TWI585790B - Laminated coil parts - Google Patents

Description

Laminated coil parts

The present invention relates to a laminated coil component.

There is a laminated coil component as described in Patent Document 1, which is provided with a green body formed by laminating an insulator layer and having a pair of end faces facing each other as an outer surface. a method of forming four sides extending in a direction opposite to a pair of end faces; and a coil comprising a plurality of inner conductors disposed in the body and having an axis orthogonal to a direction opposite to a pair of end faces; and a pair of outer portions The electrodes are respectively disposed at ends of one of the pair of end faces on the end face side and are connected to the corresponding ends of the coils. Each of the external electrodes includes an electrode portion on the end face and four electrode portions on the four sides.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2005-166745

In the laminated coil component described in the above Patent Document 1, there is a possibility that the magnetic flux of the coil is prevented from passing due to the electrode portions located on the four side faces. If the magnetic flux of the coil is impeded, energy loss such as overcurrent loss occurs and the Q factor (quality factor) of the coil is lowered. Therefore, if the electrode portions are reduced so that the electrode portions do not interfere with the magnetic flux of the coils in order to adjust the Q characteristics of the coils, the area of the electrodes connected by the solder when the laminated coil components are mounted on the electronic device is reduced. Installation strength There is no way to ensure the possibility of reduced installation.

Therefore, it is required to ensure the mountability while adjusting the Q characteristics of the coil. However, in the laminated coil component described in the above Patent Document 1, each of the external electrodes is coated with a conductive paste by the both ends of the wafer obtained by firing the laminated insulator layer, and the conductive paste is sintered. Since the coating amount of the conductor paste from the both end portions of the wafer to the side surfaces is the same for either side, it is not possible to appropriately adjust the amount of wrapping or the like for each side surface. Therefore, adjustment of the electrode area or the like of each electrode portion located on the four side faces for each side surface cannot be performed, and adjustment of the Q characteristics of the coil is difficult.

Accordingly, it is an object of the present invention to provide a laminated coil component which can easily adjust the Q characteristics of a coil while ensuring mountability.

The laminated coil component of the present invention includes: a blank body formed by laminating a plurality of insulator layers and having a rectangular parallelepiped shape, having opposite mounting faces and opposite faces, opposite first and second end faces facing each other, a first side surface and a second side opposite to each other; the coil comprising a plurality of inner conductors disposed in the body and having an axis of opposite directions of the first side surface and the second side surface; the first end surface electrode, The first end surface is connected to one end of the coil; the second end surface electrode is disposed on the second end surface and connected to the other end of the coil; and the first side electrode, the second side electrode, the third side electrode, and the fourth a side electrode formed by simultaneous firing with the blank; the first side electrode is located at a first corner formed by the first side surface, the first end surface, and the mounting surface and exposed on the first side surface, the first end surface, and the mounting a second side electrode is located at a second corner formed by the first side surface, the second end surface, and the mounting surface and is exposed on the first side surface, the second end surface, and the mounting surface, and the third side electrode is located on the second side a third corner formed by the first end surface and the mounting surface and exposed on the second side surface, the first end surface and the mounting surface, wherein the fourth side electrode is located at the fourth corner formed by the second side surface, the second end surface and the mounting surface And exposing to the second side surface, the second end surface, and the mounting surface, wherein the first side electrode and the third side electrode are exposed on each of the first end surface and The first end surface electrode is connected, and each of the second side electrode and the fourth side electrode exposed to the second end surface is connected to the second end surface electrode.

The laminated coil component of the present invention is exposed to the mounting surfaces of the first side electrode, the second side electrode, the third side electrode, and the fourth side electrode when mounted on an electronic device (for example, a circuit board or an electronic component) Part of the solder is connected to the electronic device. The first to fourth side electrodes are formed by being simultaneously fired with the green body by being separated from the first and second end surface electrodes, so that the conductor pattern for the first to fourth side electrodes before firing is formed. Further, the area of each electrode of the first to fourth side electrodes after firing which is exposed to the first or second side surface can be appropriately changed. Therefore, for example, by forming the conductor patterns for the first to fourth side electrodes in such a manner as to have the minimum mounting strength and not obstructing the magnetic flux of the coil, the mounting strength can be ensured and the Q characteristics of the coil can be easily adjusted. Further, the first to fourth side electrodes are respectively located at the first to fourth corner portions, and have a positional relationship that is symmetrical from a direction orthogonal to the mounting surface. When soldering the laminated coil component to the electronic device, the solder is wet-diffused with respect to the portions of the first to fourth side electrodes exposed on the mounting surface and the mounting surface is stressed from the solder, and the force from the solder is caused by the first The position of the symmetry of the fourth side electrode is symmetrical with respect to the mounting surface. Thereby, the surface tension from the solder acts symmetrically, and the laminated coil component is surely mounted at a specific position, and the so-called self-alignment property can be ensured. Further, since the force from the solder acts symmetrically with respect to the mounting surface, and the moment generated by the solder paste faces of the first to fourth side electrodes can be equalized, it is possible to suppress the imbalance of the torque due to the electronic component. The so-called tombstone phenomenon of erected joints. According to the above, the Q characteristics of the coil can be easily adjusted while ensuring the mountability.

In the laminated coil component of the present invention, the first side electrode, the second side electrode, the third side electrode, and the fourth side electrode may be disposed so as not to overlap the inner diameter region of the coil as viewed from the axial direction of the coil. In this case, since the first side electrode, the second side electrode, the third side electrode, and the fourth side electrode are less likely to impede the flow of the magnetic flux of the coil, Therefore, the decrease in the Q characteristics of the coil can be suppressed.

In the laminated coil component of the present invention, further comprising: at least one first auxiliary electrode positioned between the first side electrode and the third side electrode in the body and exposed on the first end surface and the mounting surface; and at least one The second auxiliary electrode is located between the second side electrode and the fourth side electrode in the body and is exposed on the second end surface and the mounting surface. In this case, the area of the electrode connected by the solder when the laminated coil component is mounted on the electronic device by the first auxiliary electrode and the second auxiliary electrode exposed on the mounting surface is increased, and the mounting strength can be improved. Further, a stray capacitance may be formed between the first auxiliary electrode and at least one of the first side electrode and the third side electrode, and the second auxiliary electrode is on the second side electrode and the fourth side A stray capacitance can be formed between at least one of the electrodes, so that the stray capacitance formed in the laminated coil component can be adjusted.

In the laminated coil component of the present invention, a first plating layer may be formed on the surfaces of the first end surface electrode, the first side surface electrode, the third side surface electrode, and the first auxiliary electrode, and the second end surface electrode, the second side surface electrode, The surface of the fourth side electrode and the second auxiliary electrode form a second plating layer. In this case, the first plating layer extends from the so-called plating to the surface of the blank between the first end surface electrode, the first side surface electrode, the third side surface electrode and the first auxiliary electrode, and the first end surface The electrode, the first side electrode, the third side electrode, and the first auxiliary electrode are integrated. Moreover, the second plating layer extends to the surface of the blank between the second end surface electrode, the second side surface electrode, the fourth side surface electrode and the second auxiliary electrode, and the second end surface electrode, the second side surface electrode, and the fourth surface The side electrode and the second auxiliary electrode are integrated. Thereby, the electrode area for solder connection with the electronic device at the time of mounting can be substantially increased, and the mounting strength can be improved.

In the laminated coil component of the present invention, the first auxiliary electrode and the second auxiliary electrode may be located in a region of the body that does not include a region where the coil is formed. In this case, since the first auxiliary electrode and the second auxiliary electrode are less likely to impede the flow of the magnetic flux of the coil, it is possible to more reliably ensure the mountability and suppress the decrease in the Q characteristic of the coil.

In the laminated coil component of the present invention, the first auxiliary electrode and the second auxiliary electrode have less than the first side electrode, the second side electrode, the third side electrode, and the fourth side viewed from opposite directions of the first side surface and the second side surface The area of the side electrode. In this case, since the areas of the first auxiliary electrode and the second auxiliary electrode located on the center side of the body are smaller than the first to fourth side electrodes, contact with the inner conductors constituting the coils in the body can be prevented and can be prevented. A short circuit caused by the contact.

In the laminated coil component of the present invention, the first side electrode, the second side electrode, the third side electrode, and the fourth side electrode have a substantially L-shaped shape as viewed in the opposing direction of the first side surface and the second side surface. In this case, the first side electrode and the third side electrode are easily connected to the first end surface electrode because they can form a shape extending along the first end surface, and the second side electrode and the fourth side electrode can be set to be along the second The shape in which the end faces extend is easily connected to the second end face electrode. Thereby, the connection strength between the first side surface electrode and the third side surface electrode and the first end surface electrode, and the connection strength between the second side surface electrode and the fourth side surface electrode and the second end surface electrode can be improved.

According to the present invention, it is possible to provide a laminated coil component which ensures the mountability and easily adjusts the Q characteristics of the coil.

1‧‧‧Laminated coil parts

1A‧‧‧Layered coil parts

1B‧‧‧Layered coil parts

1C‧‧‧ laminated coil parts

3‧‧‧ Body

3a‧‧‧ end face

3b‧‧‧ end face

3c‧‧‧ mounting surface

3d‧‧‧ opposite

3e‧‧‧ side

3f‧‧‧ side

4‧‧‧External electrode

5‧‧‧External electrode

6‧‧‧Side electrode

6a‧‧‧Electrode part

6b‧‧‧Electrode part

6c‧‧‧electrode section

7‧‧‧Side electrode

7A‧‧‧Side electrode

7a‧‧‧Electrode part

7b‧‧‧electrode section

7c‧‧‧electrode section

8‧‧‧Side electrode

8A‧‧‧Side electrode

8a‧‧‧Electrode part

8b‧‧‧Electrode part

8c‧‧‧electrode section

9‧‧‧Side electrodes

9A‧‧‧Side electrode

9a‧‧‧Electrode part

9b‧‧‧Electrode part

9c‧‧‧electrode section

10‧‧‧ coil

10a‧‧‧Coil conductor

10b‧‧‧ coil conductor

10c‧‧‧ coil conductor

10d‧‧‧ coil conductor

11‧‧‧Insulator layer

11a‧‧‧

11b‧‧‧ side

11c‧‧‧

11d‧‧‧ side

11e‧‧‧ face

11f‧‧‧ face

11g‧‧‧ outermost layer

11h‧‧‧ outermost layer

12a‧‧‧Through conductor

12b‧‧‧through hole conductor

12c‧‧‧through hole conductor

13‧‧‧ lead conductor

14‧‧‧ lead conductor

16‧‧‧ plating

17‧‧‧ plating

21~24, 31~42‧‧‧ auxiliary electrode

61‧‧‧Electrode part

62‧‧‧Electrode part

71‧‧‧Electrode part

72‧‧‧Electrode part

81‧‧‧Electrode part

82‧‧‧Electrode part

A‧‧‧Inner diameter area

E1‧‧‧ end

E2‧‧‧The other end

R1‧‧‧ corner (first corner)

R2‧‧‧ corner (second corner)

R3‧‧‧ corner (third corner)

R4‧‧‧ corner (fourth corner)

Fig. 1 is a perspective view showing a laminated coil component according to a first embodiment of the present invention.

Figure 2 is a cross-sectional view taken along line II-II of Figure 1.

Figure 3 is a cross-sectional view of the blank taken along line III-III of Figure 1.

Fig. 4 is an exploded perspective view of the green body included in the laminated coil component shown in Fig. 1.

Fig. 5 is a cross-sectional view showing a green body of a laminated coil component according to a second embodiment, and corresponds to Fig. 3 .

Fig. 6 is an exploded perspective view of the green body of the laminated coil component of the second embodiment, and corresponds to Fig. 4 .

Fig. 7 is a cross-sectional view showing a laminated coil component of a third embodiment and corresponds to Fig. 2;

Fig. 8 is a cross-sectional view showing a green body of a laminated coil component according to a third embodiment, and corresponds to Fig. 3 .

Fig. 9 is an exploded perspective view of the green body of the laminated coil component of the third embodiment, and corresponds to Fig. 4 .

Fig. 10 is a perspective view showing a laminated coil component of a fourth embodiment.

Figure 11 is a cross-sectional view of the blank taken along line XI-XI of Figure 10.

Fig. 12 is an exploded perspective view of the green body of the laminated coil component shown in Fig. 10.

Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. In the description, the same reference numerals are given to the same elements or elements having the same functions, and the overlapping description will be omitted.

(First embodiment)

The configuration of the laminated coil component of the first embodiment will be described with reference to Figs. 1 to 4 . Fig. 1 is a perspective view showing a laminated coil component according to a first embodiment of the present invention. Figure 2 is a cross-sectional view taken along line II-II of Figure 1. Figure 3 is a cross-sectional view of the blank taken along line III-III of Figure 1. Fig. 4 is an exploded perspective view of the green body included in the laminated coil component shown in Fig. 1. Further, in the cross-sectional view of the green body shown in Fig. 3, the illustration of the external electrodes disposed at both end portions of the green body is omitted.

The laminated coil component 1 shown in FIGS. 1 to 4 includes a green body 3, and a coil 10 disposed between the blank body 3 and the one end portion of the pair of external electrodes 4 and 5 and disposed inside the blank body 3, and The green body 3 is simultaneously fired to form the side electrodes 6, 7, 8, and 9 of the green body 3.

The blank 3 has a rectangular parallelepiped shape. The blank 3 has a mounting surface 3c and a facing surface 3d which face each other as an outer surface thereof, a pair of end faces 3a and 3b opposed to each other, and a pair of opposite side faces 3e and 3f. The mounting surface 3c is for mounting the laminated coil component 1 to other electronic components not shown. When it is prepared (for example, a circuit board or an electronic part), it faces the other electronic equipment. The end faces 3a and 3b face each other in a direction orthogonal to the direction in which the mounting surface 3c and the opposing surface 3d oppose each other. The side faces 3e and 3f oppose each other in a direction orthogonal to the direction in which the mounting surface 3c and the opposing surface 3d oppose each other and the direction in which the end faces 3a and 3b oppose each other. The rectangular parallelepiped shape includes a shape of a rectangular parallelepiped in which a corner portion and a ridge portion are chamfered, and a rectangular parallelepiped shape in which a corner portion and a ridge portion are rounded.

The green body 3 is formed by laminating a plurality of insulator layers 11 (see Fig. 4). Each of the insulator layers 11 is laminated in the opposing direction of the side faces 3e, 3f of the blank 3. That is, the direction of lamination of each of the insulator layers 11 coincides with the direction in which the side faces 3e and 3f of the green body 3 oppose each other. The opposite direction of the side faces 3e and 3f will also be referred to as the "stacking direction". Each of the insulator layers 11 has a substantially rectangular shape and has sides 11a, 11b, 11c, and 11d which are divided into an end surface 3a, an end surface 3b, a mounting surface 3c, and a facing surface 3d of the blank 3.

The outermost insulator layer 11 (hereinafter also referred to as "outermost layer 11g") which is disposed on one side in the laminating direction of each of the insulator layers 11 has a surface 11e which is divided into the side faces 3e of the green body 3. The outermost insulator layer 11 (hereinafter also referred to as "the other outermost layer 11h") which is disposed on the other side in the stacking direction of each of the insulator layers 11 has a surface 11f which is divided into the side faces 3f of the green body 3. Each of the insulator layers 11 is, for example, an insulator having electrical insulation, and is composed of a sintered body of an insulator blank. In the actual green body 3, each of the insulator layers 11 is integrated so that the boundary between the layers cannot be visually recognized.

The insulator layer 11 includes, for example, glass formed of barium, calcium, alumina, and cerium oxide, and glass-based ceramics formed of alumina. The insulating layer 11 may also contain ferrite (Ni-Cu-Zn ferrite, Ni-Cu-Zn-Mg ferrite, Cu-Zn ferrite, or Ni-Cu ferrite) A portion of the insulator layer 11 may also contain non-magnetic ferrite.

The external electrode 4 (first end surface electrode) is disposed on one end surface 3a, and the external electrode 5 (second end surface electrode) is disposed on the other end surface 3b (see FIG. 1). That is, each of the external electrodes 4, 5 is spaced apart from each other and positioned in the opposing direction of the pair of end faces 3a, 3b. Each of the external electrodes 4, 5 has a substantially rectangular shape in plan view, and its corner is rounded. Each of the external electrodes 4, 5 includes a conductive material such as Ag or Pd material. Each of the external electrodes 4 and 5 is formed by adhering a conductive paste containing Ag or Pd as a main component to the end faces 3a and 3b of the green body 3 after firing by a dip method or the like, followed by firing. . Electroplating is performed on each of the external electrodes 4, 5 to form a plating layer 16 (first plating layer) on the surface of the external electrode 4, and a plating layer 17 (second plating layer) is formed on the surface of the external electrode 5. Ni, Sn, etc. are used for electroplating. Further, the illustration of the plating layers 16, 17 is omitted in FIG.

Each of the external electrodes 4, 5 covers the entire end faces 3a, 3b. Furthermore, by adjusting the immersion depth of the end faces 3a, 3b with respect to the conductive paste, the adhesion amount of the conductive paste to the end face 3a can be adjusted, and in the manufacturing step, the conductive paste is also somewhat wrapped with the green body. The case where the end face 3a of 3 is adjacent to the face. In other words, the external electrode 4 may cover the edge portion on the side of the end surface 3a of at least one of the side surface 3e, the side surface 3f, the mounting surface 3c, and the opposing surface 3d, in addition to the entire end surface 3a. The outer electrode 5 may cover an edge portion of the side surface 3b side of at least one of the side surface 3e, the side surface 3f, the mounting surface 3c, and the opposing surface 3d, in addition to the entire end surface 3b.

The coil 10 includes a plurality of coil conductors 10a, 10b, 10c, 10d (internal conductors) and lead conductors 13, 14 (internal conductors). The plurality of coil conductors 10a to 10d and the lead conductors 13 and 14 include a conductive material such as Ag or Pd. The plurality of coil conductors 10a to 10d and the lead conductors 13 and 14 are formed, for example, as a sintered body of a conductive paste containing a conductive material such as Ag or Pd. The conductor patterns that become the coil conductors 10a to 10d and the lead conductors 13 and 14 are formed by screen printing a conductive paste using a screen plate formed with an opening corresponding to the conductor pattern. In the present embodiment, the conductor pattern of the coil conductor 10d and the conductor pattern of the lead conductor 13 are continuously formed integrally, and the conductor pattern of the coil conductor 10a and the conductor pattern of the lead conductor 14 are continuously formed integrally.

The coil conductors 10a to 10d are provided in the green body 3 in the lamination direction of the insulator layer 11. The coil conductors 10a to 10d are arranged in order from one side of the outermost layer 11g to the coil conductor 10a, the coil conductor 10b, the coil conductor 10c, and the coil conductor 10d. The coil conductor 10a has a shape that extends in a substantially U shape. The coil conductors 10b, 10c, and 10d have a shape that extends in a substantially L shape.

The ends of the coil conductors 10a to 10d are connected to each other by the via-hole conductors 12a, 12b, and 12c (internal conductors). Thereby, the coil conductors 10a-10d are mutually electrically connected, and the coil 10 is formed in the blank 3. The via-hole conductors 12a, 12b, and 12c include a conductive material such as Ag or Pd, and are configured as a sintered body of a conductive paste containing a conductive material.

The coil 10 has an axis center in the opposing direction of the side faces 3e, 3f of the blank 3. That is, the axis of the coil 10 is substantially orthogonal to the side faces 3e, 3f of the blank 3, and is substantially parallel to the mounting surface 3c of the blank 3. The coil 10 is connected to the coil conductors 10a to 10d by the via-hole conductors 12a, 12b, and 12c so as to be wound into a cylindrical shape, and has an inner diameter region A surrounded by the coil conductors 10a to 10d as viewed from the lamination direction of the insulator layer 11. .

The lead conductor 13 corresponds to one end E1 of the coil 10. The lead conductor 13 is connected to the external electrode 4 by positioning between the coil conductor 10d and the side 11a on the insulator layer 11. That is, one end E1 of the coil 10 is exposed to the end surface 3a of the blank 3 and is connected to the external electrode 4.

The lead conductor 14 corresponds to the other end E2 of the coil 10. The lead conductor 14 is connected to the external electrode 5 by positioning between the coil conductor 10a and the side 11b on the insulator layer 11. That is, the other end E2 of the coil 10 is exposed to the end surface 3b of the blank 3 and is connected to the external electrode 5.

Each of the side electrodes 6, 7 is formed on the outermost layer 11g of each of the insulator layers 11. The side electrodes 8, 9 are formed on the outermost layer 11h of each of the insulator layers 11. Each of the side surface electrodes 6 and 7 and each of the side surface electrodes 8 and 9 are opposed to each other with the coil 10 interposed therebetween in the laminating direction of the insulator layer 11.

Each of the side surface electrodes 6 to 9 has a substantially rectangular shape when viewed in the direction of lamination of the insulator layer 11. Each of the side surface electrodes 6 to 9 contains a conductive material such as Ag or Pd. Each of the side surface electrodes 6 to 9 is configured as, for example, a sintered body of a conductive paste containing a conductive material such as Ag or Pd. The conductor pattern of each of the side electrodes 6 to 9 is formed by screen printing a conductive paste using a screen plate formed with an opening corresponding to the conductor pattern. Each of the side surface electrodes 6 to 9 is formed by firing simultaneously with the green body 3.

The above-described plating is performed together with the external electrodes 4 and 5 on the respective side electrodes 6 to 9. Thereby, the plating layer 17 (see FIG. 2) formed on the surface of the external electrode 5 is also formed on the surface of the outer side surface electrodes 7, 9, (refer FIG. 3). That is, the plating layer 17 is integrally formed on the surface of the external electrode 5 and the surfaces of the side surface electrodes 7, 9. Further, the plating layer 16 (see FIG. 2) formed on the surface of the external electrode 4 is omitted from the drawing as shown in FIG. 3, but is also formed on the surface of each of the side surface electrodes 6, 8. That is, the plating layer 16 is integrally formed on the surface of the external electrode 4 and the surfaces of the respective side electrodes 6, 8.

The side electrode 6 (first side electrode) is located at a corner formed by the sides 11a and 11c among the four corner portions on the outermost layer 11g. That is, the side surface electrode 6 is located at the corner portion R1 (first corner portion) formed by the side surface 3e, the end surface 3a, and the mounting surface 3c. The side electrode 6 has a shape formed by a corner portion formed by the side 11a and the side 11c on the outermost layer 11g so as to extend on the side 11a and the side 11c. Thereby, the side surface electrode 6 has the electrode portion 6a exposed on the side surface 3e, the electrode portion 6b exposed to the end surface 3a, and the electrode portion 6c exposed on the mounting surface 3c. The electrode portion 6a is exposed on the side surface 3a side of the side surface 3e and exposed to the region on the side of the mounting surface 3c. The electrode portion 6b is exposed on the side of the side surface 3e on the end surface 3a and on the side of the mounting surface 3c. The electrode portion 6b is connected to the external electrode 4. That is, the side surface electrode 6 is electrically connected to the external electrode 4. The electrode portion 6c is exposed on the side of the end surface 3a on the mounting surface 3c and on the side of the side surface 3e. The electrode portion 6c is soldered to the other electronic component when the laminated coil component 1 is mounted on another electronic device.

The side surface electrode 7 (second side surface electrode) is located at a corner portion formed by the side 11b and the side 11c among the four corner portions on the outermost layer 11g. That is, the side surface electrode 7 is located at the corner portion R2 (second corner portion) formed by the side surface 3e, the end surface 3b, and the mounting surface 3c. The side surface electrode 7 has a shape formed by a corner portion formed by the side 11b and the side 11c on the outermost layer 11g so as to extend on the side 11b and the side 11c. Thereby, the side surface electrode 7 has the electrode portion 7a exposed on the side surface 3e, the electrode portion 7b exposed to the end surface 3b, and the electrode portion 7c exposed on the mounting surface 3c. The electrode portion 7a is exposed on the side of the end surface 3b on the side surface 3e and on the side of the mounting surface 3c. The electrode portion 7b is exposed on the side of the side surface 3e on the end surface 3b and on the side of the mounting surface 3c. Electrode portion 7b is connected to external electrode 5 Pick up. That is, the side surface electrode 7 is electrically connected to the external electrode 5. The electrode portion 7c is exposed on the side of the end surface 3b on the mounting surface 3c and on the side of the side surface 3e. The electrode portion 7c is soldered to the other electronic device when the laminated coil component 1 is mounted on another electronic device.

The side surface electrode 8 (third side surface electrode) is located at a corner portion formed by the side 11a and the side 11c among the four corner portions on the outermost layer 11h. That is, the side surface electrode 8 is located at the corner portion R3 (third corner portion) formed by the side surface 3f, the end surface 3a, and the mounting surface 3c. The side surface electrode 8 has a shape formed by a corner portion formed by the side 11a and the side 11c on the outermost layer 11h so as to extend on the side 11a and the side 11c. Thereby, the side surface electrode 8 has the electrode portion 8a exposed on the side surface 3f, the electrode portion 8b exposed to the end surface 3a, and the electrode portion 8c exposed on the mounting surface 3c. The electrode portion 8a is exposed on the side surface 3a of the side surface 3f and exposed on the side of the mounting surface 3c. The electrode portion 8b is exposed on the side of the side surface 3f on the end surface 3a and on the side of the mounting surface 3c. The electrode portion 8b is connected to the external electrode 4. That is, the side surface electrode 8 is electrically connected to the external electrode 4. The electrode portion 8c is exposed on the side of the end surface 3a on the mounting surface 3c and on the side of the side surface 3f. The electrode portion 8c is soldered to the other electronic device when the laminated coil component 1 is mounted on another electronic device.

The side surface electrode 9 (fourth side surface electrode) is located at a corner portion formed by the side 11b and the side 11c among the four corner portions on the outermost layer 11h. That is, the side surface electrode 9 is located at the corner portion R4 (fourth corner portion) formed by the side surface 3f, the end surface 3b, and the mounting surface 3c. The side surface electrode 9 has a shape formed by a corner portion formed by the side 11b and the side 11c on the outermost layer 11h so as to extend on the side 11b and the side 11c. Thereby, the side surface electrode 9 has the electrode portion 9a exposed on the side surface 3f, the electrode portion 9b exposed to the end surface 3b, and the electrode portion 9c exposed on the mounting surface 3c. The electrode portion 9a is exposed on the side of the end surface 3b on the side surface 3f and on the side of the mounting surface 3c. The electrode portion 9b is exposed on the side of the side surface 3f on the end surface 3b and on the side of the mounting surface 3c. The electrode portion 9b is connected to the external electrode 5. That is, the side surface electrode 9 is electrically connected to the external electrode 5. The electrode portion 9c is exposed on the side of the end surface 3b on the mounting surface 3c and on the side of the side surface 3f. The electrode portion 9c is soldered to the other electronic device when the laminated coil component 1 is mounted on another electronic device.

The side electrodes 6 to 9 are in the axial direction of the coil 10 (that is, the laminated layer of the insulator layer 11) It is arranged so as not to overlap the inner diameter area A of the coil 10. That is, the side electrodes 6 to 9 are disposed at least outside the inner diameter of the coil 10 as viewed from the axial direction of the coil 10. In the present embodiment, the side surface electrodes 6 to 9 are disposed on the respective coil conductors 10a, 10b, and 10c so as not to overlap the coil conductors 10a, 10b, 10c, and 10d constituting the coil 10 as viewed in the axial direction of the coil 10. 10d on the outside. In other words, the side electrodes 6 to 9 are disposed in the region of the blank 3 that does not include the coil forming region in which the coil 10 is formed. The coil forming region refers to a region in which the coil 10 occupies the inside of the blank 3 when viewed from the axial direction of the coil 10, for example, an area on the inner side of each outer edge of each of the coil conductors 10a, 10b, 10c, and 10d, or The area indicated by the cross-sectional area of the coil 10 or the like.

Each of the side surface electrodes 6 to 9 is located at each of the corner portions R1 to R4, and is located at each of the four corner portions of the mounting surface 3c as viewed in a direction orthogonal to the mounting surface 3c of the blank 3. Each of the side surface electrodes 6 to 9 is arranged in point symmetry from a direction orthogonal to the mounting surface 3c of the green body 3. Thus, the lateral electrodes 6 to 9 have a symmetrical positional relationship, and the solder is wet-diffused with respect to the electrode portions 6c, 7c, 8c, and 9c of the side electrodes 6 to 9 when the laminated coil component 1 is mounted, on the mounting surface 3c. The force from the solder acts symmetrically to the mounting surface 3c from the time the solder is stressed.

Therefore, the surface tension from the solder acts symmetrically, and the laminated coil component 1 is surely mounted at a specific position, and so-called self-alignment property can be ensured. The self-alignment means that the electronic component is subjected to its own position adjustment by the surface tension of the molten solder. Further, since the force from the solder acts symmetrically with respect to the mounting surface, and the moment generated by the solder paste surface of each of the side surface electrodes 6 to 9 can be equalized, the so-called tombstoning phenomenon can be suppressed. The phenomenon of the tombstoning phenomenon refers to a phenomenon in which the electronic component is erected due to the imbalance of the moment generated on the surface of the solder paste of each of the side electrodes 6 to 9.

As described above, in the laminated coil component 1 of the present embodiment, the electrode portions 6c, 7c, 8c, and 9c of the respective side surface electrodes 6 to 9 exposed on the mounting surface 3c are solder-connected to the electronic device when mounted on the electronic device. The side electrodes 6 to 9 are formed by being simultaneously fired with the green body 3 by being separated from the external electrodes 4 and 5, so that the conductors for the side electrodes 6 to 9 before firing are used. The pattern forming method can appropriately change the electrode areas of the electrode portions 6a, 7a, 8a, and 9a exposed to the side surface 3e or the side surface 3f of each of the side surface electrodes 6 to 9 after firing. Therefore, for example, by forming the conductor pattern for the side surface electrodes 6 to 9 with a minimum mounting strength and without obstructing the magnetic flux of the coil 10, the Q characteristics of the coil 10 can be easily adjusted while ensuring the mounting strength. Further, each of the side surface electrodes 6 to 9 is located at each of the corner portions R1 to R4, and is arranged in point symmetry as viewed from a direction orthogonal to the mounting surface 3c. When the laminated coil component 1 is solder-mounted to the electronic device, the solder is wetted and spread by the electrode portions 6c, 7c, 8c, and 9c exposed to the mounting surface 3c with respect to the respective side electrodes 6 to 9 and the mounting surface 3c is stressed by the solder, but The force from the solder acts symmetrically with respect to the mounting surface due to the positional symmetry of the side electrodes 6 to 9. Thereby, the surface tension from the solder acts symmetrically, and the laminated coil component 1 is surely mounted at a specific position, and the so-called self-alignment can be ensured. Further, since the force from the solder acts symmetrically with respect to the mounting surface 3c, and the moment generated by the solder paste surface of each of the side surface electrodes 6 to 9 can be equalized, it is possible to suppress the imbalance of the electronic component due to the moment. The erected phenomenon is a so-called tombstoning phenomenon of poor joint. According to the above, the Q characteristics of the coil 10 can be easily adjusted while ensuring the mountability.

Further, according to the present embodiment, each of the side surface electrodes 6 to 9 is disposed so as not to overlap the inner diameter region of the coil 10 as viewed from the direction of the axis of the coil 10. Thereby, since the side electrodes 6 to 9 do not easily hinder the flow of the magnetic flux of the coil 10, the decrease in the Q characteristics of the coil 10 can be suppressed.

(Second embodiment)

Next, the laminated coil component of the second embodiment will be described with reference to Figs. 5 and 6 . Fig. 5 is a cross-sectional view showing a green body of a laminated coil component according to a second embodiment, and corresponds to Fig. 3 . Fig. 6 is an exploded perspective view of the green body of the laminated coil component of the second embodiment, and corresponds to Fig. 4 . In addition, the perspective view of the laminated coil component of the present embodiment corresponds to the cross-sectional view of the laminated coil component of the present embodiment and the present embodiment, and corresponds to FIG. 2 and FIG. 2 and FIG. .

As shown in FIG. 5 and FIG. 6, the laminated coil component 1A of the second embodiment is different from the laminated coil component 1 in that the auxiliary electrode 21, 22, 23, and 24 are further provided in the blank 3. The auxiliary electrodes 21 to 24 are disposed between the side surface electrodes 6 and 7 and the side surface electrodes 8 and 9 in the lamination direction of the insulator layer 11.

The auxiliary electrodes 21 and 22 are formed on the insulator layer 11 (hereinafter also referred to as "insulator layer 11i") disposed between the outermost layer 11g and the insulator layer 11 on which the coil conductor 10a is formed in each of the insulator layers 11. That is, the auxiliary electrodes 21 and 22 are disposed between the side surface electrodes 6 and 7 and the coil 10. The auxiliary electrodes 23 and 24 are formed on the insulator layer 11 (hereinafter also referred to as "insulator layer 11j") disposed between the outermost layer 11h and the insulator layer 11 on which the coil conductor 10d is formed in each of the insulator layers 11. That is, the auxiliary electrodes 23 and 24 are disposed between the side surface electrodes 8 and 9 and the coil 10.

Each of the auxiliary electrodes 21 to 24 has a substantially rectangular shape as viewed in the lamination direction. Each of the auxiliary electrodes 21 to 24 has substantially the same area as each of the side surface electrodes 6 to 9 as viewed in the lamination direction. Each of the auxiliary electrodes 21 to 24 includes a conductive material such as Ag or Pd in the same manner as each of the side surface electrodes 6 to 9. Each of the auxiliary electrodes 21 to 24 is configured as a sintered body of a conductive paste containing a conductive material such as Ag or Pd. The conductor pattern of each of the auxiliary electrodes 21 to 24 is formed by screen printing a conductive paste using a screen plate formed with an opening corresponding to the conductor pattern. Each of the auxiliary electrodes 21 to 24 is formed by sintering simultaneously with the green body 3.

The above-described plating is performed on each of the auxiliary electrodes 21 to 24 together with the side electrodes 6 to 9 and the external electrodes 4 and 5. Thereby, the plating layer 17 (see FIG. 2) formed on the surface of the external electrode 5 is collectively formed on the surfaces of the side surface electrodes 7, 9 and the surfaces of the auxiliary electrodes 22, 24 (see FIG. 5). That is, the plating layer 17 is integrally formed on the surface of the external electrode 5, the surfaces of the side surface electrodes 7, 9 and the surfaces of the auxiliary electrodes 22, 24. The plating layer 17 extends not only to the electrodes but also to the surface of the blank 3 between the electrodes by the so-called plating extension, and between the side electrode 7 and the auxiliary electrode 22 of the mounting surface 3c and the mounting surface 3c The side electrode 9 and the auxiliary electrode 24 are also covered. Moreover, the plating layer 16 (refer to 2) formed on the surface of the external electrode 4 is Although the illustration is omitted in Fig. 5, the surface of each of the side surface electrodes 6, 8 and the surfaces of the auxiliary electrodes 21, 23 are also formed. The plating layer 16 extends not only to the electrodes but also to the surface of the blank 3 between the electrodes by the so-called plating extension, and between the side electrode 6 and the auxiliary electrode 21 of the mounting surface 3c and the mounting surface 3c The side electrode 8 and the auxiliary electrode 23 are also covered.

The auxiliary electrode 21 (first auxiliary electrode) is located at a corner portion formed by the side 11a and the side 11c among the four corner portions on the insulator layer 11i. That is, the auxiliary electrode 21 faces the side surface electrode 6 in the lamination direction. Thereby, a stray capacitance is formed between the auxiliary electrode 21 and the side surface electrode 6. The auxiliary electrode 21 has a shape extending from a corner portion formed by the side 11a and the side 11c so as to be located on the side 11a and the side 11c. Thereby, the auxiliary electrode 21 is exposed to the end surface 3a of the blank 3, is connected to the external electrode 4, and is exposed to the mounting surface 3c of the blank 3, and is soldered to the electronic device when the laminated coil component 1 is mounted on the electronic device. connection.

The auxiliary electrode 22 (second auxiliary electrode) is located at a corner portion formed by the side 11b and the side 11c among the four corner portions on the insulator layer 11i. That is, the auxiliary electrode 22 faces the side surface electrode 7 in the lamination direction. Thereby, a stray capacitance is formed between the auxiliary electrode 22 and the side surface electrode 7. The auxiliary electrode 22 has a shape extending from a corner portion formed by the side 11b and the side 11c so as to be located on the side 11b and the side 11c. Thereby, the auxiliary electrode 22 is exposed to the end surface 3b of the blank 3, is connected to the external electrode 5, and is exposed to the mounting surface 3c of the blank 3, and is soldered to the electronic device when the laminated coil component 1 is mounted on the electronic device. connection.

The auxiliary electrode 23 (first auxiliary electrode) is located at a corner portion formed by the side 11a and the side 11c among the four corner portions on the insulator layer 11j. That is, the auxiliary electrode 22 faces the side surface electrode 8 in the lamination direction. Thereby, a stray capacitance is formed between the auxiliary electrode 23 and the side surface electrode 8. The auxiliary electrode 23 has a shape in which the corner portion formed by the side 11a and the side 11c extends on the side 11a and the side 11c. Thereby, the auxiliary electrode 23 is exposed to the end surface 3a of the blank 3, is connected to the external electrode 4, and is exposed to the mounting surface 3c of the blank 3, and is soldered to the electronic device when the laminated coil component 1 is mounted on the electronic device. connection.

The auxiliary electrode 24 (second auxiliary electrode) is located at a corner portion formed by the side 11b and the side 11c among the four corner portions on the insulator layer 11j. That is, the auxiliary electrode 24 faces the side surface electrode 9 in the lamination direction. Thereby, a stray capacitance is formed between the auxiliary electrode 24 and the side surface electrode 9. The auxiliary electrode 24 has a shape extending from a corner portion formed by the side 11b and the side 11c so as to be located on the side 11b and the side 11c. Thereby, the auxiliary electrode 24 is exposed to the end surface 3b of the blank 3, is connected to the external electrode 5, and is exposed to the mounting surface 3c of the blank 3, and is soldered to the electronic device when the laminated coil component 1 is mounted on the electronic device. connection.

The auxiliary electrodes 21 to 24 are disposed so as not to overlap the inner diameter region A of the coil 10 as viewed from the axial direction of the coil 10. In other words, the auxiliary electrodes 21 to 24 are disposed at least outside the inner diameter of the coil 10 as viewed from the axial direction of the coil 10. In the present embodiment, the auxiliary electrodes 21 to 24 are disposed on the respective coil conductors 10a and 10b so as not to overlap the coil conductors 10a, 10b, 10c, and 10d constituting the coil 10 as viewed from the axial direction of the coil 10. 10c, 10d are on the outside. In other words, the auxiliary electrodes 21 to 24 are disposed in a region where the coil forming region in which the coil 10 is formed is not included in the blank 3.

Each of the auxiliary electrodes 21 to 24 is located at each of the four corners of the mounting surface 3c as viewed in a direction orthogonal to the mounting surface 3c of the blank 3. In other words, each of the auxiliary electrodes 21 to 24 is arranged in point symmetry as viewed from the direction perpendicular to the mounting surface 3c of the blank 3, similarly to the respective side surface electrodes 6 to 9. Thus, the auxiliary electrodes 21 to 24 have a symmetrical positional relationship, and when the laminated coil component 1A is mounted, the solder is wetted and diffused with respect to the portions of the auxiliary electrodes 21 to 24 exposed on the mounting surface 3c, and is mounted on the mounting surface 3c. In the case where the solder is stressed, the force from the solder acts symmetrically with respect to the mounting surface 3c. Therefore, when each of the auxiliary electrodes 21 to 24 is provided in addition to the side electrodes 6 to 9, the surface tension from the solder also acts symmetrically, and the laminated coil component 1A is surely mounted at a specific position, thereby ensuring The so-called self-alignment. Further, since the force from the solder acts symmetrically with respect to the mounting surface, and the moment generated by the solder paste surface of each of the auxiliary electrodes 21 to 24 can be equalized, the so-called tombstoning phenomenon can be suppressed.

As described above, in the laminated coil component 1A of the present embodiment, the side electrodes 6 to 9 formed by firing simultaneously with the green body 3 are used, and the Q characteristics of the coil 10 can be easily adjusted while ensuring the mountability. Further, similarly to the above-described embodiment, self-alignment can be ensured and the phenomenon of tombstoning can be suppressed. According to the above, the Q characteristics of the coil 10 can be easily adjusted while ensuring the mountability.

Further, according to the laminated coil component 1A of the present embodiment, when the laminated coil component 1A is attached to the electronic device by the auxiliary electrodes 21 to 24 exposed on the mounting surface 3c, the area of the electrode connected by the solder is increased, and the mounting strength can be improved. Further, the auxiliary electrode 21 can form a stray capacitance between the side surface electrodes 6 opposed to the laminating direction, and the auxiliary electrode 22 can form a stray capacitance between the side surface electrodes 7 opposed to the lamination direction, and the auxiliary electrode 23 can be A stray capacitance is formed between the side electrodes 8 opposed to the lamination direction, and the auxiliary electrode 24 can form a stray capacitance between the side electrodes 9 opposed to the lamination direction. Therefore, the stray capacitance formed in the laminated coil component 1A can be adjusted by the auxiliary electrodes 21 to 24.

According to the laminated coil component 1A, the plating layer 16 is extended by the so-called plating extension to the surface of the blank 3 between the external electrode 4, each of the side surface electrodes 6, 8 and each of the auxiliary electrodes 21, 23, and the external electrode 4, The side electrodes 6, 8 and the auxiliary electrodes 21, 23 are integrated. Further, the plating layer 17 extends to the surface of the blank 3 between the external electrode 5, each of the side surface electrodes 7, 9 and each of the auxiliary electrodes 22, 24, the external electrode 5, the side electrodes 7, 9 and the auxiliary electrodes 22 24 is integrated. Thereby, the electrode area which is solder-connected to the electronic device can be substantially increased at the time of mounting, and the mounting strength can be improved.

According to the laminated coil component 1A, the auxiliary electrodes 21 to 24 are disposed in the region of the blank 3 that does not include the coil forming region, and the auxiliary electrodes 21 to 24 are less likely to impede the flow of the magnetic flux of the coil 10, thereby ensuring the mountability and the mounting. Further, it is sure to achieve a reduction in the Q characteristic of the suppression coil 10.

(Third embodiment)

Next, the laminated coil component of the third embodiment will be described with reference to Figs. 7 to 9 . Fig. 7 is a cross-sectional view showing a laminated coil component of a third embodiment and corresponds to Fig. 2; Fig. 8 is a cross-sectional view showing a green body of a laminated coil component according to a third embodiment, and corresponds to Fig. 3 . Fig. 9 is an exploded perspective view of the green body of the laminated coil component of the third embodiment, and corresponds to Fig. 4 . In addition, the perspective view of the laminated coil component of this embodiment is the same as that of FIG. 1 corresponding to FIG. 1, and the illustration is abbreviate|omitted.

As shown in FIG. 7 to FIG. 9, the laminated coil component 1B of the third embodiment is different from the laminated coil component 1 in that the auxiliary electrodes 31 to 42 are further provided in the blank 3. The auxiliary electrodes 31 to 42 are disposed between the side surface electrodes 6 and 7 and the side surface electrodes 8 and 9 in the lamination direction of the insulator layer 11.

The auxiliary electrodes 31, 32 are formed on the respective insulator layers 11i. That is, the auxiliary electrodes 31 and 32 are disposed between the side electrodes 6 and 7 and the coil 10. The auxiliary electrodes 33 and 34 are formed on the insulator layer 11 (hereinafter also referred to as "insulator layer 11m") in which the coil conductor 10a is formed. The auxiliary electrodes 35 and 36 are formed on the insulator layer 11 (hereinafter also referred to as "insulator layer 11n") in which the coil conductor 10b is formed. The auxiliary electrodes 37 and 38 are formed on the insulator layer 11 (hereinafter also referred to as "insulator layer 11q") in which the coil conductor 10c is formed. The auxiliary electrodes 39 and 40 are formed on the insulator layer 11 (hereinafter also referred to as "insulator layer 11s") in which the coil conductor 10d is formed. The auxiliary electrodes 41, 42 are formed on the insulator layer 11j. That is, the auxiliary electrodes 41 and 42 are disposed between the side surface electrodes 8 and 9 and the coil 10.

Each of the auxiliary electrodes 31 to 42 has a substantially rectangular shape when viewed in the lamination direction. Each of the auxiliary electrodes 31 to 42 has an area smaller than that of each of the side surface electrodes 6 to 9 as viewed from the lamination direction. Similarly to each of the side surface electrodes 6 to 9, each of the auxiliary electrodes 31 to 42 is configured as a sintered body of a conductive paste containing a conductive material such as Ag or Pd. The conductor pattern which becomes each of the auxiliary electrodes 31 to 42 is formed by screen printing a conductive paste using a screen plate formed with an opening corresponding to the conductor pattern. Each of the auxiliary electrodes 31 to 42 is formed by sintering simultaneously with the green body 3.

For each of the auxiliary electrodes 31 to 42, together with the side electrodes 6 to 9 and the external electrodes 4 and 5 Apply the above plating. Thereby, the plating layer 17 (refer to FIG. 7) formed on the surface of the external electrode 5 is collectively formed on the surfaces of the side surface electrodes 7, 9 and the surfaces of the auxiliary electrodes 32, 34, 36, 38, 40, 42 (refer to the figure). 8). The plating layer 17 extends from the so-called plating and extends not only to the electrodes but also to the surface of the blank 3 between the electrodes, and the side electrodes 7, 9 and the auxiliary electrodes 32, 34 on the mounting surface 3c, Each of 36, 38, 40, and 42 is also covered. Further, since the plating layer 16 (see FIG. 7) formed on the surface of the external electrode 4 is the same as that of FIG. 8, the illustration is omitted, and is formed on the surfaces of the side surface electrodes 6, 8 and the auxiliary electrodes 31, 33, 35, 37, 39, 41 surface. The plating layer 16 is extended by so-called plating to extend not only to the electrodes but also to the surface of the blank 3 between the electrodes, and the side electrodes 6, 8 of the mounting surface 3c and the auxiliary electrodes 31, 33, 35 , 37, 39, 41 are also covered.

Each of the auxiliary electrodes 31, 33, 35, 37, 39, 41 (first auxiliary electrode) is formed by the side 11a and the side 11c among the four corner portions on the respective insulator layers 11i, 11m, 11n, 11q, 11s, and 11j. Corner. The auxiliary electrode 31 is adjacent to the side surface electrode 6 in the lamination direction. Thereby, a stray capacitance is formed between the auxiliary electrode 31 and the side surface electrode 6. The auxiliary electrode 41 is adjacent to the side surface electrode 8 in the lamination direction. Thereby, a stray capacitance is formed between the auxiliary electrode 41 and the side surface electrode 8. The auxiliary electrodes 31, 33, 35, 37, 39, 41 are arranged adjacent to each other in the lamination direction, and the adjacent electrodes face each other. Thereby, stray capacitances are formed between the electrodes facing each other.

Each of the auxiliary electrodes 31, 33, 35, 37, 39, 41 has a corner portion formed by the sides 11b and 11c on each of the insulator layers 11i, 11m, 11n, 11q, 11s, 11j to be located on the side 11a and on the side 11c The shape of the way is extended. Thereby, the auxiliary electrodes 31, 33, 35, 37, 39, 41 are exposed on the end surface 3a of the blank 3, are connected to the external electrode 4, and are exposed on the mounting surface 3c of the blank 3, and the laminated coil component 1 is mounted. The electronic device is connected to the electronic device by solder.

Each of the auxiliary electrodes 32, 34, 36, 38, 40, 42 (second auxiliary electrode) is located in each insulation Among the four corner portions of the bulk layers 11i, 11m, 11n, 11q, 11s, and 11j, corner portions formed by the side 11b and the side 11c. The auxiliary electrode 32 is adjacent to and opposed to the side surface electrode 7 in the lamination direction. Thereby, a stray capacitance is formed between the auxiliary electrode 32 and the side surface electrode 7. The auxiliary electrode 42 is adjacent to and opposed to the side surface electrode 9 in the lamination direction. Thereby, a stray capacitance is formed between the auxiliary electrode 42 and the side surface electrode 9. The auxiliary electrodes 32, 34, 36, 38, 40, 42 are arranged adjacent to each other in the lamination direction, and the adjacent electrodes face each other. Thereby, stray capacitances are formed between the electrodes facing each other.

Each of the auxiliary electrodes 32, 34, 36, 38, 40, 42 has a corner formed by the sides 11b and 11c on each of the insulator layers 11i, 11m, 11n, 11q, 11s, 11j to be located on the side 11b and on the side 11c. The way to extend the shape. Thereby, the auxiliary electrodes 32, 34, 36, 38, 40, 42 are exposed on the end surface 3a of the blank 3, are connected to the external electrode 4, and are exposed on the mounting surface 3c of the blank 3, so that the laminated coil component 1 is to be laminated. When soldered to an electronic device, it is soldered to the electronic device.

The auxiliary electrodes 31 to 42 are arranged so as not to overlap the inner diameter region A of the coil 10 as viewed from the axial direction of the coil 10. In other words, the auxiliary electrodes 31 to 42 are disposed at least outside the inner diameter of the coil 10 as viewed from the axial direction of the coil 10. In the present embodiment, the auxiliary electrodes 31 to 42 are disposed on the respective coil conductors 10a and 10b so as not to overlap the coil conductors 10a, 10b, 10c, and 10d constituting the coil 10 as viewed from the axial direction of the coil 10. 10c, 10d are on the outside. In other words, the auxiliary electrodes 31 to 42 are disposed in the region of the blank 3 that does not include the coil forming region in which the coil 10 is formed.

Each of the auxiliary electrodes 31 to 42 is located at each of the four corners of the mounting surface 3c as viewed in a direction orthogonal to the mounting surface 3c of the blank 3. In other words, each of the auxiliary electrodes 31 to 42 is arranged in point symmetry as viewed from the direction perpendicular to the mounting surface 3c of the green body 3, similarly to the respective side surface electrodes 6 to 9. When the laminated coil component 1B is mounted by the auxiliary electrodes 31 to 42 in a symmetrical positional relationship, the solder is wet-diffused with respect to the portions of the auxiliary electrodes 31 to 42 exposed on the mounting surface 3c, and the soldering surface is mounted on the mounting surface 3c. The force from the solder in the case of force is symmetric to the mounting surface 3c Play a role. Therefore, when the auxiliary electrodes 31 to 42 are provided in addition to the side electrodes 6 to 9, the surface tension from the solder also acts symmetrically, and thus the laminated coil component 1B is surely mounted at a specific position. Ensure the so-called self-alignment. Further, since the force from the solder acts symmetrically with respect to the mounting surface, and the moment generated by the solder paste surface of each of the auxiliary electrodes 21 to 24 can be equalized, the so-called tombstoning phenomenon can be suppressed.

As described above, in the laminated coil component 1B of the present embodiment, similarly to the above-described embodiment, the Q characteristics of the coil 10 can be easily adjusted while ensuring the mountability.

Further, according to the laminated coil component 1B of the present embodiment, the area of the electrode connected by the solder when the laminated coil component 1B is mounted on the electronic device by the auxiliary electrodes 31 to 42 exposed on the mounting surface 3c is increased, and the mounting strength can be improved. Further, each of the auxiliary electrodes 31, 33, 35, 37, 39, 41 can form a stray capacitance between the side surface electrode 6 and the side surface electrode 8, and each of the auxiliary electrodes 32, 34, 36, 38, 40, 42 can be on the side electrode. A stray capacitance is formed between the side surface electrode 9 and the side electrode 9. Therefore, the stray capacitance formed in the laminated coil component 1B can be adjusted by the respective auxiliary electrodes 31 to 42.

According to the laminated coil component 1B, the plating layer is extended by so-called plating to the green body 3 between the external electrode 4, each of the side surface electrodes 6, 8 and each of the auxiliary electrodes 31, 33, 35, 37, 39, 41. The surface is such that the external electrode 4, the side electrodes 6, 8 and the auxiliary electrodes 31, 33, 35, 37, 39, 41 are integrated. Further, the plating layer 17 extends to the surface of the blank 3 between the external electrode 5, each of the side surface electrodes 7, 9 and each of the auxiliary electrodes 32, 34, 36, 38, 40, 42 so that the external electrode 5 and each side The electrodes 7, 9 and the auxiliary electrodes 32, 34, 36, 38, 40, 42 are integrated. Thereby, the electrode area which is solder-connected to the electronic device can be substantially increased at the time of mounting, and the mounting strength can be improved.

According to the laminated coil component 1B, the auxiliary electrodes 31 to 42 are disposed in the region of the blank 3 that does not include the coil forming region, and the auxiliary electrodes 31 to 42 are less likely to impede the flow of the magnetic flux of the coil 10, thereby ensuring the mountability and the mounting. Further, it is sure to achieve a reduction in the Q characteristic of the suppression coil 10.

According to the laminated coil component 1B, the auxiliary electrodes 31 to 42 have an area smaller than the side electrodes 6 to 9 as viewed from the lamination direction, and the areas of the auxiliary electrodes 31 to 42 located on the center side in the blank 3 are smaller than the side electrodes 6 to 9, Therefore, contact with the coil conductors 10a, 10b, 10c, 10d constituting the coil 10 in the blank 3 can be prevented, and the short circuit caused by the contact can be prevented.

(Fourth embodiment)

Next, the laminated coil component of the fourth embodiment will be described with reference to Figs. 10 to 12 . Fig. 10 is a perspective view showing a laminated coil component of a fourth embodiment. Figure 11 is a cross-sectional view of the blank taken along line XI-XI of Figure 10. Further, in the cross-sectional view of the green body shown in Fig. 10, the illustration of the external electrodes disposed at both end portions of the green body is omitted. Fig. 12 is an exploded perspective view of the green body of the laminated coil component shown in Fig. 10. In addition, the cross-sectional view of the laminated coil component of this embodiment corresponds to FIG. 2, and is the same as that of FIG.

As shown in FIG. 10 to FIG. 12, the laminated coil component 1C of the fourth embodiment is different from the laminated coil component 1 in that side electrodes 6A, 7A, 8A, and 9A are provided instead of the side electrodes 6, 7, 8, and 9. Each of the side surface electrodes 6A to 9A is different from the side surface electrodes 6 to 9 in that the shape thereof has a shape that is substantially L-shaped as viewed from the direction in which the layers of the insulator layer 11 are opposed from the side faces 3e and 3f.

The side surface electrode 6A has a shape in which the outermost layer 11g extends in a substantially L shape along the side 11a and the side 11c. That is, the side surface electrode 6A has a shape which is curved from the direction along the side surface 3e toward the direction along the end surface 3a and along the corner portion R1. The side electrode 6A has an electrode portion 51 extending along the side surface 3e, and an electrode portion 52 extending along the end surface 3a. The side surface electrode 7A has a shape in which the outermost layer 11g extends in a substantially L shape along the side 11b and the side 11c. That is, the side surface electrode 7A has a shape that is curved from the direction along the side surface 3e toward the direction along the end surface 3b and along the corner portion R2. The side surface electrode 7A has an electrode portion 61 extending along the side surface 3e, and an electrode portion 62 extending along the end surface 3b.

The side electrode 8A has a substantially L shape on the outermost layer 11h along the side 11a and on the side 11c. Shape extended. That is, the side surface electrode 8A has a shape that is curved from the direction along the side surface 3f toward the end surface 3a and along the corner portion R3. The side surface electrode 8A has an electrode portion 71 extending along the side surface 3f and an electrode portion 72 extending along the end surface 3a. The side surface electrode 9A has a shape in which the outermost layer 11g extends in a substantially L shape along the side 11b and the side 11c. That is, the side surface electrode 9A has a shape that is curved from the direction along the side surface 3f toward the direction along the end surface 3b and along the corner portion R4. The side surface electrode 9A has an electrode portion 81 extending along the side surface 3f and an electrode portion 82 extending along the end surface 3b.

Similarly to the side surface electrodes 6 to 9 , the side electrodes 6A to 9A are disposed so as not to overlap the inner diameter region A of the coil 10 as viewed from the axial direction of the coil 10 . In other words, the side electrodes 6A to 9A are disposed at least outside the inner diameter of the coil 10 as viewed from the axial direction of the coil 10. In the present embodiment, the side surface electrodes 6A to 9A are disposed on the respective coil conductors 10a and 10b so as not to overlap the coil conductors 10a, 10b, 10c, and 10d constituting the coil 10 as viewed from the axial direction of the coil 10. 10c, 10d are on the outside. In other words, the side electrodes 6A to 9A are disposed in a region where the coil forming region in which the coil 10 is formed is not included in the blank 3.

Similarly to the side surface electrodes 6 to 9, the side surface electrodes 6A to 9A are respectively disposed at four corner portions of the mounting surface 3c as viewed in a direction orthogonal to the mounting surface 3c of the green body 3. Each of the side surface electrodes 6A to 9A is arranged in point symmetry as viewed in a direction orthogonal to the mounting surface 3c of the green body 3.

As described above, in the laminated coil component 1C of the present embodiment, as in the above-described embodiment, the Q characteristics of the coil 10 can be easily adjusted while ensuring the mountability.

Further, according to the laminated coil component 1C of the present embodiment, each of the side surface electrodes 6A and 8A can be easily connected to the external electrode 4 because it can extend along the end surface 3a, and each of the side surface electrodes 7A and 9A can be formed along the end surface. The shape of the extension 3b is easily connected to the external electrode 5. Thereby, the connection strength between each of the side surface electrodes 6A and 8A and the external electrode 4 and the connection strength between the side surface electrodes 7A and 9A and the external electrode 5 can be improved.

The various embodiments of the present invention have been described above, but the present invention is not limited to the above-described embodiments, and the subject matter described in the respective patent claims may not be changed. Deformation within the circumference or suitable for other aspects.

In the above embodiment, each of the side surface electrodes 6 to 9 of the laminated coil component 1, 1A, and 1B is not limited to a rectangular shape, and may have a substantially L shape. Further, in the above-described embodiment, the auxiliary electrodes 21 to 24 and 31 to 42 have a substantially rectangular shape when viewed from the lamination direction. However, the present invention is not limited thereto. For example, the auxiliary electrodes 21 to 24 and 31 to 42 may have a substantially L shape as viewed from the lamination direction. shape. Further, the auxiliary electrodes 21 to 24 and 31 to 42 may have an area larger than the side surface electrodes 6 to 9 as viewed from the lamination direction.

Further, the external electrodes 4 and 5 are not limited to the case where they are formed on the end faces 3a and 3b of the green body 3 after firing, and may be formed by firing simultaneously with the green body 3.

1‧‧‧Laminated coil parts

3‧‧‧ Body

3a‧‧‧ end face

3b‧‧‧ end face

3c‧‧‧ mounting surface

3d‧‧‧ opposite

3e‧‧‧ side

3f‧‧‧ side

4‧‧‧External electrode

5‧‧‧External electrode

6‧‧‧Side electrode

6a‧‧‧Electrode part

6b‧‧‧Electrode part

6c‧‧‧electrode section

7‧‧‧Side electrode

7a‧‧‧Electrode part

7b‧‧‧electrode section

7c‧‧‧electrode section

8‧‧‧Side electrode

8a‧‧‧Electrode part

8b‧‧‧Electrode part

8c‧‧‧electrode section

9‧‧‧Side electrodes

9a‧‧‧Electrode part

9b‧‧‧Electrode part

9c‧‧‧electrode section

R1‧‧‧ corner (first corner)

R2‧‧‧ corner (second corner)

R3‧‧‧ corner (third corner)

R4‧‧‧ corner (fourth corner)

Claims (10)

A laminated coil component comprising: a blank body formed by laminating a plurality of insulator layers and having a rectangular parallelepiped shape, having opposite mounting faces and opposite faces, facing opposite first and second end faces, And a first side and a second side opposite to each other; the coil includes a plurality of inner conductors disposed in the body, and has an axis of opposite directions of the first side surface and the second side surface; the first end surface An electrode disposed on the first end surface and connected to one end of the coil; a second end surface electrode disposed on the second end surface and connected to the other end of the coil; and a first side electrode, a second side electrode, and a second electrode The three side surface electrodes and the fourth side surface electrode are formed by simultaneous firing with the green body; the first side surface electrode is located at a first corner formed by the first side surface, the first end surface, and the mounting surface And exposing the first side surface, the first end surface, and the mounting surface, wherein the second side surface electrode is shaped by the first side surface, the second end surface, and the mounting surface The second corner portion is exposed on the first side surface, the second end surface, and the mounting surface, and the third side surface electrode is located at a third corner portion formed by the second side surface, the first end surface, and the mounting surface, and is exposed The fourth side surface electrode is located at a fourth corner formed by the second side surface, the second end surface, and the mounting surface on the second side surface, the first end surface, and the mounting surface, and is exposed on the second side surface, The second end surface and the mounting surface, Each of the first side surface electrode and the third side surface electrode exposed to the first end surface is connected to the first end surface electrode, and the second side surface electrode and the fourth side surface electrode are exposed to each of the second end surface portions Connected to the second end surface electrode. The laminated coil component of claim 1, wherein the first side electrode, the second side electrode, the third side electrode, and the fourth side electrode are not overlapped in the coil as viewed from an axial direction of the coil The configuration of the path area. The laminated coil component of claim 1 or 2, further comprising: at least one first auxiliary electrode positioned between the first side electrode and the third side electrode in the body and exposed to the first end face and And a mounting surface; and at least one second auxiliary electrode located between the second side surface electrode and the fourth side surface electrode in the body and exposed to the second end surface and the mounting surface. The laminated coil component of claim 3, wherein a first plating layer is formed on a surface of the first end surface electrode, the first side surface electrode, the third side surface electrode, and the first auxiliary electrode, and the second end surface electrode is A second plating layer is formed on the surfaces of the second side surface electrode, the fourth side surface electrode, and the second auxiliary electrode. The laminated coil component of claim 3, wherein the first auxiliary electrode and the second auxiliary electrode are located in the body and do not include a region in which the formation region of the coil is formed. The laminated coil component of claim 3, wherein the first auxiliary electrode and the second auxiliary electrode have an opposite direction from the first side surface and the second side surface, and are smaller than the first side surface electrode and the second side surface electrode Third side The area of the surface electrode and the fourth side electrode. The laminated coil component of claim 1 or 2, wherein the first side electrode, the second side electrode, the third side electrode, and the fourth side electrode have opposite directions from the first side surface and the second side surface Observed as a substantially L-shaped shape. The laminated coil component of claim 3, wherein a first plating layer is formed on a surface of the first end surface electrode, the first side surface electrode, the third side surface electrode, and the first auxiliary electrode, and the second end surface electrode is a second plating layer is formed on a surface of the second side surface electrode, the fourth side surface electrode, and the second auxiliary electrode, and the first auxiliary electrode and the second auxiliary electrode are located in the body and do not include a formation region in which the coil is formed The area. The laminated coil component of claim 3, wherein a first plating layer is formed on a surface of the first end surface electrode, the first side surface electrode, the third side surface electrode, and the first auxiliary electrode, and the second end surface electrode is a second plating layer is formed on a surface of the second side surface electrode, the fourth side surface electrode, and the second auxiliary electrode, and the first auxiliary electrode and the second auxiliary electrode have a direction from the first side surface and the second side surface The direction is smaller than the area of the first side surface electrode, the second side surface electrode, the third side surface electrode, and the fourth side surface electrode. The laminated coil component of claim 3, wherein the first auxiliary electrode and the second auxiliary electrode are located in the body and do not include a region in which the formation region of the coil is formed, and the first auxiliary electrode and the second auxiliary electrode are Having an opposite direction from the first side surface and the second side surface, smaller than the first side surface electrode and the upper side The areas of the second side electrode, the third side electrode, and the fourth side electrode are described.