TWI575280B - Lc testing platform and the method for the same - Google Patents
Lc testing platform and the method for the same Download PDFInfo
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本發明大體上相關於液晶面板測試平台領域,特定而言,係液晶面板測試平台之智能接觸判斷裝置。 The present invention relates generally to the field of liquid crystal panel test platforms, and more particularly to smart contact judging devices for liquid crystal panel test platforms.
隨著顯示技術發展,液晶面板已取代CRT顯示器,成為現代社會顯示裝置的主流,也為每個家庭或公司不可或缺的設備之一。液晶面板開始被大量製造,而不同尺寸、類型或超高解析度之液晶面板也相應而生。一般而言液晶面板可因反射式或透射式分為薄膜電晶體液晶或矽基液晶。 With the development of display technology, liquid crystal panels have replaced CRT monitors, becoming the mainstream of modern social display devices, and also one of the indispensable devices for every home or company. Liquid crystal panels are beginning to be mass-produced, and liquid crystal panels of different sizes, types, or ultra-high resolutions are correspondingly produced. In general, a liquid crystal panel can be classified into a thin film transistor liquid crystal or a germanium based liquid crystal by a reflective or transmissive type.
矽基液晶又稱液晶矽基板(Liquid Crystal On Silicon,LCOS)其結構與薄膜電晶體液晶(TFT-LCD)相類似,TFT-LCD是在上下兩塊玻璃基板中灌入液晶,而LCOS則是以CMOS製程形成的驅動電路作為下層基板。 矽-based liquid crystal, also known as liquid crystal on silicon (LCOS), has a structure similar to that of thin film transistor liquid crystal (TFT-LCD). TFT-LCD is filled with liquid crystal in the upper and lower glass substrates, while LCOS is A driving circuit formed in a CMOS process is used as the underlying substrate.
矽基液晶(LCOS)與傳統液晶面板(穿透式)製作的不同之處,是在於矽基液晶底層電極是以金屬鏡代替透明的透明導電膜(Indium Tin Oxide,ITO),並將單晶互補金屬氧化物半導體(CMOS)做在晶片內,與一般液晶面板結構最大的區別便是反射光的應用。 The difference between the 矽-based liquid crystal (LCOS) and the conventional liquid crystal panel (transmissive) is that the 矽-based liquid crystal underlying electrode is replaced by a transparent mirror (Indium Tin Oxide, ITO) with a metal mirror, and the single crystal Complementary metal oxide semiconductor (CMOS) is fabricated in a wafer, and the biggest difference from a typical liquid crystal panel structure is the application of reflected light.
反射式設計是入射光到達像素的反射電極就折回,電極下面的電晶體及其他線路不會干擾入射光或反射光,因此面板的光利用效率可大為提昇,另一方面,矽基液晶上微小電路的整合,可以提高驅動效率及可靠度,並且可在大型積體電路工廠大量生產,有助成本調降。綜上而言,矽基液晶的低成本與高解析度是此類反射式矽基液晶在液晶面板業界中最具有吸引力之優勢。 The reflective design is that the incident light reaches the reflective electrode of the pixel and is folded back. The transistor and other lines under the electrode do not interfere with the incident light or the reflected light, so the light utilization efficiency of the panel can be greatly improved. On the other hand, the 矽-based liquid crystal is used. The integration of tiny circuits can improve drive efficiency and reliability, and can be mass-produced in large integrated circuit factories, helping to reduce costs. In summary, the low cost and high resolution of germanium-based liquid crystals are the most attractive advantages of such reflective germanium-based liquid crystals in the liquid crystal panel industry.
對於矽基液晶產品,通常而言,可對其功能性或影像進行檢測,對於功能性之檢測而言,可在一檢測環境或檢測技術下測試LCOS內部電路之正確性,舉例而言,開路(Open)、短路(Short)及洩漏(Leakage)之類之電壓電流的測試或內部記憶體等的功能測試;對於影像上之檢測,可在檢測技術或檢測環境下檢查產品表驗的缺陷,例如,表面及內部髒污確認,以及產品的投影功 能測試。 For 矽-based liquid crystal products, generally, the functionality or image can be detected. For functional detection, the correctness of the internal circuit of LCOS can be tested under a test environment or detection technology. For example, open circuit Test of voltage and current such as (Open), Short and Leakage, or functional test of internal memory; for image detection, the defects of the product inspection may be checked under the detection technology or the detection environment. For example, surface and internal contamination confirmation, as well as product projection work Can test.
為了對矽基液晶產品進行檢測,常使用一測試平台,此品台包括了功能性測試及影像測試兩部分。通常而言,在一基座中,一轉接板與一矽基液晶產品耦接後,此轉接板可與影像測試板耦接進行影像測試以檢測矽基液晶產品之缺陷;另一方面轉接板經移動後,可與一功能測試板耦接以測試矽基液晶產品之功能性。 In order to test the 矽-based liquid crystal products, a test platform is often used. This product platform includes two parts: functional test and image test. Generally, in a pedestal, after an adapter board is coupled to a 矽-based liquid crystal product, the adapter board can be coupled to the image test board for image testing to detect defects of the silli-based liquid crystal product; After the adapter board is moved, it can be coupled to a functional test board to test the functionality of the silicon-based liquid crystal product.
承上所述,為進行影像測試,在一測試環境下,轉接板需與影像測試板進行有效之耦接,進一步而言,轉接板上之針腳必須與對準影像測試板上之金屬墊以進行有效耦接。在調整測試環境時,通常轉接板已固定,故將影像測試板之所有金屬墊對準轉接板上相對應之針腳。由於測試平台、轉接板及測試板基座通常會形成視覺上之死角,在調整位置時無法直接觀測轉接板與影像測試板是否有效對準。另一方面,若影像測試板之一軸已對準轉接板,另一軸稍有偏差,造成兩板之間夾一偏差角,則此時影像測試板及轉接板則不為有效對準。 As described above, in order to perform image testing, the adapter board needs to be effectively coupled to the image test board in a test environment. Further, the pins on the adapter board must be aligned with the metal on the image test board. Pad for effective coupling. When adjusting the test environment, usually the adapter plate is fixed, so align all the metal pads of the image test board with the corresponding pins on the adapter plate. Since the test platform, the adapter board, and the test board base usually form a visual dead angle, it is impossible to directly observe whether the adapter plate and the image test board are effectively aligned when adjusting the position. On the other hand, if one of the axes of the image test board is aligned with the adapter plate and the other axis is slightly offset, causing a deviation angle between the two plates, the image test board and the adapter plate are not effectively aligned.
在進行轉接板與影像測試板之耦接架設時,往往因為測試空間較狹小或基座中之設備擋住視線,使得影像測試板及轉接板難以對準,即使可藉由相機影像來確認影像測試板與轉接板是否正確耦接及有效對準,然而卻不夠直觀,無法藉由影像來進行更準確的調整,需花費許多時間調整影像測試板及轉接板之位置,因此造成測試硬體的調整效率不佳,也造成測試環境的不穩定性。 When the adapter plate and the image test board are coupled and erected, the test test space and the adapter plate are difficult to align because the test space is narrow or the device in the pedestal blocks the line of sight, even if it can be confirmed by camera image. The image test board and the adapter board are properly coupled and effectively aligned, but they are not intuitive enough to be more accurately adjusted by the image. It takes a lot of time to adjust the position of the image test board and the adapter board, thus causing the test. The poor adjustment efficiency of the hardware also causes instability in the test environment.
有鑑於上述習知測試平台的缺失,本發明即用解決上述之問題。本發明之一目的在於提供一種液晶面板測試平台,改進習知測試平台在影像測試板及轉接板無法準確對準之問題。意即,本發明之液晶面板測試平台之智能接觸判斷裝置,在調整影像測試板及轉接板之位置時利於判斷影像測試板及轉接板是否能有效對準,在測試產品的過程中不需不斷地藉由觀察相機影像來調整影像測試板及轉接板之位置,而是使用本發明之智能接觸判斷裝置來做準確之調節,以達到測試環境穩定性之要求。 In view of the above-mentioned lack of the conventional test platform, the present invention solves the above problems. An object of the present invention is to provide a liquid crystal panel test platform, which improves the problem that the conventional test platform cannot be accurately aligned in the image test board and the adapter board. That is, the intelligent contact judging device of the liquid crystal panel test platform of the present invention is convenient for judging whether the image test board and the interposer board can be effectively aligned when adjusting the position of the image test board and the interposer board, and is not in the process of testing the product. It is necessary to constantly adjust the position of the image test board and the adapter board by observing the camera image, and use the intelligent contact judging device of the present invention to make accurate adjustments to meet the requirements of the stability of the test environment.
為了達到上揭之目的及其他目的,本發明提供本發明提供一種液晶面板測試平台,至少包含:一影像測試板,具有至少一偵測針腳;一轉接板, 配置於影像測試板之對面,具有至少一金屬墊;以及一智能接觸判斷裝置,與該影像測試板及該轉接板耦接,該智能接觸判斷裝置至少包含:至少一發光二極體,耦接至少一金屬墊;以及至少一電路,耦接至少一偵測針腳,其中電路具有一電阻,以及其中當該至少一金屬墊接觸至少一偵測針腳時,發光二極體與電路電性耦接,以利於判斷轉接板與影像測試板是否對準。 The present invention provides a liquid crystal panel test platform, comprising at least: an image test board having at least one detecting stitch; and an adapter board. The device is disposed on the opposite side of the image test board and has at least one metal pad; and an intelligent contact judging device coupled to the image test board and the interposer, the smart contact judging device comprising: at least one light emitting diode, coupled Connecting at least one metal pad; and at least one circuit coupled to the at least one detecting pin, wherein the circuit has a resistor, and wherein the light emitting diode is electrically coupled to the circuit when the at least one metal pad contacts the at least one detecting pin Connect to determine if the adapter plate and the image test board are aligned.
為達上述所有目的,其中液晶面板為矽基液晶(LCOS)。 For all of the above purposes, the liquid crystal panel is a germanium based liquid crystal (LCOS).
為達上述所有目的,其中該至少一偵測針腳短於該影像測試板之至少一訊號針腳,以利於對該影像測試板進行接觸判斷。 For all of the above purposes, the at least one detection pin is shorter than the at least one signal pin of the image test board to facilitate contact determination of the image test board.
為達上述所有目的,其中該至少一偵測針腳之長度短於該至少一訊號針腳長度之80%。 For all of the above purposes, the length of the at least one detection pin is shorter than 80% of the length of the at least one signal pin.
為達上述所有目的,其中該至少一偵測針腳位於該影像測試板所有針腳中的四個角落,以利於判斷該影像測試板與該轉接板三維方向之對準狀況。 For all of the above purposes, the at least one detection pin is located at four corners of all the pins of the image test board to facilitate determining the alignment of the image test board with the three-dimensional direction of the adapter plate.
為達上述所有目的,其中該電路之供電電壓為3.3V。 For all of the above purposes, the supply voltage of the circuit is 3.3V.
本發明之另一目的在於提供一種矽基液晶測試平台之智能接觸方法,改進習知測試平台在影像測試板及轉接板無法準確對準之問題。意即,本發明之矽基液晶測試平台之智能接觸方法,在調整影像測試板及轉接板之位置時利於判斷影像測試板及轉接板是否能有效對準,在測試產品的過程中不需不斷地藉由觀察相機影像來調整影像測試板及轉接板之位置,而是觀看本發明之智能接觸判斷裝置來做準確之調節,以達到測試環境之要求。 Another object of the present invention is to provide a smart contact method for a germanium-based liquid crystal test platform, which improves the problem that the conventional test platform cannot be accurately aligned in the image test board and the adapter board. That is, the intelligent contact method of the 矽-based liquid crystal test platform of the present invention facilitates judging whether the image test board and the adapter board can be effectively aligned when adjusting the position of the image test board and the adapter board, and does not during the test of the product. The position of the image test board and the adapter board needs to be constantly adjusted by observing the camera image, and the intelligent contact judging device of the present invention is viewed to make accurate adjustments to meet the requirements of the test environment.
為了達到上揭之目的及其他目的,本發明提供一種用於液晶面板測試平台之智能接觸判斷方法,智能接觸判斷方法包含:將至少一發光二極體耦接一轉接板之至少一金屬墊;將至少一電路耦接一影像測試板之至少一偵測針腳;以及當至少一金屬墊接觸偵測針腳使得至少一電路與至少一發光二極體電性耦接,則轉接板對準影像測試板。 In order to achieve the above object and other objects, the present invention provides an intelligent contact judging method for a liquid crystal panel test platform. The smart contact judging method includes: coupling at least one light emitting diode to at least one metal pad of an interposer At least one circuit is coupled to at least one detecting pin of an image test board; and when at least one metal pad contacts the detecting pin such that at least one circuit is electrically coupled to the at least one light emitting diode, the adapter plate is aligned Image test board.
為達上述所有目的,其中包含步驟:使用該影像測試板中較短之針腳做為偵測針腳。 For all of the above purposes, the steps include: using the shorter pins of the image test board as the detection pins.
為達上述所有目的,其中包含步驟:使用該影像測試板中較訊號針腳短20%之針腳做為偵測針腳。 For all of the above purposes, the steps include: using the pin of the image test board that is 20% shorter than the signal pin as the detection pin.
為達上述所有目的,其中包含步驟:該至少一偵測針腳位於該影 像測試板之四個角落,利用該至少一發光二極體之發光數量來判斷該轉接板是否對準該影像測試板。 For all of the above purposes, the method includes the steps of: the at least one detection pin is located in the shadow The four corners of the test board are used to determine whether the adapter board is aligned with the image test board by using the number of illuminations of the at least one LED.
為達上述所有目的,其中包含步驟:設定該電路之阻值,以增強該至少一偵測針腳是否對準該至少一金屬墊之判斷準確度。 For all of the above purposes, the method includes the steps of: setting a resistance of the circuit to enhance the determination accuracy of whether the at least one detection pin is aligned with the at least one metal pad.
相較於先前習知技術,根據本發明之用於矽基液晶測試平台之智能接觸判斷裝置及方法,除了能不需觀看影像來進行轉接板與影像測試板之位置配置外,更能達到有效與迅速對準之功效。 Compared with the prior art, the smart contact judging device and method for the sputum-based liquid crystal test platform according to the present invention can achieve the positional configuration of the interposer and the image test board without viewing the image. Effective and rapid alignment.
以上所述係用以說明本發明之目的、技術手段以及其可達成之功效,相關領域內熟悉此技術之人可以經由以下實施例之示範與伴隨之圖式說明及申請專利範圍更清楚明瞭本發明。 The above is to clarify the purpose, technical means and achievable effects of the present invention, and those skilled in the relevant art can clarify the present invention through the following examples and accompanying drawings and patent claims. invention.
100‧‧‧智能接觸判斷裝置 100‧‧‧Intelligent contact judgment device
110、210、310、410‧‧‧影像測試板 110, 210, 310, 410‧‧‧ image test board
112、312、412‧‧‧偵測針腳 112, 312, 412‧‧‧ detection stitches
120、220、320、420‧‧‧轉接板 120, 220, 320, 420‧‧‧ adapter plates
122、322、422‧‧‧金屬墊 122, 322, 422‧‧‧ metal pads
130、330、430‧‧‧發光二極體 130, 330, 430‧‧‧Lighting diodes
140、340、440‧‧‧電路 140, 340, 440‧‧‧ circuits
142‧‧‧電阻 142‧‧‧resistance
216‧‧‧測試板基座 216‧‧‧Test board base
250、350‧‧‧測試載座 250, 350‧‧‧ test carrier
260‧‧‧功能測試板 260‧‧‧ functional test board
313‧‧‧訊號針腳 313‧‧‧Signal pins
500‧‧‧用於矽基液晶測試平台之智能接觸判斷方法 500‧‧‧Intelligent contact judgment method for silicon-based liquid crystal test platform
510‧‧‧將發光二極體耦接轉接板之金屬墊 510‧‧‧Connecting the light-emitting diode to the metal pad of the adapter plate
520‧‧‧將電路耦接影像測試板之偵測針腳 520‧‧‧Connecting the circuit to the detection pin of the image test board
530‧‧‧當金屬墊接觸偵測針腳使得電路與發光二極體電性耦接,則轉接板對準影像測試板 530‧‧‧ When the metal pad contacts the detection pin so that the circuit is electrically coupled to the LED, the adapter plate is aligned with the image test board
540‧‧‧使用影像測試板中較短之針腳做為偵測針腳 540‧‧‧Use the shorter pins in the image test board as the detection pin
550‧‧‧使用影像測試板中較訊號針腳長度80%之針腳做為偵測針腳 550‧‧‧Use the pin of the image test board that is 80% longer than the signal pin length as the detection pin
560‧‧‧至少一偵測針腳位於影像測試板之四個角落,利用至少一發光二極體之發光數量來判斷轉接板是否對準該影像測試板 560‧‧‧ At least one detection pin is located at four corners of the image test board, and the number of illuminations of at least one of the light-emitting diodes is used to determine whether the adapter plate is aligned with the image test board
570‧‧‧設定電路之阻值,以增強至少一偵測針腳是否對準至少一金屬墊之判斷準確度 570‧‧‧Set the resistance of the circuit to enhance the accuracy of at least one detection pin alignment with at least one metal pad
900‧‧‧測試平台 900‧‧‧Test platform
如下所述之對本發明的詳細描述與實施例之示意圖,應使本發明更被充分地理解;然而,應可理解此僅限於作為理解本發明應用之參考,而非限制本發明於一特定實施例之中。 The present invention will be more fully understood from the following detailed description of the embodiments of the invention, and In the example.
圖1A係根據本發明之一實施例說明液晶面板測試平台之智能接觸判斷裝置之基本架構示意圖。 1A is a schematic diagram showing the basic structure of an intelligent contact judging device for a liquid crystal panel test platform according to an embodiment of the present invention.
圖1B係根據本發明之一實施例說明液晶面板測試平台之智能接觸判斷裝置之基本架構示意圖。 FIG. 1B is a schematic diagram showing the basic structure of an intelligent contact judging device for a liquid crystal panel test platform according to an embodiment of the invention.
圖2係根據本發明之一實施例說明液晶面板檢測平台之架構示意圖。 2 is a schematic structural diagram of a liquid crystal panel detection platform according to an embodiment of the invention.
圖3係根據本發明之一實施例說明液晶面板測試平台之智能接觸判斷裝置之偵測針腳示意圖。 FIG. 3 is a schematic diagram showing the detection pin of the smart contact judging device of the liquid crystal panel test platform according to an embodiment of the invention.
圖4係根據本發明之一實施例說明液晶面板測試平台之智能接觸判斷裝置之偵測針腳示意圖。 4 is a schematic diagram showing the detection pin of the smart contact judging device of the liquid crystal panel test platform according to an embodiment of the invention.
圖5係根據本發明之一實施例說明液晶面板測試平台之智能接觸判斷之方法流程圖。 FIG. 5 is a flow chart illustrating a method for intelligent contact determination of a liquid crystal panel test platform according to an embodiment of the invention.
以下藉由特定的具體實施例說明本發明之實施方式,經由說明書中所揭示之內容,熟悉該領域中之技術者將領會多媒體訊號傳輸裝置及其傳輸方法,並能輕易地瞭解本發明之功效與優點。然該領域之熟習技藝者須瞭解本 創作亦可在不具備這些細節之條件下實行。此外,文中不會對一些已熟知之結構或功能或是作細節描述,以避免各種實施例間不必要相關描述之混淆,以下描述中使用之術語將以最廣義的合理方式解釋,即使其與本創作某特定實施例之細節描述一起使用。 The embodiments of the present invention will be described below by way of specific embodiments. Those skilled in the art will appreciate the multimedia signal transmission device and its transmission method, and can easily understand the efficacy of the present invention. And advantages. However, those skilled in the field must understand this Creation can also be carried out without these details. In addition, some well-known structures or functions may be described or described in detail to avoid obscuring the description of the various embodiments. The terms used in the following description will be interpreted in the broadest sense, even if A detailed description of a particular embodiment of the present work is used together.
本發明將以較佳實施例及觀點加以敘述以解釋本發明之結構,僅用來說明而非用以限制本發明之申請專利範圍,因此,除說明書中之較佳實施例外,本發明亦可廣泛實行於其他實施例中。 The present invention will be described in terms of the preferred embodiments and the aspects of the present invention, which are intended to illustrate and not to limit the scope of the invention. It is widely practiced in other embodiments.
本發明之液晶面板測試平台,適用於液晶產品之檢測,可包括透射式液晶,例如,薄膜電晶體液晶(TFT-LCD),或反射式液晶,例如,矽基液晶(LCOS),應注意的是,在此之液晶(液晶面板)僅為舉例而非用以限制,在不違背本發明之發明範疇下,還可為其他不同種類之液晶(面板)。以下各種實施例,係以矽基液晶(LCOS)做為解釋及舉例,非為限制,而俾利於說明本發明之結構及由本發明不同類型之態樣。 The liquid crystal panel test platform of the present invention is suitable for the detection of liquid crystal products, and may include a transmissive liquid crystal, for example, a thin film transistor liquid crystal (TFT-LCD), or a reflective liquid crystal, for example, a germanium-based liquid crystal (LCOS), which should be noted. It is to be noted that the liquid crystal (liquid crystal panel) herein is merely an example and not intended to be limiting, and other kinds of liquid crystals (panels) may be used without departing from the scope of the invention. The following various embodiments are based on the explanation and examples of the quinone-based liquid crystal (LCOS), and are not intended to limit the structure of the present invention and the different types of the present invention.
第一實施例First embodiment
圖1A係根據本發明之一實施例說明矽基液晶測試平台之智能接觸判斷裝置之基本架構示意圖。參閱圖1A所示,在一實施例中,本發明之矽基液晶測試平台900,至少包含:一影像測試板110,具有至少一偵測針腳112;一轉接板120,配置於影像測試板110之對面,具有至少一金屬墊122;以及一智能接觸判斷裝置100,與影像測試板110及轉接板120耦接,智能接觸判斷裝置100至少包含:至少一發光二極體130,耦接至少一金屬墊122;以及至少一電路140,耦接至少一偵測針腳112,其中電路140具有一電阻142,以及其中當至少一金屬墊122接觸至少一偵測針腳112時,發光二極體130與電路電性耦接140,以利於判斷轉接板120與影像測試板112是否對準。 1A is a schematic diagram showing the basic structure of an intelligent contact judging device for a silli-based liquid crystal test platform according to an embodiment of the present invention. As shown in FIG. 1A, in an embodiment, the 矽-based liquid crystal test platform 900 of the present invention comprises at least one image test board 110 having at least one detecting pin 112, and an adapter board 120 disposed on the image test board. Opposite the 110, having at least one metal pad 122; and a smart contact determining device 100 coupled to the image test board 110 and the adapter plate 120, the smart contact determining device 100 includes at least one light emitting diode 130 coupled At least one metal pad 122; and at least one circuit 140 coupled to the at least one detecting pin 112, wherein the circuit 140 has a resistor 142, and wherein the at least one metal pad 122 contacts the at least one detecting pin 112, the light emitting diode The 130 is electrically coupled to the circuit 140 to facilitate determining whether the adapter plate 120 and the image test board 112 are aligned.
參閱圖1A所示,在一實施例中,與矽基液晶產品500(未顯示於圖1)耦接之一轉接板120,在與影像測試板110做接觸及有效對準後,可對矽基液晶產品500進行測試,其中轉接板120上具有許多金屬墊122,而影像測試板110上則具有許多針腳。在一實施例中,測試平台之使用者可架設一智能接觸判斷裝置100以進行影像測試板110與轉接板120之正確耦接及有效對準,對於一智能接觸判斷裝置而言,可在許多針腳中自行設定一個以上之偵測針腳112,此測試針腳112將連接一電路140,電路140上則具有一電阻142,此電阻142 可為可變電阻或固定電阻,使用者可調整阻值,電路之元件不限於此,在不脫離本發明範疇下,還可包括一電源,以及其他電子元件,在正常狀況下可使得發光二極體130正常運作。另一方面,轉接板120之金屬墊122則耦接至少一發光二極體130,舉例而言,可為四個發光二極體130。 As shown in FIG. 1A, in an embodiment, an adapter plate 120 is coupled to the silicon-based liquid crystal product 500 (not shown in FIG. 1), and after being in contact with and effectively aligned with the image test panel 110, The germanium based liquid crystal product 500 was tested with a plurality of metal pads 122 on the adapter plate 120 and a plurality of pins on the image test board 110. In an embodiment, the user of the test platform can set up a smart contact judging device 100 for correct coupling and effective alignment of the image test board 110 and the interposer 120. For an intelligent contact judging device, One or more detection pins 112 are set by themselves in a plurality of pins. The test pin 112 is connected to a circuit 140, and the circuit 140 has a resistor 142. The resistor 142 It can be a variable resistor or a fixed resistor, and the user can adjust the resistance. The components of the circuit are not limited thereto, and may include a power source and other electronic components without departing from the scope of the present invention. The polar body 130 operates normally. On the other hand, the metal pad 122 of the interposer 120 is coupled to the at least one LED 130, for example, four LEDs 130.
圖1B係根據本發明之一實施例說明矽基液晶測試平台之智能接觸判斷裝置之基本架構示意圖。參閱圖1B,在一實施例中,測試平台使用者調整影像測試板及轉接板之位置,目的為使影像測試板110與轉接板120可互相接觸。應注意的是,在此之影像測試板110及轉接板120位置之調整,可包括兩個板三維方向之微調,舉例而言,影像測試板110可做上下之微調、前後之微調,但不以此為限,應視測試環境之需求,舉例而言,影像測試板110可為固定而只移動轉接板120來進行接觸。在一實施例中,可藉由觀看矽基液晶產品500之影像是否正確再進行影像測試板110及轉接板120位置之調整。 FIG. 1B is a schematic diagram showing the basic structure of an intelligent contact judging device for a silli-based liquid crystal test platform according to an embodiment of the present invention. Referring to FIG. 1B, in an embodiment, the test platform user adjusts the position of the image test board and the adapter board in order to make the image test board 110 and the adapter board 120 contact each other. It should be noted that the adjustment of the position of the image test board 110 and the adapter board 120 may include fine adjustment of the three-dimensional direction of the two boards. For example, the image test board 110 may be fine-tuned up and down, and fine-tuned before and after, but Without limitation, depending on the needs of the test environment, for example, the image test board 110 may be fixed and only move the adapter plate 120 for contact. In one embodiment, the position of the image test board 110 and the adapter board 120 can be adjusted by viewing whether the image of the liquid crystal based product 500 is correct.
參閱圖1B所示,在一實施例中,當影像測試板110與轉接板120耦接,其金屬墊122與偵測針腳112相接觸並達成有效對準,則發光二極體130與電路140電性耦接,形成通路,在此條件下發光二極體130將發光以提示使用者,而利於判斷轉接板120與影像測試板112是否對準。 As shown in FIG. 1B , in an embodiment, when the image test board 110 is coupled to the adapter board 120 and the metal pad 122 is in contact with the detecting pin 112 and achieves effective alignment, the LED and the circuit are electrically connected. The electrical coupling is 140 to form a path. Under this condition, the LED 130 will emit light to prompt the user, and it is convenient to determine whether the adapter plate 120 and the image test board 112 are aligned.
參閱圖1B所示,在一實施例中,測試平台900之使用者可自行配置或調整發光二極體130之發光電路,舉例而言,當具有兩個以上之發光二極體時,配置一串聯電路,使不同的發光二極體具有相同之電流,在此時,總順向偏壓在串聯時就等於每個發光二極體130順向偏壓的總和。除此之外,還可設定多個限流電阻分別對個別發光二極體串來做電流控制。此外,此電路140易可為並聯電路,以保持多個發光二極體130發光之獨立性。應注意的是,在此藉由影像測試板110與轉接板120互相對準所達成之發光二極體130之實施例,僅為舉例而發加以限制,在不背離本發明範疇下,舉凡發光二極體130之數量、發光二極體130之種類、電源電壓大小、電阻阻值、串並聯方式及發光二極體放置方式,皆為使用者可對其測試平台或測試環境之方便性或穩定性所調設;基於以上係屬電子電路通常已知架構,故在此不加贅述。 As shown in FIG. 1B, in an embodiment, a user of the test platform 900 can configure or adjust the light-emitting circuit of the LED 130. For example, when there are two or more LEDs, one is configured. The series circuit is such that the different light-emitting diodes have the same current, and at this time, the total forward bias is equal to the sum of the forward bias of each of the light-emitting diodes 130 in series. In addition, a plurality of current limiting resistors can be set to perform current control on individual LED strings. In addition, the circuit 140 can be a parallel circuit to maintain the independence of the illumination of the plurality of LEDs 130. It should be noted that the embodiment of the light-emitting diode 130 achieved by the image test board 110 and the adapter board 120 being aligned with each other is limited by way of example, without departing from the scope of the invention. The number of the light-emitting diodes 130, the type of the light-emitting diode 130, the power supply voltage, the resistance value, the series-parallel method, and the arrangement of the light-emitting diodes are all convenient for the user to test the platform or the test environment. Or the stability is set; based on the above-mentioned electronic circuits are generally known architecture, so no further details are provided here.
第二實施例Second embodiment
圖2係根據本發明之一實施例說明矽基液晶檢測平台之架構示意圖。參閱圖2所示,在一實施例中,測試平台900包含轉接板220,轉接板 220與一測試載座250連接,測試載座250放置矽基液晶產品500,影像測試板210則由一測試板基座216固定,而測試板基座216具有螺絲可對影像測試板210之位置進行微調。舉例而言,將測試板基座216向轉接板220方向微調。參閱圖1A及圖2所示,智能接觸判斷裝置100,與影像測試板210及該轉接板220耦接,智能接觸判斷裝置100至少包含:至少一發光二極體130,耦接轉接板之金屬墊122;以及一電路140,耦接影像測試板210之偵測針腳212,其中電路140具有一電阻142,以及其中當至少一金屬墊122接觸至少一偵測針腳112時,發光二極體130與電路電性耦接140,以利於判斷轉接板120與影像測試板112是否對準。 2 is a schematic diagram showing the architecture of a germanium-based liquid crystal detection platform according to an embodiment of the present invention. Referring to FIG. 2, in an embodiment, the test platform 900 includes an adapter plate 220, an adapter plate. 220 is connected to a test carrier 250, the test carrier 250 is placed on the silicon-based liquid crystal product 500, the image test board 210 is fixed by a test board base 216, and the test board base 216 has a screw position on the image test board 210. Make fine adjustments. For example, the test board base 216 is finely adjusted toward the adapter plate 220. As shown in FIG. 1A and FIG. 2, the smart contact judging device 100 is coupled to the image test board 210 and the interposer 220. The smart contact judging device 100 includes at least one light emitting diode 130 coupled to the interposer board. a metal pad 122; and a circuit 140 coupled to the detecting pin 212 of the image test board 210, wherein the circuit 140 has a resistor 142, and wherein the at least one metal pad 122 contacts the at least one detecting pin 112, the light emitting diode The body 130 is electrically coupled to the circuit 140 to facilitate determining whether the adapter plate 120 and the image test board 112 are aligned.
參閱圖2所示,在一實施例中,影像轉接板210之位置可做鉛直及前後之微調,而轉接板220因連接測試載座250,故可藉測試載座250之設計前後移動或滑動以靠近或遠離影像測試板210。由於測試平台900、轉接板及測試板基座216將形成一視覺上之死角,在調整位置時無法直接觀測轉接板220與影像測試板210是否有效對準,因此,在配置一智能接觸判斷裝置100後經由智能接觸判斷裝置100,使用者以發光二極體130之提示並搭配影像測試板210與轉接板220位置之調整,可輕易並直覺地達成影像測試板210與轉接板220之有效對準。 Referring to FIG. 2, in an embodiment, the position of the image transfer board 210 can be vertically and frontally adjusted, and the adapter board 220 can be moved back and forth by the design of the test carrier 250 by connecting the test carrier 250. Or slide to approach or away from the image test board 210. Since the test platform 900, the adapter plate and the test board base 216 will form a visual dead angle, it is impossible to directly observe whether the adapter plate 220 and the image test board 210 are effectively aligned when adjusting the position, and therefore, a smart contact is configured. After the judging device 100 passes the smart contact judging device 100, the user can easily and intuitively achieve the image test board 210 and the interposer board by prompting the LEDs 130 and adjusting the position of the image test board 210 and the adapter board 220. 220 effective alignment.
參閱圖2所示,在一實施例中,同理而言,智能接觸判斷裝置100可配置於功能測試板260與轉接板220上,智能接觸判斷裝置100與功能測試板260及轉接板220耦接,功能測試板260上配置偵測針腳112,偵測針腳113與電路140耦接;另一方面,一個以上之發光二極體130與轉接板220上之金屬墊122耦接。測試平台900之使用者可轉接板220或功能測試板260之位置,當轉接板220與功能測試板260接觸後,若功能測試板260與轉接板200有效對準,則發光二極體130與電路140電性耦接,形成通路,發光二極體130發光,提示使用者轉接板220與功能測試板260有效對準之判斷。 Referring to FIG. 2, in an embodiment, the smart contact judging device 100 can be configured on the function test board 260 and the adapter board 220, and the smart contact judging device 100 and the function test board 260 and the interposer board. The coupling pin 112 is disposed on the function test board 260, and the detecting pin 113 is coupled to the circuit 140. On the other hand, one or more LEDs 130 are coupled to the metal pad 122 on the adapter board 220. The user of the test platform 900 can adjust the position of the board 220 or the function test board 260. When the adapter board 220 is in contact with the function test board 260, if the function test board 260 and the adapter board 200 are effectively aligned, the LEDs are illuminated. The body 130 is electrically coupled to the circuit 140 to form a via, and the LED 230 emits light, prompting the user to determine the effective alignment of the adapter plate 220 and the functional test board 260.
第三實施例Third embodiment
圖3係根據本發明之一實施例說明矽基液晶測試平台之智能接觸判斷裝置之偵測針腳示意圖。參閱圖3所示,在一實施例中,影像測試板310上具有一定數量之訊號針腳313,且轉接板320上則具有與訊號針腳313相對應數量之金屬墊322。偵測針腳312耦接一電路340;金屬墊322耦接發光二極體。 使用者可於影像測試板310上選擇一個以上之針腳做為偵測針腳312,其中偵測針腳312短於影像測試板310之至少一訊號針腳313,如此一來,在進行轉接板320與影像測試板310之接觸時,此較短之偵測針腳312之設計可保證所有訊號針腳313皆接觸所對應之金屬墊322後,偵測針腳312才與金屬墊322接觸。此時發光二極體330與電路340電性耦接,形成通路並發光,以利於對影像測試板310進行接觸判斷。 FIG. 3 is a schematic diagram showing the detection pin of the smart contact judging device of the 矽-based liquid crystal test platform according to an embodiment of the invention. Referring to FIG. 3, in an embodiment, the image test board 310 has a certain number of signal pins 313, and the adapter board 320 has a metal pad 322 corresponding to the signal pins 313. The detecting pin 312 is coupled to a circuit 340; the metal pad 322 is coupled to the LED. The user can select one or more pins on the image test board 310 as the detection pin 312, wherein the detection pin 312 is shorter than the at least one signal pin 313 of the image test board 310, so that the adapter plate 320 is When the image test board 310 is in contact, the shorter detection pin 312 is designed to ensure that all the signal pins 313 are in contact with the corresponding metal pad 322, and the detection pin 312 is in contact with the metal pad 322. At this time, the LEDs 330 are electrically coupled to the circuit 340 to form a via and emit light to facilitate contact determination of the image test board 310.
參閱圖3所示,在一實施例中,較短之偵測針腳312可為訊號針腳313長度之70%-90%,在一較佳之實施例中,較短之偵測針腳312可為訊號針腳313長度之80%。應注意的是,在此之針腳長度並僅為舉例而非加以限制,應視實際測試環境或影像測試板310與轉接板320之對準敏感度微調,故使用者仍可對偵測針腳312與訊號針腳313進行長度調整。 Referring to FIG. 3, in an embodiment, the shorter detection pin 312 can be 70%-90% of the length of the signal pin 313. In a preferred embodiment, the shorter detection pin 312 can be a signal. The length of the stitch 313 is 80%. It should be noted that the length of the stitches herein is merely an example and not a limitation, and the alignment sensitivity of the actual test environment or the image test board 310 and the adapter board 320 should be finely adjusted, so that the user can still detect the stitches. 312 and signal pin 313 are length adjusted.
參閱圖3所示,在一實施例中,電路340之供電電壓為3.0V-3.5V,在一較佳實施例中,電路340之供電電壓為3.3V。應注意的是,在此所述之藉由影像測試板310與轉接板320互相對準所達成之發光二極體330之實施例,僅為舉例而發加以限制,在不背離本發明範疇下,舉凡發光二極體330之數量、發光二極體330之種類、電源電壓大小、電阻阻值、電路串並聯方式及發光二極體放置方式,皆為使用者可對其測試平台或測試環境之方便性或穩定性所調控,基於以上係屬電子電路通常已知架構,故在此不加贅述。 Referring to FIG. 3, in one embodiment, the supply voltage of circuit 340 is 3.0V-3.5V. In a preferred embodiment, the supply voltage of circuit 340 is 3.3V. It should be noted that the embodiment of the LED diode 330 achieved by the image test board 310 and the interposer 320 being aligned with each other is limited by way of example only, without departing from the scope of the invention. Next, the number of the light-emitting diodes 330, the type of the light-emitting diode 330, the power supply voltage, the resistance value, the circuit-parallel connection method, and the light-emitting diode placement manner are all available for the user to test the platform or test. The convenience or stability of the environment is controlled, and the above-mentioned electronic circuits are generally known structures, and thus will not be described herein.
第四實施例Fourth embodiment
圖4係根據本發明之一實施例說明矽基液晶測試平台之智能接觸判斷裝置之偵測針腳示意圖。參閱圖4所示,在一實施例中,使用者可配置四個偵測針腳412分別置於影像測試板410之四個角落,偵測針腳412與電路440耦接,此四個偵測針腳412分別對應至轉接板420上四個金屬墊422,四個金屬墊422皆分別與發光二極體430耦接,當偵測針腳412與金屬墊422有效對準時,電路440與發光二極體430電性耦接形成通路,而使得發光二極體430發光。 FIG. 4 is a schematic diagram showing the detection pin of the smart contact judging device of the 矽-based liquid crystal test platform according to an embodiment of the invention. As shown in FIG. 4, in one embodiment, the user can configure four detection pins 412 to be respectively placed at four corners of the image test board 410, and the detection pin 412 is coupled to the circuit 440. The four detection pins are connected. The 412 is respectively corresponding to the four metal pads 422 on the adapter board 420. The four metal pads 422 are respectively coupled to the LEDs 430. When the detection pins 412 are effectively aligned with the metal pads 422, the circuit 440 and the LEDs are illuminated. The body 430 is electrically coupled to form a via such that the light emitting diode 430 emits light.
參閱圖4所示,在一實施例中,若影像測試板410與轉接板420具有一夾角,換言之,四個發光二極體430中之兩個發光二極體431、432因影像測試板410與轉接板420之一側較靠近而形成通路發光,另外兩個發光二極體433、434則因影像測試板410與轉接板420相隔較遠而未接觸而未發亮。在 此時,當使用者觀察發光二極體431、432已亮而發光二極體433、434未亮,因此使用者可對此現象得知影像測試板410與轉接板420不為有效對準,並做出判斷,使用者還可推論影像測試板410與轉接板420勢必有一夾角且同時調整正發亮之發光二極體431、432一側或未發亮之發光二極體433、434之一側有助於影像測試板410與轉接板420之有效對準。 Referring to FIG. 4, in an embodiment, if the image test board 410 has an angle with the adapter board 420, in other words, two of the four LEDs 430 and 432 are image test boards. The 410 is closer to one side of the adapter plate 420 to form a path illumination, and the other two LEDs 433 and 434 are not in contact with each other because the image test board 410 is far from the adapter plate 420 and is not illuminated. in At this time, when the user observes that the light-emitting diodes 431, 432 are bright and the light-emitting diodes 433, 434 are not bright, the user can know that the image test board 410 and the adapter plate 420 are not effectively aligned. And making a judgment, the user can also infer that the image test board 410 and the adapter board 420 are bound to have an angle and simultaneously adjust the side of the light-emitting diode 431, 432 that is being illuminated or the unlit light-emitting diode 433, One side of the 434 facilitates effective alignment of the image test board 410 with the adapter plate 420.
參閱圖4所示,在一實施例中,影像測試板410與轉接板420之間之夾角也可能使得發光二極體431、433發亮;發光二極體432、434未發亮,同理而言,使用者也可經由發光二極體431-434之提示,來判斷哪一側產生偏移或歪斜,以此方式來調整影像測試板410與轉接板420之位置,以達成影像測試板410與轉接板420之有效對準。 Referring to FIG. 4, in an embodiment, the angle between the image test board 410 and the adapter board 420 may also cause the LEDs 431, 433 to illuminate; the LEDs 432, 434 are not illuminated, the same For example, the user can also determine which side is offset or skewed by the prompt of the LEDs 431-434, and adjust the position of the image test board 410 and the adapter board 420 to achieve the image. The test board 410 is effectively aligned with the adapter plate 420.
參閱圖4所示,在一實施例中,應注意的是,發光二極體430之位置僅用來舉例而非用以限制,在不違背本發明範疇下,使用者可對發光二極體之數量或位置根據使用經驗、測試環境的方便度或測試平台之穩定性進行配置,舉例而言,將發光二極體耦接於轉接板420中間。 Referring to FIG. 4, in an embodiment, it should be noted that the position of the LED 430 is for illustrative purposes only and is not intended to be limiting. The user may operate the LEDs without departing from the scope of the present invention. The number or position is configured according to the experience of use, the convenience of the test environment, or the stability of the test platform. For example, the light emitting diode is coupled to the middle of the adapter plate 420.
第五實施例Fifth embodiment
參閱圖5,對應上述矽基液晶測試平台之智能接觸判斷裝置及相關圖示,圖1~4,以下對用於矽基液晶測試平台之智能接觸方法500之步驟510至530進行詳細闡述。 Referring to FIG. 5, the smart contact judging device corresponding to the above-mentioned 矽-based liquid crystal test platform and related illustrations, FIGS. 1 to 4, the steps 510 to 530 of the smart contact method 500 for the silli-based liquid crystal test platform are described in detail below.
圖5係根據本發明之一實施例說明矽基液晶測試平台之智能接觸判斷之方法流程圖。同時參考圖1A及圖1B,在此實施例中,智能接觸判斷方法500包含:將至少一發光二極體130耦接一轉接板120之至少一金屬墊122;將至少一電路140耦接一影像測試板110之至少一偵測針腳112;以及當至少一金屬墊122接觸偵測針腳112使得至少一電路140與至少一發光二極體130電性耦接,則轉接板120對準影像測試板110。 FIG. 5 is a flow chart illustrating a method for intelligent contact determination of a germanium-based liquid crystal test platform according to an embodiment of the invention. Referring to FIG. 1A and FIG. 1B , in the embodiment, the smart contact determination method 500 includes: coupling at least one LED assembly 130 to at least one metal pad 122 of an interposer 120; coupling at least one circuit 140 At least one detection pin 112 of an image test board 110; and when at least one metal pad 122 contacts the detection pin 112 such that at least one circuit 140 is electrically coupled to at least one of the light emitting diodes 130, the adapter plate 120 is aligned Image test board 110.
參考圖5及圖1A所示,在步驟510中,將發光二極體130耦接轉接板120之金屬墊122,在步驟520中,將電路140耦接影像測試板110之偵測針腳112。在步驟510及步驟520中,在一實施例中,轉接板120上具有許多金屬墊122,而影像測試板110上則具有許多針腳。在一實施例中,測試平台之使用者可架設一智能接觸判斷裝置100以進行影像測試板110與轉接板120之接觸及有效對準,對於一智能接觸判斷裝置而言,可在許多針腳中自行設定一 個以上之偵測針腳112,此測試針腳112將連接一電路140,電路140上則具有一電阻142,但不限於此,在不脫離本發明範疇下,還可包括一電源,以及其他電子元件,在正常狀況下可使得發光二極體130正常運作。另一方面,轉接板120之金屬墊122則耦接至少一發光二極體130,舉例而言,可為四個發光二極體130。 Referring to FIG. 5 and FIG. 1A, in step 510, the LEDs 130 are coupled to the metal pads 122 of the interposer 120. In step 520, the circuit 140 is coupled to the detection pins 112 of the image test board 110. . In steps 510 and 520, in one embodiment, the adapter plate 120 has a plurality of metal pads 122 thereon, and the image test board 110 has a plurality of pins. In an embodiment, the user of the test platform can set up a smart contact determining device 100 for contacting and effectively aligning the image test board 110 with the adapter board 120. For a smart contact judging device, many pins can be used. Set one by yourself More than one detection pin 112, the test pin 112 will be connected to a circuit 140, and the circuit 140 has a resistor 142, but is not limited thereto, and may include a power source and other electronic components without departing from the scope of the present invention. Under normal conditions, the LEDs 130 can operate normally. On the other hand, the metal pad 122 of the interposer 120 is coupled to the at least one LED 130, for example, four LEDs 130.
參閱圖5及圖1B所示,在步驟510及步驟520中,在一實施例中,測試平台使用者調整影像測試板及轉接板之位置,目的為使影像測試板110與轉接板120可互相接觸。應注意的是,在此之影像測試板110及轉接板120位置之調整,可包括兩個板三維方向之微調,舉例而言,影像測試板110可做上下之微調、前後之微調,但不以此為限,應視測試環境之需求,舉例而言,影像測試板110可為固定而只移動轉接板120來進行接觸。在一實施例中,可藉由矽基液晶產品500之影像進行影像測試板110及轉接板120位置之調整。 Referring to FIG. 5 and FIG. 1B, in step 510 and step 520, in an embodiment, the test platform user adjusts the position of the image test board and the adapter board for the purpose of the image test board 110 and the adapter board 120. Can be in contact with each other. It should be noted that the adjustment of the position of the image test board 110 and the adapter board 120 may include fine adjustment of the three-dimensional direction of the two boards. For example, the image test board 110 may be fine-tuned up and down, and fine-tuned before and after, but Without limitation, depending on the needs of the test environment, for example, the image test board 110 may be fixed and only move the adapter plate 120 for contact. In one embodiment, the position of the image test board 110 and the adapter board 120 can be adjusted by the image of the 矽-based liquid crystal product 500.
參閱圖5及圖1B所示,在步驟530中,在一實施例中,當影像測試板110與轉接板120接觸後,其金屬墊122與偵測針腳112相接觸並達成有效對準,則發光二極體130與電路140電性耦接,形成通路,在此條件下發光二極體130將發光以提示使用者,而利於判斷轉接板120與影像測試板112是否對準。 Referring to FIG. 5 and FIG. 1B, in step 530, in an embodiment, when the image test board 110 is in contact with the adapter board 120, the metal pad 122 contacts the detecting pin 112 and achieves effective alignment. The LEDs 130 are electrically coupled to the circuit 140 to form a via. Under these conditions, the LEDs 130 will emit light to prompt the user to determine whether the adapter plate 120 and the image test panel 112 are aligned.
參閱圖5及圖1B所示,在步驟530中,在一實施例中,測試平台900之使用者可自行配置或調整發光二極體130之發光電路,舉例而言,當具有兩個以上之發光二極體時,配置一串聯電路,使不同的發光二極體具有相同之電流,在此時,總順向偏壓在串聯時就等於每個發光二極體130順向偏壓的總和。除此之外,還可設定多個限流電阻分別對個別發光二極體串來做電流控制。應注意的是,在此藉由影像測試板110與轉接板120互相對準所達成之發光二極體130之實施例,僅為舉例而發加以限制,在不背離本發明範疇下,舉凡發光二極體130之數量、發光二極體130之種類、電源電壓大小、電阻阻值、串並聯方式及發光二極體放置方式,皆為使用者可對其測試平台或測試環境之方便性或穩定性所調設;基於以上係屬電子電路通常已知架構,故在此不加贅述。 Referring to FIG. 5 and FIG. 1B, in step 530, in an embodiment, the user of the test platform 900 can configure or adjust the light-emitting circuit of the light-emitting diode 130, for example, when there are two or more In the case of a light-emitting diode, a series circuit is arranged such that different light-emitting diodes have the same current, and at this time, the total forward bias is equal to the sum of the forward bias of each of the light-emitting diodes 130 in series. . In addition, a plurality of current limiting resistors can be set to perform current control on individual LED strings. It should be noted that the embodiment of the light-emitting diode 130 achieved by the image test board 110 and the adapter board 120 being aligned with each other is limited by way of example, without departing from the scope of the invention. The number of the light-emitting diodes 130, the type of the light-emitting diode 130, the power supply voltage, the resistance value, the series-parallel method, and the arrangement of the light-emitting diodes are all convenient for the user to test the platform or the test environment. Or the stability is set; based on the above-mentioned electronic circuits are generally known architecture, so no further details are provided here.
參閱圖5及圖3所示,在方法500中,包含步驟540:使用影像測試板中較短之針腳做為偵測針腳。在步驟540中,在一實施例中,影像測試 板310上具有一定數量之訊號針腳313,且轉接板320上則具有與訊號針腳313相對應數量之金屬墊322。偵測針腳312耦接一電路340;金屬墊322耦接發光二極體。使用者可於影像測試板310上選擇一個以上之針腳做為偵測針腳312,其中偵測針腳312短於影像測試板310之至少一訊號針腳313,如此一來,在進行轉接板320與影像測試板310之接觸時,此較短之偵測針腳312之設計可保證所有訊號針腳313皆接觸所對應之金屬墊322後,偵測針腳312才與金屬墊322接觸。此時發光二極體330與電路340電性耦接,形成通路並發光,以利於對影像測試板310進行接觸判斷。 Referring to FIG. 5 and FIG. 3, in method 500, step 540 is included: using a shorter pin in the image test board as the detecting pin. In step 540, in an embodiment, the image test The board 310 has a number of signal pins 313 thereon, and the adapter board 320 has a metal pad 322 corresponding to the signal pins 313. The detecting pin 312 is coupled to a circuit 340; the metal pad 322 is coupled to the LED. The user can select one or more pins on the image test board 310 as the detection pin 312, wherein the detection pin 312 is shorter than the at least one signal pin 313 of the image test board 310, so that the adapter plate 320 is When the image test board 310 is in contact, the shorter detection pin 312 is designed to ensure that all the signal pins 313 are in contact with the corresponding metal pad 322, and the detection pin 312 is in contact with the metal pad 322. At this time, the LEDs 330 are electrically coupled to the circuit 340 to form a via and emit light to facilitate contact determination of the image test board 310.
參閱圖5及圖3所示,在方法500中,包含步驟550:使用影像測試板中較訊號針腳長度80%之針腳做為偵測針腳。在步驟550中,在一實施例中,較短之偵測針腳312可為訊號針腳313長度之70%-90%,在一較佳之實施例中,較短之偵測針腳312可為訊號針腳313長度之80%。 Referring to FIG. 5 and FIG. 3, in the method 500, the method includes the following steps: 550: using a pin of the image test board that is 80% longer than the signal pin as the detecting pin. In step 550, in a preferred embodiment, the shorter detection pin 312 can be 70%-90% of the length of the signal pin 313. In a preferred embodiment, the shorter detection pin 312 can be a signal pin. 80% of the length of 313.
參閱圖5及圖4所示,在方法500中,包含步驟560:至少一偵測針腳位於影像測試板之四個角落,利用至少一發光二極體之發光數量來判斷轉接板是否對準該影像測試板。在步驟560中,在一實施例中,若影像測試板410與轉接板420具有一夾角,換言之,四個發光二極體430中之兩個發光二極體431、432因影像測試板410與轉接板420之一側較靠近而形成通路發光,另外兩個發光二極體433、434則因影像測試板410與轉接板420相隔較遠而未接觸而未發亮。在此時,當使用者觀察發光二極體431、432已亮而發光二極體433、434未亮,因此使用者可對此現象得知影像測試板410與轉接板420不為有效對準,並做出判斷,使用者還可推論影像測試板410與轉接板420勢必有一夾角且同時調整正發亮之發光二極體431、432一側或未發亮之發光二極體433、434之一側有助於影像測試板410與轉接板420之有效對準。 Referring to FIG. 5 and FIG. 4, in method 500, step 560 is included: at least one detection pin is located at four corners of the image test board, and the number of illuminations of the at least one light-emitting diode is used to determine whether the adapter board is aligned The image test board. In step 560, in an embodiment, if the image test board 410 has an angle with the adapter board 420, in other words, two of the four light-emitting diodes 430 are 431, 432 due to the image test board 410. The path light is formed closer to one side of the adapter plate 420, and the other two LEDs 433 and 434 are not in contact with each other because the image test board 410 is far apart from the adapter plate 420. At this time, when the user observes that the light-emitting diodes 431, 432 are bright and the light-emitting diodes 433, 434 are not bright, the user can know that the image test board 410 and the adapter plate 420 are not valid for this phenomenon. The user can also infer that the image test board 410 and the adapter board 420 are necessarily at an angle and simultaneously adjust the side of the light-emitting diode 431, 432 that is being illuminated or the unlit light-emitting diode 433. One side of the 434 facilitates effective alignment of the image test board 410 with the adapter plate 420.
參閱圖5及圖4所示,在步驟560中,在一實施例中,影像測試板410與轉接板420之間之夾角也可能使得發光二極體431、433發亮;發光二極體432、434未發亮,同理而言,使用者也可經由發光二極體431-434之提示,來判斷哪一側產生偏移或歪斜,以此方式來調整影像測試板410與轉接板420之位置,以達成影像測試板410與轉接板420之有效對準。 Referring to FIG. 5 and FIG. 4, in step 560, in an embodiment, the angle between the image test board 410 and the adapter board 420 may also cause the LEDs 431, 433 to illuminate; the LEDs 432, 434 are not illuminated. Similarly, the user can also determine which side is offset or skewed by the prompt of the LEDs 431-434, thereby adjusting the image test board 410 and the transfer. The position of the board 420 is such that effective alignment of the image test board 410 with the interposer board 420 is achieved.
參閱圖5及圖1所示,在方法500中,包含步驟570:設定電路140之阻值,以增強至少一偵測針腳112是否對準至少一金屬墊122之判斷準確 度。在步驟570中,在一實施例中,使用者可設定電路340之供電電壓為3.0V-3.5V,在一較佳實施例中,電路140之供電電壓為3.3V。在一實施例中,使用者也可設定電阻142之阻值來增加發光二極體130之敏感度,同時增加影像測試板110及轉接板120之對準精確度。應注意的是,在此所述之藉由影像測試板110與轉接板120互相對準所達成之發光二極體130、電路140、電阻142及電源電壓之實施例,僅為舉例而非加以限制,在不背離本發明範疇下,舉凡發光二極體330之數量、發光二極體330之種類、電源電壓大小、可變電阻阻值、電路串並聯方式及發光二極體放置方式,皆為使用者可對其測試平台或測試環境之方便性或穩定性所調控,基於以上係屬電子電路通常已知架構,故在此不加贅述。 Referring to FIG. 5 and FIG. 1 , in the method 500, the method includes the step 570: setting the resistance of the circuit 140 to enhance the determination of whether at least one of the detecting pins 112 is aligned with the at least one metal pad 122. degree. In step 570, in an embodiment, the user can set the supply voltage of circuit 340 to be 3.0V-3.5V. In a preferred embodiment, the supply voltage of circuit 140 is 3.3V. In an embodiment, the user can also set the resistance of the resistor 142 to increase the sensitivity of the LED 130, and increase the alignment accuracy of the image test board 110 and the adapter board 120. It should be noted that the embodiment of the LED diode 130, the circuit 140, the resistor 142 and the power supply voltage achieved by the image test board 110 and the interposer 120 being aligned with each other is merely an example instead of The limitation is that, without departing from the scope of the present invention, the number of the light-emitting diodes 330, the type of the light-emitting diode 330, the power supply voltage, the variable resistance, the circuit-parallel connection, and the arrangement of the light-emitting diodes are All users can control the convenience or stability of their test platform or test environment. Based on the above-mentioned electronic circuits, the architecture is generally known, so it will not be described here.
綜上所述,本發明提供一種矽基液晶半自動測試平台之智能接觸判斷裝置及其方法,改進習知測試平台再進行轉接板與影像測試板位置之調整時需要花費較多時間且無法進行有效調整之缺失,意即,本發明之矽基液晶測試平台之智能接觸判斷裝置及其方法,在進行檢測環境的設定過程中不需觀看相機之影像,甚至花費較多時間調整轉接板與影像測試板之位置,而是使用智能接觸判斷裝置,以發光二極體之亮燈來對準轉接板與影像測試板,可在簡單操作及利於判斷之狀況下節省時間來達到測試環境之要求。 In summary, the present invention provides an intelligent contact judging device for a silli-based liquid crystal semi-automatic test platform and a method thereof, and it takes a lot of time and cannot be performed to improve the position of the adapter board and the image test board after the conventional test platform is improved. The lack of effective adjustment means that the intelligent contact judging device and the method thereof of the 矽-based liquid crystal test platform of the present invention do not need to watch the image of the camera during the setting process of the detection environment, and even spend more time adjusting the adapter plate and The position of the image test board is to use the intelligent contact judging device to align the adapter plate and the image test board with the illumination of the LED, which can save time and achieve the test environment under the condition of simple operation and judgment. Claim.
根據上述,本發明具有底下之優點:一、智能接觸判斷裝置利於調整影像測試板及轉接板之位置;二、檢測環境的穩定度得到提升;三、檢測硬體之調整效率得到提升。 According to the above, the present invention has the following advantages: 1. The intelligent contact judging device is advantageous for adjusting the position of the image test board and the interposer; second, the stability of the detecting environment is improved; and third, the adjusting efficiency of the detecting hardware is improved.
上述之目的在於解釋,各種特定細節係為了提供對於本發明之徹底理解。熟知本發明領域之通常知識者應可實施本發明,而無需其中某些特定細節。在其他實施例中,習知的結構及裝置並未顯示於方塊圖中。在圖式元件之間可能包含中間結構。所述的元件可能包含額外的輸入和輸出,其並未詳細描繪於附圖中。 The above description is intended to be illustrative of specific details of the invention. Those skilled in the art of the invention will be able to practice the invention without some specific details. In other embodiments, conventional structures and devices are not shown in the block diagram. Intermediate structures may be included between the schematic elements. The elements described may include additional inputs and outputs, which are not depicted in detail in the drawings.
本發明包含各種處理程序,該處理程序得以硬碟元件加以執行,或內嵌於電腦可讀取指令中,其可形成一般或特殊目的且具有編程指令的處理器或邏輯電路,以執行程序,除此之外,該程序亦得由硬體及軟體之組合加以執行。 The present invention includes various processing programs that are executable by hard disk components or embedded in computer readable instructions that form a general or special purpose processor or logic circuit with programmed instructions to execute the program. In addition, the program must be executed by a combination of hardware and software.
用基本形式來描述方法,在未脫離本發明範疇下,任一方法或訊息得自程序中增加或刪除,熟知該項技術領域之通常知識者應可進一步改良或修正本發明,特定實施方式僅用以說明,非限制本發明。 The method is described in a basic form, and any method or message may be added or deleted from the program without departing from the scope of the invention, and those skilled in the art should be able to further improve or modify the invention. It is intended to illustrate and not to limit the invention.
於不同實施例所提之元件係為單獨電路,惟亦可將部分或全部元件整合於單一電路中,因而,所附之申請專利範圍中所述之不同元件可能對應一或多了電路之部分功能。 The components mentioned in the different embodiments are separate circuits, but some or all of the components may be integrated into a single circuit, and thus the different components described in the appended claims may correspond to one or more portions of the circuit. Features.
若文中有一元件“A”耦接(或耦合)至元件“B”,元件A可能直接耦接(或耦合)至B,亦或是經元件C間接地耦接(或耦合)至B。若說明書載明一元件、特徵、結構、程序或特性A會導致一元件、特徵、結構、程序或特性B,其表示A至少為B之一部分原因,亦或是表示有其他元件、特徵、結構、程序或特性協助造成B。在說明書中所提到的“可能”一詞,其元件、特徵、程序或特性不受限於說明書中;說明書中所提到的數量不受限於“一”或“一個”等詞。 If a component "A" is coupled (or coupled) to component "B", component A may be directly coupled (or coupled) to B, or indirectly coupled (or coupled) to B via component C. If the specification states that a component, feature, structure, program, or characteristic A will result in a component, feature, structure, procedure, or characteristic B, it indicates that A is at least part of B, or indicates that there are other components, features, or structures. , program or feature assists in causing B. The word "may" as used in the specification, its elements, features, procedures or characteristics are not limited to the description; the number mentioned in the specification is not limited to the words "a" or "an".
本發明無論就目的、手段及功效,在在均顯示其迴異於習知技術之特徵,為一大突破。惟須注意,上述實施例僅為例示性說明本發明之原理及其功效,而非用於限制本發明之範圍。雖然在這裡已闡明與解釋特定實施例與所揭露之應用,該實施例並不意圖侷限於精確解釋,任何熟於此項技藝之人士均可在不違背本發明之技術原理及精神下,對實施例作修改與變化。也應當了解,在不背離本發明所揭露之精神與範疇下,本發明所揭露於此之元件與其之各種修正、變更、對於此領域之技術者為顯而易見之加以排列之延伸、操作、該方法之細節,以及在此所揭露之裝置與方法將不被侷限,且應包含於下述專利申請範圍內。 The present invention is a major breakthrough in terms of its purpose, means, and efficacy, both of which are distinguished from the characteristics of conventional techniques. It is to be noted that the above-described embodiments are merely illustrative of the principles of the invention and its advantages, and are not intended to limit the scope of the invention. Although the specific embodiments and the disclosed applications have been illustrated and described herein, the embodiments are not intended to be limited to the precise explanation, and those skilled in the art can do without departing from the technical principles and spirit of the invention. The examples are subject to modification and variation. It is also to be understood that the present invention is not limited by the spirit and scope of the invention, and the various modifications, changes, and permutations, operations, and methods of the present invention will be apparent to those skilled in the art. The details, as well as the devices and methods disclosed herein, are not intended to be limiting, and are included in the scope of the following patent applications.
110‧‧‧影像測試板 110‧‧‧Image Test Board
112‧‧‧偵測針腳 112‧‧‧Detecting stitches
120‧‧‧轉接板 120‧‧‧Adapter plate
122‧‧‧金屬墊 122‧‧‧Metal pad
130‧‧‧發光二極體 130‧‧‧Lighting diode
140‧‧‧電路 140‧‧‧ Circuitry
142‧‧‧電阻 142‧‧‧resistance
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Citations (4)
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TW200420886A (en) * | 2003-04-09 | 2004-10-16 | lan-xiang Chen | Method for inspecting Chip-On-Glass liquid crystal display |
TW201219794A (en) * | 2010-04-14 | 2012-05-16 | Pro 2000 Co Ltd | Probe sheet for testing LCD panel, probe unit having the probe sheet, and method of manufacturing the probe sheet |
TW201219792A (en) * | 2010-08-18 | 2012-05-16 | Pro 2000 Co Ltd | Probe unit for testing LCD panel |
CN202486454U (en) * | 2012-01-09 | 2012-10-10 | 瑞仪光电(苏州)有限公司 | Adapter plate fixed fixture |
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Publication number | Priority date | Publication date | Assignee | Title |
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TW200420886A (en) * | 2003-04-09 | 2004-10-16 | lan-xiang Chen | Method for inspecting Chip-On-Glass liquid crystal display |
TW201219794A (en) * | 2010-04-14 | 2012-05-16 | Pro 2000 Co Ltd | Probe sheet for testing LCD panel, probe unit having the probe sheet, and method of manufacturing the probe sheet |
TW201219792A (en) * | 2010-08-18 | 2012-05-16 | Pro 2000 Co Ltd | Probe unit for testing LCD panel |
CN202486454U (en) * | 2012-01-09 | 2012-10-10 | 瑞仪光电(苏州)有限公司 | Adapter plate fixed fixture |
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