JP5774441B2 - Injection molding machine and mold thickness adjusting method for injection molding machine - Google Patents

Injection molding machine and mold thickness adjusting method for injection molding machine Download PDF

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Publication number
JP5774441B2
JP5774441B2 JP2011232292A JP2011232292A JP5774441B2 JP 5774441 B2 JP5774441 B2 JP 5774441B2 JP 2011232292 A JP2011232292 A JP 2011232292A JP 2011232292 A JP2011232292 A JP 2011232292A JP 5774441 B2 JP5774441 B2 JP 5774441B2
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mold
movable
fixed
contact
injection molding
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JP2013086488A (en
Inventor
達也 柴田
達也 柴田
惇朗 田村
惇朗 田村
知寛 森谷
知寛 森谷
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住友重機械工業株式会社
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/64Mould opening, closing or clamping devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/1761Means for guiding movable mould supports or injection units on the machine base or frame; Machine bases or frames
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/76Measuring, controlling or regulating
    • B29C45/80Measuring, controlling or regulating of relative position of mould parts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/64Mould opening, closing or clamping devices
    • B29C2045/645Mould opening, closing or clamping devices using magnetic means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76Measuring, controlling or regulating
    • B29C2945/76003Measured parameter
    • B29C2945/76083Position
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76Measuring, controlling or regulating
    • B29C2945/76003Measured parameter
    • B29C2945/76167Presence, absence of objects
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76Measuring, controlling or regulating
    • B29C2945/76494Controlled parameter
    • B29C2945/76568Position
    • B29C2945/76581Position distance
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76Measuring, controlling or regulating
    • B29C2945/76494Controlled parameter
    • B29C2945/76585Dimensions, e.g. thickness

Description

  The present invention relates to an injection molding machine and a mold thickness adjusting method for an injection molding machine.

  The injection molding machine molds a molded product by injecting molten resin from an injection apparatus, filling the cavity of a mold apparatus, and solidifying. The mold apparatus includes a fixed mold and a movable mold. Mold closing, mold clamping, and mold opening of the mold apparatus are performed by a mold clamping apparatus.

  As a mold clamping device, a system using a drive source such as a motor and a toggle mechanism is widely used. However, due to the characteristics of the toggle mechanism, it is difficult to change the mold clamping force, and responsiveness and stability. Is bad. In addition, a bending moment may be generated during the operation of the toggle mechanism, and the mounting surface to which the mold apparatus is attached may be distorted.

  Therefore, a mold clamping device has been proposed that uses a linear motor for the mold opening and closing operation and uses the attractive force of an electromagnet for the mold clamping operation. The mold clamping device includes a fixed platen to which a fixed mold is attached, a movable platen to which a movable mold is attached, a suction plate that moves together with the movable platen, and a rear platen that is disposed between the movable platen and the suction plate. And a rod that penetrates the rear platen and connects the movable platen and the suction plate. When an attracting force by an electromagnet is generated between the rear platen and the attracting plate, the attracting force is transmitted to the movable platen via the rod, and a mold clamping force is generated between the movable platen and the fixed platen.

  By the way, when the mold apparatus is replaced, the thickness of the mold apparatus changes, and the gap formed between the rear platen and the suction plate at the end of mold closing may change. When the gap changes, the suction force changes and the clamping force changes.

  On the other hand, conventionally, a mold thickness adjusting unit that adjusts the distance between the movable platen and the suction plate in accordance with the thickness of the mold apparatus has been proposed (for example, see Patent Document 1). The mold thickness adjusting unit adjusts the gap to a set value by adjusting the interval between the movable platen and the suction plate while the movable mold is in contact with the fixed mold.

WO05 / 090052 pamphlet

  Patent Document 1 proposes a mold thickness adjustment unit that adjusts the distance between the movable platen and the suction plate in accordance with the thickness of the mold apparatus, but does not mention details of a specific adjustment method.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide an injection molding machine suitable for replacement of a mold apparatus and a mold thickness adjusting method for the injection molding machine.

In order to solve the above object, an injection molding machine according to the aspect (1) of the present invention provides:
A first fixing member to which a fixed mold is attached;
A first movable member to which a movable mold is attached;
A second movable member that moves with the first movable member;
A second fixed member disposed between the first movable member and the second movable member;
An electromagnet formed on one of the second movable member and the second fixed member and attracting the other to generate a clamping force;
A mold thickness adjusting unit for adjusting an interval between the first movable member and the second movable member;
A mold thickness adjustment processing unit for controlling the mold thickness adjustment unit;
A movement restricting portion for restricting movement of the second movable member in the mold opening direction in a state where a predetermined gap is formed between the second movable member and the second fixed member;
In a state where the movement is restricted by the movement restriction unit, the mold thickness adjustment processing unit drives the mold thickness adjustment unit to move the first movable member in the mold closing direction, and the movable mold and the It is made to contact the said 1st fixing member through a fixed metal mold | die.

Moreover, the mold thickness adjusting method of the injection molding machine according to the aspect (2) of the present invention is:
A first fixing member to which a fixed mold is attached;
A first movable member to which a movable mold is attached;
A second movable member that moves with the first movable member;
A second fixed member disposed between the first movable member and the second movable member;
An electromagnet formed on one of the second movable member and the second fixed member and attracting the other to generate a clamping force;
In a mold thickness adjusting method for an injection molding machine comprising a mold thickness adjusting unit that adjusts an interval between the first movable member and the second movable member.
In a state where a predetermined gap is formed between the second movable member and the second fixed member and movement of the second movable member in the mold opening direction is restricted, the mold thickness adjusting unit Is driven to move the first movable member in the mold closing direction and to contact the first fixed member via the movable mold and the fixed mold.

  ADVANTAGE OF THE INVENTION According to this invention, the mold thickness adjustment method of the injection molding machine suitable for replacement | exchange of a die apparatus and an injection molding machine is provided.

The figure which shows the state at the time of mold closing of the injection molding machine by one Embodiment of this invention The figure which shows the state at the time of the mold opening of the injection molding machine by one Embodiment of this invention Explanatory drawing of mold thickness adjustment of the injection molding machine by one Embodiment of this invention

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. In each of the drawings, the same or corresponding components are denoted by the same or corresponding reference numerals, and description thereof will be omitted. Further, a description will be given assuming that the moving direction of the movable platen when performing mold closing is the front and the moving direction of the movable platen when performing mold opening is the rear.

  FIG. 1 is a view showing a state when a mold is closed in an injection molding machine according to an embodiment of the present invention. FIG. 2 is a view showing a state when the mold of the injection molding machine according to the embodiment of the present invention is opened.

  In the figure, 10 is a mold clamping device, Fr is a frame of an injection molding machine, Gd is a guide composed of two rails laid on the frame Fr, and 11 is a fixed platen (first fixing member). The fixed platen 11 may be provided on a position adjustment base Ba that is movable along a guide Gd that extends in the mold opening / closing direction (left-right direction in the drawing). The fixed platen 11 may be placed on the frame Fr.

  A movable platen (first movable member) 12 is disposed facing the fixed platen 11. The movable platen 12 is fixed on the movable base Bb, and the movable base Bb can run on the guide Gd. Thereby, the movable platen 12 is movable in the mold opening / closing direction with respect to the fixed platen 11.

  A rear platen (second fixing member) 13 is disposed at a predetermined distance from the fixed platen 11 and parallel to the fixed platen 11. The rear platen 13 is fixed to the frame Fr via the leg portion 13a.

  Between the fixed platen 11 and the rear platen 13, four tie bars 14 (only two of the four tie bars 14 are shown in the figure) are installed as connecting members. The fixed platen 11 is fixed to the rear platen 13 via the tie bar 14. A movable platen 12 is disposed along the tie bar 14 so as to freely advance and retract. A guide hole (not shown) for penetrating the tie bar 14 is formed at a position corresponding to the tie bar 14 in the movable platen 12. In addition, you may make it form a notch part instead of a guide hole.

  A screw portion (not shown) is formed at the front end portion (right end portion in the drawing) of the tie bar 14, and the front end portion of the tie bar 14 is fixed to the fixed platen 11 by screwing and tightening a nut n1 to the screw portion. The rear end of the tie bar 14 is fixed to the rear platen 13.

  A fixed mold 15 is attached to the fixed platen 11, and a movable mold 16 is attached to the movable platen 12. The fixed mold 15 and the movable mold 16 are brought into contact with and separated from each other as the movable platen 12 advances and retreats. Closing, mold clamping and mold opening are performed. As the mold clamping is performed, a cavity space (not shown) is formed between the fixed mold 15 and the movable mold 16, and a molten resin (not shown) injected from the injection nozzle 18 of the injection device 17 is formed in the cavity. The space is filled. A mold apparatus 19 is configured by the fixed mold 15 and the movable mold 16.

  The suction plate 22 (second movable member) is disposed in parallel with the movable platen 12. The suction plate 22 is fixed to the slide base Sb via the mounting plate 27, and the slide base Sb can travel on the guide Gd. As a result, the suction plate 22 can move back and forth behind the rear platen 13. The suction plate 22 may be formed of a magnetic material. The attachment plate 27 may not be provided, and in this case, the suction plate 22 is directly fixed to the slide base Sb.

  The rod 39 is connected to the suction plate 22 at the rear end portion and is connected to the movable platen 12 at the front end portion. Therefore, the rod 39 is moved forward as the suction plate 22 moves forward when the mold is closed to move the movable platen 12 forward, and is retracted and moved backward as the suction plate 22 moves back when the mold is opened. Retreat. For this purpose, a rod hole 41 for penetrating the rod 39 is formed in the central portion of the rear platen 13.

  The linear motor 28 is a mold opening / closing drive unit for moving the movable platen 12 forward and backward, and is disposed, for example, between the suction plate 22 connected to the movable platen 12 and the frame Fr. The linear motor 28 may be disposed between the movable platen 12 and the frame Fr.

  The linear motor 28 includes a stator 29 and a mover 31. The stator 29 is formed on the frame Fr in parallel with the guide Gd and corresponding to the movement range of the slide base Sb. The mover 31 is formed at a lower end of the slide base Sb so as to face the stator 29 and over a predetermined range.

  The mover 31 includes a core 34 and a coil 35. The core 34 includes a plurality of magnetic pole teeth 33 that are protruded toward the stator 29 and formed at a predetermined pitch, and the coil 35 is wound around each magnetic pole tooth 33. The magnetic pole teeth 33 are formed in parallel to each other in a direction perpendicular to the moving direction of the movable platen 12. The stator 29 includes a core (not shown) and a permanent magnet (not shown) formed to extend on the core. The permanent magnet is formed by alternately magnetizing the N and S poles. A position sensor 53 that detects the position of the mover 31 is disposed. Further, a current sensor 54 that detects a current value of a current supplied to the coil 35 is provided between the coil 35 and the power source.

  When the linear motor 28 is driven by supplying a predetermined current to the coil 35, the mover 31 is moved back and forth. Along with this, the suction plate 22 and the movable platen 12 are advanced and retracted, and the mold can be closed and opened. The linear motor 28 is feedback-controlled based on the detection result of the position sensor 53 so that the position of the mover 31 becomes a set value.

  In the present embodiment, the permanent magnet is disposed on the stator 29 and the coil 35 is disposed on the mover 31, but the coil is disposed on the stator and the permanent magnet is disposed on the mover. You can also. In this case, since the coil does not move as the linear motor 28 is driven, wiring for supplying power to the coil can be easily performed.

  As the mold opening / closing drive unit, instead of the linear motor 28, a rotary motor, a ball screw mechanism that converts the rotary motion of the rotary motor into a linear motion, or a fluid pressure cylinder such as a hydraulic cylinder or a pneumatic cylinder may be used. .

  The electromagnet unit 37 generates an attracting force between the rear platen 13 and the attracting plate 22. This suction force is transmitted to the movable platen 12 via the rod 39, and a mold clamping force is generated between the movable platen 12 and the fixed platen 11.

  The mold clamping device 10 is constituted by the fixed platen 11, the movable platen 12, the rear platen 13, the suction plate 22, the linear motor 28, the electromagnet unit 37, the rod 39, and the like.

  The electromagnet unit 37 includes an electromagnet 49 formed on the rear platen 13 side and a suction portion 51 formed on the suction plate 22 side. The suction portion 51 is formed in a predetermined portion of the suction surface (front end surface) of the suction plate 22, for example, a portion surrounding the rod 39 in the suction plate 22 and facing the electromagnet 49. A groove 45 for accommodating the coil 48 of the electromagnet 49 is formed around a predetermined portion of the attracting surface (rear end surface) of the rear platen 13, for example, around the rod 39. A core 46 is formed inside the groove 45. A coil 48 is wound around the core 46. A yoke 47 is formed at a portion other than the core 46 of the rear platen 13.

  In the present embodiment, the electromagnet 49 is formed separately from the rear platen 13 and the attracting part 51 is formed separately from the attracting plate 22, but the electromagnet is part of the rear platen 13 and the attracting part is part of the attracting plate 22. May be formed. Moreover, the arrangement of the electromagnet and the attracting part may be reversed. For example, the electromagnet 49 may be provided on the suction plate 22 side, and the suction portion 51 may be provided on the rear platen 13 side. Moreover, the number of the coils 48 of the electromagnet 49 may be plural.

  When an electric current is supplied to the coil 48 in the electromagnet unit 37, the electromagnet 49 is driven to attract the attracting part 51 and generate a mold clamping force.

  Driving of the linear motor 28 and the electromagnet 49 of the mold clamping device 10 is controlled by the control device 60. The control device 60 includes a CPU, a memory, and the like, and supplies current to the coil 35 of the linear motor 28 and the coil 48 of the electromagnet 49 according to the result calculated by the CPU. A mold clamping force sensor 55 is connected to the control device 60. The mold clamping force sensor 55 is installed at a predetermined position (a predetermined position between the fixed platen 11 and the rear platen 13) of at least one tie bar 14 in the mold clamping device 10 and detects a load applied to the tie bar 14. To do. The mold clamping force sensor 55 is composed of, for example, a strain gauge that detects the extension amount of the tie bar 14. The load detected by the mold clamping force sensor 55 is sent to the control device 60.

  Next, the operation of the mold clamping device 10 will be described.

  The mold closing process is controlled by the mold opening / closing processor 61 of the control device 60. In the state of FIG. 2 (the state of mold opening), the mold opening / closing processor 61 supplies current to the coil 35 to drive the linear motor 28. The movable platen 12 moves forward, and the movable mold 16 is brought into contact with the fixed mold 15 as shown in FIG. At this time, a gap δ is formed between the rear platen 13 and the suction plate 22, that is, between the electromagnet 49 and the suction portion 51. Note that the force required for mold closing is sufficiently reduced compared to the mold clamping force.

  Subsequently, the mold clamping processing unit 62 of the control device 60 controls the mold clamping process. The mold clamping processing unit 62 supplies current to the coil 48 of the electromagnet 49 and attracts the attracting unit 51 to the electromagnet 49. This suction force is transmitted to the movable platen 12 via the rod 39, and a mold clamping force is generated between the movable platen 12 and the fixed platen 11.

  The mold clamping force is detected by a mold clamping force sensor 55. The detected mold clamping force is sent to the control device 60, and the mold clamping processing unit 62 adjusts the current supplied to the coil 48 so that the mold clamping force becomes a set value, and performs feedback control. During this time, the molten resin melted in the injection device 17 is injected from the injection nozzle 18 and filled into the cavity space of the mold device 19.

  When the resin in the cavity space is cooled and solidified, the mold opening / closing processor 61 controls the mold opening process. The mold clamping processing unit 62 stops supplying current to the coil 48 of the electromagnet 49 in the state of FIG. Accordingly, the linear motor 28 is driven, the movable platen 12 is moved backward, and the movable mold 16 is moved backward as shown in FIG. 2 to open the mold.

  By the way, when the mold apparatus 19 is replaced, the thickness of the mold apparatus 19 changes, and the gap δ formed between the rear platen 13 and the suction plate 22 at the end of mold closing changes. When the gap δ changes, the suction force changes and the mold clamping force changes.

  Therefore, the injection molding machine includes a mold thickness adjusting unit 70 that adjusts the distance between the movable platen 12 and the suction plate 22 in accordance with the thickness of the mold apparatus 19. The mold thickness adjusting unit 70 includes a mold thickness adjusting motor 71, a gear 72, a nut 73, a rod 39, and the like. The rod 39 passes through the central portion of the suction plate 22, and a screw 43 is formed at the rear end portion of the rod 39. The screw 43 and a nut 73 that is rotatably supported by the suction plate 22 are screwed together. A gear (not shown) is formed on the outer peripheral surface of the nut 73, and this gear is engaged with a gear 72 attached to the output shaft 71 a of the mold thickness adjusting motor 71. The nut 73 and the screw 43 constitute a movement direction conversion unit, and the rotation direction of the nut 73 is converted into a straight movement of the rod 39 in the movement direction conversion unit. Further, a current sensor 56 for detecting a current value of a current supplied to the driving coil of the mold thickness adjusting motor 71 is provided between the mold thickness adjusting motor 71 and the power source.

  When a predetermined current is supplied to drive the mold thickness adjusting motor 71, the nut 73 rotates a predetermined amount with respect to the screw 43, and the position of the rod 39 with respect to the suction plate 22 is adjusted. Therefore, the gap between the movable platen 12 and the suction plate 22 is adjusted, and the gap δ at the end of mold closing can be set to an optimum value.

  The mold thickness adjusting motor 71 may be a servo motor, and may include an encoder unit 71 b that detects the amount of rotation of the output shaft 71 a of the mold thickness adjusting motor 71. The current supplied to the mold thickness adjusting motor 71 is feedback-controlled based on the detection result of the encoder unit 71b so that the distance between the movable platen 12 and the suction plate 22 becomes a target value.

  Next, the operation of the mold thickness adjusting unit 70 will be described with reference to FIG. The operation of the mold thickness adjustment unit 70 is controlled by the mold thickness adjustment processing unit 63 of the control device 60.

  When the new movable mold 16 is attached to the movable platen 12 and the new fixed mold 15 is attached to the fixed platen 11 in accordance with the replacement of the mold apparatus 19, the control apparatus 60 drives the linear motor 28 and the gap The suction plate 22 is moved forward until δ reaches a predetermined value (> 0). At this time, the gap monitoring unit 64 of the control device 60 monitors the gap δ based on information from the position sensor 53, for example. The position of the suction plate 22 is determined by the position of the mover 31 of the linear motor 28 detected by the position sensor 53, and the gap δ is determined. When the gap δ reaches a predetermined value, the movable mold 16 that moves forward together with the suction plate 22 and the movable platen 12 is not in contact with the fixed mold 15. Contact between the movable mold 16 and the fixed mold 15 is referred to as “mold touch”.

  Before the linear motor 28 is driven, the mold thickness adjustment processing unit 63 drives the mold thickness adjustment unit 70 to move the suction plate 22 so that the mold touch does not occur before the gap δ reaches a predetermined value. The distance from the platen 12 may be sufficiently narrowed. In addition, when the elapsed time from the start of driving the linear motor 28 reaches a predetermined time, if the gap δ does not reach a predetermined value, a mold touch has occurred. 70 may be driven to narrow the distance between the suction plate 22 and the movable platen 12.

  Next, in a state where the movement restriction unit 65 of the control device 60 restricts the backward movement of the suction plate 22, the mold thickness adjustment processing unit 63 drives the mold thickness adjustment unit 70 to advance the movable platen 12 (see FIG. 3). The movable mold 16 is brought into contact with the fixed mold 15 (see FIG. 1).

  The movement restricting unit 65 drives the linear motor 28 while the mold thickness adjustment processing unit 63 drives the mold thickness adjusting unit 70 to widen the distance between the suction plate 22 and the movable platen 12, for example. Limit. Therefore, the movable platen 12 moves forward and a mold touch is performed. Mold thickness adjustment ends when the mold is touched. In order to suppress excessive driving of the mold thickness adjusting unit 70 after the mold touch, the control device 60 may include a contact detection unit 66 that detects the mold touch.

  The contact detection unit 66 detects the presence or absence of a mold touch by detecting the presence or absence of a reaction force caused by a mold touch or the presence or absence of a mold clamping force caused by a mold touch.

  (1) When a reaction force is generated by the mold touch, the driving force of the linear motor 28 for limiting the backward movement of the suction plate 22 increases. (2) When the driving force of the linear motor 28 reaches the upper limit value and loses the driving force of the mold thickness adjusting unit 70, the suction plate 22 moves backward. The above (1) and (2) occur when the driving force of the mold thickness adjusting unit 70 is higher than the driving force of the linear motor 28.

  In the case of (1) to (2) above, the contact detection unit 66 may detect the presence or absence of a reaction force generated by the mold touch based on whether or not the driving force of the linear motor 28 is equal to or greater than a predetermined value. The driving force of the linear motor 28 is proportional to the current value of the current supplied to the coil 35 of the linear motor 28, for example, and can be detected by the current sensor 54.

  In the case of (2), the contact detection unit 66 may determine the presence or absence of a reaction force caused by the mold touch based on whether or not the position of the suction plate 22 has been retracted by a predetermined amount or more from the stop position. . Since the position of the suction plate 22 is determined by the position of the mover 31 of the linear motor 28, it can be detected by the position sensor 53.

  (3) When a reaction force is generated by the mold touch, the driving force of the mold thickness adjusting unit 70 is increased to advance the movable platen 12. The above (3) occurs when the driving force of the mold thickness adjusting unit 70 is lower than the driving force of the linear motor 28.

  In the case of (3) above, the contact detection unit 66 may detect the presence or absence of a reaction force generated by the mold touch based on whether or not the driving force of the mold thickness adjusting unit 70 is equal to or greater than a predetermined value. The driving force of the mold thickness adjusting unit 70 is proportional to the current value of the current supplied to the driving coil of the mold thickness adjusting motor 71 and can be detected by the current sensor 56.

  (4) A mold clamping force is generated by the mold touch. Therefore, the contact detection unit 66 may determine the presence or absence of the mold touch based on whether or not the mold clamping force is equal to or greater than a predetermined value. The mold clamping force can be detected by a mold clamping force sensor 55.

  As described above, the contact detection unit 66 detects the presence / absence of the mold touch based on the information from the position sensor 53, the current sensor 54, the current sensor 56, or the mold clamping force sensor 55. This eliminates the need for a dedicated sensor.

  The mold thickness adjustment processing unit 63 performs the mold thickness adjustment unit 70 in a state where the backward movement of the suction plate 22 is limited so that the gap δ is maintained at a predetermined value by the movement limitation unit 65 until the mold touch is detected by the contact detection unit 66. Drive. When the mold touch is detected by the contact detection unit 66, the driving of the mold thickness adjusting unit 70 is released.

  Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications and substitutions are made to the above-described embodiments without departing from the scope of the present invention. be able to.

  For example, the movement restriction unit 65 of the above embodiment drives the linear motor 28 to restrict the backward movement of the suction plate 22 in order to maintain the gap δ at a predetermined value, but the movement of the suction plate 22 is controlled by the braking force of the brake device. You may limit retreat. The brake device is not particularly limited, and may be a device that brakes the slide base Sb against the guide Gd, for example. As described above, when the backward movement of the suction plate 22 is limited by the braking force of the brake device, the presence / absence of contact may be detected based on information from the current sensor 56 or the mold clamping force sensor 55.

  In addition, the control device 60 according to the above embodiment controls the linear motor 28 to advance the suction plate 22 to a predetermined position when the new mold device 19 is attached. It may be performed in a state where the mold device 19 is temporarily fixed. For example, this control may be performed in a state where the mold apparatus 19 is temporarily fixed to the fixed platen 11 in a state where the movable mold 16 and the fixed mold 15 are suspended together by a crane or the like. Thereafter, the movable platen 12 moves forward and contacts the mold device 19, and then the mold device 19 is clamped. In the clamped state, the fixed mold 15 is fixed to the fixed platen 11 and the movable mold 16 is fixed to the movable platen 12 with bolts or the like. The mold device 19 may be temporarily fixed to the movable platen 12 instead of the fixed platen 11.

  The contact detection unit 66 of the above embodiment detects the contact between the movable mold 16 and the fixed mold 15, but the movable platen 12 and the fixed platen 11 via the movable mold 16 and the fixed mold 15 are detected. What is necessary is just to detect a contact. For example, when the mold apparatus 19 is temporarily fixed to the fixed platen 11, the contact detection unit 66 may detect contact between the movable platen 12 and the movable mold 16. When the mold apparatus 19 is temporarily fixed to the movable platen 12, the contact detection unit 66 may detect contact between the fixed mold 15 and the fixed platen 11. In any case, since a reaction force or a mold clamping force is generated by the contact, the contact detection unit 66 can detect the presence or absence of contact based on information from the position sensor 53 or the like.

  Moreover, although the mold thickness adjustment of the said embodiment is performed automatically by the control apparatus 60, you may perform it manually.

  Further, in the above-described embodiment, a predetermined gap δ is formed between the rear platen 13 and the suction plate 22, and the movable platen 12 is advanced by driving the mold thickness adjusting unit 70 in a state where the backward movement of the suction plate 22 is restricted. Although the mold thickness adjustment is performed by bringing the mold plate 19 into contact with the fixed platen 11 via the mold device 19, the mold thickness adjustment may be performed by another method. For example, the gap when the linear motor 28 is driven to move the movable platen 12 forward and come into contact with the fixed platen 11 via the mold device 19 is detected, and the mold is determined according to the difference between the detected value and the target value. The mold thickness may be adjusted by driving the thickness adjusting unit 70. When the detected value is smaller than the target value, the mold thickness adjusting unit 70 is driven to widen the gap between the movable platen 12 and the suction plate 22 in order to widen the gap. The amount by which the interval is widened may be substantially the same as the absolute value of the difference between the detected value and the target value. When the detected value is larger than the target value, the mold thickness adjusting unit 70 is driven to narrow the gap between the movable platen 12 and the suction plate 22 in order to narrow the gap. The amount by which the interval is narrowed may be substantially the same as the absolute value of the difference between the detected value and the target value. Contact detection, gap detection, and the like are performed in the same configuration as in the above embodiment. For example, contact detection is performed by the contact detection unit 66, gap detection is performed by the gap monitoring unit 64, and control of the mold thickness adjustment unit 70 is performed by the mold thickness adjustment processing unit 63. The target value is determined in advance by a test or the like and recorded on a recording medium such as a memory.

10 mold clamping device 11 fixed platen (first fixing member)
12 Movable platen (first movable member)
13 Rear platen (second fixing member)
15 Fixed mold 16 Movable mold 22 Suction plate (second movable member)
39 Rod 48 Coil 49 Electromagnet 53 Position sensor 54 Current sensor for electromagnet 55 Mold clamping force sensor 56 Current sensor for mold thickness adjusting unit 60 Control device 61 Mold opening / closing processing unit 62 Mold clamping processing unit 63 Mold thickness adjusting processing unit 64 Gap Monitoring unit 65 Movement restriction unit 66 Contact detection unit 70 Mold thickness adjustment unit

Claims (8)

  1. A first fixing member to which a fixed mold is attached;
    A first movable member to which a movable mold is attached;
    A second movable member that moves with the first movable member;
    A second fixed member disposed between the first movable member and the second movable member;
    An electromagnet formed on one of the second movable member and the second fixed member and attracting the other to generate a clamping force;
    A mold thickness adjusting unit for adjusting an interval between the first movable member and the second movable member;
    A mold thickness adjustment processing unit for controlling the mold thickness adjustment unit;
    A movement restricting portion for restricting movement of the second movable member in the mold opening direction in a state where a predetermined gap is formed between the second movable member and the second fixed member;
    In a state where the movement is restricted by the movement restriction unit, the mold thickness adjustment processing unit drives the mold thickness adjustment unit to move the first movable member in the mold closing direction, and the movable mold and the An injection molding machine, wherein the first fixing member is brought into contact via a fixed mold.
  2. A contact detection unit for detecting presence or absence of contact between the first movable member and the first fixed member via the movable mold and the fixed mold;
    2. The injection molding according to claim 1, wherein the mold thickness adjustment processing unit drives the mold thickness adjustment unit to move the first movable member in a mold closing direction until the contact is detected by the contact detection unit. Machine.
  3.   The injection molding machine according to claim 2, wherein the contact detection unit detects the presence or absence of the contact by detecting the presence or absence of a reaction force generated by the contact.
  4.   The injection molding machine according to claim 2, wherein the contact detection unit detects the presence or absence of the contact by detecting the presence or absence of a clamping force generated by the contact.
  5.   The contact between the first movable member and the first fixed member via the movable mold and the fixed mold is a contact between the movable mold and the fixed mold. The injection molding machine as described in any one of Claims.
  6. At the time of mold thickness adjustment, the movable mold is attached to the first fixed member together with the fixed mold,
    The contact of the movable mold and said first movable member through said fixed mold and said first securing member according to claim 1 and wherein the first movable member and the a contact between the movable mold The injection molding machine according to any one of 4.
  7. At the time of mold thickness adjustment, the fixed mold is attached to the first movable member together with the movable mold,
    The contact between the first movable member and the first fixed member via the movable mold and the fixed mold is a contact between the first fixed member and the fixed mold. The injection molding machine according to any one of 4.
  8. A first fixing member to which a fixed mold is attached;
    A first movable member to which a movable mold is attached;
    A second movable member that moves with the first movable member;
    A second fixed member disposed between the first movable member and the second movable member;
    An electromagnet formed on one of the second movable member and the second fixed member and attracting the other to generate a clamping force;
    In a mold thickness adjusting method for an injection molding machine comprising a mold thickness adjusting unit that adjusts an interval between the first movable member and the second movable member.
    In a state where a predetermined gap is formed between the second movable member and the second fixed member and movement of the second movable member in the mold opening direction is restricted, the mold thickness adjusting unit To move the first movable member in the mold closing direction to contact the first fixed member via the movable mold and the fixed mold. Thickness adjustment method.
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JP2011232292A JP5774441B2 (en) 2011-10-21 2011-10-21 Injection molding machine and mold thickness adjusting method for injection molding machine
TW101124784A TWI492832B (en) 2011-10-21 2012-07-10 Injection Molding Machine and Injection Molding Machine
CN201210260147.5A CN103057063B (en) 2011-10-21 2012-07-25 Injection moulding machine and method for adjusting mould thickness of injection moulding machine
KR1020120116556A KR101330041B1 (en) 2011-10-21 2012-10-19 Injection molding machine, and mold thickness adjusting method of injection molding machine

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JP6187869B2 (en) * 2013-11-22 2017-08-30 新東工業株式会社 Device for detecting the amount of movement of a moving member in a mold making apparatus
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JP2550420Y2 (en) * 1992-01-30 1997-10-15 東芝機械株式会社 Mold clamping device of injection molding machine
JPH05237893A (en) * 1992-03-02 1993-09-17 Toshiba Mach Co Ltd Mold clamping device of injection molding machine
JP4021815B2 (en) * 2003-07-10 2007-12-12 住友重機械工業株式会社 Clamping device
CN100534759C (en) * 2004-03-19 2009-09-02 住友重机械工业株式会社 Mold clamping device and mold thickness adjusting method
DE112008001353T5 (en) * 2007-05-21 2010-04-01 Sumitomo Heavy Industries, Ltd. Mold clamping device and method for controlling the mold clamping device
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TW201321162A (en) 2013-06-01
KR20130044174A (en) 2013-05-02
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TWI492832B (en) 2015-07-21
JP2013086488A (en) 2013-05-13
CN103057063A (en) 2013-04-24

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