TWI574441B - Oled continuously processing device - Google Patents
Oled continuously processing device Download PDFInfo
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- TWI574441B TWI574441B TW103113655A TW103113655A TWI574441B TW I574441 B TWI574441 B TW I574441B TW 103113655 A TW103113655 A TW 103113655A TW 103113655 A TW103113655 A TW 103113655A TW I574441 B TWI574441 B TW I574441B
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Description
本發明係有關於發光二極體之加工裝置,尤指一種可撓性發光二極體之連續加工裝置。 The invention relates to a processing device for a light-emitting diode, in particular to a continuous processing device for a flexible light-emitting diode.
蒸鍍機為有機發光二極體(OLED)製程的重要設備,現行的有機發光二極體巳經從硬皮時代進入到可撓性軟板時代。空氣中的水氣及氧會在有機發光二極體的蒸鍍製程中嚴重損害有機發光二極體小分子薄膜。因此,一般的有機鍍膜設備多配備有一個與蒸鍍機氣密相連通的氮氣手套箱,蒸鍍機與氮氣手套箱構成一密閉空間,其內供操作人員更換材料遮、佈點與元件封裝,藉此避免有機發光二極體在加工製程轉換時接觸空氣,而能夠保護有機發光二極體小分子薄膜。 The vapor deposition machine is an important device for the organic light-emitting diode (OLED) process, and the current organic light-emitting diodes have entered the era of flexible soft boards from the hard skin era. The moisture and oxygen in the air can seriously damage the organic light-emitting diode small molecule film in the vapor deposition process of the organic light-emitting diode. Therefore, the general organic coating equipment is often equipped with a nitrogen glove box which is airtightly connected with the vapor deposition machine, and the vapor deposition machine and the nitrogen glove box form a closed space, in which the operator replaces the material covering, the cloth point and the component package. Thereby, the organic light-emitting diode is prevented from contacting the air during the processing process conversion, and the organic light-emitting diode small molecule film can be protected.
可撓性有機發光二極體的製作主要使用PET塑膠作為基材,塑膠基材本身即具有透水透氣性。可撓性有機發光二極體具有可彎折捲曲的特性,因此不適用傳統的硬板式發光二極體封裝技術,其必須採用在其上沉積氧化鋁薄膜的封裝方式而產生隔水層以阻隔水氣。氮氣手套箱同時也能夠用於氧化鋁薄膜沉積的封裝製程。 The flexible organic light-emitting diode is mainly made of PET plastic as a substrate, and the plastic substrate itself has water permeability and permeability. The flexible organic light-emitting diode has the characteristics of bendable crimping, so it is not suitable for the conventional hard-plate light-emitting diode packaging technology, and it is necessary to use a packaging method on which an aluminum oxide film is deposited to generate a water-repellent layer to block steam. The nitrogen glove box can also be used in the packaging process for alumina film deposition.
現有技術的缺點在於手套箱本身、其耗材以及維護之價格皆相當高昂,且可撓性有機發光二極體半成品進出蒸鍍機的過程有可能對其造成損害而導致製程良率下降。 A disadvantage of the prior art is that the cost of the glove box itself, its consumables and maintenance is quite high, and the process of entering and exiting the vaporizer from the flexible organic light-emitting diode semi-finished product may cause damage thereto and cause a decrease in process yield.
有鑑於此,本發明人遂針對上述現有技術,特潛心研究並配合 學理的運用,盡力解決上述之問題點,即成為本發明人改良之目標。 In view of this, the inventors of the present invention have devoted themselves to research and cooperation in view of the above prior art. The use of the theory, trying to solve the above problems, has become the goal of the inventor's improvement.
本發明之主要目的,在於提供一種可撓性發光二極體之連續加工裝置,其能夠整合可撓性發光二極體之蒸鍍及封裝製程,且能夠連續自動加工。 The main object of the present invention is to provide a continuous processing device for a flexible light-emitting diode which can integrate the vapor deposition and packaging process of the flexible light-emitting diode and can be continuously processed automatically.
為了達成上述之目的,本發明係提供一種可撓性發光二極體之連續加工裝置,係用以對一基材料帶進行蒸鍍及封裝。其包含一氣密箱、一給料輪、一捲料輪、一蒸鍍系統及一封裝系統。給料輪設置於氣密箱內用以供基材料帶的一端捲繞。捲料輪設置於氣密箱內用以供基材料帶的另一端捲繞而使基材料帶延伸在給料輪與捲料輪之間。蒸鍍系統設置於氣密箱內且對應基材料帶在氣密箱內的位置配置。封裝系統設置於氣密箱內且對應基材料帶在氣密箱內的位置配置。 In order to achieve the above object, the present invention provides a continuous processing apparatus for a flexible light-emitting diode for vapor deposition and encapsulation of a base material strip. It comprises an airtight box, a feed wheel, a roll of material, an evaporation system and a packaging system. The feed wheel is disposed in the airtight box for winding one end of the base material strip. The reel is disposed in the airtight case for winding the other end of the base material strip to extend the base material strip between the feed wheel and the reel. The evaporation system is disposed in the airtight box and corresponding to the position of the base material strip in the airtight box. The packaging system is disposed in the airtight box and corresponding to the position of the base material strip in the airtight box.
較佳地,前述之可撓性發光二極體之連續加工裝置,其中該氣密箱包含一蒸鍍腔及一封裝腔,該封裝腔與該蒸鍍腔之間藉由一通道而氣密相連通,該給料輪及該蒸鍍系統設置於該蒸鍍腔內,該捲料輪及該封裝系統設置於該封裝腔內,所述基材料帶通過該通道延伸在該給料輪與該捲料輪之間。 Preferably, in the above-mentioned continuous processing device of the flexible light-emitting diode, the airtight box comprises an evaporation chamber and a package cavity, and the package cavity and the vapor deposition chamber are airtight by a channel In connection, the feed wheel and the vapor deposition system are disposed in the vapor deposition chamber, the coil wheel and the packaging system are disposed in the package cavity, and the base material strip extends through the channel at the feed wheel and the roll Between the wheels.
較佳地,前述之可撓性發光二極體之連續加工裝置,其中該蒸鍍系統包含一遮罩治具,對應所述基材料帶的位置配置以遮罩所述基材料帶之一部份。 Preferably, the foregoing continuous processing device for a flexible light-emitting diode, wherein the vapor deposition system comprises a mask jig corresponding to a position of the base material strip to cover a portion of the base material strip Share.
較佳地,前述之可撓性發光二極體之連續加工裝置,其中該蒸鍍系統包含一氣密罩,與該遮罩治具相對配置且分別對應所述基材料帶的二面,該氣密罩能夠相對於該遮罩治具移動而將所述基材料帶之一部份夾持在該氣密罩與該遮罩治具之間。 Preferably, the foregoing continuous processing device for a flexible light-emitting diode, wherein the vapor deposition system comprises an airtight cover disposed opposite to the mask fixture and respectively corresponding to two sides of the base material strip, the gas The cover is configured to move a portion of the base material strip between the airtight cover and the mask fixture relative to the mask fixture.
較佳地,前述之可撓性發光二極體之連續加工裝置,其中該遮罩治具上開設有至少一蒸鍍孔以供所基材料帶露出於該蒸鍍內。 Preferably, in the above-mentioned continuous processing device for a flexible light-emitting diode, the mask fixture is provided with at least one vapor deposition hole for exposing the base material strip to the vapor deposition.
較佳地,前述之可撓性發光二極體之連續加工裝置,其中該遮 罩治具包含一載台,該載台上開設有複數個通孔,各該該通孔分別遮罩有一遮板,該蒸鍍孔開設於其中一該遮板。 Preferably, the foregoing flexible processing device for a flexible light-emitting diode, wherein the cover The cover fixture comprises a loading platform, and the plurality of through holes are defined in the loading platform, and each of the through holes is respectively covered with a shielding plate, and the vapor deposition hole is opened in one of the shielding plates.
較佳地,前述之可撓性發光二極體之連續加工裝置,其中該封裝系統包含一沉積箱,該沉積箱具有一開口且該開口對應所述基材料帶配置以遮罩所述基材料帶之一部份。 Preferably, the foregoing flexible processing device for a flexible light emitting diode, wherein the packaging system comprises a deposition tank having an opening and the opening is configured to cover the base material corresponding to the base material strip Take one part.
較佳地,前述之可撓性發光二極體之連續加工裝置,其中該封裝系統包含一氣密罩,與該開口相對配置且分別對應所述基材料帶的二面,該氣密罩能夠相對於該遮罩治具移動封合該開口以氣密該沉積箱並且將所述基材料帶之一部份密封在該沉積箱之內。 Preferably, the above-mentioned continuous processing device for a flexible light-emitting diode, wherein the packaging system comprises an airtight cover opposite to the opening and corresponding to two sides of the base material strip, respectively, the airtight cover can be opposite The opening is moved to seal the opening to hermetically seal the deposit box and seal a portion of the base material strip within the deposition tank.
本發明之可撓性有機發光二極體之連續加工裝置藉由捲料方式將蒸鍍及封裝製程整合在一氣密箱內進行同時進行以提升良率且縮短加工耗時。 The continuous processing device for the flexible organic light-emitting diode of the present invention integrates the vapor deposition and packaging processes in a gas-tight box by a coiling method to simultaneously improve the yield and shorten the processing time.
10‧‧‧基材料帶 10‧‧‧Base material belt
11‧‧‧進料端 11‧‧‧ Feeding end
12‧‧‧捲料端 12‧‧‧Roll end
100‧‧‧氣密箱 100‧‧‧ airtight box
110‧‧‧蒸鍍腔 110‧‧‧vapor plating chamber
120‧‧‧封裝腔 120‧‧‧Package cavity
130‧‧‧通道 130‧‧‧ channel
210‧‧‧給料輪 210‧‧‧feeding wheel
220‧‧‧捲料輪 220‧‧‧Roller
300‧‧‧蒸鍍系統 300‧‧‧Evaporation system
310‧‧‧遮罩治具 310‧‧‧Mask fixture
311‧‧‧載台 311‧‧‧
312‧‧‧通孔 312‧‧‧through hole
313‧‧‧遮板 313‧‧‧ visor
314‧‧‧蒸鍍孔 314‧‧‧ evaporated holes
320‧‧‧氣密罩 320‧‧‧ airtight cover
330‧‧‧電動定位機構 330‧‧‧Electric positioning mechanism
331‧‧‧滑軌 331‧‧‧rails
332‧‧‧定位馬達 332‧‧‧ Positioning motor
340‧‧‧蒸鍍源 340‧‧‧vapor deposition source
350‧‧‧隔板 350‧‧ ‧ partition
400‧‧‧封裝系統 400‧‧‧Package system
410‧‧‧沉積箱 410‧‧‧Sedimentation box
411‧‧‧開口 411‧‧‧ openings
420‧‧‧氣密罩 420‧‧‧ airtight cover
第一圖 係本發明較佳實施例之可撓性有機發光二極體之連續加工裝置之示意圖。 BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic view of a continuous processing apparatus for a flexible organic light-emitting diode according to a preferred embodiment of the present invention.
第二圖 係本發明較佳實施例中蒸鍍系統之示意圖。 The second drawing is a schematic view of an evaporation system in a preferred embodiment of the invention.
參閱第一圖至第二圖,本發明之較佳實施例提供一種可撓性有機發光二極體(OLED)之連續加工裝置,係用以對一基材料帶10進行蒸鍍及封裝之連續加工。其中,基材料帶10為可撓性之長條塑膠薄膜,且基材料帶10的其中一面之已預先佈設有複數個發光二極體,基材料帶10的二端分別為一進料端11及一捲料端12。藉由蒸鍍製程而能夠在發光二極體上形成至少一有機層或是金屬層;藉由封裝製程則能夠在發光二極體上沉積形成一氧化鋁薄以作為防水之用。於本實施例中,本發明之可撓性發光二極體之連續加工裝置包含有一氣密箱100、一給料輪210、一捲料輪220、一蒸鍍系統300及一封裝系統400。 Referring to the first to second embodiments, a preferred embodiment of the present invention provides a continuous processing device for a flexible organic light emitting diode (OLED) for performing vapor deposition and packaging of a substrate strip 10. machining. The base material strip 10 is a flexible strip of plastic film, and one of the base material strips 10 is pre-wired with a plurality of light emitting diodes, and the two ends of the base material strip 10 are respectively a feeding end 11 And a roll end 12. At least one organic layer or a metal layer can be formed on the light-emitting diode by the evaporation process; by the packaging process, a thin aluminum oxide can be deposited on the light-emitting diode for waterproofing. In the present embodiment, the continuous processing device for the flexible light-emitting diode of the present invention comprises an airtight box 100, a feed wheel 210, a winding wheel 220, an evaporation system 300 and a packaging system 400.
氣密箱100內形成一蒸鍍腔110及一封裝腔120,封裝腔120與 蒸鍍腔110之間形成一通道130而氣密相連通。其能夠經由抽出氣密箱100內的空氣而使封裝腔120與蒸鍍腔110之內維持真空狀態。 An evaporation chamber 110 and a package cavity 120 are formed in the airtight box 100, and the package cavity 120 is A channel 130 is formed between the vapor deposition chambers 110 to be hermetically connected. It is capable of maintaining a vacuum state within the package chamber 120 and the vapor deposition chamber 110 by extracting air from the airtight container 100.
給料輪210樞設於蒸鍍腔110的內側壁上,給料輪210係用以供前述的基材料帶10未經加工的進料端11捲繞於其上。捲料輪220設置於封裝腔120內用以供基材料帶10已加工的捲料端12捲繞於其上以回收已加工完成的基材料帶10。基材料帶10通過通道130延伸在給料輪210與捲料輪220之間而能夠分別在蒸鍍腔110及封裝腔120中對其上的發光二極體進行蒸鍍及封裝加工。較佳地,捲出至給料輪210與捲料輪220之間的基材料帶10上的發光二極體呈向下配置以利於加工。 The feed wheel 210 is pivotally mounted on the inner side wall of the evaporation chamber 110, and the feed wheel 210 is used to feed the unprocessed feed end 11 of the aforementioned base material strip 10 thereon. A reeling wheel 220 is disposed within the package cavity 120 for winding the web end 12 from which the base material strip 10 has been machined to recover the finished base material strip 10. The base material strip 10 extends between the feed wheel 210 and the reel 220 through the passage 130 to vapor-deposit and enclose the LEDs in the vapor deposition chamber 110 and the package chamber 120, respectively. Preferably, the light-emitting diodes that are rolled out onto the base material strip 10 between the feed wheel 210 and the reeling wheel 220 are disposed downwardly to facilitate processing.
蒸鍍系統300設置於蒸鍍腔110內,且對應基材料帶10在封裝腔120內的位置配置,蒸鍍系統300包含一遮罩治具310、一氣密罩320及一電動定位機構330。遮罩治具310對應基材料帶10在蒸鍍腔110內的位置配置以遮罩基材料帶10之一部份。遮罩治具310包含一載台311,載台311上開設有複數個通孔312,各通孔312分別遮罩有一遮板313,至少其中一個遮板313上開設有至少一個一蒸鍍孔314以供基材料帶10露出於蒸鍍孔314內而被蒸鍍。氣密罩320與遮罩治具310相對配置且分別對應基材料帶10的二面,氣密罩320能夠相對於遮罩治具310移動而將基材料帶10之一部份夾持在氣密罩320與遮罩治具310之間。電動定位機構330包含有一對滑軌331以及一定位馬達332,載台311設置在滑軌331上,並且藉由定位馬達332驅動載台311在滑軌331上移動,藉以調整遮板313對準基材料帶10上的待加工區塊。蒸鍍腔110內的底面上較佳地設置有複數個蒸鍍源340,各蒸鍍源340分別連接一加熱源。蒸鍍源340可以是有機蒸鍍源340或是金屬蒸鍍源340,例如,蒸鍍腔110內設有二支金屬蒸鍍源340及四支有機蒸鍍源340以提供製作不同顏色的可撓性發光二極體,且各蒸鍍源340之間藉由隔板350而分隔屏蔽。以加熱源加熱蒸鍍源340而能夠使蒸鍍源340汽 化蒸鍍至發光二極體上。 The vapor deposition system 300 is disposed in the vapor deposition chamber 110 and disposed corresponding to the base material strip 10 in the package cavity 120. The vapor deposition system 300 includes a mask fixture 310, an airtight cover 320, and an electric positioning mechanism 330. The mask jig 310 is disposed at a position within the vapor deposition chamber 110 corresponding to a portion of the base material strip 10 to cover a portion of the base material strip 10. The mask fixture 310 includes a loading platform 311. The mounting base 311 defines a plurality of through holes 312. Each of the through holes 312 is respectively covered with a shielding plate 313. At least one of the shielding plates 313 is provided with at least one vapor deposition hole. 314 is vapor-deposited by exposing the base material tape 10 to the vapor deposition hole 314. The airtight cover 320 is disposed opposite to the mask jig 310 and respectively corresponds to two sides of the base material strip 10, and the airtight cover 320 can move relative to the mask jig 310 to clamp a portion of the base material strip 10 to the gas. The cover 320 is disposed between the cover 320 and the mask jig 310. The electric positioning mechanism 330 includes a pair of slide rails 331 and a positioning motor 332. The stage 311 is disposed on the slide rails 331 and drives the stage 311 to move on the slide rails 331 by the positioning motor 332, thereby adjusting the alignment of the shutter 313. The block to be processed on the base material strip 10. Preferably, a plurality of evaporation sources 340 are disposed on the bottom surface of the vapor deposition chamber 110, and each of the evaporation sources 340 is connected to a heating source. The evaporation source 340 may be an organic evaporation source 340 or a metal evaporation source 340. For example, the vapor deposition chamber 110 is provided with two metal evaporation sources 340 and four organic evaporation sources 340 to provide different colors. The flexible light-emitting diodes are separated from each other by a separator 350 between the vapor deposition sources 340. The evaporation source 340 is heated by the heat source to enable the vapor deposition source 340 to be vaporized. Evaporation onto the light-emitting diode.
封裝系統400設置於封裝腔120內且對應基材料帶10在封裝腔120內的位置配置,封裝系統400包含一沉積箱410及一氣密罩420。沉積箱410較佳地設置在封裝腔120內的的低面上,其具有一開口411且開口411較佳地對應基材料帶10的位置而朝上配置,藉此遮罩基材料帶10上待加工的區塊。氣密罩420與開口411相對配置且分別對應基材料帶10的二面,氣密罩420能夠相對於沉積箱410移動而氣密沉積箱410並且將基材料帶10加工的區塊份密封在沉積箱410之內以將氧化鋁沉積在區塊之上。 The packaging system 400 is disposed in the package cavity 120 and corresponding to the position of the base material strip 10 in the package cavity 120. The package system 400 includes a deposition box 410 and an airtight cover 420. The deposition tank 410 is preferably disposed on a low surface within the package cavity 120 having an opening 411 and the opening 411 is preferably disposed upwardly corresponding to the position of the base material strip 10, thereby masking the base material strip 10 The block to be processed. The airtight cover 420 is disposed opposite to the opening 411 and respectively corresponds to two sides of the base material strip 10, and the airtight cover 420 is movable relative to the deposition tank 410 to hermetically deposit the tank 410 and seal the block portion processed by the base material strip 10 Within the deposition tank 410 is deposited alumina over the block.
基材料帶10上的待加工區塊完成蒸鍍製程後,可藉由給料輪210及捲料輪220及捲動而移入封裝腔120中進行封裝製程,下一個待加工區塊也能夠同時捲動至蒸鍍系統300並且同時進行蒸鍍製程。 After the evaporation process is completed, the block to be processed on the base material strip 10 can be moved into the package cavity 120 by the feed wheel 210 and the reel 220 and rolled to perform a packaging process, and the next block to be processed can also be simultaneously wound. The vapor deposition system 300 is moved to the vapor deposition system 300.
綜上所述,本發明之可撓性有機發光二極體之連續加工裝置能夠將蒸鍍及封裝製程整合在一氣密箱100內進行,其能夠減少人工移動的機會以避免損傷,且能夠藉由捲料方式同時進行蒸鍍及封裝製程以縮短加工耗時。 In summary, the continuous processing device for the flexible organic light-emitting diode of the present invention can integrate the evaporation and packaging process into a gas-tight container 100, which can reduce the chance of manual movement to avoid damage, and can borrow The vapor deposition and packaging processes are simultaneously performed by the coiling method to shorten the processing time.
以上所述僅為本發明之較佳實施例,非用以限定本發明之專利範圍,其他運用本發明之專利精神之等效變化,均應俱屬本發明之專利範圍。 The above is only the preferred embodiment of the present invention, and is not intended to limit the scope of the invention, and other equivalent variations of the patent spirit of the present invention are all within the scope of the invention.
10‧‧‧基材料帶 10‧‧‧Base material belt
11‧‧‧進料端 11‧‧‧ Feeding end
12‧‧‧捲料端 12‧‧‧Roll end
100‧‧‧氣密箱 100‧‧‧ airtight box
110‧‧‧蒸鍍腔 110‧‧‧vapor plating chamber
120‧‧‧封裝腔 120‧‧‧Package cavity
130‧‧‧通道 130‧‧‧ channel
210‧‧‧給料輪 210‧‧‧feeding wheel
220‧‧‧捲料輪 220‧‧‧Roller
300‧‧‧蒸鍍系統 300‧‧‧Evaporation system
310‧‧‧遮罩治具 310‧‧‧Mask fixture
320‧‧‧氣密罩 320‧‧‧ airtight cover
330‧‧‧電動定位機構 330‧‧‧Electric positioning mechanism
340‧‧‧蒸鍍源 340‧‧‧vapor deposition source
350‧‧‧隔板 350‧‧ ‧ partition
400‧‧‧封裝系統 400‧‧‧Package system
410‧‧‧沉積箱 410‧‧‧Sedimentation box
411‧‧‧開口 411‧‧‧ openings
420‧‧‧氣密罩 420‧‧‧ airtight cover
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW103113655A TWI574441B (en) | 2014-04-15 | 2014-04-15 | Oled continuously processing device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW103113655A TWI574441B (en) | 2014-04-15 | 2014-04-15 | Oled continuously processing device |
Publications (2)
Publication Number | Publication Date |
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TW201539821A TW201539821A (en) | 2015-10-16 |
TWI574441B true TWI574441B (en) | 2017-03-11 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW103113655A TWI574441B (en) | 2014-04-15 | 2014-04-15 | Oled continuously processing device |
Country Status (1)
Country | Link |
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TW (1) | TWI574441B (en) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW349249B (en) * | 1996-06-28 | 1999-01-01 | Gotoh Seisakusho Kk | Resin-packaged type semiconductor device having a heat sink |
US20060216951A1 (en) * | 2003-04-11 | 2006-09-28 | Lorenza Moro | Method of making an encapsulated sensitive device |
JP2008537316A (en) * | 2005-04-19 | 2008-09-11 | 株式会社荏原製作所 | Substrate processing equipment |
TW200940420A (en) * | 2008-03-27 | 2009-10-01 | 3M Innovative Properties Co | Packaging device of electronic component, packaging method of electronic component, and packaging equipment thereof |
US20100038662A1 (en) * | 2006-11-08 | 2010-02-18 | Hiroshi Fushimi | Light emitting device and production method of same |
-
2014
- 2014-04-15 TW TW103113655A patent/TWI574441B/en not_active IP Right Cessation
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW349249B (en) * | 1996-06-28 | 1999-01-01 | Gotoh Seisakusho Kk | Resin-packaged type semiconductor device having a heat sink |
US20060216951A1 (en) * | 2003-04-11 | 2006-09-28 | Lorenza Moro | Method of making an encapsulated sensitive device |
JP2008537316A (en) * | 2005-04-19 | 2008-09-11 | 株式会社荏原製作所 | Substrate processing equipment |
US20100038662A1 (en) * | 2006-11-08 | 2010-02-18 | Hiroshi Fushimi | Light emitting device and production method of same |
TW200940420A (en) * | 2008-03-27 | 2009-10-01 | 3M Innovative Properties Co | Packaging device of electronic component, packaging method of electronic component, and packaging equipment thereof |
Also Published As
Publication number | Publication date |
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TW201539821A (en) | 2015-10-16 |
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