TWI582428B - Pre-scan based track correction focusing leveling device and method - Google Patents
Pre-scan based track correction focusing leveling device and method Download PDFInfo
- Publication number
- TWI582428B TWI582428B TW104132693A TW104132693A TWI582428B TW I582428 B TWI582428 B TW I582428B TW 104132693 A TW104132693 A TW 104132693A TW 104132693 A TW104132693 A TW 104132693A TW I582428 B TWI582428 B TW I582428B
- Authority
- TW
- Taiwan
- Prior art keywords
- sensor array
- sampling
- horizontal direction
- value
- sensor
- Prior art date
Links
Landscapes
- Length Measuring Devices By Optical Means (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
Description
本發明有關於光蝕刻領域,特別有關於一種用於光蝕刻機中的基於預掃描的軌跡校正調焦調平裝置和方法。 The present invention relates to the field of photoetching, and more particularly to a pre-scan based trajectory correction focusing leveling apparatus and method for use in a photoetching machine.
在投影光蝕刻裝置中,通常使用矽片調焦調平探測裝置來實現對矽片的表面特定區域進行高度和傾斜度的測量。該測量裝置要求的精度較高,且操作時不能損傷矽片。所以,矽片的調焦調平測量必須是非接觸式測量,常用的非接觸式調焦調平測量方法有三種:光學測量法、電容測量法、氣壓測量法。 In a projection photolithography apparatus, a cymbal focusing leveling detection device is typically used to achieve measurement of the height and slope of a particular area of the surface of the cymbal. The measuring device requires high precision and does not damage the cymbal during operation. Therefore, the focus measurement of the cymbal must be non-contact measurement. There are three commonly used non-contact focus measurement methods: optical measurement, capacitance measurement, and barometric measurement.
美國專利US 4650983中記載一種調焦調平檢測裝置和方法,其中採用掃描反射鏡來調製包含被測物體(比如:半導體襯底或矽片)的表面相對光蝕刻機投影光學系統的聚焦平面的離焦高度資訊的光信號,並使經過掃描反射鏡調製的光信號藉由光敏探測器轉變成包含離焦高度資訊的類比電信號,最後再藉由相敏解調(PSD)電路從類比電信號中解調出實際的離焦高度資料。該三角測量方法中,入射到被測物上的光斑是有一定大小的,且與調焦調平檢測裝置的量程有關。 A focus leveling detecting apparatus and method are described in US Pat. No. 4,650,983, in which a scanning mirror is used to modulate a surface containing a measured object (such as a semiconductor substrate or a cymbal) with respect to a focal plane of a photoetching machine projection optical system. The optical signal of the defocus height information, and the optical signal modulated by the scanning mirror is converted into an analog electrical signal containing the information of the defocus height by the photosensitive detector, and finally from the analogy by the phase sensitive demodulation (PSD) circuit. The actual defocus height data is demodulated in the signal. In the triangulation method, the spot incident on the object to be tested is of a certain size and is related to the range of the focus leveling detecting device.
傳統的干涉儀也是一種非接觸式的用來測量微小的空間距離的設備。傳統干涉儀一般採用相干長度很長的單色(或窄帶)光源,藉由檢測干涉條紋的位置、形狀和距離等參數的變化來 精確測定空間距離。該測量方法中,入射到被測物上的光斑可認為是一個點。 Traditional interferometers are also a non-contact device for measuring small spatial distances. Conventional interferometers generally use a single-color (or narrow-band) light source with a long coherence length, by detecting changes in the position, shape, and distance of the interference fringes. Accurately measure spatial distance. In this measurement method, the spot incident on the object to be measured can be regarded as a point.
實際如矽片或玻璃基板的被測物,表面會存在週期性的溝槽,而該溝槽並不是我們要測量的位置。溝槽出現的週期一般為毫米量級(如3mm),溝槽本身的大小為數百微米量級(可為100μm)。這就使得在光斑很小時,測量點可能會落在工藝溝槽內,使得測量產生誤差。本發明提出一種基於預掃描的軌跡可校正的調焦調平裝置,在每批被測物測量前藉由預掃描,進而調整測量軌跡,避免測量到溝槽位置。 In the case of an object such as a cymbal or a glass substrate, there may be periodic grooves on the surface, and the groove is not the position we want to measure. The period in which the grooves appear is generally on the order of millimeters (e.g., 3 mm), and the size of the grooves themselves is on the order of hundreds of microns (which may be 100 μm). This makes it possible for the measuring point to fall within the process trench when the spot is small, causing errors in the measurement. The invention provides a trajectory calibratable focusing and leveling device based on pre-scanning, which pre-scans each batch of objects to be measured, thereby adjusting the measurement trajectory to avoid measuring the position of the groove.
針對以上問題,本發明提出一種基於預掃描的軌跡校正調焦調平裝置,包括一感測器陣列和一運動台,該運動台用於承載一被測物在水平方向上運動,該被測物具有沿第一水平方向延伸的圖形,該感測器陣列大致沿與第一水平方向垂直的第二水平方向排列,用於對該被測物的表面的多個採樣點進行採樣,以獲得採樣結果,該調焦調平裝置還包括一控制器,用於根據該採樣結果對該被測物的表面進行擬合以獲得一擬合面,並根據該採樣結果和該擬合面之間的偏差值△H控制該感測器陣列的整體在第二水平方向上進行位置微調。 In view of the above problems, the present invention provides a pre-scan based trajectory correction focusing and leveling device, comprising a sensor array and a motion stage for carrying a measured object in a horizontal direction, the measured The object has a pattern extending in a first horizontal direction, the sensor array being arranged substantially in a second horizontal direction perpendicular to the first horizontal direction for sampling a plurality of sampling points of the surface of the object to be measured to obtain The sampling result, the focus leveling device further includes a controller, configured to fit the surface of the object according to the sampling result to obtain a fitting surface, and according to the sampling result and the fitting surface The deviation value ΔH controls the overall fine adjustment of the position of the sensor array in the second horizontal direction.
針對以上問題,本發明提出一種基於預掃描的軌跡校正調焦調平裝置,包括一感測器陣列和一運動台,該運動台用於承載一被測物在水平方向上運動,該被測物具有沿第一水平方向延伸的圖形,該感測器陣列大致沿與第一水平方向垂直的第二水平方向排列,用於對該被測物的表面的多個採樣點進行採樣,以獲得採樣 結果,該調焦調平裝置還包括一控制器,用於根據該採樣結果對該被測物的表面進行擬合以獲得一擬合面,並根據該採樣結果和該擬合面之間的偏差值△H控制該感測器陣列中該偏差值△H超出臨界值的感測器在第二水平方向上進行位置微調。 In view of the above problems, the present invention provides a pre-scan based trajectory correction focusing and leveling device, comprising a sensor array and a motion stage for carrying a measured object in a horizontal direction, the measured The object has a pattern extending in a first horizontal direction, the sensor array being arranged substantially in a second horizontal direction perpendicular to the first horizontal direction for sampling a plurality of sampling points of the surface of the object to be measured to obtain sampling As a result, the focus leveling device further includes a controller for fitting the surface of the object to be obtained according to the sampling result to obtain a fitting surface, and according to the sampling result and the fitting surface The deviation value ΔH controls the sensor in the sensor array that the deviation value ΔH exceeds the critical value to perform position fine adjustment in the second horizontal direction.
其中,該感測器陣列中的每一個感測器都可以在第二水平方向上進行位置微調。 Wherein, each of the sensors in the sensor array can be finely adjusted in the second horizontal direction.
其中,該感測器陣列中相鄰感測器之間的距離小於該被測物的表面上相鄰圖形之間的距離。 Wherein, the distance between adjacent sensors in the sensor array is smaller than the distance between adjacent patterns on the surface of the object to be tested.
本發明還提出一種利用上述裝置進行預掃描以及軌跡校正的方法,包括:步驟一:確定感測器陣列的初始測量位置;步驟二:該感測器陣列在該初始測量位置對被測物的表面進行測量,獲得該感測器陣列中各感測器的測量點高度值,並對該測量點高度值進行擬合以獲得一擬合面;步驟三:計算各該測量點高度值與該擬合面的偏差值△H;步驟四:將相應各該測量點高度值的偏差值△H與一高度臨界值H0進行比較,若所有的偏差值△H均小於該高度臨界值H0,則進入步驟八,否則進入步驟五;步驟五:判斷該感測器陣列的位置微調次數是否小於預設最大微調次數,若是則進入步驟六,否則進入步驟七;步驟六:控制該感測器陣列的整體在第二水平方向上進行位置微調並重複步驟二至步驟四;步驟七:選取多次位置微調後測得的偏差值△H的最大值中為最小的一次所對應的感測器陣列的位置作為採樣位置,並結束;以 及步驟八:確定目前的感測器陣列的位置為採樣位置,並結束。 The invention also provides a method for performing pre-scanning and trajectory correction by using the above device, comprising: step 1: determining an initial measurement position of the sensor array; and step 2: the sensor array is at the initial measurement position on the object to be tested The surface is measured, the measurement point height value of each sensor in the sensor array is obtained, and the measurement point height value is fitted to obtain a fitting surface; Step 3: calculating the height value of each measurement point and the The deviation value of the fitting surface is ΔH; Step 4: comparing the deviation value ΔH of each corresponding measuring point height value with a height threshold H 0 , if all the deviation values ΔH are smaller than the height threshold H 0 Then, go to step eight, otherwise go to step 5; step 5: determine whether the position of the sensor array is finely adjusted is less than the preset maximum fine tuning times, if yes, go to step 6, otherwise go to step 7; step 6: control the sensing The whole of the array is finely adjusted in the second horizontal direction and steps 2 to 4 are repeated; Step 7: selecting the maximum value of the deviation value ΔH measured after multiple position fine adjustment is the most A position corresponding to the position of the sensor array as a sample, and ends; and eight steps: determining the current position of the sensor array of sampling positions, and ends.
本發明還提出了另一種利用上述裝置進行預掃描以及軌跡校正的方法,包括:步驟一:確定感測器陣列的初始測量位置;步驟二:該感測器陣列在該初始測量位置對被測物的表面進行測量,獲得感測器陣列中各感測器的測量點高度值並對該測量點高度值進行擬合以獲得一擬合面;步驟三:計算各該測量點高度值與擬合面的偏差值△H;步驟四:將相應各該測量點高度值的偏差值△H與一高度臨界值H0進行比較,若所有的偏差值△H均小於該高度臨界值H0,則進入步驟八,否則進入步驟五;步驟五:判斷該感測器陣列的位置微調次數是否小於預設最大微調次數,若是則進入步驟六,否則進入步驟七;步驟六:微調該感測器陣列中該偏差值△H超出高度臨界值H0的感測器在第二水平方向上的位置並重複步驟二至步驟四;步驟七:選取多次位置微調後測得的偏差值△H的最大值中為最小的一次所對應的感測器陣列的位置作為採樣位置,並結束;以及步驟八:確定目前的感測器陣列的位置為採樣位置,並結束。 The present invention also provides another method for performing pre-scanning and trajectory correction using the above apparatus, comprising: Step 1: determining an initial measurement position of the sensor array; and step 2: the sensor array is measured at the initial measurement position Measuring the surface of the object, obtaining the measured point height value of each sensor in the sensor array and fitting the measuring point height value to obtain a fitting surface; Step 3: calculating the height value of each measuring point and calculating Deviation value ΔH of the joint surface; Step 4: Comparing the deviation value ΔH of the corresponding height value of the measurement point with a height threshold H 0 , if all the deviation values ΔH are smaller than the height threshold H 0 , Then enter step eight, otherwise go to step five; step five: determine whether the position of the sensor array is finely adjusted is less than the preset maximum fine-tuning times, if yes, go to step six, otherwise go to step seven; step six: fine-tune the sensor the array deviation values △ H exceeds the height position of the threshold value H 0 of the sensor in a second horizontal direction of the step and repeat steps two to four; step seven: selecting a plurality of times after the measured position fine adjustment Maximum difference △ H is a minimum in a position corresponding to the position of the sensor array as a sample, and ends; and eight steps: determining the current position of the sensor array of sampling positions, and ends.
其中,在步驟六中,感測器陣列中各感測器的位置可進行單獨微調。 Wherein, in step 6, the positions of the sensors in the sensor array can be separately fine-tuned.
現有技術中,例如基於光通量調製的三角測量法。其光斑在非測量方向大小一般為2~4mm。光斑較大時難以規避被測 物的表面的溝槽。採用根據本發明的裝置和方法,可以將測量點沿工件台的非測量方向做微小調整,進行複測直到滿足一定要求為止。這樣可以在最大程度上規避測量點落在溝槽內的可能,提高測量精度。 In the prior art, for example, triangulation based on luminous flux modulation. The spot size is generally 2~4mm in the non-measurement direction. It is difficult to evade the measured when the spot is large The groove of the surface of the object. With the apparatus and method according to the present invention, the measurement points can be finely adjusted along the non-measurement direction of the workpiece stage, and the retest is performed until a certain requirement is met. This can avoid the possibility that the measuring point falls within the groove to the greatest extent and improve the measurement accuracy.
S1-S9‧‧‧感測器 S1-S9‧‧‧ sensor
關於本發明的優點與精神可以藉由以下的發明詳述及所附圖得到進一步的瞭解。 The advantages and spirit of the present invention will be further understood from the following detailed description of the invention.
圖1所示為矽片及測量點陣列示意圖;圖2所示為感測器及被測物的劃線槽示意圖;圖3所示為測量及擬合面示意圖;圖4所示為某一測量點在劃線槽內的多點採樣圖;圖5所示為各採樣點與擬合面的偏差示意圖;圖6所示為根據本發明第一實施例的一體式感測器的採樣位置預掃描及軌跡校正流程圖;圖7所示為一體式感測器的採樣位置校正後的多點採樣示意圖;圖8所示為根據本發明第二實施例的獨立可調式感測器的採樣位置預掃描及軌跡校正流程圖;以及圖9所示為獨立可調式感測器的採樣位置校正後的多點採樣示意圖。 Figure 1 is a schematic diagram of the cymbal and measuring point array; Figure 2 is a schematic diagram of the scribe groove of the sensor and the measured object; Figure 3 is a schematic view of the measuring and fitting surface; Figure 4 shows a certain A multi-point sampling map of the measuring point in the scribe groove; FIG. 5 is a schematic diagram showing the deviation of each sampling point from the fitting surface; FIG. 6 is a sampling position of the integrated sensor according to the first embodiment of the present invention. Pre-scan and trajectory correction flowchart; FIG. 7 is a schematic diagram of multi-point sampling after sampling position correction of the integrated sensor; FIG. 8 is a sampling of the independent tunable sensor according to the second embodiment of the present invention; Position pre-scan and trajectory correction flowchart; and FIG. 9 is a schematic diagram of multi-point sampling after sampling position correction of the independently adjustable sensor.
下面結合附圖詳細說明本發明的具體實施例。 Specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
根據本發明的第一實施例介紹預掃描的過程及作用,在本實施例中多個感測器的佈置是一體式的,亦即感測器間不能相互移動,掃描軌跡的變動是藉由承載被測物的運動台完成的。這樣可以在不增加裝置複雜度的基礎上,完成預掃描及軌跡調整的目的。 According to the first embodiment of the present invention, the process and the function of the pre-scan are introduced. In this embodiment, the arrangement of the plurality of sensors is integrated, that is, the sensors cannot move with each other, and the variation of the scan track is caused by The exercise station carrying the object to be tested is completed. This can achieve the purpose of pre-scanning and trajectory adjustment without increasing the complexity of the device.
本發明中,水平方向包括x方向和y方向,x方向和y方向相互垂直,水平運動台載著被測物沿y方向運動,水平運動台和感測器為避開劃線槽沿x方向進行微調。 In the present invention, the horizontal direction includes an x direction and a y direction, the x direction and the y direction are perpendicular to each other, and the horizontal motion stage carries the object to be moved in the y direction, and the horizontal motion stage and the sensor avoid the scribe groove in the x direction. Make fine adjustments.
圖1所示為矽片及測量點陣列示意圖。可以看出,實際被測物的表面存在週期性的工藝線條。感測器陣列對矽片的表面進行測量的過程中,若某一感測器測量光斑落在劃線槽內,則該點測量值會與其它感測器的測量值有較大的差別。在做平面擬合後,相較於其它感測器的測量值,該感測器的測量值與擬合面的殘差值會明顯偏大。 Figure 1 shows a schematic diagram of the cymbal and measuring point array. It can be seen that there are periodic process lines on the surface of the actual object to be tested. During the measurement of the surface of the cymbal by the sensor array, if a sensor measurement spot falls within the scribe groove, the measured value of the point will be significantly different from the measured values of other sensors. After the plane fitting is performed, the residual value of the measured value of the sensor and the fitting surface is significantly larger than that of the other sensors.
圖2所示為感測器及被測物的劃線槽的放大示意圖。在實際測量曝光過程中,劃線槽的延伸方向與承載該被測物的運動台的運動方向通常是一致的,在本發明中也以此為前提。在本實施例中,劃線槽的週期是3mm,劃線槽寬、深均為100μm,一排佈置多個感測器。當某一感測器的光斑落在劃線槽內時,可以改變測量位置,以避開劃線槽的影響。由於感測器的光斑很小,藉由移動測量位置避開劃線槽的方案是可行的也是必要的。在現有的掃描反射鏡式三角測量方法中,光斑在非測量方向上的大小一般為2~4mm,這與劃線槽出現的週期間距相當,從而移動感測器在被測物上的採樣位置時,測量點很難避開劃線槽。當感測器的光斑在非測 量方向的長度大於劃線槽週期間距時,感測器的採樣點始終無法避開劃線槽。 FIG. 2 is an enlarged schematic view showing the scribe groove of the sensor and the measured object. In the actual measurement exposure process, the direction in which the scribe groove extends is generally coincident with the direction of movement of the motion table carrying the object to be tested, and this is also premised in the present invention. In the present embodiment, the period of the scribe groove is 3 mm, the scribe groove width and the depth are both 100 μm, and a plurality of sensors are arranged in a row. When the spot of a sensor falls within the scribe groove, the measurement position can be changed to avoid the influence of the scribe groove. Since the spot of the sensor is small, it is also possible to avoid the scheme of the scribe groove by moving the measurement position. In the existing scanning mirror type triangulation method, the size of the spot in the non-measurement direction is generally 2 to 4 mm, which is equivalent to the periodic interval in which the scribe groove appears, thereby moving the sensor to sample on the object to be measured. When the position is in place, it is difficult for the measuring point to avoid the scribe groove. When the spot of the sensor is not measured When the length of the measurement direction is greater than the interval of the scribe groove, the sampling point of the sensor cannot always avoid the scribe groove.
圖3所示為多點測量及擬合面。調焦調平系統根據感測器的多點測量值,按一定的擬合演算法得到測量平面。由於採樣點位置的不同,擬合平面也有一定差別,如圖中虛線所示的測量面1和測量面2。圖中測量面1和測量面2之間的虛線為理想面,它是曝光視場範圍內的所有點的擬合平面。為了更準確的反映實際的被測物的面形,採樣點應盡可能避免落在局部面形變化特別大的地方。在玻璃基板的測量中,劃線槽即為局部面形變化大的點。 Figure 3 shows the multipoint measurement and fit surface. The focus leveling system obtains the measurement plane according to a multi-point measurement value of the sensor according to a certain fitting algorithm. Due to the difference in the position of the sampling points, the fitting plane also has a certain difference, such as the measuring surface 1 and the measuring surface 2 shown by the broken lines in the figure. The dashed line between the measuring surface 1 and the measuring surface 2 in the figure is the ideal plane, which is the fitting plane of all points in the range of the exposure field of view. In order to more accurately reflect the actual shape of the measured object, the sampling point should be avoided as much as possible in the place where the local surface shape changes greatly. In the measurement of the glass substrate, the scribe groove is a point where the local surface shape changes greatly.
圖4所示為某一測量點在劃線槽內的多點採樣圖;圖5所示為圖4中各採樣點與擬合面的偏差示意圖。圖4中一排佈置若干個感測器S1-S9……,即可同時測得各感測器到被測物的表面的多個高度值。感測器S8的光斑剛好在溝槽內,在水平運動台載著被測物沿y方向運動時,感測器S8測到的一直為溝槽的底部。計算各個採樣點與擬合平面的偏差,可以發現S8的測量偏差值△H明顯偏大。可根據實際情況,設置一高度臨界值H0,當某一採樣點到擬合面的偏差值△H超過這一臨界值時,認為該感測器的採樣點是被測物的溝槽內。此時可以藉由水平運動台,將被測物沿x正向(或負向)做微調整。 Figure 4 shows a multi-point sampling diagram of a certain measuring point in the scribe groove; Figure 5 shows a deviation of each sampling point and the fitting surface in Figure 4. In Fig. 4, a plurality of sensors S1-S9 are arranged in a row, and a plurality of height values of the respective sensors to the surface of the object to be measured can be simultaneously measured. The spot of the sensor S8 is just inside the groove. When the horizontal moving table carries the object to be moved in the y direction, the sensor S8 always measures the bottom of the groove. Calculating the deviation between each sampling point and the fitting plane, it can be found that the measured deviation value ΔH of S8 is significantly larger. According to the actual situation, a height threshold H 0 can be set. When the deviation value ΔH of a sampling point to the fitting surface exceeds the critical value, the sampling point of the sensor is considered to be the groove of the object to be tested. . At this time, the object to be measured can be finely adjusted in the x-direction (or negative direction) by the horizontal motion stage.
圖6所示為一體式感測器的採樣位置預掃描及軌跡校正流程圖。其中,包括下列步驟:步驟一:確定初始測量位置;步驟二:利用感測器陣列在該初始測量位置進行測量,以獲得各感測器的測量點高度值並藉由擬合獲得一擬合面; 步驟三:計算各測量點高度值與擬合面的偏差值△H;步驟四:將相應各測量點高度值的偏差值△H與高度臨界值H0進行比較,若所有的偏差值△H均小於高度臨界值H0,則進入步驟八,否則進入步驟五;步驟五:判斷進入該感測器的第i次微調(i=1,2,3,……);步驟六:將i與預設最大調整次數I進行比較,若小於I,則微調運動台在x方向上的位置使得感測器陣列的整體在x方向上移動,並重複步驟二至步驟六,否則進入步驟七;步驟七:選取多次調整中偏差值△H的最大值中為最小的一次所處的位置作為採樣位置,並結束;以及步驟八:確定目前的位置為採樣位置,並結束。 Figure 6 shows the sampling position pre-scan and trajectory correction flowchart of the integrated sensor. The method includes the following steps: Step 1: determining an initial measurement position; and step 2: performing measurement at the initial measurement position by using a sensor array to obtain a measurement point height value of each sensor and obtaining a fitting by fitting Step 3: Calculate the deviation value ΔH between the height value of each measuring point and the fitting surface; Step 4: Compare the deviation value ΔH of the height value of each measuring point with the height threshold H 0 , if all the deviation values If △H is less than the height threshold H 0 , proceed to step eight, otherwise go to step 5; step 5: judge the ith fine adjustment (i=1, 2, 3, ...) entering the sensor; step 6: Comparing i with a preset maximum adjustment number I. If less than 1, fine-tuning the position of the motion stage in the x direction causes the entire sensor array to move in the x direction, and repeats steps 2 to 6, otherwise the steps are entered. Step 7: Select the position where the minimum value of the maximum value of the deviation value ΔH in the multiple adjustment is the sampling position, and end; and Step 8: Determine the current position as the sampling position, and end.
在步驟四中,當某一採樣點到擬合面的偏差值△H超過臨界值時,認為該感測器的採樣點對應的是被測物的溝槽。當最大偏差值△H<H0時,說明所有測量點均未在被測物的溝槽內,在此位置進行測試即可。當最大偏差值△H>H0時,說明有測量點在溝槽內,則需要調整運動台的x方向的位置,直至最大偏差值△H<H0為止。考慮到一些實際情況,如面形特殊性、臨界值選取合理性等,經過多次位置微調均不能滿足最大偏差值△H<H0。此時可以在所有位置調整中,選取最大偏差值△H中為最小的一次所對應的位置作為測量位置進行測量。 In step four, when the deviation value ΔH of a certain sampling point to the fitting surface exceeds a critical value, it is considered that the sampling point of the sensor corresponds to the groove of the object to be tested. When the maximum deviation value △H<H 0 , it means that all the measurement points are not in the groove of the object to be tested, and the test can be performed at this position. When the maximum deviation △ H> H 0, it indicates that there are measurement points within the trenches, the need to adjust the x-direction movement stage position until the maximum deviation △ H <far H 0. Considering some actual conditions, such as the particularity of the shape and the rationality of the selection of the critical value, the maximum deviation value △H<H 0 cannot be satisfied after repeated fine adjustment of the position. At this time, in all the position adjustments, the position corresponding to the smallest one of the maximum deviation values ΔH is selected as the measurement position for measurement.
圖7所示為進行上述採樣位置校正後的多點採樣示意圖。本實施例中,感測器的測量位置的整體做了調整。 FIG. 7 is a schematic diagram of multi-point sampling after performing the above sampling position correction. In this embodiment, the overall measurement position of the sensor is adjusted.
根據本發明的第二實施例介紹獨立可調式感測器的預掃描過程,與第一實施例的區別在於,本實施例中在預掃描過程中任一感測器在水平方向的測量位置均是可調整的,亦即掃描軌跡的變動是藉由若干感測器的水平位置自身的獨立調整完成的。這樣增加了裝置的複雜程度,但可以有針對性的對溝槽位置等特殊面形在掃描軌跡上進行調整及規避。 A pre-scanning process of the independently adjustable sensor according to the second embodiment of the present invention is different from the first embodiment in that the measurement position of any of the sensors in the horizontal direction in the pre-scanning process in this embodiment is It is adjustable, that is, the variation of the scan trajectory is accomplished by independent adjustment of the horizontal position of several sensors themselves. This increases the complexity of the device, but can be adjusted and circumvented on the scanning trajectory in a specific shape such as the groove position.
圖8所示為獨立可調式感測器的採樣位置預掃描及軌跡校正流程圖。其中,包括下述步驟:步驟一:確定初始測量位置;步驟二:利用感測器陣列在該初始測量位置進行測量,以獲得各感測器的測量點高度值並藉由擬合獲得一擬合面;步驟三:計算各測量點高度值與擬合面的偏差值△H;步驟四:將相應各測量點高度值的偏差值△H與高度臨界值H0進行比較,若所有的偏差值△H均小於高度臨界值H0,則進入步驟八,否則進入步驟五;步驟五:判斷進入該感測器的第i次微調(i=1,2,3,……);步驟六:將i與預設最大調整次數I進行比較,若小於I,則微調感測器陣列中超出臨界值的測量值△H所對應的感測器在x方向上的位置,並重複步驟二至步驟六,否則進入步驟七;步驟七:選取多次調整中偏差值△H的最大值中為最小的一次所處的位置作為採樣位置,並結束;以及步驟八:確定目前的位置為採樣位置,並結束。 Figure 8 shows the sampling position pre-scan and trajectory correction flowchart for the independently adjustable sensor. The method includes the following steps: Step 1: Determine an initial measurement position; Step 2: Perform measurement at the initial measurement position by using a sensor array to obtain a measurement point height value of each sensor and obtain a simulation by fitting Face combination; Step 3: Calculate the deviation value ΔH between the height value of each measurement point and the fitting surface; Step 4: Compare the deviation value ΔH of the height value of each measurement point with the height threshold H 0 , if all deviations If the value ΔH is less than the height threshold H 0 , proceed to step eight, otherwise proceed to step five; step five: determine the ith fine adjustment (i=1, 2, 3, ...) entering the sensor; step six : comparing i with the preset maximum adjustment number I, if less than I, fine-tuning the position of the sensor corresponding to the critical value of the measured value ΔH in the x direction in the sensor array, and repeating step two to Step 6 otherwise, go to step 7; Step 7: Select the position where the minimum value of the maximum value of the deviation value ΔH is adjusted as the sampling position and end; and Step 8: Determine the current position as the sampling position And ended.
在步驟四中,當某一採樣點到擬合面的偏差值△H超過臨界值時,認為該感測器的採樣點是被測物的溝槽。當最大偏差 值△H<H0時,說明所有測量點均未在被測物的溝槽內,在此位置進行測試即可。當存在偏差值△H>H0時,說明有測量點在溝槽內,則需要調整該測量點對應的感測器的x方向的位置,直至其偏差值△H<H0為止。考慮到一些實際情況,如面形特殊性、臨界值選取合理性等,經過多次位置微調均不能滿足偏差值△H<H0。此時可以在所有位置調整中,選取最大偏差值△H中為最小的那一次所對應的位置作為測量位置進行測量。 In step four, when the deviation value ΔH of a certain sampling point to the fitting surface exceeds a critical value, the sampling point of the sensor is considered to be a groove of the object to be tested. When the maximum deviation value △H<H 0 , it means that all the measurement points are not in the groove of the object to be tested, and the test can be performed at this position. When there is a deviation value ΔH>H 0 , it indicates that there is a measurement point in the groove, and it is necessary to adjust the position of the sensor corresponding to the x direction of the measurement point until the deviation value ΔH<H 0 . Considering some actual conditions, such as the particularity of the shape and the rationality of the selection of the critical value, the deviation value △H<H 0 cannot be satisfied after repeated fine adjustment of the position. At this time, in all the position adjustments, the position corresponding to the smallest deviation value ΔH is selected as the measurement position for measurement.
圖9為獨立可調式感測器的採樣位置校正後的多點採樣示意圖。本實施例中,僅感測器S8的測量位置做了調整。 FIG. 9 is a schematic diagram of multi-point sampling after sampling position correction of the independently adjustable sensor. In this embodiment, only the measurement position of the sensor S8 is adjusted.
本說明書中所述的只是本發明的較佳具體實施例,以上實施例僅用以說明本發明的技術方案而非對本發明的限制。凡本領域技術人員依本發明的構思藉由邏輯分析、推理或者有限的實驗可以得到的技術方案,皆應在本發明的範圍之內。 The description of the present invention is only a preferred embodiment of the present invention, and the above embodiments are merely illustrative of the technical solutions of the present invention and are not intended to limit the present invention. Any technical solution that can be obtained by a person skilled in the art according to the idea of the present invention by logic analysis, reasoning or limited experimentation should be within the scope of the present invention.
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW104132693A TWI582428B (en) | 2015-10-05 | 2015-10-05 | Pre-scan based track correction focusing leveling device and method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW104132693A TWI582428B (en) | 2015-10-05 | 2015-10-05 | Pre-scan based track correction focusing leveling device and method |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201713951A TW201713951A (en) | 2017-04-16 |
TWI582428B true TWI582428B (en) | 2017-05-11 |
Family
ID=59256574
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104132693A TWI582428B (en) | 2015-10-05 | 2015-10-05 | Pre-scan based track correction focusing leveling device and method |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI582428B (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004363085A (en) * | 2003-05-09 | 2004-12-24 | Ebara Corp | Inspection apparatus by charged particle beam and method for manufacturing device using inspection apparatus |
TW200915010A (en) * | 2007-05-30 | 2009-04-01 | Nikon Corp | Detection device, movable body apparatus, pattern formation apparatus and pattern formation method, exposure apparatus and exposure method, and device manufacturing method |
CN103969961A (en) * | 2013-02-04 | 2014-08-06 | 上海微电子装备有限公司 | Focusing and leveling system |
-
2015
- 2015-10-05 TW TW104132693A patent/TWI582428B/en active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004363085A (en) * | 2003-05-09 | 2004-12-24 | Ebara Corp | Inspection apparatus by charged particle beam and method for manufacturing device using inspection apparatus |
TW200915010A (en) * | 2007-05-30 | 2009-04-01 | Nikon Corp | Detection device, movable body apparatus, pattern formation apparatus and pattern formation method, exposure apparatus and exposure method, and device manufacturing method |
CN103969961A (en) * | 2013-02-04 | 2014-08-06 | 上海微电子装备有限公司 | Focusing and leveling system |
Also Published As
Publication number | Publication date |
---|---|
TW201713951A (en) | 2017-04-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US9207189B2 (en) | Sample support apparatus | |
KR102592917B1 (en) | Method for inspecting surface and method for manufacturing semiconductor device | |
US9897927B2 (en) | Device and method for positioning a photolithography mask by a contactless optical method | |
JP2004501516A (en) | Design of overlay alignment mark | |
US20130222579A1 (en) | Measurement apparatus and correction method of the same | |
KR101962830B1 (en) | Pre-alignment measuring device and method | |
JP6491833B2 (en) | Height measuring device | |
US7268877B2 (en) | Method and apparatus for orienting semiconductor wafers in semiconductor fabrication | |
CN104977821B (en) | A kind of trajectory corrector focusing leveling device and method based on prescan | |
JP6548764B2 (en) | Auto focus device | |
CN105988310B (en) | Photolithography method and wafer | |
JP6309366B2 (en) | Height measuring device and autofocus device in charged particle beam device | |
KR102554797B1 (en) | Verification of individual beam pattern placement in multi-beam lithography | |
TWI582428B (en) | Pre-scan based track correction focusing leveling device and method | |
Rahimi et al. | Improving measurement accuracy of position sensitive detector (PSD) for a new scanning PSD microscopy system | |
KR20130010845A (en) | Charged particle beam drawing apparatus and method of manufacturing article | |
CN110095944A (en) | A kind of focus adjustment method of focus control, litho machine and focus control | |
JP2024516240A (en) | Scanning probe microscope system, optical microscope, calibration structure, and method for calibration in a scanning probe microscope device - Patents.com | |
JP7057655B2 (en) | Measuring equipment, lithography equipment, manufacturing method of goods, and measuring method | |
CN102566289A (en) | Method for testing diaphragm of illumining system of photoetching equipment | |
JP2019153602A (en) | Auto-focus device | |
KR100854222B1 (en) | Exposure apparatus | |
KR101008328B1 (en) | Grating moving apparatus and method for measuring three-dimensional using moire | |
CN107783379B (en) | Compensation method for measurement information | |
CN106933072B (en) | A kind of focusing and leveling measuring system and its calibration method |