TWI577890B - Multi-function bladeless fan - Google Patents

Description

Cooling and heating dual-purpose fanless fan

The present invention relates to a fan, and more particularly to a fan in which the blade is not exposed and can switch between cold and hot air.

In the hot summer, the cool fan is a kind of standing appliance that is indispensable in life. The main purpose is to use the rotation of the blade to cause air circulation and generate wind to achieve the effect of reducing the temperature. However, the conventional fan is exposed due to the blade, and if the blade is accidentally dropped or the user's finger is inserted under the high-speed rotation of the blade, the blade is not only easily damaged, but also the user's finger is injured. Therefore, the conventional fan is convenient but has some danger.

In addition, the conventional fan is cooled by the rotation of the blade to make the air circulate, but if the temperature of the air itself is too high, the temperature of the wind generated by the blade will be higher, and the hot air will be formed, but the heat can not be cooled. effect. Moreover, the general blade rotation can only achieve the effect of cooling, which makes it impossible to use the fan in the cold winter. Therefore, the actual use time of the conventional fan is quite limited, which reduces the practicality of the conventional fan.

Therefore, one aspect of the present invention provides a fanless fan for cooling and heating, which not only hides the convection fan in the fan from being hidden in the body, but also installs a cooling chip set in front of the convection fan blade. By controlling the direction of current flow through the cooling chip module, the switching fan blows out cold air or hot air, which not only reduces the danger of the use of the fan, but also improves the utility of the fan.

According to an embodiment of the invention, a dual-use fanless fan includes a base, a hollow body, a convection fan blade, a cooling chip set, a wind collector, and a control module. The hollow body is mounted above the base and communicates with the base, and the hollow body has at least one air outlet and at least one heat dissipation port. The convection fan blade is installed in the base, and the wind direction of the convection fan blade faces the air outlet of the hollow body. The cooling chip set is erected in the hollow body and is interposed between the air outlet and the convection fan blade. The inner side of the periphery of the wind collector has an air supply opening, which communicates with the air outlet of the hollow body. The control module is electrically connected to the cooling chip set for controlling the direction of current flow through the cooling chip set.

According to an embodiment of the invention, the cooling and cooling wafer set of the dual-use fanless fan comprises at least one refrigerating wafer, and at least one rear fin group is attached to the back surface of the refrigerating wafer.

According to another embodiment of the present invention, the fan-cooling fan-and-fan fan further includes a front fin group disposed in the hollow body and located in front of the refrigerating wafer.

According to another embodiment of the present invention, the control module of the dual-use fanless fan is electrically connected to the convection fan to control the rotation speed of the convection fan blade.

According to another embodiment of the present invention, the above-mentioned dual-use fanless fan The hollow fuselage is composed of a front shell and a rear shell.

According to another embodiment of the present invention, the control module for the dual-use fanless fan includes a cold-hot switching unit for controlling the direction of current passing through the cooled wafer set, and a rotational speed control unit for controlling the rotational speed of the convection fan.

100‧‧‧Combined with fan and leaf

110‧‧‧Base

120‧‧‧ front case

122‧‧‧air outlet

130‧‧‧ rear case

132‧‧‧ vent

140‧‧‧Convection fan blades

142‧‧‧ fan leaves

150‧‧‧Cold chipset

152‧‧‧Chilled wafer

154‧‧‧ Rear heat sink

160‧‧‧Air collector

162‧‧‧ hollow round body

164‧‧‧Acceptance Department

166‧‧‧Air outlet

170‧‧‧Control Module

171‧‧‧Power input unit

172‧‧‧Power switch unit

174‧‧‧hot and cold switching unit

176‧‧‧Speed Control Unit

180‧‧‧Front heat sink

The above and other objects, features, advantages and embodiments of the present invention will become more <RTIgt; <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; Explosion diagram of the fan.

2 is a functional block diagram of a control module in accordance with an embodiment of the present invention.

FIG. 3A is a schematic diagram showing the appearance of a fan-and-fan fan for heating and cooling according to an embodiment of the invention.

Fig. 3B is a cross-sectional view taken along line 3B-3B of Fig. 3A.

FIG. 1 is an exploded view of a fan-and-fan fan for heating and cooling according to an embodiment of the invention. The dual-purpose fanless fan 100 includes a base 110, a front casing 120, a rear casing 130, a convection fan blade 140, a cooling chip set 150, a wind collector 160, and a control module 170.

The front casing 120 and the rear casing 130 are combined to form a hollow body without a bottom. It is disposed on the base 110 and communicates with the base 110 to form an accommodating space. According to an embodiment of the invention, the front casing 120 has an air outlet 122, and the rear casing 130 has a heat dissipation opening 132.

The convection fan blade 140 is mounted on the base 110, and the fan blade 142 faces the air outlet 122 on the front casing 120. In other words, the wind generated by the airflow caused by the rotation of the blade 142 is directed to the air outlet 122.

The cooling chip set 150 is erected in the hollow body formed by the front casing 120 and the rear casing 130, and is interposed between the air outlet 122 and the convection fan 140. The cooled wafer set 150 includes a cooled wafer 152 and a rear fin 154. The so-called upright arrangement refers to a substantially vertical relationship between the cooled wafer 152 and the convection fan blade 140. The rear fins 154 are attached to the back surface of the refrigerating wafer 152, and the rear fins 154 are aligned with the heat dissipating openings on the rear casing 132. According to an embodiment of the invention, the dual-purpose leafless fan 100 is provided with two sets of adjacent cooling chip sets 150 side by side.

The wind collector 160 has a hollow circular body 162 and a receiving portion 164. The receiving portion 164 is located at the bottom of the hollow circular body 162. The air collector 160 is mounted on the air outlet 122 of the front cabinet 120 by the receiving portion 164. The inner circumference of the hollow circular body 162 of the wind collector 160 has a blowing port 166, and the air blowing port 166 communicates with the air outlet 122 of the front casing 120.

The control module 170 is mounted in the hollow body and electrically connected to the cooled wafer 142 of the cooling chip set 140. The control module 170 is used to control the direction of current flow through the cooled wafer set 140. The foregoing cooling film 152 is mainly made of a semiconductor material, and when the current passes, the front surface of the cooling chip generates an endothermic effect to cool down, and the back surface (ie, the side opposite to the rear heat sink 154) generates an exothermic effect. Warm up. If current is made In the opposite direction, the heat absorption and heat release effects of the front and back sides of the cooled wafer are mutually adjusted, which is the so-called Hall effect. According to an embodiment of the present invention, the front surface of the cooling wafer 152 is provided with a front heat sink 180, and the rear surface of the cooling wafer 152 is provided with a rear heat sink 154. Since the temperature of the air surrounding the refrigerant wafer 152 is changed by the heat absorption or heat release of the refrigerant wafer 152, the front heat sink 180 and the rear heat sink 154 diffuse the air cooled or warmed by the heat absorption or heat release.

2 is a functional block diagram of a control module in accordance with an embodiment of the present invention. The control module 170 includes a power input unit 171, a power switch unit 172, a hot and cold switching unit 174, and a rotational speed control unit 176. The power input unit 171 is used to input an external current to the cold and warm fanless fan 100 of the present invention as a power source. The power input unit 171 is electrically connected to the power switch unit 172, and the power switch unit 172 is used to control whether the current enters the cold/warm fanless fan 100 of the present invention. The hot and cold switching unit 174 is electrically connected to the power switch unit 172, the rotational speed control unit 176, and the refrigerating wafer 152 at the same time. The cold-hot switching unit 174 is used to convert the direction of current flow through the chilled wafer 152. The rotation speed control unit 176 is electrically connected to the convection fan blade 140 for controlling the rotation speed of the convection fan blade 140. When the rotation speed is larger, the wind force is stronger. Conversely, the smaller the rotation speed, the weaker the wind force.

FIG. 3A is a schematic diagram showing the appearance of a fan-and-roller fan 100 for cooling and heating according to an embodiment of the invention. Fig. 3B is a cross-sectional view taken along line 3B-3B of Fig. 3A. Next, the state of the cold and warm fanless fan 100 of the present invention in actual operation will be described. Please refer to Figure 1, Figure 2 and Figure 3B at the same time. The power switch unit 172 is activated to cause current to enter the cold and warm fanless fan of the present invention via the power input unit 171. In the fan 100, the front side of the refrigerating wafer 152 is subjected to heat absorption by the hot and cold switching unit 174 to allow the current flowing through the refrigerating wafer 152. At this time, the back surface of the refrigerating wafer 152 is subjected to an exothermic effect, and the rear fins 154 are utilized. The hot air generated by the heat release is discharged from the heat radiating port 132 of the rear casing 130. At the same time, the cold air generated by the endothermic action of the front surface of the cooled wafer 152 is dispersed into the front casing 120 of the hollow body via the front fins 180. At this time, the hollow machine is further rotated by the bottom convection fan 140. The cold air in the front casing 120 of the body flows to generate cold air toward the air outlet 122 of the front casing 120, and finally, the cooled airflow is sent out through the air blowing port 166 of the air collector 160 to blow cold air.

Conversely, when the direction of the current flowing through the chilled wafer 152 is changed by the cold/hot switching unit 174, the front surface of the chilled wafer 152 is subjected to an exothermic effect, and at this time, the back surface of the chilled wafer 152 is subjected to endothermic action. The cold air generated by the endothermic action is discharged from the heat radiating port 132 of the rear casing 130 by the rear fins 154, and the hot air generated by the heat radiating action of the front surface of the cold fin 152 is dispersed to the hollow via the front fins 180. In the front casing 120 of the fuselage, the rotation of the bottom convection fan 140 causes the hot air in the front casing 120 of the hollow body to generate cold air toward the air outlet 122 of the front casing 120, and finally through the wind collector. The air supply port 166 of 160 is sent out to blow hot air.

In the above, the fan-and-fan fan of the present invention hides the convection fan that generates airflow and is hidden in the fuselage, thereby reducing the risk that the user may use. And a cooling chip set is arranged between the convection fan and the air outlet, and the control module controls the current direction flowing through the cooling chip group to change the heat release and heat absorption surface of the cooling chip, so that the airflow generated by the convection fan is heated Or cooling down, so that the fan-and-fan fan of the present invention can blow hot or cold air to extend the user's The time of the cold and warm dual-purpose fanless fan of the present invention can be used in the middle of the year to improve the practicality of the fan-and-fan fan of the present invention.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and the present invention can be modified and retouched without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached.

100‧‧‧Two-purpose fanless fan

110‧‧‧Base

120‧‧‧ front case

122‧‧‧air outlet

130‧‧‧ rear case

132‧‧‧ vent

140‧‧‧Convection fan blades

142‧‧‧ fan leaves

150‧‧‧Cold chipset

152‧‧‧Chilled wafer

154‧‧‧ Rear heat sink

160‧‧‧Air collector

162‧‧‧ hollow round body

164‧‧‧Acceptance Department

166‧‧‧Air outlet

170‧‧‧Control Module

180‧‧‧Front heat sink

Claims (4)

A fan-cooling dual-purpose fanless fan includes: a base; a hollow body mounted above the base and communicating with the base, and the hollow body has at least one upward air outlet and at least one rearward a pair of flow fans, the pair of flow blades are disposed in the base, and the wind direction of the convection fan faces the air outlet of the hollow body; the uniform cold chip set is erected in the hollow body, and is interposed therebetween Between the air outlet and the convection fan blade; a wind collector having an air supply opening on the inner side of the circumference, communicating with the air outlet of the hollow body; and a control module electrically connected to the cooling chip group Controlling the direction of current flow through the cooled wafer set; wherein the cooled wafer set includes at least a uniform cold wafer, at least one rear heat sink, and a front heat sink set, the rear heat sink being attached to the cooled wafer The back side is disposed in the rearward heat dissipation opening of the hollow body, and the front heat sink group is installed in the hollow body and located in front of the cooling chip group. The fan-cooling dual-purpose fanless fan of claim 1, wherein the control module is electrically connected to the convection fan blade for controlling the rotational speed of the convection fan blade. The fan-cooling fan-cooling fan according to claim 1, wherein the hollow body is composed of one The front shell and the rear shell are composed. The fan-cooling dual-purpose fanless fan according to claim 1, wherein the control module comprises: a cold-hot switching unit for controlling a current direction passing through one of the cooling chip sets; and a speed control unit for controlling The speed of the convection fan blade.