TWI564354B - Photo-curable coating composition, photo-curing coating film and touch panel - Google Patents

Photo-curable coating composition, photo-curing coating film and touch panel Download PDF

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TWI564354B
TWI564354B TW104117808A TW104117808A TWI564354B TW I564354 B TWI564354 B TW I564354B TW 104117808 A TW104117808 A TW 104117808A TW 104117808 A TW104117808 A TW 104117808A TW I564354 B TWI564354 B TW I564354B
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coating composition
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TW201643226A (en
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高怡惠
黃昱豪
李中斌
梁育豪
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奇美實業股份有限公司
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/14Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
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    • C08G73/1067Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/58Metal-containing linkages
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40Additives
    • C09D7/65Additives macromolecular
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10Optical coatings produced by application to, or surface treatment of, optical elements
    • G02B1/14Protective coatings, e.g. hard coatings

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Description

光硬化性塗佈組成物、光硬化塗佈膜及觸控面板 Photocurable coating composition, photocurable coating film, and touch panel

本發明是有關於一種光硬化性塗佈組成物,且特別是有關於一種包含具有聚有機金屬矽氧烷結構與聚醯亞胺系結構之光硬化性聚合物的光硬化性塗佈組成物(Photo-curable composition)、由所述光硬化性塗佈組成物製得的光硬化塗佈膜及包括所述光硬化塗佈膜的觸控面板。 The present invention relates to a photocurable coating composition, and more particularly to a photocurable coating composition comprising a photocurable polymer having a polyorganometalloxane structure and a polyamidene structure. (Photo-curable composition), a photocurable coating film obtained from the photocurable coating composition, and a touch panel including the photocurable coating film.

近來,為達到高折射率、高穿透率、保護性佳與視別性佳等效果,已經發展出一種光硬化性組成物,可用於各種顯示裝置,這種光硬化性組成物所形成的光硬化塗佈膜層兼具披覆層(Overcoat)與五氧化二鈮(Nb2O5)層的作用。 Recently, in order to achieve high refractive index, high transmittance, good protection, and good visibility, a photocurable composition has been developed which can be used in various display devices, which are formed by such a photocurable composition. The photohardenable coating film layer also functions as an overcoat layer and a bismuth pentoxide (Nb 2 O 5 ) layer.

然而,隨著電子產品日益強調可撓性,軟性顯示器的應用也廣受矚目。在軟性顯示器中,傳統玻璃基板會被塑膠基板所取代,如聚醯亞胺(Polyimide,簡稱PI)基板。但在軟性顯示器中使用上述光硬化性組成物,會有與聚醯亞胺基板密著性不佳的問 題。 However, as electronic products increasingly emphasize flexibility, the use of flexible displays has also attracted attention. In a flexible display, a conventional glass substrate is replaced by a plastic substrate, such as a polyimide (PI) substrate. However, when the photocurable composition is used in a flexible display, there is a problem that the adhesion to the polyimide substrate is poor. question.

本發明提供一種光硬化性塗佈組成物,具有良好的折射率、分散性與塗佈性。 The present invention provides a photocurable coating composition which has good refractive index, dispersibility and coatability.

本發明另提供一種光硬化塗佈膜,具有良好的折射率、密著性以及耐化性。 The present invention further provides a photocurable coating film which has good refractive index, adhesion, and chemical resistance.

本發明再提供一種觸控面板,具有能與基板之密著性佳的光硬化塗佈膜。 The present invention further provides a touch panel having a light-curable coating film which is excellent in adhesion to a substrate.

本發明的光硬化性塗佈組成物,包括:具有聚有機金屬矽氧烷結構與聚醯亞胺系結構之光硬化性聚合物,其中基於光硬化性聚合物100重量份,聚有機金屬矽氧烷結構之含量為60重量份至95重量份,聚醯亞胺系結構之含量為5重量份至40重量份。而且,所述聚醯亞胺系結構之醯亞胺化率為60%至75%。 The photocurable coating composition of the present invention comprises: a photocurable polymer having a polyorganometalloxane structure and a polyamidene structure, wherein the polyorganometallic ruthenium is based on 100 parts by weight of the photocurable polymer. The content of the oxyalkylene structure is from 60 parts by weight to 95 parts by weight, and the content of the polyamidene structure is from 5 parts by weight to 40 parts by weight. Moreover, the polyamidene structure has a ruthenium imidation ratio of 60% to 75%.

在本發明的一實施例中,基於上述光硬化性聚合物100重量份,上述聚有機金屬矽氧烷結構之含量為65重量份至90重量份,上述聚醯亞胺系結構之含量為10重量份至35重量份。 In one embodiment of the present invention, the polyorganometalloxane structure is contained in an amount of from 65 parts by weight to 90 parts by weight based on 100 parts by weight of the photocurable polymer, and the polyiminoimine structure is contained in an amount of 10 parts by weight. Parts by weight to 35 parts by weight.

在本發明的一實施例中,基於上述光硬化性聚合物100重量份,上述聚有機金屬矽氧烷結構之含量為70重量份至90重量份,上述聚醯亞胺系結構之含量為10重量份至30重量份。 In one embodiment of the present invention, the polyorganometalloxane structure is contained in an amount of 70 parts by weight to 90 parts by weight based on 100 parts by weight of the photocurable polymer, and the polyiminoimine structure is 10 parts by weight. Parts by weight to 30 parts by weight.

在本發明的一實施例中,上述的聚醯亞胺系結構之醯亞胺化率為60%至69%。 In an embodiment of the invention, the polyamidene structure has a ruthenium amination ratio of 60% to 69%.

在本發明的一實施例中,上述的光硬化性塗佈組成物還可包括溶劑。 In an embodiment of the invention, the photocurable coating composition described above may further include a solvent.

在本發明的一實施例中,上述聚有機金屬矽氧烷結構包含通式(I)、通式(II)及通式(III)所示之化合物經加水分解縮合反應而得。 In one embodiment of the present invention, the polyorganometalloxane structure comprises a compound represented by the formula (I), the formula (II) and the formula (III) by hydrolysis and condensation reaction.

Ra 1Si(ORb)3 (I)式(I)中,Ra表示碳數2~10之烯基、具有丙烯醯氧基的碳數1~5的烷基或具有甲基丙烯醯氧基的碳數1~5的烷基;Rb表示碳數1~5之烷基。 R a 1 Si(OR b ) 3 (I) In the formula (I), R a represents an alkenyl group having 2 to 10 carbon atoms, an alkyl group having 1 to 5 carbon atoms having an acryloxy group or a methacryl The alkyl group having 1 to 5 carbon atoms of the oxy group; and R b represents an alkyl group having 1 to 5 carbon atoms.

Si(ORc)4 (II)式(II)中,Rc表示碳數1~5之烷基。 Si(OR c ) 4 (II) In the formula (II), R c represents an alkyl group having 1 to 5 carbon atoms.

M(ORd)n (III)式(III)中,M表示鈦(Ti)、鉭(Ta)、鋯(Zr)、硼(B)、鋁(Al)、鎂(Mg)或鋅(Zn),Rd表示碳數1~5之烷基,n為2~5的整數。 M(OR d ) n (III) In the formula (III), M represents titanium (Ti), cerium (Ta), zirconium (Zr), boron (B), aluminum (Al), magnesium (Mg) or zinc (Zn). And R d represents an alkyl group having 1 to 5 carbon atoms, and n is an integer of 2 to 5.

其中,基於通式(I)、通式(II)及通式(III)所示之化合物100重量份,通式(I)所示之化合物之含量為25重量份至45重量份,通式(II)所示之化合物之含量為15重量份至20重量份,通式(III)所示之化合物之含量為35重量份至60重量份。 Wherein the content of the compound represented by the formula (I) is from 25 parts by weight to 45 parts by weight based on 100 parts by weight of the compound represented by the formula (I), the formula (II) and the formula (III), The content of the compound shown in (II) is from 15 parts by weight to 20 parts by weight, and the content of the compound represented by the formula (III) is from 35 parts by weight to 60 parts by weight.

在本發明的一實施例中,上述通式(I)所示之化合物包括乙烯基三甲氧基矽烷、以及至少一種選自3-甲基丙烯醯氧丙基三甲氧基矽烷、3-甲基丙烯醯氧丙基三乙氧基矽烷及3-丙烯醯氧丙基三甲氧基矽烷。 In one embodiment of the present invention, the compound represented by the above formula (I) includes vinyltrimethoxynonane, and at least one selected from the group consisting of 3-methacryloxypropyltrimethoxydecane and 3-methyl. Propylene oxiranyl triethoxy decane and 3-propenyl methoxypropyl trimethoxy decane.

本發明的光硬化塗佈膜是由上述光硬化性塗佈組成物所製得。 The photocurable coating film of the present invention is obtained from the above photocurable coating composition.

在本發明的另一實施例中,上述光硬化塗佈膜的膜厚度為100nm時之折射率為1.60至1.65。 In another embodiment of the present invention, the photocurable coating film has a refractive index of 1.60 to 1.65 at a film thickness of 100 nm.

本發明的觸控面板則是包括上述的光硬化塗佈膜。 The touch panel of the present invention includes the above-described photo-curing coating film.

基於上述,由於本發明的光硬化性塗佈組成物中之光硬化性聚合物,具有特定比例所構成的聚有機金屬矽氧烷結構與聚醯亞胺系結構,以及聚醯亞胺系結構具有特定範圍之醯亞胺化率,因此以上述組成物製作的光硬化性塗佈膜具有良好的折射率、密著性以及耐化性。 Based on the above, the photocurable polymer in the photocurable coating composition of the present invention has a polyorganometalloxane structure and a polyamidene structure having a specific ratio, and a polyamidene structure. Since the photo-curable coating film produced by the above composition has a good refractive index, adhesion, and chemical resistance.

為讓本發明的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。 The above described features and advantages of the invention will be apparent from the following description.

100‧‧‧觸控面板 100‧‧‧ touch panel

102‧‧‧基板 102‧‧‧Substrate

104‧‧‧觸控元件 104‧‧‧Touch components

106‧‧‧保護層 106‧‧‧Protective layer

110、120‧‧‧觸控串列 110, 120‧‧‧ Touch series

112、122‧‧‧觸控電極 112, 122‧‧‧ touch electrodes

114、124‧‧‧連接部 114, 124‧‧‧ Connections

130‧‧‧絕緣圖案 130‧‧‧Insulation pattern

D1、D2‧‧‧方向 D1, D2‧‧‧ direction

圖1是依照本發明一實施例的一種觸控面板的上視示意圖。 FIG. 1 is a top plan view of a touch panel according to an embodiment of the invention.

圖2是圖1的觸控面板沿剖線I-I’的剖面示意圖。 2 is a cross-sectional view of the touch panel of FIG. 1 taken along line I-I'.

以下,將詳細描述本發明的實施例。然而,這些實施例為例示性,且本發明揭露不限於此。 Hereinafter, embodiments of the invention will be described in detail. However, these embodiments are illustrative, and the disclosure of the present invention is not limited thereto.

在本發明的一實施例中,光硬化性塗佈組成物包括光硬 化性聚合物。在100重量份之光硬化性聚合物中,聚有機金屬矽氧烷結構(polyorganometallosiloxane structure)與聚醯亞胺系結構(polyimide series structure)之含量分別為60重量份至95重量份以及5重量份至40重量份。聚有機金屬矽氧烷結構的含量小於60重量份、聚醯亞胺系結構的含量大於40重量份時,溶液分散性及溶液塗佈性差。聚有機金屬矽氧烷結構的含量大於95重量份、聚醯亞胺系結構的含量小於5重量份時,與PI基板之密著性差。在另一實施例中,基於上述光硬化性聚合物100重量份,聚有機金屬矽氧烷結構之含量為65重量份至90重量份,且聚醯亞胺系結構之含量為10重量份至35重量份;較佳是基於上述光硬化性聚合物100重量份,聚有機金屬矽氧烷結構之含量為70重量份至90重量份,且聚醯亞胺系結構之含量為10重量份至30重量份。 In an embodiment of the invention, the photocurable coating composition comprises light hard Polymer. The content of the polyorganometallosiloxane structure and the polyimide series structure is from 60 parts by weight to 95 parts by weight and 5 parts by weight, respectively, per 100 parts by weight of the photocurable polymer. Up to 40 parts by weight. When the content of the polyorganometalloxane structure is less than 60 parts by weight and the content of the polyamidene-based structure is more than 40 parts by weight, the solution dispersibility and the solution coating property are inferior. When the content of the polyorganometalloxane structure is more than 95 parts by weight and the content of the polyamidene-based structure is less than 5 parts by weight, the adhesion to the PI substrate is inferior. In another embodiment, the content of the polyorganometalloxane structure is 65 parts by weight to 90 parts by weight based on 100 parts by weight of the photocurable polymer, and the content of the polyamidene structure is 10 parts by weight to 35 parts by weight; preferably, based on 100 parts by weight of the photocurable polymer, the polyorganometalloxane structure is 70 parts by weight to 90 parts by weight, and the polyamidene structure is 10 parts by weight to 30 parts by weight.

而且,在所述光硬化性聚合物中,聚醯亞胺系結構之醯亞胺化率為60%至75%;較佳是60%至69%。當所述醯亞胺化率大於75%時,溶液塗佈性差;醯亞胺化率小於60%時,所得光硬化塗佈膜之耐化性差。 Further, in the photocurable polymer, the polyamidene structure has a ruthenium amination ratio of 60% to 75%; preferably 60% to 69%. When the ruthenium iodide ratio is more than 75%, the solution coating property is poor; when the oxime imidization ratio is less than 60%, the obtained photocurable coating film is inferior in chemical resistance.

聚有機金屬矽氧烷結構Polyorganometalloxane structure

在一實施例中,上述聚有機金屬矽氧烷結構包含通式(I)、通式(II)及通式(III)所示之化合物經加水分解縮合反應而得。 In one embodiment, the polyorganometalloxane structure comprises a compound represented by the formula (I), the formula (II) and the formula (III) by hydrolysis and condensation reaction.

Ra 1Si(ORb)3 (I)式(I)中,Ra表示碳數2~10之烯基、具有丙烯醯氧基的碳數1~5的烷基或具有甲基丙烯醯氧基的碳數1~5的烷基;Rb表示碳數1~5 之烷基。 R a 1 Si(OR b ) 3 (I) In the formula (I), R a represents an alkenyl group having 2 to 10 carbon atoms, an alkyl group having 1 to 5 carbon atoms having an acryloxy group or a methacryl The alkyl group having 1 to 5 carbon atoms of the oxy group; and R b represents an alkyl group having 1 to 5 carbon atoms.

Si(ORc)4 (II)式(II)中,Rc表示碳數1~5之烷基。 Si(OR c ) 4 (II) In the formula (II), R c represents an alkyl group having 1 to 5 carbon atoms.

M(ORd)n (III)式(III)中,M表示鈦(Ti)、鉭(Ta)、鋯(Zr)、硼(B)、鋁(Al)、鎂(Mg)或鋅(Zn),Rd表示碳數1~5之烷基,n為2~5的整數,較佳為3或4的整數。 M(OR d ) n (III) In the formula (III), M represents titanium (Ti), cerium (Ta), zirconium (Zr), boron (B), aluminum (Al), magnesium (Mg) or zinc (Zn). And R d represents an alkyl group having 1 to 5 carbon atoms, and n is an integer of 2 to 5, preferably an integer of 3 or 4.

基於通式(I)、通式(II)及通式(III)所示之化合物100重量份,通式(I)所示之化合物之含量為25重量份至45重量份,通式(II)所示之化合物之含量為15重量份至20重量份,通式(III)所示之化合物之含量為35重量份至60重量份。 The content of the compound represented by the formula (I) is from 25 parts by weight to 45 parts by weight based on 100 parts by weight of the compound represented by the formula (I), the formula (II) and the formula (III), and the formula (II) The content of the compound shown is from 15 parts by weight to 20 parts by weight, and the compound represented by the formula (III) is contained in an amount of from 35 parts by weight to 60 parts by weight.

上述「碳數2~10之烯基」可列舉,乙烯基、1-丙烯基、2-丙烯基、1-丁烯基、2-丁烯基、3-丁烯基、1-戊烯基、2-戊烯基、3-戊烯基、4-戊烯基、1-己烯基、2-己烯基、3-己烯基、4-己烯基或5-己烯基。 The above "alkenyl group having 2 to 10 carbon atoms" may, for example, be a vinyl group, a 1-propenyl group, a 2-propenyl group, a 1-butenyl group, a 2-butenyl group, a 3-butenyl group or a 1-pentenyl group. , 2-pentenyl, 3-pentenyl, 4-pentenyl, 1-hexenyl, 2-hexenyl, 3-hexenyl, 4-hexenyl or 5-hexenyl.

上述「具有丙烯醯氧基的碳數1~5的烷基或具有甲基丙烯醯氧基的碳數1~5的烷基」可列舉,3-丙烯醯氧基丙基或3-甲基丙烯醯氧基丙基。 The above-mentioned "alkyl group having 1 to 5 carbon atoms having an acryloxy group or alkyl group having 1 to 5 carbon atoms having a methacryloxy group" may, for example, be 3-propenyloxypropyl or 3-methyl. Acryloxypropyl.

上述「碳數1~5之烷基」可列舉,甲基、乙基、正丙基、異丙基、正丁基、異丁基、第三丁基、正戊基或異戊基。 The above "alkyl group having 1 to 5 carbon atoms" may, for example, be methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, tert-butyl, n-pentyl or isopentyl.

通式(I)所示之化合物的實例包括但不限於:乙烯基三甲氧基矽烷(vinyl trimethoxysilane)、乙烯基三乙氧基矽烷(vinyl triethoxysilane)、3-丙烯醯氧基丙基三甲氧基矽烷(3-acryoyloxypropyl trimethoxysilane)、3-甲基丙烯醯氧基丙基三甲氧基矽烷(3-methacryloyloxypropyl trimethoxysilane)、3-甲基丙烯醯氧基丙基三乙氧基矽烷(3-methacryloyloxypropyl triethoxysilane),或其組合。另外,適合用作通式(I)所示之化合物的市售產品的實例包括:KBM 1003、KBE 1003、KBM 503、KBE 503及KBM 5103(由信越化學工業製造)。 Examples of the compound represented by the formula (I) include, but are not limited to, vinyl trimethoxysilane, vinyl triethoxysilane (vinyl) Triethoxysilane), 3-acryoyloxypropyl trimethoxysilane, 3-methacryloyloxypropyl trimethoxysilane, 3-methacryloxypropyl trimethoxysilane 3-methacryloyloxypropyl triethoxysilane, or a combination thereof. Further, examples of commercially available products suitable for use as the compound represented by the general formula (I) include: KBM 1003, KBE 1003, KBM 503, KBE 503, and KBM 5103 (manufactured by Shin-Etsu Chemical Co., Ltd.).

通式(II)所示之化合物的實例包括但不限於:四甲氧基矽烷、四乙氧基矽烷、四丙氧基矽烷、四丁氧基矽烷等四烷氧矽烷類;或其組合。 Examples of the compound represented by the formula (II) include, but are not limited to, tetraalkoxydecanes such as tetramethoxynonane, tetraethoxydecane, tetrapropoxydecane, tetrabutoxydecane; or a combination thereof.

通式(III)所示之化合物的實例包括但不限於:鈦烷氧化物,可使用四乙氧化鈦、四丙氧化鈦、四異丁氧化鈦、四正丁氧化鈦等四烷氧化鈦化合物;鋯烷氧化物,可使用四乙氧化鋯、四丙氧化鋯、四丁氧化鋯等四烷氧化鋯化合物;鋁烷氧化物,可使用三丁氧化鋁、三異丙氧化鋁、三乙氧化鋁等三烷氧化鋁化合物;鉭烷氧化物,可使用五丙氧化鉭、五丁氧化鉭等五烷氧化鉭化合物等,或其組合。 Examples of the compound represented by the formula (III) include, but are not limited to, titanium alkoxide, and tetraalkyltitanium oxide compound such as tetraethoxytitanium oxide, tetrapropylene titanium oxide, tetraisobutyltitanium oxide or tetra-n-butyltin oxide can be used. As the zirconium alkoxide, a tetradecyl zirconia compound such as tetraethoxy zirconia, tetrapropoxide zirconia or tetrabutyl zirconia; aluminum alkoxide, tributyl alumina, triisopropyl alumina, triethoxylate can be used; A trialkylaluminum compound such as aluminum; a nonane oxide; a pentadecane ruthenium compound such as pentapropoxide or pentoxide, or a combination thereof may be used.

以提高硬度的觀點而言,上述通式(I)所示之化合物,可包括乙烯基三甲氧基矽烷(vinyl trimethoxysilane)、以及至少一種選自3-甲基丙烯醯氧丙基三甲氧基矽烷(3-methacryloyloxypropyl trimethoxysilane)、3-甲基丙烯醯氧丙基三乙氧基矽烷(3-methacryloyloxypropyl triethoxysilane)及3-丙烯醯氧丙基三甲 氧基矽烷(3-acryloyloxypropyl trimethoxysilane)。 The compound represented by the above formula (I) may include vinyl trimethoxysilane, and at least one selected from the group consisting of 3-methacryloxypropyltrimethoxydecane, from the viewpoint of improving hardness. 3-methacryloyloxypropyl trimethoxysilane, 3-methacryloyloxypropyl triethoxysilane and 3-propenyloxypropyl trimethylsilane 3-acryloyloxypropyl trimethoxysilane.

在前述實施例中,所述加水分解縮合反應可使用一般的方法。舉例而言,將通式(I)所示之化合物、通式(II)所示之化合物及通式(III)所示之化合物與溶劑、水或選擇性添加的觸媒於30℃~150℃下加熱攪拌0.5小時~120小時。另外,在攪拌時,還可藉由蒸餾進一步除去副產物(如醇類、水等)。 In the foregoing embodiments, the hydrolysis method can be carried out by a general method. For example, a compound represented by the formula (I), a compound represented by the formula (II), and a compound represented by the formula (III) and a solvent, water or a catalyst optionally added at 30 ° C to 150 Heat and stir at °C for 0.5 hour to 120 hours. Further, by stirring, by-products (e.g., alcohols, water, etc.) may be further removed by distillation.

上述溶劑並沒有特別限制,可與本發明光硬化性塗佈組成物中所使用的溶劑(相關描述將於下文中說明)相同或不同,只要是可溶解反應物與生成物即可。以通式(I)所示之化合物、通式(II)所示之化合物及通式(III)所示之化合物的總量為100重量份計,溶劑的使用量較佳為100重量份至1,200重量份,更佳為300重量份至1,000重量份。 The solvent is not particularly limited and may be the same as or different from the solvent used in the photocurable coating composition of the present invention (the description will be described later) as long as it is a soluble reactant and a product. The solvent is preferably used in an amount of 100 parts by weight based on 100 parts by weight of the total of the compound represented by the formula (I), the compound of the formula (II) and the compound of the formula (III). 1,200 parts by weight, more preferably from 300 parts by weight to 1,000 parts by weight.

以通式(I)所示之化合物、通式(II)所示之化合物及通式(III)所示之化合物中所含的可水解基團為1莫耳計,用於水解的水的使用量為0.5莫耳至2莫耳。 The hydrolyzable water contained in the compound represented by the formula (I), the compound represented by the formula (II) and the compound represented by the formula (III) is 1 mol. The amount used is from 0.5 moles to 2 moles.

上述觸媒並沒有特別的限制。在一實施例中,觸媒是選自於酸觸媒或鹼觸媒。所述酸觸媒包含但不限於草酸、鹽酸、硝酸、硫酸、氟酸、磷酸、醋酸、三氟醋酸、蟻酸、多元羧酸或其酐、離子交換樹脂等。所述鹼觸媒包含但不限於二乙胺、三乙胺、三丙胺、三丁胺、三戊胺、三己胺、三庚胺、三辛胺、二乙醇胺、三乙醇胺、氫氧化鈉、氫氧化鉀、含有胺基的烷氧基矽烷、離子交換樹脂等。以通式(I)所示之化合物、通式(II)所示之化合物及通 式(III)所示之化合物的總量為100重量份計,觸媒的使用量較佳為0.005重量份至15重量份,更佳為0.01重量份至12重量份,最佳為0.05重量份至10重量份。 The above catalyst is not particularly limited. In one embodiment, the catalyst is selected from an acid catalyst or a base catalyst. The acid catalyst includes, but is not limited to, oxalic acid, hydrochloric acid, nitric acid, sulfuric acid, hydrofluoric acid, phosphoric acid, acetic acid, trifluoroacetic acid, formic acid, polycarboxylic acid or anhydride thereof, ion exchange resin, and the like. The base catalyst includes, but is not limited to, diethylamine, triethylamine, tripropylamine, tributylamine, triamylamine, trihexylamine, triheptylamine, trioctylamine, diethanolamine, triethanolamine, sodium hydroxide, Potassium hydroxide, an alkoxysilane containing an amine group, an ion exchange resin, and the like. a compound represented by the formula (I), a compound represented by the formula (II), and a compound The total amount of the compound represented by the formula (III) is 100 parts by weight, and the amount of the catalyst used is preferably from 0.005 parts by weight to 15 parts by weight, more preferably from 0.01 part by weight to 12 parts by weight, most preferably 0.05 parts by weight. Up to 10 parts by weight.

基於安定性的觀點,經加水分解縮合反應而得的聚有機金屬矽氧烷聚合物以不含副產物(如醇類或水)、觸媒為佳,因此可選擇性地對經加水分解縮合反應而得的聚有機金屬矽氧烷聚合物進行純化。純化方法並無特別限制。在一實施例中,可以疏水性溶劑稀釋聚有機金屬矽氧烷聚合物,接著以蒸發器濃縮經水洗滌數回的有機層,以除去醇類或水。另外,可使用離子交換樹脂除去觸媒。 From the viewpoint of stability, the polyorganometalloxane polymer obtained by the hydrolysis condensation reaction is preferably free from by-products (such as alcohols or water) and a catalyst, so that it can be selectively hydrolyzed and condensed. The polyorganometalloxane polymer obtained by the reaction is purified. The purification method is not particularly limited. In one embodiment, the polyorganometalloxane polymer can be diluted with a hydrophobic solvent, followed by concentration of the organic layer washed several times with water by an evaporator to remove the alcohol or water. Alternatively, the catalyst can be removed using an ion exchange resin.

聚醯亞胺系結構Polyimine structure

在一實施例中,上述聚醯亞胺系結構包含四羧酸二酐與二胺經聚合反應及脫水閉環反應而得的結構。 In one embodiment, the polyimine structure comprises a structure in which a tetracarboxylic dianhydride and a diamine are subjected to a polymerization reaction and a dehydration ring closure reaction.

所述四羧酸二酐並無限制,可選自於脂肪族四羧酸二酐化合物、脂環族四羧酸二酐化合物、芳香族四羧酸二酐化合物、如下式(a1)至式(a6)所示之四羧酸二酐化合物或含氟的四羧酸二酐化合物(fluorine-containing tetracarboxylic dianhydride compound)等。 The tetracarboxylic dianhydride is not limited and may be selected from an aliphatic tetracarboxylic dianhydride compound, an alicyclic tetracarboxylic dianhydride compound, an aromatic tetracarboxylic dianhydride compound, and the following formula (a1) to formula A tetracarboxylic dianhydride compound represented by (a6) or a fluorine-containing tetracarboxylic dianhydride compound.

脂肪族四羧酸二酐化合物之具體例可包含但不限於乙烷四羧酸二酐或丁烷四羧酸二酐等之脂肪族四羧酸二酐。 Specific examples of the aliphatic tetracarboxylic dianhydride compound may include, but are not limited to, an aliphatic tetracarboxylic dianhydride such as ethane tetracarboxylic dianhydride or butane tetracarboxylic dianhydride.

脂環族四羧酸二酐化合物之具體例可包含但不限於1,2,3,4-環丁烷四羧酸二酐、1,2-二甲基-1,2,3,4-環丁烷四羧酸二 酐、1,3-二甲基-1,2,3,4-環丁烷四羧酸二酐、1,3-二氯-1,2,3,4-環丁烷四羧酸二酐、1,2,3,4-四甲基-1,2,3,4-環丁烷四羧酸二酐、1,2,3,4-環戊烷四羧酸二酐、1,2,4,5-環己烷四羧酸二酐、3,3’,4,4’-二環己基四羧酸二酐、順-3,7-二丁基環庚基-1,5-二烯-1,2,5,6-四羧酸二酐或2,3,5-三羧基環戊基醋酸二酐等之脂環族四羧酸二酐化合物。 Specific examples of the alicyclic tetracarboxylic dianhydride compound may include, but are not limited to, 1,2,3,4-cyclobutanetetracarboxylic dianhydride, 1,2-dimethyl-1,2,3,4- Cyclobutane tetracarboxylic acid Anhydride, 1,3-dimethyl-1,2,3,4-cyclobutanetetracarboxylic dianhydride, 1,3-dichloro-1,2,3,4-cyclobutanetetracarboxylic dianhydride 1,2,3,4-Tetramethyl-1,2,3,4-cyclobutanetetracarboxylic dianhydride, 1,2,3,4-cyclopentanetetracarboxylic dianhydride, 1,2 , 4,5-cyclohexanetetracarboxylic dianhydride, 3,3',4,4'-dicyclohexyltetracarboxylic dianhydride, cis-3,7-dibutylcycloheptyl-1,5- An alicyclic tetracarboxylic dianhydride compound such as diene-1,2,5,6-tetracarboxylic dianhydride or 2,3,5-tricarboxycyclopentyl acetic acid dianhydride.

脂環族四羧酸二酐化合物亦可包含雙環系脂環族四羧酸二酐化合物(bicyclo-containing aliphatic tetracarboxylic dianhydride compound)。較佳地,該雙環系脂環族四羧酸二酐化合物具有原子總數目為7至9的四價橋烴基團(bridged hydrocarbon group),且該四價橋烴基團中的其中一個橋(bridge)的橋原子數目為1或2。 The alicyclic tetracarboxylic dianhydride compound may also contain a bicyclo-containing aliphatic tetracarboxylic dianhydride compound. Preferably, the bicyclic alicyclic tetracarboxylic dianhydride compound has a bridged hydrocarbon group having a total atomic number of 7 to 9, and one of the tetravalent bridge hydrocarbon groups (bridge) The number of bridge atoms is 1 or 2.

雙環系脂環族四羧酸二酐化合物之具體例可包含但不限於雙環[2.2.1]庚烷-2,3,5,6-四羧酸二酐、7-氮雜雙環[2.2.1]庚烷-2,3,5,6-四羧酸二酐、7-氧雜雙環[2.2.1]庚烷-2,3,5,6-四羧酸二酐、7-硫雜雙環[2.2.1]庚烷-2,3,5,6-四羧酸二酐、6-(羧甲基)雙環[2.2.1]庚烷-2,3,5-三羧酸-2,3,5,6-二酐、雙環[2.2.2]辛烷-2,3,5,6-四羧酸二酐、雙環[2.2.2]辛-7-烯-2,3,5,6-四羧酸二酐、雙環[2.2.2]辛-5-烯-1,2,7,8-四羧酸二酐、雙環[2.2.2]辛-2-烯-2,3,5,6-四羧酸二酐、7-氮雜雙環[2.2.2]辛烷-2,3,5,6-四羧酸二酐、7-氧雜雙環[2.2.2]辛烷-2,3,5,6-四羧酸二酐、7-硫雜雙環[2.2.2]辛烷-2,3,5,6-四羧酸二酐、雙環[3.2.1]辛烷-2,3,5,6-四羧酸二酐、雙環[3.2.1]辛烷-2,4,5,6-四羧酸二酐、7-氮雜雙環[3.2.1]辛烷-2,3,5,6-四羧酸二酐、7-氮雜雙環 [3.2.1]辛烷-2,4,5,6-四羧酸二酐、7-氧雜雙環[3.2.1]辛烷-2,3,5,6-四羧酸二酐、7-氧雜雙環[3.2.1]辛烷-2,4,5,6-四羧酸二酐、7-硫雜雙環[3.2.1]辛烷-2,3,5,6-四羧酸二酐、7-硫雜雙環[3.2.1]辛烷-2,4,5,6-四羧酸二酐、雙環[3.2.2]壬烷-2,3,6,7-四羧酸二酐、雙環[3.2.2]壬烷-2,4,6,7-四羧酸二酐、雙環[3.2.2]壬-8-烯基-2,3,6,7-四羧酸二酐、雙環[3.2.2]壬-8-烯基-2,4,6,7-四羧酸二酐、8-氮雜雙環[3.2.2]壬烷-2,3,6,7-四羧酸二酐、8-氮雜雙環[3.2.2]壬烷-2,4,6,7-四羧酸二酐、8-氧雜雙環[3.2.2]壬烷-2,3,6,7-四羧酸二酐、8-氧雜雙環[3.2.2]壬烷-2,4,6,7-四羧酸二酐、8-硫雜雙環[3.2.2]壬烷-2,3,6,7-四羧酸二酐或8-硫雜雙環[3.2.2]壬烷-2,4,6,7-四羧酸二酐等。 Specific examples of the bicyclic alicyclic tetracarboxylic dianhydride compound may include, but are not limited to, bicyclo [2.2.1] heptane-2,3,5,6-tetracarboxylic dianhydride, 7-azabicyclo[2.2. 1] heptane-2,3,5,6-tetracarboxylic dianhydride, 7-oxabicyclo[2.2.1]heptane-2,3,5,6-tetracarboxylic dianhydride, 7-thia Bicyclo [2.2.1] heptane-2,3,5,6-tetracarboxylic dianhydride, 6-(carboxymethyl)bicyclo[2.2.1]heptane-2,3,5-tricarboxylic acid-2 ,3,5,6-dianhydride, bicyclo[2.2.2]octane-2,3,5,6-tetracarboxylic dianhydride, bicyclo[2.2.2]oct-7-ene-2,3,5 ,6-tetracarboxylic dianhydride, bicyclo[2.2.2]oct-5-ene-1,2,7,8-tetracarboxylic dianhydride, bicyclo[2.2.2]oct-2-ene-2,3 ,5,6-tetracarboxylic dianhydride, 7-azabicyclo[2.2.2]octane-2,3,5,6-tetracarboxylic dianhydride, 7-oxabicyclo[2.2.2]octane -2,3,5,6-tetracarboxylic dianhydride, 7-thiabicyclo[2.2.2]octane-2,3,5,6-tetracarboxylic dianhydride, bicyclo[3.2.1]octane -2,3,5,6-tetracarboxylic dianhydride, bicyclo[3.2.1]octane-2,4,5,6-tetracarboxylic dianhydride, 7-azabicyclo[3.2.1]octane -2,3,5,6-tetracarboxylic dianhydride, 7-azabicyclo [3.2.1] Octane-2,4,5,6-tetracarboxylic dianhydride, 7-oxabicyclo[3.2.1]octane-2,3,5,6-tetracarboxylic dianhydride, 7 -oxabicyclo[3.2.1]octane-2,4,5,6-tetracarboxylic dianhydride, 7-thiabicyclo[3.2.1]octane-2,3,5,6-tetracarboxylic acid Dihydride, 7-thiabicyclo[3.2.1]octane-2,4,5,6-tetracarboxylic dianhydride, bicyclo[3.2.2]nonane-2,3,6,7-tetracarboxylic acid Dihydride, bicyclo[3.2.2]nonane-2,4,6,7-tetracarboxylic dianhydride, bicyclo[3.2.2]non-8-alkenyl-2,3,6,7-tetracarboxylic acid Dihydride, bicyclo[3.2.2]non-8-alkenyl-2,4,6,7-tetracarboxylic dianhydride, 8-azabicyclo[3.2.2]nonane-2,3,6,7 -tetracarboxylic dianhydride, 8-azabicyclo[3.2.2]nonane-2,4,6,7-tetracarboxylic dianhydride, 8-oxabicyclo[3.2.2]nonane-2,3 6,6-tetracarboxylic dianhydride, 8-oxabicyclo[3.2.2]nonane-2,4,6,7-tetracarboxylic dianhydride, 8-thiabicyclo[3.2.2]decane -2,3,6,7-tetracarboxylic dianhydride or 8-thiabicyclo[3.2.2]nonane-2,4,6,7-tetracarboxylic dianhydride or the like.

芳香族四羧酸二酐化合物之具體例可包含但不限於3,4-二羧基-1,2,3,4-四氫萘-1-琥珀酸二酐、苯均四羧酸二酐、2,2’,3,3’-二苯甲酮四羧酸二酐、3,3’,4,4’-二苯甲酮四羧酸二酐、3,3’,4,4’-聯苯碸四羧酸二酐、1,4,5,8-萘四羧酸二酐、2,3,6,7-萘四羧酸二酐、3,3’-4,4’-二苯基乙烷四羧酸二酐、3,3’,4,4’-二甲基二苯基矽烷四羧酸二酐、3,3’,4,4’-四苯基矽烷四羧酸二酐、1,2,3,4-呋喃四羧酸二酐、2,3,3’,4’-二苯醚四羧酸二酐、3,3’,4,4’-二苯醚四羧酸二酐、4,4’-雙(3,4-二羧基苯氧基)二苯硫醚二酐、2,3,3’,4’-二苯硫醚四羧酸二酐、3,3’,4,4’-二苯硫醚四羧酸二酐、4,4’-雙(3,4-二羧基苯氧基)二苯碸二酐、4,4’-雙(3,4-二羧基苯氧基)二苯丙烷二酐、2,2’,3,3’-二苯基四羧酸二酐、2,3,3’,4’-二苯基四羧酸二酐、3,3’,4,4’-二苯基四羧酸二酐、雙(苯二酸)苯膦氧化物二酐、對-伸 苯基-雙(三苯基苯二酸)二酐、間-伸苯基-雙(三苯基苯二酸)二酐、雙(三苯基苯二酸)-4,4’-二苯基醚二酐、雙(三苯基苯二酸)-4,4’-二苯基甲烷二酐、乙二醇-雙(脫水偏苯三酸酯)、丙二醇-雙(脫水偏苯三酸酯)、1,4-丁二醇-雙(脫水偏苯三酸酯)、1,6-己二醇-雙(脫水偏苯三酸酯)、1,8-辛二醇-雙(脫水偏苯三酸酯)、2,2-雙(4-羥苯基)丙烷-雙(脫水偏苯三酸酯)、2,3,4,5-四氫呋喃四羧酸二酐、1,3,3a,4,5,9b-六氫-5-(四氫-2,5-二側氧基-3-呋喃基)-萘並[1,2-c]-呋喃-1,3-二酮、1,3,3a,4,5,9b-六氫-5-甲基-5-(四氫-2,5-二側氧基-3-呋喃基)-萘並[1,2-c]-呋喃-1,3-二酮、1,3,3a,4,5,9b-六氫-5-乙基-5-(四氫-2,5-二側氧基-3-呋喃基)-萘並[1,2-c]-呋喃-1,3-二酮、1,3,3a,4,5,9b-六氫-7-甲基-5-(四氫-2,5-二側氧基-3-呋喃基)-萘並[1,2-c]-呋喃-1,3-二酮、1,3,3a,4,5,9b-六氫-7-乙基-5-(四氫-2,5-二側氧基-3-呋喃基)-萘並[1,2-c]-呋喃-1,3-二酮、1,3,3a,4,5,9b-六氫-8-甲基-5-(四氫-2,5-二側氧基-3-呋喃基)-萘並[1,2-c]-呋喃-1,3-二酮、1,3,3a,4,5,9b-六氫-8-乙基-5-(四氫-2,5-二側氧基-3-呋喃基)-萘並[1,2-c]-呋喃-1,3-二酮、1,3,3a,4,5,9b-六氫-5,8-二甲基-5-(四氫-2,5-二側氧基-3-呋喃基)-萘並[1,2-c]-呋喃-1,3-二酮、5-(2,5-二側氧基四氫呋喃基)-3-甲基-3-環己烯-1,2-二羧酸二酐等。 Specific examples of the aromatic tetracarboxylic dianhydride compound may include, but are not limited to, 3,4-dicarboxy-1,2,3,4-tetrahydronaphthalene-1-succinic dianhydride, pyromellitic dianhydride, 2,2',3,3'-benzophenonetetracarboxylic dianhydride, 3,3',4,4'-benzophenonetetracarboxylic dianhydride, 3,3',4,4'- Biphenyl fluorene tetracarboxylic dianhydride, 1,4,5,8-naphthalenetetracarboxylic dianhydride, 2,3,6,7-naphthalenetetracarboxylic dianhydride, 3,3'-4,4'-di Phenylethane tetracarboxylic dianhydride, 3,3',4,4'-dimethyldiphenylnonane tetracarboxylic dianhydride, 3,3',4,4'-tetraphenylnonane tetracarboxylic acid Dihydride, 1,2,3,4-furantetracarboxylic dianhydride, 2,3,3',4'-diphenyl ether tetracarboxylic dianhydride, 3,3',4,4'-diphenyl ether Tetracarboxylic dianhydride, 4,4'-bis(3,4-dicarboxyphenoxy)diphenyl sulfide dianhydride, 2,3,3',4'-diphenyl sulfide tetracarboxylic dianhydride, 3,3',4,4'-diphenyl sulfide tetracarboxylic dianhydride, 4,4'-bis(3,4-dicarboxyphenoxy)diphenyl phthalic anhydride, 4,4'-bis ( 3,4-dicarboxyphenoxy)diphenylpropane dianhydride, 2,2',3,3'-diphenyltetracarboxylic dianhydride, 2,3,3',4'-diphenyltetracarboxylate Acid dianhydride, 3,3',4,4'-diphenyltetracarboxylic dianhydride, bis(phthalic acid) phenylphosphine oxide On - stretch Phenyl-bis(triphenylphthalic acid) dianhydride, m-phenylene-bis(triphenylphthalic acid) dianhydride, bis(triphenylphthalic acid)-4,4'-diphenyl Ether dianhydride, bis(triphenylphthalic acid)-4,4'-diphenylmethane dianhydride, ethylene glycol-bis(hydroper trimellitate), propylene glycol-bis (dehydrated trimellitic acid) Ester), 1,4-butanediol-bis(anhydrotrimellitic acid ester), 1,6-hexanediol-bis(anhydrotrimellitic acid ester), 1,8-octanediol-double (dehydration) Trimellitic acid ester), 2,2-bis(4-hydroxyphenyl)propane-bis(anhydrotrimellitic acid ester), 2,3,4,5-tetrahydrofuran tetracarboxylic dianhydride, 1,3, 3a,4,5,9b-hexahydro-5-(tetrahydro-2,5-di-oxy-3-furanyl)-naphtho[1,2-c]-furan-1,3-dione 1,3,3a,4,5,9b-hexahydro-5-methyl-5-(tetrahydro-2,5-di-oxy-3-furanyl)-naphtho[1,2-c ]-furan-1,3-dione, 1,3,3a,4,5,9b-hexahydro-5-ethyl-5-(tetrahydro-2,5-di-oxy-3-furanyl) )-naphtho[1,2-c]-furan-1,3-dione, 1,3,3a,4,5,9b-hexahydro-7-methyl-5-(tetrahydro-2,5 -di-oxo-3-furyl)-naphtho[1,2-c]-furan-1,3-dione, 1,3,3a,4,5,9b-hexahydro-7-ethyl -5-(tetrahydro-2,5-di-oxy-3-furanyl)-naphtho[1,2-c]-furan-1,3-di 1,3,3a,4,5,9b-hexahydro-8-methyl-5-(tetrahydro-2,5-di-oxy-3-furanyl)-naphtho[1,2-c ]-furan-1,3-dione, 1,3,3a,4,5,9b-hexahydro-8-ethyl-5-(tetrahydro-2,5-di-oxy-3-furanyl )-naphtho[1,2-c]-furan-1,3-dione, 1,3,3a,4,5,9b-hexahydro-5,8-dimethyl-5-(tetrahydro- 2,5-di-oxy-3-furanyl)-naphtho[1,2-c]-furan-1,3-dione, 5-(2,5-di-oxytetrahydrofuranyl)-3 -methyl-3-cyclohexene-1,2-dicarboxylic dianhydride or the like.

式(a1)至式(a6)所示之四羧酸二酐如下所示: The tetracarboxylic dianhydride represented by the formula (a1) to the formula (a6) is as follows:

於式(a5)中,A1表示含有芳香環的二價基團;a表示1至2之整數;A2及A3可為相同或不同,且可分別代表氫原子或烷基。較佳地,如式(a5)所示之四羧酸二酐可選自於如下式(a5-1)至式(a5-3)所示之化合物: In the formula (a5), A 1 represents a divalent group containing an aromatic ring; a represents an integer of 1 to 2; and A 2 and A 3 may be the same or different and each may represent a hydrogen atom or an alkyl group. Preferably, the tetracarboxylic dianhydride represented by the formula (a5) may be selected from the compounds represented by the following formulas (a5-1) to (a5-3):

於式(a6)中,A4代表含有芳香環的二價基團;A5及A6可為相同或不同,且分別地代表氫原子或烷基。較佳地,如式(a6)所示之四羧酸二酐可選自於如下式(a6-1)所示之化合物: In the formula (a6), A 4 represents a divalent group containing an aromatic ring; and A 5 and A 6 may be the same or different and each represents a hydrogen atom or an alkyl group. Preferably, the tetracarboxylic dianhydride represented by the formula (a6) may be selected from the compounds represented by the following formula (a6-1):

該含氟的四羧酸二酐化合物之具體例可包含但不限於9,9-雙(三氟甲基)-9H-二苯並喃-2,3,6,7-四羧酸二酐、下式(a7)至式 (a13)所示之四羧酸二酐化合物或上述化合物之任意組合: Specific examples of the fluorine-containing tetracarboxylic dianhydride compound may include, but are not limited to, 9,9-bis(trifluoromethyl)-9H-dibenzofuran-2,3,6,7-tetracarboxylic dianhydride. a tetracarboxylic dianhydride compound represented by the following formula (a7) to formula (a13) or any combination of the above compounds:

於該式(a7)中,A7及A8中至少一者為氟原子或三氟甲基。 In the formula (a7), at least one of A 7 and A 8 is a fluorine atom or a trifluoromethyl group.

上述之四羧酸二酐可以單獨一種使用或者混合複數種使用。該四羧酸二酐較佳係包含但不限於1,2,3,4-環丁烷四羧酸二酐、1,2,3,4-環戊烷四羧酸二酐、2,3,5-三羧基環戊基醋酸二酐、1,2,4,5-環己烷四羧酸二酐、3,3’,4,4’-二環己基四羧酸二酐、雙環[2.2.1]庚烷-2,3,5,6-四羧酸二酐、7-氧雜雙環[2.2.1]庚烷-2,3,5,6-四羧酸二酐、雙環[2.2.2]辛-7-烯-2,3,5,6-四羧酸二酐、8-硫雜雙環[3.2.2]壬烷-2,3,6,7-四羧酸二酐、3,4-二羧基-1,2,3,4-四氫萘-1-琥珀酸二酐、苯均四羧酸二酐、3,3’,4,4’-二苯甲酮四羧酸二酐、3,3’,4,4’-二苯基四羧酸二酐、3,3’,4,4’-聯苯碸四羧酸二酐、9,9-雙(三氟甲基)-9H-二苯並喃-2,3,6,7-四羧酸二酐、1,4-二氟-2,3,5,6-苯均四羧酸二酐、3,6-雙(三氟甲基)-1,2,4,5-苯均四羧酸二酐,或者式(a8)或式(a10)所示之四羧酸二酐化合物等。 The above tetracarboxylic dianhydride may be used singly or in combination of plural kinds. The tetracarboxylic dianhydride preferably includes, but is not limited to, 1,2,3,4-cyclobutanetetracarboxylic dianhydride, 1,2,3,4-cyclopentane tetracarboxylic dianhydride, 2,3 , 5-tricarboxycyclopentyl acetic acid dianhydride, 1,2,4,5-cyclohexanetetracarboxylic dianhydride, 3,3',4,4'-dicyclohexyltetracarboxylic dianhydride, bicyclo [ 2.2.1] heptane-2,3,5,6-tetracarboxylic dianhydride, 7-oxabicyclo[2.2.1]heptane-2,3,5,6-tetracarboxylic dianhydride, bicyclo [ 2.2.2] Oct-7-ene-2,3,5,6-tetracarboxylic dianhydride, 8-thiabicyclo[3.2.2]nonane-2,3,6,7-tetracarboxylic dianhydride , 3,4-dicarboxy-1,2,3,4-tetrahydronaphthalene-1-succinic dianhydride, benzene tetracarboxylic dianhydride, 3,3',4,4'-benzophenone IV Carboxylic dianhydride, 3,3',4,4'-diphenyltetracarboxylic dianhydride, 3,3',4,4'-biphenylfluorene tetracarboxylic dianhydride, 9,9-bis (three Fluoromethyl)-9H-dibenzofuran-2,3,6,7-tetracarboxylic dianhydride, 1,4-difluoro-2,3,5,6-benzenetetracarboxylic dianhydride, 3 , 6-bis(trifluoromethyl)-1,2,4,5-benzenetetracarboxylic dianhydride, or a tetracarboxylic dianhydride compound represented by the formula (a8) or the formula (a10).

所述二胺並無限制,可選自於脂肪族二胺化合物、脂環族二胺化合物、芳香族二胺化合物,如下式(b1)至(b15)所示之二胺化合物或含氟的二胺化合物等,且上述二胺可以單獨一種使用或者混合複數種使用。 The diamine is not limited and may be selected from an aliphatic diamine compound, an alicyclic diamine compound, an aromatic diamine compound, a diamine compound represented by the following formulas (b1) to (b15) or a fluorine-containing compound. A diamine compound or the like, and the above diamine may be used alone or in combination of plural kinds.

脂肪族二胺化合物包含但不限於1,2-二胺基乙烷、1,3-二胺基丙烷、1,4-二胺基丁烷、1,5-二胺基戊烷、1,6-二胺基己烷、1,7-二胺基庚烷、1,8-二胺基辛烷、1,9-二胺基壬烷、1,10-二胺基癸烷、4,4’-二胺基庚烷、1,3-二胺基-2,2-二甲基丙烷、1,6-二胺基-2,5-二甲基己烷、1,7-二胺基-2,5-二甲基庚烷、1,7-二胺基-4,4-二甲基庚烷、1,7-二胺基-3-甲基庚烷、1,9-二胺基-5-甲基壬烷、2,11-二胺基十二烷、1,12-二胺基十八烷、1,2-雙(3-胺基丙氧基)乙烷等。 The aliphatic diamine compound includes, but is not limited to, 1,2-diaminoethane, 1,3-diaminopropane, 1,4-diaminobutane, 1,5-diaminopentane, 1, 6-Diaminohexane, 1,7-diaminoheptane, 1,8-diaminooctane, 1,9-diaminodecane, 1,10-diaminodecane, 4, 4'-Diaminoheptane, 1,3-diamino-2,2-dimethylpropane, 1,6-diamino-2,5-dimethylhexane, 1,7-diamine Base-2,5-dimethylheptane, 1,7-diamino-4,4-dimethylheptane, 1,7-diamino-3-methylheptane, 1,9-di Amino-5-methylnonane, 2,11-diaminododecane, 1,12-diaminooctadecane, 1,2-bis(3-aminopropoxy)ethane, and the like.

脂環族二胺化合物包含但不限於4,4’-二胺基二環己基甲烷、4,4’-二胺基-3,3’-二甲基二環己基胺、1,3-二胺基環己烷、1,4-二胺基環己烷、異佛爾酮二胺、四氫二環戊二烯二胺、三環[6.2.1.02,7]-十一碳烯二甲基二胺、4,4’-亞甲基雙(環己基胺)等。 The alicyclic diamine compound includes, but is not limited to, 4,4'-diaminodicyclohexylmethane, 4,4'-diamino-3,3'-dimethyldicyclohexylamine, 1,3-two Aminocyclohexane, 1,4-diaminocyclohexane, isophoronediamine, tetrahydrodicyclopentadiene diamine, tricyclo[6.2.1.0 2,7 ]-ten Monocarbene dimethyl diamine, 4,4'-methylene bis(cyclohexylamine), and the like.

芳香族二胺化合物包含但不限於4,4’-二胺基二苯基甲烷、4,4’-二胺基二苯基乙烷、4,4’-二胺基二苯基碸、4,4’-二胺基苯甲醯苯胺、4,4’-二胺基二苯基醚、3,4’-二胺基二苯基醚、1,5-二胺基萘、5-胺基-1-(4’-胺基苯基)-1,3,3-三甲基氫茚、6-胺基-1-(4’-胺基苯基)-1,3,3-三甲基氫茚、六氫-4,7-甲橋伸氫茚基二亞甲基二胺、3,3’-二胺基二苯甲酮、3,4’-二胺基二苯甲酮、4,4’-二胺基二苯甲酮、2,2-雙[4-(4-胺基苯氧基)苯基]丙烷、2,2-雙[4-(4- 胺基苯氧基)苯基]碸、1,4-雙(4-胺基苯氧基)苯、1,3-雙(4-胺基苯氧基)苯、1,3-雙(3-胺基苯氧基)苯、9,9-雙(4-胺基苯基)-10-氫蒽、9,10-雙(4-胺基苯基)蒽[9,10-bis(4-aminophenyl)anthracene]、2,7-二胺基茀、9,9-雙(4-胺基苯基)茀、4,4’-亞甲基-雙(2-氯苯胺)、4,4’-(對-伸苯基異亞丙基)雙苯胺、4,4’-(間-伸苯基異亞丙基)雙苯胺、5-[4-(4-正戊烷基環己基)環己基]苯基亞甲基-1,3-二胺基苯{5-[4-(4-n-pentylcyclohexyl)cyclohexyl]phenylmethylene-1,3-diami nobenzene}、1,1-雙[4-(4-胺基苯氧基)苯基]-4-(4-乙基苯基)環己烷{1,1-bis[4-(4-aminophenoxy)phenyl]-4-(4-ethylphenyl)cyclohexane}等。 Aromatic diamine compounds include, but are not limited to, 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenylethane, 4,4'-diaminodiphenylanthracene, 4 , 4'-diaminobenzimidamide, 4,4'-diaminodiphenyl ether, 3,4'-diaminodiphenyl ether, 1,5-diaminonaphthalene, 5-amine 1-(4'-aminophenyl)-1,3,3-trimethylhydroquinone, 6-amino-1-(4'-aminophenyl)-1,3,3-tri Methylhydroquinone, hexahydro-4,7-methyl bridge hydroquinone dimethylene diamine, 3,3'-diaminobenzophenone, 3,4'-diaminobenzophenone , 4,4'-diaminobenzophenone, 2,2-bis[4-(4-aminophenoxy)phenyl]propane, 2,2-bis[4-(4- Aminophenoxy)phenyl]anthracene, 1,4-bis(4-aminophenoxy)benzene, 1,3-bis(4-aminophenoxy)benzene, 1,3-bis(3) -aminophenoxy)benzene, 9,9-bis(4-aminophenyl)-10-hydroquinone, 9,10-bis(4-aminophenyl)anthracene [9,10-bis (4 -aminophenyl)anthracene], 2,7-diaminopurine, 9,9-bis(4-aminophenyl)anthracene, 4,4'-methylene-bis(2-chloroaniline), 4,4 '-(p-phenylphenylidene)diphenylamine, 4,4'-(m-phenylene isopropylidene)diphenylamine, 5-[4-(4-n-pentylcyclohexyl) Cyclohexyl]phenylmethylene-1,3-diaminobenzene {5-[4-(4-n-pentylcyclohexyl)cyclohexyl]phenylmethylene-1,3-diami nobenzene}, 1,1-bis[4- (4-aminophenoxy)phenyl]-4-(4-ethylphenyl)cyclohexane {1,1-bis[4-(4-aminophenoxy)phenyl]-4-(4-ethylphenyl) Cyclohexane} and so on.

式(b1)至(b15)所示之二胺化合物,如下所示: The diamine compounds represented by the formulae (b1) to (b15) are as follows:

於式(b1)中,B1表示-O-、-COO-、-OCO-、-NHCO-、-CONH-或-CO-;B2表示含有甾類(類固醇)骨架、碳數為2至30的烷基或衍生自吡啶、嘧啶、三嗪、哌啶及哌嗪等含氮原子環狀結構的一價基團。 In the formula (b1), B 1 represents -O-, -COO-, -OCO-, -NHCO-, -CONH- or -CO-; B 2 represents a steroid-like (steroid) skeleton having a carbon number of 2 to The alkyl group of 30 or a monovalent group derived from a cyclic structure of a nitrogen atom such as pyridine, pyrimidine, triazine, piperidine or piperazine.

於式(b1)所示之二胺化合物較佳是選自於2,4-二胺基苯基甲酸乙酯(2,4-diaminophenyl ethyl formate)、3,5-二胺基苯基甲酸乙酯(3,5-diaminophenyl ethyl formate)、2,4-二胺基苯基甲酸丙酯(2,4-diaminophenyl propyl formate)、3,5-二胺基苯基甲酸丙酯 (3,5-diaminophenyl propyl formate)、1-十二烷氧基-2,4-胺基苯(1-dodecoxy-2,4-aminobenzene)、1-十六烷氧基-2,4-胺基苯(1-hexadecoxy-2,4-aminobenzene)、1-十八烷氧基-2,4-胺基苯(1-octadecoxy-2,4-aminobenzene)或下式(b1-1)至式(b1-4)所示之二胺化合物: The diamine compound represented by the formula (b1) is preferably selected from the group consisting of 2,4-diaminophenyl ethyl formate and 3,5-diaminophenylethylate B. 3,5-diaminophenyl ethyl formate, 2,4-diaminophenyl propyl formate, 3,5-diaminophenyl propyl formate (3,5- Diaminophenyl propyl formate), 1-dodecoxy-2,4-aminobenzene, 1-hexadecyloxy-2,4-aminobenzene (1- Hexadecoxy-2,4-aminobenzene), 1-octadecoxy-2,4-aminobenzene or the following formula (b1-1) to formula (b1-4) Diamine compounds shown:

於式(b2)中,B3代表-O-、-COO-、-OCO-、-NHCO-、-CONH-或-CO-;B4及B5代表伸脂肪族環、伸芳香族環或伸雜環基團;B6代表碳數為3至18的烷基、碳數為3至18的烷氧基、氰基或氯原子。較佳地,該式(b2)所示之二胺化合物是選自於下式(b2-1)至式(b2-8)所示之二胺化合物: In the formula (b2), B 3 represents -O-, -COO-, -OCO-, -NHCO-, -CONH- or -CO-; B 4 and B 5 represent an extended aliphatic ring, an extended aromatic ring or a heterocyclic group; B 6 represents an alkyl group having 3 to 18 carbon atoms, an alkoxy group having 3 to 18 carbon atoms, a cyano group or a chlorine atom. Preferably, the diamine compound represented by the formula (b2) is a diamine compound selected from the following formulas (b2-1) to (b2-8):

於式(b2-5)至式(b2-8)中,b可代表3至12之整數。 In the formulae (b2-5) to (b2-8), b may represent an integer of from 3 to 12.

於式(b3)中,B7代表氫、碳數為1至5的醯基、碳數為1至5的烷基、碳數為1至5的烷氧基或氯原子,且每個重複單元中的B7可為相同或不同;B8為1至3的整數。 In the formula (b3), B 7 represents hydrogen, a fluorenyl group having 1 to 5 carbon atoms, an alkyl group having 1 to 5 carbon atoms, an alkoxy group having 1 to 5 carbon atoms or a chlorine atom, and each repeat B 7 in the unit may be the same or different; B 8 is an integer from 1 to 3.

該式(b3)所示之二胺化合物較佳是選自於(1)B8為1:對-二胺苯、間-二胺苯、鄰-二胺苯或2,5-二胺甲苯等;(2)B8為2:4,4’-二胺基聯苯、2,2’-二甲基-4,4’-二胺基聯苯、3,3’-二甲基-4,4’-二胺基聯苯、3,3’-二甲氧基-4,4’-二胺基聯苯、2,2’-二氯-4,4’-二胺基聯苯、3,3’-二氯-4,4’-二胺基聯苯、2,2’,5,5’-四氯-4,4’-二胺基聯苯或2,2’-二氯-4,4’-二胺基-5,5’-二甲氧基聯苯等;(3)B8為3:1,4-雙(4’-胺基苯基)苯等,更佳是選自於對-二胺苯、2,5-二胺甲苯、4,4’-二胺基聯苯、3,3’-二甲氧基-4,4’-二胺基聯苯或1,4-雙(4’-胺基苯基)苯。 The diamine compound represented by the formula (b3) is preferably selected from the group consisting of (1) B 8 being 1: p-diamine benzene, m-diamine benzene, o-diamine benzene or 2,5-diamine toluene. Etc.; (2) B 8 is 2:4,4'-diaminobiphenyl, 2,2'-dimethyl-4,4'-diaminobiphenyl, 3,3'-dimethyl- 4,4'-diaminobiphenyl, 3,3'-dimethoxy-4,4'-diaminobiphenyl, 2,2'-dichloro-4,4'-diaminobiphenyl , 3,3'-dichloro-4,4'-diaminobiphenyl, 2,2',5,5'-tetrachloro-4,4'-diaminobiphenyl or 2,2'-di Chloro-4,4'-diamino-5,5'-dimethoxybiphenyl, etc.; (3) B 8 is 3: 1,4-bis(4'-aminophenyl)benzene, etc. Preferably selected from the group consisting of p-diamine benzene, 2,5-diamine toluene, 4,4'-diaminobiphenyl, 3,3'-dimethoxy-4,4'-diaminobiphenyl Or 1,4-bis(4'-aminophenyl)benzene.

於式(b4)中,B9為2至12的整數。 In the formula (b4), B 9 is an integer of 2 to 12.

於式(b5)中,B10代表1至5之整數。該式(b5)較佳係選自於4,4’-二胺基二苯基硫醚。 In the formula (b5), B 10 represents an integer of 1 to 5. The formula (b5) is preferably selected from 4,4'-diaminodiphenyl sulfide.

於式(b6)中,B11及B13可為相同或不同,且分別代表二價有機基團,B12代表衍生自吡啶、嘧啶、三嗪、哌啶及哌嗪等含氮原子環狀結構的二價基團。 In the formula (b6), B 11 and B 13 may be the same or different and each represents a divalent organic group, and B 12 represents a nitrogen-containing atom derived from a pyridine, a pyrimidine, a triazine, a piperidine or a piperazine. A divalent group of the structure.

於式(b7)中,B14代表-O-或伸環己烷基,B15代表-CH2-,B16代表伸苯基或伸環己烷基,B17代表氫或庚基。 In the formula (b7), B 14 represents -O- or a cyclohexane group, B 15 represents -CH 2 -, B 16 represents a phenyl or cyclohexane group, and B 17 represents hydrogen or heptyl.

該式(b7)所示之二胺化合物較佳係選自於如下式(b7-1)至式(b7-2)所示之二胺化合物: The diamine compound represented by the formula (b7) is preferably selected from the diamine compounds represented by the following formulas (b7-1) to (b7-2):

式(b8)至式(b15)所示之其他二胺化合物如下所示: Other diamine compounds represented by formula (b8) to formula (b15) are as follows:

該含氟的二胺化合物較佳是選自於2,2-雙[4-(4-胺基苯氧基)苯基]-1,1,1,3,3,3-六氟丙烷、2,2-雙[4-(3-胺基苯氧基)苯基]-1,1,1,3,3,3-六氟丙烷、2,2-雙[3-(4-胺基苯氧基)苯基]-1,1,1,3,3,3-六氟丙烷、2,2-雙[3-(3-胺基苯氧基)苯基]-1,1,1,3,3,3-六氟丙烷、2,2-雙(4-胺基苯基)-1,1,1,3,3,3-六氟丙烷、2,2-雙(3-胺基苯基)-1,1,1,3,3,3-六氟丙烷、2,2-雙(3-胺基-4-羥基苯基)-1,1,1,3,3,3-六氟丙烷、雙(2,3,5,6-四氟-4-胺基苯基)醚、雙(2,3,5,6-四氟-4-胺基苯基)硫醚、2,2'-雙(三氟甲基)-4,4'-二胺基聯苯、3,3'-雙(三氟甲基)-4,4'-二胺基聯苯、下式(b16)至式(b45)所示之二胺化合物或上述化合物之任意組合: The fluorine-containing diamine compound is preferably selected from 2,2-bis[4-(4-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane, 2,2-bis[4-(3-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane, 2,2-bis[3-(4-amino) Phenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane, 2,2-bis[3-(3-aminophenoxy)phenyl]-1,1,1 ,3,3,3-hexafluoropropane, 2,2-bis(4-aminophenyl)-1,1,1,3,3,3-hexafluoropropane, 2,2-bis(3-amine Phenyl)-1,1,1,3,3,3-hexafluoropropane, 2,2-bis(3-amino-4-hydroxyphenyl)-1,1,1,3,3,3 -hexafluoropropane, bis(2,3,5,6-tetrafluoro-4-aminophenyl)ether, bis(2,3,5,6-tetrafluoro-4-aminophenyl) sulfide, 2,2'-bis(trifluoromethyl)-4,4'-diaminobiphenyl, 3,3'-bis(trifluoromethyl)-4,4'-diaminobiphenyl, the following formula (b16) to a diamine compound of the formula (b45) or any combination of the above compounds:

上述之二胺可以單獨一種使用或者混合複數種使用。該二胺較佳係包含但不限於1,2-二胺基乙烷、4,4’-二胺基二環己基甲烷、1,4-二胺基環己烷、4,4’-二胺基二苯基甲烷、4,4’-二胺基二苯基醚、5-[4-(4-正戊烷基環己基)環己基]苯基亞甲基-1,3-二 胺基苯、1,1-雙[4-(4-胺基苯氧基)苯基]-4-(4-乙基苯基)環己烷、2,4-二胺基苯基甲酸乙酯、對-二胺苯、間-二胺苯、鄰-二胺苯、4,4’-二胺基聯苯、2,2-雙[4-(4-胺基苯氧基)苯基]-1,1,1,3,3,3-六氟丙烷、2,2-雙(3-胺基苯基)-1,1,1,3,3,3-六氟丙烷、雙(2,3,5,6-四氟-4-胺基苯基)醚、2,2'-雙(三氟甲基)-4,4'-二胺基聯苯,或者式(b1-1)、式(b1-2)、式(b2-1)、式(b2-6)、式(b7-1)、式(b23)、式(b25)、式(b26)、式(b27)、式(b33)、式(b37)或式(b39)所示之二胺化合物。 The above diamines may be used singly or in combination of plural kinds. Preferably, the diamine includes, but is not limited to, 1,2-diaminoethane, 4,4'-diaminodicyclohexylmethane, 1,4-diaminocyclohexane, 4,4'-di Aminodiphenylmethane, 4,4'-diaminodiphenyl ether, 5-[4-(4-n-pentylcyclohexyl)cyclohexyl]phenylmethylene-1,3-di Aminobenzene, 1,1-bis[4-(4-aminophenoxy)phenyl]-4-(4-ethylphenyl)cyclohexane, 2,4-diaminophenylformate B Ester, p-diamine benzene, m-diamine benzene, o-diamine benzene, 4,4'-diaminobiphenyl, 2,2-bis[4-(4-aminophenoxy)phenyl ]-1,1,1,3,3,3-hexafluoropropane, 2,2-bis(3-aminophenyl)-1,1,1,3,3,3-hexafluoropropane, double ( 2,3,5,6-tetrafluoro-4-aminophenyl)ether, 2,2'-bis(trifluoromethyl)-4,4'-diaminobiphenyl, or formula (b1-1 ), formula (b1-2), formula (b2-1), formula (b2-6), formula (b7-1), formula (b23), formula (b25), formula (b26), formula (b27), a diamine compound represented by the formula (b33), the formula (b37) or the formula (b39).

在前述實施例中,該聚醯亞胺系結構聚合物的製備方法包含以下步驟:將一包括四羧酸二酐與二胺的混合物溶於溶劑中,進行聚合反應。接著,將上述的反應溶液以蒸發器進行減壓蒸餾,即可得到聚醯胺酸樹脂,或者將上述的反應溶液倒入大量的貧溶劑中,以得到一析出物。然後,利用減壓乾燥之方式乾燥處理該析出物,即可得到聚醯胺酸樹脂。 In the foregoing embodiment, the method for producing the polyimine-based structural polymer comprises the steps of: dissolving a mixture comprising a tetracarboxylic dianhydride and a diamine in a solvent to carry out a polymerization reaction. Next, the above reaction solution is subjected to distillation under reduced pressure in an evaporator to obtain a polyamic acid resin, or the above reaction solution is poured into a large amount of a poor solvent to obtain a precipitate. Then, the precipitate is dried by a method of drying under reduced pressure to obtain a polyamine resin.

基於該二胺的總莫耳數為100莫耳,該四羧酸二酐的使用量較佳為20莫耳至200莫耳,更佳為30莫耳至120莫耳。 The tetracarboxylic dianhydride is preferably used in an amount of from 20 moles to 200 moles, more preferably from 30 moles to 120 moles, based on the total moles of the diamine being 100 moles.

該聚合反應中所使用的溶劑可與本發明光硬化性塗佈組成物中所使用的溶劑(相關描述將於下文中說明)相同或不同,且該用於聚合反應中的溶劑並無特別的限制,只要是可溶解反應物與生成物即可。較佳地,基於該四羧酸二酐與二胺的混合物的總使用量為100重量份,該用於聚合反應中的溶劑的使用量範圍為200重量份至2,000重量份;更佳地,該用於聚合反應中的溶劑的使用量範圍為300重量份至1,800重量份。 The solvent used in the polymerization reaction may be the same as or different from the solvent used in the photocurable coating composition of the present invention (the description will be described later), and the solvent used in the polymerization reaction is not particularly specific. The restriction is as long as it is a soluble reactant and a product. Preferably, the total amount of the mixture of the tetracarboxylic dianhydride and the diamine is 100 parts by weight, and the solvent used in the polymerization is used in an amount ranging from 200 parts by weight to 2,000 parts by weight; more preferably, The solvent used in the polymerization is used in an amount ranging from 300 parts by weight to 1,800 parts by weight.

特別地,於該聚合反應中,該溶劑可併用適量的貧溶劑,只要不讓該聚醯胺酸樹脂析出即可。該貧溶劑可單獨一種或者混合複數種使用,且該貧溶劑包含但不限於(1)醇類:甲醇、乙醇、異丙醇、環己醇、乙二醇、丙二醇、1,4-丁二醇或三乙二醇等;(2)酮類:丙酮、甲基乙基酮、甲基異丁基酮或環己酮等;(3)酯類:醋酸甲酯、醋酸乙酯、醋酸丁酯、草酸二乙酯、丙二酸二乙酯或乙二醇乙基醚醋酸酯等;(4)醚類:二乙基醚、乙二醇甲基醚、乙二醇乙基醚、乙二醇正丙基醚、乙二醇異丙基醚、乙二醇正丁基醚、乙二醇二甲基醚或二乙二醇二甲基醚等;(5)鹵化烴類:二氯甲烷、1,2-二氯乙烷、1,4-二氯丁烷、三氯乙烷、氯苯或鄰-二氯苯等;(6)烴類:四氫呋喃、己烷、庚烷、辛烷、苯、甲苯或二甲苯等;或(7)上述之任意組合。較佳地,基於二胺的總使用量為100重量份,該貧溶劑的使用量範圍為0重量份至60重量份;更佳地,該貧溶劑的使用量範圍為0重量份至50重量份。 In particular, in the polymerization, the solvent may be used in combination with an appropriate amount of a poor solvent as long as the polyamic acid resin is not allowed to precipitate. The poor solvent may be used singly or in combination, and the poor solvent includes but is not limited to (1) alcohol: methanol, ethanol, isopropanol, cyclohexanol, ethylene glycol, propylene glycol, 1,4-butane Alcohol or triethylene glycol; (2) ketones: acetone, methyl ethyl ketone, methyl isobutyl ketone or cyclohexanone; (3) esters: methyl acetate, ethyl acetate, acetic acid Ester, diethyl oxalate, diethyl malonate or ethylene glycol ethyl ether acetate; (4) ethers: diethyl ether, ethylene glycol methyl ether, ethylene glycol ethyl ether, B Glycol propyl ether, ethylene glycol isopropyl ether, ethylene glycol n-butyl ether, ethylene glycol dimethyl ether or diethylene glycol dimethyl ether; (5) halogenated hydrocarbons: dichloromethane, 1,2-dichloroethane, 1,4-dichlorobutane, trichloroethane, chlorobenzene or o-dichlorobenzene; (6) hydrocarbons: tetrahydrofuran, hexane, heptane, octane, Benzene, toluene or xylene, etc.; or (7) any combination of the above. Preferably, the total amount of the diamine used is 100 parts by weight, and the amount of the poor solvent is from 0 parts by weight to 60 parts by weight; more preferably, the amount of the poor solvent is from 0 parts by weight to 50 parts by weight. Share.

該聚醯亞胺系結構聚合物的製備方法更包含以下步驟:將聚合反應所形成的聚醯胺酸樹脂,在脫水劑及觸媒的存在下,進一步加熱並進行脫水閉環反應,使得聚合反應時產生的醯胺酸官能基轉變成醯亞胺官能基(即醯亞胺化)。 The preparation method of the polyamidene-based structural polymer further comprises the steps of: further heating the poly-proline resin formed by the polymerization reaction in the presence of a dehydrating agent and a catalyst, and performing a dehydration ring-closure reaction to cause a polymerization reaction. The resulting proline functional group is converted to a quinone imine functional group (ie, hydrazide).

該聚合反應及脫水閉環反應可採用所屬領域以往操作的反應溫度及反應時間。較佳地,該聚合反應的操作溫度範圍為0℃至100℃。較佳地,該聚合反應的操作時間範圍為1小時至24小時。較佳地,該脫水閉環反應的操作溫度範圍為30℃至200℃, 且該脫水閉環反應的操作時間範圍為0.5小時至50小時。 The polymerization reaction and the dehydration ring closure reaction can employ a reaction temperature and a reaction time which have been conventionally operated in the art. Preferably, the polymerization has an operating temperature in the range of from 0 °C to 100 °C. Preferably, the polymerization has an operating time ranging from 1 hour to 24 hours. Preferably, the dehydration ring closure reaction has an operating temperature in the range of 30 ° C to 200 ° C, And the operation time of the dehydration ring closure reaction ranges from 0.5 hours to 50 hours.

該用於脫水閉環反應中的溶劑可與本發明光硬化性塗佈組成物中所使用的溶劑相同,故不再贅述。較佳地,基於聚醯胺酸樹脂的使用量為100重量份,該用於脫水閉環反應中的溶劑的使用量範圍為200重量份至2,000重量份,更佳地,該用於脫水閉環反應中的溶劑的使用量範圍為300重量份至1,800重量份。 The solvent used in the dehydration ring-closure reaction can be the same as the solvent used in the photocurable coating composition of the present invention, and therefore will not be described again. Preferably, the polyacetal acid resin is used in an amount of 100 parts by weight, and the solvent used in the dehydration ring closure reaction is used in an amount ranging from 200 parts by weight to 2,000 parts by weight, and more preferably, for the dehydration ring closure reaction. The solvent is used in an amount ranging from 300 parts by weight to 1,800 parts by weight.

用於脫水閉環反應中的脫水劑是擇自於(1)酸酐類化合物:醋酸酐、丙酸酐或三氟醋酸酐等。基於該聚醯胺酸樹脂為1莫耳,該脫水劑的使用量範圍為0.01莫耳至20莫耳。該用於脫水閉環反應中的觸媒是擇自於(1)吡啶類化合物:吡啶、三甲基吡啶或二甲基吡啶等;(2)三級胺類化合物:三乙基胺等。基於該脫水劑為1莫耳,該觸媒的使用量範圍為0.5莫耳至10莫耳。 The dehydrating agent used in the dehydration ring closure reaction is selected from the group consisting of (1) an acid anhydride compound: acetic anhydride, propionic anhydride or trifluoroacetic anhydride. The dehydrating agent is used in an amount ranging from 0.01 mol to 20 mol based on 1 mol of the polyaminic acid resin. The catalyst used in the dehydration ring closure reaction is selected from the group consisting of (1) a pyridine compound: pyridine, trimethylpyridine or lutidine; and (2) a tertiary amine compound: triethylamine. The catalyst is used in an amount ranging from 0.5 moles to 10 moles, based on the dehydrating agent being 1 mole.

本發明光硬化性聚合物中,聚醯亞胺系結構之醯亞胺化率為60%至75%;較佳是60%至69%。當所述醯亞胺化率大於75%時,溶液塗佈性差;醯亞胺化率小於60%時,所得光硬化塗佈膜之耐化性差。 In the photocurable polymer of the present invention, the ruthenium imidization ratio of the polyimine structure is 60% to 75%; preferably 60% to 69%. When the ruthenium iodide ratio is more than 75%, the solution coating property is poor; when the oxime imidization ratio is less than 60%, the obtained photocurable coating film is inferior in chemical resistance.

溶劑Solvent

在一實施例中,上述光硬化性塗佈組成物所包括的溶劑並沒有特別限制,溶劑包括但不限於含醇式羥基(alcoholic hydroxyl)的化合物或含羰基的環狀化合物。另外,溶劑可單獨或混合使用。 In one embodiment, the solvent included in the photocurable coating composition is not particularly limited, and the solvent includes, but is not limited to, an alcoholic hydroxyl group-containing compound or a carbonyl group-containing cyclic compound. Further, the solvent may be used singly or in combination.

所述含醇式羥基的化合物包含但不限於丙酮醇 (acetol)、3-羥基-3-甲基-2-丁酮、4-羥基-3-甲基-2-丁酮、5-羥基-2-戊酮、4-羥基-4-甲基-2-戊酮(又稱二丙酮醇,diacetone alcohol)、乳酸乙酯、乳酸丁酯、丙二醇單甲醚、丙二醇單乙醚(propylene glycol monoethyl ether)、丙二醇甲醚醋酸酯(propylene glycol monomethylether acetate)、丙二醇單正丙醚、丙二醇單正丁醚、丙二醇單第三丁醚、3-甲氧基-1-丁醇、3-甲基-3-甲氧基-1-丁醇或此等一組合。含醇式羥基的化合物較佳是擇自於二丙酮醇、乳酸乙酯、丙二醇單乙醚、丙二醇甲醚醋酸酯,或此等一組合。 The alcoholic hydroxyl group-containing compound includes, but is not limited to, acetol (acetol), 3-hydroxy-3-methyl-2-butanone, 4-hydroxy-3-methyl-2-butanone, 5-hydroxy-2-pentanone, 4-hydroxy-4-methyl- 2-pentanone (also known as diacetone alcohol), ethyl lactate, butyl lactate, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monomethylether acetate, Propylene glycol mono-n-propyl ether, propylene glycol mono-n-butyl ether, propylene glycol mono-tert-butyl ether, 3-methoxy-1-butanol, 3-methyl-3-methoxy-1-butanol or a combination thereof . The alcoholic hydroxyl group-containing compound is preferably selected from the group consisting of diacetone alcohol, ethyl lactate, propylene glycol monoethyl ether, propylene glycol methyl ether acetate, or a combination thereof.

所述含羰基的環狀化合物包含但不限於γ-丁內酯、γ-戊內酯、δ-戊內酯、碳酸丙烯酯、氮-甲基吡咯烷酮、環己酮或環庚酮等。含羰基的環狀化合物較佳是擇自於γ-丁內酯、氮-甲基吡咯烷酮、環己酮,或此等一組合。 The carbonyl group-containing cyclic compound includes, but is not limited to, γ-butyrolactone, γ-valerolactone, δ-valerolactone, propylene carbonate, nitrogen-methylpyrrolidone, cyclohexanone or cycloheptanone. The carbonyl-containing cyclic compound is preferably selected from the group consisting of γ-butyrolactone, nitrogen-methylpyrrolidone, cyclohexanone, or a combination thereof.

在不損及本發明的光硬化性塗佈組成物的效果範圍內,光硬化性塗佈組成物亦可以含有其他溶劑。所述其他溶劑包含但不限於(1)酯類:醋酸乙酯、醋酸正丙酯、醋酸異丙酯、醋酸正丁酯、醋酸異丁酯、3-甲氧基-1-醋酸丁酯、3-甲基-3-甲氧基-1-醋酸丁酯等;(2)酮類:甲基異丁酮、二異丙酮、二異丁酮等;(3)醚類:二乙醚、二異丙醚、二正丁醚、二苯醚等。 The photocurable coating composition may contain other solvents within the range of the effect of not impairing the photocurable coating composition of the present invention. The other solvents include, but are not limited to, (1) esters: ethyl acetate, n-propyl acetate, isopropyl acetate, n-butyl acetate, isobutyl acetate, 3-methoxy-1-butyl acetate, 3-methyl-3-methoxy-1-butyl acetate, etc.; (2) ketones: methyl isobutyl ketone, diisopropanone, diisobutyl ketone, etc.; (3) ethers: diethyl ether, two Isopropyl ether, di-n-butyl ether, diphenyl ether, and the like.

另外,以光硬化性聚合物的總量為100重量份計,溶劑的使用量較佳為500重量份至20,000重量份,更佳為800重量份至10,000重量份,最佳為1,000重量份至6,000重量份。 Further, the solvent is preferably used in an amount of from 500 parts by weight to 20,000 parts by weight, more preferably from 800 parts by weight to 10,000 parts by weight, most preferably 1,000 parts by weight, based on 100 parts by total of the total amount of the photocurable polymer. 6,000 parts by weight.

在不損及本發明的光硬化性塗佈組成物的效果範圍內, 光硬化性塗佈組成物可依需要添加使用其他的添加劑。添加劑可單獨或混合使用,且添加劑包含但不限於增感劑、密著助劑、界面活性劑、溶解促進劑、消泡劑,或此等一組合。 Insofar as the effect of the photocurable coating composition of the present invention is not impaired, The photocurable coating composition may be added with other additives as needed. The additives may be used singly or in combination, and the additives include, but are not limited to, sensitizers, adhesion promoters, surfactants, dissolution promoters, antifoaming agents, or a combination thereof.

光硬化塗佈膜Light hardening coating film

在本發明的另一實施例中,可將上述光硬化性塗佈組成物利用各種適合的製程技術製作成膜。舉例來說,將上述光硬化性塗佈組成物塗佈於一基材上,進行預烤(pre-bake)處理、進行光硬化處理、以及進行後烤(post-bake)處理,即可形成光硬化塗佈膜。所述光硬化塗佈膜的膜厚度為100nm時,其折射率為1.60至1.65。 In another embodiment of the present invention, the photocurable coating composition can be formed into a film by various suitable process techniques. For example, the photocurable coating composition is applied onto a substrate, pre-bake, photohardenable, and post-bake. Light hardened coating film. When the film thickness of the photo-curing coating film is 100 nm, the refractive index thereof is from 1.60 to 1.65.

上述塗佈光硬化性塗佈組成物的方法並無限定,可使用一般的塗佈法,例如浸漬塗佈法、旋塗法、噴塗法、刷毛塗佈法、輥轉印法、網版印刷法、噴墨法或膠版印刷法。 The method of applying the photocurable coating composition is not limited, and a general coating method such as a dip coating method, a spin coating method, a spray coating method, a brush coating method, a roll transfer method, or screen printing can be used. Method, inkjet method or offset printing method.

上述預烤處理的溫度例如室溫至150℃,較佳為40℃至120℃。預烤處理的時間例如30秒至10分鐘左右,較佳為1分鐘至8分鐘左右。預烤處理的方法例如使用加熱板或熱風循環式烘箱等。 The temperature of the above prebaking treatment is, for example, room temperature to 150 ° C, preferably 40 ° C to 120 ° C. The pre-baking treatment time is, for example, about 30 seconds to 10 minutes, preferably about 1 minute to 8 minutes. The pre-baking treatment method is, for example, a hot plate or a hot air circulation type oven or the like.

上述光硬化處理所使用的光線以g線、h線、i線等紫外線為例,並且用來提供紫外線的設備例如(超)高壓水銀燈、金屬鹵素燈等。 The light used in the above photohardening treatment is exemplified by ultraviolet rays such as g-line, h-line, and i-line, and devices for providing ultraviolet rays such as (ultra) high-pressure mercury lamps, metal halide lamps, and the like.

所述後烤處理的溫度例如為100℃至300℃,較佳為150℃至250℃。後烤處理的時間例如5分鐘以上,較佳為15分鐘以 上。後烤處理的方法例如使用加熱板、熱風循環式烘箱、紅外線烘箱等。 The temperature of the post-baking treatment is, for example, 100 ° C to 300 ° C, preferably 150 ° C to 250 ° C. The post-baking treatment time is, for example, 5 minutes or longer, preferably 15 minutes. on. The post-baking treatment method uses, for example, a hot plate, a hot air circulation type oven, an infrared oven, or the like.

觸控面板Touch panel

在本發明的再一實施例中,上述光硬化塗佈膜可作為觸控面板的構件之一。 In still another embodiment of the present invention, the light-curable coating film can be used as one of members of a touch panel.

圖1是本發明一實施方式的觸控面板的上視示意圖。圖2是圖1的觸控面板沿剖線I-I’的剖面示意圖。請同時參照圖1及圖2,觸控面板100包括基板102、觸控元件104及保護層106。 1 is a top plan view of a touch panel according to an embodiment of the present invention. 2 is a cross-sectional view of the touch panel of FIG. 1 taken along line I-I'. Referring to FIG. 1 and FIG. 2 , the touch panel 100 includes a substrate 102 , a touch element 104 , and a protective layer 106 .

基板102可以是所屬領域中具有通常知識者所周知的任一基板,例如矽基板、玻璃基板、塑膠基板或是其他軟性基板。 Substrate 102 can be any substrate known in the art, such as a germanium substrate, a glass substrate, a plastic substrate, or other flexible substrate.

觸控元件104配置在基板102上。在本實施方式中,觸控元件104包括多個觸控串列110及多個觸控串列120,其中觸控串列110沿著方向D1延伸,觸控串列120沿著與方向D1相交的方向D2延伸,以及觸控串列110與觸控串列120彼此電性絕緣。詳細而言,各觸控串列110包括多個觸控電極112以及多條連接部114,其中各連接部114連接相鄰兩個觸控電極112,以及各觸控串列120包括多個觸控電極122以及多條連接部124,其中各連接部124連接相鄰兩個觸控電極122。另外,觸控串列110與觸控串列120的交錯處設置有絕緣圖案130,以使兩者彼此電性絕緣。 The touch element 104 is disposed on the substrate 102. In this embodiment, the touch component 104 includes a plurality of touch strings 110 and a plurality of touch strings 120, wherein the touch string 110 extends along the direction D1, and the touch string 120 intersects the direction D1. The direction D2 extends, and the touch string 110 and the touch string 120 are electrically insulated from each other. In detail, each touch string 110 includes a plurality of touch electrodes 112 and a plurality of connecting portions 114. Each of the connecting portions 114 connects two adjacent touch electrodes 112, and each touch string 120 includes multiple touches. The control electrode 122 and the plurality of connecting portions 124 are connected to the adjacent two touch electrodes 122. In addition, an insulation pattern 130 is disposed at the intersection of the touch string 110 and the touch string 120 to electrically insulate the two.

觸控串列110之觸控電極112與連接部114以及觸控串列120之觸控電極122與連接部124的材質可以相同或是不同,且例如是透明導電材料或其他適合的導電材料,其中透明導電材 料例如是銦錫氧化物、銦鋅氧化物、鋁鋅氧化物等,以及其混合物或是疊層。 The material of the touch electrode 112 and the connecting portion 114 of the touch string 110 and the touch electrode 122 and the connecting portion 124 of the touch string 120 may be the same or different, and is, for example, a transparent conductive material or other suitable conductive material. Transparent conductive material The materials are, for example, indium tin oxide, indium zinc oxide, aluminum zinc oxide, and the like, and mixtures or laminates thereof.

此外,雖然在本實施方式中是以具有圖1及圖2所示之結構的觸控元件104為例來進行說明,但本發明不以此為限。觸控元件104可以是所屬領域具有通常知識者所周知的任一觸控元件。也就是說,觸控元件104可以具有所熟知的其他構形。 In addition, in the present embodiment, the touch element 104 having the structure shown in FIGS. 1 and 2 is taken as an example, but the invention is not limited thereto. Touch element 104 can be any touch element known to those of ordinary skill in the art. That is, touch element 104 can have other configurations as are well known.

保護層106配置在基板102上且覆蓋觸控元件104,用以保護觸控元件104免於外力按壓而破壞。在本實施方式中,保護層106是由任一種前述實施方式中的光硬化塗佈膜實現。也就是說,保護層106是透過將本發明的光硬化性塗佈組成物塗佈於觸控元件104上後,進行預烤處理、光硬化處理以及後烤處理而形成。然而,光硬化塗佈膜的相關描述及製備方法已於前述實施方式中進行詳盡地說明,故於此不再贅述。 The protective layer 106 is disposed on the substrate 102 and covers the touch element 104 for protecting the touch element 104 from external force. In the present embodiment, the protective layer 106 is realized by the photo-curing coating film of any of the above embodiments. That is, the protective layer 106 is formed by applying the photocurable coating composition of the present invention to the touch element 104, and then performing prebaking treatment, photocuring treatment, and post-baking treatment. However, the related description and preparation method of the photo-curing coating film have been described in detail in the foregoing embodiments, and thus will not be described herein.

值得說明的是,如上所述,本發明的光硬化塗佈膜的折射率介於1.60至1.65之間,藉此使得以本發明的光硬化塗佈膜作為保護層的觸控面板可擁有良好的視別性及顯示品質。 It is to be noted that, as described above, the refractive index coating film of the present invention has a refractive index of between 1.60 and 1.65, whereby the touch panel using the photohardenable coating film of the present invention as a protective layer can have a good performance. Visibility and display quality.

以下列舉數個實驗用以驗證本發明的效果,但本發明之範圍並不侷限於以下實驗。 Several experiments are listed below to verify the effects of the present invention, but the scope of the present invention is not limited to the following experiments.

聚有機金屬矽氧烷之製備Preparation of polyorganometalloxane 1.原料 Raw material

VTMS:乙烯基三甲氧基矽烷(Vinyl trimethoxysilane) VTMS: Vinyl trimethoxysilane

KBM503:3-甲基丙烯醯氧丙基三甲氧基矽烷 (3-Methacryloxypropyl trimethoxysilane) KBM503: 3-methacryloxypropyltrimethoxydecane (3-Methacryloxypropyl trimethoxysilane)

KBE503:3-甲基丙烯醯氧丙基三乙氧基矽烷 (3-Methacryloxypropyl triethoxysilane) KBE503: 3-methacryloxypropyltriethoxydecane (3-Methacryloxypropyl triethoxysilane)

KBM5103:3-丙烯醯氧基丙基三甲氧基矽烷(3-Acryloxypropyl trimethoxysilane) KBM5103: 3-Acryloxypropyl trimethoxysilane

TEOS:四乙氧基矽烷(Tetraethoxysilane) TEOS: Tetraethoxysilane

TMOS:四甲氧基矽烷(Tetramethoxysilane) TMOS: Tetramethoxysilane

Ti(OBu)4:四正丁氧基鈦 Ti(OBu) 4 : tetra-n-butoxy titanium

Ti(OEt)4:四乙氧基鈦 Ti(OEt) 4 : tetraethoxy titanium

Ti(OPr)4:四異丙氧基鈦 Ti(OPr) 4 : titanium tetraisopropoxide

2.合成例A1 2. Synthesis Example A1

在一容積500毫升的三頸燒瓶中,加入20重量份的乙烯基三甲氧基矽烷(VTMS)、15重量份的3-甲基丙烯醯氧丙基三甲氧基矽烷(KBM503)、15重量份的四乙氧基矽烷(TEOS)、50重量份的四正丁氧基鈦(Ti(OBu)4)及150重量份的N-甲基吡咯烷酮。之後,於室溫下一邊攪拌一邊於30分鐘內,添加鹽酸水溶液,其比例為0.6重量份的35%鹽酸(Hydrochloric acid)與15重量份的去離子水(deionized water)。接著,浸於30℃的油浴中並攪拌30分鐘,反應結束後進行減壓濃縮,可得固形份含量為30wt%之聚有機金屬矽氧烷溶液。 In a 500 ml three-necked flask, 20 parts by weight of vinyltrimethoxydecane (VTMS), 15 parts by weight of 3-methylpropenyloxypropyltrimethoxydecane (KBM503), and 15 parts by weight were added. Tetraethoxydecane (TEOS), 50 parts by weight of titanium tetra-n-butoxide (Ti(OBu) 4 ), and 150 parts by weight of N-methylpyrrolidone. Thereafter, an aqueous hydrochloric acid solution was added over a period of 30 minutes while stirring at room temperature in a ratio of 0.6 part by weight of 35% hydrochloric acid (hydrochloric acid) and 15 parts by weight of deionized water. Subsequently, the mixture was immersed in an oil bath at 30 ° C and stirred for 30 minutes, and after the completion of the reaction, concentration under reduced pressure was carried out to obtain a polyorganometalloxane solution having a solid content of 30% by weight.

3.合成例A2~A5 3. Synthesis Example A2~A5

按照表一的比例,並採用與合成例A1相同的製備方式進 行合成例A2~A5之製備。 According to the ratio of Table 1, and using the same preparation method as in Synthesis Example A1 The preparation of the synthesis examples A2 to A5 was carried out.

聚醯亞胺系聚合物之製備Preparation of polyamidene polymer 1.合成例B1 1. Synthesis Example B1

在一容積500毫升之四頸錐瓶上設置氮氣入口、攪拌器、加熱器、冷凝管及溫度計,並導入氮氣。於此四頸錐瓶加入10.01克的4,4’-二胺基二苯基醚及70克的N-甲基吡咯烷酮,在室溫下攪拌至溶解後;接著,加入10.91克的苯均四羧酸二酐及30克的N-甲基吡咯烷酮,並在室溫反應6小時。反應後,加入97克的N-甲基吡咯烷酮、5.61克的醋酸酐及19.35克的吡啶至前述之反應液中,升溫至60℃,且持續攪拌3小時,進行脫水閉環反應。反應結束後,將反應溶液倒入1500毫升的水中以析出聚合物。過濾所得之聚合物,以甲醇重複進行清洗及過濾之步驟三次。之後, 將產物置入真空烘箱中,並以溫度60℃進行乾燥,即可得聚醯亞胺系聚合物。將所得之聚醯亞胺系聚合物進行醯亞胺化率之評價,結果顯示於表二。接著,將100重量份的聚醯亞胺系聚合物及1150重量份的N-甲基吡咯烷酮,以搖動式攪拌器攪拌均勻後,可得固形份8wt%的聚醯亞胺系聚合物溶液。 A nitrogen inlet, a stirrer, a heater, a condenser, and a thermometer were placed on a four-necked conical flask having a volume of 500 ml, and nitrogen gas was introduced. 10.01 g of 4,4'-diaminodiphenyl ether and 70 g of N-methylpyrrolidone were added to the four-necked flask, and stirred at room temperature until dissolved; then, 10.91 g of benzene was added. The carboxylic acid dianhydride and 30 g of N-methylpyrrolidone were reacted at room temperature for 6 hours. After the reaction, 97 g of N-methylpyrrolidone, 5.61 g of acetic anhydride and 19.35 g of pyridine were added to the above reaction liquid, and the mixture was heated to 60 ° C, and stirring was continued for 3 hours to carry out a dehydration ring closure reaction. After the reaction was completed, the reaction solution was poured into 1500 ml of water to precipitate a polymer. The resulting polymer was filtered, and the steps of washing and filtering were repeated three times with methanol. after that, The product was placed in a vacuum oven and dried at a temperature of 60 ° C to obtain a polyamidene-based polymer. The obtained polyfluorene-based polymer was evaluated for the ruthenium yield, and the results are shown in Table 2. Next, 100 parts by weight of a polyimine-based polymer and 1150 parts by weight of N-methylpyrrolidone were uniformly stirred by a shaking stirrer to obtain a polycondensed polyimide polymer solution having a solid content of 8 wt%.

2.合成例B2~B6 2. Synthesis Example B2~B6

按照表二的比例,並採用與合成例B1相同的製備方式進行合成例B2~B6之製備,並在表二中顯示合成例B2~B6之醯亞胺化率。 The preparation of Synthesis Examples B2 to B6 was carried out in the same manner as in Synthesis Example B1 according to the ratio of Table 2, and the imidization ratio of the synthesis examples B2 to B6 is shown in Table 2.

光硬化性聚合物的製備Preparation of photocurable polymer 1.實驗例1~9 1. Experimental examples 1 to 9

在容積500毫升的三頸燒瓶中,根據表三所示的最終成分與比例,加入各種比例範圍之合成例,如實驗例1是加入120重量份的前述合成例A1聚有機金屬矽氧烷溶液,以及50重量份的前述合成例B1聚醯亞胺系聚合物溶液。接著,升溫至60℃加熱攪拌6小時,再利用蒸餾方式將溶劑移除,即可得光硬化性聚合物。 In a three-necked flask having a volume of 500 ml, according to the final composition and ratio shown in Table 3, a synthesis example in various ratio ranges was added, as in Experimental Example 1, 120 parts by weight of the above-mentioned synthesis example A1 polyorganometalloxane solution was added. And 50 parts by weight of the above-mentioned Synthesis Example B1 polyamidene-based polymer solution. Subsequently, the mixture was heated to 60 ° C for heating and stirring for 6 hours, and the solvent was removed by distillation to obtain a photocurable polymer.

將上述光硬化性聚合物100重量份與1900重量份的N-甲基吡咯烷酮,以搖動式攪拌器攪拌均勻後,即可得到實驗例1~9的光硬化性塗佈組成物溶液(固形份:5重量%)。 100 parts by weight of the photocurable polymer and 1900 parts by weight of N-methylpyrrolidone were uniformly stirred by a stirring stirrer to obtain a photocurable coating composition solution of Experimental Examples 1 to 9 (solid content) : 5 wt%).

2.比較例1~6 2. Comparative Examples 1~6

在容積500毫升的三頸燒瓶中,根據表四所示的最終成分與比例,加入各種比例範圍之合成例。接著,升溫至60℃加熱攪拌6小時,再利用蒸餾方式將溶劑移除,即可得光硬化性聚合物。 In a three-necked flask having a volume of 500 ml, according to the final components and ratios shown in Table 4, synthesis examples in various ratio ranges were added. Subsequently, the mixture was heated to 60 ° C for heating and stirring for 6 hours, and the solvent was removed by distillation to obtain a photocurable polymer.

將上述光硬化性聚合物100重量份與1900重量份的N-甲基吡咯烷酮,以搖動式攪拌器攪拌均勻後,即可得到比較例1~6的光硬化性塗佈組成物溶液(固形份:5重量%)。 100 parts by weight of the photocurable polymer and 1900 parts by weight of N-methylpyrrolidone were uniformly stirred by a shaking stirrer to obtain a photocurable coating composition solution of Comparative Examples 1 to 6 (solid content) : 5 wt%).

將上述實驗例1~9與比較例1~6的光硬化性塗佈組成物溶液進行以下測試,並將結果記載於表三和表四。 The photocurable coating composition solutions of the above Experimental Examples 1 to 9 and Comparative Examples 1 to 6 were subjected to the following tests, and the results are shown in Tables 3 and 4.

測試方法testing method 1.溶液分散性 Solution dispersion

以透明玻璃器具盛裝組成物溶液並放置於黑布上,以由上部照亮的狀態,以目視進行觀察,依據以下基準進行評價。 The composition solution was placed in a transparent glassware, placed on a black cloth, and visually observed in a state of being illuminated from the upper portion, and evaluated according to the following criteria.

○:組成物溶液為透明澄清。 ○: The composition solution was transparent and clear.

×:組成物溶液有塊狀沉澱物質或溶液呈混濁。 ×: The composition solution has a bulk precipitated substance or the solution is cloudy.

2.溶液塗佈性 2. Solution coating

組成物溶液以孔徑0.5μm之膜濾器加壓過濾,以旋塗法於PI基板上形成塗膜。經由目視觀察,依據以下基準進行評價。 The composition solution was filtered under pressure with a membrane filter having a pore size of 0.5 μm to form a coating film on the PI substrate by spin coating. The evaluation was performed based on the following criteria by visual observation.

○:塗膜平整。 ○: The coating film was flat.

△:塗膜有針孔。 △: The coating film has pinholes.

×:無法成膜。 ×: Film formation was impossible.

3.折射率 3. refractive index

將上述溶液塗佈性測試所得有塗膜的基板,置於溫度設定為90℃的加熱板上,加熱5分鐘使其乾燥。之後,使用紫外線照射裝置進行材料固化,以UV波長254nm能量2000mJ/cm2(燈源功率30mW/cm2,科毅公司製造,型號:AG110-4D-N-C)和UV波長365nm能量3500mJ/cm2(燈源功率100mW/cm2,Eye Graphies公司製造,型號:UB-011-3A)之紫外線照射後,將基板移至溫度設定為230℃的熱風循環式烘箱內,進行後烤處理30分鐘,以於基板上形成光硬化塗佈膜(膜厚為100nm)。再使用薄膜量測儀(Mission Peak Optics Inc.製造,型號:MP100-ST),測定波長550nm下的折射率。 The substrate having the coating film obtained by the above-described solution coating property test was placed on a hot plate set to a temperature of 90 ° C, and dried by heating for 5 minutes. Thereafter, the material was solidified using an ultraviolet irradiation device at an energy of 2000 mJ/cm 2 at a UV wavelength of 254 nm (light source power of 30 mW/cm 2 , manufactured by Keyi, model: AG110-4D-NC) and energy of 3500 mJ/cm 2 at a wavelength of 365 nm. After the ultraviolet irradiation (light source power 100 mW/cm 2 , manufactured by Eye Graphies, model: UB-011-3A), the substrate was transferred to a hot air circulating oven set to a temperature of 230 ° C, and post-baked for 30 minutes. A photo-curing coating film (having a film thickness of 100 nm) was formed on the substrate. Further, a refractive index at a wavelength of 550 nm was measured using a film measuring instrument (manufactured by Mission Peak Optics Inc., model: MP100-ST).

4.耐化性 4. Chemical resistance

進行耐化測試前先量測試片膜厚,將試片浸泡於耐化測試液(1% KOH)中,浸泡溫度為40℃、浸泡時間為2分鐘。浸泡後將試片取出,以去離子水清洗,在氮氣下乾燥後,量測耐化測試後的試片膜厚。 The film thickness was measured before the endurance test, and the test piece was immersed in a chemical resistant test solution (1% KOH) at a soaking temperature of 40 ° C and a soaking time of 2 minutes. After immersing, the test piece was taken out, washed with deionized water, and dried under nitrogen, and the film thickness of the test piece after the endurance test was measured.

○:膜厚減少比例≦10%。 ○: The film thickness reduction ratio was ≦10%.

×:膜厚減少比例>10%。 ×: The film thickness reduction ratio was >10%.

5.百格密著性 5. Hundreds of confidentiality

據JIS K5600的方法,在10cm×10cm的塊狀光硬化塗佈膜表面上,以切刀切出10格(square)×10格的100個方格。之後,將3M公司製造的600膠帶黏貼於表面上,並予以急遽地剝離,以殘留的方格數目進行評估,其評估標準如下。 According to the method of JIS K5600, 100 squares of 10 squares × 10 squares were cut by a cutter on the surface of a 10 cm × 10 cm bulk photo-curing coating film. Thereafter, 600 tapes manufactured by 3M Company were adhered to the surface, and they were peeled off sharply, and evaluated by the number of remaining squares, and the evaluation criteria were as follows.

5B:無任何方格脫落。 5B: No squares fall off.

4B:0%<脫落的方格數量≦5%。 4B: 0% < the number of squares falling off ≦ 5%.

3B:5%<脫落的方格數量≦15%。 3B: 5% < the number of squares falling off ≦ 15%.

2B:15%<脫落的方格數量≦35%。 2B: 15% < the number of fallen squares is 5% 35%.

1B:35%<脫落的方格數量≦65%。 1B: 35% < the number of squares falling off ≦ 65%.

0B:65%<脫落的方格數量≦100%。 0B: 65% < the number of squares dropped off ≦ 100%.

6.鉛筆硬度 6. Pencil hardness

依據JIS K5600-5-4的鉛筆硬度試驗,對上述10cm×10cm的塊狀光硬化塗佈膜表面進行硬度測定。鉛筆硬度規格較佳為大於等於HB,更佳為大於等於H以上。 The surface of the above-mentioned 10 cm × 10 cm bulk photo-curing coating film was subjected to hardness measurement in accordance with the pencil hardness test of JIS K5600-5-4. The pencil hardness specification is preferably greater than or equal to HB, and more preferably greater than or equal to H.

表三 Table 3

由表三可知,實驗例1~9的光硬化性塗佈組成物皆具有良好的溶液分散性與溶液塗佈性,且所製得的光硬化塗佈膜在折射率、百格密著性、鉛筆硬度及耐化性方面均有良好表現。 As can be seen from Table 3, the photocurable coating compositions of Experimental Examples 1 to 9 all have good solution dispersibility and solution coating properties, and the obtained photohardenable coating film has a refractive index and a hundred-gram adhesion. , pencil hardness and chemical resistance have a good performance.

相反地,在表四中,比較例1的溶液分散性與溶液塗佈性不佳,故不進行後續評價。比較例2與5的溶液塗佈性不佳,特別是比較例2的折射率表現亦不佳,故兩者也不進行後續評價。比較例3、4與6在百格密著性上都僅有3B或更小的評價,在鉛筆硬度上的表現則分別是H、H與B;另外,比較例3與6在耐化性也表現不佳。 On the contrary, in Table 4, the solution dispersibility and the solution coating property of Comparative Example 1 were not good, so that subsequent evaluation was not performed. The coating properties of Comparative Examples 2 and 5 were not good, and in particular, the refractive index of Comparative Example 2 was not good, so neither of them was evaluated. Comparative Examples 3, 4 and 6 have only 3B or less evaluation on the hundred-cell adhesion, and H, H and B on the pencil hardness, respectively; and Comparative Examples 3 and 6 in the chemical resistance. Also underperformed.

綜上所述,在本發明所提出的光硬化性塗佈組成物中,藉由含量在特定範圍內之聚有機金屬矽氧烷結構與聚醯亞胺系結構,以及聚醯亞胺系結構具有特定範圍之醯亞胺化率,構成光硬化性聚合物。這樣的光硬化性聚合物在溶液分散性與溶液塗佈性方面優異,且可製得對於PI基板具有良好密著性,並且折射率、鉛筆硬度與耐化性皆有良好表現的光硬化塗佈膜。 In summary, in the photocurable coating composition of the present invention, the polyorganometalloxane structure and the polyamidene structure and the polyamidene structure are contained in a specific range. It has a specific range of ruthenium imidization ratio and constitutes a photocurable polymer. Such a photocurable polymer is excellent in solution dispersibility and solution coating property, and can provide a photohardenable coating which has good adhesion to a PI substrate and which has good refractive index, pencil hardness and chemical resistance. Cloth film.

雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,故本發明的保護範圍 當視後附的申請專利範圍所界定者為準。 Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of protection of the present invention It is subject to the definition of the scope of the patent application attached.

Claims (10)

一種光硬化性塗佈組成物,包括:具有聚有機金屬矽氧烷結構與聚醯亞胺系結構之光硬化性聚合物,其中基於該光硬化性聚合物100重量份,該聚有機金屬矽氧烷結構之含量為60重量份至95重量份,該聚醯亞胺系結構之含量為5重量份至40重量份;以及該聚醯亞胺系結構之醯亞胺化率為60%至75%。 A photocurable coating composition comprising: a photocurable polymer having a polyorganometalloxane structure and a polyamidene-based structure, wherein the polyorganometallic ruthenium is based on 100 parts by weight of the photocurable polymer The content of the oxyalkylene structure is from 60 parts by weight to 95 parts by weight, the content of the polyamidene structure is from 5 parts by weight to 40 parts by weight; and the ruthenium imidization ratio of the polyamidene structure is 60% to 75%. 如申請專利範圍第1項所述的光硬化性塗佈組成物,其中基於該光硬化性聚合物100重量份,該聚有機金屬矽氧烷結構之含量為65重量份至90重量份,該聚醯亞胺系結構之含量為10重量份至35重量份。 The photocurable coating composition according to claim 1, wherein the polyorganometalloxane structure is contained in an amount of from 65 parts by weight to 90 parts by weight based on 100 parts by weight of the photocurable polymer. The content of the polyimine structure is from 10 parts by weight to 35 parts by weight. 如申請專利範圍第2項所述的光硬化性塗佈組成物,其中基於該光硬化性聚合物100重量份,該聚有機金屬矽氧烷結構之含量為70重量份至90重量份,該聚醯亞胺系結構之含量為10重量份至30重量份。 The photocurable coating composition according to claim 2, wherein the polyorganometalloxane structure is contained in an amount of 70 parts by weight to 90 parts by weight based on 100 parts by weight of the photocurable polymer. The content of the polyimine structure is from 10 parts by weight to 30 parts by weight. 如申請專利範圍第1項所述的光硬化性塗佈組成物,其中該聚醯亞胺系結構之醯亞胺化率為60%至69%。 The photocurable coating composition according to claim 1, wherein the polyamidene structure has a ruthenium amination ratio of 60% to 69%. 如申請專利範圍第1項所述的光硬化性塗佈組成物,更包括溶劑。 The photocurable coating composition according to claim 1, further comprising a solvent. 如申請專利範圍第1項所述的光硬化性塗佈組成物,其中該聚有機金屬矽氧烷結構包含通式(I)、通式(II)及通式(III)所示之化合物經加水分解縮合反應而得,Ra 1Si(ORb)3 (I) 式(I)中,Ra表示碳數2~10之烯基、具有丙烯醯氧基的碳數1~5的烷基或具有甲基丙烯醯氧基的碳數1~5的烷基;Rb表示碳數1~5之烷基;Si(ORc)4 (II)式(II)中,Rc表示碳數1~5之烷基;M(ORd)n (III)式(III)中,M表示鈦(Ti)、鉭(Ta)、鋯(Zr)、硼(B)、鋁(Al)、鎂(Mg)或鋅(Zn),Rd表示碳數1~5之烷基,n為2~5的整數;其中,基於通式(I)、通式(II)及通式(III)所示之化合物100重量份,該通式(I)所示之化合物之含量為25重量份至45重量份,該通式(II)所示之化合物之含量為15重量份至20重量份,該通式(III)所示之化合物之含量為35重量份至60重量份。 The photocurable coating composition according to claim 1, wherein the polyorganometalloxane structure comprises a compound represented by the formula (I), the formula (II) and the formula (III). Addition of a water-decomposition condensation reaction, R a 1 Si(OR b ) 3 (I) In the formula (I), R a represents an alkenyl group having 2 to 10 carbon atoms and an alkyl group having 1 to 5 carbon atoms having an acryloxy group. Or an alkyl group having 1 to 5 carbon atoms having a methacryloxy group; R b represents an alkyl group having 1 to 5 carbon atoms; Si (OR c ) 4 (II) wherein R c represents carbon Number of alkyl groups of 1 to 5; M(OR d ) n (III) In the formula (III), M represents titanium (Ti), cerium (Ta), zirconium (Zr), boron (B), aluminum (Al), Magnesium (Mg) or zinc (Zn), R d represents an alkyl group having 1 to 5 carbon atoms, and n is an integer of 2 to 5; wherein, based on the general formula (I), the general formula (II) and the general formula (III) 100 parts by weight of the compound shown, the compound represented by the formula (I) is contained in an amount of 25 parts by weight to 45 parts by weight, and the compound represented by the formula (II) is contained in an amount of 15 parts by weight to 20 parts by weight, The content of the compound represented by the formula (III) is from 35 parts by weight to 60 parts by weight. 如申請專利範圍第6項所述的光硬化性塗佈組成物,其中該通式(I)所示之化合物包括乙烯基三甲氧基矽烷、以及至少一種選自3-甲基丙烯醯氧丙基三甲氧基矽烷、3-甲基丙烯醯氧丙基三乙氧基矽烷及3-丙烯醯氧丙基三甲氧基矽烷。 The photocurable coating composition according to claim 6, wherein the compound represented by the formula (I) comprises vinyltrimethoxynonane, and at least one selected from the group consisting of 3-methylpropenyloxypropane Trimethoxy decane, 3-methacryl oxiranyl triethoxy decane and 3-propenyl methoxypropyl trimethoxy decane. 一種光硬化塗佈膜,其由如申請專利範圍第1項至第7項中任一項所述的光硬化性塗佈組成物所製得。 A photo-curable coating film obtained by the photocurable coating composition according to any one of claims 1 to 7. 如申請專利範圍第8項所述的光硬化塗佈膜,其膜厚度為100nm時之折射率為1.60至1.65。 The photo-curing coating film according to item 8 of the invention of claim 8 has a refractive index of 1.60 to 1.65 at a film thickness of 100 nm. 一種觸控面板,包括如申請專利範圍第8項或第9項所述的光硬化塗佈膜。 A touch panel comprising the photo-curing coating film according to claim 8 or claim 9.
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