TWI569900B - Method of fabricating titanium-clad-copper electrode - Google Patents

Method of fabricating titanium-clad-copper electrode Download PDF

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TWI569900B
TWI569900B TW105120760A TW105120760A TWI569900B TW I569900 B TWI569900 B TW I569900B TW 105120760 A TW105120760 A TW 105120760A TW 105120760 A TW105120760 A TW 105120760A TW I569900 B TWI569900 B TW I569900B
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titanium
cold
rolled
copper electrode
shells
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TW105120760A
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TW201800159A (en
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楊子青
李存仁
洪胤庭
張孝慈
伍昭憲
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中國鋼鐵股份有限公司
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Description

鈦包銅電極的製造方法 Method for manufacturing titanium-coated copper electrode

本發明係關於一種電極的製造方法,特別是關於一種鈦包銅電極的製造方法。 The present invention relates to a method of manufacturing an electrode, and more particularly to a method of manufacturing a titanium-coated copper electrode.

鈦包銅電極主要是透過鈦的高耐腐蝕性及銅本身的高導電性的優點,以使該鈦包銅電極能在應用在高腐蝕的環境中。 The titanium-coated copper electrode mainly has the advantages of high corrosion resistance of titanium and high conductivity of copper itself, so that the titanium-coated copper electrode can be used in a highly corrosive environment.

然而,現有的鈦包銅電極的製造方法,是在一鈦盒中澆鑄高溫銅熔湯,待銅熔湯凝固後再進行後續的處理。這種鈦包銅電極的製造方法主要有兩個缺點,第一個缺點是銅熔湯澆鑄於薄板之鈦盒中容易因溫度梯度的影響,導致凝固後的銅的中心處產生心部縮孔缺陷,並在鄰近縮孔處的銅,會因高溫與氧結合生成氧化銅。第二個缺點是,鈦與銅之間的界面會因高溫銅熔湯的熔融狀態,而使得鈦與銅結合形成一稀釋區域。在這一稀釋區域中,銅與鈦間會相互擴散,生成硬脆的介金屬化合物(Ti2Cu),導致於生成微裂縫,此將提高電子移動之阻抗以及電弧生成的機率。這二個缺點將導致所製得之鈦包銅電極易從微裂縫或心部縮孔缺陷的位置開始腐蝕,進而降低鈦包銅電極的使用年限以及降低導電率。 However, the conventional method for manufacturing a titanium-clad copper electrode is to cast a high-temperature copper melt soup in a titanium box, and to perform subsequent treatment after the copper melt soup is solidified. The method for manufacturing the titanium-clad copper electrode has two main disadvantages. The first disadvantage is that the copper melt cast in the titanium box of the thin plate is easily affected by the temperature gradient, resulting in the formation of a core crater at the center of the solidified copper. Defects, and copper near the shrinkage cavity, combine with high temperature to form copper oxide due to high temperatures. The second disadvantage is that the interface between titanium and copper is combined with copper to form a dilute region due to the molten state of the high temperature copper melt. In this dilute region, copper and titanium will mutually diffuse to form a hard and brittle intermetallic compound (Ti 2 Cu), resulting in the formation of micro-cracks, which will increase the impedance of electron movement and the probability of arc generation. These two disadvantages will cause the prepared titanium-clad electrode to be easily etched from the position of micro-crack or core crater defects, thereby reducing the service life of the titanium-coated copper electrode and reducing the conductivity.

故,有必要提供一種鈦包銅電極的製造方法,以解決習用技術所存在的問題。 Therefore, it is necessary to provide a method for manufacturing a titanium-clad copper electrode to solve the problems of the conventional technology.

本發明之主要目的在於提供一種鈦包銅電極的製造方法,依序透過冷軋鈦板及冷軋銅板的組裝、焊接與軋延步驟來 製得該鈦包銅電極,可避免微裂縫或心部縮孔缺陷的產生。 The main object of the present invention is to provide a method for manufacturing a titanium-clad copper electrode, which sequentially passes through the assembly, welding and rolling steps of a cold rolled titanium plate and a cold rolled copper plate. The titanium-clad copper electrode is obtained to avoid the occurrence of micro-cracks or core shrinkage defects.

為達上述之目的,本發明提供一種鈦包銅電極的製造方法,其包含步驟:提供一冷軋銅板;進行一包覆步驟,通過至少二冷軋鈦殼包覆該冷軋銅板以形成一第一金屬胚,其中該第一金屬胚露出該冷軋銅板之頭尾二端;對該第一金屬胚進行一焊接步驟,焊接該些冷軋鈦殼的至少一接縫處以形成一第二金屬胚;以及對該第二金屬胚進行一軋延步驟以形成該鈦包銅電極,其中該鈦包銅電極的總軋延比率大於或等於85%。 In order to achieve the above object, the present invention provides a method for manufacturing a titanium-clad copper electrode, comprising the steps of: providing a cold-rolled copper plate; performing a coating step of coating the cold-rolled copper plate with at least two cold-rolled titanium shells to form a a first metal embryo, wherein the first metal embryo exposes a tip end of the cold-rolled copper plate; a welding step is performed on the first metal blank, and at least one seam of the cold-rolled titanium shell is welded to form a second a metal embryo; and a rolling step of the second metal blank to form the titanium-clad copper electrode, wherein the titanium-clad copper electrode has a total rolling ratio of greater than or equal to 85%.

在本發明之一實施例中,該些冷軋鈦殼的數量是二個,以及該些冷軋鈦殼之其中一個具有呈一U字型之橫剖面,該些冷軋鈦殼之另一個具有呈一平板型之橫剖面。 In an embodiment of the invention, the number of the cold rolled titanium shells is two, and one of the cold rolled titanium shells has a U-shaped cross section, and the cold rolled titanium shells are another It has a cross section in the form of a flat plate.

在本發明之一實施例中,該些冷軋鈦殼的數量是四個,以及該些冷軋鈦殼中的二個具有呈一平板型之橫剖面,該些冷軋鈦殼中的另外二個具有呈圓弧型之剖面。 In one embodiment of the present invention, the number of the cold rolled titanium shells is four, and two of the cold rolled titanium shells have a flat cross section, and the other of the cold rolled titanium shells The two have a circular arc profile.

在本發明之一實施例中,該焊接步驟係一雷射焊接步驟,該雷射焊接步驟具有一雷射功率介於1500瓦至2500瓦之間,及一移行速度介於1000毫米/分至8000毫米/分之間。 In an embodiment of the invention, the soldering step is a laser soldering step having a laser power between 1500 watts and 2500 watts and a travel speed of between 1000 mm/min. Between 8000 mm / min.

在本發明之一實施例中,該雷射焊接步驟係在一保護氣體下進行,其中該保護氣體包含一氬氣,且該保護氣體之一氣體流量係介於20升/分至30升/分之間。 In an embodiment of the invention, the laser welding step is performed under a shielding gas, wherein the shielding gas comprises an argon gas, and the gas flow rate of the shielding gas is between 20 liters/minute and 30 liters/ Between the points.

在本發明之一實施例中,該軋延步驟係一熱軋步驟,其中該熱軋步驟具有一熱軋溫度介於500℃至800℃之間,以及在該熱軋步驟中係以5℃/秒至15℃/秒的一冷卻速率進行冷卻至到達200℃至300℃之一完冷溫度為止。 In an embodiment of the invention, the rolling step is a hot rolling step, wherein the hot rolling step has a hot rolling temperature between 500 ° C and 800 ° C, and 5 ° C in the hot rolling step. Cooling is performed at a cooling rate of from sec to 15 ° C / sec until reaching a temperature of one of 200 ° C to 300 ° C.

在本發明之一實施例中,在該熱軋步驟之後更包含:對到達該完冷溫度之鈦包銅電極進行一水冷步驟。 In an embodiment of the invention, after the hot rolling step, the method further comprises: performing a water cooling step on the titanium-clad electrode that reaches the cooling temperature.

在本發明之一實施例中,該些冷軋鈦殼的一平均晶粒尺寸係介於20微米至40微米之間。 In one embodiment of the invention, the cold rolled titanium shell has an average grain size between 20 microns and 40 microns.

在本發明之一實施例中,該冷軋銅板的平均晶粒尺 寸係介於10微米至50微米之間。 In an embodiment of the invention, the average grain size of the cold rolled copper plate The inch system is between 10 microns and 50 microns.

在本發明之一實施例中,該冷軋銅板係純度為99.95%至100%之無氧銅板。 In one embodiment of the invention, the cold rolled copper sheet is an oxygen free copper sheet having a purity of from 99.95% to 100%.

10‧‧‧方法 10‧‧‧ method

11‧‧‧步驟 11‧‧‧Steps

12‧‧‧步驟 12‧‧‧ steps

13‧‧‧步驟 13‧‧‧Steps

14‧‧‧步驟 14‧‧‧Steps

第1圖:本發明實施例之鈦包銅電極的製造方法的流程示意圖。 Fig. 1 is a flow chart showing a method of manufacturing a titanium-coated copper electrode according to an embodiment of the present invention.

為了讓本發明之上述及其他目的、特徵、優點能更明顯易懂,下文將特舉本發明較佳實施例,並配合所附圖式,作詳細說明如下。再者,本發明所提到的方向用語,例如上、下、頂、底、前、後、左、右、內、外、側面、周圍、中央、水平、橫向、垂直、縱向、軸向、徑向、最上層或最下層等,僅是用以說明及理解本發明,而非用以限制本發明。 The above and other objects, features and advantages of the present invention will become more <RTIgt; Furthermore, the directional terms mentioned in the present invention, such as upper, lower, top, bottom, front, rear, left, right, inner, outer, side, surrounding, central, horizontal, horizontal, vertical, longitudinal, axial, The radial, uppermost or lowermost layers, and the like, are merely illustrative and understanding of the invention and are not intended to limit the invention.

請參照第1圖所示,第1圖係本發明實施例之鈦包銅電極的製造方法10的流程示意圖。本發明實施例之鈦包銅電極的製造方法10主要包含下列步驟11至步驟14:提供一冷軋銅板(步驟11);進行一包覆步驟,通過至少二冷軋鈦殼包覆該冷軋銅板以形成一第一金屬胚,其中該第一金屬胚露出該冷軋銅板之頭尾二端(步驟12);對該第一金屬胚進行一焊接步驟,焊接該些冷軋鈦殼的至少一接縫處以形成一第二金屬胚(步驟13);以及對該第二金屬胚進行一軋延步驟以形成該鈦包銅電極,其中該鈦包銅電極的總軋延比率大於或等於85%(步驟14)。本發明將於下文利用第1圖詳細說明實施例之上述各步驟的實施細節及其原理。 Referring to Fig. 1, Fig. 1 is a schematic flow chart showing a method 10 for manufacturing a titanium-coated copper electrode according to an embodiment of the present invention. The method for manufacturing a titanium-clad copper electrode according to the embodiment of the present invention mainly comprises the following steps 11 to 14: providing a cold-rolled copper plate (step 11); performing a coating step of coating the cold rolling by at least two cold-rolled titanium shells a copper plate to form a first metal embryo, wherein the first metal embryo exposes both ends of the cold-rolled copper plate (step 12); performing a welding step on the first metal blank to weld at least the cold-rolled titanium shell a seam to form a second metal blank (step 13); and a rolling step of the second metal blank to form the titanium-clad electrode, wherein the total copper rolling ratio of the titanium-clad electrode is greater than or equal to 85 % (step 14). The present invention will be described in detail below with reference to Fig. 1 for details of the implementation of the above steps of the embodiment and the principles thereof.

請參照第1圖所示,本發明實施例之鈦包銅電極的製造方法10首先係步驟11:提供一冷軋銅板。在本步驟11中,該冷軋銅板的平均晶粒尺寸係介於10微米至50微米之間。在一示範例中,該冷軋銅板的平均晶粒尺寸大致上可以是30微米。在另一實施例中,該冷軋銅板係純度為99.95%至100%之無氧銅板。 此處所指之純度係指銅的成分佔整個冷軋銅板的重量百分比為99.95%至100%,其中不足的成分是由不可避免的雜質所構成。要提到的是,該冷軋銅板可以是透過電解方式取得,因此該冷軋銅板中心處並未有心部縮孔缺陷,因此可避免習知使用澆鑄技術所產生的問題。 Referring to FIG. 1, a method 10 for manufacturing a titanium-clad copper electrode according to an embodiment of the present invention is first performed in a step 11 of providing a cold-rolled copper plate. In this step 11, the cold rolled copper plate has an average grain size of between 10 micrometers and 50 micrometers. In an exemplary embodiment, the cold rolled copper sheet may have an average grain size of substantially 30 microns. In another embodiment, the cold rolled copper sheet is an oxygen free copper sheet having a purity of from 99.95% to 100%. The purity referred to herein means that the composition of copper accounts for 99.95% to 100% by weight of the entire cold-rolled copper plate, and the insufficient component is composed of unavoidable impurities. It should be mentioned that the cold-rolled copper plate can be obtained by electrolysis, so that there is no core shrinkage defect at the center of the cold-rolled copper plate, so that the problems caused by the conventional casting technique can be avoided.

本發明實施例之鈦包銅電極的製造方法10接著係步驟12:進行一包覆步驟,通過至少二冷軋鈦殼包覆該冷軋銅板以形成一第一金屬胚,其中該第一金屬胚露出該冷軋銅板之頭尾二端。在本步驟12中,該些冷軋鈦殼的一平均晶粒尺寸可以係介於20微米至40微米之間。在一示範例中,該些冷軋鈦殼的平均晶粒尺寸與該冷軋銅板的平均晶粒尺寸大致相同,例如大致上都是30微米左右,此可讓該些冷軋鈦殼與該冷軋銅板在微結構上具有相近的晶粒性質,可提高導電性及抗腐蝕性。在另一實施例中,該冷軋銅板略呈一扁方塊狀,且該些冷軋鈦殼的數量可以是二個或四個。例如當該些冷軋鈦殼的數量是二個時,該些冷軋鈦殼之其中一個具有呈一U字型之橫剖面,該些冷軋鈦殼之另一個具有呈一平板型之橫剖面。換言之,當這二個冷軋鈦殼包覆該冷軋銅板以形成一第一金屬胚,可使該第一金屬胚露出該冷軋銅板之頭尾二端。又例如當該些冷軋鈦殼的數量是四個時,該些冷軋鈦殼中的二個具有呈一平板型之橫剖面,該些冷軋鈦殼中的另外二個具有呈圓弧型之剖面。換言之,當這四個冷軋鈦殼包覆該冷軋銅板以形成一第一金屬胚,可使該第一金屬胚露出該冷軋銅板之頭尾二端。要提到的是,該些冷軋鈦殼主要是用來包覆該冷軋銅板並露出該冷軋銅板的頭尾二端,因此該些冷軋鈦殼的尺寸較佳是對應該冷軋銅板的尺寸。 The method for manufacturing a titanium-coated copper electrode according to an embodiment of the present invention is followed by step 12: performing a coating step of coating the cold-rolled copper plate with at least two cold-rolled titanium shells to form a first metal embryo, wherein the first metal The embryo exposes the ends of the cold rolled copper plate. In this step 12, the average grain size of the cold rolled titanium shells may be between 20 microns and 40 microns. In an exemplary embodiment, the average grain size of the cold rolled titanium shells is substantially the same as the average grain size of the cold rolled copper sheets, for example, about 30 microns, which allows the cold rolled titanium shells to The cold-rolled copper plate has similar grain properties on the microstructure, which improves conductivity and corrosion resistance. In another embodiment, the cold rolled copper sheet is slightly flat and the number of the cold rolled titanium shells may be two or four. For example, when the number of the cold-rolled titanium shells is two, one of the cold-rolled titanium shells has a U-shaped cross section, and the other of the cold-rolled titanium shells has a flat shape. section. In other words, when the two cold rolled titanium shells coat the cold rolled copper sheet to form a first metal blank, the first metal blank can be exposed to the ends of the cold rolled copper sheet. For example, when the number of the cold-rolled titanium shells is four, two of the cold-rolled titanium shells have a flat cross section, and the other two of the cold-rolled titanium shells have an arc shape. Type profile. In other words, when the four cold-rolled titanium shells coat the cold-rolled copper sheet to form a first metal blank, the first metal blank can be exposed to the ends of the cold-rolled copper sheet. It is to be noted that the cold-rolled titanium shells are mainly used to coat the cold-rolled copper sheets and expose the ends of the cold-rolled copper sheets. Therefore, the dimensions of the cold-rolled titanium shells are preferably corresponding to cold rolling. The size of the copper plate.

本發明實施例之鈦包銅電極的製造方法10接著係步驟13:對該第一金屬胚進行一焊接步驟,焊接該些冷軋鈦殼的至少一接縫處以形成一第二金屬胚。在本步驟13中,該焊接步驟可以係一雷射焊接步驟,該雷射焊接步驟具有一雷射功率介於1500 瓦至2500瓦之間,及一移行速度介於1000毫米/分至8000毫米/分之間。在一示範實施例中,該雷射焊接步驟係在一保護氣體下進行,其中該保護氣體包含一氬氣,且該保護氣體之一氣體流量係介於20升/分至30升/分之間。要提到的是,該雷射焊接步驟主要是將該些冷軋鈦殼的接縫處進行焊接(也有可能焊接到位於接縫處的冷軋銅板),以使該些冷軋鈦殼形成包覆該冷軋銅板的殼體。 The method 10 for manufacturing a titanium-clad copper electrode according to an embodiment of the present invention is followed by a step 13 of performing a soldering step on the first metal blank to weld at least one seam of the cold-rolled titanium shells to form a second metal blank. In this step 13, the soldering step may be a laser soldering step having a laser power of 1500 The tile is between 2500 watts and a moving speed is between 1000 mm/min and 8000 mm/min. In an exemplary embodiment, the laser welding step is performed under a shielding gas, wherein the shielding gas comprises an argon gas, and a gas flow rate of the shielding gas is between 20 liters/minute and 30 liters/minute. between. It should be mentioned that the laser welding step is mainly to weld the joints of the cold-rolled titanium shells (it is also possible to weld to the cold-rolled copper sheets located at the joints) to form the cold-rolled titanium shells. A casing covering the cold rolled copper plate.

續言之,例如在該雷射焊接步驟的實施例1中,雷射功率為2000瓦、移行速度為6000毫米/分,之後對該第二金屬胚進行極化曲線量測的分析後可得到2.562伏特的孔蝕電位及0.227伏特的致鈍電壓,其中孔蝕電位及致鈍電壓是透過一市售之恆電位儀器(Biologic VSP恆電位儀)在使用90克/升的硫酸銅、110克/升及70℃之量測溫度下對該第二金屬胚進行極化曲線量測而得。另外,還有進行其他實施例2-4、未加工之之一冷軋鈦材的實驗及分析如下表1所示。從下表1可知,雖然該些冷軋鈦殼的接縫處透過上述的雷射焊接步驟進行焊接動作,但整體而言並不會影響所製得之鈦包銅電極的鈍化程度,甚至於還可以提高孔蝕電位(與未加工之一冷軋鈦材相比)。由於致鈍電壓並無顯著變化,所以可知本發明實施例所製得之鈦包銅電極在鈍化程度上與未加工過(未進行雷射焊接)的冷軋鈦材相近,故本發明實施例所製得之鈦包銅電極不容易鈍化。另一方面,由於孔蝕電位越高代表材料的耐孔蝕特性越佳,因此經過雷射焊接步驟後的鈦包銅電極可得到更優良的耐孔蝕特性。 Continuingly, for example, in the first embodiment of the laser welding step, the laser power is 2000 watts and the traveling speed is 6000 mm/min, and then the analysis of the polarization curve of the second metal embryo is performed. The pitting potential of 2.562 volts and the blunt voltage of 0.227 volts, wherein the pitting potential and the blunt voltage are transmitted through a commercially available potentiostat (Biologic VSP potentiostat) using 90 g/L of copper sulfate, 110 g. The second metal embryo was subjected to a polarization curve measurement at a temperature of 70 ° C and measured. Further, the experiment and analysis of the cold rolled titanium materials of the other examples 2-4 and the unprocessed ones are shown in Table 1 below. It can be seen from Table 1 that although the joints of the cold-rolled titanium shells are subjected to the above-described laser welding step, the overall degree of passivation does not affect the degree of passivation of the prepared titanium-coated copper electrodes, and even It is also possible to increase the pitting potential (compared to one of the unprocessed cold rolled titanium). Since the blunt voltage does not change significantly, it can be seen that the titanium-coated copper electrode obtained in the embodiment of the present invention is similar in degree of passivation to the unprocessed (non-laser-welded) cold-rolled titanium material, so the embodiment of the present invention The prepared titanium-coated copper electrode is not easily passivated. On the other hand, since the higher the pitting potential represents the better pitting resistance of the material, the titanium-coated copper electrode after the laser welding step can obtain more excellent pitting corrosion resistance.

請參照第1圖所示,本發明實施例之鈦包銅電極的製造方法10最後係步驟14:對該第二金屬胚進行一軋延步驟以形成該鈦包銅電極,其中該鈦包銅電極的總軋延比率大於或等於85%。在本步驟14中,該軋延步驟可以係一熱軋步驟,其中該熱軋步驟具有一熱軋溫度介於500℃至800℃之間,以及在該熱軋步驟中係以5℃/秒至15℃/秒的一冷卻速率進行冷卻至到達200℃至300℃之一完冷溫度為止。在一實施例中,在一開始進行該熱軋步驟時,可預先將該第二金屬胚加熱達介於750℃至900℃之間並持溫20~45分鐘,以使該第二金屬胚受熱均勻。值得一提的是,該鈦包銅電極的總軋延比率需要大於或等於85%的原因在於,透過軋延的方式使該冷軋鈦板及該冷軋銅板的界面產生接合效果,還可進一步避免微裂縫的產生。另外,該總軋延比率可能大於100%,例如該鈦包銅電極的長度在軋延前為10毫米(mm),在軋延後為30毫米,該總軋延比率即為200%。在又一實施例中,在進行步驟14之後,還可對到達該完冷溫度之鈦包銅電極進行一水冷步驟,以使該鈦包銅電極降溫至室溫。 Referring to FIG. 1 , a method for manufacturing a titanium-coated copper electrode according to an embodiment of the present invention is finally a step 14 : performing a rolling step on the second metal blank to form the titanium-coated copper electrode, wherein the titanium-coated copper The total rolling ratio of the electrodes is greater than or equal to 85%. In this step 14, the rolling step may be a hot rolling step, wherein the hot rolling step has a hot rolling temperature between 500 ° C and 800 ° C, and 5 ° C / sec in the hot rolling step. Cooling is carried out to a cooling rate of from 200 ° C to 300 ° C at a cooling rate of 15 ° C / sec. In an embodiment, when the hot rolling step is started, the second metal embryo may be heated in advance between 750 ° C and 900 ° C and held for 20 to 45 minutes to make the second metal embryo. Heat evenly. It is worth mentioning that the reason why the total rolling ratio of the titanium-coated copper electrode needs to be greater than or equal to 85% is that the interface between the cold-rolled titanium plate and the cold-rolled copper plate is joined by rolling, and Further avoid the generation of micro cracks. In addition, the total rolling ratio may be greater than 100%. For example, the length of the titanium-coated copper electrode is 10 mm (mm) before rolling, and 30 mm after rolling, and the total rolling ratio is 200%. In still another embodiment, after step 14 is performed, a titanium-clad electrode that reaches the cooling temperature may be subjected to a water cooling step to cool the titanium-coated copper electrode to room temperature.

綜上所述,本發明實施例之鈦包銅電極的製造方法,依序透過冷軋鈦板及冷軋銅板的組裝、焊接與軋延步驟來製得該鈦包銅電極,可避免微裂縫或心部縮孔缺陷的產生。 In summary, the method for manufacturing a titanium-coated copper electrode according to the embodiment of the present invention sequentially obtains the titanium-coated copper electrode through the assembly, welding and rolling steps of the cold-rolled titanium plate and the cold-rolled copper plate, thereby avoiding micro-cracks. Or the generation of defects in the core.

雖然本發明已以較佳實施例揭露,然其並非用以限制本發明,任何熟習此項技藝之人士,在不脫離本發明之精神和範圍內,當可作各種更動與修飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。 The present invention has been disclosed in its preferred embodiments, and is not intended to limit the invention, and the present invention may be modified and modified without departing from the spirit and scope of the invention. The scope of protection is subject to the definition of the scope of the patent application.

10‧‧‧方法 10‧‧‧ method

11‧‧‧步驟 11‧‧‧Steps

12‧‧‧步驟 12‧‧‧ steps

13‧‧‧步驟 13‧‧‧Steps

14‧‧‧步驟 14‧‧‧Steps

Claims (10)

一種鈦包銅電極的製造方法,其包含步驟:提供一冷軋銅板;進行一包覆步驟,通過至少二冷軋鈦殼包覆該冷軋銅板以形成一第一金屬胚,其中該第一金屬胚露出該冷軋銅板之頭尾二端;對該第一金屬胚進行一焊接步驟,焊接該些冷軋鈦殼的至少一接縫處以形成一第二金屬胚;及對該第二金屬胚進行一軋延步驟以形成該鈦包銅電極,其中該鈦包銅電極的總軋延比率大於或等於85%。 A method for manufacturing a titanium-coated copper electrode, comprising the steps of: providing a cold-rolled copper plate; performing a coating step of coating the cold-rolled copper plate with at least two cold-rolled titanium shells to form a first metal blank, wherein the first a metal embryo exposing the ends of the cold-rolled copper sheet; performing a welding step on the first metal blank, welding at least one seam of the cold-rolled titanium shells to form a second metal blank; and forming the second metal The embryo is subjected to a rolling step to form the titanium-clad copper electrode, wherein the titanium-clad copper electrode has a total rolling ratio of greater than or equal to 85%. 如申請專利範圍第1項所述之鈦包銅電極的製造方法,其中該些冷軋鈦殼的數量是二個,以及該些冷軋鈦殼之其中一個具有呈一U字型之橫剖面,該些冷軋鈦殼之另一個具有呈一平板型之橫剖面。 The method for manufacturing a titanium-coated copper electrode according to claim 1, wherein the number of the cold-rolled titanium shells is two, and one of the cold-rolled titanium shells has a U-shaped cross section. The other of the cold rolled titanium shells has a flat cross section. 如申請專利範圍第1項所述之鈦包銅電極的製造方法,其中該些冷軋鈦殼的數量是四個,以及該些冷軋鈦殼中的二個具有呈一平板型之橫剖面,該些冷軋鈦殼中的另外二個具有呈圓弧型之剖面。 The method for manufacturing a titanium-coated copper electrode according to claim 1, wherein the number of the cold-rolled titanium shells is four, and two of the cold-rolled titanium shells have a flat cross section. The other two of the cold rolled titanium shells have a circular arc profile. 如申請專利範圍第1項所述之鈦包銅電極的製造方法,其中該焊接步驟係一雷射焊接步驟,該雷射焊接步驟具有一雷射功率介於1500瓦至2500瓦之間,及一移行速度介於1000毫米/分至8000毫米/分之間。 The method for manufacturing a titanium-coated copper electrode according to claim 1, wherein the soldering step is a laser welding step having a laser power of between 1,500 watts and 2,500 watts, and A moving speed is between 1000 mm/min and 8000 mm/min. 如申請專利範圍第4項所述之鈦包銅電極的製造方法,其中該雷射焊接步驟係在一保護氣體下進行,其中該保護氣體 包含一氬氣,且該保護氣體之一氣體流量係介於20升/分至30升/分之間。 The method for manufacturing a titanium-coated copper electrode according to claim 4, wherein the laser welding step is performed under a shielding gas, wherein the shielding gas An argon gas is included, and one of the shielding gas gas flows between 20 liters/minute and 30 liters/minute. 如申請專利範圍第1項所述之鈦包銅電極的製造方法,其中該軋延步驟係一熱軋步驟,其中該熱軋步驟具有一熱軋溫度介於500℃至800℃之間,以及在該熱軋步驟中係以5℃/秒至15℃/秒的一冷卻速率進行冷卻至到達200℃至300℃之一完冷溫度為止。 The method for producing a titanium-coated copper electrode according to claim 1, wherein the rolling step is a hot rolling step, wherein the hot rolling step has a hot rolling temperature between 500 ° C and 800 ° C, and In the hot rolling step, cooling is performed at a cooling rate of 5 ° C / sec to 15 ° C / sec until reaching a cooling temperature of 200 ° C to 300 ° C. 如申請專利範圍第6項所述之鈦包銅電極的製造方法,其中在該熱軋步驟之後更包含:對到達該完冷溫度之鈦包銅電極進行一水冷步驟。 The method for manufacturing a titanium-coated copper electrode according to claim 6, wherein after the hot rolling step, the method further comprises: performing a water cooling step on the titanium-clad electrode reaching the cold temperature. 如申請專利範圍第1項所述之鈦包銅電極的製造方法,其中該些冷軋鈦殼的一平均晶粒尺寸係介於20微米至40微米之間。 The method for producing a titanium-coated copper electrode according to claim 1, wherein the cold rolled titanium shell has an average grain size of between 20 μm and 40 μm. 如申請專利範圍第1項所述之鈦包銅電極的製造方法,其中該冷軋銅板的一平均晶粒尺寸係介於10微米至50微米之間。 The method for producing a titanium-coated copper electrode according to claim 1, wherein the cold-rolled copper plate has an average grain size of between 10 μm and 50 μm. 如申請專利範圍第1項所述之鈦包銅電極的製造方法,其中該冷軋銅板係純度為99.95%至100%之無氧銅板。 The method for producing a titanium-clad copper electrode according to claim 1, wherein the cold-rolled copper plate is an oxygen-free copper plate having a purity of 99.95% to 100%.
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JPH04103798A (en) * 1990-08-21 1992-04-06 Kobe Steel Ltd Production of platinum clad titanium electrode material
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CN102912373A (en) * 2009-06-08 2013-02-06 昆明理工大学 Method for manufacturing composite electrode plate in titanium-cladded copper layer shape by using spray deposition method
CN205141075U (en) * 2015-10-27 2016-04-06 苏州攀特电陶科技股份有限公司 Electrode with titanium oxide base ceramic coating

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04103798A (en) * 1990-08-21 1992-04-06 Kobe Steel Ltd Production of platinum clad titanium electrode material
US20030116241A1 (en) * 2000-12-27 2003-06-26 Sakiko Tomonaga Titanium-made cathode electrode for producing electrolytic oper foil, rotary cathode drum using the titanium-made cathode electrode, method of producing titanium material using titanium-made cathod electrode and method of coorecting/working titanium material for titanium-made cathode electrode
CN102912373A (en) * 2009-06-08 2013-02-06 昆明理工大学 Method for manufacturing composite electrode plate in titanium-cladded copper layer shape by using spray deposition method
CN205141075U (en) * 2015-10-27 2016-04-06 苏州攀特电陶科技股份有限公司 Electrode with titanium oxide base ceramic coating

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