TWI591667B - Flexible circuit board - Google Patents

Flexible circuit board Download PDF

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Publication number
TWI591667B
TWI591667B TW105135325A TW105135325A TWI591667B TW I591667 B TWI591667 B TW I591667B TW 105135325 A TW105135325 A TW 105135325A TW 105135325 A TW105135325 A TW 105135325A TW I591667 B TWI591667 B TW I591667B
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Taiwan
Prior art keywords
surrounding
circuit board
flexible circuit
substrate
lines
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TW105135325A
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Chinese (zh)
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TW201810318A (en
Inventor
孫永祥
曾恭勝
范學源
江嘉華
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毅嘉科技股份有限公司
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Priority to TW105135325A priority Critical patent/TWI591667B/en
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Publication of TW201810318A publication Critical patent/TW201810318A/en

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Description

軟式電路板 Flexible circuit board

本發明是涉及一種電磁鐵,還涉及一種能被應用於電磁鐵的軟式電路板。 The present invention relates to an electromagnet and to a flexible circuit board that can be applied to an electromagnet.

常用的電磁鐵是以金屬線纏繞在芯體周圍,以使金屬線纏繞形成線圈。然而,常用的電磁鐵構造因為使用金屬線纏繞芯體,所以會使得常用電磁鐵的體積受到金屬線侷限,而無法進一步地縮小,並且常用電磁鐵的生產製造也會因為使用金屬線而降低產能。 A commonly used electromagnet is wound around a core with a wire so that the wire is wound to form a coil. However, the commonly used electromagnet construction uses a metal wire to wrap the core, so that the volume of the common electromagnet is limited by the metal wire, and cannot be further reduced, and the production of the commonly used electromagnet also reduces the productivity due to the use of the metal wire. .

於是,本發明人認為上述缺陷可改善,乃特潛心研究並配合學理的運用,終於提出一種設計合理且有效改善上述缺陷的本發明。 Accordingly, the inventors believe that the above-mentioned defects can be improved, and that the present invention has been put forward with great interest in designing and cooperating with the theory, and finally proposes a design which is reasonable in design and effective in improving the above defects.

本發明實施例在於提供一種軟式電路板,能有效地解決常用電磁鐵所存在的問題。 The embodiment of the invention provides a flexible circuit board, which can effectively solve the problems existing in the common electromagnet.

本發明實施例公開一種軟式電路板,包括:一基板及彼此分離地設置於所述基板的多條圍繞線路,所述基板的相反兩端相接而形成一管狀結構,並且多條所述圍繞線路依序頭尾相接而構成至少一線圈;其中,每個所述圍繞線路包括有兩個金屬層及連接所述兩個金屬層的至少一連接部;每個所述圍繞線路的兩個所述金屬層分別形成在所述基板的相反兩個板面上,而每個所述圍繞線路的所述至少一連接部埋置於所述基板內。 The embodiment of the invention discloses a flexible circuit board, comprising: a substrate and a plurality of surrounding lines disposed on the substrate separately from each other, the opposite ends of the substrate are connected to form a tubular structure, and the plurality of said surrounding The lines are connected end to end to form at least one coil; wherein each of the surrounding lines includes two metal layers and at least one connecting portion connecting the two metal layers; two of each of the surrounding lines The metal layers are respectively formed on opposite plate faces of the substrate, and the at least one connecting portion of each of the surrounding wires is buried in the substrate.

綜上所述,本發明實施例所公開的軟式電路板,能通過所述 線路單元所構成的線圈取代習用金屬線條所繞成的線圈,藉以利於所述電磁鐵的生產製造及微小化。 In summary, the flexible circuit board disclosed in the embodiment of the present invention can pass the The coil formed by the line unit replaces the coil wound by the conventional metal wire, thereby facilitating the manufacture and miniaturization of the electromagnet.

為使能更進一步瞭解本發明的特徵及技術內容,請參閱以下有關本發明的詳細說明與附圖,但是此等說明與附圖僅用來說明本發明,而非對本發明的保護範圍作任何的限制。 For a better understanding of the features and technical aspects of the present invention, reference should be made to the accompanying drawings limits.

100‧‧‧電磁鐵 100‧‧‧electromagnet

1‧‧‧軟式電路板 1‧‧‧Soft circuit board

11‧‧‧基板(管狀結構) 11‧‧‧Substrate (tubular structure)

111‧‧‧圍繞區(管狀結構) 111‧‧‧ surrounding area (tubular structure)

1111‧‧‧第一端部 1111‧‧‧ first end

1112‧‧‧第二端部 1112‧‧‧ second end

112‧‧‧連接區 112‧‧‧Connected area

12‧‧‧線路單元 12‧‧‧Line unit

121‧‧‧圍繞線路 121‧‧‧ Around the line

1211‧‧‧金屬層 1211‧‧‧ metal layer

1212‧‧‧連接部 1212‧‧‧Connecting Department

1213‧‧‧第一焊墊 1213‧‧‧First pad

1214‧‧‧第二焊墊 1214‧‧‧Second pad

122‧‧‧連接線路 122‧‧‧Connected lines

1221‧‧‧金屬層 1221‧‧‧metal layer

1222‧‧‧連接部 1222‧‧‧Connecting Department

1223‧‧‧連接焊墊 1223‧‧‧Connecting pads

13‧‧‧接合層 13‧‧‧ bonding layer

2‧‧‧芯體 2‧‧‧ core

L‧‧‧長度方向 L‧‧‧ Length direction

圖1為本發明電磁鐵實施例一的俯視示意圖。 1 is a schematic top plan view of a first embodiment of an electromagnet according to the present invention.

圖2為本發明電磁鐵實施例一的側視示意圖。 2 is a side elevational view of the first embodiment of the electromagnet of the present invention.

圖3為本發明電磁鐵實施例一的軟式電路板呈平面狀態的示意圖。 3 is a schematic view showing the state in which the flexible circuit board of the first embodiment of the electromagnet of the present invention is in a planar state.

圖4為圖3沿IV-IV剖線的剖視示意圖。 Figure 4 is a cross-sectional view taken along line IV-IV of Figure 3;

圖5為圖3沿V-V剖線的剖視示意圖。 Figure 5 is a cross-sectional view of Figure 3 taken along line V-V.

圖6為圖3沿V-V剖線的另一剖視示意圖。 Figure 6 is another cross-sectional view of Figure 3 taken along line V-V.

圖7為圖3沿V-V剖線的又一部視示意圖。 Figure 7 is a further perspective view of Figure 3 taken along line V-V.

圖8為本發明電磁鐵實施例二的立體示意圖。 FIG. 8 is a perspective view of a second embodiment of an electromagnet according to the present invention.

圖9為本發明電磁鐵實施例二的軟式電路板呈平面狀態的示意圖。 Fig. 9 is a schematic view showing the state in which the flexible circuit board of the second embodiment of the electromagnet of the present invention is in a planar state.

圖10為圖9的軟式電路板安裝於芯體的立體示意圖。 10 is a perspective view showing the flexible circuit board of FIG. 9 mounted on a core.

[實施例一] [Example 1]

請參閱圖1至圖7,為本發明的實施例一,需先說明的是,本實施例對應圖式所提及的相關數量與外型,僅用來具體地說明本發明的實施方式,以便於了解本發明的內容,而非用來侷限本發明的保護範圍。 Referring to FIG. 1 to FIG. 7 , which is a first embodiment of the present invention, it should be noted that the related numbers and appearances mentioned in the embodiments are only used to specifically describe the embodiments of the present invention. The scope of the present invention is not to be construed as limiting the scope of the present invention.

如圖1和圖2所示,本實施例公開一種電磁鐵100,包括一軟式電路板1與一芯體2,上述軟式電路板1套設於所述芯體2,並且軟式電路板1能夠接收電流,以使所述芯體2產生磁性。也就是說,本實施例是以軟式電路板1取代金屬線條所繞成的線圈,藉以利於所述電磁鐵100的生產製造及微小化。為便於理解本實 施例的電磁鐵100,以下先就軟式電路板1呈平面狀態的可能實施構造作一說明,但不侷限於此。 As shown in FIG. 1 and FIG. 2, the embodiment discloses an electromagnet 100 including a flexible circuit board 1 and a core 2, the flexible circuit board 1 is sleeved on the core 2, and the flexible circuit board 1 can A current is received to cause the core 2 to be magnetic. That is to say, in the present embodiment, the coil formed by the metal circuit is replaced by the flexible circuit board 1 to facilitate the manufacture and miniaturization of the electromagnet 100. To facilitate understanding of this reality The electromagnet 100 of the embodiment will be described below with a possible implementation of the flexible circuit board 1 in a planar state, but is not limited thereto.

如圖3所示,所述軟式電路板1包括一基板11與形成於所述基板11的一線路單元12。其中,所述基板11於本實施例中所使用的材質為聚醯亞胺(Polyimide,PI),所述基板11具有多個圍繞區111及位於任兩個相鄰所述圍繞區111間的一連接區112。多個所述圍繞區111各呈長條狀且彼此平行,而任兩相鄰的所述圍繞區111的相對應部位則以一個所述連接區112連接。也就是說,任一個所述連接區112與所相連接的兩個所述圍繞區111構成H字型。 As shown in FIG. 3, the flexible circuit board 1 includes a substrate 11 and a line unit 12 formed on the substrate 11. The material used in the embodiment of the substrate 11 is Polyimide (PI), and the substrate 11 has a plurality of surrounding regions 111 and is located between any two adjacent surrounding regions 111. A connection area 112. A plurality of the surrounding areas 111 are each elongated and parallel to each other, and corresponding portions of any two adjacent surrounding areas 111 are connected by one of the connecting areas 112. That is, any one of the connection regions 112 and the two surrounding regions 111 connected thereto form an H-shape.

所述線路單元12於本實施例中是以銅所製成,並且線路單元12包括彼此分離設置的多條圍繞線路121及多條連接線路122,也就是說,多條所述圍繞線路121及多條所述連接線路122的任兩條線路不會相互接觸。其中,多條所述圍繞線路121分別形成於多個所述圍繞區111上,每個所述連接區112及相鄰的兩個所述圍繞區111上設置有一條所述連接線路122。須說明的是,每個所述圍繞區111上的所述圍繞線路121數量於本實施例中為多個,但每個所述圍繞區111上也可以僅形成有單條所述圍繞線路121。 The line unit 12 is made of copper in the embodiment, and the line unit 12 includes a plurality of surrounding lines 121 and a plurality of connecting lines 122 which are disposed apart from each other, that is, a plurality of the surrounding lines 121 and Any two of the plurality of connecting lines 122 do not contact each other. A plurality of the surrounding lines 121 are respectively formed on the plurality of surrounding areas 111, and each of the connecting areas 112 and two adjacent surrounding areas 111 are provided with one connecting line 122. It should be noted that the number of the surrounding lines 121 on each of the surrounding areas 111 is plural in the embodiment, but only a single of the surrounding lines 121 may be formed on each of the surrounding areas 111.

如圖3和圖4所示,每個所述圍繞線路121包括有兩個金屬層1211及連接所述兩個金屬層1211的至少一連接部1212。每個所述圍繞線路121的兩個所述金屬層1211分別形成在所述基板11的相反兩個板面上(如圖4中的基板11頂面與底面),而每個所述圍繞線路121的連接部1212埋置於所述基板11內。再者,每個所述圍繞線路121的兩個所述金屬層1211能夠上下對齊(圖中未示出)或是錯位設置,在此不加以限制。藉此,所述圍繞線路121透 過將兩個金屬層1211分別形成在基板11的相反兩個板面,以使圍繞線路121的加工難度能夠有效地降低,例如:所述圍繞線路121的蝕刻深度降低,使圍繞線路121的成形更為容易。 As shown in FIGS. 3 and 4, each of the surrounding lines 121 includes two metal layers 1211 and at least one connecting portion 1212 connecting the two metal layers 1211. Two of the metal layers 1211 surrounding the line 121 are respectively formed on opposite two plates of the substrate 11 (such as the top and bottom surfaces of the substrate 11 in FIG. 4), and each of the surrounding lines The connecting portion 1212 of 121 is buried in the substrate 11. Moreover, each of the two metal layers 1211 surrounding the line 121 can be vertically aligned (not shown) or misaligned, and is not limited herein. Thereby, the surrounding circuit 121 is transparent The two metal layers 1211 are respectively formed on opposite plate faces of the substrate 11 so that the processing difficulty around the line 121 can be effectively reduced, for example, the etching depth around the line 121 is lowered, and the surrounding line 121 is formed. It's easier.

進一步地說,如圖5所示,每個所述圍繞線路121的兩個所述金屬層1211上可未形成有任何構造,藉以降低軟式電路板1的總厚度。因此,所述軟式電路板1的厚度介於100微米(μm)至150微米,並且圖5中的軟式電路板1厚度為125微米。再者,如圖6所示,所述軟式電路板1可進一步包括有一接合層13,所述接合層13設置於所述基板11的其中一個板面並且覆蓋每個圍繞線路121中的相對應所述金屬層1211,而上述軟式電路板1的厚度介於125微米至175微米,並且圖6中的軟式電路板1厚度為150微米。或者,如圖7所示,所述軟式電路板1也可進一步包括有兩個接合層13,兩個所述接合層13分別設置於所述基板11的相反兩個板面並且分別覆蓋多個所述金屬層1211,而所述軟式電路板1的厚度介於150微米至200微米,並且圖7中的軟式電路板1厚度為175微米。 Further, as shown in FIG. 5, any configuration may be formed on each of the two metal layers 1211 surrounding the wiring 121, thereby reducing the total thickness of the flexible circuit board 1. Therefore, the flexible circuit board 1 has a thickness of from 100 micrometers (μm) to 150 micrometers, and the flexible circuit board 1 of FIG. 5 has a thickness of 125 micrometers. Furthermore, as shown in FIG. 6, the flexible circuit board 1 may further include a bonding layer 13 disposed on one of the board faces of the substrate 11 and covering each corresponding one of the surrounding lines 121. The metal layer 1211 has a thickness of the above-mentioned flexible circuit board 1 of from 125 μm to 175 μm, and the flexible circuit board 1 of FIG. 6 has a thickness of 150 μm. Alternatively, as shown in FIG. 7, the flexible circuit board 1 may further include two bonding layers 13, which are respectively disposed on opposite plate faces of the substrate 11 and respectively cover a plurality of layers The metal layer 1211, and the flexible circuit board 1 has a thickness of 150 micrometers to 200 micrometers, and the flexible circuit board 1 of FIG. 7 has a thickness of 175 micrometers.

另,每個所述連接線路122的構造如同上述圍繞線路121的構造,也就是說,每個所述連接線路122同樣至少包含有分別形成在所述基板11相反兩個板面上的兩個金屬層1221以及埋置於基板11並連接上述兩個金屬層1221的一連接部1222。因此,本實施例不在重複說明連接線路122的構造。 In addition, each of the connection lines 122 is configured as described above around the line 121, that is, each of the connection lines 122 also includes at least two of the opposite sides of the substrate 11 respectively. The metal layer 1221 and a connecting portion 1222 embedded in the substrate 11 and connected to the two metal layers 1221. Therefore, the configuration of the connection line 122 is not repeatedly described in this embodiment.

請參閱圖3,改由所述線路單元12的線路布局來看,每個所述圍繞區111具有位於相反兩端(如圖3中的圍繞區111頂端部與底端部)的一第一端部1111與一第二端部1112,並且多個所述圍繞區111的第一端部1111呈直線狀地排列,多個所述圍繞區111的第二端部1112也呈直線狀地排列。 Referring to FIG. 3, each of the surrounding areas 111 has a first portion at opposite ends (such as the top end portion and the bottom end portion of the surrounding portion 111 in FIG. 3). The end portion 1111 and a second end portion 1112, and the first end portions 1111 of the plurality of surrounding regions 111 are linearly arranged, and the second end portions 1112 of the plurality of surrounding regions 111 are also linearly arranged. .

在每個所述圍繞區111上,每條所述圍繞線路121自所述第 一端部1111延伸至第二端部1112。其中,每條所述圍繞線路121的相反兩端分別形成有一第一焊墊1213與一第二焊墊1214,並且每條所述圍繞線路121的第一焊墊1213與第二焊墊1214分別位在所述第一端部1111與第二端部1112。也就是說,多條所述圍繞線路121的第一焊墊1213在所述第一端部1111排成一列,而多條所述圍繞線路121的第二焊墊1214在所述第二端部1112排成另一列。更詳細地說,每個所述圍繞線路121定義有連接所述第一焊墊1213與所述第二焊墊1214的一虛擬直線(圖中未示出),並且所述虛擬直線與圍繞區111的一長度方向L相夾形成有一銳角(圖中未示出)。也就是說,任一條所述圍繞線路121的第一焊墊1213與第二焊墊1214不會同時位在所述長度方向L上。 On each of the surrounding areas 111, each of the surrounding lines 121 is from the first One end portion 1111 extends to the second end portion 1112. A first pad 1213 and a second pad 1214 are respectively formed on opposite ends of each of the surrounding lines 121, and each of the first pad 1213 and the second pad 1214 surrounding the line 121 are respectively Located at the first end portion 1111 and the second end portion 1112. That is, a plurality of the first pads 1213 surrounding the line 121 are arranged in a row at the first end portion 1111, and a plurality of the second pads 1214 surrounding the line 121 are at the second end portion. 1112 is arranged in another column. In more detail, each of the surrounding lines 121 defines a virtual straight line (not shown) connecting the first pad 1213 and the second pad 1214, and the virtual straight line and the surrounding area A lengthwise L-phase clip of 111 forms an acute angle (not shown). That is to say, the first pad 1213 and the second pad 1214 surrounding any of the lines 121 are not simultaneously positioned in the length direction L.

每條連接線路122則是自所設置的兩個所述圍繞區111的其中一個圍繞區111的所述第一端部1111延伸經過連接區112至其中另一個圍繞區111的所述第二端部1112(如圖3)。再者,每條連接線路122的兩末端各形成有一連接焊墊1223,並且任一所述連接焊墊1223是與一個所述第一焊墊1213(或是一個所述第二焊墊1214)位在所述長度方向L上。此外,本實施例的連接線路122並不局限於上述類型,在一未繪示的實施例中,每條連接線路122則是自所設置的兩個所述圍繞區111的其中一個圍繞區111的所述第一端部1111延伸經過連接區112至其中另一個圍繞區111的所述第一端部1111。 Each of the connecting lines 122 extends from the first end 1111 of the surrounding area 111 of the two surrounding surrounding areas 111 through the connecting area 112 to the second end of the other surrounding area 111. Part 1112 (Figure 3). Furthermore, a connection pad 1223 is formed at each end of each connection line 122, and any of the connection pads 1223 is associated with one of the first pads 1213 (or one of the second pads 1214). Located in the length direction L. In addition, the connection line 122 of the present embodiment is not limited to the above type. In an unillustrated embodiment, each connection line 122 is surrounded by one of the two surrounding areas 111 provided. The first end portion 1111 extends through the connecting portion 112 to the first end portion 1111 of the other surrounding portion 111.

進一步地說,請參閱圖1至圖3,每個所述圍繞區111的相反兩端能相接而形成一管狀結構111(即每個所述圍繞區111能彎折而使所述第一端部1111與第二端部1112彼此堆疊設置)、並且每條所述連接線路122的相反兩端分別連接於兩條相鄰但不在相同管狀結構111上的所述圍繞線路121,以使所述線路單元12的多條所述圍繞線路121及多條連接線路122構成至少一線圈。 Further, referring to FIG. 1 to FIG. 3, opposite ends of each of the surrounding regions 111 can be joined to form a tubular structure 111 (ie, each of the surrounding regions 111 can be bent to make the first The end portion 1111 and the second end portion 1112 are stacked on each other, and the opposite ends of each of the connecting lines 122 are respectively connected to the two adjacent lines 121 which are not adjacent to the same tubular structure 111, so as to The plurality of surrounding lines 121 and the plurality of connecting lines 122 of the line unit 12 constitute at least one coil.

以上為本實施例軟式電路板1呈平面狀態的可能實施構造,以下接著說明軟式電路板1與芯體2相互結合後的關係,而有關軟式電路板1已於上述說明中揭露的技術特徵,則不在下述說明中全部複述。 The above is a possible implementation configuration of the flexible circuit board 1 in the planar state of the present embodiment. The following describes the relationship between the flexible circuit board 1 and the core 2, and the technical features disclosed in the above description of the flexible circuit board 1 are It will not be repeated in the following description.

所述芯體2呈環型,並且本實施例的芯體2是以方環狀作一說明,但不受限於此。舉例來說,所述芯體2也可以是圓環狀、三角狀、長條狀、或是不規則形狀。其中,所述芯體2於本實施例中是鐵芯及包覆於鐵芯外表面的絕緣層所組成,並且芯體2的厚度大致為400微米。 The core 2 is in a ring shape, and the core 2 of the present embodiment is described in a square ring shape, but is not limited thereto. For example, the core 2 may also be annular, triangular, elongated, or irregular. The core 2 is composed of an iron core and an insulating layer covering the outer surface of the iron core in the embodiment, and the core 2 has a thickness of approximately 400 μm.

所述基板11的每個所述圍繞區111的相反兩端相接而形成一管狀結構111,並且每條所述連接線路122的相反兩端分別連接於兩條相鄰但不在相同管狀結構111上的所述圍繞線路121,以使所述線路單元12的多條圍繞線路121及多條連接線路122構成至少一線圈。再者,每個所述管狀結構111繞設於芯體2,而本實施例的芯體2則是在四邊各繞設有一個所述管狀結構111,以使所述線圈纏繞於芯體2。所述軟式電路板1所形成的線圈的一端能用來輸入電流,另一端能用來輸出電流,以使芯體2產生磁性。藉此,所述電磁鐵100通過所述軟式電路板1取代習用金屬線條所繞成的線圈,藉以利於所述電磁鐵100的生產製造及微小化。 The opposite ends of each of the surrounding regions 111 of the substrate 11 are joined to form a tubular structure 111, and opposite ends of each of the connecting lines 122 are respectively connected to two adjacent but not identical tubular structures 111. The above-mentioned surrounding circuit 121 is such that a plurality of surrounding lines 121 and a plurality of connecting lines 122 of the line unit 12 constitute at least one coil. Furthermore, each of the tubular structures 111 is wound around the core 2, and the core 2 of the embodiment is wound around the four sides of the tubular structure 111 so that the coils are wound around the core 2. . One end of the coil formed by the flexible circuit board 1 can be used to input current, and the other end can be used to output current to make the core 2 magnetic. Thereby, the electromagnet 100 replaces the coil wound by the conventional metal wire by the flexible circuit board 1 to facilitate the manufacture and miniaturization of the electromagnet 100.

具體來說,每個所述管狀結構111的第一端部1111與第二端部1112彼此堆疊設置,並且位在上述第一端部1111上的焊墊分別連接(如:焊接)於位在第二端部1112的焊墊。其中,每個所述管狀結構111的多個所述圍繞線路121依序頭尾相接,也就是說,任兩條相鄰的所述圍繞線路121的其中一條所述圍繞線路121的第一焊墊1213連接固定於其中另一條所述圍繞線路121的第二焊墊1214。而所述連接線路122的任一連接焊墊1223則是與位在相同長度方向L上的第一焊墊1213(或第二焊墊1214)相接。 Specifically, the first end portion 1111 and the second end portion 1112 of each of the tubular structures 111 are stacked on each other, and the pads on the first end portion 1111 are respectively connected (eg, soldered) in position. The pad of the second end portion 1112. Wherein, the plurality of surrounding lines 121 of each of the tubular structures 111 are connected end to end in sequence, that is, the first of the two adjacent surrounding lines 121 is the first around the line 121. The pad 1213 is connected and fixed to the other of the second pads 1214 surrounding the line 121. And any of the connection pads 1223 of the connection line 122 is in contact with the first pad 1213 (or the second pad 1214) located in the same length direction L.

再者,本實施例的多個所述連接區112設置於芯體2的內側 並且面向所述芯體2的內側壁,藉以利用芯體2的內側空間,進而有助於縮小電磁鐵100的體積。而所述每個管狀結構111較佳是以內表面抵靠於所述芯體2的表面,藉以使降低所述電磁鐵100的整體厚度。 Furthermore, a plurality of the connection regions 112 of the embodiment are disposed on the inner side of the core 2 Further, the inner side wall of the core body 2 faces the inner space of the core body 2, thereby contributing to reducing the volume of the electromagnet 100. Each of the tubular structures 111 preferably has an inner surface abutting against the surface of the core 2, thereby reducing the overall thickness of the electromagnet 100.

[實施例二] [Embodiment 2]

請參閱圖8至圖10,為本發明的實施例二,本實施例與上述實施例一類似,相同處則不再加以贅述,而兩個實施例的主要差異如下所述。 Referring to FIG. 8 to FIG. 10, which is a second embodiment of the present invention, the present embodiment is similar to the above-mentioned first embodiment, and the same portions are not described again, and the main differences between the two embodiments are as follows.

本實施例所公開電磁鐵100包括一軟式電路板1及一芯體2,所述軟式電路板1包括一基板11及彼此分離地設置於基板11的多條圍繞線路121。其中,所述基板11大致呈矩形,並且基板11的相反兩端(如圖9中的基板11的相反兩個短側端)相接而形成一管狀結構11,並且多條所述圍繞線路121依序頭尾相接而構成至少一線圈。再者,所述芯體2呈長型並且是由鐵芯及包覆於鐵芯外表面的絕緣層所組成,所述芯體2插設於上述管狀結構11中,並且所述軟式電路板1所形成的線圈的一端能用來輸入電流,另一端能用來輸出電流,以使芯體2產生磁性。 The electromagnet 100 disclosed in this embodiment includes a flexible circuit board 1 and a core body 2. The flexible circuit board 1 includes a substrate 11 and a plurality of surrounding lines 121 disposed apart from each other on the substrate 11. Wherein, the substrate 11 is substantially rectangular, and opposite ends of the substrate 11 (such as opposite short side ends of the substrate 11 in FIG. 9) are joined to form a tubular structure 11, and a plurality of the surrounding lines 121 are formed. At least one coil is formed by sequentially connecting the head and the tail. Furthermore, the core 2 is long and consists of an iron core and an insulating layer covering the outer surface of the core, the core 2 is inserted into the tubular structure 11, and the flexible circuit board One end of the formed coil can be used to input current, and the other end can be used to output current to make the core 2 magnetic.

具體來說,所述基板11具有位於相反兩端(如圖9中的基板11的相反兩個短側端)的一第一端部1111與一第二端部1112,每條所述圍繞線路121自所述第一端部1111延伸至第二端部1112,並且所述管狀結構11的所述第一端部1111與所述第二端部1112彼此堆疊設置。進一步地說,每條所述圍繞線路121的相反兩端分別形成有一第一焊墊1213與一第二焊墊1214,每條所述圍繞線路121的第一焊墊1213與第二焊墊1214分別位在第一端部1111與第二端部1112,並且任兩條相鄰的圍繞線路121的其中一條圍繞線路121的第一焊墊1213連接固定於其中另一條圍繞線路121的第二焊墊1214。 Specifically, the substrate 11 has a first end portion 1111 and a second end portion 1112 at opposite ends (such as the opposite two short side ends of the substrate 11 in FIG. 9), each of which surrounds the line 121 extends from the first end portion 1111 to the second end portion 1112, and the first end portion 1111 and the second end portion 1112 of the tubular structure 11 are stacked one on another. Further, a first pad 1213 and a second pad 1214 are formed on opposite ends of each of the surrounding lines 121, and the first pad 1213 and the second pad 1214 surrounding the line 121 are respectively formed. Located at the first end portion 1111 and the second end portion 1112, respectively, and any one of the two adjacent surrounding wires 121 is connected to the first pad 1213 of the line 121 and is fixed to the second wire of the other of the wires 121. Pad 1214.

再者,每個所述圍繞線路121包括有兩個金屬層1211及連接所述兩個金屬層1211的至少一連接部1212(如同實施例一的圖4),每個所述圍繞線路121的兩個所述金屬層1211分別形成在所述基板11的相反兩個板面上,而每個所述圍繞線路121的連接部1212則埋置於基板11內。較佳地,每個所述圍繞線路121的兩個金屬層1211上未形成有任何構造,並且所述軟式電路板1的厚度介於100微米至150微米。 Furthermore, each of the surrounding lines 121 includes two metal layers 1211 and at least one connecting portion 1212 connecting the two metal layers 1211 (as in FIG. 4 of the first embodiment), each of which surrounds the line 121. Two metal layers 1211 are respectively formed on opposite plate faces of the substrate 11, and each of the connecting portions 1212 surrounding the wires 121 is buried in the substrate 11. Preferably, no configuration is formed on each of the two metal layers 1211 surrounding the line 121, and the flexible circuit board 1 has a thickness of between 100 micrometers and 150 micrometers.

[本發明實施例的技術效果] [Technical Effects of Embodiments of the Invention]

綜上所述,本發明實施例所公開的電磁鐵及軟式電路板,能通過所述軟式電路板的線路單元所構成的線圈取代習用金屬線條所繞成的線圈,藉以利於所述電磁鐵的生產製造及微小化。再者,所述圍繞線路透過將兩個金屬層分別形成在基板的相反兩個板面,以使圍繞線路的加工難度能夠有效地降低,例如:所述圍繞線路的蝕刻深度降低,使圍繞線路的成形更為容易。 In summary, the electromagnet and the flexible circuit board disclosed in the embodiments of the present invention can replace the coil formed by the conventional metal wire by the coil formed by the circuit unit of the flexible circuit board, thereby facilitating the electromagnet. Manufacturing and miniaturization. Furthermore, the surrounding line is formed by forming two metal layers on opposite plates of the substrate, so that the processing difficulty around the line can be effectively reduced, for example, the etching depth of the surrounding line is reduced, so that the surrounding line is made. Forming is easier.

以上所述僅為本發明的較佳可行實施例,並非用來侷限本發明的保護範圍,凡依本發明申請專利範圍所做的均等變化與修飾,皆應屬本發明的涵蓋範圍。 The above are only the preferred embodiments of the present invention, and are not intended to limit the scope of the present invention. All changes and modifications made by the scope of the present invention should be construed as the scope of the present invention.

100‧‧‧電磁鐵 100‧‧‧electromagnet

1‧‧‧軟式電路板 1‧‧‧Soft circuit board

11‧‧‧基板(管狀結構) 11‧‧‧Substrate (tubular structure)

12‧‧‧線路單元 12‧‧‧Line unit

2‧‧‧芯體 2‧‧‧ core

Claims (4)

一種軟式電路板,包括:一基板及彼此分離地設置於所述基板的多條圍繞線路,所述基板的相反兩端相接而形成一管狀結構,並且多條所述圍繞線路依序頭尾相接而構成至少一線圈;其中,每個所述圍繞線路包括有兩個金屬層及連接所述兩個金屬層的至少一連接部;每個所述圍繞線路的兩個所述金屬層分別形成在所述基板的相反兩個板面上,而每個所述圍繞線路的所述至少一連接部埋置於所述基板內。 A flexible circuit board comprising: a substrate and a plurality of surrounding lines disposed on the substrate separately from each other, the opposite ends of the substrate are joined to form a tubular structure, and the plurality of surrounding lines are sequentially arranged Forming at least one coil; wherein each of the surrounding lines includes two metal layers and at least one connecting portion connecting the two metal layers; each of the two metal layers surrounding the circuit respectively Formed on opposite plate faces of the substrate, and the at least one connection portion of each of the surrounding wires is buried in the substrate. 如請求項1所述的軟式電路板,其中,所述基板具有位於相反兩端的一第一端部與一第二端部,每條所述圍繞線路自所述第一端部延伸至所述第二端部,並且所述管狀結構的所述第一端部與所述第二端部彼此堆疊設置。 The flexible circuit board of claim 1, wherein the substrate has a first end and a second end at opposite ends, each of the surrounding lines extending from the first end to the a second end, and the first end and the second end of the tubular structure are stacked one on another. 如請求項2所述的軟式電路板,其中,每條所述圍繞線路的相反兩端分別形成有一第一焊墊與一第二焊墊,每條所述圍繞線路的所述第一焊墊與所述第二焊墊分別位在所述第一端部與所述第二端部,並且任兩條相鄰的所述圍繞線路的其中一條所述圍繞線路的所述第一焊墊連接固定於其中另一條所述圍繞線路的所述第二焊墊。 The flexible circuit board of claim 2, wherein each of the opposite ends of each of the surrounding lines is formed with a first pad and a second pad, and each of the first pads surrounding the line And the second pad is respectively located at the first end and the second end, and any one of the two adjacent ones of the surrounding lines is connected to the first pad surrounding the line The second pad is fixed to the other of the surrounding wires. 如請求項1所述的軟式電路板,其中,每個所述圍繞線路的兩個所述金屬層上未形成有任何構造,並且所述軟式電路板的厚度介於100微米至150微米。 The flexible circuit board of claim 1, wherein no configuration is formed on each of the two metal layers surrounding the wiring, and the flexible circuit board has a thickness of between 100 micrometers and 150 micrometers.
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