TWI594047B - Cutting device for display panel and manufacturing method of display device using the same - Google Patents
Cutting device for display panel and manufacturing method of display device using the same Download PDFInfo
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- TWI594047B TWI594047B TW102128220A TW102128220A TWI594047B TW I594047 B TWI594047 B TW I594047B TW 102128220 A TW102128220 A TW 102128220A TW 102128220 A TW102128220 A TW 102128220A TW I594047 B TWI594047 B TW I594047B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/01—Means for holding or positioning work
- B26D7/015—Means for holding or positioning work for sheet material or piles of sheets
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
- B26D1/04—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a linearly-movable cutting member
- B26D1/045—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a linearly-movable cutting member for thin material, e.g. for sheets, strips or the like
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
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- Crystallography & Structural Chemistry (AREA)
- Computer Hardware Design (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Description
所述技術係通常關於一種用於顯示面板之裁切裝置。更明確地,所述技術係通常關於一種用於裁切可撓式顯示面板之裁切裝置及使用其製造顯示裝置之方法。 The technique is generally directed to a cutting device for a display panel. More specifically, the techniques are generally directed to a cutting apparatus for cutting a flexible display panel and a method of manufacturing the same using the same.
平板顯示器、液晶顯示器(LCD)及有機發光二極體顯示器(OLED)為習知的。其中,不同於液晶顯示器,自發光型之有機發光二極體顯示器不需要背光源,使得其厚度及重量可被降低。 Flat panel displays, liquid crystal displays (LCDs), and organic light emitting diode displays (OLEDs) are conventional. Among them, unlike the liquid crystal display, the self-luminous type organic light emitting diode display does not require a backlight, so that its thickness and weight can be reduced.
此外,當像素電路及有機發光二極體設置於如聚合物薄膜,而非剛性基板之可撓式基板時,有機發光二極體顯示器可具有彎曲特性。包含複數個無機層(二氧化矽、氮化矽等)之屏障層及緩衝層係設置於可撓式基板及像素電路之間。 In addition, when the pixel circuit and the organic light emitting diode are disposed on a flexible substrate such as a polymer film instead of a rigid substrate, the organic light emitting diode display may have a bending property. A barrier layer and a buffer layer including a plurality of inorganic layers (cerium oxide, tantalum nitride, etc.) are disposed between the flexible substrate and the pixel circuit.
顯示面板一開始係以包含複數個單位格(一個單位格對應於一個顯示面板)之母基板之形狀來製造,且接著分割成各個顯示面板。包含聚合物薄膜之可撓式顯示面板係藉由使用向下移動之裁切刀來裁切。 The display panel is initially manufactured in the shape of a mother substrate including a plurality of unit cells (one unit cell corresponding to one display panel), and then divided into individual display panels. A flexible display panel comprising a polymeric film is cut by using a downwardly moving cutting knife.
然而,當裁切刀進入可撓式顯示面板時,會產生在裁切刀兩側於水平方向將層推擠之力量。因此,在靠近切口表面之無機層會產生裂痕,即屏障層及緩衝層,而因裂痕產生收縮缺陷於顯示面板中。 However, when the cutting blade enters the flexible display panel, there is a force that pushes the layer horizontally on both sides of the cutting blade. Therefore, cracks are generated in the inorganic layer near the surface of the slit, that is, the barrier layer and the buffer layer, and shrinkage defects are generated in the display panel due to the crack.
上述於先前技術中所揭露之資訊僅用以增強所述技術背景之理解,因此其可包含所屬技術領域之通常知識者已知之先前技術之資訊。 The above information disclosed in the prior art is only used to enhance the understanding of the technical background, and thus it may contain information of prior art known to those of ordinary skill in the art.
本發明提供一種用於顯示面板之裁切裝置,以預防當裁切可撓式顯示面板時切口表面之裂痕之收縮缺陷產生,以及使用其製造顯示裝置之方法。 The present invention provides a cutting device for a display panel to prevent shrinkage defects of a slit surface when cutting a flexible display panel, and a method of manufacturing a display device using the same.
依據例示性實施例之一種用於顯示面板之裁切裝置包含:藉由吸附方法接收母基板之顯示面板以支撐顯示面板及彎曲顯示面板以施加拉力至顯示面板之載台;以及當相對於載台往復運動時裁切顯示面板之裁切刀。 A cutting device for a display panel according to an exemplary embodiment includes: a display panel that receives a mother substrate by an adsorption method to support a display panel and a curved display panel to apply a pulling force to a stage of the display panel; and when relative to the load The cutting blade of the display panel is cut when the table is reciprocating.
載台可以圓柱型狀形成且可耦接載台驅動器而旋轉。 The stage can be formed in a cylindrical shape and can be coupled to the stage drive for rotation.
載台可包含:形成複數個第一開口之內管;包圍內管且形成複數個第二開口之外管;以及分別連接於內管及外管之間之複數個第一開口及複數個第二開口之複數個連接管。複數個第一開口及複數個第二開口可依據載台之半徑方向一對一且面對面相互對應。 The stage may include: an inner tube forming a plurality of first openings; a tube surrounding the inner tube and forming a plurality of second openings; and a plurality of first openings and a plurality of numbers respectively connected between the inner tube and the outer tube a plurality of connecting tubes of two openings. The plurality of first openings and the plurality of second openings may correspond to each other one-to-one and face-to-face according to a radial direction of the stage.
載台驅動器可包含:驅動馬達;耦接驅動馬達之驅動齒輪;以及依據外管之圓周方向形成且嚙合驅動齒輪之垂直運動齒輪。 The stage drive may include: a drive motor; a drive gear coupled to the drive motor; and a vertical motion gear formed according to a circumferential direction of the outer tube and engaging the drive gear.
用於顯示面板之裁切裝置更可包含安裝在內管內部之一側且提供真空壓力至內管之真空吸附部、以及安裝在內管內部之另一側且朝向內管吹送壓縮空氣之空氣釋放部。 The cutting device for the display panel may further comprise a vacuum suction portion mounted on one side of the inner tube and providing vacuum pressure to the inner tube, and an air mounted on the other side inside the inner tube and blowing compressed air toward the inner tube Release department.
裁切裝置更可包含經由軸承耦接內管之末端之一對支撐件,且真空吸附部及空氣釋放部可固定且安裝以分隔一對支撐件間之內管。 The cutting device may further comprise a pair of supports coupled to the end of the inner tube via a bearing, and the vacuum suction portion and the air release portion may be fixed and mounted to separate the inner tube between the pair of supports.
真空吸附部可包含:面對內管之一部分且形成複數個第一狹縫之第一主體;產生真空壓力之真空幫浦;以及連接第一主體內部及真空幫浦之第一連接管。第一主體可形成為半圓柱體,且朝向裁切刀而設置,且可在面對內管之曲面形成複數個第一狹縫。 The vacuum adsorption portion may include: a first body facing a portion of the inner tube and forming a plurality of first slits; a vacuum pump generating a vacuum pressure; and a first connecting tube connecting the inside of the first body and the vacuum pump. The first body may be formed as a semi-cylindrical body and disposed toward the cutting blade, and a plurality of first slits may be formed on a curved surface facing the inner tube.
空氣釋放部可包含:面對內管之一部分且形成複數個第二狹縫之第二主體;釋放壓縮空氣之空氣幫浦;以及連接第二主體內部及空氣幫浦之第二連接管。第二主體可形成為四分之一圓柱體,且於裁切後朝向載台中之顯示面板而設置,並可在面對內管之曲面形成複數個第二狹縫。 The air release portion may include: a second body facing a portion of the inner tube and forming a plurality of second slits; an air pump that releases compressed air; and a second connecting tube connecting the interior of the second body and the air pump. The second body may be formed as a quarter cylinder and disposed toward the display panel in the stage after cutting, and may form a plurality of second slits on a curved surface facing the inner tube.
用於顯示面板之裁切裝置更可包含:接收及傳送母基板之顯示面板至載台之第一傳送部;以及自載台接收及傳送已裁切之顯示面板至接下來的製程之第二傳送部。第一傳送部及第二傳送部可經由載台位於相對於真空吸附部之一側,且空氣釋放部可朝著第二傳送部而設置。 The cutting device for the display panel may further include: receiving and transmitting the display panel of the mother substrate to the first transfer portion of the stage; and receiving and transmitting the cut display panel from the loading stage to the second process of the next process Transfer department. The first transfer portion and the second transfer portion may be located on one side with respect to the vacuum suction portion via the stage, and the air release portion may be disposed toward the second transfer portion.
依據例示性實施例之顯示裝置之製造方法包含:傳送於母基板中之顯示面板至旋轉之圓柱型狀之載台;藉由使用真空壓力吸附顯示面板至載台以及將顯示面板彎曲成與載台相同之曲率以施加拉力至顯 示面板;藉由使用裁切刀裁切顯示面板;以及吹送壓縮空氣至已裁切之顯示面板以將已裁切之顯示面板與載台分離。 A manufacturing method of a display device according to an exemplary embodiment includes: transmitting a display panel in a mother substrate to a rotating cylindrical shaped stage; adsorbing the display panel to the stage by using vacuum pressure, and bending the display panel into and out The same curvature of the table to apply tension to the display a display panel; cutting the display panel by using a cutting blade; and blowing compressed air to the cut display panel to separate the cut display panel from the stage.
母基板之顯示面板可為可撓式顯示面板,且可包含依據第一方向及與第一方向相交之第二方向排列之複數個單位格。母基板之顯示面板可依據平行於第一方向之第一裁切線裁切分成條狀,其中複數個單位格係形成於一方向中,且條狀之顯示面板可依據平行於第二方向之第二裁切線裁切分成各個顯示面板。 The display panel of the mother substrate may be a flexible display panel, and may include a plurality of unit cells arranged according to the first direction and the second direction intersecting the first direction. The display panel of the mother substrate may be divided into strips according to a first cutting line parallel to the first direction, wherein a plurality of unit cells are formed in one direction, and the strip display panel may be parallel to the second direction The two cutting lines are cut into individual display panels.
藉由施加拉力裁切顯示面板,在以裁切刀刺穿之後顯示面板之切口表面係容易打開。因此,藉由裁切刀之刺穿在裁切刀之每一側之水平方向中推擠各層之力量則不會產生,使得可預防由複數個無機層所製造之屏障層及緩衝層之裂痕。 By cutting the display panel by applying a pulling force, the slit surface of the display panel is easily opened after being pierced by the cutting blade. Therefore, the force of pushing the layers in the horizontal direction of each side of the cutting blade by the piercing of the cutting blade does not occur, so that the crack of the barrier layer and the buffer layer made of a plurality of inorganic layers can be prevented. .
10‧‧‧第一傳送部 10‧‧‧First Transfer Department
20‧‧‧載台 20‧‧‧ stage
21‧‧‧第一開口 21‧‧‧ first opening
22‧‧‧內管 22‧‧‧Inside
23‧‧‧第二開口 23‧‧‧second opening
24‧‧‧外管 24‧‧‧External management
25‧‧‧連接管 25‧‧‧Connecting tube
31‧‧‧裁切刀 31‧‧‧ cutting knife
32‧‧‧裁切驅動器 32‧‧‧Cut drive
40‧‧‧第二傳送部 40‧‧‧Second Transfer Department
50‧‧‧顯示面板 50‧‧‧ display panel
51‧‧‧可撓式基板 51‧‧‧Flexible substrate
52‧‧‧屏障層 52‧‧‧ barrier layer
53‧‧‧緩衝層 53‧‧‧buffer layer
54‧‧‧像素電路 54‧‧‧pixel circuit
55‧‧‧有機發光二極體層 55‧‧‧Organic light-emitting diode layer
56‧‧‧薄膜封裝層 56‧‧‧film encapsulation layer
57‧‧‧下保護膜 57‧‧‧Under protective film
58‧‧‧上保護膜 58‧‧‧Upper protective film
60‧‧‧載台驅動器 60‧‧‧stage drive
61‧‧‧驅動馬達 61‧‧‧Drive motor
62‧‧‧驅動齒輪 62‧‧‧ drive gear
63‧‧‧垂直運動齒輪 63‧‧‧Vertical motion gear
65‧‧‧支撐件 65‧‧‧Support
66‧‧‧軸承 66‧‧‧ bearing
70‧‧‧真空吸附部 70‧‧‧vacuum adsorption department
71‧‧‧第一狹縫 71‧‧‧first slit
72‧‧‧第一主體 72‧‧‧ first subject
73‧‧‧真空幫浦 73‧‧‧vacuum pump
74‧‧‧第一連接管 74‧‧‧First connecting pipe
80‧‧‧空氣釋放部 80‧‧ Air Release Department
81‧‧‧第二狹縫 81‧‧‧Second slit
82‧‧‧第二主體 82‧‧‧Second subject
83‧‧‧空氣幫浦 83‧‧‧Air pump
84‧‧‧第二連接管 84‧‧‧Second connection tube
100‧‧‧裁切裝置 100‧‧‧ cutting device
501‧‧‧顯示面板 501‧‧‧ display panel
541‧‧‧驅動薄膜電晶體 541‧‧‧Drive film transistor
551‧‧‧有機發光二極體 551‧‧‧Organic Luminescent Diodes
552‧‧‧像素電極 552‧‧‧pixel electrode
553‧‧‧有機發光層 553‧‧‧Organic light-emitting layer
554‧‧‧共同電極 554‧‧‧Common electrode
CL1‧‧‧第一裁切線 CL1‧‧‧ first cutting line
CL2‧‧‧第二裁切線 CL2‧‧‧second cutting line
S10~S40‧‧‧步驟 S10~S40‧‧‧Steps
第1圖為依據例示性實施例之用於顯示面板之裁切裝置之示意圖。 1 is a schematic view of a cutting device for a display panel in accordance with an exemplary embodiment.
第2圖為顯示於第1圖之裁切裝置之一部分之透視圖。 Figure 2 is a perspective view of a portion of the cutting device shown in Figure 1.
第3圖為顯示於第2圖之載台之剖面圖。 Figure 3 is a cross-sectional view of the stage shown in Figure 2.
第4圖為顯示於第2圖之載台之內部之透視圖。 Figure 4 is a perspective view of the interior of the stage shown in Figure 2.
第5圖為由第4圖之A方向所觀看之真空吸附部之透視圖。 Fig. 5 is a perspective view of the vacuum suction portion as viewed in the direction A of Fig. 4.
第6圖為顯示於第4圖之真空吸附部及空氣釋放部之剖面圖。 Fig. 6 is a cross-sectional view showing the vacuum adsorption unit and the air release unit shown in Fig. 4.
第7圖為在裁切製程中顯示面板之放大剖面圖。 Figure 7 is an enlarged cross-sectional view of the display panel in the cutting process.
第8圖為使用比較例之裁切裝置之顯示面板之裁切製程之示意圖。 Fig. 8 is a view showing the cutting process of the display panel using the cutting device of the comparative example.
第9圖為依據例示性實施例之顯示裝置之製造方法之製程流程圖。 Figure 9 is a process flow diagram of a method of fabricating a display device in accordance with an exemplary embodiment.
第10圖為顯示於第9圖之第一步驟之顯示面板之上視圖。 Figure 10 is a top view of the display panel shown in the first step of Figure 9.
第11圖為顯示於第10圖之顯示面板之放大剖面圖。 Figure 11 is an enlarged cross-sectional view showing the display panel shown in Figure 10.
本發明將參照其中顯示例示性實施例之附圖於下文中更完整描述。如所屬領域之通常知識者所理解,所述之實施例可以各種不同的方式修改而不背離本發明之精神或範疇。 The invention will be described more fully hereinafter with reference to the accompanying drawings in which FIG. As those skilled in the art would understand, the described embodiments may be modified in various different ways without departing from the spirit or scope of the invention.
在說明書中,除非有相反的明確描述,詞彙“包含(comprise)”及其變形如“包含(comprises)”或“包含(comprising)”將被理解為包含所述之元件,但不排除包含其他元件。其將被理解的是,當元件如層、膜、區域或基板被提及位於其他元件“上(on)”時,其可直接位於其它元件上或可存在中繼元件。再者,在說明書中,目標部分之上部係表示目標部分之上部或下部,且不需表示目標部分係總是位於基於重力方向之上側。 In the specification, the word "comprise" and its variants such as "comprises" or "comprising" are to be understood to include the recited elements, unless otherwise specified. element. It will be understood that when an element such as a layer, film, region or substrate is referred to as being "on" another element, it may be directly on the other element or the relay element may be present. Further, in the specification, the upper portion of the target portion indicates the upper portion or the lower portion of the target portion, and it is not necessary to indicate that the target portion is always located on the upper side based on the gravity direction.
第1圖為依據例示性實施例之用於顯示面板之裁切裝置之示意圖。 1 is a schematic view of a cutting device for a display panel in accordance with an exemplary embodiment.
參照第1圖,依據本發明例示性實施例之用於顯示面板之裁切裝置100包含第一傳送部10、載台20、裁切刀31及第二傳送部40。 Referring to Fig. 1, a cutting apparatus 100 for a display panel according to an exemplary embodiment of the present invention includes a first conveying portion 10, a stage 20, a cutting blade 31, and a second conveying portion 40.
第一傳送部10提供母基板之顯示面板50至載台20。載台20係以圓柱型形成,其係以一預定速度旋轉,且藉由使用真空壓力吸附顯示面板50。裁切刀31係相對於載台20往復運動,且裁切被載台20吸附之顯示面板50。第一傳送部40傳送已裁切之顯示面板50至接下來的製程。 The first transfer unit 10 supplies the display panel 50 of the mother substrate to the stage 20. The stage 20 is formed in a cylindrical shape which is rotated at a predetermined speed, and the display panel 50 is adsorbed by using vacuum pressure. The cutting blade 31 reciprocates relative to the stage 20, and cuts the display panel 50 adsorbed by the stage 20. The first transfer portion 40 transfers the cut display panel 50 to the next process.
本發明例示性實施例之裁切裝置100係以可撓式顯示面板50為目標。換言之,裁切裝置100係用以裁切包含可撓式基板如聚合物薄膜之可撓式顯示面板50,而非包含剛性基板之顯示面板。 The cutting device 100 of the exemplary embodiment of the present invention targets the flexible display panel 50. In other words, the cutting device 100 is used to cut a flexible display panel 50 including a flexible substrate such as a polymer film, rather than a display panel including a rigid substrate.
可撓式顯示面板50包含可撓式基板、設置於可撓式基板上之屏障層、緩衝層、像素電路、有機發光二極體(OLED)及薄膜封裝層。屏障層及緩衝層係以沉積複數個無機層之結構形成,且薄膜封裝層係以複數個有機層及複數個無機層一對一交替沉積之結構形成。屏障層及緩衝層抑制朝著有機發光二極體(OLED)之水氣之背側滲透,且薄膜封裝層抑制朝著有機發光二極體(OLED)之水氣之前側滲透。 The flexible display panel 50 includes a flexible substrate, a barrier layer disposed on the flexible substrate, a buffer layer, a pixel circuit, an organic light emitting diode (OLED), and a thin film encapsulation layer. The barrier layer and the buffer layer are formed by depositing a plurality of inorganic layers, and the thin film encapsulation layer is formed by a plurality of organic layers and a plurality of inorganic layers alternately deposited one to one. The barrier layer and the buffer layer inhibit penetration toward the back side of the water vapor of the organic light emitting diode (OLED), and the thin film encapsulation layer inhibits penetration toward the front side of the water vapor of the organic light emitting diode (OLED).
插入載台20中之可撓式顯示面板50為包含複數個單位格之母基板。母基板之可撓式顯示面板50係由一結構所形成,其中對應於複數個顯示面板之像素電路、有機發光二極體(OLED)、薄膜封裝層係為一片狀沉積於可撓式基板上。保護膜係貼附於可撓式基板及薄膜封裝層之外表面。 The flexible display panel 50 inserted into the stage 20 is a mother substrate including a plurality of unit cells. The flexible display panel 50 of the mother substrate is formed by a structure in which a pixel circuit, an organic light emitting diode (OLED), and a thin film encapsulation layer corresponding to a plurality of display panels are deposited in a sheet shape on the flexible substrate. on. The protective film is attached to the outer surface of the flexible substrate and the thin film encapsulation layer.
第一傳送部10及第二傳送部40可以一般傳送機械裝置形成如輸送裝置或傳送帶。第一傳送部10係位於載台20之一側上,以在載台20上提供顯示面板50,且第二傳送部40係位於載台20之一側下,以自 載台20之下部接收及傳送已裁切之顯示面板50。參照第1圖,第一傳送部10及第二傳送部40所處之一側為載台20之右側。 The first transfer portion 10 and the second transfer portion 40 may be generally formed as a transport device or a conveyor belt. The first conveying portion 10 is located on one side of the stage 20 to provide the display panel 50 on the stage 20, and the second conveying portion 40 is located under one side of the stage 20 to The lower portion of the stage 20 receives and transports the cut display panel 50. Referring to Fig. 1, one side of the first transfer unit 10 and the second transfer unit 40 is on the right side of the stage 20.
裁切刀31係安裝於載台20之外部,且朝著顯示面板50下降以裁切顯示面板20。裁切刀31係位於相對於第一傳送部10及第二傳送部40之一側。裁切刀31係耦接裁切驅動器32且相對於載台20往復運動。裁切驅動器32可以各種方法如汽缸驅動方法及凸輪驅動方法之機械裝置形成。 The cutting blade 31 is attached to the outside of the stage 20 and is lowered toward the display panel 50 to cut the display panel 20. The cutting blade 31 is located on one side with respect to the first conveying unit 10 and the second conveying unit 40. The cutting blade 31 is coupled to the cutting drive 32 and reciprocates relative to the stage 20. The cutting drive 32 can be formed by various methods such as a cylinder driving method and a mechanical device of a cam driving method.
在本發明例示性實施例之裁切裝置100中,載台20係以具有一預定之曲率之圓柱型狀而形成,而非平板型狀。因此,吸附至載台20之顯示面板50係彎曲成與載台20相同之曲率,以藉此彎曲而產生拉力,使得顯示面板50係在施加拉力之狀態下藉由裁切刀31裁切。 In the cutting device 100 of the exemplary embodiment of the present invention, the stage 20 is formed in a cylindrical shape having a predetermined curvature instead of a flat plate shape. Therefore, the display panel 50 adsorbed to the stage 20 is bent to have the same curvature as the stage 20, thereby bending to generate a pulling force, so that the display panel 50 is cut by the cutting blade 31 in a state where the pulling force is applied.
載台20係耦接下述之真空吸附部及空氣釋放部,藉以穩定地吸附由第一傳送部10提供之顯示面板50,且平順地傳送已裁切之顯示面板50至第二傳送部40。 The stage 20 is coupled to the vacuum suction portion and the air release portion described below, thereby stably adsorbing the display panel 50 provided by the first transfer portion 10, and smoothly conveying the cut display panel 50 to the second transfer portion 40. .
第2圖為顯示於第1圖之裁切裝置之一部分之透視圖,第3圖為顯示於第2圖之載台之剖面圖。。 Fig. 2 is a perspective view showing a part of the cutting device shown in Fig. 1, and Fig. 3 is a sectional view showing the stage shown in Fig. 2. .
參照第2圖及第3圖,載台20係形成為包含複數個開口之雙管型狀。換言之,載台20包含形成複數個第一開口21之內管22、形成複數個第二開口23之外管24、以及在內管22及外管24之間連接第一開口21及第二開口23之複數個連接管25。 Referring to FIGS. 2 and 3, the stage 20 is formed in a double tube shape including a plurality of openings. In other words, the stage 20 includes an inner tube 22 forming a plurality of first openings 21, a tube 24 forming a plurality of second openings 23, and a first opening 21 and a second opening connected between the inner tube 22 and the outer tube 24. 23 of a plurality of connecting tubes 25.
依據載台20之半徑方向,第一開口21及第二開口23係相互面對,且其提供相同數量並一對一相互對應。複數個連接管25係平行於 載台20之半徑方向而設置。依據內管22之軸方向及圓周方向,第一開口21係彼此以相等間距設置,且依據外管24之軸方向及圓周方向,第二開口23係彼此以相等間距設置。 According to the radial direction of the stage 20, the first opening 21 and the second opening 23 face each other, and they provide the same number and correspond one-to-one to each other. a plurality of connecting tubes 25 are parallel to The stage 20 is provided in the radial direction. The first openings 21 are disposed at equal intervals from each other according to the axial direction and the circumferential direction of the inner tube 22, and the second openings 23 are disposed at equal intervals from each other according to the axial direction and the circumferential direction of the outer tube 24.
載台20係藉由載台驅動器60之動力而旋轉。載台驅動器60可包含驅動馬達61、連接驅動馬達61之驅動齒輪62、以及依據外管24之圓周方向形成且嚙合驅動齒輪62之垂直運動齒輪63。在此例子中,若驅動齒輪62係藉由驅動馬達61之動力而旋轉,則當垂直運動齒輪63嚙合驅動齒輪62旋轉時,載台20便旋轉。 The stage 20 is rotated by the power of the stage driver 60. The stage drive 60 may include a drive motor 61, a drive gear 62 that connects the drive motor 61, and a vertical motion gear 63 that is formed in accordance with the circumferential direction of the outer tube 24 and that engages the drive gear 62. In this example, if the drive gear 62 is rotated by the power of the drive motor 61, when the vertical motion gear 63 meshes with the drive gear 62, the stage 20 rotates.
載台驅動器60不限於上述結構,且可應用耦接載台20以旋轉載台20之機械結構。 The stage driver 60 is not limited to the above structure, and a mechanical structure that couples the stage 20 to rotate the stage 20 can be applied.
管型之支撐件65係經由軸承66耦接載台20之兩端以支撐載台20。軸承66可為球型軸承,其中複數個金屬球係設置於內環及外環之間。在此例子中,支撐件65係固定於內環,且載台20之內管22係固定於外環。軸承66不限於球型軸承,且可替換各種軸承。 The tubular support member 65 is coupled to both ends of the stage 20 via bearings 66 to support the stage 20. The bearing 66 can be a ball bearing in which a plurality of metal balls are disposed between the inner ring and the outer ring. In this example, the support member 65 is fixed to the inner ring, and the inner tube 22 of the stage 20 is fixed to the outer ring. The bearing 66 is not limited to a ball bearing and can replace various bearings.
第4圖為顯示於第2圖之載台之內部之透視圖,第5圖為由第4圖之A方向所觀看之真空吸附部之透視圖,以及第6圖為顯示於第4圖之真空吸附部及空氣釋放部之剖面圖。 Fig. 4 is a perspective view showing the inside of the stage shown in Fig. 2, Fig. 5 is a perspective view of the vacuum suction portion viewed from the direction A of Fig. 4, and Fig. 6 is a view showing Fig. 4; A cross-sectional view of the vacuum adsorption section and the air release section.
參照第4圖至第6圖,裁切裝置100包含位於載台20內部之真空吸附部70及空氣釋放部80。支撐件65係固定於真空吸附部70及空氣釋放部80之兩側,以支撐真空吸附部70及空氣釋放部80。真空吸附部70及空氣釋放部80係與內管22分隔,其係以一預定距離而旋轉。 Referring to FIGS. 4 to 6 , the cutting device 100 includes a vacuum suction portion 70 and an air release portion 80 that are located inside the stage 20 . The support member 65 is fixed to both sides of the vacuum suction portion 70 and the air release portion 80 to support the vacuum suction portion 70 and the air release portion 80. The vacuum adsorption unit 70 and the air release unit 80 are separated from the inner tube 22 and rotated at a predetermined distance.
真空吸附部70包含面對內管22之一部份且形成複數個第一狹縫71之第一主體72、產生真空壓力之真空幫浦73、以及連接第一主體72之內部及真空幫浦73之第一連接管74。 The vacuum adsorption portion 70 includes a first body 72 that faces a portion of the inner tube 22 and forms a plurality of first slits 71, a vacuum pump 73 that generates vacuum pressure, and an inner portion that connects the first body 72 and a vacuum pump The first connecting pipe 74 of 73.
第一主體72可以半圓柱型形成,且複數個第一狹縫71係形成於面對內管22之曲面。複數個第一狹縫71係依據第一主體72之圓周方向形成,且可依據第一主體72之軸方向彼此以相等間距形成。真空幫浦73係位於支撐件65之外部,且第一連接管74係位於支撐件65之內部,藉此連接第一主體72及真空幫浦73。 The first body 72 may be formed in a semi-cylindrical shape, and a plurality of first slits 71 are formed on a curved surface facing the inner tube 22. The plurality of first slits 71 are formed in accordance with the circumferential direction of the first body 72, and may be formed at equal intervals from each other in accordance with the axial direction of the first body 72. The vacuum pump 73 is located outside the support member 65, and the first connecting tube 74 is located inside the support member 65, thereby connecting the first body 72 and the vacuum pump 73.
第一主體72係固定且安裝於顯示面板50要吸附之部分。換言之,第一主體72係位於面對第1圖之裁切刀31之載台20之內部左側。 The first body 72 is fixed and mounted to a portion of the display panel 50 to be adsorbed. In other words, the first body 72 is located on the inner left side of the stage 20 facing the cutting blade 31 of Fig. 1.
產生於真空幫浦73之真空壓力係經由第一主體72之第一狹縫71、面對第一主體72之載台20之第一開口21以及第二開口23傳送至顯示面板50。因此,插入載台20之顯示面板50係藉由真空壓力而吸附以穩固地固定於載台20。 The vacuum pressure generated by the vacuum pump 73 is transmitted to the display panel 50 via the first slit 71 of the first body 72, the first opening 21 facing the stage 20 of the first body 72, and the second opening 23. Therefore, the display panel 50 inserted into the stage 20 is adsorbed by vacuum pressure to be firmly fixed to the stage 20.
此時,第一主體72係固定且以一預定之位置安裝,且複數個第一開口21及複數個第二開口23係依據載台20之圓周方向及軸方向以相等間距設置,使得當載台20旋轉時,真空壓力係施加於在第一主體72安裝之位置內之顯示面板50。 At this time, the first body 72 is fixed and mounted at a predetermined position, and the plurality of first openings 21 and the plurality of second openings 23 are disposed at equal intervals according to the circumferential direction and the axial direction of the stage 20, so that when loaded When the stage 20 is rotated, vacuum pressure is applied to the display panel 50 in the position where the first body 72 is mounted.
空氣釋放部80包含面對內管22之一部份且形成複數個第二狹縫81之第二主體82、排出壓縮空氣之空氣幫浦83、以及連接第二主體82之內部及空氣幫浦83之第二連接管84。 The air release portion 80 includes a second body 82 facing a portion of the inner tube 22 and forming a plurality of second slits 81, an air pump 83 for discharging compressed air, and an inner portion and an air pump connecting the second body 82. The second connecting tube 84 of 83.
第二主體82可以半圓柱型或四分之一圓柱型形成,且複數個第二狹縫81係形成於面對內管22之曲面。複數個第二狹縫81係依據第二主體82之圓周方向延長,且可依據第二主體82之軸方向以相等間距設置。空氣幫浦83係位於支撐件65之外部,且第二連接管84係安裝於支撐件65之內部,藉此連接第二主體82及空氣幫浦83。 The second body 82 may be formed in a semi-cylindrical or quarter-cylindrical shape, and a plurality of second slits 81 are formed on a curved surface facing the inner tube 22. The plurality of second slits 81 are elongated in accordance with the circumferential direction of the second body 82, and may be disposed at equal intervals in accordance with the axial direction of the second body 82. The air pump 83 is located outside the support member 65, and the second connecting tube 84 is mounted inside the support member 65, thereby connecting the second body 82 and the air pump 83.
第二主體82係固定且安裝於顯示面板50要分離之部分。換言之,第二主體82係位於面對第1圖之第二傳送部40之載台20之內部右側。 The second body 82 is fixed and mounted to a portion of the display panel 50 to be separated. In other words, the second body 82 is located on the inner right side of the stage 20 facing the second conveying portion 40 of Fig. 1 .
自空氣幫浦83排出之壓縮空氣係經由第二主體82之第二狹縫81、面對第二主體82之載台20之第一開口21以及第二開口23傳送至顯示面板50。因此,吸附至載台20及裁切之顯示面板50係藉由壓縮空氣自載台20分離,且傳送至第二傳送部40。 The compressed air discharged from the air pump 83 is transmitted to the display panel 50 via the second slit 81 of the second body 82, the first opening 21 facing the stage 20 of the second body 82, and the second opening 23. Therefore, the display panel 50 adsorbed to the stage 20 and cut is separated from the stage 20 by compressed air, and is transferred to the second transfer unit 40.
此時,第二主體82係固定且以一預定之位置安裝,且複數個第一開口21及複數個第二開口23係依據載台20之圓周方向及軸方向以相等間距設置,使得當載台20旋轉時,壓縮空氣係吹向位於第二主體82安裝之位置內之顯示面板50。 At this time, the second body 82 is fixed and mounted at a predetermined position, and the plurality of first openings 21 and the plurality of second openings 23 are disposed at equal intervals according to the circumferential direction and the axial direction of the stage 20, so that when loaded When the stage 20 is rotated, the compressed air is blown toward the display panel 50 located in the position where the second body 82 is mounted.
在第4圖及第6圖中,第一主體72係以半圓柱型形成,且第二主體82係以四分之一圓柱型形成,然而第一主體72及第二主體82之曲面之寬度不限於範例所示,且可進行各種修改。 In FIGS. 4 and 6, the first body 72 is formed in a semi-cylindrical shape, and the second body 82 is formed in a quarter cylindrical shape, but the width of the curved surface of the first body 72 and the second body 82 is It is not limited to the examples, and various modifications can be made.
第7圖為在裁切製程中顯示面板之放大剖面圖。 Figure 7 is an enlarged cross-sectional view of the display panel in the cutting process.
參照第1圖及第7圖,來自第一傳送部10至載台20插入之顯示面板50係被吸附至載台20之表面。吸附至載台20之顯示面板50係彎曲 成與載台20相同之曲率,且藉由彎曲產生拉力,且藉由裁切刀31於施加拉力的狀態下裁切。 Referring to FIGS. 1 and 7, the display panel 50 from which the first transfer unit 10 is inserted into the stage 20 is adsorbed to the surface of the stage 20. The display panel 50 adsorbed to the stage 20 is bent The curvature is the same as that of the stage 20, and a pulling force is generated by bending, and is cut by the cutting blade 31 in a state where a tensile force is applied.
在第7圖中,顯示面板50包含可撓式基板51、屏障層52、緩衝層53、像素電路54、有機發光二極體(OLED)層55、及薄膜封裝層56。此外,下保護膜57及上保護膜58係分別位於可撓式基板51及薄膜封裝層56之外面。 In FIG. 7, the display panel 50 includes a flexible substrate 51, a barrier layer 52, a buffer layer 53, a pixel circuit 54, an organic light emitting diode (OLED) layer 55, and a thin film encapsulation layer 56. Further, the lower protective film 57 and the upper protective film 58 are located on the outer surfaces of the flexible substrate 51 and the thin film encapsulation layer 56, respectively.
在施加拉力之狀態下藉由裁切刀31刺穿顯示面板50,顯示面板50在裁切刀31刺穿後之切口表面係直接地藉由拉力而容易打開。因此,藉由裁切刀31之刺穿在裁切刀31之每一側之水平方向中推擠各層之力量則不會產生,藉此可預防包含複數個無機層之屏障層52及緩衝層53之裂痕產生。 When the display panel 50 is pierced by the cutting blade 31 in a state where the pulling force is applied, the surface of the slit of the display panel 50 after the cutting of the cutting blade 31 is directly opened by the pulling force. Therefore, the force of pushing the layers in the horizontal direction of each side of the cutting blade 31 by the piercing of the cutting blade 31 does not occur, thereby preventing the barrier layer 52 and the buffer layer including the plurality of inorganic layers from being prevented. The crack of 53 is produced.
第8圖為使用比較例之裁切裝置之顯示面板之裁切製程之示意圖。 Fig. 8 is a view showing the cutting process of the display panel using the cutting device of the comparative example.
參閱第8圖,若裁切刀31進入顯示面板501而未施加拉力,推擠各層之力量(參照箭頭)係於裁切刀31之每一側之水平方向中產生。因此,裂痕在靠近切口表面之以無機層製造之屏障層52及緩衝層53中產生,使得由於裂痕造成之收縮缺陷可能產生於顯示面板501中。 Referring to Fig. 8, if the cutting blade 31 enters the display panel 501 without applying a pulling force, the force pushing the layers (refer to the arrow) is generated in the horizontal direction of each side of the cutting blade 31. Therefore, cracks are generated in the barrier layer 52 and the buffer layer 53 which are made of an inorganic layer close to the surface of the slit, so that shrinkage defects due to cracks may be generated in the display panel 501.
然而,在本發明範例實施例之裁切裝置100中,拉力可施加至顯示面板50,使得切口表面藉由小壓力(藉由裁切刀31之刮痕)而容易打開,藉由裁切刀31之刺穿之裂痕則不會產生。因此,本發明範例實施例之裁切裝置100可平順地裁切顯示面板50,而不會產生裂痕,且可避免顯示面板50之收縮缺陷。 However, in the cutting device 100 of the exemplary embodiment of the present invention, a pulling force can be applied to the display panel 50 such that the slit surface is easily opened by a small pressure (by the scratch of the cutting blade 31) by the cutting blade The piercing crack of 31 will not occur. Therefore, the cutting device 100 of the exemplary embodiment of the present invention can smoothly cut the display panel 50 without cracks, and the shrinkage defect of the display panel 50 can be avoided.
第9圖為依據範例實施例之顯示裝置之製造方法之製程流程圖。 FIG. 9 is a process flow diagram of a method of manufacturing a display device according to an exemplary embodiment.
參照第9圖,顯示裝置之製造方法包含傳送母基板之顯示面板至圓柱型之載台之第一步驟(S10),以及吸附顯示面板至載台且同時將顯示面板彎曲成與載台相同之曲率以施加拉力至顯示面板之的第二步驟(S20)。此外,顯示裝置之製造方法包含藉由使用裁切刀裁切顯示面板之第三步驟(S30),以及自載台分離已裁切之顯示面板之第四步驟(S40)。 Referring to FIG. 9, the manufacturing method of the display device includes a first step of transferring the display panel of the mother substrate to the cylindrical stage (S10), and adsorbing the display panel to the stage while bending the display panel to be the same as the stage. The curvature is to apply a pulling force to the second step of the display panel (S20). Further, the manufacturing method of the display device includes a third step of cutting the display panel by using a cutting blade (S30), and a fourth step of separating the cut display panel from the stage (S40).
第10圖為顯示於第9圖之第一步驟之顯示面板之上視圖,以及第11圖為顯示於第10圖之顯示面板之放大剖面圖。 Figure 10 is a top view of the display panel shown in the first step of Figure 9, and Figure 11 is an enlarged cross-sectional view of the display panel shown in Figure 10.
參照第10圖及第11圖,第一步驟(S10)之顯示面板50包含可撓式基板51,以及複數個像素電路及複數個有機發光二極體(OLEDs)551係分別設置於可撓式基板51上之複數個預定之單位格區域(如第10圖中之虛線所示)中。此外,顯示面板50包含覆蓋複數個有機發光二極體(OLEDs)551之薄膜封裝層56、覆蓋薄膜封裝層56之上保護膜58、及覆蓋可撓式基板51之外部表面之下保護膜57。 Referring to FIG. 10 and FIG. 11 , the display panel 50 of the first step ( S10 ) includes a flexible substrate 51 , and a plurality of pixel circuits and a plurality of organic light emitting diodes (OLEDs) 551 are respectively disposed on the flexible A plurality of predetermined unit cell regions (shown by broken lines in Fig. 10) on the substrate 51. In addition, the display panel 50 includes a thin film encapsulation layer 56 covering a plurality of organic light emitting diodes (OLEDs) 551, a protective film 58 over the cover film encapsulation layer 56, and a protective film 57 covering the outer surface of the flexible substrate 51. .
像素電路及有機發光二極體(OLEDs)551係於每一個像素一個接一個形成。像素電路包含至少兩個薄膜電晶體(開關薄膜電晶體及驅動薄膜電晶體)及至少一個電容。第11圖係顯示驅動薄膜電晶體541。屏障層52及緩衝層53係位於可撓式基板51及像素電路之間。屏障層52及緩衝層53係以其中沉積複數個無機層之結構而形成。 A pixel circuit and organic light emitting diodes (OLEDs) 551 are formed one after another for each pixel. The pixel circuit includes at least two thin film transistors (switching film transistor and driving thin film transistor) and at least one capacitor. Fig. 11 shows a driving film transistor 541. The barrier layer 52 and the buffer layer 53 are located between the flexible substrate 51 and the pixel circuit. The barrier layer 52 and the buffer layer 53 are formed by a structure in which a plurality of inorganic layers are deposited.
有機發光二極體(OLED)551包含像素電極552、有機發光層553及共同電極554。像素電極552係分別地提供予每一個像素且電性 連接驅動薄膜電晶體541。共同電極554係形成於整個可撓式基板51中而沒有像素區別。開關薄膜電晶體係作為用於選擇發光之像素之開關,且驅動薄膜電晶體541施加用以將使所選擇之像素中的有機發光層553發光之驅動電壓施加至像素電極552。 The organic light emitting diode (OLED) 551 includes a pixel electrode 552, an organic light emitting layer 553, and a common electrode 554. The pixel electrode 552 is separately provided to each pixel and electrically The driving film transistor 541 is connected. The common electrode 554 is formed in the entire flexible substrate 51 without pixel distinction. The switch film electro-crystal system is used as a switch for selecting pixels for illumination, and the drive film transistor 541 is applied to apply a driving voltage for causing the organic light-emitting layer 553 in the selected pixel to emit light to the pixel electrode 552.
像素電極552及共同電極554之其中之一為當作電洞注入電極之陽極,且另一為當作電子注入電極之陰極。自陽極注入之電洞及自陰極注入之電子係於有機發光層553中結合以產生激子,且當激子發出能量時,便執行發光。 One of the pixel electrode 552 and the common electrode 554 is an anode serving as a hole injection electrode, and the other is a cathode serving as an electron injection electrode. The holes injected from the anode and the electrons injected from the cathode are combined in the organic light-emitting layer 553 to generate excitons, and when the excitons emit energy, light emission is performed.
像素電極552及共同電極554之其中之一可以金屬層形成,且另一可以半透射層或透明導電層形成。有機發光層533之光線係自金屬層反射,且傳送至半透射層或透明導電層以向外發光。 One of the pixel electrode 552 and the common electrode 554 may be formed of a metal layer, and the other may be formed of a semi-transmissive layer or a transparent conductive layer. The light of the organic light-emitting layer 533 is reflected from the metal layer and transmitted to the semi-transmissive layer or the transparent conductive layer to emit light outward.
薄膜封裝層56封裝複數個有機發光二極體(OLEDs)551,以抑制由外部水氣及氧氣造成之有機發光二極體(OLEDs)551之惡化。薄膜封裝層56可具有由至少一個有機層及至少一個無機層一個接一個交替堆疊之結構。此外,暴露於薄膜封裝層56外部之最上層可以無機層形成,以預防蒸氣滲透進入有機發光二極體551。 The thin film encapsulation layer 56 encapsulates a plurality of organic light emitting diodes (OLEDs) 551 to suppress deterioration of the organic light emitting diodes (OLEDs) 551 caused by external moisture and oxygen. The thin film encapsulation layer 56 may have a structure in which at least one organic layer and at least one inorganic layer are alternately stacked one after another. Further, the uppermost layer exposed to the outside of the thin film encapsulation layer 56 may be formed of an inorganic layer to prevent vapor from penetrating into the organic light emitting diode 551.
薄膜封裝層56之有機層係以聚合物製成,且可例如為以聚對苯二甲酸乙二醇酯(polyethylene terephthalate)、聚酰亞胺(polyimide)、聚碳酸酯(polycarbonate)、環氧樹脂(epoxy)、聚乙烯(polyethylene)及聚丙烯酸酯(polyacrylate)之任一者之單層或多層所製造。薄膜封裝層56之無機層可為包含金屬氧化物或金屬氮化物之單層或 多層。舉例來說,無機層可包含係氮化物(SiNx)、三氧化二鋁(Al2O3)、二氧化矽(SiO2)及二氧化鈦(TiO2)之任一者。 The organic layer of the film encapsulation layer 56 is made of a polymer, and may be, for example, polyethylene terephthalate, polyimide, polycarbonate, epoxy. It is produced by a single layer or a plurality of layers of any of epoxy, polyethylene, and polyacrylate. The inorganic layer of the thin film encapsulation layer 56 may be a single layer or a plurality of layers including a metal oxide or a metal nitride. For example, the inorganic layer may include any of a nitride (SiNx), an aluminum oxide (Al 2 O 3 ), cerium oxide (SiO 2 ), and titanium dioxide (TiO 2 ).
再次參照第1圖至第6圖,在第一步驟(S10)中,母基板之顯示面板50係藉由第一傳送部10傳送至載台20,且在第二步驟(S20)中,顯示面板50係藉由真空吸附部70所產生之真空壓力而被吸附至載台20之外管24。在第二步驟(S20)中,顯示面板50係彎曲成與載台20之外管24相同之曲率,藉以產生拉力。 Referring again to FIGS. 1 to 6, in the first step (S10), the display panel 50 of the mother substrate is transferred to the stage 20 by the first transfer unit 10, and is displayed in the second step (S20). The panel 50 is adsorbed to the outer tube 24 of the stage 20 by the vacuum pressure generated by the vacuum suction unit 70. In the second step (S20), the display panel 50 is bent to have the same curvature as the outer tube 24 of the stage 20, thereby generating a pulling force.
在第三步驟(S30)中,裁切刀31係朝著顯示面板50下降並裁切顯示面板50。藉由將裁切刀31刺穿施加拉力之顯示面板50,在裁切刀31之刺穿後,顯示面板50之切口表面藉由拉力而直接地易於打開。因此,可預防屏障層52及緩衝層53之裂痕產生,且可獲得均勻的切口表面。 In the third step (S30), the cutting blade 31 is lowered toward the display panel 50 and the display panel 50 is cut. By piercing the cutting blade 31 by the display panel 50 to which the pulling force is applied, after the piercing of the cutting blade 31, the slit surface of the display panel 50 is directly opened easily by the pulling force. Therefore, crack generation of the barrier layer 52 and the buffer layer 53 can be prevented, and a uniform slit surface can be obtained.
已裁切之顯示面板50維持在已裁切之顯示面板50被吸附至載台20之狀態,且接著在面對第二主體82之位置接收壓縮空氣以自載台20分離。自載台20分離之顯示面板50係經由第二傳送部40傳送至接下來的製程。 The cut display panel 50 is maintained in a state where the cut display panel 50 is adsorbed to the stage 20, and then receives compressed air at a position facing the second body 82 to be separated from the stage 20. The display panel 50 separated from the stage 20 is transferred to the next process via the second transfer unit 40.
參照第10圖,母基板之顯示面板50包含平行之複數個單位格(如虛線所示),其係依據第一方向(y軸方向)及與第一方向相交之第二方向(x軸方向)而平行設置。 Referring to FIG. 10, the display panel 50 of the mother substrate includes a plurality of parallel unit cells (shown by broken lines) according to the first direction (y-axis direction) and the second direction intersecting the first direction (x-axis direction). ) and set in parallel.
顯示面板50之首次裁切係依據平行於第一方向之第一裁切線CL1,以被分成條狀,其中複數個單位格係形成於一方向(線裁切)。條狀之顯示面板50接著依據平行於第二方向之第二裁切線CL2裁切,藉此複數個單位格係個別地被區分(單位裁切)。 The first cutting of the display panel 50 is divided into strips according to the first cutting line CL1 parallel to the first direction, wherein a plurality of unit cells are formed in one direction (line cutting). The strip-shaped display panel 50 is then cut according to a second cutting line CL2 parallel to the second direction, whereby a plurality of unit cells are individually distinguished (unit cut).
上保護膜58及下保護膜57係於裁切製程後移除,且至少一部分可不被移除且可保留在顯示面板50。藉由裁切製程分離之顯示面板50接著以覆晶薄膜(Chip On Film,COF)及印刷電路板(Printed Circuit Board,PCB)組裝以完成顯示裝置。可撓式印刷電路(Flexible Printed Circuit,FPC)包含輸出控制訊號至顯示面板50之控制電路,以及電性及物理性連接顯示面板50及可撓式印刷電路(FPC)之覆晶薄膜。 The upper protective film 58 and the lower protective film 57 are removed after the cutting process, and at least a portion may not be removed and may remain on the display panel 50. The display panel 50 separated by the cutting process is then assembled by a chip on film (COF) and a printed circuit board (PCB) to complete the display device. The Flexible Printed Circuit (FPC) includes a control circuit for outputting a control signal to the display panel 50, and a flip chip for electrically and physically connecting the display panel 50 and the flexible printed circuit (FPC).
當本發明已連結目前認為係實際範例之實施例而描述,其將被理解的是,本發明不限於所揭露之實施例,惟,另一方面,本發明係意圖涵蓋包含於後附申請專利範圍之精神與範疇之各種修改及等效配置。 While the present invention has been described in connection with the embodiments of the present invention, it is understood that the invention is not limited to the disclosed embodiments, but in another aspect, the present invention is intended to cover the appended claims. Various modifications and equivalent configurations of the spirit and scope of the scope.
10‧‧‧第一傳送部 10‧‧‧First Transfer Department
20‧‧‧載台 20‧‧‧ stage
31‧‧‧裁切刀 31‧‧‧ cutting knife
32‧‧‧裁切驅動器 32‧‧‧Cut drive
40‧‧‧第二傳送部 40‧‧‧Second Transfer Department
50‧‧‧顯示面板 50‧‧‧ display panel
72‧‧‧第一主體 72‧‧‧ first subject
82‧‧‧第二主體 82‧‧‧Second subject
100‧‧‧裁切裝置 100‧‧‧ cutting device
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