TWI587053B - Conductive line structure and active device array substrate - Google Patents

Description

Wire structure and active device array substrate

The present invention relates to a wire structure and an active device array substrate to which the wire structure is applied.

Flat panel displays, such as liquid crystal displays and plasma displays, are widely used in mobile phones, notebook computers, desktop displays, and televisions because of their high image quality, small size, light weight, and wide application range. Electronic products have gradually replaced traditional cathode ray tube displays and become the mainstream of displays. The so-called large-area, high-resolution requirements, etc., have become the key to these flat-panel display appeals.

In a flat panel display, an electrical signal is transmitted to each pixel through a wire and its connected signal line. However, as the resolution of flat panel displays increases and the frame size of the display becomes narrower, the spacing between the wires is also reduced to approach the limits allowed by the design rules. Since the soldering legs are closely arranged and the signal lines are dispersed, that is to say, the spacing between the soldering legs and the spacing of the signal lines are different, the lengths of the individual wires are different to form a fanout, and the wires of different lengths cause the waveform of the signal to occur. Deformation, which affects the display quality of the liquid crystal display device.

In various embodiments of the present invention, the wire structure has a first wire and a second wire stacked on each other, and the position of the second wire may have a certain tolerance range, and the process deviation does not affect the first wire and the first wire. The overlap area of the two wires, thereby ensuring that the capacitance of the wire structure does not change due to slight offset of the second wire. In addition, as the length of each wire structure changes, the second wires of each wire structure can be adjusted accordingly, so that the capacitances of the respective wire structures are substantially the same.

According to some embodiments of the invention, the wire structure comprises a first wire and a second wire. The first wire has a first portion, a second portion, and a buffer portion, wherein the buffer portion is electrically connected between the first portion and the second portion, and the extending direction of the first portion is different from the extending direction of the buffer portion. The second wire has a first side and a second side opposite to the first side, wherein the first side overlaps at least the first portion of the first wire and the buffer portion and does not overlap the second portion of the first wire, The second side overlaps at least the second portion of the first wire.

In one or more embodiments of the present invention, the second side overlaps the buffer portion of the first wire and does not overlap the first portion of the first wire.

In one or more embodiments of the present invention, the extending direction of the first portion of the first wire is substantially the same as the extending direction of the second portion of the first wire.

In one or more embodiments of the present invention, the second wire has a first portion, a second portion, and a buffer portion, and the buffer portion of the second wire is electrically connected between the first portion and the second portion of the second wire. The extending direction of the first portion of the second wire is different from the extending direction of the buffer portion of the second wire.

In one or more embodiments of the present invention, the direction in which the buffer portion of the first wire extends is substantially the same as the direction in which the buffer portion of the second wire extends.

In one or more embodiments of the present invention, the buffer portion of the first wire overlaps with the buffer portion of the second wire.

In one or more embodiments of the present invention, the buffer portion of the first wire does not overlap with the buffer portion of the second wire.

In one or more embodiments of the present invention, the extending direction of the first portion of the first wire is substantially the same as the extending direction of the first portion of the second wire.

In one or more embodiments of the present invention, the extending direction of the second portion of the first wire is substantially the same as the extending direction of the second portion of the second wire.

In one or more embodiments of the present invention, a vertical projection of the first portion and the second portion of the first wire on the projection surface has a first pitch therebetween, and the first portion and the second portion of the second wire are on the projection surface The upper vertical projection has a second pitch therein, and the first pitch is no greater than a combination of the second pitch and the width of the first portion of the second wire.

In one or more embodiments of the present invention, the second wire includes a long straight wire, and the long straight wire at least partially overlaps the buffer portion of the first wire.

In one or more embodiments of the present invention, the vertical projections of the first portion and the second portion of the first wire on the projection surface are substantially connected.

In one or more embodiments of the present invention, the wire structure further includes an intermediate layer disposed between the first wire and the second wire, wherein the intermediate layer The first wire is separated from the second wire.

According to some embodiments of the present invention, an active device array substrate includes a substrate, a plurality of transmission lines, a driver, and a plurality of the aforementioned wire structures. The substrate has a display area and a non-display area. The transmission line is disposed on the display area of the substrate. The driver is disposed in a non-display area of the substrate. The wire structures are respectively connected between the transmission line and the driver.

In one or more embodiments of the present invention, the buffer portion of the first wire and the second wire in each wire structure constitute an overlap portion. The area of at least two overlapping portions is different.

In one or more embodiments of the present invention, the second wire of the at least part of the wire structure has a first portion, a second portion, and a buffer portion, and the buffer portion of the second wire is electrically connected to the first portion and the second portion of the second wire Between the two parts, wherein the extending direction of the first portion of the second wire is different from the extending direction of the buffer portion of the second wire, wherein the buffer portion of the second wire of at least part of the wire structure is different in size.

In one or more embodiments of the present invention, the buffer portions of the first wires of each of the wire structures are substantially the same size.

In one or more embodiments of the present invention, the second portion of the first wire is connected to the driver, and the first portion of the first wire is connected to one of the transmission lines, wherein the length of the first portion of the first wire is substantially equal to the length of the first wire The length of the second part.

In one or more embodiments of the present invention, the first wire of each wire structure includes a first connecting portion, wherein the first connecting portion of the first wire is paddedly connected to the first portion of the first wire and a transmission line Every guide The second wire of the wire structure includes a first connecting portion, wherein the first connecting portion of the second wire is connected between the first portion of the second wire and the other transmission line, wherein the first connecting portion and the second wire of the first wire The first connecting portions do not overlap.

100‧‧‧Active component array substrate

110‧‧‧Substrate

120‧‧‧ transmission line

120a~120b‧‧‧ transmission line

130‧‧‧ drive

224‧‧‧ second

226‧‧‧ buffer

227‧‧‧First connection

228‧‧‧Second connection

229‧‧‧Long straight wire

140‧‧‧Fan-in wire

200‧‧‧Wire structure

200a~200d‧‧‧ wire structure

210‧‧‧First wire

212‧‧‧ first

214‧‧‧Part II

216‧‧‧ buffer

217‧‧‧First connection

218‧‧‧Second connection

220‧‧‧second wire

220a‧‧‧ first side

220b‧‧‧ second side

222‧‧‧ first

230‧‧‧Intermediate

X-, X+‧‧‧ directions

Y-, Y+‧‧‧ direction

AA‧‧‧ display area

NA‧‧‧Non-display area

P1‧‧‧projection surface

L1‧‧‧ first spacing

L2‧‧‧second spacing

W2‧‧‧Width

OV‧‧‧ overlap

1C-1C‧‧‧ line

300‧‧‧Soft circuit board

1A is a top plan view of an active device array substrate according to some embodiments of the present invention.

Fig. 1B is a partially enlarged plan view showing the active device array substrate of Fig. 1A.

Fig. 1C is a schematic cross-sectional view taken along line 1C-1C of Fig. 1B.

FIG. 1D is an enlarged schematic view showing the first wire of the wire structure of the active device array substrate of FIG. 1B.

Fig. 1E is a top plan enlarged view showing the wire structure of the active device array substrate of Fig. 1B.

2A and 2B are top views of the wire structure of Fig. 1B in a process offset state.

Figure 3 is a top plan view of a wire structure in accordance with some embodiments of the present invention.

Figure 4 is a top plan view of a wire structure in accordance with some embodiments of the present invention.

Figure 5 is a top plan view of a wire structure in accordance with some embodiments of the present invention.

6A to 6C are diagrams showing wire junctions according to some embodiments of the present invention A schematic view of the structure.

The various embodiments of the present invention are disclosed in the drawings, and in the claims However, it should be understood that these practical details are not intended to limit the invention. That is, in some embodiments of the invention, these practical details are not necessary. In addition, some of the conventional structures and elements are shown in the drawings in a simplified manner.

FIG. 1A is a top plan view of an active device array substrate 100 in accordance with some embodiments of the present invention. The active device array substrate 100 includes a substrate 110, a plurality of transmission lines 120, a driver 130, and a plurality of wire structures 200. The substrate 110 has a display area AA and a non-display area NA. In some embodiments, a plurality of pixel units (not shown) are disposed in the display area AA to control the liquid crystal layer or the organic light emitting layer. The transmission line 120 is disposed in the display area AA of the substrate 110 to connect the pixel units. The driver 130 is disposed on the non-display area NA of the substrate 100. The wire structure 200 is connected between the transmission line 120 and the driver 130, respectively, for use as a fan-out wire. In addition to the above configuration, the active device array substrate 100 may further include a fan-in wire 140 to connect the driver 130 and the flexible circuit board 300.

Referring to FIGS. 1B and 1C, FIG. 1B is a partially enlarged plan view of the active device array substrate 100 of FIG. 1A. Fig. 1C is a schematic cross-sectional view taken along line 1C-1C of Fig. 1B. The wire structure 200 includes a first wire 210, a second wire 220, and an intermediate layer 230. First wire 210 electrical The second wire 220 is electrically connected between the transmission line 120b and the driver 130. The first wire 210 and the second wire 220 are stacked on each other, and the intermediate layer 230 is disposed between the first wire 210 and the second wire 220 to separate the first wire 210 and the second wire 220. In this way, two different signals can be transmitted simultaneously in a limited space.

Reference is also made to FIG. 1B and FIG. 1D. 1D is a top plan view of the first wire 210 of the wire structure 200 of the active device array substrate of FIG. 1B. In the embodiment of the present invention, the first wire 210 has a first portion 212 , a second portion 214 , and a buffer portion 216 . The buffer portion 216 is electrically connected between the first portion 212 and the second portion 214 . The extending direction of the first portion 212 is different from the extending direction of the buffer portion 214. In some embodiments, the extending direction of the second portion 214 is different from the extending direction of the buffer portion 216. In the definition of the noun in this document, as indicated by the 1D figure, the projections of the first portion 212 and the second portion 214 in the extending direction overlap with the buffer portion 216, and the first portion 212 and the second portion 214 are defined as respectively connected. Two portions of the first wire 210 at opposite ends of the buffer portion 216. In the first DD, the dividing line of the first portion 212, the buffer portion 216, and the second portion 214 is indicated by a broken line.

On the other hand, in the present embodiment, the second wire 220 has a first portion 222, a second portion 224, and a buffer portion 226. The buffer portion 226 of the second wire 220 is electrically connected to the first portion 222 of the second wire 220. Between the second portion 224, the extending direction of the first portion 222 of the second wire 220 is different from the extending direction of the buffer portion 226 of the second wire 220. In some embodiments, the extending direction of the second portion 224 and the extending direction of the buffer portion 226 are different, and the extending direction of the second portion 224 is different from the extending direction of the buffer portion 226. In the definition of the nouns herein, the projections of the first portion 222 and the second portion 224 in the extending direction overlap with the buffer portion 226, and the first portion 222 and the second portion 224 are respectively connected to opposite ends of the buffer portion 226. The definition of the first portion 222, the second portion 224, and the buffer portion 226 of the second wire 220 is substantially the same as that of the first wire 210, and the dividing line is not illustrated in the drawings.

Herein, the first portion 212 of the first wire 210 and the first portion 222 of the second wire 220 extend substantially the same direction, and the second portion 214 of the first wire 210 and the second portion 224 of the second wire 220 extend. Roughly the same, the first wire 210 and the second wire 220 are stacked on each other, and two different signals can be simultaneously transmitted in a limited space.

In some cases, because the reticle alignment accuracy is limited, the second wire 220 may not be disposed at the center of the first wire 210 as in FIG. 1B, so that the relative positions of the first wire 210 and the second wire 220 are The problem of offset. This offset problem may cause a drastic change in the overlapping area of the first wire 210 and the second wire 220, thereby affecting the capacitance between the first wire 210 and the second wire 220. Reference can be made to the formula of the parallel plate capacitor: C = ε A / d, where C is the capacitance in the wire structure 200, ε is the dielectric constant of the intermediate layer 130, and A is the overlapping area of the first wire 210 and the second wire 220, d is the distance between the first wire 210 and the second wire 220, wherein the capacitance is proportional to the overlap area. At this point, it is difficult to control the capacitance of the wire structure 200 due to the accuracy problem.

Referring to FIG. 1B and FIG. 1E simultaneously, FIG. 1E is a top view enlarged view of one of the conductor structures 200 of the active device array substrate 100 of FIG. 1B. The second side 220b of the side 220a. In the various embodiments of the present invention, the first side 220a of the second wire 220 is designed to overlap at least the first portion 212 of the first wire 210 and the buffer portion 216 and does not overlap the second portion 214 of the first wire 210. The second side 220b of the second wire 220 overlaps at least the second portion 214 of the first wire 210, and the second side 220b of the second wire 220 may not overlap with the first portion 212 of the first wire 210. In this way, even if the first wire 210 and the second wire 220 are offset in the direction X+/X- and the direction Y+/Y-, the overlapping area of the first wire 210 and the second wire 220 can be maintained substantially the same, thereby ensuring The capacitance of the wire structure 200 does not change due to the slight offset of the second wire 220.

Specifically, the first portion 212 of the first wire 210 and the first portion 222 of the second wire 220 have a first overlapping area, and the second portion 214 of the first wire 210 and the second portion 224 of the second wire 220 have A second overlapping area. In one aspect, the width of the first overlap area and the second overlap area have opposite amounts of change with respect to the offset in the direction X+/X-, direction Y+/Y-. For example, the first overlap area is increased by a certain area as the second wire 220 is X-shifted in the direction, and the second overlap area is decreased by a certain area as the second wire 220 is X-shifted in the direction. On the other hand, the first wire 210 and the second wire 220 have a special configuration such that the first overlap area is similar to the length of the second overlap area. In this way, in view of the fact that the first overlap area is similar to the length of the second overlap area, the widths of the first overlap area and the second overlap area have opposite changes with the offset direction, so the first overlap area overlaps with the second overlap. The sum of the areas can still be maintained substantially the same, so that the capacitance of the wire structure 200 does not change due to the slight offset of the second wire 220.

Regarding the design of the special configuration such that the first overlapping area is similar to the length of the second overlapping area, the buffer portion 216 and the buffer portion 226 may be designed to be located as far as possible in the center of the first wire 210 and the second wire 220, respectively, so that the first wire 210 is made. The length of the first portion 212 is as equal as possible to the length of the second portion 214 of the first wire 210, and the length of the first portion 222 of the second wire 220 is as equal as possible to the length of the second portion 224 of the second wire 220. However, in view of the relationship between the transmission line 120 and the driver 130, in actual design, the lengths of the first portion 212 and the second portion 214 of the first wire 210 are difficult to be the same, and the first portion 222 and the second portion of the second wire 220 are The length of the first portion 212 of the first wire 210 is greater than the length of the second portion 214 of the first wire 210, and the length of the second portion 224 of the second wire 220 is greater than the length. The length of the first portion 222 of the two wires 220. In some embodiments of the present invention, the length of the first portion 212 may be approximately equal to the length of the second portion 224, and the length of the first portion 222 is approximately equal to the length of the second portion 214, such that the first overlap can be made. The area is similar to the length of the second overlap area to ensure that the sum of the first overlap area and the second overlap area remains substantially the same.

For convenience of explanation, the projection plane P1 is defined as a plane perpendicular to the extending direction of the first portion 222 of the second wire 220. The vertical projection of the first portion 212 and the second portion 214 of the first wire 210 on the projection surface P1 has a first pitch L1 therein, and the first portion 222 and the second portion 224 of the second wire 220 are on the projection surface P1. The vertical projection has a second pitch L2 therein. The second pitch L2 is smaller than the first pitch L1. In other words, the distance between the first portion 222 of the second wire 220 and the second portion 224 is less than the first of the first wire 210 The distance between the portion 212 and the second portion 214 is such that the length of the buffer portion 226 of the second wire 220 can be smaller than the buffer portion 216 of the first wire 210.

In order to make the first side 220a of the second wire 220 overlap at least the first portion 212 of the first wire 210 and the buffer portion 216 and not overlap the second portion 214 of the first wire 210, the second side of the second wire 220 The edge 220b overlaps at least the second portion 214 of the first wire 210. At this time, the first pitch L1 can be designed to be no greater than the width W2 of the first portion 222 of the second wire 220. In some embodiments, the width W2 of the first portion 222 of the second wire 220 is the width of the vertical projection of the first portion 222 of the second wire 220 on the projection surface P1. In this way, the position of the second wire 220 can be set to a certain tolerance range. Specifically, in the embodiment, the first pitch L1 is approximately equal to the width of the second portion L2 and the width W2 of the first portion 222 (and the second portion 224) of the second wire 220 on the projection surface P1. The deviation tolerance range is approximately equal to the value of the width W2 on the projection surface P1. In other embodiments, the first pitch L1 is smaller than the width W2 of the first portion 222 of the second wire 220, and the tolerance range is approximately equal to the first on the projection surface P1 on the projection surface P1. The pitch L1 is subtracted from the value of the second pitch L2.

2A and 2B are top views of the wire structure 200 of FIG. 1B in a process offset state. Here, two extreme examples within the allowable offset range in the direction X+/X- are shown in Figures 2A and 2B, respectively, wherein the second wire 220 in the embodiment of Figure 2A is offset X-direction. In the embodiment of FIG. 2A, the first side 220a of the second wire 220 overlaps the buffer portion 216 of the first wire 210 and does not overlap the second wire 210. 214, the second side 220b just overlaps the edge of the second portion 214 of the first wire 210, so that the sum of the first overlap area and the second overlap area can still be equal to the first overlap area in FIG. 2A and The sum of the second overlapping areas. In the embodiment of FIG. 2B, the second wire 220 is offset in the direction X+, and the second side 220b of the second wire 220 is overlapped with the buffer portion 216 of the first wire 210 and does not overlap the first portion 212 of the first wire 210. The first side 220a overlaps the first portion 212 of the first wire 210 and the edge of the buffer portion 216, so that the sum of the first overlap area and the second overlap area can still be equal to the first overlap in FIG. 2A. The sum of the area and the second overlapping area.

In one or more embodiments of the present invention, the widths of the first portion 212 and the second portion 214 of the first wire 210 are substantially the same, and the widths of the first portion 222 and the second portion 224 of the second wire 220 are substantially the same, Achieve the aforementioned anti-offset purpose. In the present embodiment, the width of the first wire 210 (ie, the width of the first portion 212 and the second portion 214) may be equal to the width of the second wire 220 (ie, the width of the first portion 222 and the second portion 224). The scope of the present invention should not be limited in this way. In other embodiments, the width of the first wire 210 (ie, the width of the first portion 212 and the second portion 214) may not be equal to the width of the second wire 220 (ie, the first The width of the portion 222 and the second portion 224 can be designed to be no longer than the width W2 of the first portion 222 (or the second portion 224) of the second wire 220. There may be deviations as described above to allow for efficacy.

In one or more embodiments of the present invention, the first portion 212 of the first wire 210 and the second portion 214 extend substantially the same direction, and the first portion 222 of the second wire 220 and the second portion 224 extend substantially the same direction. . borrow Thus, the first overlapping area formed is substantially the same as the second overlapping area shape. The scope of the invention should not be limited thereby, in some embodiments, the overlap area is primarily affected by the length of the first portion 212, 222 and the second portion 214, 224, ensuring that the first portion 212 and the first portion 222 extend When the directions of the second portion 214 and the second portion 224 are substantially the same, the difference between the extending directions of the first portion 212 and the second portion 214 has little effect on the overlapping area, so the first wire 210 is first. The extending direction of the portion 212 and the second portion 214 may be different, and the extending direction of the first portion 222 and the second portion 224 of the second wire 220 may be different.

In the present embodiment, the buffer portion 216 of the first wire 210 overlaps with the buffer portion 226 of the second wire 220, and the buffer portion 216 of the first wire 210 extends in substantially the same direction as the buffer portion 226 of the second wire 220. For example, this is parallel to the direction X- and the direction X+ to achieve space saving. In other embodiments, the buffer portion 216 of the first wire 210 and the buffer portion 226 of the second wire 220 may extend in a direction not parallel to the direction X- and the direction X+. In other embodiments, as described above, the overlap area is mainly affected by the lengths of the first portions 212, 222 and the second portions 214, 224, so that the direction of extension of the buffer portion 216 of the first wire 210 and the second wire 220 The direction in which the buffer portion 226 extends may be different.

Go back to Figure 1B. In this embodiment, the first wire 210 of each wire structure 200 includes a first connecting portion 217 and a second connecting portion 218, wherein the first connecting portion 217 connects the first portion 212 of the first wire 210 with the transmission line 120a, and the second The connecting portion 218 connects the second portion 214 of the first wire 210 with the driver 130. On the other hand, the second guide of each wire structure 200 The wire 220 includes a first connecting portion 227 and a second connecting portion 228, wherein the first connecting portion 227 is connected to the first portion 222 of the second wire 220 and the transmission line 120b, and the second connecting portion 228 is connected to the second portion 224 of the second wire 220. With the drive 130.

The first connecting portion 217 of the first wire 210 does not overlap with the first connecting portion 227 of the second wire 220, and the second connecting portion 218 of the first wire 210 does not overlap with the second connecting portion 228 of the second wire 220. . Therefore, the lengths of the first connecting portions 217, 227 and the second connecting portions 218, 228 do not affect the aforementioned capacitance values, and the lengths of the first connecting portions 217, 227 and the second connecting portions 218, 228 may be arbitrarily configured as appropriate.

So far, the anti-offset effect can be obtained by the above-described provision of the wire structure 200.

In various embodiments of the present invention, the first wire 210 and the second wire 220 may be formed of various conductive materials, such as metal. The intermediate layer 230 and the protective layer 240 may be formed of various insulating materials such as inorganic materials (for example, yttria, tantalum nitride, yttrium oxynitride, other suitable materials, or a combination thereof) or organic materials (for example, photoresist). , polyimide (PI), benzocyclobutene (BCB), epoxy (Epoxy), perfluorocyclobutane (PFCB), other suitable materials, or combinations thereof, or other suitable Material, or a combination of the above. The intermediate layer 230 and the protective layer 240 may be formed of the same or different materials. The intermediate layer 230 is made of an insulating material, and the first wire 210 and the second wire 220 can be electrically insulated. In other embodiments, the intermediate layer 230 can also be formed from a semiconductor material, such as a doped semiconductor material. The semiconductor material can allow the first wire 210 and the second wire 220 to be within a suitable potential difference range (eg, 0 to 8 volts) Influence each other. For example, the semiconductor material can be a single crystal germanium.

3 is a top plan view of a wire structure 200 in accordance with some embodiments of the present invention. This embodiment is similar to the embodiment of FIG. 1B. The difference is that in the embodiment, the first portion 212 of the first wire 210 and the second portion 214 extend in different directions, and the first portion 222 of the second wire 220 is The second portion 224 extends in a different direction. As previously mentioned, the overlap area is primarily affected by the length of the first portions 212, 222 and the second portions 214, 224, ensuring that the first portion 212 and the first portion 222 extend substantially the same direction, the second portion 214 and the second portion When the extending direction of the 224 is substantially the same, the extending direction of the first portions 212, 222 may be different from the extending direction of the second portions 214, 224 to facilitate the utilization of the space to match the configuration of other components. Other details of the present embodiment are substantially as described above, and are not described herein again.

4 is a top plan view of a wire structure 200 in accordance with some embodiments of the present invention. This embodiment is similar to the embodiment of FIG. 1B except that in the present embodiment, the buffer portion 216 of the first wire 210 and the buffer portion 226 of the second wire 220 do not overlap.

As previously mentioned, the overlap area is primarily affected by the length of the first portions 212, 222 and the second portions 214, 224, and relatively independent of the arrangement of the buffer portion 216 and the buffer portion 226. Therefore, the buffer portion 216 and the buffer portion 226 can be designed to be shifted. In other embodiments, the extending direction of the buffer portion 216 of the wire 210 may be different from the extending direction of the buffer portion 226 of the second wire 220. Other details of the present embodiment are substantially as described above, and are not described herein again.

Figure 5 is a top plan view of a wire structure 200 in accordance with some embodiments of the present invention. This embodiment is similar to the embodiment of FIG. 1B. The difference is that in the present embodiment, the second wire 220 includes the long straight wire 229 without the buffer portion 226 (refer to FIG. 1B). The long straight wire 229 is connected between the first connecting portion 227 and the second connecting portion 228. The extending direction of the long straight wire 229 is different from the extending direction of the first connecting portion 227 and the second connecting portion 228. Herein, the first portion 212 of the first wire 210 and the second portion 214 extend substantially the same direction, and the extending direction of the first portion 212 and the second portion 214 of the first wire 210 and the extending direction of the long straight wire 229 are substantially the same. In some embodiments, the long straight wire 229 at least partially overlaps the buffer portion 216 of the first wire 210. Here, the long straight wire 229 refers to a wire having a single extending direction.

In one or more embodiments of the present invention, the first portion 212 of the first wire 210 and the second portion 214 are substantially connected to the vertical projection of the projection surface P1. In other words, the projection of the buffer portion 216 of the first wire 210 on the projection surface P1 is a vertical projection set in which the first portion 212 and the second portion 214 are common to the projection surface P1.

Through the above design, it can be ensured that the first wire 210 and the second wire 220 are within the proper offset range, and the overlapping area of the first wire 210 and the second wire 220 is the same, thereby ensuring that the capacitance of the wire structure 200 does not change due to the offset. .

Other details of the present embodiment are substantially as described above, and are not described herein again.

Go back to Figure 1A. In various embodiments of the present invention, the distribution of the pins (not shown) of the driver 130 is not the same as the distribution of the transmission lines 120 located in the active area AA, so that the lengths of the respective wire structures 200 are not the same. with. For example, the length of the wire structure 200a located on the outer side is greater than the length of the wire structure 200c located on the inner side. In various embodiments of the invention, the first overlap area and the second overlap area of each of the wire structures 200 are adjusted for the length of the wire structure 200.

6A to 6C are top plan views of a plurality of wire structures 200a to 200c of the active device array substrate 100 of Fig. 1A. Referring to FIGS. 6A-6C, the buffer portion 216 of the first wire 210 in each of the wire structures 200a-200c and the second wire 220 constitute an overlapping portion OV, wherein at least two overlapping portions OV have different areas.

For convenience of description, the vertical projection of the first portion 212 and the second portion 216 of the first wire 210 on the projection surface P1 is first defined to have a first pitch L1 therein, and the first portion 222 of the second wire 220 is The vertical projection of the second portion 226 on the projection surface P1 has a second pitch L2 therein.

In the present embodiment, for the length of the wire structures 200a to 200c, the distance between the second pitches L2 of the second wires 220 is adjusted while maintaining the first pitch L1 of the first wires 210. In detail, the length of the wire structures 200a-200c and the second pitch L2 of the second wire 220 may have a negative correlation. For example, the length of the wire structure 200a is greater than the length of the wire structure 200b, and the second spacing L2 (not labeled) of the wire structure 200a is zero, which is less than the second spacing L2 of the wire structure 200b. Similarly, the length of the wire structure 200b is greater than the length of the wire structure 200c, and the second spacing L2 of the wire structure 200b is less than the second spacing L2 of the wire structure 200c.

In this way, although the lengths of the respective wire structures 200a to 200c are different, because the second pitch L2 of the second wire 220 is adjusted, The overlapping area of the wire structures 200a to 200c (i.e., the sum of the aforementioned first overlapping area and the second overlapping area) is substantially the same.

In the present embodiment, the second pitch L2 of the above adjustment second wire 220 may be reflected in the size of the buffer portion 226. The buffer portions 216 of the first wires 210 of each of the wire structures 200a to 200c have the same size. For the length of the wire structure 200, the size of the buffer portion 226 of the second wire 220 of at least part of the wire structures 200a-200c is adjusted, and the size of the buffer portion 226 of the second wire 220 of at least part of the wire structures 200a-200c is different, and the overlap is adjusted. The area of the OV. In detail, the length of the wire structures 200a to 200c may have a negative correlation with the area of the overlapping portion OV. For example, the length of the wire structure 200a is greater than the length of the wire structure 200b, and the area of the overlapping portion OV of the wire structure 200a is smaller than the area of the overlapping portion OV of the wire structure 200b. Similarly, the length of the wire structure 200b is greater than the length of the wire structure 200c, and the area of the overlap OV of the wire structure 200b is smaller than the area of the overlap OV of the wire structure 200c. In other words, the length of the first one of the wire structures is greater than the length of the second one of the wire structures, and the area of the overlapping portion of the first one of the wire structures is smaller than the wire structure The area of the overlapping portion of the second one.

As described above, the area adjustment of the second pitch L2 and the overlapping portion OV has a negative correlation with the length of the wire structures 200a to 200c. In this way, even if the lengths of the respective wire structures 200a to 200c are not the same, the overlapping area of the respective wire structures 200a to 200c (that is, the sum of the first overlapping area and the second overlapping area) can be maintained substantially the same.

Here, the design of the design is only described by the wire structures 200a to 200c. It is to be noted that the respective wire structures 200a to 200c are generally configured as the front wire structure 200 (refer to FIG. 1B), and the actual application does not limit the scope of the present invention by the number of the wire structures 200a to 200c.

Other details of the present embodiment are substantially as described above, and are not described herein again.

In various embodiments of the present invention, the design wire structure has a first wire and a second wire stacked on each other, and the second wire is disposed at a certain tolerance range, and the process deviation does not affect the first wire and The overlapping area of the second wire, thereby ensuring that the capacitance of the wire structure does not change due to slight offset of the second wire. In addition, as the length of each wire structure changes, the second wires of each wire structure can be adjusted accordingly, so that the capacitances of the respective wire structures are substantially the same.

While the invention has been described above in terms of various embodiments, it is not intended to limit the invention, and the invention may be modified and modified without departing from the spirit and scope of the invention. The scope of protection is subject to the definition of the scope of the patent application attached.

120‧‧‧ transmission line

120a~120b‧‧‧ transmission line

130‧‧‧ drive

200‧‧‧Wire structure

210‧‧‧First wire

212‧‧‧ first

214‧‧‧Part II

216‧‧‧ buffer

217‧‧‧First connection

218‧‧‧Second connection

220‧‧‧second wire

220a‧‧‧ first side

220b‧‧‧ second side

222‧‧‧ first

224‧‧‧ second

226‧‧‧ buffer

227‧‧‧First connection

228‧‧‧Second connection

X-‧‧‧ direction

X+‧‧‧ direction

Y-‧‧‧ direction

Y+‧‧‧ direction

1C-1C‧‧‧ line

Claims (21)

A wire structure comprising: a first wire having a first portion, a second portion, and a buffer portion, wherein the buffer portion is electrically connected between the first portion and the second portion, the first portion One extending direction is different from an extending direction of one of the buffer portions; and a second wire having a first side and a second side opposite the first side, wherein the first side of the second wire The edge overlaps at least the first portion of the first wire and the buffer portion and does not overlap the second portion of the first wire, and the second side of the second wire overlaps at least the first wire The second part. The wire structure of claim 1, wherein the second side overlaps the buffer portion of the first wire and does not overlap the first portion of the first wire. The wire structure of claim 1, wherein the extending direction of the first portion of the first wire is substantially the same as the direction in which one of the second portions of the first wire extends. The wire structure of claim 1, wherein the second wire has a first portion, a second portion, and a buffer portion, wherein the buffer portion of the second wire is electrically connected to the first portion of the second wire Between the portion and the second portion, an extending direction of the first portion of the second wire is different from an extending direction of the buffer portion of the second wire. The wire structure of claim 4, wherein the extending direction of the buffer portion of the first wire is substantially the same as the extending direction of the buffer portion of the second wire. The wire structure of claim 4, wherein the buffer portion of the first wire overlaps the buffer portion of the second wire. The wire structure of claim 4, wherein the buffer portion of the first wire does not overlap the buffer portion of the second wire. The wire structure of claim 4, wherein the extending direction of the first portion of the first wire is substantially the same as the extending direction of the first portion of the second wire. The wire structure of claim 8, wherein one of the second portions of the first wire extends in substantially the same direction as one of the second portions of the second wire. The wire structure of claim 4, wherein the first portion of the first wire and the vertical projection of the second portion on a projection surface have a first spacing therebetween, the first portion of the second wire And a vertical projection of the second portion on the projection surface has a second pitch, wherein the first pitch is not greater than a width of the second pitch and a width of the first portion of the second wire. The wire structure of claim 1, wherein the second wire comprises a long straight wire, and the long straight wire at least partially overlaps the buffer portion of the first wire. The wire structure of claim 11, wherein the first portion of the first wire is substantially connected to a vertical projection of the second portion on a projection surface. The wire structure of claim 11, further comprising: an intermediate layer disposed between the first wire and the second wire, wherein the intermediate layer separates the first wire from the second wire. The wire structure of claim 1, wherein the extending direction of the first portion of the first wire is different from the extending direction of one of the second portions of the first wire. An active device array substrate comprises: a substrate having a display area and a non-display area; a plurality of transmission lines disposed on the display area of the substrate; a driver disposed in the non-display area of the substrate; and a plurality of The wire structure described in claim 1 is respectively connected between the transmission lines and the driver. The active device array substrate according to claim 15, wherein the buffer portion of the first wire in each of the wire structures is The second wire constitutes an overlapping portion, wherein at least two of the overlapping portions have different areas. The active device array substrate of claim 16, wherein a length of the first one of the plurality of wire structures is greater than a length of a second one of the wire structures, and the first one of the wire structures overlaps The area of the portion is smaller than the area of the overlapping portion of the second one of the wire structures. The active device array substrate of claim 15, wherein at least a portion of the second wires of the wire structures have a first portion, a second portion, and a buffer portion, wherein the buffer portion of the second wire is electrically connected Between the first portion and the second portion of the second wire, wherein an extending direction of the first portion of the second wire is different from an extending direction of the buffer portion of the second wire, at least a portion thereof The buffer portions of the second wires of the wire structures are different in size. The active device array substrate according to claim 15, wherein the buffer portion of the first wire of each of the wire structures has the same size. The active device array substrate of claim 15, wherein the second portion of the first wire is connected to the driver, the first portion of the first wire is connected to one of the transmission lines, wherein the first wire The length of a portion is substantially equal to the length of the second portion of the first wire. The active device array substrate of claim 15, wherein the first wire of each of the wire structures comprises a first connecting portion, wherein the first connecting portion of the first wire connects one of the plurality of transmission lines And the first portion of the first wire, the second wire of each of the wire structures includes a first connecting portion and a first portion, wherein the first connecting portion of the second wire connects the transmission lines a second one of the first portion of the second wire, wherein the first connection portion of the first wire does not overlap the first connection portion of the second wire.