TWI581365B - Electrostatic chuck device - Google Patents

Description

Electrostatic chuck device

The present invention relates to the field of semiconductor processing equipment, and more particularly to an electrostatic chuck device.

Typically, an electrostatic chuck device includes an electrostatic chuck ESC and a support structure for supporting the electrostatic chuck. In the semiconductor processing process, the wafer to be processed needs to be fixed on the electrostatic chuck. Moreover, in order to obtain a better treatment effect, it is also necessary to measure the temperature of the electrostatic chuck. Therefore, the electrostatic chuck device further includes a temperature detecting device for measuring the temperature of the electrostatic chuck.

At present, in semiconductor processing technology, a temperature detecting device usually employs a thermocouple measuring element. The thermocouple measuring component directly measures the temperature of the electrostatic chuck and converts the temperature signal into a thermoelectromotive force signal, which is converted into the temperature of the electrostatic chuck by an electric meter (secondary meter). In other words, the thermocouple uses a voltage signal during the temperature measurement process. However, in semiconductor processing, these RF energy sources generate electromagnetic signals due to the use of RF energy. Therefore, in the semiconductor processing process, these electromagnetic signals may interfere with the voltage signal generated during the thermocouple measurement component temperature measurement, thereby affecting the measurement accuracy of the thermocouple measurement component. In order to accurately measure the temperature of the electrostatic chuck, in the field of semiconductor processing, the temperature of the electrostatic chuck was measured using a fiber optic detector.

However, the transmission fiber of the conventional fiber optic detector is a whole elongated fiber. Generally, one end of the transmission fiber of the fiber detector is fixed on the support structure, and the other end is a measuring end, and the measuring end is from the supporting structure. The surface is extended. When assembling the electrostatic chuck and the support structure, the electrostatic chuck passes through the measuring end of the transmission fiber, and a section of the transmission fiber near the measuring end is installed in the electrostatic chuck, thereby realizing assembly of the electrostatic chuck and the supporting structure. When the electrostatic chuck device is removed, it is also necessary to pass the electrostatic chuck through the measuring end of the transmission fiber. Therefore, during the assembly and disassembly of the electrostatic chuck device, the electrostatic chuck passes through the measuring end of the transmission fiber, so in the process of installing and removing the electrostatic chuck device, the electrostatic chuck easily touches the probe mounted on the measuring end of the transmission fiber. , resulting in reduced measurement accuracy of the fiber temperature sensor. Moreover, since the elongated transmission fiber is fragile, the transmission fiber is easily damaged during the installation and removal of the electrostatic chuck device, resulting in an increase in the cost of the hardware device.

In view of this, the present invention provides a new electrostatic chuck device to reduce the probability of damage to the fiber optic detector, thereby reducing hardware costs.

In order to solve the above technical problems, the present invention adopts the following technical means:

The present invention provides an electrostatic chuck device comprising an electrostatic chuck, a support structure for supporting an electrostatic chuck, and an optical fiber temperature sensor for measuring the temperature of the electrostatic chuck, wherein the fiber temperature sensor comprises a transmission fiber; the transmission fiber comprises separate fibers. a first transmission fiber and a second transmission fiber.

A first mounting structure for mounting the first transmission fiber is disposed on the electrostatic chuck.

A second mounting structure for mounting the second transmission fiber is disposed on the support structure.

When the electrostatic chuck is assembled to the support structure, the lower surface of the electrostatic chuck on which the first transmission fiber is mounted is placed opposite the upper surface of the support structure on which the second transmission fiber is mounted, and the first end of the first transmission fiber The first ends of the two transmission fibers are docked.

Wherein the first end of the first transmission fiber is located on a side of the lower surface of the electrostatic chuck; the first end of the second transmission fiber is located on a side of the upper surface of the support structure.

Preferably, the first end of the first transmission fiber is flush with the lower surface of the electrostatic chuck; the first end of the second transmission fiber is flush with the upper surface of the support structure.

Preferably, the first end of the first transmission fiber projects from the lower surface of the electrostatic chuck by a first length; the first end of the second transmission fiber is retracted from the upper surface of the support structure by a first length.

Preferably, the first length is no more than 2 mm.

Preferably, the first end of the first transmission fiber is retracted from the lower surface of the electrostatic chuck to a second length; the first end of the second transmission fiber is retracted from the upper surface of the support structure by a second length.

Preferably, the second length is no more than 2 mm.

Preferably, the materials of the first transmission fiber and the second transmission fiber are different.

Preferably, the material used to make the first transmission fiber is capable of withstanding the temperature at which the electrostatic chuck operates; the material used to make the second transmission fiber can withstand the temperature at which the support structure operates.

Preferably, the lower surface side of the electrostatic chuck is provided with a first positioning structure; the upper surface side of the support structure is provided with a second positioning structure; when the electrostatic chuck and the support structure are assembled, the first positioning structure and the second positioning structure are adapted Alignment and docking the first end of the first transmission fiber with the first end of the second transmission fiber.

The present invention provides an electrostatic chuck device comprising an electrostatic chuck, a support structure for supporting an electrostatic chuck, and an optical fiber temperature sensor for measuring the temperature of the electrostatic chuck, wherein the fiber temperature sensor comprises a transmission fiber; the transmission fiber comprises a first transmission The optical fiber and the second transmission fiber; the material of the first transmission fiber is different from the material of the second transmission fiber.

When the electrostatic chuck is assembled to the support structure, the first transmission fiber is mounted on the electrostatic chuck and the second transmission fiber is mounted on the support structure.

Preferably, the material used to make the first transmission fiber is capable of withstanding the temperature at which the electrostatic chuck operates; the material used to make the second transmission fiber can withstand the temperature at which the support structure operates.

Compared with the prior art, the present invention has the following beneficial effects:

In the electrostatic chuck device provided by the present invention, the transmission fiber includes a first transmission fiber and a second transmission fiber which are separated from each other. Before assembling the electrostatic chuck and the support structure, the first transmission fiber may be preliminarily mounted on the first mounting structure on the electrostatic chuck, and the second transmission fiber is mounted on the second mounting structure of the support structure, and then the electrostatic chuck is It is assembled with the support structure. Thus, in the process of assembling the electrostatic chuck and the support structure, only one end of the first transmission fiber mounted on the electrostatic chuck and one end of the second transmission fiber mounted on the support structure can be docked, and the electrostatic chuck does not need to be worn. Passing a slender transmission fiber. Moreover, the electrostatic chuck does not need to pass through the elongated transmission fiber during the removal of the electrostatic chuck device. Therefore, compared with the prior art, the electrostatic chuck device provided by the present invention reduces the probability of damage of the transmission fiber, thereby ensuring the stability of the transmission fiber and reducing the hardware cost of the electrostatic chuck device.

In addition, the first mounting structure disposed on the electrostatic chuck and the second mounting structure disposed on the support structure can protect the first transmission fiber in addition to the function of mounting and fixing the first transmission fiber and the second transmission fiber. And the role of the second transmission fiber. When the first transmission fiber is installed in the first mounting structure and the second transmission fiber is installed in the second mounting structure, the entire first transmission fiber and the entire second transmission fiber can be prevented from protruding. Therefore, in this respect, the electrostatic chuck device provided by the present invention is also advantageous in reducing the probability of damage of the transmission fiber.

In addition, in the process of assembling and disassembling the electrostatic chuck device provided by the present invention, the electrostatic chuck does not touch the probe located at the measuring end of the first transmission fiber, so the electrostatic chuck device provided by the invention can ensure the measurement accuracy of the fiber temperature sensor. .

In order to make the objects, technical means and technical effects of the present invention more clear and complete, the specific embodiments of the present invention are described below in conjunction with the drawings.

It should be noted that, when the wafer to be processed is processed, the wafer to be processed needs to be placed on the upper surface of the electrostatic chuck ESC in the reaction chamber. The wafer to be processed is fixed by adsorption of an electrostatic chuck ESC. In order to accurately control the processing conditions to improve the processing quality of the wafer to be processed, it is necessary to know the temperature of the wafer to be processed. Those of ordinary skill in the art to which the present invention pertains typically use the backside temperature of the wafer to be processed as the temperature of the wafer to be processed.

Since the wafer to be processed is placed on the upper surface of the electrostatic chuck, when the temperature of the upper surface of the electrostatic chuck is known, the temperature of the back surface of the wafer to be processed is obtained, and the temperature of the back surface of the wafer to be processed is the crystal to be processed. The temperature of the circle.

In order to measure the temperature of the back surface of the wafer to be processed, the electrostatic chuck device for fixing the wafer to be processed further includes a temperature measuring device. Typically, the temperature measuring device of the electrostatic chuck device is disposed at the bottom of the electrostatic chuck device, and the measuring probe of the temperature measuring device extends from the bottom support structure to the upper surface of the electrostatic chuck. Thereby, the measurement of the surface temperature of the electrostatic chuck is achieved.

In order to ensure the accuracy of the temperature measurement, the embodiment of the present invention uses a fiber optic temperature sensor for measurement. The transmission fiber is used to transmit the signal of the upper surface of the electrostatic chuck measured by the measuring probe to the light temperature sensor.

In addition, in order to prevent the electrostatic chuck from contacting the transmission fiber and the measuring probe of the fiber optic temperature sensor during the process of assembling the electrostatic chuck on the supporting structure or detaching the electrostatic chuck from the supporting structure, the present invention provides a New structure of the electrostatic chuck device. See the following examples for details.

First embodiment

1A is an exploded perspective view of an electrostatic chuck device according to a first embodiment of the present invention; and FIG. 1B is a schematic structural view of an electrostatic chuck device assembled with an electrostatic chuck and a support structure.

As shown in FIG. 1A, an electrostatic chuck device according to a first embodiment of the present invention includes an electrostatic chuck 11, a support structure 12, and an optical fiber temperature sensor 13 for measuring the temperature of the electrostatic chuck 11.

The support structure 12 may be a support column or a support table whose upper surface is flat. The support structure 12 shown in Fig. 1A is a support table.

The fiber optic temperature sensor 13 includes a transmission fiber for transmitting signals; the transmission fiber includes a first transmission fiber 131 and a second transmission fiber 132.

The first chucking structure 11 is provided with a first mounting structure 111 for mounting the first transmitting fiber 131; the first mounting structure 111 is a cavity structure formed from an opening formed on the lower surface of the electrostatic chuck 11 toward the inside of the electrostatic chuck 11; The bottom of the cavity structure is close to the upper surface of the electrostatic chuck 11.

A second mounting structure 121 for mounting the second transmission fiber 132 is disposed on the support structure 12.

The first mounting structure 111 and the second mounting structure 121 are also capable of fixing the first transmission fiber 131 and the second transmission fiber 132 installed therein. In addition, the structures of the first mounting structure 111 and the second mounting structure 121 can also be adapted to each other to provide a positioning function when the electrostatic chuck 11 and the support structure 12 are assembled.

One end of the first transmission fiber 131 is a measurement end of the fiber temperature sensor, and the measurement end includes a measurement probe of the fiber temperature sensor.

Since the first mounting structure 111 is a cavity structure formed from an opening formed in the lower surface of the electrostatic chuck 11 toward the inside of the electrostatic chuck 11, the measuring end of the first transmission fiber 131 can be inserted into the inside of the first mounting structure 111. To achieve assembly of the first transmission fiber 131 and the electrostatic chuck. After assembly, the measuring end of the first transmission fiber 131 is located on the upper surface side of the electrostatic chuck 11, and the first end of the first transmission fiber 131 opposite to the measuring end is located on the lower surface side of the electrostatic chuck 11. Also, as shown in FIG. 1A, the first end of the assembled first transmission fiber 131 is flush with the lower surface of the electrostatic chuck 11.

It should be noted that, in the case where the size of the electrostatic chuck device is constant, the transmission fiber in the prior art is an entire transmission fiber. Compared with a whole transmission fiber in the prior art, the first transmission fiber provided by the present invention has a short length, so that the probability of the first transmission fiber being damaged is reduced during the process of installing the first transmission fiber. After the installation is completed, the measuring probe of the measuring end of the first transmission fiber can measure the temperature of the back side of the wafer on the upper surface of the electrostatic chuck.

In addition, one end of the second transmission fiber 132 is a first end. After the second transmission fiber 132 is mounted on the second mounting structure 22, the first end of the second transmission fiber 132 is located on the upper surface side of the support structure 12, and as shown in FIG. 1A, the second transmission fiber 132 One end is flush with the upper surface of the support structure 12.

After the electrostatic chuck 11 is assembled onto the support structure 12, as shown in FIG. 1B, that is, the electrostatic chuck 11 is placed on the support structure 12, and the lower surface of the electrostatic chuck 11 is placed opposite the upper surface of the support structure 12, and first The first end of the transmission fiber 131 interfaces with the first end of the second transmission fiber 132.

The signal transmission between the first transmission fiber 131 and the second transmission fiber 132 can be performed. Thus, the signal on the first transmission fiber 131 can be transmitted to the second transmission fiber 132, and the signal on the second transmission fiber 132. It can be transmitted to the first transmission fiber 131. Therefore, the docked first transmission fiber 131 and the second transmission fiber 132 are equivalent to a whole transmission fiber in the prior art.

Thus, the measuring probe of the measuring end of the first transmission fiber 131 measures the temperature of the back surface of the wafer to be processed above the electrostatic chuck to obtain a measurement signal. The measurement signal is transmitted to the fiber temperature sensor by the first transmission fiber 131 and the second transmission fiber 132 that is connected to the first transmission fiber 131, and the measurement signal is processed through the fiber temperature sensor to obtain the measurement. The temperature of the back side of the wafer to be processed.

Therefore, the optical fiber temperature sensor with the first transmission fiber 131 and the second transmission fiber 132 provided by the present invention can measure the back surface temperature of the wafer to be processed, thereby providing a basis for accurately controlling the processing process.

In addition, the present invention provides an electrostatic chuck device that does not need to pass through an elongated transmission fiber mounted on a support structure when the electrostatic chuck is assembled to the support structure or when the electrostatic chuck is detached from the support structure. Therefore, the possibility that the transmission fiber is damaged is reduced. In addition, when the electrostatic chuck is assembled and disassembled, the electrostatic chuck does not touch the measuring probe of the measuring end of the light temperature sensor. Therefore, the electrostatic chuck device provided by the present invention can ensure the accuracy of measuring the temperature of the fiber optic temperature sensor.

The above is the electrostatic chuck device provided by the first embodiment of the present invention. In the electrostatic chuck device shown in the first embodiment, the first end of the first transfer fiber 131 mounted on the first mounting structure 111 of the electrostatic chuck 11 is flush with the lower surface of the electrostatic chuck 11. Since the lower surface of the electrostatic chuck 11 and the upper surface of the support structure 12 are generally flat surfaces, in order to achieve the docking of the first transmission fiber 131 and the second transmission fiber 132, correspondingly, the second surface is mounted to the second mounting structure 122. The first end of the transmission fiber 132 is flush with the upper surface of the support structure 12. It should be noted that the electrostatic chuck device provided by the embodiment of the present invention is not limited to the structure shown in the first embodiment. In order to achieve the docking of the first transmission fiber 131 and the second transmission fiber 132, the embodiment of the present invention further provides static electricity. Other ways of sucker devices. For details, refer to the following second embodiment and third embodiment.

Second embodiment

2A is a schematic exploded view of the electrostatic chuck device according to the second embodiment of the present invention; and FIG. 2B is a schematic structural view of the assembled electrostatic chuck device according to the second embodiment of the present invention.

Similar to the first embodiment, the electrostatic chuck device of the second embodiment also includes an electrostatic chuck 21, a support structure 22 for supporting the electrostatic chuck 21, and an optical fiber temperature sensor 23 for measuring the surface temperature of the electrostatic chuck, wherein the temperature of the optical fiber is sensed. The detector includes a first transmission fiber 231 and a second transmission fiber 232 that are separated from each other.

In addition, a first mounting structure 211 for mounting the first transmission fiber 231 is further disposed on the electrostatic chuck 21; and a second mounting structure 221 for mounting the second transmission fiber 232 is disposed on the supporting structure 22.

It should be noted that the structure of the electrostatic chuck device of the second embodiment has many similarities with the structure of the electrostatic chuck device of the first embodiment. For the sake of brevity, the present embodiment only focuses on the differences, and the similarities are described in the description of the first embodiment.

The difference between this embodiment and the first embodiment is only the positional relationship between the first end of the first transmission fiber 231 after installation and the lower surface of the electrostatic chuck 21, and the first end of the second transmission fiber 232 after installation. Positional relationship with the upper surface of the support structure 22. The positional relationship is as follows.

As shown in FIG. 2A, the first end of the first transmission fiber 231 mounted on the first mounting structure 211 on the electrostatic chuck 21 protrudes from the lower surface of the electrostatic chuck 21 by a first length; correspondingly, to the support structure 22 The first end of the second transmission fiber 232 on the second mounting structure 221 is retracted from the upper surface of the support structure 22 by a first length. As such, when the electrostatic chuck 21 is assembled to the support structure 22, as shown in FIG. 2B, the transmission fiber extending from the lower surface of the electrostatic chuck 21 is inserted into the second mounting structure 221 and mounted in the second mounting structure 221. The first end of the second transmission fiber 232 is docked.

Wherein, in order to prevent damage to the first transmission fiber 231 during insertion, the first length may be no more than 2 mm.

In the electrostatic chuck device shown in the second embodiment, the first end of the first transmission fiber 231 protrudes outside the electrostatic chuck 21; accordingly, the first end of the second transmission fiber 232 is retracted into the interior of the support structure 22. As a further embodiment of the present invention, the first end of the first transmission fiber 231 may be retracted into the interior of the electrostatic chuck 21, while the second end of the second transmission fiber 232 protrudes beyond the support structure 22. Third embodiment.

Third embodiment

3A is a schematic exploded view of the electrostatic chuck device according to the third embodiment of the present invention; and FIG. 3B is a schematic structural view of the assembled electrostatic chuck device according to the third embodiment of the present invention.

Similar to the first embodiment, the electrostatic chuck device of the third embodiment also includes an electrostatic chuck 31, a support structure 32 for supporting the electrostatic chuck 31, and an optical fiber temperature sensor 33 for measuring the surface temperature of the electrostatic chuck 31, wherein the optical fiber The temperature sensor includes a first transmission fiber 331 and a second transmission fiber 332 that are separated from each other.

In addition, a first mounting structure 311 for mounting the first transmission fiber 331 is further disposed on the electrostatic chuck 31, and a second mounting structure 321 for mounting the second transmission fiber 332 is disposed on the support structure 32.

It should be noted that the structure of the electrostatic chuck device of the third embodiment has many similarities with the structure of the electrostatic chuck device of the first embodiment. For the sake of brevity, the present embodiment only focuses on the differences, and the similarities are described in the description of the first embodiment.

The difference between this embodiment and the first embodiment is only the positional relationship between the first end of the first transmission fiber 331 after installation and the lower surface of the electrostatic chuck 31, and the first end of the second transmission fiber 332 after installation. Positional relationship with the upper surface of the support structure 32. The positional relationship is as follows.

As shown in FIG. 3A, the first end of the first transmission fiber 331 mounted on the first mounting structure 311 is located inside the electrostatic chuck 31, and the distance between the first end of the first transmission fiber 331 and the lower surface of the electrostatic chuck 31 is The second length; correspondingly, the first end of the second transmission fiber 332 mounted to the second mounting structure 321 extends a second length from the upper surface of the support structure 32. In order to achieve the docking of the first transmission fiber 331 and the second transmission fiber 332, and to prevent damage to the second transmission fiber by inserting the second transmission fiber 332 into the first mounting structure 311, the second length may be no more than 2 mm.

The above is the structure of the electrostatic chuck device provided by the third embodiment of the present invention.

It should be noted that, in the electrostatic chuck device provided by the embodiment of the present invention, the positional relationship between the first transmission fiber and the electrostatic chuck after installation and the positional relationship between the second transmission fiber and the support structure after installation are not limited to the above three embodiments. The positional relationship can be achieved by assembling the terminals of the first transmission fiber and the second transmission fiber after assembling the electrostatic chuck to the support structure.

Further, in the electrostatic chuck device of any of the above embodiments, the materials of the first transmission fiber and the second transmission fiber may be the same. Further, the materials of the first transmission fiber and the second transmission fiber may also be different.

Moreover, studies have shown that the transmission fiber far from the measuring probe affects the measurement accuracy to a lesser extent than the transmission fiber close to the measuring probe. Therefore, the second transmission fiber can be made of a lower cost material than the first transmission fiber without affecting the measurement accuracy.

In addition, studies have also shown that, in general, the temperature in the electrostatic chuck is generally different from the temperature in the support structure, so the operating temperatures of the first transmission fiber and the second transmission fiber are different. In order to accommodate different operating temperatures, the first transmission fiber and the second transmission fiber may be of different materials. In particular, the material used to make the first transmission fiber can withstand the temperature within the electrostatic chuck, while the material used to make the second transmission fiber can withstand the temperature within the support structure.

In addition, in order to facilitate the docking of the first transmission fiber and the second transmission fiber, the electrostatic chuck and the support structure of the electrostatic chuck device provided in any of the above embodiments may be provided with a matching positioning structure. See the fourth embodiment for details.

Fourth embodiment

4A is an exploded structural view of an electrostatic chuck device according to a fourth embodiment of the present invention; and FIG. 4B is a schematic structural view of the assembled electrostatic chuck device according to a fourth embodiment of the present invention.

It is to be noted that the fourth embodiment is an electrostatic chuck device which is improved on the basis of the electrostatic chuck device provided in the first embodiment. Therefore, the electrostatic chuck device provided by the fourth embodiment has many similarities with the electrostatic chuck device provided by the first embodiment. For the sake of brevity, only the differences from the first embodiment will be described herein, which are similar. Please refer to the corresponding description of the first embodiment.

As shown in FIG. 4A, the electrostatic chuck device of the fourth embodiment may include the following structures in addition to the structure of the first embodiment:

a first positioning structure 412 disposed on a lower surface side of the electrostatic chuck; and a second positioning structure 422 disposed on an upper surface side of the support structure.

When the electrostatic chuck is assembled to the support structure, as shown in FIG. 4B, the first positioning structure 412 and the second positioning structure 422 are aligned; when the first positioning structure 412 and the second positioning structure 422 are aligned, A transmission fiber 131 and a second transmission fiber 132 are also docked.

Therefore, the arrangement of the first positioning structure 412 and the second positioning structure 422 facilitates the docking efficiency of the first transmission fiber 131 and the second transmission fiber 132.

As a specific embodiment of the present invention, the first positioning structure 412 may be a structure recessed into the interior of the electrostatic chuck; accordingly, the second positioning structure 422 may be a structure that protrudes outward from the surface of the support structure. And the size and shape of the recessed structure correspond to the size and shape of the protruding structure.

In addition, in the electrostatic chuck device, when the fiber temperature sensor operates, the optical fiber of the transmission fiber near the measuring end is installed in the electrostatic chuck, and the fiber away from the measuring end is installed in the supporting structure. Since the operating temperatures of the electrostatic chuck and the support structure are different during semiconductor processing, it is required that the transmission fiber installed in the electrostatic chuck and the transmission fiber installed in the support structure have different temperature resistance. In order to make the fibers of the optical fiber temperature sensor's transmission fiber have different temperature resistance, the present invention also provides a fifth embodiment.

Fifth embodiment

5A is an exploded structural view of an electrostatic chuck device according to a fifth embodiment of the present invention; and FIG. 5B is a schematic structural view of the assembled electrostatic chuck device according to the fifth embodiment of the present invention.

As shown in FIG. 5A, the electrostatic chuck device includes an electrostatic chuck 51, a support structure 52, and a fiber optic temperature sensor 53 for measuring the temperature of the upper surface of the electrostatic chuck. The fiber optic temperature sensor includes a transmission fiber for transmitting signals, wherein the transmission fiber is an entire transmission fiber. And, the transmission fiber includes a first transmission fiber 531 and a second transmission fiber 532.

In addition, a first mounting structure 511 for mounting and fixing the first transmission fiber 531 is disposed on the electrostatic chuck 51; and a second mounting structure 521 for mounting and fixing the second transmission fiber 532 is disposed on the support structure 52.

As shown in FIG. 5B, when it is required to assemble the electrostatic chuck 51 onto the support structure 52, the second transmission fiber of the transmission fiber is preliminarily mounted on the second mounting structure 521, and after installation, the first transmission fiber 531 protrudes from the support structure. The outside. Then, the first transmission fiber 531 is mounted into the first mounting structure 511, thereby realizing assembly of the electrostatic chuck 51 and the support structure 52.

Since the operating temperatures of the electrostatic chuck 51 and the support structure 52 are different during processing, it is required that the first transmission fiber 531 and the second transmission fiber 532 installed inside thereof have different temperature resistance. In order to make the first transmission fiber 531 and the second transmission fiber 532 have different temperature resistance, in the embodiment of the present invention, the materials for manufacturing the first transmission fiber 531 and the second transmission fiber 532 may be different fiber materials. Thus, the first transmission fiber 531 and the second transmission fiber 532 can be manufactured by selecting optical fiber materials of different temperature resistances according to the operating temperatures of the electrostatic chuck 51 and the support structure 52, respectively.

Specifically, the material for manufacturing the first transmission fiber 531 is selected according to the operating temperature of the electrostatic chuck 51, for example, if the operating temperature range of the electrostatic chuck 51 is between 50 and 90 ° C, the temperature range is selected to be 50 to The first transmission fiber 531 is fabricated by using a 90 ° C fiber material. In addition, the material used to fabricate the second transmission fiber 532 is selected based on the operating temperature of the support structure 52, for example, if the operating temperature range of the support structure 52 is between 20 and 70 ° C, the temperature range is selected to be 20 to 70 °. A second transmission fiber 532 is fabricated from the fiber material between C.

The above is only a specific embodiment of the present invention, and it should be understood that various modifications and improvements can be made without departing from the principles of the invention. It should also be considered as the scope of protection of the present invention.

11, 21, 31, 51: electrostatic chucks 111, 211, 311, 331, 511: first mounting structures 12, 22, 32, 52: support structures 121, 221, 321, 332, 521: second mounting structure 13, 23, 33, 53: fiber temperature sensor 131, 231, 531: first transmission fiber 132, 232, 532: second transmission fiber 412: first positioning structure 422: second positioning structure

In order to clearly understand the technical means of the present invention, a brief description will be made below to describe the drawings used in the description of the specific embodiments of the present invention. Obviously, these drawings are only partial embodiments of the present invention, and those having ordinary knowledge in the technical field of the present invention can obtain other drawings under the premise of progress: FIG. 1A and FIG. 1B are respectively the first embodiment of the present invention. FIG. 2A and FIG. 2B are respectively an exploded view and an assembled view of an electrostatic chuck device according to a second embodiment of the present invention; FIG. 3A and FIG. 3B are respectively FIG. 4A and FIG. 4B are respectively an exploded view and an assembled view of an electrostatic chuck device according to a fourth embodiment of the present invention; FIG. 5A and FIG. 5B are respectively a view of an exploded view and an assembled view of the electrostatic chuck device according to the third embodiment of the present invention; An exploded view and an assembled view of an electrostatic chuck device according to a fifth embodiment of the present invention.

11: electrostatic chuck 111: first mounting structure 12: support structure 121: second mounting structure 13: fiber temperature sensor 131: first transmission fiber 132: second transmission fiber

Claims (11)

An electrostatic chuck device includes: an electrostatic chuck, a support structure configured to support the electrostatic chuck, and a fiber optic temperature sensor configured to measure the temperature of the electrostatic chuck, wherein the fiber temperature sensor includes a transmission fiber, The transmission fiber includes a first transmission fiber and a second transmission fiber separated from each other; the electrostatic chuck is provided with a first mounting structure configured to mount the first transmission fiber; the support structure is provided with a configuration to install the first a second mounting structure of the second transmission fiber; when the electrostatic chuck is assembled to the support structure, the lower surface of the electrostatic chuck to which the first transmission fiber is mounted and the support structure on which the second transmission fiber is mounted The first end of the first transmission fiber is in abutment with the first end of the second transmission fiber; wherein the first end of the first transmission fiber is located on a side of the lower surface of the electrostatic chuck; The first end of the second transmission fiber is located on one side of the upper surface of the support structure. The electrostatic chuck device of claim 1, wherein the first end of the first transmission fiber is flush with the lower surface of the electrostatic chuck, and the first end of the second transmission fiber and the upper surface of the support structure Qi Ping. The electrostatic chuck device of claim 1, wherein the first end of the first transmission fiber protrudes from the lower surface of the electrostatic chuck by a first length, and the first end of the second transmission fiber is supported from the support The upper surface of the structure is retracted into the first length. The electrostatic chuck device of claim 3, wherein the first length is no more than 2 mm. The electrostatic chuck device of claim 1, wherein the first end of the first transmission fiber is retracted from the lower surface of the electrostatic chuck by a second length, and the first end of the second transmission fiber is from the support structure The upper surface is retracted to the second length. The electrostatic chuck device of claim 5, wherein the second length is no more than 2 mm. The electrostatic chuck device of any one of claims 1 to 6, wherein the materials of the first transmission fiber and the second transmission fiber are different. The electrostatic chuck device of claim 7, wherein the material of the first transmission fiber is configured to withstand the temperature during operation of the electrostatic chuck, and the material configured to make the second transmission fiber can withstand the support structure. The temperature at work. The electrostatic chuck device according to any one of claims 1 to 6, wherein a first positioning structure is disposed on a lower surface side of the electrostatic chuck, and a second positioning structure is disposed on an upper surface side of the support structure. When the electrostatic chuck and the support structure are assembled, when the first positioning structure and the second positioning structure are aligned, the first end of the first transmission fiber and the first end of the second transmission fiber are butted. An electrostatic chuck device includes: an electrostatic chuck, a support structure configured to support the electrostatic chuck, and a fiber optic temperature sensor configured to measure the temperature of the electrostatic chuck, wherein the fiber temperature sensor includes a transmission fiber, The transmission fiber includes a first transmission fiber and a second transmission fiber; the material of the first transmission fiber is different from the material of the second transmission fiber; when the electrostatic chuck is assembled to the support structure, the first transmission fiber Mounted on the electrostatic chuck, the second transmission fiber is mounted on the support structure. The electrostatic chuck device of claim 10, wherein the material configured to fabricate the first transmission fiber is capable of withstanding the temperature during operation of the electrostatic chuck, and the material configured to make the second transmission fiber can withstand the support structure The temperature at work.