部相對於吸附板支撐構件48的下端部會向前方位移,使吸附板支撐構件48前傾。如此一來,吸附板18前傾,吸附板18與後壓板15的間隙變得不均一,從而吸附力的平衡失衡。由於相同的原因,亦會有因後壓板15之後傾導致吸附力的平衡失衡之情況。在下述的第1變形例~第3變形例中相同。 Further, the cause of the imbalance in the adsorption force in the present embodiment is the presence of the frame 11, but the reason may be various. For example, when the adsorption force acts between the rear platen 15 and the adsorption plate 18, due to the adsorption plate branch Since the lower end portion of the stay member 48 is restricted, the upper end portion of the suction-plate supporting member 48 may be displaced forward with respect to the lower end portion of the suction-plate supporting member 48, and the suction-plate supporting member 48 may be tilted forward. As a result, the adsorption plate 18 is tilted forward, and the gap between the adsorption plate 18 and the rear pressure plate 15 becomes uneven, so that the balance of the adsorption force is unbalanced. For the same reason, there is also a situation in which the balance of the adsorption force is unbalanced due to the backward tilting of the rear platen 15. The same applies to the first to third modifications described below.

後壓板15的接觸部15a和吸附板18的接觸部18a只要在合模時接觸即可,閉模結束時可以不接觸。當閉模結束時,後壓板15的吸附面及吸附板18的吸附面可以相對於模開閉方向為垂直。因吸附力的平衡失衡,後壓板15及吸附板18中的至少一個(第3圖中為吸附板18)會發生變形,由此接觸部15a和接觸部18a能夠進行接觸。 The contact portion 15a of the rear platen 15 and the contact portion 18a of the suction plate 18 may be contacted at the time of mold clamping, and may not be in contact at the end of mold closing. When the mold closing is completed, the adsorption surface of the rear platen 15 and the adsorption surface of the adsorption plate 18 may be perpendicular to the mold opening and closing direction. Due to the imbalance of the adsorption force, at least one of the rear platen 15 and the adsorption plate 18 (the adsorption plate 18 in Fig. 3) is deformed, whereby the contact portion 15a and the contact portion 18a can make contact.

可以較窄地設定閉模結束時的間隙δ,以便在合模時使後壓板15的接觸部15a和吸附板18的接觸部18a接觸。間隙δ越窄,磁阻越小,能夠以較少之電力產生規定的合模力。 The gap δ at the end of the mold closing can be set narrowly so as to bring the contact portion 15a of the rear platen 15 into contact with the contact portion 18a of the suction plate 18 at the time of mold clamping. The narrower the gap δ, the smaller the magnetic resistance, and the ability to generate a prescribed mold clamping force with less power.

另一方面,合模時在後壓板15的非接觸部15b與吸附板18的非接觸部18b之間形成間隙。由於吸附面只有一部分接觸,因此藉由接觸而產生之推斥力小於吸附力,能夠產生規定的合模力。 On the other hand, a gap is formed between the non-contact portion 15b of the rear platen 15 and the non-contact portion 18b of the suction plate 18 at the time of mold clamping. Since only a part of the adsorption surface is in contact, the repulsive force generated by the contact is smaller than the adsorption force, and a predetermined mold clamping force can be generated.

另外,在本實施形態中,後壓板15的接觸部15a和吸附板18的接觸部18a在閉模結束時不接觸,但亦可以在閉模結束時接觸。例如,有時會有吸附板支撐構件48 因作用於吸附板18之重力而撓曲,從而吸附板18前傾之情況。因此,吸附板18的一部分和後壓板15的一部分亦可以在閉模結束時接觸。同樣地,後壓板15會因後壓板支撐構件45之撓曲而後傾,從而後壓板15的一部分和吸附板18的一部分亦可以進行接觸。在下述的第1變形例~第3變形例中相同。 Further, in the present embodiment, the contact portion 15a of the rear platen 15 and the contact portion 18a of the suction plate 18 are not in contact at the end of the mold closing, but they may be in contact at the end of the mold closing. For example, there may be an adsorption plate support member 48 It is deflected by the gravity acting on the adsorption plate 18, so that the adsorption plate 18 is tilted forward. Therefore, a part of the suction plate 18 and a part of the rear pressure plate 15 can also be contacted at the end of the mold closing. Similarly, the rear platen 15 is tilted backward by the deflection of the rear platen support member 45, so that a portion of the rear platen 15 and a portion of the suction plate 18 can also be brought into contact. The same applies to the first to third modifications described below.

另外,本實施形態的接觸部15a作為後壓板15的一部分而形成,但亦可以與後壓板15分體形成。此時,由後壓板15和接觸部15a構成固定塊,固定塊相當於申請專利範圍中記載的第1塊及第2塊中的任一個。此時,接觸部15a可以由鐵等磁性材料、樹脂等非磁性材料中的任一種形成。在下述的第1變形例~第3變形例中相同。 Further, the contact portion 15a of the present embodiment is formed as a part of the rear platen 15, but may be formed separately from the rear platen 15. At this time, the rear platen 15 and the contact portion 15a constitute a fixed block, and the fixed block corresponds to any one of the first block and the second block described in the patent application. At this time, the contact portion 15a may be formed of any one of a magnetic material such as iron or a non-magnetic material such as a resin. The same applies to the first to third modifications described below.

同樣地,本實施形態的接觸部18a作為吸附板18的一部分而形成,但亦可以與吸附板18分體形成。此時,由吸附板18和接觸部18a構成可動塊,可動塊相當於申請專利範圍中記載的第1塊及第2塊中的任一個。此時,接觸部18a可以由磁性材料、非磁性材料中的任意一種形成。在下述的第1變形例~第3變形例中相同。 Similarly, the contact portion 18a of the present embodiment is formed as a part of the adsorption plate 18, but may be formed separately from the adsorption plate 18. At this time, the adsorption plate 18 and the contact portion 18a constitute a movable block, and the movable block corresponds to any one of the first block and the second block described in the patent application. At this time, the contact portion 18a may be formed of any one of a magnetic material and a non-magnetic material. The same applies to the first to third modifications described below.

然而,依本實施形態,後壓板15的接觸部15a僅形成於後壓板15的端部。同樣地,吸附板18的接觸部18a僅形成於吸附板18的端部。在遠離力矩中心之位置產生推斥力,從而容易抵消力矩。力矩的中心和連桿19的中心距離框架11之高度可以相同。 However, according to the present embodiment, the contact portion 15a of the rear platen 15 is formed only at the end of the rear platen 15. Similarly, the contact portion 18a of the suction plate 18 is formed only at the end of the suction plate 18. A repulsive force is generated at a position away from the center of the moment, thereby easily canceling the moment. The center of the moment and the center of the link 19 may be the same height from the frame 11.

另外,在本實施形態中,後壓板15和吸附板18為大 致相同之大小,因此後壓板15和吸附板18的端部彼此在合模時接觸,但當後壓板15和吸附板18為不同大小時,其中一方的端部與另一方的一部分接觸即可。在下述的第1變形例~第3變形例中相同。 Further, in the present embodiment, the rear platen 15 and the suction plate 18 are large. The same size is obtained, so that the ends of the rear platen 15 and the suction plate 18 are in contact with each other when the mold is closed, but when the rear platen 15 and the suction plate 18 are of different sizes, one of the ends can be in contact with the other part. . The same applies to the first to third modifications described below.

並且,依本實施形態,後壓板15的接觸部15a僅形成於後壓板15的上端部。同樣地,吸附板18的接觸部18a僅形成於吸附板18的上端部。由於推斥力偏向連桿19的一側產生,因此與推斥力以連桿19為中心對稱地產生之情況相比,因推斥力引起之合模力下降較少。大部分吸附力能夠用作合模力,吸附力的利用效率良好。 Further, according to the present embodiment, the contact portion 15a of the rear platen 15 is formed only at the upper end portion of the rear platen 15. Similarly, the contact portion 18a of the suction plate 18 is formed only at the upper end portion of the suction plate 18. Since the repulsive force is generated on one side of the link 19, the mold clamping force is less reduced due to the repulsive force than when the repulsive force is generated symmetrically around the link 19. Most of the adsorption force can be used as a mold clamping force, and the utilization efficiency of the adsorption force is good.

另外,在本實施形態中,後壓板15的上端部和吸附板18的上端部接觸,但接觸部位可依吸附力的平衡失衡的情況適當地進行改變。例如,可以使後壓板15的下端部和吸附板18的下端部接觸。並且,亦可以使後壓板15的側端部和吸附板18的側端部接觸。另外,還可以使後壓板15的外周部和吸附板18的外周部接觸。在下述的第1變形例~第3變形例中相同。 Further, in the present embodiment, the upper end portion of the rear platen 15 is in contact with the upper end portion of the suction plate 18, but the contact portion can be appropriately changed depending on the balance of the adsorption force. For example, the lower end portion of the rear platen 15 may be brought into contact with the lower end portion of the suction plate 18. Further, the side end portion of the rear platen 15 may be brought into contact with the side end portion of the suction plate 18. Further, the outer peripheral portion of the rear platen 15 and the outer peripheral portion of the suction plate 18 may be brought into contact with each other. The same applies to the first to third modifications described below.

第4圖係表示第1變形例之合模力產生部的合模時的狀態之圖。第1變形例之吸附板18A的吸附面具有段差,隔著段差具有接觸部18Aa和非接觸部18Ab。藉由段差能夠劃分接觸部18Aa和非接觸部18Ab。接觸部18Aa及非接觸部18Ab可以是在閉模結束時相對於模開閉方向垂直的面。接觸部18Aa形成在相對於吸附板18A中與後壓板15相對向部分中與框架11為相反側的端部(第4圖中為 上端部)。 Fig. 4 is a view showing a state at the time of mold clamping of the mold clamping force generating portion of the first modification. The adsorption surface of the adsorption plate 18A of the first modification has a step, and has a contact portion 18Aa and a non-contact portion 18Ab via a step. The contact portion 18Aa and the non-contact portion 18Ab can be divided by the step. The contact portion 18Aa and the non-contact portion 18Ab may be surfaces that are perpendicular to the mold opening and closing direction at the end of mold closing. The contact portion 18Aa is formed at an end portion opposite to the frame 11 in the opposing portion of the suction plate 18A from the rear platen 15 (in FIG. 4 is Upper end).

依本變形例,後壓板15的接觸部15a和吸附板18A的接觸部18Aa至少在合模時接觸。因此,可以得到與上述實施形態相同的效果。 According to the present modification, the contact portion 15a of the rear platen 15 and the contact portion 18Aa of the suction plate 18A are in contact at least at the time of mold clamping. Therefore, the same effects as those of the above embodiment can be obtained.

另外,在本變形例中,在吸附板18A的吸附面形成段差,而在後壓板15的吸附面沒有形成段差,但亦可以在兩個吸附面或僅在後壓板15的吸附面形成段差。此時,後壓板15可以隔著段差具有接觸部15a和非接觸部15b。藉由段差能夠劃分接觸部15a和非接觸部15b。 Further, in the present modification, a step is formed on the adsorption surface of the adsorption plate 18A, and no step is formed on the adsorption surface of the rear platen 15, but a step may be formed on the two adsorption surfaces or only on the adsorption surface of the rear platen 15. At this time, the rear platen 15 may have the contact portion 15a and the non-contact portion 15b with a step difference therebetween. The contact portion 15a and the non-contact portion 15b can be divided by the step.

第5圖係表示第2變形例之合模力產生部的合模時的狀態之圖。第2變形例之吸附板18B的吸附面具有閉模結束時相對於模開閉方向垂直之垂直部、及閉模結束時相對於模開閉方向傾斜之傾斜部,且在傾斜部具有接觸部18Ba。接觸部18Ba形成為線狀或點狀且進行線接觸或點接觸,因此與面接觸之情況相比,接觸面積較小、推斥力較小、合模力較大。接觸部18Ba形成於吸附板18B中與後壓板15相對向部分中與框架11為相反側的端部(第5圖中為上端部)。非接觸部18Bb形成於傾斜部的一部分及垂直部。 Fig. 5 is a view showing a state at the time of mold clamping of the mold clamping force generating portion of the second modification. The adsorption surface of the adsorption plate 18B of the second modification has a vertical portion that is perpendicular to the mold opening and closing direction at the end of mold closing, and an inclined portion that is inclined with respect to the mold opening and closing direction at the end of mold closing, and has a contact portion 18Ba at the inclined portion. Since the contact portion 18Ba is formed in a line shape or a dot shape and is in line contact or point contact, the contact area is small, the repulsive force is small, and the mold clamping force is large as compared with the case of the surface contact. The contact portion 18Ba is formed at an end portion (upper end portion in Fig. 5) on the opposite side of the frame 11 from the opposing portion of the suction plate 18B and the rear platen 15. The non-contact portion 18Bb is formed in a part of the inclined portion and a vertical portion.

依本變形例,後壓板15的接觸部15a和吸附板18B的接觸部18Ba至少在合模時接觸。因此,可以得到與上述實施形態相同的效果。 According to the present modification, the contact portion 15a of the rear platen 15 and the contact portion 18Ba of the suction plate 18B are in contact at least at the time of mold clamping. Therefore, the same effects as those of the above embodiment can be obtained.

另外,本變形例的吸附板18B的吸附面局部具有傾斜部,但亦可以僅具有傾斜部。包含接觸部18Ba之傾斜部 可以與吸附板18B分體形成。 Further, the adsorption surface of the adsorption plate 18B of the present modification partially has an inclined portion, but may have only an inclined portion. Including the inclined portion of the contact portion 18Ba It can be formed separately from the adsorption plate 18B.

並且,本變形例的後壓板15的吸附面僅具有閉模結束時相對於模開閉方向垂直之垂直部,但亦可以具有閉模結束時相對於模開閉方向傾斜之傾斜部,且在傾斜部具有接觸部15a。當後壓板15的吸附面具有傾斜部時,吸附板18B的吸附面可以不具有傾斜部,亦可以只具有垂直部。 Further, the suction surface of the rear platen 15 of the present modification has only a vertical portion perpendicular to the mold opening and closing direction at the end of the mold closing, but may have an inclined portion that is inclined with respect to the mold opening and closing direction at the end of the mold closing, and may be inclined at the inclined portion. There is a contact portion 15a. When the adsorption surface of the rear platen 15 has an inclined portion, the adsorption surface of the adsorption plate 18B may have no inclined portion or may have only a vertical portion.

第6圖係表示第3變形例之合模力產生部的合模時的狀態之圖。第3變形例之後壓板15C具備具有吸附面之後壓板主體、及安裝於該後壓板主體之接觸部15Ca。該接觸部15Ca形成於後壓板15C中與吸附板18C相對向部分中與框架11為相反側的端部(第6圖中為上端部)。非接觸部15Cb為後壓板主體的整個吸附面。 Fig. 6 is a view showing a state at the time of mold clamping of the mold clamping force generating portion of the third modification. In the third modification, the pressure plate 15C includes a pressure plate main body having an adsorption surface, and a contact portion 15Ca attached to the rear pressure plate main body. The contact portion 15Ca is formed at an end portion (upper end portion in FIG. 6) on the opposite side of the frame 11 from the suction plate 18C in the rear platen 15C. The non-contact portion 15Cb is the entire adsorption surface of the rear platen body.

並且,第3變形例之吸附板18C具備具有吸附面之吸附板主體、及安裝於該吸附板主體之接觸部18Ca。該接觸部18Ca形成於吸附板18C中與後壓板15C相對向部分中與框架11為相反側的端部(第6圖中為上端部)。非接觸部18Cb為吸附板主體的整個吸附面。 Further, the adsorption plate 18C according to the third modification includes an adsorption plate main body having an adsorption surface, and a contact portion 18Ca attached to the adsorption plate main body. The contact portion 18Ca is formed at an end portion (upper end portion in FIG. 6) on the opposite side of the frame 11 from the opposing portion of the rear platen 15C in the suction plate 18C. The non-contact portion 18Cb is the entire adsorption surface of the adsorption plate main body.

依本變形例,後壓板15C的接觸部15Ca和吸附板18C的接觸部18Ca至少在合模時接觸。因此,可以得到與上述實施形態相同的效果。 According to the present modification, the contact portion 15Ca of the rear platen 15C and the contact portion 18Ca of the suction plate 18C are in contact at least at the time of mold clamping. Therefore, the same effects as those of the above embodiment can be obtained.

以上,對射出成形機的實施形態進行了說明,但本發明並不限定於上述實施形態,在申請專利範圍中記載之宗旨的範圍內可以進行各種變形、改進。 Although the embodiment of the injection molding machine has been described above, the present invention is not limited to the above embodiment, and various modifications and improvements can be made within the scope of the gist of the invention.

例如,上述實施形態的射出成形機是模開閉方向為水平方向的臥式,但亦可以是模開閉方向為上下方向的立式。 For example, the injection molding machine according to the above embodiment is a horizontal type in which the mold opening and closing direction is horizontal, but may be a vertical type in which the mold opening and closing direction is the vertical direction.

10‧‧‧射出成形機 10‧‧‧ Injection molding machine

11‧‧‧框架 11‧‧‧Frame

12‧‧‧固定壓板 12‧‧‧Fixed platen

13‧‧‧可動壓板 13‧‧‧ movable platen

14‧‧‧導引塊 14‧‧‧Guiding block

15‧‧‧後壓板 15‧‧‧ rear platen

15a‧‧‧接觸部 15a‧‧‧Contacts

15b‧‧‧非接觸部 15b‧‧‧ Non-contact department

16‧‧‧繫桿 16‧‧‧ tied

17‧‧‧導件 17‧‧‧ Guides

18‧‧‧吸附板 18‧‧‧Adsorption plate

18a‧‧‧接觸部 18a‧‧‧Contacts

18b‧‧‧非接觸部 18b‧‧‧ Non-contact department

19‧‧‧連桿 19‧‧‧ Connecting rod

20‧‧‧滑動底座 20‧‧‧Sliding base

21‧‧‧線性馬達 21‧‧‧Linear motor

22‧‧‧定子 22‧‧‧ Stator

23‧‧‧轉子 23‧‧‧Rotor

24‧‧‧合模力產生部 24‧‧‧Molding force generation department

25‧‧‧電磁鐵 25‧‧‧Electromagnet

26‧‧‧吸附部 26‧‧‧Adsorption Department

27‧‧‧線圈 27‧‧‧ coil

28‧‧‧槽 28‧‧‧ slots

29‧‧‧磁芯 29‧‧‧ magnetic core

30‧‧‧模具裝置 30‧‧‧Molding device

32‧‧‧固定模 32‧‧‧Fixed mode

33‧‧‧可動模 33‧‧‧ movable mold

42‧‧‧固定壓板支撐構件 42‧‧‧Fixed plate support members

43‧‧‧可動壓板支撐構件 43‧‧‧ movable platen support member

45‧‧‧後壓板支撐構件 45‧‧‧ Rear platen support member

48‧‧‧吸附板支撐構件 48‧‧‧Adsorption plate support member

Claims (6)

一種射出成形機,其特徵為具有:安裝有固定模的固定壓板;安裝有可動模的可動壓板;與前述可動壓板一同移動的可動構件;配設於前述可動構件與前述可動壓板之間的固定構件;及藉由電磁鐵之吸附力產生合模力的合模力產生部,該合模力產生部包括前述吸附力起作用之第1塊及第2塊,前述第1塊僅在與前述第2塊相對向部分的一部分具有至少在合模時與前述第2塊接觸之接觸部,前述可動構件及前述固定構件中的一個為前述第1塊,另一個為前述第2塊。 An injection molding machine, comprising: a fixed pressure plate to which a fixed mold is mounted; a movable pressure plate on which a movable mold is mounted; a movable member that moves together with the movable pressure plate; and a fixing between the movable member and the movable pressure plate And a clamping force generating portion that generates a clamping force by an adsorption force of the electromagnet, wherein the clamping force generating portion includes the first block and the second block in which the adsorption force acts, and the first block is only in the foregoing A part of the opposing portion of the second block has a contact portion that contacts the second block at least during mold clamping, and one of the movable member and the fixing member is the first block, and the other is the second block. 如申請專利範圍第1項所述之射出成形機,其中,前述接觸部形成於前述第1塊中與前述第2塊相對向部分的端部。 The injection molding machine according to the first aspect of the invention, wherein the contact portion is formed at an end portion of the first block facing the second block. 如申請專利範圍第2項所述之射出成形機,其中,前述射出成形機具有:配設有前述第1塊及前述第2塊之框架,前述接觸部形成於前述第1塊中與前述第2塊相對向部分之中與前述框架為相反側的端部。 The injection molding machine according to claim 2, wherein the injection molding machine has a frame in which the first block and the second block are disposed, and the contact portion is formed in the first block and the first Among the two opposing portions, the end portion on the opposite side to the aforementioned frame. 一種射出成形方法,其特徵為設置:安裝有固定模的固定壓板; 安裝有可動模的可動壓板;與前述可動壓板一同移動的可動構件;及配設於前述可動構件與前述可動壓板之間的固定構件,並具有:藉由在第1塊與第2塊之間產生電磁鐵之吸附力來產生合模力的合模製程,至少在合模時,僅使前述第1塊與第2塊彼此相對向部分的一部分接觸,前述可動構件及前述固定構件中的一個為前述第1塊,另一個為前述第2塊。 An injection molding method, characterized in that: a fixed pressure plate mounted with a fixed mold; a movable platen to which a movable mold is attached; a movable member that moves together with the movable platen; and a fixing member that is disposed between the movable member and the movable platen, and has a space between the first block and the second block a mold clamping process for generating an clamping force of the electromagnet to generate a mold clamping force, and at least a part of the facing portion of the first block and the second block are in contact with each other, at least one of the movable member and the fixing member The first block and the other block are the aforementioned second block. 如申請專利範圍第4項所述之射出成形方法,其中,至少在合模時,使前述第1塊中與前述第2塊相對向部分的端部,與前述第2塊接觸。 The injection molding method according to claim 4, wherein at least the end portion of the first block facing the second block is brought into contact with the second block at the time of mold clamping. 如申請專利範圍第5項所述之射出成形方法,其中,前述第1塊及前述第2塊配設於框架,至少在合模時,使前述第1塊中與前述第2塊相對向部分之中與前述框架為相反側的端部,與前述第2塊接觸。 The injection molding method according to claim 5, wherein the first block and the second block are disposed in a frame, and at least a part of the first block is opposed to the second block at the time of mold clamping. The end opposite to the frame is in contact with the second block.
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