TWI566931B - Non-substrate type adhesive transper tape for transper printing and preparation method thereof - Google Patents
Non-substrate type adhesive transper tape for transper printing and preparation method thereof Download PDFInfo
- Publication number
- TWI566931B TWI566931B TW104101403A TW104101403A TWI566931B TW I566931 B TWI566931 B TW I566931B TW 104101403 A TW104101403 A TW 104101403A TW 104101403 A TW104101403 A TW 104101403A TW I566931 B TWI566931 B TW I566931B
- Authority
- TW
- Taiwan
- Prior art keywords
- release
- layer
- film
- substrate
- adhesive
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/26—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
- B41M5/382—Contact thermal transfer or sublimation processes
- B41M5/38207—Contact thermal transfer or sublimation processes characterised by aspects not provided for in groups B41M5/385 - B41M5/395
- B41M5/38214—Structural details, e.g. multilayer systems
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Laminated Bodies (AREA)
- Duplication Or Marking (AREA)
- Adhesive Tapes (AREA)
- Decoration By Transfer Pictures (AREA)
Description
本說明書揭示一種對產業用機器、IT電子機器(電話、平板電腦、電視等)等面板及螢幕實施圖案、印刷、蒸鍍等之裝飾時,可以轉印方式實施裝飾之用於轉印印刷的無基材黏著轉印帶及其製造方法。 This specification discloses a method for performing transfer printing on a panel or a screen such as an industrial machine or an IT electronic device (telephone, tablet, television, etc.), such as patterning, printing, vapor deposition, or the like. A substrate-free adhesive transfer belt and a method of manufacturing the same.
在使用於產業用機器及IT電子機器(電話、平板電腦、電視等)等面板及螢幕之強化玻璃(例如觸控螢幕面板之強化玻璃)上實施裝飾。 It is used for decoration on panels and screen tempered glass (such as tempered glass for touch screen panels) used in industrial equipment and IT electronic equipment (telephone, tablet, TV, etc.).
用於此種裝飾之一種方式係在強化玻璃上直接進行圖案之形成、印刷或金屬蒸鍍。 One method for such decoration is to directly form a pattern, print, or metal vapor deposition on the tempered glass.
但是,在強化玻璃上直接賦予裝飾效果之方式,存在強化玻璃價格高、以及因生產合格率低無法避免生產成本提高的問題。 However, in the manner in which the decorative effect is directly imparted to the tempered glass, there is a problem that the price of the tempered glass is high and the production cost is lowered because the production yield is low.
另外,參照韓國專利公開公報第2013-0071582號之內容,其使用在防止飛散膜上進行圖案之形成、印刷、金屬蒸鍍等,再將該防止飛散膜黏貼於強化玻璃之方式。 In addition, Japanese Laid-Open Patent Publication No. 2013-0071582 discloses a method of forming a pattern on a scattering film, printing, metal deposition, or the like, and adhering the scattering preventing film to the tempered glass.
圖1係顯示過去之防止飛散膜的製造方法之概略圖,圖2係顯示過去之防止飛散膜之構造剖面的概略圖。 Fig. 1 is a schematic view showing a conventional method for preventing a scattering film, and Fig. 2 is a schematic view showing a structural section of a conventional scattering preventing film.
具體而言,如圖1所示,過去之防止飛散膜係在基材膜(Substrate Film)(1)之一面形成底層(2)後,在該基材膜(1)之相反面形成黏著層3。其次,貼合該黏著層(3)與離型膜層(4)。其次,在底層(2)之上面黏貼保護膜層(5),來製造如圖2所示之防止飛散膜。由於該防止飛散膜係夾著黏貼底層(2)與黏著層(3)之基材膜(1)而設置離型膜層(4)與保護膜層(5),因此亦稱 為附基材黏著膜。 Specifically, as shown in FIG. 1, in the past, the scattering preventing film is formed on the opposite side of the substrate film (1) after forming the underlayer (2) on one side of the substrate film (1). 3. Next, the adhesive layer (3) and the release film layer (4) are bonded. Next, a protective film layer (5) is adhered to the upper layer (2) to produce a scattering preventing film as shown in FIG. Since the scattering preventing film is provided with the release film layer (4) and the protective film layer (5) sandwiching the base film (1) of the adhesive layer (2) and the adhesive layer (3), it is also called Adhesive film is attached to the substrate.
前述防止飛散膜在薄膜製作後之工序中,於除去保護膜層(5)後,在底層之上面以圖案、印刷、蒸鍍等形成印刷及圖案層(6),除去離型膜層(4)後,黏貼於強化玻璃等之附著體(7)(參照圖1)。結果,藉由將防止飛散膜之印刷及圖案層(6)黏貼於如強化玻璃的附著體7,可實施裝飾。 In the step of preventing the scattering film from being formed after the film is formed, after the protective film layer (5) is removed, the printing and pattern layer (6) is formed on the upper surface of the underlayer by pattern, printing, vapor deposition, or the like, and the release film layer is removed. After that, it is adhered to the adherend (7) of tempered glass or the like (see Fig. 1). As a result, the decoration can be carried out by adhering the printing and pattern layer (6) of the scattering preventing film to the adhering body 7 such as tempered glass.
然而,以前述方法製造之防止飛散膜因為在中間部夾入基材膜(1),所以整體厚度相當厚(參考數據:基材膜之厚度通常為50~125μm),特別是底層(2)、基材膜(1)及黏著層(3)各個厚度合計通常達到80~155μm程度。 However, the anti-scattering film manufactured by the above method has a relatively thick overall thickness because the base film (1) is sandwiched in the intermediate portion (reference data: the thickness of the substrate film is usually 50 to 125 μm), particularly the bottom layer (2). The thickness of each of the base film (1) and the adhesive layer (3) is usually about 80 to 155 μm.
再者,如上述,因為基材膜夾入中間部,所以也有光學特性非常差的問題(防止飛散膜通常全光線透過率為88~92%,霧度(Haze)為1%的水準)。 Further, as described above, since the base film is sandwiched between the intermediate portions, there is a problem that the optical characteristics are extremely poor (the scattering film is prevented from having a total light transmittance of 88 to 92% and a haze of 1%).
本發明之實施例一方面之目的為提供一種對產業用機器及IT電子機器(電話、平板電腦、電視等)之面板及螢幕裝飾時,比起在面板之強化玻璃等上直接實施裝飾的方式,不僅可輕易實施裝飾,還可降低生產成本之用於轉印印刷的無基材黏著轉印帶及其製造方法。 An object of an embodiment of the present invention is to provide a method for directly performing decoration on a panel and a screen of an industrial machine and an IT electronic device (telephone, tablet, television, etc.) compared to a tempered glass of a panel. A substrate-free adhesive transfer belt for transfer printing and a method of manufacturing the same, which can not only easily carry out decoration but also reduce production cost.
此外,本發明之實施例另一方面之目的為提供一種可減少黏著帶厚度,且可確保優異之光特性的用於轉印印刷之無基材黏著轉印帶及其製造方法。 Further, another object of an embodiment of the present invention is to provide a substrate-free adhesive transfer belt for transfer printing which can reduce the thickness of an adhesive tape and which can ensure excellent light characteristics, and a method of manufacturing the same.
此外,本發明之實施例隻另一目的為提供一種為了在轉印前形成印刷及圖案層而從轉印印刷用無基材帶除去離型膜時,不致因底層浮起或隧道現象等產生變形或損傷,從底層輕易除去一方離型膜,且黏著層上不產生變形或損傷,而可將黏著層保持於另一方離型膜上之用於轉印印刷的無基材黏著轉印帶及其製造方法。 Further, it is only another object of the embodiment of the present invention to provide a method for removing a release film from a substrate-less tape for transfer printing in order to form a printing and pattern layer before transfer, without causing a floating phenomenon or a tunnel phenomenon. Deformation or damage, a substrate-free adhesive transfer tape for transfer printing that can be easily removed from the bottom layer without any deformation or damage on the adhesive layer, and the adhesive layer can be held on the other release film. And its manufacturing method.
此外,本發明之實施例之又另一目的為提供一種可提高前述轉印印刷用無基材膜之高溫及高濕可靠性的轉印印刷用無基材帶之製造方法。 Further, another object of the embodiment of the present invention is to provide a method for producing a substrateless tape for transfer printing which can improve the high temperature and high humidity reliability of the substrate-free film for transfer printing.
本發明之實施例提供一種用於轉印印刷之無基材黏著轉印帶,其特徵包含:一輕剝離離型膜;一底層,其係位於該輕剝離離型膜一方之面;一黏著層,其係位於該底層一方之面;及一中剝離離型膜,其係位於該黏著層一方之面;該輕剝離離型膜由一第一基礎膜及與該底層接觸之一第一離型層構成,該中剝離離型膜由第二基礎膜及與該黏著層接觸之一第二離型層構成,該輕剝離離型膜之剝離力比該中剝離離型膜之剝離力小。 Embodiments of the present invention provide a substrate-free adhesive transfer tape for transfer printing, comprising: a light release release film; a bottom layer disposed on a side of the light release release film; a layer on a side of the bottom layer; and a peeling release film on the side of the adhesive layer; the light release release film is firstly contacted by a first base film and the bottom layer The release layer is composed of a second base film and a second release layer in contact with the adhesive layer, and the peeling force of the light release release film is lower than the peeling force of the release release film small.
例示之實施例中,該底層與該輕剝離離型膜之剝離力係P1,該黏著層與該中剝離離型膜之剝離力係P2,且P2/P1係2.0~5.0。 In the illustrated embodiment, the peeling force of the bottom layer and the light release release film is P1, the peeling force of the adhesive layer and the medium release release film is P2, and the P2/P1 system is 2.0 to 5.0.
例示之實施例中,該底層與該輕剝離離型膜之剝離力P1係1~5gf/25mm,該黏著層與該中剝離離型膜之剝離力P2係2~25gf/25mm。 In the illustrated embodiment, the peeling force P1 of the underlayer and the light release release film is 1 to 5 gf/25 mm, and the peeling force P2 of the adhesive layer and the medium release release film is 2 to 25 gf/25 mm.
例示之實施例中,該黏著層之黏著力宜係1000gf~3000gf/25mm。 In the illustrated embodiment, the adhesion of the adhesive layer is preferably from 1000 gf to 3000 gf/25 mm.
例示之實施例中,該底層之表面張力宜比該輕剝離離型膜之第一離型層的表面張力低。 In the illustrated embodiment, the surface tension of the underlayer is preferably lower than the surface tension of the first release layer of the light release liner.
例示之實施例中,該第一離型層之表面張力宜係35~45dyne。 In the illustrated embodiment, the surface tension of the first release layer is preferably 35 to 45 dyne.
例示之實施例中,該底層之表面張力宜係25~35dyne。 In the illustrated embodiment, the surface tension of the bottom layer is preferably 25 to 35 dyne.
例示之實施例中,該第一離型層以該底層表面不致因該第一基礎膜之表面粗度而產生起伏的方式塗布於該第一基礎膜,例如可具有0.5~3g/m2之離型劑塗布量。 In an exemplary embodiment, the first release layer is applied to the first base film in such a manner that the bottom surface does not cause undulation due to the surface roughness of the first base film, and may have, for example, 0.5 to 3 g/m 2 . Release agent coating amount.
例示之實施例中,該底層於熱硬化後,宜與黏著層貼合。 In the illustrated embodiment, the underlayer is preferably bonded to the adhesive layer after heat curing.
例示之實施例中,該底層與該黏著層的厚度之和宜為10~30μm。 In the illustrated embodiment, the sum of the thickness of the underlayer and the adhesive layer is preferably 10 to 30 μm.
例示之實施例中,該無基材黏著轉印帶之全光線透過率可為99%以上,且霧度為0.15%以下。 In the illustrated embodiment, the substrate-free adhesive transfer belt may have a total light transmittance of 99% or more and a haze of 0.15% or less.
本發明又其他實施例中提供一種用於轉印印刷之無基材黏著轉印帶的製造方法,該無基材黏著轉印帶係堆疊一輕剝離離型膜、一底層、一黏著層、及一中剝離離型膜。 In still another embodiment of the present invention, there is provided a method for manufacturing a substrate-free adhesive transfer tape for transfer printing, wherein the substrate-free adhesive transfer tape is stacked with a light release release film, a bottom layer, an adhesive layer, And peeling off the release film.
例示之實施例中,該製造方法包含以下階段:在第一基礎膜一方之面形成第一離型層,而形成輕剝離離型膜;在該第一離型層上形成底層;在第二基礎膜上形成第二離型層,而形成中剝離離型膜;在該第二離型層 上形成黏著層;及貼合形成有該黏著層之中剝離離型膜與形成有該底層之輕剝離離型膜。 In an exemplified embodiment, the manufacturing method comprises the steps of: forming a first release layer on a side of the first base film to form a light release release film; forming a bottom layer on the first release layer; Forming a second release layer on the base film to form a medium release release film; in the second release layer An adhesive layer is formed on the adhesive layer; and the release release film and the light release release film formed with the underlayer are formed in the adhesive layer.
例示之實施例中,該製造方法包含以下階段:在第一基礎膜一方之面形成第一離型層,而形成輕剝離離型膜;在該第一離型層上形成底層;在該底層上形成黏著層;在第二基礎膜上形成第二離型層,而形成中剝離離型膜;及貼合形成有該黏著層與底層之輕剝離離型膜與該中剝離離型膜。此外,此時,底層宜在底組合物熱硬化後與黏著層貼合。 In an exemplified embodiment, the manufacturing method comprises the steps of: forming a first release layer on a side of the first base film to form a light release release film; forming a bottom layer on the first release layer; Forming an adhesive layer thereon; forming a second release layer on the second base film to form a medium release release film; and laminating the light release release film having the adhesive layer and the bottom layer and the medium release release film. Further, at this time, the underlayer is preferably bonded to the adhesive layer after the base composition is thermally cured.
採用本發明之實施例時,對產業用機器及IT電子機器(電話、平板電腦、電視等)之面板及螢幕裝飾時,因為並非對面板之強化玻璃等上直接實施裝飾,而係以轉印方式輕易實施裝飾,所以比起對強化玻璃等直接實施裝飾,可輕易實施裝飾且可降低生產成本。 When the embodiment of the present invention is used for the decoration of panels and screens of industrial equipment and IT electronic equipment (telephone, tablet, television, etc.), it is not directly applied to the tempered glass of the panel, but is transferred. Since the decoration is easy to implement, the decoration can be easily implemented and the production cost can be reduced as compared with the direct decoration of the tempered glass.
此外,藉由採用基材膜不介於底層與黏著層之間的無基材(non-substrate)方式,可減少整個黏著膜之厚度且可確保優異的光特性。 Further, by using a non-substrate method in which the base film is not interposed between the underlayer and the adhesive layer, the thickness of the entire adhesive film can be reduced and excellent light characteristics can be ensured.
再者,藉由在轉印印刷用無基材帶中之底層上形成輕剝離離型膜,並在黏著層上形成中剝離離型膜,使底層與黏著層間之剝離力不同,於轉印前之印刷及圖案部形成時,輕剝離離型膜不致從印刷及形成圖案部之底層浮起或產生隧道現象等,而可輕易除去,並且底層與黏著層可保持於中剝離離型膜上,可避免在底層與黏著層上產生變形或損傷等。 Furthermore, by forming a light release release film on the underlayer in the substrateless tape for transfer printing, and forming a release release film on the adhesive layer, the peeling force between the bottom layer and the adhesive layer is different, and the transfer is performed. When the front printing and pattern portions are formed, the light release release film is not easily floated from the bottom layer of the printing and patterning portion, or is tunneled, etc., and can be easily removed, and the underlayer and the adhesive layer can be held on the intermediate release film. It can avoid deformation or damage on the bottom layer and the adhesive layer.
再者,還可提高轉印印刷用無基材膜之高溫及高濕可靠性。 Further, the high temperature and high humidity reliability of the substrate-free film for transfer printing can be improved.
1‧‧‧基材膜 1‧‧‧Base film
2‧‧‧底層 2‧‧‧ bottom layer
3‧‧‧黏著層 3‧‧‧Adhesive layer
4‧‧‧離型膜層 4‧‧‧ release film
5‧‧‧保護膜層 5‧‧‧Protective film
6‧‧‧印刷及圖案層 6‧‧‧Printing and patterning
7‧‧‧附著體 7‧‧‧ Attachment
10‧‧‧輕剝離離型膜 10‧‧‧Light peeling release film
11‧‧‧第一基礎膜 11‧‧‧First base film
12‧‧‧第一離型層 12‧‧‧First release layer
20‧‧‧底層 20‧‧‧ bottom layer
30‧‧‧黏著層 30‧‧‧Adhesive layer
40‧‧‧中剝離離型膜 40‧‧‧ peeling release film
41‧‧‧第二離型層 41‧‧‧Second release layer
42‧‧‧第二基礎膜 42‧‧‧Second base film
50‧‧‧印刷及圖案層 50‧‧‧Printed and patterned layers
60‧‧‧載體膜 60‧‧‧ carrier film
70‧‧‧強化玻璃 70‧‧‧Strengthened glass
100‧‧‧(轉印及印刷前之)無基材黏著轉印帶 100‧‧‧ (Before transfer and printing) non-substrate adhesive transfer tape
101‧‧‧轉印前印刷後之無基材黏著轉印帶 101‧‧‧No substrate adhesive transfer tape after printing
102‧‧‧轉印後之無基材黏著轉印帶 102‧‧‧Transfer-free substrate-free adhesive transfer belt
圖1係概略顯示過去之防止飛散膜的製造方法及使用其之裝飾效果的具體表現方法之流程圖。 Fig. 1 is a flow chart schematically showing a conventional method for producing a scattering preventing film and a specific expression method for using the decorative effect thereof.
圖2係顯示過去之防止飛散膜的構造剖面之概略圖。 Fig. 2 is a schematic view showing a structural section of a conventional scattering preventing film.
圖3係顯示本發明例示之一個實施例的無基材黏著轉印帶之構造剖面的概略圖。 Fig. 3 is a schematic view showing a structural cross section of a substrate-free adhesive transfer belt according to an embodiment of the present invention.
圖4係概略顯示本發明例示之一個實施例的轉印印刷用無基材黏著轉印帶之製造方法及使用其之裝飾效果的具體表現方法之流程圖。 Fig. 4 is a flow chart schematically showing a method of manufacturing a substrate-free adhesive transfer belt for transfer printing according to an embodiment of the present invention and a concrete expression method for using the same.
圖5係概略顯示本發明例示之另一個實施例的轉印印刷用無基材黏 著轉印帶之製造方法及使用其之裝飾效果的具體表現方法之流程圖。 Figure 5 is a schematic view showing a substrate-free adhesive for transfer printing according to another embodiment of the present invention. A flow chart of a method for producing a transfer belt and a specific expression method for using the decorative effect thereof.
圖6係在本發明例示之另一個實施例之無基材黏著轉印帶中除去輕剝離離型膜,實施印刷、蒸鍍等裝飾加工,貼合了載體膜而裝飾後之轉印前黏著帶的構造剖面之概略圖。 Fig. 6 is a view showing a non-substrate adhesive transfer tape of another embodiment of the present invention, in which a light release release film is removed, and a decorative process such as printing, vapor deposition, or the like is applied, and a carrier film is bonded and decorated before transfer. A schematic view of the structural section of the belt.
圖7係顯示在圖6中裝飾後之黏著膜中,進一步除去中剝離離型膜,轉印於強化玻璃,除去載體膜之轉印後無基材黏著轉印帶的構造剖面之概略圖。 Fig. 7 is a schematic view showing a structural cross section of a non-substrate-adhesive transfer belt after transfer of the detached release film in the adhesive film after the decoration in Fig. 6 and transfer to the tempered glass to remove the carrier film.
以下,參照附圖詳細說明本發明之實施例。 Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
本說明書中,所謂無基材(non-substrate)黏著轉印帶,係指輕剝離離型膜與中剝離離型膜之間僅存在底層與黏著層,不夾入形成底層與黏著層之基材的黏著轉印帶,而使印刷及圖案層轉印於面板或螢幕等之附著體的轉印帶。此為與夾入形成有底層與黏著層之基材的附基材黏著帶對比。 In the present specification, the non-substrate adhesive transfer belt means that only the underlying layer and the adhesive layer are present between the lightly peeling release film and the medium release release film, and the base layer and the adhesive layer are not sandwiched. The transfer belt of the material is transferred to the transfer belt of the attachment of the panel or the screen. This is in contrast to the attached substrate adhesive tape sandwiched between the substrate on which the underlayer and the adhesive layer are formed.
本說明書中所謂附著體,係指適用本發明實施例之轉印印刷用無基材黏著轉印帶的構件,例如係對組裝於一般產業用機器、IT電子產品及顯示裝置等之強化玻璃面板或螢幕等實施裝飾的構件。 The term "adhered body" as used in the present specification refers to a member to which a substrate-free adhesive transfer belt for transfer printing according to an embodiment of the present invention is applied, and is, for example, a tempered glass panel that is assembled in general industrial equipment, IT electronic products, and display devices. Or a decorative component such as a screen.
本說明書中所謂印刷及圖案層,係指實施圖案之形成、印刷、蒸鍍等裝飾的層。 The term "printing and pattern layer" as used herein refers to a layer that performs decoration such as pattern formation, printing, and vapor deposition.
本說明書中所謂輕剝離離型膜,係指剝離力比中剝離離型膜低之膜。 The term "light release release film" as used herein means a film having a lower peeling force than a release release film.
本說明書中所謂中剝離離型膜,係指剝離力比輕剝離離型膜高之膜。 The term "peel release film" as used herein refers to a film having a higher peeling force than a light release release film.
圖3係顯示本發明例示之一個實施例的一(轉印及印刷前之)無基材黏著轉印帶(100)之構造剖面的概略圖。 Fig. 3 is a schematic cross-sectional view showing a structure of a substrate-free adhesive transfer belt (100) (for transfer and printing) according to an embodiment of the present invention.
如圖3所示,本發明之該(轉印及印刷前之)無基材黏著轉印帶(100)具有堆疊一輕剝離離型膜(10)、一底層(20)、一黏著層(30)、一中剝離離型膜(40)之構造。該輕剝離離型膜(10)由一第一基礎膜(11)及一第一離型層(12)構成,該第一離型層(12)與該底層(20)接觸,該中剝離離型膜(40)由一第二 基礎膜(42)及一第二離型層(41)構成,該第二離型層(41)與該黏著層(30)接觸。 As shown in FIG. 3, the (transfer and pre-transfer) substrate-free adhesive transfer belt (100) of the present invention has a stack of a light release release film (10), a bottom layer (20), and an adhesive layer ( 30), a structure in which the release film (40) is peeled off. The light release release film (10) is composed of a first base film (11) and a first release layer (12), and the first release layer (12) is in contact with the bottom layer (20). Release film (40) consists of a second The base film (42) and a second release layer (41) are formed, and the second release layer (41) is in contact with the adhesive layer (30).
本發明實施例之轉印印刷用無基材黏著轉印帶,其轉印前之印刷及圖案的形成係直接實施於底層。亦即,該底層(20)成為形成有印刷及圖案層之印刷及圖案層形成部。因此,需要先剝離該輕剝離離型膜(10),在其剝離時需要避免在底層上產生浮起或隧道現象,及其他變形或損傷。此外,該底層(20)與該黏著層(30)需要確實黏貼於該中剝離離型膜(40)。 In the substrate-free adhesive transfer belt for transfer printing according to the embodiment of the present invention, the printing and pattern formation before transfer are directly performed on the underlayer. That is, the underlayer (20) is a printing and pattern layer forming portion in which a printing and pattern layer is formed. Therefore, it is necessary to peel off the light release release film (10) first, and it is necessary to avoid floating or tunneling on the bottom layer, and other deformation or damage when it is peeled off. In addition, the underlayer (20) and the adhesive layer (30) need to be adhered to the release liner film (40).
例示之實施例中,該底層(20)與該輕剝離離型膜(10)之剝離力係P1,該黏著層(30)與該中剝離離型膜(40)之剝離力係P2時,P2/P1宜為2.0~5.0。 In the illustrated embodiment, the peeling force of the bottom layer (20) and the light release release film (10) is P1, and the peeling force of the adhesive layer (30) and the medium release release film (40) is P2. P2/P1 should be 2.0~5.0.
因為該輕剝離離型膜(10)與中剝離離型膜之離型力的差異小時,在除去該輕剝離離型膜(10)時會損傷該黏著層(30)或該底層(20),所以宜儘量提高該輕剝離離型膜(10)及該中剝離離型膜(40)間之離型力的差異。 Because the difference in the release force of the light release release film (10) and the medium release release film is small, the adhesion layer (30) or the bottom layer (20) may be damaged when the light release release film (10) is removed. Therefore, it is desirable to increase the difference in the release force between the light release release film (10) and the release release film (40).
一個實施形態中,該輕剝離離型膜(10)之剝離力宜為1~5gf/25mm,該中剝離離型膜(40)之剝離力宜為2~25gf/25mm。該輕剝離離型膜(10)之剝離力未達1gf/25mm時,因為與該底層(20)發生浮起或隧道現象等問題而不易保護該底層(20),此外,超過5gf/25mm時,當剝該離輕剝離離型膜(10)時該底層(20)或該黏著層(30)會被剝離。 In one embodiment, the peeling force of the light release release film (10) is preferably from 1 to 5 gf/25 mm, and the peeling force of the release release film (40) is preferably from 2 to 25 gf/25 mm. When the peeling force of the light release release film (10) is less than 1 gf/25 mm, the underlayer (20) is not easily protected by problems such as floating or tunneling with the underlayer (20), and when it exceeds 5 gf/25 mm The underlayer (20) or the adhesive layer (30) may be peeled off when peeling off the light release release film (10).
另外,該中剝離離型膜(40)之離型剝離力宜即使在70℃下放置24小時後,該中剝離離型膜(40)之剝離力仍不超過30gf/25mm。其理由是因形成印刷及圖案層後在該印刷及圖案層上黏貼一載體膜(60),該中剝離離型膜(40)與該黏著層(30)間之剝離力比該載體膜(60)與印刷及圖案層間之剝離力高時,也可能剝離中剝離離型膜(40)困難。 Further, the release force of the release release film (40) is preferably such that the peeling force of the intermediate release film (40) does not exceed 30 gf / 25 mm even after being left at 70 ° C for 24 hours. The reason is that a carrier film (60) is adhered to the printing and pattern layer after the printing and pattern layer is formed, and the peeling force between the peeling release film (40) and the adhesive layer (30) is higher than that of the carrier film ( 60) When the peeling force between the printing and pattern layers is high, it may be difficult to peel off the release film (40) during peeling.
以下為各構成之詳述。 The following is a detailed description of each configuration.
該第一基礎膜(11)及該第二基礎膜(42)係由具有耐熱性之材料構成的光學用薄膜,且包含耐熱性樹脂(例如,聚對苯二甲酸乙二醇酯(Polyethylene terephthalate;PET)、聚2,6萘二甲酸乙二酯(Polyethylene naphthalate)、聚對苯二甲酸丁二醇酯(Polybuthylene terephthalate)等之聚脂(Polyester)樹脂),並宜為PET薄膜,該第一基礎膜(11)及/或該第二基礎膜 (42)之厚度無限制的例示可為具有25~188μm範圍之厚度。 The first base film (11) and the second base film (42) are optical films made of a heat resistant material, and include a heat resistant resin (for example, polyethylene terephthalate). PET), polyethylene naphthalate, polybutylene terephthalate, etc., and preferably PET film, the first a base film (11) and/or the second base film An unlimited limitation of the thickness of (42) may be a thickness having a range of 25 to 188 μm.
一個實施形態中,該第一基礎膜(11)及/或該第二基礎膜(42)之拉伸強度在MD方向(寬度方向)可為22.0±8kgf/mm2,在TD方向(長度方向)可為30.0±9kgf/mm2。此外,該第一基礎膜(11)及/或該第二基礎膜(42)之伸展率,在MD方向可為150±80%,在TD方向可為100±80%。 In one embodiment, the tensile strength of the first base film (11) and/or the second base film (42) may be 22.0±8 kgf/mm 2 in the MD direction (width direction) in the TD direction (longitudinal direction). ) can be 30.0 ± 9kgf / mm 2 . Further, the elongation ratio of the first base film (11) and/or the second base film (42) may be 150±80% in the MD direction and 100±80% in the TD direction.
另外,一個實施形態中,該第二基礎膜(42)(中剝離離型膜之基礎膜)宜為配向角係6°(度)以下的薄膜。更具體而言,配向角宜為0~6°。配向角係指製造該第二基礎膜(42)時基礎膜延伸之角度,此表示配向主軸之斜度。前述配向角之角度為6°以下時,在以後工序將黏著膜黏貼於附著體時,容易看到存在於附著體之雜質。因而,可提高對附著體檢查雜質時的精度。 Further, in one embodiment, the second base film (42) (the base film of the intermediate release film) is preferably a film having an alignment angle of 6 (degrees) or less. More specifically, the alignment angle is preferably 0 to 6°. The alignment angle refers to the angle at which the base film extends when the second base film (42) is manufactured, which indicates the inclination of the alignment main axis. When the angle of the alignment angle is 6 or less, when the adhesive film is adhered to the adherend in a later step, impurities existing in the adherend are easily observed. Therefore, the accuracy in checking the impurities on the adherend can be improved.
塗布於該第一基礎膜(11)表面之該第一離型層(12)宜具有用於形成該底層(20)之高表面張力(比底層高之表面張力),並且宜具有與該底層(20)之界面低的離型力。 The first release layer (12) coated on the surface of the first base film (11) preferably has a high surface tension (higher surface tension than the bottom layer) for forming the bottom layer (20), and preferably has a bottom layer (20) The low release force at the interface.
該第一離型層(12)之表面張力宜為30~50dyne,更宜為35~45dyne。該第一離型層(12)之離型劑並無特別限制,不過宜使用非矽系之三聚氰胺系或丙烯酸系離型劑,此外,硬化方式可使用藉由熱之硬化方式或是藉由紫外線之硬化方式。 The surface tension of the first release layer (12) is preferably from 30 to 50 dyne, more preferably from 35 to 45 dyne. The release agent of the first release layer (12) is not particularly limited, but a non-lanthanum melamine-based or acrylic release agent is preferably used. Further, the hardening method may be performed by heat hardening or by heat. UV hardening method.
包含於該第一離型層(12)之離型劑的塗布量並無特別限制,不過考慮剝離性能,宜在0.3~4g/m2之範圍,更宜在0.5~3g/m2之範圍。前述塗布量低時,因為該第一基礎膜(11)之表面粗度會影響該底層(20)(亦即,避免因第一基礎膜之表面粗度而在底層表面產生起伏),所以宜維持一定塗布量。 The coating amount of the release agent contained in the first release layer (12) is not particularly limited, but in view of the release property, it is preferably in the range of 0.3 to 4 g/m 2 , more preferably in the range of 0.5 to 3 g/m 2 . . When the coating amount is low, since the surface roughness of the first base film (11) affects the bottom layer (20) (that is, avoiding undulation on the bottom surface due to the surface roughness of the first base film), Maintain a certain amount of coating.
該第二離型層(41)之離型劑亦無特別限制,不過為了適用對丙烯酸黏著劑發揮離型物性之附加型矽系,宜在乾燥溫度130℃以下製作。此因在130℃以上製作時,因薄膜之熱收縮而發生橫皺紋及/縱皺紋。此外,不加熱之矽系離型劑亦可使用紫外線硬化型之丙烯矽、含氫硫基矽、及含環氧基矽。 The release agent of the second release layer (41) is not particularly limited. However, in order to apply an additional type which has a release property to an acrylic adhesive, it is preferably produced at a drying temperature of 130 ° C or lower. When the film is produced at 130 ° C or higher, transverse wrinkles and/or vertical wrinkles occur due to heat shrinkage of the film. Further, as the unheated oxime release agent, an ultraviolet ray-curable acryl hydrazine, a hydrazine-containing hydrazine, and an epoxy group-containing oxime may be used.
該離型層(第一及/或第二離型層)對基礎膜(第一及/或第二基 礎膜)之形成,使用在該技術領域中一般使用之塗布法即可。具體而言,例如以凹輥塗布、梅耶桿塗布(Meyer bar coating)、氣刀塗布、及刮刀塗布等各種方法將離型劑塗布於基礎膜後,以加熱處理、紫外線照射等方法使其乾燥、硬化即可形成。 The release layer (first and/or second release layer) to the base film (first and / or second base) The formation of the base film can be carried out by a coating method generally used in the technical field. Specifically, for example, the release agent is applied to the base film by various methods such as gravure coating, Meyer bar coating, air knife coating, and blade coating, and then subjected to heat treatment, ultraviolet irradiation, or the like. It can be formed by drying and hardening.
另外,該底層(20)之情況,在爾後工序中形成於該底層(20)上之印刷及圖案層與該底層(20)的附著力很重要。因而,必須形成比印刷及圖案層之樹脂(例如,紫外線硬化型樹脂及印刷油墨樹脂)高的表面張力。此外,為了在該輕剝離離型膜(10)上形成該底層(20),該底層(20)之表面張力必須比該輕剝離離型膜(10)之該第一離型層(12)的表面張力低。因而,該底層(20)之表面張力宜為25~35dyne。可使用於底層之材料可使用胺基甲酸酯丙烯酸酯、丙烯基丙烯酸酯、環氧丙烯酸酯等單體、低聚物、聚合物等組合而構成者,並可依硬化方式添加光開始劑或硬化劑。 Further, in the case of the underlayer (20), the adhesion of the printing and pattern layer formed on the underlayer (20) to the underlayer (20) in the subsequent process is important. Therefore, it is necessary to form a surface tension higher than that of the resin of the printing and pattern layer (for example, an ultraviolet curable resin and a printing ink resin). Furthermore, in order to form the underlayer (20) on the light release release film (10), the surface tension of the bottom layer (20) must be higher than the first release layer (12) of the light release release film (10). The surface tension is low. Therefore, the surface tension of the bottom layer (20) is preferably 25 to 35 dyne. The material for the underlayer can be formed by using a combination of a monomer such as urethane acrylate, acryl acrylate or epoxy acrylate, an oligomer, a polymer, etc., and a photoinitiator can be added in a hardened manner. Or hardener.
該底層(20)之形成亦可使用在該技術領域中一般使用之塗布法來實施。具體而言,以凹輥塗布、梅耶桿塗布(Meyer bar coating)、縫口模頭塗布、氣刀塗布、及刮刀塗布等各種方法將底層組合物塗布於該第一離型層(12)上後,以熱硬化或紫外線硬化等方法使其乾燥、硬化即可達成。 The formation of the underlayer (20) can also be carried out using a coating method generally used in the art. Specifically, the underlayer composition is applied to the first release layer (12) by various methods such as gravure coating, Meyer bar coating, slot die coating, air knife coating, and blade coating. After drying, it can be achieved by drying or hardening by heat hardening or ultraviolet curing.
例示之實施例中,於形成該底層(20)時,宜使用熱硬化方式。此因,可達成該底層(20)與該黏著層(30)之化學性結合強化,在該黏著層(30)與該底層(20)附著性方面可獲得高度可靠性。相對於紫外線硬化方式係在硬化反應完成,而熱硬化方式之該底層(20)維持在未反應狀態,而可保留以後與該黏著層(30)之化學性結合的狀態,在該黏著層(30)與該底層(20)之附著力方面可獲得高度可靠性。 In the illustrated embodiment, when the underlayer (20) is formed, it is preferred to use a thermosetting method. For this reason, chemical bonding strengthening of the underlayer (20) and the adhesive layer (30) can be achieved, and high reliability can be obtained in terms of adhesion of the adhesive layer (30) to the underlayer (20). The hardening reaction is completed with respect to the ultraviolet curing method, and the underlayer (20) of the thermosetting mode is maintained in an unreacted state, and the state of chemical bonding with the adhesive layer (30) can be retained in the adhesive layer ( 30) High reliability is obtained in terms of adhesion to the underlayer (20).
另外,該黏著層(30)可適用在該技術領域中一般使用之所有黏著劑。 Further, the adhesive layer (30) can be applied to all of the adhesives generally used in the art.
例示之實施例中,黏著劑組合物之主要成分宜為丙烯酸系共聚合物。更宜使用確保透明性之聚合具有4~20個碳原子之丙烯酸酯單體而獲得的共聚合物。若使用20個以上碳原子之單體而共聚合時,因p軌道(Orbital)干擾而產生立體障礙(Steric hindrance)導致未反應之單體比率增加,在附著可靠性中產生氣泡、斑點等問題。另外,使用4個以下碳原子之單體而共 聚合時,容易產生氣化,導致內部壓力增加,從而引起共聚合不平衡及安全上的問題。 In the illustrated embodiment, the main component of the adhesive composition is preferably an acrylic copolymer. It is more preferable to use a copolymer obtained by polymerizing an acrylate monomer having 4 to 20 carbon atoms to ensure transparency. When a monomer of 20 or more carbon atoms is used for copolymerization, steric hindrance due to interference of the orbital (Orbital) causes an increase in the ratio of unreacted monomers, and bubbles, spots, and the like occur in adhesion reliability. . In addition, a total of 4 or less carbon atoms are used. At the time of polymerization, vaporization easily occurs, resulting in an increase in internal pressure, causing problems of copolymerization imbalance and safety.
一個實施形態中,合成前述丙烯酸系共聚合物時,宜進一步包含可交聯之官能團。不含官能團之共聚合物者,黏著劑間之凝聚力差,在評估可靠性時產生浮起、氣泡、轉移等問題。官能團宜使用單獨之羧基、單獨之羥基、或複合性包含羧基與羥基之單體。更宜使用僅有羥基之單體。含有羧基之單體者,可能因強大反應力而產生附著表面腐蝕或氧化,對產品可靠性帶來不良影響。 In one embodiment, when the acrylic copolymer is synthesized, it is preferred to further contain a crosslinkable functional group. In the case of a copolymer having no functional group, the cohesive force between the adhesives is poor, and problems such as floating, bubbles, and transfer occur when reliability is evaluated. The functional group is preferably a monomer having a carboxyl group, a single hydroxyl group, or a complex comprising a carboxyl group and a hydroxyl group. It is more preferred to use a monomer having only a hydroxyl group. A monomer containing a carboxyl group may cause corrosion or oxidation of the adhesion surface due to a strong reaction force, which may adversely affect product reliability.
一個實施形態中,前述共聚合物之構造,基於強化凝聚力及耐用性之目的,宜使用與羥基具有反應性之交聯劑。交聯劑可使用二異氰酸酯、4官能環氧化物、金屬螯合物、醯胺、胺等化合物。其中,最宜使用可保持黏著劑之透明度且與各種表面層具有優異密合性之具有六甲撐二異氰酸酯(HMDI)構造的異氰酸酯化合物者。 In one embodiment, the structure of the above-mentioned copolymer is preferably a crosslinking agent reactive with a hydroxyl group for the purpose of enhancing cohesive force and durability. As the crosslinking agent, a compound such as a diisocyanate, a tetrafunctional epoxide, a metal chelate compound, a guanamine or an amine can be used. Among them, an isocyanate compound having a hexamethylene diisocyanate (HMDI) structure which can maintain the transparency of the adhesive and has excellent adhesion to various surface layers is preferably used.
一個實施形態中,黏著劑之分子量宜約為70~150萬,剝離轉移溫度(Tg)宜為-50~-10℃。前述剝離轉移溫度若過低,則黏著劑之凝聚力降低,此外,若剝離轉移溫度過高,則與附著體之黏著性降低。 In one embodiment, the molecular weight of the adhesive is preferably about 700 to 1.5 million, and the peeling transfer temperature (Tg) is preferably -50 to -10 °C. When the peeling transition temperature is too low, the cohesive force of the adhesive is lowered, and if the peeling transition temperature is too high, the adhesion to the adherend is lowered.
此外,一個實施形態中,使交聯劑與黏著劑官能團反應,凝膠分率宜為60%以上,更宜為60~80%。前述凝膠分率愈高該黏著層(30)之凝聚力及耐熱性愈優,在物性方面優異,不過藉由超過80%之凝膠分率導致該黏著層(30)過硬時,在無基材黏著轉印帶黏貼於附著體狀態下,而在高溫、高濕條件下保管時,會產生氣泡或是產生隧道現象。 Further, in one embodiment, the crosslinking agent is reacted with the adhesive functional group, and the gel fraction is preferably 60% or more, more preferably 60 to 80%. The higher the gel fraction, the better the cohesive force and heat resistance of the adhesive layer (30), and the excellent physical properties. However, when the adhesive layer (30) is too hard by a gel fraction of more than 80%, there is no basis. The adhesive tape is adhered to the attached body, and when stored under high temperature and high humidity conditions, bubbles or tunneling may occur.
一個實施形態中,前述黏著劑組合物中亦可添加矽烷耦合劑。前述矽烷耦合劑宜為含有環氧基之矽烷耦合劑。矽烷耦合劑之環氧基與共聚合物之反應性基結合,藉由烷氧基矽烷部分與適用黏著劑之附著體結合,擔任提高接著穩定性,且在高溫及高濕條件下長期間放置時防止接著力惡化之角色。 In one embodiment, a decane coupling agent may be added to the adhesive composition. The aforementioned decane coupling agent is preferably a cyclodecane coupling agent containing an epoxy group. The epoxy group of the decane coupling agent is combined with the reactive group of the copolymer, and the alkoxy decane moiety is combined with the adhesive of the applicable adhesive to improve the stability of the bonding, and is placed for a long period of time under high temperature and high humidity conditions. The role of preventing the deterioration of the force.
其他,一個實施形態中,在前述黏著劑組合物中,基於特定之目的,可進一步混合使用可塑劑、環氧樹脂、及硬化劑等,並可依一般性目的進一步添加紫外線穩定劑、防氧化劑等。 In another embodiment, in the adhesive composition, a plasticizer, an epoxy resin, a curing agent, or the like may be further blended for specific purposes, and a UV stabilizer or an antioxidant may be further added for general purposes. Wait.
非限制性之例示為該黏著層(30)對於丙烯酸系黏著劑組合物100重量部,可含有異氰酸酯系硬化劑0.1~0.3重量部及矽烷耦合劑0.01~1.0重量部。此外,對於丙烯酸系黏著劑組合物100重量部可含有環氧系硬化劑0.1~2.0重量部。 By way of non-limiting example, the adhesive layer (30) may contain 0.1 to 0.3 parts by weight of the isocyanate curing agent and 0.01 to 1.0 part by weight of the decane coupling agent to 100 parts by weight of the acrylic pressure-sensitive adhesive composition. Further, the weight portion of the acrylic pressure-sensitive adhesive composition may contain 0.1 to 2.0 parts by weight of the epoxy-based curing agent.
一個實施形態中,該黏著層(30)之塗布量宜為5~50g/m2。更宜為10~20g/m2。塗布量未達5g/m2時,附著力顯著降低,在可靠性評估時會發生浮起之問題,若50g/m2以上時,因黏著劑特有之黏彈性會產生按壓阻力等的問題。 In one embodiment, the adhesive layer (30) is preferably applied in an amount of 5 to 50 g/m 2 . More preferably 10~20g/m 2 . When the coating amount is less than 5 g/m 2 , the adhesion is remarkably lowered, and the problem of floating occurs during the reliability evaluation. When the coating amount is 50 g/m 2 or more, the adhesion resistance due to the adhesive viscoelasticity of the adhesive may occur.
此外,該黏著層(30)宜具有1000~3000gf/25mm之黏著力。黏著力未達1000gf/25mm時,在黏貼於附著體之狀態下,在高溫及高濕條件下保管時會發生氣泡或隧道現象。此外,超過3000gf/25mm時,與強化玻璃等附著體發生貼合不良時無法除去,導致生產成本提高。 In addition, the adhesive layer (30) preferably has an adhesion of 1000 to 3000 gf / 25 mm. When the adhesion is less than 1000gf/25mm, bubbles or tunneling may occur when stored under high temperature and high humidity conditions while being adhered to the attached body. In addition, when it exceeds 3000 gf / 25 mm, it cannot remove in the case where it is badly bonded to the attachment body, such as a tempered glass, and it raises the manufacturing cost.
黏著劑之塗布可採用在該技術領域中一般使用之塗布法來實施,雖然不特別限制,不過具體而言可利用金屬型塗布機、夾輥塗布機、輪轉凹輥塗布機、點塗塗布機(Comma coater)等來實施。 The application of the adhesive can be carried out by a coating method generally used in the art, and although not particularly limited, specifically, a metal coater, a nip coater, a rot roll coater, a spot coater can be used. (Comma coater) and so on.
本發明例示之實施例的轉印印刷用無基材黏著轉印帶可形成極薄,該底層(20)及該黏著層(30)的厚度之和約為10~30μm。 The substrate-free adhesive transfer belt for transfer printing according to the exemplified embodiment of the present invention can be formed to be extremely thin, and the sum of the thicknesses of the underlayer (20) and the adhesive layer (30) is about 10 to 30 μm.
此外,本發明例示之實施例的轉印印刷用無基材黏著轉印帶光學特性宜特別優異,例如可顯示全光線透過率90%以上,更宜可顯示全光線透過率99%以上。 Further, the substrate-less adhesive transfer belt for transfer printing according to the embodiment of the present invention is preferably excellent in optical characteristics, for example, exhibiting a total light transmittance of 90% or more, and more preferably exhibiting a total light transmittance of 99% or more.
以下,詳述本發明實施例之製造方法。 Hereinafter, the manufacturing method of the embodiment of the present invention will be described in detail.
本發明之實施例可堆疊一輕剝離離型膜(10)、一底層(20)、一黏著層(30)及一中剝離離型膜(40)來製造前述的無基材黏著轉印帶。 The embodiment of the present invention can stack a light release release film (10), a bottom layer (20), an adhesive layer (30) and a release release film (40) to manufacture the aforementioned substrate-free adhesive transfer tape. .
圖4係概略顯示本發明例示之一個實施例的轉印印刷用無基材黏著轉印帶之製造方法的流程圖。 Fig. 4 is a flow chart schematically showing a method of manufacturing a substrate-free adhesive transfer sheet for transfer printing according to an embodiment of the present invention.
一個實施例中,本發明之轉印方式的無基材黏著轉印帶之製造方法如圖4所示,在一第一基礎膜(11)一方之面形成一第一離型層(12),而形成該輕剝離離型膜(10)(圖4之A),在該第一離型層(12)上形成該底層(20)(圖4之B),並在一第二基礎膜(42)上形成一第二離型層(41)而形成該中 剝離離型膜(40),在此形成該黏著層(30)後,將該黏著層(30)與該底層(20)貼合(圖4之C),即可製造無基材黏著轉印帶(圖4之D)。 In one embodiment, a method for manufacturing a substrate-free adhesive transfer belt of the transfer method of the present invention is as shown in FIG. 4, and a first release layer (12) is formed on a surface of a first base film (11). Forming the light release release film (10) (A of FIG. 4), forming the bottom layer (20) on the first release layer (12) (B of FIG. 4), and forming a second base film Forming a second release layer (41) on (42) to form the middle After peeling off the release film (40), after forming the adhesive layer (30), the adhesive layer (30) is bonded to the bottom layer (20) (Fig. 4C), and the substrate-free adhesive transfer can be manufactured. Belt (D of Figure 4).
圖5係概略顯示本發明例示之其他實施例的轉印印刷用無基材黏著轉印帶之製造方法的流程圖。 Fig. 5 is a flow chart schematically showing a method of manufacturing a substrate-free adhesive transfer belt for transfer printing according to another embodiment of the present invention.
其他一個實施例中,本發明之轉印方式的無基材黏著轉印帶之製造方法如圖5所示,在該第一基礎膜(11)一方之面形成該第一離型層(12),而形成該輕剝離離型膜(10)(圖5之A),在該第一離型層(12)上形成該底層(20)(圖5之B),並在該底層(20)上形成該黏著層(30),且將在該第二基礎膜(42)上形成有該第二離型層(41)之該中剝離離型膜(40)與該黏著層(30)貼合(圖5之C'),可製造無基材黏著轉印帶(圖5之D)。 In another embodiment, the method for manufacturing the substrate-free adhesive transfer belt of the transfer method of the present invention is as shown in FIG. 5, and the first release layer is formed on one side of the first base film (11). And forming the light release release film (10) (A of FIG. 5), forming the bottom layer (20) (B of FIG. 5) on the first release layer (12), and at the bottom layer (20) Forming the adhesive layer (30), and the intermediate release film (40) and the adhesive layer (30) on which the second release layer (41) is formed on the second base film (42) The adhesive (Fig. 5, C') can be used to produce a substrate-free adhesive transfer belt (Fig. 5, D).
前述製造方法中,宜採用圖5所示之方式製造者,因其比圖4所示之製造方法,該底層(20)與該黏著層(30)之附著性優異,且可提高轉印印刷用無基材膜之高溫及高濕可靠性。 In the above manufacturing method, it is preferable to use a method as shown in FIG. 5, because the adhesion between the underlayer (20) and the adhesive layer (30) is superior to that of the manufacturing method shown in FIG. 4, and transfer printing can be improved. High temperature and high humidity reliability without substrate film.
以前述製造方法所製造之無基材黏著轉印帶可實施爾後工序(轉印前之印刷工序)。亦即,再度參考圖4中之E及圖5之E時,爾後工序係在除去該輕剝離離型膜(10)[該第一基礎膜(11)+該第一離型層(12)]後實施圖案、印刷及蒸鍍加工等,而形成印刷及圖案層(50)後,在前述印刷及圖案層上黏貼一載體膜(60),在如圖6所示之轉印前之印刷後的無基材黏著轉印帶(101)(參照圖6)。 The substrate-free adhesive transfer belt manufactured by the above-described production method can be subjected to a post-process (printing process before transfer). That is, when referring again to E in FIG. 4 and E in FIG. 5, the subsequent process is to remove the light release release film (10) [the first base film (11) + the first release layer (12) After performing the pattern, printing, vapor deposition, etc., and forming the printing and pattern layer (50), a carrier film (60) is adhered to the printing and pattern layer, and the printing is performed before the transfer as shown in FIG. The subsequent substrate-free adhesive transfer belt (101) (see Fig. 6).
另外,再度參照圖4中之F及圖5之F時,從該轉印前之無基材黏著轉印帶(101)除去該中剝離離型膜(40)[該第二基礎膜(42)+該第二離型層(41)]即可轉印於如強化玻璃(70)之一附著體。此外,除去該載體膜(60)時,最後可製造如圖7所示之構造的轉印後之無基材黏著轉印帶(2)、(102)(參照圖7)。 Further, when referring again to F in FIG. 4 and F in FIG. 5, the intermediate release film (40) is removed from the substrate-free adhesive transfer belt (101) before the transfer [the second base film (42) + The second release layer (41)] can be transferred to an attachment such as one of tempered glass (70). Further, when the carrier film (60) is removed, the transfer-free substrate-free adhesive transfer belts (2) and (102) having the structure shown in Fig. 7 can be finally produced (see Fig. 7).
以下,舉本發明之實施例進一步詳述本發明的實施例。下述實施例不過是為了幫助理解本發明而提供者,並非藉由此等而限定本發明之範圍者。 Hereinafter, embodiments of the invention will be further described in detail by way of examples of the invention. The following examples are provided to assist the understanding of the present invention and are not intended to limit the scope of the invention.
[實施例1] [Example 1]
在由聚對苯二甲酸乙二醇酯構成之第一基礎膜(厚度75μm)一方 之面上,對三聚氰胺系樹脂100重量部配合硬化劑1重量部與有機溶劑300重量部實施凹輥塗布,形成第一離型層(厚度0.7μm)。 In the first base film (thickness 75 μm) composed of polyethylene terephthalate On the surface of the melamine resin, 100 parts by weight of the melamine-based resin was blended with the weight portion of the curing agent and 300 parts by weight of the organic solvent to form a first release layer (thickness: 0.7 μm).
其次,在該第一離型層上,對胺基甲酸酯丙烯酸酯100重量部配合硬化劑3重量部、丙烯酸系均化劑0.2重量部及有機溶劑300重量部實施凹輥塗布,形成底層(厚度5μm)後,將該底層以紫外線硬化。 Next, on the first release layer, the urethane acrylate 100 parts by weight of the curing agent 3 parts by weight, the acrylic leveling agent 0.2 parts by weight, and the organic solvent 300 parts by weight are subjected to concave roll coating to form an underlayer. After the thickness (5 μm), the underlayer was cured by ultraviolet rays.
另外,另行在由聚對苯二甲酸乙二醇酯構成之第二基礎膜(厚度100μm)一方之面上,對矽離型劑100重量部配合硬化劑1重量部及有機溶劑600重量部實施凹輥塗布,形成第二離型層(厚度0.7μm)。 Further, on the surface of the second base film (thickness: 100 μm) made of polyethylene terephthalate, the weight of the release agent 100 is added to the weight of the hardener 1 and the weight of the organic solvent by 600 parts. The concave roll was coated to form a second release layer (thickness 0.7 μm).
在該第二離型層上,對包含作為官能團之羥基的丙烯酸系共聚合物100重量部配合異氰酸酯系硬化劑0.2重量部及有機溶劑50重量部,實施縫口模頭塗布,形成黏著層(厚度10μm)後,與該底層貼合來製造無基材黏著轉印帶(參照圖4)。 In the second release layer, 100 parts by weight of the acrylic copolymer containing a hydroxyl group as a functional group is blended with 0.2 parts by weight of an isocyanate-based curing agent and 50 parts by weight of an organic solvent, and a slit die is applied to form an adhesive layer ( After the thickness was 10 μm, the substrate was bonded to the underlayer to produce a substrate-free adhesive transfer belt (see Fig. 4).
[實施例2] [Embodiment 2]
與前述實施例1比較,除了形成底層後,將該黏著層直接縫口模頭塗布於底層上後,貼合中剝離離型膜之外,以相同方法製造無基材黏著轉印帶(參照圖5)。 In comparison with the first embodiment, after the underlayer is formed, the adhesive layer direct-slot die is applied to the underlayer, and then the substrate-free adhesive transfer tape is produced in the same manner except that the release film is peeled off during the bonding (refer to Figure 5).
[實施例3] [Example 3]
與前述實施例1比較,除了底層(厚度5μm)為對胺基甲酸酯丙烯酸酯100重量部配合硬化劑5重量部及有機溶劑300重量部,以凹輥塗布法形成後,將該底層熱硬化之外,以相同方法製造無基材黏著轉印帶。 Compared with the foregoing Example 1, except that the bottom layer (thickness 5 μm) is a weight of 5 parts by weight of the urethane acrylate, 5 parts by weight of the hardener, and 300 parts by weight of the organic solvent, after the formation by the concave roll coating method, the bottom layer is heated. In addition to hardening, a substrate-free adhesive transfer belt was produced in the same manner.
[比較例1] [Comparative Example 1]
在聚對苯二甲酸乙二醇酯基材膜(厚度100μm)一方之面形成底層(厚度5μm)後,在相反側之面形成黏著層(厚度25μm)。底層與黏著層之構成與實施例1相同。 After the underlayer (thickness: 5 μm) was formed on the surface of the polyethylene terephthalate base film (thickness: 100 μm), an adhesive layer (thickness: 25 μm) was formed on the surface on the opposite side. The constitution of the underlayer and the adhesive layer is the same as that of the first embodiment.
其次,將該黏著層黏貼於離型膜層(離型膜層之構成與前述實施例的中剝離離型膜層相同),並在底層之上面黏貼由聚對苯二甲酸乙二醇酯構成的保護膜層(厚度60μm),來製造比較例1之薄膜。 Next, the adhesive layer is adhered to the release film layer (the release film layer has the same structure as the release release film layer of the foregoing embodiment), and is adhered to the bottom layer by polyethylene terephthalate. A protective film layer (thickness: 60 μm) was used to produce a film of Comparative Example 1.
[比較例2] [Comparative Example 2]
與前述比較例1比較,依序堆疊厚度不同之保護膜層(厚度60μm)、 底層(厚度5μm)、基材膜層(厚度50μm)、黏著層(厚度25μm)、及離型膜層(厚度75μm),來製造比較例2之薄膜。 Compared with the foregoing Comparative Example 1, the protective film layers (thickness 60 μm) having different thicknesses are sequentially stacked, A film of Comparative Example 2 was produced by a primer layer (thickness: 5 μm), a base film layer (thickness: 50 μm), an adhesive layer (thickness: 25 μm), and a release film layer (thickness: 75 μm).
[實驗例] [Experimental example]
對實施例及比較例的樣品進行物性測定。 The physical properties of the samples of the examples and the comparative examples were measured.
對前述實施例1~3之無基材黏著轉印帶進行離型剝離力、黏著力的測定。另外,對比較例1~2之薄膜,因為不具輕剝離離型膜、中剝離離型膜,所以僅進行黏著力之測定。 The release adhesive force and the adhesive force of the substrate-free adhesive transfer belts of the above Examples 1 to 3 were measured. Further, in the films of Comparative Examples 1 and 2, since the light release film and the release film were not peeled off, only the adhesion was measured.
具體而言,將製造之實施例及比較例的樣品在機械方向切割成寬度25mm×長度250mm之大小 Specifically, the samples of the manufactured examples and comparative examples were cut in the machine direction to have a width of 25 mm and a length of 250 mm.
對實施例1~3使用黏著力測定器(CKP-5000),採用180°剝離測試(Peel Test)方式,以300m/min之剝離速度剝離,來測定輕剝離離型剝離力。此外,將進行離型剝離實驗之測試片以自動貼合機(負重2kg)貼合於TESA 7475帶上,在25±2℃下保管30分鐘。使用黏著力測定器(CKP-5000),採用180°剝離測試方式,以300m/min之剝離速度剝離,來進行中剝離離型剝離力的測定。將進行實驗之測試片以自動貼合機(負重2kg)貼合於玻璃或不銹鋼板(SUS板)(此為對應於附著體者),並在25±2℃下保管30分鐘。使用黏著力測定器(CKP-5000),採用180°剝離測試方式,以300m/min之剝離速度剝離,來進行黏著力的測定。 For each of Examples 1 to 3, an adhesive force measuring device (CKP-5000) was used, and the peeling force at a peeling speed of 300 m/min was peeled off by a 180° peeling test method to measure the light peeling release peeling force. Further, the test piece subjected to the release peeling test was attached to a TESA 7475 tape by an automatic laminator (load: 2 kg), and stored at 25 ± 2 ° C for 30 minutes. The peeling peeling force was measured by using an adhesion tester (CKP-5000) by a 180° peeling test method and peeling at a peeling speed of 300 m/min. The test piece to be tested was attached to a glass or stainless steel plate (SUS plate) (this corresponds to the attached body) by an automatic laminator (load weight 2 kg), and stored at 25 ± 2 ° C for 30 minutes. The adhesion was measured by using an adhesion tester (CKP-5000) using a 180° peel test method and peeling at a peeling speed of 300 m/min.
對比較例1及2除去離型膜後,利用自動貼合機(負重2kg)貼合於玻璃或SUS板(此為對應於附著體者)上,並在25±2℃下保管30分鐘。使用黏著力測定器(CKP-5000),採用180°剝離測試方式,以300m/min之剝離速度剝離,來進行黏著力的測定。 After removing the release film of Comparative Examples 1 and 2, the film was bonded to a glass or SUS plate (here, corresponding to the adherend) by an automatic laminator (load: 2 kg), and stored at 25 ± 2 ° C for 30 minutes. The adhesion was measured by using an adhesion tester (CKP-5000) using a 180° peel test method and peeling at a peeling speed of 300 m/min.
另外,對實施例1~3及比較例1~2進行全光線透過率、霧度的測定,並進行高溫、高濕可靠性評估。 Further, in Examples 1 to 3 and Comparative Examples 1 and 2, total light transmittance and haze were measured, and high-temperature and high-humidity reliability evaluation was performed.
霧度使用JIS K7136規格,並以NDH2000裝備進行測定。 The haze was measured using JIS K7136 and equipped with NDH2000 equipment.
全光線透過率使用JIS K7361規格,並以NDH2000裝備進行測定。 The total light transmittance was measured using JIS K7361 specifications and equipped with NDH2000 equipment.
高溫及高濕可靠性評估係在強化玻璃上貼合各個樣品後,在85℃、85%之RH條件下放置72小時後,於測試片表面以1mm之等間隔縱橫切成11列切口形成100分量後,黏貼3M 810D膠帶,確認剝離時底層與黏 著層界面有無脫離。 The high-temperature and high-humidity reliability evaluation was carried out by adhering each sample to the tempered glass, and after standing at 85 ° C and 85% RH for 72 hours, the surface of the test piece was cut into 11 rows of slits at intervals of 1 mm to form 100 slits. After the component, stick the 3M 810D tape and confirm the bottom layer and stickiness when peeling off. Whether the layer interface is detached.
若底層與黏著層界面毫無脫離時評估為「非常良好」。此外,若底層與黏著層介面之間有一部分脫離時評估為「普通」。 It is evaluated as "very good" if there is no separation between the bottom layer and the adhesive layer interface. In addition, it is evaluated as "ordinary" if there is a part of the separation between the bottom layer and the adhesive layer interface.
表1係表示對實施例之輕剝離離型膜之底層的剝離力P1、對中剝離離型膜之黏著層的剝離力P2者。 Table 1 shows the peeling force P1 of the underlayer of the lightly peeling release film of the example, and the peeling force P2 of the adhesive layer of the centering peeling release film.
表2係表示其他物性測定之結果者。 Table 2 shows the results of other physical property measurements.
*◎:非常良好,△:普通 *◎: Very good, △: Normal
*該表中之全厚度,係指底層厚度+基材膜層厚度+黏著層厚度。 * The full thickness in this table refers to the thickness of the bottom layer + the thickness of the base film layer + the thickness of the adhesive layer.
從前述表可確認本發明實施例1~3之無基材黏著轉印帶在底層與黏著層之間不介有基材膜,而過去之防止飛散膜的比較例1~2介有基材膜。 It can be confirmed from the above table that the substrate-free adhesive transfer belts of Examples 1 to 3 of the present invention do not have a substrate film between the underlayer and the adhesive layer, and the comparative examples 1 to 2 of the conventional method for preventing the scattering film are provided with a substrate. membrane.
比較例1~2之底層、基礎膜及黏著層的各個厚度之和達130μm(比較例1)或80μm(比較例2),而實施例1~3因為不介有基材膜層所以底層及黏著層的厚度之和可顯著減低為15μm。 The sum of the thicknesses of the underlayer, the base film, and the adhesive layer of Comparative Examples 1 to 2 was 130 μm (Comparative Example 1) or 80 μm (Comparative Example 2), and Examples 1 to 3 did not have a base film layer, and the bottom layer and The sum of the thicknesses of the adhesive layers can be remarkably reduced to 15 μm.
亦即,本發明例示之實施例的無基材黏著轉印帶與過去方式比較,可薄膜化且可實現薄膜之薄厚度化。此外,實施例1~3顯示全光線透過率達99%以上,且霧度(%)也顯示在0.15%以下之非常優異的值,可確認具有優異之光學特性。 That is, the substrate-free adhesive transfer belt of the exemplified embodiment of the present invention can be thinned and thinned in thickness as compared with the conventional method. Further, in Examples 1 to 3, the total light transmittance was 99% or more, and the haze (%) was also found to be a very excellent value of 0.15% or less, and it was confirmed that the optical properties were excellent.
另外,本發明例示之實施例的無基材黏著轉印帶中,特別是在底層直接塗布黏著層之實施例2,在高溫、高濕可靠性方面顯示比實施例1優異的結果。此外,將底層熱硬化後之實施例3的情況,即使按照實施例1之製造方法,在高溫、高濕可靠性方面,仍顯示優異的結果。因此,在高溫、高濕可靠性方面應該按照實施例2之製造方法(參照圖5),或是將底層熱硬化,最好應該按照實施例2之製造方法(參照圖5)並且將底層熱硬化。 Further, in the substrate-free adhesive transfer belt of the exemplified embodiment of the present invention, in particular, Example 2 in which the adhesive layer was directly applied to the underlayer, showed excellent results in terms of high temperature and high humidity reliability as compared with Example 1. Further, in the case of Example 3 in which the underlayer was thermally cured, even in accordance with the production method of Example 1, excellent results were exhibited in terms of high temperature and high humidity reliability. Therefore, in terms of high temperature and high humidity reliability, the manufacturing method of Example 2 (refer to FIG. 5) or the underlayer is thermally cured, preferably in accordance with the manufacturing method of Embodiment 2 (refer to FIG. 5) and the underlying heat is applied. hardening.
10‧‧‧輕剝離離型膜 10‧‧‧Light peeling release film
11‧‧‧第一基礎膜 11‧‧‧First base film
12‧‧‧第一離型層 12‧‧‧First release layer
20‧‧‧底層 20‧‧‧ bottom layer
30‧‧‧黏著層 30‧‧‧Adhesive layer
40‧‧‧中剝離離型膜 40‧‧‧ peeling release film
41‧‧‧第二離型層 41‧‧‧Second release layer
42‧‧‧第二基礎膜 42‧‧‧Second base film
100‧‧‧(轉印及印刷前之)無基材黏著轉印帶 100‧‧‧ (Before transfer and printing) non-substrate adhesive transfer tape
Claims (15)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020140041354A KR101530591B1 (en) | 2014-04-07 | 2014-04-07 | Non-substrate type adhesive tape for transper printing and preparation method thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201538318A TW201538318A (en) | 2015-10-16 |
TWI566931B true TWI566931B (en) | 2017-01-21 |
Family
ID=53519545
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104101403A TWI566931B (en) | 2014-04-07 | 2015-01-16 | Non-substrate type adhesive transper tape for transper printing and preparation method thereof |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5986242B2 (en) |
KR (1) | KR101530591B1 (en) |
CN (1) | CN104972779B (en) |
TW (1) | TWI566931B (en) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101831939B1 (en) | 2015-06-24 | 2018-02-26 | (주)세일하이텍 | Swelling tape comprising polyurethane flim and method for manufacturing same |
KR101803884B1 (en) * | 2015-12-16 | 2017-12-04 | 율촌화학 주식회사 | Non-substrate type transparent conductive films using detach manner and method for manufacturing the same |
KR101803885B1 (en) * | 2015-12-16 | 2017-12-04 | 율촌화학 주식회사 | Non-substrate type ultra thin transparent electrode and method for manufacturing the same |
KR101729168B1 (en) * | 2016-02-01 | 2017-04-25 | 율촌화학 주식회사 | Adhesive tape for protecting surface of cover glass for touch panel and method for preparing the same |
KR101924445B1 (en) * | 2017-01-02 | 2019-02-22 | 율촌화학 주식회사 | Silicon-based adhesive tape and method of preparing the same |
KR101847980B1 (en) * | 2017-06-23 | 2018-04-11 | 율촌화학 주식회사 | Non-substrate adhesive tape for transfer printing having reinforced scattering resistance |
KR102028718B1 (en) * | 2017-07-24 | 2019-10-07 | (주)코반케미칼 | Decoration film manufacturing method capable of implementing multi color using laminating process |
WO2019108439A2 (en) * | 2017-11-28 | 2019-06-06 | Rubin Eliot I | Multi-layered decorative wrap and method of use of the same |
KR101916680B1 (en) | 2018-01-25 | 2018-11-12 | 율촌화학 주식회사 | Thermosensitive non-substrate adhesive film |
KR102262068B1 (en) * | 2018-07-13 | 2021-06-09 | 주식회사 엘지화학 | Adhesive composition and substrate-less adhesive tape |
JP7100541B2 (en) | 2018-08-29 | 2022-07-13 | 日本カーバイド工業株式会社 | Laminate manufacturing method and laminate |
KR102328313B1 (en) | 2020-10-21 | 2021-11-18 | (주)한울 | Ink composition for silcon cutting sheet and process for preparing the same |
CN113561465B (en) * | 2021-07-28 | 2023-04-28 | 东莞市聚龙高科电子技术有限公司 | Plastic product surface 3D texture forming method and plastic product |
CN114574113A (en) * | 2022-03-17 | 2022-06-03 | 苏州达翔新材料有限公司 | Substrate-free adhesive tape transferring equipment and adhesive tape transferring method thereof |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW450889B (en) * | 1998-12-25 | 2001-08-21 | Nitto Denko Corp | Release liner and pressure-sensitive adhesive sheet |
TW201406917A (en) * | 2012-07-19 | 2014-02-16 | 日東電工股份有限公司 | Pressure-sensitive adhesive sheet, electric or electronic device member laminate and optical member laminate |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW300204B (en) * | 1995-08-25 | 1997-03-11 | Avery Dennison Corp | |
CN100336607C (en) * | 2000-03-22 | 2007-09-12 | 艾弗里丹尼逊公司 | Method for forming multilayer release liners and linears formed thereby |
KR100700346B1 (en) * | 2005-08-05 | 2007-03-29 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | Heat-transferring adhesive tape with improved functionality |
KR20080066320A (en) * | 2007-01-12 | 2008-07-16 | 주식회사 엘지화학 | Method of preparing fine article by using releasing film of hydrophilic property |
KR20110064946A (en) * | 2009-12-09 | 2011-06-15 | 도레이첨단소재 주식회사 | Release sheet for a double-coated adhesive tape and manufacturing method thereof |
KR101084973B1 (en) * | 2010-02-01 | 2011-11-23 | (주)알케이 | Method for preparing a golf ball marking sticker |
KR20130078388A (en) * | 2011-12-30 | 2013-07-10 | 율촌화학 주식회사 | Adhesive tape without base film |
US8974879B2 (en) * | 2012-06-01 | 2015-03-10 | Fuji Xerox Co., Ltd. | Image transfer sheet and image recording material |
CN202805978U (en) * | 2012-09-10 | 2013-03-20 | 温州市华艺激光材料公司 | Easy-to-tear transfer membrane |
JP6366969B2 (en) * | 2014-03-19 | 2018-08-01 | リンテック株式会社 | Substrate-less double-sided pressure-sensitive adhesive tape and method for producing the substrate-less double-sided adhesive tape |
-
2014
- 2014-04-07 KR KR1020140041354A patent/KR101530591B1/en active IP Right Grant
-
2015
- 2015-01-16 TW TW104101403A patent/TWI566931B/en active
- 2015-01-30 JP JP2015017675A patent/JP5986242B2/en active Active
- 2015-02-06 CN CN201510063673.6A patent/CN104972779B/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW450889B (en) * | 1998-12-25 | 2001-08-21 | Nitto Denko Corp | Release liner and pressure-sensitive adhesive sheet |
TW201406917A (en) * | 2012-07-19 | 2014-02-16 | 日東電工股份有限公司 | Pressure-sensitive adhesive sheet, electric or electronic device member laminate and optical member laminate |
Also Published As
Publication number | Publication date |
---|---|
JP2015199339A (en) | 2015-11-12 |
CN104972779B (en) | 2017-10-24 |
TW201538318A (en) | 2015-10-16 |
CN104972779A (en) | 2015-10-14 |
JP5986242B2 (en) | 2016-09-06 |
KR101530591B1 (en) | 2015-06-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI566931B (en) | Non-substrate type adhesive transper tape for transper printing and preparation method thereof | |
JP5968587B2 (en) | Optical adhesive sheet, optical film and display device | |
JP5936537B2 (en) | Optical adhesive sheet | |
US10488571B2 (en) | Polarizing plate, method of manufacturing the same, and optical display comprising the same | |
US20120328864A1 (en) | Optical double-sided pressure-sensitive adhesive sheet | |
US20130005928A1 (en) | Optical double-sided pressure-sensitive adhesive sheet, optical member, touch panel, image display device, and separating method | |
KR101943705B1 (en) | Adhesive film, optical member comprising the same and optical display apparatus comprising the same | |
KR20150067101A (en) | Hard coat film and touch panel using the same | |
US20220380636A1 (en) | Laminate sheet and release film | |
JP5855465B2 (en) | Surface protective film, optical component on which it is adhered, and industrial product | |
JP2013122035A (en) | Self-adhesive sheet | |
CN106133084B (en) | Double-sided adhesive sheet | |
US10964445B2 (en) | Heating element and manufacturing method therefor | |
KR20180137748A (en) | Method for Manufacturing Flexible Display Device Comprising Touch Sensor | |
KR20160060595A (en) | Manufacturing method of heat-resistant adhesive sheet and functional film | |
KR101847980B1 (en) | Non-substrate adhesive tape for transfer printing having reinforced scattering resistance | |
CN115335480A (en) | Adhesive composition, adhesive, and adhesive sheet | |
CN115380093A (en) | Adhesive sheet and release liner-attached adhesive sheet | |
KR20130078388A (en) | Adhesive tape without base film | |
KR101585512B1 (en) | Non-substrate type layered film comprising conductive layer and method for manufacturing the same | |
CN115315647A (en) | Adhesive optical film | |
JP5898505B2 (en) | Resin sheet for laminating hard flat plate, laminate and display body | |
KR102024909B1 (en) | Adhesive film and method of producing the same | |
KR101733600B1 (en) | Transferring films and the methods of making thereof | |
KR20090132061A (en) | Pressure sensitive adhesive transfer-tape used in article for liquid crystal display |