WO2018021470A1 - Microcoil and method for forming same - Google Patents

Microcoil and method for forming same Download PDF

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Publication number
WO2018021470A1
WO2018021470A1 PCT/JP2017/027231 JP2017027231W WO2018021470A1 WO 2018021470 A1 WO2018021470 A1 WO 2018021470A1 JP 2017027231 W JP2017027231 W JP 2017027231W WO 2018021470 A1 WO2018021470 A1 WO 2018021470A1
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Prior art keywords
electrode
wire
electrode array
array
pads
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PCT/JP2017/027231
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French (fr)
Japanese (ja)
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智宣 中村
美仁 萩原
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株式会社新川
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R15/00—Details of measuring arrangements of the types provided for in groups G01R17/00 - G01R29/00, G01R33/00 - G01R33/26 or G01R35/00
    • G01R15/14—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks
    • G01R15/18—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using inductive devices, e.g. transformers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F5/00—Coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body

Definitions

  • the present invention relates to a structure of a microcoil formed on a substrate and a method for forming the same.
  • Patent Document 1 a strip-shaped metal pattern is disposed on a glass substrate or a silicon substrate, and a first insulating film, a magnetic film, and a second insulating film are stacked on the metal pattern, and the metal pattern is formed. Describes a microcoil structure in which a wire is connected by wire bonding from one end to the opposite end of an adjacent metal pattern, and the metal pattern and the wire by wire bonding surround the periphery of the magnetic film.
  • the conventional microcoil described in the cited document 1 can stack a metal layer, a magnetic layer, an insulating layer, and various types of layers on a glass substrate or a silicon substrate by using an etching or sputtering technique. There is a problem that many processes are required to form the microcoil.
  • an object of the present invention is to provide a microcoil that can be formed on a substrate by a simple method.
  • the microcoil of the present invention includes a first electrode array in which a plurality of electrode pads are arranged in a line at a predetermined interval, and a second electrode in which the plurality of electrode pads are arranged in a line at a predetermined interval in parallel with the first electrode array.
  • a second wire connecting the electrode pad of the next row and the electrode pad of the next row of the first electrode array by a loop higher than the first wire.
  • the microcoil of the present invention further includes a magnetic body disposed between the first electrode array and the second electrode array in parallel with the first and second electrode arrays and spaced from the surface of the substrate by a predetermined distance.
  • One wire may pass between the electrode pads through the lower side of the magnetic body, and the second wire may connect between the electrode pads so as to straddle the upper side of the magnetic body.
  • the substrate includes two electrode bases disposed between the first and second electrode arrays and on the outer side in the arrangement direction of the electrode pads of the first and second electrode arrays. May be connected on two electrode bases.
  • the substrate includes two second electrode pads arranged on the outer side in the arrangement direction of the electrode pads of the first and second electrode arrays between the first and second electrode arrays.
  • the magnetic body may be a magnetic body wire that connects the two second electrode pads.
  • the second electrode array is parallel to the first electrode array, and a plurality of electrode pads are arranged in a row at a predetermined interval so that the positions of the electrode pads of the first electrode array and the electrode pads are shifted. It may be arranged in line.
  • the method of forming a microcoil according to the present invention includes a first electrode array in which a plurality of electrode pads are arranged in a line at a predetermined interval, a parallel to the first electrode array, and a plurality of electrode pads in a line at a predetermined interval.
  • a substrate on which the second electrode array is arranged is prepared, and the first wire is bonded by wire bonding between the electrode pad of one row of the first electrode array and the electrode pad of one row of the second electrode array. And connecting the electrode pad of one row of the second electrode array and the electrode pad of the next row of the first electrode array with a second wire having a loop higher than the first wire by wire bonding.
  • the substrate is provided with two electrode platforms between the first and second electrode arrays, on the outer side in the arrangement direction of the first and second electrode arrays.
  • An electrode pad of one row of the array and an electrode pad of one row of the second electrode array are connected by a first wire by wire bonding, and the two wires are separated from the first wire above the first wire.
  • a magnetic body is mounted on the electrode base, and a wire bonding is applied between the electrode pad in one row of the second electrode array and the electrode pad in the next row of the first electrode array so as to straddle the magnetic body. It is good also as connecting with 2 wires.
  • the substrate has a plurality of electrode pads such that the second electrode array is parallel to the first electrode array and the positions of the electrode pads of the first electrode array and the electrode pads are shifted. May be arranged in a line at a predetermined interval.
  • the present invention can provide a microcoil that can be formed on a substrate by a simple method.
  • the microcoil 100 of this embodiment is configured on a substrate 10, and the substrate 10 has a plurality of electrode pads 21 to 25 arranged in a line at a predetermined interval.
  • the electrode pads 21 to 25 and 31 to 35 are arranged to face each other, the electrode pads 21 and 31 are in the first row, the electrode pads 22 and 32 are in the second row, the electrode pads 23 and 33 are in the third row, The electrode pads 24 and 34 will be described as the fourth row, and the electrode pads 25 and 35 will be described as the fifth row electrode pads.
  • the substrate 10 is made of a material such as silicon, and the electrode pads 21 to 25 and 31 to 35 are electrodes insulated from the surrounding substrate 10. Such an electrode can be formed by the same method as the electrode formed on the surface of the semiconductor chip.
  • the size and pitch of the electrode pads 21 to 25 and 31 to 35 are not limited, but as an example, the size of the electrode pads 21 to 25 and 31 to 35 is a square of 30 to 60 ⁇ m, and the electrode pads 21 to 25 , 31 to 35 may be 50 to 100 ⁇ m in the arrangement direction.
  • the electrode bases 41 and 42 may be anything as long as the height is higher than the loop height of the first wire 50 described later and the magnetic body 70 can be supported thereon.
  • electrode pads similar to the electrode pads 21 to 25 and 31 to 35 may be formed, and bumps may be formed thereon using a wire bonding apparatus, or a metal plate having a predetermined thickness may be formed on the electrode pads. May be joined.
  • the height of the electrode bases 41 and 42 may be about 100 ⁇ m, for example.
  • a rod-like magnetic body 70 is attached on the electrode bases 41 and 42 of the substrate 10.
  • the magnetic body 70 may be, for example, a magnetic wire 71 having a diameter of about 50 ⁇ m with a metal around the central magnetic wire, or may be a flat ferrite having a thickness of about 50 ⁇ m.
  • the magnetic body 70 is composed of the magnetic wire 71, as shown in FIG. 4, in place of the electrode bases 41 and 42, second electrode pads 43 and 44 similar to the electrode pads 21 to 25 and 31 to 35 are provided.
  • the two second electrode pads 43 and 44 may be connected to each other by the magnetic wire 71 by wire bonding.
  • the magnetic wire 71 extends linearly at the same height as the electrode bases 41 and 42, and both ends are bent downward toward the two second electrode pads 43 and 44. It has a shape.
  • the first electrode array 20 and the second electrode array 30 of the substrate 10 are connected by a first wire 50 and a second wire 60 as shown in FIGS.
  • the first wire 50 is disposed below the magnetic body 70 between the electrode pads 21 to 35 in one row of the first electrode array 20 and the electrode pads 31 to 35 in one row facing the second electrode array 30. It is a wire to be connected. More specifically, the first wire 50 connects the electrode pad 21 of the first row of the first electrode array 20 and the electrode pad 31 of the first row of the second electrode array 30 to the first electrode array 20. It consists of five wires up to what connects the electrode pads 25 in the fifth row and the electrode pads 35 in the fifth row of the second electrode array 30.
  • the first wire 50 is a wire of about 20 ⁇ m to 40 ⁇ m, such as gold or copper, having a substantially trapezoidal loop shape as shown in FIG. 2, and the loop height is, for example, about 50 ⁇ m. .
  • the second wire 60 extends between the electrode pads 31 to 34 in one row of the second electrode array 30 and the electrode pads 22 to 25 in the next row of the first electrode array 20 so as to straddle over the magnetic body 70. They are connected by a loop higher than the first wire 50. More specifically, the second wire 60 connects the electrode pad 31 in the first row of the second electrode array 30 and the electrode pad 22 in the second row (next row) of the first electrode array 20 to the second wire 60. It consists of four wires up to what connects the electrode pads 34 in the fourth row of the two-electrode array 30 and the electrode pads 25 in the fifth row (next row) of the first electrode array 20.
  • the second wire 60 is a wire of about 20 ⁇ m to 50 ⁇ m, such as gold or copper. As shown in FIGS. 2 and 3, the second wire 60 has a mountain-shaped loop shape, and the height thereof may be, for example, about 200 ⁇ m.
  • the first wire 50 and the second wire 60 configured as described above constitute the microcoil 100 wound around the magnetic body 70 as shown in FIGS.
  • microcoil 100 shown in FIGS. 1 to 3 on the substrate 10 will be described.
  • the dimensions of each part are illustrated for the sake of explanation, but it is possible to form microcoils 100 having different sizes as different dimensions by the same method.
  • the first electrode array 20, the second electrode array 30, and the two electrode stands 41 and 42 are arranged on the substrate 10.
  • the electrode bases 41 and 42 are formed by bumps on the electrode pads, one step or so that the height is about 100 ⁇ m by wire bonding on the electrode pads arranged at the positions of the electrode bases 41 and 42. A plurality of bumps are formed.
  • the electrode pads 21 to 21 of the first electrode array 20 are formed by wire bonding using gold or copper wire having a diameter of about 30 ⁇ m. 25 and the electrode pads 31 to 35 of the second electrode array 30 are connected by five first wires 50. As described above, the first wire 50 has a substantially trapezoidal loop shape and a height of about 50 ⁇ m.
  • the magnetic body 70 is attached on the electrode bases 41 and 42. Since the electrode tables 41 and 42 have a height of about 100 ⁇ m, the magnetic body 70 is disposed on the first wire 50 so as to be separated from the first wire 50. Further, the extending direction of the magnetic body 70 and the direction of the loop of the first wire 50 are orthogonal to each other.
  • the magnetic body 70 is composed of the magnetic wire 71, the second electrode pads 43 and 44 are connected by the magnetic wire 71 having a loop height of about 100 ⁇ m as shown in FIG.
  • the electrode pads 31 to 34 of the second electrode array 30 and the electrode pads 22 to 22 of the first electrode array 20 are formed so as to straddle the magnetic body 70 by wire bonding using a gold or copper wire having a diameter of about 30 ⁇ m. 24 are connected by four second wires 60.
  • the second wire has a mountain-shaped loop shape and a height of about 200 ⁇ m.
  • the height at which the magnetic body 70 is disposed is about 100 ⁇ m, and the diameter of the magnetic body 70 is about 50 ⁇ m, so that there is a space between the magnetic body 70 and the second wire 60.
  • the microcoil 100 can be configured by a simple method in which the electrode pads 21 to 25 and 31 to 35 arranged on the substrate 10 are connected by wire bonding.
  • the microtransformer 150 connects the input line 80 from the AC power supply 81 to the electrode pad 21 in the first row of the first electrode array 20, and the electrode pad in the second row of the second electrode array 30.
  • a ground line 82 is connected to 32, and an output line 83 is connected to the electrode pad 35 in the fifth row of the second electrode array 30.
  • the microcoil 100 is divided into a 1.5-turn first winding from the electrode pad 21 to the electrode pad 32 and a 3.5-turn second winding from the electrode pad 31 to the electrode pad 35.
  • microcoil 200 according to another embodiment of the present invention will be described with reference to FIGS. Parts similar to those of the embodiment described above with reference to FIGS. 1 to 3 are denoted by the same reference numerals and description thereof is omitted.
  • the microcoil 200 of the present embodiment does not have the magnetic body 70 and the electrode bases 41 and 42 of the microcoil 100 described with reference to FIGS.
  • the configuration of the first wire 50 and the second wire 60 is the same as that of the microcoil 100 described with reference to FIGS.
  • the microcoil 200 of the present embodiment can be formed on the substrate 10 by a simpler method.
  • the second electrode array 30 is arranged in parallel with the first electrode array 20 so that the positions of the electrode pads 21 to 25 and the electrode pads 31 to 35 of the first electrode array 20 are shifted.
  • the electrode pads 21 are electrode pads in the first row of the first electrode array
  • the electrode pads 22 to 25 are electrode pads in the second to fifth rows of the first electrode array 20.
  • the electrode pads 31 are electrode pads in the first row of the second electrode array 30, and the electrode pads 32 to 35 are electrode pads in the second row to fifth row of the second electrode array 30.
  • the electrode bases 41 and 42 and the magnetic body 70 of the microcoil 300 according to this embodiment are the same as those described with reference to FIGS.
  • the first wire 50 is formed between the electrode pads 21 to 25 in one row of the first electrode array 20 and the electrode pads 31 to 35 in one row of the second electrode array 30. It is a wire connected on the lower side. More specifically, the first wire 50 connects the electrode pad 21 of the first row of the first electrode array 20 and the electrode pad 31 of the first row of the second electrode array 30 to the first electrode array 20. It consists of five wires up to what connects the electrode pads 25 in the fifth row and the electrode pads 35 in the fifth row of the second electrode array 30.
  • the first wire 50 is a wire of about 20 ⁇ m to 40 ⁇ m, such as gold or copper, having a substantially trapezoidal loop shape as shown in FIG. 2, and the loop height is, for example, about 50 ⁇ m. .
  • the second wire 60 straddles the magnetic body 70 so that the electrode pads 31 to 34 in one row of the second electrode array 30 and the electrode pads 22 to 25 in the next row of the first electrode array 20 are straddled. Are connected by a loop higher than that of the first wire 50. More specifically, the second wire 60 connects the electrode pad 31 in the first row of the second electrode array 30 and the electrode pad 22 in the second row (next row) of the first electrode array 20 to the second wire 60. It consists of four wires up to what connects the electrode pads 34 in the fourth row of the two-electrode array 30 and the electrode pads 25 in the fifth row (next row) of the first electrode array 20.
  • the second wire 60 is a wire of about 20 ⁇ m to 50 ⁇ m, such as gold or copper. As shown in FIGS. 2 and 3, the second wire 60 has a mountain-shaped loop shape, and the height thereof may be, for example, about 200 ⁇ m.
  • the first wire 50 and the second wire 60 configured as described above constitute a microcoil 300 wound around the magnetic body 70 as shown in FIG.

Abstract

The present invention has: a substrate (10) in which first and second electrode arrays (20), (30) respectively including electrode pads (21)-(25), (31)-(35) are arranged in parallel; a first wire (50) that connects the electrode pads (21)-(25) of the first electrode array (20) and the electrode pads (31)-(35) of the second electrode array (30); and a second wire (60) that connects the electrode pads (22)-(25) of the first electrode array and the electrode pads (31)-(34) of the second electrode array (30) by a loop higher than that of the first wire (50). With this configuration, a microcoil that can be formed on a substrate by a simple method can be provided.

Description

マイクロコイル及びその形成方法Microcoil and method for forming the same
　本発明は、基板上に形成されたマイクロコイルの構造とその形成方法に関する。 The present invention relates to a structure of a microcoil formed on a substrate and a method for forming the same.
　近年、ＩＣチップの中にマイクロコイルを内蔵して電流計測を行うＩＣチップが提案されている（例えば、特許文献１参照）。特許文献１には、ガラス基板またはシリコン基板の上に短冊アレイ状の金属パターンを配置し、金属パターンの上に第１の絶縁膜と磁性膜と第２の絶縁膜とを積層し、金属パターンの片端部から隣り合う金属パターンの対向する端部にワイヤボンディングによってワイヤを接続し、金属パターンとワイヤボンディングによるワイヤとが磁性膜の周囲を取り囲むようなマイクロコイルの構造が記載されている。 Recently, an IC chip for measuring current by incorporating a microcoil in an IC chip has been proposed (for example, see Patent Document 1). In Patent Document 1, a strip-shaped metal pattern is disposed on a glass substrate or a silicon substrate, and a first insulating film, a magnetic film, and a second insulating film are stacked on the metal pattern, and the metal pattern is formed. Describes a microcoil structure in which a wire is connected by wire bonding from one end to the opposite end of an adjacent metal pattern, and the metal pattern and the wire by wire bonding surround the periphery of the magnetic film.
特許第４５０１８５８号公報Japanese Patent No. 4501858
　引用文献１に記載された従来技術のマイクロコイルは、エッチングやスパッタリングの技術を用いて、ガラス基板またはシリコン基板の上に、金属層、磁性層、絶縁層と多種類の層を積層することが必要でありマイクロコイルを形成するのに多くの処理が必要となってしまうという問題があった。 The conventional microcoil described in the cited document 1 can stack a metal layer, a magnetic layer, an insulating layer, and various types of layers on a glass substrate or a silicon substrate by using an etching or sputtering technique. There is a problem that many processes are required to form the microcoil.
　そこで、本発明は、簡便な方法で基板上に形成可能なマイクロコイルを提供することを目的とする。 Therefore, an object of the present invention is to provide a microcoil that can be formed on a substrate by a simple method.
　本発明のマイクロコイルは、複数の電極パッドが所定の間隔で一列に並んだ第１電極アレイと、第１電極アレイと平行で、複数の電極パッドが所定の間隔で一列に並んだ第２電極アレイと、が配置された基板と、第１電極アレイの一の行の電極パッドと第２電極アレイの一の行の電極パッドとの間を接続する第１ワイヤと、第２電極アレイの一の行の電極パッドと第１電極アレイの次の行の電極パッドとの間を第１ワイヤよりも高いループによって接続する第２ワイヤと、を有することを特徴とする。 The microcoil of the present invention includes a first electrode array in which a plurality of electrode pads are arranged in a line at a predetermined interval, and a second electrode in which the plurality of electrode pads are arranged in a line at a predetermined interval in parallel with the first electrode array. An array, a first wire that connects between an electrode pad of one row of the first electrode array and an electrode pad of one row of the second electrode array, and one of the second electrode array And a second wire connecting the electrode pad of the next row and the electrode pad of the next row of the first electrode array by a loop higher than the first wire.
　本発明のマイクロコイルにおいて、第１電極アレイと第２電極アレイとの間に第１、第２電極アレイと平行で基板の表面から所定の間隔をあけて配置された磁性体を更に備え、第１ワイヤは、磁性体の下側を通って電極パッドの間を接続し、第２ワイヤは、磁性体の上側を跨ぐように電極パッドの間を接続することとしてもよい。 The microcoil of the present invention further includes a magnetic body disposed between the first electrode array and the second electrode array in parallel with the first and second electrode arrays and spaced from the surface of the substrate by a predetermined distance. One wire may pass between the electrode pads through the lower side of the magnetic body, and the second wire may connect between the electrode pads so as to straddle the upper side of the magnetic body.
　本発明のマイクロコイルにおいて、基板は、第１、第２の電極アレイの間で、第１、第２の電極アレイの電極パッドの並び方向外側に配置された２つの電極台を含み、磁性体は、２つの電極台の上に接続されていること、としてもよい。 In the microcoil of the present invention, the substrate includes two electrode bases disposed between the first and second electrode arrays and on the outer side in the arrangement direction of the electrode pads of the first and second electrode arrays. May be connected on two electrode bases.
　本発明のマイクロコイルにおいて、基板は、第１、第２の電極アレイの間で、第１、第２の電極アレイの電極パッドの並び方向外側に配置された２つの第２の電極パッドを含み、磁性体は、２つの第２の電極パッド間を接続する磁性体ワイヤであることとしてもよい。 In the microcoil of the present invention, the substrate includes two second electrode pads arranged on the outer side in the arrangement direction of the electrode pads of the first and second electrode arrays between the first and second electrode arrays. The magnetic body may be a magnetic body wire that connects the two second electrode pads.
　本発明のマイクロコイルにおいて、第２電極アレイは、第１電極アレイと平行で、第１電極アレイの電極パッドと電極パッドの並び方向の位置がずれるように複数の電極パッドが所定の間隔で一列に並んでいることとしてもよい。 In the microcoil of the present invention, the second electrode array is parallel to the first electrode array, and a plurality of electrode pads are arranged in a row at a predetermined interval so that the positions of the electrode pads of the first electrode array and the electrode pads are shifted. It may be arranged in line.
　本発明のマイクロコイルを形成する方法は、複数の電極パッドが所定の間隔で一列に並んだ第１電極アレイと、第１電極アレイと平行で、複数の電極パッドが所定の間隔で一列に並んだ第２電極アレイと、が配置された基板を準備し、第１電極アレイの一の行の電極パッドと第２電極アレイの一の行の電極パッドとの間をワイヤボンディングにより第１ワイヤで接続し、第２電極アレイの一の行の電極パッドと第１電極アレイの次の行の電極パッドとの間をワイヤボンディングにより第１ワイヤよりも高いループを有する第２ワイヤで接続することを特徴とする。 The method of forming a microcoil according to the present invention includes a first electrode array in which a plurality of electrode pads are arranged in a line at a predetermined interval, a parallel to the first electrode array, and a plurality of electrode pads in a line at a predetermined interval. A substrate on which the second electrode array is arranged is prepared, and the first wire is bonded by wire bonding between the electrode pad of one row of the first electrode array and the electrode pad of one row of the second electrode array. And connecting the electrode pad of one row of the second electrode array and the electrode pad of the next row of the first electrode array with a second wire having a loop higher than the first wire by wire bonding. Features.
　本発明のマイクロコイルを形成する方法において、基板は、第１、第２の電極アレイの間で、第１、第２の電極アレイの並び方向外側に２つの電極台が配置され、第１電極アレイの一の行の電極パッドと第２電極アレイの一の行の電極パッドとの間をワイヤボンディングにより第１ワイヤで接続し、第１ワイヤの上側で第１ワイヤと離間するように２つの電極台の上に磁性体を取り付け、磁性体の上を跨ぐように、第２電極アレイの一の行の電極パッドと第１電極アレイの次の行の電極パッドとの間をワイヤボンディングにより第２ワイヤで接続することとしてもよい。 In the method of forming a microcoil according to the present invention, the substrate is provided with two electrode platforms between the first and second electrode arrays, on the outer side in the arrangement direction of the first and second electrode arrays. An electrode pad of one row of the array and an electrode pad of one row of the second electrode array are connected by a first wire by wire bonding, and the two wires are separated from the first wire above the first wire. A magnetic body is mounted on the electrode base, and a wire bonding is applied between the electrode pad in one row of the second electrode array and the electrode pad in the next row of the first electrode array so as to straddle the magnetic body. It is good also as connecting with 2 wires.
　本発明のマイクロコイルを形成する方法において、基板は、第２電極アレイが第１電極アレイと平行で、第１電極アレイの電極パッドと電極パッドの並び方向の位置がずれるように複数の電極パッドが所定の間隔で一列に並んで配置されていることとしてもよい。 In the method of forming a microcoil according to the present invention, the substrate has a plurality of electrode pads such that the second electrode array is parallel to the first electrode array and the positions of the electrode pads of the first electrode array and the electrode pads are shifted. May be arranged in a line at a predetermined interval.
　本発明は、簡便な方法で基板上に形成可能なマイクロコイルを提供することができる。 The present invention can provide a microcoil that can be formed on a substrate by a simple method.
本発明の実施形態におけるマイクロコイルの平面図である。It is a top view of the microcoil in the embodiment of the present invention. 本発明の実施形態におけるマイクロコイルの側面図である。It is a side view of the microcoil in the embodiment of the present invention. 本発明の実施形態におけるマイクロコイルの正面図である。It is a front view of the microcoil in the embodiment of the present invention. 磁性体を磁性ワイヤで構成した本発明の実施形態のマイクロコイルの側面図である。It is a side view of the microcoil of embodiment of this invention which comprised the magnetic body with the magnetic wire. 図１から図３に示すマイクロコイルを応用したマイクロトランスである。4 is a microtransformer to which the microcoil shown in FIGS. 本発明の他の実施形態におけるマイクロコイルの平面図である。It is a top view of the microcoil in other embodiment of this invention. 本発明の他の実施形態におけるマイクロコイルの側面図である。It is a side view of the microcoil in other embodiment of this invention. 本発明の他の実施形態におけるマイクロコイルの正面図である。It is a front view of the microcoil in other embodiment of this invention. 本発明の他の実施形態におけるマイクロコイルの平面図である。It is a top view of the microcoil in other embodiment of this invention.
　以下、図１から図３を参照して本発明の実施形態のマイクロコイル１００について説明する。図１～図３に示すように、本実施形態のマイクロコイル１００は、基板１０の上に構成されたものであり、基板１０は、複数の電極パッド２１～２５が所定の間隔で一列に並んだ第１電極アレイ２０と、第１電極アレイ２０と平行に配置され、複数の電極パッド３１～３５が所定の間隔で一列に並んだ第２電極アレイ３０と、第１、第２電極アレイ２０，３０の間で、第１、第２電極アレイ２０，３０の電極パッド２１～２５、３１～３５の並び方向外側に配置された２つの電極台４１、４２を含んでいる。ここで、電極パッド２１～２５、３１～３５は、対向して配置され、電極パッド２１、３１を第１行、電極パッド２２、３２を第２行、電極パッド２３、３３を第３行、電極パッド２４、３４を第４行、電極パッド２５、３５を第５行の電極パッドとして説明する。 Hereinafter, a microcoil 100 according to an embodiment of the present invention will be described with reference to FIGS. 1 to 3. As shown in FIGS. 1 to 3, the microcoil 100 of this embodiment is configured on a substrate 10, and the substrate 10 has a plurality of electrode pads 21 to 25 arranged in a line at a predetermined interval. The first electrode array 20, the second electrode array 30 arranged in parallel with the first electrode array 20, and a plurality of electrode pads 31 to 35 arranged in a line at a predetermined interval, and the first and second electrode arrays 20 , 30 includes two electrode bases 41, 42 arranged on the outer side in the arrangement direction of the electrode pads 21-25, 31-35 of the first and second electrode arrays 20, 30. Here, the electrode pads 21 to 25 and 31 to 35 are arranged to face each other, the electrode pads 21 and 31 are in the first row, the electrode pads 22 and 32 are in the second row, the electrode pads 23 and 33 are in the third row, The electrode pads 24 and 34 will be described as the fourth row, and the electrode pads 25 and 35 will be described as the fifth row electrode pads.
　基板１０は、シリコン等の材料で構成され、電極パッド２１～２５、３１～３５は周囲の基板１０と絶縁された電極である。このような電極は、半導体チップの表面に形成される電極と同様の方法で形成することができる。電極パッド２１～２５、３１～３５の大きさとピッチに制限は無いが、一例をあげると、電極パッド２１～２５、３１～３５の大きさは、３０～６０μｍの正方形で、電極パッド２１～２５、３１～３５の並び方向のピッチは、５０～１００μｍであってもよい。 The substrate 10 is made of a material such as silicon, and the electrode pads 21 to 25 and 31 to 35 are electrodes insulated from the surrounding substrate 10. Such an electrode can be formed by the same method as the electrode formed on the surface of the semiconductor chip. The size and pitch of the electrode pads 21 to 25 and 31 to 35 are not limited, but as an example, the size of the electrode pads 21 to 25 and 31 to 35 is a square of 30 to 60 μm, and the electrode pads 21 to 25 , 31 to 35 may be 50 to 100 μm in the arrangement direction.
　電極台４１、４２は、後で説明する第１ワイヤ５０のループ高さよりも高さが高く、その上に磁性体７０を支持できるものであれば良い。例えば、電極パッド２１～２５、３１～３５と同様の電極パッドを形成し、その上にワイヤボンディング装置でバンプを形成したものであっても良いし、電極パッドの上に所定の厚みの金属板を接合したものであってもよい。第１ワイヤ５０のループ高さが、例えば、５０μｍ程度の場合、電極台４１，４２の高いは、例えば、１００μｍ程度であってもよい。 The electrode bases 41 and 42 may be anything as long as the height is higher than the loop height of the first wire 50 described later and the magnetic body 70 can be supported thereon. For example, electrode pads similar to the electrode pads 21 to 25 and 31 to 35 may be formed, and bumps may be formed thereon using a wire bonding apparatus, or a metal plate having a predetermined thickness may be formed on the electrode pads. May be joined. For example, when the loop height of the first wire 50 is about 50 μm, the height of the electrode bases 41 and 42 may be about 100 μm, for example.
　基板１０の電極台４１，４２の上には、棒状の磁性体７０が取り付けられている。磁性体７０は、例えば、中心の磁性線の周囲を金属で覆った直径５０μｍ程度の磁性ワイヤ７１であっても良いし、厚さ５０μｍ程度の平板状のフェライトであってもよい。磁性体７０を磁性ワイヤ７１で構成する場合、図４に示すように、電極台４１、４２に代えて電極パッド２１～２５、３１～３５と同様の第２の電極パッド４３，４４を電極台４１、４２の位置に配置し、ワイヤボンディングによって２つの第２の電極パッド４３、４４の間を磁性ワイヤ７１で接続してもよい。この場合、磁性ワイヤ７１は、図４に示すように、電極台４１、４２と同様の高さで直線状に延び、両端が２つの第２の電極パッド４３，４４に向かって下向きに曲がっている形状となっている。 A rod-like magnetic body 70 is attached on the electrode bases 41 and 42 of the substrate 10. The magnetic body 70 may be, for example, a magnetic wire 71 having a diameter of about 50 μm with a metal around the central magnetic wire, or may be a flat ferrite having a thickness of about 50 μm. When the magnetic body 70 is composed of the magnetic wire 71, as shown in FIG. 4, in place of the electrode bases 41 and 42, second electrode pads 43 and 44 similar to the electrode pads 21 to 25 and 31 to 35 are provided. The two second electrode pads 43 and 44 may be connected to each other by the magnetic wire 71 by wire bonding. In this case, as shown in FIG. 4, the magnetic wire 71 extends linearly at the same height as the electrode bases 41 and 42, and both ends are bent downward toward the two second electrode pads 43 and 44. It has a shape.
　基板１０の第１電極アレイ２０と第２電極アレイ３０との間は、図２、図３に示すように、第１ワイヤ５０と第２ワイヤ６０とで接続されている。第１ワイヤ５０は、第１電極アレイ２０の一の行の電極パッド２１～２５と対向する第２電極アレイ３０の一の行の電極パッド３１～３５との間を磁性体７０の下側で接続するワイヤである。より詳しくは、第１ワイヤ５０は、第１電極アレイ２０の第１行の電極パッド２１と第２電極アレイ３０の第１行の電極パッド３１とを接続するものから、第１電極アレイ２０の第５行の電極パッド２５と第２電極アレイ３０の第５行の電極パッド３５とを接続するものまでの５本のワイヤで構成されている。また、第１ワイヤ５０は、金あるいは銅等の２０μｍ～４０μｍ程度のワイヤを、図２に示すように略台形のループ形状としたものであり、そのループ高さは、例えば、５０μｍ程度である。 The first electrode array 20 and the second electrode array 30 of the substrate 10 are connected by a first wire 50 and a second wire 60 as shown in FIGS. The first wire 50 is disposed below the magnetic body 70 between the electrode pads 21 to 35 in one row of the first electrode array 20 and the electrode pads 31 to 35 in one row facing the second electrode array 30. It is a wire to be connected. More specifically, the first wire 50 connects the electrode pad 21 of the first row of the first electrode array 20 and the electrode pad 31 of the first row of the second electrode array 30 to the first electrode array 20. It consists of five wires up to what connects the electrode pads 25 in the fifth row and the electrode pads 35 in the fifth row of the second electrode array 30. The first wire 50 is a wire of about 20 μm to 40 μm, such as gold or copper, having a substantially trapezoidal loop shape as shown in FIG. 2, and the loop height is, for example, about 50 μm. .
　第２ワイヤ６０は、磁性体７０の上を跨ぐように、第２電極アレイ３０の一の行の電極パッド３１～３４と、第１電極アレイ２０の次の行の電極パッド２２～２５との間を前記第１ワイヤ５０よりも高いループによって接続するものである。より詳しくは、第２ワイヤ６０は、第２電極アレイ３０の第１行の電極パッド３１と第１電極アレイ２０の第２行（次の行）の電極パッド２２とを接続するものから、第２電極アレイ３０の第４行の電極パッド３４と第１電極アレイ２０の第５行（次の行）の電極パッド２５とを接続するものまでの４本のワイヤで構成されている。第２ワイヤ６０は、第１ワイヤ５０と同様、金あるいは銅等の２０μｍ～５０μｍ程度のワイヤである。第２ワイヤ６０は、図２、図３に示すように、山形のループ形状であり、その高さは、例えば、２００μｍ程度であってもよい。 The second wire 60 extends between the electrode pads 31 to 34 in one row of the second electrode array 30 and the electrode pads 22 to 25 in the next row of the first electrode array 20 so as to straddle over the magnetic body 70. They are connected by a loop higher than the first wire 50. More specifically, the second wire 60 connects the electrode pad 31 in the first row of the second electrode array 30 and the electrode pad 22 in the second row (next row) of the first electrode array 20 to the second wire 60. It consists of four wires up to what connects the electrode pads 34 in the fourth row of the two-electrode array 30 and the electrode pads 25 in the fifth row (next row) of the first electrode array 20. Similar to the first wire 50, the second wire 60 is a wire of about 20 μm to 50 μm, such as gold or copper. As shown in FIGS. 2 and 3, the second wire 60 has a mountain-shaped loop shape, and the height thereof may be, for example, about 200 μm.
　以上のように構成された第１ワイヤ５０、第２ワイヤ６０は、図１から図３に示すように、磁性体７０の周囲に巻回されたマイクロコイル１００を構成する。 The first wire 50 and the second wire 60 configured as described above constitute the microcoil 100 wound around the magnetic body 70 as shown in FIGS.
　次に、図１から図３に示すマイクロコイル１００を基板１０の上に形成する方法について説明する。以下の説明では、説明のために各部の寸法を例示するが、異なる寸法として異なる大きさのマイクロコイル１００を同様の方法で形成することが可能である。 Next, a method for forming the microcoil 100 shown in FIGS. 1 to 3 on the substrate 10 will be described. In the following description, the dimensions of each part are illustrated for the sake of explanation, but it is possible to form microcoils 100 having different sizes as different dimensions by the same method.
　基板１０には、先に説明したように、第１電極アレイ２０と、第２電極アレイ３０と２つの電極台４１，４２が配置されている。電極台４１，４２を電極パッドの上にバンプを形成したものとする場合、電極台４１，４２の位置に配置された電極パッドの上にワイヤボンディングによって高さが１００μｍ程度になる様に一段あるいは複数段のバンプを形成する。 As described above, the first electrode array 20, the second electrode array 30, and the two electrode stands 41 and 42 are arranged on the substrate 10. When the electrode bases 41 and 42 are formed by bumps on the electrode pads, one step or so that the height is about 100 μm by wire bonding on the electrode pads arranged at the positions of the electrode bases 41 and 42. A plurality of bumps are formed.
　基板１０の第１電極アレイ２０、第２電極アレイ３０、電極台４１，４２の準備ができたら、直径３０μｍ程度の金または銅ワイヤを用いてワイヤボンディングによって第１電極アレイ２０の電極パッド２１～２５と第２電極アレイ３０の電極パッド３１～３５との間を５本の第１ワイヤ５０で接続する。先に説明したように、第１ワイヤ５０は略台形のループ形状で５０μｍ程度の高さとする。 When the first electrode array 20, the second electrode array 30, and the electrode bases 41 and 42 on the substrate 10 are ready, the electrode pads 21 to 21 of the first electrode array 20 are formed by wire bonding using gold or copper wire having a diameter of about 30 μm. 25 and the electrode pads 31 to 35 of the second electrode array 30 are connected by five first wires 50. As described above, the first wire 50 has a substantially trapezoidal loop shape and a height of about 50 μm.
　次に、電極台４１，４２の上に磁性体７０を取り付ける。電極台４１，４２の高さは１００μｍ程度であるから、磁性体７０は、第１ワイヤ５０の上に第１ワイヤ５０と離間して配置される。また、磁性体７０の延びる方向と第１ワイヤ５０のループの方向は直交方向となる。なお、磁性体７０を磁性ワイヤ７１で構成する場合には、図４に示すように、第２の電極パッド４３，４４の間をループ高さ１００μｍ程度の磁性ワイヤ７１で接続する。 Next, the magnetic body 70 is attached on the electrode bases 41 and 42. Since the electrode tables 41 and 42 have a height of about 100 μm, the magnetic body 70 is disposed on the first wire 50 so as to be separated from the first wire 50. Further, the extending direction of the magnetic body 70 and the direction of the loop of the first wire 50 are orthogonal to each other. When the magnetic body 70 is composed of the magnetic wire 71, the second electrode pads 43 and 44 are connected by the magnetic wire 71 having a loop height of about 100 μm as shown in FIG.
　次に、直径３０μｍ程度の金または銅ワイヤを用いてワイヤボンディングによって、磁性体７０の上を跨ぐように、第２電極アレイ３０の電極パッド３１～３４と第１電極アレイ２０の電極パッド２２～２４との間を４本の第２ワイヤ６０で接続する。先に説明したように、第２ワイヤは、山形のループ形状で２００μｍ程度の高さである。磁性体７０の配置されている高さは、１００μｍ程度であり、磁性体７０の直径は５０μｍ程度であるから、磁性体７０と第２ワイヤ６０との間には空間ができる。第２ワイヤ６０の接続が終了すると基板１０の上に磁性体７０の周囲にワイヤが巻回されたマイクロコイル１００が形成される。 Next, the electrode pads 31 to 34 of the second electrode array 30 and the electrode pads 22 to 22 of the first electrode array 20 are formed so as to straddle the magnetic body 70 by wire bonding using a gold or copper wire having a diameter of about 30 μm. 24 are connected by four second wires 60. As described above, the second wire has a mountain-shaped loop shape and a height of about 200 μm. The height at which the magnetic body 70 is disposed is about 100 μm, and the diameter of the magnetic body 70 is about 50 μm, so that there is a space between the magnetic body 70 and the second wire 60. When the connection of the second wire 60 is completed, the microcoil 100 in which the wire is wound around the magnetic body 70 is formed on the substrate 10.
　以上説明したように、基板１０に配置された電極パッド２１～２５、３１～３５の間をワイヤボンディングによってワイヤで接続するという簡便な方法でマイクロコイル１００を構成することができる。 As described above, the microcoil 100 can be configured by a simple method in which the electrode pads 21 to 25 and 31 to 35 arranged on the substrate 10 are connected by wire bonding.
　次に、図５を参照しながら、図１から図３を参照して説明したマイクロコイル１００を応用したマイクロトランス１５０について説明する。図５に示すように、マイクロトランス１５０は、第１電極アレイ２０の第１行の電極パッド２１に交流電源８１からの入力線８０を接続し、第２電極アレイ３０の第２行の電極パッド３２にグランド線８２を接続し、第２電極アレイ３０の第５行の電極パッド３５に出力線８３を接続する。これにより、マイクロコイル１００は、電極パッド２１から電極パッド３２までの１．５ターンの第１巻線と、電極パッド３１から電極パッド３５までの３．５ターンの第２巻線に分けられる。そして、入力線８０に交流電源８１を接続し、出力線８３に出力端子８４を接続すると、出力端子８４からは、第１巻線のターン数と第２巻線のターン数に比例した電圧が出力される。 Next, a microtransformer 150 to which the microcoil 100 described with reference to FIGS. 1 to 3 is applied will be described with reference to FIG. As shown in FIG. 5, the microtransformer 150 connects the input line 80 from the AC power supply 81 to the electrode pad 21 in the first row of the first electrode array 20, and the electrode pad in the second row of the second electrode array 30. A ground line 82 is connected to 32, and an output line 83 is connected to the electrode pad 35 in the fifth row of the second electrode array 30. Thus, the microcoil 100 is divided into a 1.5-turn first winding from the electrode pad 21 to the electrode pad 32 and a 3.5-turn second winding from the electrode pad 31 to the electrode pad 35. When the AC power supply 81 is connected to the input line 80 and the output terminal 84 is connected to the output line 83, a voltage proportional to the number of turns of the first winding and the number of turns of the second winding is generated from the output terminal 84. Is output.
　次に図６から図８を参照しながら本発明の他の実施形態のマイクロコイル２００について説明する。先に図１から図３を参照して説明した実施形態と同様の部分には同様の符号を付して説明は省略する。 Next, a microcoil 200 according to another embodiment of the present invention will be described with reference to FIGS. Parts similar to those of the embodiment described above with reference to FIGS. 1 to 3 are denoted by the same reference numerals and description thereof is omitted.
　本実施形態のマイクロコイル２００は、図１から図３を参照して説明したマイクロコイル１００の磁性体７０、電極台４１、４２がないものである。第１ワイヤ５０、第２ワイヤ６０の構成は、図１から図３を参照して説明したマイクロコイル１００と同様である。本実施形態のマイクロコイル２００は、より簡便な方法で基板１０の上にマイクロコイル２００を形成することができる。 The microcoil 200 of the present embodiment does not have the magnetic body 70 and the electrode bases 41 and 42 of the microcoil 100 described with reference to FIGS. The configuration of the first wire 50 and the second wire 60 is the same as that of the microcoil 100 described with reference to FIGS. In the microcoil 200 of the present embodiment, the microcoil 200 can be formed on the substrate 10 by a simpler method.
　次に図９を参照しながら、本発明の他の実施形態のマイクロコイル３００について説明する。本実施形態では、第２電極アレイ３０は、第１電極アレイ２０と平行で、第１電極アレイ２０の電極パッド２１～２５と電極パッド３１～３５の並び方向の位置がずれるよう配置されているものである。電極パッド２１は第１電極アレイの第１行の電極パッドであり、電極パッド２２～２５は第１電極アレイ２０の第２行～第５行の電極パッドである。また、電極パッド３１は第２電極アレイ３０の第１行の電極パッドであり、電極パッド３２～３５は第２電極アレイ３０の第２行～第５行の電極パッドである。なお、本実施形態のマイクロコイル３００の電極台４１、４２、磁性体７０は、図１～図３を参照して説明した実施形態と同様である。 Next, a microcoil 300 according to another embodiment of the present invention will be described with reference to FIG. In the present embodiment, the second electrode array 30 is arranged in parallel with the first electrode array 20 so that the positions of the electrode pads 21 to 25 and the electrode pads 31 to 35 of the first electrode array 20 are shifted. Is. The electrode pads 21 are electrode pads in the first row of the first electrode array, and the electrode pads 22 to 25 are electrode pads in the second to fifth rows of the first electrode array 20. The electrode pads 31 are electrode pads in the first row of the second electrode array 30, and the electrode pads 32 to 35 are electrode pads in the second row to fifth row of the second electrode array 30. The electrode bases 41 and 42 and the magnetic body 70 of the microcoil 300 according to this embodiment are the same as those described with reference to FIGS.
　本実施形態でも、第１ワイヤ５０は、第１電極アレイ２０の一の行の電極パッド２１～２５と第２電極アレイ３０の一の行の電極パッド３１～３５との間を磁性体７０の下側で接続するワイヤである。より詳しくは、第１ワイヤ５０は、第１電極アレイ２０の第１行の電極パッド２１と第２電極アレイ３０の第１行の電極パッド３１とを接続するものから、第１電極アレイ２０の第５行の電極パッド２５と第２電極アレイ３０の第５行の電極パッド３５とを接続するものまでの５本のワイヤで構成されている。また、第１ワイヤ５０は、金あるいは銅等の２０μｍ～４０μｍ程度のワイヤを、図２に示すように略台形のループ形状としたものであり、そのループ高さは、例えば、５０μｍ程度である。 Also in this embodiment, the first wire 50 is formed between the electrode pads 21 to 25 in one row of the first electrode array 20 and the electrode pads 31 to 35 in one row of the second electrode array 30. It is a wire connected on the lower side. More specifically, the first wire 50 connects the electrode pad 21 of the first row of the first electrode array 20 and the electrode pad 31 of the first row of the second electrode array 30 to the first electrode array 20. It consists of five wires up to what connects the electrode pads 25 in the fifth row and the electrode pads 35 in the fifth row of the second electrode array 30. The first wire 50 is a wire of about 20 μm to 40 μm, such as gold or copper, having a substantially trapezoidal loop shape as shown in FIG. 2, and the loop height is, for example, about 50 μm. .
　また、第２ワイヤ６０は、磁性体７０の上を跨ぐように、第２電極アレイ３０の一の行の電極パッド３１～３４と、第１電極アレイ２０の次の行の電極パッド２２～２５との間を前記第１ワイヤ５０よりも高いループによって接続するものである。より詳しくは、第２ワイヤ６０は、第２電極アレイ３０の第１行の電極パッド３１と第１電極アレイ２０の第２行（次の行）の電極パッド２２とを接続するものから、第２電極アレイ３０の第４行の電極パッド３４と第１電極アレイ２０の第５行（次の行）の電極パッド２５とを接続するものまでの４本のワイヤで構成されている。第２ワイヤ６０は、第１ワイヤ５０と同様、金あるいは銅等の２０μｍ～５０μｍ程度のワイヤである。第２ワイヤ６０は、図２、図３に示すように、山形のループ形状であり、その高さは、例えば、例えば、２００μｍ程度であってもよい。 Further, the second wire 60 straddles the magnetic body 70 so that the electrode pads 31 to 34 in one row of the second electrode array 30 and the electrode pads 22 to 25 in the next row of the first electrode array 20 are straddled. Are connected by a loop higher than that of the first wire 50. More specifically, the second wire 60 connects the electrode pad 31 in the first row of the second electrode array 30 and the electrode pad 22 in the second row (next row) of the first electrode array 20 to the second wire 60. It consists of four wires up to what connects the electrode pads 34 in the fourth row of the two-electrode array 30 and the electrode pads 25 in the fifth row (next row) of the first electrode array 20. Similar to the first wire 50, the second wire 60 is a wire of about 20 μm to 50 μm, such as gold or copper. As shown in FIGS. 2 and 3, the second wire 60 has a mountain-shaped loop shape, and the height thereof may be, for example, about 200 μm.
　以上のように構成された第１ワイヤ５０、第２ワイヤ６０は、図９に示すように、磁性体７０の周囲に巻回されたマイクロコイル３００を構成する。 The first wire 50 and the second wire 60 configured as described above constitute a microcoil 300 wound around the magnetic body 70 as shown in FIG.
　１０　基板、２０　第１電極アレイ、２１～２５，３１～３５，４３，４４　電極パッド、３０　第２電極アレイ、４１，４２　電極台、５０　第１ワイヤ、６０　第２ワイヤ、７０　磁性体、７１　磁性ワイヤ、８０　入力線、８１　交流電源、８２　グランド線、８３　出力線、８４　出力端子、１００，２００，３００　マイクロコイル、１５０　マイクロトランス。 10 substrate, 20 first electrode array, 21-25, 31-35, 43, 44 electrode pad, 30 second electrode array, 41, 42 electrode base, 50 first wire, 60 second wire, 70 magnetic material, 71 Magnetic wire, 80 input line, 81 AC power supply, 82 ground line, 83 output line, 84 output terminal, 100, 200, 300 microcoil, 150 microtransformer.

Claims (9)

  1. 　複数の電極パッドが所定の間隔で一列に並んだ第１電極アレイと、前記第１電極アレイと平行で、複数の電極パッドが所定の間隔で一列に並んだ第２電極アレイと、が配置された基板と、
    　前記第１電極アレイの一の行の電極パッドと前記第２電極アレイの一の行の電極パッドとの間を接続する第１ワイヤと、
    　前記第２電極アレイの一の行の電極パッドと前記第１電極アレイの次の行の電極パッドとの間を前記第１ワイヤよりも高いループによって接続する第２ワイヤと、を有するマイクロコイル。     A first electrode array in which a plurality of electrode pads are arranged in a line at a predetermined interval, and a second electrode array in which the plurality of electrode pads are arranged in a line at a predetermined interval in parallel with the first electrode array are arranged. A substrate,
    A first wire connecting between one row of electrode pads of the first electrode array and one row of electrode pads of the second electrode array;
    A microcoil comprising: a second wire connecting an electrode pad in one row of the second electrode array and an electrode pad in the next row of the first electrode array by a loop higher than the first wire.
  2. 　請求項１に記載のマイクロコイルであって、
    　前記第１電極アレイと前記第２電極アレイとの間に前記第１、第２電極アレイと平行で前記基板の表面から所定の間隔をあけて配置された磁性体を更に備え、
    　前記第１ワイヤは、前記磁性体の下側を通って電極パッドの間を接続し、前記第２ワイヤは、前記磁性体の上側を跨ぐように電極パッドの間を接続するマイクロコイル。     The microcoil according to claim 1,
    A magnetic body disposed between the first electrode array and the second electrode array at a predetermined distance from the surface of the substrate in parallel with the first and second electrode arrays;
    The first wire connects between the electrode pads through the lower side of the magnetic body, and the second wire connects between the electrode pads so as to straddle the upper side of the magnetic body.
  3. 　請求項２に記載のマイクロコイルであって、
    　前記基板は、前記第１、第２の電極アレイの間で、前記第１、第２の電極アレイの電極パッドの並び方向外側に配置された２つの電極台を含み、
    　前記磁性体は、２つの前記電極台の上に接続されていること、
    　を特徴とするマイクロコイル。     The microcoil according to claim 2,
    The substrate includes two electrode bases arranged between the first and second electrode arrays, on the outer side in the arrangement direction of the electrode pads of the first and second electrode arrays,
    The magnetic body is connected to the two electrode bases;
    A microcoil characterized by
  4. 　請求項２に記載のマイクロコイルであって、
    　前記基板は、前記第１、第２の電極アレイの間で、前記第１、第２の電極アレイの電極パッドの並び方向外側に配置された２つの第２の電極パッドを含み、
    　前記磁性体は、２つの前記第２の電極パッド間を接続する磁性体ワイヤであるマイクロコイル。     The microcoil according to claim 2,
    The substrate includes two second electrode pads disposed between the first and second electrode arrays on the outer side in the arrangement direction of the electrode pads of the first and second electrode arrays,
    The magnetic body is a microcoil that is a magnetic body wire connecting the two second electrode pads.
  5. 　請求項１から４のいずれか１項に記載のマイクロコイルであって、
    　前記第２電極アレイは、前記第１電極アレイと平行で、前記第１電極アレイの電極パッドと電極パッドの並び方向の位置がずれるように複数の電極パッドが所定の間隔で一列に並んでいるマイクロコイル。     The microcoil according to any one of claims 1 to 4, wherein
    The second electrode array is parallel to the first electrode array, and a plurality of electrode pads are arranged in a line at a predetermined interval so that the positions of the electrode pads of the first electrode array and the electrode pads are shifted. Micro coil.
  6. 　マイクロコイルを形成する方法であって、
    　複数の電極パッドが所定の間隔で一列に並んだ第１電極アレイと、前記第１電極アレイと平行で、複数の電極パッドが所定の間隔で一列に並んだ第２電極アレイと、が配置された基板を準備し、
    　前記第１電極アレイの一の行の電極パッドと前記第２電極アレイの一の行の電極パッドとの間をワイヤボンディングにより第１ワイヤで接続し、
    　前記第２電極アレイの一の行の電極パッドと前記第１電極アレイの次の行の電極パッドとの間をワイヤボンディングにより前記第１ワイヤよりも高いループを有する第２ワイヤで接続する方法。     A method of forming a microcoil, comprising:
    A first electrode array in which a plurality of electrode pads are arranged in a line at a predetermined interval, and a second electrode array in which the plurality of electrode pads are arranged in a line at a predetermined interval in parallel with the first electrode array are arranged. Prepare the board
    A first wire connected by wire bonding between an electrode pad in one row of the first electrode array and an electrode pad in one row of the second electrode array;
    A method in which the electrode pads in one row of the second electrode array and the electrode pads in the next row of the first electrode array are connected by a second wire having a loop higher than the first wire by wire bonding.
  7. 　請求項６に記載のマイクロコイルを形成する方法であって、
    　前記基板は、前記第１、第２の電極アレイの間で、前記第１、第２の電極アレイの並び方向外側に２つの電極台が配置され、
    　前記第１電極アレイの一の行の電極パッドと前記第２電極アレイの一の行の電極パッドとの間をワイヤボンディングにより第１ワイヤで接続し、
    　前記第１ワイヤの上側で前記第１ワイヤと離間するように２つの前記電極台の上に磁性体を取り付け、
    　前記磁性体の上を跨ぐように、前記第２電極アレイの一の行の電極パッドと前記第１電極アレイの次の行の電極パッドとの間をワイヤボンディングにより第２ワイヤで接続する方法。     A method of forming a microcoil according to claim 6, comprising:
    In the substrate, two electrode platforms are arranged between the first and second electrode arrays on the outer side in the arrangement direction of the first and second electrode arrays,
    A first wire connected by wire bonding between an electrode pad in one row of the first electrode array and an electrode pad in one row of the second electrode array;
    A magnetic body is mounted on the two electrode tables so as to be separated from the first wire above the first wire,
    A method of connecting the electrode pads in one row of the second electrode array and the electrode pads in the next row of the first electrode array with a second wire by wire bonding so as to straddle the magnetic body.
  8. 　請求項６に記載のマイクロコイルを形成する方法であって、
    　前記基板は、前記第２電極アレイが前記第１電極アレイと平行で、前記第１電極アレイの電極パッドと電極パッドの並び方向の位置がずれるように複数の電極パッドが所定の間隔で一列に並んで配置されている方法。     A method of forming a microcoil according to claim 6, comprising:
    The substrate has a plurality of electrode pads arranged in a line at a predetermined interval so that the second electrode array is parallel to the first electrode array and the positions of the electrode pads of the first electrode array and the electrode pads are shifted in the alignment direction. Method that is arranged side by side.
  9. 　請求項７に記載のマイクロコイルを形成する方法であって、
    　前記基板は、前記第２電極アレイが前記第１電極アレイと平行で、前記第１電極アレイの電極パッドと電極パッドの並び方向の位置がずれるように複数の電極パッドが所定の間隔で一列に並んで配置されている方法。
          A method of forming a microcoil according to claim 7, comprising:
    The substrate has a plurality of electrode pads arranged in a line at a predetermined interval so that the second electrode array is parallel to the first electrode array and the positions of the electrode pads of the first electrode array and the electrode pads are shifted in the alignment direction. Method that is arranged side by side.
PCT/JP2017/027231 2016-07-29 2017-07-27 Microcoil and method for forming same WO2018021470A1 (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050122198A1 (en) * 2003-12-05 2005-06-09 Yaping Zhou Inductive device including bond wires
JP2016018817A (en) * 2014-07-04 2016-02-01 ローム株式会社 Semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050122198A1 (en) * 2003-12-05 2005-06-09 Yaping Zhou Inductive device including bond wires
JP2016018817A (en) * 2014-07-04 2016-02-01 ローム株式会社 Semiconductor device

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