TWI563244B - - Google Patents
Info
- Publication number
- TWI563244B TWI563244B TW104121564A TW104121564A TWI563244B TW I563244 B TWI563244 B TW I563244B TW 104121564 A TW104121564 A TW 104121564A TW 104121564 A TW104121564 A TW 104121564A TW I563244 B TWI563244 B TW I563244B
- Authority
- TW
- Taiwan
Links
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410323157.8A CN105441909B (en) | 2014-07-08 | 2014-07-08 | A kind of system and method for detecting temperature and the MOCVD device equipped with the system |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201602534A TW201602534A (en) | 2016-01-16 |
TWI563244B true TWI563244B (en) | 2016-12-21 |
Family
ID=55552527
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104121564A TW201602534A (en) | 2014-07-08 | 2015-07-02 | System and method for detecting temperature and MOCVD equipment having the system |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN105441909B (en) |
TW (1) | TW201602534A (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105928625B (en) * | 2016-06-20 | 2023-04-07 | 中国工程物理研究院流体物理研究所 | Metal surface dynamic temperature point measuring method based on reflectivity change |
CN111155073A (en) * | 2019-12-30 | 2020-05-15 | 中国电子科技集团公司第十三研究所 | Temperature calibration method of MOCVD epitaxial equipment |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100111511A1 (en) * | 2008-10-31 | 2010-05-06 | Nir Merry | Use of infrared camera for real-time temperature monitoring and control |
EP2372752A1 (en) * | 2008-12-26 | 2011-10-05 | Y Systems Ltd. | Method and device for measuring temperature during deposition of semiconductor |
TW201243955A (en) * | 2011-03-11 | 2012-11-01 | Applied Materials Inc | Apparatus for monitoring and controlling substrate temperature |
TW201351529A (en) * | 2012-05-07 | 2013-12-16 | Advanced Micro Fab Equip Inc | Method and device for measuring temperature of substrate in vacuum processing apparatus |
TW201419383A (en) * | 2012-06-26 | 2014-05-16 | Veeco Instr Inc | Temperature control for GaN based materials |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11190670A (en) * | 1997-12-26 | 1999-07-13 | Toshiba Corp | Surface temperature measuring device and surface temperature measuring method |
US7734439B2 (en) * | 2002-06-24 | 2010-06-08 | Mattson Technology, Inc. | System and process for calibrating pyrometers in thermal processing chambers |
US8254767B2 (en) * | 2008-08-29 | 2012-08-28 | Applied Materials, Inc. | Method and apparatus for extended temperature pyrometry |
CN102183316B (en) * | 2010-12-10 | 2013-04-24 | 中国科学院安徽光学精密机械研究所 | Real-time temperature monitoring instrument for tunable semiconductor laser absorption spectrum |
JP5964626B2 (en) * | 2012-03-22 | 2016-08-03 | 株式会社Screenホールディングス | Heat treatment equipment |
CN103884449B (en) * | 2014-03-04 | 2016-08-17 | 中国空间技术研究院 | A kind of NOZZLE ARC temperature non-contact measurement system based on fiber-optic transfer |
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2014
- 2014-07-08 CN CN201410323157.8A patent/CN105441909B/en active Active
-
2015
- 2015-07-02 TW TW104121564A patent/TW201602534A/en unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100111511A1 (en) * | 2008-10-31 | 2010-05-06 | Nir Merry | Use of infrared camera for real-time temperature monitoring and control |
EP2372752A1 (en) * | 2008-12-26 | 2011-10-05 | Y Systems Ltd. | Method and device for measuring temperature during deposition of semiconductor |
TW201243955A (en) * | 2011-03-11 | 2012-11-01 | Applied Materials Inc | Apparatus for monitoring and controlling substrate temperature |
TW201351529A (en) * | 2012-05-07 | 2013-12-16 | Advanced Micro Fab Equip Inc | Method and device for measuring temperature of substrate in vacuum processing apparatus |
TW201419383A (en) * | 2012-06-26 | 2014-05-16 | Veeco Instr Inc | Temperature control for GaN based materials |
Also Published As
Publication number | Publication date |
---|---|
TW201602534A (en) | 2016-01-16 |
CN105441909A (en) | 2016-03-30 |
CN105441909B (en) | 2018-06-26 |