TWI563780B - Power heat dissipation device and heat dissipation control method thereof - Google Patents

Power heat dissipation device and heat dissipation control method thereof

Info

Publication number
TWI563780B
TWI563780B TW103143064A TW103143064A TWI563780B TW I563780 B TWI563780 B TW I563780B TW 103143064 A TW103143064 A TW 103143064A TW 103143064 A TW103143064 A TW 103143064A TW I563780 B TWI563780 B TW I563780B
Authority
TW
Taiwan
Prior art keywords
heat dissipation
control method
power
dissipation device
power heat
Prior art date
Application number
TW103143064A
Other languages
English (en)
Other versions
TW201622314A (zh
Inventor
Po Hua Chang
Kou Tzeng Lin
Chih Yu Hwang
Min Chuan Wu
Wen Shu Chiang
Original Assignee
Ind Tech Res Inst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ind Tech Res Inst filed Critical Ind Tech Res Inst
Priority to TW103143064A priority Critical patent/TWI563780B/zh
Priority to CN201410815806.6A priority patent/CN105786041A/zh
Priority to US14/919,237 priority patent/US20160167518A1/en
Publication of TW201622314A publication Critical patent/TW201622314A/zh
Application granted granted Critical
Publication of TWI563780B publication Critical patent/TWI563780B/zh

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/38Cooling arrangements using the Peltier effect
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B60VEHICLES IN GENERAL
    • B60LPROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
    • B60L1/00Supplying electric power to auxiliary equipment of vehicles
    • B60L1/02Supplying electric power to auxiliary equipment of vehicles to electric heating circuits
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B60VEHICLES IN GENERAL
    • B60LPROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
    • B60L3/00Electric devices on electrically-propelled vehicles for safety purposes; Monitoring operating variables, e.g. speed, deceleration or energy consumption
    • B60L3/0023Detecting, eliminating, remedying or compensating for drive train abnormalities, e.g. failures within the drive train
    • B60L3/003Detecting, eliminating, remedying or compensating for drive train abnormalities, e.g. failures within the drive train relating to inverters
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B60VEHICLES IN GENERAL
    • B60LPROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
    • B60L3/00Electric devices on electrically-propelled vehicles for safety purposes; Monitoring operating variables, e.g. speed, deceleration or energy consumption
    • B60L3/0023Detecting, eliminating, remedying or compensating for drive train abnormalities, e.g. failures within the drive train
    • B60L3/0084Detecting, eliminating, remedying or compensating for drive train abnormalities, e.g. failures within the drive train relating to control modules
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B60VEHICLES IN GENERAL
    • B60LPROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
    • B60L2240/00Control parameters of input or output; Target parameters
    • B60L2240/10Vehicle control parameters
    • B60L2240/36Temperature of vehicle components or parts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B60VEHICLES IN GENERAL
    • B60LPROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
    • B60L2240/00Control parameters of input or output; Target parameters
    • B60L2240/40Drive Train control parameters
    • B60L2240/42Drive Train control parameters related to electric machines
    • B60L2240/421Speed
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B60VEHICLES IN GENERAL
    • B60LPROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
    • B60L2240/00Control parameters of input or output; Target parameters
    • B60L2240/40Drive Train control parameters
    • B60L2240/42Drive Train control parameters related to electric machines
    • B60L2240/423Torque
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B60VEHICLES IN GENERAL
    • B60LPROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
    • B60L2240/00Control parameters of input or output; Target parameters
    • B60L2240/40Drive Train control parameters
    • B60L2240/42Drive Train control parameters related to electric machines
    • B60L2240/429Current
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02TCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
    • Y02T10/00Road transport of goods or passengers
    • Y02T10/60Other road transportation technologies with climate change mitigation effect
    • Y02T10/64Electric machine technologies in electromobility

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Transportation (AREA)
  • Sustainable Energy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW103143064A 2014-12-10 2014-12-10 Power heat dissipation device and heat dissipation control method thereof TWI563780B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW103143064A TWI563780B (en) 2014-12-10 2014-12-10 Power heat dissipation device and heat dissipation control method thereof
CN201410815806.6A CN105786041A (zh) 2014-12-10 2014-12-24 功率散热装置及其散热控制方法
US14/919,237 US20160167518A1 (en) 2014-12-10 2015-10-21 Power heat dissipation device and method for controlling the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW103143064A TWI563780B (en) 2014-12-10 2014-12-10 Power heat dissipation device and heat dissipation control method thereof

Publications (2)

Publication Number Publication Date
TW201622314A TW201622314A (zh) 2016-06-16
TWI563780B true TWI563780B (en) 2016-12-21

Family

ID=56110360

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103143064A TWI563780B (en) 2014-12-10 2014-12-10 Power heat dissipation device and heat dissipation control method thereof

Country Status (3)

Country Link
US (1) US20160167518A1 (zh)
CN (1) CN105786041A (zh)
TW (1) TWI563780B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2557592A (en) * 2016-12-09 2018-06-27 Evonetix Ltd Temperature control device
CN117457599B (zh) * 2023-12-25 2024-04-16 东莞市湃泊科技有限公司 功率器件散热装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM295285U (en) * 2006-02-21 2006-08-01 Bing-Jiun Ju Case housing with thermoelectric cooling apparatus
TWM297148U (en) * 2006-02-17 2006-09-01 Macs Technology Inc Heat radiator with refrigeration controlling chip
TW200823407A (en) * 2006-11-16 2008-06-01 Ta Yih Ind Co Ltd Heat dissipation device for a LED car lamp
US7633752B2 (en) * 2004-03-29 2009-12-15 Intel Corporation Cooling an integrated circuit die with coolant flow in a microchannel and a thin film thermoelectric cooling device in the microchannel
TWM383110U (en) * 2009-10-16 2010-06-21 Asia Vital Components Co Ltd Heat exchanger

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5456081A (en) * 1994-04-01 1995-10-10 International Business Machines Corporation Thermoelectric cooling assembly with optimized fin structure for improved thermal performance and manufacturability
US7654311B2 (en) * 2004-10-20 2010-02-02 University Of Maryland Thermal management of systems having localized regions of elevated heat flux
EP2498288A3 (en) * 2007-03-12 2014-04-23 Toyo Tanso Co., Ltd. Circuit board using heat radiating member, electronic module and method for manufacturing the module
US8209989B2 (en) * 2007-03-30 2012-07-03 Intel Corporation Microarchitecture control for thermoelectric cooling
TW200906283A (en) * 2007-07-27 2009-02-01 Ta Yih Ind Co Ltd Heat dissipation device for LED car lamp and method used thereby
US8058724B2 (en) * 2007-11-30 2011-11-15 Ati Technologies Ulc Holistic thermal management system for a semiconductor chip
US8341967B2 (en) * 2010-02-18 2013-01-01 Golden Sun News Techniques Co., Ltd. Heat-dissipating device for supplying cold airflow
TW201212802A (en) * 2010-09-07 2012-03-16 Hon Hai Prec Ind Co Ltd Heat dissipation apparatus
TWI443883B (zh) * 2010-11-29 2014-07-01 Ind Tech Res Inst 具有高熱電轉換效能之熱電轉換組件
WO2013065196A1 (ja) * 2011-11-04 2013-05-10 富士通株式会社 マイクロチャネル冷却デバイス、マイクロチャネル冷却システム、及び電子機器

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7633752B2 (en) * 2004-03-29 2009-12-15 Intel Corporation Cooling an integrated circuit die with coolant flow in a microchannel and a thin film thermoelectric cooling device in the microchannel
TWM297148U (en) * 2006-02-17 2006-09-01 Macs Technology Inc Heat radiator with refrigeration controlling chip
TWM295285U (en) * 2006-02-21 2006-08-01 Bing-Jiun Ju Case housing with thermoelectric cooling apparatus
TW200823407A (en) * 2006-11-16 2008-06-01 Ta Yih Ind Co Ltd Heat dissipation device for a LED car lamp
TWM383110U (en) * 2009-10-16 2010-06-21 Asia Vital Components Co Ltd Heat exchanger

Also Published As

Publication number Publication date
TW201622314A (zh) 2016-06-16
US20160167518A1 (en) 2016-06-16
CN105786041A (zh) 2016-07-20

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