TWI575343B - Manufacturing process monitoring method - Google Patents
Manufacturing process monitoring method Download PDFInfo
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- TWI575343B TWI575343B TW104143270A TW104143270A TWI575343B TW I575343 B TWI575343 B TW I575343B TW 104143270 A TW104143270 A TW 104143270A TW 104143270 A TW104143270 A TW 104143270A TW I575343 B TWI575343 B TW I575343B
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Description
一種製程監控方法，尤指利用判斷裝置測量工件於加工裝置時之間隔時間，藉此得知工件於加工過程中是否有異常。 A process monitoring method, in particular, the judging device is used to measure the interval time of the workpiece in the processing device, thereby knowing whether the workpiece is abnormal during the processing.
按，現今為了能夠針對各種製程都能夠作異常檢測，許多投收板機與主設備上都有安裝三色燈，能夠知道製程故障在哪個設備上，但都僅限於使用者必須在機台旁邊直接透過目視看到狀態三色燈是否有發生異常，甚為不便。 Press, nowadays, in order to be able to detect abnormalities for various processes, many of the switching machines and the main equipment are equipped with three-color lights, which can know which device is on the process, but only the user must be next to the machine. It is very inconvenient to see through the visual view whether there is an abnormality in the state tri-color lamp.
是以，要如何解決上述習知之問題與缺失，即為相關業者所亟欲研發之課題所在。 Therefore, how to solve the above-mentioned problems and shortcomings is the subject of research and development that the relevant industry is eager to develop.
本發明之主要目的乃在於，利用判斷裝置之第一感測器與第二感測器測量工件於加工裝置時之間隔時間，能得知工件於加工過程中是否有異常，讓使用者無需位於加工裝置一旁進行監控，且微處理器可統計間隔時間，進而對標準作業時間更新，使標準作業時間範圍更加精確。 The main purpose of the present invention is to use the first sensor and the second sensor of the judging device to measure the interval between the workpiece and the processing device, and to know whether the workpiece is abnormal during the processing, so that the user does not need to be located. The processing device is monitored alongside, and the microprocessor can count the interval time to update the standard operating time to make the standard operating time range more accurate.
為達上述目的，本發明之製程監控方法包括有加工裝置以及判斷裝置，其中：該加工裝置設置有進料站、收料站以及進料站與收料站之間設置之複數工作站；該判斷裝置設置第一感測器、第二感測器、計時器以及微處理器，第一感測器、第二感測器分別連接於微處理器，第一感測器用以偵測加工裝置之進料站所投 送之工件，並於進料站投送工件時發出進料觸發信號至微處理器，第二感測器用以偵測加工裝置之收料站所接收之工件，並於收料站接收工件時發出收料觸發信號至微處理器，且微處理器係設置有標準作業時間，並用以接受第一感測器之進料觸發信號與第二感測器之收料觸發信號，且微處理器會計算該工件觸發第一感測器與觸發第二感測器的間隔時間，並將此時間比對標準作業時間，當工件觸發第一感測器與觸發第二感測器的間隔時間未於標準作業時間內，則判斷該工件可能發生異常，當工件觸發第一感測器與觸發第二感測器的間隔時間於標準作業時間內，則判斷該工件為正常。 In order to achieve the above object, the process monitoring method of the present invention includes a processing device and a judging device, wherein: the processing device is provided with a feeding station, a receiving station, and a plurality of workstations disposed between the feeding station and the receiving station; The device is provided with a first sensor, a second sensor, a timer and a microprocessor. The first sensor and the second sensor are respectively connected to the microprocessor, and the first sensor is used for detecting the processing device. Feeding station The workpiece is sent, and a feeding trigger signal is sent to the microprocessor when the workpiece is delivered at the feeding station, and the second sensor is used to detect the workpiece received by the receiving station of the processing device and receive the workpiece at the receiving station. Sending a receiving trigger signal to the microprocessor, and the microprocessor is set with standard working time, and is configured to receive the feeding trigger signal of the first sensor and the receiving trigger signal of the second sensor, and the microprocessor Calculating the interval between the triggering of the first sensor and the triggering of the second sensor, and comparing the time to the standard working time, when the workpiece triggers the interval between the first sensor and the second sensor is not During the standard working time, it is judged that the workpiece may be abnormal. When the workpiece triggers the interval between the first sensor and the second sensor to be within the standard working time, the workpiece is judged to be normal.
藉由上述之技術手段，本創作即可達到提升便利性、實用性與耐用性之功效。 With the above technical means, the creation can achieve the convenience, convenience and durability.
1‧‧‧加工裝置 1‧‧‧Processing device
11‧‧‧進料站 11‧‧‧ Feeding station
12‧‧‧收料站 12‧‧‧ receiving station
121‧‧‧第一暫存區 121‧‧‧First temporary storage area
122‧‧‧第二暫存區 122‧‧‧Second temporary storage area
13‧‧‧工作站 13‧‧‧Workstation
2‧‧‧判斷裝置 2‧‧‧Judgement device
21‧‧‧第一感測器 21‧‧‧First sensor
22‧‧‧第二感測器 22‧‧‧Second sensor
23‧‧‧計時器 23‧‧‧Timer
24‧‧‧微處理器 24‧‧‧Microprocessor
第一圖係為本發明之方塊圖。 The first figure is a block diagram of the present invention.
請參閱第一圖所示，由圖中可清楚看出，本發明之製程監控方法包括有加工裝置1以及判斷裝置2，其中： Referring to the first figure, it can be clearly seen from the figure that the process monitoring method of the present invention includes a processing device 1 and a judging device 2, wherein:
該加工裝置1設置有進料站11、收料站12以及進料站11與收料站12之間設置之複數工作站13，並於收料站12內設置有第一暫存區121與第二暫存區122。 The processing device 1 is provided with a feeding station 11, a receiving station 12, and a plurality of workstations 13 disposed between the feeding station 11 and the receiving station 12, and a first temporary storage area 121 and a first portion are disposed in the receiving station 12. Second temporary storage area 122.
該判斷裝置2設置第一感測器21、第二感測器22、計時器23以及微處理器24，第一感測器21、第二感測器22分別連接於微處理器24，第一感測器21用以偵測加工裝置1之進料站11所投送之工件，並於進料站11投送工件時發出進料觸發信號至微處理器24，第二感測器22用以偵測加工裝置1之收料站12所接收之工件，並於收料站12接收工件時發出收料觸發信號至微處 理器24，且微處理器24係設置有標準作業時間，並用以接受第一感測器21之進料觸發信號與第二感測器22之收料觸發信號，且微處理器24會計算該工件觸發第一感測器21與觸發第二感測器22的間隔時間，並將此時間比對標準作業時間，當工件觸發第一感測器21與觸發第二感測器22的間隔時間未於標準作業時間內，則判斷該工件可能發生異常，並將可能異常之工件放置於第二暫存區122；當工件觸發第一感測器21與觸發第二感測器22的間隔時間於標準作業時間內，則判斷該工件為正常，將正常之工件放置於第一暫存區121，上述之第二暫存區122內異常之工件會再進一步進行檢測。 The determining device 2 is provided with a first sensor 21, a second sensor 22, a timer 23 and a microprocessor 24. The first sensor 21 and the second sensor 22 are respectively connected to the microprocessor 24, A sensor 21 is configured to detect a workpiece delivered by the feeding station 11 of the processing device 1, and send a feeding trigger signal to the microprocessor 24 when the feeding station 11 delivers the workpiece. The second sensor 22 For detecting the workpiece received by the receiving station 12 of the processing device 1, and sending a receiving trigger signal to the micro place when the receiving station 12 receives the workpiece The microprocessor 24 is provided with a standard operating time and is configured to receive the feed trigger signal of the first sensor 21 and the receipt trigger signal of the second sensor 22, and the microprocessor 24 calculates The workpiece triggers the interval between the first sensor 21 and the second sensor 22, and compares the time to the standard working time. When the workpiece triggers the interval between the first sensor 21 and the second sensor 22 is triggered. If the time is not within the standard working time, it is judged that the workpiece may be abnormal, and the workpiece that may be abnormal is placed in the second temporary storage area 122; when the workpiece triggers the interval between the first sensor 21 and the second sensor 22 is triggered When the time is within the standard working time, the workpiece is judged to be normal, and the normal workpiece is placed in the first temporary storage area 121, and the abnormal workpiece in the second temporary storage area 122 is further detected.
請參閱第一圖所示，由圖中可清楚看出，本發明之製程監控方法，使用時，當工件從進料站11進行投料，該工件觸發第一感測器21時，第一感測器21會發出進料觸發信號至微處理器24，此時微處理器24會去抓取計時器23進料觸發當下之時間，當該工件位移至收料站12收板時，該工件會觸發第二感測器22，第二感測器22之收料觸發信號傳送至微處理器24，微處理器24會去抓取計時器23收料觸發當下之時間，當該工件加工結束時，所得到之間隔時間於標準作業時間內，間隔時間會與微處理器24之標準作業時間，透過微處理器24統計出一平均值，該平均值會設定成為微處理器24新的標準作業時間。 Referring to the first figure, it can be clearly seen from the figure that the process monitoring method of the present invention, when used, when the workpiece is fed from the feeding station 11, the workpiece first triggers the first sensor 21, the first sense The detector 21 will send a feed trigger signal to the microprocessor 24, at which time the microprocessor 24 will go to the capture timer 23 to trigger the current time, when the workpiece is displaced to the receiving station 12, the workpiece The second sensor 22 is triggered, and the receiving trigger signal of the second sensor 22 is transmitted to the microprocessor 24. The microprocessor 24 will grab the timer 23 to receive the triggering time, when the workpiece processing ends. When the interval is between the standard operating time and the standard operating time of the microprocessor 24, an average value is calculated by the microprocessor 24, and the average value is set to become the new standard of the microprocessor 24. Working time.
再者，也可利用工件加工結束時，所得到於標準作業時間內之間隔時間持續累計，利用微處理器24統計出於間隔時間之常態分佈中出現最多次數之間隔時間，將此間隔時間設定為微處理器24之新的標準作業時間。 Furthermore, when the workpiece processing is completed, the interval time obtained during the standard working time is continuously accumulated, and the microprocessor 24 counts the interval time of the maximum number of occurrences in the normal distribution of the interval time, and sets the interval time. It is the new standard operating time for the microprocessor 24.
1‧‧‧加工裝置 1‧‧‧Processing device
11‧‧‧進料站 11‧‧‧ Feeding station
12‧‧‧收料站 12‧‧‧ receiving station
121‧‧‧第一暫存區 121‧‧‧First temporary storage area
122‧‧‧第二暫存區 122‧‧‧Second temporary storage area
13‧‧‧工作站 13‧‧‧Workstation
2‧‧‧判斷裝置 2‧‧‧Judgement device
21‧‧‧第一感測器 21‧‧‧First sensor
22‧‧‧第二感測器 22‧‧‧Second sensor
23‧‧‧計時器 23‧‧‧Timer
24‧‧‧微處理器 24‧‧‧Microprocessor
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104143270A TWI575343B (en) | 2015-12-23 | 2015-12-23 | Manufacturing process monitoring method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104143270A TWI575343B (en) | 2015-12-23 | 2015-12-23 | Manufacturing process monitoring method |
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| Publication Number | Publication Date |
|---|---|
| TWI575343B true TWI575343B (en) | 2017-03-21 |
| TW201723697A TW201723697A (en) | 2017-07-01 |
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|---|---|---|---|
| TW104143270A TWI575343B (en) | 2015-12-23 | 2015-12-23 | Manufacturing process monitoring method |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6556949B1 (en) * | 1999-05-18 | 2003-04-29 | Applied Materials, Inc. | Semiconductor processing techniques |
| CN1625722A (en) * | 2002-04-30 | 2005-06-08 | 先进微装置公司 | Agent reactive scheduling in an automated manufacturing environment |
| CN101498921A (en) * | 2009-02-26 | 2009-08-05 | 晶澳（扬州）太阳能科技有限公司 | Method for automatically monitoring fragmentation rate in solar cell processing course |
| CN101572280A (en) * | 2009-06-01 | 2009-11-04 | 无锡尚德太阳能电力有限公司 | Deposition apparatus for manufacturing metal electrode layer of thin film solar cell |
| TW201248342A (en) * | 2011-05-26 | 2012-12-01 | Topcell Solar Internat Co Ltd | Method of automatically monitoring process |
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2015
- 2015-12-23 TW TW104143270A patent/TWI575343B/en active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6556949B1 (en) * | 1999-05-18 | 2003-04-29 | Applied Materials, Inc. | Semiconductor processing techniques |
| CN1625722A (en) * | 2002-04-30 | 2005-06-08 | 先进微装置公司 | Agent reactive scheduling in an automated manufacturing environment |
| CN101498921A (en) * | 2009-02-26 | 2009-08-05 | 晶澳（扬州）太阳能科技有限公司 | Method for automatically monitoring fragmentation rate in solar cell processing course |
| CN101572280A (en) * | 2009-06-01 | 2009-11-04 | 无锡尚德太阳能电力有限公司 | Deposition apparatus for manufacturing metal electrode layer of thin film solar cell |
| TW201248342A (en) * | 2011-05-26 | 2012-12-01 | Topcell Solar Internat Co Ltd | Method of automatically monitoring process |
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| TW201723697A (en) | 2017-07-01 |
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