TWI573988B - Method for measuring level of material by material level measuring apparatus - Google Patents

Method for measuring level of material by material level measuring apparatus Download PDF

Info

Publication number
TWI573988B
TWI573988B TW104128799A TW104128799A TWI573988B TW I573988 B TWI573988 B TW I573988B TW 104128799 A TW104128799 A TW 104128799A TW 104128799 A TW104128799 A TW 104128799A TW I573988 B TWI573988 B TW I573988B
Authority
TW
Taiwan
Prior art keywords
height
material level
level
sensing circuit
measuring
Prior art date
Application number
TW104128799A
Other languages
Chinese (zh)
Other versions
TW201710649A (en
Inventor
張良琪
黃軍翰
林益助
Original Assignee
桓達科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 桓達科技股份有限公司 filed Critical 桓達科技股份有限公司
Priority to TW104128799A priority Critical patent/TWI573988B/en
Application granted granted Critical
Publication of TWI573988B publication Critical patent/TWI573988B/en
Publication of TW201710649A publication Critical patent/TW201710649A/en

Links

Landscapes

  • Measurement Of Levels Of Liquids Or Fluent Solid Materials (AREA)
  • Length-Measuring Devices Using Wave Or Particle Radiation (AREA)

Description

利用料位量測裝置量測料位高度的方法Method for measuring material height by using material level measuring device

本發明係有關於一種量測料位高度的方法,特別是一種利用料位量測裝置量測料位高度的方法。The invention relates to a method for measuring the height of a material level, in particular to a method for measuring the height of a material level by means of a material level measuring device.

目前,料位量測裝置,例如時域反射雷達感測器,被廣泛地運用於料位量測;然而,有很多因素會影響料位量測裝置的精確度,例如物料的介電系數。因此,料位量測裝置被安裝好之後,料位的高度並沒有被料位量測裝置準確地測量,如此對使用者來說非常地不方便。Currently, level measurement devices, such as time domain reflectance radar sensors, are widely used for level measurement; however, there are many factors that affect the accuracy of the level measurement device, such as the dielectric constant of the material. Therefore, after the level measuring device is installed, the height of the material level is not accurately measured by the material level measuring device, which is very inconvenient for the user.

為改善上述習知技術之缺點,本發明之目的在於提供一種利用料位量測裝置量測料位高度的方法In order to improve the disadvantages of the above prior art, the object of the present invention is to provide a method for measuring the height of a material level by using a material level measuring device.

為達成本發明之上述目的,本發明之一種利用料位量測裝置量測料位高度的方法,包含:將一料位量測裝置的一探棒插入一容器的一物料內;該料位量測裝置發射一電磁波訊號,該電磁波訊號沿該探棒表面往該物料方向傳遞;當該電磁波訊號接觸該物料之一表面時產生一第一反射訊號;該第一反射訊號沿該探棒回傳至該料位量測裝置的一料位感測電路;當該電磁波訊號接觸該探棒之一底端時產生一第二反射訊號;該第二反射訊號沿該探棒回傳至該料位感測電路;該料位感測電路利用該第一反射訊號計算出一第一走時差值;該料位感測電路利用該第二反射訊號計算出一第二走時差值;該料位感測電路利用該第一走時差值計算出一第一料位高度;該料位感測電路利用該第二走時差值及該料位感測電路之一預設空桶走時差值計算出一第二料位高度;該料位感測電路利用該第一料位高度及該第二料位高度計算出一第三料位高度;及該料位感測電路計算出該第三料位高度後,該料位感測電路傳送該第三料位高度至一顯示單元進行顯示。In order to achieve the above object of the present invention, a method for measuring the height of a material level by using a material level measuring device comprises: inserting a probe of a material level measuring device into a material of a container; The measuring device emits an electromagnetic wave signal, and the electromagnetic wave signal is transmitted along the surface of the probe to the material; when the electromagnetic wave signal contacts a surface of the material, a first reflected signal is generated; the first reflected signal is returned along the probe a level sensing circuit transmitted to the level measuring device; generating a second reflected signal when the electromagnetic wave signal contacts a bottom end of the probe; the second reflected signal is transmitted back to the material along the probe a bit sensing circuit; the level sensing circuit calculates a first travel time difference using the first reflected signal; and the level sensing circuit calculates a second travel time difference by using the second reflected signal; The material level sensing circuit calculates a first material level height by using the first travel time difference; the material level sensing circuit uses the second travel time difference and one of the material level sensing circuits to preset an empty barrel The time difference calculates a second level height; the material The sensing circuit calculates a third material level height by using the first material level height and the second material level height; and after the material level sensing circuit calculates the third material level height, the material level sensing circuit transmits The third level is displayed to a display unit for display.

再者,在一具體實施例,如上述所述之利用料位量測裝置量測料位高度的方法,其中該第三料位高度係為該第一料位高度加上該第二料位高度之平均值。Furthermore, in a specific embodiment, the method for measuring the height of the material level by using the material level measuring device as described above, wherein the third material level height is the first material level height plus the second material level The average of the heights.

再者,在一具體實施例,如上述所述之利用料位量測裝置量測料位高度的方法,其中該第一料位高度等於該探棒之長度減去一第一空氣高度;該第一空氣高度等於該第一走時差值與一空氣波速之乘積再除以二。Moreover, in a specific embodiment, the method for measuring the height of the material level by using the material level measuring device as described above, wherein the first material level height is equal to the length of the probe minus a first air height; The first air level is equal to the product of the first travel time difference and an air wave speed divided by two.

再者,在一具體實施例,如上述所述之利用料位量測裝置量測料位高度的方法,其中一第三走時差值等於該第二走時差值與該預設空桶走時差值之差值。Furthermore, in a specific embodiment, the method for measuring the height of the material level by using the material level measuring device as described above, wherein a third travel time difference is equal to the second travel time difference value and the preset empty space The difference between the time difference values.

再者,在一具體實施例,如上述所述之利用料位量測裝置量測料位高度的方法,其中該第二料位高度等於該第三走時差值與一波速值之乘積;該波速值等於該空氣波速與一物料波速之乘積再除以兩倍的該空氣波速與該物料波速之差值。Furthermore, in a specific embodiment, the method for measuring the height of the material level by using the material level measuring device as described above, wherein the second material level height is equal to a product of the third travel time difference value and a wave speed value; The wave speed value is equal to the product of the air wave velocity and a material wave velocity divided by twice the difference between the air wave velocity and the material wave velocity.

再者,在一具體實施例,如上述所述之利用料位量測裝置量測料位高度的方法,更包含發射多個該電磁波訊號進行多次量測,其中該些電磁波訊號之間具有固定間隔發射時間;該料位感測電路利用該些電磁波訊號得到該些第一料位高度及該些第二料位高度;該料位感測電路將當次量測的該第一料位高度與該第二料位高度與前一次量測的該第三料位高度分別進行比較以得到兩個比較結果;如果該些比較結果的其中之一大於一預設值,則將該些比較結果中不大於該預設值的該第一料位高度或該第二料位高度當作該第三料位高度,該料位感測電路將該第三料位高度顯示在該顯示單元。Furthermore, in a specific embodiment, the method for measuring the height of the material level by using the material level measuring device as described above further comprises transmitting a plurality of the electromagnetic wave signals for performing multiple measurements, wherein the electromagnetic wave signals have a fixed interval emission time; the material level sensing circuit uses the electromagnetic wave signals to obtain the first material level height and the second material level height; the material level sensing circuit will measure the first material level The height is compared with the second level height and the previous level of the third level to obtain two comparison results; if one of the comparison results is greater than a predetermined value, the comparison is compared The first level height or the second level height which is not greater than the preset value is regarded as the third level height, and the level sensing circuit displays the third level height on the display unit.

再者,在一具體實施例,如上述所述之利用料位量測裝置量測料位高度的方法,其中如果該些比較結果皆大於該預設值,則將當次量測的該第一料位高度及該第二料位高度進行計算後以得到該第三料位高度;該料位感測電路將該第三料位高度顯示在該顯示單元。Furthermore, in a specific embodiment, the method for measuring the height of the material level by using the material level measuring device as described above, wherein if the comparison results are greater than the preset value, the first measurement is performed. A level height and the second level height are calculated to obtain the third level height; the level sensing circuit displays the third level height on the display unit.

本發明之功效在於用不同方式量測並計算物料的高度,以提高料位量測裝置的精確度,選取誤差低的量測數據給使用者參考。The utility model has the advantages that the height of the material is measured and calculated in different ways, so as to improve the accuracy of the material level measuring device, and the measurement data with low error is selected for reference by the user.

有關本發明的詳細說明及技術內容,請參閱以下的詳細說明和附圖說明如下,而附圖與詳細說明僅作為說明之用,並非用於限制本發明。The detailed description and the technical description of the present invention are to be understood as the

請參考圖1,其係為本發明之利用料位量測裝置量測料位高度的方法流程圖。並請同時參考圖2a,其係為利用料位量測裝置量測料位高度的方法之一部分示意圖;並請同時參考圖2b,其係為利用料位量測裝置量測料位高度的方法之另一部分示意圖。Please refer to FIG. 1 , which is a flow chart of a method for measuring the height of a material level by using a material level measuring device according to the present invention. Please also refer to FIG. 2a at the same time, which is a schematic diagram of one part of the method for measuring the height of the material level by using the material level measuring device; and also referring to FIG. 2b, which is a method for measuring the material level height by using the material level measuring device. Another part of the schematic.

一種利用料位量測裝置量測料位高度的方法,包含:A method for measuring the height of a material level by using a material level measuring device, comprising:

步驟S02:將一料位量測裝置10的一探棒14插入一容器20的一物料30內。Step S02: Inserting a probe 14 of a level measuring device 10 into a material 30 of a container 20.

步驟S04:該料位量測裝置10發射一電磁波訊號(即,偵測訊號),該電磁波訊號沿該探棒14表面往該物料30方向傳遞。Step S04: The material level measuring device 10 emits an electromagnetic wave signal (ie, a detection signal), and the electromagnetic wave signal is transmitted along the surface of the probe 14 in the direction of the material 30.

步驟S06:當該電磁波訊號接觸該物料30之一表面時產生一第一反射訊號。Step S06: A first reflection signal is generated when the electromagnetic wave signal contacts a surface of the material 30.

步驟S08:該第一反射訊號沿該探棒14回傳至該料位量測裝置10的一料位感測電路12。Step S08: The first reflected signal is transmitted back along the probe 14 to a level sensing circuit 12 of the level measuring device 10.

步驟S10:當該電磁波訊號接觸該探棒14底端時產生一第二反射訊號。Step S10: A second reflection signal is generated when the electromagnetic wave signal contacts the bottom end of the probe 14.

步驟S12:該第二反射訊號沿該探棒14回傳至該料位感測電路12。Step S12: The second reflected signal is transmitted back to the level sensing circuit 12 along the probe 14.

步驟S14:該料位感測電路12利用該第一反射訊號計算出一第一走時差值t1(容後詳述)。Step S14: The level sensing circuit 12 calculates a first travel time difference t1 using the first reflected signal (detailed later).

步驟S16:該料位感測電路12利用該第二反射訊號計算出一第二走時差值t2(容後詳述)。Step S16: The level sensing circuit 12 calculates a second travel time difference t2 (described in detail later) by using the second reflection signal.

步驟S18:該料位感測電路12利用該第一走時差值t1計算出一第一料位高度(容後詳述)。Step S18: The level sensing circuit 12 calculates a first level height using the first travel time difference t1 (detailed later).

步驟S20:該料位感測電路12利用該第二走時差值t2及該料位感測電路12之一預設空桶走時差值t3計算出一第二料位高度(容後詳述)。Step S20: The material level sensing circuit 12 calculates a second material level height by using the second travel time difference t2 and one of the material level sensing circuits 12 to preset the empty space travel time difference t3. Said).

步驟S22:該料位感測電路12利用該第一料位高度及該第二料位高度計算出一第三料位高度(容後詳述)。Step S22: The level sensing circuit 12 calculates a third level height using the first level height and the second level height (described in detail later).

步驟S24:該料位感測電路12計算出該第三料位高度後,該料位感測電路12傳送該第三料位高度至一顯示單元40進行顯示。Step S24: After the level sensing circuit 12 calculates the third level height, the level sensing circuit 12 transmits the third level to a display unit 40 for display.

再者,該電磁波訊號接觸該物料30之該表面後,一部分的該電磁波訊號自該物料30之該表面反射以產生該第一反射訊號,其餘的該電磁波訊號穿透該物料30沿該探棒14表面傳遞,直到接觸該探棒底端,接著其餘的該電磁波訊號自該探棒14底端反射以產生該第二反射訊號。After the electromagnetic wave signal contacts the surface of the material 30, a portion of the electromagnetic wave signal is reflected from the surface of the material 30 to generate the first reflected signal, and the remaining electromagnetic wave signals penetrate the material 30 along the probe. The surface is transferred until it contacts the bottom end of the probe, and then the remaining electromagnetic wave signals are reflected from the bottom end of the probe 14 to generate the second reflected signal.

以下內容將詳細敘述上述之步驟S14;請再次參考圖1及圖2a。The above-mentioned step S14 will be described in detail; please refer to FIG. 1 and FIG. 2a again.

Lm表示該物料30的物料高度;Lt表示該探棒14的探棒長度(亦即,該容器20的深度);Lt-Lm等於該容器20的空氣高度。Lm represents the material height of the material 30; Lt represents the probe length of the probe 14 (i.e., the depth of the container 20); Lt-Lm is equal to the air height of the container 20.

該第一走時差值t1等於二倍的一第一時間t01;該第一時間t01等於該空氣高度Lt-Lm除以一空氣波速Vair,該空氣波速Vair係為一常數c,即該電磁波訊號沿該探棒14且通過介質為空氣時的速度。The first travel time difference t1 is equal to twice the first time t01; the first time t01 is equal to the air height Lt-Lm divided by an air wave speed Vair, and the air wave speed Vair is a constant c, that is, the electromagnetic wave The speed along which the signal passes along the probe 14 and through which the medium is air.

上述內容可以以下列公式表達:The above can be expressed in the following formula:

t1 = t01 + t01 = [ (Lt-Lm) / Vair ] + [ (Lt-Lm) / Vair ] = 2 * (Lt-Lm) / VairT1 = t01 + t01 = [ (Lt-Lm) / Vair ] + [ (Lt-Lm) / Vair ] = 2 * (Lt-Lm) / Vair

以下內容將詳細敘述上述之步驟S16;請再次參考圖1及圖2a。The above-mentioned step S16 will be described in detail; please refer to FIG. 1 and FIG. 2a again.

該第二走時差值t2等於該第一走時差值t1加上二倍的一第二時間t02;該第二時間t02等於該物料高度Lm除以一物料波速Vm,該物料波速Vm等於該常數c除以該物料30的一介電系數ε的平方根,即該電磁波訊號沿該探棒14且通過該物料30時的速度。The second travel time difference t2 is equal to the first travel time difference t1 plus a second time t02; the second time t02 is equal to the material height Lm divided by a material wave speed Vm, and the material wave speed Vm is equal to The constant c is divided by the square root of a dielectric coefficient ε of the material 30, i.e., the velocity at which the electromagnetic wave signal travels along the probe 14 and through the material 30.

上述內容可以以下列公式表達:The above can be expressed in the following formula:

t2 = t01 + t01 + t02 + t02 = [ 2 ( Lt – Lm ) / Vair ] + ( 2 * Lm / Vm )T2 = t01 + t01 + t02 + t02 = [ 2 ( Lt – Lm ) / Vair ] + ( 2 * Lm / Vm )

以下內容將詳細敘述上述之步驟S18;由該第一走時差值t1計算出該第一料位高度;依據上述該些公式,該第一料位高度等於該探棒14的探棒長度Lt減去一第一空氣高度;該第一空氣高度即該電磁波訊號從發射端到接觸該物料30之該表面時之高度,該第一空氣高度等於該第一走時差值t1與一空氣波速Vair之乘積再除以二。The following step S18 will be described in detail; the first level height is calculated from the first travel time difference t1; according to the above formulas, the first level height is equal to the probe length Lt of the probe 14. Subtracting a first air height, that is, a height of the electromagnetic wave signal from the transmitting end to the surface contacting the material 30, the first air height being equal to the first travel time difference t1 and an air wave speed The product of Vair is divided by two.

上述內容可以以下列公式表達:The above can be expressed in the following formula:

該第一料位高度 = Lm = Lt – ( t1 * Vair / 2 )The first level height = Lm = Lt - ( t1 * Vair / 2 )

Lt、t1及Vair為已知,故可求得該第一料位高度。Lt, t1 and Vair are known, so the first level height can be determined.

以下內容將詳細敘述上述之步驟S20;請再次參考圖1及圖2b。由該第二走時差值t2及該預設空桶走時差值t3計算出該第二料位高度。The above-described step S20 will be described in detail; please refer to FIG. 1 and FIG. 2b again. The second level height is calculated from the second travel time difference t2 and the preset empty travel time difference t3.

由圖2a可知:t2 = [ 2 ( Lt – Lm ) / Vair ] + ( 2 * Lm / Vm )It can be seen from Fig. 2a that t2 = [ 2 ( Lt – Lm ) / Vair ] + ( 2 * Lm / Vm )

再由圖2b可知:Lt = t3 * Vair / 2It can be seen from Fig. 2b that Lt = t3 * Vair / 2

所以,t3 = 2 * Lt / VairSo, t3 = 2 * Lt / Vair

所以t2 – t3  = [ 2 ( Lt – Lm ) / Vair ] + ( 2 * Lm / Vm ) – ( 2 * Lt / Vair )So t2 – t3 = [ 2 ( Lt – Lm ) / Vair ] + ( 2 * Lm / Vm ) – ( 2 * Lt / Vair )

t2 – t3 = ( 2 * Lt / Vair – 2 * Lm  / Vair ) + ( 2 * Lm / Vm ) – ( 2 * Lt / Vair )T2 – t3 = ( 2 * Lt / Vair – 2 * Lm / Vair ) + ( 2 * Lm / Vm ) – ( 2 * Lt / Vair )

t2 – t3 = ( – 2 * Lm  / Vair ) + ( 2 * Lm / Vm )T2 – t3 = ( – 2 * Lm / Vair ) + ( 2 * Lm / Vm )

( t2 – t3 ) * Vm * Vair =  ( – 2 * Lm * Vm ) + ( 2 * Lm * Vair )( t2 – t3 ) * Vm * Vair = ( – 2 * Lm * Vm ) + ( 2 * Lm * Vair )

( t2 – t3 ) * Vm * Vair =  ( Vair – Vm ) * 2 * Lm( t2 – t3 ) * Vm * Vair = ( Vair – Vm ) * 2 * Lm

( t2 – t3 ) * Vm * Vair / [ 2 * ( Vair – Vm ) ] = Lm( t2 – t3 ) * Vm * Vair / [ 2 * ( Vair – Vm ) ] = Lm

在此定義,該第二料位高度等於一第三走時差值與一波速值之乘積;該第三走時差值等於該第二走時差值t2與該預設空桶走時差值t3之差值,該波速值等於該空氣波速Vair與該物料波速Vm之乘積再除以兩倍的該空氣波速Vair與該物料波速Vm之差值。Herein, the second level height is equal to a product of a third travel time difference and a wave speed value; the third travel time difference is equal to the second travel time difference t2 and the preset empty barrel travel time difference The difference of the value t3, the wave speed value being equal to the product of the air wave velocity Vair and the material wave velocity Vm divided by twice the difference between the air wave velocity Vair and the material wave velocity Vm.

亦即,該第二料位高度 = Lm = ( t2 – t3 ) * Vm * Vair / [ 2 * ( Vair – Vm ) ]That is, the second level height = Lm = ( t2 - t3 ) * Vm * Vair / [ 2 * ( Vair – Vm ) ]

t2、t3、Vm及Vair為已知,故可求得該第二料位高度。T2, t3, Vm and Vair are known, so the second level height can be determined.

以下內容將詳細敘述上述之步驟S22;該第三料位高度等於該第一料位高度以及該第二料位高度之平均值。The above step S22 will be described in detail; the third level height is equal to the average of the first level height and the second level height.

上述內容可以以下列公式表達:The above can be expressed in the following formula:

該第三料位高度 = ( 該第一料位高度 + 該第二料位高度 ) / 2 = { Lt – ( t1 * Vair / 2 ) + ( t2 – t3 ) * Vm * Vair / [ 2 * ( Vair – Vm ) ] } / 2The third level height = (the first level height + the second level height) / 2 = { Lt - ( t1 * Vair / 2 ) + ( t2 – t3 ) * Vm * Vair / [ 2 * ( Vair – Vm ) ] } / 2

在本發明之另一實施例中,在步驟S22,該料位感測電路12會發射多個該電磁波訊號進行多次量測,該些電磁波訊號之間具有固定間隔發射時間;該料位感測電路12利用該些電磁波訊號得到該些第一料位高度及該些第二料位高度,將該料位感測電路12當次量測的該第一料位高度、該第二料位高度分別與前一次量測的該第三料位高度進行比較以得到兩個比較結果,該些比較結果有其中之一的該比較結果大於一預設值,則將該些比較結果中不大於該預設值的該第一料位高度或該第二料位高度當作該第三料位高度,該料位感測電路12將該第三料位高度顯示在該顯示單元40;若該些比較結果皆大於該預設值,將當次量測的該第一料位高度及該第二料位高度進行計算後以得到該第三料位高度,該料位感測電路12將該第三料位高度顯示在該顯示單元40。In another embodiment of the present invention, in step S22, the level sensing circuit 12 transmits a plurality of the electromagnetic wave signals for multiple measurements, and the electromagnetic wave signals have a fixed interval emission time; The measuring circuit 12 obtains the first level height and the second level height by using the electromagnetic wave signals, and the first level height and the second level measured by the level sensing circuit 12 The height is respectively compared with the third level height of the previous measurement to obtain two comparison results, and if the comparison result has one of the comparison results being greater than a preset value, the comparison result is not greater than The first level height or the second level height of the preset value is regarded as the third level height, and the level sensing circuit 12 displays the third level height on the display unit 40; The comparison results are all greater than the preset value, and the first level height and the second level height are calculated to obtain the third level height, and the level sensing circuit 12 The third level height is displayed on the display unit 40.

再者,該比較結果可為該第一料位高度、該第二料位高度分別與該第三料位高度之相減後所得的數值;或該比較結果可為該第一料位高度、該第二料位高度分別與該第三料位高度相除之後所得的數值。Furthermore, the comparison result may be a value obtained by subtracting the height of the first material level and the height of the second material level from the height of the third material level respectively; or the comparison result may be the height of the first material level, The value obtained after the second level height is respectively divided by the third level height.

再者,其中該料位量測裝置10可為例如但本發明不限定為一時域反射雷達感測器。Furthermore, the level measuring device 10 can be, for example, but the invention is not limited to a time domain reflection radar sensor.

再者,為增加該料位量測裝置10的可用性,該料位量測裝置10更包含一擴時電路16(如圖2a及圖2b所示);該擴時電路16將一走時差值變化量(即t1 - t2)乘以一增益值,使得該走時差值變化量的單位從微秒放大至毫秒;藉此,增加該料位量測裝置10的可用性。Furthermore, in order to increase the usability of the level measuring device 10, the level measuring device 10 further includes a time-expanding circuit 16 (as shown in FIGS. 2a and 2b); the time-expanding circuit 16 will take a time difference. The amount of change in value (i.e., t1 - t2) is multiplied by a gain value such that the unit of the amount of change in the travel time difference is amplified from microseconds to milliseconds; thereby, the usability of the level measuring device 10 is increased.

本發明之功效在於用不同方式量測並計算物料的高度,以提高料位量測裝置的精確度,選取誤差低的量測數據給使用者參考。The utility model has the advantages that the height of the material is measured and calculated in different ways, so as to improve the accuracy of the material level measuring device, and the measurement data with low error is selected for reference by the user.

然以上所述者,僅為本發明之較佳實施例,當不能限定本發明實施之範圍,即凡依本發明申請專利範圍所作之均等變化與修飾等,皆應仍屬本發明之專利涵蓋範圍意圖保護之範疇。本發明還可有其它多種實施例,在不背離本發明精神及其實質的情況下,熟悉本領域的技術人員當可根據本發明作出各種相應的改變和變形,但這些相應的改變和變形都應屬於本發明所附的權利要求的保護範圍。綜上所述,當知本發明已具有產業利用性、新穎性與進步性,又本發明之構造亦未曾見於同類產品及公開使用,完全符合發明專利申請要件,爰依專利法提出申請。However, the above is only a preferred embodiment of the present invention, and the scope of the present invention is not limited thereto, that is, the equivalent changes and modifications made by the scope of the present invention should still be covered by the patent of the present invention. The scope of the scope is intended to protect. The invention may be embodied in various other modifications and changes without departing from the spirit and scope of the inventions. It is intended to fall within the scope of the appended claims. In summary, it is known that the present invention has industrial applicability, novelty and advancement, and the structure of the present invention has not been seen in similar products and public use, and fully complies with the requirements of the invention patent application, and is filed according to the patent law.

10‧‧‧料位量測裝置10‧‧‧Level measuring device

12‧‧‧料位感測電路12‧‧‧Level sensing circuit

14‧‧‧探棒14‧‧‧ Probe

16‧‧‧擴時電路16‧‧‧Time-expanding circuit

20‧‧‧容器20‧‧‧ container

30‧‧‧物料30‧‧‧Materials

40‧‧‧顯示單元40‧‧‧Display unit

Lt‧‧‧探棒長度Lt‧‧‧ probe length

Lm‧‧‧物料高度Lm‧‧‧ material height

S02~S24‧‧‧步驟S02~S24‧‧‧Steps

t1‧‧‧第一走時差值t1‧‧‧First time difference

t2‧‧‧第二走時差值t2‧‧‧Second time difference

t3‧‧‧預設空桶走時差值t3‧‧‧Preset empty bucket travel time difference

t01‧‧‧第一時間T01‧‧‧First time

t02‧‧‧第二時間T02‧‧‧ second time

圖1為本發明之利用料位量測裝置量測料位高度的方法流程圖。1 is a flow chart of a method for measuring the height of a material level by using a material level measuring device according to the present invention.

圖2a為利用料位量測裝置量測料位高度的方法之一部分示意圖。Figure 2a is a partial schematic view of a method for measuring the height of a fill level using a level measuring device.

圖2b為利用料位量測裝置量測料位高度的方法之另一部分示意圖。Figure 2b is a schematic illustration of another portion of the method of measuring the fill level using a level measuring device.

S02~24‧‧‧步驟 S02~24‧‧‧Steps

Claims (7)

一種利用料位量測裝置量測料位高度的方法,包含: a. 將一料位量測裝置的一探棒插入一容器的一物料內; b. 該料位量測裝置發射一電磁波訊號,該電磁波訊號沿該探棒表面往該物料方向傳遞; c. 當該電磁波訊號接觸該物料之一表面時產生一第一反射訊號; d. 該第一反射訊號沿該探棒回傳至該料位量測裝置的一料位感測電路; e. 當該電磁波訊號接觸該探棒之一底端時產生一第二反射訊號; f. 該第二反射訊號沿該探棒回傳至該料位感測電路; g. 該料位感測電路利用該第一反射訊號計算出一第一走時差值; h. 該料位感測電路利用該第二反射訊號計算出一第二走時差值; i. 該料位感測電路利用該第一走時差值計算出一第一料位高度; j. 該料位感測電路利用該第二走時差值及該料位感測電路之一預設空桶走時差值計算出一第二料位高度; k. 該料位感測電路利用該第一料位高度及該第二料位高度計算出一第三料位高度;及 l. 該料位感測電路計算出該第三料位高度後,該料位感測電路傳送該第三料位高度至一顯示單元進行顯示。A method for measuring a height of a material level by using a material level measuring device, comprising: a. inserting a probe of a material level measuring device into a material of a container; b. transmitting a electromagnetic wave signal by the material level measuring device The electromagnetic wave signal is transmitted along the surface of the probe toward the material; c. generating a first reflected signal when the electromagnetic wave signal contacts a surface of the material; d. the first reflected signal is transmitted back to the probe along the probe a level sensing circuit of the level measuring device; e. generating a second reflected signal when the electromagnetic wave signal contacts a bottom end of the probe; f. the second reflected signal is returned to the rod along the probe a material level sensing circuit; g. the material level sensing circuit calculates a first travel time difference using the first reflected signal; h. the material level sensing circuit uses the second reflected signal to calculate a second walk The time difference value; i. the material level sensing circuit calculates a first material level height by using the first travel time difference; j. the material level sensing circuit uses the second travel time difference and the material sense One of the measurement circuits presets a difference in the travel time of the empty bucket to calculate a second material level height; k. the material level The measuring circuit calculates a third material level height by using the first material level height and the second material level height; and l. the material level sensing circuit calculates the third material level height, the material level sensing circuit The third level height is transmitted to a display unit for display. 如申請專利範圍第1項所述之料位高度的量測方法,其中該第三料位高度係為該第一料位高度加上該第二料位高度之平均值。The method for measuring the height of a material level as described in claim 1, wherein the third material level height is an average of the first material level height plus the second material level height. 如申請專利範圍第1項所述之料位高度的量測方法,其中該第一料位高度等於該探棒之長度減去一第一空氣高度;該第一空氣高度等於該第一走時差值與一空氣波速之乘積再除以二。The method for measuring the height of a material level as described in claim 1, wherein the first material level height is equal to the length of the probe minus a first air height; the first air height is equal to the first travel time The product of the difference and an air wave velocity is divided by two. 如申請專利範圍第1項所述之料位高度的量測方法,其中一第三走時差值等於該第二走時差值與該預設空桶走時差值之差值。For the method for measuring the height of the material level as described in claim 1, wherein the third travel time difference is equal to the difference between the second travel time difference and the preset empty travel time difference. 如申請專利範圍第4項所述之料位高度的量測方法,其中該第二料位高度等於該第三走時差值與一波速值之乘積;該波速值等於該空氣波速與一物料波速之乘積再除以兩倍的該空氣波速與該物料波速之差值。The method for measuring the height of a material level as described in claim 4, wherein the second material level height is equal to a product of the third travel time difference value and a wave speed value; the wave speed value is equal to the air wave speed and a material The product of the wave velocity is then divided by twice the difference between the air wave velocity and the material wave velocity. 如申請專利範圍第1項所述之料位高度的量測方法,更包含發射多個該電磁波訊號進行多次量測,其中該些電磁波訊號之間具有固定間隔發射時間;該料位感測電路利用該些電磁波訊號得到該些第一料位高度及該些第二料位高度;該料位感測電路將當次量測的該第一料位高度與該第二料位高度與前一次量測的該第三料位高度分別進行比較以得到二比較結果,當該些比較結果中,有其中之一的該比較結果大於一預設值,則將該些比較結果中不大於該預設值的該第一料位高度或該第二料位高度當作該第三料位高度,該料位感測電路將該第三料位高度顯示在該顯示單元。The method for measuring the height of the material level as described in claim 1 further comprises transmitting a plurality of the electromagnetic wave signals for performing a plurality of measurements, wherein the electromagnetic wave signals have a fixed interval emission time; the material level sensing The circuit uses the electromagnetic wave signals to obtain the first material level height and the second material level heights; the material level sensing circuit measures the first material level height and the second material level height The third level heights of the first measurement are respectively compared to obtain two comparison results. When one of the comparison results is greater than a preset value, the comparison result is not greater than the comparison result. The first level height or the second level height of the preset value is regarded as the third level height, and the level sensing circuit displays the third level height on the display unit. 如申請專利範圍第6項所述之料位高度的量測方法,若該些比較結果皆大於該預設值,將當次量測的該第一料位高度及該第二料位高度進行計算後以得到該第三料位高度,該料位感測電路將該第三料位高度顯示在該顯示單元。For the method for measuring the height of the material level as described in claim 6, if the comparison results are greater than the preset value, the height of the first material level and the height of the second material level are measured. After calculating to obtain the third level height, the level sensing circuit displays the third level height on the display unit.
TW104128799A 2015-09-01 2015-09-01 Method for measuring level of material by material level measuring apparatus TWI573988B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW104128799A TWI573988B (en) 2015-09-01 2015-09-01 Method for measuring level of material by material level measuring apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW104128799A TWI573988B (en) 2015-09-01 2015-09-01 Method for measuring level of material by material level measuring apparatus

Publications (2)

Publication Number Publication Date
TWI573988B true TWI573988B (en) 2017-03-11
TW201710649A TW201710649A (en) 2017-03-16

Family

ID=58766333

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104128799A TWI573988B (en) 2015-09-01 2015-09-01 Method for measuring level of material by material level measuring apparatus

Country Status (1)

Country Link
TW (1) TWI573988B (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6452467B1 (en) * 1999-04-01 2002-09-17 Mcewan Technologies, Llc Material level sensor having a wire-horn launcher
US6531881B1 (en) * 1995-11-01 2003-03-11 Transco Plc Measurement arrangement
US6795015B2 (en) * 2003-01-29 2004-09-21 Saab Rosemount Tank Radar Ab Bottom reflector for a radar-based level gauge
US8018373B2 (en) * 2008-12-19 2011-09-13 Rosemount Tank Radar Ab System and method for filling level determination
CN203224275U (en) * 2012-09-26 2013-10-02 罗斯蒙特储罐雷达股份公司 Guide wave radar charge level indicator system
CN204101129U (en) * 2013-12-23 2015-01-14 罗斯蒙特储罐雷达股份公司 Guided wave radar material level gauge system

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6531881B1 (en) * 1995-11-01 2003-03-11 Transco Plc Measurement arrangement
US6452467B1 (en) * 1999-04-01 2002-09-17 Mcewan Technologies, Llc Material level sensor having a wire-horn launcher
US6795015B2 (en) * 2003-01-29 2004-09-21 Saab Rosemount Tank Radar Ab Bottom reflector for a radar-based level gauge
US8018373B2 (en) * 2008-12-19 2011-09-13 Rosemount Tank Radar Ab System and method for filling level determination
CN203224275U (en) * 2012-09-26 2013-10-02 罗斯蒙特储罐雷达股份公司 Guide wave radar charge level indicator system
CN103674172A (en) * 2012-09-26 2014-03-26 罗斯蒙特储罐雷达股份公司 Guided wave radar level gauge system and method for determining the level of filling materials contained in a container
CN204101129U (en) * 2013-12-23 2015-01-14 罗斯蒙特储罐雷达股份公司 Guided wave radar material level gauge system

Also Published As

Publication number Publication date
TW201710649A (en) 2017-03-16

Similar Documents

Publication Publication Date Title
US8963769B2 (en) Guided wave radar interface measurement medium identification
US10072961B2 (en) Level measuring instrument for determining moisture content
JP3022350B2 (en) Calibration method for filling level measurement
US9618617B2 (en) Level measurement using correlation between a pair of secondary reference signals
WO2017149526A3 (en) A method and apparatus for cooperative usage of multiple distance meters
US9151793B1 (en) Method for measuring the complex dielectric constant of a substance
RU2013125462A (en) SPEED DETECTION DEVICE
US10055519B2 (en) Pulse shape change for interface determination
RU2017100254A (en) TOUCH DEVICE, MEASUREMENT DEVICE AND METHOD OF MEASUREMENTS
US20160097669A1 (en) Level finding using multiple search steps
SA519410321B1 (en) Method for Movement Measurement of an Instrument in A Wellbore
RU2389982C1 (en) Method of compensating for errors in ultrasonic level gauge measurements
EP2221613A1 (en) An apparatus and a method for estimating the air humidity within an oven cavity
RU2389981C1 (en) Method of compensating for errors in ultrasonic level gauge measurements
TWI573988B (en) Method for measuring level of material by material level measuring apparatus
TWI452322B (en) Method and system for detecting object position by using sound wave
US9958309B2 (en) Method for measuring level of material level measuring apparatus
CN104272066B (en) For the method measuring the liquid level of liquid
JP6071756B2 (en) Thickness measurement method
TWI588497B (en) Method for measuring dielectric coefficient of material
CN106483383B (en) The method for measurement of the dielectric coefficient of material
CN106525198B (en) The method for measuring controlling level using material level measurement device
US9976893B2 (en) Method for measuring permittivity of material
CN209821382U (en) Dynamic plane height measurement sensor and height measurement system
US20150323370A1 (en) Method for Evaluation for Measurement Signals of a Level Gauge