TWI564093B - Cleaning apparatus - Google Patents

Description

Cleaning device

The present invention relates to a cleaning device, and more particularly to a cleaning device for cleaning a semiconductor product.

A conventional semiconductor product includes a substrate and a plurality of conductive terminals spaced apart from each other on the substrate. Semiconductor products are soldered to the pads of another circuit product through conductive terminals, and semiconductor products can exchange signals for another circuit product. However, during soldering or soldering, the gap between the conductive terminals is often contaminated with dirt or foreign matter, resulting in a short circuit or poor contact between the conductive terminals.

Operators can only use the items at hand (such as blades or screwdrivers) to scrape off any dirt or foreign matter in each interval, which not only takes a lot of time, but also damages the conductive terminals of the semiconductor products or the lines on the substrate, thus affecting The original electrical properties of semiconductor products.

To this end, if we can provide a solution design that can solve the above requirements and let the industry stand out from the competition, it becomes an important issue to be solved urgently.

In view of the above, it is an object of the present invention to provide a cleaning apparatus for solving the difficulties mentioned in the prior art.

In order to achieve the above object, in accordance with an embodiment of the present invention, such a cleaning device is adapted to clean a semiconductor product. The semiconductor product has a plurality of spaced-apart conductive terminals, and a plurality of gaps are formed between the conductive terminals. The cleaning device includes a housing and a cleaning head. The cleaning head includes a body and a plurality of pins. The body is located on the housing. The pins are spaced side by side on the body for respectively extending into the gaps between the conductive terminals to clean the semiconductor product. The space between any two adjacent pins accommodates a single conductive terminal.

Thus, through the cleaning device, the embodiment can not only quickly remove the dirt or foreign matter at every interval on the semiconductor product, but also damage the conductive terminals of the semiconductor product or the circuits on the substrate, thereby avoiding affecting the original electrical performance of the semiconductor product. .

In one or more embodiments of the invention, the stitches are movably located on the body such that the plurality of pitches of the stitches are adjustable relative to one another.

In one or more embodiments of the present invention, the body includes a telescoping mechanism and an adjustment portion. The telescopic mechanism is telescopically located in the housing and is extended and contracted along an axial direction, and the stitches are arranged side by side on one side of the telescopic mechanism, so that the plurality of pitches of the stitches are corresponding to the expansion and contraction of the telescopic mechanism. Adjustment. The adjustment portion is movably disposed on the housing and is connected to the telescopic mechanism for controlling the expansion and contraction of the telescopic mechanism.

In one or more embodiments of the invention, the telescoping mechanism comprises a plurality of first links, a plurality of second links, a plurality of third links, and a plurality of fourth links. The shafts are connected to the pins, respectively, and one of the long axes of each of the pins intersects at least one of the major axes of each of the shafts. One end of each second link is pivotally connected to one end of each of the first links through one of the shafts. An intermediate region of each of the third links is pivotally coupled to an intermediate region of each of the first links. One end of each fourth link is pivotally connected to one end of each third link, and an intermediate portion of each fourth link is pivotally connected to an intermediate portion of each second link. The adjusting portion connects the other end of one of the first links with the other end of one of the third links. When the adjusting portion rotates the first link, the second link, the third link, and the fourth link such that the intermediate portion of the first link and the intermediate portion of the fourth link approach each other, the telescopic mechanism reduces the stitch spacing.

In one or more embodiments of the invention, the telescoping mechanism includes a Z-folded elastic sheet. The Z-folded elastic piece has a plurality of first body portions and a plurality of second body portions. The first body portions and the second body portions are adjacent to each other, and each of the first body portions has an adjacent side edge between the adjacent second body portions. The stitches are respectively coupled to the adjacent side edges, and one of the long axes of each of the pins intersects at least one of the major axes of each of the adjacent side edges. The adjustment portion is connected to one end of the Z-shaped folded elastic piece. In this manner, when the adjustment portion compresses the Z-folded flaps such that the first sheet portions and the second sheet portions approach each other, the telescopic mechanism reduces the pitch of the stitches.

In one or more embodiments of the present invention, the adjusting portion is a slider, the slider is slidably located on the housing, and one end of the telescopic mechanism is connected to adjust the stitches of the telescopic mechanism to adjust the stitches. spacing.

In one or more embodiments of the invention, the stitches are juxtaposed side by side on the body, wherein the spacing of the stitches is identical to one another. The surface of the housing has a scale adjacent to the position of the slider. The scale has a plurality of scale values. These scale values correspond to these spacings for these pins, respectively.

In one or more embodiments of the present invention, the telescopic mechanism has a resilient elasticity, the adjusting portion is a rotating bolt, the rotating bolt is screwed to the housing, and the rotating bolt abuts against one end of the telescopic mechanism for controlling the telescopic mechanism The telescopic, adjust these spacing of these pins.

In one or more embodiments of the invention, the stitches are juxtaposed side by side to the body, wherein the spacing of the stitches is identical to one another. The surface of the rotating bolt has a scale, and the scale has a plurality of scale values, which respectively correspond to the spacing of the stitches.

In one or more embodiments of the invention, the pins are fixedly located on the body, wherein the spacing of the pins is constant.

In one or more embodiments of the invention, the cleaning head is removably located on the housing.

In one or more embodiments of the invention, the stitches are juxtaposed side by side to the body, wherein the spacing of the stitches is identical to one another.

In one or more embodiments of the invention, the pins comprise an antistatic material.

In one or more embodiments of the present invention, the stitches are linear, hooked, L-shaped or pointed.

In one or more embodiments of the invention, one end of each of the pins has a sharp portion or plane.

The above description is only for explaining the problems to be solved by the present invention, the technical means for solving the problems, the effects thereof, and the like, and the specific details of the present invention will be described in detail in the following embodiments and related drawings.

10, 11, 12, 13‧‧‧ cleaning devices

100, 101, 102, 103‧‧‧ shells

110‧‧‧ accommodating slots

111‧‧‧ housing inner wall

120‧‧‧ first opening

130‧‧‧second opening

140‧‧‧ third opening

150‧‧‧Slot section

160‧‧‧Second socket

170‧‧‧scale

200, 201, 202‧‧‧ cleaning head

210‧‧‧ body

211‧‧‧First set of joints

220‧‧‧cross telescopic fence

221‧‧‧ first link

222‧‧‧second link

223‧‧‧third link

224‧‧‧fourth link

225‧‧‧ shaft

226‧‧‧ pivot

230‧‧‧Z-fold folding spring

231‧‧‧ first body

232‧‧‧Second body

233‧‧‧ adjacent side edges

240‧‧‧Adjustment Department

250‧‧‧ Slider

251‧‧‧Sliding track

252‧‧‧Operating parts

260‧‧‧Rotating bolt

261‧‧‧circular surface

262‧‧‧ scale

300, 300A~300D‧‧‧ pins

301‧‧‧ plane

302‧‧‧ end face

303‧‧‧ Sharp Department

400‧‧‧Package unit

410‧‧‧Electrical terminals

C1‧‧‧first hour hand direction

C2‧‧‧second hour direction

D1‧‧‧ first direction

D2‧‧‧ second direction

G1‧‧‧ spacing

G2‧‧‧ gap

X~Z‧‧‧ axis

The above and other objects, features, advantages and embodiments of the present invention will become more <RTIgt; <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; FIG. 2 is an exploded view of the cleaning device of FIG. 1; FIG. 3 is a partially enlarged view of the cleaning head of FIG. 2; and FIG. 4 is a schematic view showing the operation of the cleaning device of FIG. 1; 5 to 6 are schematic views showing a cleaning device according to another embodiment of the present invention; FIG. 7 is a schematic view showing a cleaning device according to another embodiment of the present invention; and FIG. 8 is a view showing still another embodiment of the present invention; A schematic view of a cleaning device of an embodiment; and FIGS. 9A-9D illustrate schematic views of stitches of a cleaning device in accordance with other embodiments of the present invention.

The embodiments of the present invention are disclosed in the following drawings, and the details of However, it should be understood that these practical details are not intended to limit the invention. That is, in some embodiments of the invention, these practical details are not necessary. In addition, some conventional structures and components are used to simplify the drawing. The drawings will be illustrated in a simple schematic manner.

1 is a schematic view of a cleaning device 10 and a semiconductor product to be cleaned in accordance with an embodiment of the present invention. Fig. 2 is an exploded view of the cleaning device 10 of Fig. 1. As shown in Figures 1 and 2, such a cleaning device 10 is used to clean a semiconductor product to be cleaned. The cleaning device 10 includes a housing 100 and a cleaning head 200. The cleaning head 200 includes a body 210 and a plurality of pins 300. The body 210 is located on the housing 100. The pins 300 are spaced side by side on the body 210, so that there is a gap G1 between any two adjacent pins 300. In the present embodiment, the pins 300 are arranged side by side on the body 210 in a single row, and the pins 300 are equally spaced on the body 210, that is, the pitches G1 of the pins 300 are identical to each other. However, the present invention is not limited thereto. In other embodiments, the pins need not be equidistantly arranged side by side on the body, and need not be arranged side by side on the body.

In the present embodiment, the semiconductor product is, for example, a package unit 400. The package unit 400 has a plurality of conductive terminals 410. The conductive terminals 410 are spaced apart from each other on the package unit 400. Therefore, there is a gap G2 between any two adjacent conductive terminals 410. For example, the gap G2 of the conductive terminals 410 is generally between 0.2 and 1.27 mm. These pitches G1 of the stitches 300 are generally 0.2 to 3 mm.

Thus, when the pins 300 of the cleaning device 10 respectively protrude into and clean the gaps G2 of the package unit 400, the pins 300 can not only quickly remove the dirt or foreign matter in the gaps G2 of the package unit 400, nor damage them. The conductive terminals 410 of the package unit 400 or the surface lines thereon, thereby avoiding affecting the original electrical performance of the package unit 400.

It should be understood that when the pins 300 are respectively protruded into the gaps G2 of the package unit 400, the space between any two adjacent pins 300 is The test spacing G1) can accommodate one of the conductive terminals 410 of the package unit 400. However, the present invention is not limited thereto. In other embodiments, the gap between any two adjacent conductive terminals does not have to accommodate only a single conductive terminal of the package unit.

However, the present invention is not limited thereto. In other embodiments, the semiconductor product may also be a circuit board (not shown).

In the present embodiment, the pins 300 are movably located on the body 210 such that the spacing G1 of the pins 300 relative to one another is adjustable. More specifically, for example, the stitches 300 can be located on the body 210 in a laterally movable manner. When these stitches 300 are moved laterally, these pitches G1 of the stitches 300 can thus be increased or decreased in synchronization.

Fig. 3 is a partial enlarged view of the cleaning head 200 of Fig. 2. FIG. 3 is a schematic view showing the operation of the cleaning device 10 of FIG. 1. As shown in FIGS. 2 and 3 , the housing 100 has a receiving groove 110 , a first opening 120 and a second opening 130 . The accommodating groove 110 is located inside the housing 100. The first opening 120 is located at one side of the housing 100 and is connected to the receiving slot 110. The second opening 130 is located on the other side of the housing 100 and is connected to the receiving slot 110. The body 210 includes an adjustment portion 240 and a telescopic mechanism (such as a cross telescopic fence 220). The telescopic mechanism is telescopically located in the receiving groove 110 of the housing 100 and is stretched and contracted in an axial direction (such as the Y-axis), and the pins 300 are axially aligned (such as the Y-axis) on one side of the telescopic mechanism, so that these The pitch G1 of the stitch 300 is adjusted correspondingly with the expansion and contraction of the telescopic mechanism. The adjusting portion 240 is movably disposed on the housing 100 and is connected with a telescopic mechanism for controlling the expansion and contraction of the telescopic mechanism.

For example, the telescopic mechanism is a cross-retractable barrier 220 that is telescopically located in the receiving slot 110 of the housing 100, and the opposite ends of the cross-retracting barrier 220 are connected to the adjusting portion 240 and the housing inner wall 111, respectively. These pins 300 side by side The ground is connected to one side of the cross-retractable barrier 220 and extends out of the housing 100 from the accommodating slot 110 via the first opening 120. The adjustment unit 240 movably connects the housing 100 and the cross-retracting barrier 220 for dynamically controlling the expansion and contraction of the telescopic mechanism, thereby adjusting the pitch G1 of the pins 300.

More specifically, as shown in FIG. 3 , the adjusting portion 240 is a slider 250 , and the slider 250 is slidably disposed on the housing 100 and connected to one end of the cross telescopic barrier 220 for controlling the cross telescopic fence 220 . The telescoping adjusts these spacings G1 of these pins 300. For example, the slider 250 slidably connects the housing 100 with the cross telescoping fence 220. The slider 250 has at least one sliding rail portion 251 and an operating member 252. The housing 100 has at least one sliding groove portion 150. The sliding rail portion 251 of the sliding block 250 and the sliding groove portion 150 of the housing 100 are engaged with each other. The 250 can slide back and forth in the accommodating groove 110 to dynamically control the expansion and contraction of the cross-retracting fence 220. The operating member 252 of the slider 250 extends out of the housing 100 via the second opening 130 for the user to slide.

In this way, regardless of the gap specifications of the pins 300 of the package unit 400, the pitch G1 of the pins 300 can be increased or decreased by controlling the expansion and contraction of the telescopic mechanism (such as the cross telescopic barrier 220), thereby facilitating the user. The package unit 400 of different gap specifications is immediately cleaned.

In the present embodiment, the cross-telescopic fence 220 includes a plurality of first links 221, a plurality of second links 222, a plurality of third links 223, and a plurality of fourth links 224. The first link 221 to the fourth link 224 are pivotally connected to each other through the pivot 226. More specifically, the adjusting portion 240 connects one end of the first first link 221 away from the second link 222 and one end of the first third link 223 away from the fourth link 224, respectively. The inner wall 111 of the housing is respectively connected to the last second link 222 away from the first One end of a link 221 is connected to an end of the last fourth link 224 away from the third link 223. In the remaining first link 221 to fourth link 224, the two ends of the first link 221 are respectively pivotally connected to one end of the two second links 222, and the two ends of the second link 222 are pivotally connected to the two ends respectively. One end of the first link 221 and the two ends of the third link 223 are respectively pivotally connected to one ends of the two fourth links 224, and the two ends of the fourth link 224 are respectively pivotally connected to the two third links. One end of 223. In addition, an intermediate portion of the third link 223 is pivotally connected to an intermediate portion of the first link 221 via a pivot 226. An intermediate portion of the fourth link 224 is pivotally coupled to an intermediate region of the second link 222 via a pivot 226. In particular, the second link 222 is pivotally connected to the first link 221 through a shaft 225, and the fourth link 224 is pivotally connected to the third link 221 through the other shaft 225. The shaft 225 is longer than the pivot 226, and the shaft One of the pins 300 is coupled to one of the pins 300, and one of the long axes of the pins 300 (e.g., the X-axis) intersects at least one of the major axes of the shaft 225 (e.g., the Z-axis).

Thus, FIG. 4 is a schematic view showing the operation of the cleaning device 10 of FIG. 1. As shown in FIGS. 3 and 4, when the user moves the operating member 252 toward the first direction D1, the user causes the slider 250 to face. The first direction D1 pushes the cross-retracting fence 220 and rotates the first to fourth links 221 to 224 such that the intermediate portion of the first link 221 (the position of the reference pivot 226 at the first link 221) is connected to the fourth The intermediate portion of the rod 224 (the position of the reference pivot 226 at the fourth link 224) gradually approaches each other, thereby allowing the cross-retracting barrier 220 to reduce the pitch G1 of the stitches 300; conversely, when the user moves the operating member toward the second direction D2 At 252, the same spacing G1 of these pins 300 can be increased (Fig. 1).

However, the present invention is not limited thereto. When the telescopic mechanism is a cross-retractable fence, the adjustment portion is not limited to a slider, and in other embodiments, the adjustment portion is also It may be a rotating bolt that controls the expansion and contraction of the telescopic mechanism by rotating or reversing the rotating bolt to achieve the increase or decrease of these pitches of the stitches.

Further, as shown in FIG. 1, the surface of the casing 100 adjacent to the slider 250 has a scale 170 having a plurality of scale values corresponding to the pitches G1 of the stitches. For example, when the slider 250 points to one of the scale values, it means that the pitches G1 of the stitches belong to the size corresponding to the scale value.

5 to 6 illustrate schematic views of a cleaning device 12 in accordance with another embodiment of the present invention. As shown in FIG. 5, in another embodiment, the telescopic mechanism is, for example, a Z-folded elastic piece 230. The opposite ends of the Z-folding elastic piece 230 are respectively connected to the housing 100 and the adjusting portion 240. The Z-folded elastic piece 230 has a plurality of first body portions 231 and a plurality of second body portions 232. The first body portion 231 and the second body portions 232 are adjacent to each other, and each of the first body portions 231 has an adjacent side edge 233 between the adjacent second body portions 232. The pins 300 are respectively connected to the adjacent side edges 233 on the same side of the Z-folded elastic piece 230. One of the long axes of the pins 300 (such as the X-axis) intersects at least one of the long axes (such as the Z-axis) of the adjacent side edges 233, and the adjustment portion 240 connects one end of the Z-folded elastic piece 230.

More specifically, as shown in FIG. 5, in addition to the receiving groove 110 and the first opening 120, the housing 101 further has a third opening 140. The third opening 140 is located on the other side of the housing 101 and is connected to the receiving slot 110. The adjusting portion 240 is a rotating bolt 260. The rotating bolt 260 is screwed onto the casing 101, and one end of the rotating bolt 260 abuts against the Z-folding elastic piece 230, and the other end of the rotating bolt 260 extends out of the casing 101 via the third opening 140. In addition, for the user to operate the rotation. In this way, regardless of the specifications of the pin gap of the package unit, the Z-fold can be controlled by the control. The expansion and contraction of the elastic pieces 230 to increase or decrease the spacing G1 of the pins 300 allows the user to immediately clean the package units of different gap specifications.

Thus, as shown in FIG. 6, when the user gradually turns the rotating bolt 260 into the accommodating groove 110 in the first hour hand direction C1, the rotating bolt 260 compresses the Z-folded elastic piece 230 so that the first piece body portion 231 is The second body portions 232 are close to each other, thereby narrowing the pitch G1 of the pins 300; otherwise, when the user turns the rotating bolt 260 gradually out of the receiving groove 110 toward the second hour hand direction C2 and gradually releases the Z-folded elastic piece At 230 o'clock, for the same reason, since the Z-shaped folded elastic piece 230 is restored, the Z-shaped folded elastic piece 230 increases the pitch G1 of the stitches 300.

Further, the circumferential surface 261 of the rotating bolt 260 has a scale 262 having a plurality of scale values. These scale values correspond to the type specifications of the pitches G1 of the stitches 300, respectively. For example, one of the scale values 262 of the rotating bolt 260 partially exposed outside the casing 101 indicates the size of the pitch G of the pins 300.

However, the present invention is not limited thereto. When the telescopic mechanism is a Z-folded elastic piece, the adjustment portion is not limited to a rotating bolt. In other embodiments, the adjustment portion may also be a slider, and the telescopic mechanism is controlled to retract and contract by reciprocating sliding. To increase or decrease these spacings of these pins.

FIG. 7 is a schematic view of a cleaning device 12 in accordance with yet another embodiment of the present invention. As shown in FIG. 7, the cleaning devices 10, 11 of the foregoing embodiment are substantially the same as the cleaning device 12 of the present embodiment except that the cleaning head 201 of the cleaning device 12 of the present embodiment is fixedly located on the housing 102, and these Pin 300 It is fixedly located on the cleaning head 201. As such, these pitches G1 of the pins 300 are constant or invariant. As such, the pins 300 of the cleaning device 12 have a certain degree of structural strength that is less susceptible to damage during cleaning.

In addition, FIG. 8 is a schematic view of a cleaning device 13 according to still another embodiment of the present invention. As shown in Fig. 8, the cleaning devices 10 to 11 of the above-described embodiment are substantially the same as the cleaning device 13 of the present embodiment except that the cleaning head 202 of the cleaning device 13 of the present embodiment is detachably located on the casing 103. As such, the user can remove the cleaning head 202 for replacement or cleaning. For example, the structure and type of cleaning head 202 can be modularized to provide a plurality of cleaning heads having different spacing types.

More specifically, the cleaning head 202 has a first socket 211. The first set of joints 211 are located on one side of the cleaning head 202 opposite the pins 300. The first set of joints 211 is, for example, a slot. The housing 103 has a second socket 160. The second socket portion 160 is located on one side of the housing 103, and the second socket portion 160 and the first socket portion 211 are matched to each other on the outer shape. The second socket portion 160 is, for example, a bump. Thus, the second socket portion 160 is sleeved through the first socket portion 211, and the cleaning head 202 is assembled on the casing 103.

9A to 9D are schematic views showing the stitches of the cleaning device according to other embodiments of the present invention. As shown in Fig. 9A, the outer shape of each of the stitches 300A is linear, so that the long axes L of the stitches 300A are parallel to each other. However, the present invention is not limited thereto. In other embodiments, for other needs or limitations, for example, as shown in FIGS. 9B to 9D, the stitches may also be hook-shaped pins 300B (FIG. 9B). A generally L-shaped stitch 300C (Fig. 9C) or a needle-shaped stitch 300D (Fig. 9D). Having the technical field of the present invention Generally, the knowledge should flexibly select the type of the pin according to the actual needs.

Further, in other variations, as shown in Fig. 9A, one end surface 301 of the stitch 300A is flat, and the long axis L of the stitch 300A passes through the plane 301 of the stitch 300A. However, the present invention is not limited thereto. In other embodiments, for other needs or limitations, for example, as shown in FIG. 9C, since the stitch 300C is hook-shaped, the long axis L of the stitch 300C does not pass through the stitch. The end face 303 of the 300C; or one end of the pin 300D of the 9D figure may have a sharp portion 302. Those having ordinary knowledge in the technical field to which the present invention pertains should flexibly select the type of appearance of one end of the pin according to actual needs.

In addition, in all the above embodiments, the pins include a metal material or a non-metal material. However, as long as the hardness of the material of the pins is sufficient to remove dirt or foreign matter between the conductive terminals of the package unit, the present invention is not limited to the pins. Material. Furthermore, when these pins are further provided with an antistatic material, the chance of generating static electricity to damage the package unit can be reduced.

Furthermore, in all of the above embodiments, the package unit for cleaning by the cleaning device is not limited to the type and shape. For example, the package unit may be of the following specifications. Quad flat package (QFP), low/thin quad flat package (LQFP or TQFP), quad flat non-leaded package (QFN) , quad flat I-leaded package (QFI), small outline package (SOP), thin small outline package (TSOP), small Small Outline J-lead Package (SOJ), small outline type I pin seal Small Outline I-lead Package (SOI), Ceramic Leaded Chip Carrier (CLCC), Plastic Leaded Chip Carrier (PLCC), J-Lead Wafer J-leaded chip carrier (JLCC), single in-line package (SIP), dual in-line package (DIP), plastic dual in-line Packaged components (Plastic Dual In-Line Package, P-DIP), Zigzag In-Line Package (ZIP), Small Outline Transistor (SOT), Thin transistor (Thin small outline) Transistor, SOT), pin grid array (PGA), ball grid array (BGA), ball grid array (BGA), PLASTIC Ball Grid Array (BGA), heat dissipation ball grid array HEAT SLUG Ball Grid Array (HSBGA) or Chip-Scale Package (CSP).

Those having ordinary knowledge in the technical field to which the present invention pertains should flexibly select the type of the package unit to be cleaned by the cleaning device according to actual needs.

Finally, the various embodiments disclosed above are not intended to limit the invention, and those skilled in the art can be protected in various modifications and refinements without departing from the spirit and scope of the invention. In the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

10‧‧‧ cleaning device

100‧‧‧shell

120‧‧‧ first opening

130‧‧‧second opening

170‧‧‧scale

200‧‧‧ cleaning head

210‧‧‧ body

252‧‧‧Operating parts

300‧‧‧ stitches

400‧‧‧Package unit

410‧‧‧Electrical terminals

D1‧‧‧ first direction

D2‧‧‧ second direction

G1‧‧‧ spacing

G2‧‧‧ gap

X~Z‧‧‧ axis

Claims (14)

A cleaning device is suitable for cleaning a semiconductor product, the semiconductor product has a plurality of spaced-apart conductive terminals, and a plurality of gaps are respectively formed between the conductive terminals, the cleaning device comprises: a casing; and a cleaning The head includes: a body on the housing; and a plurality of pins spaced side by side on the body for respectively extending into the gaps of the conductive terminals, wherein the two adjacent pins The space between them accommodates a single of the conductive terminals, wherein the pins are movably located on the body such that the plurality of pitches between the pins are adjustable. The cleaning device of claim 1, wherein the body comprises: a telescopic mechanism retractably located in the housing and telescopically extending along an axial direction, and the stitches are side by side of the telescopic mechanism along the axial direction So that the plurality of stitches are spaced apart from each other by the expansion and contraction of the telescopic mechanism; and an adjusting portion is movably located on the housing and connected to the telescopic mechanism for controlling the expansion and contraction of the telescopic mechanism . The cleaning device of claim 2, wherein the telescopic mechanism comprises: a plurality of shafts respectively connected to the stitches, and one of the long axes of each of the stitches intersects at least one of the long axes of each of the plurality of shafts; a plurality of first links; a plurality of second links, each One end of the second connecting rod is pivotally connected to one end of each of the first connecting rods through one of the shafts; a plurality of third connecting rods, and an intermediate portion of each of the third connecting rods Connecting an intermediate portion of each of the first links; and a plurality of fourth links, one end of each of the fourth links being pivotally connected to each of the third links through another of the plurality of shafts An intermediate portion of each of the fourth links is pivotally connected to an intermediate portion of each of the second links, wherein the adjusting portion connects the other ends of one of the first links with the The other end of one of the third links, wherein the adjusting portion rotates the first link, the second links, the third links, and the fourth links, so that the When the intermediate regions of a link and the intermediate regions of the fourth links are close to each other, the telescopic mechanism reduces the spacing of the stitches. The cleaning device of claim 2, wherein the telescopic mechanism comprises a Z-shaped folded elastic piece, and the opposite ends of the Z-shaped folded elastic piece are respectively connected to the housing and the adjusting portion, and have a plurality of first body portions and a plurality of second body portions, wherein the first body portions and the second body portions are adjacent to each other, and each of the first body portions and the second portion adjacent to each of the second body portions respectively have a Adjacent side edges, wherein the pins are respectively connected to the adjacent side edges, and one of the long axes of each of the pins intersects at least one of the long axes of each of the adjacent side edges, Wherein, when the adjusting portion compresses the Z-folding elastic piece such that the first piece body portion and the second piece body portions are close to each other, the telescopic mechanism reduces the spacing of the stitches. The cleaning device of claim 2, wherein the adjusting portion is a slider slidably located on the housing and connected to one end of the telescopic mechanism for controlling expansion and contraction of the telescopic mechanism. Adjust the spacing of the stitches. The cleaning device of claim 5, wherein the stitches are equidistantly arranged on the body, wherein the pitches of the stitches are identical to each other; and the surface of the housing has a scale adjacent to the slider. The scale has a plurality of scale values, and the scale values respectively correspond to the pitches of the stitches. The cleaning device of claim 2, wherein the telescopic mechanism has a resilient elasticity, the adjusting portion is a rotating bolt, the rotating bolt is screwed to the housing, and the rotating bolt abuts against one end of the telescopic mechanism, The spacing of the stitches is adjusted by controlling the expansion and contraction of the telescopic mechanism. The cleaning device of claim 7, wherein the stitches are juxtaposed side by side on the body, wherein the pitches of the stitches are identical to each other; The surface of the rotating bolt has a scale, and the scale has a plurality of scale values, and the scale values respectively correspond to the pitches of the stitches. The cleaning device of claim 1, wherein the pins are fixedly located on the body such that the plurality of stitches are spaced apart from each other by a constant distance. A cleaning device according to claim 1, wherein the cleaning head is detachably located on the housing. The cleaning device of claim 1, wherein the stitches are juxtaposed side by side on the body, wherein the plurality of stitches are spaced apart from each other by a plurality of intervals. The cleaning device of claim 1, wherein the pins comprise an antistatic material. The cleaning device of claim 1, wherein each of the stitches is linear, hooked, L-shaped or pointed. The cleaning device of claim 1, wherein one of the ends of each of the pins has a sharp portion or a flat surface.